Display panel, manufacturing method of display panel, and electronic device

Abstract

The present application provides a display panel, a manufacturing method of the display panel, and an electronic device. The display panel includes: a substrate; an isolation structure located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; a plurality of light-emitting devices, the light-emitting devices including a first light-emitting device located in a first isolation opening and a second light-emitting device located in a second isolation opening; a plurality of encapsulation units; and a first filling unit, at least a part of the first filling unit is located between a first surface area and a first encapsulation unit. By setting the top of the isolation structure to be lower on the side close to the first isolation opening than on the side close to the second isolation opening, a concave structure is formed. After manufacturing the first light-emitting device and the first encapsulation unit, it is easier to fill the gap between the first encapsulation unit and the top of the isolation structure with the first filling unit, so as to form better support for the first encapsulation unit and reduce the risk of damage to the first encapsulation unit in subsequent manufacturing processes.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and in particular, to a display panel, a manufacturing method of the display panel, and an electronic device. Background Art

[0002] Flat panel display devices based on technologies such as Organic Light Emitting Diode (OLED) and Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, TVs, laptop computers, and desktop computers due to advantages such as high picture quality, power saving, thin body, and wide application range, and have become the mainstream in display devices. In the process of manufacturing traditional display panels, the light-emitting pixel patterning is usually achieved through a Fine Metal Mask (FMM). The FMM technology is mature and has rich mass production experience. However, the FMM technology also has problems such as limited precision, high development cost, and long development cycle. The fine metal maskless technology eliminates the limitations of the traditional OLED process on the display screen size, resolution, and other screen body performances, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, CN118781966A record the relevant content of the fine metal maskless technology for reference.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] One of the purposes of the present application is to provide a display panel, and the display panel includes:

[0005] A substrate;

[0006] An isolation structure on one side of the substrate, the isolation structure enclosing to form a plurality of isolation openings, the isolation openings including adjacent first isolation opening and second isolation opening; a side of the isolation structure between the first isolation opening and the second isolation opening away from the substrate includes a first surface area close to the first isolation opening and a second surface area close to the second isolation opening, and a distance from the first surface area to the substrate is less than a distance from a side of the second surface area away from the substrate to the substrate;

[0007] A plurality of light-emitting devices, the light-emitting devices including a first light-emitting device in the first isolation opening and a second light-emitting device in the second isolation opening;

[0008] Multiple encapsulation units, the encapsulation units including a first encapsulation unit, at least part of the first encapsulation unit being located on a side of the first light-emitting device away from the substrate, and at least another part of the first encapsulation unit being located on a side of the first surface area away from the substrate;

[0009] A first filling unit, at least part of the first filling unit being located between the first surface area and the first encapsulation unit.

[0010] In some possible implementation manners, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode that are sequentially stacked in a direction away from the substrate;

[0011] A positive projection of the first electrode of the first light-emitting device on the substrate is offset from a positive projection of the isolation structure located between the first isolation opening and the second isolation opening on the substrate, a positive projection of the first electrode of the second light-emitting device on the substrate is offset from a positive projection of the first surface area on the substrate, and at least part of a positive projection of the first electrode of the second light-emitting device on the substrate coincides with a positive projection of the second surface area on the substrate.

[0012] In some possible implementation manners, in a direction away from the substrate, a thickness of the first electrode of the first light-emitting device is less than or equal to a thickness of the first electrode of the second light-emitting device.

[0013] In some possible implementation manners, the light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode that are sequentially stacked in a direction away from the substrate;

[0014] At least part of a positive projection of the first electrode of the first light-emitting device on the substrate coincides with at least part of a positive projection of the first surface area on the substrate; at least part of a positive projection of the first electrode of the second light-emitting device on the substrate coincides with at least part of a positive projection of the second surface area on the substrate;

[0015] In a direction away from the substrate, a thickness of the first electrode of the first light-emitting device is less than a thickness of the first electrode of the second light-emitting device.

[0016] In some possible implementation manners, a thickness difference between the first electrode of the first light-emitting device and the first electrode of the second light-emitting device is greater than or equal to 500 angstroms.

[0017] In some possible implementations, the first electrode includes a first sub-layer, a second sub-layer, and a third sub-layer stacked in a direction away from the substrate; the difference between the total thickness of the second sub-layer and the third sub-layer of the first electrode of the first light-emitting device and the total thickness of the second sub-layer and the third sub-layer of the first electrode of the second light-emitting device is greater than or equal to 500 angstroms;

[0018] The materials of the first sub-layer and the third sub-layer include indium tin oxide, and the material of the second sub-layer includes silver.

[0019] In some possible implementations, the isolation opening further includes a third isolation opening adjacent to the second isolation opening;

[0020] On the side of the isolation structure away from the substrate between the second isolation opening and the third isolation opening, there are further a third surface area close to the second isolation opening and a fourth surface area close to the third isolation opening, and the distance from the third surface area to the substrate is less than the distance from the side of the fourth surface area away from the substrate to the substrate;

[0021] The encapsulation unit further includes a second encapsulation unit, at least part of the second encapsulation unit is located on the side of the second light-emitting device away from the substrate, and at least another part of the second encapsulation unit is located on the side of the second surface area away from the substrate;

[0022] The display panel further includes a second filling unit, at least part of the second filling unit is located between the second surface area and the second encapsulation unit;

[0023] The light-emitting device further includes a third light-emitting device located in the third isolation opening;

[0024] The encapsulation unit further includes a third encapsulation unit, at least part of the third encapsulation unit is located on the side of the third light-emitting device away from the substrate.

[0025] In some possible implementations, the orthographic projection of the first electrode of the second light-emitting device on the substrate and the orthographic projection of the third surface area on the substrate at least partially overlap, and the orthographic projection of the first electrode of the third light-emitting device on the substrate and the orthographic projection of the fourth surface area on the substrate at least partially overlap.

[0026] In some possible implementations, in the direction away from the substrate, the thickness of the first electrode of the second light-emitting device is less than the thickness of the first electrode of the third light-emitting device.

[0027] In some possible implementation manners, the orthographic projection of the first electrode of the second light-emitting device on the substrate is offset from the orthographic projection of the isolation structure located between the second isolation opening and the third isolation opening on the substrate. The orthographic projection of the first electrode of the third light-emitting device on the substrate is offset from the orthographic projection of the third surface region on the substrate, and the orthographic projection of the first electrode of the third light-emitting device on the substrate and the orthographic projection of the fourth surface region on the substrate at least partially overlap.

[0028] In some possible implementation manners, one side of the first filling unit away from the substrate is attached to the first encapsulation unit, and one side of the first filling unit close to the substrate is attached to the isolation structure.

[0029] In some possible implementation manners, the material of the first filling unit includes an organic polymer material, a transparent optical adhesive, or a photoresist.

[0030] In some possible implementation manners, in a direction parallel to the substrate, the edge of the orthographic projection of the side of the first encapsulation unit away from the first isolation opening on the substrate is located within the orthographic projection of the first surface region on the substrate;

[0031] There is a gap between the edge of the orthographic projection of the side of the first encapsulation unit away from the first isolation opening on the substrate and the edge of the orthographic projection of the first surface region on the substrate.

[0032] In some possible implementation manners, the isolation opening further includes a third isolation opening adjacent to the first isolation opening; one side of the isolation structure located between the first isolation opening and the third isolation opening away from the substrate includes a fifth surface region close to the first isolation opening and a sixth surface region close to the third isolation opening. The distance from the fifth surface region to the substrate is less than the distance from the side of the sixth surface region away from the substrate to the substrate. At least a part of the first filling unit is located between the fifth surface region and the first encapsulation unit;

[0033] The light-emitting device includes a third light-emitting device located within the third isolation opening;

[0034] The encapsulation unit further includes a third encapsulation unit, and at least a part of the third encapsulation unit is located on the side of the third light-emitting device away from the substrate.

[0035] In some possible implementations, the isolation structure includes a support portion and a shielding portion located on a side of the support portion away from the substrate, and a positive projection of the support portion on the substrate is located within a positive projection of the shielding portion on the substrate; the material of the support portion includes aluminum, and / or the material of the shielding portion includes titanium;

[0036] The isolation structure further includes a receiving portion located between the support portion and the substrate; a positive projection of an end of the receiving portion close to the isolation opening on the substrate is located within a positive projection of an end of the shielding portion close to the isolation opening on the substrate; the material of the receiving portion includes molybdenum.

[0037] In some possible implementations, the display panel further includes:

[0038] A first encapsulation layer located on a side of the encapsulation unit and the isolation structure away from the substrate;

[0039] A second encapsulation layer located on a side of the first encapsulation layer away from the substrate;

[0040] The materials of the encapsulation unit and the second encapsulation layer include inorganic materials; the material of the first encapsulation layer includes an organic material.

[0041] Another object of the present application is to provide a manufacturing method of a display panel, the method including:

[0042] Providing a substrate;

[0043] Forming an isolation structure on one side of the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation openings including adjacent first isolation opening and second isolation opening; a side of the isolation structure away from the substrate includes a first surface area close to the first isolation opening and a second surface area close to the second isolation opening, and a distance from the first surface area to the substrate is less than a distance from a side of the second surface area away from the substrate to the substrate;

[0044] Forming a light-emitting functional layer, a second electrode and a first encapsulation unit corresponding to a first light-emitting device, the first light-emitting device being located within the first isolation opening, at least a part of the first encapsulation unit being located on a side of the first light-emitting device away from the substrate, and at least another part of the first encapsulation unit being located on a side of the first surface area away from the substrate;

[0045] Forming a first filling unit between the first surface area and the first encapsulation unit;

[0046] Forming a second light-emitting device by means of etching after full-layer evaporation deposition.

[0047] In some possible implementation manners, before the step of forming the isolation structure on one side of the substrate, the method further includes:

[0048] forming a first electrode of the first light-emitting device and the second light-emitting device on one side of the substrate;

[0049] Wherein, after forming the isolation structure, a positive projection of the first electrode of the first light-emitting device on the substrate is offset from a positive projection of the isolation structure between the first isolation opening and the second isolation opening on the substrate, a positive projection of the first electrode of the second light-emitting device on the substrate is offset from a positive projection of the first surface area on the substrate, and at least a part of the positive projection of the first electrode of the second light-emitting device on the substrate coincides with a positive projection of the second surface area on the substrate.

[0050] In some possible implementation manners, before the step of forming the isolation structure on one side of the substrate, the method further includes:

[0051] forming a first electrode of the first light-emitting device and the second light-emitting device on one side of the substrate, and in a direction away from the substrate, a thickness of the first electrode of the first light-emitting device is less than a thickness of the first electrode of the second light-emitting device;

[0052] Wherein, after forming the isolation structure, at least a part of the positive projection of the first electrode of the first light-emitting device on the substrate coincides with a positive projection of the first surface area on the substrate; at least a part of the positive projection of the first electrode of the second light-emitting device on the substrate coincides with a positive projection of the second surface area on the substrate.

[0053] Another object of the present application is to provide an electronic device, the electronic device includes the display panel provided by the present application, or the electronic device includes a display panel manufactured by the manufacturing method of the display panel provided by the present application.

[0054] Compared with the prior art, the present application has the following beneficial effects:

[0055] The present application provides a display panel, a manufacturing method of the display panel and an electronic device. By setting the top of the isolation structure to be lower on the side close to the first isolation opening than on the side close to the second isolation opening, a concave structure is formed. After manufacturing the first light-emitting device and the first encapsulation unit, it is easier to fill the gap between the first encapsulation unit and the top of the isolation structure with the first filling unit, so as to form better support for the first encapsulation unit and reduce the risk of damage to the first encapsulation unit in subsequent processes. Description of the Drawings

[0056] To more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0057] Figure 1 Schematic diagram of the structure of a display panel of the prior art;

[0058] Figure 2 One of the cross-sectional schematic diagrams of the display panel provided in this embodiment;

[0059] Figure 3 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0060] Figure 4 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0061] Figure 5 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0062] Figure 6 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0063] Figure 7 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0064] Figure 8 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0065] Figure 9 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0066] Figure 10 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0067] Figure 11 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0068] Figure 12 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0069] Figure 13 Another cross-sectional schematic diagram of the display panel provided in this embodiment;

[0070] Figure 14 Schematic diagram of the first filling unit provided in this embodiment;

[0071] Figure 15 The thirteenth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0072] Figure 16 One of the schematic diagrams of the isolation structure provided in this embodiment;

[0073] Figure 17 Another schematic diagram of the isolation structure provided in this embodiment;

[0074] Figure 18 The fourteenth cross-sectional schematic diagram of the display panel provided in this embodiment;

[0075] Figure 19 The flow schematic diagram of the manufacturing method of the display panel provided in this embodiment.

[0076] Icons: 111, 111'-substrate; 112, 112'-array functional layer; 120, 120'-first electrode; 130, 130'-pixel defining layer; 140, 140'-isolation structure; 141-supporting part; 142-blocking part; 143-receiving part; 1401-first surface area; 1402-second surface area; 1403-third surface area; 1404-fourth surface area; 1405-fifth surface area; 1406-sixth surface area; 810-light emitting device; 811-first light emitting device; 812-second light emitting device; 813-third light emitting device; 910, 910'-isolation opening; 911-first isolation opening; 912-second isolation opening; 913-third isolation opening; 150-light emitting functional layer; 160-second electrode; 170, 170'-encapsulation unit; 171-first encapsulation unit; 172-second encapsulation unit; 173-third encapsulation unit; 180-first encapsulation layer; 190-second encapsulation layer; 501'-gap; 411-first filling unit; 412-second filling unit. Detailed implementation manners

[0077] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated herein can be arranged and designed in various different configurations.

[0078] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present application.

[0079] It should be noted that like reference numerals and letters denote like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

[0080] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship in which the inventive product is customarily placed during use. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0081] It should be noted that, without conflict, different features in the embodiments of the present application may be combined with each other.

[0082] Please refer to Figure 1 , in some related display panels, an isolation structure 140 having isolation openings 910' is disposed above a pixel defining layer 130'. When depositing a light-emitting material layer and a conductive material layer to form a light-emitting functional layer 150' and a second electrode 160' of a light-emitting device 810', the light-emitting material layer and the conductive material layer between different isolation openings 910' can be disconnected, so that the light-emitting functional layer 150' and the second electrode 160' can be formed by etching after whole-layer deposition.

[0083] It has been found through research that in such display panels, there is usually a gap 501' between the top of the encapsulation unit 170' and the isolation structure 140', and a part of the encapsulation unit 170' is suspended, resulting in that this part is easily damaged and broken in subsequent processes, affecting the encapsulation effect.

[0084] In view of this, the present embodiment provides a solution that can improve the encapsulation effectiveness of the encapsulation unit. The solution provided by the present embodiment will be elaborated in detail below.

[0085] Please refer to Figure 2 , Figure 2 is a schematic diagram of a display panel provided by the present embodiment. The display panel may include a substrate 111, an isolation structure 140, a plurality of light-emitting devices 810, a plurality of encapsulation units 170, and at least one first filling unit 411.

[0086] In this embodiment, the material of the substrate 111 may include a rigid material, such as glass; or, the material of the substrate 111 may include a flexible material, such as polyimide (Pi).

[0087] Optionally, an array functional layer 112 may be further disposed on one side of the substrate 111. The array functional layer 112 may include multiple film layer structures, such as a buffer layer, an active layer, multiple conductive layers, multiple insulating layers, and a planarization layer, etc. The multiple film layer structures of the array functional layer 112 may form multiple thin film transistors (TFTs) and wiring structures at different positions. The thin film transistors may cooperate with each other to form multiple pixel driving units or driving circuits, and the wiring structures provide signals or voltages for the circuits.

[0088] The isolation structure 140 is located on one side of the substrate 111. For example, the isolation structure 140 may be located on the side of the array functional layer 112 away from the substrate 111. The isolation structure 140 encloses to form multiple spaced-apart isolation openings 910. The isolation openings 910 include adjacent first isolation opening 911 and second isolation opening 912.

[0089] In this embodiment, please refer to Figure 3 , on the side of the isolation structure 140 between the first isolation opening 911 and the second isolation opening 912 away from the substrate 111, it includes a first surface region 1401 close to the first isolation opening 911 and a second surface region 1402 close to the second isolation opening 912. The distance H11 from the first surface region 1401 to the substrate 111 is less than the distance H12 from the side of the second surface region 1402 away from the substrate 111 to the substrate 111.

[0090] For example, for the isolation structure 140 between the first isolation opening 911 and the second isolation opening 912, the side of this part of the isolation structure 140 away from the substrate 111 includes a first surface region 1401 and a second surface region 1402. Among them, the first surface region 1401 is located on the side close to the first isolation opening 911, and the second surface region 1402 is located on the side close to the second isolation opening 912. In the direction away from the substrate 111, the first surface region 1401 is lower than the second surface region 1402, forming a concave structure.

[0091] The light-emitting device 810 includes a first light-emitting device 811 located in the first isolation opening 911 and a second light-emitting device 812 located in the second isolation opening 912. Optionally, in this embodiment, the light-emitting colors of the first light-emitting device 811 and the second light-emitting device 812 may be different. For example, the first light-emitting device 811 and the second light-emitting device 812 are formed in different etching processes, and among them, the first light-emitting device 811 may be formed prior to the second light-emitting device 812.

[0092] The encapsulation unit 170 includes a first encapsulation unit 171. At least part of the first encapsulation unit 171 is located on the side of the first light-emitting device 811 away from the substrate 111, and at least another part of the first encapsulation unit 171 is located on the side of the first surface area 1401 away from the substrate 111.

[0093] Optionally, the encapsulation unit 170 may further include a second encapsulation unit 172. At least part of the second encapsulation unit 172 is located on the side of the second light-emitting device 812 away from the substrate 111, and at least another part of the second encapsulation unit 172 is located on the side of the second surface area 1402 away from the substrate 111.

[0094] At least part of the first filling unit 411 is located between the first surface area 1401 and the first encapsulation unit 171. For example, the first encapsulation unit 171 may at least partially fill the gap between the first surface area 1401 and the first encapsulation unit 171.

[0095] In the solution provided in this embodiment, since the first surface area 1401 is lower than the second surface area 1402 on the side of the isolation structure 140 away from the substrate 111 between the first isolation opening 911 and the second isolation opening 912, forming a concave structure. After manufacturing the first light-emitting device 811 and the first encapsulation unit 171, when setting the filling material for forming the first filling unit 411, the filling material can flow better to the relatively lower first surface area 1401, so as to better fill the gap between the first encapsulation unit 171 and the top of the isolation structure 140, ensuring the supporting effect of the formed first filling unit 411 on the first encapsulation unit 171 and reducing the risk of damage to the first encapsulation unit 171 in subsequent processes.

[0096] Optionally, the display panel provided in this embodiment may further include a pixel defining layer 130. The pixel defining layer 130 is located between the isolation structure 140 and the substrate 111. For example, the pixel defining layer 130 is located between the isolation structure 140 and the array functional layer 112. The pixel defining layer 130 includes a pixel opening, and the orthographic projection of the pixel opening on the substrate 111 is located within the orthographic projection of the isolation opening 910 on the substrate 111, that is, the pixel opening and the isolation opening 910 are connected.

[0097] In some possible implementation manners, please refer to Figure 2 , the light-emitting device 810 includes a first electrode 120, a light-emitting functional layer 150, and a second electrode 160 that are sequentially stacked in a direction away from the substrate 111.

[0098] Optionally, the first electrode 120 may be connected to a pixel driving circuit in the array functional layer 112, and the second electrode 160 may be connected to a common voltage providing circuit through the isolation structure 140. When there is a potential difference between the first electrode 120 and the second electrode 160, the light-emitting functional layer 150 located between the first electrode 120 and the second electrode 160 is driven to emit light.

[0099] Optionally, in this embodiment, the pixel defining layer 130 may cover the edge region of the first electrode 120, and the pixel opening may expose the central region of the first electrode 120. The light-emitting functional layer 150 extends into the pixel opening and contacts the first electrode 120.

[0100] Please refer to Figure 3 , the orthographic projection of the first electrode 120 of the first light-emitting device 811 on the substrate 111 is offset from the orthographic projection of the isolation structure 140 located between the first isolation opening 911 and the second isolation opening 912 on the substrate 111, the orthographic projection of the first electrode 120 of the second light-emitting device 812 on the substrate 111 is offset from the orthographic projection of the first surface region 1401 on the substrate 111, and the orthographic projection of the first electrode 120 of the second light-emitting device 812 on the substrate 111 and the orthographic projection of the second surface region 1402 on the substrate 111 at least partially overlap.

[0101] For example, one end of the first electrode 120 corresponding to the first light-emitting device 811 close to the second light-emitting device 812 may not extend under the isolation structure 140, while one end of the first electrode 120 corresponding to the second light-emitting device 812 close to the first light-emitting device 811 may extend under the isolation structure 140. That is, on the side of the isolation structure 140 close to the first isolation opening 911, there is no first electrode 120 under the isolation structure 140; while on the side of the isolation structure 140 close to the second isolation opening 912, the isolation structure 140 is raised by the first electrode 120 of the second light-emitting device 812. In this way, a first surface region 1401 and a second surface region 1402 with a certain height difference are formed on the side of the isolation structure 140 away from the substrate 111.

[0102] Optionally, in this case, in the direction away from the substrate 111, the thicknesses of the first electrodes 120 of the first light-emitting device 811 and the second light-emitting device 812 may be equal, or the thicknesses of the first electrodes 120 of the first light-emitting device 811 and the second light-emitting device 812 may also be unequal.

[0103] If the thicknesses of the first electrodes 120 of the first light-emitting device 811 and the second light-emitting device 812 are equal, the first electrodes 120 of the first light-emitting device 811 and the second light-emitting device 812 may be etched and formed in the same manufacturing step.

[0104] If the thicknesses of the first electrodes 120 of the first light-emitting device 811 and the second light-emitting device 812 are not equal, the first electrodes 120 of the first light-emitting device 811 and the second light-emitting device 812 with different thicknesses can be set synchronously in different manufacturing steps.

[0105] Optionally, the thickness of the first electrode 120 of the first light-emitting device 811 is less than the thickness of the first electrode 120 of the second light-emitting device 812.

[0106] In some other possible implementation manners, please refer to Figure 4 and Figure 5 , the light-emitting device 810 includes a first electrode 120, a light-emitting functional layer 150, and a second electrode 160 that are sequentially stacked in a direction away from the substrate 111.

[0107] The orthographic projection of the first electrode 120 of the first light-emitting device 811 on the substrate 111 and the orthographic projection of the first surface area 1401 on the substrate 111 at least partially overlap; the orthographic projection of the first electrode 120 of the second light-emitting device 812 on the substrate 111 and the orthographic projection of the second surface area 1402 on the substrate 111 at least partially overlap.

[0108] In a direction away from the substrate 111, the thickness H01 of the first electrode 120 of the first light-emitting device 811 is less than the thickness H02 of the first electrode 120 of the second light-emitting device 812.

[0109] For example, the first electrode 120 corresponding to the first light-emitting device 811 can extend under the isolation structure 140, and the first electrode 120 corresponding to the second light-emitting device 812 can extend under the isolation structure 140. That is, on one side of the isolation structure 140 close to the first isolation opening 911, the isolation structure 140 is elevated by the first electrode 120 of the first light-emitting device 811, and on one side of the isolation structure 140 close to the second isolation opening 912, the isolation structure 140 is elevated by the first electrode 120 of the second light-emitting device 812.

[0110] However, since the thickness H01 of the first electrode 120 of the first light-emitting device 811 is less than the thickness H02 of the first electrode 120 of the second light-emitting device 812, the height by which the isolation structure 140 is elevated on the side close to the first isolation opening 911 is less than the height by which the isolation structure 140 is elevated on the side close to the second isolation opening 912, so that a first surface area 1401 and a second surface area 1402 with a certain height difference are formed on the side of the isolation structure 140 away from the substrate 111.

[0111] In some possible implementation manners, the difference in thickness between the first electrode 120 of the first light-emitting device 811 and the first electrode 120 of the second light-emitting device 812 is greater than or equal to 500 angstroms.

[0112] In some possible implementations, the first electrode 120 includes a first sub-layer, a second sub-layer, and a third sub-layer that are stacked in a direction away from the substrate 111. The difference between the total thickness of the second sub-layer and the third sub-layer of the first electrode 120 of the first light-emitting device 811 and the total thickness of the second sub-layer and the third sub-layer of the first electrode 120 of the second light-emitting device 812 is greater than or equal to 500 angstroms.

[0113] Optionally, the thickness of the first sub-layer of the first electrode 120 of the first light-emitting device 811 is equal to the thickness of the first sub-layer of the first electrode 120 of the second light-emitting device 812.

[0114] Optionally, the materials of the first sub-layer and the third sub-layer include indium tin oxide, and the material of the second sub-layer includes silver.

[0115] In some possible implementations, please refer to Figure 6 or Figure 7 , the isolation opening 910 further includes a third isolation opening 913 adjacent to the second isolation opening 912.

[0116] Please refer to Figure 8 and Figure 9 , on the side of the isolation structure 140 away from the substrate 111 between the second isolation opening 912 and the third isolation opening 913, there are further a third surface area 1403 close to the second isolation opening 912 and a fourth surface area 1404 close to the third isolation opening 913. The distance H13 from the third surface area 1403 to the substrate 111 is less than the distance H14 from the side of the fourth surface area 1404 away from the substrate 111 to the substrate 111.

[0117] For example, for the isolation structure 140 between the second isolation opening 912 and the third isolation opening 913, on the side of this part of the isolation structure 140 away from the substrate 111, there are a third surface area 1403 and a fourth surface area 1404, where the third surface area 1403 is located on the side close to the second isolation opening 912, and the fourth surface area 1404 is located on the side close to the third isolation opening 913. In the direction away from the substrate 111, the third surface area 1403 is lower than the fourth surface area 1404, forming a concave structure.

[0118] The light-emitting device 810 further includes a third light-emitting device 813 located in the third isolation opening 913. The first light-emitting device 811, the second light-emitting device 812, and the third light-emitting device 813 have different light-emitting colors. The second light-emitting device 812 can be formed prior to the third light-emitting device 813.

[0119] The encapsulation unit 170 further includes a third encapsulation unit 173. At least a part of the third encapsulation unit 173 is located on the side of the third light-emitting device 813 away from the substrate 111, and at least another part of the third encapsulation unit 173 may be located on the side of the isolation structure 140 away from the substrate 111.

[0120] The display panel further includes a second filling unit 412. At least a part of the second filling unit 412 is located between the third surface region 1403 and the second encapsulation unit 172.

[0121] That is, in the solution provided in this embodiment, since the third surface region 1403 is lower than the fourth surface region 1404 in the side of the isolation structure 140 away from the substrate 111 between the second isolation opening 912 and the third isolation opening 913, a concave structure is formed. After manufacturing the second light-emitting device 812 and the second encapsulation unit 172, when setting the filling material for forming the second filling unit 412, the filling material can flow better to the relatively lower third surface region 1403, so as to better fill the gap between the second encapsulation unit 172 and the top of the isolation structure 140, ensure the supporting effect of the formed second filling unit 412 on the second encapsulation unit 172, and reduce the risk of damage to the second encapsulation unit 172 in subsequent processes.

[0122] Optionally, in some possible implementation manners, at least another part of the second filling unit 412 may also be located between the second surface region 1402 and the second encapsulation unit 172.

[0123] In some possible implementation manners, the positive projection of the first electrode 120 of the second light-emitting device 812 on the substrate 111 and the positive projection of the third surface region 1403 on the substrate 111 at least partially overlap, and the positive projection of the first electrode 120 of the third light-emitting device 813 on the substrate 111 and the positive projection of the fourth surface region 1404 on the substrate 111 at least partially overlap.

[0124] In the direction away from the substrate 111, the thickness H02 of the first electrode 120 of the second light-emitting device 812 is less than the thickness H03 of the first electrode 120 of the third light-emitting device 813.

[0125] For example, one end of the first electrode 120 corresponding to the second light-emitting device 812 close to the third light-emitting device 813 can extend under the isolation structure 140, and one end of the first electrode 120 corresponding to the third light-emitting device 813 close to the second light-emitting device 812 can extend under the isolation structure 140. That is, on the side of the isolation structure 140 close to the second isolation opening 912, the isolation structure 140 is raised by the first electrode 120 of the second light-emitting device 812, and on the side of the isolation structure 140 close to the third isolation opening 913, the isolation structure 140 is raised by the first electrode 120 of the third light-emitting device 813.

[0126] However, since the thickness H02 of the first electrode 120 of the second light-emitting device 812 is less than the thickness H03 of the first electrode 120 of the third light-emitting device 813, the height by which the side of the isolation structure 140 close to the second isolation opening 912 is raised is less than the height by which the side of the isolation structure 140 close to the third isolation opening 913 is raised, so that a third surface region 1403 and a fourth surface region 1404 with a certain height difference are formed on the side of the isolation structure 140 away from the substrate 111 between the second isolation opening 912 and the third isolation opening 913.

[0127] In some possible implementation manners, the thickness difference between the first electrode 120 of the second light-emitting device 812 and the first electrode 120 of the third light-emitting device 813 is greater than or equal to 500 angstroms.

[0128] Optionally, please refer to Figure 6 and Figure 8 , in some possible implementation manners, one end of the first electrode 120 of the first light-emitting device 811 close to the second light-emitting device 812 may not extend under the isolation structure 140, while one end of the first electrode 120 of the second light-emitting device 812 close to the first light-emitting device 811 can extend under the isolation structure 140, so that the first surface region 1401 is lower than the second surface region 1402.

[0129] At the same time, one end of the first electrode 120 of the second light-emitting device 812 close to the third light-emitting device 813 and one end of the first electrode 120 of the third light-emitting device 813 close to the second light-emitting device 812 both extend under the isolation structure 140, but the first electrode 120 of the second light-emitting device 812 is thinner than the first electrode 120 of the third light-emitting device 813, so that the third surface region 1403 is lower than the fourth surface region 1404.

[0130] Optionally, please refer to Figure 7 and Figure 9, in some other possible implementation manners, the edges of the first electrodes 120 of the first light-emitting device 811, the second light-emitting device 812, and the third light-emitting device 813 can all extend under the corresponding isolation structure 140, but the thicknesses of the first electrodes 120 of the first light-emitting device 811, the second light-emitting device 812, and the third light-emitting device 813 increase successively, so that the first surface area 1401 is lower than the second surface area 1402, the second surface area 1402 and the third surface area 1403 are approximately equal in height, and the third surface area 1403 is lower than the fourth surface area 1404.

[0131] In some other possible implementation manners, please refer to Figure 10 and Figure 11 , the orthographic projection of the first electrode 120 of the second light-emitting device 812 on the substrate 111 is offset from the orthographic projection of the isolation structure 140 located between the second isolation opening 912 and the third isolation opening 913 on the substrate 111, the orthographic projection of the first electrode 120 of the third light-emitting device 813 on the substrate 111 is offset from the orthographic projection of the third surface area 1403 on the substrate 111, and the orthographic projection of the first electrode 120 of the third light-emitting device 813 on the substrate 111 and the orthographic projection of the fourth surface area 1404 on the substrate 111 at least partially overlap.

[0132] For example, one end of the first electrode 120 corresponding to the second light-emitting device 812 close to the third light-emitting device 813 may not extend under the isolation structure 140, while one end of the first electrode 120 corresponding to the third light-emitting device 813 close to the second light-emitting device 812 may extend under the isolation structure 140. That is, on the side of the isolation structure 140 close to the second isolation opening 912, there is no first electrode 120 under the isolation structure 140; while on the side of the isolation structure 140 close to the third isolation opening 913, the isolation structure 140 is raised by the first electrode 120 of the third light-emitting device 813. In this way, a third surface area 1403 and a fourth surface area 1404 with a certain height difference are formed on the side of the isolation structure 140 away from the substrate 111.

[0133] In this case, the isolation structure 140 located between the first isolation opening 911 and the second isolation opening 912 can form a first surface area 1401 and a second surface area 1402 with a height difference due to different extension lengths of the first electrode 120, as Figure 10 shown, or can also form a first surface area 1401 and a second surface area 1402 with a height difference due to different thicknesses of the first electrode 120, as Figure 11 shown, which will not be elaborated in this embodiment.

[0134] Optionally, in some possible implementation manners, the display panel may also have a third filling unit, and at least a part of the third filling unit is located between the third encapsulation unit 173 and the fourth surface area 1404.

[0135] In some possible implementation manners, please refer to Figure 12 and Figure 13 , the isolation structure 140 further includes a third isolation opening 913 adjacent to the first isolation opening 911.

[0136] On the side of the isolation structure 140 away from the substrate 111 and between the first isolation opening 911 and the third isolation opening 913, there are a fifth surface area 1405 close to the first isolation opening 911 and a sixth surface area 1406 close to the third isolation opening 913. The distance H15 from the fifth surface area 1405 to the substrate 111 is less than the distance H16 from the side of the sixth surface area 1406 away from the substrate 111 to the substrate 111.

[0137] The light-emitting device 810 further includes a third light-emitting device 813 located in the third isolation opening 913. Optionally, in this embodiment, the light-emitting colors of the first light-emitting device 811, the second light-emitting device 812, and the third light-emitting device 813 are different from each other. For example, the first light-emitting device 811 and the third light-emitting device 813 are formed in different etching processes, and among them, the first light-emitting device 811 may be formed prior to the third light-emitting device 813.

[0138] That is, in this embodiment, when the display panel includes a third light-emitting device 813 located in the third isolation opening 913, the isolation structure 140 between the first isolation opening 911 and the third isolation opening 913 may further include a fifth surface area 1405 close to the first isolation opening 911 and a sixth surface area 1406 close to the third isolation opening 913. In the direction away from the substrate 111, the fifth surface area 1405 is lower than the sixth surface area 1406, forming a concave structure.

[0139] At least a part of the first filling unit 411 is located between the fifth surface area 1405 and the first encapsulation unit 171. For example, the first encapsulation unit 171 may at least partially fill the gap between the fifth surface area 1405 and the first encapsulation unit 171.

[0140] In this way, when the first filling unit 411 is formed on the side of the first encapsulation layer 180 close to the third isolation opening 913, the first filling unit 411 can also flow and fill better between the first encapsulation unit 171 and the fifth surface area 1405.

[0141] Optionally, the orthographic projection of the first surface region 1401 and the fifth surface region 1405 on the substrate 111 surrounds the orthographic projection of the first isolation opening 911 on the substrate 111. For example, see Figure 14 , the first isolation opening 911 is surrounded by the second isolation opening 912 and the third isolation opening 913. In this case, around the first isolation opening 911, the depression formed by the first surface region 1401 and the fifth surface region 1405 surrounds the first isolation opening 911. Thus, when the first filling unit 411 is provided, the first filling unit 411 can surround the first isolation opening 911 and better flow and fill into the depression formed by the first surface region 1401 and the fifth surface region 1405, so as to better fill the gap between the first encapsulation unit 171 and the isolation structure 140.

[0142] In some possible implementation manners, the side of the first filling unit 411 close to the substrate 111 is attached to the isolation structure 140, and the side of the first filling unit 411 far from the substrate 111 is attached to the first encapsulation unit 171, that is, the first filling unit 411 completely fills the gap between the first surface region 1401 and the first encapsulation unit 171.

[0143] In this embodiment, the manner in which the fifth surface region 1405 and the sixth surface region 1406 form a height difference may be the same as the manner in which the first surface region 1401 and the second surface region 1402 form a height difference, which will not be elaborated one by one in this embodiment.

[0144] In some possible implementation manners, the material of the first filling unit 411 includes an organic polymer material, a transparent optical adhesive, or a photoresist.

[0145] Correspondingly, when the display panel has a second filling unit 412, the material of the second filling unit 412 includes an organic polymer material, a transparent optical adhesive, or a photoresist.

[0146] Correspondingly, when the display panel has a third filling unit, the material of the third filling unit includes an organic polymer material, a transparent optical adhesive, or a photoresist.

[0147] In some possible implementation manners, see Figure 15 , in the direction parallel to the substrate 111, the edge of the orthographic projection of the side of the first encapsulation unit 171 far from the first isolation opening 911 on the substrate 111 is located within the orthographic projection of the first surface region 1401 on the substrate 111.

[0148] For example, there is a gap W11 between the edge of the orthographic projection of the side of the first encapsulation unit 171 far from the first isolation opening 911 on the substrate 111 and the edge of the orthographic projection of the first surface region 1401 on the substrate 111.

[0149] In this way, when the first filling unit 411 is provided, the first filling unit 411 has enough flow space to flow toward the gap between the first encapsulation unit 171 and the first surface area 1401 .

[0150] Accordingly, when the second surface area 1402 and the third surface area 1403 of the isolation structure 140 have a height difference, the edge of the orthographic projection of the side of the second encapsulation unit 172 away from the second isolation opening 912 on the substrate 111 is located within the orthographic projection of the second surface area 1402 on the substrate 111 .

[0151] For example, there may also be a gap between an edge of an orthographic projection of a side of the second encapsulation unit 172 away from the second isolation opening 912 on the substrate 111 and an edge of an orthographic projection of the second surface region 1402 on the substrate 111 .

[0152] For some possible implementations, see Figure 16 The isolation structure 140 includes a supporting portion 141 and a shielding portion 142 located on a side of the supporting portion 141 away from the substrate 111 , and an orthographic projection of the supporting portion 141 on the substrate 111 is located within an orthographic projection of the shielding portion 142 on the substrate 111 .

[0153] Optionally, the etching resistance of the support portion 141 is weaker than the etching resistance of the shielding portion 142 .

[0154] Optionally, the material of the support portion 141 includes aluminum, and / or the material of the shielding portion 142 includes titanium.

[0155] For some possible implementations, see Figure 17 The isolation structure 140 also includes a receiving portion 143 located between the supporting portion 141 and the substrate 111 .

[0156] Optionally, the orthographic projection of the receiving portion 143 on the substrate 111 is located within the orthographic projection of the shielding portion 142 on the substrate 111 .

[0157] Optionally, the material of the receiving portion 143 includes molybdenum.

[0158] For some possible implementations, see Figure 18 The display panel further includes a first encapsulation layer 180 and a second encapsulation layer 190 located on a side of the encapsulation unit 170 and the isolation structure 140 away from the substrate 111 .

[0159] Optionally, the materials of the encapsulation unit 170 and the second encapsulation layer 190 include inorganic materials, and the material of the first encapsulation layer 180 includes organic materials.

[0160] In some possible implementation manners, the display panel provided in this embodiment may further include film layer structures such as an optical film (e.g., a polarizer), a transparent adhesive layer (e.g., an optical glue layer), and a cover plate on a side of the second encapsulation layer 190 away from the substrate 111.

[0161] Please refer to Figure 19 , this embodiment further provides a manufacturing method of a display panel, and the method may include the following steps.

[0162] Step S110: Provide a substrate 111.

[0163] Step S120: Form an isolation structure 140 on one side of the substrate 111. The isolation structure 140 encloses a plurality of isolation openings 910. The isolation openings 910 include adjacent first isolation opening 911 and second isolation opening 912. A side of the isolation structure 140 away from the substrate 111 includes a first surface area 1401 close to the first isolation opening 911 and a second surface area 1402 close to the second isolation opening 912. The distance from the first surface area 1401 to the substrate 111 is less than the distance from a side of the second surface area 1402 away from the substrate 111 to the substrate 111.

[0164] In this embodiment, a first electrode 120 corresponding to each light-emitting device 810 may be formed on one side of the substrate 111. Then, a pixel defining material layer and an isolation material layer are disposed on one side of the first electrode 120, and the pixel defining material layer and the isolation material layer are etched to form a pixel opening and an isolation opening 910 that expose at least part of the first electrode 120.

[0165] In a possible implementation manner, before step S120, a first electrode 120 of a first light-emitting device 811 and a second light-emitting device 812 may be formed on one side of the substrate 111 first.

[0166] After the isolation structure 140 is formed, a positive projection of the first electrode 120 of the first light-emitting device 811 on the substrate 111 is staggered from a positive projection of the isolation structure 140 on the substrate 111. A positive projection of the first electrode 120 of the second light-emitting device 812 on the substrate 111 is staggered from a positive projection of the first surface area 1401 on the substrate 111, and at least part of a positive projection of the first electrode 120 of the second light-emitting device 812 on the substrate 111 coincides with a positive projection of the second surface area 1402 on the substrate 111.

[0167] In some other possible implementation manners, before step S120, a first electrode 120 of the first light-emitting device 811 and the second light-emitting device 812 may be formed on one side of the substrate 111 first. Among them, in the direction away from the substrate 111, the thickness of the first electrode 120 of the first light-emitting device 811 is less than the thickness of the first electrode 120 of the second light-emitting device 812.

[0168] After forming the isolation structure 140, the orthographic projection of the first electrode 120 of the first light-emitting device 811 on the substrate 111 and the orthographic projection of the first surface region 1401 on the substrate 111 at least partially overlap; the orthographic projection of the first electrode 120 of the second light-emitting device 812 on the substrate 111 and the orthographic projection of the second surface region 1402 on the substrate 111 at least partially overlap.

[0169] Step S130, forming a light-emitting functional layer 150, a second electrode 160, and a first encapsulation unit 171 corresponding to the first light-emitting device 811. The first light-emitting device 811 is located in the first isolation opening 911. At least part of the first encapsulation unit 171 is located on the side of the first light-emitting device 811 away from the substrate 111, and at least another part of the first encapsulation unit 171 is located on the side of the first surface region 1401 away from the substrate 111.

[0170] Step S140, forming a first filling unit 411 between the first surface region 1401 and the first encapsulation unit 171.

[0171] Specifically, since the first surface region 1401 formed in step S120 is lower than the second surface region 1402, forming a recessed structure. When setting the first filling unit 411, the first filling unit 411 can flow and fill into the gap between the first encapsulation unit 171 and the first surface region 1401 more smoothly.

[0172] Step S150, forming the second light-emitting device 812 by etching after full-layer evaporation.

[0173] In step S150, a second encapsulation unit 172 may also be formed. Among them, the second light-emitting device 812 is located in the second isolation opening 912. At least part of the second encapsulation unit 172 is located on the side of the second light-emitting device 812 away from the substrate 111.

[0174] For example, in step S150, a light-emitting material layer, an electrode material layer, and an encapsulation material layer corresponding to the second light-emitting device 812 may be set by full-layer evaporation, and then the encapsulation material layer is etched to form the second encapsulation unit 172. The second electrode 160 and the light-emitting functional layer 150 of the second light-emitting device 812 are formed by etching the electrode material layer and the light-emitting material layer respectively.

[0175] In the above process, the first light-emitting device 811 and the first encapsulation unit 171 are first formed, then the first filling unit 411 is provided, and then other light-emitting devices 810 (such as the second light-emitting device 812) are formed. In this way, during the manufacturing process of the subsequent other light-emitting devices 810, the first filling unit 411 can support the first encapsulation unit 171, reducing the risk of damage to the first encapsulation unit 171 during wet etching or water washing operations. Moreover, the first filling unit 411 can prevent the subsequent wet etching solution from invading the first light-emitting device 811 through the gap between the first encapsulation unit 171 and the isolation structure 140, reducing the risk of damage to the first light-emitting device 811.

[0176] The present application also provides an electronic device, which includes the display panel provided by the present application, or a display panel manufactured by the manufacturing method of the display panel provided by the present application. The electronic device may include devices with display functions such as mobile phones, tablet computers, smart wearable devices, televisions, laptop computers, and monitors.

[0177] In summary, the present application provides a display panel, a manufacturing method of the display panel, and an electronic device. By setting the top of the isolation structure to be lower on the side close to the first isolation opening than on the side close to the second isolation opening, a concave structure is formed. After manufacturing the first light-emitting device and the first encapsulation unit, it is easier to fill the first filling unit into the gap between the first encapsulation unit and the top of the isolation structure, so as to form better support for the first encapsulation unit and reduce the risk of damage to the first encapsulation unit during subsequent manufacturing processes.

[0178] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0179] The above-described embodiments merely represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the invention patent should be subject to the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation openings including adjacent first and second isolation openings; a side of the isolation structure between the first isolation opening and the second isolation opening, away from the substrate, includes a first surface area close to the first isolation opening and a second surface area close to the second isolation opening, and a distance from the first surface area to the substrate is less than a distance from a side of the second surface area away from the substrate to the substrate; a plurality of light-emitting devices, the light-emitting devices including a first light-emitting device located in the first isolation opening and a second light-emitting device located in the second isolation opening; a plurality of encapsulation units, the encapsulation units including a first encapsulation unit, at least part of the first encapsulation unit being located on a side of the first light-emitting device away from the substrate, and at least another part of the first encapsulation unit being located on a side of the first surface area away from the substrate; a first filling unit, at least part of the first filling unit being located between the first surface area and the first encapsulation unit.

2. The display panel according to claim 1, wherein The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode that are sequentially stacked in a direction away from the substrate; A positive projection of the first electrode of the first light-emitting device on the substrate is offset from a positive projection of the isolation structure between the first isolation opening and the second isolation opening on the substrate, a positive projection of the first electrode of the second light-emitting device on the substrate is offset from a positive projection of the first surface area on the substrate, and the positive projection of the first electrode of the second light-emitting device on the substrate and a positive projection of the second surface area on the substrate at least partially overlap.

3. The display panel according to claim 2, wherein In a direction away from the substrate, a thickness of the first electrode of the first light-emitting device is less than or equal to a thickness of the first electrode of the second light-emitting device.

4. The display panel according to claim 1, wherein The light-emitting device includes a first electrode, a light-emitting functional layer, and a second electrode that are sequentially stacked in a direction away from the substrate; The positive projection of the first electrode of the first light-emitting device on the substrate and the positive projection of the first surface area on the substrate at least partially overlap; The positive projection of the first electrode of the second light-emitting device on the substrate and the positive projection of the second surface area on the substrate at least partially overlap; In a direction away from the substrate, a thickness of the first electrode of the first light-emitting device is less than a thickness of the first electrode of the second light-emitting device.

5. The display panel according to claim 4, wherein A thickness difference between the first electrode of the first light-emitting device and the first electrode of the second light-emitting device is greater than or equal to 500 angstroms.

6. The display panel according to claim 5, wherein The first electrode includes a first sub-layer, a second sub-layer, and a third sub-layer that are stacked in a direction away from the substrate; a difference between a total thickness of the second sub-layer and the third sub-layer of the first electrode of the first light-emitting device and a total thickness of the second sub-layer and the third sub-layer of the first electrode of the second light-emitting device is greater than or equal to 500 angstroms; The materials of the first sub-layer and the third sub-layer include indium tin oxide, and the material of the second sub-layer includes silver.

7. The display panel according to any one of claims 2-4, characterized in that, The isolation opening further includes a third isolation opening adjacent to the second isolation opening; The side of the isolation structure located between the second isolation opening and the third isolation opening away from the substrate further includes a third surface area close to the second isolation opening and a fourth surface area close to the third isolation opening, and the distance from the third surface area to the substrate is shorter than the distance from the side of the fourth surface area away from the substrate to the substrate; The encapsulation unit further comprises a second encapsulation unit, at least a portion of the second encapsulation unit is located on a side of the second light-emitting device away from the substrate, and another at least a portion of the second encapsulation unit is located on a side of the second surface area away from the substrate; The display panel further includes a second filling unit, at least a portion of the second filling unit is located between the second surface area and the second encapsulation unit; The light emitting device further comprises a third light emitting device located in the third isolation opening; The packaging unit further includes a third packaging unit, at least a portion of which is located at a side of the third light emitting device away from the substrate.

8. The display panel according to claim 7, wherein The orthographic projection of the first electrode of the second light-emitting device on the substrate and the orthographic projection of the third surface area on the substrate at least partially overlap, and the orthographic projection of the first electrode of the third light-emitting device on the substrate and the orthographic projection of the fourth surface area on the substrate at least partially overlap.

9. The display panel according to claim 8, wherein, In a direction away from the substrate, a thickness of the first electrode of the second light emitting device is smaller than a thickness of the first electrode of the third light emitting device.

10. The display panel according to claim 7, characterized in that, The orthographic projection of the first electrode of the second light-emitting device on the substrate is staggered with the orthographic projection of the isolation structure located between the second isolation opening and the third isolation opening on the substrate, the orthographic projection of the first electrode of the third light-emitting device on the substrate is staggered with the orthographic projection of the third surface area on the substrate, and the orthographic projection of the first electrode of the third light-emitting device on the substrate is at least partially overlapped with the orthographic projection of the fourth surface area on the substrate.

11. The display panel according to claim 1, wherein A side of the first filling unit away from the substrate is attached to the first packaging unit, and a side of the first filling unit close to the substrate is attached to the isolation structure.

12. The display panel according to claim 1, characterized in that, The material of the first filling unit includes organic polymer material, transparent optical glue or photoresist.

13. The display panel according to claim 1, wherein In a direction parallel to the substrate, an edge of an orthographic projection of a side of the first encapsulation unit away from the first isolation opening on the substrate is located within an orthographic projection of the first surface area on the substrate; A space is provided between an edge of an orthographic projection of a side of the first encapsulation unit away from the first isolation opening on the substrate and an edge of an orthographic projection of the first surface region on the substrate.

14. The display panel according to claim 1, wherein, The isolation opening further includes a third isolation opening adjacent to the first isolation opening; on the side of the isolation structure away from the substrate between the first isolation opening and the third isolation opening, it includes a fifth surface region close to the first isolation opening and a sixth surface region close to the third isolation opening, and the distance from the fifth surface region to the substrate is less than the distance from the side of the sixth surface region away from the substrate to the substrate; at least part of the first filling unit is located between the fifth surface region and the first encapsulation unit; The light-emitting device includes a third light-emitting device located within the third isolation opening; The encapsulation unit further includes a third encapsulation unit, and at least part of the third encapsulation unit is located on the side of the third light-emitting device away from the substrate.

15. The display panel according to claim 1, wherein The isolation structure includes a support portion and a shielding portion located on the side of the support portion away from the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the shielding portion on the substrate; the material of the support portion includes aluminum, and / or the material of the shielding portion includes titanium; The isolation structure further includes a receiving portion located between the support portion and the substrate; The orthographic projection of the end of the receiving portion close to the isolation opening on the substrate is located within the orthographic projection of the end of the shielding portion close to the isolation opening on the substrate; the material of the receiving portion includes molybdenum.

16. The display panel according to claim 1, wherein The display panel further includes: A first encapsulation layer located on the side of the encapsulation unit and the isolation structure away from the substrate; A second encapsulation layer located on the side of the first encapsulation layer away from the substrate; The materials of the encapsulation unit and the second encapsulation layer include inorganic materials; the material of the first encapsulation layer includes organic materials.

17. A manufacturing method of a display panel, characterized in that, The method includes: Providing a substrate; Forming an isolation structure on one side of the substrate, the isolation structure enclosing a plurality of isolation openings, the isolation openings including adjacent first and second isolation openings; on the side of the isolation structure away from the substrate, it includes a first surface region close to the first isolation opening and a second surface region close to the second isolation opening, and the distance from the first surface region to the substrate is less than the distance from the side of the second surface region away from the substrate to the substrate; Forming a light-emitting functional layer, a second electrode, and a first encapsulation unit corresponding to the first light-emitting device, the first light-emitting device being located within the first isolation opening, at least part of the first encapsulation unit being located on the side of the first light-emitting device away from the substrate, and at least another part of the first encapsulation unit being located on the side of the first surface region away from the substrate; Forming a first filling unit between the first surface region and the first encapsulation unit; Forming a second light-emitting device by etching after full-layer evaporation.

18. The method according to claim 17, wherein Before the step of forming the isolation structure on one side of the substrate, the method further includes: Forming a first electrode of the first light-emitting device and the second light-emitting device on one side of the substrate; Among them, after forming the isolation structure, a positive projection of the first electrode of the first light-emitting device on the substrate is offset from a positive projection of the isolation structure between the first isolation opening and the second isolation opening on the substrate; a positive projection of the first electrode of the second light-emitting device on the substrate is offset from a positive projection of the first surface area on the substrate; and a positive projection of the first electrode of the second light-emitting device on the substrate and a positive projection of the second surface area on the substrate at least partially overlap.

19. The method according to claim 17, wherein Before the step of forming the isolation structure on one side of the substrate, the method further includes: forming the first electrodes of the first light-emitting device and the second light-emitting device on one side of the substrate, and in a direction away from the substrate, a thickness of the first electrode of the first light-emitting device is less than a thickness of the first electrode of the second light-emitting device; Among them, after forming the isolation structure, a positive projection of the first electrode of the first light-emitting device on the substrate and a positive projection of the first surface area on the substrate at least partially overlap; a positive projection of the first electrode of the second light-emitting device on the substrate and a positive projection of the second surface area on the substrate at least partially overlap.

20. An electronic device, characterized in that The electronic device includes the display panel according to any one of claims 1-16, or the electronic device includes a display panel manufactured by the manufacturing method of the display panel according to any one of claims 17-19.

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