Regulation and control method and device for discharge localization in electrochemical discharge composite grinding

Abstract

The invention relates to a regulation and control method and device for discharge localization in electrochemical discharge composite grinding, and the method comprises the steps: obtaining the current machining region distribution characteristics of a workpiece surface of a target machining workpiece in the electrochemical discharge composite grinding process based on a current machining task, so as to determine a target discharge position and target liquid film distribution; based on the target liquid film distribution, the rotating direction of the grinding wheel is determined, and a nozzle layout scheme is determined based on preset airflow constraint; performing an electrochemical discharge composite grinding machining pre-experiment on the target machining workpiece to obtain an experiment result, and obtaining a process parameter range meeting a preset constraint condition by utilizing the experiment result; the working parameters of the grinding wheel and the nozzle under the current area space distribution characteristics are adjusted respectively, and the electrochemical discharge occurrence position is restrained to the unmachined surface of the target workpiece till the current machining task is completed. Therefore, the technical problems that in the related technology, the applicable machining working condition is limited, the cost is high, discharge localization is difficult to reliably and effectively restrain, and then the quality of electrochemical discharge composite grinding machining is affected are solved.

Description

Technical Field

[0001] This application relates to the field of special processing technologies, and particularly relates to a method and device for regulating discharge localization in electrochemical discharge composite grinding. Background Art

[0002] Electrochemical discharge machining is a special processing method that relies on thermal melting and chemical reactions to erode materials. To address the problems faced in macro-scale machining using electrochemical discharge machining, namely, that the machining efficiency is too low when the discharge energy is reduced, and a large heat-affected zone is caused when the discharge energy is increased, the discharge high temperature during the electrochemical discharge process can be used to soften insulating hard and brittle materials. Subsequently, the softened insulating hard and brittle materials are expected to be plastically removed by abrasive grains to complete efficient and damage-free material processing. In the actual application process, due to the curved surface characteristics of the grinding wheel or the workpiece itself, there is always a gradually changing machining gap in the machining area. When the machining gap is filled with electrolyte, the contact area between the cathode and the electrolyte will form an electrolytic circuit, and electrolysis will generate bubbles to form a gas film breakdown and electrochemical discharge will occur. The entire machining gap will become a potential area for electrochemical discharge. On the one hand, a large range of electrochemical discharges near the machining area will generate a large amount of stray discharges that consume energy and reduce the discharge stability. On the other hand, some electrochemical discharges will act on the machined surface, resulting in deterioration of the machining surface quality. Therefore, during the electrochemical discharge composite grinding process, it is necessary to confine the discharge localization to occur in the unprocessed area to reduce stray discharges and improve the discharge stability.

[0003] In related technologies, the methods for confining discharge localization to improve discharge localization mainly include: (1) Ceramic sleeve sidewall insulated electrode: A ceramic microtube is sleeved on the tool electrode to avoid sidewall discharge. This method is simple to operate, but the ceramic microtube is prone to breakage during electrochemical discharge composite grinding; (2) Diamond-coated sidewall insulated electrode: A micron-level diamond insulating film is coated on the electrode sidewall to avoid sidewall discharge of the electrode. This method is applicable to microelectrodes of various shapes, but the cost is expensive, and the insulating layer is prone to failure during electrochemical discharge composite grinding; (3) Changing the electrode structure: The end of the tool electrode is processed into a multi-lobe and multi-edge structure to utilize the tip discharge characteristic to confine the discharge to the end. This method is applicable to processing small holes at the end by electrochemical discharge, but when applied to electrochemical discharge composite grinding, since the tool electrode also acts as a grinding wheel to perform mechanical grinding and removal, processing a multi-edge structure on it will damage the grinding effect and affect the composite process effect.

[0004] In summary, in related technologies, the applicable processing conditions are limited, the cost is high, it is difficult to reliably and effectively confine discharge localization, which in turn affects the quality of electrochemical discharge composite grinding, and urgent improvement is needed. Summary of the Invention

[0005] The present application provides a method and device for regulating discharge localization in electrochemical discharge composite grinding, so as to solve the technical problems in the related art that the applicable processing conditions are limited, the cost is relatively high, it is difficult to reliably and effectively constrain discharge localization, and thus the quality of electrochemical discharge composite grinding is affected.

[0006] In the first aspect of the embodiments of the present application, a method for regulating discharge localization in electrochemical discharge composite grinding is provided, including the following steps: Based on the current processing task, obtain the current processing area distribution characteristics on the surface of the target workpiece during the electrochemical discharge composite grinding process, so as to determine the target discharge position and the target liquid film distribution based on the current processing area distribution characteristics; Based on the target liquid film distribution, determine the rotation direction of the grinding wheel, and determine the layout scheme of the nozzle based on the preset air flow constraint; Based on the layout scheme and the rotation direction, conduct a pre-experiment on the electrochemical discharge composite grinding of the target workpiece to obtain the experimental results, and use the experimental results to obtain the process parameter range that meets the preset constraint conditions; Based on the process parameter range, adjust the working parameters of the grinding wheel and the nozzle under the current area spatial distribution characteristics respectively, so as to constrain the electrochemical discharge occurrence position to the unprocessed surface of the target workpiece until the current processing task is completed.

[0007] Optionally, in an embodiment of the present application, the step of obtaining the current processing area distribution characteristics on the surface of the target workpiece during the electrochemical discharge composite grinding process based on the current processing task, so as to determine the target discharge position and the target liquid film distribution based on the current processing area distribution characteristics includes: Obtain the feed direction of the grinding wheel during the electrochemical discharge composite grinding process to obtain the spatial positions of the processed area and the unprocessed area in the current processing area distribution characteristics; Use the processing gap formed between the grinding wheel and the unprocessed area as the target discharge position, and determine the target liquid film distribution based on the target discharge position.

[0008] Optionally, in an embodiment of the present application, the step of determining the rotation direction of the grinding wheel based on the target liquid film distribution includes: Combine the target liquid film distribution and the current processing area distribution characteristics to determine the rotation direction, so that when the grinding wheel rotates, the electrolyte in the processing gap is squeezed from the processed area to the unprocessed area.

[0009] Optionally, in an embodiment of the present application, the step of determining the rotation direction of the grinding wheel based on the shape of the target liquid film distribution and determining the layout scheme of the nozzle based on the preset air flow constraint includes: Set the nozzle with the processing area of the target workpiece as the center, so that the outlet air flow of the nozzle flows from the processed area to the unprocessed area, and the liquid film is concentrated in the processing gap.

[0010] Optionally, in an embodiment of the present application, based on the layout scheme and the rotation direction, a pre-experiment on electrochemical discharge composite grinding of the target workpiece is carried out to obtain experimental results, and a process parameter range that meets preset constraint conditions is obtained by using the experimental results, including: obtaining the spark discharge position and the range of the discharge influence area in the machining gap; adjusting the working parameters of the nozzle and the grinding wheel based on the spark discharge position and the range of the discharge influence area until the electrochemical discharge is constrained within the machining gap to obtain the process parameter range.

[0011] An embodiment of the second aspect of the present application provides a device for regulating and controlling the discharge localization in electrochemical discharge composite grinding, including: an acquisition module, configured to obtain the current machining area distribution characteristics on the surface of the target workpiece during the electrochemical discharge composite grinding process based on the current machining task, so as to determine the target discharge position and the target liquid film distribution based on the current machining area distribution characteristics; a determination module, configured to determine the rotation direction of the grinding wheel based on the target liquid film distribution and determine the layout scheme of the nozzle based on a preset air flow constraint; a pre-experiment module, configured to carry out a pre-experiment on electrochemical discharge composite grinding of the target workpiece based on the layout scheme and the rotation direction to obtain experimental results, and obtain a process parameter range that meets preset constraint conditions by using the experimental results; a regulation and control module, configured to adjust the working parameters of the grinding wheel and the nozzle under the current area spatial distribution characteristics based on the process parameter range, so as to constrain the electrochemical discharge occurrence position to the unprocessed surface of the target workpiece until the current machining task is completed.

[0012] Optionally, in an embodiment of the present application, the acquisition module includes: a first acquisition unit, configured to obtain the feed direction of the grinding wheel during the electrochemical discharge composite grinding process to obtain the spatial positions of the processed area and the unprocessed area in the current machining area distribution characteristics; a first determination unit, configured to use the machining gap formed between the grinding wheel and the unprocessed area as the target discharge position and determine the target liquid film distribution based on the target discharge position.

[0013] Optionally, in an embodiment of the present application, the determination module includes: a second determination unit, configured to determine the rotation direction by combining the target liquid film distribution and the current machining area distribution characteristics, so that when the grinding wheel rotates, the electrolyte in the machining gap is squeezed from the processed area to the unprocessed area.

[0014] Optionally, in an embodiment of the present application, the determining module includes: a setting unit configured to set the nozzle centered on the machining area of the target workpiece, such that the outlet air flow of the nozzle flows from the machined area to the un-machined area, and such that the liquid film is concentrated within the machining gap.

[0015] Optionally, in an embodiment of the present application, the pre-experiment module includes: a second acquisition unit configured to acquire the spark discharge position and the discharge influence area range within the machining gap; an adjustment unit configured to adjust the working parameters of the nozzle and the grinding wheel based on the spark discharge position and the discharge influence area range until the electrochemical discharge is constrained within the machining gap, so as to obtain the process parameter range.

[0016] An embodiment of the third aspect of the present application provides an electronic device, including: a memory, a processor, and a computer program stored on the memory and executable on the processor, where the processor executes the program to implement the method for regulating discharge localization in electrochemical discharge composite grinding as described in the above embodiments.

[0017] An embodiment of the fourth aspect of the present application provides a computer-readable storage medium storing computer instructions for causing a computer to execute the method for regulating discharge localization in electrochemical discharge composite grinding as described in the above embodiments.

[0018] An embodiment of the fifth aspect of the present application provides a computer program product including a computer program which, when executed, is used to implement the method for regulating discharge localization in electrochemical discharge composite grinding as described above.

[0019] Embodiments of the present application can, based on the current machining task, acquire the current machining area distribution characteristics of the surface of the target workpiece during the electrochemical discharge composite grinding process, so as to determine the target discharge position and the target liquid film distribution, determine the rotation direction of the grinding wheel, and determine the layout scheme of the nozzle based on the preset air flow constraint. A pre-experiment on the electrochemical discharge composite grinding of the target workpiece is carried out according to the rotation direction and the layout scheme, so as to obtain the process parameter range that meets the preset constraint conditions by using the experimental results, and respectively adjust the working parameters of the grinding wheel and the nozzle under the current area spatial distribution characteristics, constrain the electrochemical discharge occurrence position to the un-machined surface of the target workpiece, and adjust the liquid film distribution by using the air flow constraint and the grinding wheel rotation state to control the discharge localization, improve the discharge localization, and realize that during the electrochemical discharge composite grinding process, the discharge localization is reliably and effectively constrained to occur in the un-machined area until the current machining task is completed. Thereby, the technical problems in the related art that the applicable machining conditions are limited, the cost is high, it is difficult to reliably and effectively constrain the discharge localization, and thus the quality of the electrochemical discharge composite grinding process is affected are solved.

[0020] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. Description of the Drawings

[0021] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description of embodiments in conjunction with the drawings, wherein:

[0022] Figure 1 FIG. is a flowchart of a method for regulating discharge localization in electrochemical discharge compound grinding according to an embodiment of the present application;

[0023] Figure 2 FIG. is a schematic diagram of the principle of a method for regulating discharge localization in electrochemical discharge compound grinding according to an embodiment of the present application;

[0024] Figure 3 FIG. is a schematic diagram of the principle of the influence of the rotating state of a grinding wheel on the distribution of electrolyte according to an embodiment of the present application;

[0025] Figure 4 FIG. is a schematic structural diagram of a device for regulating discharge localization in electrochemical discharge compound grinding according to an embodiment of the present application;

[0026] Figure 5 FIG. is a schematic structural diagram of an electronic device according to an embodiment of the present application. Detailed Description of the Embodiments

[0027] Embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present application and should not be construed as limiting the present application.

[0028] The following describes a method and device for regulating discharge localization in electrochemical discharge composite grinding according to an embodiment of the present application. Aiming at the technical problems in the related art mentioned in the above background art, where the applicable processing conditions are limited, the cost is high, and it is difficult to reliably and effectively constrain discharge localization, thereby affecting the quality of electrochemical discharge composite grinding processing, the present application provides a method for regulating discharge localization in electrochemical discharge composite grinding. In this method, based on the current processing task, the current processing area distribution characteristics on the surface of the target workpiece during the electrochemical discharge composite grinding process can be obtained, so as to determine the target discharge position and the target liquid film distribution, determine the rotation direction of the grinding wheel, and determine the layout scheme of the nozzle based on the preset air flow constraint. A pre-experiment on the electrochemical discharge composite grinding of the target workpiece is carried out according to the rotation direction and the layout scheme, so as to obtain the process parameter range that meets the preset constraint conditions by using the experimental results, and respectively adjust the working parameters of the grinding wheel and the nozzle under the current area space distribution characteristics, and constrain the electrochemical discharge occurrence position to the unprocessed surface of the target workpiece, so as to control the liquid film distribution by using the air flow constraint and the grinding wheel rotation state to control discharge localization, improve the discharge localization performance, and realize that during the electrochemical discharge composite grinding process, discharge localization occurs reliably and effectively in the unprocessed area until the current processing task is completed. Thus, the technical problems in the related art, where the applicable processing conditions are limited, the cost is high, and it is difficult to reliably and effectively constrain discharge localization, thereby affecting the quality of electrochemical discharge composite grinding processing, are solved.

[0029] Specifically, Figure 1 FIG. is a schematic flow chart of a method for regulating discharge localization in electrochemical discharge composite grinding provided by an embodiment of the present application.

[0030] As Figure 1 shown, the method for regulating discharge localization in electrochemical discharge composite grinding includes the following steps:

[0031] In step S101, based on the current processing task, the current processing area distribution characteristics on the surface of the target workpiece during the electrochemical discharge composite grinding process are obtained, so as to determine the target discharge position and the target liquid film distribution based on the current processing area distribution characteristics.

[0032] It can be understood that electro-chemical discharge compound grinding is a compound machining method that combines electro-chemical discharge and mechanical grinding. In order to more reliably and effectively confine the electro-localization to the unprocessed area during the electro-chemical discharge compound grinding process, the embodiments of the present application can determine the current machining area distribution characteristics on the surface of the target workpiece during the electro-chemical discharge compound grinding process according to the current machining task, that is, obtain the distribution characteristics such as the processed area, machining area, and unprocessed area on the workpiece surface, and then determine the target discharge position and target liquid film distribution according to the current machining area distribution characteristics to confine the electro-localization in the subsequent process.

[0033] Optionally, in an embodiment of the present application, based on the current machining task, obtain the current machining area distribution characteristics on the surface of the target workpiece during the electro-chemical discharge compound grinding process, so as to determine the target discharge position and target liquid film distribution based on the current machining area distribution characteristics, including: obtaining the feed direction of the grinding wheel during the electro-chemical discharge compound grinding process to obtain the spatial positions of the processed area and the unprocessed area in the current machining area distribution characteristics; taking the machining gap formed between the grinding wheel and the unprocessed area as the target discharge position, and determining the target liquid film distribution based on the target discharge position.

[0034] In the actual execution process, the embodiments of the present application can determine the spatial positions of the processed area and the unprocessed area on the surface of the target workpiece according to the feed direction of the grinding wheel during the electro-chemical discharge compound grinding. Among them, ideally, the electro-chemical discharge should occur in the machining gap formed between the grinding wheel and the unprocessed area to achieve the discharge softening effect, and avoid occurring in the machining gap formed between the grinding wheel and the processed area, which will deteriorate the quality of the processed surface. The presence of the electrolyte film between the grinding wheel and the target workpiece is a prerequisite for the occurrence of the discharge. Therefore, the ideal liquid film distribution position, that is, the target liquid film distribution, can be determined according to the above-determined ideal discharge position (target discharge position).

[0035] In step S102, based on the target liquid film distribution, determine the rotation direction of the grinding wheel, and determine the layout scheme of the nozzle based on the preset air flow constraint.

[0036] Furthermore, the embodiments of the present application can determine the liquid film shape under the ideal distribution according to the target liquid film distribution, determine the rotation direction of the grinding wheel, and determine the layout scheme of the air flow constraint nozzle, so as to control the liquid film distribution by using the air flow constraint and the rotation state of the grinding wheel to control the electro-localization and ensure the electro-localization during the machining process.

[0037] Optionally, in an embodiment of the present application, determining the rotation direction of the grinding wheel based on the target liquid film distribution includes: determining the rotation direction by combining the target liquid film distribution and the characteristics of the current machining area distribution, so that when the grinding wheel rotates, the electrolyte in the machining gap is squeezed from the machined area to the unmachined area.

[0038] In some embodiments, during the rotation of the grinding wheel, the high-speed rotational movement of the grinding wheel surface and the abrasive grains will squeeze and drive the electrolyte film in the machining area to move and accumulate in the same direction. Therefore, according to the ideal liquid film distribution position, that is, the target liquid film distribution, the rotation direction of the grinding wheel should be such that the electrolyte in the machining gap between the grinding wheel and the workpiece can be driven by the rotation of the grinding wheel and squeezed from the machined area to the unmachined area.

[0039] Optionally, in an embodiment of the present application, determining the rotation direction of the grinding wheel based on the shape of the target liquid film distribution and determining the layout scheme of the nozzle based on a preset airflow constraint includes: arranging the nozzle with the machining area of the target workpiece as the center, so that the outlet airflow of the nozzle flows from the machined area to the unmachined area, and the liquid film is concentrated in the machining gap.

[0040] In some other embodiments, with the machining area as the center, the nozzle should be arranged such that the flow direction of the outlet airflow of the nozzle is from the machined area to the unmachined area. The overall objective of the nozzle arrangement is to concentrate the liquid film as much as possible in the machining gap formed between the grinding wheel and the unmachined area of the target workpiece, and in the gap formed between the grinding wheel and the machined surface of the target workpiece, there is no electrolyte film due to the action of the airflow.

[0041] In step S103, based on the layout scheme and the rotation direction, a pre-experiment on electrochemical discharge composite grinding of the target workpiece to be machined is carried out to obtain experimental results, and the process parameter range that meets the preset constraint conditions is obtained by using the experimental results.

[0042] As a possible implementation method, the embodiments of the present application can use the determined nozzle layout scheme and the rotation direction of the grinding wheel to carry out a pre-experiment on electrochemical discharge composite grinding, so as to continuously adjust the working parameters of the nozzle and the grinding wheel according to the experimental results until the optimal process parameter range is found.

[0043] Optionally, in an embodiment of the present application, based on the layout scheme and the rotation direction, a pre-experiment on electrochemical discharge composite grinding of the target workpiece to be machined is carried out to obtain experimental results, and the process parameter range that meets the preset constraint conditions is obtained by using the experimental results, including: obtaining the spark discharge position and the range of the discharge influence area in the machining gap; adjusting the working parameters of the nozzle and the grinding wheel based on the spark discharge position and the range of the discharge influence area until the electrochemical discharge is constrained in the machining gap to obtain the process parameter range.

[0044] Among them, the optimization objective of the pre-experiment of electrochemical discharge composite grinding is to obtain the preferred process parameter range that confines the electrochemical discharge occurrence position to the unprocessed surface of the target workpiece. The preferred parameters mainly include the nozzle gas flow rate, nozzle angle, nozzle distance, nozzle outlet diameter, and the rotational speed of the grinding wheel.

[0045] For example, the optimization steps can be as follows: (1) Conduct an electrochemical discharge composite grinding experiment under given parameters, observe and record the position of spark discharge in the machining gap through a camera, and observe and record the range of the discharge influence area on the surface after machining; (2) Change the nozzle gas flow rate, nozzle angle, nozzle distance, nozzle outlet diameter, and the rotational speed of the grinding wheel respectively, repeat the experimental process in (1), and obtain the preferred parameter range that confines the electrochemical discharge within the gap formed between the grinding wheel and the unprocessed area of the target workpiece; (3) According to the preferred parameter range obtained in step (2), obtain the optimal parameter combination that can achieve the discharge confinement in the unprocessed area.

[0046] In step S104, based on the process parameter range, adjust the working parameters of the grinding wheel and the nozzle respectively under the spatial distribution characteristics of the current area, so as to confine the electrochemical discharge occurrence position to the unprocessed surface of the target workpiece until the current machining task is completed.

[0047] The embodiments of the present application can perform electrochemical discharge composite grinding on the target workpiece of the insulating material by using the optimized process parameters according to the process parameter range, and adjusting the air flow constraint nozzle and the rotational state of the grinding wheel. Combined Figure 2 and Figure 3 shown, the working principle of the discharge localization control method in the electrochemical discharge composite grinding of the embodiments of the present application is elaborated in detail with an embodiment.

[0048] Among them, Figure 2 in (a) is a schematic diagram of the machining situation without air flow constraint, Figure 2 in (b) is a schematic diagram of the machining situation with three nozzles arranged to constrain the liquid film distribution to control the discharge localization.

[0049] As Figure 2 shown in (a) and (b) therein, during the process of machining the workpiece material by electrochemical discharge composite grinding, due to the curved surface characteristics of the shape of the grinding wheel or the target workpiece itself, there will always be a gradually changing machining gap in the machining area. When the machining gap is filled with electrolyte, according to the contact area between the cathode of the electrochemical discharge and the electrolyte, an electrolytic circuit will be formed to generate electrolysis to produce bubbles, thus forming a gas film breakdown to occur electrochemical discharge, and the entire machining gap will become a potential area for electrochemical discharge to occur.

[0050] As Figure 2As shown in (a) thereof, the surface of the grinding wheel forms a gradually changing machining area with both the machined surface on the left side and the unmachined surface on the right side of the target workpiece. When the electrolyte fills the machining gap, electrochemical discharges will occur throughout the gap. On the one hand, this will lead to a large amount of stray discharges consuming energy and reducing the discharge stability. On the other hand, some electrochemical discharges will act on the machined surface, resulting in the deterioration of the machining surface quality. Therefore, by changing the distribution of the electrolyte film to regulate the distribution position of the electrolyte to adjust the discharge position, the localization of the discharge can be controlled, ensuring the discharge localization during the machining process.

[0051] As Figure 2 shown in (b) thereof, according to the relative spatial positions of the machined area and the unmachined area on the surface of the target workpiece, it is determined that the ideal discharge position should occur on the right side of the grinding wheel. Therefore, it is necessary to control the electrolyte film on the right side of the grinding wheel. By setting three air flow constraint nozzles above, on the left, and below with the machining area as the center, the flow direction of the air flow at the nozzle outlet is from the machined area to the unmachined area, so as to concentrate the liquid film as much as possible in the machining gap formed between the grinding wheel and the unmachined area of the target workpiece on the right side to control the discharge localization to act on the unmachined area, thereby realizing the control of the discharge localization.

[0052] As Figure 3 shown, during the rotation of the grinding wheel, the high-speed rotational motion of the grinding wheel surface and the abrasive grains will squeeze and drive the electrolyte film in the machining area to move and accumulate in the same direction. Therefore, in the actual machining process, this characteristic should be utilized to squeeze the electrolyte in the machining gap from the machined area to the unmachined area. Figure 3 In terms of this, the left side of the target workpiece should be the machined surface, and the right side of the target workpiece should be the unmachined surface.

[0053] According to the method for regulating discharge localization in electrochemical discharge assisted grinding proposed by the embodiments of the present application, based on the current machining task, the current machining area distribution characteristics of the workpiece surface during the electrochemical discharge assisted grinding of the target workpiece can be obtained, so as to determine the target discharge position and the target liquid film distribution, determine the rotation direction of the grinding wheel, and determine the layout scheme of the nozzle based on the preset air flow constraint. A pre-experiment on the electrochemical discharge assisted grinding of the target workpiece is carried out according to the rotation direction and the layout scheme, and thus the process parameter range that meets the preset constraint conditions is obtained by using the experimental results, so as to respectively adjust the working parameters of the grinding wheel and the nozzle under the current area spatial distribution characteristics, and confine the electrochemical discharge occurrence position to the unprocessed surface of the target workpiece, so as to control the liquid film distribution by using the air flow constraint and the grinding wheel rotation state to control the discharge localization, improve the discharge localization, and realize that during the electrochemical discharge assisted grinding process, the discharge localization is reliably and effectively confined to the unprocessed area until the current machining task is completed. Thereby, the technical problems in the related art that the applicable machining conditions are limited, the cost is high, it is difficult to reliably and effectively confine the discharge localization, and further affect the quality of the electrochemical discharge assisted grinding process are solved.

[0054] Next, a device for regulating discharge localization in electrochemical discharge assisted grinding proposed by the embodiments of the present application will be described with reference to the accompanying drawings.

[0055] Figure 4 It is a block diagram of a device for regulating discharge localization in electrochemical discharge assisted grinding according to the embodiments of the present application.

[0056] As Figure 4 shown, the device 10 for regulating discharge localization in electrochemical discharge assisted grinding includes: an acquisition module 100, a determination module 200, a pre-experiment module 300, and a regulation module 400.

[0057] Specifically, the acquisition module 100 is configured to obtain the current machining area distribution characteristics of the workpiece surface during the electrochemical discharge assisted grinding of the target workpiece based on the current machining task, so as to determine the target discharge position and the target liquid film distribution based on the current machining area distribution characteristics.

[0058] The determination module 200 is configured to determine the rotation direction of the grinding wheel based on the target liquid film distribution, and determine the layout scheme of the nozzle based on the preset air flow constraint.

[0059] The pre-experiment module 300 is configured to perform a pre-experiment on the electrochemical discharge assisted grinding of the target workpiece based on the layout scheme and the rotation direction, obtain experimental results, and obtain the process parameter range that meets the preset constraint conditions by using the experimental results.

[0060] The control module 400 is configured to adjust the working parameters of the grinding wheel and the nozzle respectively based on the process parameter range under the spatial distribution characteristics of the current area, so as to confine the electrochemical discharge occurrence position to the unprocessed surface of the target workpiece until the current machining task is completed.

[0061] Optionally, in an embodiment of the present application, the acquisition module 100 includes: a first acquisition unit and a first determination unit.

[0062] Wherein, the first acquisition unit is configured to acquire the feed direction of the grinding wheel during the electrochemical discharge composite grinding process, so as to obtain the spatial positions of the processed area and the unprocessed area in the spatial distribution characteristics of the current machining area.

[0063] The first determination unit is configured to use the machining gap formed between the grinding wheel and the unprocessed area as the target discharge position, and determine the target liquid film distribution based on the target discharge position.

[0064] Optionally, in an embodiment of the present application, the determination module 200 includes: a second determination unit.

[0065] Wherein, the second determination unit is configured to determine the rotation direction by combining the target liquid film distribution and the spatial distribution characteristics of the current machining area, so that when the grinding wheel rotates, the electrolyte in the machining gap is squeezed from the processed area to the unprocessed area.

[0066] Optionally, in an embodiment of the present application, the determination module 200 includes: a setting unit.

[0067] Wherein, the setting unit is configured to set the nozzle centered on the machining area of the target workpiece, so that the outlet air flow of the nozzle flows from the processed area to the unprocessed area, and the liquid film is concentrated in the machining gap.

[0068] Optionally, in an embodiment of the present application, the pre-experiment module 300 includes: a second acquisition unit and an adjustment unit.

[0069] Wherein, the second acquisition unit is configured to acquire the spark discharge position and the discharge influence area range in the machining gap.

[0070] The adjustment unit is configured to adjust the working parameters of the nozzle and the grinding wheel based on the spark discharge position and the discharge influence area range until the electrochemical discharge is confined in the machining gap to obtain the process parameter range.

[0071] It should be noted that the foregoing explanation of the embodiments of the method for controlling discharge localization in electrochemical discharge composite grinding also applies to the device for controlling discharge localization in electrochemical discharge composite grinding of this embodiment, and will not be repeated here.

[0072] The discharge localization control device in electrochemical discharge composite grinding proposed according to the embodiments of the present application can, based on the current machining task, obtain the current machining area distribution characteristics on the surface of the target workpiece during the electrochemical discharge composite grinding process, so as to determine the target discharge position and the target liquid film distribution, determine the rotation direction of the grinding wheel, and determine the layout scheme of the nozzle based on the preset air flow constraint. Conduct a pre-experiment on the electrochemical discharge composite grinding of the target workpiece according to the rotation direction and the layout scheme, and thus obtain the process parameter range that meets the preset constraint conditions by using the experimental results, so as to adjust the working parameters of the grinding wheel and the nozzle under the current area space distribution characteristics respectively, and confine the electrochemical discharge occurrence position to the unprocessed surface of the target workpiece, so as to control the liquid film distribution by using the air flow constraint and the grinding wheel rotation state to control the discharge localization, improve the discharge localization performance, and achieve reliable and effective confinement of the discharge localization to occur in the unprocessed area during the electrochemical discharge composite grinding process until the current machining task is completed. Thereby, the technical problems in the related art that the applicable machining conditions are limited, the cost is relatively high, it is difficult to reliably and effectively confine the discharge localization, and thus the quality of the electrochemical discharge composite grinding process is affected are solved.

[0073] Figure 5 The following is a schematic structural diagram of an electronic device provided by an embodiment of the present application. The electronic device may include:

[0074] A memory 501, a processor 502, and a computer program stored on the memory 501 and executable on the processor 502.

[0075] When the processor 502 executes the program, it implements the discharge localization control method in electrochemical discharge composite grinding provided in the above embodiment.

[0076] Further, the electronic device further includes:

[0077] A communication interface 503 for communication between the memory 501 and the processor 502.

[0078] The memory 501 is used to store a computer program executable on the processor 502.

[0079] The memory 501 may include a high-speed RAM memory, and may also include a non-volatile memory, such as at least one disk memory.

[0080] If the memory 501, the processor 502, and the communication interface 503 are implemented independently, the communication interface 503, the memory 501, and the processor 502 can be interconnected through a bus and communicate with each other. The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, an Extended Industry Standard Architecture (EISA) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 5 only a thick line is used in Figure 5 , but it does not mean that there is only one bus or one type of bus.

[0081] Optionally, in a specific implementation, if the memory 501, the processor 502, and the communication interface 503 are integrated on a single chip, the memory 501, the processor 502, and the communication interface 503 can communicate with each other through an internal interface.

[0082] The processor 502 may be a Central Processing Unit (CPU), or an Application Specific Integrated Circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0083] This embodiment also provides a computer-readable storage medium, on which a computer program is stored. When the program is executed by a processor, it implements the method for regulating discharge localization in electrochemical discharge compound grinding as described above.

[0084] The embodiments of the present application also provide a computer program product, including a computer program. When the computer program is executed by a processor, it implements the method for regulating discharge localization in electrochemical discharge compound grinding provided by the embodiments of the present invention.

[0085] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or N embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0086] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this application, the meaning of "N" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0087] Any process or method description shown in the flowchart or described in other ways herein can be understood to represent a module, segment, or portion of code including one or N executable instructions for implementing a customized logical function or process, and the scope of the preferred embodiments of this application includes additional implementations, where the functions may be executed in a substantially simultaneous manner or in the reverse order according to the involved functions, rather than in the order shown or discussed, which should be understood by those skilled in the art to which the embodiments of this application belong.

[0088] The logic and / or steps represented in the flowchart or otherwise described herein, for example, can be considered as a definite sequence list of executable instructions for implementing logical functions, and can be specifically implemented in any computer-readable medium for use by an instruction execution system, apparatus, or device (such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device), or used in conjunction with these instruction execution systems, apparatus, or devices. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in conjunction with an instruction execution system, apparatus, or device. More specific examples (non-exhaustive list) of computer-readable media include the following: an electrical connection portion (electronic device) having one or N wirings, a portable computer disk cartridge (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which the program can be printed, because the program can be obtained electronically by optically scanning the paper or other media, followed by editing, interpretation, or otherwise processing as appropriate, and then stored in a computer memory.

[0089] It should be understood that various parts of the present application can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, the N steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits having logic gate circuits for implementing logical functions on data signals, application specific integrated circuits having appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

[0090] Those of ordinary skill in the art of this technology can understand that all or part of the steps carried by the methods of the above embodiments can be completed by instructing relevant hardware through a program, and the program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0091] In addition, each functional unit in various embodiments of the present application may be integrated into one processing module, may exist physically alone for each unit, or two or more units may be integrated into one module. The above-mentioned integrated module may be implemented in the form of hardware or in the form of a software functional module. When the integrated module is implemented in the form of a software functional module and sold or used as an independent product, it may also be stored in a computer-readable storage medium.

[0092] The above-mentioned storage medium may be a read-only memory, a magnetic disk, an optical disc, etc. Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A method for regulating discharge localization in electrochemical discharge composite grinding, characterized in that: The following steps are involved: Based on the current processing task, the current processing area distribution characteristics of the workpiece surface of the target workpiece during the electrochemical discharge composite grinding process are obtained, so as to determine the target discharge position and the target liquid film distribution based on the current processing area distribution characteristics; Based on the target liquid film distribution, determining the rotation direction of the grinding wheel, and determining the layout of the nozzles based on the preset airflow constraints; Based on the layout scheme and the rotation direction, a preliminary experiment of electrochemical discharge composite grinding of the target workpiece is performed to obtain experimental results, and the process parameter range that meets the preset constraint conditions is obtained by using the experimental results; Based on the process parameter range, the working parameters of the grinding wheel and the nozzle under the spatial distribution characteristics of the current area are adjusted respectively, so as to constrain the location where the electrochemical discharge occurs to the unprocessed surface of the target workpiece based on the working parameters until the current processing task is completed.

2. The method according to claim 1, characterized in that The method of obtaining the current processing area distribution characteristics of the target workpiece surface during the electrochemical discharge composite grinding process based on the current processing task, so as to determine the target discharge position and the target liquid film distribution based on the current processing area distribution characteristics, includes: Obtaining the feeding direction of the grinding wheel during the electrochemical discharge composite grinding process to obtain the spatial position of the processed area and the spatial position of the unprocessed area in the current processing area distribution characteristics; A machining gap formed between the grinding wheel and the unmachined area is used as the target discharge position, and the target liquid film distribution is determined based on the target discharge position.

3. The method according to claim 2, characterized in that Determining the rotation direction of the grinding wheel based on the target liquid film distribution includes: The rotation direction is determined in combination with the target liquid film distribution and the distribution characteristics of the current processing area, so that when the grinding wheel turns, the electrolyte in the processing gap is squeezed from the processed area to the unprocessed area.

4. The method according to claim 2, characterized in that: The method of determining the rotation direction of the grinding wheel based on the shape of the target liquid film distribution and determining the layout of the nozzle based on the preset airflow constraint includes: The nozzle is arranged with the processing area of ​​the target workpiece as the center, so that the outlet airflow of the nozzle flows from the processed area to the unprocessed area, and the liquid film is concentrated in the processing gap.

5. The method according to claim 2, characterized in that: Based on the layout scheme and the rotation direction, a preliminary experiment of electrochemical discharge composite grinding of the target workpiece is performed to obtain experimental results, and the process parameter range that meets the preset constraint conditions is obtained by using the experimental results, including: Obtaining the spark discharge position and the discharge influence area range in the machining gap; Based on the spark discharge position and the range of the discharge influence zone, the working parameters of the nozzle and the grinding wheel are adjusted until the electrochemical discharge is confined within the machining gap to obtain the process parameter range.

6. A control device for discharge localization in electrochemical discharge composite grinding, characterized in that: include: An acquisition module, for acquiring, based on a current processing task, current processing area distribution characteristics of a target workpiece surface during an electrochemical discharge composite grinding process, so as to determine a target discharge position and a target liquid film distribution based on the current processing area distribution characteristics; A determination module, used to determine the rotation direction of the grinding wheel based on the target liquid film distribution, and determine the layout of the nozzles based on the preset airflow constraints; A pre-experimental module, for performing a pre-experiment of electrochemical discharge composite grinding of the target workpiece based on the layout scheme and the rotation direction, obtaining experimental results, and using the experimental results to obtain a process parameter range that meets preset constraint conditions; The control module is used to adjust the working parameters of the grinding wheel and the nozzle under the spatial distribution characteristics of the current area based on the process parameter range, so as to constrain the location where the electrochemical discharge occurs to the unprocessed surface of the target workpiece based on the working parameters until the current processing task is completed.

7. The device according to claim 6, characterized in that The acquisition module comprises: An acquisition unit, used for acquiring the feeding direction of the grinding wheel during the electrochemical discharge composite grinding process, so as to obtain the spatial position of the processed area and the spatial position of the unprocessed area in the current processing area distribution characteristics; A determination unit is used to take a machining gap formed between the grinding wheel and the unmachined area as the target discharge position, and determine the target liquid film distribution based on the target discharge position.

8. An electronic device, characterized in that: include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the method for regulating discharge localization in electrochemical discharge composite grinding as described in any one of claims 1 to 5.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: The program is executed by a processor to implement the method for regulating discharge localization in electrochemical discharge composite grinding as described in any one of claims 1 to 5.

10. A computer program product, comprising a computer program, characterized in that When the computer program is executed, it is used to implement the method for regulating discharge localization in electrochemical discharge composite grinding as described in any one of claims 1 to 5.

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