Ceramic, preparation method thereof and electrostatic chuck

Abstract

The invention relates to ceramic, a preparation method thereof and an electrostatic chuck. The ceramic is prepared from the following raw materials in parts by mass: 72-97 parts of aluminum oxide, 1-10 parts of titanium nitride, 1-8 parts of titanium fluoride, 1-5 parts of aluminum fluoride and 1-5 parts of manganese nitride. Aluminum oxide, titanium nitride, titanium fluoride, aluminum fluoride and manganese nitride in a proper proportion are used as preparation raw materials, and the raw materials are matched with one another, so that the maximum load of the prepared ceramic is relatively large, the bending strength is relatively high, and the bearing capacity of the ceramic is relatively good.

Description

Technical Field

[0001] The present application relates to the field of ceramic technology, and in particular to a ceramic and a preparation method thereof, and an electrostatic chuck. Background Art

[0002] Electrostatic chucks are widely used in semiconductors, panel displays, optics and other fields, playing an important role in processes that require high precision and stable clamping. For example, in semiconductor manufacturing, electrostatic chucks are core components of equipment such as physical vapor deposition (PVD), etching technology (ETCH), and ion implantation, and are used to evenly clamp ultra-thin wafers. Electrostatic chucks usually use highly thermally conductive and high-temperature resistant materials, such as alumina ceramics. However, the load-bearing capacity of traditional electrostatic chucks made of alumina ceramics needs to be further improved. Summary of the invention

[0003] Based on this, the present application provides a ceramic with good load-bearing capacity and a preparation method thereof, and an electrostatic chuck.

[0004] The technical solution of this application to solve the above technical problems is as follows.

[0005] The first aspect of the present application provides a ceramic, the preparation raw materials of which include, by mass: 72 to 97 parts of aluminum oxide, 1 to 10 parts of titanium nitride, 1 to 8 parts of titanium fluoride, 1 to 5 parts of aluminum fluoride and 1 to 5 parts of manganese nitride.

[0006] In some of the embodiments, the ceramic is prepared from raw materials, by weight: 80-97 parts of aluminum oxide, 1-8 parts of titanium nitride, 1-5 parts of titanium fluoride, 1-4 parts of aluminum fluoride, and 1-3 parts of manganese nitride.

[0007] In some of the embodiments, in the ceramic, the mass ratio of the titanium fluoride to the titanium nitride is 0.6-1.7:1.

[0008] A second aspect of the present application provides a method for preparing a ceramic, comprising the following steps:

[0009] By weight, 72-97 parts of aluminum oxide, 1-10 parts of titanium nitride, 1-8 parts of titanium fluoride, 1-5 parts of aluminum fluoride and 1-5 parts of manganese nitride are used as powder raw materials to prepare a green body;

[0010] The green body is sintered to prepare ceramics.

[0011] In some of the embodiments, in the method for preparing the ceramic, the sintering temperature is 1400° C. to 1600° C.;

[0012] And / or, the sintering atmosphere includes nitrogen and hydrogen; optionally, in the sintering atmosphere, the volume content of the hydrogen is greater than or equal to the volume content of the nitrogen.

[0013] In some of these embodiments, in the method for preparing the ceramic, the steps for preparing the green body include the following:

[0014] Mix the powder raw materials with a binder and a solvent, and then perform ball milling to prepare a slurry;

[0015] Shape the slurry to prepare a green body.

[0016] In some of these embodiments, in the method for preparing the ceramic, the mass of the binder is 5% - 15% of the total mass of the powder raw materials;

[0017] And / or, the binder includes polyvinyl butyral acetate;

[0018] And / or, the mass of the solvent is 13% - 25% of the total mass of the powder raw materials;

[0019] And / or, the solvent includes at least one of acetone and butylene carbonate; optionally, the solvent includes acetone and butylene carbonate, and the mass ratio of acetone to butylene carbonate is 1:0.15 - 0.5;

[0020] And / or, the particle size D50 of the powder in the slurry is ≤ 0.3 μm;

[0021] And / or, the viscosity of the slurry is 16000 mPa·s - 30000 mPa·s.

[0022] In some of these embodiments, in the method for preparing the ceramic, before the shaping and after the ball milling, it further includes a step of degassing the intermediate slurry obtained by ball milling; optionally, the temperature of the degassing is 20°C - 30°C.

[0023] In some of these embodiments, in the method for preparing the ceramic, the shaping is tape casting, and the green body is a green sheet;

[0024] Before the sintering, it further includes the following steps: After setting electrode paste on at least one surface of the green sheet, perform isostatic pressing; optionally, the pressure of the isostatic pressing is 15000 PSI - 30000 PSI, and the temperature of the isostatic pressing is 70°C - 90°C.

[0025] The third aspect of the present application provides the use of the ceramic prepared by the method for preparing the ceramic provided in the first aspect or the ceramic provided in the second aspect in the preparation of an electrostatic chuck.

[0026] Advantageous effects:

[0027] The ceramic of the present application uses appropriate proportions of alumina, titanium nitride, titanium fluoride, aluminum fluoride, and manganese nitride as raw materials for preparation. Among them, alumina is used as the matrix, aluminum fluoride is used as a cosolvent, and titanium nitride, titanium fluoride, and manganese nitride are added, which can effectively improve the hardness, mechanical strength, and wear resistance of the ceramic. At the same time, the combination of titanium nitride, titanium fluoride, aluminum fluoride, and manganese nitride can also improve the electrical conductivity of the ceramic; the raw materials cooperate with each other, making the maximum load of the obtained ceramic relatively large and the flexural strength relatively high, thereby enabling the ceramic to have better load-bearing capacity. Description of the Drawings

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application and more completely understand the present application and its beneficial effects, the following will briefly introduce the drawings required for use in the description of the embodiments. Obviously, the following-described drawings are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0029] Figure 1 It is a test result diagram of the dielectric constant and loss of the ceramic provided in Example 1. Detailed Embodiments

[0030] The following will further describe the present application in detail in combination with the embodiments and implementation manners. It should be understood that these embodiments and implementation manners are only used to illustrate the present application and not to limit the scope of the present application. The purpose of providing these embodiments and implementation manners is to make the understanding of the disclosed content of the present application more thorough and comprehensive.

[0031] It should also be understood that the present application can be implemented in many different forms and is not limited to the embodiments and implementation manners described herein. Those skilled in the art can make various changes or modifications without departing from the connotation of the present application, and the equivalent forms obtained also fall within the protection scope of the present application. For example, the features described or illustrated as part of one embodiment can be combined in a suitable manner with another embodiment to produce a new embodiment. In addition, in the following description, a large number of specific details are given to provide a more thorough understanding of the present application. It should be understood that the present application can be implemented without one or more of these details.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present application belongs. The terms used in the description of the present application in this specification are only for the purpose of describing the embodiments and implementation manners and are not intended to limit the present application.

[0033] Unless otherwise stated or there are contradictions, the terms or phrases used herein have the following meanings:

[0034] In this application, terms such as "multiple", "multiple types", "multiple times", etc., unless otherwise specifically defined, mean greater than or equal to 2 in quantity. For example, "one or more types" means one type or two or more types.

[0035] As used herein, "its combination", "any combination thereof", "any combination mode thereof", etc. include all suitable combination modes of any two or more than two of the listed items.

[0036] In this document, the "suitable" in "suitable combination mode", "suitable mode", "any suitable mode", etc. is subject to being able to implement the technical solution of this application, solve the technical problems of this application, and achieve the expected technical effects of this application.

[0037] In this document, "preferred", "better", "more preferable", "it is advisable" are only used to describe the implementation modes or examples with better effects. It should be understood that they do not constitute a limitation on the protection scope of this application. If there are multiple "preferred" in a technical solution, unless otherwise specified and there are no contradictions or mutual restrictions, each "preferred" is independent of each other.

[0038] In this application, "further", "even further", "especially", etc. are used for descriptive purposes, indicating differences in content, but should not be understood as a limitation on the protection scope of this application.

[0039] In this application, "optionally", "optional", "optional" mean that it can be either present or absent, that is, it refers to any one of the two parallel options of "present" or "absent". If there are multiple "optional" in a technical solution, unless otherwise specified and there are no contradictions or mutual restrictions, each "optional" is independent of each other.

[0040] In this application, in "the first aspect", "the second aspect", "the third aspect", "the fourth aspect", etc., the terms "first", "second", "third", "fourth", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or quantity, nor can it be understood as implicitly indicating the importance or quantity of the indicated technical features. Moreover, "first", "second", "third", "fourth", etc. only serve the purpose of non-exhaustive listing and description, and it should be understood that they do not constitute a closed limitation on quantity.

[0041] In this application, for the technical features described in an open-ended manner, it includes the closed technical solutions composed of the listed features, as well as the open-ended technical solutions containing the listed features.

[0042] As used herein, the terms "and / or", "or / and", and "and / or" include any one of two or more related listed items, as well as any and all combinations of the related listed items. The said any and all combinations include any two related listed items, any more than two related listed items, or the combination of all related listed items. It should be noted that when at least three items are connected by at least two conjunctions selected from "and / or", "or / and", and "and / or", it should be understood that in this application, this technical solution undoubtedly includes the technical solution connected by "logical AND", and also undoubtedly includes the technical solution connected by "logical OR". For example, "A and / or B" includes three parallel solutions: A, B, and A + B. Another example, the technical solution of "A, and / or, B, and / or, C, and / or, D" includes any one of A, B, C, and D (that is, the technical solution connected by "logical OR"), and also includes any and all combinations of A, B, C, and D, that is, it includes the combination of any two or any three of A, B, C, and D, and also includes the four-item combination of A, B, C, and D (that is, the technical solution connected by "logical AND").

[0043] In this application, when it comes to a numerical interval (that is, a numerical range), unless otherwise specified, the distribution of the optional numerical values within this numerical interval is regarded as continuous, and includes the two numerical endpoints of this numerical interval (that is, the minimum value and the maximum value), as well as each numerical value between these two numerical endpoints. Unless otherwise specified, when the numerical interval only refers to the integers within this numerical interval, it includes the two endpoint integers of this numerical range, as well as each integer between the two endpoints, which is equivalent to directly listing each integer. When multiple numerical ranges are provided to describe features or characteristics, these numerical ranges can be combined. In other words, unless otherwise specified, the numerical ranges disclosed herein should be understood to include any and all sub-ranges subsumed therein. The "numerical value" in this numerical interval can be any quantitative value, such as a number, a percentage, a ratio, etc. The "numerical interval" allows to broadly include numerical interval types such as a percentage interval, a ratio interval, a ratio value interval, etc.

[0044] The temperature parameter in this application, unless otherwise specifically limited, allows both constant temperature treatment and variation within a certain temperature interval. It should be understood that the said constant temperature treatment allows the temperature to fluctuate within the accuracy range controlled by the instrument. Fluctuation within a range such as ±5°C, ±4°C, ±3°C, ±2°C, ±1°C is allowed.

[0045] In this application, the term "room temperature" or "normal temperature" generally refers to 4°C to 35°C, such as 20°C ± 5°C. In some embodiments of this application, "room temperature" or "normal temperature" refers to 10°C to 30°C. In some embodiments of this application, "room temperature" or "normal temperature" refers to 20°C to 30°C.

[0046] In this application, for units related to data ranges, if a unit is only attached after the right endpoint, it means that the units of the left and right endpoints are the same. For example, 3~5 h means that the units of both the left endpoint "3" and the right endpoint "5" are h (hours).

[0047] All documents mentioned in this application are cited herein as references, as if each document were cited individually as a reference. Unless it conflicts with the inventive purpose and / or technical solution of this application, the cited documents involved in this application are cited in their entirety and for all purposes. When this application refers to cited documents, the definitions of relevant technical features, terms, nouns, phrases, etc. in the cited documents are also cited. When this application refers to cited documents, examples and preferred ways of the relevant technical features cited can also be incorporated into this application as references, provided that this application can be implemented. It should be understood that when the cited content conflicts with the description in this application, this application shall prevail or be amended adaptively according to the description in this application.

[0048] The mass or weight of the relevant components mentioned in the specification of the embodiments of this application not only can refer to the specific content of each component, but also can represent the proportional relationship of the mass or weight between each component. Therefore, as long as the content of the relevant components in the specification of the embodiments of this application is scaled up or down proportionally, it is within the scope disclosed in the specification of the embodiments of this application. Specifically, the mass or weight described in the specification of the embodiments of this application can be units well-known in the chemical industry such as μg, mg, g, kg, etc.

[0049] The term "ball milling": Ball milling, in English "ball-milling", is a grinding method that mainly uses balls as the medium and realizes the crushing of materials by means of impact, extrusion and friction. During the ball milling process, the grinding balls given kinetic energy will move at high speed in a sealed container, and then collide with the materials. After being impacted, the materials will break and split into smaller materials, thus realizing the fine grinding of the samples. The ball milling process is mainly realized by ball mills. Ball mills are divided into multiple types according to the movement principle of the grinding balls. For laboratories, common laboratory ball mills include drum ball mills, planetary ball mills, vibrating ball mills, etc.

[0050] The term "isostatic pressing": Isostatic pressing treatment involves placing the object to be processed in a closed container filled with liquid. Through a pressurization system, gradually increasing pressure is applied to all surfaces of the object to exert equal pressure, so as to reduce the intermolecular distance and increase the density without changing the external shape, thereby improving the physical properties of the material. Isostatic pressing is to add granulated ceramic materials into a mold, and the mold material is generally plastic or rubber with a certain elasticity. In an isostatic press, a pressure of dozens to hundreds of megapascals is applied to the mold in all directions uniformly, so that the granulated ceramic materials in the mold are compacted and formed. There are two methods of isostatic pressing forming: cold isostatic pressing and hot isostatic pressing. Cold isostatic pressing is further divided into wet and dry types.

[0051] The term "degassing" refers to vacuum degassing: The principle of vacuum degassing is based on the changes in air pressure and solubility. Under normal atmospheric pressure, when the liquid is depressurized, bubbles are released from the liquid with the change of solubility. When the pressure drops, the solubility of the gas decreases, and the gas will escape from the liquid. Therefore, under vacuum, bubbles will quickly escape from the liquid. Vacuum degassing can effectively eliminate bubbles in liquids or semi-solids and improve the stability and quality of products.

[0052] One embodiment of the present application provides a ceramic. By mass, its preparation raw materials include: 72 - 97 parts of alumina, 1 - 10 parts of titanium nitride, 1 - 8 parts of titanium fluoride, 1 - 5 parts of aluminum fluoride, and 1 - 5 parts of manganese nitride.

[0053] By using appropriate proportions of alumina, titanium nitride, titanium fluoride, aluminum fluoride, and manganese nitride as preparation raw materials, with alumina as the matrix, aluminum fluoride as the cosolvent, and titanium nitride, titanium fluoride, and manganese nitride added, the hardness, mechanical strength, and wear resistance of the ceramic can be effectively improved. At the same time, the combination of titanium nitride, titanium fluoride, aluminum fluoride, and manganese nitride can also improve the electrical conductivity of the ceramic; the cooperation between the raw materials makes the maximum load of the prepared ceramic larger and the flexural strength higher, thus making the bearing capacity of the ceramic better.

[0054] It can be understood that in the preparation raw materials of the ceramic, by mass, alumina includes but is not limited to 72 parts, 75 parts, 78 parts, 81 parts, 84 parts, 87 parts, 90 parts, 93 parts, 95 parts, 97 parts; titanium nitride includes but is not limited to 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts; titanium fluoride includes but is not limited to 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts; aluminum fluoride includes but is not limited to 1 part, 2 parts, 3 parts, 4 parts, 5 parts; manganese nitride includes but is not limited to 1 part, 2 parts, 3 parts, 4 parts, 5 parts; in some examples, it can be within the range formed by any two of these point values as the end values. The same applies hereinafter.

[0055] In some of these embodiments, in the ceramic, by mass parts, the preparation raw materials include: 80 to 97 parts of alumina, 1 to 8 parts of titanium nitride, 1 to 5 parts of titanium fluoride, 1 to 4 parts of aluminum fluoride, and 1 to 3 parts of manganese nitride.

[0056] It can be understood that in some other embodiments, in the ceramic, by mass percentage, the preparation raw materials include: 80% to 97% of alumina, 1% to 8% of titanium nitride, 1% to 5% of titanium fluoride, 1% to 4% of aluminum fluoride, and 1% to 3% of manganese nitride.

[0057] It can also be understood that alumina, titanium nitride, titanium fluoride, aluminum fluoride, and manganese nitride all belong to the powder raw materials of the ceramic, and non-powder raw materials such as binders and solvents can also be included.

[0058] In some of these embodiments, in the ceramic, by mass parts, the powder raw materials are composed of the following components:

[0059] 72 to 97 parts of alumina, 1 to 10 parts of titanium nitride, 1 to 8 parts of titanium fluoride, 1 to 5 parts of aluminum fluoride, and 1 to 5 parts of manganese nitride.

[0060] In some of these embodiments, in the ceramic, the mass ratio of titanium fluoride to titanium nitride is 0.6 to 1.7:1.

[0061] It can be understood that the mass ratio of titanium fluoride to titanium nitride includes but is not limited to 0.6:1, 0.7:1, 0.8:1, 0.9:1, 1.0:1, 1.1:1, 1.2:1, 1.3:1, 1.4:1, 1.5:1, 1.6:1, 1.7:1.

[0062] The ceramic provided by this application has a lower dielectric loss; at the same time, the sintering temperature is lower, and ceramic sintering can be achieved at 1400°C to 1600°C.

[0063] An embodiment of this application provides a method for preparing a ceramic, including the following steps:

[0064] By mass parts, using 72 to 97 parts of alumina, 1 to 10 parts of titanium nitride, 1 to 8 parts of titanium fluoride, 1 to 5 parts of aluminum fluoride, and 1 to 5 parts of manganese nitride as powder raw materials to prepare a green body;

[0065] Sinter the green body to prepare the ceramic.

[0066] It can be understood that the method for preparing the ceramic provided by this application can produce the above-mentioned ceramic, and the characteristics between the ceramic and the method for preparing the ceramic can be mutually applicable.

[0067] In some of these embodiments, in the method for preparing the ceramic, the sintering temperature is 1400°C to 1600°C.

[0068] It can be understood that the sintering temperature includes but is not limited to 1400°C, 1420°C, 1440°C, 1460°C, 1480°C, 1500°C, 1520°C, 1540°C, 1560°C, 1580°C, 1600°C.

[0069] In some of these embodiments, in the method for preparing the ceramic, the sintering time is 3 days to 5 days.

[0070] It can be understood that the sintering time includes but is not limited to 3 days, 4 days, 5 days.

[0071] In some of these embodiments, in the method for preparing the ceramic, the sintering atmosphere includes nitrogen and hydrogen.

[0072] Optionally, in the sintering atmosphere, the volume content of hydrogen is greater than or equal to the volume content of nitrogen.

[0073] Furthermore, in the sintering atmosphere, the volume content of nitrogen ≤ 50%, and the volume content of hydrogen ≥ 50%.

[0074] In some of these embodiments, in the method for preparing the ceramic, the sintering is carried out by using an atmosphere furnace for debinding sintering.

[0075] In some of these embodiments, in the method for preparing the ceramic, the preparation of the green body includes the following steps:

[0076] Mix the powder raw materials with a binder and a solvent, and then carry out ball milling to prepare a slurry;

[0077] Form the slurry to prepare a green body.

[0078] In some of these embodiments, in the method for preparing the ceramic, the mass of the binder is 5% to 15% of the total mass of the powder raw materials.

[0079] It can be understood that the mass of the binder is 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, 14% or 15% of the total mass of the powder raw materials.

[0080] In some of these embodiments, in the method for preparing the ceramic, the binder includes polyvinyl acetate butyrate.

[0081] In some of these embodiments, in the method for preparing the ceramic, the mass of the solvent is 13% to 25% of the total mass of the powder raw materials.

[0082] It can be understood that the mass of the solvent is 13%, 14%, 15%, 16%, 17%, 18%, 19%, 20%, 21%, 22%, 23%, 24% or 25% of the total mass of the powder raw materials.

[0083] In some of these embodiments, in the method for preparing the ceramic, the solvent includes at least one of acetone and butylene carbonate.

[0084] Optionally, the solvent includes acetone and butylene carbonate; further, the mass ratio of acetone to butylene carbonate is 1:0.15 to 0.5.

[0085] It can be understood that the mass ratio of acetone to butylene carbonate includes but is not limited to 1:0.15, 1:0.2, 1:0.25, 1:0.3, 1:0.35, 1:0.4, 1:0.45, 1:0.5.

[0086] In some of these embodiments, in the method for preparing the ceramic, the ball milling time is ≥ 20 h.

[0087] Optionally, the ball milling time is 20 h to 48 h.

[0088] In some of these embodiments, in the method for preparing the ceramic, the particle size D50 of the powder in the slurry is ≤ 0.3 μm.

[0089] The particle size D50 refers to the particle size corresponding to when the cumulative particle size distribution percentage of a sample reaches 50%. Its physical meaning is that 50% of the particles are larger than it and 50% of the particles are smaller than it. D50 is also called the median diameter or median particle size.

[0090] Optionally, the particle size D50 of the powder in the slurry is 0.1 μm to 0.3 μm.

[0091] It can be understood that the particle size D50 of the powder in the slurry includes but is not limited to 0.1 μm, 0.2 μm, 0.3 μm.

[0092] It can be understood that the particle size D50 of the powder in the slurry refers to the particle size D50 of the powder in the slurry obtained after the powder raw material is mixed and ball milled with the binder and the solvent, and refers to the particle size D50 of the powder and the binder wrapped on the surface of the powder after ball milling. Further, it can be understood that the particle size D50 of the powder raw material is not limited to this particle size range.

[0093] In some of these embodiments, in the method for preparing the ceramic, the viscosity of the slurry is 16000 mPa·s to 30000 mPa·s.

[0094] It can be understood that the viscosity of the slurry includes but is not limited to 16000 mPa·s, 17000 mPa·s, 18000 mPa·s, 19000 mPa·s, 20000 mPa·s, 21000 mPa·s, 22000 mPa·s, 23000 mPa·s, 24000 mPa·s, 25000 mPa·s, 26000 mPa·s, 27000 mPa·s, 28000 mPa·s, 29000 mPa·s, 30000 mPa·s.

[0095] In some of these embodiments, in the method for preparing the ceramic, before forming and after ball milling, it further includes the step of degassing the intermediate slurry obtained by ball milling.

[0096] Optionally, the temperature for degassing is 20°C to 30°C.

[0097] It can be understood that the temperature for degassing includes but is not limited to 20°C, 21°C, 22°C, 23°C, 24°C, 25°C, 26°C, 27°C, 28°C, 29°C, 30°C.

[0098] It can be understood that the viscosity of the above-mentioned slurry refers to the viscosity of the degassed slurry.

[0099] In some of these embodiments, in the method for preparing the ceramic, the forming is tape casting and the green body is a green sheet;

[0100] Before sintering, it further includes the following steps: after applying electrode slurry to at least one surface of the green sheet, isostatic pressing is performed.

[0101] In some of these embodiments, in the method for preparing the ceramic, the pressure for isostatic pressing is 15000 PSI to 30000 PSI, and the temperature for isostatic pressing is 70°C to 90°C.

[0102] It can be understood that 15,000 PSI to 30,000 PSI is approximately 103 MPa to 207 MPa. Further, the pressure for isostatic pressing includes, but is not limited to, 15,000 PSI, 16,000 PSI, 17,000 PSI, 18,000 PSI, 19,000 PSI, 20,000 PSI, 21,000 PSI, 22,000 PSI, 23,000 PSI, 24,000 PSI, 25,000 PSI, 26,000 PSI, 27,000 PSI, 28,000 PSI, 29,000 PSI, 30,000 PSI; the temperature for isostatic pressing includes, but is not limited to, 70 °C, 71 °C, 72 °C, 73 °C, 74 °C, 75 °C, 76 °C, 77 °C, 78 °C, 79 °C, 80 °C, 81 °C, 82 °C, 83 °C, 84 °C, 85 °C, 86 °C, 87 °C, 88 °C, 89 °C, 90 °C.

[0103] In some of these embodiments, in the method for preparing the ceramic, the electrode paste is a metal paste;

[0104] In some of these embodiments, in the method for preparing the ceramic, the method of setting the electrode paste includes, but is not limited to, printing.

[0105] In some of these embodiments, in the method for preparing the ceramic, before setting the electrode paste, it further includes the step of cutting the green sheet into the desired shape.

[0106] In some of these embodiments, in the method for preparing the ceramic, after setting the electrode paste and before isostatic pressing, it further includes the step of laminating at least two green sheets provided with the electrode paste.

[0107] Further, laminate in the same direction.

[0108] The method for preparing the ceramic provided by this application can improve the flatness of the cast film body, the green body is not easily deformed, and it is not easy to bulge during lamination and warm pressing; it can produce a ceramic sheet with an adjustable volume resistivity of 10 4 Ω·cm to 10 12 Ω·cm. By adjusting the proportion of the powder raw materials as needed, the volume resistivity of the ceramic sheet can be controlled; adjusting the resistance can change its adsorption performance to meet products with different requirements, and it has relatively high strength.

[0109] In some specific embodiments, the method for preparing the ceramic includes the following steps:

[0110] By mass, using 72 to 97 parts of alumina, 1 to 10 parts of titanium nitride, 1 to 8 parts of titanium fluoride, 1 to 5 parts of aluminum fluoride, and 1 to 5 parts of manganese nitride as the powder raw materials, mixing the powder raw materials with a binder and a solvent, then performing ball milling, defoaming and casting to form a green body;

[0111] After applying an electrode paste to at least one surface of a green body, at least two green bodies with the electrode paste are laminated, and then isostatic pressing and sintering are carried out in sequence to prepare a ceramic.

[0112] One embodiment of the present application provides an application of the above ceramic or a ceramic prepared by the above ceramic preparation method in the preparation of an electrostatic chuck. Another embodiment of the present application provides an electrostatic chuck including the above ceramic or a ceramic prepared by the above ceramic preparation method.

[0113] The electrostatic chuck provided by the present application has good load-bearing capacity.

[0114] One embodiment of the present application provides an application of the above electrostatic chuck in the preparation of semiconductors, flat panel displays or optical products.

[0115] The following further describes the present application in detail in conjunction with specific embodiments, but the embodiments of the present application are not limited thereto.

[0116] Example 1

[0117] (1) By mass, 100 parts of powder raw materials, a binder and a solvent are mixed and ball-milled for 24 h, and degassed (temperature 26 °C) to obtain a slurry; wherein, the powder raw materials are: 86 parts of alumina powder, 5 parts of titanium nitride powder, 3 parts of titanium fluoride, 3 parts of aluminum fluoride, 3 parts of manganese nitride, and the mass ratio of titanium fluoride to titanium nitride is about 0.6:1; the binder is polyvinyl acetate butyrate, and the mass of the binder is 10% of the total mass of the powder raw materials; the solvent is a mixed solvent of acetone and butylene carbonate, the mass of acetone is 12% of the total mass of the powder raw materials, and the mass of butylene carbonate is 3% of the total mass of the powder raw materials; the particle size D50 of the powder in the slurry after ball-milling is controlled to be 0.25 μm; the viscosity of the slurry is about 28000 mPa·s;

[0118] (2) After the slurry prepared in step (1) is cast into shape, the cast green body is cut into sheets, and the green body is punched out using a punching machine (the mold is customized according to the product type);

[0119] (3) A metal electrode paste is printed on the sheet-shaped green body prepared in step (2), 5 green bodies printed with the metal electrode paste are laminated in the same direction, encapsulated using a sealed bag, and isostatic pressing is carried out using warm water, the isostatic pressing pressure is 26000 PSI, and the temperature is 85 °C;

[0120] (4) The intermediate prepared in step (3) is debound and sintered using an atmosphere furnace, a mixed atmosphere of nitrogen and hydrogen with a volume ratio of 1:12 is used, the sintering temperature is 1580 °C, and the sintering time is 5 days to obtain a ceramic.

[0121] Example 2

[0122] It is basically the same as Example 1, except that the powder raw materials are: 86 parts of alumina powder, 3 parts of titanium nitride powder, 5 parts of titanium fluoride, 3 parts of aluminum fluoride, and 3 parts of manganese nitride; the mass ratio of titanium fluoride to titanium nitride is about 1.67:1.

[0123] Example 3

[0124] It is basically the same as Example 1, except that the powder raw materials are: 86 parts of alumina powder, 4 parts of titanium nitride powder, 4 parts of titanium fluoride, 3 parts of aluminum fluoride, and 3 parts of manganese nitride; the mass ratio of titanium fluoride to titanium nitride is about 1:1.

[0125] Example 4

[0126] It is basically the same as Example 1, except that the powder raw materials are: 86 parts of alumina powder, 7 parts of titanium nitride powder, 5 parts of titanium fluoride, 1 part of aluminum fluoride, and 1 part of manganese nitride.

[0127] Comparative Example 1

[0128] It is basically the same as Example 1, except that in the powder raw materials, the titanium nitride powder is replaced with the same mass of titanium carbide powder.

[0129] Comparative Example 2

[0130] It is basically the same as Example 1, except that in the powder raw materials, the titanium fluoride powder is replaced with the same mass of magnesium fluoride powder.

[0131] Comparative Example 3

[0132] It is basically the same as Example 1, except that the powder raw materials are: 74 parts of alumina powder, 5 parts of titanium nitride powder, 15 parts of titanium fluoride, 3 parts of aluminum fluoride, and 3 parts of manganese nitride; the mass ratio of titanium fluoride to titanium nitride is about 3:1.

[0133] The dielectric constant and dielectric loss (GB / T5594.4) of the ceramic prepared in Example 1 are as Figure 1 shown in Table 1.

[0134] Table 1

[0135]

[0136] As can be seen from Table 1, the ceramic provided in Example 1 has a lower dielectric loss.

[0137] The volume resistivity (GB / T5594.5) of the ceramic (about 5 mm × 5 mm) prepared in Example 1, test conditions: 500 V, 24.5 °C, 59% RH, and the results are shown in Table 2.

[0138] Table 2

[0139]

[0140] The flexural strength (GB / T 5594.3) of the ceramics (about 40 mm × 10 mm) prepared in each example and comparative example was tested, and the results are shown in Table 3.

[0141] Table 3

[0142]

[0143] As can be seen from Table 3, compared with the comparative examples, the ceramics prepared in each example have higher flexural strength.

[0144] The technical features of the above-described examples can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-described examples are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0145] The above-described examples merely represent several implementation manners of the present application, which are convenient for understanding the technical solutions of the present application specifically and in detail, but should not be construed as a limitation on the protection scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. It should be understood that the technical solutions obtained by those skilled in the art through logical analysis, reasoning or limited experiments based on the technical solutions provided in the present application are all within the protection scope of the appended claims of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the content of the appended claims, and the description can be used to explain the content of the claims.

Claims

1. A ceramic, characterized in that: The raw materials for its preparation include, by weight: 72-97 parts of aluminum oxide, 1-10 parts of titanium nitride, 1-8 parts of titanium fluoride, 1-5 parts of aluminum fluoride and 1-5 parts of manganese nitride.

2. The ceramic according to claim 1, characterized in that The raw materials for its preparation include, by weight: 80-97 parts of aluminum oxide, 1-8 parts of titanium nitride, 1-5 parts of titanium fluoride, 1-4 parts of aluminum fluoride and 1-3 parts of manganese nitride.

3. The ceramic according to any one of claims 1 to 2, characterized in that The mass ratio of the titanium fluoride to the titanium nitride is 0.6-1.7:

1.

4. A method for preparing ceramics, characterized in that: The following steps are involved: By weight, 72-97 parts of aluminum oxide, 1-10 parts of titanium nitride, 1-8 parts of titanium fluoride, 1-5 parts of aluminum fluoride and 1-5 parts of manganese nitride are used as powder raw materials to prepare a green body; The green body is sintered to prepare ceramics.

5. The method for preparing ceramics according to claim 4, characterized in that: The sintering temperature is 1400°C to 1600°C; And / or, the sintering atmosphere includes nitrogen and hydrogen; optionally, in the sintering atmosphere, the volume content of the hydrogen is greater than or equal to the volume content of the nitrogen.

6. The method for preparing a ceramic according to any one of claims 4 to 5, characterized in that: The preparation of the green compact comprises the following steps: The powder raw material is mixed with a binder and a solvent and then ball-milled to prepare a slurry; The slurry is molded to prepare a green body.

7. The method for preparing ceramics according to claim 6, characterized in that: The mass of the binder is 5% to 15% of the total mass of the powder raw material; and / or, the adhesive comprises polybutylene acetate; And / or, the mass of the solvent is 13% to 25% of the total mass of the powder raw material; And / or, the solvent comprises at least one of acetone and butylene carbonate; optionally, the solvent comprises acetone and butylene carbonate, and the mass ratio of the acetone to the butylene carbonate is 1:0.15-0.5; And / or, the particle size D50 of the powder in the slurry is ≤0.3 μm; And / or, the viscosity of the slurry is 16000 mPa·s~30000 mPa·s.

8. The method for preparing ceramics according to claim 6, characterized in that: Before the molding and after the ball milling, the method further includes a step of degassing the intermediate slurry obtained by ball milling; optionally, the degassing temperature is 20°C to 30°C.

9. The method for preparing ceramics according to claim 6, characterized in that: The forming is tape casting, and the green body is a green sheet; Before the sintering, the method further comprises the following steps: after setting electrode slurry on at least one surface of the green sheet, performing isostatic pressing; optionally, the isostatic pressing pressure is 15000 PSI~30000 PSI, and the isostatic pressing temperature is 70°C~90°C.

10. An electrostatic chuck, characterized in that: The invention comprises a ceramic as claimed in any one of claims 1 to 3 or a ceramic prepared by the method for preparing a ceramic as claimed in any one of claims 4 to 9.

Images