Headset and control method thereof

Abstract

The invention discloses a headphone and a control method of the headphone, and relates to the technical field of headphones. The headset comprises two headset bodies, and any headset body comprises a shell, a turnover piece, a control circuit, a drying circuit and an earmuff. The earmuff is arranged on the shell and comprises a first ear pad, an isolating layer and a second ear pad which are stacked; the overturning piece is used for overturning the earmuffs so as to enable the first ear pad and the second ear pad to exchange positions; the drying circuit is used for drying the ear pad, close to the shell, in the first ear pad and the second ear pad in a drying state; the control circuit is electrically connected with the drying circuit and the overturning piece and used for controlling the overturning piece to overturn the earmuffs and controlling the drying circuit to be in a drying state under the condition that a set trigger event occurs.

Description

Technical Field

[0001] This application relates to the technical field of headphones, and more particularly, to a headphone and a control method for the headphone. Background Art

[0002] Currently, headphones are used more and more widely. Headphones are usually designed with wraparound earcups, which can not only improve the user's wearing experience, but also greatly improve the passive noise reduction effect of the headphones.

[0003] However, in high-temperature environments or scenarios such as when users are exercising vigorously, the sweat produced by users easily seeps into the earcups, resulting in the earcups becoming damp. This not only reduces the contact feel between the user and the headphones, but also has a negative impact on the electronic components in the headphones. Summary of the Invention

[0004] One object of this application is to provide a new headphone.

[0005] According to the first aspect of this application, there is provided a headphone, including two headphone bodies. Any one of the headphone bodies includes: a housing, a flipping member, a control circuit, a drying circuit, and an earcup; wherein:

[0006] The earcup is disposed on the housing and includes a first earpad, an isolation layer, and a second earpad stacked thereon;

[0007] The flipping member is used to flip the earcup so that the first earpad and the second earpad exchange positions;

[0008] The drying circuit is used to dry the earpad close to the housing among the first earpad and the second earpad in the drying state;

[0009] The control circuit is electrically connected to the drying circuit and the flipping member respectively, and is used to control the flipping member to flip the earcup and the drying circuit to be in the drying state when a set trigger event occurs.

[0010] Optionally, the set trigger event is that the current humidity of the earpad far from the housing is greater than a preset humidity. The headphone body further includes:

[0011] A first humidity sensor, which is disposed at the first earpad and connected to the control circuit, and is used to detect the current humidity of the first earpad;

[0012] A second humidity sensor, which is disposed at the second earpad and connected to the control circuit, and is used to detect the current humidity of the second earpad;

[0013] The control circuit is further configured to obtain a current humidity of the ear pad of the first ear pad and the second ear pad that is away from the housing, and determine that the set trigger event occurs when the current humidity of the ear pad that is away from the housing is greater than a preset humidity.

[0014] Optionally, the earphone body further includes:

[0015] a temperature sensor, the temperature sensor being disposed on a surface of the housing close to the earmuff, electrically connected to the control circuit, and configured to detect a current temperature of the surface of the housing close to the earmuff;

[0016] The control circuit is further configured to control the drying circuit to be in a cooling state within a preset time period when the drying circuit is in a drying state and the current temperature is greater than a preset temperature.

[0017] Optionally, the earphone body further includes:

[0018] A prompt circuit, the prompt circuit is electrically connected to the control circuit and is used to output flip prompt information;

[0019] The control circuit is also used to control the prompt circuit to output flip prompt information when the set trigger event occurs.

[0020] Optionally, the earphone body further includes:

[0021] An input control, the input control being electrically connected to the control circuit and configured to receive a flip confirmation indication;

[0022] The control circuit is specifically used to control the prompt circuit to output flip prompt information when the set trigger event occurs, and to control the flip member to flip the earmuff and the drying circuit to be in a drying state when a flip confirmation indication is received through the input control.

[0023] Optionally, the flipping member comprises: a gear, a connecting rod and a driving motor, wherein the gear is rotationally connected to the edge of the isolation layer, and the gear, the connecting rod and the driving motor are sequentially transmission-connected;

[0024] The control circuit is specifically used to control the driving motor to rotate when a set trigger event occurs. When the driving motor rotates, the gear is driven to rotate through the connecting rod, so that the isolation layer drives the earmuff to flip.

[0025] According to a second aspect of the present application, a method for controlling a headset is provided, the method being applied to the headset as described in any one of the first aspects, comprising:

[0026] Detect whether a set trigger event occurs;

[0027] In the case where the set trigger event occurs, control the flipping member in the headset to flip the earcups in the headset and the drying circuit in the headset to be in a drying state.

[0028] Optionally, detecting whether the set trigger event occurs includes:

[0029] Obtain the current humidity of the earpad in the first earpad and the second earpad of the earcup that is far from the housing;

[0030] In the case where the current humidity of the earpad far from the housing in the headset is greater than a preset humidity, determine that the set trigger event occurs.

[0031] Optionally, after controlling the flipping member in the headset to flip the earcups in the headset and the drying circuit in the headset to be in a drying state, the method further includes:

[0032] Obtain the current temperature at the surface of the housing in the headset near the earcup;

[0033] In the case where the drying circuit is controlled to be in a drying state and the current temperature is greater than a preset temperature, control the drying circuit to be in a cooling state for a preset duration.

[0034] Optionally, in the case where the set trigger event occurs, controlling the flipping member in the headset to flip the earcups in the headset and the drying circuit in the headset to be in a drying state includes:

[0035] In the case where the set trigger event occurs, control the prompt circuit in the headset to output a flipping prompt message;

[0036] And, control the flipping member in the headset to flip the earcups in the headset and the drying circuit in the headset to be in a drying state.

[0037] Optionally, controlling the flipping member in the headset to flip the earcups in the headset and the drying circuit in the headset to be in a drying state includes:

[0038] In the case where a flipping confirmation instruction is received through the input control in the headset, control the flipping member in the headset to flip the earcups in the headset and the drying circuit in the headset to be in a drying state.

[0039] According to a third aspect of the present application, there is provided a control device for a head-mounted earphone, which is applied to the head-mounted earphone according to any one of the first aspects, and includes:

[0040] A detection module, configured to detect whether a set trigger event occurs;

[0041] A control module, configured to control a flipping member in the head-mounted earphone to flip an earcup in the head-mounted earphone and a drying circuit in the head-mounted earphone to be in a drying state when the set trigger event occurs.

[0042] According to a fourth aspect of the present application, there is provided a head-mounted earphone, which includes the control device of the head-mounted earphone according to the third aspect;

[0043] Alternatively, the head-mounted earphone includes a memory and a processor, the memory is configured to store computer instructions, and the processor is configured to call the computer instructions from the memory to execute the method according to any one of the first aspects.

[0044] According to a fifth aspect of the present application, there is provided a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, the method according to any one of the first aspects is implemented.

[0045] The present application provides a head-mounted earphone, which includes two earphone bodies. Any one of the earphone bodies includes: a housing, a flipping member, a control circuit, a drying circuit, and an earcup; wherein: the earcup is arranged on the housing and includes a first earpad, an isolation layer, and a second earpad which are stacked; the flipping member is configured to flip the earcup so that the first earpad and the second earpad exchange positions; the drying circuit is configured to dry the earpad close to the housing among the first earpad and the second earpad in a drying state; the control circuit is electrically connected to the drying circuit and the flipping member respectively, and is configured to control the flipping member to flip the earcup and the drying circuit to be in a drying state when a set trigger event occurs. This head-mounted earphone can solve the problem that the sweat generated by the user easily penetrates into the earcup, resulting in the earcup being damp, thereby reducing the contact skin feeling between the user and the head-mounted earphone, and having a negative impact on the electronic devices in the head-mounted earphone.

[0046] Through the following detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings, other features and advantages of the present application will become clear. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The drawings incorporated in the specification and constituting a part of the specification illustrate embodiments of the present application, and together with the description are used to explain the principles of the present application.

[0048] Figure 1 is a structural schematic diagram of a head-mounted earphone provided by the present applicationFigure 1 ;

[0049] Figure 2 is a schematic diagram of the structure of a head-mounted earphone provided by the present application Figure 2 ;

[0050] Figure 3 is a schematic diagram of the structure of a head-mounted earphone body provided by the present application;

[0051] Figure 4 is a schematic diagram of the flowchart of a control method for a head-mounted earphone provided by the present application;

[0052] Figure 5 is a schematic diagram of the structure of a control device for a head-mounted earphone provided by the present application;

[0053] Figure 6 A schematic diagram of the structure of a head-mounted earphone provided by the present application Figure 3 . Detailed implementation manners

[0054] Now, various exemplary embodiments of the present application will be described in detail with reference to the accompanying drawings. It should be noted that: Unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application.

[0055] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0056] Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such technologies, methods, and devices should be regarded as part of the specification.

[0057] In all examples shown and discussed herein, any specific values should be construed as merely exemplary and not as a limitation. Therefore, other examples of exemplary embodiments may have different values.

[0058] It should be noted that: Like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0059] The present application provides a head-mounted earphone, as Figure 1 , Figure 2 and Figure 3 shown, including two earphone bodies, and any one of the earphone bodies includes: a housing 20, a flipping member 40, a control circuit 50, a drying circuit 60, and an ear cup 30; wherein:

[0060] The earcup 30 is provided on the housing and includes a first earpad 301, an isolation layer 302, and a second earpad 303 that are stacked;

[0061] The flipping member 40 is used to flip the earcup 30 so that the first earpad 301 and the second earpad 302 exchange positions;

[0062] The drying circuit 60 is used to dry the earpad close to the housing among the first earpad 301 and the second earpad 302 in the drying state;

[0063] The control circuit 50 is electrically connected to the drying circuit 60 and the flipping member 40 respectively, and is used to control the flipping member 40 to flip the earcup 30 and the drying circuit 60 to be in the drying state when a set trigger event occurs.

[0064] Among them, the two earphone bodies are respectively a left earphone body for the user to wear on the left ear and a right earphone body for the user to wear on the right ear. As Figure 1 shown, the head-mounted earphone further includes a headband 10 connecting the two earphone bodies.

[0065] In this embodiment, any one of the earphone bodies includes: a housing 20, a flipping member 40, a control circuit 50, a drying circuit 60, and an earcup 30. The present application does not limit the installation positions of the flipping member 40, the control circuit 50, and the drying circuit 60, as long as the installation positions of the corresponding components do not affect the functions of the components.

[0066] As Figure 2 shown in the longitudinal section of the earcup, the earcup 30 is provided on the housing 20 and includes a first earpad 301, an isolation layer 302, and a second earpad 303 that are stacked. It can be understood that Figure 2 in the figure, the first earpad 301 is close to the housing 20 and the second earpad 303 is far from the housing as an example for illustration.

[0067] In one example, the materials of the first earpad 301 and the second earpad 302 are sponge.

[0068] When the head-mounted earphone is in the wearing state, if the first earpad 301 is close to the housing 20 and the second earpad 303 is far from the housing 20, the second earpad 303 contacts the user's ear. At this time, the sweat generated by the user will seep into the second earpad 303. Due to the existence of the isolation layer 302, the first earpad 301 will still remain dry. Correspondingly, if the second earpad 303 is close to the housing 20 and the first earpad 301 is far from the housing 20, the first earpad 301 contacts the user's ear. At this time, the sweat generated by the user will seep into the first earpad 301. Due to the existence of the isolation layer 302, the second earpad 303 will still remain dry.

[0069] The flipping member 40 can flip the earcups 30 so that the first earpad 301 and the second earpad 303 exchange positions. Specifically, when the second earpad 303 is close to the housing 20 and the first earpad 301 is away from the housing 20, after the flipping member 40 flips the earcups 30, the first earpad 301 is close to the housing 20 and the second earpad 303 is away from the housing 20. Also, when the first earpad 301 is close to the housing 20 and the second earpad 303 is away from the housing 20, after the flipping member 40 flips the earcups 30, the second earpad 303 is close to the housing 20 and the first earpad 301 is away from the housing 20.

[0070] The drying circuit 60 is used to dry the earpad that is close to the housing 20 among the first earpad 301 and the second earpad 302 in the drying state. In one example, the drying circuit 60 is located on the surface of the housing 20 close to the earcups 30, where the drying circuit 60 is specifically a heating wire.

[0071] The control circuit 50 is used to control the flipping member 40 to flip so that the first earpad 301 and the second earpad 303 exchange positions when a set trigger event occurs, and the drying circuit 60 is in the drying state to dry the earpad that is close to the housing 20 among the first earpad 301 and the second earpad 303. It can be understood that the control circuit 50 is also used to detect whether the set trigger event occurs. The control circuit 50 can be exemplarily arranged in the inner cavity of the housing 20 and is a processor. And the two headphone bodies included in the head-mounted headphones can share the same control circuit 50.

[0072] Correspondingly, the control circuit 50 is also used to control the drying circuit 60 to be in the non-drying state and no longer control the flipping member 40 to flip when the set trigger event does not occur.

[0073] In one embodiment, the set trigger event can specifically be an event that the current humidity of the earpad away from the housing 20 is greater than the preset humidity. The preset humidity is the minimum humidity of the earpad that affects the contact skin feeling between the user and the head-mounted headphones and will have a negative impact on the electronic devices of the head-mounted headphones. The preset humidity can be obtained based on experience or experiments.

[0074] In another embodiment, the set trigger event can also specifically be a flipping instruction event that receives a user input to instruct the flipping member 40 to flip. In this embodiment, an input button can be set on the housing for the user to input the flipping instruction. When the user perceives that the sweat generated by him / her easily seeps into the earcup and causes the earcup to be damp, and the sweat has a negative impact on the electronic devices in the head-mounted headphones, the user triggers the input button to input a flipping instruction event to the head-mounted headphones.

[0075] Based on the above content, taking the first ear pad 301 of the first ear pad 301 and the second ear pad 303 as an example, the headset provided by the present application can achieve: when the user wears the headset, the sweat generated by the user penetrates into the first ear pad 301, causing the current humidity of the first ear pad 301 to be greater than the preset humidity, or when the user perceives that the sweat generated by the user is easy to penetrate into the earmuff, causing the earmuff to be wet and the sweat has a negative impact on the electronic components in the headset, the input button is triggered to input a flip instruction to the headset; the control circuit 50 detects the occurrence of the set trigger event, controls the flip member 40 to flip the earmuff 30 and the drying circuit 60 to be in a drying state; the flip member 40 flips the earmuff based on the control of the control circuit 50, so that the second ear pad 303 and the first ear pad 301 exchange positions, at which time the second ear pad 303 is away from the housing 20 and in contact with the user's ear, and the first ear pad 301 is close to the housing 20; because the drying circuit 60 is in the drying state, the drying circuit 60 can dry the sweat in the first ear pad 301. Based on this, the headphones provided in the present application can solve the problem that the sweat generated by the user easily penetrates into the earmuffs, causing the earmuffs to become damp, thereby reducing the skin contact feel between the user and the headphones, and causing negative impacts on the electronic components in the headphones.

[0076] The present application provides a headset, including two headset bodies, each of which includes: a housing, a flip member, a control circuit, a drying circuit and an earmuff; wherein: the earmuff is arranged on the housing, including a first ear pad, an isolation layer and a second ear pad arranged in layers; the flip member is used to flip the earmuff so that the first ear pad and the second ear pad are exchanged; the drying circuit is used to dry the ear pad of the first ear pad and the second ear pad close to the housing in a drying state; the control circuit is electrically connected to the drying circuit and the flip member respectively, and is used to control the flip member to flip the earmuff and the drying circuit to be in a drying state when a set trigger event occurs. The headset can solve the problem that the sweat generated by the user easily penetrates into the earmuff, causing the earmuff to become wet, thereby reducing the contact feel between the user and the headset, and causing negative effects on the electronic devices in the headset.

[0077] In one embodiment of the present application, the flip member 40 includes: a gear, a connecting rod and a driving motor, wherein the gear is rotationally connected to the edge of the isolation layer, and the gear, the connecting rod and the driving motor are transmission-connected in sequence.

[0078] The control circuit is specifically used for controlling the driving motor to rotate when a set trigger event occurs. When the driving motor rotates, the gear is driven to rotate through the connecting rod, so that the isolation layer drives the earmuff to flip.

[0079] In this embodiment, the control circuit controls the driving motor to rotate when a trigger event occurs. The number of revolutions of the driving motor is the number of revolutions that can cause the isolation layer to rotate 180°, which can be determined based on experiments.

[0080] Since the gear, the connecting rod and the driving motor are sequentially connected in transmission, when the driving motor rotates, the gear can be driven to rotate through the connecting rod. Furthermore, since the gear is rotationally connected to the edge of the isolation layer, when the gear rotates, the isolation layer rotates. Furthermore, when the isolation layer rotates, the entire earmuff flips over, and the first ear pad and the second ear pad exchange positions.

[0081] It should be noted that, in order to facilitate the flipping of the earmuff, the isolation layer may be provided with flexible material at other positions except the connection position with the gear.

[0082] This embodiment provides a specific implementation method of the flip member, which is simple and easy to implement.

[0083] In one embodiment of the present application, Figure 3 As shown, in order to allow the headset to detect whether a trigger event occurs, the headset body also includes:

[0084] A first humidity sensor 70, which is disposed at the first ear pad 301 and connected to the control circuit 50, and is used to detect the current humidity of the first ear pad 301;

[0085] A second humidity sensor 80, which is disposed at the second ear pad 303 and connected to the control circuit 50, and is used to detect the current humidity of the second ear pad 303;

[0086] The control circuit 50 is further configured to obtain the current humidity of the ear pad far away from the housing 20 of the first ear pad 301 and the second ear pad 303, and determine that a set trigger event occurs when the current humidity of the ear pad far away from the housing 20 is greater than a preset humidity.

[0087] In this embodiment, a first humidity sensor 70 is provided for the first ear pad 301 to detect the current humidity of the first ear pad 301. Due to the existence of the isolation layer 302, a second humidity sensor 80 is also required to be provided for the second ear pad 303 to detect the current humidity of the second ear pad 303.

[0088] The control circuit obtains the current humidity of the ear pad far away from the housing 20 among the first ear pad 301 and the second ear pad 303, that is, obtains the current humidity of the ear pad in contact with the user's ear among the first ear pad 301 and the second ear pad 303. When the current humidity of the ear pad far away from the housing 20 is greater than the preset humidity, it is determined that the set trigger event occurs.

[0089] In an embodiment of the present application, it is set that the trigger event is that the current humidity of the ear pad far from the housing 20 is greater than the preset humidity. As Figure 3 shown, the headphone body further includes:

[0090] A temperature sensor 90, which is arranged on the surface of the housing 20 close to the ear cup 30 and is electrically connected to the control circuit 50, and is used to detect the current temperature at the surface of the housing 20 close to the ear cup 30;

[0091] The control circuit 50 is further configured to control the drying circuit 60 to be in a temperature reduction state within a preset duration when the drying circuit 60 is in a drying state and the current temperature is greater than the preset temperature.

[0092] Wherein, the preset temperature is the minimum temperature that causes damage to the headphone body and reduces the contact feel of the user with the head-mounted headphones. The preset duration is the duration that can significantly reduce the temperature of the drying circuit. The preset temperature and the preset duration can be obtained based on experience or experiments. The temperature reduction state can be, for example, a non-drying state where the drying circuit 60 does not work, or a state where the drying efficiency is reduced (such as reducing the working current, voltage, etc.).

[0093] In this embodiment, when the drying circuit 60 is in a drying state and the current temperature is greater than the preset temperature, it indicates that the temperature of the housing 20 has increased due to the long-term drying state of the drying circuit 60, and thus there are problems such as damage to the headphone body and a reduced contact feel of the user with the head-mounted headphones. At this time, the control circuit 50 controls the drying circuit 60 to be in a temperature reduction state within a preset duration, and the temperature of the surface of the housing 20 close to the ear cup 30 gradually decreases. In this way, the problems of damage to the headphone body and a reduced contact feel of the user with the head-mounted headphones can be avoided. Further, after the preset duration, if it is detected that the set trigger event occurs, the control circuit 50 continues to control the drying circuit 60 to be in a drying state.

[0094] In an embodiment of the present application, when the flipping member 40 flips the ear cup 30, to a certain extent, it will affect the user's wearing experience. For example, the headphone body may fall off the user's ear. To avoid this problem, as Figure 3 shown, the headphone body of the head-mounted headphones provided in the present application further includes:

[0095] A prompt circuit 100, which is electrically connected to the control circuit 50 and is used to output a flipping prompt message;

[0096] The control circuit 50 is further configured to control the prompt circuit 100 to output a flipping prompt message when the set trigger event occurs.

[0097] Wherein, the flipping prompt message can specifically be information such as sound, vibration, etc.

[0098] In this embodiment, when a set trigger event occurs, the control circuit 50 controls the prompt circuit to output a flip prompt message to inform the user that the earcups 30 of the headset are about to flip. At this time, the user can remove the headset based on this flip prompt message and wait for the control circuit 50 to control the flipper 40 to flip the earcups 30. After the flipper 40 finishes flipping the earcups 30, the user can continue to wear the headset.

[0099] In an embodiment of the present application, the control circuit 50 can be specifically configured to, when a set trigger event occurs, control the flipper 40 to flip the earcups 30 and the drying circuit 60 to be in a drying state after a fixed duration after controlling the prompt circuit 100 to output a flip prompt message. The fixed duration is the duration for the user to remove the headset after receiving the flip prompt message and can be determined according to experience or experiments.

[0100] In an embodiment of the present application, in order for the control circuit to accurately control the flipper to flip and the drying circuit to be in a drying state when the user removes the headset, as Figure 1 and Figure 3 shown, the headset body of the headset provided in the present application further includes:

[0101] An input control 110, electrically connected to the control circuit 50, for receiving a flip confirmation instruction;

[0102] The control circuit 50 is specifically configured to, when a set trigger event occurs, control the prompt circuit 100 to output a flip prompt message, and when receiving a flip confirmation instruction through the input control 110, control the flipper 40 to flip the earcups 30 and the drying circuit 60 to be in a drying state.

[0103] In this embodiment, when a set trigger event occurs, the control circuit 50 first controls the prompt circuit 100 to output a flip prompt message. After the user receives the flip prompt message and removes the headset, the input control 110 is triggered to input a flip confirmation instruction to the headset. At this time, the control circuit 50 receives the flip confirmation instruction and controls the flipper 40 to flip the earcups 30 and the drying circuit 60 to be in a drying state.

[0104] Based on the above headset, the present application further provides a control method for a headset, which is applied to the headset provided in any of the above embodiments. As Figure 4 shown, it includes the following steps S4100 and step S4200.

[0105] Step S4100, detecting whether a set trigger event occurs.

[0106] Step S4200, when the set trigger event occurs, control the flipping member in the head-mounted earphone to flip the earcups in the head-mounted earphone and keep the drying circuit in the head-mounted earphone in a drying state.

[0107] In an embodiment of the present application, the above step S4100 is specifically implemented by the following steps S4110 and S4111.

[0108] Step S4110, obtain the current humidity of the earpad in the first earpad and the second earpad of the earcup that is far from the housing.

[0109] Step S4111, when the current humidity of the earpad that is far from the housing in the head-mounted earphone is greater than the preset humidity, determine that the set trigger event occurs.

[0110] In an embodiment of the present application, after the above step S4200, the control method of the head-mounted earphone provided in the present application further includes the following steps S4300 and S4400.

[0111] Step S4300, obtain the current temperature at the surface of the housing in the head-mounted earphone that is close to the earcup.

[0112] Step S4400, when the drying circuit is in the drying state and the current temperature is greater than the preset temperature, control the drying circuit to be in a cooling state within a preset duration.

[0113] In an embodiment of the present application, the above step S4100 is specifically implemented by the following steps S4120 and S4121.

[0114] Step S4120, when the set trigger event occurs, control the prompting circuit in the head-mounted earphone to output a flipping prompt message.

[0115] Step S4121, control the flipping member in the head-mounted earphone to flip the earcups in the head-mounted earphone and keep the drying circuit in the head-mounted earphone in a drying state.

[0116] In an embodiment of the present application, the above step S4121 is specifically implemented by the following step S4121-1.

[0117] Step S4121-1, when a flipping confirmation instruction is received through the input control in the head-mounted earphone, control the flipping member in the head-mounted earphone to flip the earcups in the head-mounted earphone and keep the drying circuit in the head-mounted earphone in a drying state.

[0118] In one embodiment of the present application, controlling the flipping member in the above-mentioned step S4200 to flip includes: controlling the driving motor in the flipping member to rotate. When the driving motor rotates, the gear in the flipping member is driven by a connecting rod in the flipping member to rotate, so that the isolation layer drives the earcup to flip.

[0119] The specific implementation of each step in the control method of the head-mounted earphone provided by the present application is the same as the specific implementation of the control circuit in the above-mentioned embodiment of the head-mounted earphone, and will not be elaborated here.

[0120] The present application also provides a control device 500 for a head-mounted earphone. The device 500 is applied to any one of the head-mounted earphones provided in the above-mentioned embodiment of the head-mounted earphone, as Figure 5 shown, and includes:

[0121] A detection module 510, configured to detect whether a set trigger event occurs;

[0122] A control module 520, configured to control the flipping member in the head-mounted earphone to flip the earcup in the head-mounted earphone and the drying circuit in the head-mounted earphone to be in a drying state when the set trigger event occurs.

[0123] In one embodiment of the present application, the control module 520 is specifically configured to: obtain the current humidity of the earpad in the first earpad and the second earpad of the earcup that is far from the housing;

[0124] When the current humidity of the earpad far from the housing in the head-mounted earphone is greater than a preset humidity, it is determined that the set trigger event occurs.

[0125] In one embodiment of the present application, the control module 520 is further configured to: obtain the current temperature at the surface of the housing in the head-mounted earphone close to the earcup;

[0126] When the drying circuit is in a drying state and the current temperature is greater than a preset temperature, control the drying circuit to be in a cooling state for a preset duration.

[0127] In one embodiment of the present application, the control module 520 is specifically configured to: when the set trigger event occurs, control the prompting circuit in the head-mounted earphone to output a flipping prompt message;

[0128] And control the flipping member in the head-mounted earphone to flip the earcup in the head-mounted earphone and the drying circuit in the head-mounted earphone to be in a drying state.

[0129] In an embodiment of the present application, the control module 520 is specifically configured to: when a flip confirmation instruction is received through the input control in the head-mounted earphone, control the flip member in the head-mounted earphone to flip the earcup in the head-mounted earphone and the drying circuit in the head-mounted earphone to be in a drying state.

[0130] In an embodiment of the present application, the control module 520 is specifically configured to: when a set trigger event occurs, control the driving motor to rotate. When the driving motor rotates, drive the gear to rotate through the connecting rod, so that the isolation layer drives the earcup to flip.

[0131] The present application also provides another head-mounted earphone 600, and the head-mounted earphone 600 includes a control device 500 of any head-mounted earphone provided in the above device embodiment;

[0132] Or, as Figure 6 shown, the head-mounted earphone 600 includes a memory 610 and a processor 620. The memory 610 is used to store computer instructions, and the processor 620 is used to call the computer instructions from the memory 610 to execute any control method of the head-mounted earphone provided in the above control method embodiment of the head-mounted earphone.

[0133] The present application also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements any control method of the head-mounted earphone provided in the above control method embodiment of the head-mounted earphone.

[0134] The present application may be a system, a method, and / or a computer program product. The computer program product may include a computer-readable storage medium, on which computer-readable program instructions are carried for causing a processor to implement various aspects of the present application.

[0135] A computer-readable storage medium can be a tangible device that can hold and store instructions for use by an instruction execution device. A computer-readable storage medium may be, for example—but not limited to—an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the foregoing. More specific examples (a non-exhaustive list) of the computer-readable storage medium include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disc read-only memory (CD-ROM), a digital versatile disc (DVD), a memory stick, a floppy disk, a mechanically encoded device such as a punched card or raised structures in grooves having instructions stored thereon, and any suitable combination of the foregoing. The computer-readable storage medium as used herein is not construed to be an instantaneous signal per se, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagated through a waveguide or other transmission medium (e.g., an optical pulse through an optical fiber cable), or an electrical signal transmitted through a wire.

[0136] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to various computing / processing devices, or downloaded to an external computer or external storage device through a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network may include a copper transmission cable, an optical fiber transmission, a wireless transmission, a router, a firewall, a switch, a gateway computer, and / or an edge server. A network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in a computer-readable storage medium in each computing / processing device.

[0137] The computer program instructions for performing the operations of this application may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine - related instructions, microcode, firmware instructions, state - setting data, or source code or object code written in any combination of one or more programming languages, including object - oriented programming languages such as Smalltalk, C++, etc., and conventional procedural programming languages such as the "C" language or similar programming languages. The computer - readable program instructions may be executed entirely on the user's computer, partially on the user's computer, executed as a stand - alone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., through the Internet using an Internet service provider). In some embodiments, by using the state information of the computer - readable program instructions to customize an electronic circuit, such as a programmable logic circuit, a field - programmable gate array (FPGA), or a programmable logic array (PLA), the electronic circuit can execute the computer - readable program instructions to implement various aspects of this application.

[0138] Aspects of the present application are described herein with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems), and computer program products according to embodiments of the present application. It should be understood that each block of the flowcharts and / or block diagrams, and combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer - readable program instructions.

[0139] These computer - readable program instructions can be provided to a processor of a general - purpose computer, a special - purpose computer, or other programmable data - processing apparatus to produce a machine such that when these instructions are executed by the processor of the computer or other programmable data - processing apparatus, a device is produced that implements the functions / actions specified in one or more blocks of the flowchart and / or block diagram. These computer - readable program instructions can also be stored in a computer - readable storage medium, and these instructions cause the computer, programmable data - processing apparatus, and / or other devices to work in a specific manner. Thus, the computer - readable medium storing the instructions includes a manufactured article that includes instructions for implementing various aspects of the functions / actions specified in one or more blocks of the flowchart and / or block diagram.

[0140] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device, causing a series of operational steps to be performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process such that the instructions executed on the computer, other programmable data processing apparatus, or other device implement the functions / acts specified in one or more boxes of the flowchart and / or block diagram.

[0141] The flowcharts and block diagrams in the figures illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a portion of an instruction, which contains one or more executable instructions for implementing the specified logical function. In some alternative implementations, the functions noted in the blocks may occur out of the order noted in the figures. For example, two consecutive blocks may in fact be executed substantially in parallel, or they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block of the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented by a dedicated hardware-based system that performs the specified functions or acts, or by a combination of dedicated hardware and computer instructions. As is well known to those skilled in the art, implementation by hardware, implementation by software, and implementation by a combination of software and hardware are equivalent.

[0142] The embodiments of the present application have been described above. The above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art in the technical field without departing from the scope and spirit of the described embodiments. The selection of the terms used herein is intended to best explain the principles of the embodiments, the practical application, or the technical improvement of the technology in the market, or to enable other ordinary skilled persons in the technical field to understand the embodiments disclosed herein. The scope of the present application is defined by the appended claims.

Claims

1. A headset, characterized in that: It comprises two earphone bodies, and any of the earphone bodies comprises: a housing, a flip part, a control circuit, a drying circuit and an earmuff; wherein: The earmuff is arranged on the shell, and comprises a first ear pad, an isolation layer and a second ear pad which are stacked; The flipping member is used to flip the earmuff so that the first ear pad and the second ear pad exchange positions; The drying circuit is used for drying the ear pad of the first ear pad and the second ear pad close to the housing in a drying state; The control circuit is electrically connected to the drying circuit and the flip member respectively, and is used to control the flip member to flip the earmuff and the drying circuit to be in a drying state when a set trigger event occurs.

2. The headset according to claim 1, characterized in that: The set trigger event is that the current humidity of the ear pad away from the housing is greater than the preset humidity, and the earphone body further includes: a first humidity sensor, which is disposed at the first ear pad and connected to the control circuit, and is used to detect the current humidity of the first ear pad; a second humidity sensor, which is disposed at the second ear pad and connected to the control circuit, and is used to detect the current humidity of the second ear pad; The control circuit is further configured to obtain a current humidity of the ear pad of the first ear pad and the second ear pad that is away from the housing, and determine that the set trigger event occurs when the current humidity of the ear pad that is away from the housing is greater than a preset humidity.

3. The headset according to claim 1, characterized in that: The earphone body also includes: a temperature sensor, the temperature sensor being disposed on a surface of the housing close to the earmuff, electrically connected to the control circuit, and configured to detect a current temperature of the surface of the housing close to the earmuff; The control circuit is further configured to control the drying circuit to be in a cooling state within a preset time period when the drying circuit is in a drying state and the current temperature is greater than a preset temperature.

4. The headset according to claim 1, characterized in that: The earphone body also includes: A prompt circuit, the prompt circuit is electrically connected to the control circuit and is used to output flip prompt information; The control circuit is also used to control the prompt circuit to output flip prompt information when the set trigger event occurs.

5. The headset according to claim 4, characterized in that: The earphone body also includes: An input control, the input control being electrically connected to the control circuit and configured to receive a flip confirmation indication; The control circuit is specifically used to control the prompt circuit to output flip prompt information when the set trigger event occurs, and to control the flip member to flip the earmuff and the drying circuit to be in a drying state when a flip confirmation indication is received through the input control.

6. The headset according to claim 1, characterized in that: The flipping member comprises: a gear, a connecting rod and a driving motor, wherein the gear is rotationally connected to the edge of the isolation layer, and the gear, the connecting rod and the driving motor are sequentially transmission-connected; The control circuit is specifically used to control the driving motor to rotate when a set trigger event occurs. When the driving motor rotates, the gear is driven to rotate through the connecting rod, so that the isolation layer drives the earmuff to flip.

7. A method for controlling a headset, characterized in that: The method is applied to the headset according to any one of claims 1 to 6, comprising: Detect whether the set trigger event occurs; When the set trigger event occurs, the flipping member in the headset is controlled to flip the earmuff in the headset and the drying circuit in the headset is in a drying state.

8. The method according to claim 7, characterized in that The detecting setting whether a triggering event occurs includes: acquiring current humidity of the ear pad of the first ear pad and the second ear pad of the earmuff, which is farther from the housing; When the current humidity of the ear pad of the housing far away from the housing in the headset is greater than the preset humidity, it is determined that the set trigger event occurs.

9. The method according to claim 7, characterized in that: After controlling the flipping member in the headset to flip the earmuff in the headset and the drying circuit in the headset is in a drying state, the method further includes: Acquire a current temperature of a surface of a housing of the headset close to the earmuff; When the drying circuit is controlled to be in a drying state and the current temperature is greater than a preset temperature, the drying circuit is controlled to be in a cooling state within a preset time period.

10. The method according to claim 7, characterized in that When the set trigger event occurs, controlling the flip member in the headset to flip the earmuff in the headset and the drying circuit in the headset to be in a drying state includes: When the set trigger event occurs, controlling the prompt circuit in the headset to output flip prompt information; Furthermore, the flipping member in the headset is controlled to flip the earmuff in the headset and the drying circuit in the headset is in a drying state.

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