Compact optical-mechanical layout for long-range dual-camera barcode imager

Abstract

A scanning engine for capturing at least one image of an object appearing in an imaging field of view (FOV) is provided, the scanning engine including an imaging system, an illumination system, a targeting system, and a first chassis and a second chassis. The imaging system includes a lens holder and at least one lens disposed within the lens holder, and both a long range imaging system and a short range imaging system for capturing images across a plurality of fields of view at different distances. The illumination system and the targeting system are physically positioned to provide illumination of a target in a short range field of view and / or a long range field of view, and to provide a targeting pattern to the short range field of view and / or the long range field of view.

Description

BACKGROUND

[0001] Industrial scanners and / or barcode readers can be used in warehouse environments and / or other environments and can be provided in the form of mobile scanning devices. These scanners can be used to scan barcodes and other objects. Such scanners are often contained within a chassis to protect the optical components from impacts, drops, and / or other potential damaging events. In some environments, it can be desirable to have a high power scanner capable of scanning or resolving barcodes (e.g., 100 ml wide) across a wide range of distances, such as from a few inches to tens of feet or more. These scanners must also operate over a range of fields of view (FOV) and often require an illumination system and a targeting pattern system. Typically, such systems do not have effective illumination and / or targeting over the entire range of the wide FOV required for operation. Additionally, such systems require larger optics to meet performance requirements, but there is still a tradeoff between the lens system and the optics having a particular size, while being constrained by the overall size of the housing and chassis. Furthermore, larger systems can create greater mechanical fastening forces, which can potentially damage the chassis or other components. Also, compact imaging systems require high precision alignment of the optics to prevent optical distortions or device malfunctions that can result in reduced efficiency of scanning rates.

[0002] Accordingly, there is a need for improved designs with improved functionality. SUMMARY

[0003] According to a first aspect, there is provided an imaging device comprising a first chassis, a second chassis, a close range imaging system, a long range imaging system, an illumination system, and an aiming system. The first chassis comprises a body defining at least one cavity, the first chassis comprising a chassis mounting portion. The second chassis comprises a body defining at least one cavity, the first chassis being physically coupled to the second chassis by the chassis mounting portion of the first chassis and by a first printed circuit board. The close range imaging system is disposed in the cavity of the first chassis, the close range imaging system comprising close range imaging optics to capture at least one image of an object appearing in a field of view (FOV) onto an imaging plane along a close range imaging axis of the close range imaging system. The long range imaging system is disposed in the cavity of the second chassis, the long range imaging system comprising long range imaging optics to capture at least one image of an object appearing in a FOV onto an imaging plane along a long range imaging axis of the long range imaging system. The illumination system is disposed in the cavity of the first chassis, the illumination system comprising illumination optics to provide illumination to the FOV of each of the close range imaging optics and the long range imaging optics. The aiming system is disposed adjacent to the illumination system, the aiming system comprising an aiming path cavity in the first chassis and an aiming light source disposed in the cavity of the second chassis, wherein the aiming system is configured to provide an aiming pattern along the FOV of each of the close range imaging optics and the long range imaging optics. The close range imaging system is disposed adjacent to the aiming system on a side of the aiming system opposite a side of the illumination system, and the long range imaging system is disposed adjacent to the close range imaging system on a side of the close range imaging system opposite the aiming system.

[0004] In variations of embodiments, the imaging device further comprises a first circuit board disposed between the first chassis and the second chassis adjacent to the first chassis, and a second circuit board disposed on a side of the second chassis opposite a side of the first circuit board adjacent to the second chassis. Further, in variations, the illumination system comprises at least one illumination source disposed on the first circuit board. In some variations, the aiming system comprises at least one aiming radiation source disposed on the second circuit board positioned to provide aiming radiation along an aiming axis through the aiming path cavity. In variations, the close range imaging system comprises a close range image detector disposed on the first circuit board configured to capture images of objects in a close range field of view of the imaging device. In further variations, the long range imaging system comprises a long range image sensor disposed on the second circuit board configured to capture images of objects in a long range field of view of the imaging device.

[0005] In some approaches, a distant illumination source is disposed to provide distant illumination along a distant illumination axis toward a distant field of view of the imaging device, a close illumination source is disposed to provide close illumination along a close illumination axis toward a close field of view of the imaging device, and an illumination collimator is disposed in a cavity of the first chassis along the distant illumination axis and the close illumination axis. The illumination collimator is disposed to collimate distant illumination and close illumination, and a multi-lens array is disposed along the close illumination axis, where the multi-lens array is configured to expand the close illumination to illuminate the close field of view of the imaging device.

[0006] In further variations of the current embodiment, the aiming system further comprises an aiming optical element disposed along the aiming axis to form an aiming pattern in the field of view of the imaging device. The aiming optical element can be a refractive optical element or a diffractive optical element.

[0007] In some approaches, the scanning engine can further comprise an aiming system and an illumination system. In these examples, each of the aiming system and the illumination system are at least partially disposed in at least one cavity of the chassis. In variations, the aiming axis is parallel to the distant imaging axis.

[0008] In any variation of the current embodiment, the device further comprises a rigid- flexible printed circuit board, where a first portion of the rigid-flexible circuit board is disposed between the first chassis and the second chassis adjacent to the first chassis, and a second circuit board is disposed on a side of the second chassis opposite a side of the first circuit board adjacent to the second chassis. A flexible portion of the rigid-flexible circuit board is at least partially disposed outside of the first chassis and the second chassis, the flexible portion physically and electrically coupling the first portion of the rigid-flexible circuit board with the second portion of the rigid-flexible circuit board. In some implementations, the imaging device further comprises at least one guard protrusion extending along a length of the flexible portion of the rigid-flexible circuit board from the first chassis or second chassis, the guard protrusion having a height such that the at least one guard protrusion extends beyond the flexible portion of the rigid-flexible circuit board to physically guard the rigid-flexible circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0009] The accompanying drawings, where like reference numerals refer to identical or functionally similar elements throughout the various figures, which illustrate exemplary embodiments including the claimed application, are incorporated in and constitute a part of this specification, and, together with the detailed description, serve to explain the principles and advantages of the exemplary embodiments, and to enable others skilled in the art to use the application in such embodiments and with such modifications as are suited to the particular use contemplated.

[0010] Figure 1 A front elevation view of an example imaging component of an example scanner for capturing images of objects, according to various embodiments, is shown;

[0011] Figure 2 The following are illustrations of methods for capturing images of objects according to various embodiments. Figure 1 A side elevation view of an example imaging component of an example scanner;

[0012] Figure 3 Various embodiments are shown. Figure 1 and Figure 2 A perspective view of an example imaging component;

[0013] Figure 4 A side view of an example illumination system that can be implemented in an imaging component according to various embodiments is shown;

[0014] Figure 5 According to various embodiments Figures 1 to 3 A diagram of the imaging axis and illumination propagation axis of an example imaging component.

[0015] Figure 6 It is illustrated that various embodiments are used for Figures 1 to 3 A front elevation view of an example telephoto imaging system with example imaging components.

[0016] Figure 7 Various embodiments are shown. Figure 6 An example of a disassembled perspective view of a telescopic imaging system.

[0017] Figure 8 Various embodiments are shown. Figure 6 and Figure 7 A perspective view of an example long-range imaging system.

[0018] Figure 9 Various embodiments are shown. Figures 1 to 8 A cross-sectional perspective view of a portion of an example imaging component.

[0019] Figure 10 Various embodiments are shown that can be implemented according to different methods. Figures 1 to 9 A close-up cross-sectional perspective view of a portion of an example aiming system implemented in an example imaging component.

[0020] Those skilled in the art will understand that the elements in the accompanying drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the drawings may be exaggerated relative to other elements to aid in understanding embodiments of the invention.

[0021] The apparatus and method configurations have been indicated in appropriate places in the accompanying drawings by conventional symbols, which show only those specific details relevant to understanding embodiments of the invention, so as not to obscure this disclosure with details that would be obvious to those skilled in the art who benefit from the description herein. Detailed Implementation

[0022] In general, these different embodiments provide a compact, high-performance autofocus barcode scanner with reduced size requirements and a wide range of autofocus distances with multiple fields of view (FOVs). More specifically, the scanner described herein can be operatively coupled to a support chassis while utilizing the full available height within the scanner housing. It should be noted that the imaging lens system is positioned adjacent to the chassis (compared to systems where the imaging lens is positioned within the chassis). Thus, the imaging lens system is not constrained by the upper height (i.e., vertical) dimension of the chassis and can be designed to occupy the entire vertical dimension. Therefore, the scanner can incorporate larger, higher-power optical units capable of resolving barcodes positioned at greater distances and over a wider range of distances from the scanner. The positioning of the illumination system allows for more uniform illumination of the target across the autofocus distance range and multiple FOVs. Additionally, the positioning of the aiming pattern generation system further reduces parallax and allows for more accurate positioning of the aiming pattern within the FOV at greater distances from the imaging system. The rigid-flexible printed circuit board eliminates the need for additional ports and electrical interconnects, which also allows for a reduction in system size, enabling the manufacture of the compact imager and scanner described herein.

[0023] Turning to the accompanying drawings, a component 100 or scanning engine is provided for capturing at least one image of an object appearing in an imaging field of view (FOV). Component 100 includes a first chassis 105 having a body 107 defining at least one cavity for receiving one or more components for performing imaging of an object or target in the FOV. Component 100 further includes a second chassis 110 including a body 112 defining at least one cavity for receiving components for performing imaging of a target in the FOV of the scanning engine. The first chassis 105 has a chassis mounting portion 108 for mounting the first chassis 105 to the second chassis 110. The chassis mounting portion 108 may include one or more pins 115a projecting from the first chassis 105. Figure 3 ) or wedge-shaped piece, wherein the one or more pins 115a or wedge-shaped pieces are fitted into sockets 115b on the second chassis 110. Figure 3 The interior of the first frame 105 and its components are physically aligned with the second frame 110 and its components contained within the body 112 of the second frame 110. Figure 1As shown, the first chassis 105 is indirectly mounted on the second chassis 110 via a PCB 116 disposed between the first chassis 105 and the second chassis 110. In examples, the first chassis 105 can be directly connected to the second chassis 110, or physically coupled to the PCB 116, which is then physically coupled to the second chassis 110.

[0024] In examples, the first chassis 105 can be composed of a plastic material, which reduces the overall weight of the assembly, and the second chassis 110 can be composed of a metal material to act as a heat sink for electrical components, optical components, lasers, illumination sources, etc. In examples, both the first chassis 105 and the second chassis 110 can independently be composed of plastic, metal, or another material to manufacture a lightweight compact imaging scan engine.

[0025] The assembly 100 includes a first circuit board 116 disposed between the first chassis 105 and the second chassis 110 adjacent the first chassis. The first circuit board 116 can include any number of electrical and / or electromechanical components (e.g., capacitors, resistors, transistors, power sources, etc.) for communicatively coupling and / or controlling various electrical components of the assembly 100. For example, the first circuit board 116 can include any number of component mounting portions 116a to receive components (e.g., imaging sensors, light emitting diodes, laser diodes, etc.) to operably couple therewith, and can additionally include one or more board mounts to secure the first circuit board 116 with the first chassis 105 and / or the second chassis 110 (not shown).

[0026] The assembly further includes a second circuit board 118 disposed on an opposite side of the second chassis 110 from the first circuit board 105 adjacent the second chassis 110. The second circuit board 110 can include any number of electrical and / or electromechanical components (e.g., capacitors, resistors, transistors, power sources, etc.) for communicatively coupling and / or controlling various electrical components of the assembly 100. For example, the second circuit board 118 can include any number of component mounting portions 118a to receive components (e.g., imaging sensors, light emitting diodes, laser diodes, etc.) to operably couple therewith, and can additionally include one or more board mounts (not shown) to secure the second circuit board 118 with the second chassis 110.

[0027] While described as first and second circuit boards 116 and 118, in embodiments, the first and second circuit boards 116 and 118 can be part of a single rigid-flex circuit board 119. The rigid-flex circuit board 119 includes one or more substantially flexible portions 117a and 117b that physically and electrically interconnect the first and second circuit boards 116 and 118 with each other, as well as with additional elements of the assembly 100. In examples, the first and second circuit boards 116 and 118 can be substantially rigid portions of the rigid-flex circuit board 119, and the flexible portions 117a and 117b are malleable and bendable portions of the rigid-flex circuit board 119. In examples, discussed further herein, the first flexible portion 117a can provide electrical communication between the first and second circuit boards 116 and 118, and the second flexible portion 117b provides electrical communication between the second circuit board 118 and the autofocus element 142. The flexible portions 117 of the rigid-flex circuit board 119 reduce the number of additional wires and electrical interconnections in the assembly 100, allowing for a simplified electrical structure and reduced overall size of the assembly 100.

[0028] In embodiments, the flexible portions 117a and 117b of the rigid-flex circuit board are disposed outside of the first and second chassis 105 and 110. As shown in the figures, the first flexible portion 117a is disposed adjacent to and substantially outside of the second chassis and interconnects the first and second circuit boards 116 and 118. The second flexible portion 117b is disposed outside of and adjacent to the second chassis 110 on an opposite side of the second chassis 110 from the first flexible portion 117a, and further interconnects the second circuit board 118 and the autofocus element 142. While illustrated as having two flexible portions 117a and 117b, it is contemplated that the rigid-flex circuit board can include additional flexible portions to provide electrical communication between the circuit boards 116 and 118 and other components of the assembly 100.

[0029] The second chassis 110 includes any number of guard protrusions 111 extending from the sides of the second chassis adjacent to the flexible portions 117a and 117b. The guard protrusions 111 extend beyond the flexible portions 117a and 117b away from the second chassis 110 to provide protection to the flexible portions 117a and 117b. The guard protrusions 111 prevent the flexible portions 117a and 117b from making physical contact with other objects. For example, if the assembly is dropped onto the ground, a table, or another surface, the guard protrusions 111 protect the flexible portions 117a and 117b from impact. Further, the guard protrusions 111 protect the flexible portions 117a and 117b from physical contact with any object having a size comparable to the size of the flexible portions 117a and 117b or contact with an object having a size greater than the size of the flexible portions 117a and 117b. The guard protrusions can include one or more pins, ridges, beams, flanges, frames, platforms, shoulders, edges, or other physical structures that protrude away from the second chassis 110 beyond the flexible portions 117a and 117b.

[0030] The close-up imaging system 120 is disposed in a first cavity 121 of the first chassis 105. The close-up imaging system 120 is operatively coupled to the first circuit board 116 and is disposed to capture image objects in a close-up FOV along the on-axis of the close-up imaging system 120. The close-up imaging system 120 includes close-up imaging optics 125 and a close-up imaging sensor 122 for capturing images in the close-up FOV. The close-up imaging optics 125 are disposed to receive light through an aperture 127 of the first chassis 105 and the close-up imaging optics 125 focus the light onto the close-up imaging sensor 122. In some examples, the close-up imaging sensor 122 is mounted to or coupled with the first circuit board 116 via a component mounting portion 116a of the first circuit board 116. The chassis mounting portion 108 can be mounted to the component mounting portion 116a of the first circuit board 116 as well as the second chassis 110. In examples, the first circuit board 116 can include a hole 116b through which one or more pins 115a of the first chassis 105 can be placed to align components of the first chassis 105 (e.g., the close-up imaging system 120) with the component mount 116a and other components disposed on the first circuit board 116. In examples, adhesive, screws, pins, or other physical elements can be used to mount the first chassis 105 to the first circuit board 116. Additionally, a thermally conductive paste or heat pipe can be used to couple the first chassis 105 and the first circuit board 116 to provide a flow of heat path from elements contained in the first chassis 105 to the second chassis 110 or another heat sink. The component mounting portion 116a can include adhesive to assist in securing the imaging sensor cover 123 to the circuit board 116. In other examples, the component mounting portion 116a can include any number of electrical interconnections that are disposed on or otherwise coupled with corresponding electrical interconnections of the circuit board 116. Other examples are possible.

[0031] The illumination system 160 is disposed in a second cavity 161 of the first chassis 105. The illumination system 160 includes an illumination source 163 disposed on the first circuit board 116. The illumination source 163 is disposed to provide illumination along both the close-up illumination axis Ii and the distance illumination axis I2. The illumination source 163 can include a single light-emitting diode (LED) or light source, or can include multiple LEDs or multiple light sources to provide illumination along both the close-up illumination axis Ii and the distance illumination axis I2. While described as using LEDs to provide illumination, the illumination source 163 can instead or additionally include one or more laser diodes (LDs), black body radiation sources, incandescent light sources, or another light source to provide radiation along the close-up illumination axis Ii and the distance illumination axis I2. For simplicity and clarity, the illumination source 163 will be described herein as having two LEDs 163a and 163b disposed adjacent to one another on the first PCB 116 to independently provide illumination along the close-up illumination axis Ii and the distance illumination axis I2. The LEDs include a distance illumination source 163a and a close-up illumination source 163b LED disposed along respective distance and close-up illumination fields Ii and I2 to provide light along the respective illumination axes. As such, the illumination source 163 can be referred to herein as a dual illumination source 163, although it will be understood that in examples the illumination source 163 can include only a single light source, or more than two light sources.

[0032] The illumination system 160 further includes illumination optics to provide illumination to one or more FOVs of the assembly 100. The illumination system 160 includes a collimator 165 that collimates the illumination light provided by the illumination source 163. In an example, the collimator 165 can be a dual lens collimator in which each lens is disposed along a respective near and far illumination axis Ii and I2 to collimate light from two independent LEDs of the dual illumination source 163. A dual optical element 168 is disposed along both the near and far illumination axis Ii and I2 to focus the illumination from the illumination source 163 into the near and far fields of view to illuminate objects in either of the near and / or far fields of view of the imaging assembly 100. The dual optical element 168 is a substrate that includes a transparent window 168a at one region of the dual optical element and a microlens array (MLA) 168b disposed at another region of the dual optical element 168, where the regions of the transparent window 168a and the MLA 168b are disposed adjacent to each other. The transparent window 168a is a material or aperture that allows light to propagate through the transparent window 168a without changing the propagation axis of the light or changing the focal point of the light propagating through the transparent window 168a. The transparent window 168a is disposed along the far illumination axis I2 and allows the illumination to propagate through the window 168a along the far illumination axis I2 to illuminate objects in the far FOV. The microlens array (MLA) 168b is disposed along the near illumination axis Ii and the MLA 168b focuses the illumination from the illumination source 163 into the near FOV to illuminate objects in the near FOV of the imaging assembly 100. As such, the illumination system 160 provides illumination to both the near and far FOVs of the imaging system 100. In an example, the MLA 168b tilts the propagation of light, and thus the near illumination axis, relative to the far illumination axis by greater than 2°. In implementations, the near illumination axis can be tilted relative to the near illumination axis by greater than 3°, 5°, 7°, or greater than 9°. In an example, the far illumination FOV is less than 25° by 25° and the near illumination can illuminate a FOV greater than 50° by 30°.

[0033] The tele-imaging system 140 is disposed in the first cavity 141 of the second chassis 110. In the illustrated example, the tele-imaging system 140 is operably coupled to the second circuit board 118. The tele-imaging system 140 includes an autofocus system 142 and a rear lens assembly 145, both of which contain lenses for imaging. The autofocus system 142 is positioned adjacent to and / or operably coupled with the rear lens assembly 145. The rear lens assembly 145 is in the form of a generally hollow body, which can have any number of features (such as shape and / or cutouts 113) that correspond to the shape of one or more lenses disposed therein. These cutouts 113 reduce the overall weight of the rear lens assembly 145, and due to the uniform thickness of the sidewalls 146a, the rear lens assembly 112 is easier to manufacture (e.g., molded via injection molding or other molding machines) as compared to lens holders with varying thicknesses.

[0034] In some examples, the rear lens assembly 145 is coupled with the second circuit board 118 via a component mounting portion 118a on the second circuit board 118. As a non-limiting example, the component mounting portion 118a can be in the form of a pad onto which the rear lens assembly 145 is pressed. The component mounting portion 118a can include an adhesive to assist in securing the rear lens assembly 145 to the second circuit board 118. In other examples, the component mounting portion 118a can include any number of electrical interconnections that are disposed on or otherwise coupled with corresponding electrical interconnections of the rear lens assembly 145. The second circuit board 118 can have any number of component mounting portions 118a having through-holes, mounting pads, etc. for mounting elements to the second circuit board 118. Other examples are possible.

[0035] The tele-imaging sensor 147 is disposed on the second circuit board 118, with the tele-imaging sensor 147 disposed along a tele-imaging axis F of the imaging assembly 100. The tele-imaging sensor 147 images a FOV further away from the one or more FOVs of the imaging assembly 100 than the FOV(s) of the close- imaging assembly 120. The autofocus system 142 includes a variable focus optical element that can vary the focal length of the tele-imaging system 140 to image different imaging planes at different focal lengths. The autofocus system 142 can include a deformable lens element, a liquid lens, a T-lens, a voice coil motor, a voice coil actuator, or other variable focus optical element. The tele-imaging system 140 includes a front lens 150 disposed outside of the second chassis 110 along the tele-imaging axis F.

[0036] The aiming system 180 is partially disposed in aiming cavities 181 of both the first chassis 105 and the second chassis 110. An aiming source 182 is disposed on a second circuit board 118, wherein the aiming source is located in cavity 181 of the second chassis 182, and the aiming source 182 is configured to provide aiming light along aiming axis A. Various optics are disposed along aiming axis A to manipulate the aiming light as it propagates through the cavity of the second chassis 105. The aiming light propagates through a drilled hole 192 in the first circuit board 116 and continues to propagate through the aiming cavity 181 in the first chassis 105. In this example, the aiming cavity 181 in the first chassis 105 is substantially cylindrical to act as a tunnel through which the aiming light can be transmitted as an aiming light path cavity. An aiming diffractive optics (DOE) in the form of a pattern generator 188 is disposed in the aiming cavity 181 of the first chassis, wherein the pattern generator 188 is disposed along aiming axis A to manipulate the aiming light to form an aiming pattern. The aiming pattern generator 188 may be a diffractive or refractive optical element for forming an aiming pattern. The aiming light source 182 is positioned in the second chassis 110, and the pattern generator 188 is positioned at the distal side 105a of the first chassis 105 to allow the various systems (e.g., close-range imaging system 120, aiming system 180, and illumination system 160) in the assembly 100 to be spaced closer together, thereby reducing the overall size of the assembly 100.

[0037] like Figure 2 and Figure 3 As shown, the close-range imaging system 120, the long-range imaging system 140, the illumination system 160, and the aiming system 180 are positioned substantially along the same horizontal axis H. Placing the illumination system 160 and the aiming system 180 along the same axis as the close-range imaging system 120 and the long-range imaging system 140 allows for further reduction in the required alignment and adjustment, providing illumination and aiming patterns for the close-range and long-range FOVs of the imaging assembly 100. Additionally, positioning all systems 120, 140, 160, and 180 substantially along the same horizontal axis lowers the overall height of the imaging assembly 100. In the example shown herein, such as in Figure 2 In this configuration, the illumination system 120 and the aiming system 180 are aligned along the same horizontal axis H centered on the second chassis 110, while the close-range imaging system 120 is offset from the horizontal axis in one direction, and the long-range imaging system 140 is offset from the horizontal axis in the opposite direction to that of the close-range imaging system 120. Each of the close-range imaging system 120 and the long-range imaging system 140 has a respective close-range FOV and long-range FOV of a larger dimension along the horizontal axis H. In this example, the close-range imaging system 120 is positioned adjacent to the aiming system 180 on the side of the aiming system 180 opposite to the illumination system 160, and the long-range imaging system 140 is positioned adjacent to the close-range imaging system 120 on the side of the close-range imaging system 120 opposite to the aiming system 180.

[0038] Figure 5 It is shown Figures 1 to 4 A diagram of the various imaging axes and propagation axes of the system of component 100. In a general example, all the far-range imaging axes F, near-range imaging axes N, aiming axes A, and far-range illumination axes I2 are parallel or substantially parallel to each other (e.g., within 3°, 5°, or 10°). Configuring the aiming axis parallel to the imaging system improves the accuracy of the position of the aiming pattern generated by the aiming system 180 in the FOV of the far-range imaging FOV at a far distance. Placing the near-range imaging system 120 next to the aiming system 180 improves the accuracy of the position of the aiming pattern generated by the aiming system 180 in the FOV of the near-range imaging system at a near distance. Placing the far-range imaging system 140 away from the aiming system 180 increases the accuracy of distance ranging based on the offset of the aiming pattern in the image from the far-range imaging system camera. Thus, more accurate placement of the aiming pattern allows for more efficient operation and more accurate scanning of objects presented to the imaging component 100. The close-range imaging system 120 has a wider field of view (FOV), and therefore allows potentially more unwanted light (such as ambient light or stray light from the illumination system 160) to enter the close-range imaging system 120, which may result in a noisier image and reduce the efficiency of scanning objects within the close-range FOV of the component 100. Positioning the aiming system 180 between the close-range imaging system 120 and the illumination system 160 reduces the noise in the close-range imaging system 120 caused by the illumination system 160. The MLA 168b focuses the close-range illumination at an angle along the close-range illumination axis I1. Tilt the close-range illumination along the close-range illumination axis I1 to illuminate the object at a distance closer to the component than the far-range FOV illuminated by the far-range illumination.

[0039] In an example, the long-range imaging sensor 147 can be a 3.8 x 2.4 mm active area photodiode, and the near-range imaging sensor can be a 4.8 x 2.7 mm photodiode. The resulting long-range imaging FOV is a 12° by 7° field of view, and the resulting near-range imaging FOV is a 42° by 27° field of view. In an example, the near-range imaging system 120 can have a FOV greater than 42° by 25°, and the long-range imaging system can have a FOV less than 15° by 10°. The aiming pattern can be provided by a collimated and patterned light beam having a 1 x 1.4 mm collimated beam size provided to the long-range imaging FOV, and a patterned light beam having a 42° by 27° aiming FOV provided to the near-range imaging FOV. Long-range illumination from the collimator 165 having a 5.6 x 3.8 mm collimated beam size results in illumination in a 19° by 19° FOV in the long-range imaging FOV. After passing through the MLA 168a, the near-range illumination provided by the illumination system 160 illuminates a 55° by 33° FOV in the near-range imaging FOV. In the current example, the near-range illumination axis II is at a 2.5° tilt angle compared to the other imaging and illumination axes of the assembly 100. The resulting overall dimensions of the assembly 100 can be less than 35 mm by 12 mm by 25 mm.

[0040] Figures 6 to 8 The various components of the long-range imaging system 140 are shown in more detail. As previously described, the long-range imaging system 140 includes the compensator lens assembly 150, the variable focus assembly 144, the rear lens assembly 145, and the long-range imaging sensor 147. With brief reference to Figure 1 The rear lens assembly 145 has a central lens barrel 146, a mounting flange 145a, and a mounting tab 145b. The central lens barrel 146 contains the fixed focus optical group 154. The mounting flange 145a extends perpendicularly away from the lens barrel 146 from a first end of the lens barrel 146, and the mounting tab 145b protrudes from a bottom of the side wall 146a on an end of the lens barrel 146 opposite the mounting flange 145a. The mounting flange 145a physically couples the variable focus optical element housing 143 with the rear lens assembly 145. The mounting tab 145b extends in the direction of the optical axis F and physically couples the rear lens assembly 145 with the second printed circuit board 118 to maintain the position of the lens barrel 146 of the long-range imaging system 140 and the optics and elements (i.e., the lenses positioned inside the rear lens assembly 145, the variable focus assembly 144, the compensator lens assembly 150, etc.) relative to the long-range imaging sensor 147.

[0041] In an example, the lens barrel 146 has a first outer diameter 146d1 towards a first end of the lens barrel 146 (i.e., the end with the flange 145a), and the lens barrel 146 tapers to a smaller second outer diameter 146d2 at a second end of the lens barrel 146 (i.e., the end with the tab 145b). The tapering of the outer diameter of the lens barrel allows the piece to be machined using injection molding. The tapering allows the molded part to pop out of the mold cavity. Further, having two different diameters along the lens barrel 146 allows for control of the tilt and lateral positioning (i.e., in a direction normal to the optical axis F) of the optics housed in the rear lens assembly 145 to adjust the imaged light onto the telephoto imaging sensor 147. The second outer diameter 146d2 minimizes the positioning features used to couple the telephoto lens assembly 140 with the second chassis 110, which reduces the physical constraints on the lens assembly 140 during construction, allowing for more physical adjustability of the lens assembly 140.

[0042] The fixed focus optical group 154 can include a plurality of lenses disposed in the hollow body of the rear lens assembly 145 to provide an image to the telephoto imaging sensor 147. The cutout 113 in the cavity of the rear lens assembly 145 can provide physical support to the lenses and optics disposed in the rear lens assembly 145 to position the lenses and optics relative to each other and to other elements of the telephoto imaging system 140. The fixed focus optical group 154 is disposed along the telephoto imaging axis F, and as such, the telephoto imaging axis F can be referred to herein as the optical or imaging axis of the telephoto imaging system 140. The fixed focus optical group 154 is disposed to receive light from the zoom assembly 144 and can include one or more lenses, including but not limited to convex lenses, concave lenses, asymmetric lenses, plastic lenses, glass lenses, aspheric plastic lenses, aspheric lenses, field stops, iris diaphragms, and / or apertures. The fixed focus optical group 154 is configured to focus light at a flange focal distance of 18.766 mm for the telephoto imaging system 140 optical assembly. Depending on various conditions of the optical system, the present embodiment has an effective focal length between 19.47 mm and 19.92 mm. Depending on the optical elements used, the flange focal distance and effective focal length of the system can be adjusted on the order of millimeters, tens of millimeters, or even hundreds of millimeters. The telephoto imaging sensor 147 receives the light at the flange focal distance and generates a signal indicative of the received light to generate an image of an object in the FOV of the telephoto imaging system 140. The telephoto imaging system 140 is mounted in the second chassis 110, and in an example, the second chassis 110 is a zinc alloy having a low coefficient of thermal expansion. The telephoto imaging system 140 is fastened to the second chassis 110 at an axial position that minimizes the change in its focal position due to changes in temperature relative to the sensor 147, which takes advantage of the low expansion coefficient of the zinc alloy second chassis 110.

[0043] In addition to providing physical support for the location of the fixed focus optical group 154, the rear lens assembly 145 further acts as an optical baffle to reduce stray light in the tele-imaging system 140. The rear lens holder 154 can include structural features that act as the baffle itself, or can include a separate element that is the optical baffle. In an example, the fixed focus optical group 154 includes an optical baffle 156 disposed between lenses of the fixed focus optical group 154 along the optical axis F. The optical baffle 156 can be machined from a metallic material, such as a relatively light metal (e.g., aluminum), which allows for thinner walls and lighter weight of the baffle 156, allowing for an overall smaller size of the tele-imaging system 140. In an example, the optical baffle 156 can be of any material, but a tradeoff of cost, weight, and material can be considered. A lightweight material for the optical baffle 156 reduces the overall risk of adhesive bond failure during mechanical shock, such as dropping the assembly 100 or other physical impact to the assembly 100 or tele-imaging system 140.

[0044] The baffle 156 can have an outer diameter of less than 6 mm, less than 8 mm, less than 10 mm, or less than 20 mm. In a specific example, the optical baffle 156 has a nominal outer diameter of 5.8 mm. The optical baffle 156 has a first baffle stop edge 156a and a second baffle stop edge 156b, both of which block further propagation of stray light along the optical axis F. The baffle 156 acts as a field stop that reflects stray light into the walls of the baffle 156 and the lens barrel 146. The baffle 156 can be covered in a dark color coating, such as a black finish or paint, to increase absorption of light into the walls of the baffle 156 to further reduce stray light in the tele-imaging system 140.

[0045] The variable focus assembly 144 is physically coupled to the fixed focus optical group 145 at the flange 145a. In an example, the variable focus optical element housing 143 is physically coupled to the rear lens assembly 145 via the arms 143a of the housing 143. The variable focus optical element housing 143 can be physically coupled to the mounting flange 145a by adhesive or other suitable coupling mechanism. The autofocus system 142 is disposed in and protected by the variable focus optical element housing 143 from damage to the autofocus system 142. In an example, the autofocus system 142 includes a variable focus optical element disposed along the optical axis F to receive light from the compensator lens assembly 150. The variable focus optical element of the autofocus system can include a voice coil motor, a liquid lens, a T-lens, or another optical element with a variable focal plane or focal length for adjusting the flange focal distance of the tele-imaging system 140. The autofocus system 142 and associated variable focus optical element can be disposed entirely or partially inside the variable focus optical element housing 143, and from this, the housing 143 supports the location of the autofocus system 142 along the optical axis F.

[0046] The compensator lens assembly 150 is disposed along the tele-imaging axis F to receive light from the tele-imaging FOV of the assembly 100. The compensator lens assembly 150 includes a compensator lens 153 positioned along the optical axis F to adjust the focal flange length of the tele-imaging system 140 optical assembly. In an example, the compensator lens 153 is a glass lens with positive optical power, and the glass lens can have an anti-reflective coating, an infrared blocking coating, a bandpass coating, or another optical coating disposed thereon to reduce reflections or filter light propagating through the lens. The compensator lens assembly 150 includes a compensator lens housing 152 that contains the compensator lens 153. In an example, the compensator lens 153 is partially or entirely disposed inside the compensator lens housing 152. The compensator lens housing 152 supports the position of the compensator lens 153 along the optical axis, and the compensator lens housing 152 can be used to adjust the position of the compensator lens along the tele-imaging axis F in positioning and laterally along dimensions orthogonal to the tele-imaging axis F. The compensator lens housing 152 is physically coupled to the variable focus optical element housing 143 to maintain the position of the compensator lens 143 relative to the variable focus assembly 142 and the optics of the fixed focus optical group 154 to focus the image of the FOV onto the tele-imaging sensor 147.

[0047] In an example, the compensator lens housing 152 is physically coupled to the variable focus optical element housing by an adhesive 151, a mount, or other coupling mechanism. The adhesive 151 reduces the overall size of the tele-imaging system 140 and eliminates the need for other lens retainers or physical mounting structures. The adhesive 151 also allows for active adjustment and alignment of the flange focal distance of the tele-imaging assembly 140 after the variable focus assembly 144, the fixed focus optical group, and the rear lens assembly 145 have been positioned along the tele-imaging axis F to provide an image to the tele-imaging sensor 147. By using the adhesive 151, the compensator lens assembly 150 can be manually or automatically adjusted by a person or machine to adjust the flange focal plane of the tele-imaging assembly 140 onto the tele-imaging sensor 147. The thin bead of adhesive 151 also provides a seal between the compensator lens assembly 150 and the variable focus assembly 144 that protects the optics of the variable focus assembly 144 (e.g., autofocus system 142, liquid lens, T-lens, voice coil motor, etc.) from dust, fluids, or debris from entering the system and contaminating the image. Generally, active alignment of the optics can require adjustment of the flange focal plane by adjusting the focal distance of the variable focus optics, which reduces the total available focal distance range of the optical system. Using the compensator lens 150 to adjust the flange focal distance maintains the widest focal plane range of the tele-imaging system 140 by compensating for any focal plane errors including focal distance, plane tilt, or lateral position to provide a focused image at the tele-imaging sensor 147 that maintains the focus range of the system 140. Tipping and tilting of longer optical systems with multiple lenses and adjustable optics is generally limited due to the housing structure and surrounding physical chassis and structures. Thus, the compensator lens assembly 150 allows for a wide range of focal plane and image adjustment relative to other comparable optical systems. Further, the use of the compensator lens assembly 150 allows for the use of larger physical mounts and couplings, such as the flange 143a, which allows for the use of larger compensator lenses. Larger lenses 153 collect more light than smaller lenses, which provides higher resolution or higher quality images across multiple imaging and scanning systems metrics. The compensator lens 153 further allows for consistent system performance across devices including the described tele-imaging system 140, resulting in a high quality consistent imaging assembly 100. Due to the use of multiple features, such as dual diameter lens barrels, small form factor baffle 156, stable positioning of the optics using the flange 145a and tab 145b, and the adhesive 151, the overall size of the tele-imaging system can be 20 mm along the optical axis F and have a lateral depth and width of 10 mm by 9 mm or less. The described mounting features (e.g., mounting flange 143a, tab 145b, etc.) reduce the risk of misalignment or misalignment of the tele-imaging system 140 in the assembly 100. Further, the adhesive and mounting pads secure other systems and elements of the system in place within the assembly.It is conceivable that other physical mounting elements, features, adhesives, screws, or other physical couplers can be used to mount components and prevent any misalignment or ejection of components during physical impact events (e.g., falling onto a floor or surface, being bumped or pushed during transport, etc.). For example, the first chassis 105 can be further physically secured to the telephoto imaging system 140 and the second chassis 110 by an adhesive between the first chassis 105 and the telephoto imaging system 140 and / or the second chassis 110 to increase the physical stability of the first chassis and the components disposed therein.

[0048] refer to Figure 1 , Figure 9 and Figure 10 This document describes in detail the aiming system 180 and its environment. As previously described, the aiming system 180 includes an aiming source 182 and other components, such as a collimating lens or lens assembly 183 extending along axis A in a first direction. The aiming source 182 generates light to aid in the identification of the field of view (FOV). The collimating lens 183 is provided to control the light emitted from the aiming source 182. A pattern generator (or Design of Effect) 188 generates a decorative pattern from the emitted light to aid in the identification of the FOV. As previously described, the aiming system 180 is at least partially disposed within a cavity or enclosed volume 181 of a second chassis 110. More specifically, the enclosed volume 181 of the chassis 110 includes a chassis mounting portion 184 and a redirection region 185 at least partially surrounding the chassis mounting portion 184. In the illustrated example, the chassis mounting portion 184 is in the form of a surface that receives and holds a portion of the aiming system 180.

[0049] The redirection region 185 is in the form of a surface or sidewall that can redirect light or electromagnetic radiation propagating in a first direction (i.e., in the direction parallel to axis A) to a second direction (i.e., in the direction toward axis A). More specifically, as Figure 10 As shown, the redirection region 185 takes the form of multiple curved surfaces. In some examples, such surfaces may be approximately parabolic in shape. However, other examples and arrangements are also possible, such as, for example, generally flat, angled surfaces, or surfaces with any desired curvature or shape. In some examples, the redirection region 185 may be reflective or semi-reflective to facilitate the redirection of light or electromagnetic radiation. In these and other examples, the redirection region 185 may have additional surface treatments that result in a desired surface smoothness. For example, the redirection region 185 may have a surface roughness of approximately 0.8 micrometers (compared to the rest of chassis 110, which has a surface roughness between approximately 1.6 and 3.2 micrometers). As a result, the redirection region 185 may have a relatively smoother surface than the rest of chassis 110 to facilitate electromagnetic radiation reflection. It should be understood that the redirection region 185 may have different and / or additional surface treatments applied thereto to result in a further reduction in roughness values.

[0050] The adhesive 186 is used to couple, secure, and / or otherwise retain components with the chassis 110. It should be appreciated that while not shown, adhesive 186 can be provided to couple, secure, and / or otherwise retain any number of additional components. More specifically, the adhesive 186 can be used to couple the collimating lens 183 with the chassis 110 at the chassis mounting portion 184. In some examples, the adhesive 186 can be coupled with the chassis mounting portion 184 first, whereby the collimating lens 183 is placed on the adhesive 186, but in other examples, the adhesive 186 can be coupled with the collimating lens 183 first, whereby the collimating lens 183 and adhesive 186 can be placed on the chassis mounting portion 184. In either of these or other arrangements, proper placement of the collimating lens 183 relative to the chassis is desired to achieve high performance of the sighting system 180. In some examples, an active alignment procedure is performed to ensure that the collimating lens 183 is properly set relative to the sighting source 182.

[0051] In some examples, the collimating lens 183 can be constructed of a plastic material such as, for example, polycarbonate. In some examples, the collimating lens 183 can have an opaque housing or body to achieve improved optical performance. The opaque collimating lens 183 can help block stray light from entering and / or escaping the sighting system 180 as compared to previous designs that use transparent and / or translucent components.

[0052] When the collimating lens 183 (or any other component of the unit 100) is properly placed and aligned with the chassis mounting portion 184, a curing process is initiated to cause the adhesive 186 to secure the collimating lens 183 at the desired location. This process can be a single-stage or multi-stage procedure whereby electromagnetic radiation (e.g., ultraviolet (“UV”) light or any other light source) is directed at the adhesive to cure. While previous systems that use a transparent or translucent collimating lens are able to perform such curing by simply directing electromagnetic radiation in an axial direction along the axis A, whereby the electromagnetic radiation passes through the transparent or translucent collimating lens and reaches the adhesive 186, in examples where the collimating lens 183 (or other component) is constructed of an opaque material, such a configuration can block and / or otherwise prevent or hinder the electromagnetic radiation from reaching the adhesive. Further, given the compact design of the unit 100, it can not be possible to attempt to direct the electromagnetic radiation at an angle that causes the electromagnetic radiation to contact the adhesive. However, because the presently described unit 100 incorporates the sighting cavity 181 with the redirecting region 185, light, heat, or other electromagnetic radiation can be directed into the cavity 181 in a direction parallel to the axis A toward the redirecting region 185, the shape, arrangement, and / or surface treatment(s) applied thereto cause such light, heat, or other electromagnetic radiation to reflect toward the adhesive 186 to initiate curing.

[0053] As previously mentioned, in some examples, the redirecting region 185 can have a generally parabolic shape. The dimensions of such an arrangement of the redirecting region 185 can be determined such that the focal point of the parabola (or other shape) is positioned at the location of the adhesive 186. In these and other arrangements, the redirected or otherwise reflected electromagnetic radiation will contact the adhesive 186 and cause it to cure.

[0054] It will be appreciated that, in some forms, the curing process can be completed in a single step. However, in other examples, the curing process can include multiple steps, where electromagnetic radiation is first directed to the redirecting region 185 to initiate curing, and a second curing process can occur thereafter. In some examples, the collimating lens 183 can be further positioned and / or aligned between these two curing steps. Further, in some examples, the second curing step can include the application of a heat source generated by a heating element to the aiming cavity 181. In other examples, during this second step, electromagnetic radiation can again be directed toward the redirecting region. Other examples are possible.

[0055] So arranged, the scanning unit 100 can incorporate any number of redirecting regions to assist in securing any number of desired components that require precise alignment. Such an arrangement is particularly beneficial in the present system, which occupies a reduced overall volume and thus has smaller component cavities. Advantageously, the sealed cavity can be less susceptible to contamination of the interior surfaces that can otherwise affect the performance of the aiming system 180. Such contaminants can include foreign matter and / or moisture. The sealed cavity can additionally provide a barrier against external light sources from entering the aiming system 180, from other systems entering the aiming system 180, and from stray light generated by the aiming system 180 creating artifacts from the engine 100.

[0056] The above description relates to block diagrams of the figures. Alternative implementations of the examples represented by the block diagrams include one or more additional or alternative elements, processes, and / or devices. Additionally or alternatively, one or more of the example blocks in the figures can be combined, divided, rearranged, or omitted. The components represented by the blocks in the figures are implemented by hardware, software, firmware, and / or any combination of hardware, software, and / or firmware. In some examples, at least one of the components represented by the blocks is implemented by a logic circuit. As used herein, the term "logic circuit" is expressly defined as a physical device that includes at least one hardware component that is configured (e.g., via operation based on a predetermined configuration and / or via execution of stored machine-readable instructions) to control one or more machines and / or perform operations of one or more machines. Examples of logic circuits include one or more processors, one or more coprocessors, one or more microprocessors, one or more controllers, one or more digital signal processors (DSPs), one or more application-specific integrated circuits (ASICs), one or more field-programmable gate arrays (FPGAs), one or more microcontroller units (MCUs), one or more hardware accelerators, one or more special-purpose computer chips, and one or more system-on-a-chip (SoC) devices. Some example logic circuits, such as ASICs or FPGAs, are specially configured hardware to perform operations (e.g., one or more of the operations described herein and represented by the process graphs of the present disclosure, if present). Some example logic circuits are hardware that executes machine-readable instructions to perform operations (e.g., one or more of the operations described herein and represented by the process graphs of the present disclosure, if present). Some example logic circuits include a combination of specially configured hardware and hardware that executes machine-readable instructions.

[0057] As used herein, each of the terms "tangible machine-readable medium," "non-transitory machine-readable medium," and "machine-readable storage device" is expressly defined as a storage medium (e.g., a platter of a hard disk drive, a disc of a digital versatile disc, an optical disc, a flash memory, a read-only memory, a random access memory, etc.) on which machine-readable instructions (e.g., program code in the form of software and / or firmware) are stored for any suitable duration of time (e.g., permanently, for an extended period of time (e.g., while a program associated with the machine-readable instructions is executing), and / or for a short period of time (e.g., while the machine-readable instructions are cached and / or in a buffering process)). Furthermore, as used herein, each of the terms "tangible machine-readable medium," "non-transitory machine-readable medium," and "machine-readable storage device" is expressly defined to exclude propagating signals. That is, as used in any claim of this patent, any of the terms "tangible machine-readable medium," "non-transitory machine-readable medium," and "machine-readable storage device" cannot be understood to be implemented by propagating signals.

[0058] In the foregoing specification, specific embodiments have been described. However, one of ordinary skill in the art appreciates that various modifications and changes can be made without departing from the scope of the present application as set forth in the claims below. Accordingly, the specification and figures are to be regarded in an illustrative manner and not a restrictive one, and all such modifications are intended to be included within the scope of the present teachings. Additionally, the described embodiments / examples / implementations should not be interpreted as mutually exclusive, but rather as potentially combinable, if such combinations are in any way permissible. In other words, any feature disclosed in any of the foregoing embodiments / examples / implementations can be included in any of the other foregoing embodiments / examples / implementations.

[0059] These benefits, advantages, problem solutions, and any element(s) that can cause any benefit, advantage, or solution to occur or become more pronounced are not to be construed as a critical, required, or essential feature or element of any or all the claims. The claimed application is only defined by the claims as set forth below, including any modifications made during the pendency of this application and all equivalents of those claims as issued.

[0060] Furthermore, relational terms such as first and second, top and bottom, and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. The terms "comprises," "comprising," "has," "having," "includes," "including," "contains," "containing," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises, has, includes, or contains a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises a," "has a," "includes a," or "contains a," with nothing subsequent in the list of elements, does not, without more constraints, preclude the existence of additional elements in the process, method, article, or apparatus that are the same as those elements listed. The terms "a" and "an" are defined as one or more unless explicitly stated otherwise herein. The terms "substantially," "essentially," "approximately," "about," or any other version thereof, are defined as being close to as understood by one of ordinary skill in the art, and in one non-limiting embodiment the term is defined to be within 10% of the value as a lower limit and 90% of the value as an upper limit, in another embodiment within 5% of the value as a lower limit and 95% of the value as an upper limit, in another embodiment within 1% of the value as a lower limit and 99% of the value as an upper limit, and in another embodiment within 0.5% of the value as a lower limit and 99.5% of the value as an upper limit. The term "coupled" as used herein is defined as connected, although not necessarily directly and not necessarily mechanically. A device or structure that is "configured" in a certain way is configured at least in that way, but can also be configured in ways not listed.

[0061] The Abstract of the Disclosure provided herein is for the purpose of allowing the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or the meaning of the claims. In addition, in the above Detailed Description, various features can be grouped together or enumerated separately for the purpose of streamlining the disclosure. This disclosure is not to be interpreted as reflecting an intention that the claimed embodiments require more features than the claims do, nor do the claims require features more than the single claim is expressed as reflecting. Rather, inventive subject matter can lie in fewer than all features of a single disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, where each claim can stand on its own as a separate disclosed embodiment.

Claims

1. An imaging apparatus comprising: a first chassis comprising a body defining at least one cavity, the first chassis comprising a chassis mounting portion; a second chassis comprising a body defining at least one cavity, the first chassis mounted to the second chassis by the chassis mounting portion of the first chassis; a close range imaging system disposed in a cavity of the first chassis, the close range imaging system comprising close range imaging optics to capture at least one image of an object appearing in a field of view along a close range imaging axis of the close range imaging system onto an imaging plane; a long range imaging system disposed in a cavity of the second chassis, the long range imaging system comprising long range imaging optics to capture at least one image of an object appearing in a field of view along a long range imaging axis of the long range imaging system onto an imaging plane; an illumination system disposed in a cavity of the first chassis, the illumination system comprising illumination optics to provide illumination to the field of view of each of the close range imaging optics and the long range imaging optics; a collimation system disposed adjacent to the illumination system, the collimation system comprising a collimation path cavity in the first chassis and a collimation light source disposed in a cavity of the second chassis to provide a collimation pattern along a collimation axis in the field of view of each of the close range imaging optics and the long range imaging optics; wherein the close range imaging system is disposed adjacent to the collimation system on a side of the collimation system opposite a side of the illumination system; and the long range imaging system is disposed adjacent to the close range imaging system on a side of the close range imaging system opposite the collimation system.

2. The imaging apparatus of claim 1, further comprising: a first circuit board disposed adjacent to the first chassis between the first chassis and the second chassis; and a second circuit board disposed adjacent to the second chassis on a side of the second chassis opposite a side of the first circuit board. the illumination system comprises at least one illumination source disposed on the first circuit board.

3. The imaging apparatus of claim 2, wherein the collimation system comprises at least one collimation radiation source disposed on the second circuit board positioned to provide collimation radiation along a collimation axis through the collimation path cavity.

4. The imaging apparatus of claim 2, wherein the close range imaging system comprises a close range image detector disposed on the first circuit board configured to capture images of objects in a close range field of view of the imaging apparatus.

5. The imaging apparatus of claim 2, wherein the long range imaging system comprises a long range image sensor disposed on the second circuit board configured to capture images of objects in a long range field of view of the imaging apparatus.

6. The imaging apparatus of claim 2, wherein the first chassis is constructed of a plastic material.

7. The imaging apparatus of claim 1, wherein the illumination system comprises:

8. The imaging apparatus of claim 1, wherein a long range illumination source disposed to provide long range illumination along a long range illumination axis to a long range field of view of the imaging apparatus; ​ a close-up illumination source disposed to provide close-up illumination along a close-up illumination axis toward a close-up field of view of the imaging device; an illumination collimator disposed in a cavity of the first chassis along the long-range illumination axis and the close-up illumination axis, the illumination collimator disposed to collimate the long-range illumination and the close-up illumination; and a multi-lens array disposed along the close-up illumination axis, the multi-lens array configured to spread the close-up illumination to illuminate the close-up field of view of the imaging device.

9. The imaging apparatus of claim 8, wherein, the close-up illumination axis is angled relative to the long-range illumination axis.

10. The imaging apparatus of claim 8, wherein, the long-range illumination illuminates a field of view less than 25° by 25°.

11. The imaging apparatus of claim 8, wherein the close-up illumination illuminates a field of view greater than 50° by 30°.

12. The imaging apparatus of claim 1, wherein, the aiming system further comprises an aiming optical element disposed along the aiming axis to form an aiming pattern in the field of view of the imaging device.

13. The imaging apparatus of claim 12, wherein, the aiming optical element comprises a diffractive optical element or a refractive optical element.

14. The imaging apparatus of claim 1, wherein, the aiming axis is parallel to the long-range imaging axis.

15. The imaging apparatus of claim 1, wherein, the close-up imaging system has a field of view greater than 42° by 25°.

16. The imaging apparatus of claim 1, wherein, the long-range imaging system has a field of view less than 15° by 10°.

17. The imaging apparatus of claim 1, wherein each of the illumination system, the aiming system, the close-up imaging system, and the long-range imaging system are disposed relative to one another along a horizontal axis of the imaging device, the horizontal axis parallel to a larger dimension direction of imaging fields of view of the close-up imaging system and the long-range imaging system.

18. The imaging apparatus of claim 1, wherein, the imaging device has an overall size less than 35 mm by 12 mm by 25 mm.

19. The imaging device of claim 1, further comprising a rigid-flex printed circuit board, wherein a first portion of the rigid-flex printed circuit board is disposed between the first chassis and the second chassis adjacent to the first chassis, and a second circuit board is disposed on an opposite side of the second chassis from a side of the first circuit board, and a flexible portion of the rigid-flex printed circuit board is disposed at least partially external to the first chassis and the second chassis, the flexible portion physically and electrically coupling the first portion of the rigid-flex printed circuit board with a second portion of the rigid-flex printed circuit board.

20. The imaging device of claim 19, further comprising at least one guard protrusion extending along a length of the flexible portion of the rigid-flex printed circuit board from the first chassis or the second chassis, the guard protrusion having a height such that the at least one guard protrusion extends beyond the flexible portion of the rigid-flex printed circuit board to physically guard the rigid-flex printed circuit board.

Images