Head-mounted device

Abstract

The invention provides head-mounted equipment. The head-mounted equipment comprises a shell, a heating device, a cooling fan and an external refrigerating and cooling device, the heat dissipation fan is arranged in the shell, the heating device is arranged in the shell and corresponds to the heat dissipation fan, the heat dissipation fan is used for carrying out air cooling heat dissipation on the heating device, and the external refrigeration heat dissipation device can be detachably connected with the shell in an attached mode, so that heat dissipation of the head-mounted equipment is achieved. According to the head-mounted equipment provided by the embodiment of the invention, the heat dissipation structure combining the heat dissipation fan and the external refrigeration heat dissipation device is utilized, the heat dissipation fan is utilized to dissipate heat under the condition of medium and low power consumption, and the external refrigeration heat dissipation device is utilized to quickly dissipate heat under the condition of high power consumption; the structure of the head-mounted device can be simplified (the host can be provided with a single small fan), the size and the weight of the head-mounted device are reduced, and then the user experience is improved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation of head-mounted devices, and specifically relates to a head-mounted device. Background Art

[0002] Extended Reality (XR) is a term used to describe an environment or interactive behavior that combines virtual and real elements. It includes AR (Augmented Reality), VR (Virtual Reality), and MR (Mixed Reality) technologies, which can cross the virtual world and the real world and are one of the technical approaches to realizing the metaverse. In terms of hardware, it also includes head-mounted displays, hand-held devices, foot-mounted devices, and full-body experience device parts, etc. Among them, the head circumference adjustment mechanism is usually in the rear shell assembly of the head-mounted display device and is used to elongate or shorten the head circumference sizes of various users, so as to achieve comfortable wearing.

[0003] All-in-one machines such as XR, AR, and MR are head-mounted intelligent devices that highly integrate an independent computing system, an optical display system, an audio system, and a perception and interaction system in one space. While gradually developing towards intelligence, they are also developing towards being thinner, lighter, higher-performance, and more multifunctional. As the performance becomes more and more powerful and the integration degree and assembly density continue to increase, the working power consumption and heat generation increase. Specifically, it includes: 1. Higher frequencies and performance: to achieve smooth and timely images; 2. Larger and clearer optical displays: the optical and display components are involved in image processing and transmission, and as the FOV (Field of View) and image clarity continue to increase, the heat generation is large; 3. Perception and interaction solution design: VR / AR / MR devices require more integrated voice interaction, sound field design, gesture interaction, face recognition, see-through, 6DoF, etc. The heat dissipation problem has become one of the pain points in the overall design of VR / AR / MR. If the heat cannot be dissipated in time, it will cause the temperatures of the GPU, sensors, display screens, and chips to be too high, resulting in the phenomenon of game scene trailing in the system and reducing the experience; at the same time, VR / AR / MR are devices worn on the face and eyes, and if the heat dissipation performance is not good, it will also affect the user's wearing experience.

[0004] Currently, the more common heat dissipation methods adopted by the above-mentioned head-mounted devices are a combination of active air-cooling (fan) and passive (heat pipe) heat dissipation. When the power consumption is large, dual fans are required. The existing heat dissipation methods have many disadvantages: 1. When the power consumption is large, dual fans are usually required, resulting in a large occupied structural volume and an increase in weight. 2. When using dual fans, more air inlets and outlets are required, resulting in an increase in structural complexity. 3. When using dual fans, more noise and a larger flow of air are generated, directly affecting the user experience. 4. Making the overall structure of the head-mounted device heavy and large. Summary of the Invention

[0005] An embodiment of the present application provides a head-mounted device, which includes a housing, a heating device, a cooling fan, and an external refrigeration and heat dissipation device; the heating device is arranged in the housing and corresponding to the cooling fan, the cooling fan is used for air-cooling the heating device, and the external refrigeration and heat dissipation device can be detachably and fittingly connected to the housing, so as to realize heat dissipation of the head-mounted device.

[0006] For the head-mounted device provided by the embodiment of the present application, by using a heat dissipation structure combining a cooling fan and an external refrigeration and heat dissipation device, in the case of medium and low power consumption, the cooling fan is used for heat dissipation, and in the case of high power consumption, the external refrigeration and heat dissipation device is used for rapid heat dissipation, which can simplify the structure of the head-mounted device itself (a single fan), reduce the volume and weight of the head-mounted device, and thus improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required to be used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0008] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the head-mounted device of the present application;

[0009] Figure 2 is Figure 1 A partial structure schematic diagram of the head-mounted device in another perspective in the embodiment;

[0010] Figure 3 is Figure 2 A structure schematic diagram of the separation state of the host and the external refrigeration and heat dissipation device in the embodiment;

[0011] Figure 4 is Figure 2 A partial structure split schematic diagram in the embodiment;

[0012] Figure 5 is Figure 2 A structure split schematic diagram of the host in the embodiment;

[0013] Figure 6 It is a structure split schematic diagram of an embodiment of the external refrigeration and heat dissipation device of the present application;

[0014] Figure 7 It is a structure cross-sectional schematic diagram of an embodiment of the external refrigeration and heat dissipation device of the present application;

[0015] Figure 8 is Figure 6 A structure schematic diagram of the heat spreader in the embodiment. Detailed Implementation Modes

[0016] The following will further describe the present application in detail in conjunction with the accompanying drawings and embodiments. It should be specifically noted that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Similarly, the following embodiments are only partial embodiments of the present application rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present application.

[0017] The terms "first", "second", and "third" in the embodiments of the present application are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", and "third" may explicitly or implicitly include at least one of such features. In the description of the present application, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly. The terms "include" and "have" and any variations thereof in the embodiments of the present application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally further include unlisted steps or units, or may optionally further include other steps or components inherent to these processes, methods, products, or devices.

[0018] Referring to "embodiments" herein means that specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The phrase appears at various positions in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0019] As used herein, an "electronic device" (or a head-mounted device) includes, but is not limited to, a device configured to receive / transmit communication signals via a wired connection (such as via a Public Switched Telephone Network (PSTN), Digital Subscriber Line (DSL), digital cable, direct cable connection, and / or another data connection / network) and / or via a wireless interface (such as for a cellular network, Wireless Local Area Network (WLAN), digital television network such as DVB-H network, satellite network, AM-FM broadcast transmitter, and / or another communication terminal). A communication terminal configured to communicate via a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular phones; Personal Communication System (PCS) terminals that can combine cellular radiotelephone with data processing, facsimile, and data communication capabilities; PDAs that may include a radiotelephone, pager, Internet / intranet access, web browser, notepad, calendar, and / or Global Positioning System (GPS) receiver; and conventional laptop and / or palmtop receivers or other electronic devices including radiotelephone transceivers. Smart devices such as mobile phones, AR, VR, XR, MR, etc. are all electronic devices configured with cellular communication modules.

[0020] Please refer to Figure 1 and Figure 2 , Figure 1 which is a schematic diagram of the overall structure of an embodiment of the head-mounted device of the present application. Figure 2 is Figure 1 a schematic diagram of a partial structure of another perspective of the head-mounted device in the embodiment. It should be noted that the head-mounted device in the present application may include head-mounted display devices such as AR (Augmented Reality), VR (Virtual Reality), MR (Mixed Reality), etc. The head-mounted device 10 may include a headband device 100, a host 200, and an external refrigeration and heat dissipation device 300.

[0021] Specifically, the headband device 100 is used to fix the host 200 to the user's head. The detailed features of this part are within the understanding of those skilled in the art and will not be elaborated here. The host 200 may include a display screen, lenses, a housing, a control chip, etc., for realizing the display of images. The specific structure will not be introduced here. In the embodiment of the present application, only the components related to the heat dissipation structure of the host 200 will be described in detail.

[0022] Please refer to Figures 3 to 5 , Figure 3 is Figure 2 a schematic diagram of the separated state of the host and the external refrigeration and heat dissipation device in the embodiment. Figure 4 is Figure 2 a schematic diagram of a partial structure split in the embodiment. Figure 5 is Figure 2Schematic diagram of the structural disassembly of the host in the embodiment. Among them, the host 200 in this embodiment may include a housing 210, a heating device 220, and a cooling fan 250.

[0023] Optionally, the heating device 220 is disposed inside the housing 210 and is arranged corresponding to the cooling fan 250. Among them, the heating device 220 may be a control circuit board provided with a chip or a device such as an optical engine. The cooling fan 250 is used for air-cooling the heating device 220, and an air outlet 211 of the cooling fan 250 is provided on the housing 210. The external refrigeration and heat dissipation device 300 can be detachably and adhesively connected to the housing 210, thereby realizing heat dissipation for the head-mounted device. In a scenario where rapid heat dissipation is required, the external refrigeration and heat dissipation device 300 can be attached to the housing 210 to dissipate heat from the host 200. When rapid heat dissipation is not required, the external refrigeration and heat dissipation device 300 is removed to reduce the weight of the head-mounted device.

[0024] The head-mounted device provided by the embodiment of the present application utilizes a heat dissipation structure combining a cooling fan and an external refrigeration and heat dissipation device. In the case of medium and low power consumption, the cooling fan is used for heat dissipation. In the case of high power consumption, the external refrigeration and heat dissipation device is used for rapid heat dissipation, which can simplify the structure of the head-mounted device itself (a single fan can be set inside the host), reduce the volume and weight of the head-mounted device, and thus improve the user experience.

[0025] Optionally, please continue to refer to Figure 4 and Figure 5 , the host 200 in this embodiment further includes a heat dissipation plate 230. The heat dissipation plate 230 is attached to the heating device 220. The cooling fan 250 is arranged corresponding to the hot end of the heat dissipation plate 230 and is used for air-cooling the heat dissipation plate 230; a heat conduction medium is provided inside the heat dissipation plate 230. Among them, the heat conduction medium includes any one or a mixture of water, oil, etc., n-eicosane, paraffin wax, and sodium sulfate pentahydrate. The heat conduction medium can undergo a phase change, thereby realizing heat transfer. At least part of the structure of the heat dissipation plate 230 is exposed outside the housing 210, and the external refrigeration and heat dissipation device 300 can be attached to the part of the heat dissipation plate 230 exposed outside the housing 210, thereby realizing rapid heat dissipation for the heat dissipation plate 230.

[0026] Optionally, please continue to refer to Figure 4 and Figure 5 , the head-mounted device in this embodiment further includes a first magnetic member 240. The first magnetic member 240 is embedded on the surface of the housing 210 and is used for attracting and aligning with the external refrigeration and heat dissipation device 300. Among them, the first magnetic member 240 can be in a ring structure and is arranged around the circumference of the part of the heat dissipation plate 230 exposed outside the housing 210. The first magnetic member 240 can be a permanent magnet.

[0027] The head-mounted device provided by the embodiment of the present application uses a heat dissipation structure that combines an energy storage heat dissipation plate, a heat dissipation fan, and an external refrigeration heat dissipation device. In the case of medium and low power consumption, the energy storage heat dissipation plate is used in combination with the heat dissipation fan for heat dissipation. In the case of high power consumption, the external refrigeration heat dissipation device is used for rapid heat dissipation, thereby greatly improving the user experience.

[0028] Optionally, please refer to Figure 6 , Figure 6 FIG. is a schematic diagram of the structural disassembly of an embodiment of the external refrigeration heat dissipation device of the present application. Among them, the external refrigeration heat dissipation device 300 includes a housing 310, a cooler 320, and a suction connection member 330; the housing 310 may include a first housing 311 and a second housing 312, and the first housing 311 and the second housing 312 cooperate to form a receiving cavity. The cooler 320 is disposed in the receiving cavity of the housing 310. The cooler 320 may be a semiconductor cooler and can achieve refrigeration in the energized state.

[0029] Among them, the suction connection member 330 can be suction-connected in alignment with the first magnetic member 240, and the external refrigeration heat dissipation device 300 can be detachably connected to the outer shell 210 ( Figure 2 in the state) and is attached to the part of the heat dissipation plate 230 exposed from the outer shell 210. Among them, the cooler 320 includes a cold source end and a heat source end. In the state where the external refrigeration heat dissipation device 300 is attached to the heat dissipation plate 230, the cold source end is located on the side close to the heat dissipation plate 230 for quickly dissipating heat from the heat dissipation plate 230.

[0030] Optionally, please refer to Figure 6 and Figure 7 , Figure 7 FIG. is a schematic cross-sectional view of the structure of an embodiment of the external refrigeration heat dissipation device of the present application. The external refrigeration heat dissipation device 300 in this embodiment further includes a heat conduction member 340 and a heat dissipation assembly 350. One side of the heat conduction member 340 is connected to the cold source end of the cooler 320, and the other side is exposed from the second housing 312. In the state where the external refrigeration heat dissipation device 300 is connected to the outer shell 210, the side of the heat conduction member 340 facing away from the cold source end is in contact connection with the heat dissipation plate 230.

[0031] Among them, the heat dissipation assembly 350 is disposed on the side of the heat source end of the cooler 320 for dissipating heat from the heat source end of the cooler 320. Among them, the heat dissipation assembly 350 in this embodiment includes a fan 351 and a heat spreader 352. Please refer to Figure 8 , Figure 8 FIG. is Figure 6Schematic structural diagram of the heat pipe in the embodiments. One side of the heat pipe 352 is attached to the heat source end of the cooler 320. The heat at the heat source end of the cooler 320 is transferred to the heat pipe 352. A groove 3521 is provided on the other side of the heat pipe 352. The fan 351 is disposed in the groove 3521. The air inlet direction of the fan 351 corresponds to the air inlet hole on the first housing 311, and the air outlet direction of the fan 351 corresponds to the heat source end of the cooler 320. The fan 351 is used to dissipate heat from the heat pipe 352. Optionally, the heat pipe 352 is further provided with a plurality of heat dissipation channels 3522 communicating with the groove 3521. On the one hand, the heat dissipation channels 3522 can increase the heat dissipation surface area of the heat pipe 352, and on the other hand, they can increase the air flow area for the fan 351, thereby improving the heat dissipation efficiency.

[0032] For the head-mounted device in the embodiments of the present application, when the temperature is relatively low, the external refrigeration and heat dissipation device is removed, and heat dissipation is carried out by relying on the heat dissipation fan and the heat dissipation plate; through the above structure, air-cooled primary heat dissipation is carried out under medium and low power consumption; under high power consumption, when the temperature of the head-mounted device is too high, the cold source generated by the external refrigeration and heat dissipation device is connected, and the low temperature is conducted to the head-mounted device to achieve rapid cooling of the head-mounted device; on the one hand, rapid refrigeration and cooling can be achieved at high temperatures; in addition, a smaller fan can be used on the main body of the head-mounted device, and better improvements can be made in terms of weight and volume, etc., and a better user experience can be obtained.

[0033] The above are only some embodiments of the present application, and thus do not limit the protection scope of the present application. Any equivalent device or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be similarly included in the patent protection scope of the present application.

Claims

1. A head-mounted device, characterized in that, the head-mounted device includes a housing, a heating device, a cooling fan, and an external refrigeration and heat dissipation device; the heating device is arranged inside the housing and corresponding to the cooling fan, the cooling fan is used for air-cooling the heating device, and the external refrigeration and heat dissipation device can be detachably and adhesively connected to the housing, so as to realize heat dissipation of the head-mounted device.

2. The head-mounted device according to claim 1, characterized in that, the head-mounted device further includes a heat dissipation plate, the heat dissipation plate is arranged in contact with the heating device, the cooling fan is arranged corresponding to the hot end of the heat dissipation plate and is used for air-cooling the heat dissipation plate; a heat conduction medium is arranged in the heat dissipation plate, at least part of the structure of the heat dissipation plate is exposed outside the housing, and the external refrigeration and heat dissipation device can be attached to the part of the heat dissipation plate exposed outside the housing, so as to realize heat dissipation of the heat dissipation plate.

3. The head-mounted device according to claim 2, characterized in that, the heat conduction medium in the heat dissipation plate includes any one or a mixture of more of water, oil, etc., n-eicosane, paraffin, and sodium sulfate pentahydrate.

4. The head-mounted device according to claim 2, characterized in that, the head-mounted device further includes a first magnetic member, the first magnetic member is embedded on the surface of the housing and is used for attracting and fitting with the external refrigeration and heat dissipation device in alignment.

5. The head-mounted device according to claim 4, characterized in that, the first magnetic member is in a ring structure and is arranged around the circumference of the part of the heat dissipation plate exposed outside the housing.

6. The head-mounted device according to claim 4, characterized in that, the external refrigeration and heat dissipation device includes a housing, a refrigerator, and a suction and connection member, the refrigerator is arranged in the housing, the suction and connection member can be attracted and connected to the first magnetic member in alignment, the external refrigeration and heat dissipation device can be detachably connected to the housing through the suction and connection member and is attached to the part of the heat dissipation plate exposed outside the housing, the refrigerator includes a cold source end and a heat source end, and in the state where the external refrigeration and heat dissipation device is attached to the heat dissipation plate, the cold source end is located on the side close to the heat dissipation plate.

7. The head-mounted device according to claim 6, characterized in that, the external refrigeration and heat dissipation device further includes a heat dissipation component, the heat dissipation component is arranged on one side of the heat source end of the refrigerator and is used for dissipating heat from the heat source end of the refrigerator.

8. The head-mounted device according to claim 7, characterized in that, the heat dissipation component includes a fan, and the air outlet direction of the fan corresponds to the heat source end of the refrigerator.

9. The head-mounted device according to claim 8, characterized in that, the heat dissipation component further includes a heat pipe, one side of the heat pipe is attached to the heat source end of the refrigerator, the other side is provided with a groove, the fan is arranged in the groove, and the heat pipe is further provided with a plurality of heat dissipation channels communicating with the groove.

10. The head-mounted device according to claim 6, characterized in that, the refrigerator is a semiconductor refrigerator.

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