Reticle defect detection method, device and machine

Abstract

The application relates to the technical field of integrated circuits, in particular to a mask plate defect detection method and device and a machine. The method comprises the following steps: obtaining first to-be-detected defect information of a to-be-detected defect of a target mask plate; obtaining a preset defect list, wherein the preset defect list comprises a plurality of preset defect information; searching for the first to-be-detected defect information in the preset defect list; and filtering the first to-be-detected defect information in the case that the first to-be-detected defect information of the to-be-detected defect is recorded in the preset defect list. A preset defect list is set, so that a defect white list is obtained. Then, whether the to-be-detected defect affects the normal process of the target mask plate can be quickly determined by determining whether the first to-be-detected defect information of the to-be-detected defect is located in the preset defect list. Further, in the case that the first to-be-detected defect information of the to-be-detected defect is recorded in the preset defect list, it is considered that the to-be-detected defect does not affect the normal use of the mask plate, the first to-be-detected defect information can be filtered, and the machine does not alarm.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuits, and in particular to a mask defect detection method, device and machine. BACKGROUND

[0002] In actual production of semiconductor devices, mask is used frequently. This makes it inevitable that defects will fall on the film surface of the mask. This will affect the normal photolithography process. Therefore, the mask often needs to be detected.

[0003] Sometimes, the defect is located in a non-working area, and the defect does not affect the normal process. In order not to affect the production capacity, the mask with the defect can be used normally. However, since the defect still exists, when the mask is detected, the detection machine will trigger an alarm for this kind of mask, affecting the efficiency of semiconductor preparation. SUMMARY

[0004] Therefore, it is necessary to provide a mask defect detection method, device and machine to solve the problem of low efficiency of semiconductor preparation in the prior art.

[0005] In order to achieve the above-mentioned purpose, on the one hand, a mask defect detection method is provided, comprising:

[0006] Obtaining first defect information to be tested of a defect to be tested of a target mask;

[0007] Obtaining a preset defect list, the preset defect list comprising at least one preset defect information;

[0008] Finding the first defect information to be tested in the preset defect list;

[0009] Filtering the first defect information to be tested in the case that the first defect information to be tested of the defect to be tested is recorded in the preset defect list.

[0010] In one of the embodiments, after finding the first defect information to be tested in the preset defect list, the method comprises:

[0011] In the case that the first defect information to be tested of the defect to be tested is not recorded in the preset defect list, marking the first defect information to be tested as a new defect;

[0012] Performing a repetitive defect test on the new defect;

[0013] In the case that no repetitive defect appears, adding the first defect information to be tested of the new defect to the preset defect list.

[0014] In one of the embodiments, after the new defect is subjected to the repetitive defect test, the method comprises:

[0015] In the case of the repetitive defect, it is determined that the target mask needs to be cleaned.

[0016] In one of the embodiments, the defect information comprises size information and / or position information.

[0017] In one of the embodiments, the defect information comprises size information.

[0018] After the first defect information of the target mask is obtained, the method comprises:

[0019] In the case that the size in the first defect information is greater than the defect control specification size, the detection machine table for mask defects is replaced, and the second defect information of the defect under test is detected by using the replaced detection machine table.

[0020] In the case that the size in the second defect information is not greater than the defect control specification size, it is determined whether the defect under test has moved based on the preset defect list, the preset error value and the second defect information of the defect under test.

[0021] In one of the embodiments, in the case that the size in the second defect information is not greater than the defect control specification size, it is determined whether the defect under test has moved based on a preset error range and the second defect information of the defect under test, which comprises:

[0022] Based on the preset defect list and the preset error value, an error range of the defect under test is calculated.

[0023] Based on whether the second defect information is located in the error range, it is determined whether the defect under test has moved.

[0024] In one of the embodiments, the preset error value comprises a position error value and a size error value, the position error value is ±0.5 μm, and the size error value is ±5 nm.

[0025] In one of the embodiments, after the size in the first defect information is greater than the defect control specification size, the detection machine table for mask defects is replaced, and the second defect information of the defect under test is detected by using the replaced detection machine table, the method comprises:

[0026] In the case that the size in the second defect information is greater than the defect control specification size, it is determined that the target mask needs to be cleaned.

[0027] In one aspect, a reticle defect detection device is provided, the reticle defect detection device comprising:

[0028] a first obtaining module configured to obtain first defect information of a defect to be detected of a target reticle;

[0029] a second obtaining module configured to obtain a preset defect list, the preset defect list comprising at least one preset defect information;

[0030] a searching module configured to search for the first defect information in the preset defect list;

[0031] a filtering module configured to filter the first defect information in a case that the first defect information of the defect to be detected is recorded in the preset defect list.

[0032] In one aspect, a reticle defect detection device is provided, the reticle defect detection device comprising:

[0033] The reticle defect detection method, device and machine table of the present application have the following beneficial effects: by setting a preset defect list, a defect white list is obtained. Then, by determining whether the first defect information of the defect to be detected is in the preset defect list, it can be quickly determined whether the defect to be detected affects the normal process of the target reticle. Further, in a case that the first defect information of the defect to be detected is recorded in the preset defect list, it can be considered that the defect to be detected does not affect the normal use of the reticle, and therefore the first defect information can be filtered, and the detection machine table does not alarm, so that the preparation process of the semiconductor can proceed smoothly. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0035] Figure 1 a flowchart of the reticle defect detection method provided in the first embodiment;

[0036] Figure 2 a flowchart of the reticle defect detection method provided in the second embodiment;

[0037] Figure 3 a flowchart of the reticle defect detection method provided in the third embodiment;

[0038] Figure 4 Figure 1 is a schematic diagram of a mask inspection apparatus according to one embodiment.

[0039] For a better understanding of those embodiments and / or examples of the application herein disclosed, reference can be made to the accompanying drawings. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed applications, presently described embodiments and / or examples, and the best mode presently contemplated of those applications. DETAILED DESCRIPTION

[0040] For the purpose of the present application, the application will be described in more detail with reference to the attached drawings. The preferred embodiments of the present application are shown in the drawings. However, the present application can be realized in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0042] As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It should also be understood that the term "comprising" or "comprises" when used in this specification, is taken to mean the presence of stated features, integers, steps, operations, elements, and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0043] In one embodiment, referring to Figure 1 , a mask inspection method is provided, comprising the steps of:

[0044] Step S100: obtaining first defect information of a defect to be inspected of a target mask.

[0045] Step S200: obtaining a preset defect list, the preset defect list comprising at least one preset defect information.

[0046] Step S300: searching for the first defect information in the preset defect list.

[0047] Step S400: filtering the first defect information in a case that the first defect information of the defect to be inspected is recorded in the preset defect list.

[0048] In step S100, the target mask has a defect to be measured. When the target mask is detected by a detection machine, the position and size of the defect to be measured can be obtained. As an example, the first defect information of the defect to be measured can include the specific position and size of the defect to be measured. Further, a coordinate system can be established based on the target mask, and the specific position of the defect to be measured can be the position of the center of the defect to be measured in the coordinate system. The specific position can be represented by an X-axis coordinate (Location X) and a Y-axis coordinate (Location Y). The specific size of the defect to be measured can be the length or width of the defect to be measured. The above-mentioned first defect information of the defect to be measured is only an example, and in actual embodiments, the first defect information of the defect to be measured is not limited to the position and size.

[0049] In step S200, the preset defect list can be a defect white list. As an example, the preset defect list can be obtained from a historical database. The preset defect list includes a plurality of preset defect information, and the defects corresponding to the preset defect information do not affect the normal use of the corresponding mask. As an example, the preset defect information can include the mask number, the type of the machine for detecting the mask, the specific position and size of the defect, etc.

[0050] In step S300, it can be determined whether the first defect information to be measured is in the preset defect list. As an example, the mask number and the type of the detection machine of the target mask can be determined first, and the corresponding specific position and size of the defect can be filtered out from the preset defect list. Then, the position of the defect to be measured is compared with the position of the defect in the preset defect list, and the size of the defect to be measured is compared with the size of the defect in the preset defect list. Of course, in this step, the first defect information to be measured can be compared with the specific values in the preset defect list, or the first defect information to be measured can be compared with the range values of the position and size calculated based on the preset defect list. The present embodiment does not limit the specific way of searching for the first defect information to be measured in the preset defect list.

[0051] In step S400, if the first defect information to be measured is recorded in the preset defect list, it can be considered that the defect to be measured belongs to the defect white list. At this time, the defect to be measured does not affect the normal use of the mask, so the first defect information to be measured can be filtered out, and the detection machine can not alarm.

[0052] In addition, after step S300, please refer to Figure 2 , which can also include:

[0053] Step S410: If the first defect information to be measured is not recorded in the preset defect list, the first defect information to be measured is marked as a new defect.

[0054] Step S420: performing a repeatability defect test on the new defect.

[0055] Step S430: adding the first defect-under-test information of the new defect to the preset defect list in the case that no repeatability defect occurs.

[0056] Step S431: determining that the target mask needs to be cleaned in the case that repeatability defect occurs.

[0057] In step S410, in the case that the first defect-under-test information of the defect-under-test is not recorded in the preset defect list, it is needed to determine whether the new defect will affect the normal process of the target mask.

[0058] In step S420, at this time, the method of repeatability defect test can be used to verify whether the new defect will affect the normal process of the target mask. Exemplarily, a wafer can be obtained, and after the wafer is coated with photoresist, the wafer is exposed using the target mask. Then, the wafer can be sent to a wafer inspection machine for defect detection analysis. If repeatability defect occurs, it is considered that the new defect affects the normal process of the target mask. If no repeatability defect occurs, it is considered that the new defect does not affect the normal process of the target mask. It can be understood that the above-mentioned repeatability defect test is only exemplary.

[0059] In step S430, in the case that no repeatability defect occurs, it can be considered that the new defect does not affect the normal process of the target mask, at this time, the first defect-under-test information (position and size) of the new defect can be added to the preset defect list.

[0060] In step S431, in the case that repeatability defect occurs, it can be considered that the new defect affects the normal process of the target mask, at this time, it can be determined that the target mask needs to be sent for cleaning.

[0061] In the embodiment, by setting the preset defect list, a defect white list is obtained. Then, by determining whether the first defect-under-test information of the defect-under-test is located in the preset defect list, it can be quickly determined whether the defect-under-test affects the normal process of the target mask. Further, in the case that the first defect-under-test information of the defect-under-test is recorded in the preset defect list, it can be considered that the defect-under-test does not affect the normal use of the mask, therefore, the first defect-under-test information can be filtered, and further, the inspection machine does not alarm, so that the preparation process of the semiconductor can be smoothly carried out.

[0062] In one embodiment, the first defect-under-test information includes the size of the defect-under-test. The preset defect list includes a defect control specification size of the target mask. It can be understood that the defect control specification size can be used to represent the maximum size of the acceptable defect of the target mask.

[0063] Correspondingly, after step S100, please refer to Figure 3 , comprising:

[0064] Step S500: In the case that the size of the first defect information under test is greater than the defect control specification size, replacing the detection machine of the mask defect, and detecting the second defect information under test of the defect under test by using the replaced detection machine.

[0065] Step S510: In the case that the size in the second defect information under test is not greater than the defect control specification size, determining whether the defect under test has a movement condition based on the preset defect list, the preset error value and the second defect information under test of the defect under test.

[0066] In step S500, in the case that the size of the first defect information under test is greater than the defect control specification size, it can be considered that the data is unreliable due to aging or non-periodic calibration of the detection machine. At this time, the target mask can be detected again by replacing the detection machine, and the second defect information under test of the same defect under test is obtained. The second defect information under test can include a new position and a new size of the defect under test.

[0067] In step S510, in the case that the size in the second defect information under test is not greater than the defect control specification size, it can be indicated that the defect under test cannot be found in the preset defect list due to the offset of the defect under test. Therefore, the embodiment provides a preset error value, which can be manually set or statistically obtained from historical data.

[0068] In one example, step S510 comprises:

[0069] Step S511: Calculating an error range of the defect under test based on the preset defect list and the preset error value.

[0070] Step S512: Determining whether the defect under test has a movement condition based on whether the second defect information under test is within the error range.

[0071] In step S511, as an example, the preset error value includes a position error value and a size error value, the position error value includes ±0.5 μm, and the size error value includes ±5 nm. It can be understood that the above-mentioned position error value and size error value are only exemplary descriptions, and in actual embodiments, the error value and size error value are not limited to the above-mentioned values.

[0072] In step S512, in one possible example, the sum or difference between the position of the second to-be-inspected defect information and the position error value is calculated to obtain a position error range. Also, the sum or difference between the size of the second to-be-inspected defect information and the size error value is calculated to obtain a size error range. Then, the preset defect list is compared with the error range to determine whether the to-be-inspected defect has moved. In another possible example, the sum or difference between the position of the defects of the same wafer in the preset defect list and the position error value is calculated to obtain a position error range. Also, the sum or difference between the size of the defects of the same wafer in the preset defect list and the size error value is calculated to obtain a size error range. Then, the second to-be-inspected defect information is compared with the error range to determine whether the to-be-inspected defect has moved.

[0073] In addition, when the to-be-inspected defect has a large movement, i.e., the to-be-inspected defect is out of the error range, the target mask can be repeatedly tested to determine whether the target mask needs to be cleaned. When the to-be-inspected defect does not have a large movement, i.e., the to-be-inspected defect is not out of the error range, the first to-be-inspected defect information and the second to-be-inspected defect information are filtered.

[0074] In addition, referring to Figure 3 , step S500 can further include:

[0075] Step S520: In the case where the size of the to-be-inspected defect in the second to-be-inspected defect information is greater than the defect control specification size, it is determined that the target mask needs to be cleaned.

[0076] In the case where the size of the to-be-inspected defect is determined to be large by both the two different inspection machines, it can be confirmed that the size of the to-be-inspected defect is large. At this time, it can be determined that the target mask needs to be cleaned. Then, the target mask should be cleaned in time.

[0077] Referring to Table 1, Table 1 exemplarily shows defect information.

[0078] Mask ID Grada Type Location X Location Y Size Spec Mask 1 G11 KRF 576.31 281.3 57nm 45nm Mask 2 G11 KRF 1561.1 98.7 61nm 45nm Mask 3 G11 KRF 1281.3 76.31 48nm 45nm Mask 4 G11 KRF 798.7 381.3 49nm 45nm

[0079] It should be understood that, although Figure 1 , Figure 2 and Figure 3 the flowcharts show the steps in sequence according to the arrows, the steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, the steps have no strict order limitation and can be executed in other orders. Moreover, Figure 1 , Figure 2 and Figure 3At least one of the steps in the method can include a plurality of steps or a plurality of stages, which are not necessarily performed at the same time, but can be performed at different times, and the order of the steps or stages is not necessarily sequential, but can be performed alternately or alternately with at least one of the other steps or the steps or stages in the other steps.

[0080] In one embodiment, as shown in Figure 4 A reticle defect detection device is provided, comprising: a first acquisition module, a second acquisition module, a search module and a filtering module, wherein:

[0081] The first acquisition module is configured to acquire first defect information of a target reticle.

[0082] The second acquisition module is configured to acquire a preset defect list, wherein the preset defect list comprises at least one preset defect information.

[0083] The search module is configured to search for the first defect information in the preset defect list.

[0084] The filtering module is configured to filter the first defect information if the first defect information of the target defect is recorded in the preset defect list.

[0085] In one embodiment, the reticle defect detection device further comprises a marking module, which is configured to mark the first defect information as a new defect if the first defect information of the target defect is not recorded in the preset defect list; perform a repetitive defect test on the new defect; and add the first defect information of the new defect to the preset defect list if no repetitive defect is found.

[0086] In one embodiment, the marking module is configured to determine that the target reticle needs to be cleaned if a repetitive defect is found.

[0087] In one embodiment, the reticle defect detection device further comprises a replacement module, which is configured to replace a detection machine for reticle defects if the size of the first defect information is greater than the defect control specification size; use the replaced detection machine to detect second defect information of the target defect; and determine whether the target defect has moved based on a preset error value and the second defect information of the target defect if the size in the second defect information is not greater than the defect control specification size.

[0088] In one embodiment, the replacement module is configured to calculate an error range of the target defect based on the preset defect list and the preset error value; and determine whether the target defect has moved based on whether the second defect information is within the error range.

[0089] In one embodiment, the replacement module is configured to determine that the target reticle needs to be cleaned when the size in the second to-be-inspected defect information is greater than the defect control specification size.

[0090] The specific limitations of the reticle defect detection device can refer to the limitations of the reticle defect detection method described above, which will not be repeated here. Each module in the above reticle defect detection device can be realized by software, hardware and their combination. The above modules can be embedded in or independent of the processor in the computer device in hardware form, or can be stored in the memory in the computer device in software form, so that the processor calls and executes the operations corresponding to the above modules.

[0091] Based on the same inventive concept, in one embodiment, a reticle defect detection machine is provided. The controller of the reticle defect detection machine performs the reticle defect detection method formed by any one or more embodiments of the present application and their combinations.

[0092] In one embodiment, a computer device is also provided, which includes a memory and a processor, the memory stores a computer program, and the processor implements the steps in the above method embodiments when executing the computer program.

[0093] In one embodiment, a computer readable storage medium is provided, which stores a computer program, and the computer program is executed by a processor to implement the steps in the above embodiments.

[0094] In one embodiment, a computer program product is provided, which includes a computer program, and the computer program is executed by a processor to implement the steps in the above method embodiments.

[0095] In the description of the present application, the description of the terms "some embodiments", "other embodiments", "ideal embodiments" and the like means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily mean the same embodiment or example. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that "the present embodiment" or "one embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily mean the same embodiment.

[0096] Any technical features in the above-described embodiments can be combined in any manner, and for the sake of brevity, not all possible combinations are described, however, any combination of the technical features is considered to be within the scope of the present application.

[0097] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but should not be understood as a limitation on the patent scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims. The above-described is only the preferred implementation manner of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made by using the content of the present application specification and drawings, or direct / indirect application in other related technical fields is included in the patent protection scope of the present application.

Claims

1. A method of detecting defects in a reticle, the method comprising: The method comprises the following steps: acquiring first defect information of a defect to be detected of a target mask; acquiring a preset defect list, wherein the preset defect list comprises at least one preset defect information; searching for the first defect information in the preset defect list; filtering the first defect information of the defect to be detected in a case where the first defect information is recorded in the preset defect list; the defect information comprises size information; after the step of acquiring the first defect information of the defect to be detected of the target mask, the method further comprises the following steps: in a case where the size in the first defect information is greater than a defect control specification size, replacing a detection machine for mask defects, and detecting second defect information of the defect to be detected by using the replaced detection machine; in a case where the size in the second defect information is not greater than the defect control specification size, determining whether the defect to be detected has moved based on the preset defect list, a preset error value and the second defect information of the defect to be detected; when the defect to be detected has moved, performing repetitive testing on the target mask to determine whether the target mask needs to be cleaned; and when the defect to be detected has not moved, filtering the first defect information and the second defect information.

2. The method of claim 1, wherein after the step of searching for the first defect information in the preset defect list, the method further comprises the following steps: in a case where the first defect information of the defect to be detected is not recorded in the preset defect list, marking the first defect information as a new defect; performing repetitive defect testing on the new defect; in a case where no repetitive defect has occurred, adding the first defect information of the new defect to the preset defect list.

3. The method of claim 2, wherein after the step of performing repetitive defect testing on the new defect, the method further comprises the following steps: in a case where a repetitive defect has occurred, determining that the target mask needs to be cleaned.

4. The method of claim 1, wherein the defect information further comprises position information.

5. The method of claim 1, wherein in a case where the size in the second defect information is not greater than the defect control specification size, determining whether the defect to be detected has moved based on the preset defect list, a preset error value and the second defect information of the defect to be detected, the method further comprises the following steps: calculating an error range of the defect to be detected based on the preset defect list and the preset error value; determining whether the defect to be detected has moved based on whether the second defect information is located in the error range.

6. The method of claim 1, wherein the preset error value comprises a position error value and a size error value, the position error value is ±0.5 μm, and the size error value is ±5 nm.

7. The method of claim 1, wherein after the step of replacing the detection machine for mask defects in a case where the size in the first defect information is greater than the defect control specification size, and detecting second defect information of the defect to be detected by using the replaced detection machine, the method further comprises the following steps: in a case where the size in the second defect information is greater than the defect control specification size, determining that the target mask needs to be cleaned.

8. A reticle defect detection apparatus, characterized by, the mask defect detection device comprises: a first acquisition module, configured to acquire first defect information of a defect to be detected of a target mask; The second acquisition module is configured to acquire a preset defect list, wherein the preset defect list comprises at least one preset defect information. The searching module is configured to search the first defect information to be tested in the preset defect list. The filtering module is configured to filter the first defect information to be tested in the case that the first defect information to be tested of the defect to be tested is recorded in the preset defect list. The mask defect detection device further comprises a replacement module, which is configured to replace the detection machine for mask defects in the case that the size of the first defect information to be tested is greater than the defect control specification size, and detect second defect information to be tested of the defect to be tested by using the replaced detection machine; and determine whether the defect to be tested moves based on the preset defect list, the preset error value and the second defect information to be tested of the defect to be tested in the case that the size in the second defect information to be tested is not greater than the defect control specification size. When the defect to be tested moves, the target mask is repeatedly tested to determine whether the target mask needs to be cleaned; and when the defect to be tested does not move, the first defect information to be tested and the second defect information to be tested are filtered.

9. A reticle defect detection machine, comprising: The controller of the mask defect detection machine executes the mask defect detection method according to any one of claims 1-7.

Images