Manufacturing method of light-emitting module, light-emitting module and display device

Abstract

The invention relates to a manufacturing method of a light-emitting module, the light-emitting module and a display device. The manufacturing method of the light-emitting module comprises the following steps: providing a circuit substrate and a light-emitting device, wherein the light-emitting device comprises a light-emitting chip and a packaging layer for packaging the light-emitting chip; arranging a light-emitting device on the circuit substrate; softening the packaging layer to enable the packaging layer to flow onto the circuit substrate; and curing the packaging layer to package the circuit substrate and the light-emitting chip together. In the manufacturing process of the light-emitting module, only at least one coating and attaching process of the packaging material is needed, the whole manufacturing process is simplified, and the cost is lower in some implementation processes.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a method for manufacturing a light-emitting module, a light-emitting module, and a display device. Background Art

[0002] With the intelligence of people's lives, display screens are increasingly applied in all aspects of life. Display technologies such as MiniLED (Mini Light Emitting Diode) and Micro LED (Micro Light Emitting Diode) have attracted wide attention in the display industry due to their excellent contrast, brightness, and other characteristics. In some applications, the light-emitting chips are first encapsulated once to form light-emitting devices and then transferred to protect the light-emitting chips during the manufacturing process. However, after the light-emitting devices are disposed on the circuit board, the circuit board and each light-emitting device thereon still need to be integrally encapsulated. It can be seen that the manufacturing of the light-emitting module requires at least two complete encapsulation processes, and both the cost and the process complexity are not low.

[0003] Therefore, how to reduce the complexity and cost of the encapsulation process in the manufacturing process of the light-emitting module is an urgent problem to be solved. Summary of the Invention

[0004] In view of the deficiencies of the above-related technologies, the purpose of the present application is to provide a method for manufacturing a light-emitting module, a light-emitting module, and a display device, aiming to solve the problem that the manufacturing of the light-emitting module requires at least two complete encapsulation processes, and both the cost and the process complexity are not low.

[0005] A method for manufacturing a light-emitting module includes:

[0006] Providing a circuit board and a light-emitting device, where the light-emitting device includes a light-emitting chip and an encapsulation layer encapsulating the light-emitting chip;

[0007] Disposing the light-emitting device on the circuit board;

[0008] Softening the encapsulation layer so that the encapsulation layer flows onto the circuit board; and

[0009] Curing the encapsulation layer to encapsulate the circuit board and the light-emitting chip together.

[0010] In the above method for manufacturing a light-emitting module, the encapsulation layer on the light-emitting device is softened and then cured again to form the final encapsulation layer. Only at least one process such as coating and attaching of the encapsulation material needs to be performed, and the overall process is simplified, and in some implementation processes, the cost is lower.

[0011] Optionally, the thickness of the encapsulation layer satisfies at least one of the following:

[0012] The thickness of the encapsulation layer on the light-emitting device before softening is greater than 150 um;

[0013] The thickness of the cured encapsulation layer on the circuit board is 100 - 250 um.

[0014] The thicker encapsulation layer formed on the light-emitting device provides stronger protection for the light-emitting device during processes such as transfer, reducing the yield loss. Moreover, in this embodiment, after the encapsulation layer is softened, the encapsulation layer flows to more areas, and its thickness will be significantly reduced compared to before softening. Therefore, it is also easy to control the thickness of the final light-emitting module.

[0015] Optionally, a plurality of the light-emitting devices with the encapsulation layer of the same material are provided on the circuit board;

[0016] The step of softening the encapsulation layer includes:

[0017] Softening and flowing the encapsulation layers on each of the light-emitting devices until they merge into one body, so that the cured encapsulation layer encapsulates the circuit board and each of the light-emitting chips thereon.

[0018] A plurality of light-emitting devices adopt encapsulation layers of the same material, and each encapsulation layer can be softened together and spread evenly, with high encapsulation efficiency; and only one integral encapsulation layer is formed on the light-emitting module, which has good protection.

[0019] Optionally, the step of providing the light-emitting device includes:

[0020] Providing a packaging substrate, the packaging substrate includes a circuit for bonding with the light-emitting chip and a circuit for connecting with the circuit board;

[0021] Setting the light-emitting chip on the packaging substrate;

[0022] Setting an encapsulation material to form the encapsulation layer encapsulating the light-emitting chip;

[0023] The step of arranging the light-emitting device on the circuit board includes:

[0024] Connecting the circuit on the packaging substrate with the circuit board.

[0025] Pre-encapsulating a plurality of light-emitting chips onto a packaging substrate to increase the size of the light-emitting device, which is easier to operate in subsequent processes and is more adaptable to existing equipment in some implementation processes.

[0026] Based on the same inventive concept, the present application also provides a light-emitting module, including:

[0027] A circuit board;

[0028] A light-emitting chip disposed on the circuit board; and

[0029] An encapsulation layer that encapsulates the light-emitting chip and the circuit board together;

[0030] Wherein, the light-emitting module is made by the above-mentioned manufacturing method of the light-emitting module.

[0031] During the manufacturing process of the above light-emitting module, only one coating, attachment and other processes of the encapsulation material need to be set. It only has one encapsulation layer that encapsulates the circuit board and the light-emitting chip thereon integrally, so the process is simplified, and in some implementation processes, it has lower cost.

[0032] Based on the same inventive concept, the present application also provides a display device, including:

[0033] A frame; and

[0034] The above-mentioned light-emitting module disposed on the frame.

[0035] The display device adopts the aforementioned light-emitting module, so the process is simplified, and in some implementation processes, it has lower cost. Description of the Drawings

[0036] Figure 1 It is a schematic flow chart of the manufacturing method of the light-emitting module provided by the embodiment of the present application;

[0037] Figure 2 It is a schematic diagram of the encapsulation structure of the light-emitting module in the related art;

[0038] Figure 3 It is a schematic flow chart of manufacturing a light-emitting device provided by the embodiment of the present application;

[0039] Figure 4 It is a schematic diagram of the structure of the light-emitting device provided by the embodiment of the present application;

[0040] Figure 5 It is a schematic diagram of the manufacturing process of the light-emitting module provided by the embodiment of the present application Figure 1 ;

[0041] Figure 6 It is a schematic diagram of the manufacturing process of the light-emitting module provided by the embodiment of the present application Figure 2 ;

[0042] Description of the Reference Numerals:

[0043] 101 - Circuit board; 200 - Light-emitting device; 2011 - Blue Micro LED chip; 2012 - Green Micro LED chip; 2013 - Red Micro LED chip; 202 - Encapsulation layer; 203 - Encapsulation substrate; 204 - Circuit for bonding with the light-emitting chip; 2041 - First pad; 205 - Second pad; 206 - Conductive through-hole; 207 - Black glue. Detailed implementation mode

[0044] For ease of understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. The preferred implementation modes of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the implementation modes described herein. On the contrary, the purpose of providing these implementation modes is to make the disclosure of the present application more thorough and comprehensive.

[0045] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present application belongs. The terms used in the specification of the present application herein are only for the purpose of describing specific implementation modes and are not intended to limit the present application.

[0046] In the related art, after the encapsulated light-emitting device is disposed on the circuit board, it is also necessary to perform overall encapsulation on the circuit board and each light-emitting device thereon, which requires two complete encapsulation processes, and both the cost and the process complexity are not low.

[0047] Based on this, the present application hopes to provide a solution that can solve the above technical problems, and its detailed content will be elaborated in the subsequent embodiments.

[0048] Embodiment:

[0049] See Figure 1 , to simplify the encapsulation process and reduce costs, the embodiment of the present application provides a method for manufacturing a light-emitting module, which includes but is not limited to the following steps:

[0050] S101. Provide a circuit board and a light-emitting device, where the light-emitting device includes a light-emitting chip and an encapsulation layer for encapsulating the light-emitting chip;

[0051] It should be noted that the encapsulation layer 202 forms a protective wrap outside the light-emitting chip. In practical applications, the encapsulation layer 202 usually adopts a light-transmitting and insulating adhesive material. The light-emitting device 200 in this application is actually a device encapsulating a light-emitting chip. It can encapsulate a single light-emitting chip or at least two light-emitting chips at the same time. To better carry the light-emitting chip and facilitate manufacturing, the light-emitting device 200 may include a substrate for carrying the light-emitting chip and the encapsulation layer 202. In this embodiment, the light-emitting chip may include, but is not limited to, at least one of a Mini LED chip and a Micro LED chip. However, in some implementation processes, it may also be other light-emitting chips.

[0052] In this application, the circuit substrate 101 can be a common PCB (Printed Circuit Board) board, or a BT (Bismaleimide Triazine, BT resin) board or a glass substrate, etc. This application does not limit this. The circuit substrate 101 may include driving circuits for driving the light-emitting device 200.

[0053] S102. Place the light-emitting device on the circuit substrate;

[0054] The setting methods of the light-emitting device 200 include, but are not limited to, techniques such as chip mounting and mass transfer. Usually, a plurality of light-emitting devices 200 are arranged on the circuit substrate 101, and these light-emitting devices 200 are arranged according to a preset rule. In practical applications, the manufacturing method of the light-emitting module in this application does not limit the number of the light-emitting devices 200, and any number of the light-emitting devices 200 can be applied.

[0055] S103. Soften the encapsulation layer to make the encapsulation layer flow onto the circuit substrate;

[0056] It can be understood that before softening the encapsulation layer 202, the encapsulation layer 202 encapsulates the light-emitting chip in a solid state, and it only covers the light-emitting device 200 without covering the circuit substrate 101. Before step S103, the encapsulation layer 202 remains in a cured or substantially cured state to enable normal transfer and other processes while encapsulating the light-emitting chip. And it can be understood that the curing of the encapsulation layer 202 before this is not permanent. After the encapsulation layer 202 is softened, it has a certain fluidity and flows onto the circuit substrate 101 under the action of gravity. In practical applications, the softening time and degree can be set according to the encapsulation situation. Exemplarily, the encapsulation layer 202 can be leveled in a static state, and the encapsulation layer 202 will cover the circuit substrate 101 and fill the gap between the light-emitting device 200 and the circuit substrate 101.

[0057] In the related art, the thickness of the encapsulation layer 202 on the light-emitting device 200 is usually set between 20 μm and 150 μm. Among them, the thinner the encapsulation layer 202 on the light-emitting device 200 is, the easier it is to make the thickness of the final light-emitting module thinner. However, there are also problems such as insufficient protection of the encapsulation layer 202 and difficulty in manufacturing the extremely thin encapsulation layer 202. But if a thicker encapsulation layer 202 is set for the light-emitting device 200, it is difficult to control the thickness when the light-emitting devices 200 are integrally encapsulated on the circuit board 101. It can be understood that the present application softens the encapsulation layer 202 so that the encapsulation layer 202 can finally encapsulate the circuit board 101 and the light-emitting device 200 together. Therefore, after softening, it should still be able to cover the light-emitting chip. In practical applications, this usually requires the encapsulation layer 202 on the light-emitting device 200 to be set thicker, so as to ensure that the material of the encapsulation layer 202 carried thereon is sufficient to encapsulate both the circuit board 101 and the light-emitting chip. In some embodiments, the thickness of the encapsulation layer 202 before softening on the light-emitting device 200 is greater than 150 μm, and / or the thickness of the encapsulation layer 202 after flowing to the circuit board 101 and curing is 100 - 250 μm, such as 130 μm, 150 μm, 170 μm, 190 μm, 210 μm, 240 μm, etc. In this embodiment, the thicker encapsulation layer 202 formed on the light-emitting device 200 provides stronger protection for the light-emitting device 200 during processes such as transfer, reducing the yield loss. Moreover, after the encapsulation layer 202 is softened in this embodiment, the encapsulation layer 202 flows to more areas, and its thickness will be significantly reduced compared with before softening. Therefore, it is also easy to control the thickness of the final light-emitting module, and it will not be difficult to control the thickness of the light-emitting module because a thicker encapsulation layer 202 is set on the light-emitting device 200, which is beneficial to manufacturing a thinner light-emitting module.

[0058] S104. Cure the encapsulation layer to encapsulate the circuit board and the light-emitting device together;

[0059] It can be understood that in some embodiments of this embodiment, the light-emitting module has only one encapsulation layer 202, which realizes the overall encapsulation of the circuit board 101 and the light-emitting chip. For the circuit board 101, at least various lines thereon are covered by the encapsulation layer 202.

[0060] See Figure 2, in the related art, after the light-emitting device 200 is disposed on the circuit substrate 101, the encapsulation material is coated again to form a secondary encapsulation layer 102 outside the light-emitting device 200, so that the display module forms two layers of encapsulation. The setting of the secondary encapsulation layer 102 will execute a complete set of encapsulation processes again. In this embodiment, the encapsulation layer 202 on the light-emitting device 200 is softened and then cured again to form the encapsulation of the circuit substrate 101 and the light-emitting chip. Therefore, in this embodiment, only one coating, attachment and other processes of the encapsulation material need to be executed, and the overall process is simplified, and in some implementation processes, it has a lower cost.

[0061] In step S104, the curing of the encapsulation layer 202 can be irreversible. In some embodiments, the material of the encapsulation layer 202 includes at least one of epoxy resin and silicone resin. Thermosetting resins such as epoxy resin and silicone resin can be cured after heating, and the curing under some conditions is irreversible and can form a stable encapsulation structure. In some embodiments, the step of softening the encapsulation layer 202 includes: heating the encapsulation layer 202 to the melting temperature to melt it; the step of curing the encapsulation layer 202 includes: heating the encapsulation layer 202 to the thermosetting temperature to cure it, and the thermosetting temperature is higher than the melting temperature.

[0062] In other implementation processes, the encapsulation layer 202 can also be made of other materials, but it should have reversible curing properties, have fluidity after softening, and can be cured again to complete the final encapsulation. That is to say, based on the actual material, the conditions for softening or re-curing the encapsulation layer 202 are not limited to heating.

[0063] In some embodiments, a plurality of light-emitting devices 200 with encapsulation layers 202 of the same material are provided on a circuit board 101; the step of softening the encapsulation layers 202 includes: softening and flowing the encapsulation layers 202 on each light-emitting device 200 until they merge into one body, so that the cured encapsulation layer 202 encapsulates the circuit board 101 and each light-emitting chip thereon. The plurality of light-emitting devices 200 adopt encapsulation layers 202 of the same material, and each encapsulation layer 202 can be softened together and spread evenly, with high encapsulation efficiency; and only one encapsulation layer 202 is formed on the light-emitting module, which has good integrity and protection. A plurality of light-emitting devices 200 may be provided on the circuit board 101, and these light-emitting devices 200 may be distributed in forms including but not limited to an array arrangement. Each light-emitting device 200 is provided with an encapsulation layer 202, and before softening, these encapsulation layers 202 are independent of each other. By means such as heating, the encapsulation layers 202 of each light-emitting device 200 can be softened, and the encapsulation layer 202 flows into the areas between the light-emitting devices 200. The encapsulation layers 202 of each light-emitting device 200 merge with each other, and finally merge into one body on the circuit board 101, and encapsulate the circuit board 101 and each light-emitting chip thereon. In some examples, each light-emitting device 200 may also adopt encapsulation layers 202 of different materials, but they should have similar properties, that is, these encapsulation layers 202 should be able to be softened and cured under the same conditions, and still maintain the performance required for encapsulation after merging with each other. In practical applications, other devices may also be provided on the circuit board 101, and various devices can also be covered by the softened encapsulation layer 202 and finally encapsulated. These devices may also be provided with the same encapsulation layer 202, or not provided with an encapsulation layer 202 in advance. In some embodiments, in order to enable the encapsulation layers 202 on each light-emitting device 200 to merge into a relatively flat new encapsulation layer 202 in a short time, the thickness of the encapsulation layers 202 before softening on each light-emitting device 200 can be configured to be the same thickness. In practical applications, a plurality of light-emitting devices 200 are usually arranged relatively evenly on the circuit board 101 in an array or other forms. The encapsulation layers 202 of the same thickness make the distribution of the encapsulation material relatively uniform before softening, so that when softening starts to flow, it can be dispersed to the encapsulation surface of the circuit board 101 faster, improving the encapsulation efficiency.

[0064] In some embodiments, the light-emitting device 200 may carry a light-emitting chip through a packaging substrate 203 with circuits, and use the circuits on the packaging substrate 203 to achieve electrical connection with the circuit board 101. Refer to Figure 3 As shown, the steps of providing the light-emitting device 200 may include but are not limited to:

[0065] S201. Provide a packaging substrate;

[0066] The encapsulation substrate 203 includes a circuit 204 for bonding with a light-emitting chip and a line for connecting with the circuit substrate 101. The encapsulation substrate 203 can be a common PCB board, or a substrate made of polymer materials such as a glass substrate or a PI (Polyimide) board. The present application is not limited thereto.

[0067] S202. Set a light-emitting chip on the encapsulation substrate;

[0068] The light-emitting chip can be set on the encapsulation substrate 203 by means of pick-and-place, transfer, etc., and bonded to the corresponding circuit on the encapsulation substrate 203.

[0069] S203. Set an encapsulation material to form an encapsulation layer for encapsulating the light-emitting chip;

[0070] Exemplarily, taking the encapsulation material as a glue material as an example, the encapsulation material is set on the encapsulation substrate 203 by coating or attaching. The encapsulation material should cover the light-emitting chip to form an encapsulation protection. By initially curing the encapsulation material, a structurally stable encapsulation layer 202 is formed. It can be understood that the curing performed in this step should be reversible.

[0071] In practical applications, multiple light-emitting chips can be simultaneously set on a single encapsulation substrate 203. After the encapsulation layer 202 is formed, a large encapsulation substrate 203 can be divided into multiple encapsulation substrates 203. Each of the divided encapsulation substrates 203 encapsulates at least one light-emitting chip to form an independent light-emitting device 200.

[0072] Corresponding to the above-mentioned manufactured light-emitting device 200, the step of setting the light-emitting device 200 on the circuit substrate 101 includes: connecting the line on the encapsulation substrate 203 with the circuit substrate 101. The line on the encapsulation substrate 203 can form a connection area at the edge of the encapsulation substrate 203; or there is a pad for connecting with the circuit substrate 101 on one side of the encapsulation substrate 203, and the pad is connected to the line on the other side through a conductive via 206. When the encapsulation substrate 203 is set on the circuit substrate 101, these pads are set in the electrical connection area of the circuit substrate 101.

[0073] In some embodiments, the step of setting a light-emitting chip on the encapsulation substrate 203 includes:

[0074] At least three different light-emitting chips are provided on the encapsulation substrate 203, and these light-emitting chips have different light-emitting wavelengths. Different light-emitting wavelengths correspond to different colors. For example, three light-emitting chips with light-emitting wavelengths corresponding to red, green, and blue can be provided on the encapsulation substrate 203, so as to achieve full-color display. In some embodiments, each light-emitting device 200 may include one light-emitting chip of each of red, green, and blue colors. A single light-emitting device 200 is equivalent to a full-color display pixel. Taking the light-emitting chip as a Micro LED chip as an example, the light-emitting device 200 may be a MIP (Micro LED In Package) chip encapsulating a blue Micro LED chip 2011, a green Micro LED chip 2012, and a red Micro LED chip 2013. In other implementation processes, other numbers of light-emitting chips may also be provided on a single encapsulation substrate 203. For example, there may be two or more full-color display pixels.

[0075] Refer to Figure 4 , which exemplifies the structure of a specific MIP chip. A circuit 204 for bonding with the light-emitting chip is provided on one side of the encapsulation substrate, and a line for connecting with the circuit substrate 101 is provided on the other side. In this example, the circuit 204 for bonding with the light-emitting chip includes a first pad 2041 connected to the electrode of the light-emitting chip, and the line for connecting with the circuit substrate 101 includes a second pad 205 connected to the driving line on the circuit substrate 101. The first pad 2041 and the second pad 205 are electrically connected through a conductive via 206. Among them, one blue Micro LED chip 2011, one green Micro LED chip 2012, and one red Micro LED chip 2013 are used as the light-emitting chips, and the three Micro LED chips can be arranged in a row. The light-emitting chip is in a flip-chip structure, and its electrodes face the same side and are directly connected to the first pad 2041 on the encapsulation substrate 203. In practical applications, the MIP chip may also use a flip-chip or vertical structure light-emitting chip. In order to ensure the display contrast, a layer of black glue 207 (or other black light-shielding materials) is also provided on the encapsulation substrate 203 in this example, and the black glue 207 covers the area outside the light-emitting chip. The encapsulation layer 202 completely covers the side of the encapsulation substrate 203 where the light-emitting chips are provided, and encapsulates and protects the light-emitting chips and their connected circuits. And in this example, the positive electrodes of each Micro LED chip are respectively connected to different circuits, and the negative electrodes of each Micro LED chip are connected to the same circuit, and each Micro LED chip can be independently controlled. In other examples, the positive electrodes of each Micro LED chip can also be configured to be connected to the same circuit, while the negative electrodes are respectively connected to different circuits.

[0076] This embodiment also provides a light-emitting module, including: a circuit board 101, a light-emitting device 200 disposed on the circuit board 101; and a packaging layer 202 that packages the light-emitting chip and the circuit board 101 together. Moreover, this light-emitting module is fabricated by the manufacturing method of the light-emitting module in the foregoing example. During the fabrication of the light-emitting module in this embodiment, only one coating, attachment, and other processes of the packaging material need to be set. It only has one packaging layer 202 that integrally packages the circuit board 101 and the light-emitting chips thereon, simplifying the process and having lower costs in some implementation processes. In this application, the light-emitting device can use a monochromatic light-emitting chip, and the light-emitting module can be used as a backlight module for display backlighting or only for lighting; the light-emitting device can also include multi-color light-emitting chips. For example, the light-emitting device is the aforementioned MIP chip, and the light-emitting module can be a display module for display, etc.; the specific application form thereof is not limited in this application.

[0077] This embodiment also provides a display device, including a frame and a light-emitting module disposed on the frame. This display device uses the aforementioned light-emitting module, simplifying the process and having lower costs in some implementation processes.

[0078] To better understand the manufacturing method of the light-emitting module of this application, this embodiment will be further described below in conjunction with a specific manufacturing process. Refer to Figure 5 As shown, in an example, the manufacturing process of the light-emitting module includes but is not limited to:

[0079] S301. Fabricate a packaging substrate 203. For ease of description, the light-emitting device 200 in this example still takes the aforementioned MIP chip as an example. Refer to Figure 5 In S301 of, in this example, the packaging substrate 203 includes a plurality of identical regions, and three Micro LED chips can be disposed in each region, Figure 5 and Figure 6 only two of the regions are schematically shown. The structure within each region is the same as that in the foregoing example, that is, it is provided with a circuit 204 for bonding with the light-emitting chip and a line for connecting with the circuit board 101, and a black glue 207 is laid to improve the contrast.

[0080] S302. Refer to Figure 5In S302, the Micro LED chips are arranged on the packaging substrate 203 by means of mass transfer. The Micro LED chips of each emission wavelength can be transferred separately, and the arrangement of the three kinds of Micro LED chips can be completed through three selective transfers. In some examples, each kind of Micro LED chip can also be transferred on a temporary substrate according to the required arrangement first, and then the Micro LED chips on the temporary substrate are transferred to the packaging substrate 203 of this example at one time. For the specific transfer process, it can be flexibly set according to the process requirements.

[0081] S303. Set the encapsulation layer 202 of the MIP chip. The encapsulation layer 202 uses a thermosetting colloidal material such as epoxy resin or silicone resin, and is preliminarily cured. See Figure 5 In S303 of this example, the thickness of the encapsulation layer 202 is greater than 150 um, and all the Micro LED chips on the packaging substrate 203 are encapsulated and protected simultaneously, providing stronger protection for the Micro LED chips. The specific thickness of the encapsulation layer 202 can be determined according to the spacing, quantity and final thickness of the light-emitting devices 200 on the final circuit board 101.

[0082] S304. See Figure 5 In S304, the packaging substrate 203 is divided into individual full-color pixels to form a plurality of light-emitting devices 200.

[0083] S305. See Figure 6 In S305, the light-emitting devices 200 formed in step S304 are arranged on the circuit board 101. The circuits on the circuit board 101 correspond to the light-emitting devices 200 and are used to drive the Micro LED chips. The light-emitting devices 200 can be transferred to the circuit board 101 by means of mass transfer. In some examples, since the light-emitting devices 200 are packaging devices integrated with multiple Micro LED chips and their sizes are relatively large, and they can meet the size requirements of the placement equipment in some implementation processes, they can also be arranged on the circuit board 101 through processes such as placement. A plurality of light-emitting devices 200 that can each serve as a full-color pixel are arranged in an array on the circuit board 101 to form a display array. For the convenience of description, only two of the light-emitting devices 200 are schematically shown in this example. There is a certain spacing between the light-emitting devices 200, and there are also gaps between the light-emitting devices 200 and the circuit board 101 in the areas other than the bonding areas.

[0084] S306. Heat up the encapsulation layer 202 to soften the encapsulation layer 202. See Figure 6In S306 of this example, the encapsulation layer 202 is softened to the extent that it can form a flow to fill the voids. Taking epoxy resin or silicone-based resin as an example, the temperature is raised to 200 - 350 °C, which is higher than the melting point of the encapsulation layer 202, so that the encapsulation layer 202 melts and flows. During this process, the temperature of the circuit board 101 and the structures provided thereon can be raised as a whole, and the encapsulation layer 202 on each light-emitting device 200 is softened. After the encapsulation layer 202 of each light-emitting device 200 melts, they come into contact and fuse with each other to form an integral body. After the encapsulation layer 202 is softened, the entire circuit board 101 is kept stationary, so that the encapsulation layer 202 can level off naturally, and the gaps between the light-emitting devices 200 and between the light-emitting device 200 and the circuit board 101 are filled with the melted encapsulation layer 202. In this example, the thickness of the melted and leveled encapsulation layer 202 is kept at about 150 μm, such as 130 μm, 140 μm, 150 μm, 160 μm, 170 μm.

[0085] S307. The temperature of the encapsulation layer 202 is further raised to reach the thermosetting temperature of the encapsulation layer 202. Taking epoxy resin or silicone-based resin as an example, the temperature is raised to 350 - 500 °C to thermoset the encapsulation layer 202. The cured encapsulation layer 202 integrally encapsulates and protects each light-emitting chip and this side of the circuit board 101.

[0086] The manufacturing method of this example only requires one process of coating and attaching the encapsulation material during the manufacturing process of the light-emitting device 200. After the light-emitting device 200 is set on the circuit board 101, there is no need to coat the encapsulation material again, and the encapsulation is directly completed using the encapsulation layer 202 on the light-emitting device 200, which simplifies the process and has lower costs in some implementation processes.

[0087] It should be understood that the application of this application is not limited to the above examples. For those of ordinary skill in the art, improvements or transformations can be made according to the above description, and all such improvements and transformations should fall within the protection scope of the appended claims of this application.

Claims

1. A manufacturing method of a light-emitting module, characterized in that, Comprising: Providing a circuit board and a light-emitting device, the light-emitting device including a light-emitting chip and a packaging layer for encapsulating the light-emitting chip; Placing the light-emitting device on the circuit board; Softening the packaging layer so that the packaging layer flows onto the circuit board; And Curing the packaging layer to encapsulate the circuit board and the light-emitting chip together.

2. The manufacturing method of the light-emitting module according to claim 1, characterized in that, The material of the packaging layer includes at least one of epoxy resin and silicone resin.

3. The manufacturing method of the light-emitting module according to claim 2, characterized in that, The step of softening the packaging layer includes: heating the packaging layer to a melting temperature to melt it; The step of curing the packaging layer includes: heating the packaging layer to a thermal curing temperature to cure it, and the thermal curing temperature is higher than the melting temperature.

4. The manufacturing method of the light-emitting module according to claim 1, characterized in that, The thickness of the packaging layer satisfies at least one of the following: The thickness of the packaging layer on the light-emitting device before softening is greater than 150 um; The thickness of the packaging layer cured on the circuit board is 100 - 250 um.

5. The manufacturing method of the light-emitting module according to claim 1, characterized in that, A plurality of light-emitting devices with the same material packaging layer are provided on the circuit board; The step of softening the packaging layer includes: Softening and flowing the packaging layers on each light-emitting device until they merge into one, so that the cured packaging layer encapsulates the circuit board and each light-emitting chip thereon together.

6. The manufacturing method of the light-emitting module according to claim 5, characterized in that, The thicknesses of the packaging layers on each light-emitting device before softening are the same.

7. The manufacturing method of the light-emitting module according to any one of claims 1-6, characterized in that, The step of providing the light-emitting device includes: Providing a packaging substrate, the packaging substrate including a circuit for bonding with the light-emitting chip and a circuit for connecting with the circuit board; Placing the light-emitting chip on the packaging substrate; Setting packaging material to form the packaging layer for encapsulating the light-emitting chip; The step of placing the light-emitting device on the circuit board includes: Connecting the circuit on the packaging substrate with the circuit board.

8. The manufacturing method of the light-emitting module according to claim 7, characterized in that, The step of placing the light-emitting chip on the packaging substrate includes: Placing at least three different light-emitting chips on the packaging substrate, and the at least three different light-emitting chips have different light-emitting wavelengths.

9. A light-emitting module, characterized in that, Comprising: A circuit board; A light-emitting chip disposed on the circuit board; And A packaging layer for encapsulating the light-emitting chip and the circuit board together; Wherein, the light-emitting module is made by the manufacturing method of the light-emitting module according to any one of claims 1 - 8.

10. A display device, characterized in that,Comprising: A housing; And The light-emitting module according to claim 9 disposed on the housing.

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