Radio frequency module, preparation method thereof and electronic equipment

Abstract

According to the radio frequency module, the preparation method thereof and the electronic equipment provided by the invention, the electric connection between the first electronic device and the second electronic device is realized by replacing a binding wire with the conductive layer, the packaging form evolution limitation of the radio frequency module can be avoided, and the decoupling capability of the first electronic device and the second electronic device is improved. The radio frequency module comprises a first electronic device, a second electronic device, a dielectric layer and a conductive layer. The first electronic device comprises a first terminal pad, and the second electronic device comprises a second terminal pad. The dielectric layer comprises first through holes and second through holes, and the number of the first through holes is m. The conductive layer is arranged on the dielectric layer and comprises a first conductive branch and a second conductive branch; the number of the first conductive branches is m, and the ith first conductive branch is electrically connected with the first connecting disc through the ith first through hole; the second conductive branch is electrically connected with the second connecting disc through the second through hole; wherein m is an integer larger than or equal to 2, and i is a positive integer smaller than or equal to m.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a radio frequency module and a preparation method thereof, and an electronic device. Background Art

[0002] In mobile communication networks, RF carrier signals are amplified by RF power tubes and then transmitted from antennas to space. RF power tubes are mainly composed of amplifier bare cores, capacitor bare cores, bonding wires, and packaging structures. Traditionally, bonding wires are used to electrically connect the pads of any two bare cores to achieve impedance matching and transmit DC and RF signals.

[0003] However, a single binding wire is connected between two bare cores in a one-to-one point-to-point manner, and the number of connection nodes connected to multiple binding wires in the pads of the two bare cores is the same, resulting in low decoupling capabilities of the corresponding two bare cores, reducing the freedom of chip design. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides a radio frequency module and a preparation method thereof, and an electronic device, which utilizes a conductive layer instead of a binding wire to realize electrical connection between a first electronic device and a second electronic device, thereby avoiding the limitation of the packaging morphology evolution of the radio frequency module and improving the decoupling capability between the first electronic device and the second electronic device.

[0005] In a first aspect, the present application provides a radio frequency module, which includes a first electronic device, a second electronic device, a dielectric layer, and a conductive layer. The first electronic device includes a first connection pad, and the second electronic device includes a second connection pad. The dielectric layer covers the first electronic device and the second electronic device, and the dielectric layer includes a first through hole and a second through hole, and the number of the first through holes is m. The conductive layer is arranged on the dielectric layer, and the conductive layer includes a first conductive branch and a second conductive branch; the number of the first conductive branches is m, and the i-th first conductive branch is electrically connected to the first connection pad through the i-th first through hole; the second conductive branch is electrically connected to the second connection pad through the second through hole; wherein m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

[0006] In the present application, a binding wire is no longer used to connect the first electronic device and the second electronic device, but a dielectric layer and a conductive layer are sequentially formed on the first electronic device and the second electronic device. The first through hole of the dielectric layer exposes the first connection disk, and the first through hole in the dielectric layer exposes m connection nodes on the first connection disk, so that the first conductive branch in the conductive layer is electrically connected to the first connection disk through the m first through holes; the second through hole in the dielectric layer exposes the connection node on the second connection disk, so that the second conductive branch in the conductive layer is electrically connected to the second connection disk through the second through hole, thereby connecting the first electronic device and the second electronic device using the conductive layer. In this way, it can be avoided that the packaging form of the RF module is limited due to the three-dimensional structure of the binding wire, and it is not conducive to stacking with other components or circuit boards. Among them, the connection node refers to: the part of the first connection disk exposed by the first through hole, and the part of the second connection disk exposed by the second through hole. It can also be said that the part of the first connection disk that is in direct contact with the first conductive branch, and the part of the second connection disk that is in direct contact with the second conductive branch.

[0007] Moreover, the first conductive branch and the second conductive branch can be equivalent to an inductor. The present application changes the connection path between the first conductive branch and the second conductive branch by changing the pattern of the first conductive branch and the second conductive branch, thereby changing the physical length of the first conductive branch and the second conductive branch. By adjusting the physical length of the first conductive branch and the second conductive branch, and the connection method of the second conductive branch and the m first conductive branches, the inductor can achieve any required equivalent inductance value. Therefore, the present application does not limit the number of the first conductive branch (first through hole) and the second conductive branch (second through hole), as long as the number of the first conductive branch and the first through hole is m. It can also be said that the scheme of the present application does not limit the number of the first through holes to be the same as the number of the second through holes, nor does it limit the number of the first conductive branches to be the same as the number of the second conductive branches. Therefore, the scheme of the present application can improve the decoupling capability of the first electronic device and the second electronic device, and improve the freedom of chip design.

[0008] On this basis, in order to meet the requirement that the first electronic device and the second electronic device are electrically connected through multiple connection nodes, the related art has a large number of binding wires (for example, 7), that is, 7 binding wires are connected in parallel, which leads to a decrease in the equivalent inductance value of the inductor, and the realization of a larger equivalent inductance value is limited. Furthermore, the number of 7 connection nodes and 7 binding wires in the related art is reduced to 4, but the number of connection nodes is sacrificed, which violates the design requirements. Furthermore, the related art proposes to extend the physical length of the 7 binding wires without reducing the number of connection nodes to increase the equivalent inductance value. However, the increase in the physical length of the binding wire means that the spacing between the first electronic device and the second electronic device increases, which leads to an increase in the size of the RF module, and also indirectly affects the material cost.

[0009] The solution of the embodiment of the present application can make the inductor achieve any required equivalent inductance value by adjusting the physical length of the first conductive branch and the second conductive branch, and the connection mode of the second conductive branch and the m first conductive branches, without increasing the distance between the first electronic device and the second electronic device. Therefore, the reduction of the equivalent inductance value of the inductor can be avoided, and the size of the RF module can be avoided.

[0010] In some possible implementations, at least two adjacent first conductive branches are connected to the first connecting portion, and the second conductive branch is connected to the first connecting portion.

[0011] In some possible implementations, the number of second through holes is n, the number of second conductive branches is n, and the jth second conductive branch is electrically connected to the second connection plate through the jth second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n. By designing the number n, m first conductive branches are electrically connected to n second conductive branches; by designing the physical length of each second conductive branch and the physical length of each first conductive branch, different inductor inductance values ​​can be achieved.

[0012] In some possible implementations, at least two adjacent second conductive branches are connected to the second connecting portion. The conductive layer further includes a connecting conductive branch, which is respectively connected to the first connecting portion and the second connecting portion.

[0013] In order to improve the phase balance of each connection node and avoid the large difference in the path length from the m connection nodes on the first connection disk to the n connection nodes on the second connection disk through the conductive layer, which leads to a large difference in the signal delay between each path when transmitting signals from the m connection nodes on the first connection disk to the n connection nodes on the second connection disk, optionally, the total length of any first conductive branch is L1, and the total length range of other first conductive branches is (1-0.3)L1 to (1+0.3)L1; wherein L1 is a positive number. And / or, when the number of second conductive branches is n, the total length of any second conductive branch is L2, and the total length of other second conductive branches is (1-0.3)L2 to (1+0.3)L2; wherein L2 is a positive number.

[0014] Furthermore, the total lengths of the m first conductive branches are the same; and / or the total lengths of the n second conductive branches are the same. In this way, the path length from any connection node on the first connection disk to any connection node on the second connection disk through the conductive layer is the same as the path length from other connection nodes on the first connection disk to other connection nodes on the second connection disk through the conductive layer, and when transmitting signals from the m connection nodes on the first connection disk to the n connection nodes on the second connection disk, the signal delays between the various paths are the same.

[0015] In some possible implementations, in the scenario of power synthesis, a multi-cell design may be adopted, where the number of first connection pads in the first electronic device is multiple, and the number of second connection pads in the second electronic device is multiple. The m first conductive branches are all electrically connected to the same first connection pad; or, the m first conductive branches are respectively electrically connected to different first connection pads; and / or, the n second conductive branches are all electrically connected to the same second connection pad; or, the n second conductive branches are respectively electrically connected to different second connection pads.

[0016] In some possible implementations, the first conductive branch is electrically connected to m first connection nodes in the first connection disk, and the second conductive branch is electrically connected to n second connection nodes in the second connection disk. The spacing between each two adjacent first connection nodes is the same as the spacing between each two adjacent second connection nodes; or the spacing between each two adjacent first connection nodes is different from the spacing between each two adjacent second connection nodes.

[0017] In some possible implementations, in a power synthesis scenario, a multi-chip circuit combining design may be adopted, where the number of conductive layers is multiple and the multiple conductive layers are arranged on the same layer.

[0018] In some possible implementations, the first conductive branches of the multiple conductive layers are electrically connected to different first connection pads of the same first electronic device, and the second conductive branches of the multiple conductive layers are electrically connected to different second connection pads of the same second electronic device.

[0019] In some possible implementations, there are multiple first electronic devices, and the second electronic devices are located between adjacent first electronic devices; and / or there are multiple second electronic devices, and the first electronic devices are located between adjacent second electronic devices.

[0020] In a second aspect, the present application provides a method for preparing a radio frequency module, comprising: providing a first electronic device and a second electronic device, the first electronic device comprising a first connection pad, and the second electronic device comprising a second connection pad. Covering the first electronic device and the second electronic device with a dielectric layer, the dielectric layer comprising a first through hole and a second through hole, the number of the first through holes being m. Forming a conductive layer on the dielectric layer, the conductive layer comprising a first conductive branch and a second conductive branch; the number of the first conductive branches is m, the i-th first conductive branch is electrically connected to the first connection pad through the i-th first through hole; the second conductive branch is electrically connected to the second connection pad through the second through hole; wherein m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

[0021] In some possible implementations, every at least two adjacent first conductive branches are connected to the first connecting portion, and the second conductive branch is connected to the first connecting portion.

[0022] In some possible implementations, the number of second through holes is n, the number of second conductive branches is n, and the jth second conductive branch is electrically connected to the second connecting plate through the jth second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n.

[0023] In some possible implementations, every two adjacent second conductive branches are connected to the second connection portion, and / or every three adjacent second conductive branches are connected to the second connection portion. The conductive layer further includes a connecting conductive branch, which is respectively connected to the first connection portion and the second connection portion.

[0024] In some possible implementations, the total length of any first conductive branch is L1, and the total length range of other first conductive branches is (1-0.3)L1 to (1+0.3)L1; wherein L1 is a positive number; and / or, when the number of second conductive branches is n, the total length of any second conductive branch is L2, and the total length range of other second conductive branches is (1-0.3)L2 to (1+0.3)L2; wherein L2 is a positive number.

[0025] In some possible implementations, the total lengths of the m first conductive branches are all the same; and / or, when the number of the second conductive branches is n, the total lengths of the n second conductive branches are all the same.

[0026] The second aspect and any implementation of the second aspect correspond to the first aspect and any implementation of the first aspect respectively. The technical effects corresponding to the second aspect and any implementation of the second aspect can refer to the technical effects corresponding to the above-mentioned first aspect and any implementation of the first aspect, which will not be repeated here.

[0027] In a third aspect, the present application provides an electronic device, comprising a circuit board and the radio frequency module described in the first aspect, wherein the radio frequency module is arranged on the circuit board.

[0028] The third aspect and any implementation of the third aspect correspond to the first aspect and any implementation of the first aspect, respectively. The technical effects corresponding to the third aspect and any implementation of the third aspect can refer to the technical effects corresponding to the first aspect and any implementation of the first aspect, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1a A schematic diagram of an amplifier die and a capacitor die being electrically connected via a binding wire provided in the related art;

[0030] Figure 1b for Figure 1a Side view of

[0031] Figure 2 A schematic diagram of a radio frequency module provided in an embodiment of the present application;

[0032] Figure 3a A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0033] Figure 3b A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0034] Figure 3c A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0035] Figure 4a A top view of the binding wire provided for related art;

[0036] Figure 4b A top view of the binding wire provided for related art;

[0037] Figure 4c A top view of the binding wire provided for related art;

[0038] Figure 5a A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0039] Figure 5b A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0040] Figure 6 A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0041] Figure 7 A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0042] Figure 8a A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0043] Figure 8b A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0044] Figure 8c A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0045] Figure 8d A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0046] Figure 9a A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0047] Figure 9b A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0048] Fig.9c A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0049] Figure 9d A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0050] Fig.10a A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0051] Fig.10b A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0052] Fig.10c A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0053] Fig.11a A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0054] Fig.11b A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0055] Fig.12a A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0056] Figure 12b A schematic diagram of the structure of the conductive layer, the first connection pad and the second connection pad provided in an embodiment of the present application;

[0057] Fig.13 A schematic diagram of a radio frequency module provided in an embodiment of the present application;

[0058] Fig.14a A schematic diagram of a radio frequency module provided in an embodiment of the present application;

[0059] Fig.14b A schematic diagram of a radio frequency module provided in an embodiment of the present application;

[0060] Fig.15A flow chart for preparing the RF module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0061] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0062] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone.

[0063] The terms "first" and "second" in the description and claims of the embodiments of the present application are used to distinguish different objects rather than to describe a specific order of objects. For example, a first target object and a second target object are used to distinguish different target objects rather than to describe a specific order of target objects.

[0064] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0065] In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" refers to two or more than two. For example, multiple processing units refer to two or more processing units; multiple systems refer to two or more systems.

[0066] An embodiment of the present application provides an electronic device, which may be a communication electronic product, a consumer electronic product, a household electronic product, a vehicle-mounted electronic product, a financial terminal product, or other device that includes a radio frequency chip.

[0067] Communication electronic products include servers, storage devices, radars, base stations and other communication equipment that contain electronic devices such as radio frequency chips. Consumer electronic products include mobile phones, tablet computers, laptops, personal computers (PCs), personal digital assistants (PDAs), smart wearable products (e.g., smart watches, smart bracelets, etc.), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, drones, etc. Home electronic products include smart door locks, TVs, smart speakers, refrigerators, sweeping robots, etc. Car-mounted electronic products include car navigation systems, car displays, etc. Financial terminal products include automated teller machines (ATMs), self-service terminals, etc.

[0068] Taking the RF power tube as an example, the RF power tube includes a RF chip. Figure 1a and Figure 1b As shown, the RF power tube includes an amplifier bare core 11, a capacitor bare core 12, a binding wire 13 and a packaging structure, and a flange 14 is used as a grounding layer to carry the amplifier bare core and the capacitor bare core, and at the same time, the amplifier bare core 11 and the capacitor bare core 12 are electrically connected to the grounding layer respectively. Among them, in the circuit topology of the RF power tube, the binding wire 14 can be equivalent to an inductor, and different equivalent inductance values ​​can be achieved through different connection parameters.

[0069] like Figure 1a and Figure 1b As shown, in RF design and application, the pad nodes within the same chip need to consider the equipotential design requirements in the dimension of distributed parameters to avoid internal signal convection and increase additional losses. For example, multiple binding wires 13 are usually used to connect the pads in the amplifier bare core 11 and the pads in the capacitor bare core 12. It can be seen from the bonding equipment of the binding wire and its process implementation principle that each binding wire 13 is independent, and multiple binding wires 13 are prepared one by one. The preparation process is affected by factors such as the size of the equipment splitter, line type, and tolerance.

[0070] However, the solution of connecting the amplifier bare core 11 and the capacitor bare core 12 with the binding wire 13 has the following two defects:

[0071] First, a single binding wire is connected between the amplifier bare core 11 and the capacitor bare core 12 in a one-to-one point-to-point manner. The number of connection nodes connected to multiple binding wires 13 in the solder pads of the amplifier bare core 11 and the capacitor bare core 12 must be the same, and the positions must correspond one to one. That is, the decoupling ability of the amplifier bare core 11 and the capacitor bare core 12 is low, which reduces the freedom of chip design.

[0072] In the present application, the poor decoupling capability of the amplifier core 11 and the capacitor core 12 means that, when the relative positions of the amplifier core 11 and the capacitor core 12 remain unchanged, removing a connection node in the amplifier core 11 or the capacitor core 12 will cause an irreversible change in the equivalent inductance value of the inductor. Therefore, it is considered that the number and position of the connection nodes in the solder pads of the amplifier core 11 and the capacitor core 12 must correspond one to one, and cannot be arbitrarily decoupled.

[0073] Second, the binding wire 13 is a three-dimensional structure, and space needs to be reserved in the longitudinal direction (Z direction in the figure), which limits the evolution of the module packaging form and is not conducive to stacking and assembling with other components or circuit boards.

[0074] Based on this, Figure 2 As shown, an embodiment of the present application provides a radio frequency module, which may include a first electronic device and a second electronic device. The embodiment of the present application does not limit the first electronic device and the second electronic device, and the first electronic device and the second electronic device may be any two electronic devices that need to be electrically connected through a pad.

[0075] For example, the first electronic device and the second electronic device may be a bare chip, a redistribution layer, an integrated passive device (IPD), etc.

[0076] The first electronic device 21 includes a first connection pad 211, and the second electronic device includes a second connection pad 221. The first connection pad 211 may also be referred to as a solder pad or other, and the second connection pad 221 may also be referred to as a solder pad or other.

[0077] like Figure 2 As shown, the RF module further includes a dielectric layer 30 and a conductive layer 40 (in the RF field, the conductive layer 40 is used to transmit RF signals) stacked sequentially on the first electronic device 21 and the second electronic device 22. Figure 3aAs shown, the dielectric layer 30 covers the first electronic device 21 and the second electronic device 22, and the dielectric layer 30 includes a first through hole and a second through hole, and the number of the first through holes is m. The conductive layer 40 includes a first conductive branch 41 and a second conductive branch 42, and the number of the first conductive branches 41 is m. The i-th first conductive branch 41 is electrically connected to the first connection pad 211 through the i-th first through hole; the second conductive branch 42 is electrically connected to the second connection pad 221 through the second through hole. Wherein, m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

[0078] In the present application, the binding wire 13 is no longer used to connect the first electronic device 21 and the second electronic device 22, but a dielectric layer 30 and a conductive layer 40 are sequentially formed on the first electronic device 21 and the second electronic device 22. The first through hole of the dielectric layer 30 exposes the first connection pad 211, and the first through hole in the dielectric layer 30 exposes m connection nodes on the first connection pad 211, so that the first conductive branch 41 in the conductive layer 40 is electrically connected to the first connection pad 211 through the m first through holes; the second through hole in the dielectric layer 30 exposes the connection node on the second connection pad 221, so that the second conductive branch 42 in the conductive layer 40 is electrically connected to the second connection pad 221 through the second through hole, thereby connecting the first electronic device 41 and the second electronic device using the conductive layer 40. In this way, it can be avoided that the packaging form evolution of the RF module is limited due to the three-dimensional structure of the binding wire 13, and it is not conducive to stacking with other components or circuit boards. The connection node refers to the portion of the first connection pad 211 exposed by the first through hole and the portion of the second connection pad 221 exposed by the second through hole. In other words, the portion of the first connection pad 211 directly in contact with the first conductive branch 41 and the portion of the second connection pad 221 directly in contact with the second conductive branch 42.

[0079] Moreover, the first conductive branch 41 and the second conductive branch 42 can be equivalent to an inductor. The embodiment of the present application changes the connection path of the first conductive branch 41 and the second conductive branch 42 by changing the pattern of the first conductive branch 41 and the second conductive branch 42, thereby changing the physical length of the first conductive branch 41 and the second conductive branch 42. By adjusting the physical length of the first conductive branch 41 and the second conductive branch 42, and the connection mode of the second conductive branch 42 and the m first conductive branches 41, the inductor can achieve any required equivalent inductance value. Therefore, the embodiment of the present application does not limit the number of the first conductive branch 41 (first through hole) and the second conductive branch 42 (second through hole), as long as the number of the first conductive branch 41 and the first through hole is m. It can also be said that the solution of the embodiment of the present application does not limit the number of the first through hole to be the same as the number of the second through hole, nor does it limit the number of the first conductive branch 41 to be the same as the number of the second conductive branch 42. Therefore, the solution of the embodiment of the present application can improve the decoupling ability of the first electronic device 21 and the second electronic device 22, and improve the freedom of chip design.

[0080] On this basis, if Figure 4a As shown, in order to meet the requirement that the first electronic device 21 and the second electronic device 22 are electrically connected through multiple connection nodes, the number of binding wires 13 is very large (for example, 7), that is, 7 binding wires 13 are connected in parallel, resulting in a decrease in the equivalent inductance value of the inductor, and a larger equivalent inductance value is limited. Figure 4b As shown, the number of 7 connection nodes and 7 binding wires 13 in the related art is reduced to 4, but the number of connection nodes is sacrificed, which is contrary to the design requirements. Figure 4c As shown, the related art proposes to extend the physical length of the seven binding wires 13 without reducing the number of connection nodes to increase the equivalent inductance value. However, the increase in the physical length of the binding wires 13 means that the distance between the first electronic device 21 and the second electronic device 22 increases, thereby increasing the size of the RF module and indirectly affecting the material cost.

[0081] In the embodiment of the present application, without increasing the spacing between the first electronic device 21 and the second electronic device 22, the inductor can achieve any desired equivalent inductance value by adjusting the physical length of the first conductive branch 41 and the second conductive branch 42, and the connection mode between the second conductive branch 42 and the m first conductive branches 41. Therefore, the reduction of the equivalent inductance value of the inductor can be avoided, and the size of the RF module can also be avoided.

[0082] The connection relationship between the second conductive branch 42 and the first conductive branch 41 in the conductive layer 40 when m has different values ​​is exemplarily described below with reference to the accompanying drawings.

[0083] For example, Figure 3a-3c As shown, m=2, the number of the first through holes and the first conductive branches 41 are both 2, and the number of the first through holes and the second conductive branches 42 are both 1. The two first conductive branches 41 are electrically connected to the first connection pad 211 through the first through holes, and the one second conductive branch 42 is electrically connected to the second connection pad 221 through the second through hole. The two first conductive branches 41 are connected to the first connection portion a, and the second conductive branch 42 is connected to multiple first connection portions a.

[0084] Assuming that the equivalent inductance value of the inductor formed by the second conductive branch 42 and the two first conductive branches 41 is L, the equivalent inductance value from the connection node A1 on the first connection disk 211 to the first connection portion a is L(1-1), and the distance from the connection node A1 on the first connection disk 211 to the first connection portion a in the Y direction is d1; the equivalent inductance value from the connection node A2 on the first connection disk 211 to the first connection portion a is L(1-2), and the distance from the connection node A2 on the first connection disk 211 to the first connection portion a in the Y direction is d1; the equivalent inductance value from the connection node B on the second connection disk 221 to the first connection portion a is L(2-1), and the distance from the connection node B on the second connection disk 221 to the first connection portion a in the Y direction is d2.

[0085] The equivalent inductance value L of the inductor is L=L(2-1)+L(1-1) / / L(1-2). By adjusting the ratio of d1 to d2, the equivalent inductance value L of the inductor can be adjusted.

[0086] For example, Figure 5a and Figure 5b As shown, m=3, the number of the first through hole and the first conductive branch 41 are both 3, and the number of the second through hole and the second conductive branch 42 are both 1. Every three adjacent first conductive branches 41 are connected to the first connection portion a, and the second conductive branch 42 is connected to multiple first connection portions a. Similarly, the equivalent inductance value L of the inductor can be adjusted by adjusting the distance between the first conductive branch 41 and the second conductive branch 42 in the Y direction.

[0087] For example, Figure 6 As shown, m=4, the number of the first through hole and the first conductive branch 41 are both 4, and the number of the second through hole and the second conductive branch 42 are both 1. The first first conductive branch 41 and the second first conductive branch 41 are connected to the first connecting portion a1, and the third first conductive branch 41 and the fourth first conductive branch 41 are connected to the first connecting portion a2. On this basis, the conductive layer 40 further includes a connecting conductive branch 43, which is respectively connected to the second conductive branch 42, the first connecting portion a1, and the first connecting portion a2.

[0088] Similarly, the equivalent inductance value L of the inductor can be adjusted by adjusting the physical lengths of the four first conductive branches 41 , the connecting conductive branch 43 , and the second conductive branch 42 .

[0089] For example, Figure 7 As shown, m=5, the number of the first through hole and the first conductive branch 41 are both 5, and the number of the second through hole and the second conductive branch 42 are both 1. The first first conductive branch 41 and the second first conductive branch 41 are connected to the first connecting portion a1, and the third first conductive branch 41, the fourth first conductive branch 41, and the fifth first conductive branch 41 are connected to the first connecting portion a2. On this basis, the conductive layer 40 further includes a connecting conductive branch 43, which is respectively connected to the second conductive branch 42, the first connecting portion a1, and the first connecting portion a2.

[0090] Similarly, the equivalent inductance value L of the inductor can be adjusted by adjusting the physical lengths of the five first conductive branches 41 , the connecting conductive branch 43 , and the second conductive branch 42 .

[0091] The above examples are based on the example that every two adjacent first conductive branches 41 are connected to the first connection part, and / or every three adjacent first conductive branches 41 are connected to the first connection part. Of course, more first conductive branches 41 can also be connected to the first connection part. That is, every at least two adjacent first conductive branches 41 are connected to the first connection part.

[0092] In some possible implementations, the embodiment of the present application does not limit the arrangement of the m first through holes. Optionally, the m first through holes are arranged along the first direction (X direction), such as Figure 3a and Figure 3b As shown, the X direction is perpendicular to the Y direction; or, Figure 3c As shown, the line in the first direction is an arc.

[0093] Of course, the first direction depends on the arrangement positions of the multiple connection nodes in the first connection disk 211. The first direction may also be other directions, which is not limited in the embodiment of the present application.

[0094] The embodiment of the present application does not limit the number of the second through holes and the second conductive branches 42 . Figure 3a-Figure 7 In the illustrated conductive layer 40 , the number of the second through hole and the number of the second conductive branches 42 are both one.

[0095] In other possible implementations, such as Figure 8a-8cAs shown, the number of second through holes is n, the number of second conductive branches 42 is n, and the j-th second conductive branch 42 is electrically connected to the second connection plate through the j-th second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n. By designing the number n, m first conductive branches 41 are electrically connected to n second conductive branches 42; by designing the physical length of each second conductive branch 42 and the physical length of each first conductive branch 41, different inductance values ​​of the inductor are achieved.

[0096] Wherein, at least two adjacent second conductive branches 42 are connected to the second connection portion. For example, at least two adjacent second conductive branches 42 are connected to the second connection portion b, and / or at least three adjacent second conductive branches 42 are connected to the second connection portion b.

[0097] like Figure 8a As shown, in the case where both the first connection portion a and the second connection portion b are one, the first connection portion a and the second connection portion b are connected through a connecting conductive branch 43 .

[0098] like Figure 8b As shown, when there are multiple (for example, two) first connection parts a and one second connection part b, the connecting conductive branch 43 includes a first connecting conductive branch 431 and a second connecting conductive branch 432, the first connecting part a1 is connected to the first connecting part a2 through the first connecting conductive branch 431, and the first connecting conductive branch 431 is connected to the second connecting part b through the second connecting conductive branch 432.

[0099] like Figure 8c As shown, when there are multiple (for example, two) first connection parts a and second connection parts b, the connecting conductive branch 43 includes a first connecting conductive branch 431, a second connecting conductive branch 432, and a third connecting conductive branch 433. The first connection part a1 is connected to the first connection part a2 through the first connecting conductive branch 431, the second connection part b1 is connected to the second connection part b2 through the second connecting conductive branch 432, and the first connecting conductive branch 431 is connected to the second connecting conductive branch 432 through the third connecting conductive branch 433.

[0100] Among some possible implementations, Figure 8a-8c As shown, the embodiment of the present application does not limit the shape of each connecting conductive branch 43, and only needs to ensure that the physical length of each connecting conductive branch 43 meets the equivalent inductance value required by the design.

[0101] In some possible implementations, the embodiments of the present application do not limit the shape and total length of each first conductive branch 41 and each second conductive branch 42, and further do not limit the length of each path from the m connection nodes on the first connection plate 211 through the conductive layer 40 to the n connection nodes on the second connection plate 221.

[0102] In order to improve the phase balance of each connection node and avoid the large difference in the path length from the m connection nodes on the first connection disk 211 to the n connection nodes on the second connection disk 221 through the conductive layer 40, which leads to a large difference in signal delay between each path when transmitting signals from the m connection nodes on the first connection disk 211 to the n connection nodes on the second connection disk 221, optionally, the total length of any first conductive branch 41 is L1, and the total length range of other first conductive branches 41 is (1-0.3)L1 to (1+0.3)L1; wherein L1 is a positive number. And / or, when the number of second conductive branches is n, the total length of any second conductive branch 42 is L2, and the total length range of other second conductive branches 42 is (1-0.3)L2 to (1+0.3)L2; wherein L2 is a positive number.

[0103] Further, such as Figure 2 a- Figure 2 b. Figure 5b , Figure 6 , Figure 8a-8c As shown, the total lengths of the m first conductive branches 41 are the same; and / or the total lengths of the n second conductive branches 42 are the same. In this way, the path length from any connection node on the first connection pad 211 to any connection node on the second connection pad 221 through the conductive layer 40 is the same as the path length from other connection nodes on the first connection pad 211 to other connection nodes on the second connection pad 221 through the conductive layer 40. When signals are transmitted from the m connection nodes on the first connection pad 211 to the n connection nodes on the second connection pad 221, the signal delays between the various paths are the same.

[0104] Of course, other methods may be used to connect the m first conductive branches 41 and the n second conductive branches 42 by using the connecting conductive branch 43, which is not limited in the present embodiment. Figure 8d As shown, every two adjacent second conductive branches 42 may share one another, and / or every two adjacent first conductive branches 41 may share one another.

[0105] like Figure 8a-8c As shown, the above describes the situation where m first conductive branches 41 are electrically connected to the same first connection pad 211 through m first through holes, and n second conductive branches 42 are electrically connected to the same second connection pad 221 through n second through holes. In other embodiments, such as Figure 9a and Figure 9b As shown, there are multiple first connection pads 211 in the first electronic device 21, and multiple second connection pads 221 in the second electronic device 22. The m first conductive branches 41 are electrically connected to different first connection pads 211, and / or the n second conductive branches 42 are electrically connected to different second connection pads 221.

[0106] For example, Figure 9a As shown, in the scenario of power synthesis, a multi-cell design can be adopted, and the two first conductive branches 41 are respectively electrically connected to the two first connection plates 211, and the two second conductive branches 42 are respectively electrically connected to the two second connection plates 221. Among them, the connection node A1 and the connection node A2 in the same first connection plate 211 are at the same potential, and the connection node B1 and the connection node B2 in the same second connection plate 221 are at the same potential.

[0107] For example, Figure 9b As shown, in the scenario of power synthesis, a multi-cell design can be adopted, where four first conductive branches 41 are electrically connected to the same first connection disk 211, the first second conductive branch 42 and the second second conductive branch 42 are electrically connected to the first second connection disk 221, and the third second conductive branch 42 and the fourth second conductive branch 42 are electrically connected to the second second connection disk 221. Among them, the connection nodes A1, A2, A3, and A4 in the same first connection disk 211 are of equal potential, and the connection nodes B1 and B2 in the same second connection disk 221 are of equal potential.

[0108] Figure 9b The example shown can be applied to a combiner, where the first second connection disk 221 on the second electronic device 22 is used to transmit a first signal, and the second second connection disk 221 on the second electronic device 22 is used to transmit a second signal. The first signal and the second signal are transmitted to the same first connection disk 211 of the first electronic device 21 through the conductive layer 40, thereby realizing signal combining.

[0109] Among some possible implementations, Figure 9b In the example shown, the first first conductive branch 41 and the second first conductive branch 41 are connected to the first connection portion a1, the third first conductive branch 41 and the fourth first conductive branch 41 are connected to the first connection portion a2, the first second conductive branch 42 and the second second conductive branch 42 are connected to the second connection portion b1, and the third second conductive branch 42 and the fourth second conductive branch 42 are connected to the second connection portion b2. Figure 9b Based on the example shown, Fig.9cAs shown, the first connection portion a1 , the first connection portion a2 , the second connection portion b1 , and the second connection portion b2 are connected via a connecting conductive branch 43 .

[0110] It should be understood that multiple connection nodes in the same first connection pad 211 are electrically connected, and multiple connection nodes in the same second connection pad 221 are electrically connected, while multiple connection nodes in different first connection pads 211 are electrically isolated, and multiple connection nodes in the same second connection pad 221 are electrically isolated.

[0111] In some embodiments, the first conductive branch 41 is electrically connected to m first connection nodes in the first connection pad 211, and the second conductive branch 42 is electrically connected to n second connection nodes in the second connection pad 221. Figure 9b and Fig.9c As shown, the distance between each two adjacent first connection nodes is different from the distance between each two adjacent second connection nodes; or Figure 9d As shown, the distance between every two adjacent first connection nodes is the same as the distance between every two adjacent second connection nodes.

[0112] In some embodiments, Figure 10a-Figure 10c As shown, in the power synthesis scenario, a multi-chip (die) circuit design can be adopted, the number of conductive layers 40 is multiple, and multiple conductive layers 40 are arranged in the same layer. Among them, the embodiment of the present application does not limit the arrangement of the multiple conductive layers 40, and the arrangement of the multiple conductive layers 40 depends on the position and arrangement of the first connection pad 211 and the second connection pad 221 electrically connected to the multiple conductive layers 40. For example, the multiple conductive layers 40 are arranged along the X direction.

[0113] In some possible implementations, due to design requirements, the plurality of first connection pads 211 and the plurality of second connection pads 221 corresponding to the plurality of conductive layers 40 need to be electrically connected. Fig.10c As shown, in the embodiment of the present application, the first conductive branches 41 of the multiple conductive layers 40 are also electrically connected to different first connection pads 211 of the same first electronic device 21, and the second conductive branches 42 of the multiple conductive layers 40 are also electrically connected to different second connection pads of the same second electronic device 22.

[0114] Among some possible implementations, Fig.11a and Fig.11b As shown, the first electronic device 21 may include a third connection disk 212 in addition to the first connection disk 211; and / or the second electronic device 22 may include a fourth connection disk 222 in addition to the second connection disk 221. The third connection disk 212 and the fourth connection disk 222 may also implement other functions, which are not limited in the embodiments of the present application.

[0115] Among some possible implementations, Fig.12a As shown, the conductive layer 40 may include a first auxiliary conductive layer 44 and a second auxiliary conductive layer 45 in addition to the first conductive branch 41, the second conductive branch 42, and the connecting conductive branch 43. The first conductive branch 41 is electrically connected to the first connection pad 211 through the first auxiliary conductive layer 44, and the second conductive branch 42 is electrically connected to the second connection pad 221 through the second auxiliary conductive layer 45.

[0116] On this basis, if Figure 12b As shown, the number of the first auxiliary conductive layer 44 and the number of the second auxiliary conductive layer 45 are both multiple, and the RF chip may further include a first component 46 and a second component 47. Two adjacent first auxiliary conductive layers 44 are electrically connected through the first component 46, and two adjacent second auxiliary conductive layers 44 are electrically connected through the second component 47. The first component 46 and the second component 47 may be chip resistors, chip capacitors, resistors made of thin films, capacitors made of thin films, and the like.

[0117] Among some possible implementations, Figure 2 As shown, the surface of the dielectric layer 30 facing away from the first electronic device 21 may be a flat surface; or Fig.13 As shown, the surface of the dielectric layer 30 that faces away from the first electronic device 21 may be an inclined surface, which is not limited in the embodiment of the present application.

[0118] The above describes the case where the RF module includes a first electronic device 21 and a second electronic device 22. In other embodiments, for example, Fig.14a and Fig.14b As shown, there are multiple first electronic devices 21 , and the second electronic devices 22 are located between adjacent first electronic devices 21 ; and / or, there are multiple second electronic devices 22 , and the first electronic devices 21 are located between adjacent second electronic devices 22 .

[0119] In another embodiment, the present application also provides a method for preparing a radio frequency module, such as Fig.15 As shown, this can be achieved through the following steps:

[0120] S110 , providing a first electronic device 21 and a second electronic device 22 , wherein the first electronic device 21 includes a first connection pad 211 , and the second electronic device 22 includes a second connection pad 221 .

[0121] S120 , covering the first electronic device 21 and the second electronic device 22 with a dielectric layer 30 , wherein the dielectric layer 30 includes first through holes and second through holes, and the number of the first through holes is m.

[0122] S130, forming a conductive layer 40 on the dielectric layer 30, the conductive layer 40 comprising a first conductive branch 41 and a second conductive branch 42. The number of the first conductive branches 41 is m, the i-th first conductive branch 41 is electrically connected to the first connection pad 211 through the i-th first through hole; the second conductive branch 42 is electrically connected to the second connection pad 221 through the second through hole. Wherein, m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

[0123] In the present application, the binding wire 13 is no longer used to connect the first electronic device 21 and the second electronic device 22, but a dielectric layer 30 and a conductive layer 40 are sequentially formed on the first electronic device 21 and the second electronic device 22. The first through hole of the dielectric layer 30 exposes the first connection pad 211, and the first through hole in the dielectric layer 30 exposes m connection nodes on the first connection pad 211, so that the first conductive branch 41 in the conductive layer 40 is electrically connected to the first connection pad 211 through the m first through holes; the second through hole in the dielectric layer 30 exposes the connection node on the second connection pad 221, so that the second conductive branch 42 in the conductive layer 40 is electrically connected to the second connection pad 221 through the second through hole, thereby connecting the first electronic device 41 and the second electronic device using the conductive layer 40. In this way, it can be avoided that the packaging form evolution of the RF module is limited due to the three-dimensional structure of the binding wire 13, and it is not conducive to stacking with other components or circuit boards. The connection node refers to the portion of the first connection pad 211 exposed by the first through hole and the portion of the second connection pad 221 exposed by the second through hole. In other words, the portion of the first connection pad 211 directly in contact with the first conductive branch 41 and the portion of the second connection pad 221 directly in contact with the second conductive branch 42.

[0124] Moreover, the first conductive branch 41 and the second conductive branch 42 can be equivalent to an inductor. The embodiment of the present application changes the connection path of the first conductive branch 41 and the second conductive branch 42 by changing the pattern of the first conductive branch 41 and the second conductive branch 42, thereby changing the physical length of each of the first conductive branch 41 and the second conductive branch 42. By adjusting the physical length of each of the first conductive branch 41 and the second conductive branch 42, and the connection mode of the second conductive branch 42 and the m first conductive branches 41, the inductor can achieve any required equivalent inductance value. Therefore, the embodiment of the present application does not limit the number of the first conductive branch 41 (first through hole) and the second conductive branch 42 (second through hole), as long as the number of the first conductive branch 41 and the first through hole is m. It can also be said that the solution of the embodiment of the present application does not limit the number of the first through hole to be the same as the number of the second through hole, nor does it limit the number of the first conductive branch 41 to be the same as the number of the second conductive branch 42. Therefore, the solution of the embodiment of the present application can improve the decoupling capability of the first electronic device 21 and the second electronic device 22, and improve the freedom of chip design.

[0125] On this basis, if Figure 4a As shown, in order to meet the requirement that the first electronic device 21 and the second electronic device 22 are electrically connected through multiple connection nodes, the number of binding wires 13 is very large (for example, 7), that is, 7 binding wires 13 are connected in parallel, resulting in a decrease in the equivalent inductance value of the inductor, and a larger equivalent inductance value is limited. Figure 4b As shown, the number of 7 connection nodes and 7 binding wires 13 in the related art is reduced to 4, but the number of connection nodes is sacrificed, which is contrary to the design requirements. Figure 4c As shown, the related art proposes to extend the physical length of the seven binding wires 13 without reducing the number of connection nodes to increase the equivalent inductance value. However, the increase in the physical length of the binding wires 13 means that the distance between the first electronic device 21 and the second electronic device 22 increases, thereby increasing the size of the RF module and indirectly affecting the material cost.

[0126] In the embodiment of the present application, without increasing the spacing between the first electronic device 21 and the second electronic device 22, the inductor can achieve any desired equivalent inductance value by adjusting the physical lengths of the first conductive branch 41 and the second conductive branch 42, and the connection mode between the second conductive branch 42 and the m first conductive branches 41. Therefore, the reduction of the equivalent inductance value of the inductor can be avoided, and the size of the RF module can also be avoided.

[0127] The connection relationship between the second conductive branch 42 and the first conductive branch 41 in the conductive layer 40 when m has different values ​​is exemplarily described below with reference to the accompanying drawings.

[0128] For example, Figure 3a-3c As shown, m=2, the number of the first through holes and the first conductive branches 41 are both 2, and the number of the first through holes and the second conductive branches 42 are both 1. The two first conductive branches 41 are electrically connected to the first connection pad 211 through the first through holes, and the one second conductive branch 42 is electrically connected to the second connection pad 221 through the second through hole. The two first conductive branches 41 are connected to the first connection portion a, and the second conductive branch 42 is connected to multiple first connection portions a.

[0129] Assuming that the equivalent inductance value of the inductor formed by the second conductive branch 42 and the two first conductive branches 41 is L, the equivalent inductance value from the connection node A1 on the first connection disk 211 to the first connection portion a is L(1-1), and the distance from the connection node A1 on the first connection disk 211 to the first connection portion a in the Y direction is d1; the equivalent inductance value from the connection node A2 on the first connection disk 211 to the first connection portion a is L(1-2), and the distance from the connection node A2 on the first connection disk 211 to the first connection portion a in the Y direction is d1; the equivalent inductance value from the connection node B on the second connection disk 221 to the first connection portion a is L(2-1), and the distance from the connection node B on the second connection disk 221 to the first connection portion a in the Y direction is d2.

[0130] The equivalent inductance value L of the inductor is L=L(2-1)+L(1-1) / / L(1-2). By adjusting the ratio of d1 to d2, the equivalent inductance value L of the inductor can be adjusted.

[0131] For example, Figure 5a and Figure 5b As shown, m=3, the number of the first through hole and the first conductive branch 41 are both 3, and the number of the second through hole and the second conductive branch 42 are both 1. Every three adjacent first conductive branches 41 are connected to the first connection portion a, and the second conductive branch 42 is connected to multiple first connection portions a. Similarly, the equivalent inductance value L of the inductor can be adjusted by adjusting the distance between the first conductive branch 41 and the second conductive branch 42 in the Y direction.

[0132] For example, Figure 6 As shown, m=4, the number of the first through hole and the first conductive branch 41 are both 4, and the number of the second through hole and the second conductive branch 42 are both 1. The first first conductive branch 41 and the second first conductive branch 41 are connected to the first connecting portion a1, and the third first conductive branch 41 and the fourth first conductive branch 41 are connected to the first connecting portion a2. On this basis, the conductive layer 40 further includes a connecting conductive branch 43, which is respectively connected to the second conductive branch 42, the first connecting portion a1, and the first connecting portion a2.

[0133] Similarly, the equivalent inductance value L of the inductor can be adjusted by adjusting the physical lengths of the four first conductive branches 41 , the connecting conductive branch 43 , and the second conductive branch 42 .

[0134] For example, Figure 7As shown, m=5, the number of the first through hole and the first conductive branch 41 are both 5, and the number of the second through hole and the second conductive branch 42 are both 1. The first first conductive branch 41 and the second first conductive branch 41 are connected to the first connecting portion a1, and the third first conductive branch 41, the fourth first conductive branch 41, and the fifth first conductive branch 41 are connected to the first connecting portion a2. On this basis, the conductive layer 40 further includes a connecting conductive branch 43, which is respectively connected to the second conductive branch 42, the first connecting portion a1, and the first connecting portion a2.

[0135] Similarly, the equivalent inductance value L of the inductor can be adjusted by adjusting the physical lengths of the five first conductive branches 41 , the connecting conductive branch 43 , and the second conductive branch 42 .

[0136] The above examples are based on the example that every two adjacent first conductive branches 41 are connected to the first connection part, and / or every three adjacent first conductive branches 41 are connected to the first connection part. Of course, more first conductive branches 41 can also be connected to the first connection part. That is, every at least two adjacent first conductive branches 41 are connected to the first connection part.

[0137] In some possible implementations, the embodiment of the present application does not limit the arrangement of the m first through holes. Optionally, the m first through holes are arranged along the first direction (X direction), such as Figure 3a and Figure 3b As shown, the X direction is perpendicular to the Y direction; or, Figure 3c As shown, the line in the first direction is an arc.

[0138] Of course, the first direction depends on the arrangement positions of the multiple connection nodes in the first connection disk 211. The first direction may also be other directions, which is not limited in the embodiment of the present application.

[0139] The embodiment of the present application does not limit the number of the second through holes and the second conductive branches 42 . Figure 3a-Figure 7 In the illustrated conductive layer 40 , the number of the second through hole and the number of the second conductive branches 42 are both one.

[0140] In other possible implementations, such as Figure 8a-8c As shown, the number of second through holes is n, the number of second conductive branches 42 is n, and the jth second conductive branch 42 is electrically connected to the second connecting plate through the jth second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n.

[0141] Wherein, at least two adjacent second conductive branches 42 are connected to the second connection portion. For example, at least two adjacent second conductive branches 42 are connected to the second connection portion b, and / or at least three adjacent second conductive branches 42 are connected to the second connection portion b.

[0142] like Figure 8a As shown, in the case where both the first connection portion a and the second connection portion b are one, the first connection portion a and the second connection portion b are connected through a connecting conductive branch 43 .

[0143] like Figure 8b As shown, when there are multiple (for example, two) first connection parts a and one second connection part b, the connecting conductive branch 43 includes a first connecting conductive branch 431 and a second connecting conductive branch 432, the first connecting part a1 is connected to the first connecting part a2 through the first connecting conductive branch 431, and the first connecting conductive branch 431 is connected to the second connecting part b through the second connecting conductive branch 432.

[0144] like Figure 8c As shown, when there are multiple (for example, two) first connection parts a and second connection parts b, the connecting conductive branch 43 includes a first connecting conductive branch 431, a second connecting conductive branch 432, and a third connecting conductive branch 433. The first connection part a1 is connected to the first connection part a2 through the first connecting conductive branch 431, the second connection part b1 is connected to the second connection part b2 through the second connecting conductive branch 432, and the first connecting conductive branch 431 is connected to the second connecting conductive branch 432 through the third connecting conductive branch 433.

[0145] Among some possible implementations, Figure 8a-8c As shown, the embodiment of the present application does not limit the shape of each connecting conductive branch 43, and only needs to ensure that the physical length of each connecting conductive branch 43 meets the equivalent inductance value required by the design.

[0146] In some possible implementations, the embodiments of the present application do not limit the shape and total length of each first conductive branch 41 and each second conductive branch 42, and further do not limit the length of each path from the m connection nodes on the first connection plate 211 through the conductive layer 40 to the n connection nodes on the second connection plate 221.

[0147] In order to improve the phase balance of each connection node and avoid the large difference in the path length from the m connection nodes on the first connection disk 211 to the n connection nodes on the second connection disk 221 through the conductive layer 40, which leads to a large difference in signal delay between each path when transmitting signals from the m connection nodes on the first connection disk 211 to the n connection nodes on the second connection disk 221, optionally, the total length of any first conductive branch 41 is L1, and the total length range of other first conductive branches 41 is (1-0.3)L1 to (1+0.3)L1; wherein L1 is a positive number. And / or, when the number of second conductive branches is n, the total length of any second conductive branch 42 is L2, and the total length range of other second conductive branches 42 is (1-0.3)L2 to (1+0.3)L2; wherein L2 is a positive number.

[0148] Further, such as Figure 2 a- Figure 2 b. Figure 5b , Figure 6 , Figure 8a-8c As shown, the total lengths of the m first conductive branches 41 are the same; and / or the total lengths of the n second conductive branches 42 are the same. In this way, the path length from any connection node on the first connection pad 211 to any connection node on the second connection pad 221 through the conductive layer 40 is the same as the path length from other connection nodes on the first connection pad 211 to other connection nodes on the second connection pad 221 through the conductive layer 40. When signals are transmitted from the m connection nodes on the first connection pad 211 to the n connection nodes on the second connection pad 221, the signal delays between the various paths are the same.

[0149] Of course, other methods may be used to connect the m first conductive branches 41 and the n second conductive branches 42 by using the connecting conductive branch 43, which is not limited in the present embodiment. Figure 8d As shown, every two adjacent second conductive branches 42 may share one another, and / or every two adjacent first conductive branches 41 may share one another.

[0150] like Figure 8a-8c As shown, the above describes the situation where m first conductive branches 41 are electrically connected to the same first connection pad 211 through m first through holes, and n second conductive branches 42 are electrically connected to the same second connection pad 221 through n second through holes. In other embodiments, such as Figure 9a and Figure 9b As shown, there are multiple first connection pads 211 in the first electronic device 21, and multiple second connection pads 221 in the second electronic device 22. The m first conductive branches 41 are electrically connected to different first connection pads 211, and / or the n second conductive branches 42 are electrically connected to different second connection pads 221.

[0151] For example, Figure 9a As shown, the two first conductive branches 41 are electrically connected to the two first connection pads 211 , respectively, and the two second conductive branches 42 are electrically connected to the two second connection pads 221 , respectively.

[0152] For example, Figure 9b As shown, four first conductive branches 41 are electrically connected to the same first connection pad 211 , the first second conductive branch 42 and the second second conductive branch 42 are electrically connected to the first second connection pad 221 , and the third second conductive branch 42 and the fourth second conductive branch 42 are electrically connected to the second second connection pad 221 .

[0153] Figure 9b The example shown can be applied to a combiner, where the first second connection disk 221 on the second electronic device 22 is used to transmit a first signal, and the second second connection disk 221 on the second electronic device 22 is used to transmit a second signal. The first signal and the second signal are transmitted to the same first connection disk 211 of the first electronic device 21 through the conductive layer 40, thereby realizing signal combining.

[0154] Among some possible implementations, Figure 9b In the example shown, the first first conductive branch 41 and the second first conductive branch 41 are connected to the first connection portion a1, the third first conductive branch 41 and the fourth first conductive branch 41 are connected to the first connection portion a2, the first second conductive branch 42 and the second second conductive branch 42 are connected to the second connection portion b1, and the third second conductive branch 42 and the fourth second conductive branch 42 are connected to the second connection portion b2. Figure 9b Based on the example shown, Fig.9c As shown, the first connection portion a1 , the first connection portion a2 , the second connection portion b1 , and the second connection portion b2 are connected via a connecting conductive branch 43 .

[0155] It should be understood that multiple connection nodes in the same first connection pad 211 are electrically connected, and multiple connection nodes in the same second connection pad 221 are electrically connected, while multiple connection nodes in different first connection pads 211 are electrically isolated, and multiple connection nodes in the same second connection pad 221 are electrically isolated.

[0156] In some embodiments, Figure 10a-Figure 10c As shown, there are multiple conductive layers 40, and the multiple conductive layers 40 are arranged in the same layer. The embodiment of the present application does not limit the arrangement of the multiple conductive layers 40, and the arrangement of the multiple conductive layers 40 depends on the position and arrangement of the first connection pad 211 and the second connection pad 221 electrically connected to the multiple conductive layers 40. For example, the multiple conductive layers 40 are arranged along the X direction.

[0157] In some possible implementations, due to design requirements, the plurality of first connection pads 211 and the plurality of second connection pads 221 corresponding to the plurality of conductive layers 40 need to be electrically connected. Fig.10c As shown, in the embodiment of the present application, the first conductive branches 41 of the multiple conductive layers 40 are also electrically connected to different first connection pads 211 of the same first electronic device 21, and the second conductive branches 42 of the multiple conductive layers 40 are also electrically connected to different second connection pads of the same second electronic device 22.

[0158] Among some possible implementations, Figure 11a-Figure 11b As shown, the first electronic device 21 may include a third connection disk 212 in addition to the first connection disk 211; and / or the second electronic device 22 may include a fourth connection disk 222 in addition to the second connection disk 221. The third connection disk 212 and the fourth connection disk 222 may also implement other functions, which are not limited in the embodiments of the present application.

[0159] Among some possible implementations, Fig.12a As shown, the conductive layer 40 may include a first auxiliary conductive layer 44 and a second auxiliary conductive layer 45 in addition to the first conductive branch 41, the second conductive branch 42, and the connecting conductive branch 43. The first conductive branch 41 is electrically connected to the first connection pad 211 through the first auxiliary conductive layer 44, and the second conductive branch 42 is electrically connected to the second connection pad 221 through the second auxiliary conductive layer 45.

[0160] On this basis, if Figure 12b As shown, the number of the first auxiliary conductive layer 44 and the second auxiliary conductive layer 45 are both multiple, and the RF chip may further include a first component 46 and a second component 47. Two adjacent first auxiliary conductive layers 44 may be electrically connected through the first component 46, and two adjacent second auxiliary conductive layers 44 may be electrically connected through the second component 47. The first component 46 and the second component 47 may be chip resistors, chip capacitors, resistors made of thin films, capacitors made of thin films, and the like.

[0161] Among some possible implementations, Figure 2 As shown, the surface of the dielectric layer 30 facing away from the first electronic device 21 may be a flat surface; or Fig.13 As shown, the surface of the dielectric layer 30 that faces away from the first electronic device 21 may be an inclined surface, which is not limited in the embodiment of the present application.

[0162] The above describes the case where the RF module includes a first electronic device 21 and a second electronic device 22. In other embodiments, for example, Fig.14a Hull Fig.14b As shown, there are multiple first electronic devices 21 , and the second electronic devices 22 are located between adjacent first electronic devices 21 ; and / or, there are multiple second electronic devices 22 , and the first electronic devices 21 are located between adjacent second electronic devices 22 .

[0163] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A radio frequency module, It is characterized in that include: A first electronic device and a second electronic device, the first electronic device comprising a first connection pad, the second electronic device comprising a second connection pad; a dielectric layer covering the first electronic device and the second electronic device, the dielectric layer comprising a first through hole and a second through hole, the number of the first through holes being m; A conductive layer disposed on the dielectric layer, the conductive layer comprising a first conductive branch and a second conductive branch; The number of the first conductive branches is m, the i-th first conductive branch is electrically connected to the first connecting plate through the i-th first through hole; the second conductive branch is electrically connected to the second connecting plate through the second through hole; wherein m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

2. The radio frequency module according to claim 1, It is characterized in that At least two adjacent first conductive branches are connected to a first connecting portion, and the second conductive branch is connected to the first connecting portion.

3. The radio frequency module according to claim 1 or 2, It is characterized in that The number of the second through holes is n, the number of the second conductive branches is n, and the jth second conductive branch is electrically connected to the second connecting plate through the jth second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n.

4. The radio frequency module according to claim 3, It is characterized in that At least two adjacent second conductive branches are connected to the second connecting portion; The conductive layer further includes connected conductive branches, and the connected conductive branches are respectively connected to the first connecting portion and the second connecting portion.

5. The radio frequency module according to any one of claims 2 to 4, It is characterized in that The total length of any one of the first conductive branches is L1, and the total lengths of the other first conductive branches range from (1-0.3)L1 to (1+0.3)L1; wherein L1 is a positive number; and / or, When the number of the second conductive branches is n, the total length of any second conductive branch is L2, and the total lengths of other second conductive branches range from (1-0.3)L2 to (1+0.3)L2; wherein L2 is a positive number.

6. The radio frequency module according to claim 5, It is characterized in that The total lengths of the m first conductive branches are all the same; and / or, When the number of the second conductive branches is n, the total lengths of the n second conductive branches are all the same.

7. The radio frequency module according to any one of claims 3 to 6, It is characterized in that The number of the first connection pads in the first electronic device is multiple, and the number of the second connection pads in the second electronic device is multiple; The m first conductive branches are all electrically connected to the same first connecting pad; or, the m first conductive branches are respectively electrically connected to different first connecting pads; and / or, The n second conductive branches are all electrically connected to the same second connecting pad; or, the n second conductive branches are respectively electrically connected to different second connecting pads.

8. The radio frequency module according to any one of claims 3 to 7, It is characterized in that The first conductive branch is electrically connected to m first connection nodes in the first connection plate, and the second conductive branch is electrically connected to n second connection nodes in the second connection plate; The distance between each two adjacent first connection nodes is the same as the distance between each two adjacent second connection nodes; or The distance between each two adjacent first connection nodes is different from the distance between each two adjacent second connection nodes.

9. The radio frequency module according to any one of claims 1 to 8, It is characterized in that There are multiple conductive layers, and the multiple conductive layers are arranged in the same layer.

10. The radio frequency module according to claim 9, It is characterized in that The first conductive branches of the plurality of conductive layers are electrically connected to different first connection pads of the same first electronic device, respectively, and the second conductive branches of the plurality of conductive layers are electrically connected to different second connection pads of the same second electronic device.

11. The radio frequency module according to any one of claims 1 to 10, It is characterized in that There are multiple first electronic devices, and the second electronic devices are located between adjacent first electronic devices; and / or, There are multiple second electronic devices, and the first electronic devices are located between adjacent second electronic devices.

12. A method for preparing a radio frequency module, It is characterized in that include: Providing a first electronic device and a second electronic device, wherein the first electronic device comprises a first connection pad, and the second electronic device comprises a second connection pad; Covering the first electronic device and the second electronic device with a dielectric layer, wherein the dielectric layer comprises a first through hole and a second through hole, and the number of the first through holes is m; A conductive layer is formed on the dielectric layer, the conductive layer comprising a first conductive branch and a second conductive branch; the number of the first conductive branches is m, the i-th first conductive branch is electrically connected to the first connecting plate through the i-th first through hole; the second conductive branch is electrically connected to the second connecting plate through the second through hole; wherein m is an integer greater than or equal to 2, and i is a positive integer less than or equal to m.

13. The method for preparing a radio frequency module according to claim 12, It is characterized in that At least two adjacent first conductive branches are connected to a first connecting portion, and the second conductive branch is connected to the first connecting portion.

14. The method for preparing a radio frequency module according to claim 12 or 13, It is characterized in that The number of the second through holes is n, the number of the second conductive branches is n, and the jth second conductive branch is electrically connected to the second connecting plate through the jth second through hole; wherein n is an integer greater than or equal to 2, and i is a positive integer less than or equal to n.

15. The method for preparing a radio frequency module according to claim 14, It is characterized in that At least two adjacent second conductive branches are connected to the second connecting portion; The conductive layer further includes connected conductive branches, and the connected conductive branches are respectively connected to the first connecting portion and the second connecting portion.

16. The method for preparing the radio frequency module according to any one of claims 13 to 15, It is characterized in that The total length of any one of the first conductive branches is L1, and the total lengths of the other first conductive branches range from (1-0.3)L1 to (1+0.3)L1; wherein L1 is a positive number; and / or, When the number of the second conductive branches is n, the total length of any second conductive branch is L2, and the total lengths of other second conductive branches range from (1-0.3)L2 to (1+0.3)L2; wherein L2 is a positive number.

17. The method for preparing a radio frequency module according to claim 16, It is characterized in that The total lengths of the m first conductive branches are all the same; and / or, When the number of the second conductive branches is n, the total lengths of the n second conductive branches are all the same.

18. An electronic device, It is characterized in that It comprises a circuit board and the radio frequency module according to any one of claims 1 to 11, wherein the radio frequency module is arranged on the circuit board.

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