High-speed resin composition containing acenaphthylene prepolymer and product thereof

Abstract

The invention provides a resin composition which comprises the following components in parts by weight: 50-90 parts of a compound A, 10-50 parts of a prepolymer B and 0.05-0.2 part of an accelerant, wherein the compound A has at least one group shown in the following formula (1): # imgabs0 #; wherein R1, R2, R3 and R4 independently represent a hydrogen atom, an alkyl group, an arylene group or an aryl group; the number average molecular weight of the compound A is 100 to 7000; and the prepolymer B is obtained by prepolymerizing acenaphthylene or derivatives of acenaphthylene under the action of an initiator. The invention also provides a preparation method of the resin composition. The invention also provides an application of the resin composition.

Description

Technical Field

[0001] The invention relates to a resin composition containing acenaphthylene resin and a preparation method and application thereof. Background Art

[0002] For various electronic devices, as the amount of information processing increases, the installation technology of high integration of semiconductor devices, high density of wiring, and multilayering is developing rapidly. In addition, as wiring boards used in various electronic devices, wiring boards that can cope with high frequencies, such as millimeter wave radar substrates in vehicle-mounted applications, are also sought. In order to increase the transmission speed of signals and reduce the loss during signal transmission, the substrate material used to form the substrate of the wiring board used in various electronic devices is required to have a low dielectric constant and dielectric loss factor.

[0003] On the other hand, when used as a forming material such as a substrate material, it is required not only to have excellent dielectric properties, but also to have excellent heat resistance and formability. Therefore, it can be considered that the resin contained in the substrate material can be modified by adding acenaphthylene as a curing agent. Such a curing agent can be found in WO2020 / 017399, which can maintain excellent low dielectric properties while fully improving heat resistance and excellent formability.

[0004] However, acenaphthylene usually exists as a solid monomer and is easy to sublime. In addition, when manufacturing prepreg, acenaphthylene monomer is easy to volatilize during the heating and drying process, which not only pollutes the environment, but also may make the physical and chemical properties of the obtained laminate unstable.

[0005] In US9809690B2, TAIC and TAC monomers are polymerized into particles and dispersed in a resin composition as fillers. Although volatility is improved, the fluidity of the composition is deteriorated. With reference to the above, acenaphthylene oligomers can be synthesized under reasonable prepolymerization conditions, which can not only solve the performance fluctuation caused by volatility in process production, but also ensure fluidity, thereby not reducing the performance of the multilayer board.

[0006] In view of this, it is necessary to develop a resin composition for electronic materials that is stable in nature and can provide excellent heat resistance and dielectric properties. Summary of the invention

[0007] In view of this, the main purpose of the present invention is to provide a resin composition, the cured product of which has excellent heat resistance, low water absorption, high glass transition temperature, peel strength, low dielectric loss, and good processability. In addition, the purpose of the present invention is to provide a prepreg, a film with resin, a metal foil with resin, a metal foil-clad laminate, and a wiring board obtained by using the resin composition.

[0008] To achieve the above purpose, the present invention adopts the following technical solutions: A resin composition, comprising, by weight, 50-90 parts of a compound A, 10-50 parts of a prepolymer B and 0.05-0.2 parts of an accelerator; Wherein, compound A has at least one group represented by the following formula (1): ; Among them, R 1 , R 2 , R 3 , R 4 each independently represents a hydrogen atom, an alkyl group, an arylene group or an aryl group; and The number average molecular weight of compound A is 100-7000; compound A contains at least one -C=C- double bond, and can undergo free radical polymerization with a crosslinking agent containing one or more -C=C- double bonds under appropriate conditions to produce a thermosetting resin. In order to ensure good processability during the product production process, a liquid with a number average molecular weight between 100-7000 or a resin compound that can be dissolved in a suitable solvent is preferred.

[0009] The arylene group or benzylidene group is not particularly limited and includes monocyclic aromatic groups and non-monocyclic polycyclic aromatic groups, and also includes derivatives in which the hydrogen atoms bonded to the aromatic ring are substituted by other hydrocarbon groups, acyl groups, and the like.

[0010] Compound A may be a modified polyphenylene ether compound having at least one molecular structure of the aforementioned formula (1) in its molecular structure, and a polymer having a unit of the following structure (2) in its molecule. Formula 2 is as follows: In formula (2), R 1 -R 4 , R 6 -R 8 All represent independent hydrogen atoms or hydrocarbon groups, that is, R 1 -R 4 , R 6 -R 8 They can be the same group or different groups. 6 -R 8 It is a hydrogen atom or a hydrocarbon group having 1 to 7 carbon atoms.

[0011] Compound A may have a group represented by formula (1), and the atoms bound by the group are not particularly limited, including but not limited to modified polyphenylene ether, styrene and its derivatives, divinylbenzene and its oligomers, acenaphthylene, butadiene / styrene / divinylbenzene and other low molecular weight or high molecular weight homopolymers or copolymers and their modified products, maleic anhydride imide compounds, etc. In addition, as compound A, the above compounds may be used alone or in combination of two or more.

[0012] Modified polyphenylene ether compounds The modified polyphenylene ether compound is not particularly limited as long as it has a group structure represented by the above formula (1) at a molecular terminal.

[0013] The modified polyphenylene ether compound has a polyphenylene ether chain in the molecule, and preferably has the following structural formula (3), and particularly preferably is the SA9000 model produced by Sabic.

[0014] Formula (3) In formula (3), m represents a range of 1-80. 9 -R 12 are hydrogen atoms or any other groups independently of each other. 9 -R 12 are independently hydrogen atoms or alkane groups.

[0015] The modified polyphenylene ether compound may be a graft-modified or block-modified compound of the structural unit of the formula (3) or a terminal-modified compound.

[0016] Furthermore, as the modified polyphenylene ether compound, the above compounds may be used alone or in combination of two or more.

[0017] The prepolymer B is obtained by prepolymerizing acenaphthylene or a derivative of acenaphthylene under the action of an initiator. Acenaphthylene is usually in the form of a solid monomer. In the process of manufacturing the semi-cured sheet, the acenaphthylene monomer is yellow and is easily volatilized during the high-temperature drying process, which not only causes related problems such as gluing equipment and environmental pollution. It may also cause changes in the physical and chemical properties of the laminated board obtained later, thereby causing batch instability. Acenaphthylene contains a cyclic double bond structure, and it can be easily found from its structure that it has the ability to self-polymerize. From its structure, it can be easily found that acenaphthylene has the ability to self-polymerize. Under certain conditions, a small molecule acenaphthylene polymer can be formed by performing a certain degree of self-polymerization pretreatment on acenaphthylene. The acenaphthylene oligomer itself is colorless and transparent, and its volatility point is significantly improved compared with that of the acenaphthylene monomer. It will not volatilize during the semi-cured sheet preparation process, which is easy to process, ensuring the stability of the semi-cured sheet composition, and obtaining the same stable performance of the back-end product.

[0018] After acenaphthylene is prepolymerized, the molecular chain becomes longer, the large π bond conjugation of the long-chain acenaphthylene prepolymer is enhanced, and the intermolecular force is increased, thereby improving the heat resistance and glass transition temperature of the cured product of the resin compound.

[0019] Moreover, acenaphthylene itself has high symmetry. When used after prepolymerization, the symmetry of the polymer molecular chain is further improved, so that the cured resin compound has lower polarity, thereby obtaining lower dielectric loss and water absorption.

[0020] At the same time, the extension of the molecular chain is conducive to the cross-linking reaction, reduces the residual small molecular components in the cured product of the resin compound, and improves the cross-linking density of the cured product of the resin composition, thereby reducing the generation of tiny voids or gaps in the cured product of the resin composition, and further reducing the generation of poor interfaces. The reduction of voids, gaps or poor interfaces enables the cured product of the resin composition to further obtain excellent heat resistance, low water absorption, relatively higher peel strength, lower dielectric loss and other excellent properties.

[0021] After prepolymerization of acenaphthylene, the molecular chain becomes longer, and the intermolecular force of the long-chain macromolecular structure is larger, thereby improving heat resistance and not being easy to volatilize. Moreover, acenaphthylene itself is a cyclic rigid structure with high symmetry and low polarity. After prepolymerization, it obtains lower Df and water absorption. At the same time, experiments have found that the prepolymerized acenaphthylene oligomer helps to improve the crosslinking density of the cured product of the resin composition, and the resin composition further obtains excellent heat resistance, low water absorption, peel strength, low dielectric loss and other excellent properties.

[0022] It undergoes cross-linking reaction with acenaphthylene compounds and their derivative oligomers, making it difficult to generate highly polar bonds such as ether bonds and CN, and can obtain cured products with low dielectric constant and low dielectric loss.

[0023] The aforementioned promoter includes, but is not limited to, peroxide compounds and their derivatives, azo compounds and their derivatives, metal organic catalysts, etc. Preferably, the promoter is an azo compound and its derivatives. Particularly preferably, it is an azo compound that does not contain other heteroatoms except the azo group. In addition, as the aforementioned promoter, the above compounds can be used alone or in combination of two or more.

[0024] The mass fraction of the resin compound A is preferably 50-90 parts, and more preferably 60-80 parts, relative to the total mass fraction of the aforementioned compound A and the prepolymer B of the acenaphthylene compound and its derivatives being 100 parts. In addition, the mass fraction of the oligomer B of the acenaphthylene compound and its derivatives is preferably 10-50 parts, and more preferably 20-40 parts, relative to the total mass fraction of the aforementioned resin compound A and the prepolymer B of the acenaphthylene compound and its derivatives being 100 parts. In addition, the content of the aforementioned accelerator is preferably 0.05-2 parts, and more preferably 0.1-1 parts, relative to the total mass fraction of the aforementioned prepolymer B of its derivatives being 100 parts. In addition, the content of the aforementioned initiator is preferably 0.05-0.2 parts, relative to the total mass fraction of the aforementioned prepolymer B of its derivatives being 100 parts. If the contents of the resin compound A, the prepolymer B of the acenaphthylene compound and its derivatives, and the accelerator are all within the above ranges, a cured product having good dielectric properties, heat resistance, and anti-stripping properties can be obtained. It should be noted that the contents of the resin compound A, the prepolymer B of the acenaphthylene compound and its derivatives, and the accelerator are all within the preferred ranges, and the specific ratios are not particularly limited.

[0025] The weight average molecular weight of the prepolymer B is 150-5000. The weight average molecular weight of the oligomer B of the aforementioned acenaphthylene compound and its derivative is preferably 150-5000, more preferably 150-4000, and more preferably 300-3000. If the aforementioned weight average molecular weight is too low, there is a tendency that the volatility of the aforementioned acenaphthylene compound and its derivative cannot be improved. In addition, if the weight average molecular weight is too high, there is a possibility that the viscosity of the resin composition increases, the melt viscosity during heat molding increases, and the moldability during heat molding decreases. Therefore, as long as the weight average molecular weight of the aforementioned polymer is within the above range, the production processability and product stability can be improved. It should be noted that the weight average molecular weight here is any value obtained by measuring the molecular weight using a conventional molecular weight measurement method. Specifically, the value measured using gel permeation chromatography (GPC) can be cited.

[0026] The accelerator includes an azo compound; The initiator comprises a peroxide compound; The azo compound includes azobisisobutyronitrile; The peroxygen compound includes benzoyl peroxide.

[0027] The method for preparing the resin composition comprises the steps of mixing compound A, prepolymer B and accelerator in a solvent and then drying.

[0028] The drying temperature is 100-180°C.

[0029] The resin composition of the present invention may further contain other ingredients besides the aforementioned resin compound A, the prepolymer B of the acenaphthylene compound and its derivatives, and the accelerator, within the scope of not impairing the effects of the present invention. Other ingredients added to the resin composition of the present invention may include, but are not limited to, additives such as silane coupling agents, flame retardants, defoamers, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, dyes or pigments, lubricants, and fillers. In addition, the aforementioned resin composition may contain, in addition to the resin compound A, thermosetting resins such as epoxy resins, unsaturated polyester resins, thermosetting polyimide resins, and unsaturated hydrocarbon resins.

[0030] As mentioned above, the resin composition of the present invention may contain a silane coupling agent. The aforementioned silane coupling agent may be contained in the resin composition, preferably, in a manner of pre-treating the surface of the filler, more preferably, in a manner of pre-treating the surface of the filler and in the resin composition at the same time. In addition, in the prepreg, it may be contained in a manner of pre-treating the surface of the fibrous substrate.

[0031] The aforementioned silane coupling agent is a compound having one of vinyl, styryl, methacryloyl, acryloyl and phenylamino groups as a reactive group and having a hydrolyzable group such as methoxy or ethoxy, etc., without particular limitation. In addition, the aforementioned silane coupling agent may be used alone or in combination of two or more.

[0032] As described above, the resin composition of the present invention may contain a flame retardant. By containing a flame retardant, the flame retardancy of the cured product of the resin composition can be improved. The aforementioned flame retardant is not particularly limited. Including but not limited to halogen flame retardants, phosphorus flame retardants, nitrogen flame retardants, etc., for example, bromine halogen flame retardants such as decabromodiphenyl ether, hexabromobenzene, decabromodiphenylethane, ethylene bis tetrabromophthalimide, etc., for example, tris (2,6-dimethylphenyl) -phosphine, phenoxyphosphazene, xylene bis (diphenyl phosphine oxide), hypophosphite and other phosphorus flame retardants. In addition, as the aforementioned flame retardant, it can be used alone or in combination of two or more.

[0033] As mentioned above, the resin composition of the present invention may contain fillers such as inorganic fillers. As fillers, fillers added to improve the flame retardancy and heat resistance of the cured product of the resin composition can be listed, without special designation. Including but not limited to silicon dioxide such as spherical silica, metal oxides such as alumina, metal hydroxides such as aluminum hydroxide, aluminum borate, calcium carbonate, etc. As fillers, silicon dioxide, etc. are preferred, and more preferably, spherical silica, etc. In addition, as the aforementioned filler, it can be used alone or in combination of two or more. In addition, as a filler, it can be used directly, and it can be used after surface treatment with a silane coupling agent. In particular, when containing a filler, its filler content is preferably 30-270 parts by mass for the aforementioned resin composition, and more preferably 50-250 parts.

[0034] The resin composition is used to prepare prepreg; or Used in the preparation of films with resin; The prepreg comprises the resin composition and a fiber base material.

[0035] The fiber substrate includes glass cloth, aramid cloth, polyester cloth, glass non-woven fabric, aramid non-woven fabric, polyester non-woven fabric, pulp paper, or cotton woven fabric.

[0036] The application of the prepreg is used to prepare metal foil-clad laminates. The metal foil-clad laminate is used in preparing wiring boards.

[0037] The application of the prepreg is to prepare copper clad laminates; The copper clad laminate further includes an inorganic filler; The inorganic filler includes silicon dioxide.

[0038] There is no particular limitation on the method for producing the resin composition. For example, the resin composition is usually dissolved in a suitable solvent, and heating and other operations may be performed as needed, and the insoluble components are dispersed to a specified dispersion state with the assistance of a ball mill, a bead mill, a homogenizer, an emulsifier and other equipment. In particular, the solvent is not particularly required as long as it can dissolve the resin compound A, the prepolymer B and the accelerator and does not react with any of them or hinder the curing reaction of the resin composition.

[0039] After obtaining the resin composition of the present invention, further obtainable are: prepreg, metal foil-clad laminate, wiring board, metal foil with copper foil, and film with resin containing the resin composition of the present invention.

[0040] Prepreg The prepreg of the present invention should include: the aforementioned resin composition or the aforementioned semi-cured product of the resin composition and a fiber-based material.

[0041] The method for manufacturing the prepreg is not particularly limited as long as the aforementioned prepreg can be manufactured. For example, the aforementioned resin composition is formulated into a resin varnish and then attached to a fiber-based material by impregnation or coating.

[0042] The semi-cured product is a product in which the resin composition is partially cured and is in a state where a further curing reaction is possible.

[0043] The fiber-based material includes glass cloth, aramid cloth, polyester cloth, glass non-woven fabric, aramid non-woven fabric, polyester non-woven fabric, pulp paper, cotton woven fabric, etc. Glass cloth that can provide better mechanical properties to the laminate is preferred, and fiber-opening glass cloth that can improve the uniformity of the laminate is more preferred.

[0044] Metal foil laminate The metal foil-clad laminate of the present invention should include: an insulating layer of the aforementioned cured resin composition or the aforementioned cured prepreg, and a metal foil coated on one or both sides of the surface of the insulating layer. In addition, the aforementioned metal foil is subject to actual needs, and its type and thickness are not particularly limited. The thickness of the metal foil can be preferably 0.1-105 μm, and the type of metal foil can include but is not limited to copper foil, aluminum foil, etc.

[0045] The method for producing the metal-clad laminate is not particularly limited as long as the metal-clad laminate can be produced. For example, the prepreg is coated with metal foil on both sides and cured under pressure and heating conditions.

[0046] In particular, the resin composition of the present invention can be used to produce a cured product of the resin composition having low dielectric properties and high heat resistance. Therefore, the metal-clad laminate having the resin composition of the present invention cured into an insulating layer is also a metal-clad laminate having low dielectric properties and high heat resistance.

[0047] Wiring board The wiring board of the present invention should include: a metal foil-clad laminate of the cured resin composition, and wiring formed by etching a portion of the metal foil on one side or both sides.

[0048] The method for manufacturing the wiring board is not particularly limited as long as it can manufacture the aforementioned wiring board.

[0049] The wiring board according to the present invention is a wiring board having low dielectric properties and high heat resistance.

[0050] Metal foil with resin The metal foil with resin of the present invention should include: an insulating layer of the aforementioned resin composition or a cured product of the aforementioned resin composition, and a metal foil.

[0051] The aforementioned insulating layer may or may not include a fiber base material as long as it includes the aforementioned resin composition or a cured product of the aforementioned resin composition.

[0052] The metal foil with resin may be covered with a release film as needed to prevent contamination and damage.

[0053] The release film is not particularly limited as long as it does not react with the insulating layer and can be separated from the insulating layer without remaining.

[0054] The method for producing the metal foil with resin is not particularly limited as long as it can produce the metal foil with resin. For example, the metal foil with resin can be obtained by coating the required content of the resin composition on the metal foil surface with a coater and then drying it.

[0055] Film with resin The resin-bearing film of the present invention should include: an insulating layer of the aforementioned resin composition or a cured product of the aforementioned resin composition, and a supporting film.

[0056] The aforementioned resin layer may contain the aforementioned resin composition or the aforementioned resin composition cured product, and may or may not contain a fiber base material.

[0057] The support film is not particularly limited as long as it does not react with the insulating layer and can be separated from the insulating layer without remaining.

[0058] The aforementioned film with resin may be covered with a release film as needed to prevent contamination and damage.

[0059] As a method for manufacturing a film with a resin, no special requirements are made as long as the aforementioned film with a resin can be manufactured. For example, the aforementioned resin composition with a required content is coated on a support film surface using an applicator and then dried to obtain the film. The following examples further illustrate the content of the present invention, but the protection scope of the present invention is not limited by the following examples. DETAILED DESCRIPTION

[0060] The present invention is further described below by way of examples, but the protection scope of the present invention is not limited by the following examples.

[0061] The material statistics table involved in the specific embodiment of the present invention is as follows Table 1 Table 1 The present invention is further described below in conjunction with specific embodiments.

[0062] The preparation method of the composition provided by the present invention is as follows: Dissolve resin compound A, prepolymer B, accelerator and other series of additives in toluene and ketone mixed solvent, stir thoroughly and adjust to suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140℃ for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220℃ to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 2.

[0063] Example 1 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 2.

[0064] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 60° C. and reacted for 3 hours to obtain a prepolymer.

[0065] Example 2 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 2.

[0066] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 70° C. and reacted for 3 hours to obtain a prepolymer.

[0067] Example 3 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 2.

[0068] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 80°C and reacted for 3 hours to obtain a prepolymer.

[0069] Example 4 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 2.

[0070] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0071] Example 5 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 2.

[0072] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 100° C. and reacted for 3 hours to obtain a prepolymer.

[0073] Example 6 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 2.

[0074] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 110° C. and reacted for 3 hours to obtain a prepolymer.

[0075] Example 7 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 2.

[0076] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 120° C. and reacted for 3 hours to obtain a prepolymer.

[0077] Example 8 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 2.

[0078] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 130° C. and reacted for 3 hours to obtain a prepolymer.

[0079] Example 9 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 3.

[0080] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 140° C. and reacted for 3 hours to obtain a prepolymer.

[0081] Example 10 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 3.

[0082] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 1 hour to obtain a prepolymer.

[0083] Embodiment 11 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 3.

[0084] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 2 hours to obtain a prepolymer.

[0085] Example 12 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 3.

[0086] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 4 hours to obtain a prepolymer.

[0087] Example 13 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 3.

[0088] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 5 hours to obtain a prepolymer.

[0089] Embodiment 14 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 4.

[0090] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.05 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0091] Embodiment 15 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 3.

[0092] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.2 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0093] Example 16 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 3.

[0094] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0095] Embodiment 17 Dissolve 50 parts of SA9000, 50 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 4.

[0096] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0097] Embodiment 18 Dissolve 90 parts of SA9000, 10 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 4.

[0098] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0099] Embodiment 19 Dissolve 70 parts of OPE-2ST (2200), 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 4.

[0100] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0101] Embodiment 20 Dissolve 70 parts of ODV-EXT (X04), 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 4.

[0102] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0103] Embodiment 21 Dissolve SA9000, ODV-EXT (X04) 20 parts, acenaphthylene prepolymer 30 parts, VR100 0.8 parts, and spherical silica 60 parts in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 4.

[0104] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0105] Embodiment 22 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.05 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 4.

[0106] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0107] Embodiment 23 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 2 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 4.

[0108] Wherein, the preparation method of prepolymer B is as follows: Mix 100 parts of erlenme, 0.1 parts of DCP and some solvent at 90°C and react for 3 hours to obtain a prepolymer. Embodiment 24 Dissolve 50 parts of DVB810, 50 parts of acenaphthylene prepolymer, 1 part of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 4.

[0109] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0110] Embodiment 25 Dissolve 50 parts of B-1000, 50 parts of acenaphthylene prepolymer, 1 part of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 5.

[0111] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0112] Comparative Example 1 Dissolve 70 parts of SA9000, 30 parts of TAIC, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The prepolymer preparation method is shown below, and the board properties are shown in Table 5.

[0113] Comparative Example 2 Dissolve 70 parts of SA9000, 30 parts of DVB810, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 5.

[0114] Comparative Example 3 Dissolve 70 parts of SA9000, 30 parts of B-1000, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 5.

[0115] Comparative Example 4 Dissolve 70 parts of SA9000, 30 parts of BMI-70, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 5.

[0116] Comparative Example 5 Dissolve 70 parts of SA9000, 30 parts of IMILEX P, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The prepolymer preparation method is shown below, and the board properties are shown in Table 5.

[0117] Comparative Example 6 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of DCP100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 5.

[0118] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.8 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0119] Comparative Example 7 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VAm-110, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 5.

[0120] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0121] Comparative Example 8 Dissolve 0 parts of SA9000, 30 parts of acenaphthylene, 0.8 parts of DCP, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 140°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 6.

[0122] Comparative Example 9 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene, 0.8 parts of VAm-110, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 145°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 6.

[0123] Comparative Example 10 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 135°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The prepolymer preparation method is shown below, and the board properties are shown in Table 6.

[0124] Comparative Example 11 Dissolve 70 parts of SA9000, 30 parts of acenaphthylene prepolymer, 0.8 parts of VR100, and 60 parts of spherical silica in toluene, stir thoroughly and adjust to a suitable viscosity. Use 2116 glass fiber cloth to soak the resin glue to make the unit weight appropriate, and dry it in an oven at 135°C for 5 minutes to remove toluene and ketone solvents to obtain 2116 prepreg. Overlap 6 sheets of 2116 prepreg, and coat the upper and lower surfaces with copper foil of HoZ thickness. Vacuum laminate and cure for 125 minutes in a press, with a curing pressure of 2MPa and a curing temperature of 220°C to obtain a high-speed copper clad laminate. The preparation method of the prepolymer is shown below, and the properties of the board are shown in Table 6.

[0125] Wherein, the preparation method of prepolymer B is as follows: 100 parts of ersene, 0.1 parts of DCP and some solvent were mixed at 90° C. and reacted for 3 hours to obtain a prepolymer.

[0126] Glass transition temperature (DMA) (Tg) The Tg of the prepreg was measured using a dynamic thermomechanical analyzer "DMA850" manufactured by TA. At this time, the dynamic viscoelasticity measurement (DMA) was performed with the frequency set to 1 Hz in the bending modulus, and the temperature at which tanδ showed a maximum when the temperature was raised from room temperature to 300°C at a heating rate of 5°C / min was set as Tg. The measured data are shown in Tables 2 to 6.

[0127] Copper foil peel strength When making the aforementioned evaluation substrate, the number of overlapping prepreg sheets was set to 6, thereby obtaining a copper-clad laminate (metal-clad laminate) having a thickness of about 0.8 mm and a copper foil with a thickness of 18 μm bonded to both sides. The copper foils on both sides of the formed copper-clad laminate were treated with 3 mm characteristic tape, the remaining copper foils were removed by etching, and the samples were tested using a peel strength tester, and the measured data are shown in Tables 2 to 6.

[0128] Heat resistance (TMA method: T-300) When making the aforementioned evaluation substrate, the number of overlapping prepreg sheets was set to 6, thereby obtaining a copper-clad laminate (metal-clad laminate) having a thickness of about 0.8 mm and a copper foil with a thickness of 18 μm bonded to both sides. According to IPC-TM-650, the delamination burst time at 300°C was measured to evaluate the heat resistance of the aforementioned evaluation substrate, and the measured data are shown in Tables 2 to 6.

[0129] Water absorption Using a high-pressure accelerated aging tester, at 2MPa and 120°C, the water absorption rate after 180 minutes of moisture absorption was measured. The measured data are shown in Tables 2 to 6.

[0130] Dielectric loss factor The dielectric loss factor of the evaluation substrate at 15 GHz was measured using a resonant cavity perturbation method. Specifically, a network analyzer (E5071C manufactured by Keysight Technologies) was used to measure the dielectric loss factor of the evaluation substrate at 15 GHz. The measured data are shown in Tables 2 to 6.

[0131] Volatile Matter The prepreg was prepared by baking in an oven at 150°C for 5 minutes, and then measured at 163°C for 15 minutes. The data are shown in Tables 2 to 6.

[0132] Glue flow Four sheets of 100*100mm prepreg were overlapped and the data were measured at 171°C, 5 min, and 200 psi and are shown in Tables 2 to 6 below.

[0133] Number average molecular weight The number average molecular weight Mn of each prepolymer under different prepolymerization conditions of Examples 1-16 was tested by GPC, and the measured data are shown in Tables 2 to 6.

[0134] Prepreg appearance The appearance of the obtained prepreg was evaluated by visual inspection. The evaluation criteria are as follows.

[0135] ○: Uniform coating, no streaks or uneven resin x: (Streaks or Unevenness): The resin coating is uneven or streaks are visible Table 2 Table 3 Table 4 Table 5 Table 6 From Table 2 and Table 3, it can be seen that: (Example 1-9) (E9 viscosity is too large, and the sample cannot be prepared), when using different prepolymerization temperatures, the higher the prepolymerization temperature, the better the degree of crosslinking of the prepolymer, the higher the Mn, and the lower the Tg, PS, Df, water absorption, Rf, Vc, the better the heat resistance, but the higher the Mn, the worse the fluidity, and due to uneven flow, there will be stripes on the appearance of the prepreg. Among them, low Vc means less volatile acenaphthylene. In general, the performance is better when the prepolymerization temperature is 80-100℃.

[0136] It can be seen from Table 2 and Table 3 that (Examples 4, 10-13) that when different prepolymerization times are used, the longer the prepolymerization time, the better the prepolymerization, with a trend of higher Tg, PS, and Mn, and lower Df, water absorption, Rf, and Vc. However, the performance changes slightly after 2-5 hours, among which low Vc represents less volatilization of acenaphthylene. In general, the performance is better when the prepolymerization temperature is 2-4 hours, and the fluidity has deteriorated after 5 hours, and other performance improvements are small, and the energy consumption is relatively large in actual production.

[0137] It can be seen from Table 2 and Table 3 that (Examples 4, 14-15) the less the amount of promoter D used, the lower the degree of polymerization, the better the fluidity and Df, the smaller the Mn, the worse the Vc and Tg, and the more acenaphthylene volatilizes. Although using more can reduce the volatilization of acenaphthylene (Vc), it has an impact on PS. In general, relative to the total mass fraction of the oligomer B of the aforementioned derivative, which is 100 parts, the content of the aforementioned promoter D is preferably 0.05-0.2 parts.

[0138] In summary, the changes in the prepolymerization time, temperature, and the amount of accelerator D have a great influence on Mn. It can be seen from Table 2 that (Examples 1-15) Mn is preferably 1000-4000, more preferably 1000-2000, and more preferably 1300-1700. At this time, the composition can improve the volatilization of acenaphthylene, stabilize the performance of the board, and will not deteriorate. The composition can obtain high PS, high heat resistance, low Df, and good fluidity, and fully meet the requirements of high-speed and high-performance multi-layer printed circuit boards.

[0139] It can be seen from Table 2 and Table 4 that (Examples 4, 17, and 18) the weight ratio of the resin compound A to the cross-linking curing agent B is 70:30, which is excellent in performance, that is, the weight fraction of the aforementioned resin compound A is preferably 50-90 parts, and more preferably 60-80 parts. In addition, relative to the total weight fraction of the aforementioned resin compound A and the oligomer B of the acenaphthylene compound and its derivatives being 100 parts, the weight fraction of the aforementioned oligomer B of the acenaphthylene compound and its derivatives is preferably 10-50 parts, and more preferably 20-40 parts. It can be seen from Table 2 and Table 4 that (Examples 22 and 23) that too little or too much accelerator C will affect the degree of cross-linking of the resin, and exceeding the limited range will lead to a tendency for the RF / Tg / PS and other properties of the board to deteriorate.

[0140] It can be seen from Table 2 and Table 5 that (Example 4, Comparative Examples 1-5) that the cross-linking curing agent B using acenaphthylene prepolymer has better comprehensive performance than TAIC, DVB810, B-1000, BMI-70, and IMILEX P.

[0141] It can be seen from Table 2 and Table 5 that (Example 4, Comparative Examples 6-7) that the dielectric loss is reduced when the accelerator C uses an azo accelerator without hetero nitrogen atoms other than azo groups. However, the peroxide accelerator and the azo accelerator with hetero nitrogen atoms have -OH or -CN groups with large polarity in the reaction, so the dielectric loss is relatively high.

[0142] It can be seen from Table 2 and Table 6 that (Example 4, Comparative Examples 8-11) that the cross-linked curing agent B in Comparative Example 8, which simply uses acenaphthylene and resin compound A, performs poorly in Df, Vc (acenaphthylene volatilization), and PS. In Comparative Examples 8-10, as the oven drying temperature changes during gluing, acenaphthylene volatilizes, causing Vc to change significantly, and the performance of the board also deteriorates. Compared with Example 4 and Comparative Example 11, the cross-linked curing agent B uses acenaphthylene prepolymer. Even if the oven drying temperature changes during gluing, Vc is stable and the performance is basically unchanged, achieving the effect of improving the volatility of acenaphthylene, good process stability, and better fluidity.

[0143] In order to describe the present invention, the present invention has been appropriately and fully described above through the embodiments, but it should be recognized that those skilled in the art can easily change and improve the above embodiments. Therefore, as long as the modified embodiments or improved embodiments implemented by those skilled in the art do not deviate from the scope of the rights of the claims recorded in the claims, the modified embodiments or improved embodiments can be interpreted as being included in the scope of the rights of the claims.

Claims

1. A resin composition, characterized in that: In parts by weight, it comprises 50-90 parts of compound A, 10-50 parts of prepolymer B and 0.05-2 parts of accelerator; Wherein, compound A has at least one group represented by the following formula (1): ； wherein R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group, an arylene group, or an aryl group; and The number average molecular weight of compound A is 100-7000; The prepolymer B is obtained by prepolymerizing acenaphthylene or a derivative of acenaphthylene under the action of an initiator.

2. The resin composition according to claim 1, wherein: The weight average molecular weight of the prepolymer B is 150-5000.

3. The resin composition according to claim 1, wherein: The accelerator includes an azo compound; The initiator comprises a peroxide compound; The azo compound includes azobisisobutyronitrile; The peroxygen compound includes benzoyl peroxide.

4. The method for preparing a resin composition according to claim 1, wherein: The method comprises the steps of mixing compound A, prepolymer B and accelerator in a solvent and then drying.

5. The resin composition according to claim 1, wherein: The drying temperature is 100-180°C.

6. The use of the resin composition according to claim 1, characterized in that: Used in the preparation of prepreg; or Used in the preparation of films with resin; The prepreg comprises the resin composition and a fiber base material.

7. The use of the resin composition according to claim 6, characterized in that: The fiber substrate includes glass cloth, aramid cloth, polyester cloth, glass non-woven fabric, aramid non-woven fabric, polyester non-woven fabric, pulp paper, or cotton woven fabric.

8. The use of the prepreg according to claim 6, characterized in that: Used in the preparation of metal foil-clad laminates.

9. The use of the metal foil-clad laminate according to claim 1, characterized in that: Used in the preparation of wiring boards.

10. The use of the prepreg according to claim 6, characterized in that: Used in the preparation of copper clad laminates; The copper clad laminate further includes an inorganic filler; The inorganic filler includes silicon dioxide.

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