Temperature detection method, device, system and equipment and readable storage medium

Abstract

The invention discloses a temperature detection method, device, system and equipment and a readable storage medium, and the method comprises the steps: obtaining a first thermal imaging image model of a to-be-detected assembly, the to-be-detected assembly comprises a target part, and the first thermal imaging image model comprises a first target region corresponding to the target part; correcting the temperature of the first target area in the first thermal imaging image model based on a preset and determined temperature compensation value of the first target area; and according to the temperature of the first target area in the corrected first thermal imaging image model, determining the temperature of a target component in the to-be-measured assembly. According to the embodiment of the invention, the temperature of the target component in the to-be-measured component can be accurately determined.

Description

Technical Field

[0001] This application relates to the field of detection technologies, and particularly to a temperature detection method, device, system, equipment, and readable storage medium. Background Art

[0002] It is very necessary to detect the temperature of components inside a component to be measured, which can effectively ensure the safe operation of the component to be measured. However, currently, it is difficult to measure the temperature of some components inside the component to be measured, and / or the accuracy of the measured temperature is relatively low. Summary of the Invention

[0003] This application provides a temperature detection method, device, system, equipment, and readable storage medium, which can accurately determine the temperature of a target component in a component to be measured.

[0004] In a first aspect, this application provides a temperature detection method, which includes: obtaining a first thermal imaging image model of a component to be measured, where the component to be measured includes a target component, and the first thermal imaging image model includes a first target area corresponding to the target component; based on a temperature compensation value preset for the first target area, correcting the temperature of the first target area in the first thermal imaging image model; and determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model.

[0005] Based on the technical solution of the embodiments of this application, on the one hand, by obtaining the first thermal imaging image model of the component to be measured, the temperature of the first target area corresponding to the target component in the first thermal imaging image model can be obtained, realizing the measurement of the temperature of the target component in the component to be measured; on the other hand, based on the temperature compensation value preset for the first target area, correcting the temperature of the first target area in the first thermal imaging image model; and then determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model can make the temperature of the first target area in the first thermal imaging image model more accurate, thereby improving the accuracy of the determined temperature of the target component in the component to be measured.

[0006] According to some embodiments of this application, optionally, before obtaining the first thermal imaging image model of the component to be measured, the method further includes: obtaining a second thermal imaging image model of the component to be measured after being placed in a constant temperature environment for a preset duration, where the second thermal imaging image model includes a second target area corresponding to the target component; calculating a first difference between the temperature of the constant temperature environment and the temperature of the second target area, and the temperature compensation value includes the first difference.

[0007] According to some embodiments of the present application, optionally, based on the temperature compensation value of the first target area determined in advance, correcting the temperature of the first target area in the first thermal imaging image model includes: when the second difference between the temperature of the first target area and the temperature of the second target area is less than or equal to the first preset threshold, taking the first difference as the temperature compensation value of the first target area; correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area.

[0008] According to some embodiments of the present application, optionally, the constant temperature environment includes multiple sub-constant temperature environments with different temperatures; obtaining the second thermal imaging image model of the component to be measured after being placed in the constant temperature environment for a preset duration includes: for multiple sub-constant temperature environments with different temperatures, respectively obtaining the second thermal imaging image model of the component to be measured after being placed in the multiple sub-constant temperature environments with different temperatures for a preset duration, and each sub-constant temperature environment with a corresponding temperature corresponds to a second thermal imaging image model; calculating the first difference between the temperature of the constant temperature environment and the temperature of the second target area includes: for any one sub-constant temperature environment with a temperature, calculating the first difference between the temperature of the sub-constant temperature environment and the temperature of the second target area in the second thermal imaging image model corresponding to the sub-constant temperature environment.

[0009] According to some embodiments of the present application, optionally, based on the temperature compensation value of the first target area determined in advance, correcting the temperature of the first target area in the first thermal imaging image model includes: when the third difference between the temperature of the first target area and the temperature of the second target area in one of the second thermal imaging image models is less than or equal to the second preset threshold, taking the second thermal imaging image model in which the third difference between the temperature of the second target area and the temperature of the first target area is less than or equal to the second preset threshold as the second target thermal imaging image model; taking the first difference corresponding to the second target thermal imaging image model as the temperature compensation value of the first target area; correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area.

[0010] According to some embodiments of the present application, optionally, the second target area includes multiple different second sub-areas; calculating the first difference between the temperature of the constant temperature environment and the temperature of the second target area includes: calculating the first difference between the temperatures of the multiple second sub-areas in the second target area and the temperature of the constant temperature environment respectively; the temperature compensation value includes the first difference between the temperatures of the multiple second sub-areas and the temperature of the constant temperature environment.

[0011] According to some embodiments of the present application, optionally, the first target region includes a plurality of different first sub-regions, and the temperature compensation values of at least two first sub-regions are different; based on the temperature compensation value of the first target region determined in advance, correcting the temperature of the first target region in the first thermal imaging image model includes: for any one of the first sub-regions in the first target region, correcting the temperature of the first sub-region in the first thermal imaging image model based on the temperature compensation value of the first sub-region.

[0012] According to some embodiments of the present application, optionally, the plurality of first sub-regions correspond one-to-one to the plurality of second sub-regions, and the temperature compensation value of the first sub-region includes the first difference between the temperature of the second sub-region corresponding to the first sub-region and the temperature of the constant temperature environment.

[0013] According to some embodiments of the present application, optionally, the target component includes a plurality of sub-parts, and the first sub-region and the second sub-region corresponding to the first sub-region correspond to the same sub-part.

[0014] According to some embodiments of the present application, optionally, determining the temperature of the target component in the component to be measured according to the temperature of the first target region in the corrected first thermal imaging image model includes: determining the temperatures of a plurality of different sub-parts in the target component according to the temperatures of a plurality of different first sub-regions in the corrected first thermal imaging image model.

[0015] According to some embodiments of the present application, optionally, the component to be measured is placed in a constant temperature environment during the target time period, the second thermal imaging image model is obtained at the target moment, the target moment is within the target time period, or the target moment is after the end moment of the target time period, and the time interval between the target moment and the end moment is less than the first preset duration.

[0016] According to some embodiments of the present application, optionally, obtaining the first thermal imaging image model of the component to be measured includes: obtaining the first thermal imaging image of the component to be measured; establishing a first image coordinate system in the first thermal imaging image to obtain the first thermal imaging image model.

[0017] According to some embodiments of the present application, optionally, obtaining the first thermal imaging image of the component to be measured includes: obtaining the first thermal imaging image of the component to be measured based on a thermal imager.

[0018] According to some embodiments of the present application, optionally, before correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area determined preset, the method further includes: establishing a world coordinate system; obtaining the position information of the target component in the world coordinate system, and the first conversion relationship between the world coordinate system and the first image coordinate system in the first thermal imaging image model; determining the first target area in the first thermal imaging image model based on the position information of the target component in the world coordinate system and the first conversion relationship.

[0019] According to some embodiments of the present application, optionally, after determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model, the method further includes: outputting an alarm message when the temperature of the target component is greater than or equal to a preset temperature.

[0020] According to some embodiments of the present application, optionally, after determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model, the method further includes: performing a temperature reduction process on the target component when the temperature of the target component is greater than or equal to a preset temperature.

[0021] According to some embodiments of the present application, optionally, the target component includes a component that makes a rotational movement and / or a translational movement in the component to be measured.

[0022] In a second aspect, the present application provides a temperature detection device, the temperature detection device includes: a first acquisition module, configured to acquire a first thermal imaging image model of a component to be measured, the component to be measured includes a target component, and the first thermal imaging image model includes a first target area corresponding to the target component; a second acquisition module, configured to acquire a temperature compensation value of the first target area; a correction module, configured to correct the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area acquired by the second acquisition module; a first determination module, configured to determine the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model

[0023] In a third aspect, the present application provides a temperature detection system, which includes: an image acquisition component for acquiring a first thermal imaging image of a component to be measured and a second thermal imaging image of the component to be measured after being placed in a constant temperature environment for a preset duration; a controller for establishing a first thermal imaging image model of the component to be measured based on the first thermal imaging image, where the component to be measured includes a target component, and the first thermal imaging image model includes a first target area corresponding to the target component; determining a temperature compensation value of the first target area based on the second thermal imaging image acquired by the image acquisition component; correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area; and determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model.

[0024] In a fourth aspect, the present application provides an electronic device, which includes: a processor, a memory, and a computer program stored on the memory and executable on the processor. When the computer program is executed by the processor, the steps of the temperature detection method provided in the first aspect are implemented.

[0025] In a fifth aspect, the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the temperature detection method provided in the first aspect are implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The features, advantages, and technical effects of the exemplary embodiments of the present application will be described below with reference to the drawings.

[0027] Figure 1 It is a schematic flowchart of a temperature detection method provided by an embodiment of the present application;

[0028] Figure 2 It is another schematic flowchart of a temperature detection method provided by an embodiment of the present application;

[0029] Figure 3 It is a schematic operation diagram of S201 in the temperature detection method provided by an embodiment of the present application;

[0030] Figure 4 It is another schematic operation diagram of S201 in the temperature detection method provided by an embodiment of the present application;

[0031] Figure 5 It is a schematic flowchart of S103 in the temperature detection method provided by an embodiment of the present application;

[0032] Figure 6 It is a schematic flowchart of S101 in the temperature detection method provided by an embodiment of the present application;

[0033] Figure 7Another flowchart diagram of the temperature detection method provided by the embodiments of the present application;

[0034] Figure 8 A structural diagram of the temperature detection device provided by the embodiments of the present application;

[0035] Figure 9 A structural diagram of the temperature detection system provided by the embodiments of the present application;

[0036] Figure 10 Shows the hardware structure diagram of the electronic device provided by the embodiments of the present application.

[0037] In the drawings, the drawings are not necessarily drawn to actual scale. Detailed implementation manners

[0038] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are some but not all of the embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0039] It should be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprises", "comprising" or any other variation thereof is intended to cover a non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, elements defined by the statement "comprising..." do not preclude the presence of additional identical elements in the process, method, article or device comprising the said elements.

[0040] It should be understood that the term " / and" used herein is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally represents an "or" relationship between the associated objects before and after.

[0041] It is obvious to those skilled in the art that various modifications and changes can be made in the present application without departing from the spirit or scope of the present application. Therefore, the present application is intended to cover modifications and changes of the present application that fall within the scope of the corresponding claims (technical solutions for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present application can be combined with each other without contradiction.

[0042] Before describing the technical solutions provided by the embodiments of the present application, in order to facilitate the understanding of the embodiments of the present application, the present application first specifically describes the problems existing in the related art:

[0043] Motors, engines, gearboxes or hydraulic pumps are widely used as test components. For example, electric equipment can use motors as power sources to perform corresponding actions. It is very necessary to perform temperature detection on the components inside the test component, which can effectively ensure the safe operation of the test component. However, at present, the temperature of some components inside the test component is difficult to measure, and / or the accuracy of the measured temperature is low.

[0044] For example, the component to be tested may have some parts that rotate and / or move (referred to as moving parts). Since the moving parts are moving, it is difficult to measure the temperature of the moving parts by contacting the temperature sensor.

[0045] Therefore, the embodiment of the present application determines the temperature of the target component (such as a moving component) in the component to be tested by acquiring a first thermal imaging image model of the component to be tested; at the same time, for the first target area corresponding to the target component in the first thermal imaging image model, based on a preset temperature compensation value of the first target area, the temperature of the first target area in the first thermal imaging image model is corrected; and then the temperature of the target component in the component to be tested is determined based on the temperature of the first target area in the corrected first thermal imaging image model, so that the temperature of the first target area in the first thermal imaging image model is more accurate, thereby improving the accuracy of the determined temperature of the target component in the component to be tested.

[0046] The following first introduces the temperature detection method provided in the embodiment of the present application.

[0047] Figure 1 A flow chart of a temperature detection method provided in an embodiment of the present application. Figure 1 As shown, the temperature detection method provided in the embodiment of the present application may include the following steps S101 to S103.

[0048] S101, obtaining a first thermal imaging image model of a component to be tested.

[0049] Among them, the component to be measured may include a target component, and the first thermal imaging image model may include a first target area corresponding to the target component. The component to be measured can be any component or device, and the present application does not limit this. For example, in some examples, the component to be measured may be a power component (or power device), that is, a component used to provide power. For example, the power component includes but is not limited to a motor, an engine, a transmission, or a hydraulic pump, etc.

[0050] The target component can be any component in the component to be measured, and the present application does not limit this. For example, in some examples, the target component includes but is not limited to the components in the component to be measured that perform rotational motion and / or translational motion (abbreviated as moving components). In some specific examples, the target component may include rotating parts such as a rotor, a gear, a bearing, an impeller, or a piston, and other components that can also move.

[0051] The first thermal imaging image model can be generated by performing thermal imaging on the component to be measured. The first thermal imaging image model may include a first target area corresponding to the target component and the temperature of the first target area.

[0052] S102. Correct the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area determined in advance.

[0053] There may be a deviation in the temperature of the first target area in the first thermal imaging image model, and the temperature compensation value of the first target area can be determined in advance. In S102, the temperature of the first target area in the first thermal imaging image model can be corrected based on the temperature compensation value of the first target area determined in advance, so that the temperature of the first target area in the first thermal imaging image model is more accurate.

[0054] S103. Determine the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model.

[0055] After correcting the temperature of the first target area in the first thermal imaging image model, the temperature of the target component in the component to be measured can be determined according to the temperature of the first target area in the corrected first thermal imaging image model. For example, in some examples, the temperature of the first target area in the corrected first thermal imaging image model can be used as the temperature of the target component in the component to be measured.

[0056] The temperature detection method provided by the embodiments of the present application, on the one hand, by obtaining the first thermal imaging image model of the component to be measured, the temperature of the first target area corresponding to the target component in the first thermal imaging image model can be obtained, realizing the measurement of the temperature of the target component in the component to be measured; on the other hand, based on the preset temperature compensation value of the first target area, the temperature of the first target area in the first thermal imaging image model is corrected; then, according to the temperature of the first target area in the corrected first thermal imaging image model, the temperature of the target component in the component to be measured is determined, which can make the temperature of the first target area in the first thermal imaging image model more accurate, and further improve the accuracy of the determined temperature of the target component in the component to be measured.

[0057] Figure 2 It is another schematic flow chart of the temperature detection method provided by the embodiments of the present application. As Figure 2 shown, according to some embodiments of the present application, optionally, before S101, obtaining the first thermal imaging image model of the component to be measured, the temperature detection method provided by the embodiments of the present application may further include the following steps S201 and S202.

[0058] S201, obtaining a second thermal imaging image model of the component to be measured after being placed in a constant temperature environment for a preset duration, where the second thermal imaging image model includes a second target area corresponding to the target component.

[0059] The component to be measured can be first placed in a constant temperature environment for a preset duration. For example, in some examples, the component to be measured can be subjected to a thermal soak in a constant temperature environment for a preset duration. Among them, the temperature of the constant temperature environment and the size of the preset duration can be flexibly adjusted according to the actual situation, and the present application does not make any limitations in this regard. For example, in some examples, the temperature of the constant temperature environment can be 120 °C and the preset duration is 8 hours. The above 120 °C and 8 hours are only examples and do not constitute a limitation to the present application.

[0060] After the component to be measured is placed in a constant temperature environment for a preset duration, a second thermal imaging image model of the component to be measured after being placed in a constant temperature environment for a preset duration can be obtained. The second thermal imaging image model can include a second target area corresponding to the target component. It can be understood that the second target area in the second thermal imaging image model corresponds to the first target area in the first thermal imaging image model.

[0061] After the component to be measured is placed in a constant temperature environment for a preset duration, the temperature of the target component in the component to be measured should theoretically be the same as the temperature of the constant temperature environment. Similarly, the temperature of the second target area in the second thermal imaging image model should theoretically be the same as the temperature of the constant temperature environment. However, there may be a deviation between the temperature of the second target area in the second thermal imaging image model and the temperature of the constant temperature environment, and the deviation in the temperature measurement of the second target area in the second thermal imaging image model is the same as or similar to the deviation in the temperature measurement of the first target area in the first thermal imaging image model. Therefore, by calculating the difference (the first difference in the following text) between the temperature of the constant temperature environment and the temperature of the second target area, the deviation in the temperature measurement of the second target area in the second thermal imaging image model can be determined, and then the deviation in the temperature measurement of the first target area in the first thermal imaging image model can be determined.

[0062] S202. Calculate the first difference between the temperature of the constant temperature environment and the temperature of the second target area, and the temperature compensation value includes the first difference.

[0063] In S202, calculate the first difference between the temperature of the constant temperature environment and the temperature of the second target area. And since the second target area in the second thermal imaging image model corresponds to the first target area in the first thermal imaging image model, this first difference can be used as the temperature compensation value for the first target area.

[0064] Thus, by obtaining the second thermal imaging image model of the component to be measured after being placed in a constant temperature environment for a preset duration and calculating the first difference between the temperature of the constant temperature environment and the temperature of the second target area in the second thermal imaging image model, the temperature compensation value for the first target area can be accurately determined. Based on this temperature compensation value for the first target area, correcting the temperature of the first target area in the first thermal imaging image model can make the temperature of the first target area in the first thermal imaging image model more accurate, and further improve the accuracy of the temperature measurement of the target component in the component to be measured.

[0065] In order to make the determined temperature compensation value for the first target area more accurate, in some embodiments, optionally, the ambient temperature of the component to be measured when obtaining the first thermal imaging image model of the component to be measured can be the same as or similar to the temperature of the constant temperature environment.

[0066] According to some embodiments of the present application, optionally, the second target area may include a plurality of different second sub-areas. In the second thermal imaging image model, the temperatures of different second sub-areas may be the same or different. Correspondingly, the temperature deviations of different second sub-areas may be the same or different.

[0067] S202. Calculating the first difference between the temperature of the constant temperature environment and the temperature of the second target area may include the following steps:

[0068] Calculate the first difference between the temperatures of multiple second sub-regions in the second target region and the temperature of the constant-temperature environment respectively.

[0069] For example, the second target region includes N1 second sub-regions, where N1 is a positive integer. The first differences between the temperatures of the N1 second sub-regions and the temperature of the constant-temperature environment can be calculated respectively, so as to obtain the first difference between the temperature of the first second sub-region and the temperature of the constant-temperature environment, ……, the first difference between the temperature of the N1th second sub-region and the temperature of the constant-temperature environment.

[0070] Correspondingly, the temperature compensation value of the first target region can include the first differences between the temperatures of multiple second sub-regions and the temperature of the constant-temperature environment. For example, the temperature compensation value of the first target region can include the first difference between the temperature of the first second sub-region and the temperature of the constant-temperature environment, ……, the first difference between the temperature of the N1th second sub-region and the temperature of the constant-temperature environment.

[0071] According to some embodiments of the present application, optionally, the first target region may include multiple different first sub-regions, and the temperature compensation values of at least two first sub-regions may be different.

[0072] For example, in some examples, multiple first sub-regions may correspond one-to-one with multiple second sub-regions. The temperature compensation value of a first sub-region may include the first difference between the temperature of the second sub-region corresponding to the first sub-region and the temperature of the constant-temperature environment. For example, the first target region includes N1 first sub-regions, and the second target region includes N1 second sub-regions, where N1 is a positive integer. The first first sub-region may correspond to the first second sub-region, and so on, the N1th first sub-region may correspond to the N1th second sub-region.

[0073] Correspondingly, the temperature compensation value of the first first sub-region may include the first difference between the temperature of the first second sub-region and the temperature of the constant-temperature environment. And so on, the temperature compensation value of the N1th first sub-region may include the first difference between the temperature of the N1th second sub-region and the temperature of the constant-temperature environment.

[0074] According to some embodiments of the present application, optionally, S102, based on the temperature compensation value of the first target region determined in advance, correcting the temperature of the first target region in the first thermal imaging image model may include the following steps:

[0075] For any first sub-region in the first target region, correct the temperature of the first sub-region in the first thermal imaging image model based on the temperature compensation value of the first sub-region.

[0076] That is, the temperature of each first sub-region in the first thermal imaging image model can be corrected according to the corresponding temperature compensation value.

[0077] For example, for the first first sub-region, the temperature of the first first sub-region in the first thermal imaging image model can be corrected based on the temperature compensation value of the first first sub-region. By analogy, for the N1th first sub-region, the temperature of the N1th first sub-region in the first thermal imaging image model can be corrected based on the temperature compensation value of the N1th first sub-region.

[0078] In this way, the second target region is divided into multiple second sub-regions. By calculating the first differences between the temperatures of the multiple second sub-regions in the second target region and the temperature of the constant temperature environment, the temperature compensation values of the respective first sub-regions in the first target region can be accurately determined. The temperature of each first sub-region in the first thermal imaging image model can be corrected according to the corresponding temperature compensation value, so that the refined correction of the temperature of each first sub-region in the first thermal imaging image model can be realized, and further improve the accuracy of the temperature of each first sub-region in the first thermal imaging image model.

[0079] According to some embodiments of the present application, optionally, the target component may include multiple sub-parts. The multiple first sub-regions in the first target region may correspond one-to-one to the multiple sub-parts in the target component, and the multiple second sub-regions in the second target region may correspond one-to-one to the multiple sub-parts in the target component. For any first sub-region, the first sub-region and the second sub-region corresponding to the first sub-region may correspond to the same sub-part.

[0080] For example, the target component may include N1 sub-parts, the first target region may include N1 first sub-regions, and the second target region may include N1 second sub-regions, where N1 is a positive integer. The first first sub-region and the first second sub-region may correspond to the first sub-part. By analogy, the N1th first sub-region and the N1th second sub-region may correspond to the N1th sub-part. The temperatures of different sub-parts may be different or the same. Correspondingly, the temperature compensation values of the first sub-regions corresponding to different sub-parts may be different or the same.

[0081] In this way, the multiple first sub-regions in the first target region can correspond one-to-one to the multiple sub-parts in the target component, and the temperature of each first sub-region in the first thermal imaging image model can be corrected according to the corresponding temperature compensation value, so that the refined correction of the temperature of each first sub-region in the first thermal imaging image model can be realized, and further the refined correction of the temperature of each sub-part in the target component can be realized.

[0082] According to some embodiments of the present application, optionally, S103. Determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model may include the following steps:

[0083] Determine the temperatures of multiple different sub-parts in the target component according to the temperatures of multiple different first sub-areas in the corrected first thermal imaging image model.

[0084] For example, for any one of the first sub-areas, the temperature of the sub-part corresponding to the first sub-area can be determined according to the temperature of the first sub-area in the corrected first thermal imaging image model. For example, the 1st first sub-area and the 1st second sub-area can correspond to the 1st sub-part, and so on. The N1th first sub-area and the N1th second sub-area can correspond to the N1th sub-part. The temperature of the 1st sub-part can be determined according to the temperature of the 1st first sub-area in the corrected first thermal imaging image model. And so on, the temperature of the N1th sub-part can be determined according to the temperature of the N1th first sub-area in the corrected first thermal imaging image model.

[0085] In this way, refined correction of the temperatures of each sub-part in the target component can be achieved, and the accuracy of the temperatures of each sub-part in the determined target component can be improved.

[0086] Figure 3 It is an operation schematic diagram of S201 in the temperature detection method provided by the embodiments of the present application. As Figure 3 shown, according to some embodiments of the present application, optionally, the component to be measured is placed in a constant temperature environment during the target time period T. The size of the target time period T can be flexibly adjusted according to the actual situation, and the present application does not limit this. The second thermal imaging image model can be obtained at the target time t1, and the target time t1 can be within the target time period T.

[0087] Figure 4 It is another operation schematic diagram of S201 in the temperature detection method provided by the embodiments of the present application. As Figure 4 shown, according to some other embodiments of the present application, optionally, the target time t1 can be after the end time t2 of the target time period T, and the time interval between the target time t1 and the end time t2 is less than the first preset duration ΔT. The size of the first preset duration ΔT can be flexibly adjusted according to the actual situation, and the present application does not limit this.

[0088] After the component to be measured has been out of the constant temperature environment for a period of time, the temperature of the component to be measured may change, that is, the temperature of the component to be measured may be different from the temperature of the constant temperature environment. At this time, if the temperature compensation value of the first target area is determined based on the first difference between the temperature of the constant temperature environment and the temperature of the second target area, the error of the determined temperature compensation value of the first target area may be relatively large.

[0089] Therefore, when the component to be measured is still in the constant temperature environment, or within the first preset duration after the component to be measured leaves the constant temperature environment, the temperature of the component to be measured is still the same as or close to the temperature of the constant temperature environment. At this time, obtaining the second thermal imaging image model of the component to be measured, and then determining the temperature compensation value of the first target area based on the first difference between the temperature of the constant temperature environment and the temperature of the second target area, can make the error of the determined temperature compensation value of the first target area relatively small, and improve the accuracy of the temperature compensation value of the first target area.

[0090] As described above, according to some embodiments of the present application, optionally, before S101, obtaining the first thermal imaging image model of the component to be measured, the temperature detection method provided by the embodiments of the present application may further include the following steps S201 and S202.

[0091] S201. Obtain a second thermal imaging image model of the component to be measured after being placed in the constant temperature environment for a preset duration, where the second thermal imaging image model includes a second target area corresponding to the target component.

[0092] S202. Calculate a first difference between the temperature of the constant temperature environment and the temperature of the second target area, and the temperature compensation value includes the first difference.

[0093] Correspondingly, S103. Determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model may include the following steps 1 and 2.

[0094] Step 1. When the second difference between the temperature of the first target area and the temperature of the second target area is less than or equal to the first preset threshold, use the first difference as the temperature compensation value of the first target area. The size of the first preset threshold can be flexibly adjusted according to the actual situation, and the present application does not limit this.

[0095] Thus, before determining the temperature compensation value of the first target area, first determine whether the second difference between the temperature of the first target area and the temperature of the second target area is less than or equal to the first preset threshold; when the second difference between the temperature of the first target area and the temperature of the second target area is less than or equal to the first preset threshold, the first difference is used as the temperature compensation value of the first target area. This can effectively prevent the situation where when the temperature difference between the first target area and the second target area is too large, the first difference between the temperature of the constant temperature environment and the temperature of the second target area is used as the temperature compensation value of the first target area, resulting in a large temperature deviation in the corrected first target area.

[0096] Step 2. Based on the temperature compensation value of the first target area, correct the temperature of the first target area in the first thermal imaging image model.

[0097] After obtaining the temperature compensation value of the first target area, for example, the sum of the temperature of the first target area in the first thermal imaging image model and the temperature compensation value of the first target area can be calculated to obtain the corrected temperature of the first target area.

[0098] According to some embodiments of the present application, optionally, the constant temperature environment may include multiple sub-constant temperature environments with different temperatures. The temperature of each sub-constant temperature environment can be flexibly adjusted according to the actual situation, and the present application does not limit this. For example, in some examples, the constant temperature environment may include multiple sub-constant temperature environments with different temperatures such as 80°C, 100°C, 120°C, and 150°C.

[0099] Correspondingly, S201. Obtain the second thermal imaging image model of the component to be measured after being placed in the constant temperature environment for a preset duration, including:

[0100] For multiple sub-constant temperature environments with different temperatures, respectively obtain the second thermal imaging image model of the component to be measured after being placed in the multiple sub-constant temperature environments with different temperatures for a preset duration, and each sub-constant temperature environment with a corresponding temperature corresponds to a second thermal imaging image model.

[0101] For example, in some examples, the second thermal imaging image model of the component to be measured after being placed in the sub-constant temperature environment at 80°C for a preset duration can be obtained, the second thermal imaging image model of the component to be measured after being placed in the sub-constant temperature environment at 100°C for a preset duration can be obtained, the second thermal imaging image model of the component to be measured after being placed in the sub-constant temperature environment at 120°C for a preset duration can be obtained, and so on.

[0102] S202. Calculate the first difference between the temperature of the constant temperature environment and the temperature of the second target area, including:

[0103] For any sub-constant temperature environment at a certain temperature, calculate the first difference between the temperature of the sub-constant temperature environment and the temperature of the second target area in the second thermal imaging image model corresponding to the sub-constant temperature environment.

[0104] For example, for a sub-constant temperature environment at 80°C, the first difference can be calculated between the temperature of the sub-constant temperature environment (i.e., 80°C) and the temperature of the second target area in the second thermal imaging image model corresponding to the 80°C sub-constant temperature environment. For a sub-constant temperature environment at 100°C, the first difference can be calculated between the temperature of the sub-constant temperature environment (i.e., 100°C) and the temperature of the second target area in the second thermal imaging image model corresponding to the 100°C sub-constant temperature environment. And so on, without further elaboration.

[0105] Figure 5 It is a schematic flowchart of S103 in the temperature detection method provided by the embodiments of the present application. As Figure 5 shown, according to some embodiments of the present application, optionally, S103, based on the temperature compensation value of the first target area determined in advance, correct the temperature of the first target area in the first thermal imaging image model, which may include the following steps S501 to S503.

[0106] S501. When the third difference between the temperature of the first target area and the temperature of the second target area in one of the second thermal imaging image models is less than or equal to the second preset threshold, use the second thermal imaging image model in which the third difference between the temperature of the second target area and the temperature of the first target area is less than or equal to the second preset threshold as the second target thermal imaging image model.

[0107] The second preset threshold can be flexibly adjusted according to the actual situation, and the present application does not limit this.

[0108] It should be noted that when the third difference between the temperature of the first target area and the temperature of the second target areas in multiple second thermal imaging image models is less than or equal to the second preset threshold, the second thermal imaging image model with the smallest third difference between the temperature of the second target area and the temperature of the first target area can be used as the second target thermal imaging image model.

[0109] S502. Use the first difference corresponding to the second target thermal imaging image model as the temperature compensation value of the first target area.

[0110] After determining the second target thermal imaging image model, the first difference corresponding to the second target thermal imaging image model can be used as the temperature compensation value of the first target area.

[0111] S503. Based on the temperature compensation value of the first target area, correct the temperature of the first target area in the first thermal imaging image model.

[0112] Thus, when the component to be measured is at different temperatures, the temperature compensation values of the corresponding first target regions can be different. By selecting the second thermal imaging image model whose third difference between the temperature of the second target region and the temperature of the first target region is less than or equal to the second preset threshold as the second target thermal imaging image model, and taking the first difference corresponding to the second target thermal imaging image model as the temperature compensation value of the first target region, a temperature compensation value of the first target region that better conforms to the current temperature can be selected, making the temperature of the first target region after correction more accurate.

[0113] Figure 6 It is a schematic flowchart of one process of S101 in the temperature detection method provided by the embodiments of the present application. As Figure 6 shown, according to some embodiments of the present application, optionally, S101, obtaining the first thermal imaging image model of the component to be measured, may include the following steps S601 and S602.

[0114] S601, obtaining the first thermal imaging image of the component to be measured.

[0115] In some examples, for example, based on a thermal imager, the first thermal imaging image of the component to be measured can be obtained. Exemplarily, the thermal imager may include a three-dimensional thermal imager, and correspondingly, the first thermal imaging image may include a first three-dimensional thermal imaging image. Specifically, the first thermal imaging image of the component to be measured can be collected by the thermal imager.

[0116] S602, establishing a first image coordinate system in the first thermal imaging image to obtain the first thermal imaging image model.

[0117] In S602, a first image coordinate system can be established in the first thermal imaging image, thereby obtaining the first thermal imaging image model. Exemplarily, the first image coordinate system may include a Cartesian coordinate system with X, Y, and Z axes. The first thermal imaging image model can also be referred to as a temperature field, and the first thermal imaging image model may include the first thermal imaging image with the first image coordinate system.

[0118] Similarly, the second thermal imaging image model of the component to be measured can be obtained by obtaining the second thermal imaging image of the component to be measured and establishing a second image coordinate system in the second thermal imaging image, which will not be elaborated here. Exemplarily, the second thermal imaging image may include a second three-dimensional thermal imaging image.

[0119] Figure 7 It is another schematic flowchart of the temperature detection method provided by the embodiments of the present application. As Figure 7As shown, according to some embodiments of the present application, optionally, before S102, correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area determined in advance, the temperature detection method provided by the embodiments of the present application may further include the following steps S701 to S703.

[0120] S701. Establish a world coordinate system.

[0121] The world coordinate system can be understood as the coordinate system where the component to be measured is located in the real environment.

[0122] S702. Obtain the position information of the target component in the world coordinate system and the first conversion relationship between the world coordinate system and the first image coordinate system.

[0123] After the position of the component to be measured is fixed, the position information of the target component in the world coordinate system can be determined. Correspondingly, the first conversion relationship between the world coordinate system and the first image coordinate system can also be determined. The first conversion relationship can specifically be the conversion relationship between the coordinates in the world coordinate system and the coordinates in the first image coordinate system.

[0124] S703. Based on the position information of the target component in the world coordinate system and the first conversion relationship, determine the first target area in the first thermal imaging image model.

[0125] After obtaining the position information of the target component in the world coordinate system and the first conversion relationship between the world coordinate system and the first image coordinate system, the multiple coordinates of the target component in the world coordinate system can be converted into multiple coordinates in the first thermal imaging image model based on the first conversion relationship, so as to determine the first target area in the first thermal imaging image model.

[0126] It should be noted that the second target area in the second thermal imaging image model can also be obtained in a similar manner to S701 to S703, which will not be elaborated here.

[0127] According to some embodiments of the present application, optionally, after S103, determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model, the temperature detection method provided by the embodiments of the present application may further include the following steps:

[0128] When the temperature of the target component is greater than or equal to the preset temperature, an alarm message is output.

[0129] The magnitude of the preset temperature can be flexibly adjusted according to the actual situation, and the present application does not limit this.

[0130] Thus, when the temperature of the target component is greater than or equal to the preset temperature, an alarm message is output, which can timely remind the maintenance personnel and reduce the safety hazard caused by overheating of the target component.

[0131] According to some embodiments of the present application, optionally, after S103, determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model, the temperature detection method provided by the embodiments of the present application may further include the following steps:

[0132] When the temperature of the target component is greater than or equal to the preset temperature, perform a cooling process on the target component.

[0133] The way of the cooling process can be flexibly adjusted according to the actual situation, and the present application does not limit this. For example, when the target component is a rotor, the ways of the cooling process include but are not limited to reducing the rotational speed of the rotor, reducing the torque of the rotor, or implementing external cooling, etc.

[0134] Thus, when the temperature of the target component is greater than or equal to the preset temperature, timely performing a cooling process on the target component can achieve over-temperature protection for the target component and improve the service life of the target component.

[0135] Based on the temperature detection method provided in the above embodiments, correspondingly, the present application also provides a specific implementation manner of the temperature detection device. Please refer to the following embodiments.

[0136] Figure 8 It is a schematic structural diagram of a temperature detection device provided by an embodiment of the present application. As Figure 8 shown, the temperature detection device 80 provided by the embodiment of the present application may include the following modules:

[0137] The first acquisition module 801 is configured to acquire a first thermal imaging image model of the component to be measured, the component to be measured includes a target component, and the first thermal imaging image model includes a first target area corresponding to the target component;

[0138] The second acquisition module 802 is configured to acquire a temperature compensation value of the first target area;

[0139] The correction module 803 is configured to correct the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area acquired by the second acquisition module;

[0140] The first determination module 804 is configured to determine the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model.

[0141] The temperature detection device provided by the embodiment of the present application, on the one hand, can obtain the temperature of the first target area corresponding to the target component in the first thermal imaging image model by acquiring the first thermal imaging image model of the component to be measured, so as to measure the temperature of the target component in the component to be measured; on the other hand, based on the temperature compensation value of the first target area determined in advance, correct the temperature of the first target area in the first thermal imaging image model; and then determine the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model, which can make the temperature of the first target area in the first thermal imaging image model more accurate, and further improve the accuracy of the determined temperature of the target component in the component to be measured.

[0142] According to some embodiments of the present application, optionally, the temperature detection device 80 provided by the embodiment of the present application may further include a second determination module, configured to obtain a second thermal imaging image model of the component to be measured after being placed in a constant temperature environment for a preset duration, where the second thermal imaging image model includes a second target area corresponding to the target component; calculate a first difference between the temperature of the constant temperature environment and the temperature of the second target area, and the temperature compensation value includes the first difference.

[0143] According to some embodiments of the present application, optionally, the correction module 803 is specifically configured to, when a second difference between the temperature of the first target area and the temperature of the second target area is less than or equal to a first preset threshold, use the first difference as the temperature compensation value of the first target area; and correct the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area.

[0144] According to some embodiments of the present application, optionally, the constant temperature environment includes multiple sub-constant temperature environments with different temperatures. The second determination module is specifically configured to, for multiple sub-constant temperature environments with different temperatures, respectively obtain a second thermal imaging image model of the component to be measured after being placed in the multiple sub-constant temperature environments with different temperatures for a preset duration, and each sub-constant temperature environment with a temperature corresponds to a second thermal imaging image model; for any one of the sub-constant temperature environments with a temperature, calculate a first difference between the temperature of the sub-constant temperature environment and the temperature of the second target area in the second thermal imaging image model corresponding to the sub-constant temperature environment.

[0145] According to some embodiments of the present application, optionally, the correction module 803 is specifically configured to, when a third difference between the temperature of the first target area and the temperature of the second target area in one of the second thermal imaging image models is less than or equal to a second preset threshold, use the second thermal imaging image model in which the third difference between the temperature of the second target area and the temperature of the first target area is less than or equal to the second preset threshold as the second target thermal imaging image model; use the first difference corresponding to the second target thermal imaging image model as the temperature compensation value of the first target area; and correct the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area.

[0146] According to some embodiments of the present application, optionally, the second target area includes a plurality of different second sub-areas. The second determination module is specifically configured to calculate first differences between the temperatures of the plurality of second sub-areas in the second target area and the temperature of the constant temperature environment respectively; the temperature compensation value includes the first differences between the temperatures of the plurality of second sub-areas and the temperature of the constant temperature environment.

[0147] According to some embodiments of the present application, optionally, the first target area includes a plurality of different first sub-areas, and the temperature compensation values of at least two first sub-areas are different. The correction module 803 is specifically configured to, for any one of the first sub-areas in the first target area, correct the temperature of the first sub-area in the first thermal imaging image model based on the temperature compensation value of the first sub-area.

[0148] According to some embodiments of the present application, optionally, the plurality of first sub-areas correspond to the plurality of second sub-areas one by one, and the temperature compensation value of the first sub-area includes the first difference between the temperature of the second sub-area corresponding to the first sub-area and the temperature of the constant temperature environment.

[0149] According to some embodiments of the present application, optionally, the target component includes a plurality of sub-parts, and the first sub-area and the second sub-area corresponding to the first sub-area correspond to the same sub-part.

[0150] According to some embodiments of the present application, optionally, the first determination module 804 is specifically configured to determine the temperatures of the plurality of different sub-parts in the target component respectively according to the temperatures of the plurality of different first sub-areas in the corrected first thermal imaging image model.

[0151] According to some embodiments of the present application, optionally, the component to be measured is placed in a constant temperature environment during the target time period, the second thermal imaging image model is acquired at the target moment, the target moment is within the target time period, or the target moment is after the end moment of the target time period and the time interval between the target moment and the end moment is less than the first preset duration.

[0152] According to some embodiments of the present application, optionally, the first acquisition module 801 is specifically configured to acquire a first thermal imaging image of the component to be measured; establish a first image coordinate system in the first thermal imaging image to obtain a first thermal imaging image model.

[0153] According to some embodiments of the present application, optionally, the first acquisition module 801 is specifically configured to acquire a first thermal imaging image of the component to be measured based on a thermal imager.

[0154] According to some embodiments of the present application, optionally, the temperature detection device 80 provided in the embodiments of the present application may further include a third determination module, configured to establish a world coordinate system; acquire position information of the target component in the world coordinate system, and a first conversion relationship between the world coordinate system and the first image coordinate system in the first thermal imaging image model; determine a first target area in the first thermal imaging image model based on the position information of the target component in the world coordinate system and the first conversion relationship.

[0155] According to some embodiments of the present application, optionally, the temperature detection device 80 provided in the embodiments of the present application may further include an alarm module, configured to output an alarm message when the temperature of the target component is greater than or equal to a preset temperature.

[0156] According to some embodiments of the present application, optionally, the temperature detection device 80 provided in the embodiments of the present application may further include a cooling module, configured to perform a cooling process on the target component when the temperature of the target component is greater than or equal to a preset temperature.

[0157] According to some embodiments of the present application, optionally, the target component includes a component that rotates and / or moves in the component to be measured.

[0158] Figure 8 Each module / unit in the shown device has the functions of implementing the steps in the temperature detection method provided in the above method embodiments, and can achieve their corresponding technical effects. For the sake of brevity, the description is not repeated here.

[0159] Based on the temperature detection method provided in the above embodiments, correspondingly, the present application also provides a specific implementation manner of a temperature detection system. Please refer to the following embodiments.

[0160] Figure 9 This is a schematic structural diagram of a temperature detection system provided in an embodiment of the present application. As Figure 9 shown, the temperature detection system 90 provided in the embodiments of the present application may include an image acquisition component 901 and a controller 902.

[0161] The image acquisition component 901 may be configured to acquire a first thermal imaging image of the component to be measured and a second thermal imaging image of the component to be measured after being placed in a constant temperature environment for a preset duration.

[0162] The controller 902 is configured to establish a first thermal imaging image model of the component to be measured based on the first thermal imaging image. The component to be measured includes a target component, and the first thermal imaging image model includes a first target area corresponding to the target component. Based on the second thermal imaging image obtained by the image acquisition component, determine the temperature compensation value of the first target area. Based on the temperature compensation value of the first target area, correct the temperature of the first target area in the first thermal imaging image model. Determine the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model.

[0163] For the temperature detection system provided by the embodiments of the present application, on the one hand, by obtaining the first thermal imaging image model of the component to be measured, the temperature of the first target area corresponding to the target component in the first thermal imaging image model can be obtained, realizing the measurement of the temperature of the target component in the component to be measured. On the other hand, based on the preset temperature compensation value of the first target area, correct the temperature of the first target area in the first thermal imaging image model. Then, determine the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model, which can make the temperature of the first target area in the first thermal imaging image model more accurate, and further improve the accuracy of the determined temperature of the target component in the component to be measured.

[0164] According to some embodiments of the present application, optionally, the image acquisition component 901 may include a thermal imager.

[0165] According to some embodiments of the present application, optionally, the controller 902 may execute the steps of the temperature detection method provided in the above embodiments.

[0166] Based on the temperature detection method provided in the above embodiments, correspondingly, the present application also provides a specific implementation manner of an electronic device. Please refer to the following embodiments.

[0167] Figure 10 The schematic diagram of the hardware structure of the electronic device provided by the embodiments of the present application is shown.

[0168] The electronic device may include a processor 1001 and a memory 1002 storing computer program instructions.

[0169] Specifically, the above-mentioned processor 1001 may include a Central Processing Unit (CPU), or an Application Specific Integrated Circuit (ASIC), or one or more integrated circuits configured to implement the embodiments of the present application.

[0170] The memory 1002 may include a mass storage for data or instructions. By way of example and not limitation, the memory 1002 may include a hard disk drive (HDD), a floppy disk drive, a flash memory, an optical disk, a magneto-optical disk, a magnetic tape, or a universal serial bus (USB) drive, or a combination of two or more of these. In one example, the memory 1002 may include removable or non-removable (or fixed) media, or the memory 1002 is a non-volatile solid-state memory. The memory 1002 may be internal or external to the electronic device.

[0171] In one example, the memory 1002 may be a read only memory (ROM). In one example, the ROM may be a mask-programmed ROM, a programmable ROM (PROM), an erasable PROM (EPROM), an electrically erasable PROM (EEPROM), an electrically alterable ROM (EAROM), or a flash memory, or a combination of two or more of these.

[0172] The memory 1002 may include a read only memory (ROM), a random access memory (RAM), a magnetic disk storage media device, an optical storage media device, a flash memory device, an electrical, optical, or other physical / tangible memory storage device. Thus, generally, the memory includes one or more tangible (non-transitory) computer-readable storage media (e.g., memory devices) encoded with software including computer-executable instructions, and when the software is executed (e.g., by one or more processors), it is operable to perform the operations described with reference to the method according to an aspect of the present application.

[0173] The processor 1001 reads and executes the computer program instructions stored in the memory 1002 to implement the method / steps in the above method embodiments and achieve the corresponding technical effects achieved by the method embodiments when they execute their method / steps. For the sake of brevity, the description is not repeated here.

[0174] In one example, the electronic device may further include a communication interface 1003 and a bus 1010. Among them, as Figure 10 shown, the processor 1001, the memory 1002, and the communication interface 1003 are connected through the bus 1010 and complete communication with each other.

[0175] The communication interface 1003 is mainly used to implement communication between the various modules, devices, units, and / or devices in the embodiments of the present application.

[0176] Bus 1010 includes hardware, software, or both, and couples components of an electronic device to each other. By way of example and not limitation, the bus may include an Accelerated Graphics Port (AGP) or other graphics bus, an Extended Industry Standard Architecture (EISA) bus, a Front Side Bus (FSB), a Hyper Transport (HT) interconnect, an Industry Standard Architecture (ISA) bus, an InfiniBand interconnect, a Low Pin Count (LPC) bus, a memory bus, a Micro Channel Architecture (MCA) bus, a Peripheral Component Interconnect (PCI) bus, a PCI-Express (PCI-X) bus, a Serial Advanced Technology Attachment (SATA) bus, a Video Electronics Standards Association Local (VLB) bus, or other suitable bus or a combination of two or more of these. Where appropriate, bus 1010 may include one or more buses. Although embodiments of the present application describe and illustrate specific buses, the present application contemplates any suitable bus or interconnect.

[0177] In addition, in combination with the temperature detection method in the above embodiments, embodiments of the present application may provide a computer-readable storage medium to implement. Computer program instructions are stored on the computer-readable storage medium; when the computer program instructions are executed by a processor, any one of the temperature detections in the above embodiments is implemented. Examples of computer-readable storage media include non-transitory computer-readable storage media, such as electronic circuits, semiconductor memory devices, ROMs, random access memories, flash memories, erasable ROMs (EROMs), floppy disks, CD-ROMs, optical discs, and hard disks.

[0178] It should be clear that the present application is not limited to the specific configurations and processes described above and illustrated in the figures. For the sake of brevity, detailed descriptions of known methods are omitted here. In the above embodiments, several specific steps are described and illustrated as examples. However, the method process of the present application is not limited to the specific steps described and illustrated, and those skilled in the art can make various changes, modifications, and additions, or change the order between steps after understanding the spirit of the present application.

[0179] The functional blocks shown in the above-described structural block diagrams can be implemented as hardware, software, firmware, or a combination thereof. When implemented in hardware, it can be, for example, an electronic circuit, an application specific integrated circuit (ASIC), appropriate firmware, a plug-in, a functional card, and so on. When implemented in software, the elements of the present application are programs or code segments for performing the required tasks. The program or code segment can be stored in a machine-readable medium or transmitted over a transmission medium or communication link via a data signal carried in a carrier wave. A "machine-readable medium" can include any medium capable of storing or transmitting information. Examples of machine-readable media include electronic circuits, semiconductor memory devices, ROM, flash memory, erasable ROM (EROM), floppy disks, CD-ROMs, optical discs, hard disks, fiber optic media, radio frequency (RF) links, and so on. The code segment can be downloaded via a computer network such as the Internet, an intranet, and so on.

[0180] It should also be noted that the exemplary embodiments mentioned in the present application describe some methods or systems based on a series of steps or devices. However, the present application is not limited to the order of the above steps, that is, the steps can be executed in the order mentioned in the embodiments, can be different from the order in the embodiments, or several steps can be executed simultaneously.

[0181] Aspects of the present application have been described above with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems), and computer program products according to embodiments of the present application. It should be understood that each block in the flowcharts and / or block diagrams, and the combinations of blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device to produce a machine, such that the instructions executed by the processor of the computer or other programmable data processing device enable the implementation of the functions / actions specified in one or more blocks of the flowcharts and / or block diagrams. Such a processor can be, but is not limited to, a general-purpose processor, a special-purpose processor, a special application processor, or a field programmable logic circuit. It can also be understood that each block in the block diagrams and / or flowcharts, and the combinations of blocks in the block diagrams and / or flowcharts, can also be implemented by dedicated hardware for performing the specified functions or actions, or can be implemented by a combination of dedicated hardware and computer instructions.

[0182] As described above, this is only the specific implementation manner of the present application. Those skilled in the art can clearly understand that for the convenience and brevity of description, the specific working processes of the systems, modules, and units described above can refer to the corresponding processes in the foregoing method embodiments, and will not be elaborated herein. It should be understood that the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application can easily think of various equivalent modifications or substitutions, and these modifications or substitutions should all be covered within the protection scope of the present application.

Claims

1. A temperature detection method, characterized in that, it includes: obtaining a first thermal imaging image model of a component to be measured, the component to be measured includes a target component, and the first thermal imaging image model includes a first target area corresponding to the target component; correcting the temperature of the first target area in the first thermal imaging image model based on a temperature compensation value of the first target area determined in advance; determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model.

2. The method according to claim 1, characterized in that, before obtaining the first thermal imaging image model of the component to be measured, the method further includes: obtaining a second thermal imaging image model of the component to be measured after being placed in a constant temperature environment for a preset duration, the second thermal imaging image model includes a second target area corresponding to the target component; calculating a first difference between the temperature of the constant temperature environment and the temperature of the second target area, and the temperature compensation value includes the first difference.

3. The method according to claim 2, characterized in that, the correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area determined in advance includes: when a second difference between the temperature of the first target area and the temperature of the second target area is less than or equal to a first preset threshold, taking the first difference as the temperature compensation value of the first target area; correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area.

4. The method according to claim 2 or 3, characterized in that, the constant temperature environment includes multiple sub-constant temperature environments with different temperatures; the obtaining a second thermal imaging image model of the component to be measured after being placed in a constant temperature environment for a preset duration includes: for the multiple sub-constant temperature environments with different temperatures, respectively obtaining a second thermal imaging image model of the component to be measured after being placed in the multiple sub-constant temperature environments with different temperatures for a preset duration, and each sub-constant temperature environment with a corresponding temperature corresponds to one second thermal imaging image model; the calculating a first difference between the temperature of the constant temperature environment and the temperature of the second target area includes: for any one sub-constant temperature environment with a corresponding temperature, calculating a first difference between the temperature of the sub-constant temperature environment and the temperature of the second target area in the second thermal imaging image model corresponding to the sub-constant temperature environment.

5. The method according to claim 4, characterized in that, the correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area determined in advance includes: In the case where a third difference between the temperature of the first target region and the temperature of the second target region in one of the second thermal imaging image models is less than or equal to a second preset threshold, use the second thermal imaging image model in which the third difference between the temperature of the second target region and the temperature of the first target region is less than or equal to the second preset threshold as the second target thermal imaging image model; Use the first difference corresponding to the second target thermal imaging image model as the temperature compensation value of the first target region; Based on the temperature compensation value of the first target region, correct the temperature of the first target region in the first thermal imaging image model.

6. The method according to any one of claims 2 to 5, wherein, the second target region includes a plurality of different second sub-regions; the calculating the first difference between the temperature of the constant temperature environment and the temperature of the second target region includes: calculating the first difference between the temperatures of the plurality of second sub-regions in the second target region and the temperature of the constant temperature environment respectively; the temperature compensation value includes the first difference between the temperatures of the plurality of second sub-regions and the temperature of the constant temperature environment.

7. The method according to claim 6, wherein, the first target region includes a plurality of different first sub-regions, and the temperature compensation values of at least two of the first sub-regions are different; the correcting the temperature of the first target region in the first thermal imaging image model based on the temperature compensation value of the first target region determined in advance includes: for any one of the first sub-regions in the first target region, correct the temperature of the first sub-region in the first thermal imaging image model based on the temperature compensation value of the first sub-region.

8. The method according to claim 7, wherein, the plurality of first sub-regions correspond to the plurality of second sub-regions one by one, and the temperature compensation value of the first sub-region includes the first difference between the temperature of the second sub-region corresponding to the first sub-region and the temperature of the constant temperature environment.

9. The method according to claim 7 or 8, wherein, the target component includes a plurality of sub-parts, and the first sub-region and the second sub-region corresponding to the first sub-region correspond to the same sub-part.

10. The method according to any one of claims 6 to 9, wherein, the determining the temperature of the target component in the component to be measured according to the temperature of the first target region in the corrected first thermal imaging image model includes: determining the temperatures of the plurality of different sub-parts in the target component respectively according to the temperatures of the plurality of different first sub-regions in the corrected first thermal imaging image model.

11. The method according to any one of claims 2 to 10, wherein, The component to be measured is placed in the constant temperature environment during the target time period, and the second thermal imaging image model is obtained at the target time, where the target time is within the target time period, or the target time is after the end time of the target time period and the time interval between the target time and the end time is less than the first preset duration.

12. The method according to any one of claims 1 to 11, wherein, the obtaining of the first thermal imaging image model of the component to be measured includes: obtaining a first thermal imaging image of the component to be measured; establishing a first image coordinate system in the first thermal imaging image to obtain the first thermal imaging image model.

13. The method according to claim 12, wherein, the obtaining of the first thermal imaging image of the component to be measured includes: obtaining a first thermal imaging image of the component to be measured based on a thermal imager.

14. The method according to any one of claims 1 to 13, wherein, before correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area determined preset, the method further includes: establishing a world coordinate system; obtaining the position information of the target component in the world coordinate system and the first conversion relationship between the world coordinate system and the first image coordinate system in the first thermal imaging image model; determining the first target area in the first thermal imaging image model based on the position information of the target component in the world coordinate system and the first conversion relationship.

15. The method according to any one of claims 1 to 14, wherein, after determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model, the method further includes: outputting an alarm message when the temperature of the target component is greater than or equal to a preset temperature.

16. The method according to any one of claims 1 to 15, wherein, after determining the temperature of the target component in the component to be measured according to the temperature of the first target area in the corrected first thermal imaging image model, the method further includes: performing a temperature reduction process on the target component when the temperature of the target component is greater than or equal to a preset temperature.

17. The method according to any one of claims 1 to 16, wherein, the target component includes the component that rotates and / or moves in the component to be measured.

18. A temperature detection device, wherein, it includes: a first acquisition module for acquiring a first thermal imaging image model of a component to be measured, the component to be measured includes a target component, and the first thermal imaging image model includes a first target area corresponding to the target component; a second acquisition module for acquiring the temperature compensation value of the first target area; a correction module for correcting the temperature of the first target area in the first thermal imaging image model based on the temperature compensation value of the first target area acquired by the second acquisition module; A first determination module, configured to determine the temperature of the target component in the component under test according to the temperature of the first target region in the corrected first thermal imaging image model of the component under test.

19. A temperature detection system, characterized in that it includes: An image acquisition component, configured to acquire a first thermal imaging image of the component under test and a second thermal imaging image of the component under test after being placed in a constant temperature environment for a preset duration; A controller, configured to establish a first thermal imaging image model of the component under test based on the first thermal imaging image, the component under test includes a target component, and the first thermal imaging image model includes a first target region corresponding to the target component; Determine the temperature compensation value of the first target region based on the second thermal imaging image acquired by the image acquisition component; Based on the temperature compensation value of the first target region, correct the temperature of the first target region in the first thermal imaging image model; Determine the temperature of the target component in the component under test according to the temperature of the first target region in the corrected first thermal imaging image model.

20. An electronic device, characterized in that the electronic device includes: a processor, a memory, and a computer program stored on the memory and executable on the processor, and when the computer program is executed by the processor, it implements the steps of the temperature detection method according to any one of claims 1 to 17.

21. A computer-readable storage medium, characterized in that a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, it implements the steps of the temperature detection method according to any one of claims 1 to 17.

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