Semiconductor chip package structure and heat dissipation method thereof

Abstract

The application provides a semiconductor chip packaging structure and a heat dissipation method thereof, and relates to the technical field of semiconductor packaging. The structure comprises a resin packaging body, a solder wire, a first lead base, a second lead base, solder paste, a chip, a ceramic sheet copper layer and a ceramic sheet. One side of the ceramic sheet copper layer is attached to the ceramic sheet, and the other side is attached to the chip through the solder paste. One side of the chip is connected to the first lead base and the second lead base respectively. The first lead base and the second lead base are electrically connected through the solder wire. The pins of the first lead base and the pins of the second lead base are arranged opposite to the two sides of the resin packaging body and extend out of the resin packaging body. One side of the resin packaging body is provided with a heat dissipation opening. The structure adjusts the structure of the heat dissipation fin to optimize the performance of the semiconductor, and carries out packaging quality detection based on visual technology in the packaging production, so as to effectively ensure the timely correction and control of the quality problems generated in the packaging.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging, in particular to a semiconductor chip packaging structure and a heat dissipation method thereof. BACKGROUND

[0002] At present, some products on the market are packaged with the heat dissipation fins downward to the circuit board, so that the heat is directly transmitted to the PCB, increasing the heat of the board and the internal loss of the product, and the material of the heat dissipation fin is copper, which cannot avoid the special application environment of some chips, such as the need to consider the reverse voltage breakdown and the need for internal insulation design, that is, the copper material does not have this kind of functional requirement; the legs of some products on the market are long or bent along the outside of the product, resulting in poor stability of the entire finished product after the product is mounted on the board; some products on the market are packaged with the chip upward, which needs to be welded, resulting in an excessively thick product; and the use space and heat dissipation are affected. How to reasonably arrange the position of the heat dissipation fin and optimize the structure of the semiconductor device becomes an important research content.

[0003] Meanwhile, for the packaging technology of semiconductor, with the development of science and technology, the packaging process is gradually realized automation, and the packaging process is gradually mature. The influence of packaging on the product is mainly the control of packaging accuracy to ensure that the packaged semiconductor product has ideal performance. With the development of visual technology, real-time and efficient inspection and verification can be realized through the collection of image data, so that the detection of the real-time state of packaging in the packaging process helps to find problems in the packaging site in time and make reasonable and effective adjustments.

[0004] Therefore, it is an urgent problem to be solved to design a semiconductor chip packaging structure and a heat dissipation method thereof, which can optimize the performance of the semiconductor by adjusting the structure of the heat dissipation fin, and effectively ensure the timely correction and control of the quality problems caused by packaging based on the visual technology in the packaging production. SUMMARY

[0005] The present application aims to provide a semiconductor chip packaging structure, which can effectively ensure the insulation and heat dissipation function of the packaged semiconductor by setting a porcelain chip copper layer above the chip, directly expose the porcelain chip by opening a heat dissipation port on the resin packaging body corresponding to the porcelain chip, and improve the heat dissipation of the porcelain chip, greatly increasing the heat resistance of the packaged semiconductor. Meanwhile, the pins of the first lead base and the second lead base adopt flat pins, which can increase the electrical connection area, improve the connection stability, reduce the installation space caused by the pin structure during the installation of the packaged semiconductor, make the overall structure compact, and greatly reduce the overall thickness of the product.

[0006] The application also aims to provide a packaging method, which establishes the basis reference information for subsequent visual technology-based appearance size information comparison and analysis by packaging the model structure data of the semiconductor to extract the appearance size information for different visual angle directions, and can also extract the historical image pixels extracted in the historical production process to extract the appearance size eligibility deviation parameters, thereby defining the allowable range of the finished product appearance size of the packaged semiconductor.

[0007] The application also aims to provide a heat dissipation method, which avoids thermal damage to the circuit board by transferring the heat of the lead base away from the circuit board, and dissipates the heat through the porcelain sheet, which can effectively avoid electrical breakdown due to being made of ceramic material, and also has good heat dissipation effect, and the efficiency of heat dissipation is greatly improved when part of the surface is directly exposed, thereby improving the heat resistance of the packaging structure as a whole.

[0008] In a first aspect, the application provides a semiconductor chip packaging structure, comprising: a resin packaging body, a bonding wire, a first lead base, a second lead base, solder paste, a chip, a porcelain sheet copper layer, and a porcelain sheet; one side of the porcelain sheet copper layer is attached to the porcelain sheet, and the other side is attached to the chip through the solder paste; the side of the chip away from the porcelain sheet copper layer is connected to the first lead base and the second lead base through the solder paste; the first lead base and the second lead base are electrically connected through the bonding wire; the bonding wire, the first lead base, the second lead base, the solder paste, the chip, the porcelain sheet copper layer, and the porcelain sheet are all arranged in the resin packaging body; the pins of the first lead base and the pins of the second lead base are arranged on the two sides of the resin packaging body, and the pins of the first lead base and the pins of the second lead base both extend out of the resin packaging body; a heat dissipation opening is formed on the side of the resin packaging body close to the porcelain sheet, and the heat dissipation opening exposes the side of the porcelain sheet away from the porcelain sheet copper layer.

[0009] In the application, the structure can effectively ensure insulation and heat dissipation in the packaged semiconductor by arranging the porcelain sheet copper layer above the chip, and the heat dissipation of the porcelain sheet can be improved by exposing the porcelain sheet through the heat dissipation opening formed in the resin packaging body corresponding to the porcelain sheet, thereby greatly increasing the heat resistance of the packaged semiconductor. At the same time, the pins of the first lead base and the second lead base are in a planar shape, which can increase the electrical connection area and improve the connection stability, and also can reduce the installation space caused by the pin structure during the installation of the packaged semiconductor, so that the overall structure is compact and the overall thickness of the product is greatly reduced.

[0010] As a possible implementation manner, the pins of the first lead base are located on the same plane as the outer surface of the resin package on the side far from the chip; the pins of the second lead base are located on the same plane as the outer surface of the resin package on the side far from the chip; and a plurality of creepage grooves are arranged in parallel on the side far from the ceramic sheet on the resin package.

[0011] In the present application, the plane where the pins are mounted is located on the same plane as the outer surface of the resin package, which can ensure close contact of the packaged semiconductor with the board during mounting, reduce the occupied height and space, and avoid damage to the pins caused by long-term use.

[0012] In the second aspect, the present application provides a packaging method, comprising: obtaining packaging product model data, extracting feature information of the outer shape size to form model appearance reference feature data; collecting packaging product image data, and combining the model appearance reference feature data to perform positioning range analysis to form product packaging size range feature data; obtaining target image data of a target product, combining the product packaging size range feature data to perform packaging size verification, and forming packaging verification result data.

[0013] In the present application, the method extracts the outer shape size information of different visual angle directions based on the model structure data of the packaged semiconductor to establish the basic reference information for subsequent visual technology-based comparison and analysis of the outer shape size information, and also extracts the qualified deviation parameters of the outer shape size from the historical image data extracted in the historical production process to define the allowable range of the finished product appearance size of the packaged semiconductor. Therefore, the characteristic data can be used for efficient and accurate packaging quality analysis and judgment during the production of the packaged semiconductor, the packaging quality can be ensured, the packaging condition can be efficiently and timely monitored, the packaging problems can be accurately obtained in time, and the quality problems caused by packaging can be timely corrected and controlled.

[0014] As a possible implementation, the package finished product model data is acquired, the characteristic information extraction for the appearance size is performed, and the model appearance reference characteristic data is formed, including: according to the package finished product model data, the model overhead image information, the model first side view image information and the model second side view image information matching the production line position are extracted, and the model view angle direction image data is formed; according to the model view angle direction image data, the positioning analysis is performed, and the view angle direction positioning information under different view angles is determined; according to the view angle direction positioning information, and in combination with the model view angle direction image data, the appearance reference size extraction is performed, and the model appearance reference characteristic data is formed.

[0015] In the present application, to acquire the package related characteristic information from the model, firstly, it is needed to understand that for the packaged semiconductor, due to the optimization on the arrangement and structure of the components, the appearance size of the whole packaged semiconductor is changed, and the change of the appearance size is essentially the expression of the package process. Thus, the appearance size data acquisition from the model is an important means to realize the effective and reasonable package quality detection. Herein, in the appearance size characteristic information extraction, two aspects are mainly considered, one aspect is that the extracted appearance size data is used as the size data reference of the corresponding position information, thus the extracted appearance size data needs to be reasonably positioned and the specific direction appearance size data information extraction, so that in the subsequent real-time comparison test, the direction positioning information can be used to quickly match the real object and the theoretical data. Another aspect is that for the package product, the image information collection direction on line is limited, in order to maximize the data extraction, the determined image direction needs to be reasonably considered, thus the present application extracts the model reference data by acquiring the three direction image data which can be efficiently and quickly acquired on the production line. Through the consideration of the two aspects, the model appearance reference characteristic data is more comparative and reasonable.

[0016] As a possible implementation manner, according to the model perspective direction image data, the positioning analysis is performed to determine perspective direction positioning information in different perspective directions, including: extracting the top view contour information of the packaging product model from the model top view image information, and performing positioning calibration on the image frame of the top view contour to determine the model top view direction positioning point; determining two different model top view positioning size groups according to the top view contour information, wherein: the model top view positioning size group includes two top view size boundary lines, and the two top view size boundary lines are two boundary lines intersecting on the contour boundary; different model top view positioning size groups do not have the same top view size boundary line; the two different model top view positioning size groups and the model top view direction positioning point are combined to form the top view direction positioning information; extracting the first side view contour information of the packaging product model from the model first side view image information, and performing positioning calibration on the image frame of the first side view contour to determine the model first side view direction positioning point; determining two different model first side view positioning size groups according to the first side view contour information, wherein: the model first side view positioning size group includes two first side view size boundary lines, and the two first side view size boundary lines are two boundary lines intersecting on the contour boundary; different model first side view positioning size groups do not have the same first side view size boundary line; the two different model first side view positioning size groups and the model first side view direction positioning point are combined to form the first side view direction positioning information; extracting the second side view contour information of the packaging product model from the model second side view image information, and performing positioning calibration on the image frame of the second side view contour to determine the model second side view direction positioning point; determining two different model second side view positioning size groups according to the second side view contour information, wherein: the model second side view positioning size group includes two second side view size boundary lines, and the two second side view size boundary lines are two boundary lines intersecting on the contour boundary; different model second side view positioning size groups do not have the same second side view size boundary line; the two different model second side view positioning size groups and the model second side view direction positioning point are combined to form the second side view direction positioning information.

[0017] In the present application, the extraction of the visual angle range positioning information first needs to determine the direction of the model appearance reference based on the reference point, and then the position of the packaged semiconductor body is positioned by the data after the direction is determined, and the positioning data information under the corresponding visual angle is obtained. It should be noted that the model under the visual angle direction can be quickly determined, and the image frame formed is taken as the positioning object to realize it. After all, the image data frame is uniform. For the selection of the positioning point from the corresponding visual angle direction, the present application considers that only one data comparison in the same visual angle direction will have a large data error, so two positioning size groups are selected under each visual angle direction, which provides a reference for subsequent real-time comparison and analysis. And the boundary lines selected in the two positioning size groups should be completely different, so as to avoid the effect of not reaching the comparison verification after the boundary data is overlapped.

[0018] As a possible implementation manner, according to the visual angle direction positioning information, and combining the model visual angle direction image data, the appearance reference size is extracted, and the model appearance reference feature data is formed, including: taking the intersection of two top-view size boundary lines in any one model top-view positioning size group as the origin to establish a model top-view coordinate system, and parameterizing the model top-view contour according to the model top-view coordinate system to form model top-view appearance size feature information; taking the intersection of two first side-view size boundary lines in any one model first side-view positioning size group as the origin to establish a model first side-view coordinate system, and parameterizing the model first side-view contour according to the model first side-view coordinate system to form model first side-view appearance size feature information; taking the intersection of two second side-view size boundary lines in any one model second side-view positioning size group as the origin to establish a model second side-view coordinate system, and parameterizing the model second side-view contour according to the model second side-view coordinate system to form model second side-view appearance size feature information; the model top-view appearance size feature information, the model first side-view appearance size feature information and the model second side-view appearance size feature information are collected to form the model appearance reference feature data.

[0019] In the present application, the extraction of the appearance reference size is mainly to parameterize the contour information of the model under the coordinate system at different visual angle directions, so as to provide accurate and quantitative reference data for subsequent real-time comparison. Of course, considering that the model data information has uniqueness, so only one positioning size group under each visual angle direction can be used when extracting the contour information.

[0020] As a possible implementation manner, the package product image data is collected, and the positioning range analysis is performed in combination with the model appearance reference feature data to form product package size range feature data, including: obtaining product top view image information, product first side view image information and product second side view image information corresponding to qualified different package products in the package product image data to form product perspective direction image data of different package products; for different package products, according to the corresponding product perspective direction image data, in combination with perspective direction positioning information and model appearance reference feature data, performing positioning size range analysis on product perspective direction to form corresponding product qualified size range data; for different package products, product top view contour information in the product top view image information is extracted, and image frame direction position is positioned according to model top view direction positioning points; for the product top view contour information, product top view coordinate systems with the same coordinate direction and with the intersection of two top view size boundary lines in different model top view positioning size groups as the origin are respectively established, and coordinate parameterization is performed on the product top view contour according to the product top view coordinate system to form one group of product top view appearance size feature information and two groups of product top view appearance size feature information; one group of product top view appearance size feature information is compared with model top view appearance size feature information to determine overall size deviation of the product top view contour in two directions of the coordinate system to form one group of product top view overall size deviation ; two groups of product top view appearance size feature information are compared with model top view appearance size feature information to determine overall size deviation of the product top view contour in two directions of the coordinate system to form two groups of product top view overall size deviation ; the minimum value of one group of product top view overall size deviation and two groups of product top view overall size deviation in different directions is determined as product top view appearance size deviation ; for different package products, product first side view contour information in the product first side view image information is extracted, and image frame direction position is positioned according to model first side view direction positioning points; for the product first side view contour information, product first side view coordinate systems with the same coordinate direction and with the intersection of two first side view size boundary lines in different model first side view positioning size groups as the origin are respectively established, and coordinate parameterization is performed on the product first side view contour according to the product first side view coordinate system to form one group of product first side view appearance size feature information and two groups of product first side view appearance size feature information; one group of product first side view appearance size feature information is compared with model first side view appearance size feature information to determine overall size deviation of the product first side view contour in two directions of the coordinate system to form one group of product first side view overall size deviation The dimensional feature information of the first side view of the two sets of products is compared with the dimensional feature information of the first side view of the model to determine the overall dimensional deviation of the product's first side view contour in two directions of the coordinate system, thus forming the overall dimensional deviation of the first side view of the two sets of products. The overall dimensional deviation of a group of products viewed from the first side. Overall dimensional deviation of the first side view of the two sets of products The minimum value in different directions is determined as the dimensional deviation of the product's first side view. For different packaged products, extract the product's second-side view contour information from the corresponding product second-side view image information, and locate the image frame's orientation position based on the model's second-side view direction positioning point. For the product's second-side view contour information, establish a product second-side view coordinate system with the intersection point of the boundary lines of two second-side view dimensions in different model second-side view positioning dimension groups as the origin and with the same coordinate orientation. Then, parameterize the product's second-side view contour according to the product second-side view coordinate system to form one set of product second-side view appearance dimension feature information and two sets of product second-side view appearance dimension feature information. Compare one set of product second-side view appearance dimension feature information with the model's second-side view appearance dimension feature information to determine the overall size deviation of the product's second-side view contour in the two directions of the coordinate system, forming a set of overall size deviations of the product's second-side view. The dimensional feature information of the second side view of the two sets of products is compared with the dimensional feature information of the second side view of the model to determine the overall dimensional deviation of the product's second side view contour in two directions of the coordinate system, thus forming the overall dimensional deviation of the second side view of the two sets of products. ; The overall dimensional deviation of a group of products viewed from the second side Overall dimensional deviation of the second side view of the two sets of products The minimum value in different directions is determined as the dimensional deviation of the product's second side view. Combined with the product's top-view dimensional deviations Dimensional deviation of the product from the first side view and the deviation of the product's second side view dimensions This process generates product acceptable size range data. Combining this data with the acceptable size range data for different packaged products, a size positioning range analysis is performed to generate product package size range characteristic data. For all packaged products, the top-view dimensional deviations are compared. The maximum value in different directions will be determined as the allowable deviation of the top view dimension of the product package. Compare the dimensional deviations of different products from the first side view. The maximum value in different directions will be determined as the allowable deviation of the first side view dimension of the product package. Compare the dimensional deviations of different products from the second side view. determining the maximum value in different directions as the product package second side view size allowable deviation ; set product package top view size allowable deviation , product package first side view size allowable deviation , and product package second side view size allowable deviation , forming product package size range feature data.

[0021] In the present application, the positioning range analysis of the package product image data, on the one hand, determines the reasonable size deviation range of the package product in different visual angle directions by using big data information, and on the other hand, determines the allowable deviation in each visual angle direction, avoids the situation of reducing the product qualification rate based on the model data directly, and can accurately reference the qualified product verification and inspection. Because there are two reference positioning size groups in each visual angle direction, there will be two groups of deviation data when extracting the deviation data in each visual angle direction of the historical data, and each group of deviation data considers the data characteristics of the established plane coordinate system. The recorded deviation information is the deviation in two directions of the coordinate system. It can be understood that if the parameterized contour information is analyzed for the length and position of each boundary line, the data complexity will be reduced and the analysis efficiency will be reduced. Therefore, it is more reasonable and efficient to extract the total deviation data in two directions of the coordinate system. Of course, in order to ensure strict control of the package product under the historical big data, both groups of deviation data are taken as the allowable deviation limit with a smaller value, which can improve the quality of the product package to a certain extent. Of course, under the big data, the size deviation range in three visual angle directions is obtained for different qualified package products, and the size deviation range data of all package products in the same visual angle direction is reasonably combined and calculated to determine the allowable size deviation range reference provided by the big data.

[0022] As a possible implementation manner, target image data of a target product is obtained, package size verification is performed in combination with product package size range feature data, and package verification result data is formed, including: target top view image information, target first side view image information and target second side view image information of the target product are respectively extracted according to the target image data; target top view contour information in the target top view image information is extracted, and size deviation of the target top view contour information after coordinate parameterization relative to two model top view positioning size groups is determined in combination with visual angle direction positioning information and model appearance reference feature data and model top view appearance size feature information, forming one group of target top view overall size deviation and two groups of target top view overall size deviation ; extracting target first side view image information of the target first side view contour information, combined with the perspective direction positioning information and model appearance reference feature data, determine the target first side view contour information respectively relative to two model first side view positioning size group after coordinate parameterization, the size deviation of the model first side view appearance size feature information is formed a group of target first side view overall size deviation and two groups of target first side view overall size deviation ; extracting target second side view image information of the target second side view contour information, combined with the perspective direction positioning information and model appearance reference feature data, determine the target second side view contour information respectively relative to two model second side view positioning size group after coordinate parameterization, the size deviation of the model second side view appearance size feature information is formed a group of target second side view overall size deviation and two groups of target second side view overall size deviation ; according to a group of target overall size deviation , two groups of target overall size deviation , a group of target first side view overall size deviation , two groups of target first side view overall size deviation , a group of target second side view overall size deviation , two groups of target second side view overall size deviation , product package top view size allowable deviation , product package first side view size allowable deviation and product package second side view size allowable deviation , the following package size verification analysis: if simultaneously satisfy: ≤ 、 ≤ 、 ≤ 、 ≤ 、 ≤ 、 ≤ , then the package verification information is formed; if not simultaneously satisfy: ≤ 、 ≤ 、 ≤ 、 ≤ 、 ≤ 、 ≤ , the overall size deviation is not satisfied is marked and output.

[0023] In the present application, the inspection of the target product is to determine whether the target product is qualified by comparing and analyzing the size range characteristic data with the current overall size information obtained from three perspective positions of the target product, and then to complete the real-time and efficient inspection of the target product. Of course, only the overall size deviation of different directions in each perspective position meets the requirements, the target product can be determined as qualified, otherwise the size exceeding the range needs to be calibrated to provide a reference for subsequent targeted packaging process inspection and adjustment.

[0024] In a third aspect, the present application provides a heat dissipation method, comprising: heat of the first lead base and the second lead base is transferred to the ceramic sheet through the tin paste between the chips and the ceramic sheet copper layer, and then dissipated on the ceramic sheet; the heat transferred to the ceramic sheet is partially dissipated through the resin package, and the other part is dissipated through the heat dissipation holes on the resin package and air contact; the heat dissipated through the heat dissipation holes on the resin package is greater than the heat dissipated through the resin package.

[0025] In the present application, the heat of the lead base is transferred in the direction away from the circuit board to avoid thermal damage to the circuit board, and the heat is dissipated through the ceramic sheet, which can effectively avoid electrical breakdown on one hand because the ceramic material, and on the other hand can also play a good heat dissipation effect, and in the case of part of the surface directly exposed to the outside, the efficiency of heat dissipation is greatly improved, and the heat resistance of the packaging structure is improved as a whole.

[0026] As a possible implementation manner, the ceramic sheet copper layer disperses and transfers the heat to the ceramic sheet.

[0027] In the present application, the ceramic sheet copper layer improves the efficiency of heat transfer, and avoids the heat transfer being too concentrated to cause uneven heat dissipation and local high temperature of the ceramic sheet receiving the heat.

[0028] The semiconductor chip packaging structure and the heat dissipation method provided by the present application have the following beneficial effects:

[0029] The structure can effectively ensure the insulation and heat dissipation function in the packaged semiconductor by setting the ceramic sheet copper layer above the chip, and the heat dissipation holes are opened on the resin package corresponding to the ceramic sheet, and the ceramic sheet is directly exposed to improve the heat dissipation of the ceramic sheet, greatly increasing the heat resistance of the packaged semiconductor. At the same time, the pins of the first lead base and the second lead base adopt flat pins, which can increase the electrical connection area, improve the connection stability, reduce the installation space caused by the pin structure during the installation of the packaged semiconductor, make the overall structure compact, and greatly reduce the overall thickness of the product.

[0030] The packaging method extracts the size information of the packaging semiconductor from the model structure data of the packaging semiconductor in different visual angle directions, establishes the basic reference information for subsequent visual technology-based size information comparison and analysis, and can also extract the historical image pixels extracted in the historical production process to extract the size qualification deviation parameters, thereby defining the allowable range of the appearance size of the finished packaging semiconductor. Therefore, the characteristic data can be used for efficient and accurate packaging quality analysis and judgment during the packaging semiconductor production process, which can ensure the packaging quality and efficiently and timely monitor the packaging condition, effectively ensure the timely and accurate acquisition of the packaging problem, and realize the timely correction and control of the quality problem caused by the packaging.

[0031] The heat dissipation method transmits the heat of the lead base away from the circuit board to avoid thermal damage to the circuit board, and the heat is dissipated through the porcelain sheet, which can effectively avoid electrical breakdown due to the ceramic material of the porcelain sheet and has a good heat dissipation effect. In addition, the heat dissipation efficiency is greatly improved when part of the surface is directly exposed to the outside, and the heat resistance of the packaging structure is improved as a whole. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments of the present application. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0033] Fig. 1 The structural diagram of the semiconductor chip packaging structure provided by the embodiments of the present application is shown.

[0034] Fig. 2 The step diagram of the packaging method provided by the embodiments of the present application is shown.

[0035] Icon: 01, resin package; 02, solder wire; 03, first lead base; 04, second lead base; 05, tin paste; 06, chip; 07, porcelain sheet copper layer; 08, porcelain sheet; 09, creepage groove. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

[0037] Some products on the market have the heat dissipation fin packaged downward to the circuit board, resulting in the heat being directly transmitted to the PCB, increasing the board heat and product internal consumption, and the heat dissipation fin is made of copper, which cannot avoid the special application environment of part of the chip, such as: the product needs to consider the reverse voltage breakdown, and needs to be internally insulated, that is, the copper material does not have this kind of functional requirement; the legs of some products on the market are long or bent along the outside of the product, resulting in poor stability of the entire finished product after the product is mounted on the board; some products on the market are packaged with the chip upward, which needs to be welded, resulting in too thick product thickness; affecting the use space and heat dissipation. How to reasonably arrange the position of the heat dissipation fin and optimize the structure of the semiconductor device becomes an important research content.

[0038] At the same time, for the packaging technology of semiconductor, with the development of science and technology, the packaging process is gradually realized automation, and the packaging process is gradually mature, the influence of packaging on the product is mainly the control of packaging accuracy, so as to ensure that the packaged semiconductor product has ideal performance, and such packaging control can realize real-time and efficient inspection and verification through image data collection with the development of visual technology, so that the detection of real-time state of packaging on the packaging process helps to find problems in the packaging site in time and make reasonable and effective adjustment.

[0039] Reference Figs. 1-2 The semiconductor chip packaging structure provided by the embodiment of the present application comprises a resin packaging body 01, a solder wire 02, a first lead base 03, a second lead base 04, a tin paste 05, a chip 06, a porcelain sheet copper layer 07 and a porcelain sheet 08. One side of the porcelain sheet copper layer 07 is attached to the porcelain sheet 08, and the other side is attached to the chip 06 through the tin paste 05. The side of the chip 06 away from the porcelain sheet copper layer 07 is connected to the first lead base 03 and the second lead base 04 through the tin paste 05 respectively. The first lead base 03 and the second lead base 04 are electrically connected through the solder wire 02. The solder wire 02, the first lead base 03, the second lead base 04, the tin paste 05, the chip 06, the porcelain sheet copper layer 07 and the porcelain sheet 08 are all arranged in the resin packaging body 01. The pins of the first lead base 03 and the pins of the second lead base 04 are arranged on the two sides of the resin packaging body 01, and the pins of the first lead base 03 and the pins of the second lead base 04 all extend out of the resin packaging body 01. A heat dissipation opening is formed on one side of the resin packaging body 01 close to the porcelain sheet 08, and the side of the porcelain sheet 08 away from the porcelain sheet copper layer 07 is exposed outside through the heat dissipation opening.

[0040] The structure can effectively guarantee the insulation and heat dissipation function in the packaged semiconductor by arranging the porcelain sheet copper layer above the chip, the heat dissipation opening is arranged on the resin package corresponding to the porcelain sheet, the direct exposure of the porcelain sheet can improve the heat dissipation of the porcelain sheet, and the heat resistance of the packaged semiconductor is greatly increased.

[0041] The pin of the first lead base 03 is located on the same plane as the outer surface of the resin package 01 on the side away from the chip 06, the pin of the second lead base 04 is located on the same plane as the outer surface of the resin package 01 on the side away from the chip 06, and a plurality of creep grooves 09 are arranged in parallel and spaced apart on the plane on the side away from the porcelain sheet 08 of the resin package 01. Here, the plane where the pin is installed is located on the same plane as the outer surface of the resin package, which can not only ensure that the packaged semiconductor is closely attached to the board during installation to reduce the occupied height and space, but also avoid damage to the pin caused by not being on the same plane for a long time. In addition, the creep grooves arranged on the resin package can increase the creep distance, and the design of the grooves greatly increases the withstand voltage of the product, so that the packaged semiconductor is suitable for higher working voltage environment, and the application range of the packaged semiconductor is improved.

[0042] The application also provides a packaging method, which extracts the shape size information of the model structure data of the packaged semiconductor for different visual angle directions to establish the basic reference information for subsequent visual technology-based shape size information comparison and analysis, and extracts the historical image pixels extracted in the historical production process to extract the shape size qualified deviation parameters, thereby defining the allowable range of the appearance size of the packaged semiconductor. Therefore, these characteristic data can be used for efficient and accurate packaging quality analysis and judgment during the packaging semiconductor production process, which can ensure the packaging quality and efficiently and timely monitor the packaging condition, effectively ensure the timely and accurate acquisition of the packaging problem, and realize the timely correction and control of the quality problem caused by the packaging.

[0043] The semiconductor chip front surface heat dissipation method specifically includes the following steps:

[0044] S1: Obtain the packaged product model data, extract the characteristic information of the shape size, and form the model appearance reference characteristic data.

[0045] The model data of the packaging finished product is acquired, the characteristic information of the external size is extracted, the model appearance reference characteristic data is formed, and the model appearance reference characteristic data includes: the model top view image information, the model first side view image information and the model second side view image information which are matched with the position of the production line are extracted according to the model data of the packaging finished product, the model view direction image data is formed; the view direction positioning information under different view directions is determined through the positioning analysis according to the model view direction image data; the appearance reference size is extracted according to the view direction positioning information and in combination with the model view direction image data, and the model appearance reference characteristic data is formed.

[0046] To acquire the characteristic information related to the packaging from the model, it is first needed to understand that the appearance size of the whole packaging semiconductor is changed due to the optimization of the arrangement and structure of the components, and the change of the appearance size is essentially the expression of the packaging process. Thus, the acquisition of the appearance size data from the model is an important means to realize the effective and reasonable packaging quality detection. Here, two aspects are mainly considered in the extraction of the appearance size characteristic information. On one hand, the extracted appearance size data is used as the size data reference of the corresponding position information, and thus the extracted appearance size data needs to be reasonably positioned and the appearance size data information of a specific direction is extracted, so that the real object and the theoretical data can be matched and corresponded quickly through the directional positioning information in the subsequent real-time comparison and inspection. On the other hand, the direction of the image information collection on the packaging product is limited, and in order to maximize the extraction of the data, the determined image direction needs to be reasonably considered. Thus, the model reference data is extracted through the acquisition of the three-direction image data which can be acquired efficiently and quickly on the production line. Through the consideration of the two aspects, the model appearance reference characteristic data is more comparative and reasonable.

[0047] According to the model perspective direction image data, the positioning analysis is performed to determine the perspective direction positioning information in different perspective directions, including: extracting the top view contour information of the packaging product model according to the model top view image information, and performing the positioning calibration on the image frame of the top view contour to determine the model top view direction positioning point; determining two different model top view positioning size groups according to the top view contour information, wherein: the model top view positioning size group includes two top view size boundary lines, and the two top view size boundary lines are two boundary lines intersecting on the contour boundary; the different model top view positioning size groups do not have the same top view size boundary line; and the two different model top view positioning size groups and the model top view direction positioning point are collected to form the top view direction positioning information; extracting the first side view contour information of the packaging product model according to the model first side view image information, and performing the positioning calibration on the image frame of the first side view contour to determine the model first side view direction positioning point; determining two different model first side view positioning size groups according to the first side view contour information, wherein: the model first side view positioning size group includes two first side view size boundary lines, and the two first side view size boundary lines are two boundary lines intersecting on the contour boundary; the different model first side view positioning size groups do not have the same first side view size boundary line; and the two different model first side view positioning size groups and the model first side view direction positioning point are collected to form the first side view direction positioning information; extracting the second side view contour information of the packaging product model according to the model second side view image information, and performing the positioning calibration on the image frame of the second side view contour to determine the model second side view direction positioning point; determining two different model second side view positioning size groups according to the second side view contour information, wherein: the model second side view positioning size group includes two second side view size boundary lines, and the two second side view size boundary lines are two boundary lines intersecting on the contour boundary; the different model second side view positioning size groups do not have the same second side view size boundary line; and the two different model second side view positioning size groups and the model second side view direction positioning point are collected to form the second side view direction positioning information.

[0048] The extraction of the visual angle range positioning information first needs to determine the direction of the model appearance reference based on the reference point, and then the position of the packaged semiconductor body is positioned by the determined data to obtain the positioning data information under the corresponding visual angle. It should be noted that the model under the visual angle can be quickly determined in direction, and the image frame formed by the collected image data is used as the positioning object to realize it. After all, the image data frame has uniformity. For the selection of the positioning point from the corresponding visual angle, the present application considers that only one data comparison at the same visual angle may have a large data error, so two positioning size groups are selected under each visual angle to provide a reference for subsequent real-time comparison and analysis. And the boundary lines selected in the two positioning size groups should be completely different, so as to avoid the effect of not reaching the comparison verification after the boundary data is overlapped.

[0049] According to the visual angle orientation positioning information, and in combination with the model visual angle orientation image data, the appearance reference size is extracted to form the model appearance reference feature data, including: for the top view contour information, taking the intersection of two top view size boundary lines in any one model top view positioning size group as the origin to establish a model top view coordinate system, and according to the model top view coordinate system, the model top view contour is parameterized to form the model top view appearance size feature information; for the first side view contour information, taking the intersection of two first side view size boundary lines in any one model first side view positioning size group as the origin to establish a model first side view coordinate system, and according to the model first side view coordinate system, the model first side view contour is parameterized to form the model first side view appearance size feature information; for the second side view contour information, taking the intersection of two second side view size boundary lines in any one model second side view positioning size group as the origin to establish a model second side view coordinate system, and according to the model second side view coordinate system, the model second side view contour is parameterized to form the model second side view appearance size feature information; the model top view appearance size feature information, the model first side view appearance size feature information and the model second side view appearance size feature information are collected to form the model appearance reference feature data.

[0050] The extraction of the appearance reference size is mainly to parameterize the contour information of the model under the coordinate system at different visual angle orientations to provide accurate and quantitative reference data for subsequent real-time comparison. Of course, considering the uniqueness of the model data information, only one positioning size group under each visual angle is used when extracting the contour information.

[0051] S2: Collecting packaged product image data, and combining model appearance reference feature data to analyze the positioning range and form product packaging size range feature data.

[0052] The image data of the packaged product is collected, and the positioning range analysis is performed in combination with the model appearance reference feature data to form product packaging size range feature data, including: obtaining product top view image information, product first side view image information and product second side view image information corresponding to qualified different packaging products in the packaging product image data to form product perspective direction image data of different packaging products; for different packaging products, according to the corresponding product perspective direction image data, in combination with the perspective direction positioning information and the model appearance reference feature data, the positioning size range analysis of the product perspective direction is performed to form the corresponding product qualified size range data; for different packaging products, product top view contour information in the corresponding product top view image information is extracted, and the direction position of the image frame is positioned according to the model top view direction positioning point; for the product top view contour information, a product top view coordinate system with the same coordinate direction and the intersection of the two top view size boundary lines in different model top view positioning size groups as the origin is established, and the product top view contour is parameterized according to the product top view coordinate system to form a group of product top view appearance size feature information and two groups of product top view appearance size feature information; the one group of product top view appearance size feature information is compared with the model top view appearance size feature information to determine the overall size deviation of the product top view contour in two directions of the coordinate system to form one group of product top view overall size deviation , wherein n takes x and y, when n takes x, it is the overall size deviation in the horizontal axis direction of the coordinate system, and when n takes y, it is the overall size deviation in the vertical axis direction of the coordinate system; the two groups of product top view appearance size feature information are compared with the model top view appearance size feature information to determine the overall size deviation of the product top view contour in two directions of the coordinate system to form two groups of product top view overall size deviation ; the minimum value of the one group of product top view overall size deviation and the two groups of product top view overall size deviation in different directions is determined as the product top view appearance size deviation ; for different packaging products, product first side view contour information in the corresponding product first side view image information is extracted, and the direction position of the image frame is positioned according to the model first side view direction positioning point; for the product first side view contour information, a product first side view coordinate system with the same coordinate direction and the intersection of the two first side view size boundary lines in different model first side view positioning size groups as the origin is established, and the product first side view contour is parameterized according to the product first side view coordinate system to form a group of product first side view appearance size feature information and two groups of product first side view appearance size feature information; the one group of product first side view appearance size feature information is compared with the model first side view appearance size feature information to determine the overall size deviation of the product first side view contour in two directions of the coordinate system to form one group of product first side view overall size deviation The dimensional feature information of the first side view of the two sets of products is compared with the dimensional feature information of the first side view of the model to determine the overall dimensional deviation of the product's first side view contour in two directions of the coordinate system, thus forming the overall dimensional deviation of the first side view of the two sets of products. The overall dimensional deviation of a group of products viewed from the first side. Overall dimensional deviation of the first side view of the two sets of products The minimum value in different directions is determined as the dimensional deviation of the product's first side view. For different packaged products, extract the product's second-side view contour information from the corresponding product second-side view image information, and locate the image frame's orientation position based on the model's second-side view direction positioning point. For the product's second-side view contour information, establish a product second-side view coordinate system with the intersection point of the boundary lines of two second-side view dimensions in different model second-side view positioning dimension groups as the origin and with the same coordinate orientation. Then, parameterize the product's second-side view contour according to the product second-side view coordinate system to form one set of product second-side view appearance dimension feature information and two sets of product second-side view appearance dimension feature information. Compare one set of product second-side view appearance dimension feature information with the model's second-side view appearance dimension feature information to determine the overall size deviation of the product's second-side view contour in the two directions of the coordinate system, forming a set of overall size deviations of the product's second-side view. The dimensional feature information of the second side view of the two sets of products is compared with the dimensional feature information of the second side view of the model to determine the overall dimensional deviation of the product's second side view contour in two directions of the coordinate system, thus forming the overall dimensional deviation of the second side view of the two sets of products. ; The overall dimensional deviation of a group of products viewed from the second side Overall dimensional deviation of the second side view of the two sets of products The minimum value in different directions is determined as the dimensional deviation of the product's second side view. Combined with the product's top-view dimensional deviations Dimensional deviation of the product from the first side view and the deviation of the product's second side view dimensions This process generates product acceptable size range data. Combining this data with the acceptable size range data for different packaged products, a size positioning range analysis is performed to generate product package size range characteristic data. For all packaged products, the top-view dimensional deviations are compared. The maximum value in different directions will be determined as the allowable deviation of the top view dimension of the product package. Compare the dimensional deviations of different products from the first side view. The maximum value in different directions will be determined as the allowable deviation of the first side view dimension of the product package. Compare the dimensional deviations of different products from the second side view. The maximum value in different directions is determined as the product package second side view size allowable deviation ; the set product package top view size allowable deviation , the product package first side view size allowable deviation , and the product package second side view size allowable deviation , forming product package size range feature data.

[0053] The positioning range analysis of the package product image data is to determine the reasonable size deviation range of the package product in different visual angle directions on the one hand, and to determine the allowable deviation in each visual angle direction on the other hand, so as to avoid the situation of reducing the product qualification rate due to invalid reference based on model data, and at the same time, accurate reference can be made for qualified product verification. Because there are two reference positioning size groups in each visual angle direction, there will be two groups of deviation data when extracting deviation data in each visual angle direction from historical data, and each group of deviation data considers the data characteristics of the established plane coordinate system. The recorded deviation information is the deviation in two directions of the coordinate system. It can be understood that if the parameterized contour information is analyzed for the length and position of each boundary line, the data complexity will be reduced and the analysis efficiency will be reduced. Therefore, it is more reasonable and efficient to extract total deviation data in two directions of the coordinate system. Of course, in order to ensure strict control of the package product under the historical big data, both groups of deviation data are taken as the allowable deviation limit with a smaller value, which can improve the quality of the product package to a certain extent. Of course, under the big data, the size deviation range in three visual angle directions is obtained for different qualified package products, and the size deviation range data of all package products in the same visual angle direction is reasonably combined and calculated to determine the allowable size deviation range reference provided by the big data.

[0054] S3: obtaining target image data of the target product, combining product package size range feature data to perform package size verification, and forming package verification result data.

[0055] Obtaining target image data of the target product, combining product package size range feature data to perform package size verification, and forming package verification result data, including: according to the target image data, respectively extracting target top view image information, target first side view image information and target second side view image information of the target product; extracting target top view contour information in the target top view image information, combining visual angle direction positioning information and model appearance reference feature data, determining size deviation of the target top view contour information after coordinate parameterization relative to two model top view positioning size groups respectively, and forming one group of target top view overall size deviation and two groups of target top view overall size deviation ; extracting target first side view contour information in the target first side view image information, combining the view angle orientation positioning information and the model appearance reference feature data, determining size deviations of the target first side view contour information after coordinate parameterization respectively relative to two model first side view positioning size groups from the model first side view appearance size feature information, forming a group of target first side view overall size deviations and two groups of target first side view overall size deviations ; extracting target second side view contour information in the target second side view image information, combining the view angle orientation positioning information and the model appearance reference feature data, determining size deviations of the target second side view contour information after coordinate parameterization respectively relative to two model second side view positioning size groups from the model second side view appearance size feature information, forming a group of target second side view overall size deviations and two groups of target second side view overall size deviations ; according to one group of target top view overall size deviations , two groups of target top view overall size deviations , one group of target first side view overall size deviations , two groups of target first side view overall size deviations , one group of target second side view overall size deviations , two groups of target second side view overall size deviations , product package top view size allowable deviations , product package first side view size allowable deviations , and product package second side view size allowable deviations , the following package size checking analysis is performed: if the following conditions are simultaneously satisfied: ≤ , ≤ , ≤ , ≤ , ≤ , ≤ , ≤ , ≤ , ≤ , ≤ , ≤ , ≤ , then package checking pass information is formed; if the following conditions are not simultaneously satisfied:

[0056] The inspection of the target product is to compare and analyze the size range characteristic data under the condition of obtaining the current overall size information of the target product in three perspective directions, so as to determine whether the target product is qualified, and then complete the real-time and efficient inspection of the target product. Of course, only the overall size deviation in different directions of each perspective direction meets the requirements, the target product can be determined to be qualified, otherwise the size exceeding the range needs to be calibrated, so as to provide a reference for subsequent targeted packaging process inspection and adjustment.

[0057] The application also provides a heat dissipation method, comprising: the heat of the first lead base and the second lead base is transmitted to the ceramic sheet through the tin paste between the chips and the copper layer of the ceramic sheet, and then is dissipated on the ceramic sheet; the heat transmitted to the ceramic sheet is partially dissipated through the resin package, and the other part is dissipated through the heat dissipation holes on the resin package and the air; the heat dissipated through the heat dissipation holes on the resin package is greater than the heat dissipated through the resin package.

[0058] The heat dissipation method transmits the heat of the lead base to the direction away from the circuit board, so as to avoid thermal damage to the circuit board, and the heat is dissipated through the ceramic sheet, which can effectively avoid electrical breakdown due to the ceramic material of the ceramic sheet, and also has good heat dissipation effect, and the efficiency of heat dissipation is greatly improved in the case that part of the surface is directly exposed to the outside, so that the heat resistance of the packaging structure is improved as a whole.

[0059] In summary, the semiconductor chip packaging structure and the heat dissipation method provided by the embodiments of the application have the following advantages:

[0060] The structure can effectively ensure the insulation and heat dissipation function in the packaged semiconductor by arranging the copper layer of the ceramic sheet above the chip, and the heat dissipation property of the ceramic sheet is improved by directly exposing the ceramic sheet through the heat dissipation holes on the resin package corresponding to the ceramic sheet, so that the heat resistance of the packaged semiconductor is greatly improved. At the same time, the pins of the first lead base and the second lead base adopt the plane type pins, which can increase the electrical connection area, improve the connection stability, reduce the installation space caused by the pin structure during the installation of the packaged semiconductor, make the overall structure compact, and greatly reduce the overall thickness of the product.

[0061] The packaging method extracts the size information of the packaging semiconductor from the model structure data of the packaging semiconductor in different view directions, establishes the basic reference information for subsequent visual technology-based size information comparison and analysis, and can also extract the size qualification deviation parameters of the historical image pixels extracted in the historical production process, so as to define the allowable range of the appearance size of the finished packaging semiconductor. Therefore, the characteristic data can be used for efficient and accurate packaging quality analysis and judgment during the packaging semiconductor production process, the packaging quality can be ensured, the packaging condition can be efficiently and timely monitored, the packaging problem can be accurately obtained in time, and the quality problem caused by the packaging can be timely corrected and controlled.

[0062] The heat dissipation method avoids thermal damage to the circuit board by transferring the heat of the lead base away from the circuit board, and the heat is dissipated through the porcelain sheet. On the one hand, the porcelain sheet can effectively avoid electrical breakdown because it is a ceramic material, and on the other hand, it can also play a good heat dissipation role. In the case of part of the surface being directly exposed to the outside, the efficiency of heat dissipation is greatly improved, and the heat resistance of the packaging structure as a whole is improved.

[0063] In the embodiments of the present application, the indication can include direct indication and indirect indication, and can also include explicit indication and implicit indication. The information indicated by certain information is referred to as to-be-indicated information, and in the specific implementation process, there are many ways to indicate the to-be-indicated information, for example but not limited to, the to-be-indicated information can be directly indicated, such as the to-be-indicated information itself or the index of the to-be-indicated information. The to-be-indicated information can also be indirectly indicated by indicating other information, wherein the other information and the to-be-indicated information have an association relationship. The to-be-indicated information can also be only indicated in part, and the other part of the to-be-indicated information is known or agreed in advance. For example, the indication of a specific information can also be achieved by means of the arrangement order of each information agreed in advance (for example, a protocol), thereby reducing the indication overhead to a certain extent. At the same time, the common part of each information can be identified and uniformly indicated to reduce the indication overhead caused by separately indicating the same information.

[0064] In addition, the specific indication method can also be various existing indication methods, for example but not limited to, the above-mentioned indication methods and various combinations thereof. The specific details of various indication methods can refer to the prior art, and will not be described herein. As can be seen from the above, for example, when multiple information of the same type needs to be indicated, the indication methods of different information can be different. In the specific implementation process, the required indication method can be selected according to the specific needs, and the selected indication method is not limited by the embodiments of the present application, so that the indication method involved in the embodiments of the present application should be understood as covering various methods that can enable the to-be-indicated party to know the to-be-indicated information.

[0065] It should be understood that the to-be-indicated information can be sent as a whole or can be sent separately into multiple sub-information, and the sending period and / or sending occasion of the sub-information can be the same or different. The specific sending method is not limited by the embodiments of the present application. The sending period and / or sending occasion of the sub-information can be predefined, for example, predefined according to a protocol, or configured by the sending end device by sending configuration information to the receiving end device.

[0066] The "predefined" or "preconfigured" can be implemented by pre-storing corresponding codes, tables or other means for indicating related information in a device, and the specific implementation manner is not limited by the embodiments of the present application. The "storing" can mean storing in one or more memories. The one or more memories can be separately arranged or integrated in the encoder or decoder, processor or communication device. The one or more memories can be partially separately arranged and partially integrated in the decoder, processor or communication device. The type of the memory can be any form of storage medium, and the embodiments of the present application do not limit this.

[0067] The "protocol" involved in the embodiments of the present application can refer to a protocol family in the communication field, a standard protocol similar to the protocol family frame structure, or a related protocol applied to a future communication system, and the embodiments of the present application do not limit this.

[0068] In the embodiments of the present application, the descriptions such as "when", "in the case of", "if" and "whether" all refer to that the device will make corresponding processing under certain objective condition, and are not limited by time, and it is not required that the device must have a judgment action when implemented, and it does not mean that there is other limitation.

[0069] In the description of the embodiments of the present application, unless otherwise specified, " / " means that the objects associated before and after are in an "or" relationship, for example, A / B can represent A or B; "and / or" in the embodiments of the present application is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent: A exists alone, A and B exist together, and B exists alone, where A and B can be singular or plural. And in the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more than two. "At least one of the following" or the like means any combination of the items, including any combination of single item or multiple items. For example, at least one of a, b or c can represent: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, and c can be single or multiple. In addition, in order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, "first", "second", etc. are used to distinguish the same items or similar items with basically the same function and effect. Those skilled in the art can understand that "first", "second", etc. do not limit the quantity and execution order, and "first", "second", etc. also do not necessarily mean different. At the same time, in the embodiments of the present application, "exemplary" or "for example" means to serve as an example, illustration or description. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as more preferred or more advantageous than other embodiments or design schemes. Rather, "exemplary" or "for example" is used to present the relevant concept in a specific manner, for understanding.

[0070] It should be understood that the processor in the embodiments of the present application can be a central processing unit (CPU), and the processor can also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), ready programmable gate arrays (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor.

[0071] It should also be understood that the memory in the embodiments of the present application can be volatile or nonvolatile memory, or can include both volatile and nonvolatile memory. The nonvolatile memory can be read-only memory (ROM), programmable ROM (PROM), erasable PROM (EPROM), electrically EPROM (EEPROM), or flash memory. The volatile memory can be random access memory (RAM) used as external cache. By way of example, and not limitation, many forms of random access memory (RAM) are available, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchlink DRAM (SLDRAM), and direct rambus RAM (DR RAM).

[0072] The above-described embodiments can be implemented in whole or in part by software, hardware (such as a circuit), firmware, or any combination thereof. When implemented in software, the above-described embodiments can be implemented in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the processes or functions described in the embodiments of the present application are wholly or partially generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium or transferred from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions can be transferred from one website, computer, server, or data center to another website, computer, server, or data center through a wired (such as infrared, wireless, microwave, etc.) manner. The computer-readable storage medium can be any available medium accessible by a computer or a data storage device such as a server, data center, etc. containing one or more available medium collections. The available medium can be a magnetic medium (such as a floppy disk, a hard disk, a magnetic tape), an optical medium (such as a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state disk.

[0073] It should be understood that the term "and / or" herein merely describes an association relationship of associated objects, which means that there can be three relationships, for example, A and / or B can represent three cases of A alone, A and B together, and B alone, where A and B can be singular or plural. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after it, but it can also represent an "and / or" relationship, which can be understood in the context before and after it.

[0074] In the present application, "at least one" means one or more, and "multiple" means two or more. "At least one of the following" or the like means any combination of the items, including any combination of single or multiple items. For example, at least one of a, b, or c can represent a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, and c can be single or multiple.

[0075] It should be understood that in various embodiments of the present application, the size of the sequence number of the above-described processes does not mean the order of execution, and the execution order of the processes should be determined by their functions and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0076] Those skilled in the art can clearly understand that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized by electronic hardware or a combination of computer software and electronic hardware. Whether the functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0077] Those skilled in the art can clearly understand that, for the convenience and brevity of the description, the specific working processes of the above-described system, device and unit can refer to the corresponding processes in the foregoing method embodiments, which will not be repeated here.

[0078] In several embodiments provided by the present application, it should be understood that the disclosed system, device and method can be implemented by other ways. For example, the above-described device embodiments are merely schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the units shown or discussed can be indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0079] The units described as separate components can or can not be physically separated, and the components shown as units can or can not be physical units, that is, they can be located in one place, or can be distributed on multiple network units. Part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

[0080] In addition, each functional unit in each embodiment of the present application can be integrated into a processing unit, or each unit can exist physically independently, or two or more units can be integrated into one unit.

[0081] If the functions are realized in the form of software function units and sold or used as independent products, they can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application or the parts of the present application that essentially contribute to the prior art or the parts of the technical solutions can be embodied in the form of software products. The computer software product is stored in a storage medium and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in the various embodiments of the present application. The aforementioned storage medium includes a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, and various media that can store program codes.

[0082] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of changes or replacements within the technical range disclosed by the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A packaging method applied to a semiconductor chip packaging structure, the semiconductor chip packaging structure comprising a resin package, a bonding wire, a first lead base, a second lead base, a solder paste, a chip, a ceramic copper layer and a ceramic sheet; one side of the ceramic copper layer is attached to the ceramic sheet, and the other side is attached to the chip through the solder paste; the side of the chip away from the ceramic copper layer is connected to the first lead base and the second lead base respectively through the solder paste; the first lead base and the second lead base are electrically connected through the bonding wire; the bonding wire, the first lead base, the second lead base, the solder paste, the chip, the ceramic copper layer and the ceramic sheet are all arranged in the resin package; the pins of the first lead base and the pins of the second lead base are arranged on the two sides of the resin package respectively, and the pins of the first lead base and the pins of the second lead base both extend out of the resin package; a heat dissipation opening is formed on the side of the resin package close to the ceramic sheet, and the heat dissipation opening exposes the side of the ceramic sheet away from the ceramic copper layer, characterized in that, The method comprises the following steps: acquiring packaging product model data, extracting characteristic information of the shape and size, and forming model appearance reference characteristic data; extracting model top view image information, model first side view image information, and model second side view image information matching the position of the production line according to the packaging product model data, and forming model view angle direction image data; performing positioning analysis according to the model view angle direction image data, and determining view angle direction positioning information under different view angles, wherein the top view contour information of the packaging product model is extracted from the model top view image information, and the image frame of the top view contour is positioned and calibrated to determine the model top view direction positioning point; two different model top view positioning size groups are determined according to the top view contour information, wherein: the model top view positioning size group comprises two top view size boundary lines, and the two top view size boundary lines are two boundary lines intersecting on the contour boundary; different model top view positioning size groups do not have the same top view size boundary line; the two different model top view positioning size groups and the model top view direction positioning point are combined to form top view direction positioning information; the first side view contour information of the packaging product model is extracted from the model first side view image information, and the image frame of the first side view contour is positioned and calibrated to determine the model first side view direction positioning point; two different model first side view positioning size groups are determined according to the first side view contour information, wherein: the model first side view positioning size group comprises two first side view size boundary lines, and the two first side view size boundary lines are two boundary lines intersecting on the contour boundary; different model first side view positioning size groups do not have the same first side view size boundary line; the two different model first side view positioning size groups and the model first side view direction positioning point are combined to form first side view direction positioning information; the second side view contour information of the packaging product model is extracted from the model second side view image information, and the image frame of the second side view contour is positioned and calibrated to determine the model second side view direction positioning point; two different model second side view positioning size groups are determined according to the second side view contour information, wherein: the model second side view positioning size group comprises two second side view size boundary lines, and the two second side view size boundary lines are two boundary lines intersecting on the contour boundary; different model second side view positioning size groups do not have the same second side view size boundary line; the two different model second side view positioning size groups and the model second side view direction positioning point are combined to form second side view direction positioning information; the view angle direction positioning information is combined with the model view angle direction image data to extract appearance reference size, and the model appearance reference characteristic data is formed; packaging product image data is collected, and positioning range analysis is performed in combination with the model appearance reference characteristic data to form product packaging size range characteristic data: Obtaining product top view image information, product first side view image information and product second side view image information corresponding to qualified different packaging products in the packaging product image data, and forming product perspective direction image data of different packaging products; For different packaging products, according to the corresponding product perspective direction image data, combining the perspective direction positioning information and the model appearance reference feature data, the positioning size range analysis of product perspective direction is carried out, and the corresponding product qualified size range data is formed: For different packaging products, product top view contour information in the corresponding product top view image information is extracted, and the direction position of the image frame is positioned according to the model top view direction positioning point; For the product top view contour information, product top view coordinate systems with the same coordinate direction and the intersection of two top view size boundary lines in different model top view positioning size groups as the origin are respectively established, and the product top view contour is parameterized according to the product top view coordinate system, forming a group of product top view appearance size feature information and two groups of product top view appearance size feature information; The top-view appearance size feature information of the group of products is compared with the model top-view appearance size feature information to determine overall size deviations of the product top-view profile in two directions of the coordinate system, forming a group of product top-view overall size deviations wherein n takes x, y, when n takes x, it is an overall size deviation in the horizontal axis direction of the coordinate system, and when n takes y, it is an overall size deviation in the vertical axis direction of the coordinate system; The top-view appearance size feature information of the two groups of products is compared with the top-view appearance size feature information of the model, overall size deviations of the top-view profiles of the products in two directions of the coordinate system are determined, and top-view overall size deviations of the two groups of products are formed ; the set of products in the direction of the maximum deviation and the set of products in the direction of the minimum deviation the minimum value in the different directions is determined as the product apparent size deviation ; For different packaging products, product first side view contour information in the corresponding product first side view image information is extracted, and the direction position of the image frame is positioned according to the model first side view direction positioning point; For the product first side view contour information, product first side view coordinate systems with the same coordinate direction and the intersection of two first side view size boundary lines in different model first side view positioning size groups as the origin are respectively established, and the product first side view contour is parameterized according to the product first side view coordinate system, forming a group of product first side view appearance size feature information and two groups of product first side view appearance size feature information; comparing the set of product first side view appearance dimensional feature information with model first side view appearance dimensional feature information to determine overall dimensional deviations of the product first side view profile in two directions of the coordinate system, forming a set of product first side view overall dimensional deviations ; comparing the first side view appearance size feature information of the two groups of products with the first side view appearance size feature information of the model, determining overall size deviation of the first side view profile of the products in two directions of the coordinate system, and forming two groups of first side view overall size deviation ; determining a first side view overall size deviation of the set of products and a second side view overall size deviation of the set of products the minimum value in different directions is determined as the first side view appearance size deviation of the product ; For different packaging products, product second side view contour information in the corresponding product second side view image information is extracted, and the direction position of the image frame is positioned according to the model second side view direction positioning point; For the product second side view contour information, product second side view coordinate systems with the same coordinate direction and the intersection of two second side view size boundary lines in different model second side view positioning size groups as the origin are respectively established, and the product second side view contour is parameterized according to the product second side view coordinate system, forming a group of product second side view appearance size feature information and two groups of product second side view appearance size feature information; comparing the second side view appearance dimensional feature information of the set of products with the second side view appearance dimensional feature information of the model to determine overall dimensional deviations of the second side view profile of the products in two directions of the coordinate system, forming a set of second side view overall dimensional deviations of the products ; comparing the second side view appearance size feature information of the two groups of products with the second side view appearance size feature information of the model to determine overall size deviations of the second side view profile of the products in two directions of the coordinate system to form second side view overall size deviations of the two groups of products ; the second side view overall size deviation of the first group of products and the second side view overall size deviation of the second group of products the minimum value in different directions is determined as the second side view appearance size deviation of the product ; combining the product top view appearance dimensional deviation the product first side view appearance dimensional deviation and the product second side view appearance dimensional deviation to form the product acceptable dimensional range data; Combining the product qualified size range data corresponding to different packaging products, the positioning range analysis of size is carried out, and the product packaging size range feature data is formed: For all of the packaged products, comparing the top view appearance dimensional deviation of different products The maximum value in different directions is determined as the allowable deviation of the top view dimension of product packaging ; Comparing different product first side appearance dimensional deviations Determining the maximum value in different directions as the product package first side dimension allowance ; Comparing different product second side appearance dimensional deviations Determining the maximum value in different directions as the product package second side appearance dimensional allowance ; collecting product package top view size allowable deviations collecting product package first side view size allowable deviations collecting product package second side view size allowable deviations forming product package size range feature data Obtaining target image data of a target product, combining the product packaging size range feature data to carry out packaging size verification, and forming packaging verification result data: According to the target image data, target top view image information, target first side view image information and target second side view image information of the target product are respectively extracted; extracting target overhead contour information in the target overhead image information, combining the view direction positioning information and the model appearance reference feature data, determining size deviation of the target overhead contour information after coordinate parameterization relative to two model overhead positioning size groups respectively from the model overhead appearance size feature information, forming a group of target overhead overall size deviation and two groups of target overhead overall size deviation ; extracting target first side view image information in the target first side view image information, combining the view direction positioning information and the model appearance reference feature data, determining the size deviation of the target first side view image information after the coordinate parameterization relative to the two model first side view positioning size groups respectively, and the model first side view appearance size feature information, forming a group of target first side view overall size deviations and two groups of target first side view overall size deviations ; extracting target second side view image information of the target second side view image, combining the view direction positioning information and the model appearance reference feature data, determining the size deviation of the target second side view image information after being respectively coordinate parameterized relative to two model second side view positioning size groups and the model second side view appearance size feature information, forming a group of target second side view overall size deviation and two groups of target second side view overall size deviation ; according to the set of target overhead gross dimension deviations , the second set of target overhead gross dimension deviations , the set of target first side gross dimension deviations , the second set of target first side gross dimension deviations , the set of target second side gross dimension deviations , the second set of target second side gross dimension deviations , the product package overhead dimension allowance , the product package first side dimension allowance , and the product package second side dimension allowance , performing the following package dimension check analysis: If the following are simultaneously satisfied: ≤ , ≤ , ≤ , ≤ , ≤ , ≤ , then a package verification pass information is formed; If the following are not simultaneously satisfied: ≤ 、 ≤ 、 ≤ 、 ≤ 、 ≤ 、 ≤ , then the overall dimensional deviation that is not satisfied is flagged and output.

2. The packaging method according to claim 1, characterized in that, According to the perspective direction positioning information, and combining the model perspective direction image data, the appearance reference size is extracted, and the model appearance reference feature data is formed, including: The intersection of any two of the model top-view dimension boundary lines in the model top-view positioning dimension group is taken as the origin to establish a model top-view coordinate system, and the model top-view profile is parameterized according to the model top-view coordinate system to form model top-view appearance dimension feature information; The intersection of any two of the model first-side-view dimension boundary lines in the model first-side-view positioning dimension group is taken as the origin to establish a model first-side-view coordinate system, and the model first-side-view profile is parameterized according to the model first-side-view coordinate system to form model first-side-view appearance dimension feature information; The intersection of any two of the model second-side-view dimension boundary lines in the model second-side-view positioning dimension group is taken as the origin to establish a model second-side-view coordinate system, and the model second-side-view profile is parameterized according to the model second-side-view coordinate system to form model second-side-view appearance dimension feature information; The model top-view appearance dimension feature information, the model first-side-view appearance dimension feature information, and the model second-side-view appearance dimension feature information are collected to form the model appearance reference feature data.

3. A semiconductor chip package structure, comprising: The semiconductor chip packaging structure is packaged by using the packaging method in claim 1, and the packaging structure comprises a resin packaging body, a solder wire, a first lead base, a second lead base, a tin paste, a chip, a ceramic copper layer, and a ceramic sheet; one side of the ceramic copper layer is attached to the ceramic sheet, and the other side is attached to the chip through the tin paste; the side of the chip away from the ceramic copper layer is connected to the first lead base and the second lead base through the tin paste; the first lead base and the second lead base are electrically connected through the solder wire; the solder wire, the first lead base, the second lead base, the tin paste, the chip, the ceramic copper layer, and the ceramic sheet are arranged in the resin packaging body; the pins of the first lead base and the pins of the second lead base are arranged on the two sides of the resin packaging body, and the pins of the first lead base and the pins of the second lead base both extend out of the resin packaging body; a heat dissipation opening is formed on the side of the resin packaging body close to the ceramic sheet, and the heat dissipation opening exposes the side of the ceramic sheet away from the ceramic copper layer.

4. The heat dissipation method applied to the semiconductor chip package structure of claim 3, wherein, The heat of the first lead base and the second lead base is transferred to the ceramic sheet through the tin paste between the chips and the ceramic copper layer, and is dissipated on the ceramic sheet; part of the heat transferred to the ceramic sheet is dissipated through the resin packaging body, and the other part is dissipated by contacting with air through the heat dissipation holes formed on the resin packaging body; the heat dissipated through the heat dissipation holes on the resin packaging body is greater than the heat dissipated through the resin packaging body. The ceramic copper layer disperses and transfers heat to the ceramic sheet.

5. The heat dissipation method according to claim 4, wherein, ​

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