Semiconductor wafer edge grinding device

Abstract

The invention relates to the technical field of semiconductor wafer production equipment, in particular to a semiconductor wafer edge grinding device which comprises a supporting seat, a mounting structure, a grinding wheel, a driving structure, a protective structure, a sliding frame, a positioning structure, a placing structure, a cooling structure, a guide seat, an electric push rod and a water collecting box. In the using process, a wafer can be placed on the placing structure, then the wafer can be positioned through the positioning structure, and after the positioning structure completes positioning of the wafer, the wafer can deviate from the two sides of the wafer; according to the wafer grinding device, the positioning structure is arranged on the wafer, so that damage caused by collision between the wafer and the positioning structure can be avoided when the wafer is taken and placed, and therefore the use safety is effectively improved, and a plurality of grinding wheels can be mounted through the mounting structure; and when one grinding wheel needs to be replaced, the other grinding wheel can be rapidly located at the position of the grinding wheel needing to be replaced, so that rapid replacement of the grinding wheels is achieved, and the machining efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafer production equipment, specifically a semiconductor wafer edge grinding device. Background Art

[0002] A semiconductor wafer is a very thin flat plate, usually made of single crystal silicon, and is used to manufacture integrated circuits. It is a thin slice of semiconductor material (such as crystalline silicon), which is called a wafer in the electronics industry. Edge grinding of the wafer can make the edge of the chip smoother, thereby reducing the size difference between chips and improving the consistency and stability of the manufacturing process.

[0003] However, when the traditional edge grinding device grinds the edge of the wafer, the wafer is placed on a suction cup. After the wafer is placed, it is positioned by a positioning structure. Since the positioning structure is located on both sides of the wafer, the wafer may collide with the positioning structure and be damaged when the wafer is picked up and placed, resulting in poor safety in use. In addition, when replacing the grinding wheel inside the grinding device, the protective cover for protecting the grinding wheel needs to be removed first, and then the grinding wheel is removed for replacement. This process requires the machine to stop for a long time, thus reducing the processing efficiency. Summary of the Invention

[0004] In view of the problems in the prior art, the present invention provides a semiconductor wafer edge grinding device.

[0005] The technical solution adopted by the present invention to solve its technical problems is: a semiconductor wafer edge grinding device, including a support base, an installation structure is provided on the support base, a plurality of grinding wheels are installed on the installation structure, a driving structure is provided on the support base, a protective structure is provided on the support base, two guiding seats are fixedly connected to the support base, the same sliding frame is slidably connected to the two guiding seats, a positioning structure is provided on the sliding frame, a placement structure is provided on the sliding frame, a cooling structure is provided on the support base, two electric push rods are installed on the support base, one end of the electric push rod is fixedly connected to the sliding frame, and a water collecting box is placed on the support base;

[0006] The positioning structure includes a handle and a sliding plate. Two sliding plates are slidably connected to the carriage, and the same handle is fixedly connected between the two sliding plates. The sliding plate is provided with a first guiding groove. Two sliding rods are slidably connected to the carriage. The bottom end of the sliding rod is fixedly connected with a first guiding shaft, and the end of the first guiding shaft extends into the first guiding groove and is slidably connected with the sliding plate. A rotating rod is rotatably connected to the sliding rod. One end of the rotating rod is fixedly connected with a positioning plate. A connecting rod is fixedly connected to the rotating rod. A second guiding shaft is fixedly connected to the connecting rod. A connecting plate is fixedly connected to the carriage. The connecting plate is provided with a second guiding groove, and one end of the second guiding shaft extends into the second guiding groove and is slidably connected with the connecting plate.

[0007] Specifically, a spring is fixedly connected to the sliding plate, and one end of the spring abuts against the carriage.

[0008] Specifically, one end of the second guiding groove is inclined, and the other end of the second guiding groove is horizontal.

[0009] Specifically, the whole positioning plate is in a V-shaped structure, and the bottom end of the sliding rod is in a dovetail-shaped structure.

[0010] Specifically, the placing structure includes a suction cup and a third gear. A suction cup is rotatably connected to the carriage. A third gear is fixedly connected to the suction cup. A third motor is installed on the carriage, and a fourth gear is fixedly connected to the output shaft of the third motor. The third gear meshes with the fourth gear.

[0011] Specifically, the installation structure includes a first motor and a turntable. A first motor is installed on the support base. A turntable is rotatably connected to the support base. The output shaft of the first motor is fixedly connected to the turntable. Four installation shafts are rotatably connected to the turntable. Bolts are threadedly connected to the installation shafts. A pressing piece abuts between the bolts and the turntable. A first gear is fixedly connected to the installation shaft. A grinding wheel is clamped on the installation shaft. The pressing piece abuts against the grinding wheel.

[0012] Specifically, the four installation shafts are circumferentially and arrayed about the middle of the turntable, and the width of the cross section of one end of the installation shaft is greater than that of the other end.

[0013] Specifically, the driving structure includes a second motor and a second gear. A second motor is installed on the support base. A second gear is fixedly connected to the output shaft of the second motor. The second gear meshes with one of the first gears.

[0014] Specifically, the protection structure includes a protective cover and a baffle. A protective cover is fixedly connected to the support base. A baffle is rotatably connected to the protective cover, and one end of the baffle extends to the outside of the protective cover.

[0015] Specifically, the cooling structure includes a support frame and a bamboo joint pipe. A support frame is fixedly connected to the support base, and two bamboo joint pipes are fixedly connected to the support frame. A nozzle is installed at one end of the bamboo joint pipe.

[0016] The beneficial effects of the present invention are as follows:

[0017] (1) For the semiconductor wafer edge grinding device of the present invention, during use, the wafer can be placed on the placement structure, and then the wafer can be positioned by the positioning structure. When the positioning structure completes the positioning of the wafer, it will deviate from both sides of the wafer. Therefore, it is possible to avoid collision and damage between the wafer and the positioning structure when taking and placing the wafer, thereby effectively improving the safety of use.

[0018] (2) For the semiconductor wafer edge grinding device of the present invention, the mounting structure can mount multiple grinding wheels. When one of the grinding wheels is severely worn and needs to be replaced, another unused grinding wheel can be quickly positioned at the position of the grinding wheel to be replaced, and then the grinding work can continue, thereby realizing the quick replacement of the grinding wheel, avoiding the need for a long downtime, improving the processing efficiency. Then, while processing, the damaged grinding wheel can be replaced, effectively saving time and improving the processing efficiency.

[0019] (3) For the semiconductor wafer edge grinding device of the present invention, when two electric push rods extend simultaneously, the carriage can move. The movement of the carriage will drive the wafer to move together. When the wafer contacts the grinding wheel, the driving structure can drive the grinding wheel to rotate. The rotation of the grinding wheel will realize the grinding of the edge of the wafer. During the grinding process, the cooling structure can cool the grinding part of the wafer, thereby avoiding damage to the wafer due to frictional heat generation during grinding, and effectively improving the safety of use. Description of the Drawings

[0020] The present invention will be further described below in conjunction with the drawings and embodiments.

[0021] Figure 1 It is a schematic structural diagram of the overall structure of a preferred embodiment of the semiconductor wafer edge grinding device provided by the present invention;

[0022] Figure 2 is Figure 1 the enlarged schematic view of part A shown in;

[0023] Figure 3 It is a schematic connection structure diagram of the first motor and the turntable of the present invention;

[0024] Figure 4 is Figure 3 the enlarged schematic view of part B shown in the figure;

[0025] Figure 5 the schematic connection structure diagram of the skateboard and the spring of the present invention;

[0026] Figure 6 the schematic connection structure diagram of the helix and the pressing piece of the present invention;

[0027] Figure 7 the schematic structure diagram of the mounting shaft of the present invention;

[0028] Figure 8 the schematic connection structure diagram of the mounting shaft and the first gear of the present invention.

[0029] In the figure: 1, support base; 2, mounting structure; 201, first motor; 202, turntable; 203, mounting shaft; 204, bolt; 205, pressing piece; 206, first gear; 3, grinding wheel; 4, driving structure; 401, second motor; 402, second gear; 5, protection structure; 501, protective cover; 502, baffle; 6, carriage; 7, positioning structure; 701, handle; 702, skateboard; 703, first guide groove; 704, first guide shaft; 705, slide bar; 706, rotating rod; 707, positioning plate; 708, connecting rod; 709, second guide shaft; 710, second guide groove; 711, connecting plate; 712, spring; 8, placing structure; 801, suction cup; 802, third gear; 804, fourth gear; 805, third motor; 9, cooling structure; 901, support frame; 902, bamboo joint pipe; 903, nozzle; 10, guide seat; 11, electric push rod; 12, water collecting box. Detailed implementation manners

[0030] In order to make the technical means, creative features, achieved purposes and functions of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners.

[0031] Such as Figure 1 , Figure 2 , Figure 3 and Figure 4As shown, the edge grinding device for semiconductor wafers according to the present invention includes a support base 1, an installation structure 2 is provided on the support base 1, a plurality of grinding wheels 3 are installed on the installation structure 2, a driving structure 4 is provided on the support base 1, a protective structure 5 is provided on the support base 1, two guiding seats 10 are fixedly connected to the support base 1, the same sliding frame 6 is slidably connected to the two guiding seats 10, a positioning structure 7 is provided on the sliding frame 6, a placement structure 8 is provided on the sliding frame 6, a cooling structure 9 is provided on the support base 1, two electric push rods 11 are installed on the support base 1, one end of the electric push rod 11 is fixedly connected to the sliding frame 6, and a water collecting box 12 is placed on the support base 1;

[0032] As Figure 1 , Figure 2 , Figure 3 , Figure 5 and Figure 6As shown, the positioning structure 7 includes a handle 701 and a slide plate 702. Two slide plates 702 are slidably connected to the carriage 6. The same handle 701 is fixedly connected between the two slide plates 702. A first guiding groove 703 is provided on the slide plate 702. Two slide rods 705 are slidably connected to the carriage 6. A first guiding shaft 704 is fixedly connected to the bottom end of the slide rod 705. The end of the first guiding shaft 704 extends into the first guiding groove 703 and is slidably connected to the slide plate 702. A rotating rod 706 is rotatably connected to the slide rod 705. A positioning plate 707 is fixedly connected to one end of the rotating rod 706. A connecting rod 708 is fixedly connected to the rotating rod 706. A second guiding shaft 709 is fixedly connected to the connecting rod 708. A connecting plate 711 is fixedly connected to the carriage 6. A second guiding groove 710 is provided on the connecting plate 711. One end of the second guiding shaft 709 extends into the second guiding groove 710 and is slidably connected to the connecting plate 711. A spring 712 is fixedly connected to the slide plate 702. One end of the spring 712 abuts against the carriage 6. One end of the second guiding groove 710 is inclined, and the other end of the second guiding groove 710 is horizontal. The whole positioning plate 707 is in a V-shaped structure. The bottom end of the slide rod 705 is in a dovetail structure. The placing structure 8 includes a suction cup 801 and a third gear 802. The suction cup 801 is rotatably connected to the carriage 6. The third gear 802 is fixedly connected to the suction cup 801. A third motor 805 is installed on the carriage 6. A fourth gear 804 is fixedly connected to the output shaft of the third motor 805. The third gear 802 meshes with the fourth gear 804. That is, when it is necessary to grind the wafer, the wafer can be placed on the suction cup 801. Then, by pushing the handle 701, the movement of the handle 701 will drive the two slide plates 702 to move. The spring 712 contracts. The movement of the slide plate 702 will drive the first guiding groove 703 to move. While the first guiding groove 703 is moving, the first guiding shaft 704 will move inside the first guiding groove 703. While the first guiding shaft 704 is moving inside the first guiding groove 703, the slide rod 705 will slide on the carriage 6. The movement of the slide rod 705 will drive the connecting rod 708 to move. The connecting rod 708 drives the second guiding shaft 709 to move inside the second guiding groove 710. When the second guiding shaft 709 moves at the inclined position of the second guiding groove 710, the rotating rod 706 will rotate. When the second guiding shaft 709 moves to the horizontal position of the second guiding groove 710, the rotating rod 706 will rotate to a horizontal state. At this time, as the slide rod 705 continues to move, the rotating rod 706 will not rotate. Then, the movement of the rotating rod 706 will drive the positioning plate 707 to move towards the wafer. When the two positioning plates 707 simultaneously abut against the wafer, stop pushing the handle 701. At this time, the positioning of the wafer is realized, ensuring that the position of the wafer remains unchanged after each placement, thus ensuring the quality of the ground edge of the wafer.After the wafer is positioned, the handle 701 can be released. At this time, the spring 712 will stretch to drive the slide plate 702 to reset. During the reset process of the slide plate 702, the positioning plate 707 will rotate to the bottom end of the wafer, so it will not block the wafer. Therefore, when taking and placing the wafer, it is possible to avoid collisions and damage between the wafer and the positioning plate 707, thereby improving the safety of use. And because there is a large space around the wafer, it is possible to avoid the positioning plate 707 blocking the hands of the staff when taking and placing the wafer, thus facilitating the taking and placing of the wafer. After the wafer is positioned, the wafer can be adsorbed and fixed by the suction cup 801.,

[0033] Specifically, such as Figure 1 、 Figure 3 、 Figure 4 、 Figure 6 、 Figure 7 and Figure 8As shown, the mounting structure 2 includes a first motor 201 and a turntable 202. The first motor 201 is mounted on the support base 1, and the turntable 202 is rotatably connected to the support base 1. The output shaft of the first motor 201 is fixedly connected to the turntable 202. Four mounting shafts 203 are rotatably connected to the turntable 202. A bolt 204 is threadedly connected to the mounting shaft 203. A pressing piece 205 is provided between the bolt 204 and the turntable 202. A first gear 206 is fixedly connected to the mounting shaft 203. A grinding wheel 3 is engaged with the mounting shaft 203. The pressing piece 205 abuts against the grinding wheel 3. The four mounting shafts 203 are circumferentially arranged in an array about the center of the turntable 202. The width of one end cross-section of the mounting shaft 203 is greater than that of the other end cross-section. The protection structure 5 includes a protective cover 501 and a baffle 502. The protective cover 501 is fixedly connected to the support base 1. The baffle 502 is rotatably connected to the protective cover 501. One end of the baffle 502 extends to the outside of the protective cover 501. That is, the multiple grinding wheels 3 can be shielded and protected by the protective cover 501 and the baffle 502, thereby preventing the grinding wheels 3 from being damaged by collision, and further improving the safety of use. When it is necessary to replace one of the grinding wheels 3, the first motor 201 can be started. The output shaft of the first motor 201 rotates to drive the turntable 202 to rotate. The rotation of the turntable 202 will drive the four mounting shafts 203 to move. The movement of the mounting shafts 203 will drive the grinding wheels 3 to move. When the turntable 202 rotates 90 degrees, the output shaft of the first motor 201 stops rotating. At this time, another unused grinding wheel 3 will be located at the position of the grinding wheel 3 to be replaced. Then, the grinding work of the wafer can be continued, thereby shortening the downtime and improving the processing efficiency. When the grinding wheel 3 to be replaced moves to one side of the baffle 502, the baffle 502 can be rotated so that it does not block the grinding wheel 3. Then, the bolt 204 can be removed by an inner hexagon wrench, and the pressing piece 205 can be taken away from one side of the grinding wheel 3. Then, the old grinding wheel 3 can be directly removed from the mounting shaft 203 and the new grinding wheel 3 can be snapped onto the mounting shaft 203. Then, the pressing piece 205 is placed on one side of the grinding wheel 3. Finally, the bolt 204 is tightened, so that the disassembly and assembly of the grinding wheel 3 can be realized while the grinding process is carried out. Therefore, time can be effectively saved and the processing efficiency can be improved.

[0034] Specifically, as Figure 1 、 Figure 2 、 Figure 3 、and Figure 4As shown, the drive structure 4 includes a second motor 401 and a second gear 402. The second motor 401 is installed on the support base 1, and a second gear 402 is fixedly connected to the output shaft of the second motor 401. The second gear 402 meshes with one of the first gears 206. The cooling structure 9 includes a support frame 901 and a corrugated pipe 902. The support frame 901 is fixedly connected to the support base 1, and two corrugated pipes 902 are fixedly connected to the support frame 901. One end of the corrugated pipe 902 is provided with a nozzle 903. That is, after the wafer is fixed, two electric push rods 11 can be started simultaneously. When the two electric push rods 11 extend simultaneously, the carriage 6 will be driven to move, and the wafer will move together with the carriage 6. After the wafer contacts the grinding wheel 3, the second motor 401 can be started. The output shaft of the second motor 401 rotates to drive the second gear 402 to rotate. The second gear 402 will drive one of the first gears 206 to rotate. The rotation of the first gear 206 will drive the mounting shaft 203 to rotate. The rotation of the mounting shaft 203 will drive the grinding wheel 3 to rotate. While the grinding wheel 3 is rotating, the third motor 805 can be started. The output shaft of the third motor 805 rotates to drive the fourth gear 804 to rotate. The rotation of the fourth gear 804 drives the third gear 802 to rotate. The rotation of the third gear 802 will drive the suction cup 801 to rotate. The rotation of the suction cup 801 will drive the wafer to rotate. Friction will be generated between the wafer and the grinding wheel 3 during the rotation of the wafer. The edge of the wafer will be ground during the friction between the grinding wheel 3 and the edge of the wafer. During the grinding process, cooling water can enter the interiors of the two corrugated pipes 902 and finally be ejected from the two nozzles 903. The ejected cooling water will cool the grinding part, thus preventing the wafer from generating heat and being damaged during the grinding process, effectively improving the safety of use. The water collecting box 12 can centrally collect the dripping cooling water.

[0035] When the present invention is in use, when it is necessary to grind the wafer, the wafer can be placed on the suction cup 801, and then the handle 701 is pushed. The movement of the handle 701 will drive the two slides 702 to move, the spring 712 contracts, and the movement of the slide 702 will drive the first guide groove 703 to move. When the first guide groove 703 moves, the first guide shaft 704 will move inside the first guide groove 703. When the first guide shaft 704 moves inside the first guide groove 703, the slide bar 705 will slide on the slide 6. The movement of the slide bar 705 will drive the connecting rod 708 to move. The connecting rod 708 drives the second guide shaft 709 to move inside the second guide groove 710. When the second guide shaft 709 moves at the inclined position of the second guide groove 710, the rotating rod 706 will rotate. When the second guide shaft 709 moves to the horizontal position of the second guide groove 710, the rotating rod 706 will rotate to a horizontal state. At this time, as the sliding rod 705 continues to move, the rotating rod 706 will not rotate. , then the movement of the rotating rod 706 will drive the positioning plate 707 to move toward the wafer. When the two positioning plates 707 resist the wafer at the same time, the handle 701 is stopped. At this time, the positioning of the wafer is achieved, ensuring that the position of the wafer remains unchanged after each placement, thereby ensuring the quality of the edge of the wafer after grinding. When the wafer is positioned, the handle 701 can be released. At this time, the spring 712 will extend and drive the slide plate 702 to reset. During the resetting process of the slide plate 702, the positioning plate 707 will rotate to the bottom end of the wafer, so it will not resist the wafer, so that when taking and placing the wafer, it can avoid the wafer and the positioning plate 707 from being damaged by collision, thereby improving the safety of use. Because the space around the wafer is large, it can avoid the positioning plate 707 from resisting the staff's hand when taking and placing the wafer, so that it is convenient for the wafer to be taken and placed. When the wafer is positioned, the suction cup 801 can be used to adsorb and fix the wafer;

[0036] After the wafer is fixed, two electric push rods 11 can be started simultaneously. When the two electric push rods 11 extend simultaneously, they will drive the carriage 6 to move, and the wafer will move along with the carriage 6. After the wafer contacts the grinding wheel 3, the second motor 401 can be started. The output shaft of the second motor 401 rotates to drive the second gear 402 to rotate. The second gear 402 will drive one of the first gears 206 to rotate. The rotation of the first gear 206 will drive the mounting shaft 203 to rotate. The rotation of the mounting shaft 203 will drive the grinding wheel 3 to rotate. While the grinding wheel 3 is rotating, the third motor 805 can be started. The output shaft of the third motor 805 rotates to drive the fourth gear 804 to rotate. The rotation of the fourth gear 804 drives the third gear 802 to rotate. The rotation of the third gear 802 will drive the suction cup 801 to rotate. The rotation of the suction cup 801 will drive the wafer to rotate. Friction will be generated between the wafer and the grinding wheel 3 during the rotation of the wafer. The edge of the wafer will be ground when the grinding wheel 3 rubs against the edge of the wafer. During the grinding process, cooling water can enter the interiors of the two bamboo joint pipes 902 and finally spray out from the two nozzles 903. The sprayed cooling water will cool the grinding part, thus preventing the wafer from generating heat and being damaged during the grinding process, and effectively improving the safety of use;

[0037] The protective cover 501 and the baffle 502 can shield and protect multiple grinding wheels 3, thus preventing the grinding wheels 3 from being damaged by collision and further improving the safety of use. When one of the grinding wheels 3 needs to be replaced, the first motor 201 can be started. The output shaft of the first motor 201 rotates to drive the turntable 202 to rotate. The rotation of the turntable 202 will drive the four mounting shafts 203 to move. The movement of the mounting shafts 203 will drive the grinding wheels 3 to move. When the turntable 202 rotates 90 degrees, the output shaft of the first motor 201 stops rotating. At this time, another unused grinding wheel 3 will be located at the position of the grinding wheel 3 that needs to be replaced. Then, the grinding work of the wafer can be continued, thus shortening the downtime and improving the processing efficiency. When the grinding wheel 3 that needs to be replaced moves to one side of the baffle 502, the baffle 502 can be rotated so that it does not block the grinding wheel 3. Then, the bolt 204 can be unscrewed with an Allen wrench, and the pressing piece 205 can be taken away from one side of the grinding wheel 3. Then, the old grinding wheel 3 can be directly removed from the mounting shaft 203 and the new grinding wheel 3 can be snapped onto the mounting shaft 203. Then, the pressing piece 205 can be placed on one side of the grinding wheel 3, and finally the bolt 204 can be tightened. Thus, the disassembly and assembly of the grinding wheel 3 can be realized while the grinding process is in progress, so that time can be effectively saved and the processing efficiency can be improved.

[0038] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above-described exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be embraced within the present invention. Any reference signs in the claims should not be construed as limiting the claims involved.

[0039] In addition, it should be understood that although this specification is described in terms of embodiments, not every embodiment only contains an independent technical solution. This narrative manner of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor wafer edge grinding device, characterized in that: The invention comprises a support seat (1), wherein a mounting structure (2) is provided on the support seat (1), a plurality of grinding wheels (3) are mounted on the mounting structure (2), a driving structure (4) is provided on the support seat (1), a protective structure (5) is provided on the support seat (1), two guide seats (10) are fixedly connected to the support seat (1), a same slide frame (6) is slidably connected to the two guide seats (10), a positioning structure (7) is provided on the slide frame (6), a placement structure (8) is provided on the slide frame (6), a cooling structure (9) is provided on the support seat (1), two electric push rods (11) are mounted on the support seat (1), one end of the electric push rod (11) is fixedly connected to the slide frame (6), and a water collecting box (12) is placed on the support seat (1); The positioning structure (7) comprises a handle (701) and a slide plate (702); two slide plates (702) are slidably connected to the slide frame (6); a handle (701) is fixedly connected between the two slide plates (702); a first guide groove (703) is provided on the slide plate (702); two slide bars (705) are slidably connected to the slide frame (6); a first guide shaft (704) is fixedly connected to the bottom end of the slide bar (705); an end of the first guide shaft (704) extends to the inside of the first guide groove (703) and slides between the slide plate (702). The sliding rod (705) is rotatably connected to a rotating rod (706), one end of which is fixedly connected to a positioning plate (707), the rotating rod (706) is fixedly connected to a connecting rod (708), the connecting rod (708) is fixedly connected to a second guide shaft (709), the sliding frame (6) is fixedly connected to a connecting plate (711), a second guide groove (710) is provided on the connecting plate (711), one end of the second guide shaft (709) extends to the inside of the second guide groove (710) and is slidably connected to the connecting plate (711).

2. The semiconductor wafer edge grinding device according to claim 1, characterized in that: The slide plate (702) is fixedly connected with a spring (712), and one end of the spring (712) abuts against the slide frame (6).

3. The semiconductor wafer edge grinding device according to claim 1, characterized in that: One end of the second guide groove (710) is arranged obliquely, and the other end of the second guide groove (710) is arranged horizontally.

4. The semiconductor wafer edge grinding device according to claim 1, characterized in that: The positioning plate (707) is in a V-shaped structure as a whole, and the bottom end of the sliding rod (705) is in a dovetail-shaped structure.

5. The semiconductor wafer edge grinding device according to claim 1, characterized in that: The placement structure (8) comprises a suction cup (801) and a third gear (802); the suction cup (801) is rotatably connected to the slide (6); the third gear (802) is fixedly connected to the suction cup (801); a third motor (805) is installed on the slide (6); a fourth gear (804) is fixedly connected to the output shaft of the third motor (805); and the third gear (802) is meshed with the fourth gear (804).

6. The semiconductor wafer edge grinding device according to claim 1, characterized in that: The mounting structure (2) comprises a first motor (201) and a rotating disk (202); the first motor (201) is mounted on the support seat (1); the rotating disk (202) is rotatably connected to the support seat (1); the output shaft of the first motor (201) is fixedly connected to the rotating disk (202); four mounting shafts (203) are rotatably connected to the rotating disk (202); bolts (204) are threadedly connected to the mounting shafts (203); a pressing plate (205) abuts against the bolts (204) and the rotating disk (202); a first gear (206) is fixedly connected to the mounting shaft (203); a grinding wheel (3) is engaged with the mounting shaft (203); and the pressing plate (205) abuts against the grinding wheel (3).

7. The semiconductor wafer edge grinding device according to claim 6, characterized in that: The four installation shafts (203) are distributed in a circular array about the middle of the turntable (202), and the width of the cross section at one end of the installation shaft (203) is greater than the width of the cross section at the other end.

8. The semiconductor wafer edge grinding device according to claim 6, characterized in that: The driving structure (4) comprises a second motor (401) and a second gear (402); the second motor (401) is mounted on the support seat (1); the second gear (402) is fixedly connected to the output shaft of the second motor (401); the second gear (402) is meshed with one of the first gears (206).

9. The semiconductor wafer edge grinding device according to claim 1, characterized in that: The protective structure (5) comprises a protective cover (501) and a baffle (502); the protective cover (501) is fixedly connected to the support seat (1); the baffle (502) is rotatably connected to the protective cover (501); one end of the baffle (502) extends to the outside of the protective cover (501).

10. The semiconductor wafer edge grinding device according to claim 1, characterized in that: The cooling structure (9) comprises a support frame (901) and a bamboo tube (902); the support frame (901) is fixedly connected to the support seat (1); two bamboo tubes (902) are fixedly connected to the support frame (901); and a nozzle (903) is installed at one end of the bamboo tube (902).

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