Display panel manufacturing method, display substrate and display device

Abstract

The invention relates to a manufacturing method of a display panel, a display substrate and a display device. The manufacturing method of the display panel comprises the steps that a mark and a first electrode are formed on one side of a substrate; forming a pixel definition layer on one side, far away from the substrate, of the mark and the first electrode, wherein the pixel definition layer comprises a first covering part; forming an isolation layer on one side, far away from the substrate, of the pixel definition layer, wherein the isolation layer comprises a second covering part; patterning the isolation layer to form a plurality of first isolation openings, and reserving the second covering part; patterning the pixel definition layer to form a plurality of first pixel openings, and reserving the first covering part; at least forming a first light-emitting function layer, a second electrode and a first packaging layer of the first light-emitting device in the first isolation opening; patterning the isolation layer to form a plurality of second isolation openings, and removing the second covering part; patterning the pixel definition layer to form a plurality of second pixel openings; the mark can be prevented from being damaged.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for manufacturing a display panel, a display substrate, and a display device. Background Art

[0002] OLED (Organic Light Emitting Diode) display panel is one of the hot topics in the current display panel research field. OLED display panel has the advantages of low energy consumption, low cost, self-luminescence, wide viewing angle and fast response speed. In the preparation process of traditional display panels, the light-emitting pixel graphics are usually realized through fine metal mask (FMM). FMM technology is mature and has rich experience in mass production. However, FMM technology also has problems such as limited accuracy, high development cost and long development cycle. The non-fine metal mask technology eliminates the limitations of traditional OLED processes on display screen size, resolution and other screen performance, and has the advantages of high performance, full-domain size and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A record relevant contents of the non-fine metal mask technology for reference.

[0003] However, there are still some problems with display panels that need to be solved urgently. Summary of the invention

[0004] Based on this, it is necessary to provide a method for manufacturing a display panel, a display substrate, and a display device in order to improve the problem that the mark is easily damaged during the manufacturing process of the OLED display panel.

[0005] According to a first aspect of the present application, a first method for manufacturing a display panel is provided, comprising:

[0006] providing a substrate;

[0007] forming at least one mark and a plurality of first electrodes arranged in an array on one side of the substrate;

[0008] A pixel definition layer is formed on a side of at least one mark and a plurality of first electrodes away from the substrate, wherein the pixel definition layer includes at least one first covering portion, and an orthographic projection of the mark on the substrate is located within an orthographic projection range of the corresponding first covering portion on the substrate;

[0009] An isolation layer is formed on a side of the pixel definition layer away from the substrate, the isolation layer includes a second covering portion, and the orthographic projection of the mark on the substrate is located within the orthographic projection range of the corresponding second covering portion on the substrate;

[0010] Patterning the isolation layer to form a plurality of first isolation openings and retaining the second covering portion;

[0011] Patterning the pixel definition layer to form a plurality of first pixel openings and retaining the first covering portion, wherein the first pixel openings are connected to the corresponding first isolation openings, and the first pixel openings expose the corresponding first electrodes;

[0012] Forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of a first light-emitting device at least in the first isolation opening;

[0013] Patterning the isolation layer to form a plurality of second isolation openings, and removing the second covering portion;

[0014] Patterning the pixel definition layer to form a plurality of second pixel openings, wherein the second pixel openings are connected to the corresponding second isolation openings, and the second pixel openings expose the corresponding first electrodes;

[0015] A second light emitting functional layer, a second electrode and a second encapsulation layer of the second light emitting device are formed at least in the second isolation opening.

[0016] In some embodiments, the step of patterning the pixel definition layer to form a plurality of second pixel openings includes: retaining the first covering portion;

[0017] Optionally, the second light emitting device is the last light emitting device manufactured;

[0018] Optionally, the pixel definition layer comprises an inorganic insulating material;

[0019] Optionally, the isolation layer comprises a conductive material;

[0020] Optionally, the marked material comprises metal;

[0021] Optionally, the marking includes an alignment mark;

[0022] Optionally, the step of forming a second light-emitting functional layer, a second electrode and a second encapsulation layer of the second light-emitting device at least in the second isolation opening includes:

[0023] sequentially forming a second preset light-emitting functional layer, a preset second electrode and a preset second encapsulation layer of a second light-emitting device;

[0024] Patterning the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device, removing the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the first isolation opening, retaining the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second isolation opening, and forming the second light-emitting functional layer, the second electrode and the second encapsulation layer of the second light-emitting device in the second isolation opening;

[0025] Optionally, the step of forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of the first light-emitting device at least in the first isolation opening includes:

[0026] sequentially forming a first preset light-emitting functional layer, a preset second electrode and a preset first encapsulation layer of a first light-emitting device;

[0027] The first preset light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first light-emitting device are patterned, at least part of the first preset light-emitting functional layer, at least part of the preset second electrode and at least part of the preset first packaging layer outside the first isolation opening are removed, the first preset light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first isolation opening are retained, and the first light-emitting functional layer, the second electrode and the first packaging layer of the first light-emitting device are formed in the first isolation opening.

[0028] In some embodiments, while sequentially forming the second preset light-emitting functional layer, the preset second electrode, and the preset second encapsulation layer of the second light-emitting device, the manufacturing method further includes:

[0029] forming a third covering portion, wherein at least a portion of the third covering portion is disposed in the same layer and made of the same material as the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device;

[0030] The step of patterning the second preset light-emitting function layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device includes: removing the third covering portion to expose the first covering portion.

[0031] In some embodiments, while sequentially forming the second preset light-emitting functional layer, the preset second electrode, and the preset second encapsulation layer of the second light-emitting device, the manufacturing method further includes:

[0032] forming a third covering portion, wherein at least a portion of the third covering portion is disposed in the same layer as the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device;

[0033] The step of patterning the second preset light-emitting function layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device includes: retaining the third covering portion.

[0034] In some embodiments, at least after the step of forming the first light-emitting functional layer, the second electrode and the first encapsulation layer of the first light-emitting device in the first isolation opening, and before the step of patterning the isolation layer to form a plurality of second isolation openings and removing the second covering portion, the method further includes:

[0035] Patterning the isolation layer to form a plurality of third isolation openings and retaining the second covering portion;

[0036] Patterning the pixel definition layer to form a plurality of third pixel openings and retaining the first covering portion, wherein the third pixel openings are connected to corresponding third isolation openings, and the third pixel openings expose corresponding first electrodes;

[0037] A third light emitting functional layer, a second electrode and a third encapsulation layer of the third light emitting device are formed at least in the third isolation opening.

[0038] In some embodiments, the step of forming a third light-emitting functional layer, a second electrode, and a third encapsulation layer of the third light-emitting device at least in the third isolation opening includes:

[0039] sequentially forming a third preset light-emitting functional layer, a preset second electrode and a preset third encapsulation layer of a third light-emitting device;

[0040] The third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device are patterned, the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device of the first isolation opening are removed, the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device of the third isolation opening are retained, and the third light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device are formed in the third isolation opening.

[0041] In some embodiments, after the step of patterning the isolation layer to form a plurality of second isolation openings and removing the second covering portion, the isolation layer includes an isolation structure, and the isolation structure is disposed around the first isolation opening, the second isolation opening, and the third isolation opening;

[0042] Optionally, the isolation structure is in a grid shape;

[0043] Optionally, the isolation structure includes a conductive material, the second electrode of the first light-emitting device is electrically connected to the isolation structure, the second electrode of the second light-emitting device is electrically connected to the isolation structure; and the second electrode of the third light-emitting device is electrically connected to the isolation structure.

[0044] In some embodiments, at least after the step of forming the second light-emitting functional layer, the second electrode and the second encapsulation layer of the second light-emitting device in the second isolation opening, the first encapsulation layer, the second encapsulation layer and the third encapsulation layer are arranged at intervals;

[0045] Optionally, the first encapsulation layer includes an inorganic material; the second encapsulation layer includes an inorganic material; and the third encapsulation layer includes an inorganic material.

[0046] In some embodiments, the isolation structure includes a support portion and a crown portion stacked in sequence on the substrate in a direction away from the substrate, and the orthographic projection of a side of the support portion away from the substrate on the substrate is within the range of the orthographic projection of the crown portion on the substrate;

[0047] Optionally, the support portion includes a conductive material, and the second electrode of the first light-emitting device overlaps the side wall of the support portion surrounding the first isolation opening; the second electrode of the second light-emitting device overlaps the side wall of the support portion surrounding the second isolation opening; the second electrode of the third light-emitting device overlaps the side wall of the support portion surrounding the third isolation opening;

[0048] Optionally, the material of the support portion comprises aluminum, and / or the material of the crown portion comprises titanium.

[0049] In some embodiments, the isolation structure includes a support portion and a crown portion stacked in sequence on the substrate in a direction away from the substrate, and a pad portion located between the support portion and the substrate, the orthographic projection of the side of the support portion away from the substrate on the substrate is located within the range of the orthographic projection of the crown portion on the substrate, and the orthographic projection of the support portion on the substrate is located within the range of the orthographic projection of the pad portion on the substrate;

[0050] Optionally, the pad portion includes a conductive material, and the second electrode of the first light-emitting device overlaps the pad portion surrounding the first isolation opening; the second electrode of the second light-emitting device overlaps the pad portion surrounding the second isolation opening; the second electrode of the third light-emitting device overlaps the pad portion surrounding the third isolation opening;

[0051] Optionally, the pad portion and the support portion both include a conductive material, the second electrode of the first light-emitting device overlaps the pad portion and the support portion surrounding the first isolation opening; the second electrode of the second light-emitting device overlaps the pad portion and the support portion surrounding the second isolation opening; the second electrode of the third light-emitting device overlaps the pad portion and the support portion surrounding the third isolation opening;

[0052] Optionally, the material of the support portion comprises aluminum, and / or the material of the crown portion comprises titanium, and / or the material of the pad portion comprises molybdenum.

[0053] In some embodiments, the first light emitting device, the second light emitting device, and the third light emitting device emit different colors;

[0054] Optionally, the first light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device, the second light-emitting device is one of the red light-emitting device, the green light-emitting device, and the blue light-emitting device that is different from the first light-emitting device, and the third light-emitting device is one of the red light-emitting device, the green light-emitting device, and the blue light-emitting device that is different from both the first light-emitting device and the second light-emitting device.

[0055] In some embodiments, the substrate includes a preset display area and a preset non-display area, the first light emitting device, the second light emitting device, and the third light emitting device are formed in the preset display area, and the mark is formed in the preset non-display area.

[0056] According to a second aspect of the present application, based on the same inventive concept, a second method for manufacturing a display panel is provided, comprising:

[0057] providing a substrate;

[0058] forming at least one mark on one side of the substrate;

[0059] forming at least a portion of a protective layer on a side of at least one mark away from the substrate, wherein an orthographic projection of the mark on the substrate overlaps an orthographic projection of the protective layer on the substrate;

[0060] forming an isolation layer on one side of the substrate;

[0061] patterning the isolation layer to form a first isolation opening;

[0062] forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of a first light-emitting device in the first isolation opening;

[0063] patterning the isolation layer to form a second isolation opening;

[0064] A second light emitting functional layer, a second electrode and a second encapsulation layer of the second light emitting device are formed in the second isolation opening.

[0065] In some embodiments, the protective layer includes a first covering portion and a second covering portion sequentially stacked in a direction away from the substrate;

[0066] Before the step of forming an isolation layer on one side of the substrate, the method for manufacturing a display panel further includes: forming a pixel definition layer, the pixel definition layer including a first covering portion, an orthographic projection of the mark on the substrate overlapping with an orthographic projection of the first covering portion on the substrate;

[0067] At the same time or after the step of patterning the isolation layer to form the second isolation opening, the method for manufacturing the display panel further includes: removing the second covering portion;

[0068] Optionally, the materials of the second covering portion and the isolation layer are at least partially different or arranged in different layers, and the second covering portion includes a light-transmitting layer;

[0069] Optionally, the material of the light-transmitting layer includes semiconductor metal oxide;

[0070] Optionally, the semiconductor metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide, and indium gallium zinc oxide;

[0071] Alternatively, the corrosion resistance of the material of at least part of the film layer of the second covering portion is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer;

[0072] Optionally, the material of the second covering portion includes titanium;

[0073] Alternatively, the isolation layer includes a second covering portion, and the orthographic projection of the mark on the substrate overlaps with the orthographic projection of the second covering portion on the substrate;

[0074] While patterning the isolation layer to form the first isolation opening, the method for manufacturing the display panel further includes: retaining the second covering portion;

[0075] While patterning the isolation layer to form the second isolation opening, the method for manufacturing the display panel further includes: removing the second covering portion;

[0076] Optionally, the number of film layers of the second covering portion is less than or equal to the number of film layers of the isolation layer;

[0077] Optionally, the second covering portion is a single metal film layer or a multi-layer film layer stacked along the thickness direction of the substrate;

[0078] Optionally, an overlapping area of ​​an orthographic projection of the first covering portion on the substrate and an orthographic projection of the second covering portion on the substrate overlaps with an orthographic projection of the mark on the substrate;

[0079] Optionally, the orthographic projection of the mark on the substrate is located within the orthographic projection of the first covering portion on the substrate, and the orthographic projection of the mark on the substrate is located within the orthographic projection of the second covering portion on the substrate;

[0080] Optionally, the first light-emitting device further includes a first electrode located between the substrate and the first light-emitting functional layer, and the mark is arranged in the same layer as the first electrode of the first light-emitting device.

[0081] According to a third aspect of the present application, based on the same inventive concept, a display substrate is provided, comprising:

[0082] substrate;

[0083] At least one mark and a plurality of first electrodes arranged in an array are located on one side of the substrate, and the mark and the first electrode are in the same layer and material;

[0084] A pixel definition layer is located on a side of the at least one mark and the plurality of first electrodes away from the substrate, the pixel definition layer comprises at least one first covering portion, and a plurality of first pixel openings and a plurality of second pixel openings, and the orthographic projection of the mark on the substrate is located within the orthographic projection range of the corresponding first covering portion on the substrate;

[0085] An isolation layer is located on a side of the pixel definition layer away from the substrate, the isolation layer includes a plurality of first isolation openings and a plurality of second isolation openings, the first pixel openings are connected to the corresponding first isolation openings, the first pixel openings expose the corresponding first electrodes, the second pixel openings are connected to the corresponding second isolation openings, the second pixel openings expose the corresponding first electrodes;

[0086] The first light-emitting functional layer, the second electrode and the first encapsulation layer of the first light-emitting device are at least located in the first isolation opening;

[0087] The second light-emitting functional layer, the second electrode and the second encapsulation layer of the second light-emitting device are at least located in the second isolation opening.

[0088] In some embodiments, the display substrate further includes a second covering portion, the second covering portion is located on a side of the first covering portion away from the substrate, and the orthographic projection of the mark on the substrate is located within the orthographic projection range of the corresponding second covering portion on the substrate;

[0089] Optionally, the second covering portion is provided in the same layer and with the same material as the isolation layer;

[0090] Alternatively, the material of the second covering portion includes a light-transmitting layer;

[0091] Optionally, the material of the light-transmitting layer includes semiconductor metal oxide;

[0092] Optionally, the semiconductor metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide, and indium gallium zinc oxide;

[0093] Alternatively, the corrosion resistance of the material of at least part of the film layer of the second covering portion is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer;

[0094] Optionally, the material of the second covering portion includes titanium;

[0095] Optionally, the side of the mark away from the substrate does not have a material that is arranged in the same layer and the same material as the light-emitting functional layer and the second electrode of the light-emitting device.

[0096] According to a fourth aspect of the present application, a display device is provided, which includes a display panel manufactured by the first display panel manufacturing method described in any one of the above, or the display device includes a display panel manufactured by the second display panel manufacturing method described in any one of the above, or the display device includes the display substrate described in any one of the above.

[0097] In an embodiment of the present application, the pixel definition layer includes at least one first covering portion, that is, the first covering portion is formed when the pixel definition layer is formed; the isolation layer includes at least one second covering portion, that is, the second covering portion is formed when the isolation layer or the isolation structure is formed; the isolation layer is patterned to form a plurality of second isolation openings, and the second covering portion is removed, that is, when the second isolation opening is formed, the second covering portion is removed at the same time; the pixel definition layer is patterned to form a plurality of second pixel openings, the second pixel openings are connected to the corresponding second isolation openings, and the second pixel openings expose the corresponding first electrodes, that is, the first covering portion is retained when the second pixel openings are formed. The embodiments of the present application have many beneficial effects. 1) On the one hand, the first covering portion can protect the mark, and the second covering portion can protect the first covering portion before forming the second isolation opening. The second covering portion can protect the first covering portion in the wet etching process of etching the isolation layer with a wet etching solution to form the first isolation opening and / or the wet etching process of etching the electrode material layer with a wet etching solution to form the second electrode of the light-emitting device, so as to prevent the first covering portion from being etched or damaged, thereby preventing the mark from being damaged when the first covering portion is etched or damaged; 2) On the second hand, when forming the second isolation opening, the second covering portion is removed at the same time to prevent the second covering portion from blocking the mark, thereby preventing the mark from being used for alignment in subsequent processes; 3) On the third hand, when forming the second pixel opening, the first covering portion is retained at the same time, the pixel definition layer is a light-transmitting material, the first covering portion is a light-transmitting material, the first covering portion can continue to protect the mark, and will not block the mark, and will not have an adverse effect on the recognition and alignment of the mark. BRIEF DESCRIPTION OF THE DRAWINGS

[0098] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0099] Figure 1 A schematic diagram of a first process step of a first method for manufacturing a display panel provided in some embodiments of the present application.

[0100] Figure 2 A schematic diagram of a second process step of the first method for manufacturing a display panel provided in some embodiments of the present application.

[0101] Figure 3 A schematic diagram of a motherboard in a first method for manufacturing a display panel provided in some embodiments of the present application.

[0102] Figure 4Schematic diagram of small and medium pieces of the first display panel manufacturing method provided in some embodiments of the present application.

[0103] Figure 5 A schematic diagram of a first intermediate process of a first method for manufacturing a display panel provided in some embodiments of the present application.

[0104] Figure 6 A schematic diagram of a second intermediate process of a first method for manufacturing a display panel provided in some embodiments of the present application.

[0105] Figure 7 A schematic diagram of a third intermediate process of the first display panel manufacturing method provided in some embodiments of the present application.

[0106] Figure 8 A schematic diagram of a fourth intermediate process of the first display panel manufacturing method provided in some embodiments of the present application.

[0107] Fig. 9 A schematic diagram of a fifth intermediate process of the first method for manufacturing a display panel provided in some embodiments of the present application.

[0108] Fig.10 A schematic diagram of a sixth intermediate process of the first display panel manufacturing method provided in some embodiments of the present application.

[0109] Fig.11 A schematic diagram of the seventh intermediate process of the first method for manufacturing a display panel provided in some embodiments of the present application.

[0110] Fig.12 Another schematic diagram of the seventh intermediate process of the first display panel manufacturing method provided in some embodiments of the present application.

[0111] Fig.13 Another schematic diagram of the seventh intermediate process of the first display panel manufacturing method provided in some embodiments of the present application.

[0112] Fig.14 A schematic diagram of the process steps of a second method for manufacturing a display panel provided in some embodiments of the present application.

[0113] Fig.15 A schematic diagram of a first intermediate process of a second method for manufacturing a display panel provided in some embodiments of the present application.

[0114] Fig.16 A schematic diagram of a second intermediate process of a second method for manufacturing a display panel provided in some embodiments of the present application.

[0115] Fig.17Another schematic diagram of the second intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0116] Fig.18 A schematic diagram of a third intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0117] Fig.19 A schematic diagram of a fourth intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0118] Fig. 20 A schematic diagram of a fifth intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0119] Fig.21 A schematic diagram of a sixth intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0120] Fig. 22 A schematic diagram of the seventh intermediate process of the second display panel manufacturing method provided in some embodiments of the present application.

[0121] Fig.23 A schematic structural diagram of a display panel in a second method for manufacturing a display panel provided in some embodiments of the present application.

[0122] Fig.24 A schematic diagram of a display device provided in an embodiment of the present application.

[0123] Reference numerals: display panel 100; display device 200; display substrate 110; substrate 11; reference 12m; first conductive layer 12; first electrode 121; motherboard 1000; pixel definition layer 13; first covering portion 13g; isolation layer 14; second covering portion 14g; first sub-isolation layer 141; second sub-isolation layer 142; first isolation opening 14k1; first pixel opening 13k1; first light-emitting device 2341; first light-emitting functional layer 21; second electrode 31; first encapsulation layer 41; second isolation opening 14k2; second pixel opening 13k2; second light-emitting device 2 342; second light-emitting functional layer 22; second encapsulation layer 42; third isolation opening 14k3; third pixel opening 13k3; third light-emitting device 2343; third light-emitting functional layer 23; third encapsulation layer 43; display area AA; non-display area BB; third covering portion 234g; first sub-electrode 121a; second sub-electrode 121b; third sub-electrode 121c; isolation structure 14f; pixel definition structure 131; support portion 14f1; crown portion 14f2; preset non-display area BB1; preset display area AA1; protective layer B10; third sub-isolation layer 143; pad portion 14f3. DETAILED DESCRIPTION

[0124] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0125] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0126] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number or order of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0127] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0128] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0129] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0130] In the related art, there is a problem that the mark is easily damaged in the manufacturing process of the OLED display panel.

[0131] In order to solve the problem of how to prevent the mark from being easily damaged and improve the display quality of the display panel, the present application designs a display panel and its manufacturing method, a display substrate and a display device, aiming to improve the display quality of the display panel.

[0132] See also Figures 1 to 12 . Figure 1 A schematic diagram of a first process step of a first method for manufacturing a display panel provided in some embodiments of the present application. Figure 2 A schematic diagram of a second process step of the first method for manufacturing a display panel provided in some embodiments of the present application.

[0133] Figure 3 A schematic diagram of a motherboard in a first method for manufacturing a display panel provided in some embodiments of the present application. Figure 4 Schematic diagram of small and medium pieces of the first display panel manufacturing method provided in some embodiments of the present application.

[0134] Figure 5 A schematic diagram of a first intermediate process of a first method for manufacturing a display panel provided in some embodiments of the present application. Figure 6 A schematic diagram of a second intermediate process of a first method for manufacturing a display panel provided in some embodiments of the present application. Figure 7A schematic diagram of a third intermediate process of the first display panel manufacturing method provided in some embodiments of the present application. Figure 8 A schematic diagram of a fourth intermediate process of the first display panel manufacturing method provided in some embodiments of the present application. Fig. 9 A schematic diagram of a fifth intermediate process of the first method for manufacturing a display panel provided in some embodiments of the present application. Fig.10 A schematic diagram of a sixth intermediate process of the first display panel manufacturing method provided in some embodiments of the present application. Fig.11 A schematic diagram of the seventh intermediate process of the first method for manufacturing a display panel provided in some embodiments of the present application. Fig.12 Another schematic diagram of the seventh intermediate process of the first display panel manufacturing method provided in some embodiments of the present application. Fig.13 Another schematic diagram of the seventh intermediate process of the first display panel manufacturing method provided in some embodiments of the present application.

[0135] It should be noted that, in some implementations, in the method for manufacturing the display panel, after Figures 5 to 10 The manufacturing steps can be obtained Fig.11 In some other implementations, in the method for manufacturing the display panel, after Figures 5 to 10 The manufacturing steps can be obtained Fig.12 The structure of the display substrate is shown.

[0136] It should be noted that Figure 6 The first isolation opening 14k1 and the first pixel opening 13k1 are schematically formed. Figure 7 It is illustrated that the first light emitting device 2341 and the first encapsulation layer 41 are formed. Figure 8 The third isolation opening 14k3 and the third pixel opening 13k3 are schematically formed. Fig. 9 It is illustrated that the third light emitting device 2343 and the third encapsulation layer 43 are formed. Fig.10 The second isolation opening 14k2 and the second pixel opening 13k2 are schematically formed. Fig.11 and Fig.12 It is illustrated that a second light emitting device 2342 and a second encapsulation layer 42 are formed.

[0137] It should be noted that Figures 6 to 11 ,as well as Fig.12 In the display panel manufacturing process, Figure 4 Schematic diagram of the cross-sectional structure at the dotted line C1-C1.

[0138] First, see Figure 1The present application provides a first method for manufacturing a display panel, and the method for manufacturing a display panel includes: step S100, step S200, step S300, step S400, step S500, step S600, step S700, step S800, step S900, and step S1000.

[0139] Step S100, providing a substrate.

[0140] For example, Figure 5 As shown, a substrate 11 is provided.

[0141] Step S200: forming at least one mark and a plurality of first electrodes arranged in an array on one side of the substrate.

[0142] For example, Figure 5 As shown, at least one mark 12 m and a plurality of first electrodes 121 arranged in an array are formed on one side of the substrate 11 .

[0143] For example, Figure 5 The structure and film layers of the display substrate obtained from step S100 to step S400 are illustrated.

[0144] For example, before step S200, before forming at least one mark and a plurality of first electrodes arranged in an array, a plurality of drive circuits and a plurality of drive signal lines may be formed on one side of the substrate 11. For example, the plurality of drive circuits include a plurality of pixel drive circuits and a plurality of gate drive circuits, etc. For example, the plurality of drive signal lines include a plurality of data signal lines and a plurality of scan signal lines, etc. The plurality of drive circuits may include thin film transistors and / or capacitors. After forming the plurality of drive circuits and the plurality of drive signal lines, at least one mark 12m and a plurality of first electrodes 121 arranged in an array may be formed on a side of the plurality of drive circuits and the plurality of drive signal lines away from the substrate 11.

[0145] For example, Figure 5 As shown, a first conductive layer 12 may be formed on one side of the substrate 11 , and the first conductive layer 12 is patterned to form at least one mark 12 m and a plurality of first electrodes 121 arranged in an array, that is, the mark 12 m and the first electrode 121 are made of the same material and process.

[0146] For example, the first electrode 121 may be one of an anode and a cathode. In the embodiment of the present application, the first electrode 121 is exemplified as an anode.

[0147] For example, the mark 12m may be used for alignment during the manufacturing process of the display panel. For example, the mark 12m may be used for alignment during the manufacturing process of the touch layer of the display panel.

[0148] For example, Figure 3As shown, during the manufacturing process of the display panel, it is usually manufactured on a motherboard 1000 (large panel), and multiple small pieces (that is, multiple display panels) can be manufactured on the motherboard 1000.

[0149] For example, Figure 4 for Figure 3 A small piece on the middle motherboard 1000 or an enlarged schematic diagram of a corresponding area of ​​the display panel, the display panel 100 may include a display area AA and a non-display area BB surrounding the display area AA.

[0150] For example, Figure 4 As shown, a plurality of light emitting devices may be formed in the display area AA, and at least one mark 12m may be formed in the non-display area BB. For example, the mark 12m may be formed in the non-display area BB at the four corners of the display panel, but the mark 12m may also be formed at other locations.

[0151] Step S300, forming a pixel definition layer on a side of at least one of the marks and the plurality of the first electrodes away from the substrate, the pixel definition layer comprising at least one first covering portion, the orthographic projection of the mark on the substrate being within the orthographic projection range of the corresponding first covering portion on the substrate.

[0152] For example, Figure 5 As shown, a pixel definition layer 13 is formed on a side of at least one mark 12m and a plurality of first electrodes 121 away from the substrate 11, and the pixel definition layer 13 includes at least one first covering portion 13g, and the orthographic projection of the mark 12m on the substrate 11 is located within the orthographic projection range of the corresponding first covering portion 13g on the substrate 11.

[0153] For example, Figure 5 As shown, when the pixel definition layer 13 is formed, the first covering portion 13g is formed at the same time. In step S300 and subsequent steps, the first covering portion 13g and other parts of the pixel definition layer 13 in the display area AA can be connected and arranged.

[0154] For example, the first covering portion 13g is formed simultaneously when the pixel definition layer 13 is formed. In step S300 and subsequent steps, the first covering portion 13g and other parts of the pixel definition layer 13 in the display area AA may be spaced apart, for example, the first covering portion 13g may be island-shaped or block-shaped.

[0155] For example, the first covering portion 13g may play a role of protecting the mark 12m.

[0156] For example, the material of the pixel definition layer 13 may include an organic material or an inorganic material, which is not limited here.

[0157] Step S400, forming an isolation layer on a side of the pixel definition layer away from the substrate, the isolation layer comprising a second covering portion, and the orthographic projection of the mark on the substrate is located within the orthographic projection range of the corresponding second covering portion on the substrate.

[0158] For example, Figure 5 As shown, an isolation layer 14 is formed on the side of the pixel definition layer 13 away from the substrate 11, and the isolation layer 14 includes a second covering portion 14g, and the orthographic projection of the mark 12m on the substrate 11 overlaps with the orthographic projection of the corresponding second covering portion 14g on the substrate 11. The orthographic projection of the mark 12m on the substrate 11 is located within the orthographic projection range of the corresponding second covering portion 14g on the substrate 11.

[0159] For example, Figure 5 As shown, when the isolation layer 14 is formed, the second covering portion 14g is formed at the same time. In step S400 and subsequent steps, the second covering portion 14g and other parts of the isolation layer 14 in the display area AA can be connected and arranged.

[0160] For example, the second covering portion 14g is formed simultaneously when the isolation layer 14 is formed. In step S400 and subsequent steps, the second covering portion 14g and other parts of the isolation layer 14 in the display area AA may be spaced apart, for example, the second covering portion 14g may be island-shaped or block-shaped.

[0161] For example, the second covering portion 14g may play a role in protecting the first covering portion 13g.

[0162] For example, in some embodiments, the first covering portion 13g may be in an island shape or a block shape, the second covering portion 14g may be in an island shape or a block shape, the orthographic projection of the first covering portion 13g on the substrate 11 is located within the range of the orthographic projection of the second covering portion 14g on the substrate 11, and the second covering portion 14g may better protect the first covering portion 13g.

[0163] For example, Figure 5 The diagram shows that the isolation layer 14 includes a first sub-isolation layer 141 and a second sub-isolation layer 142 which are sequentially stacked on the pixel definition layer 13 in a direction away from the substrate. The first sub-isolation layer 141 can form a support portion 14f1 in subsequent embodiments, and the second sub-isolation layer 142 can form a crown portion 14f2 in subsequent embodiments.

[0164] For example, the step of forming the first isolation opening 14k1 includes: etching the second sub-isolation layer 142 and the first sub-isolation layer 141 by a dry etching process to form a first opening, and then etching the first sub-isolation layer 141 by a wet etching process to form the first opening into the first isolation opening 14k1. For example, the cross section of the first opening perpendicular to the substrate may be rectangular, and the cross section of the first isolation opening 14k1 perpendicular to the substrate may be T-shaped or I-shaped.

[0165] For example, in some other embodiments, the isolation layer 14 may include a third sub-isolation layer 143, a first sub-isolation layer 141, and a second sub-isolation layer 142, which are sequentially stacked on the pixel definition layer 13 in a direction away from the substrate. The third sub-isolation layer 143 can form a pad portion 14f3 in subsequent embodiments, the first sub-isolation layer 141 can form a support portion 14f1 in subsequent embodiments, and the second sub-isolation layer 142 can form a crown portion 14f2 in subsequent embodiments.

[0166] Step S500 , patterning the isolation layer to form a plurality of first isolation openings, and retaining the second covering portion.

[0167] For example, Figure 6 As shown, the isolation layer 14 is patterned to form a plurality of first isolation openings 14k1, and the second covering portion 14g is retained.

[0168] Step S600 , patterning the pixel definition layer to form a plurality of first pixel openings and retaining the first covering portion, wherein the first pixel openings are connected to the corresponding first isolation openings, and the first pixel openings expose the corresponding first electrodes.

[0169] For example, Figure 6 As shown, the pixel definition layer 13 is patterned to form a plurality of first pixel openings 13k1, and the first covering portion 13g is retained, the first pixel openings 13k1 are connected to the corresponding first isolation openings 14k1, and the first pixel openings 13k1 expose the corresponding first electrodes 121. For example, the orthographic projection of the first pixel opening 13k1 on the substrate 11 overlaps with the orthographic projection of the corresponding first isolation opening 14k1 on the substrate 11.

[0170] For example, Figure 6 As shown, during the manufacturing process of the display panel, the first isolation opening 14k1 may be formed by an etching process (eg, dry etching and wet etching), and then the first pixel opening 13k1 may be formed by an etching process, but the present invention is not limited thereto.

[0171] For example, Figure 6 As shown, in some embodiments, the orthographic projection of the area of ​​the first pixel opening 13k1 on the substrate 11 is located within the range of the orthographic projection of the area of ​​the first isolation opening 14k1 on the substrate 11 .

[0172] Step S700: forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of a first light-emitting device at least in the first isolation opening.

[0173] For example, Figure 7 As shown, the first light emitting function layer 21 , the second electrode 31 and the first encapsulation layer 41 of the first light emitting device 2341 are formed at least in the first isolation opening 14k1 .

[0174] For example, the first light emitting device 2341 includes a corresponding first electrode 121 ( Figure 7 The first sub-electrode 121a in the embodiment of the present invention is a first light-emitting functional layer 21, and a corresponding second electrode 31. The first encapsulation layer 41 may include an inorganic material. For example, the first encapsulation layers 41 corresponding to the plurality of first light-emitting devices 2341 are arranged at intervals. For example, the inorganic material includes one or more of silicon oxide, silicon nitride, and silicon oxynitride.

[0175] Step S800: patterning the isolation layer to form a plurality of second isolation openings, and removing the second covering portion.

[0176] For example, Fig.10 As shown, the isolation layer 14 is patterned to form a plurality of second isolation openings 14k2, and the second covering portion 14g is removed.

[0177] Step S900 , patterning the pixel definition layer to form a plurality of second pixel openings, wherein the second pixel openings are connected to the corresponding second isolation openings, and the second pixel openings expose the corresponding first electrodes.

[0178] For example, Fig.10 As shown, the pixel definition layer 13 is patterned to form a plurality of second pixel openings 13k2, the second pixel openings 13k2 are connected to the corresponding second isolation openings 14k2, and the second pixel openings 13k2 expose the corresponding first electrodes 121. For example, the orthographic projection of the second pixel openings 13k2 on the substrate 11 overlaps with the orthographic projection of the corresponding second isolation openings 14k2 on the substrate 11.

[0179] For example, Fig.10 As shown, during the manufacturing process of the display panel, the second isolation opening 14k2 may be formed by an etching process (eg, dry etching and wet etching), and then the second pixel opening 13k2 may be formed by an etching process, but the present invention is not limited thereto.

[0180] For example, Fig.10 As shown, in some embodiments, the orthographic projection of the area of ​​the second pixel opening 13k2 on the substrate 11 is located within the range of the orthographic projection of the area of ​​the second isolation opening 14k2 on the substrate 11 .

[0181] For example, the inventors have found that after the mark 12m is formed, the first covering portion 13g is easily etched or damaged in the subsequent manufacturing process, which can easily cause the mark 12m to be exposed and damaged. For example, in the related art, the first covering portion 13g is easily etched or damaged when the second pixel opening 13k2 is formed. Therefore, in the embodiment of the present application, a second covering portion 14g is provided on the side of the first covering portion 13g away from the substrate 11. The second covering portion 14g can protect the first covering portion 13g in multiple manufacturing processes such as etching the isolation layer to form the first isolation opening 14k1 and etching the pixel definition layer 13 to form the first pixel opening 13k1, thereby preventing the first covering portion 13g from being etched or damaged, thereby preventing the mark 12m from being damaged when the first covering portion 13g is etched or damaged.

[0182] Step S1000 , forming a second light-emitting functional layer, a second electrode and a second encapsulation layer of a second light-emitting device at least in the second isolation opening.

[0183] For example, Fig.11 or Fig.12 As shown, at least the second light-emitting functional layer 22, the second electrode 31 and the second encapsulation layer 42 of the second light-emitting device 2342 are formed in the second isolation opening 14k2. The second encapsulation layer 42 may include an inorganic material. For example, the second encapsulation layers 42 corresponding to the plurality of second light-emitting devices 2342 are arranged at intervals. For example, the second encapsulation layer 42 corresponding to the second light-emitting device 2342 and the first encapsulation layer 41 corresponding to the first light-emitting device 2341 are arranged at intervals.

[0184] For example, the second light emitting device 2342 includes a corresponding first electrode 121 ( Fig.11 The second sub-electrode 121b in the embodiment of the present invention is a second light-emitting functional layer 22, and a corresponding second electrode 31. For example, the first light-emitting device 2341 and the second light-emitting device 2342 have different light-emitting colors.

[0185] For example, when performing step S800 , step S900 , and step S1000 , a photoresist layer or a photoresist layer may be formed first to protect the first light emitting device 2341 .

[0186] In the embodiment of the present application, in step S300, the pixel definition layer 13 includes at least one first covering portion 13g, that is, the first covering portion 13g is formed when the pixel definition layer 13 is formed; in step S400, the isolation layer 14 includes at least one second covering portion 14g, that is, the second covering portion 14g is formed when the isolation layer 14 is formed; in step S800, the isolation layer 14 is patterned to form a plurality of second isolation openings 14k2, and the second covering portion 14g is removed, that is, when the second isolation openings 14k2 are formed, the second covering portion 14g is removed at the same time; in step S900, the pixel definition layer 13 is patterned to form a plurality of second pixel openings 13k2, the second pixel openings 13k2 are connected to the corresponding second isolation openings 14k2, and the second pixel openings 13k2 expose the corresponding first electrodes 121, that is, when the second pixel openings 13k2 are formed, the first covering portion 13g is retained. The embodiment of the present application has many beneficial effects. 1) In the first aspect, the first covering portion 13g can protect the mark 12m, and the second covering portion 14g can protect the first covering portion 13g before forming the second isolation opening 14k2. The second covering portion 14g can protect the first covering portion 13g in multiple manufacturing processes such as etching the isolation layer to form the first isolation opening 14k1 and etching the pixel definition layer 13 to form the first pixel opening 13k1, so as to prevent the first covering portion 13g from being etched or damaged, thereby preventing the mark 12m from being etched or damaged. 12m is damaged; 2) On the second aspect, when the second isolation opening 14k2 is formed, the second covering portion 14g is removed at the same time to prevent the second covering portion 14g from blocking the mark 12m, thereby preventing the mark 12m from being used for alignment in the subsequent process; 3) On the third aspect, when the second pixel opening 13k2 is formed, the first covering portion 13g is retained at the same time, the pixel definition layer 13 is a light-transmitting material, and the first covering portion 13g is a light-transmitting material. The first covering portion 13g can continue to protect the mark 12m without blocking the mark 12m and causing no adverse effects on the recognition and alignment of the mark.

[0187] In some embodiments, Fig.11 As shown in FIG. 12 , the step of patterning the pixel definition layer 13 to form a plurality of second pixel openings 13 k 2 (step S900 ) includes: retaining the first covering portion 13 g , so that the first covering portion 13 g continues to protect the mark.

[0188] Optionally, in some embodiments, the second light emitting device 2342 is the last light emitting device manufactured.

[0189] For example, the manufacturing method of the display panel 100 includes manufacturing light emitting devices of multiple colors, and the second light emitting device 2342 is a light emitting device of the last color manufactured, which can increase the number of steps in the protection process of the second covering portion 14g.

[0190] Optionally, in some embodiments, the pixel definition layer 13 includes an inorganic insulating material, for example, one or more of silicon oxide, silicon nitride, and silicon oxynitride.

[0191] Optionally, in some embodiments, the isolation layer 14 includes a conductive material. For example, the isolation layer 14 is electrically connected to the second electrode 31 .

[0192] Optionally, in some embodiments, the material of the marker 12m includes metal.

[0193] Optionally, in some embodiments, the mark 12m includes an alignment mark. The alignment mark can be used for alignment during the manufacturing process of the display panel.

[0194] Optionally, in some embodiments, Fig.11 Or as shown in 12, the step of forming the second light-emitting functional layer 22, the second electrode 31 and the second encapsulation layer 42 of the second light-emitting device 2342 at least in the second isolation opening 14k2 (step S1000) includes: step S1001, sequentially forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342; step S1002, patterning the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342, removing the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the first isolation opening 14k1, retaining the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second isolation opening 14k2, and forming the second light-emitting functional layer 22, the second electrode 31 and the second encapsulation layer 42 of the second light-emitting device 2342 in the second isolation opening 14k2.

[0195] For example, in step S1001, a second preset light-emitting functional layer, a preset second electrode, and a preset second encapsulation layer of the second light-emitting device 2342 are formed on the entire surface, and then in step S1002, the second light-emitting functional layer 22, the second electrode 31, and the second encapsulation layer 42 of the second light-emitting device 2342 are patterned. The second preset light-emitting functional layer of the second light-emitting device 2342 is patterned to form the second light-emitting functional layer 22 of the second light-emitting device 2342; the preset second electrode of the second light-emitting device 2342 is patterned to form the second electrode 31 of the second light-emitting device 2342, and the preset second encapsulation layer of the second light-emitting device 2342 is patterned to form the second encapsulation layer 42 of the second light-emitting device 2342.

[0196] Optionally, in some embodiments, Figure 7As shown, the step (step S700) of forming the first light-emitting functional layer 21, the second electrode 31 and the first packaging layer 41 of the first light-emitting device 2341 at least in the first isolation opening 14k1 includes: step S701, sequentially forming the first preset light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first light-emitting device 2341; step S702, patterning the first preset light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first light-emitting device 2341, removing at least part of the first preset light-emitting functional layer, at least part of the preset second electrode and at least part of the preset first packaging layer outside the first isolation opening 14k1, retaining the first preset light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first isolation opening 14k1, and forming the first light-emitting functional layer 21, the second electrode 31 and the first packaging layer 41 of the first light-emitting device 2341 in the first isolation opening 14k1.

[0197] For example, in step S701, a first preset light-emitting functional layer, a preset second electrode, and a preset first encapsulation layer of the first light-emitting device 2341 are formed on the entire surface, and then in step S702, the first light-emitting functional layer 21, the second electrode 31, and the first encapsulation layer 41 of the first light-emitting device 2341 are patterned. The first preset light-emitting functional layer of the first light-emitting device 2341 is patterned to form the first light-emitting functional layer 21 of the first light-emitting device 2341; the preset second electrode of the first light-emitting device 2341 is patterned to form the second electrode 31 of the first light-emitting device 2341; and the preset first encapsulation layer of the first light-emitting device 2341 is patterned to form the first encapsulation layer 41 of the first light-emitting device 2341.

[0198] In some embodiments, Fig.11 As shown, while the steps of sequentially forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 (step S1001), the manufacturing method of the display panel also includes: forming a third covering portion 234g, the third covering portion 234g is at least partially arranged in the same layer as the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342; the step of patterning the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 (step S1002), including: removing the third covering portion 234g to expose the first covering portion 13g.

[0199] For example, in some embodiments, in step S1001, when forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 on the whole surface, a third covering portion (not shown in the figure) is formed at the same time, that is, the third covering portion is composed of the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342. In step S1002, as Fig.11 As shown, the third covering portion is removed to expose the first covering portion 13g, so that the first covering portion 13g continues to protect the mark 12m.

[0200] For example, in some other embodiments, in step S701, when the first preset light-emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light-emitting device 2341 are formed on the whole surface, a partial film layer of the third covering portion (not shown in the figure) is formed at the same time; in step S1001, when the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 are formed on the whole surface, a partial film layer of the third covering portion (not shown in the figure) is formed at the same time, that is, the third covering portion consists of the first preset light-emitting functional layer, the preset second electrode and the preset first encapsulation layer of the first light-emitting device 2341, and the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342; in step S1002, as Fig.11 As shown, the third covering portion is removed to expose the first covering portion 13g, so that the first covering portion 13g continues to protect the mark 12m.

[0201] In some embodiments, Fig.12 As shown, while the steps of sequentially forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 (step S1001), the method for manufacturing the display panel also includes: forming a third covering portion, the third covering portion is at least partially arranged in the same layer and made of the same material as the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342; the step of patterning the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 (step S1002), including: retaining the third covering portion 234g.

[0202] For example, Fig.12 As shown, in some other embodiments, in step S1001, when forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342 on the whole surface, the third covering portion 234g is formed at the same time, and the third covering portion 234g is composed of the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device 2342. In step S1002, as Fig.12 As shown, the third covering portion 234g is retained, so that the third covering portion 234g and the first covering portion 13g protect the mark 12m together. At the same time, the third covering portion 234g also has light-transmitting properties and will not block the mark 12m. The mark 12m can be used for alignment in the subsequent manufacturing process.

[0203] For example, combined with Fig.12As shown, in some other embodiments, in step S701, when forming the first preset light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first light-emitting device 2341 on the whole surface, a partial film layer of the third covering portion 234g is formed at the same time (not shown in the figure); in step S1001, when forming the second preset light-emitting functional layer, the preset second electrode and the preset second packaging layer of the second light-emitting device 2342 on the whole surface, a partial film layer of the third covering portion 234g is formed at the same time, and the third covering portion 234g is composed of the first preset light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first light-emitting device 2341, and the second preset light-emitting functional layer, the preset second electrode and the preset second packaging layer of the second light-emitting device 2342; in step S1002, combined with Fig.12 As shown, the third covering portion 234g is retained, so that the third covering portion 234g and the first covering portion 13g protect the mark 12m together. At the same time, the third covering portion 234g also has light-transmitting properties and will not block the mark 12m. The mark 12m can be used for alignment in the subsequent manufacturing process.

[0204] In some embodiments, Figure 2 As shown, at least after the step (step S700) of forming the first light-emitting functional layer 21, the second electrode 31 and the first encapsulation layer 41 of the first light-emitting device 2341 in the first isolation opening 14k1, before the step (step S800) of patterning the isolation layer 14 to form a plurality of second isolation openings 14k2 and removing the second covering portion 14g, it also includes: step S1100, step S1200, and step S1300.

[0205] Step S1100 , patterning the isolation layer to form a plurality of third isolation openings, and retaining the second covering portion.

[0206] For example, Figure 8 As shown, the isolation layer 14 is patterned to form a plurality of third isolation openings 14k3, and the second covering portion 14g is retained.

[0207] Step S1200 , patterning the pixel definition layer to form a plurality of third pixel openings and retaining the first covering portion, wherein the third pixel openings are connected to the corresponding third isolation openings, and the third pixel openings expose the corresponding first electrodes.

[0208] For example, Figure 8As shown, the pixel definition layer 13 is patterned to form a plurality of third pixel openings 13k3, and the first covering portion 13g is retained, the third pixel openings 13k3 are connected to the corresponding third isolation openings 14k3, and the third pixel openings 13k3 expose the corresponding first electrodes 121. For example, the orthographic projection of the third pixel opening 13k3 on the substrate 11 overlaps with the orthographic projection of the corresponding third isolation opening 14k3 on the substrate 11.

[0209] For example, Figure 8 As shown, during the manufacturing process of the display panel, the third isolation opening 14k3 can be formed by an etching process (eg, dry etching and wet etching), and then the third pixel opening 13k3 can be formed by an etching process, but is not limited thereto.

[0210] For example, Figure 8 As shown, in some embodiments, the orthographic projection of the area of ​​the third pixel opening 13k3 on the substrate 11 is located within the range of the orthographic projection of the area of ​​the third isolation opening 14k3 on the substrate 11 .

[0211] Step S1300 , forming a third light-emitting functional layer, a second electrode and a third encapsulation layer of a third light-emitting device at least in the third isolation opening.

[0212] For example, Fig. 9 As shown, at least the third light-emitting functional layer 23, the second electrode 31 and the third encapsulation layer 43 of the third light-emitting device 2343 are formed in the third isolation opening 14k3. The third encapsulation layer 43 may include an inorganic material. For example, the third encapsulation layers 43 corresponding to the plurality of third light-emitting devices 2343 are arranged at intervals. For example, the second encapsulation layer 42 corresponding to the second light-emitting device 2342 and the third encapsulation layer 43 corresponding to the third light-emitting device 2343 are arranged at intervals. For example, the third encapsulation layer 43 corresponding to the third light-emitting device 2343 and the first encapsulation layer 41 corresponding to the first light-emitting device 2341 are arranged at intervals.

[0213] For example, in some embodiments, Figure 2As shown, the manufacturing method of the display panel includes: step S100, step S200, step S300, step S400, step S500, step S600, step S700, step S1100, step S1200, step S1300, step S800, step S900, step S1000. That is, the manufacturing method of the display panel includes: forming a plurality of first light-emitting devices 2341, forming a plurality of third light-emitting devices 2343, and forming a plurality of second light-emitting devices 2342. In the manufacturing method of the display panel, it is necessary to sequentially manufacture a plurality of first light-emitting devices 2341, a plurality of third light-emitting devices 2343, and a plurality of second light-emitting devices 2342. In the manufacturing process of the first light-emitting device 2341, the first covering portion 13g and the second protecting portion 14g are formed. In the multiple manufacturing processes of the third light-emitting device 2343, the second covering portion 14g can also protect the first covering portion 13g.

[0214] By way of example, the first light-emitting functional layer 21 of the first light-emitting device 2341, the second light-emitting functional layer 22 of the second light-emitting device 2342, and the third light-emitting functional layer 23 of the third light-emitting device 2343 are light-emitting functional layers that emit light of different colors. The light-emitting functional layers may include a light-emitting layer (Emission layer, EML). The light-emitting functional layers may also include other film layers other than the light-emitting layer (Emission layer, EML), for example, may also include one or more of a hole injection layer (Hole Injection Layer, HIL), a hole transport layer (Hole Transport Layer, HTL), an electron injection layer (Electron Injection Layer, EIL), an electron transport layer (Electron Transport Layer, ETL), a hole blocking layer (Hole Block Layer, HBL) and an electron blocking layer (Electron Block Layer, EBL).

[0215] In some embodiments, Fig. 9As shown, the step (step S1300) of forming the third light-emitting functional layer 23, the second electrode 31 and the third encapsulation layer 43 of the third light-emitting device 2343 at least in the third isolation opening 14k3 includes: step S1301, sequentially forming the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device 2343; step S1302, patterning the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device 2343, removing the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device 2343 of the first isolation opening 14k1, retaining the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device 2343 of the third isolation opening 14k3, and forming the third light-emitting functional layer 23, the second electrode 31 and the third encapsulation layer 43 of the third light-emitting device 2343 in the third isolation opening.

[0216] For example, in step S1301, a third preset light-emitting functional layer, a preset second electrode, and a preset third encapsulation layer of the third light-emitting device 2343 are formed on the entire surface, and then in step S1302, the third light-emitting functional layer 23, the second electrode 31, and the third encapsulation layer 43 of the third light-emitting device 2343 are patterned. The third preset light-emitting functional layer of the third light-emitting device 2343 is patterned to form the third light-emitting functional layer 23 of the third light-emitting device 2343; the preset second electrode of the third light-emitting device 2343 is patterned to form the second electrode 31 of the third light-emitting device 2343, and the preset third encapsulation layer of the third light-emitting device 2343 is patterned to form the third encapsulation layer 43 of the third light-emitting device 2343.

[0217] For example, the third light emitting device 2343 includes a corresponding first electrode 121 ( Fig. 9 a third sub-electrode 121c in the middle), a third light-emitting functional layer 23 and a corresponding second electrode 31.

[0218] In some embodiments, in combination Figures 10 to 12 As shown, after the step (step S800) of patterning the isolation layer 14 to form a plurality of second isolation openings 14k2 and removing the second covering portion 14g, the isolation layer 14 includes an isolation structure 14f, which is arranged around the first isolation opening 14k1 and the second isolation opening 14k2, for example, the isolation structure 14f is arranged around the first isolation opening 14k1, the second isolation opening 14k2 and the third isolation opening 14k3. The isolation structure 14f is electrically connected to the second electrode 31.

[0219] For example, Fig.11As shown, after the isolation layer 14 is patterned, or after the first isolation opening 14k1, the third isolation opening 14k3 and the second isolation opening 14k2 are patterned, the isolation layer 14 includes an isolation structure 14f. The formation process of the first isolation opening 14k1, the third isolation opening 14k3 and the second isolation opening 14k2 is the same or similar, and will not be repeated here.

[0220] For example, after the isolation layer 14 is patterned, in a top view, the isolation layer 14 includes a plurality of first isolation openings 14k1 and a plurality of second isolation openings 14k2. For example, the isolation layer 14 includes a plurality of first isolation openings 14k1, a plurality of third isolation openings 14k3 and a plurality of second isolation openings 14k2, and an isolation structure 14f surrounding the plurality of first isolation openings 14k1, the plurality of third isolation openings 14k3 and the plurality of second isolation openings 14k2.

[0221] For example, combined with Figures 10 to 12 As shown, the pixel definition layer 13 includes a pixel definition structure 131, and the pixel definition structure 131 encloses a plurality of pixel openings, the plurality of pixel openings including a first pixel opening 13k1 and a second pixel opening 13k2, for example, the plurality of pixel openings include a first pixel opening 13k1, a second pixel opening 13k2 and a third pixel opening 13k3.

[0222] Optionally, in some embodiments, the isolation structure 14f is in a grid shape.

[0223] Optionally, the isolation structure 14f includes a conductive material, the second electrode 31 of the first light-emitting device 2341 is electrically connected to the isolation structure 14f, the second electrode 31 of the second light-emitting device 2342 is electrically connected to the isolation structure 14f; the second electrode 31 of the third light-emitting device 2343 is electrically connected to the isolation structure 14f.

[0224] In some embodiments, Fig.11 and Fig.12 As shown, at least after the step of forming the second light emitting functional layer 22, the second electrode 31 and the second encapsulation layer 42 of the second light emitting device 2342 in the second isolation opening 14k2 (step S1000), the first encapsulation layer 41, the second encapsulation layer 42 and the third encapsulation layer 43 are arranged at intervals.

[0225] Optionally, in some embodiments, the first encapsulation layer 41 includes an inorganic material; the second encapsulation layer 42 includes an inorganic material; and the third encapsulation layer 43 includes an inorganic material.

[0226] In some embodiments, Fig.11As shown, the isolation structure 14f includes a support portion 14f1 and a crown portion 14f2 which are stacked in sequence on the substrate 11 in a direction away from the substrate 11, and the orthographic projection of the side of the support portion 14f1 away from the substrate 11 on the substrate 11 is within the range of the orthographic projection of the crown portion 14f2 on the substrate 11.

[0227] For example, the orthographic projection area of ​​the side of the support portion 14f1 away from the base 11 on the base 11 is smaller than the orthographic projection area of ​​the crown portion 14f2 on the base 11. Fig.11 As shown, the support portion 14f1 includes a conductive material, and the second electrode 31 of the first light-emitting device 2341 overlaps the side wall of the support portion 14f1 surrounding the first isolation opening 14k1; the second electrode 31 of the second light-emitting device 2342 overlaps the side wall of the support portion 14f1 surrounding the second isolation opening 14k2; and the second electrode 31 of the third light-emitting device 2343 overlaps the side wall of the support portion 14f1 surrounding the third isolation opening 14k3.

[0228] For example, Fig.11 As shown, the isolation structure 14f includes a support portion 14f1 and a crown portion 14f2 which are sequentially stacked on the substrate 11 in a direction away from the substrate 11, and the orthographic projection of the side of the support portion 14f1 away from the substrate 11 on the substrate 11 is located within the range of the orthographic projection of the crown portion 14f2 on the substrate 11. In this way, between two adjacent light-emitting devices, around the isolation openings (the isolation openings include the first isolation opening 14k1, the second isolation opening 14k2, and the third isolation opening 14k3), at least the portion of the isolation structure 14f away from the substrate 11 is set to a shape that is wide at the top and narrow at the bottom, so that the isolation structure 14f can block other film layers such as the light-emitting layer EML or the hole transport layer HTL of the adjacent light-emitting device, which can save expensive fine metal mask plates (FMM), thereby reducing the manufacturing cost of the display panel. At the same time, without using the fine metal mask (FMM), the light-emitting area of ​​the sub-pixel is not limited by the opening of the fine metal mask. The light-emitting area of ​​the sub-pixel can be made smaller, and more sub-pixels can be formed in the display panel, thereby improving the resolution of the display panel.

[0229] Optionally, in some embodiments, Fig.11 As shown, the material of the support portion 14f1 includes aluminum, and / or the material of the crown portion 14f2 includes titanium.

[0230] In some embodiments, Fig.13As shown, the isolation structure 14f includes a support portion 14f1 and a crown portion 14f2 which are sequentially stacked on the substrate 11 along a direction Z away from the substrate 11, and a pad portion 14f3 located between the support portion 14f1 and the substrate 11, the orthographic projection of the side of the support portion 14f1 away from the substrate 11 on the substrate 11 is located within the range of the orthographic projection of the crown portion 14f2 on the substrate 11, and the orthographic projection of the support portion 14f1 on the substrate 11 is located within the range of the orthographic projection of the pad portion 14f3 on the substrate 11.

[0231] It should be noted that Fig.12 The difference is that Fig.13 The middle isolation layer 14 includes a first sub-isolation layer 141, a second sub-isolation layer 142 and a third sub-isolation layer 143 which are sequentially stacked in a direction away from the substrate 11, and the isolation structure 14f includes a pad portion 14f3, a support portion 14f1 and a crown portion 14f2 which are sequentially stacked in a direction away from the substrate 11.

[0232] For example, the orthographic projection area of ​​the support portion 14f1 on the substrate 11 is smaller than the orthographic projection area of ​​the pad portion 14f3 on the substrate 11 .

[0233] Optionally, in some embodiments, in combination Fig.11 As shown, the pad 14f3 includes a conductive material, the second electrode 31 of the first light-emitting device 2341 overlaps the pad 14f3 surrounding the first isolation opening 14k1; the second electrode 31 of the second light-emitting device 2342 overlaps the pad 14f3 surrounding the second isolation opening 14k2; the second electrode 31 of the third light-emitting device 2343 overlaps the pad 14f3 surrounding the third isolation opening 14k3.

[0234] Optionally, in some embodiments, in combination Fig.11 As shown, the pad portion 14f3 and the support portion 14f1 both include conductive materials, and the second electrode 31 of the first light-emitting device 2341 overlaps the pad portion 14f3 and the support portion 14f1 surrounding the first isolation opening 14k1; the second electrode 31 of the second light-emitting device 2342 overlaps the pad portion 14f3 and the support portion 14f1 surrounding the second isolation opening 14k2; and the second electrode 31 of the third light-emitting device 2343 overlaps the pad portion 14f3 and the support portion 14f1 surrounding the third isolation opening 14k3.

[0235] Optionally, in some embodiments, in combination Fig.11 As shown, the material of the support portion 14f1 includes aluminum, and / or the material of the crown portion 14f2 includes titanium, and / or the material of the pad portion 14f3 includes molybdenum.

[0236] In some embodiments, in combination Fig.11 and Fig.12As shown, the first light emitting device 2341, the second light emitting device 2342 and the third light emitting device 2343 emit different colors;

[0237] Optionally, in some embodiments, the first light-emitting device 2341 is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device, the second light-emitting device 2342 is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from the first light-emitting device 2341, and the third light-emitting device 2343 is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from both the first light-emitting device 2341 and the second light-emitting device 2342.

[0238] For example, in some embodiments, the first light emitting device 2341 is a red light emitting device, the second light emitting device 2342 is a green light emitting device, and the third light emitting device 2343 is a blue light emitting device. In some embodiments, the first light emitting device 2341 is a green light emitting device, the second light emitting device 2342 is a red light emitting device, and the third light emitting device 2343 is a blue light emitting device. In some embodiments, the first light emitting device 2341 is a blue light emitting device, the second light emitting device 2342 is a green light emitting device, and the third light emitting device 2343 is a red light emitting device, but is not limited thereto.

[0239] In some embodiments, Figure 3 and Figure 4 As shown, the substrate 11 includes a preset display area AA1 and a preset non-display area BB1, the first light emitting device 2341, the second light emitting device 2342 and the third light emitting device 2343 are formed in the preset display area AA1, and the mark 12m is formed in the preset non-display area BB1.

[0240] For example, combined with Figure 3 and Figure 4 As shown, after the display panel is manufactured, the preset display area AA1 is the display area AA of the display panel, the preset non-display area BB1 is the non-display area BB of the display panel, and the mark 12m is located in the preset non-display area BB1 or the non-display area BB.

[0241] In some embodiments, the first isolation opening 14k1 may be formed after the third isolation opening 14k3 is formed. The first pixel opening 13k1 may be formed after the third pixel opening 13k3 is formed. For example, the light-emitting function layer of the first light-emitting device 2341 is formed after the light-emitting function layer of the third light-emitting device 2343 is formed.

[0242] In some embodiments, the first isolation opening 14k1 and the third isolation opening 14k3 are formed simultaneously. The first pixel opening 13k1 and the third pixel opening 13k3 are formed simultaneously. For example, the light-emitting functional layer of the first light-emitting device 2341 is formed before the light-emitting functional layer of the third light-emitting device 2343 is formed. Alternatively, the light-emitting functional layer of the first light-emitting device 2341 is formed after the light-emitting functional layer of the third light-emitting device 2343 is formed.

[0243] Fig.11 , Fig.12 , Fig.13 It can be the final state of the display panel.

[0244] It should be noted that in the second method for manufacturing a display panel, in some implementations, for example, in the implementation where the second covering portion 14g and at least a portion of the film layer of the isolation layer 14 are provided in the same layer and the same material, Figures 5 to 13 The example may also be a schematic diagram of an intermediate process of the manufacturing method of the second display panel.

[0245] Second, see Figures 14 to 23 ,or Figures 5 to 13 Based on the same inventive concept, the present application provides a second method for manufacturing a display panel, such as Fig.14 As shown, the second method for manufacturing a display panel includes: step T100, step T200, step T300, step T400, step T500, step T600, step T700, and step T800.

[0246] Step T100 , providing a substrate 11 .

[0247] Step T200 , forming at least one mark 12 m on one side of the substrate 11 .

[0248] Step T300 , forming at least a partial film layer of the protective layer B10 on a side of at least one mark 12 m away from the substrate 11 , wherein the orthographic projection of the mark 12 m on the substrate 11 overlaps with the orthographic projection of the protective layer B10 on the substrate 11 .

[0249] Step T400 , forming an isolation layer 14 on one side of the substrate 11 .

[0250] Step T500 , patterning the isolation layer 14 to form a first isolation opening 14k1 .

[0251] Step T600 , forming the first light emitting function layer 21 , the second electrode 31 and the first encapsulation layer 41 of the first light emitting device 2341 in the first isolation opening 14 k 1 .

[0252] Step T700 , patterning the isolation layer 14 to form a second isolation opening 14k2 .

[0253] Step T800 , forming the second light emitting function layer 22 , the second electrode 31 and the second encapsulation layer 42 of the second light emitting device 2342 in the second isolation opening 14k2 .

[0254] Step T300 may be performed before, after or simultaneously with step T400. The protective layer B10 may protect the mark 12m, and may protect the mark from being etched or damaged in the manufacturing process such as the wet etching process of etching the isolation layer 14 with a wet etching solution to form the first isolation opening 14k1, and the wet etching process of etching the electrode material layer with a wet etching solution to form the second electrode of the light-emitting device.

[0255] This embodiment can be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0256] By way of example, in some embodiments, after step T600 and before step T700, the second method for manufacturing a display panel further includes: patterning the isolation layer 14 to form a third isolation opening 14k3; and forming a third light-emitting functional layer 23, a second electrode 31 and a third encapsulation layer 43 of a third light-emitting device 2343 in the third isolation opening 14k3.

[0257] In some embodiments, the protective layer B10 includes a first covering portion 13 g and a second covering portion 14 g sequentially stacked in a direction away from the substrate 11 .

[0258] In some embodiments, before the step of forming the isolation layer 14 on one side of the substrate 11 (step T400), the method for manufacturing the display panel further includes: forming a pixel definition layer 13, the pixel definition layer 13 includes a first covering portion 13g, and the orthographic projection of the mark 12m on the substrate 11 overlaps with the orthographic projection of the first covering portion 13g on the substrate 11.

[0259] In some embodiments, at the same time or after the step of patterning the isolation layer 14 to form the second isolation opening 14k2 (step T700), the method for manufacturing the display panel further includes: removing the second covering portion 14g. This arrangement can prevent the second covering portion 14g from blocking the mark 12m and affecting the accuracy of recognition and alignment of the mark 12m.

[0260] In some embodiments, Fig.15 , the materials of the second covering portion 14g and the isolation layer 14 are at least partially different or arranged in different layers, for example, the second covering portion 14g includes a light-transmitting layer. For example, before or after forming the isolation layer 14, the light-transmitting layer of the second covering portion 14g is formed, and the orthographic projection of the isolation layer 14 on the substrate 11 does not overlap with the orthographic projection of the second covering portion 14g on the substrate 11. The orthographic projection of the isolation layer 14 on the substrate 11 does not overlap with the orthographic projection of the light-transmitting layer in the second covering portion 14g on the substrate 11.

[0261] Multiple structures arranged in the same layer can be obtained by patterning the same film layer to simplify the process. Multiple structures arranged in different layers can be formed by different film layers.

[0262] In some embodiments, Fig.15 , the material of the light-transmitting layer includes semiconductor metal oxide.

[0263] like Fig.15 The semiconductor metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide and indium gallium zinc oxide.

[0264] and Figures 5 to 13 The example is different. Fig.15 and Fig.16 In the example shown, after forming the pixel definition layer 13, a second covering portion 14g is formed on the side of the first covering portion 13g away from the substrate 11, the second covering portion 14g includes a light-transmitting layer, and then an isolation layer 14 is formed on the side of the second covering portion 14g away from the substrate 11.

[0265] For example, in some embodiments, Figures 15 to 18 In the example shown, when forming the first isolation opening 14k1, the film layer of the isolation layer 14 on the surface of the second covering portion 14g can be removed. At this time, the mark 12m can be used for subsequent manufacturing processes. For example, the mark 12m can be used for the alignment process during the subsequent formation of the second isolation opening 14k2 or the third isolation opening 14k3.

[0266] In other embodiments, a second covering portion 14g is formed on a side of the first covering portion 13g away from the substrate 11, and an isolation layer 14 is formed on one side of the substrate 11. The orthographic projection of the isolation layer 14 on the substrate 11 does not overlap with the orthographic projection of the second covering portion 14g on the substrate 11. When the first isolation opening 14k1 is formed, the second covering portion 14g can protect the first covering portion 13g and the mark 12m from being damaged by etching.

[0267] For example, at or after the step (step T700) of patterning the isolation layer 14 to form the second isolation opening 14k2, the method for manufacturing the display panel further includes: removing the second covering portion 14g. Before removing the second covering portion 14g, the second covering portion 14g can protect the first covering portion 13g, thereby protecting the mark 12m.

[0268] In some embodiments, Fig.15As shown, the corrosion resistance of the material of at least part of the film layer of the second covering portion 14g is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer 14. For example, the corrosion resistance of the material of the light-transmitting layer in the second covering portion 14g is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer 14 (for example, aluminum). The light-transmitting layer in the second covering portion 14g can play a role in protecting the mark 12m, and can protect the mark from being etched or damaged in manufacturing processes such as a wet etching process of etching the isolation layer 14 with a wet etching solution to form a first isolation opening 14k1, and a wet etching process of etching the electrode material layer with a wet etching solution to form a second electrode of the light-emitting device. For the wet etching solution, the corrosion resistance of the material of at least part of the film layer of the second covering portion 14g is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer 14.

[0269] Optionally, in some embodiments, Fig.15 As shown, the material of the second covering portion 14g includes titanium. For example, the corrosion resistance of titanium is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer 14 (for example, aluminum). The titanium layer in the second covering portion 14g can play a role in protecting the mark 12m, and can protect the mark from being etched or damaged in the manufacturing process such as the wet etching process of etching the isolation layer 14 with a wet etching solution to form the first isolation opening 14k1, and the wet etching process of etching the electrode material layer with a wet etching solution to form the second electrode of the light-emitting device.

[0270] For example, in some embodiments, Figures 15 to 23 As shown, the corrosion resistance of the material of at least part of the film layer of the second covering portion 14g is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer 14, so that when the isolation layer 14 is etched, the second covering portion 14g will not be etched away, ensuring that the second covering portion 14g can protect the first covering portion 13g.

[0271] For example, in some embodiments, Fig.16 As shown, the manufacturing method of the display panel further includes forming an isolation layer 14 on a side of the second covering portion 14 g away from the substrate 11 , and the second covering portion 14 g is a film layer different from the isolation layer 14 .

[0272] For example, in some embodiments, at the same time or after the step of patterning the isolation layer 14 to form the second isolation opening 14k2 (step T700), the method for manufacturing the display panel further includes: removing the second covering portion 14g (for example, including a light-transmitting layer or a titanium layer). Before removing the second covering portion 14g, the second covering portion 14g can protect the first covering portion 13g, thereby protecting the mark 12m.

[0273] In some embodiments, the final state of the display substrate or the display panel: the light-transmitting layer in the second covering portion 14g may remain.

[0274] In some embodiments, Figures 5 to 13 , the isolation layer 14 includes a second covering portion 14g, and the orthographic projection of the mark 12m on the substrate 11 overlaps with the orthographic projection of the second covering portion 14g on the substrate 11; while patterning the isolation layer 14 to form the first isolation opening 14k1 (step T500), the method for manufacturing the display panel also includes: retaining the second covering portion 14g; while patterning the isolation layer 14 to form the second isolation opening 14k2 (step T700), the method for manufacturing the display panel also includes: removing the second covering portion 14g.

[0275] In some embodiments, Figures 5 to 13 As shown, the second covering portion 14g is provided with the same layer and the same material as a part of the film layer of the isolation layer 14, that is, the second covering portion 14g is manufactured at the same time when the isolation layer 14 is manufactured. For example, the second sub-isolating layer 142 includes the second covering portion 14g. For example, the second covering portion 14g does not include the first sub-isolating layer 141. For example, the orthographic projection of the first sub-isolating layer 141 on the substrate 11 does not overlap with the orthographic projection of the second covering portion 14g on the substrate 11. For example, the second covering portion 14g does not include the third sub-isolating layer 143. For example, the orthographic projection of the third sub-isolating layer 143 on the substrate 11 does not overlap with the orthographic projection of the second covering portion 14g on the substrate 11.

[0276] In some embodiments, Figures 5 to 13 As shown, the second covering portion 14g is provided in the same layer and material as the isolation layer 14, that is, the second covering portion 14g is manufactured simultaneously when the isolation layer 14 is manufactured. At this time, the process of manufacturing the second display panel is the same or similar to the process of manufacturing the first display panel.

[0277] In some embodiments, the number of film layers of the second covering portion 14g is less than or equal to the number of film layers of the isolation layer 14. The second covering portion 14g includes only the second sub-isolating layer 142, such as a titanium layer. Alternatively, the second covering portion 14g includes the first sub-isolating layer 141 and the second sub-isolating layer 142, or the second covering portion 14g includes the first sub-isolating layer 141, the second sub-isolating layer 142 and the third sub-isolating layer 143.

[0278] In some embodiments, the second covering portion 14 g is a single metal film layer (eg, a titanium layer) or a multi-layer film layer stacked along the thickness direction (parallel to the direction Z) of the substrate 11 .

[0279] In some embodiments, an overlapping area of ​​an orthographic projection of the first covering portion 13 g on the substrate 11 and an orthographic projection of the second covering portion 14 g on the substrate 11 overlaps with an orthographic projection of the mark 12 m on the substrate 11 .

[0280] Optionally, in some embodiments, the orthographic projection of the mark 12m on the substrate 11 is located within the orthographic projection of the first covering portion 13g on the substrate 11 , and the orthographic projection of the mark 12m on the substrate 11 is located within the orthographic projection of the second covering portion 14g on the substrate 11 .

[0281] Optionally, in some embodiments, the first light-emitting device 2341 further includes a first electrode 121 located between the substrate 11 and the first light-emitting functional layer 21 , and the marker 12m is disposed in the same layer as the first electrode 121 of the first light-emitting device 2341 .

[0282] For example, the second method for manufacturing a display panel has the same or similar beneficial effects as the first method for manufacturing a display panel, and will not be described in detail herein. Fig.11 , Fig.12 , Fig.13 , Fig.23 It can be an intermediate state or a final state of a display panel or a display substrate.

[0283] In the third aspect, based on the same inventive concept, the present application provides a display substrate 110, which can be obtained by any of the above-mentioned display panel manufacturing methods (the first display panel manufacturing method and / or the second display panel manufacturing method). The display substrate 110 includes a base 11, at least one mark 12m and a plurality of first electrodes 121 arranged in an array, a pixel definition layer 13, an isolation layer 14, a first light-emitting device 2341, a first encapsulation layer 41, a second light-emitting device 2342, and a second encapsulation layer 42. At least one mark 12m and a plurality of first electrodes 121 arranged in an array are located on one side of the substrate 11, and the mark 12m and the first electrode 121 are in the same layer and made of the same material; the pixel definition layer 13 is located on a side of the at least one mark 12m and the plurality of first electrodes 121 away from the substrate 11, the pixel definition layer 13 includes at least one first covering portion 13g, and a plurality of first pixel openings 13k1 and a plurality of second pixel openings, and the orthographic projection of the mark 12m on the substrate 11 is located within the orthographic projection range of the corresponding first covering portion 13g on the substrate 11; the isolation layer 14 is located on a side of the pixel definition layer 13 away from the substrate 11, and the isolation layer 14 includes a plurality of A first isolation opening 14k1 and multiple second isolation openings 14k2, the first pixel opening 13k1 is connected with the corresponding first isolation opening 14k1, the first pixel opening 13k1 exposes the corresponding first electrode 121, the second pixel opening is connected with the corresponding second isolation opening 14k2, the second pixel opening exposes the corresponding first electrode 121; the first light-emitting functional layer 21, the second electrode 31 and the first encapsulation layer 41 of the first light-emitting device 2341 are at least located in the first isolation opening 14k1; the second light-emitting functional layer 22, the second electrode 31 and the second encapsulation layer 42 of the second light-emitting device are at least located in the second isolation opening 14k2.

[0284] For example, the display substrate 110 may be an intermediate state or a final state obtained during the manufacturing method of the first display panel or the manufacturing method of the second display panel. This embodiment may be combined with some or all of the features of the above embodiments, which will not be described in detail here. The display substrate may be a display panel.

[0285] For example, in the first light-emitting device 2341, the second light-emitting device 2342 and the third light-emitting device 2343, one of the first electrode 121 and the second electrode 31 is an anode, and the other of the first electrode 121 and the second electrode 31 is a cathode. The embodiment of the present application is illustrated by taking the first electrode 121 as the anode and the second electrode 31 as the cathode.

[0286] For example, the display substrate 110 of the embodiment of the present application can be obtained by any of the above-mentioned display panel manufacturing methods. The display substrate 110 of the embodiment of the present application can have multiple implementations. The display substrate 110 of the embodiment of the present application can have a structure and a film layer obtained by any of the above-mentioned display panel manufacturing methods. For example, the display substrate 110 can also include a third light-emitting device 2343 and a third encapsulation layer 43. The display substrate 110 of the embodiment of the present application has the same beneficial effects of the above-mentioned display panel manufacturing method, which will not be repeated here.

[0287] In some embodiments, the display substrate 110 further includes a second covering portion 14g, which is located on a side of the first covering portion 13g away from the substrate 11, and the orthographic projection of the mark 12m on the substrate 11 is located within the corresponding orthographic projection range of the second covering portion 14g on the substrate 11.

[0288] In some embodiments, the second covering portion 14g is provided in the same layer and with the same material as the isolation layer 14 .

[0289] In some embodiments, Figures 15 to 23 As shown, the material of the second covering portion 14g includes a light-transmitting layer.

[0290] In some embodiments, the material of the light-transmitting layer includes a semiconductor metal oxide.

[0291] In some embodiments, the semiconducting metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide, and indium gallium zinc oxide.

[0292] In some embodiments, the corrosion resistance of the material of at least a portion of the film layer of the second covering portion 14 g is greater than the corrosion resistance of the material of at least a portion of the film layer of the isolation layer 14 .

[0293] In some embodiments, the material of the second covering portion 14g includes titanium.

[0294] In some embodiments, the side of the mark 12m away from the substrate 11 does not have a material that is arranged in the same layer and the same material as the light-emitting functional layer of the light-emitting device (for example, including the first light-emitting device 2341, the second light-emitting device 2342 and the third light-emitting device 2343) and the second electrode 31.

[0295] See also Fig.24 , Fig.24 A schematic diagram of a display device provided in an embodiment of the present application.

[0296] Fourth, please refer to Fig.24 Based on the same inventive concept, the present application also provides a display device 200, the display device 200 includes a display panel manufactured by the first display panel manufacturing method described in any one of the above, or the display device 200 includes a display panel manufactured by the second display panel manufacturing method described in any one of the above, or the display device 200 includes the display substrate described in any one of the above.

[0297] For example, the display device 200 may be a mobile phone, a laptop computer, a television, a tablet computer, a wearable device, a vehicle-mounted display device, etc., but is not limited thereto.

[0298] The technical features of the above-described embodiments may be arbitrarily combined or sub-combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0299] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A method for manufacturing a display panel, characterized in that: include: providing a substrate; forming at least one mark and a plurality of first electrodes arranged in an array on one side of the substrate; A pixel definition layer is formed on a side of at least one of the marks and the plurality of the first electrodes away from the substrate, wherein the pixel definition layer includes at least one first covering portion, and an orthographic projection of the mark on the substrate is within an orthographic projection range of the corresponding first covering portion on the substrate; An isolation layer is formed on a side of the pixel definition layer away from the substrate, the isolation layer includes a second covering portion, and the orthographic projection of the mark on the substrate is located within the orthographic projection range of the corresponding second covering portion on the substrate; Patterning the isolation layer to form a plurality of first isolation openings and retaining the second covering portion; Patterning the pixel definition layer to form a plurality of first pixel openings and retaining the first covering portion, wherein the first pixel openings are connected to the corresponding first isolation openings, and the first pixel openings expose the corresponding first electrodes; forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of a first light-emitting device at least in the first isolation opening; Patterning the isolation layer to form a plurality of second isolation openings, and removing the second covering portion; Patterning the pixel definition layer to form a plurality of second pixel openings, wherein the second pixel openings are connected to the corresponding second isolation openings, and the second pixel openings expose the corresponding first electrodes; A second light-emitting functional layer, a second electrode and a second encapsulation layer of a second light-emitting device are formed at least in the second isolation opening.

2. The method for manufacturing a display panel according to claim 1, wherein: The step of patterning the pixel definition layer to form a plurality of second pixel openings includes: retaining the first covering portion; The step of forming a second light-emitting functional layer, a second electrode and a second encapsulation layer of a second light-emitting device at least in the second isolation opening comprises: sequentially forming a second preset light-emitting functional layer, a preset second electrode and a preset second encapsulation layer of the second light-emitting device; patterning the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device, removing the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the first isolation opening, retaining the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second isolation opening, and forming the second light-emitting functional layer, the second electrode and the second encapsulation layer of the second light-emitting device in the second isolation opening; The step of forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of the first light-emitting device at least in the first isolation opening comprises: sequentially forming a first preset light-emitting functional layer, a preset second electrode and a preset first encapsulation layer of the first light-emitting device; The first preset light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first light-emitting device are patterned, at least part of the first preset light-emitting functional layer, at least part of the preset second electrode and at least part of the preset first packaging layer outside the first isolation opening are removed, the first preset light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first isolation opening are retained, and the first light-emitting functional layer, the preset second electrode and the preset first packaging layer of the first light-emitting device are formed in the first isolation opening.

3. The method for manufacturing a display panel according to claim 2, wherein: The second light emitting device is the last light emitting device manufactured; and / or, the pixel definition layer comprises an inorganic insulating material; and / or, the isolation layer comprises a conductive material; and / or, the material of the marker comprises metal; and / or, the marking comprises an alignment mark; And / or, while sequentially forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device, the manufacturing method further comprises: forming a third covering portion, wherein at least a part of the third covering portion is disposed in the same layer and made of the same material as the second preset light-emitting function layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device; The step of patterning the second preset light-emitting function layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device includes: removing the third covering portion to expose the first covering portion.

4. The method for manufacturing a display panel according to claim 2, wherein: While sequentially forming the second preset light-emitting functional layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device, the manufacturing method further includes: forming a third covering portion, wherein at least a part of the third covering portion is disposed in the same layer and made of the same material as the second preset light-emitting function layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device; The step of patterning the second preset light-emitting function layer, the preset second electrode and the preset second encapsulation layer of the second light-emitting device includes: retaining the third covering portion.

5. The method for manufacturing a display panel according to claim 1, wherein: After the step of forming the first light-emitting functional layer, the second electrode and the first encapsulation layer of the first light-emitting device at least in the first isolation opening, and before the step of patterning the isolation layer to form a plurality of second isolation openings and removing the second covering portion, the method further includes: Patterning the isolation layer to form a plurality of third isolation openings and retaining the second covering portion; Patterning the pixel definition layer to form a plurality of third pixel openings, and retaining the first covering portion, wherein the third pixel openings are connected to the corresponding third isolation openings, and the third pixel openings expose the corresponding first electrodes; A third light-emitting functional layer, a second electrode and a third encapsulation layer of the third light-emitting device are formed at least in the third isolation opening.

6. The method for manufacturing a display panel according to claim 5, characterized in that: The step of forming a third light-emitting functional layer, a second electrode and a third encapsulation layer of the third light-emitting device at least in the third isolation opening comprises: sequentially forming a third preset light-emitting functional layer, a preset second electrode and a preset third encapsulation layer of the third light-emitting device; The third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device are patterned, the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device of the first isolation opening are removed, the third preset light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device of the third isolation opening are retained, and the third light-emitting functional layer, the preset second electrode and the preset third encapsulation layer of the third light-emitting device are formed in the third isolation opening.

7. The method for manufacturing a display panel according to claim 5, characterized in that: After the step of patterning the isolation layer to form a plurality of second isolation openings and removing the second covering portion, the isolation layer includes an isolation structure, and the isolation structure is arranged around the first isolation opening, the second isolation opening, and the third isolation opening; The isolation structure is in a grid shape; The isolation structure includes a conductive material, the second electrode of the first light emitting device is electrically connected to the isolation structure, the second electrode of the second light emitting device is electrically connected to the isolation structure; and the second electrode of the third light emitting device is electrically connected to the isolation structure.

8. The method for manufacturing a display panel according to claim 5, characterized in that: After the step of forming the second light-emitting functional layer, the second electrode and the second encapsulation layer of the second light-emitting device at least in the second isolation opening, the first encapsulation layer, the second encapsulation layer and the third encapsulation layer are arranged at intervals; And / or, the first encapsulation layer includes an inorganic material; the second encapsulation layer includes an inorganic material; and the third encapsulation layer includes an inorganic material.

9. The method for manufacturing a display panel according to claim 7, wherein: The isolation structure comprises a support portion and a crown portion which are sequentially stacked on the substrate in a direction away from the substrate, wherein the orthographic projection of a side of the support portion away from the substrate on the substrate is within the range of the orthographic projection of the crown portion on the substrate; The support portion includes a conductive material, and the second electrode of the first light emitting device overlaps with a side wall of the support portion surrounding the first isolation opening; The second electrode of the second light emitting device overlaps the side wall of the support portion surrounding the second isolation opening; The second electrode of the third light emitting device overlaps the side wall of the support portion surrounding the third isolation opening; The material of the support part includes aluminum, and / or the material of the crown part includes titanium.

10. The method for manufacturing a display panel according to claim 7, wherein: The isolation structure comprises a support portion and a crown portion stacked in sequence on the substrate in a direction away from the substrate, and a pad portion located between the support portion and the substrate, the orthographic projection of the side of the support portion away from the substrate on the substrate is located within the range of the orthographic projection of the crown portion on the substrate, and the orthographic projection of the support portion on the substrate is located within the range of the orthographic projection of the pad portion on the substrate; The pad portion includes a conductive material, and the second electrode of the first light emitting device overlaps the pad portion surrounding the first isolation opening; The second electrode of the second light emitting device overlaps the pad portion surrounding the second isolation opening; The second electrode of the third light emitting device overlaps the pad portion surrounding the third isolation opening; And / or, the support portion includes a conductive material, and the second electrode of the first light-emitting device overlaps the pad portion surrounding the first isolation opening and the support portion; The second electrode of the second light emitting device overlaps the pad portion and the support portion surrounding the second isolation opening; The second electrode of the third light emitting device overlaps the pad portion and the support portion surrounding the third isolation opening; And / or, the material of the support portion includes aluminum, and / or, the material of the crown portion includes titanium, and / or, the material of the pad portion includes molybdenum.

11. The method for manufacturing a display panel according to claim 5, characterized in that: The first light emitting device, the second light emitting device and the third light emitting device emit different colors; The first light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device, the second light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from the first light-emitting device, and the third light-emitting device is one of a red light-emitting device, a green light-emitting device, and a blue light-emitting device that is different from both the first light-emitting device and the second light-emitting device.

12. The method for manufacturing a display panel according to claim 5, wherein: The substrate includes a preset display area and a preset non-display area, the first light emitting device, the second light emitting device and the third light emitting device are formed in the preset display area, and the mark is formed in the preset non-display area.

13. A method for manufacturing a display panel, characterized in that: include: providing a substrate; forming at least one mark on one side of the substrate; forming at least a partial film layer of the protective layer on a side of at least one of the marks away from the substrate, wherein the orthographic projection of the mark on the substrate overlaps with the orthographic projection of the protective layer on the substrate; forming an isolation layer on one side of the substrate; patterning the isolation layer to form a first isolation opening; forming a first light-emitting functional layer, a second electrode and a first encapsulation layer of a first light-emitting device in the first isolation opening; patterning the isolation layer to form a second isolation opening; A second light-emitting functional layer, a second electrode and a second encapsulation layer of the second light-emitting device are formed in the second isolation opening.

14. The method for manufacturing a display panel according to claim 13, wherein: The protective layer comprises a first covering portion and a second covering portion which are sequentially stacked in a direction away from the substrate; Before the step of forming an isolation layer on one side of the substrate, the method for manufacturing a display panel further includes: forming a pixel definition layer, the pixel definition layer including the first covering portion, the orthographic projection of the mark on the substrate overlaps with the orthographic projection of the first covering portion on the substrate; At the same time as or after the step of patterning the isolation layer to form the second isolation opening, the method for manufacturing the display panel further includes: removing the second covering portion.

15. The method for manufacturing a display panel according to claim 14, characterized in that: The materials of the second covering portion and the isolation layer are at least partially different or arranged in different layers, and the second covering portion includes a light-transmitting layer, and the material of the light-transmitting layer includes a semiconductor metal oxide; The semiconductor metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide and indium gallium zinc oxide.

16. The method for manufacturing a display panel according to claim 14, wherein: The corrosion resistance of the material of at least part of the film layer of the second covering portion is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer; And / or, the material of the second covering portion includes titanium.

17. The method for manufacturing a display panel according to claim 14, wherein: The isolation layer includes the second covering portion, and the orthographic projection of the mark on the substrate overlaps with the orthographic projection of the second covering portion on the substrate; While the step of patterning the isolation layer to form the first isolation opening, the method for manufacturing the display panel further includes: retaining the second covering portion; While the step of patterning the isolation layer to form the second isolation opening, the method for manufacturing the display panel further includes: removing the second covering portion; and / or, the number of film layers of the second covering portion is less than or equal to the number of film layers of the isolation layer; And / or, the second covering portion is a single metal film layer or a multi-layer film layer stacked along the thickness direction of the substrate; And / or, an overlapping area of ​​an orthographic projection of the first covering portion on the substrate and an orthographic projection of the second covering portion on the substrate overlaps with an orthographic projection of the mark on the substrate; And / or, the orthographic projection of the mark on the substrate is located within the orthographic projection of the first covering portion on the substrate, and the orthographic projection of the mark on the substrate is located within the orthographic projection of the second covering portion on the substrate; And / or, the first light-emitting device further includes a first electrode located between the substrate and the first light-emitting functional layer, and the mark is arranged in the same layer as the first electrode of the first light-emitting device.

18. A display substrate, characterized in that: include: substrate; At least one mark and a plurality of first electrodes arranged in an array are located on one side of the substrate, and the mark and the first electrodes are made of the same layer and material; a pixel definition layer, located on a side of at least one of the marks and the plurality of the first electrodes away from the substrate, the pixel definition layer comprising at least one first covering portion, and a plurality of first pixel openings and a plurality of second pixel openings, the orthographic projection of the mark on the substrate being located within the orthographic projection range of the corresponding first covering portion on the substrate; an isolation layer, located on a side of the pixel definition layer away from the substrate, the isolation layer comprising a plurality of first isolation openings and a plurality of second isolation openings, the first pixel openings being connected to the corresponding first isolation openings, the first pixel openings exposing the corresponding first electrodes, the second pixel openings being connected to the corresponding second isolation openings, the second pixel openings exposing the corresponding first electrodes; The first light-emitting functional layer, the second electrode and the first encapsulation layer of the first light-emitting device are at least located in the first isolation opening; The second light-emitting functional layer, the second electrode and the second encapsulation layer of the second light-emitting device are at least located in the second isolation opening.

19. The display substrate according to claim 18, characterized in that: The display substrate further comprises a second covering portion, the second covering portion is located on a side of the first covering portion away from the base, the orthographic projection of the mark on the base is located within the orthographic projection range of the corresponding second covering portion on the base; the second covering portion and the isolation layer are provided in the same layer and with the same material; Alternatively, the material of the second covering portion includes a light-transmitting layer; the material of the light-transmitting layer includes a semiconductor metal oxide; the semiconductor metal oxide includes at least one of indium zinc oxide, aluminum zinc oxide, and indium gallium zinc oxide; Alternatively, the corrosion resistance of the material of at least part of the film layer of the second covering portion is greater than the corrosion resistance of the material of at least part of the film layer in the isolation layer; and / or, the material of the second covering portion includes titanium; And / or, the side of the mark away from the substrate does not have a material that is arranged in the same layer and the same material as the light-emitting functional layer and the second electrode of the light-emitting device.

20. A display device, characterized in that: A display panel manufactured by the method for manufacturing a display panel as described in any one of claims 1 to 12, or a display panel manufactured by the method for manufacturing a display panel as described in any one of claims 13 to 17, or a display substrate as described in claim 18 or 19.

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