Link-optimized high-throughput satellite transponder layout method and high-throughput satellite transponder

Abstract

The invention provides a high-throughput satellite transponder layout method for link optimization. A feed source array of a multi-beam antenna is arranged on the east side or the west side of a satellite and is close to an opposite floor; a plurality of low-noise amplifiers and front-end waveguide switch assemblies are arranged in a first quadrant and a second quadrant of the inner surface of the ground plate in a partitioned mode to form independent backup rings; a heat expansion plate with an aluminum honeycomb interlayer is arranged between the bottom surface of the low-noise amplifier and the ground facing plate, and a U-shaped heat pipe is pre-buried in the heat expansion plate; the heat expansion plate is connected with the inner surface of the load cabin south plate or the load cabin north plate through the externally-attached heat pipe, so that heat is conducted to the load cabin south plate or the load cabin north plate from the heat expansion plate through the externally-attached heat pipe for radiation and heat dissipation. The invention also provides a high-throughput satellite transponder. Therefore, the method has the technical effects of flexibility, reliability, light weight cost of a thermal control scheme, low link loss and high space utilization rate.

Description

Technical Field

[0001] The present invention relates to the technical field of spacecraft, and particularly to a layout method for a high-throughput satellite transponder with optimized links and a high-throughput satellite transponder. Background Art

[0002] With the continuous development of technologies in the field of space communication, high-throughput payload satellites, with their superior performance, high-efficiency frequency reuse technology, and excellent communication capacity, are increasingly occupying a larger proportion in GEO communication satellites and playing an important role in the application of space technology.

[0003] A high-throughput satellite consists of a special feed array and a multi-channel transponder link structure. The main principle is as follows:

[0004] Multiple feeds form a feed array, which is installed on the satellite through an overall support structure. Each feed is connected to N input channels of the transponder, successively including a preselector, a waveguide switch, a low-noise amplifier, and subsequent branching equipment. To reduce losses, minimize the noise figure of the input section, improve the satellite G / T value, and enhance the performance of the satellite receiving section, the following requirements are generally put forward for the layout of satellite payloads: First, the section from the feed to the preselector, waveguide switch, and low-noise amplifier is connected using aluminum alloy waveguides, and the overall length is required to be as short as possible to reduce waveguide path loss. Second, the operating temperature of the low-noise amplifier unit itself has a great impact on the satellite G / T value, and it is necessary to control the upper limit of the operating temperature of the low-noise amplifier unit to reduce the noise of the equipment and enhance the system performance.

[0005] In the existing patent "A Layout of High-Throughput Satellite Transponder Equipment" (CN201910955527.2), a method for reducing link loss is proposed. This method sets up a small cabin on the satellite facing the ground. The feed array is arranged facing the ground. The small cabin forms a semi-closed space through several structural cabin plates, and the switch components and low-noise amplifiers are arranged inside the small cabin. This method first arranges the feeds and various components of the transponder facing the ground, occupying the most important surface payload layout space of the satellite body. Second, to ensure that the space radiation environment of each waveguide switch component and low-noise amplifier component meets the equipment usage requirements, a separate small cabin is set up, which requires additional structural cabin plates. Therefore, the satellite needs to pay a higher cost in terms of useless weight. Therefore, the design method of this method has many limitations and is not optimized.

[0006] In the existing patent "A Satellite Payload Compartment Expansion Configuration Adapted to High-Throughput Payloads" (CN202211258362.1), a method for reducing link loss is proposed. This method provides structural support for the multi-beam antenna feed by adding a complete expansion compartment to the ground. The compartment provides sufficient layout space for input-section repeater devices such as preselectors, waveguide switches, and low-noise amplifiers, solving the layout problem of ultra-large-scale multi-beam antennas and high-throughput payloads. However, the heat dissipation method of the low-noise amplifier in this method is less efficient, resulting in a relatively high operating temperature of the single unit, which has a certain impact on the payload performance indicators. Moreover, this method adopts an expansion compartment configuration design scheme, which has a certain weight penalty.

[0007] In summary, it is obvious that there are inconveniences and defects in the existing technology in actual use, so it is necessary to improve it. Summary of the Invention

[0008] The purpose of the present invention is to provide a layout method for a link-optimized high-throughput satellite repeater and a high-throughput satellite repeater that are flexible, reliable, have a low weight penalty, low link loss, high space utilization, and good heat dissipation performance.

[0009] To achieve the above purpose, on the one hand, the present invention provides a layout method for a link-optimized high-throughput satellite repeater, including the steps of:

[0010] Layout the feed array of the multi-beam antenna at a position close to the floor on the east or west side of the satellite;

[0011] Layout several low-noise amplifiers and front-end waveguide switch components in the first and second quadrants of the inner surface of the floor to form an independent backup loop;

[0012] Set a heat spreader with an aluminum honeycomb sandwich between the bottom surface of the low-noise amplifier and the floor, and pre-embed a U-shaped heat pipe in the heat spreader;

[0013] Connect the heat spreader to the inner surface of the south plate or north plate of the payload compartment through an externally attached heat pipe, so as to realize the heat conduction from the heat spreader to the south plate or north plate of the payload compartment through the externally attached heat pipe for radiation heat dissipation.

[0014] Optionally, the waveguide switch component is arranged at the front end of the inlet of the low-noise amplifier, and the total waveguide length corresponding to a single repeater channel does not exceed 1 m.

[0015] Optionally, a polyimide heat insulation gasket with a thickness of 3 mm is provided between the heat spreader and the floor.

[0016] Optionally, the externally attached heat pipe is fixedly connected to the heat spreader and the south plate of the payload compartment through heat-conducting grease and screws.

[0017] Optionally, the heat spreader is a sandwich structure of an aluminum skin and an aluminum honeycomb core with the U-shaped heat pipe embedded therein, having a thickness of 12.6 mm, the thickness of the inner and outer aluminum skins being 0.3 mm each, and the height of the honeycomb core of the sandwich structure and the U-shaped heat pipe being 12 mm each.

[0018] Optionally, one side of the U-shaped heat pipe is close to the bottom of the heat dissipation base of the low-noise amplifier, and the other side is coupled to the externally attached heat pipe.

[0019] On the other hand, the present invention also provides a high-throughput satellite transponder, which is manufactured based on the high-throughput satellite transponder layout method with link optimization as described in any one of the above.

[0020] The high-throughput satellite transponder layout method with link optimization according to the present invention arranges the feed array of the multi-beam antenna at a position close to the nadir plane on the east or west side of the satellite; partitions and arranges several low-noise amplifiers and front-end waveguide switch components in the first quadrant and the second quadrant of the inner surface of the nadir plane to form an independent backup loop; arranges a heat spreader with an aluminum honeycomb sandwich between the bottom surface of the low-noise amplifier and the nadir plane, and the U-shaped heat pipe is embedded in the heat spreader; connects the heat spreader to the inner surface of the south or north panel of the payload compartment through an externally attached heat pipe, so as to realize the heat conduction from the heat spreader to the south or north panel of the payload compartment through the externally attached heat pipe for radiation heat dissipation. Thus, the present invention has the technical effects of being flexible and reliable, having a light weight cost for the thermal control solution, low link loss, and high space utilization rate. Description of the Drawings

[0021] Figure 1 It is a flowchart of the steps of the high-throughput satellite transponder layout method with link optimization provided by an embodiment of the present invention;

[0022] Figure 2 It is a schematic structural diagram of a feed tower and an input section waveguide using the high-throughput satellite transponder layout method with link optimization provided by an embodiment of the present invention;

[0023] Figure 3 It is a schematic structural diagram of an input section waveguide, a waveguide switch component, a low-noise amplifier, and a thermal control layout using the high-throughput satellite transponder layout method with link optimization provided by an embodiment of the present invention;

[0024] Figure 4 It is a schematic diagram of the positional relationship between the low-noise amplifier, the heat spreader, the externally attached heat pipe, and each cabin panel using the high-throughput satellite transponder layout method with link optimization provided by an embodiment of the present invention;

[0025] Figure 5 It is a schematic structural diagram of the U-shaped heat pipe embedded in the heat spreader using the high-throughput satellite transponder layout method with link optimization provided by an embodiment of the present invention. Detailed implementation manners

[0026] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0027] It should be noted that the references in this specification to "one embodiment", "embodiment", "example embodiment", etc. mean that the described embodiment may include specific features, structures or characteristics, but not every embodiment must include these specific features, structures or characteristics. In addition, such expressions do not refer to the same embodiment. Further, when combining an embodiment to describe specific features, structures or characteristics, whether or not there is an explicit description, it has been shown that it is within the knowledge of those skilled in the art to combine such features, structures or characteristics into other embodiments.

[0028] In addition, in the specification and subsequent claims, certain terms are used to refer to specific components or parts. Those of ordinary skill in the art should understand that manufacturers may use different nouns or terms to refer to the same component or part. The specification and subsequent claims do not use the difference in name as a way to distinguish components or parts, but use the difference in function of components or parts as the criterion for distinction. The terms "comprising" and "including" mentioned throughout the specification and subsequent claims are open-ended terms, so they should be interpreted as "including but not limited to". In addition, the term "connected" herein includes any direct and indirect electrical connection means. Indirect electrical connection means include connection through other devices.

[0029] Figure 1 A high-throughput satellite transponder layout method for link optimization provided by an embodiment of the present invention is shown, specifically including the following steps:

[0030] S101: Layout the feed array of the multi-beam antenna at a position close to the floor on the east or west side of the satellite. By centrally arranging the feed array of the multi-beam antenna at a position close to the earth-facing cabin floor on the east or west side of the satellite, the physical distance from the feed to the equipment in the input section of the transponder is shortened.

[0031] The payload cabin of a typical high-throughput satellite is a π-shaped structure. The multi-beam antenna in the conventional configuration is on the east and west sides. The feed tower is composed of multiple feed horns of the multi-beam payload and the corresponding support structures. Layout the feed array at a position close to the ground on the east and west sides, and determine the number of layout areas of the low-noise amplifier according to the number and scale of the low-noise amplifiers connected to the feed array.

[0032] See Figure 2, in this embodiment, a certain high-throughput satellite multi-beam antenna is taken as an example for illustration. A total of 22 feed horns 4 are installed in the feed array 4, which are arranged at the position of the satellite east wall panel 2 close to the floor 1, and 22 transponder channels are connected to 15 low-noise amplifiers; the present invention does not limit the number of feed horns, low-noise amplifiers and transponder channels in the feed array.

[0033] S102: Partition and layout several low-noise amplifiers and front-end waveguide switch components in the first quadrant and the second quadrant on the inner surface of the floor to form an independent backup loop. Considering the design scale of the satellite payload compartment, in this embodiment, 15 low-noise amplifiers and front-end waveguide switch components are designed into two independent backup loops, which are respectively arranged in the first quadrant and the second quadrant on the inner surface of the floor. Specifically, the first quadrant is the northeast quadrant, and the second quadrant is the southeast quadrant; in this embodiment, 8 and 7 low-noise amplifiers are specifically arranged in the northeast quadrant and the southeast quadrant respectively. Figure 3 The layout state of the transponder channels corresponding to 8 low-noise amplifiers is shown. The waveguide switch component 7 is arranged at the front end of the inlet of the low-noise amplifier 8, and the total waveguide length corresponding to a single transponder channel does not exceed 1 m; specifically, the corresponding waveguide switch component 7 is arranged at the front end of the inlet of the corresponding low-noise amplifier 8 according to the transponder link channel, thereby reducing the waveguide 5 path length between the antenna feed and the low-noise amplifier, so that the total waveguide length layout design corresponding to a single transponder channel does not exceed 1 m, reducing the link loss.

[0034] According to the feed scale, the low-noise amplifiers and waveguide switch components are divided into multiple independent backup loops (such as 8 and 7 are arranged in the northeast and southeast quadrants respectively), forming modular functional units. This partition design not only compresses the total waveguide length (single channel ≤ 1 m), but also improves the system fault tolerance through the backup loop.

[0035] S103: Set a heat dissipation plate with an aluminum honeycomb sandwich between the bottom surface of the low-noise amplifier and the floor, and pre-buried U-shaped heat pipes in the heat dissipation plate. See Figure 3 , in order to ensure that the low-noise amplifier 8 works in a suitable working temperature range, a heat dissipation plate 9 is added between the bottom surface of the low-noise amplifier 8 and the floor 1. The low-noise amplifiers 8 are all installed on the heat dissipation plate 9, and U-shaped heat pipes 12 are also pre-buried in the heat dissipation plate 9. The direction of the U-shaped heat pipes 12 is consistent with the arrangement direction of the low-noise amplifiers 8, further leveling the temperature levels of the low-noise amplifiers 8.

[0036] In a specific embodiment, the heat spreader 9 is preferably a sandwich structure of an aluminum skin and an aluminum honeycomb core with embedded U-shaped heat pipes, having a thickness of 12.6 mm. The thickness of the inner and outer aluminum skins is 0.3 mm each, and the height of the honeycomb core and the U-shaped heat pipes in the sandwich structure is 12 mm. That is, the heat spreader 9 adopts the commonly used 12.6-mm-thick aluminum skin + aluminum honeycomb core structure, with the upper and lower skins of the heat spreader 9 having a thickness of 0.3 mm each, the honeycomb core having a height of 12 mm, and the overall thickness of the plate being 12.6 mm.

[0037] A polyimide heat insulation gasket with a thickness of 3 mm is provided between the heat spreader 9 of this embodiment and the counter floor 1; that is, the heat spreader 9 is installed on the satellite counter floor 1, and a 3-mm polyimide heat insulation gasket is provided between the heat spreader 9 and the counter floor 1 to prevent the temperature of the counter floor cabin panel from rising under sunlight and thus conducting heat to the heat spreader.

[0038] S104: Connect the heat spreader to the inner surface of the south panel or the north panel of the payload cabin through externally attached heat pipes to achieve heat radiation from the heat spreader to the south panel or the north panel of the payload cabin through the externally attached heat pipes. See Figure 4 , this embodiment also provides an externally attached heat pipe 10. The externally attached heat pipe 10 specifically includes two connecting parts. One connecting part is used for thermally conductive connection with the heat spreader, and the other connecting part is connected to the inner surface of the south panel 11 of the payload cabin, so that the heat generated on the heat spreader 9 is conducted to the externally attached heat pipe 10 and then conducted to the south panel 11 of the payload cabin, and the heat is radiated into outer space through the south panel 11 of the payload cabin. This embodiment only takes the south panel of the payload cabin as the radiation surface as an example. In other examples, the north panel of the payload cabin can also be used as the radiation surface for heat dissipation.

[0039] Furthermore, the externally attached heat pipe 10 is fixedly connected to the heat spreader 9 and the south panel 11 of the payload cabin through thermal grease and screws. Specifically, the externally attached heat pipe 10 is installed on the surface of the heat spreader 9 through connecting screws, and the other side of the externally attached heat pipe 10 is connected to the inner surface of the south panel 11 of the payload cabin through screws; moreover, thermal grease is evenly applied between the externally attached heat pipe 10 and the heat spreader 9 and between the externally attached heat pipe 10 and the inner surface of the south panel 11 of the payload cabin, and screws are used for installation and fastening, so as to realize the heat of the low-noise amplifier 8 being transferred to the inner surface of the south panel 11 of the payload cabin through the heat spreader 9 and the externally attached heat pipe 10, and finally radiating heat into outer space through the outer surface of the south panel 11 of the payload cabin.

[0040] The externally attached heat pipe 10 of this embodiment is in an L-shaped structure. Of course, in other examples, the specific structure of the externally attached heat pipe 10 can be configured according to the application environment to ensure thermally conductive connection with the heat spreader 9 on one side and connection to the inner surface of the south panel 11 of the payload cabin on the other side; this embodiment does not limit the specific configuration of the externally attached heat pipe 10.

[0041] Figure 5The U-shaped heat pipe 12 adopted in this embodiment is shown; specifically, one side of the U-shaped heat pipe 12 is close to the bottom of the heat dissipation base of the low-noise amplifier 8, and the other side is coupled to the external heat pipe 10. That is, one side of the U-shaped heat pipe 12 embedded inside the heat dissipation plate 9 is close to the heat dissipation part of the low-noise amplifier 8, and the other side is coupled to the external heat pipe 10. The coupling mentioned here means that one side of the U-shaped heat pipe 12 is in an up-and-down position coupling state with the external heat pipe 10, so that the heat on the U-shaped heat pipe 12 can be conducted to the external heat pipe 10, thereby realizing the radiation heat dissipation of the low-noise amplifier to the heat dissipation plate 9 of the low-noise amplifier 8, and being conducted to the external heat pipe 10 through the U-shaped heat pipe 12, and then being conducted to the south plate 11 of the payload compartment for radiation heat dissipation. With such a layout design, the heat dissipation means of the low-noise amplifier 8 in this embodiment is clear and effective, the weight cost of the heat dissipation measures is relatively low, and it is easy to implement in engineering.

[0042] In another embodiment, the present invention also provides a high-throughput satellite transponder, and the high-throughput satellite transponder is manufactured based on the high-throughput satellite transponder layout method with link optimization as described in the above embodiment. The structural features of the high-throughput satellite transponder provided in this embodiment are the same as those described in the above embodiment, and will not be elaborated here.

[0043] In summary, compared with the prior art, the present invention has a short channel waveguide path, low weight, and low link loss from the antenna feed to the low-noise amplifier. From the feed through the preselector, waveguide switch to the low-noise amplifier, the total waveguide length corresponding to a single transponder channel does not exceed 1 m, effectively reducing the waveguide weight, thereby reducing the link loss; the working temperature of the low-noise amplifier is more suitable. The low-noise amplifier is arranged inside the payload compartment, and the temperature radiation environment it receives is better. At the same time, economic and reasonable heat dissipation means are used, effectively reducing the upper limit of the working temperature of the low-noise amplifier, reducing the system noise, and improving the system performance; the weight cost of the thermal control scheme is low. Only the heat dissipation plate and the external heat pipe are used to realize the on-satellite layout and heat dissipation of the low-noise amplifier; the space utilization efficiency is high. The feed tower of this scheme is arranged outside the east and west plates, and the single units of the transponder, preselector, waveguide switch, and low-noise amplifier are all arranged on the inner surface of the opposite floor, saving the layout space of the satellite payload compartment facing the ground, and leaving necessary layout space for other important payloads such as antennas, phased arrays, and lasers. On the other hand, only the external heat pipe occupies a small part of the north and south plates, and the rest of the single units are arranged on the inner surface of the opposite floor. The north and south plates of the payload compartment occupy very little space, and layout space can be left for important single units such as the receiver and traveling wave tube amplifier of the transponder subsystem.

[0044] Of course, the present invention can also have many other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding changes and deformations should all fall within the protection scope of the appended claims of the present invention.

Claims

1. A link-optimized high-throughput satellite transponder layout method, characterized in that: Includes steps: Place the feed array of the multi-beam antenna on the east or west side of the satellite close to the ground plane; A plurality of low noise amplifiers and front-end waveguide switch components are arranged in the first quadrant and the second quadrant of the inner surface of the floor to form an independent backup loop; A heat expansion plate with an aluminum honeycomb sandwich is provided between the bottom surface of the low noise amplifier and the counter-floor, and a U-shaped heat pipe is embedded in the heat expansion plate; The heat expansion plate is connected to the inner surface of the south plate or the north plate of the load compartment through an external heat pipe, so that heat is conducted from the heat expansion plate to the south plate or the north plate of the load compartment through the external heat pipe for radiant heat dissipation.

2. The link-optimized high-throughput satellite transponder layout method according to claim 1, characterized in that: The waveguide switch component is arranged at the front end of the entrance of the low noise amplifier, and the total length of the waveguide corresponding to a single repeater channel does not exceed 1m.

3. The link-optimized high-throughput satellite transponder layout method according to claim 1, characterized in that: A polyimide heat-insulating gasket with a thickness of 3 mm is arranged between the heat-expanding plate and the counter-floor plate.

4. The link-optimized high-throughput satellite transponder layout method according to claim 1, characterized in that: The external heat pipe is fastened to the heat expansion plate and the south plate of the load compartment by means of thermal grease and screws.

5. The link-optimized high-throughput satellite transponder layout method according to claim 1, characterized in that: The heat expansion plate is a sandwich structure of aluminum skin and aluminum honeycomb core with the U-shaped heat pipe pre-embedded, with a thickness of 12.6 mm. The thickness of the inner and outer aluminum skins is 0.3 mm. The height of the honeycomb core of the sandwich structure and the U-shaped heat pipe is 12 mm.

6. The link-optimized high-throughput satellite transponder layout method according to claim 1, characterized in that: One side of the U-shaped heat pipe is close to the bottom of the heat dissipation base of the low noise amplifier, and the other side is coupled to the external heat pipe.

7. A high-throughput satellite transponder, characterized in that: The high-throughput satellite transponder is manufactured based on the link-optimized high-throughput satellite transponder layout method according to any one of claims 1 to 6.

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