Display device

Abstract

The invention provides a display device which comprises an auxiliary substrate and a display substrate, the auxiliary substrate comprises an auxiliary circuit for receiving signals, the display substrate is arranged on the auxiliary substrate, the display substrate comprises a circuit and at least two light-emitting elements, and the circuit of the display substrate is electrically connected with the auxiliary circuit through a first conductive through hole. The first conductive through hole is located between the at least two light-emitting elements and comprises a circuit penetrating through the display substrate and a through hole of the display substrate, a first conductive structure with a top surface, and a second conductive structure. The first conductive structure is arranged in the through hole, the second conductive structure is arranged on the first conductive structure and the circuit, the top surface of the circuit is flush with the top surface of the first conductive structure, and the second conductive structure is arranged on the top surfaces of the first conductive structure and the circuit.

Description

[0001] This divisional application is based on an invention with the application number 202011229622.3, the filing date of November 6, 2020, and the invention title of "Display Device". Technical Field

[0002] The present disclosure relates to a display device, and particularly to the structural design of a display device. Background Art

[0003] Electronic products including display panels, such as smartphones, tablets, laptops, monitors, and TVs, have become indispensable necessities in modern society. With the booming development of these portable electronic products, consumers have high expectations for the quality, functions, or prices of these products.

[0004] In response to the demand for large-area displays, panel splicing technology is widely used in the manufacturing process of displays. In order to reduce the interference of the gaps at the panel splices on the image display quality, seamless splicing technology can be further used to reduce the visual presence of the panel borders, thereby achieving a seamless visual effect.

[0005] However, as the resolution of displays increases, the pitch of the panels also decreases. Limited by the original panel structure or manufacturing process, the difficulty of achieving seamless panel splicing is gradually increasing. Therefore, developing a panel design architecture that can improve the reliability or effect of seamless display splicing remains one of the topics that the industry is currently committed to researching. Summary of the Invention

[0006] According to some embodiments of the present disclosure, a display device is provided, which includes an auxiliary substrate, a display substrate, and a circuit board. The auxiliary substrate includes auxiliary circuits. The display substrate is disposed on the auxiliary substrate. The display substrate includes circuits. The circuit board is electrically connected to the auxiliary substrate. Moreover, the circuits of the display substrate are electrically connected to the auxiliary circuits through first conductive vias, and the circuit board provides signals to the auxiliary circuits.

[0007] According to other embodiments of the present disclosure, a display device is provided, which includes an auxiliary substrate, a display substrate, and a circuit board. The auxiliary substrate includes auxiliary circuits. The display substrate is disposed on the auxiliary substrate. The display substrate has an upper surface, a lower surface, and a side surface. The upper surface and the lower surface are opposite to each other, and the side surface connects the upper surface and the lower surface. The display substrate includes circuits. The circuits have a transmission portion and a connection portion connected to the transmission portion. The transmission portion is disposed on the upper surface, and the connection portion is disposed on the side surface. The circuit board is electrically connected to the auxiliary substrate. Moreover, the transmission portion of the circuits is electrically connected to the auxiliary circuits through the connection portion, and the circuit board provides signals to the auxiliary circuits.

[0008] To make the features or advantages of the present disclosure more apparent and understandable, some embodiments are specifically presented below and described in detail in conjunction with the accompanying drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] To make the above objects, features, and advantages of the present invention more apparent and understandable, the following provides a detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, where:

[0010] Figure 1 Showing a top view structural schematic diagram of a display device according to some embodiments of the present disclosure;

[0011] Figure 2 Showing, according to some embodiments of the present disclosure, corresponding to Figure 1 a cross-sectional structural schematic diagram of the display device along the cutting line A-A';

[0012] Figure 3 Showing, according to some embodiments of the present disclosure, corresponding to Figure 1 a cross-sectional structural schematic diagram of the display device along the cutting line A-A';

[0013] Figure 4 Showing a side view structural schematic diagram of a display device according to some embodiments of the present disclosure;

[0014] Figure 5 Showing a top view structural schematic diagram of a display device according to some embodiments of the present disclosure;

[0015] Figure 6 Showing a top view structural schematic diagram of a display device according to some embodiments of the present disclosure;

[0016] Figure 7 Showing, according to some embodiments of the present disclosure, corresponding to Figure 6 a cross-sectional structural schematic diagram of the display device along the cutting line B-B';

[0017] Figure 8 Showing, according to some embodiments of the present disclosure, corresponding to Figure 6 a cross-sectional structural schematic diagram of the display device along the cutting line B-B';

[0018] Figure 9 Showing a side view structural schematic diagram of a display device according to some embodiments of the present disclosure;

[0019] Figure 10 Showing a structural schematic diagram of a display device according to some embodiments of the present disclosure;

[0020] Figure 11A Showing a structural schematic diagram of the display device before assembly according to some embodiments of the present disclosure;

[0021] Figure 11BSchematic side view of a partial structure of a display device according to some embodiments of the present disclosure;

[0022] Figure 11C Schematic diagram of the structure of a display device according to some embodiments of the present disclosure;

[0023] Figure 12 Schematic side view of a display device according to some embodiments of the present disclosure;

[0024] Figure 13 Schematic side view of a display device according to some embodiments of the present disclosure.

[0025] Symbol Explanation

[0026] 10, 20, 30, 40, 50, 60: Display device

[0027] 100, 100-1, 100-2, 100-3: Display substrate

[0028] 100A, 100-1A: Upper surface

[0029] 100B, 100-1B: Lower surface

[0030] 100-1C: Side surface

[0031] 100s-1, 100s-2, 100s-3, 100s-4: Side edges

[0032] 102: Circuit

[0033] 102-1: Transmission part

[0034] 102-2: Connection part

[0035] 102A, 102B: Signal line

[0036] 102A-1: Top surface

[0037] 104: Conductive via

[0038] 104a: Perforation

[0039] 104b, 104c: Conductive structure

[0040] 104b-1: Top surface

[0041] 120: Light-emitting element

[0042] 130: Functional layer

[0043] 140: Functional layer

[0044] 140-1, 140-2: Surfaces

[0045] 200: Auxiliary substrate

[0046] 200a: Lower surface

[0047] 200b: Upper surface

[0048] 200c: Side surface

[0049] 200s-1, 200s-2, 200s-3, 200s-4: Side edges

[0050] 202: Auxiliary circuit

[0051] 202a, 202b, 202c: Branch circuits

[0052] 202c-1: Bending portion

[0053] 204: Conductive through-hole

[0054] 204a: Perforation

[0055] 204b: Conductive structure

[0056] 205: Conductive layer

[0057] 250: Conductive pattern

[0058] 300: Circuit board

[0059] 302: Flexible printed circuit board

[0060] 400: Cover substrate

[0061] 402: Wavelength conversion layer

[0062] 404: Functional layer

[0063] 1021: Side conductive pattern

[0064] A1, A2, A3: Terminal regions

[0065] A-A’, B-B’: Cutting lines

[0066] H1, H2: Maximum distances

[0067] S: Space

[0068] W1, W2, W3, W4, W5: Widths Detailed implementation manners

[0069] The following provides a detailed description of the display device according to the embodiments of the present disclosure. It should be understood that the following description provides many different embodiments for implementing different aspects of some embodiments of the present disclosure. The specific elements and arrangements described below are only for simply and clearly describing some embodiments of the present disclosure. Of course, these are only for illustration and not a limitation of the present disclosure. In addition, similar and / or corresponding reference numerals may be used in different embodiments to label similar and / or corresponding elements to clearly describe the present disclosure. However, the use of these similar and / or corresponding reference numerals is only for simply and clearly describing some embodiments of the present disclosure, and does not represent any association between the different embodiments and / or structures discussed.

[0070] The present disclosure can be understood by referring to the following detailed description and simultaneously combining the accompanying drawings. It should be noted that, for the convenience of the reader's understanding and the simplicity of the drawings, only a part of the electronic device is shown in the multiple drawings of the present disclosure, and the specific elements in the drawings are not drawn according to the actual scale. In addition, the number and size of each element in the drawings are only for illustration and are not used to limit the scope of the present disclosure.

[0071] It should be understood that the elements or devices in the drawings may exist in various forms well-known to those skilled in the art of the relevant technology. In addition, relative terms such as "lower" or "bottom" or "higher" or "top" may be used in the embodiments to describe the relative relationship of one element in the drawing to another element. It can be understood that if the device in the drawing is turned upside down, the element described on the "lower" side will become the element on the "higher" side. The embodiments of the present disclosure can be combined with the attached Figure One and understood that the drawings of the present disclosure are also regarded as a part of the disclosure description. Furthermore, when it is mentioned that a first material layer is located on or above a second material layer, it includes the case where the first material layer is in direct contact with the second material layer, or there may be one or more other material layers in between. In this case, the first material layer and the second material layer may not be in direct contact.

[0072] Certain terms will be used in the specification of the present disclosure and the appended claims to refer to specific elements. Those skilled in the art should understand that electronic device manufacturers may use different names to refer to the same element. This document does not intend to distinguish between elements that have the same function but different names. In the following specification and claims, words such as "comprising", "including", "having" are open-ended words, and thus should be interpreted as meaning "including but not limited to...". Therefore, when the description of the present disclosure uses the terms "comprising", "including" and / or "having", it specifies the existence of the corresponding features, regions, steps, operations and / or components, but does not exclude the existence of one or more corresponding features, regions, steps, operations and / or components.

[0073] The directional terms mentioned in this document, such as "upper", "lower", "front", "rear", "left", "right", etc., are only references to the directions in the accompanying drawings. Therefore, the directional terms used are for illustration purposes and not for limiting the present disclosure. In the accompanying drawings, each drawing shows the general characteristics of the methods, structures, and / or materials used in specific embodiments. However, these drawings should not be construed as defining or limiting the scope or nature covered by these embodiments. For example, for clarity, the relative sizes, thicknesses, and positions of each film layer, region, and / or structure may be reduced or enlarged.

[0074] In some embodiments of the present disclosure, terms related to joining and connecting, such as "connect" and "interconnect", unless otherwise specifically defined, may mean that two structures are in direct contact, or may also mean that two structures are not in direct contact, with other structures disposed between these two structures. And such terms related to joining and connecting may also include the cases where both structures are movable, or both structures are fixed. In addition, the terms "electrically connected" or "electrically coupled" include any direct and indirect means of electrical connection.

[0075] In addition, it should be understood that the ordinal numbers used in the description and claims, such as "first", "second", etc., are used to modify elements, and do not themselves imply or represent that the element (or these elements) has any previous ordinal number, nor represent the order of one element and another element, or the order in the manufacturing method. The use of these ordinal numbers is only to clearly distinguish an element with a certain name from another element with the same name. The description and claims may not use the same terms. For example, the first element in the description may be the second element in the claim.

[0076] In the text, the terms "about" and "substantially" generally mean within 10%, or 5%, or 3%, or 2%, or 1%, or 0.5% of a given value or range. The given quantity is an approximate quantity, that is, the meaning of "about" and "substantially" may still be implied without specifically stating "about" and "substantially". In addition, the term "the range is between the first numerical value and the second numerical value" means that the range includes the first numerical value, the second numerical value, and other numerical values therebetween.

[0077] It should be understood that the following examples can, without departing from the spirit of the present disclosure, replace, recombine, and mix the features in several different embodiments to complete other embodiments. As long as the features between the embodiments do not violate the inventive spirit or conflict with each other, they can be arbitrarily mixed and used.

[0078] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It is understood that such terms, if defined in a commonly used dictionary, should be interpreted as having a meaning consistent with the relevant technology and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this disclosure.

[0079] According to some embodiments of the present disclosure, a display device is provided. The display device includes a display substrate and an auxiliary substrate. The circuits on the display substrate are electrically connected to the auxiliary circuits on the auxiliary substrate. Through the configuration design of the display substrate, the auxiliary substrate, and the circuit board, the signal driving end is arranged on the back side of the display substrate, which can reduce the space occupied by the related circuits or traces on the display substrate and reduce the space required for the splicing position. According to some embodiments of the present disclosure, the provided display device can improve the reliability of the panel splicing technology or its availability in high-resolution display devices, reduce the interference of the gap at the panel splicing on the image display quality, and achieve a virtually seamless visual effect.

[0080] The embodiments of the present disclosure can be applied to various electronic devices, such as including a display device, a light-emitting device, a touch device, a sensing device, an antenna device, a splicing device, or a combination of the foregoing, but not limited thereto. The electronic device can include a bendable or flexible electronic device, but not limited thereto. According to some embodiments, the electronic device can include a light-emitting diode (LED), a liquid crystal, a fluorescence, a phosphor, a quantum dot (QD), other suitable media, or a combination of the foregoing, but not limited thereto. The light-emitting diode can, for example, include an organic light-emitting diode (OLED), an inorganic light-emitting diode, a mini LED, a micro LED, or a quantum dot light-emitting diode (QD, such as QLED, QDLED), other suitable materials, or any permutation and combination of the foregoing, but not limited thereto. The foregoing antenna device can, for example, include a liquid crystal antenna device, but not limited thereto. According to the embodiments of the present disclosure, the electronic device can be any permutation and combination of the foregoing, but not limited thereto. In addition, the appearance of the electronic device can be rectangular, circular, polygonal, irregular, a shape with curved edges, or other suitable shapes, and the electronic device can have peripheral systems such as a driving system, a control system, a light source system, or a rack system to support the display device or the antenna device.

[0081] Based on the above, the following will take the display device as an example to illustrate the implementation of the present disclosure. Figure 1 as well as Figure 2 , Figure 1 A schematic diagram showing a top view of the structure of a display device 10 according to some embodiments of the present disclosure is shown. Figure 2 According to some embodiments of the present disclosure, corresponding to Figure 1 Schematic diagram of the cross-sectional structure of the display device 10 taken along the section line AA'. It should be understood that for the sake of clarity, some elements of the display device 10 are omitted in the figure, and only some elements are schematically shown. According to some embodiments, additional features may be added to the display device 10 described below. In other embodiments, some features of the display device 10 described below may be replaced or omitted.

[0082] like Figure 1 as well as Figure 2 As shown, the display device 10 may include a display substrate 100, an auxiliary substrate 200, and a circuit board 300. The display substrate 100 is disposed on the auxiliary substrate 200, and the circuit board 300 is electrically connected to the auxiliary substrate 200. According to some embodiments, the auxiliary substrate 200 may include an auxiliary circuit 202 (such as Figure 2 As shown, the display substrate 100 may include a circuit 102 , and the circuit 102 of the display substrate 100 may be electrically connected to the auxiliary circuit 202 through a conductive through hole 104 , and the circuit board 300 may provide a signal to the auxiliary circuit 202 .

[0083] In detail, according to some embodiments, in the normal direction of the display substrate 100 (e.g., the Z direction in the figure), the display substrate 100 and the auxiliary substrate 200 at least partially overlap. According to some embodiments, the display substrate 100 may include a circuit 102, and the circuit 102 may include a plurality of signal lines. According to some embodiments, the signal line may include, for example, a current signal line, a voltage signal line, a high-frequency signal line, and a low-frequency signal line, and the signal line may transmit a component operating voltage (VDD), a common ground terminal voltage (VSS), or a driving component terminal (e.g., a thin-film transistor (TFT)) voltage, but the present disclosure is not limited thereto. For example, according to some embodiments, such as Figure 1 As shown in the figure, the circuit 102 may include a signal line 102A and a signal line 102B. According to some embodiments, the signal line 102A and the signal line 102B may be a data line and a scan line, respectively, but are not limited thereto. According to some embodiments, the auxiliary circuit 202 may be, for example, a power line, but is not limited thereto. It should be understood that the number of signal lines included in the circuit 102 is not limited to those shown in the drawings, and according to different embodiments, the display device 10 may include other suitable numbers or types of circuits 102.

[0084] According to some embodiments, the display substrate 100 includes a flexible substrate, a rigid substrate, or a combination of the foregoing. According to some embodiments, the material of the display substrate 100 may include glass, quartz, sapphire, ceramics, polyimide (PI), polycarbonate (PC), polyethylene terephthalate (PET), polypropylene (PP), other suitable materials, or a combination of the foregoing, but is not limited thereto. In addition, the light transmittance of the display substrate 100 is not limited, that is, the display substrate 100 may be a light-transmissive substrate, a semi-light-transmissive substrate, or a light-impermeable substrate.

[0085] As Figure 1 shown, according to some embodiments, the display substrate 100 may have four sides, namely side 100s-1, side 100s-2, side 100s-3, and side 100s-4, where side 100s-1 is opposite to side 100s-3, and side 100s-2 is opposite to side 100s-4, but is not limited thereto. In another embodiment, side 100s-3 may be located between side 100s-2 and side 100s-4. In yet another embodiment, side 100s-4 is connected to side 100s-3. According to some embodiments, the display substrate 100 may be quadrilateral, circular, polygonal, or of a free shape, and the quadrilateral may include trapezoid, square, rectangle, rhombus, etc., but the present disclosure is not limited thereto.

[0086] According to some embodiments, the material of line 102 may include a metal conductive material, a transparent conductive material, other suitable materials, or a combination of the foregoing, but is not limited thereto. The metal conductive material may include copper (Cu), silver (Ag), gold (Au), tin (Sn), aluminum (Al), molybdenum (Mo), tungsten (W), chromium (Cr), nickel (Ni), platinum (Pt), titanium (Ti), any alloy of the foregoing metals, other suitable materials, or a combination of the foregoing, but is not limited thereto. The transparent conductive material may include a transparent conductive oxide (TCO), such as indium tin oxide (ITO), antimony zinc oxide (AZO), tin oxide (SnO), zinc oxide (ZnO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO), antimony tin oxide (ATO), other suitable transparent conductive materials, or a combination of the foregoing, but is not limited thereto.

[0087] In addition, according to some embodiments, signal lines 102A and 102B may be electrically connected to a driving element (not shown), and the driving element may be disposed on the display substrate 100. According to some embodiments, the driving element may include an active driving element, a passive driving element, or a combination of the foregoing.

[0088] For example, the active driving element may include a thin-film transistor (TFT), but is not limited thereto. The thin-film transistor may include, for example, a switching transistor, a driving transistor, a reset transistor, or other thin-film transistors. In addition, the thin-film transistor may be a top gate thin-film transistor, a bottom gate thin-film transistor, or a dual gate (or double gate) thin-film transistor. According to some embodiments, the thin-film transistor includes at least one semiconductor layer, and the semiconductor layer includes, but is not limited to, amorphous silicon, such as low-temp polysilicon (LTPS), metal oxide, other suitable materials, or a combination of the foregoing, but is not limited thereto. The metal oxide may include indium gallium zinc oxide (IGZO), indium zinc oxide (IZO), indium gallium zinc tin oxide (IGZTO), other suitable materials, or a combination of the foregoing, but is not limited thereto. According to some embodiments, different thin-film transistors may have the foregoing different semiconductor materials.

[0089] Furthermore, in embodiments where the driving element is a passive driving element, the driving element may be controlled by, for example, an integrated circuit (IC) or a microchip, etc., but the present disclosure is not limited thereto.

[0090] As Figure 1 and Figure 2 shown, according to some embodiments, the display device 10 may include a plurality of light-emitting elements 120, and the light-emitting elements 120 may be disposed on the display substrate 100. According to some embodiments, the light-emitting elements 120 may be disposed on the foregoing thin-film transistors (not shown), and the light-emitting elements 120 are electrically connected to the thin-film transistors. According to some embodiments, the thin-film transistors may be electrically connected to the auxiliary line 202 through the conductive vias 104.

[0091] According to some embodiments, the light-emitting element 120 may be a light-emitting diode die, such as including a micro-light emitting diode (micro-LED, mini-LED), an organic light-emitting diode (organic light emitting diode, OLED), or a quantum dot light-emitting diode (QLED, QDLED), but not limited thereto. According to some embodiments, the light-emitting elements 120 may be arranged in an array. According to some embodiments, one light-emitting element 120 may correspond to one pixel, and the pixel may include an appropriate number of sub-pixels. According to some embodiments, one light-emitting element 120 may correspond to one sub-pixel. According to some embodiments, the pixel or sub-pixel may have a single color or multiple colors. For example, a three-color pixel having red, green, and blue, or a four-color pixel having red, green, blue, and white, or other appropriate colors or other appropriate numbers of colors, but the present disclosure is not limited thereto. In one embodiment, the sub-pixel may be an area enclosed by the signal line 102A and the signal line 102B. In another embodiment, if the area enclosed by the signal line 102A and the signal line 102B has multiple colors, the area enclosed by the signal line 102A and the signal line 102B is called a pixel.

[0092] According to some embodiments, the packaging method of the light-emitting element 120 may include surface-mount devices (SMD) packaging of light-emitting diodes, chip-on-board (COB) packaging of light-emitting diodes, packaging of micro-light emitting diodes or flip-chip light-emitting diodes, packaging of organic light-emitting diodes, other appropriate packaging, or a combination of the foregoing, but not limited thereto.

[0093] Furthermore, the auxiliary circuit 202 may be disposed on the auxiliary substrate 200, and the circuit 102 disposed on the display substrate 100 may be electrically connected to the auxiliary circuit 202 through the conductive vias 104. According to some embodiments, the auxiliary circuit 202 may transmit signals to the circuit 102 to control the on / off or brightness of the light-emitting element 120, etc.

[0094] According to some embodiments, the auxiliary substrate 200 includes a flexible substrate, a rigid substrate, or a combination of the foregoing. According to some embodiments, the material of the auxiliary substrate 200 may include glass, quartz, sapphire, ceramic, polyimide, polycarbonate, polyethylene terephthalate, polypropylene, other appropriate materials, or a combination of the foregoing, but not limited thereto. In addition, the light transmittance of the auxiliary substrate 200 is not limited, that is, the auxiliary substrate 200 may be a light-transmitting substrate, a semi-light-transmitting substrate, or an opaque substrate. Furthermore, the material of the auxiliary substrate 200 may be the same as or different from the material of the display substrate 100.

[0095] According to some embodiments, the auxiliary substrate 200 may also have four sides, namely side 200s-1, side 200s-2, side 200s-3, and side 200s-4. Side 200s-1 is opposite to side 200s-3, and side 200s-2 is opposite to side 200s-4, but is not limited thereto. In some embodiments, side 200s-3 may be located between side 200s-4 and side 200s-2. In yet another embodiment, side 200s-4 is connected to side 200s-3. According to some embodiments, the auxiliary substrate 200 may be quadrilateral, circular, polygonal, or of an irregular shape (free shape), and the quadrilateral may include trapezoid, square, rectangle, rhombus, etc., but the present disclosure is not limited thereto. Furthermore, the shape of the auxiliary substrate 200 may be the same as or different from the shape of the display substrate 100.

[0096] According to some embodiments, side 100s-3 of the display substrate 100 is adjacent to side 200s-3 of the auxiliary substrate 200, and in the X direction, the width W1 of side 100s-3 of the display substrate 100 may be greater than the width W2 of side 200s-3 of the auxiliary substrate 200. The design where width W1 is greater than width W2 can create a space, such as space S, at side 100s-3 of the display substrate 100. In this way, components or mechanisms of the display substrate 100 and / or the display device 10 can be disposed in the aforementioned space S, which can reduce the peripheral area of the display substrate 100, achieve the effect of a narrow border, or increase the available space of the display device 10.

[0097] According to an embodiment of the present disclosure, the X direction may be defined as the substantially extending direction of the signal line 102B. Furthermore, the width of an object referred to in the present disclosure means the maximum width of the object. According to some embodiments, side 100s-3 may be substantially parallel or non-parallel to side 200s-3. Furthermore, according to some embodiments, side 100s-4 of the display substrate 100 is adjacent to side 200s-4 of the auxiliary substrate 200, and in the Y direction, the width W3 of side 100s-4 of the display substrate 100 may be greater than or equal to the width W4 of side 200s-4 of the auxiliary substrate 200. According to an embodiment of the present disclosure, the Y direction may be defined as the substantially extending direction of the signal line 102A.

[0098] In addition, according to embodiments of the present disclosure, an optical microscope (OM), a scanning electron microscope (SEM), an α-step, an ellipsometer, or other suitable means can be used to measure the width, length, area, thickness of each component, or the distance between components. Specifically, according to some embodiments, a scanning electron microscope can be used to obtain any cross-sectional image including the component to be measured, and measure the width, length, area, thickness of the component in the image, or the distance between components.

[0099] According to some embodiments, in a plane perpendicular to the normal direction (Z direction) of the display substrate 100 (e.g., the X-Y plane shown in the figure), the area of the auxiliary substrate 200 can be smaller than the area of the display substrate 100. According to some embodiments, in the normal direction (Z direction) of the display substrate 100, the side 100s-4 of the display substrate 100 protrudes beyond the side 200s-4 of the auxiliary substrate 200. In other words, the projection of the auxiliary substrate 200 on the X-Y plane can be located within the projection range of the display substrate 100 on the X-Y plane. The area of an object referred to in the present disclosure refers to the maximum area of the object.

[0100] Furthermore, according to some embodiments, the auxiliary circuit 202 and the circuit 102 can be correspondingly arranged in the normal direction (Z direction) of the display substrate 100 according to design requirements. According to embodiments of the present disclosure, "correspondingly arranged" for the auxiliary circuit 202 and the circuit 102 means that the auxiliary circuit 202 and the circuit 102 at least partially overlap in the normal direction (Z direction) of the display substrate 100.

[0101] According to some embodiments, the material of the auxiliary circuit 202 can include a metal conductive material, a transparent conductive material, other suitable materials, or a combination of the foregoing, but is not limited thereto. The metal conductive material can include copper, silver, gold, tin, aluminum, molybdenum, tungsten, chromium, nickel, platinum, titanium, any of the foregoing metal alloys, other suitable materials, or a combination of the foregoing, but is not limited thereto. The transparent conductive material can include a transparent conductive oxide, for example, can include indium tin oxide, zinc antimony oxide, tin oxide, zinc oxide, indium zinc oxide, indium gallium zinc oxide, indium tin zinc oxide, antimony tin oxide, other suitable transparent conductive materials, or a combination of the foregoing, but is not limited thereto. Furthermore, the material of the auxiliary circuit 202 can be the same as or different from the material of the circuit 102.

[0102] According to some embodiments, the resistance value of the auxiliary circuit 202 can be less than, equal to, or greater than the resistance value of the circuit 102. In addition, it should be understood that although in the embodiments shown in the drawings, both the signal line 102A and the signal line 102B are single-layer structures, according to other embodiments, the signal line 102A and / or the signal line 102B can have a multi-layer structure.

[0103] As Figure 2 shown, according to some embodiments, the display device 10 may further include a functional layer 130, and the functional layer 130 may be disposed between the display substrate 100 and the auxiliary substrate 200. According to some embodiments, the functional layer 130 may have an adhesive function to fix the display substrate 100 and the auxiliary substrate 200. According to some embodiments, the functional layer 130 may have a function of protecting the auxiliary circuit 202, for example, a moisture-proof function or an insulating function, but is not limited thereto.

[0104] According to some embodiments, the material of the functional layer 130 may include a photocurable adhesive, a thermosetting adhesive, a photo-thermosetting adhesive, other suitable materials, or a combination of the foregoing, but is not limited thereto. For example, in some embodiments, the material of the functional layer 130 may include an optical clear adhesive (OCA), an optical clear resin (OCR), other suitable materials, or a combination of the foregoing. According to other embodiments, the functional layer 130 may include a packaging material, for example, may include an organic material, an inorganic material, other suitable packaging materials, or a combination of the foregoing, but is not limited thereto. According to some embodiments, the foregoing inorganic materials may include silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or other suitable materials, but is not limited thereto. According to some embodiments, the foregoing organic materials may include epoxy resins, silicone resins, acrylic resins (such as polymethylmethacrylate (PMMA), benzocyclobutene (BCB), polyimide, polyester, polydimethylsiloxane (PDMS), polyfluoroalkoxy (PFA)), other suitable materials, or a combination of the foregoing, but is not limited thereto. Furthermore, the light transmittance of the functional layer 130 is not limited, that is, the functional layer 130 may be light-transmitting, semi-light-transmitting or light-blocking.

[0105] As Figure 2 shown, according to some embodiments, the conductive vias 104 may penetrate the display substrate 100 to the functional layer 130 and be connected to the circuit 102 and the auxiliary circuit 202.

[0106] Specifically, according to some embodiments, the conductive via 104 may include a through-hole 104a and a conductive structure 104b. The conductive structure 104b may be disposed in the through-hole 104a. The so-called conductive structure 104b being disposed in the through-hole 104a may include that the conductive structure 104b is completely disposed in the through-hole 104a, or the conductive structure 104b is only partially disposed in the through-hole 104a while the other part is exposed from the through-hole 104a. As Figure 2 shown, a part of the conductive structure 104b is located in the through-hole 104a, and the other part is located outside the through-hole 104a and disposed on the display substrate 100. The through-hole 104a may penetrate through the display substrate 100 and the functional layer 130. The conductive structure 104b may be disposed on the display substrate 100 and in contact with the line 102 (such as the signal line 102A of the line 102). According to some embodiments, in the normal direction (Z direction) of the display substrate 100, the conductive structure 104b may protrude from the signal line 102A. In other words, in the normal direction of the display substrate 100, the maximum distance H1 between the conductive structure 104b and the upper surface 100A of the display substrate 100 may be greater than the maximum distance H2 between the signal line 102A and the upper surface 100A of the display substrate 100.

[0107] According to some embodiments, the material of the conductive structure 104b may include a conductive material, such as a metal conductive material. According to some embodiments, the metal conductive material may include aluminum, molybdenum, silver, tin, tungsten, gold, chromium, nickel, platinum, copper alloy, aluminum alloy, molybdenum alloy, silver alloy, tin alloy, tungsten alloy, gold alloy, chromium alloy, nickel alloy, platinum alloy, other suitable metal materials, or a combination of the foregoing, but not limited thereto.

[0108] Furthermore, according to some embodiments, the through-hole 104a may be first formed in the display substrate 100 and the functional layer 130 by one or more lithography processes and / or etching processes, and then a conductive material may be filled in the through-hole 104a to form the conductive structure 104b. According to some embodiments, the lithography process may include photoresist coating (such as spin coating), soft baking, hard baking, mask alignment, exposure, post-exposure baking, photoresist development, cleaning, and drying, etc., but not limited thereto. The etching process may include a dry etching process or a wet etching process, but not limited thereto. Furthermore, the conductive structure 104b and the through-hole 104a may be formed in separate processes, but not limited thereto.

[0109] As mentioned above, the circuit board 300 may provide signals to the auxiliary line 202. Please refer to Figure 1 , according to some embodiments, the circuit board 300 may be adjacent to one side of the display substrate 100, for example, the side 100s-1. According to some embodiments, the display device 10 may include a plurality of circuit boards 300, and the circuit boards 300 may be respectively disposed adjacent to a plurality of sides of the display substrate 100.

[0110] According to some embodiments, the circuit board 300 may include a rigid substrate or a flexible substrate. According to some embodiments, the circuit board 300 may be a printed circuit board (PCB), but is not limited thereto. According to some embodiments, the substrate material of the circuit board 300 may include ceramics, aluminum, copper, fiberglass, other suitable materials, or a combination of the foregoing materials, but is not limited thereto. According to some embodiments, the circuit board 300 may include a metal-fiberglass composite sheet or a metal-ceramic composite sheet, but is not limited thereto.

[0111] Furthermore, as Figure 1 shown, according to some embodiments, the display device 10 further includes a flexible printed circuit (FPC) 302, and the auxiliary circuit 202 can be electrically connected to the circuit board 300 through the flexible printed circuit 302. According to some embodiments, in the normal direction (Z direction) of the display substrate 100, the flexible printed circuit 302 may partially overlap with the display substrate 100 and / or the circuit board 300, and partially overlap with the auxiliary substrate 200. Furthermore, it should be understood that the number, shape, or position of the flexible printed circuit 302 provided is not limited to those shown in the drawings. According to different embodiments, the number and position of the flexible printed circuit 302 can be adjusted as needed in combination with the circuit board 300.

[0112] According to some embodiments, the substrate material of the flexible printed circuit 302 may include polyimide, polycarbonate, polyethylene terephthalate, polypropylene, other suitable materials, or a combination of the foregoing, but is not limited thereto.

[0113] In addition, it should be understood that Figure 1 the circuit board 300 and the flexible printed circuit 302 shown are in the state before being bent (for example, before encapsulation). According to some embodiments, the flexible printed circuit 302 can be bent to bend the circuit board 300 to the back side of the auxiliary substrate 200, so that the circuit board 300 and the display substrate 100 at least partially overlap in the normal direction (Z direction) of the display substrate 100. The state of the flexible printed circuit 302 after being bent will be further described below.

[0114] Next, please refer to Figure 3 , Figure 3 a schematic cross-sectional structure diagram of the display device corresponding to the cut line A-A' in some other embodiments of the present disclosure. It should be understood that the same or similar components or elements in the following text as those in the previous text will be denoted by the same or similar reference numerals, and their materials, manufacturing methods, and functions are the same or similar to those described in the previous text, so this part will not be described in detail in the following text. Figure 1

[0115] As shown Figure 3 According to some embodiments, the conductive via 104 may further include a conductive structure 104c, and the conductive structure 104c may be disposed on the conductive structure 104b and / or the line 102. According to some embodiments, the conductive structure 104c may be electrically connected to the auxiliary line 202 through the conductive structure 104b. According to some embodiments, the top surface 104b-1 of the conductive structure 104b may be substantially flush with the top surface 102A-1 of the signal line 102A in the line 102, and the conductive structure 104c is disposed on the top surface 104b-1 of the conductive structure 104b and the top surface 102A-1 of the signal line 102A in the line 102. According to some embodiments, in a plane (e.g., the X-Y plane) perpendicular to the normal direction (Z direction) of the display substrate 100, the area of the conductive structure 104c may be larger than the area of the conductive structure 104b. According to some embodiments, the conductive structure 104c disposed on the conductive structure 104b and the line 102 may improve the overall conductive performance of the conductive via 104.

[0116] Furthermore, the material of the conductive structure 104c may be the same as or different from the material of the conductive structure 104b. According to some embodiments, the conductive structure 104c, the via 104a, and / or the conductive structure 104b may be formed in separate processes, but are not limited thereto.

[0117] Next, please refer to Figure 4 , Figure 4 a schematic side view structure diagram of the display device 10 according to some embodiments of the present disclosure. Specifically, please refer to Figure 1 and Figure 4 , Figure 4 which may be a schematic side view structure of the display device 10 observed from the perspective of the side 100s-2 or the side 100s-4 of the display substrate 100. Furthermore, Figure 4 it shows a state where the flexible printed circuit board 302 is bent to bend the circuit board 300 to the back side of the auxiliary substrate 200.

[0118] Specifically, according to some embodiments, the flexible printed circuit board 302 is connected to the auxiliary line 202 and the circuit board 300. The auxiliary line 202 is disposed on the upper surface 200b of the auxiliary substrate 200. The bent flexible printed circuit board 302 may dispose the circuit board 300 on the lower surface 200a of the auxiliary substrate 200, and the lower surface 200a is opposite to the upper surface 200b, and the lower surface 200a is farther from the display substrate 100 than the upper surface 200b. In addition, the circuit board 300 may be fixed to the lower surface 200a of the auxiliary substrate 200 or may not be fixed to the lower surface 200a of the auxiliary substrate 200, and is only adjacent to the lower surface 200a of the auxiliary substrate 200.

[0119] According to some embodiments, the flexible printed circuit board 302 may be disposed on the upper surface (e.g., the upper surface 200b) of the auxiliary substrate 200. According to some other embodiments, the flexible printed circuit board 302 may be disposed on the upper surface of the auxiliary substrate 200 and extend to the side surface (e.g., the side surface 200c) of the auxiliary substrate 200. According to still some other embodiments, the flexible printed circuit board 302 may further extend to the lower surface (e.g., the lower surface 200a) of the auxiliary substrate 200. Furthermore, according to some embodiments, the flexible printed circuit board 302 may not contact the side edge 200s-1. However, according to some other embodiments, the flexible printed circuit board 302 may contact the side edge 200s-1. According to some embodiments, a part of the flexible printed circuit board 302 may be disposed between the auxiliary circuit 202 and the functional layer 130, but is not limited thereto.

[0120] In addition, as Figure 4 shown, according to some embodiments, the circuit board 300 and the auxiliary substrate 200 are correspondingly disposed in the normal direction (Z direction) of the display substrate 100. In other words, the circuit board 300 and the auxiliary substrate 200 at least partially overlap in the normal direction (Z direction) of the display substrate 100.

[0121] It should be noted that, through the configuration design of the display substrate 100, the auxiliary substrate 200, and the circuit board 300, the signal driving ends can be disposed on the back side of the display substrate 100. Specifically, the signal driving ends are, for example, disposed on the auxiliary substrate 200 and the circuit board 300 (not labeled), or the signal driving ends can be disposed on the back surface of the display substrate 100. Thereby, the space occupied by the related circuits or traces on the front surface of the display substrate 100 can be reduced, the area of the peripheral circuits on the front surface of the display substrate 100 can be reduced, an effect of a narrow border can be produced, the gap between two splicing panels can be reduced, or the space required for the splicing position can be reduced. The front surface of the display substrate 100 described in this embodiment is defined as the surface where the light-emitting elements 120 (refer to Figure 1 ) are disposed, and the back surface is defined as the side opposite to the surface where the light-emitting elements 120 are disposed.

[0122] Next, please refer to Figure 5 , Figure 5 FIG. shows a top view structural schematic diagram of the display device 20 according to some other embodiments of the present disclosure. It should be understood that, for the sake of clear illustration, some elements of the display device 20 are omitted in the figure, and only some elements are schematically shown. According to some embodiments, additional features may be added to the display device 20 described below. In some other embodiments, some features of the display device 20 described below may be replaced or omitted.

[0123] As Figure 5As shown, according to some embodiments, the display device 20 further includes a conductive pattern 250. That is, when the display device 20 is flattened (for example, in an unbent state), the conductive pattern 250 and the circuit board 300 at least partially overlap in the normal direction (Z direction) of the display substrate 100. In addition, the circuit board 300 can be electrically connected to the auxiliary substrate 200 through the conductive pattern 250. In other words, the auxiliary circuit (not labeled) on the auxiliary substrate 200 can be electrically connected to the circuit board 300 through the conductive pattern 250. According to some embodiments, the conductive pattern 250 can be disposed on the auxiliary substrate 200, and a part of the conductive pattern 250 does not overlap with the display substrate 100 in the normal direction (Z direction) of the display substrate 100.

[0124] In this embodiment, the auxiliary substrate 200 is a flexible substrate, and the auxiliary substrate 200 can be bent to dispose the circuit board 300 on the surface (not labeled) of the auxiliary substrate 200. More specifically, when the auxiliary substrate 200 is in a bent state (not shown in the figure), in the normal direction of the display substrate 100, the circuit board 300 overlaps with the display substrate 100. It should be understood that although Figure 5 in the illustrated embodiment, the conductive pattern 250 is only disposed adjacent to the side edge 100s-1 of the display substrate 100, the present disclosure is not limited thereto. According to other embodiments, the conductive pattern 250 can be adjacent to the side edge 100s-2, side edge 100s-3, side edge 100s-4 of the display substrate 100, or adjacent to multiple side edges of the display substrate 100. In addition, according to some embodiments, the conductive pattern 250 can include a plurality of sub-patterns, and the conductive pattern 250 can have a straight line, a curved line, a bent line, or any other suitable shape. According to some embodiments, the conductive pattern 250 can be a part of the auxiliary circuit on the auxiliary substrate 200. In other words, the auxiliary circuit can extend to the edge of the auxiliary substrate 200 (for example, near the side edge 200s-1) and be electrically connected to the circuit board 300.

[0125] According to some embodiments, the material of the conductive pattern 250 can include a metal conductive material, a transparent conductive material, other suitable materials, or a combination of the foregoing, but is not limited thereto. The metal conductive material can include copper, silver, gold, tin, aluminum, molybdenum, tungsten, chromium, nickel, platinum, titanium, any alloy of the foregoing metals, other suitable materials, or a combination of the foregoing, but is not limited thereto. The transparent conductive material can include a transparent conductive oxide, for example, can include indium tin oxide, zinc antimony oxide, tin oxide, zinc oxide, indium zinc oxide, indium gallium zinc oxide, indium tin zinc oxide, antimony tin oxide, other suitable transparent conductive materials, or a combination of the foregoing, but is not limited thereto. Furthermore, the material of the conductive pattern 250 can be the same as or different from the material of the auxiliary circuit on the auxiliary substrate 200.

[0126] According to some embodiments, if the auxiliary circuit and the conductive pattern 250 are formed of the same material, the conductive pattern 250 is defined as a portion overlapping the circuit board 300 in the normal direction (e.g., the Z direction shown in the figure) of the auxiliary substrate 200. According to some embodiments, if the auxiliary circuit and the conductive pattern 250 are formed of different materials, the portion different from the material of the auxiliary circuit 202 is the conductive pattern 250.

[0127] In addition, if Figure 5 As shown, in this embodiment, the side 200s-4 of the auxiliary substrate 200 may be adjacent to the side 100s-4 of the display substrate 100. Since a space for bending the auxiliary substrate 200 needs to be reserved, the width W4 of the side 200s-4 of the auxiliary substrate 200 that is not bent in the Y direction is greater than the width W3 of the side 100s-4 of the display substrate 100. According to some embodiments, the ratio of the width W4 of the side 200s-4 of the auxiliary substrate 200 to the width W3 of the side 100s-4 of the display substrate 100 may range from 1.05 to 2.5 (1.05≤ratio W4 / W3≤2.5) or from 1.5 to 2, for example, 1.6, 1.7, 1.8 or 1.9, but is not limited thereto.

[0128] It should be noted that if the ratio of the width W4 of the side 200s-4 to the width W3 of the side 100s-4 is too small, the length of the auxiliary substrate 200 may not be sufficient to bend to the back side of the display substrate 100; if the ratio of the width W4 of the side 200s-4 to the width W3 of the side 100s-4 is too large, the length of the auxiliary substrate 200 may be too long, and the space at the panel joint may not be effectively reduced.

[0129] Next, please refer to Figure 6 as well as Figure 7 , Figure 6 A schematic diagram showing a top view of the structure of a display device 30 according to some other embodiments of the present disclosure is shown. Figure 7 According to some embodiments of the present disclosure, corresponding to Figure 6 Schematic diagram of the cross-sectional structure of the display device 30 taken along the section line BB' of FIG. It should be understood that, for the sake of clarity, some elements of the display device 30 are omitted in the figure, and only some elements are schematically shown. According to some embodiments, additional features may be added to the display device 30 described below. In other embodiments, some features of the display device 30 described below may be replaced or omitted.

[0130] like Figure 6 as well as Figure 7As shown, according to some embodiments, the auxiliary circuit 202 can be electrically connected to the circuit board 300 through the conductive vias 204. In this embodiment, the circuit board 300 can be disposed on the surface of the auxiliary substrate 200 farther away from the display substrate 100 without bending a flexible printed circuit board (not shown) or bending the auxiliary substrate 200, as Figure 6 As shown, the circuit board 300 is disposed on a surface of the auxiliary substrate 200 farther away from the display substrate 100. In other words, the circuit board 300 can be disposed below the auxiliary substrate 200. Furthermore, in this embodiment, the auxiliary circuit 202 can be disposed between the conductive via 104 and the conductive via 204, and the auxiliary circuit 202 is in contact with the conductive via 104 and the conductive via 204.

[0131] According to some embodiments, the conductive via 204 can include a through hole 204a and a conductive structure 204b. The conductive structure 204b can be disposed in the through hole 204a, and the through hole 204a can penetrate the auxiliary substrate 200. In some embodiments, the display device 30 can further include a conductive layer 205, and the conductive layer 205 can be disposed between the conductive via 204 and the circuit board 300. On the other hand, the conductive via 104 can include a through hole 104a and a conductive structure 104b. The line 102 (such as the signal line 102A of the line 102) can be electrically connected to the auxiliary circuit 202 through the conductive via 104.

[0132] According to some embodiments, the material of the conductive via 204 can include a conductive material, such as a metal conductive material. According to some embodiments, the metal conductive material can include aluminum, molybdenum, silver, tin, tungsten, gold, chromium, nickel, platinum, copper alloy, aluminum alloy, molybdenum alloy, silver alloy, tin alloy, tungsten alloy, gold alloy, chromium alloy, nickel alloy, platinum alloy, other suitable metal materials, or a combination of the foregoing, but is not limited thereto. According to some embodiments, the material of the conductive layer 205 can include an anisotropic conductive film (ACF), other suitable conductive adhesives, or a combination of the foregoing, but is not limited thereto.

[0133] Next, please refer to Figure 8 , Figure 8 A schematic cross-sectional structure diagram of a display device corresponding to the cut line B-B' in some other embodiments of the present disclosure. Figure 6 As shown in Figure 8 The embodiment shown is substantially the same as the embodiment shown in Figure 7 , and the difference is that, in the embodiment shown in Figure 8 , the conductive via 104 can further include a conductive structure 104c. The conductive structure 104c can be disposed on the conductive structure 104b and / or the line 102 (such as the signal line 102A of the line 102). For the description of the conductive structure 104c, reference can be made toFigure 3 The related descriptions will not be repeated here.

[0134] Next, please refer to Figure 9 , Figure 9 which shows a side view structural schematic diagram of the display device 40 according to some other embodiments of the present disclosure. It should be understood that, for the sake of clear illustration, some elements of the display device 40 are omitted in the figure, and only some elements are schematically shown. According to some embodiments, additional features may be added to the display device 40 described below. In some other embodiments, some features of the display device 40 described below may be replaced or omitted.

[0135] Figure 9 The embodiment shown in Figure 4 is substantially the same as the embodiment shown in Figure 9 , except that in the embodiment shown in Figure 9 , the display device 40 may further include a cover substrate 400, a wavelength conversion layer 402, and a functional layer 404. According to some embodiments, the cover substrate 400 may be disposed on the wavelength conversion layer 402 and the functional layer 404, and the cover substrate 400 may serve as a protective cover plate of the display device 40. According to some embodiments, the wavelength conversion layer 402 may be disposed above the light-emitting element 120 and may convert the light generated by the light-emitting element 120 into light of a specific color or wavelength. According to some embodiments, the functional layer 404 may be disposed between the cover substrate 400 and the display substrate 100 and adjacent to the light-emitting element 120 and the wavelength conversion layer 402. According to some embodiments, the functional layer 404 is also disposed on the auxiliary circuit 202.

[0136] According to some embodiments, the material of the cover substrate 400 may include glass, quartz, sapphire, ceramics, other suitable materials, or a combination of the foregoing materials, but is not limited thereto. Furthermore, the material of the cover substrate 400 may be the same as or different from the material of the display substrate 100. According to some embodiments, the side surface (not labeled) of the cover substrate 400 may be substantially aligned or misaligned with the side surface (not labeled) of the display substrate 100.

[0137] According to some embodiments, the wavelength conversion layer 402 may include a polymer or glass matrix, and phosphors, quantum dot materials, fluorescent materials, etc. dispersed in the matrix, but is not limited thereto. According to some embodiments, the quantum dot material may have a core-shell structure. The core may include CdSe, CdTe, CdS, ZnS, ZnSe, ZnO, ZnTe, InAs, InP, GaP, other suitable materials, or a combination of the foregoing, but is not limited thereto. The shell may include ZnS, ZnSe, GaN, GaP, other suitable materials, or a combination of the foregoing, but is not limited thereto.

[0138] According to some embodiments, the material of the functional layer 404 is the same as or similar to that of the functional layer 130, and thus will not be repeated here. According to some embodiments, the functional layer 404 can cooperate with the light-emitting element 120 and the wavelength conversion layer 402 to make the light transmittance through the functional layer 404 greater than 90%. According to other embodiments, the functional layer 404 can include a packaging material. For example, it can include an organic material, an inorganic material, other suitable packaging materials, or a combination of the foregoing, but is not limited thereto. According to some embodiments, the foregoing inorganic material can include silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or other suitable materials, but is not limited thereto. According to some embodiments, the foregoing organic material can include epoxy resins, silicone resins, acrylic resins (such as polymethylmethacrylate (PMMA), benzocyclobutene (BCB), polyimide, polyester, polydimethylsiloxane (PDMS), polyfluoroalkoxy (PFA)), other suitable materials, or a combination of the foregoing, but is not limited thereto. According to other embodiments, the material of the functional layer 404 can include a photocurable adhesive, a thermosetting adhesive, a photo-thermosetting adhesive, other suitable materials, or a combination of the foregoing, but is not limited thereto. For example, in some embodiments, the material of the functional layer 404 can include an optical clear adhesive (OCA), an optical clear resin (OCR), other suitable materials, or a combination of the foregoing.

[0139] Next, please refer to Figure 10 , Figure 10 , which shows a schematic structural diagram of the display device 50 according to other embodiments of the present disclosure. It should be understood that, for the sake of clarity, some elements of the display device 50 are omitted in the figure, and only some elements are schematically shown. According to some embodiments, additional features can be added to the display device 50 described below.

[0140] As Figure 10 shown, according to some embodiments, the auxiliary substrate 200 can have a plurality of display substrates 100 (it should be understood that only one display substrate 100 is shown in the figure for simplicity). The light-emitting elements 120 on the display substrate 100 can be electrically connected to the auxiliary lines 202 on the auxiliary substrate 200 through the conductive vias 104. Moreover, the light-emitting elements 120 can be connected to the lines provided on the display substrate 100 (such as the signal line 102A and the signal line 102B, please refer to Figure 1 andFigure 2 ) Electrically connected. According to some embodiments, the flexible printed circuit board 302 can also be electrically connected to the auxiliary circuit 202 on the auxiliary substrate 200 through the conductive through-hole 104.

[0141] In this embodiment, the number of display substrates 100 can be greater than or equal to the number of auxiliary substrates 200. For example, 4 display substrates 100 are disposed on one auxiliary substrate 200, but the present disclosure is not limited thereto. According to different embodiments, other suitable numbers of display substrates 100 can be disposed on the auxiliary substrate 200 according to requirements. In this embodiment, in a plane perpendicular to the normal direction (Z direction) of the display substrate 100 (for example, the X-Y plane shown in the figure), the area of the auxiliary substrate 200 can be greater than the area of the display substrate 100.

[0142] According to some embodiments, the auxiliary substrate 200 can have a plurality of auxiliary circuits 202 corresponding to the plurality of display substrates 100. The flexible printed circuit board 302 is electrically connected to the circuit (not shown, refer to Figure 1 the circuit 102) on the display substrate 100 and the circuit board 300, and the flexible printed circuit board 302 can be disposed on the display substrate 100. According to some embodiments, the flexible printed circuit board 302 can be disposed on the upper surface 100A of the display substrate 100, and is bent and extended to the side surfaces of the display substrate 100 and the auxiliary substrate 200, and can further extend to the lower surface 200a of the auxiliary substrate 200.

[0143] In addition, according to some other embodiments, the flexible printed circuit board 302 is electrically connected to the auxiliary circuit 202 and the circuit board 300, and the flexible printed circuit board 302 can be disposed on the auxiliary substrate 202, and in the normal direction of the display substrate 100, the display substrate 100 and the flexible printed circuit board 302 partially overlap. According to some embodiments, the flexible printed circuit board 302 can be disposed on the upper surface 200b of the auxiliary substrate 200, and is bent and extended to the side surface of the auxiliary substrate 200, and can further extend to the lower surface 200a of the auxiliary substrate 200.

[0144] It should be noted that disposing a plurality of display substrates 100 on the auxiliary substrate 200 can shorten the length of the circuit 102 on the display substrate 100 and reduce the voltage drop (IR drop) caused by the too long signal transmission path. Specifically, it can reduce the voltage drop when the signal (such as a data signal, but not limited thereto) is transmitted in the circuit (such as Figure 1 the circuit 102A) on the display substrate 100 due to the too large width (such as width W3) of the display substrate 100, and can improve the quality of signal transmission.

[0145] It should be noted that the auxiliary circuit 202 on the auxiliary substrate 200 is simpler than the circuit on the display substrate 100. That is to say, the circuit on the display substrate 100 can be a data line, a scan line, etc., but the present disclosure is not limited thereto, and the auxiliary circuit 202 can be designed for the circuit with a more serious voltage decay situation, such as a power supply line (VDD) or a common voltage line (VSS). According to some embodiments, a wider or thicker auxiliary circuit 202 can be provided on the auxiliary substrate 200 to improve the quality of signal transmission, reduce the phenomenon of voltage decay, and further reduce the uneven brightness phenomenon emitted by the light-emitting elements 120 on the display substrate 100. For example, the width (such as width W5) of the auxiliary circuit 202 can be designed to be greater than the width of the corresponding circuit on the display substrate 100. Another example is that the thickness (not shown) of the auxiliary circuit 202 can be designed to be greater than the thickness of the corresponding circuit on the display substrate 100. The aforementioned "thickness of the auxiliary circuit 202" and "thickness of the circuit on the display substrate 100" can be the maximum thickness measured in the normal direction of the display substrate 100.

[0146] Next, please refer to Figure 11A , Figure 11A FIG. shows a schematic structural diagram of the display device 60 before assembly according to some other embodiments of the present disclosure. It should be understood that, for the sake of clear illustration, some elements of the display device 60 are omitted in the figure, and only some elements are schematically shown. According to some embodiments, additional features can be added to the display device 60 described below.

[0147] As Figure 11A shown, according to some embodiments, a plurality of display substrates 100 are disposed on the auxiliary substrate 200. For convenience of description, they are coded as 100-1, 100-2, and 100-3. The display substrates 100-1, 100-2, and 100-3 may respectively have circuits 102, and the circuits 102 can be electrically connected to the light-emitting elements 120. In this embodiment, the auxiliary circuit 202 may include branch circuits 202a, 202b, and 202c with different lengths. For example, as Figure 11A shown, the length of the branch circuit 202c is greater than the length of the branch circuit 202b, and the length of the branch circuit 202b is greater than the length of the branch circuit 202a. According to some embodiments, the branch circuits 202a, 202b, and 202c may have bending portions (such as the bending portion 202c-1), and can be staggered from the positions of other circuits. That is to say, the branch circuits 202a, 202b, and 202c can change the extension direction in their respective bending portions, so that the branch circuits 202a, 202b, and 202c are staggered from the positions of other circuits.

[0148] In addition, it should be understood that although six branch lines (two branch lines 202a, two branch lines 202b, and two branch lines 202c) are shown in the drawings, the number of branch lines of the auxiliary line 202 is not limited thereto. According to different embodiments, the auxiliary line 202 may have other suitable numbers of branch lines. In addition, one branch line shown in the drawings may actually include multiple wires.

[0149] As Figure 11A shown, according to some embodiments, the branch line 202a has an end region A1. The branch line 202b has an end region A2. The branch line 202c has an end region A3. According to some embodiments, the display substrate 100-1 may be bonded to the end region A1 of the branch line 202a, the display substrate 100-2 may be bonded to the end region A2 of the branch line 202b, and the display substrate 100-3 may be bonded to the end region A3 of the branch line 202c. After assembly, in the normal direction of the auxiliary substrate 200 (e.g., the Z direction shown in the figure), the line 102 of the display substrate 100-1 overlaps with the branch line 202a in the end region A1, the line 102 of the display substrate 100-2 overlaps with the branch line 202b in the end region A2, and the line 102 of the display substrate 100-3 overlaps with the branch line 202c in the end region A3.

[0150] Please refer to Figure 11B , Figure 11B FIG. showing a schematic side view of a partial structure of a display device 60 according to some embodiments of the present disclosure. According to this embodiment, please refer to Figure 11A and Figure 11B , the display device 60 may include an auxiliary substrate 200, a display substrate 100, and a circuit board 300. The auxiliary substrate 200 may include an auxiliary line 202. The display substrate 100 is disposed on the auxiliary substrate 200, and the display substrate 100 has an upper surface, a lower surface, and a side surface, the upper surface and the lower surface are oppositely disposed, and the side surface connects the upper surface and the lower surface. It should be noted that the upper surface of the display substrate 100 may be the surface seen in the top view direction.

[0151] According to this embodiment, the line 102 on the display substrate 100 may have a transmission portion 102-1 and a connection portion 102-2, and the connection portion 102-2 is connected to the transmission portion 102-1. Specifically, Figure 11B shows a side view of the display substrate 100 (e.g., the display substrate 100-1). As Figure 11A and Figure 11BAs shown, the display substrate 100-1 has an upper surface 100-1A, a lower surface 100-1B, and a side surface 100-1C. The upper surface 100-1A and the lower surface 100-1B are oppositely arranged, and the side surface 100-1C connects the upper surface 100-1A and the lower surface 100-1B. According to some embodiments, the upper surface 100-1A is connected to the side surface 100-1C, and the side edge 100s-1 can be the connection line between the upper surface 100-1A and the side surface 100-1C. In one embodiment, the connection portion 102-2 of the circuit 102 can be disposed on the side surface 100-1C of the display substrate 100-1. According to some embodiments, the transmission portion 102-1 of the circuit 102 is disposed on the upper surface 100-1A of the display substrate 100-1, and the transmission portion 102-1 of the circuit 102 can extend from the upper surface 100-1A of the display substrate 100-1 to the side edge 100s-1. It should be noted that the circuit 102 located on the side surface 100-1C can be the connection portion 102-2 of the circuit 102. According to some embodiments, the connection portion 102-2 of the circuit 102 can further extend to the lower surface 100-1B of the display substrate 100-1, but the present disclosure is not limited thereto. The transmission portion 102-1 of the circuit 102 located on the upper surface 100-1A of the display substrate 100-1 can be electrically connected to the auxiliary circuit 202 (such as the branch circuit 202a) through the connection portion 102-2 of the circuit 102, and the circuit board 300 provides signals to the auxiliary circuit 202. Specifically, the connection portion 102-2 of the circuit 102 extending to the lower surface 100-1B of the display substrate 100-1 can be in contact with the branch circuit of the auxiliary circuit 202 (such as in contact with a part of the branch circuit located in the end region of the branch circuit) for electrical connection. However, according to other embodiments, the transmission portion 102-1 of the circuit 102 can also be electrically connected to the branch circuit of the auxiliary circuit 202 through a conductive via (not shown, refer to Figure 10 the conductive via 104), but the present disclosure is not limited thereto.

[0152] According to some embodiments, the transmission portion 102-1 of the circuit 102 and the connection portion 102-2 of the circuit 102 may be made of the same material. According to other embodiments, the transmission portion 102-1 of the circuit 102 and the connection portion 102-2 of the circuit 102 may be made of different materials. According to some embodiments, if the transmission portion 102-1 of the circuit 102 and the connection portion 102-2 of the circuit 102 are made of different materials, the transmission portion 102-1 may be disposed on the upper surface 100-1A of the display substrate 100-1, and the transmission portion 102-1 may be electrically connected to the connection portion 102-2 disposed on the side surface 100-1C of the display substrate 100-1 at the adjacent side edge 100s-1, and the connection portion 102-2 may then extend to the side surface 100-1C of the display substrate 100-1, and may further extend to the lower surface 100-1B of the display substrate 100-1. By designing the transmission part 102-1 of the circuit 102 and the connection part 102-2 of the circuit 102 to be different materials, the selectivity of the connection part 102-2 of the circuit 102 can be increased (for example, a conductive material with better conductivity is selected), thereby improving the conductive quality. The material examples of the transmission part 102-1 and the connection part 102-2 of the circuit 102 can refer to the material examples of the circuit 102 mentioned above, which will not be repeated here. In addition, it should be understood that the above content is explained by taking the display substrate 100-1 as an example, and the display substrate 100-2 and the display substrate 100-3 can also have similar structures, which will not be repeated here.

[0153] Next, please refer to Figure 11C , Figure 11C According to some embodiments of the present disclosure, Figure 11A The structure diagram of the display device 60 after assembly is shown in FIG. Figure 11C As shown, according to some embodiments, in the normal direction of the auxiliary substrate 200 (for example, the Z direction shown in the figure), the display substrate 100-1, the display substrate 100-2 and the display substrate 100-3 overlap with the same group of auxiliary circuits 202 (for example, auxiliary circuits 202 connected to the same circuit board 300).

[0154] It is worth noting that the arrangement of the display substrates 100-1, 100-2 and 100-3 can further reduce the length of the circuit 102 disposed on the display substrate 100, which can effectively improve the voltage decay problem caused by the excessively long circuit or improve the quality of signal transmission.

[0155] Next, please refer to Figure 12 and Figure 13 , Figure 12 and Figure 13 A schematic diagram of a side view structure of a display device 60 according to some embodiments of the present disclosure is shown. Specifically, Figure 12 and Figure 13It can be a side view structure of the display device 60 as observed from the side perspective of the auxiliary substrate 200. It should be understood that, for the sake of clearly illustrating the connection relationship between the circuit 102 and the auxiliary circuit 202, some components of the display device 60 (including the flexible printed circuit board 302) are omitted in the figure, and only some components are schematically shown.

[0156] As Figure 12 shown, according to some embodiments, the circuit 102 located on the upper surface 100A of the substrate 100 can be regarded as the transmission part 102-1 of the circuit 102, and the part of the circuit 102 that is not the transmission part 102-1 can be regarded as the connection part 102-2 of the circuit 102. In one embodiment, the connection part 102-2 extending to the lower surface 100B can be electrically connected to the auxiliary circuit 202. For example, the connection part 102-2 can touch and be electrically connected to the auxiliary circuit 202. According to some embodiments, the functional layer 130 is disposed between the display substrate 100 and the auxiliary substrate 200, and can be used to fix the display substrate 100 and the auxiliary substrate 200, and increase the stability of the display device 60. Continuing from the foregoing, according to some embodiments, the functional layer 130 can have the function of protecting the auxiliary circuit 202. For example, a moisture-proof function or an insulating function, but not limited thereto. According to some embodiments, the connection part 102-2 and the auxiliary circuit 202 can be joined and electrically connected by an eutectic bonding process, but the present disclosure is not limited thereto.

[0157] As Figure 13 shown, according to some other embodiments, the display device 60 further includes another functional layer 140. The functional layer 140 is disposed between the connection part 102-2 and the auxiliary circuit 202, and the functional layer 140 can be in contact with both the circuit 102 and the auxiliary circuit 202 at the same time. Specifically, one surface 140-1 of the functional layer 140 is in contact with the connection part 102-2 of the circuit 102, and the other surface 140-2 of the functional layer 140 is in contact with the auxiliary circuit 202. The aforementioned functional layer 140 has a conductive function. For example, the functional layer 140 can be a glue material, a film material, a coating, etc. having a conductive function, but not limited thereto. According to some embodiments, the material of the functional layer 140 can include an anisotropic conductive film (ACF), other suitable conductive adhesives, or a combination of the foregoing, but not limited thereto. In addition, it should be understood that, although not shown in the drawings, according to some embodiments, the aforementioned display device can exist in a spliced form. For example, the display device can include at least two sets of display devices (display device 10, display device 20, display device 30, display device 40, display device 50 or display device 60) as described in the foregoing embodiments (for example, including at least two display substrates 100 and at least two auxiliary substrates 200), and the two sets of display devices are adjacent to each other and spliced.

[0158] In summary, according to some embodiments of the present disclosure, the provided display device can, through the configuration design of the display substrate, the auxiliary substrate, and the circuit board, set the signal driving end on the back side of the display substrate, which can reduce the space occupied by related circuits or traces on the front side of the display substrate, reduce the area of the peripheral circuits on the front side of the display substrate, produce the effect of a narrow border, reduce the gap between two spliced panels, or reduce the space required for the splicing position. According to some embodiments of the present disclosure, the provided display device can improve the reliability of the panel splicing technology or improve its availability ratio in a high-resolution display device, that is, increase the area of the displayable region of the display panel, reduce the area of the peripheral region of the display panel, reduce the interference of the gap at the panel splicing on the image display quality, and achieve a substantially seamless visual effect. According to other embodiments, the provided display device can alleviate the situation of voltage drop (IR drop), thereby reducing the uneven brightness phenomenon emitted by the light-emitting elements on the display substrate and improving the quality of signal transmission.

[0159] Although the embodiments of the present disclosure and their advantages have been disclosed above, it should be understood that any person skilled in the art can make changes, substitutions, and modifications without departing from the spirit and scope of the present disclosure. As long as the features between the embodiments of the present disclosure do not violate the inventive spirit or conflict with each other, they can be arbitrarily combined and used. In addition, the protection scope of the present disclosure is not limited to the processes, machines, manufactures, compositions of matter, devices, methods, and steps in the specific embodiments described in the specification. Any person skilled in the art can understand the processes, machines, manufactures, compositions of matter, devices, methods, and steps developed currently or in the future from the disclosure of the present disclosure. As long as they can perform substantially the same functions or obtain substantially the same results in the embodiments described herein, they can be used according to the present disclosure. Therefore, the protection scope of the present disclosure includes the above-mentioned processes, machines, manufactures, compositions of matter, devices, methods, and steps. The protection scope of the present disclosure shall be subject to what is defined by the scope of the claims. Any embodiment or claim of the present disclosure does not have to achieve all the purposes, advantages, and features disclosed in the present disclosure.

Claims

1. A display device, characterized in that, comprising: an auxiliary substrate, the auxiliary substrate including an auxiliary circuit for receiving a signal; and a display substrate disposed on the auxiliary substrate, the display substrate including a circuit and at least two light-emitting elements; wherein the circuit of the display substrate is electrically connected to the auxiliary circuit through a first conductive via, wherein the first conductive via is located between the at least two light-emitting elements and includes: a perforation penetrating the circuit and the display substrate of the display substrate; a first conductive structure having a top surface; and a second conductive structure, wherein the first conductive structure is disposed in the perforation and the second conductive structure is disposed on the first conductive structure and the circuit, wherein a top surface of the circuit is flush with the top surface of the first conductive structure, and the second conductive structure is disposed on the top surfaces of the first conductive structure and the circuit.

2. The display device according to claim 1, characterized in that, further comprising a functional layer disposed between the display substrate and the auxiliary substrate.

3. The display device according to claim 2, characterized in that, wherein the functional layer has an adhesion function.

4. The display device according to claim 2, characterized in that, wherein the perforation penetrates the functional layer.

5. The display device according to claim 1, characterized in that, further comprising a circuit board electrically connected to the auxiliary circuit to provide the signal.

6. The display device according to claim 5, characterized in that, further comprising a flexible printed circuit board, wherein the auxiliary circuit is electrically connected to the circuit board through the flexible printed circuit board.

7. The display device according to claim 5, characterized in that, the circuit board at least partially overlaps the auxiliary substrate in a normal direction of the display substrate.

8. The display device according to claim 5, characterized in that, further comprising a conductive pattern, wherein the conductive pattern is disposed on the auxiliary substrate, the auxiliary substrate is a flexible substrate, the circuit board is electrically connected to the auxiliary substrate through the conductive pattern, and when the auxiliary substrate is in a bent state, the circuit board overlaps the display substrate in a normal direction of the display substrate.

9. The display device according to claim 8, characterized in that, wherein in the normal direction of the display substrate, a part of the conductive pattern does not overlap the display substrate.

10. The display device according to claim 1, characterized in that, the display substrate includes a flexible substrate.

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