Display panel, method for manufacturing display panel, and electronic device

Abstract

The present application provides a display panel, a method for manufacturing a display panel, and an electronic device. By setting the coverage range of the auxiliary conductive unit to be larger than the coverage range of the first electrode, the first electrode is completely located above the auxiliary conductive unit. This can reduce the risk of voids at the edge of the first electrode after setting the pixel defining layer, thereby reducing the risk of water vapor released from the organic film layer below the subsequent voids and propagating along the edge of the pixel definition, causing the display panel to produce display spots.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic light-emitting diodes (OLEDs) and flat-panel displays based on technologies such as light-emitting diodes (LEDs) have become a mainstream display device due to their advantages, including high image quality, power efficiency, thin design, and wide application range. They are widely used in various consumer electronic products such as mobile phones, TVs, laptops, and desktop computers. Traditionally, in the production of display panels, pixel patterning is typically achieved using a fine metal mask (FMM). While FMM technology is mature and has extensive mass production experience, it also suffers from limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe the non-fine metal mask technology for reference.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] In order to overcome the above-mentioned deficiencies in the prior art, the present application aims to provide a display panel. One of the aims of the present application is to provide a display panel comprising:

[0005] substrate;

[0006] a first conductive layer located on one side of the substrate;

[0007] a first insulating layer located on a side of the first conductive layer away from the substrate, the first insulating layer comprising at least one first through hole exposing the first conductive layer;

[0008] at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first portion and a second portion connected to each other, the first portion being located on a side of the first insulating layer away from the substrate, and the second portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer;

[0009] a filling unit at least partially located within the recessed structure;

[0010] a first electrode of at least one light-emitting device, wherein the first electrode is located on a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, at least a portion of the first electrode is in contact with the auxiliary conductive unit, and an orthographic projection of the first electrode on the substrate is located within an orthographic projection of the auxiliary conductive unit on the substrate.

[0011] In some possible implementations, a minimum distance between an edge of an orthographic projection of the first electrode on the substrate and an edge of an orthographic projection of the auxiliary conductive unit on the substrate is greater than or equal to 1.5 micrometers;

[0012] Preferably, a distance between an edge of an orthographic projection of the first electrode on the substrate and an edge of an orthographic projection of the auxiliary conductive unit on the substrate is less than or equal to 2 micrometers.

[0013] In some possible implementations, the first electrode includes a first surface, a second surface, and a side surface, the first surface is located on the side facing the substrate, the second surface is located on the side away from the substrate, the side surface connects the first surface and the second surface, and the angle between the side surface and the surface where the substrate is located is less than or equal to 60 degrees.

[0014] In some possible implementations, the material of the film layer of the first electrode close to the substrate is the same as the material of the auxiliary conductive unit;

[0015] Preferably, the film material of the first electrode on the side close to the substrate and the material of the auxiliary conductive unit both include indium tin oxide.

[0016] In some possible implementations, the first electrode includes a first sublayer, a second sublayer, and a third sublayer sequentially stacked in a direction away from the substrate, and a thickness of the first sublayer in a thickness direction of the substrate is less than or equal to 0.01 micrometers;

[0017] Preferably, the thickness of the first sub-layer ranges from 0.005 μm to 0.01 μm;

[0018] Preferably, the film materials of the first sub-layer and the third sub-layer both include indium tin oxide, and the film material of the second sub-layer includes silver;

[0019] Preferably, a distance between an edge of an orthographic projection of the first sub-layer on the substrate and an edge of an orthographic projection of the second sub-layer on the substrate is less than or equal to 0.1 micrometer.

[0020] In some possible implementations, a distance from a side of the filling unit away from the substrate to the substrate is greater than or equal to a distance from a side of the first portion of the auxiliary conductive unit away from the substrate to the substrate;

[0021] Preferably, the material of the filling unit includes organic material.

[0022] In some possible implementations, the display panel further includes:

[0023] a pixel defining layer located on a side of the first electrode away from the substrate, the pixel defining layer comprising a plurality of pixel openings, the pixel openings exposing at least a portion of the corresponding first electrode;

[0024] an isolation structure located on a side of the pixel defining layer away from the substrate, the isolation structure comprising a plurality of isolation openings, wherein orthographic projections of the pixel openings on the substrate are located within orthographic projections of corresponding isolation openings on the substrate;

[0025] An orthographic projection of the first through hole on the substrate is located within an orthographic projection of the isolation opening on the substrate.

[0026] In some possible implementations, the display panel further includes light-emitting functional layers and second electrodes of a plurality of light-emitting devices, and the light-emitting functional layers and second electrodes are located in corresponding isolation openings;

[0027] Preferably, the isolation structure is conductive, and the second electrode is in contact with the isolation structure;

[0028] Preferably, the material of the pixel defining layer includes an inorganic insulating material.

[0029] In some possible implementations, the display panel further includes a plurality of packaging units, each of which is located on a side of the corresponding light-emitting device away from the substrate.

[0030] Preferably, there is a gap between adjacent packaging units;

[0031] Preferably, the display panel further comprises a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate;

[0032] Preferably, the materials of the encapsulation unit and the second encapsulation layer include inorganic materials; and the material of the first encapsulation layer includes organic materials.

[0033] In some possible implementations, the isolation structure includes a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate, and an orthographic projection of the supporting portion on the substrate is located within an orthographic projection of the shielding portion on the substrate;

[0034] Preferably, under the same etching conditions, the etching resistance of the support portion is weaker than that of the shielding portion;

[0035] Preferably, the material of the supporting portion includes aluminum, and / or the material of the shielding portion includes titanium;

[0036] Preferably, the isolation structure further comprises a receiving portion located between the supporting portion and the substrate;

[0037] Preferably, the orthographic projection of the receiving portion on the substrate is located within the orthographic projection of the shielding portion on the substrate;

[0038] Preferably, the material of the receiving portion includes molybdenum.

[0039] One of the objectives of the present application is to provide a method for manufacturing a display panel, the method comprising:

[0040] providing a substrate;

[0041] forming a first conductive layer on one side of the substrate;

[0042] forming a first insulating layer on a side of the first conductive layer away from the substrate, wherein the first insulating layer comprises at least one first through hole exposing the first conductive layer;

[0043] forming at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first portion and a second portion connected to each other, the first portion being located on a side of the first insulating layer away from the substrate, and the second portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer;

[0044] forming a filling unit at least partially located within the recessed structure;

[0045] A first electrode of at least one light-emitting device is formed, wherein the first electrode is located on a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, at least a portion of the first electrode is in contact with the auxiliary conductive unit, and an orthographic projection of the first electrode on the substrate is located within an orthographic projection of the auxiliary conductive unit on the substrate.

[0046] In some possible implementations, the method further includes a step of forming a first electrode of at least one light-emitting device, including:

[0047] forming a fully covered conductive material layer, the conductive material layer comprising a first sublayer, a second sublayer, and a third sublayer sequentially stacked in a direction away from the substrate;

[0048] The first sublayer, the second sublayer and the third sublayer are pattern-etched in one etching process to form a first electrode of at least one light-emitting device.

[0049] In some possible implementations, the method further includes:

[0050] forming a pixel defining layer on a side of the first electrode away from the substrate, wherein the pixel defining layer comprises a plurality of pixel openings, and the pixel openings expose at least a portion of the corresponding first electrode;

[0051] The pixel definition layer is baked.

[0052] In some possible implementations, the step of baking the pixel defining layer includes:

[0053] The pixel defining layer is baked at a temperature of less than or equal to 200 degrees Celsius for less than or equal to 30 minutes.

[0054] Another object of the present application is to provide an electronic device, which includes the display panel provided in the present application, or the electronic device includes a display panel manufactured by the manufacturing method of the display panel provided in the present application.

[0055] Compared with the prior art, this application has the following beneficial effects:

[0056] The present application provides a display panel, a method for manufacturing a display panel, and an electronic device. By setting the coverage range of the auxiliary conductive unit to be larger than the coverage range of the first electrode, the first electrode is completely located above the auxiliary conductive unit. This can reduce the risk of voids at the edge of the first electrode after setting the pixel defining layer, thereby reducing the risk of water vapor released from the organic film layer below the subsequent voids and propagating along the edge of the pixel definition, causing the display panel to produce display spots. BRIEF DESCRIPTION OF THE DRAWINGS

[0057] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0058] Figure 1 is a schematic diagram of an existing related display panel;

[0059] Figure 2 One of the schematic diagrams of the display panel provided in this embodiment;

[0060] Figure 3The second schematic diagram of the display panel provided in this embodiment;

[0061] Figure 4 The third schematic diagram of the display panel provided in this embodiment;

[0062] Figure 5 A fourth schematic diagram of a display panel provided in this embodiment;

[0063] Figure 6 The fifth schematic diagram of the display panel provided in this embodiment;

[0064] Figure 7 The sixth schematic diagram of the display panel provided in this embodiment;

[0065] Figure 8 The seventh schematic diagram of the display panel provided in this embodiment;

[0066] Figure 9 One of the schematic diagrams of the isolation structure provided in this embodiment;

[0067] Figure 10 The second schematic diagram of the isolation structure provided in this embodiment;

[0068] Figure 11 This is a schematic flow chart of a method for manufacturing a display panel provided in this embodiment.

[0069] Icon: 100-substrate; 110-array functional layer; 1116-first conductive layer; 1117-first insulating layer; 510-auxiliary conductive unit; 511-first part; 512-second part; 610-filling unit; 120-first electrode; 1201-first surface; 1202-second surface; 1203-side surface; 121-first sublayer; 122-second sublayer; 123-third sublayer; 130-pixel defining layer; 140-isolation structure; 141-supporting part; 142-shielding part; 143-receiving part; 810-light-emitting device; 910-isolation opening; 150-light-emitting functional layer; 160-second electrode; 170-packaging unit; 180-first packaging layer; 190-second packaging layer; 401-void; 710-recessed structure. DETAILED DESCRIPTION

[0070] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0071] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0072] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0073] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0074] It should be noted that, in the absence of conflict, different features in the embodiments of the present application can be combined with each other.

[0075] In order to increase the pixel density of the display panel, it is necessary to reduce the spacing between the light emitting devices 810'. Figure 1 In some related display panels, the via holes of the first electrode 120' originally set between the pixel openings (ie, the via holes connecting the first electrode 120' and the first conductive layer 1116' in the array functional layer 110') are set at corresponding positions within the pixel openings.

[0076] In this case, in order to ensure the flatness of the first electrode 120' at the via hole, an auxiliary conductive unit 510' extending into the via hole is provided, and then a filling unit 610' is provided in the recessed structure 710' formed by the auxiliary conductive unit 510' sinking into the via hole, and then the first electrode 120' is provided.

[0077] Research has found that in this type of display panel, the edges of the auxiliary electrode may be recessed relative to the edges of the first electrode 120', forming an undercut structure. This can lead to the formation of a cavity 401' at the undercut structure after the pixel-defining layer 130' is applied. Water vapor released from the planarization layer subsequently overflows from the cavity 401' and propagates through the edges of the pixel-defining layer 130', potentially causing pitting defects in the display panel.

[0078] In view of this, this embodiment provides a solution that can reduce the risk of pitting defects in a display panel. The solution provided by this embodiment is described in detail below.

[0079] See Figure 2 , Figure 2 This is a schematic diagram of a display panel provided in this embodiment. The display panel may include a substrate 100 , a first conductive layer 1116 , a first insulating layer 1117 , an auxiliary conductive unit 510 , a filling unit 610 and a light emitting device 810 .

[0080] In this embodiment, the material of the substrate 110 may include a rigid material, such as glass; or the material of the substrate 110 may include a flexible material, such as polyimide (Pi).

[0081] An array functional layer 110 may also be provided on one side of the substrate 110. The array functional layer 110 may include multiple film layers, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer. The multiple film layers of the array functional layer 110 may form multiple thin film transistors (TFTs) and wiring structures at different locations. The TFTs cooperate to form multiple pixel drive units or drive circuits, and the wiring structures provide signals or voltages to the circuits.

[0082] The first conductive layer 1116 is located on one side of the substrate 100. For example, the first conductive layer 1116 may be a conductive layer on a side of the array functional layer 110 away from the substrate 100.

[0083] The first insulating layer 1117 is located on a side of the first conductive layer 1116 away from the substrate 100, and the first insulating layer 1117 includes at least one first through hole exposing the first conductive layer 1116. Optionally, the first insulating layer 1117 may be a planarization layer.

[0084] See Figure 3 The auxiliary conductive unit 510 includes a first part 511 and a second part 512 connected to each other, the first part 511 is located on the side of the first insulating layer 1117 away from the substrate 100, and the second part 512 extends along the first insulating layer 1117 toward the side wall of the first through hole to form a recessed structure 710 in the first through hole and contacts the first conductive layer 1116.

[0085] For example, the orthographic projection of the first through hole on the substrate 100 is located within the orthographic projection of the auxiliary unit on the substrate 100. The auxiliary unit extends from the side of the first insulating layer 1117 away from the substrate 100 along the sidewall of the first through hole until it contacts the first conductive layer 1116. In this case, the auxiliary unit is sunken into the first through hole to form a recessed structure 710.

[0086] At least a portion of the filling unit 610 is located in the recessed structure 710. In this embodiment, the filling unit 610 is used to fill the recessed structure 710 formed by the auxiliary unit sinking into the first through hole. The filling unit 610 and the auxiliary conductive unit 510 together form a relatively flat surface for disposing the first electrode 120.

[0087] The first electrode 120 of at least one light-emitting device 810 is located on a side of the corresponding auxiliary conductive unit 510 and the filling unit 610 away from the substrate 100, at least a portion of the first electrode 120 is in contact with the auxiliary conductive unit 510, and the orthographic projection of the first electrode 120 on the substrate 100 is located within the orthographic projection of the auxiliary conductive unit 510 on the substrate 100.

[0088] Optionally, the display panel provided in this embodiment further includes a pixel defining layer 130 , which is located on a side of the first electrode 120 away from the substrate 100 . The pixel defining layer 130 includes a plurality of pixel openings, which expose at least part of the corresponding first electrode 120 .

[0089] Optionally, the orthographic projections of the edges of the first electrode 120 and the auxiliary conductive unit 510 on the substrate 100 are located within the orthographic projection of the pixel defining layer 130 on the substrate 100 . That is, the pixel defining layer 130 covers the edges of the first electrode 120 and the auxiliary conductive unit 510 .

[0090] Optionally, the orthographic projection of the first through hole on the substrate 100 is located within the orthographic projection of the pixel opening on the substrate 100 .

[0091] Optionally, the material of the pixel defining layer 130 includes an inorganic insulating material.

[0092] Based on the above design, in this embodiment, by setting the coverage range of the auxiliary conductive unit 510 to be larger than the coverage range of the first electrode 120, so that the first electrode 120 is completely located above the auxiliary conductive unit 510, the risk of voids existing at the edge of the first electrode 120 after the pixel defining layer 130 is set can be reduced, thereby reducing the risk of the organic film layer under the subsequent voids releasing water vapor to cause the pixel defining layer 130 to bulge and produce display spots.

[0093] Optionally, the display panel provided in this embodiment may further include an isolation structure 140, which is located on the side of the pixel defining layer 130 away from the substrate 100. The isolation structure 140 includes a plurality of isolation openings 910, and the orthographic projection of the pixel opening on the substrate 100 is located within the orthographic projection of the corresponding isolation opening 910 on the substrate 100.

[0094] The orthographic projection of the first through hole on the substrate 100 is located within the orthographic projection of the isolation opening 910 on the substrate 100 .

[0095] For some possible implementations, see Figure 4 The minimum distance W11 between the edge of the orthographic projection of the first electrode 120 on the substrate 100 and the edge of the orthographic projection of the auxiliary conductive unit 510 on the substrate 100 is greater than or equal to 1.5 microns. This reduces the risk of the auxiliary electrode edge being affected by etching and forming an undercut structure during the subsequent etching process of the first electrode 120.

[0096] Optionally, the distance between the edge of the orthographic projection of the first electrode 120 on the substrate 100 and the edge of the orthographic projection of the auxiliary conductive unit 510 on the substrate 100 is less than or equal to 2 micrometers. In this way, the distance between the edge of the first electrode 120 and the auxiliary conductive unit 510 can be prevented from being too large, thereby preventing the auxiliary conductive unit 510 from occupying too much area.

[0097] For some possible implementations, see Figure 5 The first electrode 120 includes a first surface 1201, a second surface 1202 and a side surface 1203. The first surface 1201 is located on the side facing the substrate 100, the second surface 1202 is located on the side away from the substrate 100, and the side surface 1203 connects the first surface 1201 and the second surface 1202. The angle between the side surface 1203 and the surface of the substrate 100 is Less than or equal to 60 degrees.

[0098] In some possible implementations, the film material of the first electrode 120 near the substrate 100 is the same as the material of the auxiliary conductive unit 510. For example, the film material of the first electrode 120 near the substrate 100 and the film material of the auxiliary conductive unit 510 both include indium tin oxide.

[0099] In this way, the adhesion between the first electrode 120 and the auxiliary conductive unit 510 can be ensured, and film peeling can be avoided.

[0100] For some possible implementations, see Figure 6 The first electrode 120 includes a first sublayer 121, a second sublayer 122 and a third sublayer 123 stacked in sequence in a direction away from the substrate 100. In the thickness direction of the substrate 100, the thickness H1 of the first sublayer 121 is less than or equal to 0.01 microns.

[0101] Optionally, the thickness H1 of the first sub-layer 121 ranges from 0.005 μm to 0.01 μm;

[0102] Optionally, the film materials of the first sub-layer 121 and the third sub-layer 123 both include indium tin oxide, and the film material of the second sub-layer 122 includes silver.

[0103] Optionally, a distance between an edge of an orthographic projection of the first sub-layer 121 on the substrate 100 and an edge of an orthographic projection of the second sub-layer 122 on the substrate 100 is less than or equal to 0.1 micrometer.

[0104] In this way, by reducing the thickness of the first sub-layer 121, the first sub-layer 121, the second sub-layer 122 and the third sub-layer 123 are etched simultaneously in one etching operation, that is, the first electrode 120 can be formed by one etching operation, reducing the side etching amount of the first sub-layer 121, thereby reducing the risk of undercut structures generated by multiple etchings of different film layers of the first electrode 120 itself.

[0105] For some possible implementations, see Figure 7 , a distance H21 from the side of the filling unit 610 away from the substrate 100 to the substrate 100 is greater than or equal to a distance H22 from the side of the first portion 511 of the auxiliary conductive unit 510 away from the substrate 100 to the substrate 100 .

[0106] That is, the filling unit 610 may completely fill the recessed structure 710 formed by the auxiliary conductive unit 510 sinking into the first through hole.

[0107] Optionally, the material of the filling unit 610 includes an organic material. For example, the material of the filling unit 610 can be a material that is fluid during the formation process and solidifies after formation. In this way, the filling unit 610 can better fill the recessed structure 710 of the auxiliary conductive unit 510.

[0108] In some possible implementations, the display panel further includes a light-emitting functional layer 150 and a second electrode 160 of a plurality of light-emitting devices 810 , and the light-emitting functional layer 150 and the second electrode 160 are located in corresponding isolation openings 910 .

[0109] Optionally, the isolation structure 140 is conductive, and the second electrode 160 is in contact with the isolation structure 140 .

[0110] Optionally, the first electrode 120 can be connected to the pixel driving circuit in the array functional layer 110, and the second electrode 160 can be connected to the common voltage providing circuit through the isolation structure 140. When there is a potential difference between the first electrode 120 and the second electrode 160, the light-emitting functional layer 150 located between the first electrode 120 and the second electrode 160 is driven to emit light.

[0111] In some possible implementations, the display panel further includes a plurality of encapsulation units 170 , and the encapsulation units 170 are located on a side of the corresponding light-emitting device 810 away from the substrate 100 .

[0112] Optionally, there is a gap between adjacent packaging units 170 .

[0113] Alternatively, see Figure 8 The display panel further includes a first encapsulation layer 180 and a second encapsulation layer 190 located on a side of the encapsulation unit 170 and the isolation structure 140 away from the substrate 100;

[0114] Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials; and the material of the first encapsulation layer 180 includes organic materials.

[0115] For some possible implementations, see Figure 9 The isolation structure 140 includes a supporting portion 141 and a shielding portion 142 located on a side of the supporting portion 141 away from the substrate 100 , and the orthographic projection of the supporting portion 141 on the substrate 100 is located within the orthographic projection of the shielding portion 142 on the substrate 100 .

[0116] Optionally, the etching resistance of the support portion 141 is weaker than that of the shielding portion 142 .

[0117] Optionally, the material of the support portion 141 includes aluminum, and / or the material of the shielding portion 142 includes titanium.

[0118] For some possible implementations, see Figure 10 The isolation structure 140 further includes a receiving portion 143 located between the supporting portion 141 and the substrate 100 .

[0119] Optionally, the orthographic projection of the receiving portion 143 on the substrate 100 is located within the orthographic projection of the shielding portion 142 on the substrate 100 .

[0120] Optionally, the material of the receiving portion 143 includes molybdenum.

[0121] In some possible implementations, the display panel provided in this embodiment may further include an optical film (e.g., a polarizer) located on the side of the second encapsulation layer 190 away from the substrate 110, a transparent adhesive layer (e.g., an optical adhesive layer), a cover plate and other film layer structures, which are not described one by one in this embodiment.

[0122] See Figure 11 This embodiment also provides a method for manufacturing a display panel, which may include the following steps.

[0123] Step S110 , providing a substrate 100 .

[0124] Step S120 , forming a first conductive layer 1116 on one side of the substrate 100 ;

[0125] Step S130 , forming a first insulating layer 1117 on a side of the first conductive layer 1116 away from the substrate 100 , wherein the first insulating layer 1117 includes at least one first through hole exposing the first conductive layer 1116 ;

[0126] Step S140: forming at least one auxiliary conductive unit 510. The auxiliary conductive unit 510 includes a first portion 511 and a second portion 512 connected to each other. The first portion 511 is located on a side of the first insulating layer 1117 away from the substrate 100. The second portion 512 extends along the first insulating layer 1117 toward the sidewall of the first through hole, forming a recessed structure 710 in the first through hole and contacting the first conductive layer 1116.

[0127] Step S150 , forming a filling unit 610 at least partially located in the recessed structure 710 ;

[0128] In step S160, a first electrode 120 of at least one light-emitting device 810 is formed. The first electrode 120 is located on a side of the corresponding auxiliary conductive unit 510 and the filling unit 610 away from the substrate 100. At least a portion of the first electrode 120 is in contact with the auxiliary conductive unit 510, and the orthographic projection of the first electrode 120 on the substrate 100 is located within the orthographic projection of the auxiliary conductive unit 510 on the substrate 100.

[0129] In some possible implementations, in step S160, a fully covered conductive material layer may be formed, the conductive material layer including a first sublayer 121, a second sublayer 122, and a third sublayer 123 stacked sequentially in a direction away from the substrate 100. The first sublayer 121, the second sublayer 122, and the third sublayer 123 are then pattern-etched in a single etching step to form the first electrode 120 of at least one light-emitting device 810.

[0130] In this way, the first electrode 120 can be formed through a single etching operation, thereby reducing the risk of undercut structures being generated in different film layers of the first electrode 120 due to multiple etching operations.

[0131] In some possible implementations, after step S160, the method provided in this embodiment may further include the following steps.

[0132] In step S170 , a pixel defining layer 130 is formed on a side of the first electrode 120 away from the substrate 100 . The pixel defining layer 130 includes a plurality of pixel openings, and the pixel openings expose at least a portion of the corresponding first electrode 120 .

[0133] In step S180 , the pixel definition layer 130 is baked.

[0134] In this way, adding a baking action to the pixel definition layer 130 can remove the moisture in the first insulating layer 1117 , thereby reducing the risk of subsequent moisture leakage.

[0135] In some possible implementations, in step S180 , the pixel defining layer 130 may be baked at a temperature of less than or equal to 200 degrees Celsius for less than or equal to 30 minutes.

[0136] In this way, cracking of the pixel definition layer 130 or film peeling caused by over-baking can be avoided.

[0137] This application also provides an electronic device, comprising a display panel provided herein, or a display panel manufactured using the method for manufacturing a display panel provided herein. This electronic device may include a mobile phone, tablet computer, smart wearable device, television, laptop computer, monitor, or other device with a display function.

[0138] In summary, the present application provides a display panel, a method for manufacturing a display panel, and an electronic device. By setting the coverage range of the auxiliary conductive unit to be larger than the coverage range of the first electrode, so that the first electrode is completely located above the auxiliary conductive unit, the risk of voids at the edge of the first electrode after setting the pixel defining layer can be reduced, thereby reducing the risk of the organic film layer under the subsequent voids releasing water vapor and propagating along the edge of the pixel definition, causing the display panel to produce display spots.

[0139] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0140] The above embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; a first conductive layer located on one side of the substrate; a first insulating layer located on a side of the first conductive layer away from the substrate, the first insulating layer comprising at least one first through hole exposing the first conductive layer; at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first portion and a second portion connected to each other, the first portion being located on a side of the first insulating layer away from the substrate, and the second portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer; a filling unit at least partially located within the recessed structure; a first electrode of at least one light-emitting device, the first electrode being located on a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, at least a portion of the first electrode being in contact with the auxiliary conductive unit, and an orthographic projection of the first electrode on the substrate being located within an orthographic projection of the auxiliary conductive unit on the substrate; The distance between the edge of the orthographic projection of the first electrode on the substrate and the edge of the orthographic projection of the auxiliary conductive unit on the substrate is greater than or equal to 1.5 micrometers and less than or equal to 2 micrometers.

2. The display panel according to claim 1, wherein: The first electrode includes a first surface, a second surface and a side surface, the first surface is located on the side facing the substrate, the second surface is located on the side away from the substrate, the side surface connects the first surface and the second surface, and the angle between the side surface and the surface where the substrate is located is less than or equal to 60 degrees.

3. The display panel according to claim 1, wherein: The material of the film layer of the first electrode close to the substrate is the same as the material of the auxiliary conductive unit.

4. The display panel according to claim 3, wherein: The first electrode includes a first sublayer, a second sublayer, and a third sublayer sequentially stacked in a direction away from the substrate, wherein the thickness of the first sublayer in the thickness direction of the substrate is less than or equal to 0.01 micrometers; The thickness of the first sub-layer ranges from 0.005 μm to 0.01 μm; The film layer materials of the first sub-layer and the third sub-layer both include indium tin oxide, and the film layer material of the second sub-layer includes silver; A distance between an edge of an orthographic projection of the first sub-layer on the substrate and an edge of an orthographic projection of the second sub-layer on the substrate is less than or equal to 0.1 micrometer.

5. The display panel according to claim 1, wherein: The distance between the side of the filling unit away from the substrate and the substrate is greater than or equal to the distance between the side of the first portion of the auxiliary conductive unit away from the substrate and the substrate; The material of the filling unit includes an organic material.

6. The display panel according to claim 1, wherein: The display panel further includes: a pixel defining layer located on a side of the first electrode away from the substrate, the pixel defining layer comprising a plurality of pixel openings, the pixel openings exposing at least a portion of the corresponding first electrode; an isolation structure located on a side of the pixel defining layer away from the substrate, the isolation structure comprising a plurality of isolation openings, wherein orthographic projections of the pixel openings on the substrate are located within orthographic projections of corresponding isolation openings on the substrate; An orthographic projection of the first through hole on the substrate is located within an orthographic projection of the isolation opening on the substrate.

7. The display panel according to claim 6, wherein: The display panel further includes a light-emitting functional layer and a second electrode of a plurality of light-emitting devices, wherein the light-emitting functional layer and the second electrode are located in the corresponding isolation openings; The isolation structure is conductive, and the second electrode is in contact with the isolation structure; The material of the pixel defining layer includes an inorganic insulating material.

8. The display panel according to claim 7, wherein: The display panel further comprises a plurality of packaging units, wherein the packaging units are located on a side of the corresponding light emitting device away from the substrate; There is a gap between adjacent packaging units; The display panel further includes a first encapsulation layer and a second encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate; The materials of the encapsulation unit and the second encapsulation layer both include inorganic materials; and the material of the first encapsulation layer includes organic materials.

9. The display panel according to claim 6, wherein: The isolation structure includes a supporting portion and a shielding portion located on a side of the supporting portion away from the substrate, wherein the orthographic projection of the supporting portion on the substrate is located within the orthographic projection of the shielding portion on the substrate; Under the same etching conditions, the etching resistance of the support portion is weaker than the etching resistance of the shielding portion; The isolation structure further includes a receiving portion located between the support portion and the substrate; The orthographic projection of the receiving portion on the substrate is located within the orthographic projection of the shielding portion on the substrate.

10. A method for manufacturing a display panel, characterized in that: The method comprises: providing a substrate; forming a first conductive layer on one side of the substrate; forming a first insulating layer on a side of the first conductive layer away from the substrate, wherein the first insulating layer comprises at least one first through hole exposing the first conductive layer; forming at least one auxiliary conductive unit, the auxiliary conductive unit comprising a first portion and a second portion connected to each other, the first portion being located on a side of the first insulating layer away from the substrate, and the second portion extending along the first insulating layer toward a sidewall of the first through hole into the first through hole to form a recessed structure and contact the first conductive layer; forming a filling unit at least partially located within the recessed structure; forming a first electrode of at least one light-emitting device, the first electrode being located on a side of the corresponding auxiliary conductive unit and the filling unit away from the substrate, at least a portion of the first electrode being in contact with the auxiliary conductive unit, and an orthographic projection of the first electrode on the substrate being within an orthographic projection of the auxiliary conductive unit on the substrate; Wherein, the distance between the edge of the orthographic projection of the first electrode on the substrate and the edge of the orthographic projection of the auxiliary conductive unit on the substrate is greater than or equal to 1.5 microns; A distance between an edge of an orthographic projection of the first electrode on the substrate and an edge of an orthographic projection of the auxiliary conductive unit on the substrate is less than or equal to 2 micrometers.

11. The method according to claim 10, characterized in that The step of forming a first electrode of at least one light-emitting device comprises: forming a fully covered conductive material layer, the conductive material layer comprising a first sublayer, a second sublayer, and a third sublayer sequentially stacked in a direction away from the substrate; The first sublayer, the second sublayer and the third sublayer are pattern-etched in one etching process to form a first electrode of at least one light-emitting device.

12. The method according to claim 10, characterized in that The method further comprises: forming a pixel defining layer on a side of the first electrode away from the substrate, wherein the pixel defining layer comprises a plurality of pixel openings, and the pixel openings expose at least a portion of the corresponding first electrode; The pixel definition layer is baked.

13. The method according to claim 12, characterized in that The step of baking the pixel defining layer includes: The pixel defining layer is baked at a temperature of less than or equal to 200 degrees Celsius for less than or equal to 30 minutes.

14. An electronic device, characterized in that: The electronic device includes the display panel according to any one of claims 1 to 9, or the electronic device includes a display panel manufactured by the method for manufacturing a display panel according to any one of claims 10 to 13.

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