Temperature control device and method of heating disc and storage medium
By adjusting the output power value of the second area of the heating disk in real time, and adjusting the temperature synchronously according to the actual temperature difference between the first area and the second area, the problem of inaccurate temperature control and excessive temperature difference in traditional control methods is solved, and the heating disk is damaged is achieved, and higher temperature control accuracy and safety of the heating disk are achieved.
Patent Information
- Application Number
- CN202510300457.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2025-06-17
AI Technical Summary
The traditional heating disk temperature control method is due to the mutual influence of the heat of the inner and outer ring heating wires, resulting in inaccurate temperature control, which easily generates instantaneous thermal stress, which leads to damage to the heating disk and cannot reduce the risk of temperature deviation in advance.
By adjusting the output power value of the second region in real time according to the actual temperature difference between the second region and the first region, thereby controlling the temperature adjustment of the second region and the first region in synchronization, and determining the power value using PID control is used to improve the accuracy of the temperature control.
Accurate control of the temperature of the first and second areas is achieved, the risk of excessive temperature difference in heating plates is avoided, and the service life of the heating plates is improved.
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Figure CN120161882A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of semiconductor device manufacturing, and particularly to a temperature control device for a heating plate, a temperature control method for a heating plate, and a computer-readable storage medium. Background Art
[0002] Currently, in the semiconductor industry, a dual-zone heating plate is commonly used. Through two heating wires in the inner circle and the outer circle, the central part and the edge part of the heating plate are heated respectively, and two temperature detection elements are used to detect the temperatures of the central part and the edge part of the heating plate respectively. However, for this kind of heating plate, the traditional control method is that the temperature detection elements and heating wires of the central part and the edge part are independently controlled, without interference with each other. However, this independent control method will cause the heat of the inner and outer circle heating wires to affect each other. At a certain moment, the output of one part will increase rapidly, and the output of the other part will decrease rapidly, eventually generating an instantaneous thermal stress, which will lead to the breakage of the heating plate and cause device damage. In addition, the traditional control will alarm the temperature deviation between the central part and the edge, in order to avoid the heating plate from cracking due to excessive temperature difference. However, this method belongs to post-control and cannot reduce the risk of generating temperature deviation through pre-control.
[0003] In order to overcome the above-mentioned defects existing in the prior art, there is an urgent need in the art for an improved temperature control device for a heating plate, which is used to improve the accuracy of temperature control for the first region and the second region, so as to avoid the heating plate from cracking due to excessive temperature difference between the first region and the second region. Summary of the Invention
[0004] The following gives a brief overview of one or more aspects to provide a basic understanding of these aspects. This overview is not an exhaustive survey of all contemplated aspects, and is neither intended to identify key or decisive elements of all aspects nor to attempt to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description to follow.
[0005] In order to overcome the above-mentioned defects existing in the prior art, the present invention provides a temperature control device for a heating plate, a temperature control method for a heating plate, and a computer-readable storage medium. The output power value of the second region can be adjusted in real time according to the actual temperature difference between the second region and the first region, so as to control the synchronous adjustment of the temperatures of the second region and the first region, which is used to improve the accuracy of temperature control for the first region and the second region, so as to avoid the heating plate from cracking due to excessive temperature difference between the first region and the second region.
[0006] Specifically, the temperature control device of the heating plate provided according to the first aspect of the present invention includes a first temperature controller and a second temperature controller. The first temperature controller determines a first set power value for adjusting the temperature of the first area based on the set temperature value of the first area on the heating plate and the actual temperature value of the first area. The second temperature controller determines a second set power value for controlling the temperature of the second area to be adjusted synchronously with the temperature of the first area based on the set temperature deviation value between the first area and the second area on the heating plate and the actual temperature deviation value between the first area and the second area.
[0007] Further, in some embodiments of the present invention, the step of determining the first set power value for controlling the first area based on the set temperature value of the first area on the heating plate and the actual temperature value of the first area includes: performing PID control based on the set temperature value of the first area and the actual temperature value of the first area to determine the first set power value for controlling the first area.
[0008] Further, in some embodiments of the present invention, the step of determining the second set power value for controlling the second area based on the set temperature deviation value between the first area and the second area on the heating plate and the actual temperature deviation value between the first area and the second area includes: determining a current ratio R between the current of the second area and the current of the first area based on the set temperature deviation value and the actual temperature deviation value t ; and determining the second set power value for controlling the second area based on the first set power value and the current ratio R t :
[0009] OP_OUT_SIG = OP_IN_SIG × R t
[0010] wherein, OP_IN_SIG is the first set power value, and OP_OUT_SIG is the second set power value.
[0011] Further, in some embodiments of the present invention, the step of determining the current ratio R between the current of the second area and the current of the first area based on the set temperature deviation value and the actual temperature deviation value t includes: performing PID control based on the set temperature deviation value and the actual temperature deviation value to determine the current ratio R between the current of the second area and the current of the first area t .
[0012] Further, in some embodiments of the present invention, determining the current ratio R between the current in the second region and the current in the first region according to the set temperature deviation value and the actual temperature deviation value t The step further includes: obtaining a preset first current ratio; in response to the actual temperature deviation value being greater than the set temperature deviation value, increasing the first current ratio to determine a second current ratio for controlling the current change in the second region; or in response to the actual temperature difference value being less than the set temperature deviation value, decreasing the first current ratio to determine a third current ratio for stabilizing the current in the second region.
[0013] Further, in some embodiments of the present invention, determining the current ratio R between the current in the second region and the current in the first region according to the set temperature deviation value and the actual temperature deviation value t The step further includes: obtaining a lower limit and an upper limit of the current ratio between the current in the second region and the current in the first region. The lower limit and the upper limit of the current ratio are used to define a safety range for avoiding the heating disk from cracking; and within the range between the lower limit and the upper limit of the current ratio, adjusting the current ratio between the current in the second region and the current in the first region to avoid the heating disk from cracking.
[0014] Further, in some embodiments of the present invention, the first region is a circular region with a first diameter at the center of the heating disk. The second region is an annular region concentric with the first region at the periphery of the heating disk.
[0015] Further, in some embodiments of the present invention, the temperature control device further includes a first power controller and a second power controller. The first power controller is configured to output a first actual power value to the first region on the heating disk according to the first set power value to adjust the temperature of the first region. The second power controller is configured to output a second actual power value to the second region on the heating disk according to the second set power value to control the temperature of the second region to be adjusted synchronously with the temperature of the first region.
[0016] In addition, the temperature control method of the heating plate provided according to the second aspect of the present invention includes the following steps: determining, via a first temperature controller in the temperature control device of the heating plate provided according to the first aspect of the present invention, a first set power value for controlling the first area according to the set temperature value of the first area on the heating plate and the actual temperature value of the first area. The first area is a circular area with a first diameter at the center of the heating plate; and determining, via a second temperature controller in the temperature control device, a second set power value for controlling the second area according to the set temperature deviation value between the first area and the second area on the heating plate and the actual temperature deviation value between the first area and the second area. The second area is an annular area concentric with the first area at the periphery of the heating plate.
[0017] In addition, the computer-readable storage medium provided according to the third aspect of the present invention is characterized in that computer instructions are stored thereon, and when the computer instructions are executed by a processor, the temperature control method of the heating plate provided according to the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] After reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings, the above features and advantages of the present invention can be better understood. In the drawings, the components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.
[0019] Figure 1 The structural schematic diagram of the temperature control device of the heating plate provided according to some embodiments of the present invention is shown.
[0020] Figure 2 The flowchart of the temperature control method of the heating plate provided according to some embodiments of the present invention is shown.
[0021] Figure 3 The flowchart of the temperature control method of the heating plate provided according to some embodiments of the present invention is shown.
[0022] REFERENCE NUMERALS:
[0023] 10 Programmable master controller
[0024] 11 First temperature controller
[0025] 12 Second temperature controller
[0026] 13 First power controller
[0027] 14 Second power controller
[0028] 20 Heating plate Detailed Implementation Modes
[0029] The following specific embodiments illustrate the implementation modes of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention will be introduced in combination with preferred embodiments, this does not mean that the features of this invention are limited to this implementation mode. On the contrary, the purpose of introducing the invention in combination with the implementation mode is to cover other alternatives or modifications that may extend based on the claims of the present invention. In order to provide a deep understanding of the present invention, many specific details will be included in the following description. The present invention can also be implemented without using these details. In addition, in order to avoid confusing or obscuring the key points of the present invention, some specific details will be omitted in the description.
[0030] In the description of the present invention, it should be noted that unless otherwise clearly specified and defined, the terms "install", "connect", and "couple" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0031] In addition, the "upper", "lower", "left", "right", "top", "bottom", "horizontal", and "vertical" used in the following description should be understood as the orientations shown in this section and the relevant drawings. This relative term is only for convenience of description and does not mean that the device described needs to be manufactured or operated in a specific orientation, so it should not be understood as a limitation to the present invention.
[0032] It can be understood that although terms such as "first", "second", and "third" can be used here to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first component, region, layer, and / or part discussed below can be referred to as the second component, region, layer, and / or part without departing from some embodiments of the present invention.
[0033] As described above, currently, a dual-zone heating plate is commonly used in the semiconductor industry. Through two heating wires in the inner and outer rings, the central part and the edge part of the heating plate are heated respectively, and two temperature detection elements are used to detect the temperatures of the central part and the edge part of the heating plate respectively. However, for such a heating plate, the traditional control method is to independently control the temperature detection elements and heating wires of the central part and the edge part respectively, without interference from each other. However, due to the mutual influence of the heat of the inner and outer ring heating wires, at a certain moment, the output of one part will increase rapidly while the other part will decrease rapidly, finally generating an instantaneous thermal stress, which will further cause the heating plate to break and damage the device. In addition, traditional control will alarm the temperature deviation between the central part and the edge to avoid the heating plate from cracking due to excessive temperature difference. However, this method belongs to post-control and cannot reduce the risk of generating temperature deviation through pre-control.
[0034] In order to overcome the above-mentioned defects existing in the prior art, the present invention provides a temperature control device for a heating plate, a temperature control method for a heating plate, and a computer-readable storage medium. The output power value of the second region can be adjusted in real time according to the actual temperature difference between the second region and the first region, so as to control the synchronous adjustment of the temperatures of the second region and the first region, which is used to improve the accuracy of temperature control for the first region and the second region to avoid the heating plate from cracking due to excessive temperature difference between the first region and the second region.
[0035] In some non-limiting embodiments, the temperature control method for the heating plate provided in the second aspect of the present invention can be implemented based on the temperature control device for the heating plate provided in the first aspect of the present invention.
[0036] Specifically, please refer to Figure 1 。 Figure 1 FIG. shows a schematic structural diagram of a temperature control device for a heating plate provided according to some embodiments of the present invention.
[0037] In Figure 1 the embodiment shown, the above-mentioned temperature control device provided in the first aspect of the present invention includes a programmable master controller 10 (Programmable Master Controller, PMC), a first temperature controller 11, and a second temperature controller 12. Here, the programmable master controller 10 can set the set temperature value of the first region of the heating plate 20, and the set temperature deviation value between the first region and the second region on the heating plate 20. The first temperature controller 11 can determine the first set power value for adjusting the temperature of the first region. The second temperature controller 12 can determine the second set power value for controlling the synchronous adjustment of the temperature of the second region and the temperature of the first region.
[0038] Further, in some alternative embodiments, the first region is a circular region with a first diameter at the center of the heating plate 20. The second region is an annular region concentric with the first region at the periphery of the heating plate 20.
[0039] In addition, in Figure 1 the illustrated embodiment, the temperature control device further includes a first power controller 13 and a second power controller 14. Here, the first power controller 13 is configured to output a first actual power value OP_IN to the first region on the heating plate 20 according to a first set power value to adjust the temperature of the first region. The second power controller 25 is configured to output a second actual power value OP_OUT to the second region on the heating plate according to a second set power value to control the temperature of the second region to be adjusted synchronously with the temperature of the first region.
[0040] The working principle of the above semiconductor defect detection system will be described below in conjunction with some embodiments of the temperature control method of the heating plate. Those skilled in the art can understand that these embodiments of the temperature control method are only some non-limiting implementation manners provided by the present invention, aiming to clearly show the main concept of the present invention and provide some specific solutions convenient for the public to implement, rather than limiting all functions or all working modes of the temperature control device of the heating plate. Similarly, the temperature control device of the heating plate is also a non-limiting implementation manner provided by the present invention, and does not limit the execution subject and execution order of each step in these temperature control methods of the heating plate.
[0041] Please further refer to Figure 2 and Figure 3 . Figure 2 FIG. shows a schematic flow chart of a temperature control method of a heating plate according to some embodiments of the present invention. Figure 3 FIG. shows a schematic flow chart of a temperature control method of a heating plate according to some embodiments of the present invention.
[0042] As Figure 2 shown, the temperature control device can first connect the heating plate 20 to alternating current (AC), that is, send a control signal HTR_AC_EN = 1. After that, the temperature control device can control the heating plate 20 to start heating up, that is, send a control signal HTRX_Controlstart = 1.
[0043] After that, as Figure 2 shown, the temperature control device can determine a first set power value for adjusting the temperature of the first region and a second set power value for adjusting the temperature of the second region.
[0044] Specifically, as Figure 1 and Figure 3As shown, the temperature control device can first determine the first set power value OP_IN_SIG for adjusting the temperature of the first region via the first temperature controller 11 according to the set temperature value T_IN_SP of the first region on the heating plate 20 set by the programmable master controller 10 and the actual temperature value PV_IN of the first region measured by the temperature detection element.
[0045] Further, in some preferred embodiments, the first temperature controller 11 can perform PID control according to the set temperature value T_IN_SP and the actual temperature value PV_IN to determine the first set power value OP_IN_SIG:
[0046]
[0047] where Kp1 is the proportional coefficient, Ki1 is the integral coefficient, and Kd1 is the differential coefficient.
[0048] After that, as Figure 1 and Figure 3 shown, the temperature control device can then determine the second set power value OP_OUT_SIG for controlling the synchronous adjustment of the temperature of the second region with the temperature of the first region via the second temperature controller 12 according to the set temperature deviation value △T_SP between the first region set by the programmable master controller 10 and the second region on the heating plate 20, and the actual temperature deviation value △PV between the first region and the second region measured by the temperature detection element.
[0049] Further, in some preferred embodiments, the second temperature controller 12 can perform PID control according to the set temperature deviation value △T_SP and the actual temperature deviation value △PV to determine the current ratio R between the current of the second region and the current of the first region t :
[0050] R t = Kp1×(△PV - △T_SP)+[Ki1×∫(P△PV - △T_SP)dt]+[Kd1×d(△PV - △T_SP) / dt]
[0051] where Kp1 is the proportional coefficient, Ki1 is the integral coefficient, and Kd1 is the differential coefficient.
[0052] After that, the second temperature controller 12 can determine the second set power value for controlling the second region according to the first set power value and the current ratio R t , and the second set power value for controlling the second region is:
[0053] OP_OUT_SIG = OP_IN_SIG×R t
[0054] Among them, OP_IN_SIG is the first set power value, and OP_OUT_SIG is the second set power value.
[0055] In addition, in some optional embodiments, the temperature control device may obtain a preset first current ratio. Subsequently, in response to the actual temperature deviation value being greater than the set temperature deviation value, the temperature control device may increase the first current ratio to determine a second current ratio for controlling the current change in the second region.
[0056] Conversely, in response to the actual temperature difference value being less than the set temperature deviation value, the temperature control device may decrease the first current ratio to determine a third current ratio for stabilizing the current in the second region.
[0057] In addition, in some preferred embodiments, the temperature control device may also obtain a lower limit and an upper limit of the current ratio between the current in the second region and the current in the first region. Here, the lower limit and the upper limit of the current ratio are used to define a safety range for avoiding the heating plate from cracking.
[0058] Subsequently, the temperature control device may adjust the current ratio between the current in the second region and the current in the first region within the range of the lower limit and the upper limit of the current ratio to avoid the heating plate from cracking.
[0059] In addition, as Figure 3 shown, the above temperature control device may detect the actual temperatures of the first region and the second region on the heating plate 20 and determine the heating rate of the first region and the second region based on this. Subsequently, the temperature control device may determine whether the heating rate is within the normal rate range (for example: 4°C / min to 5.5°C / min). Thereafter, in response to the heating rate not being within the normal range, the temperature control device may issue a warning of too fast heating.
[0060] Furthermore, in response to the heating rate being greater than the alarm threshold (for example: 7°C / min), the temperature control device may issue an alarm of too fast heating and issue a signal HTRX_Controlstart = 0 to stop the heating of the heating plate 20, a signal HTR_AC_EN = 0 to stop the power supply to the heating plate 20, and a signal HTRX_Temp_SP = 25°C to restore the set temperature value of the heating plate 20 to 25°C.
[0061] In addition, as Figure 3As shown, the above temperature control device can detect the heating time of the heating plate when it starts heating and determine whether it is greater than the first heating time (e.g., 1 min). In response to the heating time exceeding the first heating time, the temperature control device can send status query signals HTRX_Inner_PowCtrl_ALM = 1, HTRX_Outer_PowCtrl_ALM = 1, HTRX_CTRL_OK = 1, and further detect whether the first temperature controller 11, the second temperature controller 12, the first power controller 13, and the second power controller 14 are operating normally.
[0062] After that, in response to any one of the first temperature controller 11, the second temperature controller 12, the first power controller 13, and the second power controller 14 malfunctioning, the temperature control device can issue an alarm signal and send signals to stop the heating plate 20 from heating up, HTRX_Controlstart = 0, stop the power supply to the heating plate 20, HTR_AC_EN = 0, and restore the set temperature value of the heating plate 20 to 25 °C, HTRX_Temp_SP = 25 °C.
[0063] In addition, as Figure 3 shown, the above temperature control device can detect the heating time of the heating plate when it starts heating and determine whether it is greater than the second heating time (e.g., 3 min). In response to the heating time being greater than the second heating time, the temperature control device can further determine whether the heating plate 20 is a dual-zone heating plate.
[0064] After that, in response to the heating plate 20 being a dual-zone heating plate, the temperature control device can further obtain the current of the first zone and the current of the second zone and determine whether their current ratio is within the normal current ratio range.
[0065] After that again, in response to the current ratio not being within the normal current ratio range, the temperature control device can issue an alarm signal and send signals to stop the heating plate 20 from heating up, HTRX_Controlstart = 0, stop the power supply to the heating plate 20, HTR_AC_EN = 0, and restore the set temperature value of the heating plate 20 to 25 °C, HTRX_Temp_SP = 25 °C.
[0066] In addition, as Figure 3 shown, the above temperature control device can detect the heating time of the heating plate when it starts heating and determine whether it reaches the preset third heating time. In response to the heating time being greater than or equal to the third heating time, the temperature control device can detect whether the deviation value between the current heating plate temperature and the set temperature exceeds the set deviation alarm value of the machine.
[0067] In summary, the temperature control device, method, and storage medium of the heating plate provided by the present invention can all adjust the output power value of the second region in real time according to the actual temperature difference between the second region and the first region, so as to control the synchronous adjustment of the temperatures of the second region and the first region, which is used to improve the accuracy of temperature control for the first region and the second region, so as to avoid the heating plate from cracking due to excessive temperature difference between the first region and the second region.
[0068] Although the above methods are illustrated and described as a series of acts for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the acts, because according to one or more embodiments, some acts may occur in a different order and / or concurrently with other acts not illustrated and described herein but understood by those skilled in the art.
[0069] The steps of the methods or algorithms described in connection with the embodiments disclosed herein can be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read from, and write to, the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside as discrete components in a user terminal.
[0070] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functions may be stored on or transmitted via a computer-readable medium as one or more instructions or code. The computer-readable medium includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. The storage media may be any available media that can be accessed by a computer. By way of example and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a web site, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. As used herein, the disk and disc include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk, and Blu-ray disc, where the disk typically reproduces data magnetically, while the disc reproduces data optically with a laser. Combinations of the above should also be included within the scope of computer-readable media.
[0071] The foregoing description of the disclosure has been provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A temperature control device for a heating plate, characterized in that: include: A first temperature controller, determining a first set power value for adjusting the temperature of the first area on the heating plate according to a set temperature value of the first area and an actual temperature value of the first area; as well as The second temperature controller determines a second set power value for controlling the temperature of the second area to be synchronously adjusted with the temperature of the first area according to a set temperature deviation value between the first area and the second area on the heating plate and an actual temperature deviation value between the first area and the second area.
2. The temperature control device according to claim 1, characterized in that: The step of determining a first set power value for controlling the first area on the heating plate according to the set temperature value of the first area and the actual temperature value of the first area comprises: PID control is performed according to the set temperature value of the first area and the actual temperature value of the first area to determine a first set power value for controlling the first area.
3. The temperature control device according to claim 1, characterized in that: The step of determining a second set power value for controlling the second area according to a set temperature deviation value between the first area and a second area on the heating plate and an actual temperature deviation value between the first area and the second area comprises: According to the set temperature deviation value and the actual temperature deviation value, a current ratio R between the current in the second region and the current in the first region is determined. t ;as well as According to the first set power value and the current ratio R t , determine a second set power value for controlling the second area: OP_OUT_SIG=OP_IN_SIG×R t Among them, OP_IN_SIG is the first set power value, and OP_OUT_SIG is the second set power value.
4. The temperature control device according to claim 3, characterized in that: The current ratio R between the current in the second region and the current in the first region is determined according to the set temperature deviation value and the actual temperature deviation value. t The steps include: PID control is performed according to the set temperature deviation value and the actual temperature deviation value to determine the current ratio R between the current in the second area and the current in the first area t .
5. The temperature control device according to claim 3, characterized in that: The current ratio R between the current in the second region and the current in the first region is determined according to the set temperature deviation value and the actual temperature deviation value. t The steps also include: Obtaining a preset first current ratio; In response to the actual temperature deviation being greater than the set temperature deviation, increasing the first current ratio to determine a second current ratio for controlling the current change in the second region; or In response to the actual temperature difference being less than the set temperature deviation value, the first current ratio is reduced to determine a third current ratio for controlling the current in the second region to be stable.
6. The temperature control device according to claim 4 or 5, characterized in that: The current ratio R between the current in the second region and the current in the first region is determined according to the set temperature deviation value and the actual temperature deviation value. t The steps also include: Obtaining a lower limit and an upper limit of a current ratio between a current in the second region and a current in the first region, wherein the lower limit and the upper limit are used to define a safety range to prevent the heating plate from breaking; and Within the range of the current ratio lower limit and the current ratio upper limit, the current ratio between the current of the second region and the current of the first region is adjusted to prevent the heating disk from being broken.
7. The temperature control device according to claim 1, characterized in that: The first area is a circular area of a first diameter at the center of the heating disk, and the second area is an annular area at the periphery of the heating disk that is concentric with the first area.
8. The temperature control device according to claim 1, characterized in that: Also includes: a first power controller, configured to output a first actual power value to a first area on the heating plate according to the first set power value, so as to adjust the temperature of the first area; as well as The second power controller is used to output a second actual power value to the second area on the heating plate according to the second set power value, so as to control the temperature of the second area to be adjusted synchronously with the temperature of the first area.
9. A method for controlling the temperature of a heating plate, characterized in that: The following steps are involved: Determining, by a first thermostat in the temperature control device for a heating disk according to any one of claims 1 to 8, a first set power value for controlling the first area on the heating disk according to a set temperature value of the first area and an actual temperature value of the first area, wherein the first area is a circular area of a first diameter at the center of the heating disk; and Via the second temperature controller in the temperature control device, a second set power value for controlling the second area is determined based on a set temperature deviation value between the first area and the second area on the heating disk, and an actual temperature deviation value between the first area and the second area, wherein the second area is an annular area concentric with the first area on the periphery of the heating disk.
10. A computer-readable storage medium, characterized in that: Computer instructions are stored thereon, wherein when the computer instructions are executed by a processor, the temperature control method of the heating plate as claimed in claim 9 is implemented.
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