3D simulation cold and hot impact system and control method thereof

Abstract

The invention relates to the technical field of reliability testing of electronic components, in particular to a 3D simulation cold and hot impact system and a control method thereof. An airflow control module; a 3D space modeling module; a data acquisition and analysis module; the system can simulate a real working environment in a short time through a plurality of heaters and refrigeration units, establish a dynamic environment in a 3D space, realize natural convection, forced convection or multi-heat-source heat dissipation conditions, perform thermal and cold cycle impact on electronic components, and reinforce the performance stability of precise electronic components on a screen. The reliability of the electronic component in an extreme multi-temperature-difference environment is verified, the stability of the electronic component is ensured, and reliable data for predicting the long-term stability and durability of the electronic component can be accurately provided for the stability of the packaging material of the electronic component under different temperature and humidity conditions, such as thermal expansion, humidity permeation and the like.

Description

Technical Field

[0001] The present invention belongs to the technical field of reliability testing of electronic components, and particularly relates to a 3D simulation thermal shock system and a control method thereof. Background Art

[0002] Thermal shock testing is an important means to verify the performance stability of electronic components in extreme temperature environments. Currently, the thermal shock testing system mainly consists of a heating unit, a cooling unit, and a control unit. The heating element transfers heat to the test electronic components through a heat exchanger to quickly raise the temperature of the electronic components to a set high temperature value; the cooling unit usually adopts the reverse Carnot cycle principle, and through the coordinated operation of a compressor, a condenser, a throttle valve, and an evaporator, the refrigerant circulates in the system, thereby achieving a rapid temperature drop to a set low temperature value. The control unit is responsible for accurately controlling the operation of the heating unit and the cooling unit to ensure that the temperature in the test equipment rises and falls rapidly and accurately according to the set program.

[0003] However, since a single heating unit and a refrigeration unit are usually adopted in the current thermal shock system, its single temperature control point and temperature response speed are not convenient for realizing a dynamic temperature distribution in a 3D space, and it is difficult to simulate these complex airflow conditions due to the lack of precise airflow control in the single heating unit and refrigeration unit, thus limiting the ability of the thermal shock system to simulate the real working environment, and reducing the simulation ability of the thermal shock system. Therefore, we need to propose a 3D simulation thermal shock system and a control method thereof to solve the above existing problems, so that it can realize a dynamic temperature distribution and precise airflow control in a 3D space to verify the reliability of electronic components in an extreme multi-temperature difference environment and improve the simulation ability of the thermal shock system. Summary of the Invention

[0004] In view of the above problems, the present invention provides a 3D simulation thermal shock system, which realizes a dynamic temperature distribution and precise airflow control in a 3D space to verify the reliability of electronic components in an extreme multi-temperature difference environment and improve the simulation ability of the thermal shock system; including: a temperature control module, the temperature control module is used to quickly adjust the temperature in a 3D space, and the temperature control module includes a plurality of heaters and refrigeration units, and the plurality of heaters and refrigeration units are all connected to the main control module;

[0005] An airflow control module, the airflow control module is used to realize natural convection, forced convection or multi-heat source heat dissipation conditions;

[0006] A 3D space modeling module, the 3D space modeling module is used to establish a dynamic environment model and monitor the temperature distribution in real time;

[0007] A data acquisition and analysis module, which is used to collect and analyze the performance data of electronic components in real time;

[0008] A main control module, which is used to adjust the working states of the temperature control module and the air flow control module according to the real-time data, and set test parameters and view test results through a touch screen;

[0009] The main control module is electrically connected to the temperature control module, the air flow control module, the 3D space modeling module and the data acquisition and analysis module respectively.

[0010] Furthermore, the process of temperature adjustment by the temperature control module is as follows:

[0011] A1. The main control module determines the target temperature to be adjusted in the 3D space according to the test parameters input by the user on the touch screen, and sends the target temperature instruction to the temperature control module;

[0012] A2. Calculate the adjustment power required for heating or cooling according to the target temperature and the parameters of the 3D space. The calculation formula is as follows:

[0013] Where P is the adjustment power value required for heating or cooling, Q is the heat required to adjust the 3D space from the initial temperature to the target temperature, η is the efficiency of the heater or refrigeration unit, and t is the time requirement of the heater or refrigeration unit;

[0014] A3. During the temperature adjustment process, it is necessary to monitor the actual temperature in the 3D space in real time, compare the actual temperature with the target temperature, and calculate the temperature deviation;

[0015] A4. According to the temperature deviation, use the PID control algorithm to adjust the heating or cooling power. The PID control algorithm formula is:

[0016] Where ΔT d is the deviation between the actual temperature and the target temperature, is the integral of the temperature deviation ΔT d from 0 to t, K p is the proportional coefficient used to determine the rapid response degree adjustment of the controller to the deviation, K i is the integral coefficient used to eliminate the steady-state error of the system, K d is the differential coefficient used to predict the deviation trend, is the derivative of the temperature deviation ΔT d with respect to time t, and u(t) is the change amount of the heating or cooling power that needs to be adjusted;

[0017] A5. Repeat steps A3 - A4, continuously monitor the actual temperature, calculate the deviation and adjust the power until the temperature deviation is within the allowable error range. Then, it is determined that the temperature in the 3D space reaches the target temperature and remains stable.

[0018] Further, the air flow control module includes a fan, an air duct, and an air flow sensor. The fan is installed at one end of the air duct, the air flow sensor is installed inside the air duct, and the fan is connected to the main control module.

[0019] Further, the process of the air flow control module simulating different air flow environments is as follows:

[0020] B1. According to the air flow control mode of natural convection, forced convection, or multi - heat - source heat dissipation and the environmental information provided by the 3D space modeling module, determine the initial rotational speed that the fan needs to reach. Then, send a start command and the corresponding rotational speed control signal to the fan, and the fan starts to operate to generate air flow.

[0021] B2. After the air flow enters the air duct from the fan, different air flow distributions are carried out according to the shape, size, and branch structure of the air duct.

[0022] B3. According to the temperature distribution information fed back by the 3D space modeling module, adjust the positions of the damper or deflector components in the air duct to optimize the air flow distribution.

[0023] B4. The air flow sensor continuously monitors the parameters of the air flow speed and direction, and feeds the monitored data back to the main control module. The main control module compares the received feedback data with the preset target air flow parameters to determine whether the air flow meets the requirements.

[0024] B5. When the air flow meets the requirements, return to B4; when the air flow does not meet the requirements, enter B6.

[0025] B6. According to the difference between the data fed back by the air flow sensor and the target air flow speed parameter, calculate the adjustment amount that needs to be made to the fan rotational speed or the air duct components. Then, control the rotational speeds of the motors on the fan and the deflector according to the adjustment amount to achieve precise adjustment of the air flow. The calculation formula for the adjustment amount is:

[0026] ΔN = K a (v 目 - v 实 ), where v 目 is the target air flow speed, v 实 is the actual air flow speed, K a is the proportionality coefficient used to adjust the response degree to the air flow speed difference, ΔN is the air flow speed adjustment amount, and the rotational speed of the motor is calculated according to the air flow speed adjustment amount.

[0027] Further, the process of the 3D space modeling module establishing a dynamic environment model is as follows:

[0028] C1. Determine the boundary coordinates of the 3D space according to the actual size of the test space;

[0029] C2. Divide the 3D space into multiple small units using the grid division method, analyze the boundary conditions of the 3D space, and determine the temperature and heat flux conditions on the boundary;

[0030] C3. Uniformly arrange temperature sensors in the 3D space according to the characteristics of the 3D space and the expected change of the temperature distribution;

[0031] C4. Set an initial temperature value for each grid cell according to the initial state of the 3D space;

[0032] C5. The temperature sensors collect the temperature data at the location in real time according to the set frequency and transmit it to the data acquisition and analysis module;

[0033] C6. Calculate the heat flux at the boundary of each grid cell according to the initial temperature value and the monitored actual temperature value of each grid cell. The calculation formula is:

[0034] q m =-k m ΔT m , where q m is the heat flux density, k m is the thermal conductivity of the corresponding grid cell, and ΔT m is the difference between the initial temperature value and the actual temperature value of the grid cell;

[0035] C7. Establish an equation for temperature change according to the principle of energy conservation. The equation for temperature change is:

[0036]

[0037] where ρ is the material density, c 1 is the specific heat capacity of the material, T 1 is the temperature of the grid cell, t 1 is the temperature change time, q v is the heat source intensity in the grid cell, k 1 is the thermal conductivity of the grid cell, T 1+1 and T 1-1 are the temperatures of two adjacent grid cells respectively, Δx is the distance between two adjacent grid cells in the x direction, Δy is the distance between two adjacent grid cells in the y direction, and Δz is the distance between two adjacent grid cells in the z direction;

[0038] C8. Real-time collect the temperature data of the grid cells and update the temperature distribution model according to the actual temperature of the grid cells to form a dynamic environment model.

[0039] Further, the data acquisition and analysis module includes a sensor group and a processor. The sensor group includes a humidity sensor, a voltage sensor, a current sensor, and a temperature sensor. The humidity sensor, the voltage sensor, the current sensor, and the temperature sensor are all electrically connected to the processor.

[0040] Further, the data processing process of the processor for the sensor group is as follows:

[0041] D1. Filter the data collected by the sensor group to remove noise and interference signals in the data. The filtering processing formula is:

[0042]

[0043] where n is the window length centered on i, x j is the jth discrete data in the discrete data group, and y i is the filtered data;

[0044] D2. Extract the key features that can reflect the performance of the electronic components from the filtered data. The key feature extraction method is to satisfy y i >y i-1 and y i >y i+1 , where y i is the ith data after filtering, and y i-1 and y i+1 are the two data adjacent to the ith data after filtering respectively;

[0045] D3. Calculate the mean value of the data after feature extraction to reflect the central tendency of the data;

[0046] D4. Perform least squares fitting according to the calculated mean value to analyze the change trend of the performance data. The least squares fitting formula is:

[0047] y o =e+hx o ,

[0048] where, x oi and y oi are the coordinates of the data point (x oi ,y oi ), and i = 1, 2,..., n.

[0049] Further, the main control module controls the working state of the module according to the real-time data as follows:

[0050] E1. The main control module continuously receives the real-time information of the electronic component performance data fed back by the data acquisition and analysis module and the temperature distribution data fed back by the 3D spatial modeling module;

[0051] E2. Analyze the real-time data through the single-chip microcomputer to calculate the temperature deviation and air flow deviation that need to be adjusted;

[0052] E3. Determine the temperature control amount and air flow control amount that need to be adjusted according to the calculated temperature deviation and air flow deviation;

[0053] E4. Send corresponding control instructions to the temperature control module and the air flow control module respectively according to the temperature control amount and the air flow control amount.

[0054] Based on the 3D simulation thermal shock system described above, the present invention also provides a control method for the 3D simulation thermal shock system, including the following steps:

[0055] S1. Set the test parameters of the thermal shock system through the touch screen. The test parameters include the target temperature range, temperature change rate, desired air flow state, test time, and data acquisition frequency;

[0056] S2. Rapidly adjust the temperature in the 3D space through the temperature control module;

[0057] S3. Implement heat dissipation conditions of natural convection, forced convection, or multi-source convection through the air flow control module;

[0058] S4. Establish a dynamic environment model through the 3D space modeling module and monitor the temperature distribution in real time;

[0059] S5. The data acquisition and analysis module collects and analyzes the performance data of electronic components in real time;

[0060] S6. The main control module adjusts the working states of the temperature control module and the air flow control module according to the real-time data, and displays the test results through the touch screen.

[0061] The beneficial effects of the present invention are:

[0062] 1. Through the cooperation of the temperature control module, the air flow control module, the 3D space modeling module, the data acquisition and analysis module, and the main control module, the present invention can simulate the real working environment through multiple heaters and refrigeration units in a short time, establish a dynamic environment in the 3D space, realize heat dissipation conditions of natural convection, forced convection, or multi-source heat dissipation, conduct thermal cycling shocks on electronic components, strengthen the performance stability of precision electronic components on the screen, and verify the reliability of electronic components in an extreme multi-temperature difference environment, ensuring the stability of electronic components. At the same time, for the stability of the electronic component packaging material under different temperature and humidity conditions, such as thermal expansion, humidity penetration, etc., reliable data for accurately predicting the long-term stability and durability of electronic components can be provided.

[0063] 2. Through the setting of the 3D spatial modeling module, the present invention facilitates the establishment of a dynamic environment model and real-time monitoring of the temperature distribution, provides accurate temperature distribution information for the main control module, helps users intuitively understand the temperature situation in the 3D space, and facilitates the adjustment and optimization of the entire system.

[0064] Other features and advantages of the present invention will be described in the following specification, and in part will be obvious from the specification, or will be understood by implementing the present invention. The objectives and other advantages of the present invention can be achieved and obtained through the structures pointed out in the specification, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0066] Figure 1 Shows a system block diagram of a 3D simulation thermal shock system according to an embodiment of the present invention;

[0067] Figure 2 Shows a flowchart of temperature regulation by a temperature control module according to an embodiment of the present invention;

[0068] Figure 3 Shows a flowchart of the simulation of different airflow environments by an airflow control module according to an embodiment of the present invention;

[0069] Figure 4 Shows a flowchart of the establishment of a dynamic environment model by a 3D spatial modeling module according to an embodiment of the present invention;

[0070] Figure 5 Shows a flowchart of the data processing of a sensor group by a processor according to an embodiment of the present invention;

[0071] Figure 6 Shows a flowchart of the control of the working state of a module by a main control module according to real-time data according to an embodiment of the present invention;

[0072] Figure 7 Shows a flowchart of a control method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0073] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0074] An embodiment of the present invention provides a 3D simulation thermal shock system, as Figures 1-6 shown, which includes a temperature control module, an air flow control module, a 3D space modeling module, a data acquisition and analysis module, and a main control module. The main control module is electrically connected to the temperature control module, the air flow control module, the 3D space modeling module, and the data acquisition and analysis module respectively;

[0075] The temperature control module is used to quickly adjust the temperature in the 3D space, simulate the temperature change in the real working environment, provide the temperature conditions for the cold and hot cycle shock of electronic components, help to strengthen the performance stability of the precision electronic components on the screen, and verify the reliability of the electronic components in the extreme temperature environment;

[0076] The temperature control module includes a plurality of heaters and refrigeration units. The plurality of heaters and refrigeration units are all connected to the main control module, and the plurality of heaters and refrigeration units are evenly distributed inside the test chamber to ensure uniform temperature distribution in the test chamber;

[0077] As Figure 2 shown, the process of the temperature control module for temperature adjustment is as follows:

[0078] A1. The main control module determines the target temperature to be adjusted in the 3D space according to the test parameters input by the user on the touch screen, and sends the target temperature instruction to the temperature control module;

[0079] A2. Calculate the required heating or cooling adjustment power according to the target temperature and the parameters of the 3D space. The calculation formula is as follows:

[0080] where P is the required heating or cooling adjustment power value, Q is the heat required for the 3D space to be adjusted from the initial temperature to the target temperature, η is the efficiency of the heater or refrigeration unit, and t is the time requirement of the heater or refrigeration unit;

[0081] The parameters of the 3D space include the total mass of the air and related objects placed in the test chamber, the specific heat capacity of the air and related objects, and the initial temperature and actual temperature of the 3D space. Calculate the heat Q required for the 3D space to be adjusted from the initial temperature to the target temperature according to the parameters of the 3D space. The calculation formula is Q = mc(T 目 -T实 ), where m is the total mass of the air and related objects in the test chamber, c is the specific heat capacity of the air and related objects, and T 目 is the target temperature in the 3D space, and T 实 is the actual temperature in the 3D space.

[0082] A3. During the temperature adjustment process, it is necessary to continuously monitor the actual temperature in the 3D space, compare the actual temperature with the target temperature, and calculate the temperature deviation;

[0083] A4. According to the temperature deviation, the PID control algorithm is used to adjust the heating or cooling power. The formula of the PID control algorithm is:

[0084] where ΔT d is the deviation between the actual temperature and the target temperature, is the integral of the temperature deviation ΔT d from 0 to t, K p is the proportional coefficient used to determine the adjustment of the controller's rapid response to the deviation, K i is the integral coefficient used to eliminate the steady-state error of the system, K d is the differential coefficient used to predict the trend of the deviation, is the derivative of the temperature deviation ΔT d with respect to time t, and u(t) is the change in the heating or cooling power that needs to be adjusted;

[0085] A5. Repeat steps A3 - A4, continuously monitor the actual temperature, calculate the deviation and adjust the power until the temperature deviation is within the allowable error range, then it is determined that the temperature in the 3D space reaches the target temperature and remains stable;

[0086] The airflow control module is used to achieve natural convection, forced convection or multi-heat-source heat dissipation conditions, simulate the working state of electronic components in different airflow environments, and cooperate with the temperature control module to more comprehensively simulate the real working environment and ensure the stability of electronic components under different heat dissipation conditions;

[0087] The airflow control module includes a fan, an air duct and an airflow sensor. The fan is installed at one end of the air duct, the airflow sensor is installed in the air duct, the fan is connected to the main control module, and the rotation speed of the fan is controlled by the main control module, thereby controlling the airflow and intensity generated by the fan. The airflow generated by the fan directly enters the air duct, and the air duct conducts directional transmission of the airflow to achieve natural convection, forced convection or multi-heat-source heat dissipation conditions in the 3D space. The airflow speed and direction are continuously monitored by the airflow sensor, and the monitored airflow data is transmitted to the main control module.

[0088] Such as Figure 3As shown, the process of the air flow control module simulating different air flow environments is as follows:

[0089] B1. According to the air flow control mode of natural convection, forced convection or multi - heat - source heat dissipation and the environmental information provided by the 3D space modeling module, determine the initial rotational speed that the fan needs to reach, then send a start command and corresponding rotational speed control signal to the fan, and the fan starts to operate to generate air flow;

[0090] B2. After the air flow enters the air duct from the fan, different air flow distributions are carried out according to the shape, size and branch structure of the air duct;

[0091] When realizing natural convection, the air flow is naturally diffused and flowed in the 3D space through the air duct; when realizing forced convection, the air flow is guided to a specific area through the air duct; for multi - heat - source heat dissipation, the air duct will distribute the air flow near each heat source;

[0092] B3. According to the temperature distribution information fed back by the 3D space modeling module, adjust the positions of the damper or deflector components in the air duct to optimize the air flow distribution;

[0093] B4. The air flow sensor monitors the parameters of the air flow speed and direction in real time, and feeds the monitored data back to the main control module. The main control module compares the received feedback data with the preset target air flow parameters to judge whether the air flow meets the requirements;

[0094] B5. When the air flow meets the requirements, return to B4; when the air flow does not meet the requirements, enter B6;

[0095] B6. According to the difference between the data fed back by the air flow sensor and the target air flow speed parameter, calculate the adjustment amount that needs to be made to the fan rotational speed or air duct components, and then control the rotational speeds of the motors on the fan and deflector according to the adjustment amount to achieve precise adjustment of the air flow. The calculation formula for the adjustment amount is:

[0096] ΔN = K a (v 目 - v 实 ), where v 目 is the target air flow speed, v 实 is the actual air flow speed, K a is the proportionality coefficient used to adjust the response degree to the air flow speed difference, ΔN is the air flow speed adjustment amount, and the rotational speed of the motor is calculated according to the air flow speed adjustment amount;

[0097] The 3D space modeling module is used to establish a dynamic environment model and monitor the temperature distribution in real time, provide accurate temperature distribution information for the main control module, help users intuitively understand the temperature situation in the 3D space, and facilitate the adjustment and optimization of the entire system;

[0098] Such as Figure 4As shown, the process of the 3D space modeling module for establishing a dynamic environment model is as follows:

[0099] C1. Determine the boundary coordinates of the 3D space according to the actual size of the test space;

[0100] C2. Divide the 3D space into multiple small units using the grid division method, analyze the boundary conditions of the 3D space, and determine the temperature and heat flux conditions on the boundary;

[0101] C3. Uniformly arrange temperature sensors in the 3D space according to the characteristics of the 3D space and the expected change of temperature distribution;

[0102] C4. Set an initial temperature value for each grid cell according to the initial state of the 3D space;

[0103] C5. The temperature sensors collect the temperature data at the location in real time according to the set frequency and transmit it to the data acquisition and analysis module;

[0104] C6. Calculate the heat flux at the boundary of each grid cell according to the initial temperature value and the monitored actual temperature value of each grid cell. The calculation formula is:

[0105] q m =-k m ΔT m where q m is the heat flux density, k m is the thermal conductivity of the corresponding grid cell, and ΔT m is the difference between the initial temperature value and the actual temperature value of the grid cell;

[0106] C7. Establish an equation for temperature change according to the principle of energy conservation. The equation for temperature change is:

[0107]

[0108] where ρ is the material density, c 1 is the specific heat capacity of the material, T 1 is the temperature of the grid cell, t 1 is the temperature change time, q v is the heat source intensity in the grid cell, k 1 is the thermal conductivity of the grid cell, T 1+1 and T 1-1 are the temperatures of two adjacent grid cells respectively, Δx is the distance between two adjacent grid cells in the x direction, Δy is the distance between two adjacent grid cells in the y direction, and Δz is the distance between two adjacent grid cells in the z direction;

[0109] C8. Real-time collect the temperature data of the grid cells and update the temperature distribution model according to the actual temperature of the grid cells to form a dynamic environment model:

[0110] The data acquisition and analysis module is used to collect and analyze the performance data of electronic components in real time, providing data support for evaluating the stability and reliability of electronic components, being able to detect abnormal conditions of electronic components during the testing process in a timely manner, and providing a basis for optimizing the design and manufacturing of electronic components;

[0111] The data acquisition and analysis module includes a sensor group and a processor. The sensor group includes a humidity sensor, a voltage sensor, a current sensor, and a temperature sensor. The humidity sensor, voltage sensor, current sensor, and temperature sensor are all electrically connected to the processor. The performance parameters of the electronic components are collected in real time through the sensor group. The performance parameters include temperature, humidity, voltage, and current data;

[0112] As Figure 5 shown, the data processing flow of the processor for the sensor group is as follows:

[0113] D1. Filter the data collected by the sensor group to remove noise and interference signals in the data. The filtering processing formula is:

[0114]

[0115] where n is the window length centered on i, x j is the j-th discrete data in the discrete data group, and y i is the filtered data;

[0116] D2. Extract the key features that can reflect the performance of the electronic components from the filtered data. The key feature extraction method is to satisfy y i >y i-1 and y i >y i+1 , where y i is the i-th data after filtering, and y i-1 and y i+1 are the two data adjacent to the i-th data after filtering respectively;

[0117] D3. Calculate the mean value of the data after feature extraction to reflect the central tendency of the data;

[0118] D4. Perform least squares fitting according to the calculated mean value to analyze the change trend of the performance data. The least squares fitting formula is:

[0119] y o =e + hx o ,

[0120] where, x oi and y oi are the data points (xoi , y oi ), where \(i = 1, 2, \ldots, n\);

[0121] The main control module is used to adjust the working states of the temperature control module and the air flow control module according to real-time data, ensure that the system can operate according to the preset goals, improve the accuracy and reliability of the test, and set test parameters and view test results through the touch screen, realizing the centralized control and management of the entire system, and facilitating users to set test parameters and view test results;

[0122] As Figure 6 shown, the process of the main control module controlling the working state of the module according to real-time data is as follows:

[0123] E1. The main control module continuously receives the real-time information of the electronic component performance data feedback by the data acquisition and analysis module and the temperature distribution data feedback by the 3D space modeling module;

[0124] E2. Analyze the real-time data through the single-chip microcomputer and calculate the temperature deviation amount and air flow deviation amount that need to be adjusted;

[0125] E3. Determine the temperature control amount and air flow control amount that need to be adjusted according to the calculated temperature deviation amount and air flow deviation amount;

[0126] E4. Send corresponding control instructions to the temperature control module and the air flow control module respectively according to the temperature control amount and the air flow control amount;

[0127] Through the cooperation of the temperature control module, the air flow control module, the 3D space modeling module, the data acquisition and analysis module and the main control module, it is possible to simulate the real working environment through multiple heaters and refrigeration units in a short time, establish a dynamic environment in 3D space, realize natural convection, forced convection or multi-heat source heat dissipation conditions, conduct thermal cycling shock on electronic components, strengthen the performance stability of precision electronic components on the screen, and verify the reliability of electronic components in an extremely multi-temperature difference environment, ensure the stability of electronic components, and at the same time, for the stability of the electronic component packaging material under different temperature and humidity conditions, such as: thermal expansion, humidity penetration, etc., it can accurately provide reliable data for predicting the long-term stability and durability of electronic components.

[0128] Based on the 3D simulation thermal cycling shock system described above, the present invention also proposes a control method for the 3D simulation thermal cycling shock system, as Figure 7 shown, including the following steps:

[0129] S1. Set the test parameters of the thermal cycling shock system through the touch screen, and the test parameters include the target temperature range, the temperature change rate, the desired air flow state, the test time and the data acquisition frequency;

[0130] S2. Rapidly adjust the temperature in the 3D space through the temperature control module;

[0131] S3. Achieve heat dissipation conditions of natural convection, forced convection or multi-source convection through the air flow control module;

[0132] S4. Establish a dynamic environment model through the 3D space modeling module and monitor the temperature distribution in real time;

[0133] S5. The data acquisition and analysis module collects and analyzes the performance data of electronic components in real time;

[0134] S6. The main control module adjusts the working states of the temperature control module and the air flow control module according to the real-time data, and displays the test results through the touch screen.

[0135] Although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A 3D simulation hot and cold shock system, characterized by: include: A temperature control module, the temperature control module is used to quickly adjust the temperature in the 3D space, the temperature control module includes a plurality of heaters and refrigeration units, and the plurality of heaters and refrigeration units are connected to the main control module; An airflow control module, the airflow control module is used to achieve natural convection, forced convection or multi-heat source heat dissipation conditions; A 3D space modeling module, wherein the 3D space modeling module is used to establish a dynamic environment model and monitor temperature distribution in real time; A data acquisition and analysis module, wherein the data acquisition and analysis module is used to acquire and analyze performance data of electronic components in real time; A main control module, which is used to adjust the working status of the temperature control module and the airflow control module according to real-time data, and to set test parameters and view test results through a touch screen; The main control module is electrically connected to the temperature control module, the airflow control module, the 3D space modeling module and the data acquisition and analysis module respectively.

2. A 3D simulation thermal shock system according to claim 1, characterized in that: The process of temperature control module to adjust temperature is as follows: A1. The main control module determines the target temperature to be adjusted in the 3D space according to the test parameters input by the user on the touch screen, and sends the target temperature instruction to the temperature control module; A2. Calculate the required heating or cooling power according to the target temperature and the parameters of the 3D space. The calculation formula is as follows: Where P is the required heating or cooling power value, Q is the heat required to adjust the 3D space from the initial temperature to the target temperature, η is the efficiency of the heater or cooling unit, and t is the time requirement of the heater or cooling unit; A3. During the temperature adjustment process, the actual temperature in the 3D space needs to be monitored in real time, and the actual temperature needs to be compared with the target temperature to calculate the temperature deviation; A4. According to the temperature deviation, the PID control algorithm is used to adjust the heating or cooling power. The PID control algorithm formula is: Where, ΔT d is the deviation between the actual temperature and the target temperature, is the temperature deviation ΔT d The integral from 0 to t, K p K is the proportional coefficient used to determine the degree of rapid response of the controller to the deviation. i K is the integral coefficient used to eliminate the system steady-state error. d is the differential coefficient used to predict the deviation trend, is the temperature deviation ΔT d The derivative with respect to time t, u(t), is the change in heating or cooling power that needs to be adjusted; A5. Repeat steps A3-A4, continuously monitor the actual temperature, calculate the deviation and adjust the power until the temperature deviation is within the allowable error range, then it is determined that the temperature in the 3D space reaches the target temperature and remains stable.

3. A 3D simulation thermal shock system according to claim 2, characterized in that: The airflow control module comprises a fan, an air duct and an airflow sensor. The fan is installed at one end of the air duct, the airflow sensor is installed in the air duct, and the fan is connected to the main control module.

4. A 3D simulation thermal shock system according to claim 3, characterized in that: The process of the airflow control module simulating different airflow environments is as follows: B1. According to the airflow control mode of natural convection, forced convection or multi-heat source heat dissipation and the environmental information provided by the 3D space modeling module, determine the initial speed that the fan needs to reach, and then send a start command and a corresponding speed control signal to the fan, and the fan starts to run to generate airflow; B2. After the airflow enters the air duct from the fan, different airflow distribution is carried out according to the shape, size and branch structure of the air duct; B3. According to the temperature distribution information fed back by the 3D space modeling module, adjust the position of the damper or guide plate components in the air duct to optimize the air flow distribution; B4. The airflow sensor monitors the speed and direction of the airflow in real time and feeds the monitoring data back to the main control module. The main control module compares the received feedback data with the preset target airflow parameters to determine whether the airflow meets the requirements; B5, when the airflow meets the requirements, return to B4; when the airflow does not meet the requirements, enter B6; B6. According to the difference between the data fed back by the airflow sensor and the target airflow velocity parameter, the adjustment amount of the fan speed or the air duct component is calculated, and then the motor speed of the fan and the guide plate is controlled according to the adjustment amount to achieve accurate adjustment of the airflow. The calculation formula of the adjustment amount is: ΔN=K a (v 目 -v 实 ), where v 目 is the target air velocity, v 实 is the actual air flow velocity, K a is the proportional coefficient used to adjust the degree of response to the airflow velocity difference, ΔN is the airflow velocity adjustment amount, and the motor speed is calculated based on the airflow velocity adjustment amount.

5. A 3D simulation thermal shock system according to claim 4, characterized in that: The process of establishing a dynamic environment model in the 3D space modeling module is as follows: C1. Determine the boundary coordinates of the 3D space according to the actual test space size; C2. Use the grid division method to divide the 3D space into multiple small units, analyze the boundary conditions of the 3D space, and determine the temperature and heat flow conditions on the boundary; C3. Temperature sensors are evenly arranged in the 3D space according to the characteristics of the 3D space and the expected changes in temperature distribution; C4, setting an initial temperature value for each grid cell according to the initial state of the 3D space; C5, the temperature sensor collects the temperature data of the location in real time according to the set frequency, and transmits it to the data collection and analysis module; C6. Calculate the heat flow at the boundary of each grid cell based on the initial temperature value of each grid cell and the actual temperature value monitored. The calculation formula is: q m =-k m ΔT m , where q m is the heat flux, k m is the thermal conductivity of the corresponding grid unit, ΔT m is the difference between the initial temperature value and the actual temperature value of the grid cell; C7. According to the principle of conservation of energy, establish the equation of temperature change. The equation of temperature change is: Where ρ is the material density, c1 is the material specific heat capacity, T1 is the grid unit temperature, t1 is the temperature change time, q v is the heat source intensity in the grid unit, k1 is the thermal conductivity of the grid unit, T 1+1 and T 1-1 are the temperatures of two adjacent grid cells, Δx is the distance between two adjacent grid cells in the x direction, Δy is the distance between two adjacent grid cells in the y direction, and Δz is the distance between two adjacent grid cells in the z direction; C8. Collect the temperature data of the grid cells in real time, and update the temperature distribution model according to the actual temperature of the grid cells to form a dynamic environment model.

6. A 3D simulation thermal shock system according to claim 5, characterized in that: The data acquisition and analysis module includes a sensor group and a processor. The sensor group includes a humidity sensor, a voltage sensor, a current sensor and a temperature sensor. The humidity sensor, the voltage sensor, the current sensor and the temperature sensor are all electrically connected to the processor.

7. A 3D simulation thermal shock system according to claim 6, characterized in that: The processor processes the sensor group data as follows: D1. Filter the data collected by the sensor group to remove noise and interference signals in the data. The filtering formula is: Among them, n is the window length centered on i, x j is the jth discrete data in the discrete data set, y i is the filtered data; D2. Extract key features that can reflect the performance of electronic components from the filtered data. The key feature extraction method is to satisfy y i >y i-1 And y i >y i+1 , where y i is the i-th data after filtering, y i-1 and i+1 They are two data adjacent to the i-th data after filtering; D3. Calculate the mean of the data after feature extraction to reflect the central tendency of the data; D4. Perform the least squares fitting based on the calculated mean to analyze the changing trend of the performance data. The least squares fitting formula is: and o =e+hx o , in, x oi and oi The data points (x oi ,y oi )’s coordinates, i=1, 2,…, n.

8. A 3D simulation thermal shock system according to claim 7, characterized in that: The main control module performs module working status control according to real-time data as follows: E1. The main control module continuously receives the real-time information of the electronic component performance data fed back by the data acquisition and analysis module and the temperature distribution data fed back by the 3D space modeling module; E2. Analyze the real-time data through the single-chip computer and calculate the temperature deviation and airflow deviation that need to be adjusted; E3. Determine the temperature control amount and airflow control amount that need to be adjusted according to the calculated temperature deviation amount and airflow deviation amount; E4. Send corresponding control instructions to the temperature control module and the airflow control module respectively according to the temperature control amount and the airflow control amount.

9. A control method for a 3D simulation hot and cold shock system, based on the 3D simulation hot and cold shock system according to any one of claims 1 to 8, characterized in that: The steps include: S1. Set the test parameters of the hot and cold shock system through the touch screen. The test parameters include the target temperature range, temperature change rate, expected airflow state, test time and data collection frequency; S2, quickly adjust the temperature in 3D space through the temperature control module; S3, achieving heat dissipation conditions of natural convection, forced convection or multi-source convection through an airflow control module; S4, establish a dynamic environment model through the 3D space modeling module and monitor the temperature distribution in real time; S5, data acquisition and analysis module collects and analyzes the performance data of electronic components in real time; S6. The main control module adjusts the working status of the temperature control module and the airflow control module according to the real-time data, and displays the test results on the touch screen.

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