Design method, device and equipment of thermoelectric refrigerating unit with irregular structure and medium

Abstract

The embodiment of the invention provides a design method, device, equipment and medium of a thermoelectric refrigerating unit of an irregular structure, and relates to the technical field of thermoelectric refrigeration, and the method comprises the following steps: obtaining the appearance structure of a heating management object, the heating area of the heating management object and the heating temperature of the heating area; determining thermoelectric materials and sectional areas of thermoelectric arms of thermoelectric refrigerators according to the appearance structure, the heating area and the heating temperature of the heating management object, and determining an arrangement mode of the thermoelectric arms in the thermoelectric refrigerators and the number of the thermoelectric refrigerators according to the thermoelectric materials and the sectional areas; and after the arranged thermoelectric arms are mutually connected and packaged, the thermoelectric refrigerating unit with an irregular structure is manufactured. According to the scheme, different refrigerating capacities are generated for different areas of the thermal management equipment, and the energy utilization efficiency of thermoelectric refrigeration is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of thermoelectric refrigeration, and particularly relates to a design method, device, equipment and medium for an irregular structure thermoelectric cooler. Background Art

[0002] Thermoelectric refrigeration has advantages such as small size and no pollution, and has broad application prospects. A thermoelectric cooler uses the Peltier effect of semiconductors to achieve refrigeration. When two different conductive materials form a circuit and are passed through direct current, endothermic or exothermic effects will occur at both ends of the two conductors. A thermoelectric device includes multiple p-type and n-type thermoelectric arms made of semiconductor thermoelectric materials connected in series through copper sheets and then encapsulated by ceramic materials. However, in the field of refrigeration, according to the required temperature range, the refrigeration types can be clearly divided into four categories: high-temperature refrigeration, medium-temperature refrigeration, low-temperature refrigeration, and ultra-low-temperature refrigeration. Micro-devices such as chips and batteries have uneven heat generation in different regions, resulting in different temperatures in different regions, and different temperature regions have different requirements for refrigeration capacity. However, the thermoelectric refrigeration devices in current literature all use thermoelectric arms of uniform size in thermal management, which causes a certain degree of energy waste to a certain extent. Summary of the Invention

[0003] In view of this, an embodiment of the present invention provides a design method for an irregular structure thermoelectric cooler to solve the technical problems in the prior art that the energy utilization efficiency of thermoelectric refrigeration is low and different refrigeration capacities cannot be generated for different regions of a thermal management device. The method includes:

[0004] Obtain the appearance structure of the heat management object, the heat generation region of the heat management object, and the heat generation temperature of the heat generation region;

[0005] Determine the thermoelectric material and cross-sectional area of the thermoelectric arms of the thermoelectric cooler according to the appearance structure, heat generation region, and heat generation temperature of the heat management object, and determine the arrangement mode of the thermoelectric arms in the thermoelectric cooler and the number of thermoelectric coolers according to the thermoelectric material and cross-sectional area;

[0006] After connecting and encapsulating the arranged thermoelectric arms, an irregular structure thermoelectric cooler is made.

[0007] An embodiment of the present invention also provides a device for a design method of an irregular structure thermoelectric cooler to solve the technical problems in the prior art that the energy utilization efficiency of thermoelectric refrigeration is low and different refrigeration capacities cannot be generated for different regions of a thermal management device. The device includes:

[0008] A demand acquisition module for obtaining the appearance structure of the heat management object, the heat generation region of the heat management object, and the heat generation temperature of the heat generation region;

[0009] A thermoelectric cooler design module is used to design the thermoelectric material and cross-sectional area of the thermoelectric arms of the thermoelectric cooler according to the appearance structure, the heat generation area, and the heat generation temperature of the heat management object, and determine the arrangement mode of the thermoelectric arms in the thermoelectric cooler and the number of the thermoelectric coolers according to the thermoelectric material and the cross-sectional area;

[0010] A thermoelectric cooler preparation module is used to connect the arranged thermoelectric arms to each other and encapsulate them to make a thermoelectric cooler with an irregular structure.

[0011] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of the present specification at least include:

[0012] The design method of the thermoelectric cooler of the present invention can be applied to various refrigeration scenarios, has strong pertinence, and can generate different refrigeration capacities for different regions of the heat management device, improving the energy utilization efficiency of thermoelectric refrigeration. Description of the Drawings

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without creative efforts.

[0014] Figure 1 It is a flowchart of a design method for an irregular structure thermoelectric cooler provided by an embodiment of the present invention;

[0015] Figure 2 It is a schematic structural diagram of the thermoelectric cooler provided by an embodiment of the present invention;

[0016] Figure 3 It is a structural block diagram of a design device for an irregular structure thermoelectric cooler provided by an embodiment of the present invention. Detailed Embodiments

[0017] The embodiments of the present application will be described in detail below with reference to the drawings.

[0018] The following describes the implementation manners of the present application through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by the present application.

[0019] In an embodiment of the present invention, a design method for an irregular structure thermoelectric cooler is provided. As Figure 1 shown, the method includes:

[0020] Step S101: Obtain the appearance structure of the heat management object, the heat generation area of the heat management object, and the heat generation temperature of the heat generation area;

[0021] Step S102: Determine the thermoelectric material and cross-sectional area of the thermoelectric arms of the thermoelectric cooler according to the appearance structure, the heat generation area, and the heat generation temperature of the heat management object, and determine the arrangement manner of the thermoelectric arms in the thermoelectric cooler and the number of the thermoelectric coolers according to the thermoelectric material and the cross-sectional area;

[0022] Step S103: After connecting and encapsulating the arranged thermoelectric arms, an irregular structure thermoelectric cooler is made.

[0023] Specifically, as Figure 2 shown, the thermoelectric cooling device in the embodiment of the present invention includes: a ceramic plate, metal electrodes, and semiconductor thermoelectric materials. The semiconductor thermoelectric materials are connected end to end by the metal electrodes to form multiple groups of thermoelectric arms, and then encapsulated with a high thermal conductivity insulating ceramic material. When the formed thermoelectric cooling device is energized to form a loop, due to the Peltier effect, a temperature difference will be formed at both ends of the thermoelectric device, one end is the hot end, and the other end is the cold end, and the cold end is used for refrigeration.

[0024] The sizes (cross-sectional areas) of the p- and n-type thermoelectric arms and the semiconductor thermoelectric materials (the thermoelectric materials of the thermoelectric arms) in the thermoelectric cooling device in the embodiment of the present invention are non-uniform, which will cause different cooling capacities at the corresponding cold ends in different regions, and can simultaneously meet the heat management of equipment with different refrigeration requirements. Therefore, the thermoelectric cooling device in the embodiment of the present invention can not only improve the cascade utilization of energy, but also reduce the usage amount of thermoelectric materials, reduce the weight of the thermoelectric device, and improve the utilization and economic value of the thermoelectric cooling device.

[0025] In specific implementation, the thermoelectric materials and cross-sectional areas of the thermoelectric arms of the thermoelectric cooler are determined based on the appearance structure, the heating area, and the heating temperature of the heating management object, and the arrangement mode of the thermoelectric arms in the thermoelectric cooler and the number of the thermoelectric coolers are determined according to the thermoelectric materials and the cross-sectional areas:

[0026] If the heating management object is a flat plate-like structure, the surface of the heating management object is divided into multiple regions according to the heating temperature of the heating area, thermoelectric arms based on different thermoelectric materials and different cross-sectional areas are arranged in each region, and the number of the thermoelectric coolers is determined;

[0027] If the heating management object is a cylinder group, a hexagonal honeycomb-shaped thermoelectric cooler is provided for each cylinder in the cylinder group, and the cylinder is surrounded by the thermoelectric cooler; if the heating management object is a curved surface structure, the curved surface structure is divided into a curvature region and a quasi-plane region according to the curvature magnitude, and thermoelectric arms with different thermoelectric materials and cross-sectional areas are respectively arranged for the curvature region and the quasi-plane region.

[0028] In specific implementation, the following steps are taken to achieve that if the heating management object is a flat plate-like structure, the surface of the heating management object is divided into multiple regions according to the heating temperature of the heating area, thermoelectric arms based on different thermoelectric materials and different cross-sectional areas are arranged in each region, and the number of the thermoelectric coolers is determined:

[0029] If the heating area of the heating management object includes a core area with a continuously distributed high heat flux density, an intermediate area with a medium heat flux density, and an edge area with a low heat flux density, thermoelectric arms with linearly decreasing cross-sectional areas are arranged along the direction from the core area to the edge area; if the heating area of the heating management object is unevenly distributed on the corresponding plane, the heating area is divided into multiple sub-units according to the interval where the heating temperature is located, and multiple mutually parallel thermoelectric coolers are provided to make the thermoelectric coolers correspond to the sub-units one by one, where each thermoelectric cooler includes one or more thermoelectric arms, and the cross-sectional area of the thermoelectric arm is proportional to the heating temperature.

[0030] Specifically, if the heat management object is a flat panel, the surface of the heat management object (which can be a battery, a chip, etc.) is divided into multiple regions according to the heat generation temperature of the heat generation region. If the heat flux density in the core region is high and the heat flux in the edge region is low, a single thermoelectric cooler with a gradient distribution is used (the cross-sectional area of the thermocouples in a single thermoelectric cooler gradually changes linearly from the high-temperature end to the low-temperature end). Thermocouple pairs with a large cross-sectional area (such as a cross-sectional area of 4-6 mm2) are arranged in the core region to enhance the cooling capacity to cope with the high-frequency operation hot spots. Thermocouple pairs with a medium cross-sectional area (thermoelectric arms) are arranged in the middle region to balance cooling and energy consumption. Thermocouple pairs with a small cross-sectional area (thermoelectric arms) are arranged in the edge region to provide basic heat dissipation. Directly match the temperature gradient of the heat management object to reduce the risk of overheating in the core region.

[0031] Specifically, if the heat generation regions of the heat management object are unevenly distributed on the corresponding plane, the entire heat source is divided into multiple sub-units, and a micro thermoelectric cooler is arranged for each sub-unit.

[0032] During specific implementation, the following steps are adopted to achieve the object that if the heat management object is a cylinder group, a hexagonal honeycomb-shaped thermoelectric cooler is arranged for each cylinder in the cylinder group, and the cylinder is surrounded by the thermoelectric cooler:

[0033] The cylinder is divided into a high heat generation region located on the top surface of the cylinder, a medium heat generation region located on the side surface of the cylinder, and a low heat generation region located on the bottom surface of the cylinder according to the heat generation region; thermoelectric arms with different cross-sectional areas are respectively arranged around the high heat generation region, the medium heat generation region, and the low heat generation region, and the cross-sectional area of the thermoelectric arm is proportional to the heat generation temperature.

[0034] Specifically, if the heat source is a cylindrical battery pack, a hexagonal honeycomb-shaped thermoelectric cooler is arranged around the cylindrical battery, and the cross-sectional area of the inner ring of the thermocouple pair (thermoelectric arm) is larger than that of the outer ring. This structure is used to optimize the radial heat dissipation path of the cylindrical battery. In an embodiment of the present invention, each battery cell corresponds to a hexagonal thermoelectric cooler, and three groups of thermocouple pairs with different sizes are arranged in the thermoelectric cooler (thermocouple pairs with a cross-sectional area of 3.5 mm2 are used for the high heat load unit near the electrode, thermocouple pairs with a cross-sectional area of 2.0 mm2 are used for the side surface of the battery, and thermocouple pairs with a cross-sectional area of 1.2 mm2 are used for the low heat load unit (the bottom of the battery)). An NTC temperature sensor can also be integrated into each thermoelectric cooler to dynamically adjust the current distribution.

[0035] During specific implementation, the following steps are adopted to achieve the object that if the heat management object is a curved surface structure, the curved surface structure is divided into a curvature region and a quasi-plane region according to the curvature size, and thermoelectric materials and thermoelectric arms with different cross-sectional areas are respectively arranged for the curvature region and the quasi-plane region:

[0036] In the curvature region, a flexible metal thin film is used as the thermoelectric material of the thermoelectric arm, and in the quasi-planar region, a general metal material is used as the thermoelectric material of the thermoelectric arm; the thermoelectric arms are arranged such that the cross-sectional area of the thermoelectric arms in the curvature region is smaller than that in the quasi-planar region, and the distribution density of the thermoelectric arms in the curvature region is higher than that in the quasi-planar region.

[0037] Specifically, if the heat source is flexible or curved, the cross-sectional area of the thermocouple is distributed according to the curvature gradient. In an embodiment of the present invention, a thermocouple with a cross-sectional area of about 0.8 mm2 can be used in the high-curvature region (where heat is easily generated at the bend), and the thermoelectric material is a flexible Bi2Te3 thin film. In the planar region, a thermocouple with a cross-sectional area of 2.0 mm 2 or so is used. The thermocouples in the curvature region and the planar region can be made of different materials. At the same time, micro-thermocouple pairs (thermoelectric arms) are densely arranged in the curvature region, and the thermal contact impedance can be reduced during fitting.

[0038] During specific implementation, the thermoelectric cooler is designed according to the refrigeration requirement through the following steps:

[0039] If the heat generation region of the heat management object will change dynamically, a shape memory alloy is used as the thermoelectric material so that the cross-sectional area of the thermoelectric arm can be adjusted within a certain range; if the heat generation temperature of the heat generation region of the heat management object exceeds the threshold temperature, after multiple thermoelectric arms are connected in parallel, the thermoelectric arms are stacked in the heat generation region.

[0040] Specifically, in an embodiment of the present invention, a shape memory alloy (SMA) or MEMS technology is used as the thermoelectric material, so that the cross-sectional area of the thermocouple pair (thermoelectric arm) of the thermoelectric cooler can be dynamically adjusted between 1 - 4 mm2.

[0041] Specifically, in an embodiment of the present invention, to cope with the instantaneous high temperature of a fast-charging battery (such as above 120 °C (threshold temperature)), the temperature is gradually reduced through multiple thermocouple pairs. For example, the cross-sectional area of the first stage (high-temperature stage) is 5.0 mm2, and the thermoelectric material can use a Half-Heusler alloy. The cross-sectional area of the second stage (medium-temperature stage) is 3.0 mm 2 and the thermoelectric material can use Bi2Te3 or Sb2Te3 superlattice. The cross-sectional area of the third stage (low-temperature stage) is 1.0 mm 2 and the thermoelectric material can use nano-porous SiGe. During operation, at the first stage, heat of 120 °C on the battery surface is absorbed with an ultra-high current (20 A) and the temperature is reduced to 80 °C. At the second stage, the temperature is further reduced to 50 °C. At the third stage, the temperature is maintained below 40 °C through thin thermocouple pairs.

[0042] In specific implementation, after the arranged thermoelectric arms are interconnected and encapsulated through the following steps, a thermoelectric cooler with an irregular structure is fabricated:

[0043] The thermoelectric cooler includes the thermoelectric arms, metal electrodes, and a ceramic plate. The thermoelectric arms include p-type thermoelectric arms and n-type thermoelectric arms. The arranged p-type thermoelectric arms and n-type thermoelectric arms are connected by upper and lower groups of the metal electrodes. After the outer sides of the metal electrodes are encapsulated using the ceramic plate, a thermoelectric cooler with an irregular structure is fabricated.

[0044] Based on the same inventive concept, an apparatus for designing a thermoelectric cooler with an irregular structure is also provided in an embodiment of the present invention, as described in the following embodiments. Since the principle of solving problems by the apparatus for designing a thermoelectric cooler with an irregular structure is similar to that of the design method of a thermoelectric cooler with an irregular structure, the implementation of the apparatus for designing a thermoelectric cooler with an irregular structure can refer to the implementation of the design method of a thermoelectric cooler with an irregular structure, and repeated parts will not be described again. As used hereinafter, the term "unit" or "module" may be a combination of software and / or hardware that can achieve a predetermined function. Although the apparatuses described in the following embodiments are preferably implemented in software, implementation in hardware, or a combination of software and hardware is also possible and contemplated.

[0045] Figure 3 is a structural block diagram of an apparatus for designing a thermoelectric cooler with an irregular structure according to an embodiment of the present invention, as Figure 3 shown, including: a requirement acquisition module 301, a thermoelectric cooler design module 302, and a thermoelectric cooler fabrication module 303. The structure will be described below.

[0046] The requirement acquisition module 301 is configured to acquire the appearance structure of a heat management object, the heat generation area of the heat management object, and the heat generation temperature of the heat generation area;

[0047] The thermoelectric cooler design module 302 is configured to design the thermoelectric material and cross-sectional area of the thermoelectric arms of the thermoelectric cooler according to the appearance structure, the heat generation area, and the heat generation temperature of the heat management object, and determine the arrangement mode of the thermoelectric arms in the thermoelectric cooler and the number of the thermoelectric coolers according to the thermoelectric material and the cross-sectional area;

[0048] The thermoelectric cooler fabrication module 303 is configured to interconnect and encapsulate the arranged thermoelectric arms to fabricate a thermoelectric cooler with an irregular structure.

[0049] In one embodiment, the thermoelectric cooler design module includes:

[0050] The flat structure design unit is used for, if the heat management object is a flat plate-like structure, dividing the surface of the heat management object into multiple regions according to the heat generation temperature of the heat generation region, setting the thermoelectric arms based on different thermoelectric materials and different cross-sectional areas in each region, and determining the number of the thermoelectric coolers;

[0051] The cylinder design unit is used for, if the heat management object is a cylinder group, setting a hexagonal honeycomb-shaped thermoelectric cooler for each cylinder in the cylinder group, and surrounding the cylinder by the thermoelectric cooler;

[0052] The curved surface structure design unit is used for, if the heat management object is a curved surface structure, dividing the curved surface structure into a curvature region and a quasi-plane region according to the curvature size, and respectively setting the thermoelectric arms with different thermoelectric materials and cross-sectional areas for the curvature region and the quasi-plane region.

[0053] In one embodiment, the flat structure design unit is used for, if the heat generation region of the heat management object includes a core region with a continuously distributed high heat flux density, an intermediate region with a medium heat flux density, and an edge region with a low heat flux density, setting the thermoelectric arms with a linearly decreasing cross-sectional area along the direction from the core region to the edge region; if the heat generation region of the heat management object is unevenly distributed on the corresponding plane, dividing the heat generation region into multiple sub-units according to the interval where the heat generation temperature is located, and setting a plurality of mutually parallel thermoelectric coolers so that the thermoelectric coolers correspond to the sub-units one by one, wherein each thermoelectric cooler includes one or more thermoelectric arms, and the cross-sectional area of the thermoelectric arm is proportional to the heat generation temperature.

[0054] In one embodiment, the cylinder design unit is used for dividing the cylinder into a high heat generation region located on the top surface of the cylinder, a medium heat generation region located on the side surface of the cylinder, and a low heat generation region located on the bottom surface of the cylinder according to the heat generation region; respectively setting the thermoelectric arms with different cross-sectional areas around the high heat generation region, the medium heat generation region, and the low heat generation region, and the cross-sectional area of the thermoelectric arm is proportional to the heat generation temperature.

[0055] In one embodiment, the curved surface structure design unit is used for, in the curvature region, using a flexible metal film as the thermoelectric material of the thermoelectric arm, and in the quasi-plane region, using a general metal material as the thermoelectric material of the thermoelectric arm; setting the thermoelectric arms so that the cross-sectional area of the thermoelectric arms in the curvature region is smaller than that in the quasi-plane region, and the distribution density of the thermoelectric arms in the curvature region is higher than that in the quasi-plane region.

[0056] In one embodiment, the above device further includes a second thermoelectric cooler design module.

[0057] In one embodiment, the second thermoelectric cooler design module includes:

[0058] A dynamically changing area design unit, configured to, if the heat generation area of the heat management object will change dynamically, use a shape memory alloy as the thermoelectric material, so that the cross-sectional area of the thermoelectric arm can be adjusted within a certain range;

[0059] An extremely high temperature structure design unit, configured to, if the heat generation temperature of the heat generation area of the heat management object exceeds a threshold temperature, connect multiple stages of the thermoelectric arms in parallel, and stack the thermoelectric arms in the heat generation area.

[0060] In one embodiment, the thermoelectric cooler preparation module includes:

[0061] Construct a thermoelectric cooler unit, where the thermoelectric cooler includes the thermoelectric arms, metal electrodes, and ceramic plates, and the thermoelectric arms include p-type thermoelectric arms and n-type thermoelectric arms;

[0062] A thermoelectric arm connection unit, configured to connect the arranged p-type thermoelectric arms and n-type thermoelectric arms through upper and lower groups of the metal electrodes;

[0063] A thermoelectric cooler encapsulation unit, configured to encapsulate the outside of the metal electrodes with the ceramic plates to make a thermoelectric cooler with an irregular structure.

[0064] The embodiments of the present invention achieve the following technical effects:

[0065] The p- and n-type thermoelectric arms of the thermoelectric cooler of the present invention have non-uniform sizes, so that the cooling capacities of the cold ends corresponding to different regions are different, and the heat management of devices with different cooling requirements can be satisfied simultaneously; the thermoelectric cooler of the present invention can not only improve the cascade utilization of energy, but also reduce the usage amount of thermoelectric materials, reduce the weight of thermoelectric devices, and improve the utilization and economic value of thermoelectric refrigeration devices; the design method of the thermoelectric cooler of the present invention is applicable to various refrigeration scenarios, has strong pertinence, and can generate different cooling capacities for different regions of heat management equipment, improving the energy utilization efficiency of thermoelectric refrigeration.

[0066] Obviously, those skilled in the art should understand that the various modules or steps of the above embodiments of the present invention can be implemented by a general-purpose computing device. They can be concentrated on a single computing device or distributed on a network composed of multiple computing devices. Optionally, they can be implemented by program codes executable by the computing device. Thus, they can be stored in a storage device and executed by the computing device. And in some cases, the steps shown or described can be executed in a sequence different from that here, or they can be separately fabricated into individual integrated circuit modules, or multiple modules or steps among them can be fabricated into a single integrated circuit module to implement. In this way, the embodiments of the present invention are not limited to any specific combination of hardware and software.

[0067] The above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, various changes and modifications can be made to the embodiments of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A design method for an irregular structure thermoelectric cooler, characterized in that: include: Acquire the appearance structure of a heat management object, a heat generation area of ​​the heat management object, and a heat generation temperature of the heat generation area; Determine the thermoelectric material and cross-sectional area of ​​the thermoelectric arms of the thermoelectric cooler according to the appearance structure, the heating area and the heating temperature of the heat management object, and determine the arrangement of the thermoelectric arms in the thermoelectric cooler and the number of the thermoelectric coolers according to the thermoelectric material and the cross-sectional area; The arranged thermoelectric arms are connected to each other and packaged to form a thermoelectric cooler with an irregular structure.

2. The design method of the irregular structure thermoelectric cooler according to claim 1, characterized in that: Determining the thermoelectric material and the cross-sectional area of ​​the thermoelectric arm of the thermoelectric cooler according to the appearance structure, the heating area and the heating temperature of the heat management object, and determining the arrangement of the thermoelectric arms in the thermoelectric cooler and the number of the thermoelectric coolers according to the thermoelectric material and the cross-sectional area, including: If the heat management object is a planar plate-shaped structure, the surface of the heat management object is divided into a plurality of regions according to the heating temperature of the heating region, the thermoelectric arms based on different thermoelectric materials and different cross-sectional areas are arranged in each region, and the number of the thermoelectric coolers is determined; If the heat management object is a cylinder group, a hexagonal honeycomb thermoelectric cooler is provided for each cylinder in the cylinder group, and the cylinder is surrounded by the thermoelectric cooler; If the heat management object is a curved surface structure, the curved surface structure is divided into a curvature area and a quasi-plane area according to the curvature, and the thermoelectric arms with different thermoelectric materials and cross-sectional areas are respectively arranged for the curvature area and the quasi-plane area.

3. The design method of the irregular structure thermoelectric cooler according to claim 2, characterized in that: If the heat management object is a planar plate structure, the surface of the heat management object is divided into a plurality of regions according to the heating temperature of the heating region, the thermoelectric arms based on different thermoelectric materials and different cross-sectional areas are arranged in each region, and the number of the thermoelectric coolers is determined, including: If the heating area of ​​the heat management object includes a continuously distributed core area with high heat flux density, a middle area with medium heat flux density, and an edge area with low heat flux density, the thermoelectric arm with a linearly decreasing cross-sectional area is arranged along the direction from the core area to the edge area; If the heating area of ​​the heat management object is unevenly distributed on the corresponding plane, the heating area is divided into multiple sub-units according to the heating temperature interval, and multiple thermoelectric coolers connected in parallel are set so that the thermoelectric coolers correspond to the sub-units one by one, wherein each of the thermoelectric coolers includes one or more thermoelectric arms, and the cross-sectional area of ​​the thermoelectric arm is proportional to the heating temperature.

4. The design method of the irregular structure thermoelectric cooler according to claim 2, characterized in that: If the heat management object is a cylinder group, a hexagonal honeycomb thermoelectric cooler is provided for each cylinder in the cylinder group, and the cylinder is surrounded by the thermoelectric cooler, including: According to the heating area, the cylinder is divided into a high heating area located on the top surface of the cylinder, a medium heating area located on the side surface of the cylinder, and a low heating area located on the bottom surface of the cylinder; Thermoelectric arms with different cross-sectional areas are respectively arranged around the high heating area, the medium heating area and the low heating area, and the cross-sectional area of ​​the thermoelectric arm is proportional to the heating temperature.

5. The design method of the irregular structure thermoelectric cooler according to claim 2, characterized in that: If the heat management object is a curved surface structure, the curved surface structure is divided into a curvature area and a quasi-plane area according to the curvature, and the thermoelectric arms with different thermoelectric materials and cross-sectional areas are respectively arranged for the curvature area and the quasi-plane area, including: In the curvature region, a flexible metal film is used as the thermoelectric material of the thermoelectric arm, and in the quasi-plane region, a general metal material is used as the thermoelectric material of the thermoelectric arm; The thermoelectric arms are arranged so that the cross-sectional area of ​​the thermoelectric arms in the curvature region is smaller than the cross-sectional area of ​​the quasi-plane region, and the distribution density of the thermoelectric arms in the curvature region is higher than the distribution density of the quasi-plane region.

6. The design method of an irregular structure thermoelectric cooler according to any one of claims 1 to 5, characterized in that: Also includes: If the heating area of ​​the heat management object changes dynamically, shape memory alloy is used as the thermoelectric material so that the cross-sectional area of ​​the thermoelectric arm can be adjusted within a certain range; If the heating temperature of the heating area of ​​the heating management object exceeds a threshold temperature, multiple stages of the thermoelectric arms are connected in parallel so that the thermoelectric arms are stacked in the heating area.

7. The design method of an irregular structure thermoelectric cooler according to any one of claims 1 to 5, characterized in that: After the arranged thermoelectric arms are connected and packaged, a thermoelectric cooler with an irregular structure is manufactured, comprising: The thermoelectric cooler comprises the thermoelectric arm, a metal electrode and a ceramic plate, wherein the thermoelectric arm comprises a p-type thermoelectric arm and an n-type thermoelectric arm; Connecting the arranged p-type thermoelectric arm and the n-type thermoelectric arm through the upper and lower groups of metal electrodes; After the outer side of the metal electrode is encapsulated by using the ceramic plate, a thermoelectric cooler with an irregular structure is manufactured.

8. A design device for an irregular structure thermoelectric cooler, characterized in that: include: A demand acquisition module, used to acquire the appearance structure of a heat management object, a heat generation area of ​​the heat management object, and a heat generation temperature of the heat generation area; a thermoelectric cooler design module, configured to design the thermoelectric material and cross-sectional area of ​​the thermoelectric arms of the thermoelectric cooler according to the appearance structure, the heating area and the heating temperature of the heat management object, and determine the arrangement of the thermoelectric arms in the thermoelectric cooler and the number of the thermoelectric coolers according to the thermoelectric material and the cross-sectional area; The thermoelectric cooler preparation module is used to connect the arranged thermoelectric arms to each other and package them to make a thermoelectric cooler with an irregular structure.

9. The design device for an irregular structure thermoelectric cooler according to claim 8, characterized in that: The thermoelectric cooler design module includes: A flat plate structure design unit, for dividing the surface of the heat management object into a plurality of regions according to the heating temperature of the heating region if the heat management object is a flat plate structure, setting the thermoelectric arms based on different thermoelectric materials and different cross-sectional areas in each region, and determining the number of the thermoelectric coolers; A cylinder design unit, for providing a hexagonal honeycomb thermoelectric cooler for each cylinder in the cylinder group if the heat management object is a cylinder group, and surrounding the cylinder with the thermoelectric cooler; The curved surface structure design unit is used for dividing the curved surface structure into a curvature area and a quasi-plane area according to the curvature size if the heat management object is a curved surface structure, and respectively setting the thermoelectric arms with different thermoelectric materials and cross-sectional areas for the curvature area and the quasi-plane area.

10. The design device for an irregular structure thermoelectric cooler according to claim 8, characterized in that: The thermoelectric cooler preparation module comprises: Constructing a thermoelectric cooler unit, wherein the thermoelectric cooler comprises the thermoelectric arms, metal electrodes and a ceramic plate, wherein the thermoelectric arms comprise a p-type thermoelectric arm and an n-type thermoelectric arm; A thermoelectric arm connection unit, used to connect the arranged p-type thermoelectric arm and the n-type thermoelectric arm through the upper and lower groups of metal electrodes; The thermoelectric cooler packaging unit is used to use the ceramic plate to package the outer side of the metal electrode to form a thermoelectric cooler with an irregular structure.

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