Monitoring device for monitoring thickness of silicon dioxide in real time and using method thereof

By designing a monitoring device that monitors the thickness of silicon dioxide in real time, using technical means such as electric telescopic rods, hydraulic cylinders, brushes, rotating lift plates and sponges, the problems of rangefinder collision, dust impact, measurement errors and laser rangefinder pollution in existing devices are solved, achieving higher measurement accuracy and device protection effect.

CN120120975AActive Publication Date: 2025-06-10JIANGSU SEMICON CHAMPION MICROELECTRONICS CO LTD
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Patent Information

Application Number
CN202510591937.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-05-09
Publication Date
2025-06-10
Estimated Expiration
2045-05-09

AI Technical Summary

Technical Problem

The existing silicon dioxide thickness measurement device has problems such as collision damage between the rangefinder and the glass plate, dust affecting the measurement accuracy, inability to detect measurement errors in time, and the laser rangefinder is easily contaminated when it is vacant.

Method used

A monitoring device for real-time monitoring of the thickness of silicon dioxide is designed, using electric telescopic rods and hydraulic cylinders for buffering, using brushes to clean up dust, and changing the positions of multiple laser rangefinders by rotating the lift plate, and using a sponge to protect the laser rangefinder when idle.

Benefits of technology

It effectively reduces the collision damage between the laser rangefinder and the silica plate, improves the measurement accuracy, can detect measurement errors in time, and protects the laser rangefinder when vacant to avoid contamination and damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention discloses a monitoring device for monitoring the thickness of silicon dioxide in real time and a using method thereof, and relates to the technical field of silicon dioxide thickness monitoring, the monitoring device comprises a first plate body, a right-angle plate and a first electric telescopic rod, the top of the first plate body is provided with a controller component, and the top of the first plate body is provided with the right-angle plate; a first electric telescopic rod is installed at the top of the right-angle plate, a first moving plate is installed at the output end of the first electric telescopic rod, a first hydraulic cylinder is installed at the top of the first moving plate, a first lifting plate is installed at the output end of the first hydraulic cylinder, and a rotary thickness measuring mechanism is arranged at the bottom of the first lifting plate. When the second laser range finder moves downwards to measure the thickness of a silicon dioxide plate, contact between the second laser range finder and silicon dioxide can be buffered through the first spring, and damage to the second laser range finder when the second laser range finder collides with the silicon dioxide is reduced; the thickness measuring range can be increased by moving the second laser range finder back and forth to measure the thickness of the silicon dioxide plate.
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Description

Technical Field

[0001] The present invention relates to the technical field of silica thickness monitoring, and specifically to a monitoring device for real-time monitoring of silica thickness and its usage method. Background Art

[0002] The main material of glass is silica, and silica plates are a type of transparent plate. Monitoring the thickness of silica plates can be achieved by placing the plate on a substrate that can reflect light, then closely attaching a laser rangefinder to the top of the plate, and subsequently using the laser rangefinder to measure the thickness of the silica plate.

[0003] The defects of existing silica thickness measuring devices are as follows: 1. The prior art KR20070100618A discloses a device for measuring the thickness of a glass substrate. This technology does not have a structure for buffering the collision between the rangefinder and the glass plate. When the rangefinder and the glass approach each other, the rangefinder and the plate are prone to being damaged due to contact impact when approaching. Therefore, a monitoring device for real-time monitoring of silica thickness that can reduce impact damage when the rangefinder and the plate approach each other is needed to solve this problem.

[0004] 2. The prior art JP2007298504A discloses a thickness measuring device for a glass substrate. This technology does not have a structure for cleaning the dust between the laser rangefinder and the glass plate. When dust exists between the laser rangefinder and the glass plate, it is easy to affect the measurement accuracy of the laser rangefinder for the plate. Therefore, a monitoring device for real-time monitoring of silica thickness that can clean the dust between the laser rangefinder and the plate is needed to solve this problem.

[0005] 3. The prior art US4848913A discloses a hollow glass thickness measuring device. This technology does not have a structure for swapping the positions of multiple laser rangefinders to measure the thickness of the glass plate. When one laser rangefinder has a measurement error, it is impossible to promptly determine whether the rangefinder has a measurement error. Therefore, a monitoring device for real-time monitoring of silica thickness that can detect whether other laser rangefinders have measurement errors by swapping the positions of multiple laser rangefinders is needed to solve this problem.

[0006] 4. The prior art CN118533031B discloses a glass thickness measuring device. This technology does not have a structure for protecting the laser rangefinder during idle time. The laser rangefinder is easily contaminated by dust in the air, resulting in dust accumulation on the end face of the laser rangefinder or the laser rangefinder being scratched. Therefore, a monitoring device for real-time monitoring of silica thickness that can protect components such as the laser rangefinder during idle time is needed to solve this problem. Summary of the Invention

[0007] An object of the present application is to provide a monitoring device for real-time monitoring of the thickness of silicon dioxide and a method for using the same, which can solve the technical problems proposed in the prior art.

[0008] To achieve the above object, the present invention provides the following technical solutions: A monitoring device for real-time monitoring of the thickness of silicon dioxide, including a first plate body, a right-angle plate, and a first electric telescopic rod. A controller component is installed on the top of the first plate body. A right-angle plate is installed on the top of the first plate body. A first electric telescopic rod is installed on the top of the right-angle plate, and the first electric telescopic rod is electrically connected to the controller component. A first moving plate is installed at the output end of the first electric telescopic rod. A first hydraulic cylinder is installed on the top of the first moving plate, and the first hydraulic cylinder is electrically connected to the controller component. A first lifting plate is installed at the output end of the first hydraulic cylinder. A rotating thickness measurement mechanism is arranged at the bottom of the first lifting plate; A storage frame is installed on the back of the right-angle plate.

[0009] Preferably, a first motor is symmetrically installed on the top of the first plate body, and the first motor is electrically connected to the controller component. A lead screw is installed at the output end of the first motor. Support blocks are symmetrically installed on the top of the first plate body, and the support blocks are located outside the lead screw. A transport plate is installed on the outside of the lead screw.

[0010] Preferably, a reflection block is installed on the front of the transport plate. A first laser rangefinder is installed on the top of the first plate body, and the first laser rangefinder is located on one side of the reflection block, and the first laser rangefinder is electrically connected to the controller component.

[0011] Preferably, support plates are symmetrically installed on the front of the right-angle plate, and the support plates are located below the first moving plate.

[0012] Preferably, the rotating thickness measurement mechanism includes a second motor and a rotating lifting plate. The second motor is installed at the bottom of the first lifting plate, and the second motor is electrically connected to the controller component. The rotating lifting plate is installed at the output end of the second motor.

[0013] Preferably, the rotating thickness measurement mechanism further includes a first frame body, a first spring, a first pressure sensor, a second plate body, and a second laser rangefinder. A plurality of first frame bodies are installed at the bottom of the rotating lifting plate. A first spring is installed on the inner wall of the top of the first frame body. One end of the first spring is installed with a first pressure sensor, and the first pressure sensor is electrically connected to the controller component. The bottom input end of the first pressure sensor is installed with a second plate body. A second laser rangefinder is installed at the bottom of the second plate body, and the second laser rangefinder is electrically connected to the controller component.

[0014] Preferably, a second frame is installed on the front surface of the first frame. A second spring is installed on the inner wall of the top of the second frame. One end of the second spring is installed with a second pressure sensor, which is electrically connected to the controller component. The bottom input end of the second pressure sensor is installed with a second lifting plate. Block plates are symmetrically installed on both sides of the second lifting plate. An electric telescopic rod two is installed on the front surface of the block plate, and the electric telescopic rod two is electrically connected to the controller component. The output end of the electric telescopic rod two is installed with a moving rod, and brushes are symmetrically installed at the top and bottom of the moving rod.

[0015] Preferably, two hydraulic cylinders are symmetrically installed on the back surface of the storage frame. The two hydraulic cylinders are electrically connected to the controller component. The output end of the two hydraulic cylinders is installed with a second moving plate, and the front surface of the second moving plate penetrates through the front surface of the right-angled plate. A sponge is installed on the top of the second moving plate.

[0016] Preferably, the usage method of the monitoring device for real-time monitoring of the thickness of silicon dioxide is as follows: S1. The silicon dioxide plate is placed above the transport plate. The transport plate transports the silicon dioxide plate to below the rotating lifting plate. The rotating lifting plate moves downward so that the second laser rangefinder contacts the top of the silicon dioxide plate. S2. Then, the second laser rangefinder measures the thickness of the silicon dioxide plate. Subsequently, the rotating lifting plate moves upward. Then, after the rotating lifting plate rotates 180 degrees, the rotating lifting plate moves downward again so that the second laser rangefinder measures the thickness of the silicon dioxide plate. S3. After the measurement is completed, the rotating lifting plate moves upward. Then, the second moving plate drives the sponge to move forward. Then, the second laser rangefinder moves downward to contact the sponge to protect the second laser rangefinder.

[0017] Preferably, the following steps are further included in S1: S11. Before the second laser rangefinder contacts the silicon dioxide plate, the brush first contacts the silicon dioxide plate. Then, the brush moves back and forth to clean the dust on the bottom output section of the second laser rangefinder and the top of the silicon dioxide plate.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows: When the second laser rangefinder moves downward to measure the thickness of the silicon dioxide plate in the present invention, the first spring can buffer the contact between the second laser rangefinder and the silicon dioxide, reducing the damage caused by the collision between the second laser rangefinder and the silicon dioxide. Measuring the thickness of the silicon dioxide plate by moving the second laser rangefinder back and forth can increase the thickness measurement range.

[0019] In the present invention, before the second laser rangefinder contacts the silicon dioxide plate, the brush first contacts the silicon dioxide plate. Then, the brush moves back and forth to clean the dust on the bottom output section of the second laser rangefinder and the top of the silicon dioxide plate, ensuring the accuracy of the thickness measurement of the silicon dioxide plate by the second laser rangefinder.

[0020] After the present invention measures the thickness of the two silica plates with the laser rangefinder two, the lifting plate is then rotated to move upward. Subsequently, after the lifting plate is rotated 180 degrees, the lifting plate is rotated to move downward again so that the laser rangefinder two measures the thickness of the silica plates. Thus, it is possible to determine whether there is an error in the measurement of the silica plates based on whether the measurement data of the silica plates before and after the rotation of the laser rangefinder two is consistent, and further facilitate the determination of whether the laser rangefinder two is damaged.

[0021] After the measurement is completed in the present invention, the lifting plate is rotated to move upward, then the moving plate two drives the sponge to move forward, and then the laser rangefinder two moves downward to contact the sponge to protect the laser rangefinder two from dust or collision damage. Description of the Drawings

[0022] Figure 1 is a three-dimensional view of the present invention; Figure 2 is a schematic structural view of the right-angle plate of the present invention; Figure 3 is a schematic structural view of the rotating lifting plate of the present invention; Figure 4 is a schematic structural view of the frame one and the frame two of the present invention; Figure 5 is a side cross-sectional view of the rotating lifting plate of the present invention; Figure 6 is a side cross-sectional view of the frame one and the frame two of the present invention; Figure 7 is a schematic structural view of the storage frame of the present invention; Figure 8 is a side cross-sectional view of the storage frame of the present invention; Figure 9 is a flowchart of the usage method of the present invention.

[0023] In the figure: 1. Plate one; 2. Controller component; 3. Motor one; 4. Lead screw; 5. Support block; 6. Transport plate; 7. Reflection block; 8. Laser rangefinder one; 9. Right-angle plate; 10. Electric telescopic rod one; 11. Moving plate one; 12. Support plate; 13. Hydraulic cylinder one; 14. Lifting plate one; 15. Motor two; 16. Rotating lifting plate; 17. Frame one; 18. Spring one; 19. Pressure sensor one; 20. Plate two; 21. Laser rangefinder two; 22. Frame two; 23. Spring two; 24. Pressure sensor two; 25. Lifting plate two; 26. Block plate; 27. Electric telescopic rod two; 28. Moving rod; 29. Brush; 30. Storage frame; 31. Hydraulic cylinder two; 32. Moving plate two; 33. Sponge. Detailed Embodiments

[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0025] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly defined and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 、 Figure 5 and Figure 6 An embodiment provided by the present invention: A monitoring device for real-time monitoring of the thickness of silicon dioxide; It includes a first plate body 1, a right-angle plate 9 and a first electric telescopic rod 10. A controller component 2 is installed at the top of the first plate body 1. A right-angle plate 9 is installed at the top of the first plate body 1. Symmetrically installed on the front face of the right-angle plate 9 are support plates 12, and the support plates 12 are located below the first moving plate 11. A first electric telescopic rod 10 is installed at the top of the right-angle plate 9, and the first electric telescopic rod 10 is electrically connected to the controller component 2. The output end of the first electric telescopic rod 10 is installed with a first moving plate 11. A first hydraulic cylinder 13 is installed at the top of the first moving plate 11, and the first hydraulic cylinder 13 is electrically connected to the controller component 2. The output end of the first hydraulic cylinder 13 is installed with a first lifting plate 14. A rotating thickness measuring mechanism is provided at the bottom of the first lifting plate 14. The first plate body 1 can provide an installation position for other components of the device, enabling other components of the device to have a position for installation. The controller component 2 can receive signals from a first laser rangefinder 8, a first pressure sensor 19, a second laser rangefinder 21 and a second pressure sensor 24, and can simultaneously control a first motor 3, the first electric telescopic rod 10, the first hydraulic cylinder 13, a second motor 15, a second electric telescopic rod 27 and a second hydraulic cylinder 31. The right-angle plate 9 can provide an installation position for the first electric telescopic rod 10. The first electric telescopic rod 10 can convert electrical energy into kinetic energy, thereby driving the first moving plate 11 to move back and forth. The first moving plate 11 can drive the first hydraulic cylinder 13, the rotating and lifting plate 16 and the second laser rangefinder 21 to move back and forth through the back-and-forth movement, so that the second laser rangefinder 21 can measure the thickness of the silica plate placed on the transport plate 6 from front to back. The support plates 12 can provide support for the first moving plate 11. The first hydraulic cylinder 13 can convert hydraulic energy into kinetic energy, thereby driving the first lifting plate 14 to move up and down. The first lifting plate 14 can drive the second motor 15 and the second laser rangefinder 21 to move up and down through the up-and-down movement. The rotating thickness measuring mechanism includes a second motor 15 and a rotating and lifting plate 16. The second motor 15 is installed at the bottom of the first lifting plate 14, and the second motor 15 is electrically connected to the controller component 2. The output end of the second motor 15 is installed with a rotating and lifting plate 16. The rotating thickness measuring mechanism further includes a first frame 17, a first spring 18, a first pressure sensor 19, a second plate body 20 and a second laser rangefinder 21. A plurality of first frames 17 are installed at the bottom of the rotating and lifting plate 16. A first spring 18 is installed on the inner wall of the top of the first frame 17. One end of the first spring 18 is installed with a first pressure sensor 19. The first pressure sensor 19 is electrically connected to the controller component 2. The bottom input end of the first pressure sensor 19 is installed with a second plate body 20. A second laser rangefinder 21 is installed at the bottom of the second plate body 20, and the second laser rangefinder 21 is electrically connected to the controller component 2. The second motor 15 can convert electrical energy into kinetic energy, thereby driving the rotating and lifting plate 16 to rotate. The rotating and lifting plate 16 can drive the second laser rangefinder 21 to rotate through the rotation, so that the second laser rangefinder 21 can rotate 180 degrees to measure the thickness of the silica plate, thus facilitating the judgment of whether the measurement result of the second laser rangefinder 21 is incorrect based on the data comparison before and after rotation.The first housing 17 can provide an installation position for the first spring 18, and at the same time can provide protection for the first pressure sensor 19. The first spring 18 can provide buffering for the first pressure sensor 19, thereby reducing the damage suffered by the second laser rangefinder 21 when it moves downward and touches the silica plate. The first pressure sensor 19 can measure the supporting force of the silica plate received by the second laser rangefinder 21. The second plate body 20 can provide an installation position for the second laser rangefinder 21. The second laser rangefinder 21 can measure the thickness of the silica plate by moving downward and contacting the silica plate.

[0028] Please refer to Figure 1 、 Figure 7 and Figure 8 , an embodiment provided by the present invention: a monitoring device for real-time monitoring of the thickness of silica; A storage frame 30 is installed on the back surface of the right-angle plate 9. Hydraulic cylinders two 31 are symmetrically installed on the back surface of the storage frame 30. The hydraulic cylinders two 31 are electrically connected to the controller component 2. The output end of the hydraulic cylinder two 31 is installed with a moving plate two 32, and the front surface of the moving plate two 32 penetrates through the front surface of the right-angle plate 9. A sponge 33 is installed on the top of the moving plate two 32. The storage frame 30 can provide a storage space for the moving plate two 32. The hydraulic cylinders two 31 can convert hydraulic energy into kinetic energy, thereby driving the moving plate two 32 to move back and forth. The moving plate two 32 can drive the sponge 33 to move back and forth through the back-and-forth movement. When the sponge 33 moves forward, it can protect the second laser rangefinder 21 moving downward from dust or collision damage.

[0029] Please refer to Figure 1 , an embodiment provided by the present invention: a monitoring device for real-time monitoring of the thickness of silica; It includes a first motor 3. The first motors 3 are symmetrically installed on the top of the first plate body 1, and the first motors 3 are electrically connected to the controller component 2. The output end of the first motor 3 is installed with a lead screw 4. Support blocks 5 are symmetrically installed on the top of the first plate body 1, and the support blocks 5 are located outside the lead screw 4. A transport plate 6 is installed on the outside of the lead screw 4. A reflection block 7 is installed on the front surface of the transport plate 6. A first laser rangefinder 8 is installed on the top of the first plate body 1, and the first laser rangefinder 8 is located on one side of the reflection block 7, and the first laser rangefinder 8 is electrically connected to the controller component 2. The first motor 3 can convert electrical energy into kinetic energy, thereby driving the lead screw 4 to rotate. The lead screw 4 can drive the transport plate 6 to move left and right through rotation. The transport plate 6 can drive the silica plate placed above the transport plate 6 to move left and right through the left-and-right movement. The support block 5 can provide support for one end of the lead screw 4. The reflection block 7 can reflect the laser emitted by the first laser rangefinder 8, so that the first laser rangefinder 8 can measure the distance between itself and the reflection block 7. The first laser rangefinder 8 can facilitate the controller component 2 to calculate the position of the transport plate 6 by measuring the distance between itself and the reflection block 7.

[0030] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 , an embodiment provided by the present invention: a monitoring device for real-time monitoring of the thickness of silica; It includes a second frame 22. The second frame 22 is installed on the front of the first frame 17. A second spring 23 is installed on the inner wall of the top of the second frame 22. One end of the second spring 23 is installed with a second pressure sensor 24. The second pressure sensor 24 is electrically connected to the controller component 2. The bottom input end of the second pressure sensor 24 is installed with a second lifting plate 25. Two block plates 26 are symmetrically installed on both sides of the second lifting plate 25. An electric telescopic rod two 27 is installed on the front of the block plate 26. And the electric telescopic rod two 27 is electrically connected to the controller component 2. The output end of the electric telescopic rod two 27 is installed with a moving rod 28. Brushes 29 are symmetrically installed on the top and bottom of the moving rod 28. The second frame 22 can provide an installation position for the second spring 23, and at the same time can provide guidance for the second lifting plate 25, so that the second lifting plate 25 can move up and down. The second pressure sensor 24 can measure the supporting force received by the brush 29. The second lifting plate 25 can provide an installation position for the block plate 26. The block plate 26 can provide an installation position for the electric telescopic rod two 27. The electric telescopic rod two 27 can convert electrical energy into kinetic energy, thereby driving the moving rod 28 to move back and forth. The moving rod 28 can drive the brush 29 to move back and forth through the back-and-forth movement. The brush 29 can clean the bottom end face of the second laser rangefinder 21 and the silica plate below through the back-and-forth movement, ensuring that the second laser rangefinder 21 can accurately measure the thickness of the silica plate.

[0031] The usage method of the monitoring device for real-time monitoring of the thickness of silica is as follows: S1. The silica plate is placed above the transport plate 6. The transport plate 6 transports the silica plate to below the rotating lifting plate 16. The rotating lifting plate 16 moves down to make the second laser rangefinder 21 contact the top of the silica plate; S2. Then the second laser rangefinder 21 measures the thickness of the silica plate. Subsequently, the rotating lifting plate 16 moves up. Then, after the rotating lifting plate 16 rotates 180 degrees, the rotating lifting plate 16 moves down again so that the second laser rangefinder 21 measures the thickness of the silica plate; S3. After the measurement is completed, the rotating lifting plate 16 moves up. Then the second moving plate 32 drives the sponge 33 to move forward. Then the second laser rangefinder 21 moves down to contact the sponge 33 to protect the second laser rangefinder 21.

[0032] The following steps are also included in S1: S11. Before the second laser rangefinder 21 touches the silica plate, the brush 29 first touches the silica plate, and then the brush 29 moves back and forth to clean the dust on the bottom output section of the second laser rangefinder 21 and the top of the silica plate.

[0033] Working principle: Before using the monitoring device for real-time monitoring of the thickness of silica, it should be checked whether there are any problems affecting its use. The silica plate is placed above the transport plate 6, and the transport plate 6 transports the silica plate under the rotating lifting plate 16. The rotating lifting plate 16 moves downwards to make the brush 29 first touch the silica plate, and then the brush 29 moves back and forth to clean the dust on the bottom output end face of the second laser rangefinder 21 and the top of the silica plate. Then the second laser rangefinder 21 touches the top of the silica plate, and then the second laser rangefinder 21 measures the thickness of the silica plate. Subsequently, the rotating lifting plate 16 moves upwards. Then, after the rotating lifting plate 16 rotates 180 degrees, the rotating lifting plate 16 moves downwards again to make the second laser rangefinder 21 measure the thickness of the silica plate. After the measurement is completed, the rotating lifting plate 16 moves upwards. Then the second moving plate 32 drives the sponge 33 to move forward. Then the second laser rangefinder 21 moves downwards to touch the sponge 33 to protect the second laser rangefinder 21. Then the transport plate 6 transports the silica plate to one side to complete the monitoring of the thickness of silica.

[0034] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention, and any reference signs in the claims should not be regarded as limiting the claimed rights.

Claims

1. A monitoring device for real-time monitoring of silicon dioxide thickness, characterized in that: The invention comprises a plate body (1), a right-angle plate (9) and an electric telescopic rod (10), wherein a controller component (2) is mounted on the top of the plate body (1), a right-angle plate (9) is mounted on the top of the plate body (1), an electric telescopic rod (10) is mounted on the top of the right-angle plate (9), and the electric telescopic rod (10) is connected to the controller component (2) via an electrical signal, a moving plate (11) is mounted on the output end of the electric telescopic rod (10), a hydraulic cylinder (13) is mounted on the top of the moving plate (11), and the hydraulic cylinder (13) is connected to the controller component (2) via an electrical signal, a lifting plate (14) is mounted on the output end of the hydraulic cylinder (13), and a rotating thickness measuring mechanism is arranged at the bottom of the lifting plate (14); A storage frame (30) is installed on the back side of the right-angle plate (9).

2. A monitoring device for real-time monitoring of silicon dioxide thickness according to claim 1, characterized in that: A motor (3) is symmetrically mounted on the top of the plate body (1), and the motor (3) is electrically connected to the controller component (2); a screw (4) is mounted on the output end of the motor (3); a support block (5) is symmetrically mounted on the top of the plate body (1), and the support block (5) is located on the outside of the screw (4); and a transport plate (6) is mounted on the outside of the screw (4).

3. A monitoring device for real-time monitoring of silicon dioxide thickness according to claim 2, characterized in that: A reflective block (7) is installed on the front of the transport plate (6), a laser rangefinder (8) is installed on the top of the plate body (1), and the laser rangefinder (8) is located on one side of the reflective block (7), and the laser rangefinder (8) is connected to the controller component (2) via an electrical signal.

4. A monitoring device for real-time monitoring of silicon dioxide thickness according to claim 1, characterized in that: A support plate (12) is symmetrically mounted on the front side of the right-angle plate (9), and the support plate (12) is located below the first movable plate (11).

5. A monitoring device for real-time monitoring of silicon dioxide thickness according to claim 1, characterized in that: The rotary thickness measuring mechanism comprises a second motor (15) and a rotary lifting plate (16). The second motor (15) is mounted at the bottom of the first lifting plate (14), and the second motor (15) is connected to the controller component (2) via an electrical signal. The output end of the second motor (15) is provided with a rotary lifting plate (16).

6. A monitoring device for real-time monitoring of silicon dioxide thickness according to claim 5, characterized in that: The rotary thickness measuring mechanism further comprises a frame body (17), a spring body (18), a pressure sensor (19), a plate body (20) and a laser rangefinder (21). A plurality of frame bodies (17) are mounted at the bottom of the rotary lifting plate (16). A spring body (18) is mounted on the top inner wall of the frame body (17). A pressure sensor (19) is mounted at one end of the spring body (18). The pressure sensor (19) is electrically connected to the controller component (2). The plate body (20) is mounted at the bottom input end of the pressure sensor (19). The laser rangefinder (21) is mounted at the bottom of the plate body (20). The laser rangefinder (21) is electrically connected to the controller component (2).

7. A monitoring device for real-time monitoring of silicon dioxide thickness according to claim 6, characterized in that: A second frame (22) is installed on the front of the first frame (17), a second spring (23) is installed on the inner wall of the top of the second frame (22), a second pressure sensor (24) is installed on one end of the second spring (23), the second pressure sensor (24) is connected to the controller component (2) by electrical signals, a second lifting plate (25) is installed on the bottom input end of the second pressure sensor (24), blocks (26) are symmetrically installed on both sides of the second lifting plate (25), a second electric telescopic rod (27) is installed on the front of the block plate (26), and the second electric telescopic rod (27) is connected to the controller component (2) by electrical signals, a moving rod (28) is installed on the output end of the second electric telescopic rod (27), and brushes (29) are symmetrically installed on the top and bottom of the moving rod (28).

8. A monitoring device for real-time monitoring of silicon dioxide thickness according to claim 1, characterized in that: A second hydraulic cylinder (31) is symmetrically mounted on the back of the storage frame (30). The second hydraulic cylinder (31) is electrically connected to the controller component (2). A second moving plate (32) is mounted on the output end of the second hydraulic cylinder (31). The front side of the second moving plate (32) penetrates the front side of the right-angle plate (9). A sponge (33) is mounted on the top of the second moving plate (32).

9. A method for using a monitoring device for real-time monitoring of silicon dioxide thickness according to any one of claims 1 to 8, characterized in that: The method of using the monitoring device for real-time monitoring of silicon dioxide thickness is as follows: S1, the silicon dioxide plate is placed on the transport plate (6), the transport plate (6) transports the silicon dioxide plate to the bottom of the rotating lifting plate (16), and the rotating lifting plate (16) moves downward so that the second laser rangefinder (21) contacts the top of the silicon dioxide plate; S2, then the second laser rangefinder (21) measures the thickness of the silicon dioxide plate, and then the lifting plate (16) is rotated upward, and then the lifting plate (16) is rotated 180 degrees, and then the lifting plate (16) is rotated downward again to allow the second laser rangefinder (21) to measure the thickness of the silicon dioxide plate; S3. After the measurement is completed, the lifting plate (16) is rotated to move upward, and then the second moving plate (32) drives the sponge (33) to move forward, and then the second laser rangefinder (21) moves downward to contact the sponge (33), thereby protecting the second laser rangefinder (21).

10. The method for using the monitoring device for real-time monitoring of silicon dioxide thickness according to claim 9, characterized in that: The S1 also includes the following steps: S11. Before the laser rangefinder 2 (21) contacts the silicon dioxide plate, the brush (29) first contacts the silicon dioxide plate, and then the brush (29) moves back and forth to clean the dust on the output section at the bottom of the laser rangefinder 2 (21) and the top of the silicon dioxide plate.

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