Frame body assembly and electronic equipment

Abstract

The invention discloses a frame assembly and electronic equipment, and belongs to the technical field of electronic equipment frames. The frame body assembly comprises a frame body part, the inner side of the frame body part is provided with an installation cavity, the circuit board is installed in the installation cavity, the frame body part comprises a conductive frame body part, and the inner side wall of the conductive frame body part is provided with a conductive surface; and the conductive part is installed on the circuit board and electrically connected with the circuit board, and the side, close to the conductive face, of the conductive part makes contact with the conductive face so that the circuit board can be electrically connected with the conductive frame body part. According to the electronic equipment, the electric connection mode is transverse contact, that is, the conductive part is in contact with the conductive surface on the inner side wall of the conductive frame body part, a step structure extending in the transverse direction does not need to be arranged on the inner side of the conductive frame body part, space waste of an installation cavity in the conductive frame body part is avoided, the radial size of the electronic equipment is reduced, and light and thin development is facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device frames, and in particular to a frame assembly and an electronic device. Background Art

[0002] Smart watches are a common electronic device that has functions such as time display, communication, and positioning. The current smart watch frame needs to have waterproof and electrical connection capabilities. On the one hand, it prevents moisture from entering the watch and causing damage to the internal electrical components. On the other hand, it can effectively connect to various components on the circuit board to ensure signal quality.

[0003] However, in the traditional design of smart watches, waterproof and electrical connection solutions will occupy a certain amount of space, resulting in an increase in the size of the smart watch, which is not conducive to the development of thinness. Specifically, in the prior art, the circuit board 2 is electrically connected to the frame 6 through a metal gasket 1, and the frame 6 and the plastic / ceramic structure 5 are sealed through a lateral adhesive 3, such as Figure 1 There is also a metal spring 4 to electrically connect the circuit board 2 and the frame 6, and sealed by a lateral adhesive, such as Figure 2 These prior arts all have the following deficiencies: the contact between the metal gasket 1 or the metal spring 4 and the frame 6 is in the height direction of the watch, and a step structure extending in the horizontal direction needs to be provided on the frame 6. Such a step structure occupies a lot of space inside the watch, which leads to an increase in the radial size of the electronic device to ensure the installation of other components, which is not conducive to the development of lightweight and thinness, and affects the reliability of the electronic device. Summary of the invention

[0004] The present application provides a frame assembly and an electronic device, wherein the frame assembly is used to reduce the radial size of the electronic device while ensuring the stability of the electrical signal.

[0005] To achieve the above purpose, the embodiment of the present application adopts the following technical solution:

[0006] In a first aspect, a frame assembly is provided. The frame assembly is applied to an electronic device. The electronic device includes a circuit board. The frame assembly includes: a frame portion, an installation cavity is provided inside the frame portion, and the circuit board is installed in the installation cavity. The frame portion includes a conductive frame portion, and a conductive surface is provided on the inner side wall of the conductive frame portion; a conductive portion, the conductive portion is installed on the circuit board and electrically connected to the circuit board, and a side of the conductive portion close to the conductive surface is in contact with the conductive surface to electrically connect the circuit board to the conductive frame portion.

[0007] The frame assembly provided in the embodiment of the present application realizes lateral contact by providing a conductive surface on the inner side wall of the conductive frame portion so that the conductive portion contacts the conductive surface, thereby reducing the size of the electronic device, such as the radial size of a watch, and improving the aesthetics and portability of the electronic device. The electrical connection method of the present application is through lateral contact, that is, the conductive portion contacts the conductive surface on the inner side wall of the conductive frame portion, and there is no need to provide a step structure extending laterally on the inner side of the conductive frame portion, thereby avoiding space waste in the mounting cavity inside the conductive frame portion, reducing the radial size of the electronic device, and facilitating the development of thinness. Among them, the above-mentioned lateral direction refers to a direction perpendicular to the height direction of the electronic device, such as the radial direction of a smart watch, the direction parallel to the screen of a smart phone, etc., which is usually a direction parallel to the screen.

[0008] In one embodiment, in order to protect the conductive frame portion, the frame portion further includes an insulating frame, which is sleeved on the conductive frame portion, and a conductive channel is provided inside the insulating frame to connect the outside of the insulating frame and the installation cavity, and the conductive frame portion is partially embedded in the conductive channel and exposed to the insulating frame through the conductive channel. By sleeved on the conductive frame portion, the conductive frame portion is protected from scratches and rust, thereby improving the durability and aesthetics of the electronic device.

[0009] In one embodiment, since the material of the insulating frame is often different from that of the conductive frame portion and is not easy to merge, a waterproof path is generated between the insulating frame and the conductive frame portion, and this path often allows external moisture to flow into the installation cavity. The conductive channel forms a first opening on the inner wall of the insulating frame. The conductive frame portion includes a conductive sheet, a first frame, and a first conductive structure arranged on the first frame. The first conductive structure is embedded in the conductive channel. The conductive sheet is covered on the first opening and is electrically connected to the first conductive structure. The conductive surface is arranged on the conductive sheet. The frame portion also includes a first sealing portion, which is arranged between the first conductive structure and the conductive sheet and extends along the circumference of the first opening. By arranging the first sealing portion between the first conductive structure and the conductive sheet and extending along the circumference of the first opening, the sealing between the conductive frame portion and the conductive channel is achieved, thereby improving the waterproof performance and durability of the electronic device, and reducing the risk of water leakage and maintenance cost of the electronic device.

[0010] In one embodiment, the first conductive structure protrudes from the first opening, the conductive sheet is pressed against the side surface of the first conductive structure close to the mounting cavity, and is welded to the first conductive structure. By protruding the first conductive structure from the first opening, pressing the conductive sheet against the side surface of the first conductive structure close to the mounting cavity, and welding the conductive sheet to the first conductive structure, a close connection between the conductive sheet and the first conductive structure is achieved, thereby improving the electrical connection strength and stability of the electronic device.

[0011] In one embodiment, a plurality of welding auxiliary structures are arranged on the side of the first conductive structure close to the mounting cavity. By arranging a plurality of welding auxiliary structures on the side of the first conductive structure close to the mounting cavity, a tighter and more uniform welding between the conductive sheet and the first conductive structure is achieved, thereby improving the electrical connection quality and reliability of the electronic device, and reducing welding defects and electrical signal interference of the electronic device.

[0012] In one embodiment, the conductive part includes an elastic conductive member, and the elastic conductive member elastically abuts against the conductive surface. By setting the conductive part as an elastic conductive member and elastically abutting against the conductive surface, an adaptive connection between the conductive part and the conductive surface is achieved, thereby improving the electrical connection reliability of the electronic device and reducing poor electrical contact and electrical signal interference of the electronic device.

[0013] In one embodiment, a limiting recess is provided on the conductive surface, and the elastic conductive member can abut against the limiting recess. By providing the limiting recess on the conductive surface and allowing the elastic conductive member to abut against the limiting recess, a more accurate and stable position alignment between the conductive member and the conductive surface is achieved, thereby improving the electrical connection accuracy and reliability of the electronic device.

[0014] In one embodiment, a positioning recess is provided on the inner wall of the insulating frame, the first opening is provided on the positioning recess, the conductive sheet is installed in the positioning recess, and the positioning recess is used to position the conductive sheet. Through the guiding effect of the positioning recess, the conductive sheet can be accurately covered on the first opening and abutted against the positioning recess.

[0015] In one embodiment, the conductive channel forms a second opening on the inner wall of the insulating frame, the conductive frame portion includes a second frame body and a second conductive structure arranged on the second frame body, the second conductive structure is embedded in the conductive channel, and the conductive surface is arranged on a side of the second conductive structure close to the mounting cavity; the frame portion also includes a second sealing portion, and the second sealing portion is arranged between the inner wall of the conductive channel and the second conductive structure.

[0016] In one embodiment, the elastic conductive member includes a conductive spring or a conductive spring.

[0017] In one embodiment, there are multiple conductive surfaces and conductive parts, the multiple conductive parts are arranged at intervals along the circumference of the circuit board, and the multiple conductive parts are in contact with the multiple conductive surfaces. By providing multiple conductive surfaces and conductive parts, and arranging them at intervals along the circumference of the circuit board, multi-point electrical connection between the conductive frame part and the circuit board is achieved, thereby improving the electrical connection efficiency and reliability of the electronic device.

[0018] In one embodiment, the first conductive structure is adapted to the conductive channel, a first step cavity and a second step cavity are arranged inside the conductive channel, the first conductive structure includes a first step and a second step, the position of the first step corresponds to the position of the first step cavity, and the position of the second step corresponds to the position of the second step cavity. The total length of the conductive channel is increased, and a graded seal is formed by matching the conductive structure with the step and step cavity of the conductive channel. In this way, when water vapor and oxygen penetrate from the outside, they will encounter different resistances, thereby reducing their penetration rate.

[0019] A second aspect of the present application provides an electronic device, which includes a frame assembly, a screen assembly, and a cover plate covering the screen assembly, and the frame assembly is the above-mentioned frame assembly.

[0020] Through the above technical solution, since the electronic device includes the above frame assembly, it at least has all the beneficial effects of the frame assembly, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a partial cross-sectional view of a frame structure that uses a metal gasket to transmit electricity in the prior art;

[0022] Figure 2 It is a partial cross-sectional view of a frame structure that uses metal springs to transmit electricity in the prior art;

[0023] Figure 3 A top view of the smart watch provided in an embodiment of the present application;

[0024] Figure 4 for Figure 3 Sectional view at AA in the middle;

[0025] Figure 5 for Figure 4 Enlarged view of area B;

[0026] Figure 6 A partial structural diagram of a conductive sheet and its vicinity provided in an embodiment of the present application;

[0027] Figure 7 The frame assembly provided in the embodiment of the present application is different from Figure 4 A partial cross-sectional view at another location of the cross-sectional view.

[0028] The meanings of the figures are as follows:

[0029] 1. Metal gasket; 2. Circuit board; 3. Adhesive backing; 4. Metal spring; 5. Plastic / ceramic structural parts; 6. Frame;

[0030] 10. Circuit board;

[0031] 20. Frame portion;

[0032] 21. Installation cavity;

[0033] 22, conductive frame portion; 221, conductive surface; 222, first conductive structure; 2221, first stage; 2222, second stage;

[0034] 23. Insulation frame; 231. Positioning recess;

[0035] 24. a first sealing portion;

[0036] 25. conductive sheet; 251. welding auxiliary structure; 252. limiting recess;

[0037] 30. Transparent cover;

[0038] 40. Conductive part; DETAILED DESCRIPTION

[0039] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0040] It should be understood that in the description of the present application, it should be understood that the terms "length", "width", "thickness", "top", "bottom", "inside", "outside", "up", "down", "left", "right", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0041] The terms "first", "second", "third", "fourth", etc. are only used to distinguish descriptions and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. For example, the first push part and the second push part are only used to distinguish different push parts, and their order is not limited. The first push part can also be named as the second push part, and the second push part can also be named as the first push part without departing from the scope of the various described embodiments. And the terms "first", "second", "third", "fourth", etc. do not limit the indicated features to be different.

[0042] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically limited.

[0043] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that three relationships can exist; for example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0044] It should be noted that, in the embodiments of the present application, words such as "in one embodiment", "exemplarily", "for example", etc. are used to indicate examples, illustrations or descriptions. Any embodiment or design described in the embodiments of the present application as "in one embodiment", "exemplarily", "for example" should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "in one embodiment", "exemplarily", "for example", etc. is intended to present related concepts in a specific way.

[0045] In order to make the objectives, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0046] Smart watches in related technologies are a common electronic device that has functions such as time display, communication, and positioning. The frame of current smart watches needs to have waterproof and electrical connection capabilities, on the one hand to prevent moisture from entering the watch and causing damage to internal electrical components, and on the other hand to be able to make effective electrical connections with various components on the circuit board to ensure signal quality.

[0047] However, in the traditional design of smart watches, waterproof and electrical connection solutions will occupy a certain amount of space, resulting in an increase in the size of the smart watch, which is not conducive to the development of thinness. Specifically, in the prior art, the circuit board 2 is electrically connected to the frame 6 through a metal gasket 1, and the frame 6 and the plastic / ceramic structure 5 are sealed through a lateral adhesive 3, such as Figure 1 There is also a metal spring 4 to electrically connect the circuit board 2 and the frame 6, and sealed by a lateral adhesive, such as Figure 2These prior arts all have the following deficiencies: the contact between the metal gasket 1 or the metal spring 4 and the frame 6 is in the height direction of the watch, and a step structure extending in the horizontal direction needs to be provided on the frame 6. Such a step structure occupies a lot of space inside the watch, which leads to an increase in the radial size of the electronic device to ensure the installation of other components, which is not conducive to the development of lightweight and thinness, and affects the reliability of the electronic device.

[0048] Specifically, please refer to Figures 3 to 7 As shown, the frame assembly of the embodiment of the present application is used for an electronic device, and the electronic device includes a circuit board 10, wherein the circuit board 10 is a board that carries electronic components and connecting circuits, and is used to realize various functions of the electronic device. The frame assembly is a shell structure for fixing and protecting the circuit board 10, which can improve the waterproof and electrical connection capabilities of the electronic device. According to the functions and requirements of different electronic devices, the frame assembly can have different shapes, sizes, materials and structures. There are many kinds of electronic devices that can be used for the frame assembly. Smart watches are a common electronic device with functions such as displaying time, communication, and positioning; smart glasses are a new type of electronic device with functions such as displaying images, taking pictures, and recording videos. Of course, electronic devices can also be such as smart phones, tablet computers, laptops, televisions, stereos, etc., and they can also use frame assemblies to ensure their waterproof and electrical connection capabilities.

[0049] The frame assembly of the embodiment of the present application includes: a frame part 20 and a conductive part 40, the inner side of the frame part 20 is provided with an installation cavity 21, the circuit board 10 is installed in the installation cavity 21, the frame part 20 includes a conductive frame part 22, and the inner side wall of the conductive frame part 22 is provided with a conductive surface 221; the conductive part 40 is installed on the circuit board 10 and electrically connected to the circuit board 10, and the side of the conductive part 40 close to the conductive surface 221 is in contact with the conductive surface 221, so that the circuit board 10 is electrically connected to the conductive frame part 22. Among them, the inner side wall of the conductive frame part 22 refers to the side wall located inside the conductive frame part 22 and extending along the height direction of the conductive frame part 22, and the height direction of the conductive frame part 22 refers to the height direction of the electronic device in the normal placement state, usually the direction perpendicular to the screen. By providing the conductive surface 221 on the inner side wall of the conductive frame part 22, the conductive part 40 is in contact with it, and a lateral contact is achieved, thereby reducing the size of the electronic device, such as the radial size of a watch, and improving the aesthetics and portability of the electronic device. The horizontal direction mentioned above refers to a direction perpendicular to the height direction of the electronic device, such as the radial direction of a smart watch, the direction parallel to the screen of a smart phone, etc., which is usually a direction parallel to the screen. Specifically, the traditional electrical connection method is through vertical contact, that is, the conductive part 40 is in contact with the conductive frame part 22 up and down, and it is necessary to set a boss structure extending in the horizontal direction on the conductive frame part 22 (such as Figure 2), such a boss structure occupies a lot of space, which leads to an increase in the radial size of the electronic device, which is not conducive to the development of thinness and lightness, and affects the reliability of the electronic device. The electrical connection method of the present application is through lateral contact, that is, the conductive part 40 contacts the conductive surface 221 on the inner side wall of the conductive frame part 22, and there is no need to set a step structure extending in the lateral direction on the inner side of the conductive frame part 22, which avoids the waste of space in the mounting cavity 21 inside the frame part 20, reduces the radial size of the electronic device, and is conducive to the development of thinness and lightness.

[0050] In addition, by installing the circuit board 10 in the installation cavity 21 of the frame part 20, the frame part 20 protects the circuit board 10, thereby improving the structural strength and stability of the electronic device, and reducing the failure rate and maintenance cost of the electronic device. It should be noted that the frame part 20 is a shell that accommodates the circuit board 10, which is usually made of materials such as metal and / or plastic, and is used to protect the circuit board 10 from external damage and interference; the installation cavity 21 is a space set inside the frame part 20, which is used to accommodate the circuit board 10, so that the circuit board 10 and the frame part 20 form a close fit. By installing the conductive part 40 on the circuit board 10 and electrically connecting it to the circuit board 10, an integrated structure is formed between the conductive part 40 and the circuit board 10, thereby improving the electrical connection efficiency and reliability of the electronic device. The circuit board 10 and the conductive frame part 22 are electrically connected through the conductive part 40 and the conductive surface 221. The conductive frame part 22 not only protects the circuit board 10, but also participates in the transmission of electrical signals and acts as an antenna, which improves the communication capability and positioning accuracy of the electronic device, and improves the function and performance of the electronic device.

[0051] It should be noted that the conductive part 40 is a component electrically connected to the circuit board 10, usually made of materials such as metal or alloy, and is used to achieve electrical connection between the circuit board 10 and the conductive frame part 22; wherein electrical connection is a way to form a transmission of current or electrical signals between two or more electronic components or parts. By contacting the side of the conductive part 40 close to the conductive surface 221 with the conductive surface 221, the circuit board 10 and the conductive frame part 22 are electrically connected, ensuring the communication capability and positioning accuracy of the electronic device, and enhancing the function and performance of the electronic device. The conductive surface 221 is a surface set on the inner side wall of the conductive frame part 22, which is used to contact the conductive part 40 to achieve electrical connection between the conductive frame part 22 and the conductive part 40. By setting the conductive surface 221 on the inner side wall of the conductive frame part 22, the conductive part 40 is in contact with it, and a lateral contact is achieved, thereby reducing the size of the electronic device, such as the radial size of a watch, and improving the aesthetics and portability of the electronic device.

[0052] For example, in an embodiment where the electronic device is a smart phone, a conductive surface 221 is provided on the inner side wall of the conductive frame portion 22 of the smart phone so that the conductive portion 40 contacts it, thereby achieving lateral contact, thereby reducing the size of the smart phone, such as the width of the phone, and improving the aesthetics and portability of the smart phone. The electrical connection between the conductive frame portion 22 and the conductive portion 40 achieves the signal gain between the circuit board 10 and the conductive frame portion 22, thereby improving the wireless network signal and GPS signal of the smart phone, and enhancing the function and performance of the smart phone. Among them, the wireless network signal is an electrical signal transmitted by radio waves or microwaves, etc., and is used to realize the communication between the smart phone and other devices or networks; the GPS signal is an electrical signal transmitted by the satellite positioning system (Global Positioning System), and is used to realize the positioning and navigation of the smart phone.

[0053] Please refer to Figure 3 , Figure 4 and Figure 5 As shown, in an embodiment of an electronic device as a smart watch, by setting a conductive surface 221 on the inner side wall of the conductive frame part 22 of the smart watch, the conductive part 40 is in contact with it, and a lateral contact is achieved, thereby reducing the size of the smart watch, such as the diameter of the watch, and improving the aesthetics and comfort of the smart watch. The conductive frame part 22 is electrically connected to the conductive part 40, and the signal gain of the circuit board 10 and the conductive frame part 22 is achieved, and the signal receiving and sending capabilities of the electronic device are enhanced, and the communication capability and positioning accuracy of the electronic device are improved, and the function and performance of the electronic device are enhanced. For example, the embodiment of the present application can achieve the signal gain of ESIM or spatial positioning technology, so that the electronic device has better call quality and positioning accuracy. It can also be a heart rate signal and a blood oxygen signal, which enhances the function and performance of the smart watch. Among them, the heart rate signal is an electrical signal detected by electrodes or the like, which is used to reflect the heart rate frequency of the wearer of the smart watch; the blood oxygen signal is an electrical signal detected by electrodes or the like, which is used to reflect the oxygen content in the blood of the wearer of the smart watch.

[0054] Please refer to Figure 5As shown, in order to protect the conductive frame portion 22, the frame portion 20 of the embodiment of the present application further includes an insulating frame 23, which is sleeved on the conductive frame portion 22. A conductive channel is provided inside the insulating frame 23 to connect the outside of the insulating frame 23 and the mounting cavity 21. The conductive frame portion 22 is partially embedded in the conductive channel and exposed to the insulating frame 23 through the conductive channel. By sleeved the insulating frame 23 on the conductive frame portion 22, the conductive frame portion 22 is protected from scratches and rust, thereby improving the durability and aesthetics of the electronic device. In some traditional electronic devices, the conductive frame portion 22 is an integral structure made of materials such as metal or alloy, and the outer surface of the conductive frame portion 22 is directly exposed to the outside world, which is easily scratched or rusted, affecting the durability and aesthetics of the electronic device. In the electronic device of the embodiment of the present application, the conductive frame part 22 is a partial structure made of materials such as metal or alloy, the outer surface of the conductive frame part 22 is not directly exposed to the outside, but is set in the insulating frame 23, the insulating frame 23 is an integral structure made of materials such as plastic or rubber, and the inside of the insulating frame 23 is provided with a conductive channel, which is a space that connects the outside of the insulating frame 23 and the installation cavity 21. The conductive frame part 22 is partially embedded in the conductive channel and exposed to the insulating frame 23 through the conductive channel, which makes the outer surface of the conductive frame part 22 protected by the insulating frame 23, not easy to be scratched or rusted, and improves the durability and aesthetics of the electronic device. The conductive frame part 22 not only plays a role in protecting the circuit board 10, but is exposed to the insulating frame 23 through the conductive channel and participates in the transmission of electrical signals, which improves the communication capability and positioning accuracy of the electronic device, and improves the function and performance of the electronic device.

[0055] In a specific application scenario, by sleeve-mounting the insulating frame 23 of the smartphone on the conductive frame portion 22, the conductive frame portion 22 is protected from scratches and rust, thereby improving the durability and aesthetics of the smartphone; by partially embedding the conductive frame portion 22 in the conductive channel and exposing it to the insulating frame 23 through the conductive channel, the conductive frame portion 22 and the insulating frame 23 are fixed to each other, thereby improving the structural strength and stability of the smartphone, and reducing the failure rate and maintenance cost of the smartphone; by providing a conductive surface 221 on the inner side wall of the conductive frame portion 22 so that the conductive portion 40 contacts it, lateral contact is achieved, thereby reducing the size of the smartphone, such as the width of the smartphone, and improving the aesthetics and portability of the smartphone; the conductive frame portion 22 is electrically connected to the conductive portion 40, and the conductive frame is exposed through the conductive channel, thereby achieving signal gain between the circuit board 10 and the conductive frame portion 22, thereby improving the wireless network signal and GPS signal of the smartphone, and enhancing the function and performance of the smartphone.

[0056] In another specific application scenario, by sleeve-mounting the insulating frame 23 of the smart glasses on the conductive frame portion 22, the conductive frame portion 22 is protected from scratches and rust, thereby improving the durability and aesthetics of the smart glasses; by partially embedding the conductive frame portion 22 in the conductive channel and exposing it to the insulating frame 23 through the conductive channel, the fixation between the conductive frame portion 22 and the insulating frame 23 is achieved, thereby improving the structural strength and stability of the smart glasses, and reducing the failure rate and maintenance cost of the smart glasses; by providing a conductive surface 221 on the inner side wall of the conductive frame portion 22 so that the conductive portion 40 contacts it, lateral contact is achieved, thereby reducing the size of the smart glasses, such as the width of the glasses frame, and improving the comfort and portability of the smart glasses; the conductive frame portion 22 is electrically connected to the conductive portion 40, and the conductive frame is exposed through the conductive channel, thereby achieving signal gain between the circuit board 10 and the conductive frame portion 22, thereby improving the interaction function between the smart glasses and external devices.

[0057] Please refer to Figure 5 and Figure 7 As shown, since the material of the insulating frame 23 and the material of the conductive frame body 22 are often different and difficult to merge, a waterproof path will be generated between the insulating frame 23 and the conductive frame body 22, and this path will often allow external moisture to flow into the installation cavity 21. For this reason, the conductive channel of the embodiment of the present application forms a first opening on the inner wall of the insulating frame 23, and the conductive frame body 22 includes a conductive sheet 25, a first frame body, and a first conductive structure 222 arranged on the first frame body. The first conductive structure 222 is embedded in the conductive channel, and the conductive sheet 25 covers the first opening and is electrically connected to the first conductive structure 222. The conductive surface 221 is arranged on the conductive sheet 25; the frame body 20 also includes a first sealing portion 24, which is arranged between the first conductive structure 222 and the conductive sheet 25 and extends along the circumference of the first opening. In the electronic device of the embodiment of the present application, the conductive frame portion 22 is a partial structure made of a material such as metal or alloy. No conductive surface 221 is provided on the inner side wall of the conductive frame portion 22, but a first opening is formed on the inner side wall of the conductive channel. The first opening is a hole provided on the inner side wall of the conductive channel. The conductive frame portion 22 includes a conductive sheet 25, a first frame, and a first conductive structure 222 provided on the first frame. The first conductive structure 222 is a structure adapted to the conductive channel. The first conductive structure 222 is embedded in the conductive channel. The conductive sheet 25 is a structure adapted to the first opening. The conductive sheet 25 is covered on the first opening and is electrically connected to the first conductive structure 222. The conductive surface 221 is a surface provided on the conductive sheet 25. The conductive surface 221 contacts the conductive portion 40 to achieve electrical connection between the conductive frame portion 22 and the conductive portion 40. This makes the conductive surface 221 on the inner side wall of the conductive frame portion 22 not occupy the space of the conductive channel, reduces the size requirement for the insulating portion, and reduces the overall size.

[0058] By setting the first sealing portion 24 between the first conductive structure 222 and the conductive sheet 25 and extending along the circumference of the first opening, the sealing between the conductive frame portion 22 and the conductive channel is achieved, thereby improving the waterproof performance and durability of the electronic device, and reducing the risk of water leakage and maintenance cost of the electronic device. The first conductive structure 222 is a structure adapted to the conductive channel, and the first conductive structure 222 is embedded in the conductive channel to reduce the size of the waterproof path. The conductive sheet 25 is covered on the first opening and electrically connected to the first conductive structure 222. The first sealing portion 24 is a structure set between the first conductive structure 222 and the conductive sheet 25, and the first sealing portion 24 extends along the circumference of the first opening. The waterproof function is achieved by the first sealing portion 24 and the conductive sheet 25, reducing the risk of water leakage and improving the durability of the electronic device. Therefore, compared with traditional electronic devices, the electronic device of the embodiment of the present application realizes the two-in-one of the conductive structure and the waterproof structure, and has higher waterproof performance and durability, lower risk of water leakage and maintenance cost, and better signal strength, while reducing the size of the electronic device, such as the radial size of a watch, and improving the aesthetics and portability of the electronic device.

[0059] For example, in an embodiment where the electronic device is a smart watch, a first sealing portion 24 is provided between the first conductive structure 222 and the conductive sheet 25, and extends along the circumference of the first opening to achieve sealing between the conductive frame portion 22 and the conductive channel, thereby improving the waterproof performance and durability of the smart watch. Among them, a smart watch is a common electronic device that has functions such as displaying time, communication, and positioning. In order to achieve these functions, the smart watch needs to have waterproof and electrical connection capabilities, that is, it can work normally in water, and at the same time, it can be effectively electrically connected to various components on the circuit board 10, and ensure the stability of the signal. The embodiment of the present application can achieve a waterproof level of 5ATM, which is equivalent to a water depth pressure of 50m, so that the electronic device has better waterproof performance.

[0060] In order to realize the electrical connection between the conductive sheet 25 and the first conductive structure 222, the first conductive structure 222 of the embodiment of the present application protrudes from the first opening, and the conductive sheet 25 is attached to the side of the first conductive structure 222 close to the mounting cavity 21, and is welded to the first conductive structure 222. By protruding the first conductive structure 222 from the first opening, and attaching the conductive sheet 25 to the side of the first conductive structure 222 close to the mounting cavity 21, and welding to the first conductive structure 222, a close connection between the conductive sheet 25 and the first conductive structure 222 is realized, thereby improving the electrical connection strength and stability of the electronic device, and reducing poor electrical contact and electrical signal interference of the electronic device. In the electronic device of the embodiment of the present application, the conductive sheet 25 is a planar structure made of a material such as metal or alloy. The conductive sheet 25 is connected to the first conductive structure 222 by welding. The first conductive structure 222 is a structure adapted to the conductive channel. The first conductive structure 222 is embedded in the conductive channel and protrudes from the first opening. The first opening is a hole provided on the inner wall of the conductive channel. The conductive sheet 25 covers the first opening and is attached to the side surface of the first conductive structure 222 close to the mounting cavity 21, and is welded to the first conductive structure 222. This makes the connection between the conductive sheet 25 and the first conductive structure 222 tighter and less prone to loosening or falling off, thereby improving the electrical connection strength and stability of the electronic device. Moreover, through welding, poor electrical contact or electrical signal interference between the conductive sheet 25 and the first conductive structure 222 is reduced, thereby improving the electrical connection efficiency and reliability of the electronic device.

[0061] Please refer to Figure 6 As shown, in order to ensure the welding strength between the first conductive structure 222 and the conductive sheet 25, a plurality of welding auxiliary structures 251 are provided on the side of the first conductive structure 222 close to the mounting cavity 21 in the embodiment of the present application. By providing a plurality of welding auxiliary structures 251 on the side of the first conductive structure 222 close to the mounting cavity 21, a tighter and more uniform welding between the conductive sheet 25 and the first conductive structure 222 is achieved, thereby improving the electrical connection quality and reliability of the electronic device, and reducing the welding defects and electrical signal interference of the electronic device. The welding auxiliary structure 251 is a convex or concave structure provided on the first conductive structure 222, which is used to increase the welding area and pressure between the conductive sheet 25 and the first conductive structure 222, which makes the welding between the conductive sheet 25 and the first conductive structure 222 tighter and more uniform, and is not prone to the phenomenon of insufficient or excessive welding points, thereby improving the electrical connection quality and reliability of the electronic device, and through the welding auxiliary structure 251, welding defects or electrical signal interference are reduced, and the electrical connection efficiency and reliability of the electronic device are improved.

[0062] For example, in an embodiment where the electronic device is a smart watch, by setting a plurality of welding auxiliary structures 251 on the side of the first conductive structure 222 of the smart watch close to the mounting cavity 21, a tighter and more uniform welding is achieved between the conductive sheet 25 and the first conductive structure 222, thereby improving the electrical connection quality and reliability of the smart watch and reducing the welding defects and electrical signal interference of the smart watch.

[0063] Please refer to Figure 5 As shown, the conductive part 40 of the embodiment of the present application includes an elastic conductive member, and the elastic conductive member is elastically pressed against the conductive surface 221. By setting the conductive part 40 as an elastic conductive member and elastically pressing against the conductive surface 221, an adaptive connection between the conductive part 40 and the conductive surface 221 is achieved, thereby improving the electrical connection reliability of the electronic device and reducing poor electrical contact and electrical signal interference of the electronic device. In traditional electronic devices, the conductive part 40 is a rigid structure made of materials such as metal or alloy, and the connection between the conductive part 40 and the conductive surface 221 is by plugging or crimping, which results in the connection between the conductive part 40 and the conductive surface 221 not being tight and uniform enough, and being prone to loosening or falling off, affecting the electrical connection strength and stability of the electronic device, and being prone to poor electrical contact or electrical signal interference between the conductive part 40 and the conductive surface 221, affecting the electrical connection efficiency and reliability of the electronic device. In the electronic device of the embodiment of the present application, the conductive part 40 is an elastic structure made of metal, alloy or other materials, and the conductive part 40 is connected to the conductive surface 221 through elastic abutment. The conductive part 40 is elastically abutted against the conductive surface 221, which makes the connection between the conductive part 40 and the conductive surface 221 tighter and more uniform, and is not prone to loosening or falling off, thereby improving the electrical connection strength and stability of the electronic device. Moreover, through the elastic abutment, the poor electrical contact or electrical signal interference between the conductive part 40 and the conductive surface 221 is reduced, thereby improving the electrical connection efficiency and reliability of the electronic device.

[0064] A limiting recess 252 is provided on the conductive surface 221 of the embodiment of the present application, and the elastic conductive member can be abutted in the limiting recess 252. By providing the limiting recess 252 on the conductive surface 221 and allowing the elastic conductive member to abut in the limiting recess 252, a more accurate and stable position alignment between the conductive part 40 and the conductive surface 221 is achieved, thereby improving the electrical connection accuracy and reliability of the electronic device. In addition, during the installation process, due to the elastic effect of the elastic conductive member, it will collide with the bottom of the limiting recess 252 during the process of entering the limiting recess 252, and there will be a "click" feedback sound. The conductive surface 221 is a surface provided on the inner side wall of the conductive frame portion 22. The conductive surface 221 contacts the conductive portion 40 to achieve electrical connection between the conductive frame portion 22 and the conductive portion 40. This results in the position alignment between the conductive portion 40 and the conductive surface 221 being not accurate and stable enough, and the phenomenon of displacement or sliding is prone to occur, which affects the electrical connection accuracy and reliability of the electronic device. In addition, electrical contact errors or electrical signal interference between the conductive portion 40 and the conductive surface 221 are prone to occur, which affects the electrical connection efficiency and reliability of the electronic device. In the electronic device of the embodiment of the present application, a limiting recess 252 is provided on the conductive surface 221. The limiting recess 252 is a concave structure provided on the conductive surface 221, which is used to limit the position of the conductive portion 40. The conductive portion 40 can be abutted against the limiting recess 252, which makes the position alignment between the conductive portion 40 and the conductive surface 221 more accurate and stable, and is not prone to displacement or sliding, thereby improving the electrical connection accuracy and reliability of the electronic device.

[0065] Please refer to Figure 6As shown, with the development of electronic devices becoming thinner and lighter, the overall size of the frame assembly will also be designed to be very small, which leads to difficulties in the installation and positioning of some components. For this reason, a positioning recess 231 is provided on the inner wall of the insulating frame 23 of the embodiment of the present application, and the first opening is provided on the positioning recess 231. The conductive sheet 25 is installed in the positioning recess 231, and the positioning recess 231 is used to position the conductive sheet 25. In conventional electronic devices, the conductive sheet 25 is a planar structure made of metal or alloy, and the conductive sheet 25 is connected to the insulating frame 23 by covering or bonding. This results in the position alignment between the conductive sheet 25 and the insulating frame 23 being not precise and stable enough, and is prone to displacement or sliding, and even causes the conductive sheet 25 to be unable to completely cover the first opening. A positioning recess 231 is provided on the inner wall of the insulating frame 23 of the embodiment of the present application. The positioning recess 231 is a concave structure provided on the inner wall of the insulating frame 23, and is used to limit the position of the conductive sheet 25. The first opening is provided on the positioning recess 231. Through the guiding effect of the positioning recess 231, the conductive sheet 25 can be accurately covered on the first opening and abut against the positioning recess 231. Among them, the shape of the positioning recess 231 can vary according to the shape and size of the conductive sheet 25, and the following are common ones:

[0066] Circular positioning recess 231: Applicable to the case where the conductive sheet 25 is circular or cylindrical. The diameter of the circular positioning recess 231 should match the diameter of the conductive sheet 25 to ensure the embedding and stability of the conductive sheet 25. The advantages of the circular positioning recess 231 are simple structure and convenient processing. The disadvantage is that the positioning accuracy of the conductive sheet 25 is relatively high, otherwise the conductive sheet 25 is prone to rotation or displacement. Square positioning recess 231: Applicable to the case where the conductive sheet 25 is square or rectangular. The length and width of the square positioning recess 231 should match the length and width of the conductive sheet 25 to ensure the embedding and stability of the conductive sheet 25. The advantage of the square positioning recess 231 is that the positioning accuracy of the conductive sheet 25 is relatively low. The disadvantage is that the structure is complex, processing is difficult, and stress concentration and cracks are prone to occur. Groove-shaped positioning recess 231: This type of positioning recess 231 has a notch, and the notch faces the upper or lower part of the frame assembly. The shape and size of the groove-shaped positioning recess 231 should match the conductive sheet 25 to ensure the embedding and stability of the conductive sheet 25. The advantages of the groove-shaped positioning recess 231 are simple structure, convenient processing, and the ability to achieve directional positioning of the conductive sheet 25.

[0067] In another embodiment of the present application, the sealing of the waterproof path is achieved without the cooperation of the conductive sheet 25 and the first sealing portion 24. Specifically, the conductive channel of the embodiment of the present application forms a second opening on the inner wall of the insulating frame 23, and the conductive frame portion 22 includes a second frame and a second conductive structure arranged on the second frame, the second conductive structure is embedded in the conductive channel, and the conductive surface 221 is arranged on a side of the second conductive structure close to the mounting cavity 21; the frame portion 20 also includes a second sealing portion, and the second sealing portion is arranged between the inner wall of the conductive channel and the second conductive structure. In the electronic device of the embodiment of the present application, the conductive frame portion 22 is a partial structure made of materials such as metal or alloy, the second opening is a hole set on the inner wall of the conductive channel, the second conductive structure is a structure adapted to the conductive channel, the second conductive structure is embedded in the conductive channel and protrudes from the second opening, the conductive surface 221 is a surface set on a side of the second conductive structure close to the mounting cavity 21, the conductive surface 221 contacts the conductive portion 40 to achieve electrical connection between the conductive frame portion 22 and the conductive portion 40, and by setting the second sealing portion between the inner wall of the conductive channel and the second conductive structure, the sealing between the conductive frame portion 22 and the conductive channel is achieved, thereby improving the waterproof performance and durability of the electronic device.

[0068] The elastic conductive member in the embodiment of the present application refers to a material with conductivity and flexibility, which can be used to make various electronic devices, such as conductive springs, conductive gaskets, conductive ropes, conductive wires, etc. The advantage of the elastic conductive member is that it can withstand certain deformations, such as bending, stretching, torsion, etc., without affecting its conductive performance, thereby improving the electrical connection efficiency and reliability of electronic equipment, and reducing electrical contact loss and electrical signal attenuation.

[0069] Preferably, the elastic conductive member of the embodiment of the present application includes a conductive spring or a conductive spring. By setting the elastic conductive member as a conductive spring or a conductive spring and elastically abutting against the conductive surface 221, a more flexible and adjustable electrical connection between the conductive portion 40 and the conductive surface 221 is achieved, while also reducing costs.

[0070] In order to meet the requirements of signal strength, signal diversity, etc., the conductive surface 221 and the conductive part 40 in the embodiment of the present application are both multiple, and the multiple conductive parts 40 are arranged at intervals along the circumference of the circuit board 10, and the multiple conductive parts 40 are in contact with the multiple conductive surfaces 221 respectively. By setting the conductive surface 221 and the conductive part 40 to be multiple, and arranging them at intervals along the circumference of the circuit board 10, a multi-point electrical connection between the conductive frame part 22 and the circuit board 10 is achieved, thereby improving the electrical connection efficiency and reliability of the electronic device. In traditional electronic devices, the conductive surface 221 and the conductive part 40 are both single, and the conductive surface 221 is in contact with the conductive part 40 to achieve a single-point electrical connection between the conductive frame part 22 and the circuit board 10, which results in the electrical connection between the conductive frame part 22 and the circuit board 10 being not uniform and stable enough, affecting the electrical connection efficiency and reliability of the electronic device. In the electronic device of the embodiment of the present application, there are multiple conductive surfaces 221 and multiple conductive parts 40, and the multiple conductive surfaces 221 and multiple conductive parts 40 are in contact with each other to achieve multi-point electrical connection between the conductive frame part 22 and the circuit board 10. The multiple conductive parts 40 are arranged at intervals along the circumference of the circuit board 10, which makes the electrical connection between the conductive frame part 22 and the circuit board 10 more uniform and stable, and is not prone to poor electrical contact or electrical signal interference, thereby improving the electrical connection efficiency and reliability of the electronic device. On the other hand, the multiple conductive parts 40 can be electrically connected to different modules on the circuit board 10 respectively to improve the signal strength of different modules, such as one of the multiple conductive parts 40 is electrically connected to the esim module, another is electrically connected to the indoor positioning module, and the remaining are electrically connected to other modules.

[0071] In the embodiment where the electronic device is a smart watch, by providing a plurality of conductive surfaces 221 and conductive parts 40 of the smart watch and arranging them at intervals along the circumference of the circuit board 10, a multi-point electrical connection between the conductive frame part 22 and the circuit board 10 is achieved, thereby improving the electrical connection efficiency and reliability of the smart watch. At the same time, by electrically connecting the plurality of conductive parts 40 to the esim module, indoor positioning module and other modules respectively, the signal enhancement of different modules can be achieved, thereby ensuring the stability of various functions of the smart watch.

[0072] In order to further improve the sealing performance, the first conductive structure 222 of the embodiment of the present application is adapted to the conductive channel. At the same time, the conductive channel is provided with a first step cavity and a second step cavity. The first conductive structure 222 includes a first step 2221 and a second step 2222. The position of the first step 2221 corresponds to the position of the first step cavity, and the position of the second step 2222 corresponds to the position of the second step cavity, thereby increasing the total length of the conductive channel, and using the matching of the conductive structure and the step and step cavity of the conductive channel to form a graded seal. In this way, when water vapor and oxygen penetrate from the outside, they will encounter different resistances, thereby reducing their penetration rate.

[0073] The frame is generally covered with a transparent cover plate 30 for protecting the dial and other mechanisms. The transparent cover plate is covered on the insulating frame and connected to the insulating frame by glue or adhesive. The first sealing part and the second sealing part can also be made of glue or adhesive, as long as the material structure can achieve sealing and connection.

[0074] According to the second aspect of the present application, an electronic device is provided, the electronic device comprising a circuit board and a frame assembly, wherein the frame assembly is the frame assembly described above, the circuit board is the circuit board described above, and the electronic device may further comprise a dial, a speaker, a transparent cover plate, etc., and the transparent cover plate is preferably a glass cover plate. The electronic device may be a smart watch, smart glasses, or a smart phone, a tablet computer, a laptop computer, a television, a stereo, etc., and they may also use a frame assembly to ensure their waterproof and electrical connection capabilities.

[0075] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A frame assembly, It is characterized in that The frame assembly is used for an electronic device, the electronic device includes a circuit board, and the frame assembly includes: A frame portion, wherein a mounting cavity is disposed inside the frame portion, wherein the circuit board is mounted in the mounting cavity, wherein the frame portion comprises a conductive frame portion, wherein a conductive surface is disposed on an inner side wall of the conductive frame portion; A conductive part is mounted on the circuit board and electrically connected to the circuit board, and a side of the conductive part close to the conductive surface contacts the conductive surface so that the circuit board is electrically connected to the conductive frame part.

2. The frame assembly according to claim 1, It is characterized in that The frame body also includes an insulating frame, which is sleeved on the conductive frame body. A conductive channel is provided inside the insulating frame to connect the outside of the insulating frame and the installation cavity. The conductive frame body is partially embedded in the conductive channel and exposed to the insulating frame through the conductive channel.

3. The frame assembly according to claim 2, It is characterized in that The conductive channel forms a first opening on the inner side wall of the insulating frame, the conductive frame portion comprises a conductive sheet, a first frame, and a first conductive structure arranged on the first frame, the first conductive structure is embedded in the conductive channel, the conductive sheet is covered on the first opening and is electrically connected to the first conductive structure, and the conductive surface is arranged on the conductive sheet; The frame portion further includes a first sealing portion, which is disposed between the first conductive structure and the conductive sheet and extends along a circumferential direction of the first opening.

4. The frame assembly according to claim 3, It is characterized in that The first conductive structure protrudes from the first opening, and the conductive sheet is attached to a side surface of the first conductive structure close to the installation cavity and is welded to the first conductive structure.

5. The frame assembly according to claim 4, It is characterized in that A plurality of welding auxiliary structures are arranged on a side surface of the first conductive structure close to the installation cavity.

6. The frame assembly according to claim 1, It is characterized in that The conductive part includes an elastic conductive member, and the elastic conductive member elastically abuts against the conductive surface.

7. The frame assembly according to claim 6, It is characterized in that A limiting recess is arranged on the conductive surface, and the elastic conductive member can abut against the limiting recess.

8. The frame assembly according to claim 3, It is characterized in that A positioning recess is provided on the inner wall of the insulating frame, the first opening is provided on the positioning recess, the conductive sheet is installed in the positioning recess, and the positioning recess is used to position the conductive sheet.

9. The frame assembly according to claim 2, It is characterized in that The conductive channel forms a second opening on the inner side wall of the insulating frame, the conductive frame portion includes a second frame, and a second conductive structure arranged on the second frame, the second conductive structure is embedded in the conductive channel, and the conductive surface is arranged on a side of the second conductive structure close to the mounting cavity; The frame portion further includes a second sealing portion, and the second sealing portion is disposed between an inner wall of the conductive channel and the second conductive structure.

10. The frame assembly according to claim 6, It is characterized in that The elastic conductive member includes a conductive spring or a conductive spring.

11. The frame assembly according to any one of claims 2 to 10, It is characterized in that There are a plurality of the conductive surfaces and a plurality of the conductive parts, the plurality of the conductive parts are arranged at intervals along the circumference of the circuit board, and the plurality of the conductive parts are in contact with the plurality of the conductive surfaces respectively.

12. The frame assembly according to claim 3, It is characterized in that The first conductive structure is adapted to the conductive channel, a first step cavity and a second step cavity are provided inside the conductive channel, the first conductive structure includes a first step and a second step, the position of the first step corresponds to the position of the first step cavity, and the position of the second step corresponds to the position of the second step cavity.

13. An electronic device, It is characterized in that The electronic device comprises a circuit board and a frame assembly, wherein the frame assembly is the frame assembly according to any one of claims 1 to 12, and the circuit board is the circuit board according to any one of claims 1 to 12.

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