Back scattering imaging system and back scattering imaging method

Abstract

The invention provides a back scattering imaging system which can be applied to the field of image imaging, the field of security check or other technical fields. The back scattering imaging system comprises a back scattering imaging device, wherein the back scattering imaging device comprises at least one radiation source and at least one detector; and a data processing device; wherein the at least one ray source is configured to emit rays to scan the whole body of a detected object, and the whole body comprises the front side, the rear side, the left side, the right side, the top side and the bottom side of the detected object; the at least one detector is configured to receive back scattering signals from the front side, the rear side, the left side, the right side, the top side and the bottom side of the detected object; and the data processing equipment is configured to process the back scattering signal to obtain M two-dimensional back scattering images for displaying the overall surface layer information of the detected object, wherein M is an integer greater than or equal to 1. The invention further provides a back scattering imaging method.

Description

Technical Field

[0001] The present disclosure relates to the field of image imaging, the field of security inspection, or other technical fields. More specifically, it relates to a backscatter imaging system and a backscatter imaging method. Background Art

[0002] Backscatter detection technology can scan an object to be inspected with an X-ray beam, and at the same time use a detector to receive backscatter signals. When processing data, a two-dimensional backscatter image can be obtained by corresponding the scanning positions and the scatter signals point by point.

[0003] The two-dimensional backscatter image can display the surface information of the object to be inspected, and is used to identify the items hidden on the surface of the object to be inspected. Compared with the transmission image, its penetration ability is low, and it can only display the surface layer information of the object and cannot display more cross-sections. Therefore, backscatter detection should scan the object to be inspected more comprehensively to obtain more information.

[0004] In the process of implementing the inventive concept of the present disclosure, the inventors found that in the related art, when performing backscatter scanning on an object to be inspected, only a part of the object to be inspected is scanned, and the provided image information is not complete. If dangerous goods are hidden in other un-scanned areas, they may not be detected, which is not conducive to subsequent item search or analysis work. Summary of the Invention

[0005] In view of the above problems, the present disclosure provides a backscatter imaging system and a backscatter imaging method.

[0006] In one aspect of the embodiments of the present disclosure, a backscatter imaging system is provided, including: a backscatter imaging device, the backscatter imaging device including at least one radiation source and at least one detector; and a data processing device; wherein, at least one of the radiation sources is configured to emit radiation to scan the entire object to be inspected, and the entire object includes the front side, the back side, the left side, the right side, the top side and the bottom side of the object to be inspected; at least one of the detectors is configured to receive backscatter signals from the front side, the back side, the left side, the right side, the top side and the bottom side of the object to be inspected; the data processing device is configured to process the backscatter signals to obtain M two-dimensional backscatter images showing the overall surface information of the object to be inspected, and M is an integer greater than or equal to 1.

[0007] According to the embodiments of the present disclosure, it further includes: a three-dimensional imaging device, configured to scan the front side, the back side, the left side, the right side, the top side and the bottom side of the object to be inspected to obtain an overall three-dimensional model of the object to be inspected; wherein, the data processing device is further configured to cover the M two-dimensional backscatter images on the surface of the overall three-dimensional model to obtain an overall three-dimensional backscatter model of the object to be inspected.

[0008] According to an embodiment of the present disclosure, it further includes: a mobile device, wherein the backscatter imaging device and / or the three-dimensional imaging device is mounted on the mobile device; the mobile device is configured to drive the backscatter imaging device to move to scan the front side, rear side, left side, right side, top side and bottom side of the object to be examined, and / or drive the three-dimensional imaging device to move to scan the front side, rear side, left side, right side, top side and bottom side of the object to be examined.

[0009] According to an embodiment of the present disclosure, the mobile device includes a first moving mechanism, the backscatter imaging device includes a first backscatter imaging mechanism, and the first backscatter imaging mechanism includes a first radiation source and a first detector. Wherein, the first backscatter imaging mechanism is mounted on the first moving mechanism, and the first moving mechanism is configured to drive the first backscatter imaging mechanism to move to scan at least the front side, rear side, left side, right side and top side of the object to be examined.

[0010] According to an embodiment of the present disclosure, the three-dimensional imaging device includes a first three-dimensional imaging mechanism mounted on the first moving mechanism, and the first moving mechanism is configured to drive the first three-dimensional imaging mechanism to move to scan at least the front side, rear side, left side, right side and top side of the object to be examined.

[0011] According to an embodiment of the present disclosure, the mobile device includes a third moving mechanism, the backscatter imaging device includes a second backscatter imaging mechanism, and the second backscatter imaging mechanism includes a second radiation source and a second detector. Wherein, the second backscatter imaging mechanism is mounted on the third moving mechanism, and the third moving mechanism is configured to drive the second backscatter imaging mechanism to move under the bottom of the object to be examined to scan the bottom side of the object to be examined.

[0012] According to an embodiment of the present disclosure, the three-dimensional imaging device includes a second three-dimensional imaging mechanism mounted on the third moving mechanism, and the third moving mechanism is configured to drive the second three-dimensional imaging mechanism to move under the bottom of the object to be examined to scan the bottom side of the object to be examined.

[0013] According to an embodiment of the present disclosure, the first moving mechanism includes: a first robotic arm, wherein the first backscatter imaging mechanism and the first three-dimensional imaging mechanism are mounted on the first robotic arm; wherein, the first robotic arm is configured to drive the first backscatter imaging mechanism and the first three-dimensional imaging mechanism to move along a scanning trajectory to scan at least the front side, rear side, left side, right side and top side of the object to be examined.

[0014] According to an embodiment of the present disclosure, the first robotic arm includes a driving base and a robotic arm body mounted on the driving base, and the first backscatter imaging mechanism and the first three-dimensional imaging mechanism are mounted on the robotic arm body; the backscatter imaging system further includes: a ceiling bracket that provides a scanning track, wherein the driving base is connected to the ceiling bracket, and the driving base is configured to drive the robotic arm body to move along the scanning track, so that the robotic arm body drives the first backscatter imaging mechanism and the first three-dimensional imaging mechanism to move along a scanning trajectory.

[0015] According to an embodiment of the present disclosure, the backscatter imaging device includes NJ third backscatter imaging mechanisms, each of the third backscatter imaging mechanisms includes a third radiation source and a third detector, N1 is an integer greater than or equal to 6, and during scanning, the N1 third backscatter imaging mechanisms are located on the front side, rear side, left side, right side, top side and bottom side of the object to be inspected, and at least one third backscatter imaging mechanism is provided on any one side for scanning.

[0016] According to an embodiment of the present disclosure, the three-dimensional imaging device includes N2 third three-dimensional imaging mechanisms, N2 is an integer greater than or equal to 6, and during scanning, the N2 third three-dimensional imaging mechanisms are located on the front side, rear side, left side, right side, top side and bottom side of the object to be inspected, and at least one third three-dimensional imaging mechanism is provided on any one side for scanning.

[0017] According to an embodiment of the present disclosure, the mobile device includes: a front moving module located on the front side of the object to be inspected, a rear moving module located on the rear side of the object to be inspected, a left moving module located on the left side of the object to be inspected, a right moving module located on the right side of the object to be inspected, a top moving module located on the top side of the object to be inspected, and a bottom moving module located on the bottom side of the object to be inspected during scanning.

[0018] According to an embodiment of the present disclosure, the mobile device further includes: a gantry structure including a top cross beam and two side columns supporting the cross beam, wherein the top moving module includes the top cross beam, the left moving module includes one side column, and the right moving module includes the other side column; during scanning, the gantry structure moves along the front-rear direction of the object to be inspected, driving the third backscatter imaging mechanism and / or the third three-dimensional imaging mechanism located on the top side, left side and right side of the object to be inspected for scanning.

[0019] Another aspect of the embodiments of the present disclosure provides a backscatter imaging method for a backscatter imaging system including a data processing device and a backscatter imaging device. The backscatter imaging device includes at least one radiation source and at least one detector. The method includes: causing at least one of the radiation sources to emit radiation to scan the entire object to be inspected, where the entire object includes the front side, back side, left side, right side, top side, and bottom side of the object to be inspected; causing at least one of the detectors to receive backscatter signals from the front side, back side, left side, right side, top side, and bottom side of the object to be inspected; causing the data processing device to process the backscatter signals to obtain M two-dimensional backscatter images showing the surface information of the entire object to be inspected, where M is an integer greater than or equal to 1.

[0020] One or more of the above embodiments have the following beneficial effects: A backscatter imaging device capable of scanning the entire object to be inspected is provided. Using at least one radiation source to scan the front side, back side, left side, right side, top side, and bottom side of the object to be inspected, and at least one detector to receive the backscatter signals from each side, so that the data processing device can process the backscatter signals to obtain M two-dimensional backscatter images showing the surface information of the entire object to be inspected, providing complete image information, which is beneficial for subsequent item search or analysis and other work. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Through the following description of the embodiments of the present disclosure with reference to the accompanying drawings, the above content and other objects, features, and advantages of the present disclosure will become clearer. In the drawings:

[0022] Figure 1 Schematically shows an example diagram of a backscatter imaging system according to an embodiment of the present disclosure;

[0023] Figure 2A Schematically shows an application scenario diagram of a backscatter imaging system according to an embodiment of the present disclosure;

[0024] Figure 2B Schematically shows according to an embodiment of the present disclosure Figure 2A B-direction view of the vehicle in;

[0025] Figure 3 Schematically shows an application scenario diagram of a backscatter imaging system according to another embodiment of the present disclosure;

[0026] Figure 4 Schematically shows a flowchart of a backscatter imaging method according to some other embodiments of the present disclosure;

[0027] Figure 5 Schematically shows a flowchart of obtaining a three-dimensional backscatter model according to another embodiment of the present disclosure;

[0028] Figure 6A block diagram of an electronic device including a processor according to an embodiment of the present disclosure is schematically shown.

[0029] It should be noted that, for clarity, in the drawings used to describe the embodiments of the present disclosure, the dimensions of the overall / local structure or the overall / local area may be enlarged or reduced, that is, these drawings are not drawn to actual scale. Detailed implementation manners

[0030] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. However, it should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the present disclosure. In the following detailed description, for the sake of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present disclosure. However, obviously, one or more embodiments can also be implemented without these specific details. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present disclosure.

[0031] For example, a scanning light beam can be emitted to the surface of the object to be inspected through a backscattered ray source, a backscattered detector is used to detect the backscattered signal, and a two-dimensional backscattered image is formed. Taking a vehicle as an example, if only 4-sided backscattered images of the vehicle (two side surfaces, 1 bottom surface, 1 top surface) are scanned, lacking the backscattered image information of the front and rear surfaces of the vehicle, dangerous goods hidden on the front and rear surfaces (such as the front and rear bumpers) are difficult to detect.

[0032] Some embodiments of the present disclosure provide a backscattered imaging system, which includes a data processing device and a backscattered imaging device having at least one ray source and at least one detector. The at least one ray source is used to scan the front side, rear side, left side, right side, top side and bottom side of the object to be inspected, and the at least one detector receives the backscattered signals of each side surface. Thus, the data processing device can process the backscattered signals to obtain M two-dimensional backscattered images showing the overall surface layer information of the object to be inspected, providing complete image information, which is beneficial to subsequent item search or analysis work.

[0033] In some embodiments, the image parts of different side surfaces of the object to be inspected can be spliced. For example, the edge parts of two adjacent images are searched, and the areas with the closest imaging effects are overlapped to complete the splicing operation. For example, at least two side surface images among the front side, rear side, left side, right side, top side and bottom side of the object to be inspected are spliced to obtain 1 two-dimensional backscattered image. In other embodiments, for example, without splicing, the front side image, rear side image, left side image, right side image, top side image and bottom side image of the object to be inspected, a total of 6 images, show the overall surface layer information of the object to be inspected.

[0034] According to the backscatter imaging system provided by the present disclosure, it is possible to provide complete image information of the object to be inspected by providing M two-dimensional backscatter images. Here, the two-dimensional backscatter images lack information such as the three-dimensional shape and volume size of the object to be inspected, and due to the perspective problem of the two-dimensional plane, there may be a deviation from the actual contour of the item. If the contours of the items in the two-dimensional backscatter images are superimposed on each other, it will further affect the display effect, thus making it unfavorable for subsequent item search or analysis work. For example, the related art can use lidar to obtain the contour point cloud data of the object to be inspected and fuse it with the two-dimensional backscatter images, but no specific technical means have been proposed to obtain a three-dimensional backscatter model, and the problems existing in the two-dimensional backscatter images still cannot be overcome.

[0035] Therefore, in some embodiments of the present disclosure, a processing solution for the three-dimensional backscatter model is further provided. It is possible to use a three-dimensional imaging device to scan the front side, rear side, left side, right side, top side, and bottom side of the object to be inspected, obtain the overall three-dimensional model of the object to be inspected, and use a data processing device to cover the M two-dimensional backscatter images on the surface of the overall three-dimensional model to obtain the overall three-dimensional backscatter model of the object to be inspected. Thus, it is possible to use the three-dimensional backscatter model with backscatter information to display the whole of the object to be inspected from a three-dimensional perspective, provide the three-dimensional shape and size information of the whole object to be inspected, overcome the perspective problem of the two-dimensional backscatter images and the influence of the superposition of the contours of each item on the display, etc., provide more complete scanning information, and be conducive to subsequent item search or analysis work.

[0036] Figure 1 A schematic diagram showing an example of the backscatter imaging system according to an embodiment of the present disclosure is shown. It should be noted that Figure 1 The shown is only an example where the embodiments of the present disclosure can be applied to help those skilled in the art understand the technical content of the present disclosure, but it does not mean that the embodiments of the present disclosure cannot include other devices, systems, or be used in other environments or scenarios.

[0037] As Figure 1 shown, the backscatter imaging system 100 according to this embodiment may include a backscatter imaging device 110 and a data processing device 130.

[0038] The backscatter imaging device 110 is used to scan the object to be inspected 140, and the data processing device 130 is used to receive the backscatter signal scanned by the backscatter imaging device 110 and process it to obtain M two-dimensional backscatter images of the object to be inspected 140. Each two-dimensional backscatter image may be obtained by scanning at least one target area A of the object to be inspected 140 by the backscatter imaging device 110 each time. The target area A includes a partial or all area on the object to be inspected 140.

[0039] In some embodiments, M two-dimensional backscatter images correspond one-to-one to M regions of the object under inspection (such as M target regions A), where M is an integer greater than or equal to 1. When M is greater than or equal to 2, the ranges of any two regions are not the same, for example, any two regions may be partially intersecting or completely independent. For example, without performing the aforementioned splicing operation, each side of the object under inspection 140 is used as a target region A, and each side has a corresponding two-dimensional backscatter image. In other embodiments, each two-dimensional backscatter image includes more than two target regions A of the object under inspection, such as the front region and the left region of the object under inspection. Further, the front image and the left image of the object under inspection are spliced ​​to form a two-dimensional backscatter image.

[0040] In some embodiments, the backscatter imaging device 110 includes at least one ray source and at least one detector; the at least one ray source is configured to emit rays to scan the entire object 140, which includes the front, back, left, right, top and bottom sides of the object 140; the at least one detector is configured to receive backscatter signals from the front, back, left, right, top and bottom sides of the object 140; the data processing device 130 is configured to process the backscatter signals to obtain M two-dimensional backscatter images showing the overall surface information of the object 140.

[0041] For example, when the inspected object 140 is a vehicle, the target area A may be the front, rear, left, right, top and bottom sides of the vehicle as a whole, and the backscatter imaging device 110 may obtain six two-dimensional backscatter images of the vehicle to display the overall surface information of the inspected object. Here, the two-dimensional backscatter image is formed by the radiation signals scattered from the surface of the inspected object close to the backscatter detector side and the part at a certain distance inward from the surface (i.e., the surface).

[0042] In other embodiments, the backscatter imaging system 100 may further include a three-dimensional imaging device 120. The three-dimensional imaging device 120 may be used to perform three-dimensional imaging on the object 140 to obtain a three-dimensional model of the object 140, wherein the surface of the three-dimensional model has M regions. The M regions on the surface of the three-dimensional model are represented in the three-dimensional space of the three-dimensional imaging device 120, and have a one-to-one correspondence with the M regions on the object 140 in the physical world. The data processing device 130 is further used to overlay the M two-dimensional backscatter images on the M regions on the surface of the three-dimensional model to obtain a three-dimensional backscatter model.

[0043] In some embodiments, the three-dimensional imaging device 120 is configured to scan the front side, back side, left side, right side, top side and bottom side of the inspected object 140 to obtain an overall three-dimensional model of the inspected object 140; the data processing device 130 is configured to overlay M two-dimensional backscatter images on the surface of the overall three-dimensional model to obtain an overall three-dimensional backscatter model of the inspected object 140. The M regions may include the front region, back region, left region, right region, top region and bottom region of the inspected object.

[0044] The three-dimensional model refers to a visualized image used in computer graphics to represent the geometric data and attributes of the inspected object 140 in the three-dimensional space. The three-dimensional backscatter model refers to a visualized image that further covers a two-dimensional backscatter image on the surface of the three-dimensional model based on the visualized image representing the geometric data and attributes of the inspected object 140 in the three-dimensional space to represent the backscatter information. The backscatter information represents the different scattering phenomena of different substances to X-rays.

[0045] In some embodiments, the backscatter imaging device 110 and the three-dimensional imaging device 120 can scan the outside of the object under inspection 140, such as scanning the outside of the overall structure of the object under inspection 140, to obtain one or more two-dimensional backscatter images and one or more depth images, and further perform three-dimensional reconstruction based on the depth image to obtain an overall three-dimensional model.

[0046] The inspected object 140 may include an object, such as a vehicle, container, suitcase or other article in a security inspection scene, or various materials in a material analysis scene. The inspected object 140 may include a human body, such as a person passing through a security inspection channel in a station, airport or other public places.

[0047] For example, one or more backscatter images and one or more depth images may be collected in the circumferential direction (such as the front, rear, left and right sides) of the object under inspection 140 to obtain a three-dimensional backscatter model above the bottom of the object under inspection. It is also possible to collect images up and down, front and back, left and right of the object under inspection 140 to obtain a three-dimensional backscatter model including the circumferential direction, top and bottom. It is understood that according to actual needs, a three-dimensional backscatter model of a local range of the object under inspection 140 can be obtained, and a three-dimensional backscatter model of the entire object under inspection 140 can also be obtained.

[0048] In some embodiments, the backscatter imaging device 110 may include a control device, the control device controls the X-ray source to emit X-rays, forms flying spots under the modulation of the flying spot forming mechanism, and scans the outer surface of the object 140 under inspection. The control device controls the detector to receive backscatter signals from various sides of the object 140 under inspection, so that the data processing device processes the backscatter signals to form M backscatter images. In some embodiments, the backscatter imaging device 110 may perform the above-mentioned scanning on one or more sides of the object 140 under inspection, and then the obtained two-dimensional backscatter images are processed in the data processing device 130.

[0049] Depth imaging technology is a technology for obtaining a depth image of the inspected object 140, which can be implemented by an acoustic depth imaging system, a monocular depth imaging system, a binocular depth imaging system, an active depth imaging system, and a passive depth imaging system, etc., and can be implemented specifically by using ultrasonic waves, structured light, or time of flight. A depth image, also known as a range image, is an image that uses the distance (depth) from the image collector to each point on the surface of the inspected object 140 as a pixel value, and the depth information includes the geometric shape of the visible surface of the inspected object 140, the position information of each point in the three-dimensional coordinate system, etc. Taking a binocular depth imaging system as an example, a binocular camera is used to obtain two images of the same area of ​​the inspected object 140, and a corresponding relationship between features is established through stereo matching technology, and the image points of the same spatial physical point in the two images are matched, and the position difference of the image points in the two images is the parallax. When the relative position relationship between the binocular cameras is known, the distance from the object to the camera can be calculated based on the parallax according to the principle of similar triangles.

[0050] In some embodiments, for example, the three-dimensional imaging device 120 may include a structured light source and an image sensor. The structured light source emits structured light to the object 140 to obtain a target image based on the detection data of the image sensor. A depth image may be obtained by reconstructing a single structured light or multiple structured light images, and a three-dimensional reconstruction technique may be used to calculate the distance and position relationship between pixels in the depth image to reconstruct the three-dimensional shape and size of the object 140 to obtain a three-dimensional model.

[0051] It is particularly noted that the backscatter imaging device 110 and the three-dimensional imaging device 120 are not limited to the above-mentioned structure. The structure and type of the backscatter imaging device 110 and the three-dimensional imaging device 120 can be flexibly adjusted within the inventive concept of obtaining a three-dimensional backscatter model in the embodiment of the present disclosure.

[0052] In some embodiments, the data processing device 130 may include, for example, a general-purpose microprocessor (eg, a CPU), an instruction set processor and / or related chipsets and / or a special-purpose microprocessor (eg, an application-specific integrated circuit (ASIC)), and the like.

[0053] In some embodiments, the backscatter imaging device 110 and the 3D imaging device 120 may be connected to the data processing device 130 for data transmission via the network 150. The network 150 may include various connection types, such as wired, wireless communication links or fiber optic cables.

[0054] According to the embodiments of the present disclosure, a three-dimensional backscatter model with backscatter information can be used to display the entire inspected object from a three-dimensional perspective, provide three-dimensional shape and size information of the entire inspected object, overcome the viewing angle problem of the two-dimensional backscatter image and the display impact of the superposition of the contours of each object, improve the overall scanning effect, and facilitate subsequent object search or analysis and other tasks.

[0055] It can be understood that during backscatter scanning imaging, usually, the backscatter imaging device 110 is configured to move relative to the object 140 to obtain a two-dimensional backscatter image. In addition, when the field of view (scanning range in a static state) of the three-dimensional imaging device 120 is larger than the target area A range of the object 140, it can be directly scanned from a single orientation in a static state. When the field of view of the three-dimensional imaging device 120 is smaller than the target area range, in some embodiments, the three-dimensional imaging device 120 is configured to move relative to the object 140 to obtain a three-dimensional model.

[0056] For example, when performing backscatter scanning, the relative movement includes the backscatter imaging device 110 moving while the inspected object 140 is stationary, the backscatter imaging device 110 is stationary while the inspected object 140 is moving, or both the backscatter imaging device 110 and the inspected object 140 are moving. When performing depth scanning, the relative movement includes the 3D imaging device 120 moving while the inspected object 140 is stationary, the 3D imaging device 120 is stationary while the inspected object 140 is moving, or both the 3D imaging device 120 and the inspected object 140 are moving.

[0057] For simplicity, the backscatter imaging system 100 is further described below by taking the movement of the backscatter imaging device 110 and the 3D imaging device 120 during the scanning process as an example. It is understandable that the following example is also applicable to the case of a single backscatter imaging device 110.

[0058] In some embodiments, the backscatter imaging system 100 further includes a mobile device, wherein the backscatter imaging device 110 and / or the three-dimensional imaging device 120 are installed on the mobile device. The mobile device is configured to drive the backscatter imaging device 110 to move to scan the front side, back side, left side, right side, top side and bottom side of the inspected object 140 to obtain M two-dimensional backscatter images, and / or drive the three-dimensional imaging device 120 to move to scan the front side, back side, left side, right side, top side and bottom side of the inspected object 140 to perform three-dimensional imaging.

[0059] Exemplarily, the mobile device may include an automatic mobile device or a manual mobile device. For example, the automatic mobile device may include a first robotic arm, a drone, an AGV vehicle or a robot, etc., which is automatically controlled by a computer. The manual mobile device may include a second robotic arm, a movable bracket, etc., which are manually controlled by humans.

[0060] In some embodiments, the mobile device is configured to drive the backscatter imaging device 110 and the three-dimensional imaging device 120 to move synchronously or asynchronously. Synchronous movement means that the backscatter imaging device 110 and the three-dimensional imaging device 120 move and scan the object at the same time. For example, both devices can be installed at the end of the first mechanical arm, and move and scan the object as the first mechanical arm moves. Asynchronous movement means that one of the backscatter imaging device 110 and the three-dimensional imaging device 120 scans the object first, and the other waits for the former to finish scanning before scanning the object.

[0061] Figure 2A The application scenario diagram of the backscatter imaging system 100 according to an embodiment of the present disclosure is schematically shown. Figure 2B Schematically illustrates an embodiment of the present disclosure Figure 2A B direction view of the vehicle.

[0062] In some embodiments, the mobile device includes a first moving mechanism 210, and the backscatter imaging device 110 includes a first backscatter imaging mechanism 111, which is installed on the first moving mechanism 210, wherein the first moving mechanism 210 is located above the bottom of the object to be inspected 140, and is configured to drive the first backscatter imaging mechanism 111 to move to obtain a two-dimensional backscatter image of at least one of the circumferential area, top area and bottom area of ​​the object to be inspected 140, such as scanning at least the front side, back side, left side, right side and top side of the object to be inspected 140.

[0063] In some embodiments, the three-dimensional imaging device 120 includes a first three-dimensional imaging mechanism 121 installed on a first moving mechanism 210. The first moving mechanism 210 is configured to drive the first three-dimensional imaging mechanism 121 to move so as to perform three-dimensional imaging of at least one of the circumferential area, top area and bottom area of ​​the inspected object 140, such as scanning at least the front side, back side, left side, right side and top side of the inspected object 140. The three-dimensional imaging includes using three-dimensional reconstruction technology to process the depth image obtained by the scan to obtain a three-dimensional model.

[0064] Exemplarily, the first backscatter imaging mechanism 111 may include a first X-ray source, a first detector, and a first control device. The first three-dimensional imaging mechanism 121 may include a first structured light source and a first image sensor.

[0065] Reference Figure 2A andFigure 2B The first moving mechanism 210 may include a first mechanical arm, on which the first backscatter imaging mechanism 111 and the first three-dimensional imaging mechanism 121 are mounted. The first mechanical arm is configured to move the first backscatter imaging mechanism 111 and the first three-dimensional imaging mechanism 121 along a scanning trajectory to scan the front side, the back side, the left side, the right side, the top side, and the bottom side of the object to be inspected.

[0066] In some embodiments, the first robotic arm includes a driving base and a robotic arm body mounted on the driving base, and the first backscatter imaging mechanism 111 and the first three-dimensional imaging mechanism 121 are mounted on the robotic arm body; the backscatter imaging system 100 also includes: a ceiling bracket, which provides a scanning track, wherein the driving base is connected to the ceiling bracket, and the driving base is configured to drive the robotic arm body to move along the scanning track, so that the robotic arm body drives the first backscatter imaging mechanism 111 and the first three-dimensional imaging mechanism 121 to move along the scanning track.

[0067] For example, the first mechanical arm can be multi-degree-of-freedom, and the driving base is installed on the ceiling bracket 230, and the mechanical arm body is detachably installed at the bottom thereof. At the same time, the driving base drives the mechanical arm body to rotate at multiple angles. A first control device can be arranged to communicate with the first mechanical arm, and the first mechanical arm is controlled to drive the first backscatter imaging mechanism 111 and the first three-dimensional imaging mechanism 121 to move according to the type, shape and size of the vehicle 141 (i.e., the object to be inspected) to achieve a scanning action, and at least the cost saving effect can be achieved by only setting up one moving mechanism. In addition, for suspicious local areas in the target area, the moving trajectory 211 can be replanned for focused scanning.

[0068] In an exemplary embodiment, the first robotic arm may move along Figure 2B The trajectory 211 shown drives the first backscatter imaging mechanism 111 and the first three-dimensional imaging mechanism 121 to rotate around the object 140, thereby scanning the circumferential area of ​​the vehicle 141, obtaining one or more two-dimensional backscatter images and one or more depth images of each side of the vehicle 141, and then obtaining a three-dimensional backscatter model.

[0069] In particular, but not limited to Figure 2B The trajectory 211 shown can also scan the vehicle 141 along a new trajectory. For example, when the vehicle 141 is suspended in the air or there is a detection space at the bottom, the first moving mechanism can also move the first backscatter imaging mechanism and the first three-dimensional imaging mechanism to the bottom of the vehicle 141 to scan its bottom area to obtain a two-dimensional backscatter image and a depth image.

[0070] It is particularly noted that, in some embodiments, the first moving mechanism 210 is not limited to the first robotic arm, but may also include a second robotic arm, a drone or an AGV robot, etc., which can drive the first backscatter imaging mechanism 111 and the first three-dimensional imaging mechanism 121 to move along a predetermined trajectory.

[0071] In other embodiments, the mobile device includes a second moving mechanism (not shown), and the three-dimensional imaging device 120 includes a first three-dimensional imaging mechanism 121 mounted on the second moving mechanism, wherein the second moving mechanism is located above the bottom of the object to be inspected 140, and is configured to drive the first three-dimensional imaging mechanism 121 to move to perform three-dimensional imaging of at least one of the circumferential area, top area, and bottom area of ​​the object to be inspected.

[0072] and Figure 2A and Figure 2B The difference is that the first three-dimensional imaging mechanism 121 and the first backscatter imaging mechanism 111 are not installed on the same mobile mechanism, but a second mobile mechanism independent of the first mobile mechanism 210 is set. The second mobile mechanism can be any one of the first mechanical arm, the second mechanical arm, the drone or the AGV robot. The effect is that the corresponding mobile mechanism, moving speed and moving trajectory 211 can be adaptively set according to the scanning field of view, size, model, scanning performance and other characteristics of the first three-dimensional imaging mechanism 121 and the first backscatter imaging mechanism 111.

[0073] It can be understood that whether the first three-dimensional imaging mechanism 121 and the first backscattering imaging mechanism 111 are installed on the same mobile mechanism or not, it can be controlled whether the two scan synchronously. For example, when both are installed on the first mobile mechanism 210, they can be scanned simultaneously during the movement, in which case the trajectories of the two are the same. It is also possible to make the two scan separately through two movements, in which case the trajectories of the two can be the same or different. For another example, when the first backscattering imaging mechanism 111 is installed on the first mobile mechanism 210, and the first three-dimensional imaging mechanism 121 is installed on the second mobile mechanism, the first mobile mechanism 210 and the second mobile mechanism can move simultaneously or successively along the same / different trajectories. During the movement, the first three-dimensional imaging mechanism 121 and the first backscattering imaging mechanism 111 scan the vehicle 141.

[0074] Regardless of whether the first backscatter imaging mechanism 111 and the first three-dimensional imaging mechanism 121 are installed on the same mobile mechanism, the movement trajectory of one of them can be determined according to the type, shape and size of the vehicle 141 (i.e., the object to be inspected). For example, when both are installed on the first mobile mechanism 210, an object recognition module can be configured, such as a trigger device (to monitor whether the vehicle 141 enters the field of view), a camera device, a lighting device, an image acquisition device, and a background processor for identifying the license plate number, etc., which are used to capture a picture of the vehicle 141, and determine the movement trajectory based on the vehicle model information (such as size and model, etc.) obtained using image recognition technology. For example, when the two are installed on two mobile mechanisms respectively, the object recognition module can be used to determine the movement trajectory of the two, or the first three-dimensional imaging mechanism 121 can be used to scan along a fixed trajectory first, and the vehicle model information can be identified based on the depth image obtained by scanning or the three-dimensional model obtained by reconstruction, and then the movement trajectory of the first backscatter imaging mechanism 111 can be determined based on the vehicle model information.

[0075] In some embodiments, the first moving mechanism 210 and / or the second moving mechanism can drive any imaging mechanism installed thereon to scan any position of the circumferential region, top region, and bottom region of the inspected object. In other embodiments, the first moving mechanism 210 and / or the second moving mechanism can drive any imaging mechanism installed thereon to scan the circumferential region and top region of the inspected object, while the bottom region is scanned by any imaging mechanism installed thereon driven by the third moving mechanism 220 and / or the fourth moving mechanism. This is further described below.

[0076] In some embodiments, the mobile device includes a third moving mechanism 220, and the backscattering imaging device 110 includes a second backscattering imaging mechanism 112, which is installed on the third moving mechanism 220, wherein the third moving mechanism 220 is located below the bottom of the object to be inspected 140, and is configured to drive the second backscattering imaging mechanism 112 to move below the bottom of the object to be inspected to scan the bottom side of the object to be inspected, so as to obtain a two-dimensional backscattering image of the bottom area of ​​the object to be inspected 140.

[0077] In some embodiments, the three-dimensional imaging device 120 includes a second three-dimensional imaging mechanism 122 installed on a third moving mechanism 220, and the third moving mechanism 220 is configured to drive the second three-dimensional imaging mechanism 122 to move below the bottom of the inspected object 140 to scan the bottom side of the inspected object to perform three-dimensional imaging of the bottom area of ​​the inspected object.

[0078] Exemplarily, the second backscatter imaging mechanism 112 may include a second X-ray source, a second detector, and a second control device. The second three-dimensional imaging mechanism 122 may include a second structured light source and a second image sensor, or the second three-dimensional imaging mechanism 122 may include an ultrasonic sound source, an acoustic lens, and an acoustic image sensor.

[0079] Continue to refer to Figure 2A and Figure 2B The bottom area of ​​the vehicle 141 includes the area facing the ground 240, and the area above the bottom includes the non-bottom area, such as the outer side of the wheel, the circumferential area of ​​the vehicle shell, and the top area. Below the bottom includes the area below the bottom area of ​​the vehicle 141 in a direction perpendicular to the ground 240, such as the chassis, the ground 240, and below the ground. In particular, the bottom of the object to be inspected involved in the embodiments of the present disclosure includes the area facing the ground, for example, the bottom surface of the object to be inspected is parallel or approximately parallel to the ground.

[0080] Exemplarily, the third moving mechanism 220 may include a moving module and a control module, and the moving module may include a bottom translation conveying mechanism, and the second backscatter imaging mechanism 112 and the second three-dimensional imaging mechanism 122 are installed above the bottom translation conveying mechanism. The bottom translation conveying mechanism may include a chain plate conveyor, a belt conveyor, a roller conveying mechanism, a roller conveying mechanism or a guide rail conveying mechanism, etc., to drive the second backscatter imaging mechanism 112 and the second three-dimensional imaging mechanism 122 to move, while the vehicle 141 is stationary to achieve bottom scanning. Taking the roller conveying mechanism as an example, a plurality of rollers may be placed on both sides of the bottom of the second backscatter imaging mechanism 112 and the second three-dimensional imaging mechanism 122, and the rollers are connected by chains, and the driving mechanism works to drive the second backscatter imaging mechanism 112 and the second three-dimensional imaging mechanism 122 to move.

[0081] For example, the third mobile mechanism 220 may include the object recognition module used for the first backscatter imaging mechanism 111 and the first three-dimensional imaging mechanism 121 to determine the size and model of the vehicle 141, and the control module may determine the moving stroke of the mobile module according to the size information. The moving stroke includes the moving distance of the second backscatter imaging mechanism 112 and the second three-dimensional imaging mechanism 122 driven by the mobile module.

[0082] Again, refer to 2A and Figure 2B The third moving mechanism 220, the second backscatter imaging mechanism 112, and the second three-dimensional imaging mechanism 122 are all located below the bottom of the vehicle 141. Furthermore, the three can be installed below the ground 240, such as in a ground pit. For example, the third moving mechanism 220 can drive the second backscatter imaging mechanism 112 and the second three-dimensional imaging mechanism 122 to move in the ground pit to scan the chassis of the vehicle 141.

[0083] For example, the second three-dimensional imaging mechanism 122 includes an acoustic three-dimensional imaging system, which is located below the ground 240, and emits ultrasonic waves to irradiate the chassis of the vehicle 141 by stimulating the ultrasonic sound source, and uses an acoustic lens to focus and receive ultrasonic echoes reflected by the chassis of the vehicle 141, so as to form an imaging sound field containing intensity distribution and phase distribution, and image it on the surface of the acoustic image sensor. The acoustic image sensor is placed on the image focal plane of the acoustic lens, and is used to receive the spatial distribution information of the intensity and phase of the imaging sound field, and finally obtain a depth image.

[0084] In some embodiments, the mobile device includes a fourth moving mechanism (not shown), and the three-dimensional imaging device 120 includes a second three-dimensional imaging mechanism 122 installed on the fourth moving mechanism, wherein the fourth moving mechanism is configured to drive the second three-dimensional imaging mechanism 122 to move below the bottom of the inspected object to perform three-dimensional imaging of the bottom area of ​​the inspected object.

[0085] In other embodiments, the second three-dimensional imaging mechanism 122 includes a binocular three-dimensional imaging system based on structured light, which together with the fourth mobile mechanism can be arranged below the bottom of the vehicle 141 and above the ground 240, that is, between the chassis of the vehicle 141 and the ground 240, wherein when the second three-dimensional imaging mechanism 122 and the fourth mobile mechanism are arranged above the ground, they may not be installed above the above-mentioned ground pit. For example, the second three-dimensional imaging mechanism 122 is used to obtain a depth image of the chassis first, and then the second backscatter imaging mechanism 112 is used to obtain a two-dimensional backscatter image of the chassis. The purpose is to avoid obstructions between the structured light source and the chassis that affect the imaging effect, and to avoid timely avoiding the second three-dimensional imaging mechanism 122 during backscatter scanning, so as to better perform backscatter scanning on the chassis.

[0086] and Figure 2A and Figure 2B The difference is that the second three-dimensional imaging mechanism 122 and the second backscatter imaging mechanism 112 are not installed on the same mobile mechanism, but a fourth mobile mechanism independent of the third mobile mechanism is set. The fourth mobile mechanism can be the same or different in position, structure and function as the third mobile mechanism 220. Please refer to the above description of the position, structure and function of the third mobile mechanism 220, which will not be repeated here. The effect of installing the second three-dimensional imaging mechanism 122 and the second backscatter imaging mechanism 112 on two mobile mechanisms is that the corresponding mobile mechanisms, moving speeds and moving strokes can be adaptively set according to their respective scanning fields of view, sizes, models, scanning performance and other characteristics.

[0087] Similarly, whether the second three-dimensional imaging mechanism 122 and the second backscattering imaging mechanism 112 are installed on the same mobile mechanism, it is possible to control whether the two scan synchronously. For example, when both are installed on the third mobile mechanism 220, they can be scanned simultaneously during the movement, in which case the movement strokes of the two are equal. It is also possible to make the two scan separately through two movements, in which case the movement strokes of the two can be equal or unequal. For another example, when the second backscattering imaging mechanism 112 is installed on the third mobile mechanism 220, and the second three-dimensional imaging mechanism 122 is installed on the fourth mobile mechanism, the third mobile mechanism 220 and the fourth mobile mechanism can move equal or unequal movement strokes successively, and the second three-dimensional imaging mechanism 122 and the second backscattering imaging mechanism 112 scan the vehicle 141 during the movement.

[0088] Figure 3 The application scenario diagram of the backscatter imaging system 100 according to another embodiment of the present disclosure is schematically shown.

[0089] In some embodiments, the backscatter imaging device 110 includes N1 third backscatter imaging mechanisms 113, each of which includes a third ray source and a third detector, and the three-dimensional imaging device 120 includes N2 third three-dimensional imaging mechanisms 123, N1 and N2 are both integers greater than or equal to 1, and N1 and N2 are equal or different.

[0090] During the scanning process, N1 third backscatter imaging mechanisms 113 are located at the front side, back side, left side, right side, top side and bottom side of the object to be inspected 140, wherein any side has at least one third backscatter imaging mechanism for scanning. And / or during the scanning process, N2 third three-dimensional imaging mechanisms 123 are located at the front side, back side, left side, right side, top side and bottom side of the object to be inspected 140, wherein any side has at least one third three-dimensional imaging mechanism for scanning. N1 and N2 can be greater than or equal to 6.

[0091] Reference Figure 3 The mobile device includes a front moving module 313, a rear moving module 311, a left moving module 312, a right moving module 314, a top moving module 315 and a bottom moving module 316 which are respectively located at the front side, rear side, left side, right side, top side and bottom side of the vehicle 141.

[0092] The backscatter imaging device 110 and the three-dimensional imaging device 120 can be installed on the gantry structure 310. For example, the gantry structure 310 includes a top crossbeam and two side columns that support the crossbeam. Among them, the top moving module 315 includes the top crossbeam, the left moving module 312 includes one side column, and the right moving module 314 includes the other side column; during the scanning process, the gantry structure moves along the front-back direction of the object to be inspected, driving the third backscatter imaging mechanism and / or the third three-dimensional imaging mechanism located on the top side, left side, and right side of the object to be inspected to perform scanning.

[0093] For example, the third backscatter imaging mechanism 113C and the third three-dimensional imaging mechanism 123C are installed on the front moving module 313, the third backscatter imaging mechanism 113A and the third three-dimensional imaging mechanism 123A are installed on the rear moving module 311, the third backscatter imaging mechanism 113B and the third three-dimensional imaging mechanism 123B are installed on the left moving module 312, the third backscatter imaging mechanism 113D and the third three-dimensional imaging mechanism 123D are installed on the right moving module 314, the third backscatter imaging mechanism 113E and the third three-dimensional imaging mechanism 123E are installed on the top moving module 315, and the third backscatter imaging mechanism 113F and the third three-dimensional imaging mechanism 123F are installed on the bottom moving module 316.

[0094] Furthermore, the third backscatter imaging mechanism 113C and the third three-dimensional imaging mechanism 123C can be driven by the front moving module 313 to scan the front area of the vehicle 141, the third backscatter imaging mechanism 113A and the third three-dimensional imaging mechanism 123A can be driven by the rear moving module 311 to scan the rear area of the vehicle 141, the third backscatter imaging mechanism 113B and the third three-dimensional imaging mechanism 123B can be driven by the left moving module 312 to scan the left area of the vehicle 141, the third backscatter imaging mechanism 113D and the third three-dimensional imaging mechanism 123D can be driven by the right moving module 314 to scan the right area of the vehicle 141, the third backscatter imaging mechanism 113E and the third three-dimensional imaging mechanism 123E can be driven by the top moving module 315 to scan the top area of the vehicle 141, and the third backscatter imaging mechanism 113F and the third three-dimensional imaging mechanism 123F can be driven by the bottom moving module 316 to scan the bottom area of the vehicle 141.

[0095] For example, the top moving module 315 can move along Figure 3 the front-back direction shown to enable the third backscatter imaging mechanism 113E and the third three-dimensional imaging mechanism 123E to scan the top area of the vehicle 141. The rear moving module 311 can move along Figure 3 the left-right direction shown to enable the third backscatter imaging mechanism 113A and the third three-dimensional imaging mechanism 123A.

[0096] In some other embodiments, the three-dimensional imaging device 120 may be stationary relative to the object 140 to be inspected. Continuing to refer to Figure 3 , when the vehicle 141 is being scanned, it is in a stationary state, and the N2 third three-dimensional imaging mechanisms 123 may also be in a stationary state, as long as each imaging mechanism can scan an image of the target area on the vehicle 141.

[0097] It should be noted that the backscatter imaging system 100 provided in the embodiments of the present disclosure can be applied to various types, sizes, and models of objects 140 to be inspected. Taking the vehicle 141 as an example, it may include small vehicles 141 such as sedans, minivans, light buses, tricycles, or light trucks, and may also include large vehicles 141 such as ordinary buses, large RVs, special operation vehicles, or semi-trailer models. By adjusting the movement trajectory 211 or the movement stroke, vehicles 141 of various sizes can be scanned to obtain a three-dimensional backscatter model.

[0098] Combined with the above description of the backscatter imaging system, the backscatter imaging method will be further introduced below.

[0099] In some embodiments, the backscatter imaging method includes: first, causing at least one radiation source to emit radiation to scan the entire object to be inspected, where the entire object includes the front side, rear side, left side, right side, top side, and bottom side of the object to be inspected; then, causing at least one detector to receive backscatter signals from the front side, rear side, left side, right side, top side, and bottom side of the object to be inspected; and finally, causing a data processing device to process the backscatter signals to obtain M two-dimensional backscatter images showing the overall surface information of the object to be inspected, where M is an integer greater than or equal to 1.

[0100] Figure 4 Schematically shows a flowchart of a backscatter imaging method according to some other embodiments of the present disclosure.

[0101] As Figure 4 shown, the backscatter imaging method of this embodiment includes:

[0102] In operation S410, a backscatter imaging device and a data processing device are provided to obtain M two-dimensional backscatter images of the object to be inspected. The M two-dimensional backscatter images correspond one-to-one to M regions of the object to be inspected, where M is an integer greater than or equal to 1. When M is greater than or equal to 2, the ranges of any two regions are different. For example, causing at least one radiation source to emit radiation to scan the entire object to be inspected, causing at least one detector to receive backscatter signals, and causing the data processing device to process the backscatter signals to obtain M two-dimensional backscatter images.

[0103] In operation S420, a three-dimensional imaging device is provided to perform three-dimensional imaging on the object to be inspected to obtain a three-dimensional model of the object to be inspected.

[0104] In operation S430, a data processing device is provided to cover M two-dimensional backscatter images on M regions of the surface of a three-dimensional model, obtaining a three-dimensional backscatter model.

[0105] Exemplarily, without entering the interior of the object to be inspected, backscatter scanning and depth scanning are performed on the outer sides (such as the front side, rear side, left side, right side, top side, and bottom side) of the overall structure of the object to be inspected, and a three-dimensional backscatter model is obtained.

[0106] For example, one or more two-dimensional backscatter images can be obtained using a backscatter imaging device, and one or more depth images can be obtained using a three-dimensional imaging device, such that the data processing device fuses the two-dimensional backscatter images and the three-dimensional model to obtain a three-dimensional backscatter model.

[0107] In some embodiments, M two-dimensional backscatter images showing the overall surface information of the object to be inspected are obtained, the three-dimensional imaging device scans the front side, rear side, left side, right side, top side, and bottom side of the object to be inspected to obtain an overall three-dimensional model of the object to be inspected; the data processing device covers the M two-dimensional backscatter images on the surface of the overall three-dimensional model to obtain an overall three-dimensional backscatter model of the object to be inspected.

[0108] In some embodiments, the backscatter imaging device is controlled to move relative to the object to be inspected to scan M regions to obtain M two-dimensional backscatter images, and / or the three-dimensional imaging device is configured to move relative to the object to be inspected to obtain a three-dimensional model.

[0109] In some embodiments, the backscatter imaging device and / or the three-dimensional imaging device is installed on a mobile device. The mobile device is controlled to drive the backscatter imaging device to move to scan M regions to obtain M two-dimensional backscatter images, and / or drive the three-dimensional imaging device to move for three-dimensional imaging. For example, the backscatter imaging device is driven to move to scan the front side, rear side, left side, right side, top side, and bottom side of the object to be inspected, and / or the three-dimensional imaging device is driven to move to scan the front side, rear side, left side, right side, top side, and bottom side of the object to be inspected.

[0110] In some embodiments, the mobile device is controlled to drive the backscatter imaging device and the three-dimensional imaging device to move synchronously or asynchronously.

[0111] In some embodiments, the first backscatter imaging mechanism of the backscatter imaging device is installed on the first moving mechanism of the mobile device, and the first moving mechanism located above the bottom of the object to be inspected is controlled to drive the first backscatter imaging mechanism to move to obtain two-dimensional backscatter images of at least one of the circumferential region, top region, and bottom region of the object to be inspected. For example, the first moving mechanism is controlled to drive the first backscatter imaging mechanism to move to scan at least the front side, rear side, left side, right side, and top side of the object to be inspected.

[0112] In some embodiments, the first three-dimensional imaging mechanism of the three-dimensional imaging device is mounted on the first moving mechanism, and the first moving mechanism is controlled to drive the first three-dimensional imaging mechanism to move, so as to perform three-dimensional imaging on at least one of the circumferential region, the top region, and the bottom region of the object to be inspected. For example, the first moving mechanism is controlled to drive the first three-dimensional imaging mechanism to move, and at least the front side, the rear side, the left side, the right side, and the top side of the object to be inspected are scanned.

[0113] In other embodiments, the first three-dimensional imaging mechanism is mounted on the second moving mechanism of the mobile device, and the second moving mechanism located above the bottom of the object to be inspected is controlled to drive the first three-dimensional imaging mechanism to move, so as to perform three-dimensional imaging on at least one of the circumferential region, the top region, and the bottom region of the object to be inspected.

[0114] Regardless of whether the first backscatter imaging mechanism and the first three-dimensional imaging mechanism are mounted on the same moving mechanism, the movement trajectory of one of them can be determined according to the type, shape, and size of the object to be inspected. For example, when both are mounted on the first moving mechanism, an object recognition module can be configured, and this module can use image recognition technology to obtain vehicle type information (such as size and model, etc.) to determine the movement trajectory. For example, when they are respectively mounted on two moving mechanisms, the object recognition module can be used to determine the movement trajectories of both, or the first three-dimensional imaging mechanism can be used to scan along a fixed trajectory first, and based on the depth image obtained by the scan or the three-dimensional model reconstructed, the vehicle type information is recognized, and then based on this vehicle type information, the movement trajectory of the first backscatter imaging mechanism is determined.

[0115] In some embodiments, the second backscatter imaging mechanism of the backscatter imaging device is mounted on the third moving mechanism of the mobile device, so that the third moving mechanism is located below the bottom of the object to be inspected, and drives the second backscatter imaging mechanism to move to obtain a two-dimensional backscatter image of the bottom region of the object to be inspected. For example, the third moving mechanism is driven to drive the second backscatter imaging mechanism to move below the bottom of the object to be inspected, and the bottom side of the object to be inspected is scanned.

[0116] In some embodiments, the second three-dimensional imaging mechanism of the three-dimensional imaging device is mounted on the third moving mechanism, and the third moving mechanism is controlled to drive the second three-dimensional imaging mechanism to move to obtain a depth image of the bottom region of the object to be inspected. For example, the third moving mechanism is configured to drive the second three-dimensional imaging mechanism to move below the bottom of the object to be inspected, and the bottom side of the object to be inspected is scanned.

[0117] In other embodiments, the second three-dimensional imaging mechanism of the three-dimensional imaging device is mounted on the fourth moving mechanism of the mobile device, so that the fourth moving mechanism is located below the bottom of the object to be inspected, and drives the second three-dimensional imaging mechanism to move to obtain a depth image of the bottom region of the object to be inspected.

[0118] For example, the third moving mechanism may include an object recognition module as described above for the first backscatter imaging mechanism and the first three-dimensional imaging mechanism to determine the size, model, etc. of the object to be examined. The control module may determine the moving stroke of the moving module according to the size information. The moving stroke includes the moving distance of the moving module driving the second backscatter imaging mechanism and the second three-dimensional imaging mechanism.

[0119] In some embodiments, during the scanning process, at least one of the N1 third backscatter imaging mechanisms of the backscatter imaging device is located on at least one of the front side, rear side, left side, right side, top side, and bottom side of the object to be examined, and / or at least one of the N2 third three-dimensional imaging mechanisms 123 of the three-dimensional imaging device is located on at least one of the front side, rear side, left side, right side, top side, and bottom side of the object to be examined.

[0120] Figure 5 Schematically shows a flowchart of obtaining a three-dimensional backscatter model according to another embodiment of the present disclosure. As Figure 5 shown, this embodiment is one of the embodiments of operation S430, specifically including:

[0121] In operation S510, determine the mapping relationship between M two-dimensional backscatter images and M regions on the surface of the three-dimensional model.

[0122] For example, identify the contour edge in a certain region of the object to be examined shown in the two-dimensional backscatter image, and match the same contour edge on a certain region of the surface of the three-dimensional model, then there is a mapping relationship. It can be understood that the embodiments of the present disclosure are not limited to matching based on contour edges. For example, it may also include the shape of a specific position on the object to be examined, etc.

[0123] In operation S520, according to the point cloud of the three-dimensional model within the range of each region, deform the two-dimensional backscatter image having the mapping relationship.

[0124] The point cloud is a set of point data in three-dimensional space and can represent a three-dimensional shape. The point cloud data of the three-dimensional model can be obtained by a three-dimensional imaging device based on the principle of laser measurement or photogrammetry. For example, it can be obtained by devices such as a laser scanner, a depth camera, or a binocular camera.

[0125] In some embodiments, segment the two-dimensional backscatter image to obtain S sub-images, where S is an integer greater than or equal to 2. For each sub-image, determine the point-pixel correspondence between the points in the point cloud and the pixel points of the sub-image. For each sub-image, according to the positional relationship between the points in the point cloud and the point-pixel correspondence, assign three-dimensional information to the pixel points of the sub-image for deformation.

[0126] For example, each two-dimensional backscatter image can be segmented by grid or according to the number of point clouds. Each sub-image is segmented from a local area of the two-dimensional backscatter image. For example, if multiple point clouds form a "square" shape area, then one sub-image can be segmented from the two-dimensional backscatter image corresponding to this area.

[0127] The backscatter image is composed of many pixel points (for example, based on current conventional detectors, the spacing between pixel points is 2 - 3 mm, just for example). The point-pixel correspondence between the points in the point cloud and the pixels in the image can be determined. For example, calibrate the three-dimensional imaging device and the backscatter imaging device to determine the relationship between the coordinate systems of the two (such as the three-dimensional coordinate system and the two-dimensional coordinate system), so as to determine the different expressions of the same position of the object to be inspected in the coordinate systems of the two. Then project the point cloud onto a plane to obtain the coordinates of each point in the two-dimensional coordinate system. Next, based on the two-dimensional coordinates, match each pixel coordinate with the points in the point cloud to determine the point-pixel correspondence.

[0128] The positional relationship between the points in the point cloud is determined by the different three-dimensional coordinate values of each point in the three-dimensional coordinate system. Based on the point-pixel correspondence, each pixel point is characterized by three-dimensional coordinates in three-dimensional space. The positional relationship between the pixel points is consistent with that of the point cloud, thereby realizing the deformation of the sub-image. Taking the above "square" shape as an example, the four pixel points of the "square" are given the spatial three-dimensional information of the corresponding point cloud for deformation.

[0129] In operation S530, cover the M deformed two-dimensional backscatter images on M regions on the surface of the three-dimensional model based on the mapping relationship.

[0130] In some other embodiments of operation S430, first, divide the outer surface of the three-dimensional model into M outer surface regions according to the M regions. Secondly, determine the mapping relationship between the M two-dimensional backscatter images and the M outer surface regions. Finally, the M two-dimensional backscatter images can be covered on the M outer surface regions according to the mapping relationship to obtain a three-dimensional backscatter model.

[0131] For example, project the three-dimensional model in M regions respectively to obtain M two-dimensional projection images, calculate the similarity between any one two-dimensional projection image and the M two-dimensional backscatter images, and determine the mapping relationship between the outer surface region and the two-dimensional backscatter image when the similarity is greater than a threshold (such as 0.9, just for example). Another example is to determine the feature points in each outer surface region and the feature points in each two-dimensional backscatter image according to the characteristics of the outer surface of the object to be inspected, and determine the mapping relationship between the outer surface region and the two-dimensional backscatter image based on the feature points. Among them, the feature points represent information such as the shape and coordinates at specific positions on the outer surface of the object to be inspected.

[0132] In some embodiments, according to the three-dimensional shape of each outer surface region, the two-dimensional backscattering image having a mapping relationship with it is deformed so that the deformed two-dimensional backscattering image fits the three-dimensional shape. The M deformed two-dimensional backscattering images are covered on the M outer surface regions.

[0133] For example, for each two-dimensional backscattering image, determine the feature point information of the outer surface of the object under inspection shown on the image, including at least the two-dimensional coordinates of the vertices and contours at specific positions on the outer surface of the object under inspection (such as the vertices and contours of the trunk, and the vertices and contours of the handle area, etc.) in the image. And determine the feature point information of the corresponding outer surface region, including at least the three-dimensional coordinates of the vertices and contours at specific positions on the outer surface of the object under inspection. Determine the coordinate mapping relationship between the coordinate system of the object under inspection in the two-dimensional backscattering image and the coordinate system of the three-dimensional model, match the feature points on the two-dimensional backscattering image with the feature points of the outer surface region, and perform concave-convex changes on the two-dimensional backscattering image through stretching, deformation, etc. according to the three-dimensional coordinates to fit the three-dimensional shape and size of the outer surface region. Finally, cover it on the corresponding outer surface region. Smoothing, denoising, rendering, etc. can also be further performed to obtain a three-dimensional backscattering model.

[0134] According to the embodiments of the present disclosure, it is possible to display the object under inspection from a three-dimensional perspective using a three-dimensional backscattering model with backscattering information, provide the three-dimensional shape and size information of the object under inspection, overcome the perspective problem of two-dimensional backscattering images and the problem that the superposition of the contours of each item affects the display, improve the overall scanning effect, and facilitate subsequent item search or analysis work.

[0135] Figure 6 A block diagram of an electronic device including a processor according to an embodiment of the present disclosure is schematically shown. The backscattering imaging system according to an embodiment of the present disclosure may include an electronic device 600. Among them, the electronic device in this embodiment is one of the embodiments of the data processing device 130.

[0136] As Figure 6 shown, the electronic device 600 according to an embodiment of the present disclosure includes a processor 601, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 602 or the program loaded from the storage section 608 into the random access memory (RAM) 603. The processor 601 may include, for example, a general microprocessor (such as a CPU), an instruction set processor, and / or a related chipset, and / or a dedicated microprocessor (such as an application specific integrated circuit (ASIC)), etc. The processor 601 may also include on-board memory for caching purposes. The processor 601 may include a single processing unit or multiple processing units for performing different actions of the method flow according to the embodiments of the present disclosure.

[0137] In the RAM 603, various programs and data required for the operation of the electronic device 600 are stored. The processor 601, the ROM 602, and the RAM 603 are connected to each other via a bus 604. The processor 601 performs various operations of the method flow according to the embodiments of the present disclosure by executing programs in the ROM 602 and / or the RAM 603. It should be noted that the programs can also be stored in one or more memories other than the ROM 602 and the RAM 603. The processor 601 can also perform various operations of the method flow according to the embodiments of the present disclosure by executing programs stored in one or more memories.

[0138] According to an embodiment of the present disclosure, the electronic device 600 may further include an input / output (I / O) interface 605, and the input / output (I / O) interface 605 is also connected to the bus 604. The electronic device 600 may further include one or more of the following components connected to the I / O interface 605: an input portion 606 including a keyboard, a mouse, etc. An output portion 607 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc. and a speaker, etc. A storage portion 608 including a hard disk, etc. And a communication portion 609 including a network interface card such as a LAN card, a modem, etc. The communication portion 609 performs communication processing via a network such as the Internet. A drive 610 is also connected to the I / O interface 605 as needed. A removable medium 611, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is installed on the drive 610 as needed so that a computer program read from it can be installed into the storage portion 608 as needed.

[0139] The above describes the embodiments of the present disclosure. However, these embodiments are only for illustrative purposes and are not intended to limit the scope of the present disclosure. Although the embodiments are separately described above, this does not mean that the measures in each embodiment cannot be used advantageously in combination. The scope of the present disclosure is defined by the appended claims and their equivalents. Without departing from the scope of the present disclosure, those skilled in the art can make various substitutions and modifications, and these substitutions and modifications should fall within the scope of the present disclosure.

Claims

1. A backscatter imaging system, comprising: a backscatter imaging device, the backscatter imaging device including at least one radiation source and at least one detector; and a data processing device; wherein, at least one of the radiation sources is configured to emit radiation to scan the entire object to be examined, the entire object including the front side, rear side, left side, right side, top side and bottom side of the object to be examined; at least one of the detectors is configured to receive backscatter signals from the front side, rear side, left side, right side, top side and bottom side of the object to be examined; the data processing device is configured to process the backscatter signals to obtain M two-dimensional backscatter images for displaying the surface information of the entire object to be examined, where M is an integer greater than or equal to 1.

2. The system according to claim 1, wherein, further comprising: a three-dimensional imaging device, configured to scan the front side, rear side, left side, right side, top side and bottom side of the object to be examined to obtain an overall three-dimensional model of the object to be examined; wherein, the data processing device is further configured to cover the M two-dimensional backscatter images on the surface of the overall three-dimensional model to obtain an overall three-dimensional backscatter model of the object to be examined.

3. The system according to claim 2, wherein, further comprising: a mobile device, wherein, the backscatter imaging device and / or the three-dimensional imaging device is installed on the mobile device; the mobile device is configured to drive the backscatter imaging device to move to scan the front side, rear side, left side, right side, top side and bottom side of the object to be examined, and / or drive the three-dimensional imaging device to move to scan the front side, rear side, left side, right side, top side and bottom side of the object to be examined.

4. The system according to claim 3, wherein, the mobile device includes a first moving mechanism, the backscatter imaging device includes a first backscatter imaging mechanism, and the first backscatter imaging mechanism includes a first radiation source and a first detector, wherein, the first backscatter imaging mechanism is installed on the first moving mechanism, and the first moving mechanism is configured to drive the first backscatter imaging mechanism to move to scan at least the front side, rear side, left side, right side and top side of the object to be examined.

5. The system according to claim 4, wherein: the three-dimensional imaging device includes a first three-dimensional imaging mechanism installed on the first moving mechanism, and the first moving mechanism is configured to drive the first three-dimensional imaging mechanism to move to scan at least the front side, rear side, left side, right side and top side of the object to be examined.

6. The system according to claim 4 or 5, wherein: the mobile device includes a third moving mechanism, the backscatter imaging device includes a second backscatter imaging mechanism, and the second backscatter imaging mechanism includes a second radiation source and a second detector, wherein, the second backscatter imaging mechanism is installed on the third moving mechanism, and the third moving mechanism is configured to drive the second backscatter imaging mechanism to move under the bottom of the object to be examined to scan the bottom side of the object to be examined.

7. The system according to claim 6, wherein: The three-dimensional imaging device includes a second three-dimensional imaging mechanism mounted on the third moving mechanism, and the third moving mechanism is configured to drive the second three-dimensional imaging mechanism to move under the bottom of the object to be inspected and scan the bottom side of the object to be inspected.

8. The system according to claim 5, wherein, the first moving mechanism includes: a first robotic arm, wherein the first backscatter imaging mechanism and the first three-dimensional imaging mechanism are mounted on the first robotic arm; wherein the first robotic arm is configured to drive the first backscatter imaging mechanism and the first three-dimensional imaging mechanism to move along a scanning trajectory and scan at least the front side, rear side, left side, right side and top side of the object to be inspected.

9. The system according to claim 8, wherein, the first robotic arm includes a driving base and a robotic arm body mounted on the driving base, and the first backscatter imaging mechanism and the first three-dimensional imaging mechanism are mounted on the robotic arm body; the backscatter imaging system further includes: a ceiling bracket providing a scanning track, wherein the driving base is connected to the ceiling bracket, and the driving base is configured to drive the robotic arm body to move along the scanning track, so that the robotic arm body drives the first backscatter imaging mechanism and the first three-dimensional imaging mechanism to move along the scanning trajectory.

10. The system according to claim 3, wherein, the backscatter imaging device includes N1 third backscatter imaging mechanisms, each of the third backscatter imaging mechanisms includes a third radiation source and a third detector, N1 is an integer greater than or equal to 6, during scanning, the N1 third backscatter imaging mechanisms are located on the front side, rear side, left side, right side, top side and bottom side of the object to be inspected, and at least one third backscatter imaging mechanism is provided on any one side for scanning.

11. The system according to claim 10, wherein, the three-dimensional imaging device includes N2 third three-dimensional imaging mechanisms, N2 is an integer greater than or equal to 6, during scanning, the N2 third three-dimensional imaging mechanisms are located on the front side, rear side, left side, right side, top side and bottom side of the object to be inspected, and at least one third three-dimensional imaging mechanism is provided on any one side for scanning.

12. The system according to claim 11, wherein, the mobile device includes: during scanning, a front moving module located on the front side of the object to be inspected, a rear moving module located on the rear side of the object to be inspected, a left moving module located on the left side of the object to be inspected, a right moving module located on the right side of the object to be inspected, a top moving module located on the top side of the object to be inspected, and a bottom moving module located on the bottom side of the object to be inspected.

13. The system according to claim 12, wherein, the mobile device further includes: a gantry structure including a top cross beam and two side columns supporting the cross beam, wherein the top moving module includes the top cross beam, and the left moving module includes one side column, and the right moving module includes the other side column; During the scanning process, the gantry structure moves in the front-rear direction of the object to be inspected, driving the third backscatter imaging mechanism and / or the third three-dimensional imaging mechanism located on the top side, left side, and right side of the object to be inspected to perform scanning.

14. A backscatter imaging method for a backscatter imaging system including a data processing device and a backscatter imaging device, the backscatter imaging device including at least one radiation source and at least one detector, the method comprising: causing at least one of the radiation sources to emit radiation to scan the entire object to be inspected, the entire object including the front side, rear side, left side, right side, top side, and bottom side of the object to be inspected; causing at least one of the detectors to receive backscatter signals from the front side, rear side, left side, right side, top side, and bottom side of the object to be inspected; causing the data processing device to process the backscatter signals to obtain M two-dimensional backscatter images showing the overall surface information of the object to be inspected, where M is an integer greater than or equal to 1.

Images