Electronic component resin packaging machine

Abstract

The invention relates to the technical field of resin packaging, and particularly discloses a resin packaging machine for electronic components. According to the electronic component resin packaging machine, the purpose of heating, air-drying, cooling and accelerating curing in time after packaging is achieved. The stirring device is used for mixing, stirring and guiding liquid raw materials such as a hardening agent required by epoxy resin packaging and epoxy resin, the packaging device is used for guiding out the stirred raw materials, and the drying device is used for heating and drying the raw materials so as to accelerate curing of the raw materials; and the collecting device is used for cooling the packaged electronic component and automatically stripping the packaged electronic component. The epoxy resin, the hardening agent and other raw materials are fully mixed, and the curing process is accelerated by heating, air-drying and cooling in time after packaging, so that the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of resin encapsulation, and particularly to a resin encapsulation machine for electronic components. Background Art

[0002] The resin encapsulation technology for electronic components is a key link in semiconductor manufacturing and post-packaging. It is mainly used to protect core components such as chips and lead frames from environmental (humidity, dust, mechanical shock, etc.) erosion, and at the same time improve the electrical stability and mechanical strength of the device. The limitations of early encapsulation technologies and equipment have driven the iterative upgrade of resin encapsulation machines.

[0003] Most of the current resin encapsulation equipment adopts an operation mode of separately heating and curing in an oven after encapsulation. The uncured resin is prone to displacement during the movement, resulting in problems such as incomplete curing. Summary of the Invention

[0004] To achieve the above objectives, the present invention is realized through the following technical solutions: A resin encapsulation machine for electronic components, including a bottom plate bracket, a support frame is fixedly connected to the top of the bottom plate bracket, a stirring device is fixedly connected to the top of the support frame, a packaging device is fixedly connected to the top inner wall of the support frame, a drying device is fixedly connected to the side inner wall of the support frame, a collecting device is fixedly connected to the top of the bottom plate bracket, the drying device is arranged below the packaging device, and the collecting device is arranged inside the support frame;

[0005] The stirring device includes a stirring housing, a stirring shaft penetrates and is slidably connected to the top inner wall of the stirring housing, a feed port is communicated with the top of the stirring shaft, a stirring assembly is sleeved on the side of the stirring shaft, the output end of a belt transmission mechanism is fixedly connected to the top side of the stirring assembly, the input end of the belt transmission mechanism is fixedly connected to a first motor, a discharge pipe is communicated with the bottom side of the stirring shaft, the side of the first motor is fixedly connected to a stirring bracket, the side of the stirring bracket away from the first motor is fixedly connected to the side of the stirring housing, the bottom of the stirring shaft and the stirring bracket are both fixedly connected to the top of the support frame. The driving shaft of the first motor drives the belt transmission mechanism to rotate, the raw materials are introduced through the feed port, the raw materials enter the inner wall of the stirring housing and are fully mixed through the stirring action of the stirring assembly, so that epoxy resin and hardener, etc. are mixed. After mixing, they enter the packaging device through the discharge pipe for packaging coating. It realizes the mixing and stirring of raw materials such as epoxy resin and hardener, and increases the mixing degree between raw materials compared with the traditional extrusion mixing method, thereby improving the encapsulation quality.

[0006] Preferably, the stirring shaft includes a stirring shaft body. A rotating shaft hole is formed on the side surface of the stirring shaft body. A liquid inlet is formed at the top of the stirring shaft body. Liquid outlet holes are formed on the inner side surface of the liquid inlet. A raw material outlet hole is formed at one side of the bottom of the stirring shaft body. A diversion groove is formed at the bottom of the inner wall of the raw material outlet hole. The diversion groove is communicated with a discharge pipe. The top of the liquid inlet is communicated with the bottom of a feed inlet.

[0007] Preferably, the stirring assembly includes a stirring upper pipe. A forward stirring blade is fixedly connected to the bottom of the stirring upper pipe. A liquid outlet hole adapted to the liquid outlet holes is formed on the side surface of the stirring upper pipe. A first bevel gear is fixedly connected to the bottom of the stirring upper pipe. A second bevel gear is meshed with the side surface of the first bevel gear. A fixed shaft is fixedly connected to the side surface of the second bevel gear. A third bevel gear is meshed with the bottom of the second bevel gear. A stirring lower pipe is fixedly connected to the bottom of the third bevel gear. A reverse stirring blade is fixedly connected to the side surface of the stirring lower pipe. The fixed shaft is rotationally connected with the stirring shaft body through the rotating shaft hole. The stirring upper pipe, the first bevel gear, the third bevel gear and the stirring lower pipe are all sleeved on the side surface of the stirring shaft body and are rotationally connected with the stirring shaft body. The raw material outlet hole is arranged at a position below the stirring lower pipe. The stirring upper pipe is fixedly connected to the output end of a belt transmission mechanism. The rotation of the stirring upper pipe drives the forward stirring blade to rotate. The rotation of the forward stirring blade drives the raw materials flowing out from the liquid outlet holes to flow, so as to perform stirring. The rotation of the stirring upper pipe drives the liquid outlet holes to rotate. The rotation of the liquid outlet holes drives the second bevel gear to rotate. The second bevel gear rotates around the fixed shaft. The fixed shaft rotates on the inner wall of the rotating shaft hole and limits the second bevel gear. The rotation of the second bevel gear drives the third bevel gear to rotate. The rotation of the third bevel gear drives the stirring lower pipe to rotate. The stirring lower pipe drives the reverse stirring blade to rotate. Through the meshing and direction change of the first bevel gear, the second bevel gear and the third bevel gear, the rotation directions of the third bevel gear and the second bevel gear on the side surface of the stirring shaft body are opposite. The raw materials are pushed upward through the set angle of the reverse stirring blade, and the forward stirring blade pushes the raw materials downward, so that the raw materials are stirred at a position on the inner wall of the stirring housing located between the third bevel gear and the first bevel gear, avoiding the insufficient stirring caused by the deposition of raw materials and the stratification of raw materials, etc., so that the raw materials are stirred more fully, and the curing is uniform during the curing process after the sealing layer is completed, thereby improving the firmness of the electronic components on the circuit board and thus improving the curing quality.

[0008] Preferably, the encapsulation device includes a first electric sliding table, the bottom of the sliding end of the first electric sliding table is fixedly connected with an encapsulation tube, the side of the encapsulation tube is fixedly connected with a second motor, the driving shaft of the second motor penetrates the side of the encapsulation tube and is rotatably connected with the encapsulation tube, the side of the encapsulation tube is fixedly connected with a stud, a piston disk is sleeved on the stud and is rotationally connected with the stud through a thread, the side of the encapsulation tube away from the second motor is communicated with a liquid inlet tube, one end of the liquid inlet tube away from the encapsulation tube is communicated with a first one-way valve, the bottom of the encapsulation tube is communicated with a second one-way valve, the bottom of the second one-way valve is communicated with a coating tube, the top of the first electric sliding table is fixedly connected with the inner wall top of the support frame, and one end of the first one-way valve away from the liquid inlet tube is communicated with a discharge tube.

[0009] Preferably, the drying device includes a drying bottom shell, the side of the drying bottom shell is fixedly connected with an air inlet fan, the top of the drying bottom shell is fixedly connected with an arc plate, the side of the arc plate is fixedly connected with a reflector, a heating tube is fixedly connected at a position of the arc plate on one side of the reflector, the side of the inner wall of the drying bottom shell is fixedly connected with a wind guiding plate, the side of the arc plate is fixedly connected with the side of the support frame. The rotation of the driving shaft of the second motor drives the stud to rotate, and the rotation of the stud drives the piston disk to move through the thread. The movement of the piston disk extrudes the raw material inside the encapsulation tube, so that the raw material flows out unidirectionally from the second one-way valve and is coated on the surface of the electronic component through the coating tube. When the raw material inside the encapsulation tube is used up, the driving shaft of the second motor drives the stud to rotate back, so that the piston disk moves away from the liquid inlet tube. At this time, the second one-way valve is closed, and air cannot enter the inside of the encapsulation tube from the coating tube. The raw material flows unidirectionally along the first one-way valve through the discharge tube into the inside of the liquid inlet tube and then into the inside of the encapsulation tube for replenishment. When the piston disk squeezes the raw material when approaching the liquid inlet tube, the first one-way valve remains closed, so that the raw material cannot flow back into the inside of the discharge tube from the liquid inlet tube, thus completing the automatic replenishment of the raw material inside the encapsulation tube and keeping the inside of the encapsulation tube full of raw material, which is beneficial for automatic production line operation.

[0010] Preferably, the collection device includes a collection bracket, the inner wall top of the collection bracket is fixedly connected with a cooling fan, the side of the collection bracket is fixedly connected with a first sliding strip, a collection box is sleeved on the side of the first sliding strip and is slidably connected therewith, ventilation holes are formed in the bottom of the inner wall of the collection box, a second electric sliding table is fixedly connected to the side of the collection bracket at the top of the collection box, a fixing plate is fixedly connected to the side of the second electric sliding table, a fixing plate is fixedly connected to the side of the sliding end of the second electric sliding table, and the bottom of the collection bracket is fixedly connected with the top of the bottom plate bracket.

[0011] Preferably, the fixing plate includes a fixing base plate. A stepped hole is formed in the top of the fixing base plate. Guide bars are fixedly connected to the inner wall of the stepped hole. A material guiding hole adapted to the material guiding block is formed in one side of the fixing base plate. The side surface of the fixing base plate is fixedly connected to the side surface of the sliding end of the second electric sliding table.

[0012] The present invention provides an electronic component resin encapsulation machine, which has the following beneficial effects:

[0013] 1. In this electronic component resin encapsulation machine, the driving shaft of the first motor drives the belt transmission mechanism to rotate. The raw materials are introduced through the feed port. The raw materials enter the inner wall of the stirring housing and are fully mixed under the stirring action of the stirring assembly, so that epoxy resin, hardener, etc. are mixed. After mixing, they enter the encapsulation device through the discharge pipe for encapsulation coating. The mixing and stirring of raw materials such as epoxy resin and hardener are realized. Compared with the traditional extrusion mixing method, the mixing degree between raw materials is increased, thereby improving the encapsulation quality.

[0014] 2. In this electronic component resin encapsulation machine, the rotation of the upper stirring tube drives the forward stirring blades to rotate. The rotation of the forward stirring blades drives the raw materials flowing out of the liquid outlet holes to flow, so as to carry out stirring. The rotation of the upper stirring tube drives the liquid outlet holes to rotate. The rotation of the liquid outlet holes drives the second bevel gear to rotate. The second bevel gear rotates around the fixed shaft. The fixed shaft rotates in the inner wall of the rotating shaft hole and limits the second bevel gear. The rotation of the second bevel gear drives the third bevel gear to rotate. The rotation of the third bevel gear drives the lower stirring tube to rotate. The lower stirring tube drives the reverse stirring blades to rotate. Through the meshing and direction change of the first bevel gear, the second bevel gear and the third bevel gear, the rotation directions of the third bevel gear and the second bevel gear on the side of the stirring shaft body are opposite. And the raw materials are pushed upward through the set angles of the reverse stirring blades, and the forward stirring blades push the raw materials downward, so that the raw materials are stirred at the position between the third bevel gear and the first bevel gear on the inner wall of the stirring housing, avoiding the insufficient stirring caused by raw material deposition and the occurrence of raw material stratification and other situations, so that the raw materials are stirred more fully. During the curing process after the sealing layer is completed, the curing is uniform, thereby improving the firmness of the electronic components on the circuit board and thus improving the curing quality.

[0015] 3. The resin encapsulation machine for electronic components is provided with a drive shaft of a second motor that rotates to drive a stud to rotate. The rotation of the stud drives a piston disk to move through a thread. The movement of the piston disk extrudes the raw material inside the encapsulation tube, so that the raw material flows out unidirectionally through the second one-way valve and is coated on the surface of the electronic component through a coating tube. When the raw material inside the encapsulation tube is used up, the drive shaft of the second motor drives the stud to rotate in reverse, causing the piston disk to move away from the liquid inlet tube. At this time, the second one-way valve is closed, and air cannot enter the inside of the encapsulation tube from the coating tube. The raw material flows unidirectionally along the discharge tube through the first one-way valve into the inside of the liquid inlet tube and then into the inside of the encapsulation tube for replenishment. When the piston disk squeezes the raw material when approaching the liquid inlet tube, the first one-way valve remains closed, so that the raw material cannot flow back from the liquid inlet tube into the inside of the discharge tube, thus completing the automatic replenishment of the raw material inside the encapsulation tube and keeping the inside of the encapsulation tube full of raw material, which is beneficial for automated production line operations.

[0016] 4. The resin encapsulation machine for electronic components is provided with a heating tube that generates heat radiation to heat the bottom of the electronic component. The reflector reflects and concentrates the heat radiation generated by the heating tube, so that the heat is concentrated, and the bottom of the electronic component is heated sufficiently. Heating from the bottom is beneficial for the solder joints and the chip to heat up preferentially at the solder joint part, so that the raw material is cured. Thus, compared with the traditional curing method of preferentially curing the upper layer of the resin from the resin surface, the firmness of the electronic component is increased. The intake fan drives air to pass through the guiding action of the air guiding plate, and the air is heated by the heating tube. The hot air blows towards the bottom of the electronic component through the guiding of the air guiding plate, so as to perform auxiliary drying and curing operations, which helps the epoxy resin and the hardener to undergo a curing reaction and cure on the surface of the component.

[0017] 5. The resin encapsulation machine for electronic components is provided with a second electric slide table that drives a fixed bottom plate to move. The plate layer is placed on the inner wall of the stepped hole and slides. The guiding strip guides the plate layer, so that the plate layer is stabilized in a fixed position. The second electric slide table drives the fixed bottom plate to move, and the movement of the fixed bottom plate drives the plate layer to move. The plate layer completes the epoxy resin coating below the coating tube, moves to the vicinity of the guiding block after being heated by the heating tube, slides through the side of the guiding hole of the guiding block, and the guiding block drives the plate layer to move on the upper surface of the guiding block and moves under the blowing action of the cooling fan, so that the board falls under the action of gravity into the inside of the collection box, thus completing the collection of the board. At the same time, air flows through the ventilation holes, driving the air inside the collection box to flow, which is beneficial for the cooling fan to drive air to flow and for the heat dissipation of the board and the dissipation of heat. The cooling and automatic collection of the board are realized. Description of the Drawings

[0018] Figure 1 Schematic diagram of the resin encapsulation machine for electronic components of the present invention;

[0019] Figure 2 Schematic diagram of the stirring device of the present invention;

[0020] Figure 3 Schematic diagram of the stirring shaft of the present invention;

[0021] Figure 4 Schematic diagram of the stirring assembly of the present invention;

[0022] Figure 5 Schematic diagram of the encapsulation device of the present invention;

[0023] Figure 6 Schematic diagram of the drying device of the present invention;

[0024] Figure 7 Schematic diagram of the collection device of the present invention;

[0025] Figure 8 Schematic diagram of the fixing plate of the present invention.

[0026] In the figure: 1, bottom plate bracket; 2, support frame; 3, stirring device; 4, encapsulation device; 5, drying device; 6, collection device; 301, stirring housing; 302, stirring shaft; 303, feed inlet; 304, stirring assembly; 305, belt drive mechanism; 306, stirring bracket; 307, discharge pipe; 308, first motor; 3021, stirring shaft body; 3022, rotating shaft hole; 3023, liquid inlet; 3024, liquid outlet hole; 3025, raw material outlet hole; 3026, diversion groove; 3041, upper stirring pipe; 3042, forward stirring blade; 3043, liquid outlet hole; 3044, first bevel gear; 3045, second bevel gear; 3046, fixed shaft; 3047, third bevel gear; 3048, lower stirring pipe; 3049, reverse stirring blade; 401, first electric sliding table; 402, encapsulation pipe; 403, second motor; 404, stud; 405, piston disc; 406, liquid inlet pipe; 407, first one-way valve; 408, second one-way valve; 409, coating pipe; 501, drying bottom shell; 502, intake fan; 503, arc plate; 504, reflector; 505, heating pipe; 506, air guide plate; 601, collection bracket; 602, cooling fan; 603, first slide bar; 604, collection box; 605, ventilation hole; 606, second electric sliding table; 607, material guiding block; 608, fixing plate; 6081, fixed bottom plate; 6082, stepped hole; 6083, guiding strip; 6084, material guiding hole. Detailed implementation mode

[0027] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0028] Please refer to Figure 1 - Figure 2 , the present invention provides a technical solution: an electronic component resin encapsulation machine, including a bottom plate bracket 1, a support frame 2 is fixedly connected to the top of the bottom plate bracket 1, a stirring device 3 is fixedly connected to the top of the support frame 2, an encapsulation device 4 is fixedly connected to the inner wall top of the support frame 2, a drying device 5 is fixedly connected to the inner wall side of the support frame 2, a collecting device 6 is fixedly connected to the top of the bottom plate bracket 1, the drying device 5 is arranged below the encapsulation device 4, and the collecting device 6 is arranged inside the support frame 2.

[0029] The stirring device 3 mixes and stirs liquid raw materials such as hardeners required for epoxy resin encapsulation with epoxy resin and conducts guiding. The encapsulation device 4 discharges the stirred raw materials. The drying device 5 heats and dries the raw materials to accelerate the curing of the raw materials. The collecting device 6 cools the encapsulated electronic components and performs automatic material discharging. It realizes the full mixing of raw materials such as epoxy resin and hardener, and heats, air-dries and cools in time after encapsulation to accelerate the curing process, thereby improving the production efficiency.

[0030] The stirring device 3 includes a stirring housing 301, a stirring shaft 302 penetrates and is slidably connected to the inner wall top of the stirring housing 301, a feed inlet 303 is communicated with the top of the stirring shaft 302, a stirring assembly 304 is sleeved on the side of the stirring shaft 302, the top side of the stirring assembly 304 is fixedly connected to the output end of a belt transmission mechanism 305, the input end of the belt transmission mechanism 305 is fixedly connected to a first motor 308, a discharge pipe 307 is communicated with the bottom side of the stirring shaft 302, the side of the first motor 308 is fixedly connected to a stirring bracket 306, the side of the stirring bracket 306 away from the first motor 308 is fixedly connected to the side of the stirring housing 301, and both the bottom of the stirring shaft 302 and the stirring bracket 306 are fixedly connected to the top of the support frame 2.

[0031] During stirring, the first motor 308 is started, and the drive shaft of the first motor 308 drives the belt transmission mechanism 305 to rotate. Raw materials are introduced through the feed port 303. The raw materials enter the inner wall of the stirring housing 301 and are fully mixed through the stirring action of the stirring assembly 304, so that epoxy resin and hardener, etc. are mixed. After mixing, they enter the encapsulation device 4 through the discharge pipe 307 for encapsulation coating. The mixing and stirring of raw materials such as epoxy resin and hardener are realized, and the mixing degree between raw materials is increased compared with the traditional extrusion mixing method, thereby improving the encapsulation quality.

[0032] Please refer to Figure 1 - Figure 4 , the present invention provides a technical solution: the stirring shaft 302 includes a stirring shaft body 3021, a rotating shaft hole 3022 is formed on the side surface of the stirring shaft body 3021, a liquid inlet 3023 is formed at the top of the stirring shaft body 3021, a liquid outlet hole 3024 is formed on the inner wall side surface of the liquid inlet 3023, a raw material outlet hole 3025 is formed on one side of the bottom of the stirring shaft body 3021, a diversion groove 3026 is formed on the inner wall bottom of the raw material outlet hole 3025, the diversion groove 3026 is communicated with the discharge pipe 307, and the top of the liquid inlet 3023 is communicated with the bottom of the feed port 303.

[0033] The stirring assembly 304 includes a stirring upper pipe 3041, a forward stirring blade 3042 is fixedly connected to the bottom of the stirring upper pipe 3041, a liquid outlet hole 3043 adapted to the liquid outlet hole 3024 is formed on the side surface of the stirring upper pipe 3041, a first bevel gear 3044 is fixedly connected to the bottom of the stirring upper pipe 3041, a second bevel gear 3045 is engaged with the side surface of the first bevel gear 3044, a fixed shaft 3046 is fixedly connected to the side surface of the second bevel gear 3045, a third bevel gear 3047 is engaged with the bottom of the second bevel gear 3045, a stirring lower pipe 3048 is fixedly connected to the bottom of the third bevel gear 3047, a reverse stirring blade 3049 is fixedly connected to the side surface of the stirring lower pipe 3048, the fixed shaft 3046 is rotatably connected to the stirring shaft body 3021 through the rotating shaft hole 3022, the stirring upper pipe 3041, the first bevel gear 3044, the third bevel gear 3047 and the stirring lower pipe 3048 are all sleeved on the side surface of the stirring shaft body 3021 and rotatably connected to the stirring shaft body 3021, the raw material outlet hole 3025 is arranged at a position below the stirring lower pipe 3048, and the stirring upper pipe 3041 is fixedly connected to the output end of the belt transmission mechanism 305.

[0034] After the raw materials are introduced along the feed port 303, the raw materials flow along the liquid inlet 3023 under the action of gravity, and flow out from the liquid outlet hole 3043 through the liquid outlet hole 3024 and enter the inside of the stirring housing 301. The belt drive mechanism 305 drives the upper stirring pipe 3041 to rotate. The rotation of the upper stirring pipe 3041 drives the forward stirring blades 3042 to rotate. The rotation of the forward stirring blades 3042 drives the raw materials flowing out from the liquid outlet hole 3043 to flow, so as to carry out stirring. The rotation of the upper stirring pipe 3041 drives the liquid outlet hole 3043 to rotate. The rotation of the liquid outlet hole 3043 drives the second bevel gear 3045 to rotate. The second bevel gear 3045 rotates around the fixed shaft 3046. The fixed shaft 3046 rotates on the inner wall of the rotating shaft hole 3022 and limits the second bevel gear 3045. The rotation of the second bevel gear 3045 drives the third bevel gear 3047 to rotate. The rotation of the third bevel gear 3047 drives the lower stirring pipe 3048 to rotate. The lower stirring pipe 3048 drives the reverse stirring blades 3049 to rotate. Through the meshing and direction change of the first bevel gear 3044, the second bevel gear 3045 and the third bevel gear 3047, the rotation directions of the third bevel gear 3047 and the second bevel gear 3045 on the side of the stirring shaft body 3021 are opposite, and the raw materials are pushed upward through the set angle of the reverse stirring blades 3049, and the forward stirring blades 3042 push the raw materials downward, so that the raw materials are stirred at the position on the inner wall of the stirring housing 301 between the third bevel gear 3047 and the first bevel gear 3044, avoiding the insufficient stirring caused by the deposition of raw materials and the occurrence of raw material stratification and other situations, so that the raw materials are stirred more fully, and the curing is uniform during the curing process after the sealing layer is completed, so as to improve the firmness of the electronic components on the circuit board and thus improve the curing quality.

[0035] Please refer to Figure 1 - Figure 6, the present invention provides a technical solution: The encapsulation device 4 includes a first electric slide table 401, the bottom of the sliding end of the first electric slide table 401 is fixedly connected with an encapsulation tube 402, the side of the encapsulation tube 402 is fixedly connected with a second motor 403, the drive shaft of the second motor 403 penetrates the side of the encapsulation tube 402 and is rotatably connected with the encapsulation tube 402, the side of the encapsulation tube 402 is fixedly connected with a stud 404, a piston disk 405 is sleeved on the stud 404 and is rotationally connected by threads, one side of the encapsulation tube 402 away from the second motor 403 is communicated with a liquid inlet tube 406, one end of the liquid inlet tube 406 away from the encapsulation tube 402 is communicated with a first one-way valve 407, the bottom of the encapsulation tube 402 is communicated with a second one-way valve 408, the bottom of the second one-way valve 408 is communicated with a coating tube 409, the top of the first electric slide table 401 is fixedly connected with the inner top of the support frame 2, and one end of the first one-way valve 407 away from the liquid inlet tube 406 is communicated with the discharge tube 307.

[0036] When performing the coating curing operation, start the first electric slide table 401 and the second motor 403. The first electric slide table 401 drives the encapsulation tube 402 to move to different positions. The drive shaft of the second motor 403 rotates to drive the stud 404 to rotate. The rotation of the stud 404 drives the piston disk 405 to move through the threads. The movement of the piston disk 405 squeezes the raw material inside the encapsulation tube 402, so that the raw material flows out unidirectionally from the second one-way valve 408 and is coated on the surface of the electronic component through the coating tube 409. When the raw material inside the encapsulation tube 402 is used up, the drive shaft of the second motor 403 drives the stud 404 to rotate back, so that the piston disk 405 moves away from the liquid inlet tube 406. At this time, the second one-way valve 408 is closed, and air cannot enter the inside of the encapsulation tube 402 from the coating tube 409. The raw material flows unidirectionally along the first one-way valve 407 through the discharge tube 307 into the inside of the liquid inlet tube 406 and then into the inside of the encapsulation tube 402 for replenishment. When the piston disk 405 squeezes the raw material when approaching the liquid inlet tube 406, the first one-way valve 407 remains closed, so that the raw material cannot flow back into the inside of the discharge tube 307 from the liquid inlet tube 406, thus completing the automatic replenishment of the raw material inside the encapsulation tube 402 and keeping the inside of the encapsulation tube 402 full of raw material, which is beneficial for automated assembly line operations.

[0037] The drying device 5 includes a drying bottom shell 501. An intake fan 502 is fixedly connected to the side of the drying bottom shell 501. An arc-shaped plate 503 is fixedly connected to the top of the drying bottom shell 501. A reflecting plate 504 is fixedly connected to the side of the arc-shaped plate 503. A heating pipe 505 is fixedly connected to the position of the arc-shaped plate 503 on one side of the reflecting plate 504. A wind guiding plate 506 is fixedly connected to the inner wall side of the drying bottom shell 501. The side of the arc-shaped plate 503 is fixedly connected to the side of the support frame 2.

[0038] The heating pipe 505 generates heat radiation to heat the bottom of the electronic component board. The reflecting plate 504 reflects and concentrates the heat radiation generated by the heating pipe 505, so that the heat is concentrated, and thus the bottom of the electronic component board is heated sufficiently. Heating from the bottom is beneficial for the solder joints and the chips to heat preferentially at the solder joint parts, so that the raw materials are cured. Thus, compared with the traditional curing method of preferentially curing the upper layer of the resin from the resin surface, the firmness of the electronic components is increased. The intake fan 502 drives the air, and under the guiding action of the wind guiding plate 506, the air is heated by the heating pipe 505. The hot air is blown towards the bottom of the electronic component through the guiding of the wind guiding plate 506, so as to perform auxiliary drying and curing operations, which helps the epoxy resin and the hardener to undergo a curing reaction and cure on the surface of the component.

[0039] Please refer to Figure 1 - Figure 8 , the present invention provides a technical solution: The collection device 6 includes a collection bracket 601. A cooling fan 602 is fixedly connected to the inner wall top of the collection bracket 601. A first sliding strip 603 is fixedly connected to the side of the collection bracket 601. A collection box 604 is sleeved and slidably connected to the side of the first sliding strip 603. Ventilation holes 605 are opened at the inner wall bottom of the collection box 604. A second electric sliding table 606 is fixedly connected to the side of the collection bracket 601 at the top of the collection box 604. A fixing plate 608 is fixedly connected to the side of the second electric sliding table 606. The sliding end side of the second electric sliding table 606 is fixedly connected to a fixing plate 608. The bottom of the collection bracket 601 is fixedly connected to the top of the bottom plate bracket 1.

[0040] The fixing plate 608 includes a fixed bottom plate 6081. A stepped hole 6082 is opened at the top of the fixed bottom plate 6081. A guiding strip 6083 is fixedly connected to the inner wall of the stepped hole 6082. A guiding hole 6084 adapted to the material guiding block 607 is opened at one side of the fixed bottom plate 6081. The side of the fixed bottom plate 6081 is fixedly connected to the sliding end side of the second electric sliding table 606.

[0041] Power on the second electric slide table 606 and the cooling fan 602. The cooling fan 602 cools the cured component board, so that the epoxy resin and the hardener are completely cured on the surface of the component board layer. The second electric slide table 606 drives the fixed bottom plate 6081 to move, and the board layer slides on the inner wall of the stepped hole 6082. The guide bar 6083 guides the board layer, so that the board layer is stable in the fixed position. The second electric slide table 606 drives the fixed bottom plate 6081 to move, and the movement of the fixed bottom plate 6081 drives the board layer to move. The board layer completes the epoxy resin coating under the coating pipe 409, moves to the vicinity of the material guide block 607 after being heated by the heating pipe 505, slides through the side of the material guide hole 6084 of the material guide block 607. The material guide block 607 drives the board layer to move on the upper surface of the material guide block 607 and moves under the blowing action of the cooling fan 602, so that the board falls under the action of gravity into the inside of the collection box 604, thus completing the collection of the board. At the same time, the air flows through the ventilation hole 605, driving the air inside the collection box 604 to flow, which is beneficial to the cooling fan 602 to drive the air to flow and the heat dissipation of the board and the dissipation of heat. The cooling and automatic collection of the board are realized.

[0042] Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art and related fields without creative efforts shall fall within the protection scope of the present invention. The structures, devices and operation methods not specifically described and explained in the present invention, unless otherwise specified and limited, are implemented according to the conventional means in the art.

Claims

1. An electronic component resin encapsulation machine, characterized in that: The invention comprises a bottom plate support (1), the top of the bottom plate support (1) is fixedly connected to a support frame (2), the top of the support frame (2) is fixedly connected to a stirring device (3), the top of the inner wall of the support frame (2) is fixedly connected to a packaging device (4), the inner wall side of the support frame (2) is fixedly connected to a drying device (5), the top of the bottom plate support (1) is fixedly connected to a collecting device (6), the drying device (5) is arranged below the packaging device (4), and the collecting device (6) is arranged inside the support frame (2); The stirring device (3) comprises a stirring shell (301), the top of the inner wall of the stirring shell (301) is penetrated by a stirring shaft (302) and is slidably connected thereto, the top of the stirring shaft (302) is connected to a feed port (303), the side of the stirring shaft (302) is sleeved with a stirring assembly (304), the top side of the stirring assembly (304) is fixedly connected to the output end of a belt transmission mechanism (305), the input end of the belt transmission mechanism (305) is fixedly connected to a first motor (308), the bottom side of the stirring shaft (302) is connected to a discharge pipe (307), the side of the first motor (308) is fixedly connected to a stirring bracket (306), the side of the stirring bracket (306) away from the first motor (308) is fixedly connected to the side of the stirring shell (301), and the bottom of the stirring shaft (302) and the stirring bracket (306) are both fixedly connected to the top of a support frame (2).

2. The electronic component resin encapsulation machine according to claim 1, characterized in that: The stirring shaft (302) comprises a stirring shaft body (3021), a rotating shaft hole (3022) is provided on the side of the stirring shaft body (3021), a liquid inlet (3023) is provided on the top of the stirring shaft body (3021), a liquid outlet hole (3024) is provided on the inner wall side of the liquid inlet (3023), a raw material outlet hole (3025) is provided on one side of the bottom of the stirring shaft body (3021), and a guide groove (3026) is provided on the bottom of the inner wall of the raw material outlet hole (3025).

3. The electronic component resin encapsulation machine according to claim 2, characterized in that: The guide groove (3026) is connected to the discharge pipe (307), and the top of the liquid inlet (3023) is connected to the bottom of the feed inlet (303).

4. The electronic component resin encapsulation machine according to claim 2, characterized in that: The stirring assembly (304) comprises an upper stirring tube (3041), the bottom of which is fixedly connected to a forward stirring blade (3042), a side of which is provided with a liquid outlet hole (3043) adapted to the liquid outlet hole (3024), a first bevel gear (3044) fixedly connected to the bottom of the upper stirring tube (3041), a side of which is meshed with a second bevel gear (3045), and The side of the second bevel gear (3045) is fixedly connected to a fixed shaft (3046), the bottom of the second bevel gear (3045) is meshed with a third bevel gear (3047), the bottom of the third bevel gear (3047) is fixedly connected to a stirring lower tube (3048), the side of the stirring lower tube (3048) is fixedly connected to a reverse stirring blade (3049), and the fixed shaft (3046) is rotatably connected to the stirring shaft body (3021) through the rotating shaft hole (3022).

5. The electronic component resin encapsulation machine according to claim 4, characterized in that: The stirring upper tube (3041), the first bevel gear (3044), the third bevel gear (3047) and the stirring lower tube (3048) are all sleeved on the side of the stirring shaft (3021) and are rotatably connected to the stirring shaft (3021); the raw material outlet hole (3025) is arranged below the stirring lower tube (3048); and the stirring upper tube (3041) is fixedly connected to the output end of the belt transmission mechanism (305).

6. The electronic component resin encapsulation machine according to claim 1, characterized in that: The packaging device (4) comprises a first electric slide (401), the bottom of the sliding end of the first electric slide (401) is fixedly connected to a packaging tube (402), the side of the packaging tube (402) is fixedly connected to a second motor (403), the driving shaft of the second motor (403) passes through the side of the packaging tube (402) and is rotatably connected to the packaging tube (402), the side of the packaging tube (402) is fixedly connected to a stud (404), a piston disc (405) is sleeved on the stud (404) and is rotatably connected via a thread, and the packaging tube (402) is fixedly connected to the side of the packaging tube (402). 02) A liquid inlet pipe (406) is connected to the side away from the second motor (403), and the end of the liquid inlet pipe (406) away from the packaging tube (402) is connected to a first one-way valve (407), the bottom of the packaging tube (402) is connected to a second one-way valve (408), and the bottom of the second one-way valve (408) is connected to a coating tube (409), the top of the first electric slide (401) is fixedly connected to the top of the inner wall of the support frame (2), and the end of the first one-way valve (407) away from the liquid inlet pipe (406) is connected to the discharge pipe (307).

7. The electronic component resin encapsulation machine according to claim 1, characterized in that: The drying device (5) comprises a drying bottom shell (501), an air intake fan (502) is fixedly connected to the side of the drying bottom shell (501), an arc plate (503) is fixedly connected to the top of the drying bottom shell (501), a reflective plate (504) is fixedly connected to the side of the arc plate (503), a heating tube (505) is fixedly connected to the position of the arc plate (503) located on one side of the reflective plate (504), an air guide plate (506) is fixedly connected to the side of the inner wall of the drying bottom shell (501), and the side of the arc plate (503) is fixedly connected to the side of the support frame (2).

8. The electronic component resin encapsulation machine according to claim 1, characterized in that: The collecting device (6) comprises a collecting bracket (601), the top of the inner wall of the collecting bracket (601) is fixedly connected to a cooling fan (602), the side of the collecting bracket (601) is fixedly connected to a first slide bar (603), the side of the first slide bar (603) is sleeved and slidably connected to a collecting box (604), the bottom of the inner wall of the collecting box (604) is provided with a ventilation hole (605), the side of the collecting bracket (601) is located at the top of the collecting box (604) and is fixedly connected to a second electric slide (606), the side of the second electric slide (606) is fixedly connected to a fixing plate (608), the side of the sliding end of the second electric slide (606) is fixedly connected to a fixing plate (608), and the bottom of the collecting bracket (601) is fixedly connected to the top of the base plate bracket (1).

9. The electronic component resin encapsulation machine according to claim 8, characterized in that: The fixed plate (608) includes a fixed base plate (6081), a stepped hole (6082) is provided on the top of the fixed base plate (6081), a guide strip (6083) is fixedly connected to the inner wall of the stepped hole (6082), a material guide hole (6084) adapted to the material guide block (607) is provided on one side of the fixed base plate (6081), and a side surface of the fixed base plate (6081) is fixedly connected to the side surface of the sliding end of the second electric slide (606).

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