High temperature resistant and medium resistant coating and its manufacturing method

Abstract

The application discloses a high-temperature-resistant and medium-resistant paint and a manufacturing method thereof. The high-temperature-resistant and medium-resistant paint comprises the following raw materials in parts by weight: 320-390 parts of modified epoxy phenolic resin, 27-71 parts of graphene dispersion, 170-285 parts of pigment and filler, 120-160 parts of functional filler, 235-310 parts of mixed solvent, 44-71 parts of auxiliary agent and 5-9 parts of dispersing agent. The high-temperature-resistant and medium-resistant paint is resistant to heat (250 DEG C, 240 h), resistant to steam blowing (0.6-0.8 MPa, 4 h), resistant to heat conducting oil (250 DEG C, 168 h), resistant to high-temperature and high-pressure test (250 DEG C, 10 MPa, 5% NaCl, 168 h), resistant to 10% H2SO4 solution (100 DEG C, 480 h), resistant to 10% NaOH solution (100 DEG C, 480 h), resistant to 20% NaCl solution (100 DEG C, 480 h), resistant to salt spray (2000 h).

Description

Technical Field

[0001] This invention relates to the field of coatings, and more particularly to a high-temperature resistant and media-resistant coating and its manufacturing method. Background Technology

[0002] Heat exchangers, as important heat exchange equipment in the petroleum, petrochemical, and chemical industries, are generally made of carbon steel. They operate in complex environments with high temperature, high pressure, high flow rate, and harsh corrosiveness. During maintenance, heat exchangers and other equipment must also withstand the high temperature and high pressure environment of the steam purging stage, which leads to corrosion, perforation, and thinning in different parts of the heat exchanger tube bundle, shell, and tube box. In severe cases, this can lead to the scrapping of the heat exchanger. The harsh corrosive environment greatly shortens the service life and efficiency of the heat exchanger.

[0003] To address the aforementioned technical challenges, current methods primarily involve using high-temperature and corrosion-resistant alloy materials to fabricate heat exchanger tube bundles or employing heat exchanger coatings for corrosion protection. Due to their simple construction and reliable corrosion resistance, heat exchanger coatings effectively improve the corrosion protection of different parts of the heat exchanger tube bundle, shell, and tube box, making them a relatively economical and efficient corrosion prevention measure. However, current heat exchanger corrosion protection mainly focuses on environments with heat resistance below 180℃, with few high-temperature heat exchanger coatings suitable for steam purging and environments with high temperatures below 250℃, severely limiting the application of high-temperature heat exchangers. Summary of the Invention

[0004] This invention provides a high-temperature resistant and media-resistant coating and its manufacturing method, which can withstand steam purging and high temperature of 250℃.

[0005] This invention provides a high-temperature resistant and media-resistant coating, comprising the following raw materials in parts by weight: 320-390 parts modified epoxy phenolic resin, 27-71 parts graphene dispersion, 170-285 parts pigments and fillers, 120-160 parts functional fillers, 235-310 parts mixed solvent, 44-71 parts additives, and 5-9 parts dispersant.

[0006] Furthermore, the high-temperature and media-resistant coating comprises the following raw materials in parts by weight: 320–380 parts modified epoxy phenolic resin, 31–64 parts graphene dispersion, 173–268 parts pigments and fillers, 142–154 parts functional fillers, 241–275 parts mixed solvent, 47–65 parts additives, and 5–9 parts dispersant.

[0007] Furthermore, the modified epoxy phenolic resin includes a premixed mixture of epoxy silicone resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether, and xylene. The weight ratio of epoxy silicone resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether, and xylene is 60–75:87–130:73–95:36–47:69–75.

[0008] Furthermore, the solid content of the graphene dispersion is 10%.

[0009] Furthermore, the pigments and fillers include at least one of green silicon carbide, silicon dioxide, barite powder, aluminum oxide, and titanium dioxide.

[0010] Furthermore, the functional filler comprises the following raw materials by weight: 10-16 parts of nano titanium dioxide, 12-23 parts of boron nitride, 36-58 parts of ultrafine thermally conductive aluminum nitride, 16-28 parts of iron oxide, 21-28 parts of copper oxide, and 10-17 parts of zinc oxide.

[0011] Further, the mixed solvent comprises the following raw materials in parts by weight: 92 to 115 parts of ethylene glycol phenyl ether, 73 to 98 parts of xylene, 30 to 42 parts of n-butanol, and 12 to 19 parts of cyclohexanone.

[0012] Furthermore, the additives include the following raw materials in parts by weight: 10-13 parts defoamer, 3-10 parts leveling agent, 10-16 parts wetting agent, 12-16 parts adhesion promoter, and 4-7 parts thixotropic agent.

[0013] This invention also provides a method for manufacturing the above-mentioned high-temperature and media-resistant coating, comprising the following steps: preparing a modified epoxy phenolic resin. Adding a graphene dispersion and additives to the modified epoxy phenolic resin, dispersing at a rotation speed of 800–1000 r / min for 20–30 min to obtain a mixed solution. Adding pigments, fillers, functional fillers, and dispersants to the mixed solvent, dispersing at a rotation speed of 800–1000 r / min for 20–30 min, and grinding at a temperature ≤70℃ for 1.0–1.5 h to obtain a mixed slurry. Mixing the mixed solution and the mixed slurry, dispersing at a rotation speed of 2000–2500 r / min and a temperature ≤70℃ for 30–45 min to obtain the high-temperature and media-resistant coating.

[0014] Further, the modified epoxy phenolic resin is prepared by: adding 40 parts of phenolic resin to a solution of 20 parts of ethylene glycol phenyl ether and 20 parts of xylene, and heating and melting at a temperature controlled at 110-130℃ for 30-45 minutes to obtain a first solution. The first solution is cooled to 70-80℃, and the prescribed amounts of epoxy resin and benzyl dimethylamine are added and dispersed for 5 minutes. The temperature is then increased to 150℃ and dispersed at a rotation speed of 1000-1500 r / min for 30-40 minutes, with the benzyl dimethylamine being 1% of the total mass of the first solution, to obtain a second solution. After the second solution is cooled to room temperature, the remaining prescribed amounts of phenolic resin, epoxy silicone resin, ethylene glycol phenyl ether, and xylene are added and dispersed at a rotation speed of 1500-2000 r / min for 50-60 minutes to obtain the modified epoxy phenolic resin.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] This invention uses phenolic, epoxy, and epoxy silicone resins as the main film-forming materials, resulting in a coating with excellent appearance, high temperature resistance, high pressure resistance, and dielectric properties. The optimization and combination of the filler system improves the thermal conductivity and heat transfer effect, effectively unifying coating performance and application effect. Specifically, this invention improves the degree of polymerization of the film-forming material system through blending modification of the phenolic, epoxy, and epoxy silicone ternary resin system, thereby increasing the glass transition temperature of the coating and raising its heat resistance temperature to 250℃. The high thermal conductivity fillers such as ultrafine thermally conductive aluminum nitride and boron nitride, combined with high infrared emissivity fillers such as iron oxide, copper oxide, and zinc oxide, form effective heat conduction pathways within the coating, improving the heat exchanger coating's heat transfer efficiency. The addition of graphene dispersions, utilizing their large molecular size and high flake-to-diameter ratio, creates a shielding labyrinth effect, effectively reducing the penetration of corrosive ions into the coating and improving its dielectric resistance. Simultaneously, graphene acts as a bridge for heat conduction between high thermal conductivity fillers and high infrared emissivity fillers, further enhancing the coating's thermal conductivity efficiency.

[0017] The high-temperature and medium-resistant coating of this invention is heat-resistant (250℃, 240h), steam purging-resistant (0.6~0.8MPa, 4h), heat transfer oil-resistant (250℃, 168h), high-temperature and high-pressure resistant (250℃, 10MPa, 5% NaCl, 168h), resistant to 10% H2SO4 solution (100℃, 480h), resistant to 10% NaOH solution (100℃, 480h), resistant to 20% NaCl solution (100℃, 480h), and resistant to salt spray (2000h). Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0019] Currently, ordinary epoxy phenolic resins cannot meet the requirements for use in high-temperature and high-pressure environments of heat exchangers, especially at temperatures exceeding 200℃. Furthermore, the crosslinking density of epoxy phenolic resin coatings during high-temperature steam purging is insufficient to completely prevent the penetration of high-temperature gases, leading to coating failure during this process. Therefore, it is necessary to develop heat exchanger coatings that are heat-resistant up to 250℃ and resistant to steam purging, while also improving the coating's resistance to media and overall performance.

[0020] Heat exchanger coatings need to possess good thermal conductivity in environments resistant to various media. However, limitations in the overall performance of the filler system prevent coatings from achieving a good balance between media resistance and thermal conductivity. Therefore, it is necessary to develop an efficient thermal conductivity system specifically tailored to acid and alkali resistance and thermal conductivity to improve the coating's thermal conductivity.

[0021] To address the aforementioned issues of excellent high-temperature resistance and steam purging resistance of heat exchanger coatings, as well as the good media resistance and thermal conductivity of heat exchanger coatings...

[0022] An embodiment of the present invention provides a high-temperature resistant and media-resistant coating, comprising the following raw materials in parts by weight: 320-390 parts modified epoxy phenolic resin, 27-71 parts graphene dispersion, 170-285 parts pigments and fillers, 120-160 parts functional fillers, 235-310 parts mixed solvent, 44-71 parts additives, and 5-9 parts dispersant.

[0023] The amount of modified epoxy phenolic resin can be 320, 330, 340, 350, 360, 370, 380, or 390 parts by weight, preferably 320 to 380 parts by weight.

[0024] The modified epoxy phenolic resin can be a premixed mixture of epoxy silicone resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether, and xylene. The weight ratio of epoxy silicone resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether, and xylene is 60–75:87–130:73–95:36–47:69–75, preferably 60–72:87–125:73–93:36–45:69–75. The epoxy silicone resin can be ES-06 type resin, the epoxy resin can be NPES-901 resin, and the phenolic resin can be Jinan Nuochuang Chemical 2402 resin.

[0025] The amount of graphene dispersion can be 27, 31, 50, 64, or 71 parts by weight, preferably 31 to 64 parts by weight.

[0026] The solid content of the graphene dispersion can be 10%. The amount of graphene dispersion used can be 8% to 17% of the amount of modified epoxy phenolic resin. It should be noted that the graphene dispersion is a raw material in which graphene is dispersed in a solvent to exist stably. Since graphene, when made into a dispersion, will agglomerate and become ineffective, it is generally mixed with an organic solvent and a dispersant is added by the manufacturer to form a dispersion. Graphene is generally dispersed in a strong organic solvent (such as N-methylpyrrolidone).

[0027] The amount of pigments and fillers can be 170, 173, 200, 230, 268, or 285 parts by weight, preferably 173 to 268 parts by weight.

[0028] The pigments and fillers may be composed of at least one of green silicon carbide, silicon dioxide, barite powder, aluminum oxide, and titanium dioxide. For example, they may be green silicon carbide, a mixture of silicon dioxide and barite powder, or a mixture of aluminum oxide and titanium dioxide.

[0029] The amount of functional filler can be 120, 142, 450, 154, or 160 parts by weight, preferably 142 to 154 parts by weight.

[0030] The functional filler can be composed of the following raw materials in parts by weight: 10-16 parts of nano-titanium dioxide, 12-23 parts of boron nitride, 36-58 parts of ultrafine thermally conductive aluminum nitride, 16-28 parts of iron oxide, 21-28 parts of copper oxide, and 10-17 parts of zinc oxide. Specifically, the amount of nano-titanium dioxide can be 10, 13, or 16 parts by weight; the amount of boron nitride can be 12, 17, or 23 parts by weight; the amount of ultrafine thermally conductive aluminum nitride can be 36, 47, or 58 parts by weight; the amount of iron oxide can be 16, 22, or 28 parts by weight; the amount of copper oxide can be 21, 24, or 28 parts by weight; and the amount of zinc oxide can be 10, 13, or 17 parts by weight.

[0031] The amount of mixed solvent can be 235, 241, 260, 275, or 310 parts by weight, preferably 241 to 275 parts by weight.

[0032] The mixed solvent consists of the following raw materials in parts by weight: 92–115 parts ethylene glycol phenyl ether, 73–98 parts xylene, 30–42 parts n-butanol, and 12–19 parts cyclohexanone. The amount of ethylene glycol phenyl ether can be 92, 104, or 115 parts by weight. The amount of xylene can be 73, 85, or 98 parts by weight. The amount of n-butanol can be 30, 36, or 42 parts by weight. The amount of cyclohexanone can be 12, 15, or 19 parts by weight.

[0033] The amount of the additive can be 44, 47, 55, 65, or 71 parts by weight, preferably 47 to 65 parts by weight.

[0034] The additive may consist of the following raw materials in parts by weight: 10-13 parts defoamer, 3-10 parts leveling agent, 10-16 parts wetting agent, 12-16 parts adhesion promoter, and 4-7 parts thixotropic agent. Specifically, the amount of defoamer may be 10, 11, or 13 parts by weight. The amount of leveling agent may be 3, 6, or 10 parts by weight. The amount of wetting agent may be 10, 13, or 16 parts by weight. The amount of adhesion promoter may be 12, 14, or 16 parts by weight. The amount of thixotropic agent may be 4, 5, 6, or 7 parts by weight.

[0035] The amount of dispersant can be 5, 6, 7, 8, or 9 parts by weight.

[0036] An embodiment of the present invention also provides a method for manufacturing the above-mentioned high-temperature resistant and media-resistant coating, comprising the following steps:

[0037] (1) Preparation of modified epoxy phenolic resin.

[0038] The above steps include the following processes:

[0039] A. Add 40 parts of phenolic resin to a solution of 20 parts of ethylene glycol phenyl ether and 20 parts of xylene, and heat and melt at a temperature controlled at 110-130℃ for 30-45 minutes to obtain the first solution.

[0040] In the above process, the addition ratio of phenolic resin, ethylene glycol phenyl ether, and xylene is 2:1:1. The heating and melting temperature can be controlled at 110, 120, or 130℃, etc. The heating and melting time can be 30, 37, or 45 minutes, etc.

[0041] B. Cool the first solution to 70-80°C, slowly add the prescribed amount of epoxy resin and benzyl dimethylamine, disperse at low speed for 5 minutes, raise the temperature to 150°C, and disperse at high speed for 30-40 minutes at a rotation speed of 1000-1500 r / min. The benzyl dimethylamine is 1% of the total mass of the first solution, to obtain the second solution.

[0042] In the above process, the cooling temperature of the first solution can be 70, 75, or 80°C, etc. The high-speed dispersion speed can be 1000, 1300, or 1500 r / min, etc. The high-speed dispersion time can be 30, 35, or 40 min, etc.

[0043] C. After the second solution is cooled to room temperature, add the remaining amount of phenolic resin, epoxy silicone resin, ethylene glycol phenyl ether, and xylene. Disperse at high speed for 50-60 minutes at a speed of 1500-2000 r / min to obtain modified epoxy phenolic resin.

[0044] In the above process, the high-speed dispersion speed can be 1500, 1800, 2000 r / min, etc. The high-speed dispersion time can be 50, 55, 60 min, etc.

[0045] (2) Add the graphene dispersion and additives to the modified epoxy phenolic resin and disperse at a low speed of 800-1000 r / min for 20-30 min to obtain a mixed solution.

[0046] In the above steps, the low-speed dispersion rotation speed can be 800, 900, 1000 r / min, etc. The low-speed dispersion time can be 20, 25, 30 min, etc.

[0047] (3) Add pigments, fillers, functional fillers and dispersants to the mixed solvent, disperse at low speed for 20 to 30 minutes at a speed of 800 to 1000 r / min, and grind for 1.0 to 1.5 hours at a temperature of ≤70℃ to obtain a mixed slurry.

[0048] In the above steps, the low-speed dispersion rotation speed can be 800, 900, or 1000 r / min, etc. The low-speed dispersion time can be 20, 25, or 30 min, etc. The grinding temperature can be 30, 50, or 70℃, etc. The grinding time can be 1.0, 1.2, or 1.5 h, etc.

[0049] (4) Mix the mixed solution and mixed slurry, and disperse them at high speed for 30 to 45 minutes at a rotation speed of 2000 to 2500 r / min and a temperature of ≤70℃ to obtain a high temperature resistant and media resistant coating.

[0050] In the above steps, the high-speed dispersion speed can be 2000, 2200, 2500 r / min, etc. The high-speed dispersion temperature can be 30, 50, 70℃, etc. The high-speed dispersion time can be 30, 37, 45 min, etc.

[0051] The following detailed description is provided with reference to specific embodiments:

[0052] Example 1

[0053] Raw material formula

[0054]

[0055]

[0056] Preparation process:

[0057] (1) Add 40 parts of phenolic resin to a solution of 20 parts of ethylene glycol phenyl ether and 20 parts of xylene, and heat and melt it for 40 minutes at a temperature controlled at 120℃ to obtain the first solution.

[0058] The first solution was cooled to 75°C, and the prescribed amounts of epoxy resin and benzyl dimethylamine were slowly added. The mixture was dispersed at a low speed for 5 minutes, and then the temperature was increased to 150°C. The mixture was then dispersed at a high speed for 35 minutes at a rotation speed of 1200 r / min. The amount of benzyl dimethylamine was 1% of the total mass of the first solution, thus obtaining the second solution.

[0059] After the second solution is cooled to room temperature, the remaining amounts of phenolic resin, epoxy silicone resin, ethylene glycol phenyl ether, and xylene are added. The mixture is then dispersed at high speed for 55 minutes at a speed of 1800 r / min to obtain modified epoxy phenolic resin.

[0060] (2) Add graphene dispersion and additives to modified epoxy phenolic resin and disperse at low speed for 25 min at a speed of 900 r / min to obtain a mixed solution.

[0061] (3) Add pigments, functional fillers and dispersants to the mixed solvent, disperse at low speed for 25 min at a speed of 900 r / min, and grind for 1.2 h at a temperature of 30℃ to obtain a mixed slurry.

[0062] (4) Mix the mixed solution and mixed slurry, and disperse them at high speed for 40 minutes at a speed of 2200 r / min and a temperature of 30℃ to obtain a high temperature resistant and media resistant coating.

[0063] Example 2

[0064] The difference from Example 1 lies in the different raw material formula, as detailed below:

[0065]

[0066] Example 3

[0067] The difference from Example 1 lies in the different raw material formula, as detailed below:

[0068]

[0069]

[0070] Example 4

[0071] The difference from Example 1 lies in the different raw material formula, as detailed below:

[0072]

[0073] Example 5

[0074] The difference from Example 1 lies in the different raw material formula, as detailed below:

[0075]

[0076]

[0077] Experimental Example 1

[0078] The coating performance test indicators of the coatings obtained in Examples 1-5 are as follows:

[0079]

[0080]

[0081] The main differences between the five embodiments are as follows: In embodiments 1 to 3, the contents of epoxy silicone resin, epoxy resin, and phenolic resin are all within the preferred range, resulting in good coating performance with excellent resistance to high temperature, high pressure, media, steam purging, and chloride ion penetration, as well as good mechanical properties; In embodiment 4, the phenolic resin content is low, below the preferred range, resulting in a significant decrease in the crosslinking density of the coating, leading to low coating adhesion, and affecting its resistance to high temperature and media; In embodiment 5, the phenolic resin content is high, exceeding the preferred range, resulting in increased hardness and brittleness of the coating due to the increased amount of phenolic resin added, and reduced impact resistance and media resistance.

[0082] Experimental Example 2

[0083] This invention provides three comparative examples to effectively compare and evaluate the effects of the epoxy silicone resin, phenolic resin, and thermally conductive filler of this invention.

[0084] The difference between Comparative Example 1 and Example 1 is that the raw material formulation does not contain epoxy silicone resin. Accordingly, no epoxy silicone resin is added during the preparation process.

[0085] The difference between Comparative Example 2 and Example 1 is that the raw material formulation does not contain phenolic resin. Accordingly, no phenolic resin is added during the preparation process.

[0086] The difference between Comparative Example 3 and Example 1 is that the raw material formulation does not contain functional fillers. Accordingly, no functional fillers are added during the preparation process.

[0087] The coating performance test indicators of the coatings obtained in Comparative Examples 1-3 are as follows:

[0088]

[0089] The coating performance indicators and related standards provided by this invention are shown in Table 4:

[0090]

[0091]

[0092] Comparing Examples 1-3 with Comparative Examples 1-3, the coatings of Examples 1-3 all exhibit good impact resistance, adhesion, flexibility, abrasion resistance, high temperature resistance, high pressure resistance, media resistance, salt spray resistance, and chloride ion penetration resistance. However, the coating of Comparative Example 1 shows reduced heat resistance, flexibility, abrasion resistance, high temperature and high pressure resistance, and salt spray resistance, failing to meet the relevant testing standards. The coating of Comparative Example 2 shows significantly reduced adhesion, and its abrasion resistance, high temperature and high pressure resistance, media resistance, and salt spray resistance are below the testing standard requirements. The coating of Comparative Example 3 has poor thermal conductivity and does not meet the testing standard requirements for alkaline media resistance. This demonstrates that the lack of epoxy silicone resin, phenolic resin, and thermally conductive filler significantly affects the system's performance, failing to meet application requirements. The technical solution of this invention, employing a composite system of epoxy silicone resin, epoxy resin, phenolic resin, and thermally conductive filler, can achieve excellent mechanical properties and comprehensive high temperature and high pressure resistance in the coating.

[0093] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high temperature and medium resistant coating characterized in that, The raw materials include the following weight fractions: 320~390 parts of modified epoxy phenolic resin, 27~71 parts of graphene dispersion, 170~285 parts of color filler, 120~160 parts of functional filler, 235~310 parts of mixed solvent, 44~71 parts of auxiliary agent, 5~9 parts of dispersing agent; The modified epoxy phenolic resin includes a blended modified premix of epoxy organosilicon resin, epoxy resin, phenolic resin, ethylene glycol phenyl ether, xylene; the weight ratio of the epoxy organosilicon resin, the epoxy resin, the phenolic resin, the ethylene glycol phenyl ether, and the xylene is 60~75:87~130:73~95:36~47:69~75; The functional filler includes the following raw materials in weight fractions: 10~16 parts of nano titanium dioxide, 12~23 parts of boron nitride, 36~58 parts of ultra-fine heat-conducting aluminum nitride, 16~28 parts of iron oxide, 21~28 parts of copper oxide, 10~17 parts of zinc oxide.

2. A high temperature and medium resistant coating as claimed in claim 1, wherein, The raw materials include the following weight fractions: 320~380 parts of modified epoxy phenolic resin, 31~64 parts of graphene dispersion, 173~268 parts of color filler, 142~154 parts of functional filler, 241~275 parts of mixed solvent, 47~65 parts of auxiliary agent, 5~9 parts of dispersing agent.

3. The high-temperature-resistant and medium-resistant paint of claim 1, characterized in that, The solid content of the graphene dispersion is 10%.

4. The high-temperature-resistant and medium-resistant paint of claim 1, characterized in that, The color filler includes at least one of green silicon carbide, silicon dioxide, barite powder, aluminum oxide, and titanium white powder.

5. The high temperature and medium resistant coating as claimed in claim 1, wherein, The mixed solvent includes the following raw materials in weight fractions: 92~115 parts of ethylene glycol phenyl ether, 73~98 parts of xylene, 30~42 parts of n-butanol, 12~19 parts of cyclohexanone.

6. The high temperature and medium resistant coating as claimed in claim 1, wherein, The auxiliary agent includes the following raw materials in weight fractions: 10~13 parts of defoaming agent, 3~10 parts of leveling agent, 10~16 parts of wetting agent, 12~16 parts of adhesion promoter, 4~7 parts of thixotropic agent.

7. A method of producing the high-temperature-resistant and medium-resistant coating according to any one of claims 1 to 6, characterized by, The method includes the following steps: Preparation of modified epoxy phenolic resin; Add graphene dispersion and auxiliary agent to the modified epoxy phenolic resin, and disperse for 20~30 min at a rotation speed of 800~1000 r / min to obtain a mixed solution; Add color filler, functional filler, and dispersing agent to the mixed solvent, disperse for 20~30 min at a rotation speed of 800~1000 r / min, and grind for 1.0~1.5 h at a temperature of ≤70 ℃ to obtain a mixed slurry; Mix the mixed solution and the mixed slurry, disperse for 30~45 min at a rotation speed of 2000~2500 r / min and a temperature of ≤70 ℃, and obtain a high-temperature-resistant and medium-resistant paint.

8. The manufacturing method of claim 7, characterized in that, Preparation of modified epoxy phenolic resin includes: 40 parts of phenolic resin is added into a solution of 20 parts of ethylene glycol phenyl ether, 20 parts of xylene, heated and melted at a temperature of 110-130 DEG C for 30-45 min to obtain a first solution; The first solution is cooled to 70-80 DEG C, and the formula amount of epoxy resin and benzyl dimethyl amine is added, dispersed for 5 min, the temperature is raised to 150 DEG C, and dispersed at a speed of 1000-1500 r / min for 30-40 min, the benzyl dimethyl amine is 1% of the total mass of the first solution, to obtain a second solution; After the second solution is cooled to room temperature, the remaining formula amount of phenolic resin, the formula amount of epoxy silicone resin, the remaining formula amount of ethylene glycol phenyl ether, and the remaining formula amount of xylene are added, and dispersed at a speed of 1500-2000 r / min for 50-60 min to obtain a modified epoxy phenolic resin.

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