Resonator and filter

Abstract

The embodiment of the invention relates to a resonator and a filter. According to an embodiment of the present disclosure, an improved resonator and an improved filter are provided. The resonator includes a housing defining a cavity. The resonator also includes a dielectric resonating element disposed inside the cavity. A first end of the dielectric resonating element is electrically conductively connected directly to the housing with a first securing element. The second end of the dielectric resonating element is electrically conductively connected directly to the housing with a second securing element. The first end is opposite to the second end. A filter includes: a housing defining a cavity; a set of dielectric resonating elements arranged in parallel inside the cavity, where the set of dielectric resonating elements is directly conductively connected to the housing; an input coupling element coupled with the set of dielectric resonating elements; an outcoupling element coupled to the set of dielectric resonating elements; a cross-coupling element disposed between the dielectric resonating elements of the set of dielectric resonating elements; and a tuning element for tuning a resonant frequency in the filter or a coupling between the dielectric resonating elements. In this way, the resonator and the filter are simple and stable in structure. In addition, an improved Q value and a reduced size may be achieved.

Description

Technical Field

[0001] Embodiments of the present disclosure relate generally to the field of telecommunications, and more particularly to resonators, filters, and communication devices. Background Art

[0002] With the development of wireless communication, the requirements for the sensitivity of sending and receiving signals are becoming more and more critical. Radio frequency (RF) filters are a key part in the hardware design of 5G massive multi-input multi-output (MIMO) active antenna units (AAUs). RF filters can filter and pass electromagnetic waves of certain frequencies. Among them, a large number of filters for transmitters and / or receivers can be quite large and heavy. Many types of filter solutions can be selected according to the different characteristics of each type, such as air coaxial filters, sheet metal filters, and dielectric filters. Among them, dielectric filters using high dielectric constant (expressed as Er) materials can reduce the size of the filter compared to air coaxial filters and sheet metal filters, where the wavelength of electromagnetic waves is shortened when electromagnetic waves are transmitted in high dielectric constant materials. In addition, a transverse magnetic (TM) mode dielectric filter using a dielectric resonant element with conductive contact with the filter cavity at both ends is a typical dielectric filter with good RF performance and reduced size. Summary of the invention

[0003] In a first aspect, a resonator is provided. The resonator includes: a housing defining a cavity; and a dielectric resonant element disposed in the cavity, wherein a first end of the dielectric resonant element is directly conductively connected to the housing using a first fixing element, wherein a second end of the dielectric resonant element is directly conductively connected to the housing using a second fixing element, and wherein the first end is opposite to the second end.

[0004] In a second aspect, a filter is provided, which includes: a housing defining a cavity; a group of dielectric resonant elements arranged in parallel inside the cavity, wherein the group of dielectric resonant elements is directly conductively connected to the housing; an input coupling element coupled to the group of dielectric resonant elements; an output coupling element coupled to the group of dielectric resonant elements; a cross-coupling element arranged between dielectric resonant elements in the group of dielectric resonant elements; and a tuning element used to tune the resonant frequency in the filter or the coupling between dielectric resonant elements.

[0005] It should be understood that the present invention summary is not intended to identify the key or essential features of the embodiments of the present disclosure, nor is it intended to be used to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Some example embodiments will now be described with reference to the accompanying drawings, in which:

[0007] Figure 1 illustrates an example communication network in which example embodiments of the present disclosure may be implemented;

[0008] Figure 2 illustrates a schematic diagram of a resonator according to an embodiment of the present disclosure;

[0009] Figure 3 A schematic diagram illustrating the structure of a resonator according to an embodiment of the present disclosure is illustrated;

[0010] Figure 4A and Figure 4B 10 respectively illustrate top views of an upper housing and a bottom housing according to an embodiment of the present disclosure;

[0011] Figure 5 A schematic diagram illustrating the structure of a resonator according to an embodiment of the present disclosure is illustrated;

[0012] Fig. 6A and Figure 6B 10 respectively illustrate top views of an upper housing and a bottom housing according to an embodiment of the present disclosure;

[0013] Figure 7 A schematic diagram illustrating the structure of a resonator according to an embodiment of the present disclosure is illustrated;

[0014] Fig. 8A and Figure 8B 10 respectively illustrate top views of an upper housing and a bottom housing according to an embodiment of the present disclosure;

[0015] Fig.9A and Fig. 9B 10 respectively illustrate top views of an upper housing and a bottom housing according to an embodiment of the present disclosure;

[0016] FIG. 10A to FIG. 10C views respectively illustrating a dielectric resonant element according to an embodiment of the present disclosure;

[0017] FIG. 11A to FIG. 11C views respectively illustrating a dielectric resonant element according to an embodiment of the present disclosure;

[0018] Fig. 12A and Fig. 12B views respectively illustrating a dielectric resonant element according to an embodiment of the present disclosure;

[0019] Fig.13 A comparison of the resonator Q values ​​is shown;

[0020] Fig.14 A comparison of cavity sizes is shown;

[0021] Fig.15 shows an electromagnetic field according to an embodiment of the present disclosure;

[0022] Fig.16 A schematic diagram of a filter according to an embodiment of the present disclosure is illustrated;

[0023] Fig.17A and Fig. 17B Schematic diagrams of filters according to embodiments of the present disclosure are respectively illustrated;

[0024] Fig.18 shows a filter response according to an embodiment of the present disclosure;

[0025] Fig.19 A schematic diagram of a filter according to an embodiment of the present disclosure is illustrated;

[0026] Fig. 20 shows a filter response according to an embodiment of the present disclosure;

[0027] Fig.21 A schematic diagram of a filter according to an embodiment of the present disclosure is illustrated;

[0028] FIG. 22A to FIG. 22C A schematic diagram of a filter according to an embodiment of the present disclosure is illustrated;

[0029] Fig.23 A schematic diagram illustrating a filter according to an embodiment of the present disclosure is illustrated; and

[0030] Fig.24 An apparatus including a filter according to some example embodiments of the present disclosure is shown.

[0031] Throughout the drawings, the same or similar reference numerals refer to the same or similar elements. DETAILED DESCRIPTION

[0032] The principles of the present disclosure will now be described with reference to some example embodiments. It should be understood that these embodiments are described only for illustrative purposes and help those skilled in the art to understand and implement the present disclosure without implying any limitation on the scope of the present disclosure. The embodiments described herein can be implemented in various ways except for the way described below.

[0033] In the following description and claims, unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.

[0034] References in this disclosure to "one embodiment," "an embodiment," "an example embodiment," etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but not every embodiment necessarily includes the particular feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, it is considered to be within the knowledge of those skilled in the art to affect such feature, structure, or characteristic in conjunction with other embodiments, whether or not explicitly described.

[0035] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the example embodiments. As used herein, the term "and / or" includes any and all combinations of one or more of the listed terms.

[0036] The terms used herein are only used for the purpose of describing specific embodiments and are not intended to limit the exemplary embodiments. As used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms unless the context clearly indicates otherwise. It will be further understood that the terms "comprise", "include", "have", "have", "include" and / or "include" when used herein specify the presence of stated features, elements and / or components, etc., but do not exclude the presence or addition of one or more other features, elements, components and / or combinations thereof.

[0037] The term "housing" as used herein may refer to a structure that houses an object and at least partially covers and protects the object. The term "cavity" as used herein may refer to a hollow space that may be filled with air or a dielectric material. The term "resonator" as used herein may refer to a structure that supports electromagnetic resonance. The term "dielectric resonant element" as used herein may refer to a dielectric member integrally formed for a resonator. The term "connection" as used herein may include a direct connection or an indirect connection. The terms "coupling" and "connection" may be used interchangeably.

[0038] As mentioned above, how to reduce filter size and weight while improving key performance remains a challenge in filter design. Although so many types of filter solutions can be selected for 5G / massive MIMO AAU, most of them still have bottlenecks or problems in some performance.

[0039] According to some solutions, several types of TM mode dielectric filters are designed. Compared with air coaxial filters, by using high dielectric constant materials, the filter size is reduced and a high quality (Q) value is achieved. According to some solutions, grooves, elastic covers or conductive elastic structural features can be added to the filter housing or filter cover, which can contribute to a good connection between the TM dielectric resonant element and the filter cavity, but all these structures are too complicated for assembly or production, which affects the Q value instability. In addition, the complex structure affects production maturity and efficiency. In addition, the assembly of the dielectric resonant element in the filter cavity still depends on the pressure of the filter cover or the conductive elastic structure. During long-term use or reliability testing, there is a high risk that the filter cover or elastic structure becomes weak or unstable. In addition, when the tuning screw is placed on the top surface of the dielectric resonant element and may be inserted into the dielectric resonant element when the frequency is adjusted, the filter RF performance and Q value may become worse, which affects the electric field and magnetic field in the resonant element. At the same time, the hollowness in the center of the dielectric resonant element will increase the filter size for the same resonant frequency.

[0040] According to some solutions, several kinds of cross-coupling structures and input / output coupling structures in conventional TM mode dielectric filters are designed. However, when more components are added in the filter, both component tolerance and assembly tolerance affect the filter performance.

[0041] According to some solutions, types of sheet metal filters using 1 / 4 wavelength sheet metal resonators are designed. In these designs, the filter size and weight can be reduced, the filter structure and assembly method are simplified, and the filter reliability and manufacturability are also improved compared to air coaxial filters in the same frequency range. However, compared to dielectric filters, sheet metal filters require a larger size. When the filter size is reduced, the Q value of the sheet metal filter may decrease, which affects the filter RF performance. Compared with dielectric filters, sheet metal filters still have bottlenecks in power handling and temperature drift performance. When the screws are tuned closer to the sheet metal resonator, the risk of filter breakdown is high.

[0042] According to an embodiment of the present disclosure, an improved resonator and an improved filter are provided. The resonator includes a housing defining a cavity. The resonator also includes a dielectric resonant element arranged inside the cavity. The first end of the dielectric resonant element is directly conductively connected to the housing using a first fixing element. The second end of the dielectric resonant element is directly conductively connected to the housing using a second fixing element. The first end is opposite to the second end. In this way, the structure of the resonator is simple and stable. In addition, an improved Q value and a reduced size can be achieved.

[0043] The principles and embodiments of the present disclosure are described in detail below with reference to the accompanying drawings. Figure 1, which illustrates an example communication system 100 in which example embodiments of the present disclosure may be implemented.

[0044] Figure 1 An example communication environment 100 is shown in which an example embodiment of the present disclosure may be implemented. In the communication environment 100, multiple communication devices including a device 110 (also referred to as a "first device") and a device 120 (also referred to as a "second device") may communicate with each other. A filter 130 may be implemented at the second device 120. The filter 130 may include one or more resonators 140.

[0045] exist Figure 1 In the example of FIG. 1 , device 110 may include a terminal device, and device 120 may include a network device serving the terminal device. A service area of ​​device 120 may be referred to as a cell 102 .

[0046] It should be understood that Figure 1 The number of devices and their connections shown in are for illustrative purposes only and do not imply any limitation. Communication environment 100 may include any suitable number of devices configured to implement the example embodiments of the present disclosure. Although not shown, it should be understood that one or more additional devices may be located in cell 102, and one or more additional cells may be deployed in communication environment 100. Note that although shown as a network device, device 120 may be another device other than a network device. Although shown as a terminal device, device 110 may be another device other than a terminal device.

[0047] In the following, for the purpose of illustration, some example embodiments are described in which device 110 operates as a terminal device and device 120 operates as a network device. However, in some example embodiments, the operations described in conjunction with the terminal device may be implemented at a network device or other device, and the operations described in conjunction with the network device may be implemented at a terminal device or other device.

[0048] In some example embodiments, if device 110 is a terminal device and device 120 is a network device, the link from device 120 to device 110 is referred to as a downlink (DL), and the link from device 110 to device 120 is referred to as an uplink (UL). In the DL, device 120 is a transmitting (TX) device (or transmitter), and device 110 is a receiving (RX) device (or receiver). In the UL, device 110 is a TX device (or transmitter), and device 120 is an RX device (or receiver).

[0049] The communication in the communication environment 100 can be implemented according to any appropriate communication protocol, including but not limited to cellular communication protocols of the first generation (1G), the second generation (2G), the third generation (3G), the fourth generation (4G), the fifth generation (5G), the sixth generation (6G), etc., wireless local area network communication protocols such as the Institute of Electrical and Electronics Engineers (IEEE) 802.11, and / or any other protocol currently known or developed in the future. In addition, the communication can utilize any appropriate wireless communication technology, including but not limited to: code division multiple access (CDMA), frequency division multiple access (FDMA), time division multiple access (TDMA), frequency division duplex (FDD), time division duplex (TDD), multiple input multiple output (MIMO), orthogonal frequency division multiple access (OFDM), discrete Fourier transform spread OFDM (DFT-s-OFDM) and / or any other technology currently known or developed in the future.

[0050] Reference now Figure 2 , which shows a block diagram of the structure of the resonator 140 according to some example embodiments of the present disclosure. The resonator 140 includes a housing 210 and a dielectric resonant element 220. In some embodiments, the housing 210 may include at least a first housing component that defines a first portion of the cavity and a second housing component that defines a second portion of the cavity. The first portion of the cavity and the second portion of the cavity are separated by a common plane, and the dielectric resonant element is fixed to the first housing and the second housing. For example, the housing 210 may include an upper housing 2110 above the dielectric resonant element 220 and a bottom housing 2120 below the dielectric resonant element 220. The dielectric resonant element 220 is directly conductive to the housing 210. As shown in FIG. Figure 2 As shown, the first end 2210 of the dielectric resonant element 220 is directly conductively connected to the housing 210 using a first fixing element. The second end 2220 of the dielectric resonant element 220 is directly conductively connected to the housing 210 using a second fixing element. In other words, there may be no elastic structure between the end and the housing 210. In some embodiments, the first fixing element may include one or more of the following: a first welding element or a first screw fixing element. Alternatively or additionally, the second fixing element may include one or more of the following: a second welding element or a second screw fixing element. For example, the dielectric resonant element 220 may be connected to the housing 210 by welding. In some embodiments, the dielectric resonant element 220 may be connected to the housing 210 by screws. Alternatively, the dielectric resonant element 220 may be connected to the housing 210 by welding and screws. In this case, the strength of the upper housing of the filter may be improved to ensure the stability and reliability of the filter.

[0051] In some embodiments, multiple surfaces on the first end 2210 may be coated with a conductive material. In this case, one or more of the multiple surfaces on the first end 2210 may be directly conductively connected to the housing 210. Additionally, multiple surfaces on the second end 2220 may be coated with a conductive material. In this case, one or more of the multiple surfaces on the second end 2220 may be directly conductively connected to the housing 210.

[0052] In some embodiments, resonator 140 may also include one or more tuning elements. One or more tuning elements may be used to tune the resonant frequency. Figure 2 As shown, tuning element 230 may be connected to the housing through hole 240 in the housing. The tuning element may be disconnected from dielectric resonant element 220. The tuning element may be oriented toward a side surface of dielectric resonant element 220. The side surface may be perpendicular to first end 2210 and second end 2220 of dielectric resonant element 220. In this way, the frequency tuning screw is changed from the top surface of the dielectric resonant element to the side surface, and the dielectric resonant element is not hollow inside, thereby improving the Q value and reducing the filter size more than a conventional TM mode filter.

[0053] The housing 210 may be made of any suitable material. For example, the housing 210 may be made of a metal such as aluminum. In some embodiments, the housing 210 may be made of a plastic material, and the surface of the housing may be plated with silver or copper to improve the conductivity of the surface, thereby reducing RF signal loss. The resonator 140 may also include other elements that are not shown for clarity.

[0054] refer to Figures 3 to 15 Example embodiments of resonator 140 are described.

[0055] Figure 3 FIG. 1 is a schematic diagram showing an example structure of the resonator 140. Figure 3 As shown, the upper shell 2110 can be assembled with the bottom shell 2120 using a fixing element 310. For example, the fixing element 310 can be a screw. The resonator 140 can also include a frequency tuning element 320. The frequency tuning element 320 can be connected to the shell 210 through a hole 330 in the shell 210 (e.g., the upper shell 2110). The frequency tuning element 320 can face the side surface of the dielectric resonant element 220. The side surface of the dielectric resonant element 220 can be perpendicular to the first end and the second end of the dielectric resonant element 220. The end 2210 and the end 2220 of the dielectric resonant element 220 can be welded to the shell 210. The end 2210 and the end 2220 of the dielectric resonant element 220 can also be connected to the shell via screws. Note that, Figure 3 The number of elements shown in is by way of example only and is not limiting.

[0056] Figure 4A Picture shows Figure 3 A top view of the upper housing 2110 is shown. Figure 4A As shown, the upper housing 2110 may include a plurality of holes. A group of holes 410 may be used for assembly with the bottom housing 2120. For example, the fixing element 310 may pass through a group of holes 410. A group of holes 420 may be used to ground the dielectric resonant element 220. Additionally, the dielectric resonant element 220 may be connected to the housing 210 using screws through a group of holes 420. In other words, assembly screw holes in the height direction may be designed in the housing 210, and these assembly screw holes are not only used for filter assembly, but also for grounding the dielectric resonant element 220 and for directly connecting the two housings with good connection through screw fixation. Note that Figure 4A The number of holes and the number of elements shown in are examples only and are not limiting.

[0057] Figure 4B Picture shows Figure 3 A top view of the bottom housing 2120 is shown in FIG. Figure 4B As shown, the bottom housing 2120 may include a plurality of holes. A set of holes 430 may be used for assembly with the upper housing 2110. For example, the fixing element 310 may pass through the set of holes 430. A set of holes 440 may be used to ground the dielectric resonant element 220. Additionally, the dielectric resonant element 440 may be connected to the housing 210 using screws through the set of holes 440. In some embodiments, the bottom housing 2120 may include a hole 450 for a tuning element. The bottom housing 2120 may include one or more grooves 460. The one or more grooves 460 may be used to assemble and conductively connect the dielectric resonant element 220 to the bottom housing 2120. In this case, the width of the groove 460 may match the width of the dielectric resonant element 220. The height of the groove 460 may match the height of the dielectric resonant element 220. For example, the groove 460 may be designed to assemble the dielectric resonant element 220 on the bottom housing 2120. For example, the width and depth of the groove 460 may match the width of the dielectric resonant element 220 (in Fig. 10A and Fig. 10B 1020) and height (in Fig. 10B and Fig. 10C The upper shell 2110 and the bottom shell 2120 are matched with each other (shown as 1030) so that the bottom shell 2120 is in conductive contact with the metallized surface of the dielectric resonant element 220. In some embodiments, another groove with a suitable width / depth is designed on the upper shell 2110 and the bottom shell 2120 for reflow soldering. In this case, when the dielectric resonant element 220 is soldered to the shell 210, the groove around the dielectric resonant element 220 can help the solder flow and conductive connection. In some embodiments, in addition to Figure 4A and 4BIn addition to the assembly screw holes in the cavity, another assembly screw hole can be placed in the height direction, which is located around the cavity when the shell-resonance element assembly uses a welding method. It should be noted that Figure 4B The number of holes and the number of elements shown are examples only and are not limiting.

[0058] Figure 5 FIG. 1 is a schematic diagram showing an example structure of the resonator 140. Figure 5 As shown, the upper housing 2110 can be assembled with the bottom housing 2120 using a fixing element 510. For example, the fixing element 510 can be a screw. The resonator 140 can also include a frequency tuning element 520. The frequency tuning element 520 can be connected to the housing 210 through a hole 530 in the housing 210 (e.g., the upper housing 2110). The frequency tuning element 520 can face the side surface of the dielectric resonant element 220. The side surface of the dielectric resonant element 220 can be perpendicular to the first end and the second end of the dielectric resonant element 220. Note that Figure 5 The number of elements shown is by way of example only and is not limiting.

[0059] Fig. 6A Picture shows Figure 5 A top view of the upper housing 2110 is shown in FIG. Fig. 6A As shown in , the upper housing 2110 may include a plurality of holes. A set of holes 610 may be used for assembly with the bottom housing 2120. For example, the fixing element 510 may pass through a set of holes 610. In other words, assembly screw holes in the height direction may be designed in the housing 210, which are not only used for filter assembly, but also for grounding the dielectric resonant element 220 and for directly connecting the two housings through screw fixing. Note that Fig. 6A The number of holes and the number of elements shown in are examples only and are not limiting.

[0060] Figure 6B Picture shows Figure 5 A top view of the bottom housing 2120 is shown in FIG. Figure 6BAs shown, the bottom housing 2120 may include a plurality of holes. A set of holes 620 may be used for assembly with the upper housing 2110. For example, the fixing element 510 may pass through the set of holes 620. In some embodiments, the bottom housing 2120 may include a hole 630 for a tuning element. The bottom housing 2120 may include one or more grooves 640. The one or more grooves 640 may be used to assemble and conductively connect the dielectric resonant element 220 to the bottom housing 2120. In this case, the width of the groove 640 may match the width of the dielectric resonant element 220. The height of the groove 640 may match the height of the dielectric resonant element 220. For example, the groove 640 may be designed for assembling the dielectric resonant element 220 on the bottom housing 2120. For example, the width and depth of the groove 640 may match the width of the dielectric resonant element 220 (in Fig.11A and Fig. 11B 1120) and height (in Fig. 11B and Fig. 11C The upper shell 2110 and the bottom shell 2120 are matched with each other (shown as 1130) so that the bottom shell 2120 is in conductive contact with the metallized surface of the dielectric resonant element 220. In some embodiments, another groove with a suitable width / depth is designed on the upper shell 2110 and the bottom shell 2120 for reflow soldering. In this case, when the dielectric resonant element 220 is soldered to the shell 210, the groove around the dielectric resonant element 220 can help the solder flow and conductive connection. In some embodiments, in addition to Fig. 6A and Figure 6B In addition to the assembly screw holes in the housing, another assembly screw hole can be placed in the height direction. When the housing-resonant element assembly uses a welding method, these assembly screw holes are located around the cavity. Note that Figure 6B The number of holes and the number of elements shown in are examples only and are not limiting.

[0061] Figure 7 FIG. 1 is a schematic diagram showing an example structure of the resonator 140. Figure 7 As shown, the upper housing 2110 can be assembled with the bottom housing 2120 having the fixing element 710. For example, the fixing element 710 can be a screw. The resonator 140 can also include a frequency tuning element 720. The frequency tuning element 720 can be connected to the housing 210 through a hole 730 in the housing 210 (e.g., the upper housing 2110). The frequency tuning element 720 can face the side surface of the dielectric resonant element 220. The side surface of the dielectric resonant element 220 can be perpendicular to the first end and the second end of the dielectric resonant element 220. It should be noted that Figure 7 The number of elements shown is by way of example only and is not limiting.

[0062] Fig. 8A Picture shows Figure 7A top view of the upper housing 2110 is shown in FIG. Fig. 8A As shown, the upper housing 2110 may include a plurality of holes. A set of holes 810 may be used for assembly with the bottom housing 2120. For example, the fixing element 710 may pass through a set of holes 810. In other words, assembly screw holes in the height direction may be designed in the housing 210, which are not only used for filter assembly, but also for grounding the dielectric resonant element 220 and for directly connecting the two housings through screw fixing. Note that Fig. 8A The number of holes and the number of elements shown in are examples only and are not limiting.

[0063] Figure 8B Picture shows Figure 7 A top view of the bottom housing 2120 is shown in FIG. Figure 8B As shown, the bottom housing 2120 may include a plurality of holes. A set of holes 820 may be used for assembly with the upper housing 2110. For example, the fixing element 710 may pass through a set of holes 820. In some embodiments, the bottom housing 2120 may include holes 830 for tuning elements. The bottom housing 2120 may include one or more grooves 850. The one or more grooves 850 may assemble and conductively connect the dielectric resonant element 220 to the bottom housing 2120. In this case, the width of the groove 850 may match the width of the dielectric resonant element 220. The height of the groove 850 may match the height of the dielectric resonant element 220. For example, the groove 850 may be designed for assembling the dielectric resonant element 220 on the bottom housing 2120. For example, the width and depth of the groove 850 may match the width of the dielectric resonant element 220 (in Fig. 10A and Fig. 10B 1020) and height (in Fig. 10B and Fig. 10C 1030) so that the bottom housing 2120 is in conductive contact with the metallized surface of the dielectric resonant element 220. Note that Figure 8B The number of holes and the number of elements shown in are examples only and are not limiting.

[0064] Fig.9A Picture shows Figure 7 21. In some embodiments, at least one of the two assembly screw holes can be placed into the cavity. For example, hole 910 can be placed in the cavity. In this case, hole 910 can be supported by metallization located on each shell. In some embodiments, two supports from the upper shell and the bottom shell can directly press and make conductive contact with the metallized surface of the dielectric resonant element 220 to connect to each other. Fig. 9B Picture shows Figure 721. In some embodiments, at least one of the two assembly screw holes can be placed into the cavity. For example, hole 920 can be placed in the cavity. In this case, hole 920 can be supported by metallization located on each shell. In some embodiments, two supports from the upper shell and the bottom shell can directly press and make conductive contact with the metallized surface of the dielectric resonant element 220 to connect to each other.

[0065] In some embodiments, a dielectric resonant element 220 with metallization at both ends can be placed in the cavity. The dielectric resonant element 220 is composed of a dielectric material with a high dielectric constant (expressed as Er), high Qf (low loss) and a stable resonant frequency temperature coefficient (expressed as τf). FIG. 10A to FIG. 10C and FIG. 11A to FIG. 11C Different views of an example structure of a dielectric resonant element 220 are shown respectively.

[0066] When the housing 210 and the dielectric resonant element 220 are assembled by screwing or welding at both ends, the surface of each end may be metallized and all the metallized surfaces may be bonded together. The metallized surfaces may be connected to the grooves and supports in the upper housing 2110 and the bottom housing 2120, such as FIG. 4A to FIG. 9B As shown, both ends of the resonant element are grounded. Instead of metallizing only one top surface on each end of the dielectric resonant element in the conventional TM mode dielectric filter, according to some embodiments of the present disclosure, five or more surfaces on each end of the dielectric resonant element are metallized, and the dielectric resonant element can be conductively connected to the housing 210 using any one of the metallized surfaces, which avoids conductive failure or instability by increasing the metallized surface.

[0067] FIG. 10A to FIG. 10C Views of dielectric resonant element 220 are shown respectively. Fig. 10A A top view of dielectric resonant element 220 is shown having a width 1020 and a length 1010 . Fig. 10B A front view of dielectric resonant element 220 is shown having a width 1020 and a height 1030 . Fig. 10C 10 shows a left side view of dielectric resonant element 220 having a length 1010 and a height 1030. FIG. 10A to FIG. 10CAs shown, multiple surfaces of first end 2210 may be coated with a conductive material. In this case, one or more of the multiple surfaces of first end 2210 may be directly conductively connected to housing 210. Additionally, multiple surfaces of second end 2220 may be coated with a conductive material. In this case, one or more of the multiple surfaces of second end 2220 may be directly conductively connected to housing 210. Width 1040 may depend on the size of the assembly screw. In this case, the assembly screw may pass through dielectric resonant element 220 and directly press dielectric resonant element 220 and two housings together and have a conductive connection.

[0068] FIG. 11A to FIG. 11C Views of dielectric resonant element 220 are shown respectively. Fig.11A A top view of dielectric resonant element 220 is shown having a width 1120 and a length 1110 . Fig. 11B A front view of dielectric resonant element 220 is shown having a width 1120 and a height 1130 . Fig. 11C 1 shows a left side view of dielectric resonant element 220 having a length 1110 and a height 1130. FIG. 11A to FIG. 11C As shown in , multiple surfaces of the first end 2210 may be coated with a conductive material. In this case, one or more of the multiple surfaces of the first end 2210 may be directly conductively connected to the housing 210. Additionally, multiple surfaces of the second end 2220 may be coated with a conductive material. In this case, one or more of the multiple surfaces of the second end 2220 may be directly conductively connected to the housing 210. For example, when the housing 210 and the dielectric resonant element 220 are assembled by soldering on both ends, five surfaces on each end may be metallized, and all metallized surfaces are bonded together. The metallized surfaces may be connected to FIG. 6A to FIG. 6B The grooves in the upper shell 2110 and the bottom shell 2120 are connected, and these grooves are used to ground the two ends of the resonant element.

[0069] Fig. 12A and Fig. 12B FIG. 2 shows an example structure of the dielectric resonant element 220. Fig. 12A and Fig. 12B As shown, the frequency tuning screw can be adjusted from the height direction on the side surface of the dielectric resonant element. Fig. 12A As shown, there may be a groove on the side surface toward which the frequency tuning element is directed. As another example, Fig. 12BAs shown, there may be a groove on the side surface to which the frequency tuning element points, and there may be a raised portion on the other side surface opposite to the side surface. In this way, there is no effect on the resonant frequency of the filter, and the Q value and the filter size can be improved. In some embodiments, following the theory of short-circuit dielectric resonator filters, the resonant frequency of the resonator may mainly depend on three factors: 1. The dielectric constant Er; 2. The size of the width * height on the dielectric resonant element; 3. The size of the resonant cavity in the same coordinates. The Q value of the resonator mainly depends on two factors: 1. The length of the dielectric resonant element; 2. The volume of the resonant cavity. Therefore, according to the reference Fig. 12A and Fig. 12B The described embodiments may affect the filter Q value when the length of the dielectric resonant element is changed, while the resonant frequency changes slightly.

[0070] In some embodiments, assembly screws made of conductive material can be designed for filter assembly and housing-resonance element connection. The screws pass through the end of the dielectric resonant element from the top surface of the upper housing, and finally reach and screw to the bottom housing. For example, there can be two types of assembly screws designed for different types of housing-dielectric resonant elements in the height direction. For example, when with Figure 4A , Figure 4B , Fig. 8A , Figure 8B , Fig.9A and Fig. 9B When the assembly screw holes in the cavity match, the assembly screws in the cavity can not only be used for filter assembly, but also for grounding the dielectric resonant element 220 and connecting well with the two housings 2110 and 2120. In this case, the plating treatment for such assembly screws may affect the connection between the dielectric resonant element 220 and the housing, affecting the Q value and RF performance. Figure 4A , Figure 4B , Fig. 6A and Figure 6B If the housing-resonant element assembly is welded, the assembly screws around the cavity can be used only for filter assembly. In this case, no coating is required for such assembly screws.

[0071] In some embodiments, a frequency tuning element made of a conductive material with a plated layer can be designed to adjust the frequency in the height direction of the resonator. It can be located on the upper housing 2110 or the bottom housing 2120 or both housings.

[0072] Fig.13 A comparison of Q values ​​based on resonators of the same size is shown. Fig.14 A comparison of the size of a single cavity based on the same Q value is shown. Fig.13 and Fig.14As shown in , embodiments of the present disclosure can improve the Q value and reduce the cavity size. Fig.15 Schematic diagram of the electromagnetic field inside the resonator according to an embodiment of the present disclosure is shown. Fig.15 As shown, a TM single mode can be achieved, wherein the electric field is parallel to the length direction and the magnetic field surrounds the dielectric resonant element 220 .

[0073] According to the embodiments of the present disclosure, different resonator design theories and resonator structures are proposed. For example, when compared with conventional TM mode dielectric resonators, the embodiments of the present disclosure remove complex parts and achieve good connection between the housing and the dielectric resonant element. In addition, instead of metallizing only one top surface on each end of the dielectric resonant element in the conventional TM mode dielectric filter, according to the embodiments of the present disclosure, more surfaces on each end of the dielectric resonant element are metallized. The dielectric resonant element can be conductively connected to the cavity using any one of the metallized surfaces, which avoids conductive failure or instability by increasing the metallized surface. Additionally, according to the embodiments of the present disclosure, a tuning method for Q value improvement and size reduction is proposed. For example, the frequency tuning element can be changed from the top surface of the dielectric resonant element to the side surface, and there is no hollow inside the dielectric resonant element, which improves the Q value more than the conventional TM mode filter and reduces the filter size. In addition, according to the embodiments of the present disclosure, the strength of the upper housing of the filter can be improved to ensure the stability and reliability of the filter.

[0074] In addition, compared with the sheet metal resonator, a different resonator structure is proposed. For example, in the novel TM mode dielectric resonator, the TM mode dielectric resonant element that is metallized at both ends and in conductive contact with the shell, rather than the 1 / 4 wavelength TEM mode sheet metal resonator in the sheet metal resonator, is completely different in filter design theory and filter structure. In addition, according to the embodiments of the present disclosure, it can improve the filter Q value and filter size. For example, a dielectric material with high Qf and high dielectric constant Er can improve the filter Q value and reduce the filter size. In addition, according to the embodiments of the present disclosure, it can improve power handling and temperature drift performance. For example, depending on the differences in resonator materials and structures, the capacity and temperature drift performance of the filter power handling can be designed by optimizing the dielectric resonant element. The electromagnetic energy is concentrated inside the dielectric resonant element, so the filter power handling bottleneck can be covered by the dielectric resonant element. The filter temperature drift performance can be designed to be close to zero drift by optimizing the τf (resonance frequency temperature coefficient) of the dielectric material, while the current sheet metal filter exceeds 1MHz temperature drift.

[0075] The filter 130 includes a group of dielectric resonant elements 220 of the resonator 140. The filter 130 also includes an input coupling element coupled to the group of dielectric resonant elements 220. The filter 130 includes an output coupling element coupled to the group of dielectric resonant elements 220. The filter 130 also includes a cross-coupling element arranged between the dielectric resonant elements in the plurality of resonators 140. The filter 130 also includes a tuning element for tuning the resonant frequency or the coupling between the dielectric resonant elements in the filter 130. In some embodiments, the tuning element may be connected to the housing through a hole in the housing and toward a side surface of the group of dielectric resonant elements.

[0076] refer to Figures 3 to 12B The described embodiments may also be applied to the filter 130. For example, for a dielectric resonant element from the set of dielectric resonant elements, a first end of the dielectric resonant element may be directly conductively connected to the housing of the filter 130 using a first fixing element, and a second end of the dielectric resonant element may be directly conductively connected to the housing of the filter 130 using a second fixing element. In some embodiments, the first fixing element may include at least one of the following: a first welding element or a first screw fixing element. The second fixing element may also include at least one of the following: a second welding element or a second screw fixing element. In some embodiments, a first plurality of surfaces on the first end are coated with a conductive material, and at least one of the first plurality of surfaces is directly conductively connected to the housing. In some embodiments, a second plurality of surfaces on the second end are coated with a conductive material, and at least one of the second plurality of surfaces is directly conductively connected to the housing. In an example embodiment, a bottom housing of the housing may include a first groove for assembling and conductively connecting the dielectric resonant element to the bottom housing. In this case, a width of the first groove matches a width of the dielectric resonant element, and a height of the first groove matches a height of the dielectric resonant element. In some embodiments, the upper shell of the shell may include a second groove, the second groove is used to facilitate welding the dielectric resonant element to the upper shell, and the bottom shell of the shell may include a third groove, the third groove is used to facilitate welding the dielectric resonant element to the bottom shell. In some other embodiments, the upper shell includes a first plurality of holes, a first subset of the first plurality of holes is used for assembly with the bottom shell, and a second subset of the first plurality of holes is used to ground the dielectric resonant element. In some embodiments, the bottom shell includes a second plurality of holes, a first subset of the second plurality of holes is used for assembly with the upper shell, and a second subset of the second plurality of holes is used to ground the dielectric resonant element. In some embodiments, at least one hole in the first plurality of holes is placed into the cavity. Alternatively, at least one hole in the second plurality of holes can be placed into the cavity. For clarity, the description of the holes related to the dielectric resonant element is omitted. Figures 3 to 12B Note that filter 130 can be used to implement Figures 3 to 12BOne or any combination of related features.

[0077] Fig.16 FIG. 1 is a schematic diagram showing an example structure of the filter 130. Fig.16 As shown, the filter 130 may include a housing including an upper housing 1610 and a bottom housing 1620. The upper housing 1610 and the bottom housing 1620 may be assembled together using a fixing element 1640. The filter 130 may include a set of dielectric resonant elements 220 of the resonator 140. The set of dielectric resonant elements may be integrated with an input coupling element 1660. The set of dielectric resonant elements 220 may also be integrated with an output coupling element 1670. The filter 130 may include a set of tuning elements 1630. The filter 130 may also include a cross-coupling element 1650 between the dielectric resonant elements 220 in the plurality of resonators 140.

[0078] In some embodiments, the cross-coupling element 1650 may include a stripline. In this case, the stripline may be between dielectric resonant elements of a subset of the resonators. For example, Fig.17A and Fig. 17B As shown, the filter 130 may include striplines 1720 (e.g., striplines 1720-1, 1720-2) as cross-coupling elements. In some embodiments, when the striplines are used for filter transmission zero (TZ) design, different cross-coupling structures may be designed to achieve a filter TZ for filter suppression optimization. In some embodiments, a Z-shaped stripline 1720-2 may be used between dielectric resonant elements (e.g., 3 dielectric resonant elements). Alternatively or additionally, a U-shaped stripline 1720-1 may be used between dielectric resonant elements. In some embodiments, if the ends of the striplines are grounded, the transmission zero of the filter may be on the positive side of the high frequency edge of the passband of the filter. Alternatively, if the ends of the striplines are open, the transmission zero of the filter may be on the negative side at the low frequency edge of the passband of the filter. For example, if elements 1710-1, 1710-2, 1710-3, and 1710-4 are metal materials for grounding the ends of the stripline, TZ may be on the positive side of the high frequency edge of the passband of filter 130. In some embodiments, if elements 1710-1, 1710-2, 1710-3, and 1710-4 are dielectric materials for leaving the ends of the stripline open, TZ may be on the negative side of the low frequency edge of the passband. Example filter responses are Fig.18 Shown in.

[0079] In some embodiments, the cross-coupling element 1650 may include a notch with one end grounded. In this case, the notch may be between adjacent dielectric resonant elements of one or more resonators. For example, the arm of the notch may be made of any suitable conductive material, such as silver. The other portion of the notch may be made of a dielectric material. In this way, positive or negative TZ may be freely implemented according to the filter requirements, thereby reducing filter component parts and improving filter integration. For example, as Fig.19 As shown, the filter 130 may include a notch 1910 as a cross-coupling element. In some embodiments, if a metallized notch with one end grounded and located on a dielectric component is used for a filter TZ design, a metallized notch may be designed between any two dielectric resonant elements 220 to improve the feasibility of the TZ design. In this way, positive or negative TZ may be freely implemented for filter requirements. It is also possible to reduce filter component parts by integrating the TZ structure with the dielectric resonant element. The example filter response is Fig. 20 Shown in.

[0080] like Fig.21 As shown, the input coupling element 1660 can be integrated with the first dielectric element of the resonator. The output coupling element 1670 can be integrated with the last dielectric element of the resonator. In some embodiments, it may be necessary to partially metallize both sides of the dielectric component and ground one end. The small through hole 2110 with metallization can be designed for soldering with the center pin of the connector. The input / output coupling and frequency of the first / end resonator can depend on the height of the two components and the rectangular through hole 2120 ( Fig.21 ).

[0081] In some embodiments, each of the one or more resonators can be individually assembled in the cavity. Fig.22A As shown, all dielectric resonant elements can be assembled individually in the filter cavity. In some embodiments, the joined dielectric resonant elements can be connected together by the joint legs between every two dielectric resonant elements, which improves the integration of the filter design and improves the manufacturability of the filter production. In some embodiments, one or more resonators can be joined on one side via the joint element. For example, as Fig. 22B As shown, one or more resonators can be joined on one side via a joining element 2210. In other words, the dielectric resonant element can be joined on one side as one component and assembled in the cavity. In this way, the filter structure can be simplified and the manufacturability of the filter can be improved. The characteristics of the joining leg have no effect on the resonant frequency, the coupling between the resonant elements, or the Q value of the resonant element.

[0082] In some embodiments, the first dielectric resonant element and the second dielectric resonant element can be joined on the first side via the first joining element. The second dielectric resonant element and the third dielectric resonant element can be joined on the second side via the second joining element. The first side and the second side can be different. For example, as shown in Figure 12C, dielectric resonant element 2230-1 and dielectric resonant element 2230-2 can be joined on the first side via the first joining element 2240-1. Dielectric resonant element 2230-2 and dielectric resonant element 2230-3 can be joined on the second side via the second joining element 2240-2. In this way, the filter structure can be simplified and the manufacturability of the filter can be improved. The characteristics of the joining leg have no effect on the resonant frequency, the coupling between the resonant elements, or the Q value of the resonant element.

[0083] In some embodiments, when FIG. 22A to FIG. 22C The main coupling structure between each two dielectric resonant elements can be used for different integrated matching as shown in Fig.23 The "L" shaped coupling window shown in FIG. The coupling bandwidth may depend on the heights h1 and h2, the widths w1 and w2 in the coupling window, and the distance between the two resonant elements.

[0084] According to an embodiment of the present disclosure, the filter size can be reduced, and the excellent performance, mechanics, reliability and manufacturability of the filter RF can be achieved, which is conducive to the improvement of large-scale MIMO AAU. According to an embodiment of the present disclosure, by using a simple and stable structure for the dielectric resonator and the filter, the simplification and stability of the filter structure can be improved, and the reliability and manufacturability of the filter can be improved. Additionally, a novel assembly and grounding method can be adopted, in which the two ends of the resonant element are directly welded to the housing or the two ends of the resonant element are directly screwed to the housing. More surfaces on each end of the dielectric resonant element can be metallized, which avoids conductive failures or instability. The strength of the upper housing of the filter can also be improved for the stability and reliability of the filter. Additionally, the integration of the dielectric filter can be improved. According to an embodiment of the present disclosure, the filter power handling and temperature drift performance can be improved by optimizing the dielectric resonant element.

[0085] Fig.24An example of an apparatus 2400 including one or more filters 130 is illustrated. The apparatus 2400 may be a node in a wireless network or system, such as a wireless mobile communication network or system, a satellite communication network or system, a television broadcast network or system, a modulated radio broadcast network or system, or a RADAR network or system. The example illustrates an apparatus 2400 including one or more filters 130 and an antenna arrangement 2410. The example shows a second device 120 of a mobile cellular communication network including one or more filters 130 and an antenna arrangement 2410. In this example, but not necessarily all examples, the antenna arrangement includes a plurality of radiator elements 2410 arranged in a two-dimensional array 2406, the two-dimensional array 2406 including a plurality of parallel one-dimensional sub-arrays 2408. This arrangement may be used for large-scale multiple-input multiple-output.

[0086] Where a structural feature has been described, it may be replaced by a means for performing one or more of the functions of the structural feature, whether that or those functions are explicitly or implicitly described.

[0087] Operating frequency B may be within or cover the following (but not limited to): Long Term Evolution (LTE) (US) (734 to 746 MHz and 869 to 894 MHz), Long Term Evolution (LTE) (rest of the world) (791 to 821 MHz and 925 to 960 MHz), Amplitude Modulation (AM) Radio (0.535-1.705 MHz); Frequency Modulation (FM) Radio (76-108 MHz); Bluetooth (2400-2483.5 MHz); Wireless Local Area Network (WLAN) (2400-2483.5 MHz); Hiper Local Area Network (Hiper LAN) (5150-5850MHz); Global Positioning System (GPS) (1570.42-1580.42MHz); US-Global System for Mobile Communications (US-GSM) 850 (824-894MHz) and 1900 (1850-1990MHz); European Global System for Mobile Communications (EGSM) 900 (880-960MHz) and 1800 (1710-1880MHz); European Wideband Code Division Multiple Access (EUWCDMA) 900 (880-960MHz); Personal Communications Network (PCN / DCS) 1800 (1710-1880MHz); US Wideband Code Division Multiple Access (US-WCDMA) 1700 (transmit: 1710 to 1755MHz, receive: 2110 to 2155MHz) and 1900 (1850-1990MHz); Wideband Code Division Multiple Access (WCDMA) 2100 (transmit: 1920-1980MHz, receive: 2110-2180MHz); Personal Communications Service (PCS) 1900 (1850-1990MHz); Time Division Synchronous Code Division Multiple Access (TDSCDMA) (1900MHz to 1920MHz, 2010MHz to 2025MHz, Ultra-Wideband (UWB) lower limit (3100-4900MHz); UWB upper limit (6000-10600MHz); Digital Video Broadcast Handheld (DVB-H) (470-702MHz); DVB-H US (1670-1675MHz); Digital Radio Mono (DRM) (0.15-30MHz); Worldwide Interoperability for Microwave Access (WiMax) (2300-2400MHz, 2305-2360MHz, 2496-2690MHz, 3300-3400MHz, 3400-3800MHz, 5250-5875MHz); Digital Audio Broadcasting (DAB) (174.928-239.2MHz, 1452.96-1490.62MHz); Radio Frequency Identification Low Frequency (RFID LF) (0.125-0.134MHz); Radio Frequency Identification High Frequency (RFID HF) (13.56-13.56MHz); RFID UHF (433MHz, 865-956MHz, 2450MHz) and the frequency bands used for 5G.

[0088] In addition, although the operations are depicted in a particular order, this should not be understood as requiring such operations to be performed in the particular order shown or in sequence, or performing all the operations shown to achieve the desired result. In some cases, multitasking and parallel processing may be advantageous. Similarly, although several specific implementation details are included in the above discussion, these should not be interpreted as limitations on the scope of the present disclosure, but should be interpreted as descriptions of features that may be specific to a particular embodiment. Certain features described in the context of a separate embodiment may also be implemented in combination in a single embodiment. On the contrary, the various features described in the context of a single embodiment may also be implemented in multiple embodiments individually or in any suitable sub-combination.

[0089] Although the disclosure has been described in language specific to structural features and / or methodological acts, it should be understood that the disclosure defined in the appended claims is not necessarily limited to the specific features or acts described above. Rather, the specific features and acts described above are disclosed as example forms of implementing the claims.

Claims

1. A resonator, include: a housing defining a cavity; as well as a dielectric resonant element disposed inside the cavity, and wherein the first end of the dielectric resonant element is directly conductively connected to the housing by a first fixing element, wherein the second end of the dielectric resonant element is directly conductively connected to the housing by a second fixing element, and The first end is opposite to the second end. 2 . The resonator of claim 1 , wherein no elastic element is present between the housing and the first and second ends.

3. The resonator according to claim 1 or 2, wherein the resonator further comprises a frequency tuning element, and wherein the frequency tuning element is connected to the housing through a hole in the housing and faces a side surface of the dielectric resonant element; and The side surface is perpendicular to the first end and the second end.

4. The resonator according to any one of claims 1 to 3, wherein the first fixing element comprises at least one of the following: a first welding element or a first screw fixing element, and The second fixing element includes at least one of the following: a second welding element or a second screw fixing element.

5. The resonator of any one of claims 1 to 4, wherein a first plurality of surfaces on the first end are coated with a conductive material, and At least one of the first plurality of surfaces is directly conductively connected to the housing.

6. The resonator of any one of claims 1 to 5, wherein the second plurality of surfaces on the second end are coated with a conductive material, and At least one surface of the second plurality of surfaces is directly conductively connected to the housing.

7. The resonator according to any one of claims 1 to 6, wherein a bottom shell of the shell comprises a first groove for assembling and conductively connecting the dielectric resonant element to the bottom shell, and wherein the width of the first groove matches the width of the dielectric resonant element, and The height of the first groove matches the height of the dielectric resonant element.

8. The resonator according to any one of claims 1 to 7, wherein an upper shell of the shell comprises a second groove for facilitating welding of the dielectric resonant element to the upper shell, and The bottom shell of the shell includes a third groove, and the third groove is used to facilitate welding the dielectric resonant element to the bottom shell.

9. The resonator of any one of claims 1 to 8, wherein the upper housing comprises a first plurality of holes, and wherein a first subset of the first plurality of holes is for assembly with the bottom housing, and A second subset of the first plurality of holes is used to ground the dielectric resonant element.

10. The resonator of any one of claims 1 to 9, wherein the bottom housing comprises a second plurality of holes, and wherein a first subset of the second plurality of holes is for assembly with the upper housing, and A second subset of the second plurality of holes is used to ground the dielectric resonant element.

11. A resonator according to claim 9 or 10, wherein at least one hole of the first plurality of holes is placed into the cavity, or Wherein at least one hole of the second plurality of holes is placed into the cavity.

12. A filter, include: a housing defining a cavity; a group of dielectric resonant elements, the group of dielectric resonant elements being arranged in parallel inside the cavity, wherein the group of dielectric resonant elements are directly conductively connected to the housing; an input coupling element coupled to the set of dielectric resonant elements; an output coupling element coupled to the set of dielectric resonant elements; a cross-coupling element disposed between dielectric resonant elements in the set of dielectric resonant elements; as well as A tuning element is used to tune the resonant frequency in the filter or the coupling between dielectric resonant elements.

13. The filter of claim 12, wherein the input coupling element is integrated with a first dielectric resonant element in the set of dielectric resonant elements; and The output coupling element is integrated with the last dielectric resonant element in the set of dielectric resonant elements.

14. The filter of claim 12, wherein the cross-coupling element comprises a notch having one end grounded, and The notch is located between adjacent dielectric resonant elements in the set of dielectric resonant elements.

15. The filter of claim 12, wherein the cross-coupling elements comprise striplines, and The stripline is located between dielectric resonant elements of a subset of the set of dielectric resonant elements.

16. The filter of claim 15, wherein if the end of the stripline is grounded, the transmission zero of the filter is on the positive side of the high frequency edge of the passband of the filter, or Wherein if the end of the stripline is open-circuited, the transmission zero point of the filter is on the negative side of the low-frequency edge of the passband of the filter.

17. The filter according to any one of claims 12 to 16, wherein each dielectric resonant element in the set of dielectric resonant elements is individually assembled in the cavity.

18. The filter according to any one of claims 12 to 16, wherein the set of dielectric resonant elements are joined on one side via a joining element.

19. The filter according to any one of claims 12 to 16, wherein the first dielectric resonant element and the second dielectric resonant element are joined on a first side via a first joining element, the second dielectric resonant element and the third dielectric resonant element are joined on a second side via a second joining element, and the first side and the second side are different.

20. The method of any one of claims 12 to 19, wherein no resilient element is present between the housing and the set of dielectric resonant elements.

21. A filter according to any one of claims 12 to 20, wherein the tuning element is connected to the housing through a hole in the housing and faces a side surface of the set of dielectric resonant elements.

22. The filter according to any one of claims 12 to 21, wherein for a dielectric resonant element from the set of dielectric resonant elements, The first end of the dielectric resonant element is directly conductively connected to the housing by a first fixing element, The second end of the dielectric resonant element is directly conductively connected to the housing by a second fixing element, and The first end is opposite to the second end.

23. The filter according to claim 22, wherein the first fixing element comprises at least one of the following: a first welding element or a first screw fixing element, and The second fixing element includes at least one of the following: a second welding element or a second screw fixing element.

24. The filter of any one of claims 22 to 23, wherein a first plurality of surfaces on the first end are coated with a conductive material, and At least one of the first plurality of surfaces is directly conductively connected to the housing.

25. The filter of any one of claims 22 to 24, wherein a second plurality of surfaces on the second end are coated with a conductive material, and At least one surface of the second plurality of surfaces is directly conductively connected to the housing.

26. The filter according to any one of claims 22 to 25, wherein a bottom housing of the housing comprises a first groove for assembling and conductively connecting the dielectric resonant element to the bottom housing, and wherein the width of the first groove matches the width of the dielectric resonant element, and The height of the first groove matches the height of the dielectric resonant element.

27. The filter according to any one of claims 22 to 26, wherein the upper housing of the housing comprises a second groove for facilitating welding of the dielectric resonant element to the upper housing, and The bottom shell of the shell includes a third groove, and the third groove is used to facilitate welding the dielectric resonant element to the bottom shell.

28. The filter of any one of claims 22 to 27, wherein the upper housing comprises a first plurality of holes, and wherein a first subset of the first plurality of holes is for assembly with the bottom housing, and A second subset of the first plurality of holes is used to ground the dielectric resonant element.

29. The filter of any one of claims 22 to 28, wherein the bottom housing comprises a second plurality of holes, and wherein a first subset of the second plurality of holes is for assembly with the upper housing, and A second subset of the second plurality of holes is used to ground the dielectric resonant element.

30. A filter according to claim 28 or 29, wherein at least one hole of the first plurality of holes is placed into the cavity, or Wherein at least one hole of the second plurality of holes is positioned into the cavity.

31. A device, include: One or more filters according to any preceding claim; An antenna arrangement comprising a plurality of radiator elements arranged in a two-dimensional array, the two-dimensional array comprising a plurality of parallel one-dimensional sub-arrays, wherein each one-dimensional sub-array is associated with a cavity of a filter.

32. The apparatus of claim 31 , configured as a node for a wireless network or system, a wireless mobile communication network or system, a satellite communication network or system, a television broadcasting network or system, a modulated radio broadcasting network or system, or a RADAR network or system.

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