Electromagnetic interference shielding device

Abstract

The invention discloses an electromagnetic interference shielding device, and relates to the technical field of electromagnetic shielding, the electromagnetic interference shielding device comprises a metal substrate and a shielding case, the top surface of the metal substrate is provided with a slot corresponding to the bottom end of the shielding case, the metal substrate is internally provided with a placement groove located below the slot, and the bottom end of the shielding case can pass through the slot and extend into the placement groove; the placement groove is made of ceramic, and a plurality of electric heating wires are arranged in the groove wall of the placement groove in a penetrating manner; a metal conductive layer is laid on the inner wall of the placement groove, the top end of the metal conductive layer is electrically connected with the metal substrate, and tin is contained in the placement groove; the heating wire is electrically connected with a power supply, and a control switch is arranged between the heating wire and the power supply. By improving the connection mode between the shielding cover and the metal substrate and melting tin in the placing groove through the electric heating wire, the bottom end of the shielding cover can be connected with the tin in the placing groove together, seamless connection is formed, and the shielding effect is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electromagnetic shielding, and in particular to an electromagnetic interference shielding device. Background Art

[0002] With the development of wireless communication technology, the space we live in is filled with various electromagnetic waves. Electromagnetic waves have an interfering effect on the debugging and use of some precision instruments. Moreover, in some confidential occasions, direct electromagnetic shielding is an important means to ensure safety. In the above scenarios, electromagnetic interference shielding devices are required.

[0003] In order to ensure the shielding effect, the shielding cover of the electromagnetic interference shielding device is made of thicker metal plates. When the electromagnetic wave contacts the shielding cover through the air, part of the incident energy will be reflected by the surface of the shielding cover due to the different impedances of air and metal. At the same time, the incident energy will also be attenuated when passing through the surface of the shielding cover. When entering the air through the inside of the shielding cover, it will be reflected back to the inside of the shielding cover again due to the difference in impedance. However, once the shielding cover is poorly prepared, such as gaps, or the contact is line contact rather than surface contact, or oxidation corrosion changes the impedance, due to the skin effect of electromagnetic waves, that is, although some electromagnetic waves will not penetrate the barrier, they will move along the shielding cover and gradually attenuate. Therefore, once there is a gap on the shielding cover, the electromagnetic wave will penetrate along the gap, greatly increasing the electromagnetic wave passing through the shielding cover. Especially when the width of the gap in the shielding cover is narrow, the amount of electromagnetic waves emitted will be greater.

[0004] Existing EMI shielding devices usually use a shielding cover sealed and connected to a metal substrate, and set the EMI emission source in a cavity between the shielding cover and the metal substrate. However, there will inevitably be a connection gap between the shielding cover and the metal substrate, and the existence of this gap will reduce the shielding effect. Summary of the invention

[0005] The purpose of the present invention is to provide an electromagnetic interference shielding device to solve the problems existing in the above-mentioned prior art and improve the shielding effect.

[0006] To achieve the above object, the present invention provides the following solutions:

[0007] The present invention provides an electromagnetic interference shielding device, comprising a metal substrate and a shielding cover, wherein a slot is provided on the top surface of the metal substrate corresponding to the bottom end of the shielding cover, a placement slot is provided in the metal substrate and is located below the slot, and the bottom end of the shielding cover can pass through the slot and extend into the placement slot; the placement slot is made of ceramic, and a plurality of heating wires are passed through the slot wall of the placement slot; a metal conductive layer is applied on the inner wall of the placement slot, and the top end of the metal conductive layer is electrically connected to the metal substrate, and tin is contained in the placement slot; the heating wire is electrically connected to a power supply, and a control switch is provided between the heating wire and the power supply.

[0008] Preferably, the material of the metal conductive layer is copper.

[0009] Preferably, the cross-section of the placement groove is concave-shaped, and the placement groove includes two side groove walls and a bottom groove wall, and all the heating wires are evenly distributed in the side groove walls and the bottom groove wall.

[0010] Preferably, the placement groove is integrally formed.

[0011] Preferably, the entire top end of the metal conductive layer is welded to the metal substrate.

[0012] Preferably, the width of the slot is 0.5 mm to 1.0 mm greater than the thickness of the side wall of the shielding cover, and the width of the placement groove is greater than the width of the slot.

[0013] Preferably, the control switch and the power supply are respectively fixed on the metal substrate.

[0014] Preferably, the tin completely fills the placement groove.

[0015] Preferably, the bottom outer wall of the shielding cover is further provided with an ear plate, and the ear plate is connected to the metal base plate by bolts.

[0016] Preferably, the inner wall of the shielding cover and the upper surface of the metal substrate are both provided with a carbon fiber layer.

[0017] Compared with the prior art, the present invention has achieved the following technical effects:

[0018] The electromagnetic interference shielding device of the present invention improves the connection mode between the shielding cover and the metal substrate, utilizes electric heating wire to melt the tin in the placement groove, so that the bottom end of the shielding cover can be connected with the tin in the placement groove to form a seamless connection, thereby significantly improving the shielding effect.

[0019] Specifically, the electric heating wire is turned on to melt the tin in the placement groove, and then the bottom end of the shielding cover is passed through the slot on the metal substrate and extended into the placement groove, so that the bottom end of the shielding cover is inserted into the molten tin in the placement groove, and then the electric heating wire is turned off to allow the molten tin to cool naturally, thereby achieving a seamless connection between the shielding cover and the metal substrate, thereby significantly improving the shielding effect.

[0020] Furthermore, using ceramic material as the placement slot can improve the insulation performance of the entire device and prevent leakage. At the same time, ceramic material has good high temperature resistance and is suitable for placing electric heating wires.

[0021] Furthermore, the one-piece design of the placement slot can improve the overall strength and durability of the device and reduce structural loosening or damage caused by long-term use.

[0022] Furthermore, setting a control switch can conveniently control the heating state of the heating wire, thereby controlling the heating process and simplifying the operating steps. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a schematic structural diagram of the electromagnetic interference shielding device of the present invention;

[0025] Figure 2 for Figure 1 A partial enlarged view of the middle A;

[0026] In the figure: 100, electromagnetic interference shielding device;

[0027] 1. Metal substrate; 2. Shielding cover; 3. Electromagnetic interference emission source; 4. Ear plate; 5. Bolt; 6. Slot; 7. Tin; 8. Metal conductive layer; 9. Placement slot; 10. Heating wire. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] The purpose of the present invention is to provide an electromagnetic interference shielding device to solve the problems existing in the above-mentioned prior art and improve the shielding effect.

[0030] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] Embodiment 1

[0032] like Figure 1 to Figure 2 As shown, this embodiment provides an electromagnetic interference shielding device 100, including a metal substrate 1 and a shielding cover 2, a slot 6 is provided on the top surface of the metal substrate 1 corresponding to the bottom end of the shielding cover 2, a placement slot 9 is provided in the metal substrate 1 and is located below the slot 6, and the bottom end of the shielding cover 2 can pass through the slot 6 and extend into the placement slot 9; the material of the placement slot 9 is ceramic, and a plurality of heating wires 10 are passed through the slot wall of the placement slot 9; a metal conductive layer 8 is applied on the inner wall of the placement slot 9, and the top end of the metal conductive layer 8 is electrically connected to the metal substrate 1, and tin 7 is contained in the placement slot 9; the heating wire 10 is electrically connected to a power supply, and a control switch is provided between the heating wire 10 and the power supply.

[0033] The specific method of using the electromagnetic interference shielding device 100 of this embodiment is as follows:

[0034] First, the electromagnetic interference emission source 3 is placed on the metal substrate 1, and then the electric heating wire 10 is turned on by controlling the switch to melt the tin 7 placed in the placement groove 9, and then the shielding cover 2 is placed on the electromagnetic interference emission source 3, and the bottom end of the shielding cover 2 is extended into the placement groove 9 through the slot 6, so that the bottom end of the shielding cover 2 is inserted into the molten tin 7 in the placement groove 9, and then the electric heating wire 10 is turned off. After the molten tin 7 solidifies, the bottom end of the shielding cover 2 is connected to the metal conductive layer 8 on the inner wall of the placement groove 9 through the solidified tin 7, and there is no gap between the bottom end of the shielding cover 2 and the metal conductive layer 8, so that the seamless connection between the shielding cover 2 and the metal substrate 1 is achieved, thereby significantly improving the shielding effect;

[0035] When the electromagnetic interference emission source 3 needs to be taken out, the electric heating wire 10 is turned on by controlling the switch to melt the tin 7 placed in the placement groove 9, and then the shielding cover 2 can be taken out manually, and then the electromagnetic interference emission source 3 can be taken out.

[0036] In the optional scheme of this embodiment, it is more preferred that the material of the metal conductive layer 8 is copper, which has good conductivity and low cost.

[0037] In the optional scheme of this embodiment, it is more preferred that the cross-section of the placement groove 9 is concave, and the placement groove 9 includes two side groove walls and a bottom groove wall. All the heating wires 10 are evenly distributed in the side groove walls and the bottom groove wall. The uniform distribution of the heating wires 10 improves the uniformity of heating the tin 7.

[0038] In the optional scheme of this embodiment, it is more preferred that the placement groove 9 is integrally formed. The integrally formed design of the placement groove 9 can improve the overall strength and durability of the device and reduce structural looseness or damage caused by long-term use.

[0039] In the optional scheme of this embodiment, it is more preferred that the entire top of the metal conductive layer 8 is welded to the metal substrate 1 to ensure the continuity of the connection between the top of the metal conductive layer 8 and the metal substrate 1 and avoid the formation of a gap between the metal conductive layer 8 and the metal substrate 1.

[0040] In the optional scheme of this embodiment, it is more preferred that the width of the slot 6 is 0.5mm to 1.0mm larger than the thickness of the side wall of the shielding cover 2, and the width of the placement groove 9 is larger than the width of the slot 6; in this embodiment, the tin 7 fills the placement groove 9; when the tin 7 melts and the bottom end of the shielding cover 2 is inserted into the molten tin 7 in the placement groove 9, part of the molten tin 7 will overflow to the space between the slot 6 and the shielding cover 2, and this part of the molten tin will fill the gap between the shielding cover 2 and the slot 6, thereby eliminating the gap between the shielding cover 2 and the slot 6 and improving the shielding effect.

[0041] In the optional scheme of this embodiment, it is more preferred that the inner wall of the shielding cover 2 and the upper surface of the metal substrate 1 are both provided with a carbon fiber layer. The carbon fiber has high strength and good electromagnetic shielding performance, which can further block the leakage of electromagnetic waves.

[0042] In the optional solution of this embodiment, it is more preferred that the control switch and the power supply are respectively fixed on the metal substrate 1.

[0043] In the optional scheme of this embodiment, it is more preferred that the bottom outer wall of the shielding cover 2 is also provided with an ear plate 4, and the ear plate 4 is connected to the metal base plate 1 through bolts 5; when installing the shielding cover 2, it is necessary to first connect the ear plate 4 to the metal base plate 1 through bolts 5, and then wait for the tin 7 to cool and solidify; when removing the shielding cover 2, it is necessary to first remove the bolts 5 connecting the ear plate 4 and the metal base plate 1.

[0044] It should be noted that, since the electric heating wire is spread over the entire wall of the placement groove, when heating, the entire placement groove is heated at the same time, so that all the tin in the placement groove is quickly melted, the heating efficiency is high, and the efficiency of assembly or disassembly can be improved; secondly, the tin in the placement groove in this embodiment can be reused. In practical applications, tin can be replaced by other metals with lower melting points.

[0045] Embodiment 2

[0046] This embodiment provides an electromagnetic interference shielding device. The electromagnetic interference shielding device of this embodiment is the same as the electromagnetic interference shielding device 100 of the first embodiment in structure and working principle, and the difference is only that:

[0047] The width of the slot in the electromagnetic interference shielding device in this embodiment is relatively large, and elastic buffer layers are respectively provided on the two inner walls of the slot, one end of the elastic buffer layer is fixedly connected to the inner wall of the slot, and the other end is coated with a metal layer. When the shielding cover is inserted into the slot, the metal layers on both sides of the side walls of the shielding cover are respectively abutted against the shielding cover, and the elastic buffer layer covers the inner wall of the slot.

[0048] In the present embodiment, an elastic buffer layer and a metal layer are provided. Due to the elasticity of the elastic buffer layer, the present embodiment can adapt to shielding covers with different wall thicknesses, and the metal layer abuts against the shielding cover under the action of the elastic buffer layer. When the shielding cover is taken out, the tin attached to the bottom of the shielding cover can be scraped off. In addition, the metal layer abuts against the side wall of the shielding cover, so that there is no gap between the metal layer and the shielding cover, thereby further improving the electromagnetic shielding effect.

[0049] The present invention uses specific examples to illustrate the principles and implementation methods of the present invention. The above examples are only used to help understand the method and core ideas of the present invention. At the same time, for those skilled in the art, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting the present invention.

Claims

1. An electromagnetic interference shielding device, characterized in that: It comprises a metal substrate and a shielding cover, wherein a slot is arranged on the top surface of the metal substrate corresponding to the bottom end of the shielding cover, a placement slot is arranged inside the metal substrate and is located below the slot, and the bottom end of the shielding cover can pass through the slot and extend into the placement slot; the placement slot is made of ceramic, and a plurality of heating wires are passed through the slot wall of the placement slot; a metal conductive layer is coated on the inner wall of the placement slot, and the top end of the metal conductive layer is electrically connected to the metal substrate, and tin is placed in the placement slot; the heating wire is electrically connected to a power source, and a control switch is arranged between the heating wire and the power source.

2. The electromagnetic interference shielding device according to claim 1, characterized in that: The material of the metal conductive layer is copper.

3. The electromagnetic interference shielding device according to claim 1, characterized in that: The cross section of the placement groove is in a concave shape, and the placement groove comprises two side groove walls and a bottom groove wall, and all the heating wires are evenly distributed in the side groove walls and the bottom groove wall.

4. The electromagnetic interference shielding device according to claim 1, characterized in that: The placement groove is integrally formed.

5. The electromagnetic interference shielding device according to claim 1, characterized in that: The entire top end of the metal conductive layer is welded to the metal substrate.

6. The electromagnetic interference shielding device according to claim 1, characterized in that: The width of the slot is 0.5 mm to 1.0 mm greater than the thickness of the side wall of the shielding cover, and the width of the placement groove is greater than the width of the slot.

7. The electromagnetic interference shielding device according to claim 1, characterized in that: The control switch and the power supply are respectively fixed on the metal substrate.

8. The electromagnetic interference shielding device according to claim 1, characterized in that: The tin fills the placement groove.

9. The electromagnetic interference shielding device according to claim 1, characterized in that: The bottom outer wall of the shielding cover is also provided with an ear plate, and the ear plate is connected to the metal base plate through bolts.

10. The electromagnetic interference shielding device according to claim 1, characterized in that: The inner wall of the shielding case and the upper surface of the metal substrate are both provided with carbon fiber layers.

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