Semiconductor lens processing method and processing device

Abstract

The invention discloses a semiconductor lens processing method and device, and the method comprises the steps: respectively obtaining the minimum lens edge consumption thickness of a concave surface and a convex surface of a semiconductor lens processed by a machine tool until the concave surface and the convex surface meet the appearance requirement of the lens based on the processing capability of the machine tool; according to the method, based on the minimum consumption thickness of the edge of the lens and the concave surface curvature and the convex surface curvature of the semiconductor lens, the center consumption thickness of the lens corresponding to the minimum consumption thickness of the edge of the lens is determined, so that the corresponding center thickness allowance can be reserved in the accurate grinding stage according to the processing requirements of the concave surface and the convex surface of the semiconductor lens; synchronous control over the lens appearance and the lens center thickness is achieved, so that the quality of the machined semiconductor lens is guaranteed, the situation that the semiconductor lens needs to be corrected for the second time or the lens is scrapped due to the fact that dislocation of the lens appearance and the center thickness meets the requirement is avoided, and the lens machining efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor lens processing, and particularly relates to a semiconductor lens processing method and a processing device. Background Art

[0002] Due to its unique optical properties, such as low dispersion and low refractive index, calcium fluoride crystals are widely used in the manufacture of various optical components, including lenses, prisms, windows, and substrate materials for optical coatings. It has a wide transmission wavelength range, from ultraviolet light (about 157 nm) to the far-infrared region (about 8 - 10 μm), and even up to about 12 μm. Therefore, it is widely used in high-precision optical systems, including in military, aerospace, and other fields such as ultraviolet lithography technology, infrared optical systems, and high-power lasers. In particular, when processing the substrate in optical cold processing, it is necessary to cooperate to obtain high-precision dimensions and appearance. Due to the special nature of its material during cold processing, including low hardness, fragility, and temperature sensitivity, during the processing, good control of the appearance and thickness is required to indirectly obtain lenses with high-precision dimensions.

[0003] Usually, when cold-polishing lenses to obtain other index requirements and appearance, a certain amount of redundant lens thickness is consumed. Generally, the thickness at the center of the lens is measured as the standard, but the consumption relationship between the edge and the center thickness cannot be accurately calculated, resulting in an uncertain consumption of the entire curvature surface of the lens, making the appearance and thickness of the lens misaligned and meeting the requirements, resulting in the need to repeatedly correct the lens, affecting the processing efficiency, and in severe cases, resulting in the scrapping of the lens thickness dimension. Summary of the Invention

[0004] Technical Objective: Aiming at the deficiencies in the existing semiconductor lens processing, the present invention discloses a semiconductor lens processing method and a processing device that can simultaneously ensure the processing thickness and appearance of the lens and improve the lens processing efficiency.

[0005] Technical Solution: To achieve the above technical objective, the present invention adopts the following technical solution: A semiconductor lens processing method, comprising the steps of: S01. Based on the processing capacity of the machine tool, respectively obtain the minimum consumption thickness of the lens edge when the concave and convex surfaces of the semiconductor lens are polished to the surface that meets the appearance requirements of the lens; S02. Based on the minimum consumption thickness of the lens edge and the concave curvature and convex curvature of the semiconductor lens, determine the center consumption thickness of the lens corresponding to the minimum consumption thickness of the lens edge. The center consumption thickness of the lens is the change in the center thickness of the semiconductor lens caused by meeting the appearance requirements when polishing the concave or convex surface of the semiconductor lens; S03. Determine the processing size of the semiconductor lens in the previous fine grinding process before polishing according to the determined center consumption thickness of the lens; S04. After fine grinding is completed, use a machine tool to polish the concave and convex surfaces of the semiconductor lens, so as to achieve the required center thickness of the lens while completing the surface profile processing of the semiconductor lens.

[0006] Preferably, in step S02 of the present invention, the process of determining the center consumption thickness of the lens corresponding to the minimum consumption thickness at the lens edge includes: establishing a semiconductor lens profile model based on the concave curvature, convex curvature, and lens diameter of the semiconductor lens, and translating the concave and convex surfaces of the semiconductor lens profile along the central axis direction of the lens according to the minimum consumption thickness at the lens edge corresponding to the machining of the concave and convex surfaces of the semiconductor lens by the machine tool, so that the distance between the corresponding contour lines before and after translation reaches the value of the minimum consumption thickness at the corresponding lens edge, and obtaining the distance of the lens center position based on the positions of the contour lines before and after translation. The distance of the lens center position on the semiconductor profile is the center consumption thickness of the lens.

[0007] Preferably, the semiconductor lens profile model of the present invention uses the sectional contour line centered on the semiconductor lens.

[0008] Preferably, in step S03 of the present invention, when determining the machining size of the semiconductor lens in the fine grinding process, the center thickness of the semiconductor lens after fine grinding is the sum of the target center thickness and the center consumption thickness of the lens.

[0009] The present invention discloses a semiconductor lens processing device, which uses the above semiconductor lens processing method to process the lens, including a concave grinding tool and a convex grinding tool for grinding and polishing the concave and convex surfaces of the semiconductor lens. The concave grinding tool and the convex grinding tool are respectively connected to the main shaft of the machine tool through corresponding handles. A fixture for clamping and fixing the semiconductor lens is correspondingly arranged above the concave grinding tool and the convex grinding tool. The semiconductor lens is finely ground and polished by replacing the material between the mating surfaces of the semiconductor lens and the corresponding grinding tool. The materials include diamond pellets and polyurethane polishing materials with different particle sizes.

[0010] Preferably, the fixture of the present invention includes a convex fixture and a concave fixture. Both the convex fixture and the concave fixture have clamping grooves that match the clamping surfaces of the semiconductor lens. A pressure mechanism for applying pressure to the corresponding fixture to press the semiconductor lens tightly is arranged on the side of the convex fixture and the concave fixture facing away from the semiconductor lens.

[0011] Preferably, the pressure mechanism of the convex fixture of the present invention uses an iron head pen to cooperate with a V-shaped groove opened at the center of the back of the convex fixture to press the convex fixture. The opening position of the V-shaped groove corresponds to the position of the central axis of the semiconductor lens clamped by the convex fixture.

[0012] Preferably, the pressure mechanism of the concave fixture of the present invention includes a pressure head coaxially arranged with the center of the concave fixture. A pressure head groove is provided on the side of the pressure head close to the concave fixture. A protrusion for maintaining the coaxial state of the pressure head and the concave fixture is correspondingly provided on the concave fixture at the mating surface with the pressure head groove. A rubber ring is provided between the mating surfaces of the protrusion and the pressure head groove for filling and sealing.

[0013] Beneficial effects: A semiconductor lens processing method and a processing device disclosed by the present invention have the following beneficial effects: 1. Based on the processing capacity of the machine tool, the present invention determines the minimum consumption thickness of the lens edge for semiconductor lens processing, and determines the influence of the polishing process of the lens surface type on the center thickness of the semiconductor lens based on the minimum consumption thickness of the lens edge. Thus, corresponding center thickness allowances can be reserved according to the processing requirements of the concave and convex surfaces of the semiconductor lens in the fine grinding stage, realizing the synchronous control of the lens appearance and the lens center thickness, thereby ensuring the quality of the processed semiconductor lens and avoiding the situation where the appearance and the center thickness are misaligned and meet the requirements, resulting in the need to correct the semiconductor lens twice or scrapping the lens, and improving the lens processing efficiency; The misalignment meeting the requirements means that only one of the appearance and the center thickness of the semiconductor lens meets the requirements, that is, when the appearance of the lens is processed to meet the required accuracy, there is a deviation between the center thickness of the semiconductor lens and the design value, or when polishing is performed according to the center thickness of the semiconductor lens, the surface accuracy of the polishing process does not meet the appearance requirements of the semiconductor lens.

[0014] 2. By establishing a semiconductor lens contour model and moving the contour line according to the required minimum consumption thickness of the lens edge, the present invention can intuitively obtain accurate center consumption thickness, providing an accurate data source for semiconductor lens processing. At the same time, complex calculations are not required, and only the corresponding contour model parameters need to be adjusted according to the processing requirements of the semiconductor lens and the processing capacity of the machine tool.

[0015] 3. The semiconductor processing device of the present invention performs fine grinding and polishing of the concave and convex surfaces of the semiconductor lens through a grinding tool. Using the same grinding tool can ensure the consistency of the surface types of the semiconductor lenses processed in the fine grinding stage and the polishing stage, thus facilitating the control of the polishing amount on the lens surface.

[0016] 4. The convex fixture and the concave fixture of the present invention are both provided with grooves matching the corresponding semiconductor lens surface types, which can ensure the stability of the lens position during lens processing, thereby ensuring the coaxiality of the concave and convex surfaces of the processed semiconductor lens.

[0017] 5. The pressure mechanism of the concave fixture of the present invention utilizes the cooperation between the pressure head groove of the pressure head and the protrusion of the concave fixture, and fills the rubber ring to ensure the stability of the mating surface, which can ensure the stable movement of the lens during lens processing and ensure the processing quality. Brief Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art.

[0019] Figure 1 It is a schematic diagram of processing a semiconductor lens with a concave grinding tool according to the present invention; Figure 2 It is a schematic diagram of processing a semiconductor lens with a convex grinding tool according to the present invention; Figure 3 It is a structural diagram of the semiconductor lens according to the present invention; Wherein, 1 - semiconductor lens, 2 - concave grinding tool, 3 - convex grinding tool, 4 - handle, 5 - convex fixture, 6 - concave fixture, 7 - iron head pen, 8 - V-shaped groove, 9 - pressure head, 10 - pressure head groove, 11 - protrusion, 12 - rubber ring. Detailed Embodiment

[0020] Now, reference will be made in detail to the embodiments of the present disclosure, one or more examples of which are set forth below. Each embodiment and example is provided by way of explanation of the apparatus, composition, and materials of the present disclosure, and not by way of limitation. On the contrary, the following description provides a convenient illustration for implementing the exemplary embodiments of the present disclosure. In fact, those skilled in the art will appreciate that various modifications and variations can be made within the teachings of the present disclosure without departing from the scope or spirit of the present disclosure.

[0021] The present invention discloses a method for processing a semiconductor lens, including the steps: S01. Based on the processing capacity of the machine tool, respectively obtain the minimum consumption thickness of the lens edge when the concave and convex surfaces of the semiconductor lens are polished by the machine tool to a surface that meets the appearance requirements of the lens; The processing capacity of the machine tool is the amount of lens grinding required to polish the concave and convex surfaces of the semiconductor lens to meet the corresponding processing requirements according to the surface profile processing requirements of the semiconductor lens, which depends on the maximum damage layer caused by the previous fine grinding process to the lens surface. Since the processing amount at the edge position of the lens is the smallest, therefore, in the present invention, the amount of lens grinding is characterized by the consumption thickness at the edge position of the lens; the machine tool uses the change amount of the lens edge thickness corresponding to the minimum grinding amount that can achieve the processing requirements of the corresponding semiconductor lens as the minimum consumption thickness of the lens edge, and generally directly uses the depth of the maximum damage layer of the lens surface during fine grinding by the machine tool.

[0022] S02. Based on the minimum consumption thickness of the lens edge, the concave curvature and the convex curvature of the semiconductor lens, determine the lens center consumption thickness corresponding to the minimum consumption thickness of the lens edge. The lens center consumption thickness is the change in the center thickness of the semiconductor lens caused by meeting the appearance requirements of the lens during the polishing process of the concave or convex surface of the semiconductor lens.

[0023] The last step of the surface processing of the semiconductor lens is the polishing process. The concave curvature and the convex curvature of the semiconductor lens do not change before and after polishing. Therefore, the corresponding change in the lens center position can be obtained according to the movement of the concave and convex contour lines of the semiconductor lens caused by polishing. This change amount is the lens center consumption thickness caused by the polishing process of the concave and convex surfaces of the semiconductor lens.

[0024] In the embodiments of the present invention, in order to conveniently determine the lens center consumption thickness and meet the processing requirements of different types of machine tools for semiconductor lenses, the process of determining the lens center consumption thickness corresponding to the minimum consumption thickness of the lens edge includes: establishing a semiconductor lens contour model based on the concave curvature, convex curvature, and lens diameter of the semiconductor lens. According to the minimum consumption thickness of the lens edge corresponding to the concave and convex surfaces of the semiconductor lens processed by the machine tool, translate the concave and convex surfaces of the semiconductor lens contour along the central axis direction of the lens so that the distance between the corresponding contour lines before and after translation reaches the corresponding minimum consumption thickness value of the lens edge, and obtain the distance of the lens center position based on the positions of the contour lines before and after translation. The distance of the lens center position on the semiconductor contour is the lens center consumption thickness.

[0025] The establishment of the semiconductor lens contour model can be carried out using existing mature drawing software, and it is not necessary to generate a complete semiconductor lens model. Only the cross-sectional contour line of the semiconductor lens center is required to confirm the lens center consumption thickness. After establishing the semiconductor lens contour model, by directly inputting the corresponding minimum consumption thickness of the lens edge, it is possible to adapt to various machine tools with different processing capabilities, and correspondingly adjust the processing parameters in the fine grinding stage to ensure sufficient margin for polishing, so as to achieve synchronous control of the appearance and center thickness of the semiconductor lens.

[0026] S03. Determine the processing size of the semiconductor lens in the previous fine grinding process before polishing according to the determined lens center consumption thickness; make the center thickness of the semiconductor lens after fine grinding be the sum of the target center thickness and the lens center consumption thickness.

[0027] S04. After fine grinding is completed, use the machine tool to polish the concave and convex surfaces of the semiconductor lens. After the concave and convex surfaces of the semiconductor lens are processed, under the condition of meeting the appearance requirements of the lens, the center thickness of the semiconductor lens reaches the requirement synchronously; while making the lens center thickness reach the requirement, complete the surface appearance processing of the semiconductor lens.

[0028] To implement the above processing method, the present invention also discloses a semiconductor lens processing device, which uses the above semiconductor lens processing method to process lenses. As Figures 1 - 3 shown, it includes a concave grinding tool 2 and a convex grinding tool 3 for grinding and polishing the concave and convex surfaces of the semiconductor lens 1. The concave grinding tool 2 and the convex grinding tool 3 are respectively connected to the machine tool spindle through corresponding handles 4. A fixture for clamping and fixing the semiconductor lens 1 is correspondingly arranged above the concave grinding tool 2 and the convex grinding tool 3. The semiconductor lens is finely ground and polished by replacing the material between the mating surfaces of the semiconductor lens 1 and the corresponding grinding tool. The materials include diamond pellets with different particle sizes and polyurethane polishing materials. In the fine grinding stage, diamond pellets of 1200# and 1800# are successively used for fine grinding the semiconductor lens. In the polishing stage, polyurethane polishing materials or other materials capable of polishing the lens surface are used for polishing.

[0029] In the processing device of the present invention, the same grinding tools are used to process the concave and convex surfaces of the semiconductor lens in the fine grinding and polishing stages, which can ensure that during the transition from the fine grinding stage to the polishing stage, the curvature of the semiconductor lens is not affected by the replacement of the grinding tool or the processing equipment, thereby maintaining the consistency of the two processes, so that the lens surface shape is only affected by the grinding amount and will not affect the final control accuracy of the central thickness of the semiconductor lens due to the curvature deviation generated by the fine grinding and polishing processes. The fixture of the present invention includes a convex fixture 5 and a concave fixture 6. The convex fixture 5 and the concave fixture 6 both have clamping grooves that match the clamping surfaces of the semiconductor lens 1. A pressure mechanism for applying pressure to the corresponding fixture to tightly press the semiconductor lens 1 is arranged on the side of the convex fixture 5 and the concave fixture 6 facing away from the semiconductor lens 1. The fixtures of the present invention all maintain stable clamping and fixing of the semiconductor lens during the processing by setting clamping grooves, fully ensuring the consistency of the processing axes of the concave and convex surfaces of the semiconductor lens.

[0030] The pressure mechanism of the convex fixture 5 uses an iron head pen 7 to cooperate with a V-shaped groove 8 opened at the center of the back of the convex fixture 5 to press the convex fixture 5. The opening position of the V-shaped groove 8 corresponds to the central axis position of the semiconductor lens 1 clamped by the convex fixture 5.

[0031] The pressure mechanism of the concave fixture 6 includes a pressure head 9 coaxially arranged with the center of the concave fixture 6. A pressure head groove 10 is arranged on the side of the pressure head 9 close to the concave fixture 6. The concave fixture 6 is correspondingly provided with a protrusion 11 for maintaining the coaxial state of the pressure head 9 and the concave fixture 6 at the mating surface of the pressure head groove 10, and a rubber ring 12 is arranged for filling between the mating surfaces of the protrusion 11 and the pressure head groove 10.

[0032] The following uses a specific processing case to illustrate the lens processing method of the present invention.

[0033] Assume that the diameter of the semiconductor lens is Φ = 468.01, R1 = 267.46, R2 = 237.96, h = 80.62, and the units are all millimeters.

[0034] R1 is the radius of curvature corresponding to the concave surface curvature of the semiconductor lens, R2 is the radius of curvature corresponding to the convex surface curvature of the semiconductor lens, and h is the central thickness of the semiconductor lens.

[0035] When setting the edge thickness of the R1 = 267.46 surface to polish and remove the thickness allowance h1.2 = 0.03, the central removal thickness allowance h1.1 = 0.05, where the value of h1.2 depends on the maximum damage layer depth of the grinding tool for the curvature surface of the semiconductor lens during fine grinding.

[0036] When setting the edge thickness of the R2 = 237.96 surface to polish and remove the thickness allowance h2.2 = 0.03, the central removal thickness allowance h2.1 = 0.18. The central consumption thickness of the lens is 0.05 + 0.18 = 0.23. When the finished lens thickness h = 80.62, the thickness of the lens before polishing is h = 80.62 + 0.23 = 80.85.

[0037] In the embodiment of the present invention, the thickness allowances polished and removed from the concave and convex surfaces of the semiconductor lens are set in a consistent form, but this does not limit the equivalent relationship between the concave surface thickness allowance and the convex surface thickness allowance. Those skilled in the art should know that in actual processing, due to different grinding tools used for the concave and convex surfaces of the semiconductor lens, there may be differences in the thickness allowances that need to be removed during corresponding polishing. Just adjust the values of h1.2 and h2.2 according to the actual situation, which does not affect the implementation of the solution of the present invention.

[0038] In the fine grinding process, it is necessary to control the fine grinding process according to the size of the lens blank so that the size of the semiconductor lens product after fine grinding meets the lens size requirements calculated above. The control of the fine grinding amount for the curvature surface of the lens itself is a mature technology. It is only necessary to control the fine grinding amounts for the concave and convex surfaces of the semiconductor lens, which will not be elaborated in the present invention. It is preferred to use the processing device of the present invention to avoid deviations in the curvature of the lens curvature surface between the two processes due to the use of different grinding tools in the fine grinding and polishing processes, which affects the final control accuracy of the central thickness of the semiconductor lens.

[0039] The above is only the preferred embodiment of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A method for processing a semiconductor lens, characterized in that: Includes steps: S01. Based on the processing capability of the machine tool, the minimum consumed thickness of the edge of the lens when the machine tool polishes the concave and convex surfaces of the semiconductor lens to a surface that meets the requirements of the lens appearance is obtained respectively; S02. Determine the lens center consumption thickness corresponding to the minimum lens edge consumption thickness based on the minimum lens edge consumption thickness and the concave and convex curvatures of the semiconductor lens. The lens center consumption thickness is the change in the semiconductor lens center thickness caused by polishing the concave or convex surface of the semiconductor lens to meet the lens appearance requirements; S03, determining the processing size of the semiconductor lens in the pre-polishing fine grinding process according to the determined lens center consumption thickness; S04. After fine grinding is completed, the concave and convex surfaces of the semiconductor lens are polished using a machine tool to make the center thickness of the lens reach the requirement while completing the surface appearance processing of the semiconductor lens.

2. A semiconductor lens processing method according to claim 1, characterized in that: In step S02, the process of determining the lens center consumption thickness corresponding to the minimum consumption thickness of the lens edge includes: establishing a semiconductor lens contour model according to the concave curvature, convex curvature and lens diameter of the semiconductor lens, and according to the minimum consumption thickness of the lens edge corresponding to the concave and convex surfaces of the semiconductor lens processed by machine tools, translating the concave and convex surfaces of the semiconductor lens contour along the central axis direction of the lens so that the spacing between the corresponding contour lines before and after the translation reaches the corresponding minimum consumption thickness value of the lens edge, and obtaining the lens center position distance based on the contour line position before and after the translation. The lens center position distance on the semiconductor contour is the lens center consumption thickness.

3. A semiconductor lens processing method according to claim 2, characterized in that: The semiconductor lens contour model uses a cross-sectional contour line centered at the semiconductor lens.

4. The method for processing a semiconductor lens according to claim 1, characterized in that: In step S03, when determining the processing size of the semiconductor lens in the fine grinding process, the center thickness of the semiconductor lens after fine grinding is made to be the sum of the target center thickness and the consumed thickness of the lens center.

5. A semiconductor lens processing device, using the semiconductor lens processing method according to any one of claims 1 to 4, characterized in that: The processing device comprises a concave grinding tool (2) and a convex grinding tool (3) for grinding and polishing the concave surface and convex surface of a semiconductor lens (1); the concave grinding tool (2) and the convex grinding tool (3) are respectively connected to a machine tool spindle via corresponding handles (4); a clamp for clamping and fixing the semiconductor lens (1) is correspondingly arranged above the concave grinding tool (2) and the convex grinding tool (3); the semiconductor lens is finely ground and polished by replacing the material between the matching surface of the semiconductor lens (1) and the corresponding grinding tool; the material comprises diamond pellets with different particle sizes and polyurethane polishing material.

6. The semiconductor lens processing device according to claim 5, characterized in that: The clamp comprises a convex clamp (5) and a concave clamp (6), each of the convex clamp (5) and the concave clamp (6) having a clamping groove matched with a clamping surface of the semiconductor lens (1), and a pressure mechanism for applying pressure to the corresponding clamp to press the semiconductor lens (1) is provided on the side of the convex clamp (5) and the concave clamp (6) facing away from the semiconductor lens (1).

7. The semiconductor lens processing device according to claim 6, characterized in that: The pressure mechanism of the convex clamp (5) uses an iron stylus (7) in cooperation with a V-shaped groove (8) provided at the center of the back side of the convex clamp (5) to press the convex clamp (5), and the opening position of the V-shaped groove (8) corresponds to the central axis position of the semiconductor lens (1) clamped by the convex clamp (5).

8. The semiconductor lens processing device according to claim 6, characterized in that: The pressure mechanism of the concave clamp (6) comprises a pressure head (9) coaxially arranged with the center of the concave clamp (6); a pressure head groove (10) is arranged on a side of the pressure head (9) close to the concave clamp (6); a protrusion (11) for maintaining the coaxial state of the pressure head (9) and the concave clamp (6) is arranged at a matching surface with the pressure head groove (10); and a rubber ring (12) is arranged between the matching surfaces of the protrusion (11) and the pressure head groove (10) for filling and sealing.

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