Method for producing device having base plate and housing part for accommodating semiconductor element

Abstract

The invention relates to a method for producing a device (2) having a housing part (4) for accommodating a semiconductor element (10) and a base plate (6). In order to propose a production method which is as simple and cost-effective as possible and enables reliable wiring, the following steps are proposed: forming (42) a first housing component (12), at least one pin (16) being at least partially cast into a first molded frame (18), a wiring surface (20) being formed on the pin (16), and a second housing component (42) being formed on the wiring surface (20), a second housing assembly (14) having a damping material (22) is inserted (44) into the first housing assembly (12) in order to form a housing part (4), the damping material (22) being loosely in contact with a contact surface (24) arranged on a side of the first housing assembly (12) facing away from the connection surface (20), the housing part (4) being connected (46) to the base plate (6), the second housing assembly (14) being in contact, in particular in direct contact, with the base plate (6).

Description

Field of the Invention

[0001] The present invention relates to a method for manufacturing a device having a base plate and a housing part for receiving semiconductor components.

[0002] Furthermore, the present invention relates to a device having a base plate and a housing part for receiving semiconductor components.

[0003] Furthermore, the present invention relates to a semiconductor module having at least one such device.

[0004] Furthermore, the present invention relates to a current converter having at least one such semiconductor module.

[0005] Furthermore, the present invention relates to a computer program product comprising instructions which, when executed on a computer, cause the computer to simulate the behavior of such a device, in particular the mechanical and / or electrical behavior. Background Art

[0006] Such a device can be part of a semiconductor module typically used in a current converter. A current converter can be understood, for example, as a rectifier, an inverter, a converter or a DC voltage converter. The device can be part of a housing for at least one semiconductor component. Such a housing typically includes a plurality of housing parts, such as one or more housing frame parts, a housing substrate (also referred to as a base plate) and a housing cover. The individual housing parts are usually bonded to each other such that at least one semiconductor component, such as an integrated circuit, is completely enclosed by the housing inside the housing. The semiconductor components used in such a semiconductor module can include, but are not limited to, transistors, diodes, triacs or thyristors. For example, a transistor is formed as an insulated gate bipolar transistor (IGBT), a field effect transistor or a bipolar transistor. For electrical contact, electrical contacts, i.e., so-called pins, which lead outwards from the inside of the housing, are usually provided.

[0007] The published document WO 2021 / 209186 A1 describes a semiconductor module having a housing, at least one semiconductor component, a first substrate and a second substrate. In order to provide a more compact semiconductor module compared to the prior art, it is proposed that at least the semiconductor component and the first substrate be arranged in the housing, wherein the semiconductor component is conductively connected to at least one pin, wherein at least one pin contacts the second substrate and is inseparably connected in the housing, and wherein the first substrate is force-fittedly connected in the housing via at least one pin.

[0008] In such a housing, it is possible to establish electrical connections, including but not limited to, by wire bonding. Here, a common method is ultrasonic wire bonding, in which the bonding wire is welded to the bottom surface by pressure and ultrasonic vibration. When performing ultrasonic wire bonding on the bonding surface of the pin, the vibration generated during the bonding process can excite unwanted vibrations, such as through resonance, so that the welded connection between the bonding wire and the bonding surface of the pin cannot be established or cannot be established with the required quality. Summary of the Invention

[0009] Therefore, the object of the present invention is to provide a method for manufacturing a device having a base plate and a housing part for accommodating semiconductor elements, which is as simple and cost-effective as possible and enables reliable wiring.

[0010] According to the present invention, this object is achieved by a method for manufacturing a device having a base plate and a housing part for accommodating semiconductor elements, the housing part including: forming a first housing assembly, wherein at least one pin is at least partially cast into a first plastic frame, and a wiring surface is formed at the pin; inserting a second housing assembly having a damping material into the first housing assembly to form the housing part, wherein the damping material is in loose contact with a contact surface arranged on a side of the first housing assembly facing away from the wiring surface; connecting the housing part to the base plate, wherein the second housing assembly is in contact with, in particular directly in contact with, the base plate.

[0011] Furthermore, according to the present invention, this object is achieved by a device having a base plate and a housing part for accommodating semiconductor elements, wherein the housing part includes a first housing assembly and a second housing assembly, the first housing assembly having at least one pin, the pin being at least partially cast into a first plastic frame, a wiring surface being formed at the pin, the second housing assembly being inserted into the first housing assembly to form the housing part, the second housing assembly having a damping material, the damping material being in loose contact with a contact surface arranged on a side of the first housing assembly facing away from the wiring surface, and the housing part being connected to the base plate such that the second housing assembly is in contact with, in particular directly in contact with, the base plate.

[0012] Furthermore, according to the present invention, this object is achieved by a semiconductor module having at least one such device.

[0013] Furthermore, according to the present invention, this object is achieved by a current converter having at least one such semiconductor module.

[0014] Furthermore, according to the present invention, this object is achieved by a computer program product including instructions that, when the program is executed on a computer, cause the computer to simulate the behavior, in particular the mechanical and / or electrical behavior, of such a device.

[0015] The advantages and preferred design solutions listed below for the method can be transferred, in terms of meaning, to the device, semiconductor module, current converter, and computer program product.

[0016] The present invention is based on the following considerations: reliable wiring of the wiring surface of at least one pin is achieved by attenuating vibrations occurring during the wiring process by means of a vibration damping material, wherein the pin is at least partially cast into the first plastic frame of the first housing component. Here, the housing component is made of at least two parts, namely the first housing component and the second housing component, wherein the first housing component includes the first plastic frame, and at least one pin having a wiring surface is cast into the first plastic frame. For example, the first plastic frame is formed annularly, especially rectangularly annularly, and is configured to completely surround the semiconductor element. In a further, especially subsequent step, the second housing component with the vibration damping material is inserted into the first housing component to form the housing component. The vibration damping material can include, for example, silicone resin. The insertion can include the connection of the housing components, for example, by pressing. The vibration damping material of the second housing component contacts the contact surface of the first housing component loosely, and the contact surface is arranged on the side facing away from the wiring surface. In this context, contacting loosely can be understood as: the vibration damping material contacts the contact surface detachably, that is, for example, without a material-fit connection, that is, for example, without an adhesive connection. Loose contact can include pressing the vibration damping material. For example, the vibration damping material containing silicone resin contacts the contact surface in a cured state. In a further, especially subsequent step, the housing component is connected to the bottom plate, wherein the second housing component contacts the bottom plate, especially directly. By loosely contacting the vibration damping material with the contact surface arranged on the side facing away from the wiring surface, an improvement in vibration damping during the wiring process is achieved. In addition, due to the reduction in the number of process steps, the manufacturing process is simplified by the loose contact of the vibration damping material. For example, the time-consuming dispensing process and the subsequent drying process are eliminated. Therefore, the manufacturing process is simplified by the method, and costs are saved by reducing the number of process steps.

[0017] A computer program product including instructions can include a "digital twin", also known as a "digital twin" or can be formed as a digital twin, wherein when the program is executed by a computer, the instructions cause the computer to simulate the behavior of the described device, especially the mechanical and / or electrical behavior. For example, such a digital twin is shown in the published document US2017 / 0286572 Al. The disclosure of US 2017 / 0286572A1 is incorporated herein by reference. For example, a "digital twin" is a digital representation of components related to the manufacture and / or operation of a device.

[0018] Another embodiment provides that the damping material contacts the contact surface in a plane, in particular over the entire surface. By contacting the damping material in a plane, in particular over the entire surface, the vibrations occurring during the wiring process are optimally damped.

[0019] Another embodiment provides that at least one semiconductor element is arranged on the base plate, wherein, after connecting the housing part to the base plate, the wiring surface of the pin is wire-connected to the semiconductor element, and wherein the vibrations occurring during the wiring of the wiring surface are at least partially damped by the damping material. The wiring element can include but is not limited to a bonding wire or a bonding tape, and the bonding wire or the bonding tape is welded, in particular, by ultrasonic wire bonding. The vibrations of such a bonding connection are optimally damped by the damping material.

[0020] Another embodiment provides that at least one semiconductor element is electrically insulated and thermally connected to the base plate via a substrate before connecting the housing part to the base plate. The substrate can include but is not limited to being formed as a DGB (direct copper bonding) substrate. For example, the semiconductor element is formed as a vertical transistor, in particular as an IGBT or a vertical SiC-MOSFET, and this connection via the substrate saves space and is cost-effective. For example, the wiring surface of at least one pin is connected to the substrate, and the substrate is connected to the semiconductor element via another wiring element. Alternatively, the wiring surface of at least one pin can be directly wire-connected to the semiconductor element. A manufacturing process with a small number of process steps is achieved through the sequence of process steps.

[0021] Another embodiment provides that the connection of the housing part is carried out by a material-fit, in particular adhesive, connection of the first housing assembly and / or the second housing assembly to the base plate. For example, the first plastic frame or the second plastic frame of the housing part is adhesively connected to the base plate. In particular, the adhesive connection between the housing part and the base plate cures under tension. This material-fit connection has a minimal impact on the damping effect of the damping material.

[0022] Another embodiment provides that the second housing assembly includes a second plastic frame, and the damping material is applied, in particular applied circumferentially, on the second plastic frame before insertion. For example, the second plastic frame is formed annularly, in particular rectangularly annularly, and is configured to completely surround the semiconductor element. In particular, the circumferential application of the damping material ensures the best possible damping. A stable structure and a simple connection are achieved through the second plastic frame when the damping is sufficient.

[0023] Another embodiment provides that a force-fit connection is established between the housing assemblies when inserting the second housing assembly. In particular, a force-fit connection is established between the first plastic frame of the first housing assembly and the second plastic frame of the second housing assembly. Such a force-fit connection can be established, for example, simply and cost-effectively. Such a force-fit connection includes but is not limited to being able to simplify the subsequent pasting process.

[0024] Another embodiment provides that the damping material is formed as a particularly circumferential silicone resin layer, which is applied to the second shaping frame by screen printing or by a dispenser and then cured. When the second housing assembly is inserted, the cured silicone resin layer contacts the contact surface particularly in a planar manner. Through this pre-application, the cured silicone resin layer can contact the contact surface loosely or relaxably, thereby improving the attenuation of vibrations occurring during the wiring process. In addition, the loose contact of the damping material simplifies the manufacturing process.

[0025] Another embodiment provides that the second housing assembly is implemented as a damping frame made of damping material. For example, the damping frame is implemented as an annular, particularly rectangular annular silicone resin frame or a rubber frame. By using such a damping frame, the manufacturing process is simplified.

[0026] Another embodiment provides that when the second housing assembly is inserted, a force-fitting connection is established between the first housing assembly and the damping frame. Such a force-fitting connection can be simply and cost-effectively manufactured by clamping, for example. In addition, the force-fitting connection further simplifies the manufacturing process. Description of the Drawings

[0027] Hereinafter, the present invention will be described and explained in more detail based on the embodiments shown in the drawings.

[0028] The drawings show:

[0029] Figure 1 A schematic cross-sectional view showing a first embodiment of a device having a housing part and a base plate,

[0030] Figure 2 An enlarged schematic cross-sectional view showing the first embodiment of the device,

[0031] Figure 3 An enlarged schematic cross-sectional view showing a second embodiment of a device having a housing part and a base plate,

[0032] Figure 4 A schematic view showing the housing part in a top-down manner,

[0033] Figure 5 A three-dimensional view showing a third embodiment of a device having a housing part and a base plate,

[0034] Figure 6 A flowchart showing a method for manufacturing a semiconductor module,

[0035] Figure 7 A schematic view showing a current converter.

[0036] The embodiments described below are preferred embodiments of the present invention. In the embodiments, the described components of the embodiments are respectively individual features of the present invention that can be considered independently of each other, and the features also independently improve the present invention and can thus be regarded as components of the present invention either individually or in a manner different from the combinations shown. In addition, the described embodiments can also be supplemented by other features among the features of the present invention that have already been described.

[0037] The same reference signs have the same meanings in different drawings. Detailed Description of the Invention

[0038] Figure 1 Schematic cross-sectional view showing a first embodiment of a device 2 having a housing part 4 and a base plate 6. A substrate 8 is connected to the metal base plate 6 on the side facing away from the semiconductor element 10, and the semiconductor element 10 is joined to the substrate 8 in a material-fitting manner. The substrate 8 includes a dielectric material layer metallized on both sides, and the dielectric material layer contains a ceramic material, such as aluminum nitride or aluminum oxide, or contains an organic material, such as polyamide. The dielectric material layer can have a thickness of 25 μm to 600 μm, in particular 50 μm to 320 μm. The semiconductor element 10 can be implemented to include, but is not limited to, transistors and / or diodes, in particular vertical transistors and / or diodes. The transistors can be implemented to include, but are not limited to, insulated gate bipolar transistors (IGBTs), metal oxide semiconductor field effect transistors (MOSFETs), or bipolar transistors. In addition, at least one transistor can be equipped with a diode, in particular a diode connected in antiparallel. The material-fitting connection between the semiconductor element 10 and the substrate 8 includes, but is not limited to, being able to be established by soldering and / or sintering.

[0039] The housing part 4 has a first housing assembly 12 and a second housing assembly 14, wherein the first housing assembly 12 has a plurality of pins 16, and the pins are configured for electrical connection to the substrate 8. The pins 16 are respectively partially cast into the first plastic frame 18 and protrude from the plastic frame 18. The contact areas 17 of the pins 16 are configured for establishing a connection to a circuit board, such as a soldering connection or a press-fit connection. In addition, the pins 16 each include a wiring surface 20, and the wiring surface can be implemented to include, but is not limited to, a bonding surface, and the bonding surface is configured for establishing an electrical connection between at least one of the pins 16 and the semiconductor element 10. Figure 1The first shaping frame 18 in it is formed annularly, in particular rectangularly annularly, and completely surrounds the substrate 8. The second housing assembly 14 is inserted into the first housing assembly 12 to form the housing part 4, wherein the second housing assembly 14 is connected to the first housing assembly 12 in a force-fitting manner. For example, the second housing assembly 14 is clamped to the first housing assembly 12 via the outer surface 25. The second housing assembly 14 includes a damping material 22, which can include silicone resin, for example. The damping material 22 contacts the contact surface 24 loosely, and the contact surface is arranged on the side of the first housing assembly 12 facing away from the wiring surface 20. Loose contact can be understood as: the damping material 22 contacts the contact surface 24 in a detachable manner, that is, without a material-fit connection such as an adhesive connection. The loose contact can include pressing of the damping material 22.

[0040] Figure 1 The second housing assembly 14 in it includes a second shaping frame 26, and the second shaping frame is formed annularly, in particular rectangularly annularly, in Figure 1 it. The damping material 22 is applied annularly around the second shaping frame 26 before inserting the first housing assembly 12. For example, the silicone resin of the damping material 22 can be detachably connected to the contact surface 24 in its cured state, so that the damping material 22 abuts against the contact surface 24 loosely or contacts it by loose pressing. For example, the second shaping frame 26 of the second housing assembly 14 is connected to the first shaping frame 18 of the first housing assembly 12 in a force-fitting manner by clamping. In addition, the housing part 4 is connected to the bottom plate 6 such that the second shaping frame 26 of the second housing assembly 14 is in direct contact with the bottom plate 6. For example, the housing part 4 is adhesively connected to the bottom plate 6.

[0041] The semiconductor element 10 has a semiconductor wiring surface 28 on the side facing away from the substrate 8. A wiring element 30 is provided to electrically connect the pin 16 to the semiconductor element 10. The wiring element 30 can be implemented to include, but is not limited to, bonding wires or bonding tapes. In Figure 1 it, the wiring surface 20 of the pin 16 is connected to the substrate 8 via the wiring element 30, wherein the substrate 8 is connected to the semiconductor wiring surface 28 via the wiring element 30. Alternatively, at least one wiring surface 20 of the pin 16 can be directly connected to the semiconductor wiring surface 28 via at least one wiring element 30. The wiring element 30 is welded, for example, by ultrasonic wire bonding. The vibration that occurs during the establishment of the bonding connection is at least partially attenuated by the damping material 22.

[0042] Figure 2An enlarged schematic cross-sectional view showing a first embodiment of the device 2. The damping material 22 is embodied as a silicone resin layer 32 arranged circumferentially on an annular, in particular rectangularly annular, second shaping frame 26. The silicone resin layer 32 is applied or dispensed onto the second shaping frame 26 by means of screen printing, stencil printing or by means of a dispenser. The silicone resin is cured before the second housing assembly 14 is inserted. By means of this pre-application, the cured silicone resin layer 32 can contact the contact surface 24 loosely or detachably. The silicone resin layer 32 can have a thickness in the range of 50 μm to 1 mm. The damping material 22 embodied as the silicone resin layer 32 contacts the contact surface 24 substantially over its entire area, such that optimal damping can be achieved. The housing part 4 is materially connected to the base plate 6 by means of the bonding connection 34 of the second shaping frame 26. The bonding connection 34 is established by means of an adhesive, for example an adhesive that cures under tension, which is produced by pressing the housing part 4 against the base plate. Figure 2 A further embodiment of the device 2 in Figure 1 corresponds to the embodiment in

[0043] Figure 3 An enlarged schematic cross-sectional view showing a second embodiment of the device 2 having a housing part 4 and a base plate 6, wherein the second housing assembly 14 of the housing part 4 is embodied as a damping frame 36 made of the damping material 22. For example, the damping frame 36 is embodied as an annular, in particular rectangularly annular, silicone resin frame or rubber frame, which has a rectangular or square cross-section that is substantially constant along its length. The housing part 4 is materially connected to the base plate 6 such that a bonding connection 34 is established between the first shaping frame 18 and the base plate 6. The bonding connection 34 to the base plate 6 is established via the inner surface 38 of the first shaping frame 18, wherein the adhesive of the bonding connection 34 can extend over at least a part of the outer surface 25 of the damping frame 36. By pressing the housing part 4 against the base plate, the adhesive cures under tension. Figure 3 A further embodiment of the device 2 in Figure 2 corresponds to the embodiment in

[0044] Figure 4Schematic view of the housing part 4 shown in a top view, wherein the first housing assembly 12 includes a rectangular annular first plastic frame 18, and the pins 16 are respectively partially cast into the first plastic frame. The second housing assembly 14 of the housing part 4 is implemented as a damping frame 36 made of a damping material 22. For example, the damping frame 36 is implemented as an annular, especially rectangular annular silicone resin frame, and the silicone resin frame can be flush with the contact surface 24 of the pins 16 or can at least partially protrude from the contact surface 24 of the pins 16. The silicone resin frame is loosely arranged on the contact surface 24 of the pins 16. Alternatively, the silicone resin frame can be at least partially connected to the contact surface 24 of the pins 16 by an adhesive connection in a cured state. A slotted opening 40 implemented as a threaded drill hole, for example, can be configured to press the housing part 4 onto a bottom plate (the bottom plate is not shown for clarity in Figure 4 ). The connection of the housing part 4 to the bottom plate is carried out in another step. Figure 4 Another embodiment of the housing part 4 in Figure 3 corresponds to the embodiment in

[0045] Figure 5 A three-dimensional view showing a third embodiment of the device 2 having the housing part 4 and the bottom plate 6 is shown. The damping frame 36 is implemented as an annular, especially rectangular annular silicone resin frame, and the silicone resin frame partially protrudes from the contact surface 24 of the pins 16. However, the silicone resin frame has a substantially surrounding spacing d from the substrate 8 and is arranged planar on the bottom plate 6. In Figure 5 , the wiring of the pins 16 and the semiconductor element 10 has not been carried out yet and will be carried out in the next step. Figure 4 Another embodiment of the device 2 in Figure 3 corresponds to the embodiment in

[0046] Figure 6 A flowchart showing a method for manufacturing a semiconductor module, the semiconductor module including a housing having a housing part for accommodating a semiconductor element, at least one semiconductor element, and a bottom plate, wherein its manufacturing includes forming 42 a first housing assembly of the housing part, wherein at least one pin configured to be electrically connected to a substrate is at least partially cast into the first plastic frame, and wherein a wiring surface is formed at the pin, and the wiring surface is configured to establish an electrical connection between the pin and the semiconductor element.

[0047] In a subsequent step, a second housing assembly having a damping material is inserted 44 into the first housing assembly to form the housing part of the housing, wherein the damping material is in loose contact with a contact surface, and the contact surface is arranged on a side of the first housing assembly facing away from the wiring surface.

[0048] In a subsequent step, the housing part is connected to the base plate 46, wherein the substrate material is joined to the base plate in a form-fitting manner. At least one semiconductor element is joined to the substrate in a form-fitting manner. The second housing assembly is in direct contact with the base plate here. The direct contact includes a connecting mechanism for producing a form-fitting connection, such as an adhesive, but does not include additional connecting elements such as spacers.

[0049] In a further step, the connection of the pins to at least one semiconductor element 48 is carried out, wherein, for example, the pins are connected to the substrate via connection elements, and wherein the substrate is connected to at least one semiconductor element via connection elements. Alternatively, at least one pin can be directly connected to at least one semiconductor element via at least one connection element. For example, the connection elements are soldered by means of ultrasonic wire bonding. The vibrations occurring during the connection 48 are at least partially attenuated by damping material.

[0050] In a further step, potting and encapsulation 50 of the semiconductor module is carried out. The required voltage isolation is achieved, for example, by means of a potting compound containing silicone resin. In addition, such a potting serves to protect against harmful environmental influences. The housing is closed by a housing cover, wherein the housing cover is connected to the housing part.

[0051] Figure 7 A schematic illustration of a current converter 52 is shown, which includes a semiconductor module 54 having a device 2. The current converter 52 can include more than one semiconductor module 54. At least one semiconductor module 54 can include more than one device 2.

[0052] In summary, the invention relates to a method for manufacturing a device 2 having a base plate 6 and a housing part 4, the housing part serving to accommodate semiconductor elements 10. In order to provide a manufacturing method that is as simple and cost-effective as possible and enables reliable connection, the following steps are proposed: forming 42 a first housing assembly 12, wherein at least one pin 16 is at least partially cast into a first plastic frame 18, wherein a connection surface 20 is formed at the pin 16, inserting 44 a second housing assembly 14 having a damping material 22 into the first housing assembly 12 to form the housing part 4, wherein the damping material 22 is in loose contact with a contact surface 24, the contact surface being arranged on the side of the first housing assembly 12 facing away from the connection surface 20, connecting 46 the housing part 4 to the base plate 6, wherein the second housing assembly 14 is in contact with, in particular directly in contact with, the base plate 6.

Claims

1. A method for manufacturing a device (2) having a housing part (4) and a base plate (6), the housing part for accommodating semiconductor elements (10), the method comprising the steps of: - forming (42) a first housing assembly (12), wherein at least one pin (16) is at least partially cast into a first plastic frame (18), wherein a wiring surface (20) is formed on the pin (16), - inserting (44) a second housing assembly (14) comprising a damping material (22) into the first housing assembly (12) to form the housing part (4), wherein the damping material (22) is in loose contact with a contact surface (24) which is arranged on a side of the first housing assembly (12) facing away from the wiring surface (20), - connecting (46) the housing part (4) to the base plate (6), wherein the second housing assembly (14) contacts the base plate (6), in particular directly.

2. The method according to claim 1, wherein, the damping material (22) contacts the contact surface (24) in a plane, in particular over the entire surface.

3. The method according to any one of claims 1 or 2, wherein, at least one semiconductor element (10) is arranged on the base plate (6), wherein, after connecting (46) the housing part (4) to the base plate (6), the wiring surface (20) of the pin (16) is wire-connected (48) to the semiconductor element (10), wherein vibrations occurring during the wire connection (48) of the wiring surface (20) are at least partially attenuated by the damping material (22).

4. The method according to claim 3, wherein, before connecting (46) the housing part (4) to the base plate (6), at least one of the semiconductor elements (10) is connected to the base plate (6) in an electrically insulating and thermally conductive manner via a substrate (8).

5. The method according to any one of the preceding claims, wherein, the connection (46) of the housing part (4) is achieved by a material-fit, in particular adhesive, connection of the first housing assembly (12) and / or the second housing assembly (14) to the base plate (6).

6. The method according to any one of the preceding claims, wherein, the second housing assembly (14) comprises a second plastic frame (26), and the damping material (22) is applied, in particular applied circumferentially, to the second plastic frame before the insertion (44).

7. The method according to any one of the preceding claims, wherein, when inserting (44) the second housing assembly (14), a force-fit connection is established between the housing assemblies (12, 14).

8. The method according to any one of the preceding claims, wherein, The damping material (22) is embodied as a silicone resin layer (32), in particular a surrounding layer, which is applied to the second shaping frame (26) by means of screen printing or via a dispenser and then cured, wherein, when the second housing assembly (14) is inserted, the cured silicone resin layer (32) contacts the contact surface (24), in particular in a planar contact.

9. The method according to any one of claims 1 to 5, wherein, the second housing assembly (14) is embodied as a damping frame (36) made of the damping material (22).

10. The method according to claim 9, wherein, when the second housing assembly (14) is inserted (44), a force-fitting connection is established between the first housing assembly (12) and the damping frame (36).

11. A device (2) having a base plate (6) and a housing part (4) for receiving semiconductor elements (10), wherein, the housing part (4) comprises a first housing assembly (12) and a second housing assembly (14), wherein the first housing assembly (12) has at least one pin (16), wherein the pin (16) is at least partially cast into a first shaping frame (18), wherein a connection surface (20) is formed on the pin (16), wherein the second housing assembly (14) is inserted into the first housing assembly (12) to form the housing part (4), wherein the second housing assembly (14) has a damping material (22), wherein the damping material (22) contacts the contact surface (24) in a loose manner, the contact surface being arranged on a side of the first housing assembly (12) facing away from the connection surface (20), wherein the housing part (4) is connected to the base plate (6) such that the second housing assembly (14) contacts the base plate (6), in particular directly.

12. The device (2) according to claim 11, wherein, the damping material (22) contacts the contact surface (24) in a planar manner, in particular over the entire surface.

13. A semiconductor module (54) having at least one device (2) according to any one of claims 11 or 12.

14. A current converter (52) having at least one semiconductor module (54) according to claim 13.

15. A computer program product comprising instructions which, when executed by a computer, cause the computer to simulate the behavior, in particular the mechanical and / or electrical behavior, of the device (2) according to any one of claims 11 or 12.

Images