Display device

Abstract

A display device includes: a display panel including a display area, a light transmissive area, and a non-display area surrounding the light transmissive area; and a sensor disposed in the light-transmitting area. The display panel includes a substrate disposed in a display area and a non-display area, a circuit portion and a light emitting element portion disposed on the display area, an upper protective layer disposed on the substrate in the non-display area, and a plurality of protrusion patterns disposed on the upper protective layer. The substrate includes an opening disposed at a position corresponding to the light-transmitting region.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2023 - 0181745, filed on December 14, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical field

[0003] The present invention relates to a display device. Background art

[0004] According to the material of the light - emitting layer, electroluminescent display devices are classified into inorganic light - emitting display devices and organic light - emitting display devices. An active - matrix organic light - emitting display device includes organic light - emitting diodes (OLEDs) that emit light by themselves and has advantages such as fast response time, high luminous efficiency, high brightness, and wide viewing angle. The organic light - emitting display device has OLEDs formed in each pixel. The organic light - emitting display device can represent black grayscale as perfect black and has a fast response time, high luminous efficiency, high brightness, and wide viewing angle, thus having excellent contrast and color gamut.

[0005] Recently, organic light - emitting display devices have been implemented on plastic substrates made of flexible materials, but can also be implemented on glass substrates due to various problems.

[0006] However, when forming grooves on a glass substrate or forming holes inside a display panel using a laser, the display panel may be damaged by the laser, or moisture, oxygen, etc. may penetrate into the interior of the display panel due to such damage. Summary of the invention

[0007] One embodiment of the present invention provides a display panel and a display device including the display panel, which can prevent damage caused by a laser, thereby improving quality and reliability.

[0008] One embodiment of the present invention provides a display panel and a display device including the display panel, which has an improved structure that can prevent damage caused by an etching process.

[0009] The object to be solved by the embodiments is not limited to the above - mentioned object, and those skilled in the art will clearly understand the objects not described above from the following description.

[0010] A display device according to an embodiment of the present invention includes: a display panel including a display area, a light-transmitting area, and a non-display area surrounding the light-transmitting area; and a sensor disposed in the light-transmitting area, wherein the display panel includes: a substrate disposed in the display area and the non-display area; a circuit part and a light-emitting element part disposed on the display area; an upper protective layer disposed on the substrate in the non-display area; and a plurality of protrusion patterns disposed on the upper protective layer, and the substrate includes an opening disposed at a position corresponding to the light-transmitting area.

[0011] A display device according to an embodiment of the present invention includes: a display panel including a display area, a light-transmitting area, and a non-display area surrounding the light-transmitting area; and a sensor disposed in the light-transmitting area, wherein the display panel includes: a substrate disposed in the display area and the non-display area; a circuit part and a light-emitting element part disposed on the display area; a buffer layer disposed on the substrate in the non-display area; a lower protective layer disposed under the substrate in the non-display area; a planarization layer disposed on the buffer layer; and a plurality of protrusion patterns disposed on the planarization layer, wherein the substrate includes an opening disposed at a position corresponding to the light-transmitting area, and the distance from the center of the light-transmitting area to the lower protective layer is greater than the distance from the center of the light-transmitting area to the buffer layer.

[0012] According to the present invention, quality and reliability can be improved by preventing damage caused by laser. Therefore, it is possible to prevent moisture, oxygen, etc. from penetrating into the interior of the display panel through the light-transmitting area.

[0013] According to the present invention, process optimization can be achieved by etching a part of the substrate through an etching process.

[0014] According to the present invention, when etching a substrate made of glass, the upper protective layer can be used to prevent the etching solution from penetrating into the interior of the display panel.

[0015] The various beneficial advantages and effects of the embodiments are not limited to the above, and those skilled in the art will clearly understand the effects not described above through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By specifically describing the exemplary embodiments of the present invention with reference to the accompanying drawings, the above and other objects, features, and advantages of the present invention will become more apparent to those of ordinary skill in the art, wherein:

[0017] Figure 1 is a view showing a display device according to an embodiment of the present invention;

[0018] Figure 2 is a cross-sectional view taken along line I-I' in Figure 1 ;

[0019] Figure 3 is Figure 2 an enlarged view of part A in

[0020] Figure 4 is a cross-sectional view taken along line II-II’ in Figure 1 ;

[0021] Figure 5 is a view showing a light-transmitting region and a protective layer around the light-transmitting region;

[0022] Figure 6 is a view showing Figure 5 an enlarged view of region B in

[0023] Figure 7 is a view showing Figure 6 an enlarged view of region C in

[0024] Figure 8 is a view showing a display device according to an embodiment of the present invention;

[0025] Figure 9 is a view showing Figure 8 an enlarged view of region D in

[0026] Figure 10 is a view showing Figure 8 an enlarged view of region E in

[0027] Figure 11 is a view showing a display panel before forming a light-transmitting region;

[0028] Figures 12A to 12F is a view showing a process of etching a substrate to form a light-transmitting region in a display panel;

[0029] Figure 13 is a view showing an example of a protective layer provided on a display device according to an embodiment of the present invention;

[0030] Figure 14 is a view showing another example of a protective layer provided on a display device according to an embodiment of the present invention;

[0031] Figure 15 is a view showing still another example of a protective layer provided on a display device according to an embodiment of the present invention;

[0032] Figure 16 is a view showing yet another example of a protective layer provided on a display device according to an embodiment of the present invention;

[0033] Figure 17 is a view showing another example of a display panel before forming a light-transmitting region;

[0034] Figures 18A to 18F is a view showing a process of etching a substrate to form a light-transmitting region in a display panel provided with a lower protective layer;

[0035] Figure 19 is a view showing another example of a protective layer provided on a display device according to an embodiment of the present invention;

[0036] Figure 20 is a view showing another example of a protective layer provided on a display device according to an embodiment of the present invention;

[0037] Figure 21 is a view showing another example of a protective layer provided on a display device according to an embodiment of the present invention. Detailed Description of the Invention

[0038] Advantages and features of the present invention and methods for realizing them will be more clearly understood through the embodiments described below with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments, but can be implemented in various different forms. On the contrary, the provided embodiments will make the disclosure of the present invention complete and allow those skilled in the art to fully understand the scope of the present invention. The present invention is only defined within the scope of the appended claims.

[0039] The shapes, sizes, ratios, angles, quantities, etc. disclosed in the drawings for describing the embodiments of the present invention are exemplary, and the present invention is not limited to the items shown. The same reference numerals always denote the same elements. In addition, when describing the present invention, if it is determined that a detailed description of related known technologies may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

[0040] Terms used herein such as "comprising", "including", "having", and "consisting of" generally intend to allow the addition of other components, unless these terms are used together with "only". References to the singular shall be construed to include the plural unless otherwise expressly stated.

[0041] When interpreting components, even without a separate description, they are construed to include an error range.

[0042] When describing the positional or interconnection relationship between two components, such as "on top of", "above", "below", "next to", "connected or coupled to", "crossing", "intersecting", etc., one or more other components may be inserted between the components unless "immediately" or "directly" is used.

[0043] When describing a temporal context relationship, such as "after", "next", "subsequently", or "before", it can be discontinuous on the time scale unless "immediately" or "directly" is used.

[0044] To distinguish components, ordinal numbers such as first, second, etc. can be used before the names of the components, but the functions or structures are not limited by these ordinal numbers or the names of the components. For ease of description, different embodiments may have different ordinal numbers before the names of the same components.

[0045] The following embodiments can be combined or associated with each other in whole or in part, and various types of interlocks and drives can be carried out technically. The embodiments can be implemented independently of each other or together in an interrelated relationship.

[0046] Throughout the specification, the same reference numerals denote the same components.

[0047] As used herein, a "display device" may include a display device in a narrow sense, such as a liquid crystal module (LCM), an organic light emitting diode (OLED) module, or a quantum dot (QD) module, which includes a display panel and a driver for driving the display panel. It may also include a set of electronic devices or a set of devices or a set of equipment, such as a laptop computer, a television, a computer monitor, an automotive display device, or other forms of display devices in a vehicle, and a mobile electronic device, such as a smart phone or a tablet computer, that is, a complete product or finished product including an LCM, an OLED module, and a QD module.

[0048] The display device in the present invention may include the display device itself in a narrow sense, an application product having a display in a narrow sense, or even a set of equipment as a terminal consumer device.

[0049] Figure 1 is a conceptual diagram of a display device according to an embodiment of the present invention, Figure 2 is along Figure 1 a cross-sectional view taken along line I-I' in Figure 3 is Figure 2 an enlarged view of part A in Figure 2 In

[0050] Referring to Figure 1 and Figure 2 , a display device according to an embodiment of the present invention may include a display panel 100 that visually reproduces an input image, and a sensor 200 provided corresponding to a light transmissive area TA of the display panel 100.

[0051] The display panel 100 may include a display area DA for displaying an image, a light-transmitting area TA through which light is incident, and a non-display area NDA formed between the light-transmitting area TA and the display area DA. The light-transmitting area TA is a hole structure that allows light to enter the sensor 200 disposed below the display panel 100, but is not limited thereto. Different from the display area DA, the non-display area NDA is an area where no image is displayed.

[0052] The display panel 100 may be a panel having a rectangular structure with a width in the X-axis direction, a length in the Y-axis direction, and a thickness in the Z-axis direction. According to the application field of the display device, the width and length of the display panel 100 may be set to various design values. The X-axis direction may refer to the width direction, the row direction, or the horizontal direction, the Y-axis direction may refer to the longitudinal direction, the column direction, or the vertical direction, and the Z-axis direction may refer to the up-down direction or the thickness direction. The X-axis direction, the Y-axis direction, and the Z-axis direction may be perpendicular to each other, but may also refer to different directions that are not perpendicular to each other. Therefore, any one of the X-axis direction, the Y-axis direction, and the Z-axis direction may be described as one of the first direction, the second direction, and the third direction. The surface extending in the X-axis direction and the Y-axis direction may refer to a horizontal surface.

[0053] In the display area DA of the display panel 100, data lines, gate lines intersecting the data lines, and pixels Px arranged in a matrix form defined by the data lines and the gate lines may be arranged.

[0054] Each pixel Px includes different color sub-pixels for color reproduction. The sub-pixels include red sub-pixels, green sub-pixels, and blue sub-pixels. Although not shown, each pixel Px may also include white sub-pixels. Hereinafter, unless otherwise defined, a pixel may be interpreted as a sub-pixel. Each sub-pixel may include a pixel circuit.

[0055] The pixel circuit may include a light-emitting element, a driving element that supplies current to the light-emitting element, one or more switching elements that switch the current path of the driving element and the light-emitting element, a capacitor that holds the voltage Vgs between the gate and the source of the driving element, and the like.

[0056] The light-emitting element may be implemented with an element structure such as an organic light-emitting diode (OLED) display, a quantum dot display, and a micro light-emitting diode (LED) display. Hereinafter, the OLED structure including an organic compound layer will be described as an example.

[0057] The OLED includes an organic compound layer formed between an anode and a cathode. The organic compound layer may include, but is not limited to, a hole injection layer (HIL), a hole transport layer (HTL), an emission layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL). When a voltage is applied to the anode and cathode of the OLED, holes passing through the hole transport layer (HTL) and electrons passing through the electron transport layer (ETL) move to the emission layer (EML) to form excitons, causing the emission layer (EML) to emit visible light.

[0058] The display panel driver writes pixel data of an input image to the pixel Px. The display panel driver includes a data driver that provides data voltage of pixel data to data lines and a gate driver that sequentially provides gate pulses to gate lines. The data driver is integrated in the driving IC. The driving IC can be attached to the display panel 100.

[0059] The driving IC is connected to the data lines through data output channels and provides the voltage of the data signal to the data lines. The driving IC includes a timing controller. The timing controller sends the pixel data of the input image received from the host system to the data driver and controls the operation timing of the data driver and the gate driver.

[0060] The data driver of the driving IC converts the pixel data into a gamma compensation voltage through a digital-to-analog converter (DAC) and outputs the data voltage.

[0061] The gate driver may also include a shift register formed in the circuit layer of the display panel 100 together with the pixel array. The shift register of the gate driver sequentially provides gate signals to the gate lines under the control of the timing controller. The gate signals may include a scan pulse and an emission control pulse (hereinafter referred to as "EM pulse"). The shift register may include a scan driver that outputs the scan pulse and an EM driver that outputs the EM pulse.

[0062] The host system can be implemented as an application processor (AP). The host system sends the pixel data of the input image to the driving IC. The host system can be connected to the driving IC, for example, through a flexible printed circuit (FPC).

[0063] Various wirings and driving circuits can be provided in the non-display area NDA, and pad portions for connecting to integrated circuits, printed circuits, etc. can be provided.

[0064] The flexible printed circuit can be formed on a flexible printed circuit board and can be connected to the driving IC through the pad portion. The driving IC can be provided on the display panel 100, but is not limited thereto. For example, the driving IC can also be provided on the flexible printed circuit board.

[0065] The display panel 100 can be manufactured based on a glass substrate.

[0066] Referring to Figure 2 , the display panel 100 may include a circuit portion 13 disposed on a substrate 10 and a light-emitting element portion 15 disposed on the circuit portion 13. The display panel 100 may include a packaging portion 17 disposed on the light-emitting element portion 15, a polarizer 19 disposed on the packaging portion 17, and a cover glass 20 disposed on the polarizer 19. The display panel may further include a touch portion 18 disposed between the light-emitting element portion 15 and the polarizer 19.

[0067] The substrate 10 may be made of an insulating material or a flexible material. For example, the substrate 10 may be made of glass, metal, or plastic, but is not limited thereto. However, for the substrate 10, in order to simplify the process, a glass substrate having a certain strength may be used for the etching process.

[0068] The circuit portion 13 may include a pixel circuit that is wired-connected to data lines, gate lines, power lines, etc., and a gate driver that is connected to the gate lines. In addition, the wirings and circuit elements of the circuit portion 13 may include a plurality of insulating layers, two or more metal layers separated by the insulating layers, and an active layer including a semiconductor material. The circuit elements may include transistors and capacitors implemented as thin-film transistors (TFTs).

[0069] The light-emitting element portion 15 may include light-emitting elements driven by the pixel circuit. The light-emitting elements may include red light-emitting elements, green light-emitting elements, and blue light-emitting elements. In another embodiment, the light-emitting element portion 15 may include white light-emitting elements and color filters. The light-emitting elements of the light-emitting element portion 15 may be covered with a protective layer including an organic film.

[0070] The light-emitting element portion 15 may further include a color filter array disposed on the pixels to selectively transmit red, green, and blue wavelengths.

[0071] The packaging portion 17 covers the light-emitting element portion 15 to seal the circuit portion 13 and the light-emitting element portion 15. The packaging portion 17 may have a multi-insulating film structure in which organic films and inorganic films are alternately stacked. The inorganic film may block the penetration of moisture or oxygen. The organic film may flatten the surface of the inorganic film. When the organic film and the inorganic film are stacked in multiple layers, the movement path of moisture or oxygen becomes longer compared to a single layer, thereby effectively blocking the penetration of moisture / oxygen that affects the light-emitting element portion 15.

[0072] The touch portion 18 may include a capacitive touch sensor that senses a touch input based on a change in capacitance before and after the touch input. The touch portion 18 may include a metal wiring pattern that forms the capacitance of the touch sensor and an insulating film. The insulating film may insulate the cross portions of the metal wiring pattern and flatten the surface of the touch portion.

[0073] The polarizer 19 may be disposed on the light-emitting element unit 15. The polarizer 19 can improve the outdoor visibility of the display device. For example, the polarizer 19 can improve visibility and contrast by converting the polarization of external light reflected by the metal pattern of the circuit unit 13. The polarizer 19 can be implemented as a polarizer or a circular polarizer combining a linear polarizer and a phase retardation film. The cover glass 20 may be attached to the polarizer 19.

[0074] A light-transmitting region TA may be formed in the display region DA. The non-display region NDA may be provided to surround the light-transmitting region TA. The non-display region NDA may have a plurality of dam-like structures to protect the light-emitting elements in the display region DA from moisture, oxygen, etc. that may enter from the light-transmitting region TA.

[0075] The light-transmitting region TA may have a through-hole structure for allowing light to enter the sensor 200 (such as a camera), but is not limited thereto. For example, low-density pixels may be provided in the light-transmitting region TA.

[0076] The substrate 10 may include an opening 11 provided in the light-transmitting region TA. The opening 11 may have a tapered shape with a width narrowing toward the cover glass 20, but is not limited thereto. For example, the opening 11 may be formed in a tapered shape with a width widening toward the cover glass 20, or may be formed in a cylindrical shape with a constant width. That is, the shape of the opening 11 may vary differently according to the type of etching solution and the etching method.

[0077] A protective layer PL may be provided on the opening 11 of the substrate 10. Thus, the opening 11 of the display panel 100 may be provided as a groove formed on the back surface of the display panel 100.

[0078] The protective layer PL can protect the display panel 100 from the influence of laser emitted to the display panel 100. For example, the display panel 100 may be irradiated with laser to facilitate etching in some regions of the substrate 10, while the protective layer PL can prevent the display panel 100 from being damaged by the laser. Therefore, the protective layer PL may include at least one of an organic insulating layer made of an organic material, an inorganic insulating layer made of an inorganic material, and a metal layer made of a metal material. Based on the arrangement of the substrate 10, the protective layer PL may include an upper protective layer and a lower protective layer.

[0079] The protective layer PL can prevent the etching solution from penetrating into the interior of the display panel 100 when etching the substrate 10. Therefore, the protective layer PL may also be referred to as an anti-etching layer.

[0080] The protective layer PL may include an organic material resistant to an etching solution. For example, the protective layer PL may include one of a polyester-based polymer, a silicone-based polymer, an acrylic polymer, a polyolefin-based polymer, and a copolymer thereof. However, the protective layer PL is not limited thereto and may include various materials, such as an inorganic material or a metal material resistant to an etching solution.

[0081] The protective layer PL may be formed by extending from at least one layer among the circuit portion 13, the light-emitting element portion 15, the encapsulation portion 17, and the touch portion 18. Alternatively, considering process efficiency, the protective layer PL may be formed in the process of forming at least one layer among the circuit portion 13, the light-emitting element portion 15, the encapsulation portion 17, and the touch portion 18. That is, the protective layer PL may be a dummy layer of the circuit portion 13, the light-emitting element portion 15, the encapsulation portion 17, and the touch portion 18. With this structure, the protective layer PL can be formed without adding a separate process.

[0082] According to one embodiment, the protective layer PL may include a protruding portion P protruding toward the light-transmitting region TA. The protruding portion P may be a portion protruding from the upper surface of the opening 11 toward the center C of the light-transmitting region TA. Such a protruding portion P may be formed in the process of cutting the protective layer PL with a laser.

[0083] A coating layer 30 may be formed on the back surface of the substrate 10. The coating layer 30 may be made of an organic material including a polyester-based polymer or an acrylic-based polymer.

[0084] The coating layer 30 may include a side coating layer 31 formed on the inner surface of the opening 11 and a back coating layer 32 provided under the substrate 10.

[0085] The lower surface 31a of the side coating layer 31 may be formed to be recessed toward the etching-resistant layer. However, the side coating layer 31 is not limited thereto and may not shrink depending on the material. Therefore, even after curing is completed, the lower surface 31a of the side coating layer 31 may be substantially flat.

[0086] The inclined surface 11a of the opening 11 and the side surface S11 of the protruding portion P of the protective layer PL may have different slopes. Refer to Figure 3 , since the opening 11 is etched by an etching solution to have a tapered shape, but the protective layer PL is cut with a laser to form a relatively vertical cross-section, the inclination angle of the side surface S11 of the protruding portion P may be greater than the inclination angle of the inclined surface 11a.

[0087] The side surface S21 of the coating layer 30 provided under the protruding portion P may have the same inclination angle as the side surface S11 of the protruding portion P, but is not limited thereto. For example, the side surface S21 of the coating layer 30 may be formed at the same inclination angle as the inclined surface 11a.

[0088] Figure 4 is a cross-sectional view taken along line II-II' in Figure 1 .

[0089] Referring to Figure 4 , the first transistor 120 and the second transistor 130 may be disposed on the substrate 10 in the display area DA, and the light-emitting element 150 may be disposed on the second planarization layer 111.

[0090] The first light-blocking layer 141 and the metal layer 144 may be disposed on the substrate 10.

[0091] The first light-blocking layer 141 may include molybdenum and / or aluminum. The first light-blocking layer 141 may block light from entering the first semiconductor layer 123 or the second semiconductor layer 133. The first light-blocking layer 141 may overlap with the first semiconductor layer 123 or the second semiconductor layer 133 in the Z direction.

[0092] The metal layer 144 may be spaced apart from the first light-blocking layer 141 and may be formed together with the first light-blocking layer 141 in the formation process of the first light-blocking layer 141.

[0093] The multi-buffer layer 102 may delay the diffusion of moisture or oxygen penetrating into the substrate 10, and the multi-buffer layer 102 may be formed by alternately stacking silicon nitride (SiNx) and silicon oxide (SiOx) at least once.

[0094] The second light-blocking layer 142 may be disposed on the multi-buffer layer 102. The second light-blocking layer 142 may include molybdenum and / or aluminum. The second light-blocking layer 142 may block light from entering the first semiconductor layer 123 or the second semiconductor layer 133. The second light-blocking layer 142 may overlap with the first light-blocking layer 141 in the Z direction and may more effectively block light from entering the first semiconductor layer 123 or the second semiconductor layer 133.

[0095] The active buffer layer 103 may perform the functions of protecting the first semiconductor layer 123 and blocking various defects entering the substrate 10. The active buffer layer 103 may be made of amorphous silicon (a-Si), silicon nitride (SiNx), silicon oxide (SiOx), etc.

[0096] The first semiconductor layer 123 of the first transistor 120 may be made of a polycrystalline semiconductor layer and may include a channel region, a source region, and a drain region.

[0097] The polycrystalline semiconductor layer has a higher mobility than the amorphous semiconductor layer and the oxide semiconductor layer, thereby achieving low power consumption and excellent reliability. Due to these advantages, the polycrystalline semiconductor layer can be used to drive transistors.

[0098] The first gate 122 may be disposed on the lower gate insulating layer 104 and may overlap with the first semiconductor layer 123.

[0099] The second transistor 130 may be disposed on the lower interlayer dielectric layer 105. The upper gate insulating layer 106 may be disposed on the second semiconductor layer 133 to insulate the second gate 132 from the second semiconductor layer 133.

[0100] The upper interlayer dielectric layer 108 may be disposed on the second gate 132. The first gate 122 and the second gate 132 may each be a single layer or a multi-layer including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but is not limited thereto.

[0101] The lower interlayer dielectric layer 105 may be made of an inorganic insulating layer having a higher hydrogen particle content than the upper interlayer dielectric layer 108. For example, the lower interlayer dielectric layer 105 may be made of silicon nitride (SiNx) formed by a deposition process using NH3 gas, and the upper interlayer dielectric layer 108 may be made of silicon oxide (SiOx). The hydrogen particles included in the lower interlayer dielectric layer 105 may diffuse into the polycrystalline semiconductor layer during the hydrogenation process and fill the voids in the polycrystalline semiconductor layer with hydrogen. Accordingly, the polycrystalline semiconductor layer may be stabilized, thereby preventing deterioration of the characteristics of the first transistor 120.

[0102] After the activation and hydrogenation processes of the first semiconductor layer 123 of the first transistor 120, the second semiconductor layer 133 of the second transistor 130 may be formed. In this example, the second semiconductor layer 133 may be made of an oxide semiconductor. Since the second semiconductor layer 133 is not exposed to the high-temperature environment of the activation and hydrogenation processes of the first semiconductor layer 123, damage to the second semiconductor layer 133 may be prevented and reliability may be improved.

[0103] After the upper interlayer dielectric layer 108 is disposed, a first source contact hole 125S and a first drain contact hole 125D may be formed to correspond to the source region and the drain region of the first transistor 120, respectively, and a second source contact hole 135S and a second drain contact hole 135D may be formed to correspond to the source region and the drain region of the second transistor 130, respectively.

[0104] The first source contact hole 125S and the first drain contact hole 125D may be holes continuously formed from the upper interlayer dielectric layer 108 to the lower gate insulating layer 104. Similarly, in the second transistor 130, the second source contact hole 135S and the second drain contact hole 135D may be holes continuously formed from the upper interlayer dielectric layer 108 to the upper gate insulating layer 106.

[0105] The first source 121 and the first drain 124 corresponding to the first transistor 120 and the second source 131 and the second drain 134 corresponding to the second transistor 130 can be formed simultaneously. Thus, the number of processes for forming the sources and drains of the first transistor 120 and the second transistor 130 can be reduced.

[0106] The first source 121 and the first drain 124, and the second source 131 and the second drain 134 can each be a single layer or a multi-layer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof, but are not limited thereto.

[0107] The first source 121 and the first drain 124, and the second source 131 and the second drain 134 can each have a three-layer structure. For example, the first source 121 can include a first electrode layer made of Ti, a second electrode layer made of Al, and a third electrode layer made of Ti, and the other sources and drains can have the same structure.

[0108] A storage capacitor 140 can be provided between the first transistor 120 and the second transistor 130. According to one embodiment, the storage capacitor 140 can be formed with a first light-blocking layer 141 and a second light-blocking layer 142. For example, the second light-blocking layer 142 can be electrically connected to the pixel circuit through a storage power line 143. However, the structure of the storage capacitor 140 is not limited thereto, and various modifications can be made using two different metal layers.

[0109] On the same plane as the first source 121 and the first drain 124, and the second source 131 and the second drain 134, the storage power line 143 can be made of the same material, so that the storage power line 143 can be formed simultaneously with the first source 121 and the first drain 124, and the second source 131 and the second drain 134 using the same mask process.

[0110] An inorganic insulating material such as SiNx or SiOx is deposited on the entire surface of the substrate 10 on which the first source 121 and the first drain 124, the second source 131 and the second drain 134, and the storage power line 143 are formed, so that a protective film 109 can be formed.

[0111] A first planarization layer 110 can be formed on the protective film 109. Specifically, the first planarization layer 110 can be provided by coating an organic insulating material such as an acrylic resin on the entire surface of the protective film 109.

[0112] After the protective film 109 and the first planarization layer 110 are provided, contact holes may be formed by a photolithography process to expose the first source electrode 121 or the first drain electrode 124 of the first transistor 120. A connection electrode 145 may be provided in the contact hole exposing the first drain electrode 124 using a material made of Mo, Ti, Cu, AlNd, Al, Cr, or an alloy thereof.

[0113] A second planarization layer 111 may be provided on the connection electrode 145, and a contact hole exposing the connection electrode 145 may be formed in the second planarization layer 111, whereby a light-emitting element 150 connected to the first transistor 120 may be provided. Similar to the first source electrode 121 and the first drain electrode 124, the connection electrode 145 may be formed in a structure having multiple layers.

[0114] The light-emitting element 150 may include an anode 151 connected to the first drain electrode 124 of the first transistor 120, at least one light-emitting stack 152 formed on the anode 151, and a cathode 153 formed on the light-emitting stack 152.

[0115] The light-emitting stack 152 may include a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer. In a tandem structure in which multiple light-emitting layers overlap each other, a charge generation layer may be additionally provided between the light-emitting layers. The light-emitting layer may emit different colors corresponding to each sub-pixel.

[0116] The anode 151 may be connected to the connection electrode 145 exposed through the contact hole penetrating the second planarization layer 111. The anode 151 may be formed in a multi-layer structure including a transparent conductive film and an opaque conductive film having a high reflection efficiency. The transparent conductive film may be made of a material having a relatively high work function value, such as indium tin oxide (ITO) or indium zinc oxide (IZO), and the opaque conductive film may have a single-layer or multi-layer structure including Al, Ag, Cu, Pb, Mo, Ti, or an alloy thereof.

[0117] For example, the anode 151 may be formed in a structure in which a transparent conductive film, an opaque conductive film, and a transparent conductive film are sequentially stacked, or the anode 151 may be formed in a structure in which a transparent conductive film and an opaque conductive film are sequentially stacked.

[0118] The anode 151 is provided on the second planarization layer 111, so as to overlap not only with the light-emitting region defined by the partition 154, but also with the pixel circuit region in which the first transistor 120, the second transistor 130, and the storage capacitor 140 are provided, whereby the light-emitting region may be increased.

[0119] The light-emitting stack 152 can be formed by sequentially or reversely stacking a hole transport layer, an organic light-emitting layer, and an electron transport layer on the anode 151. Additionally, the light-emitting stack 152 can further include a charge generation layer and include a first light-emitting stack and a second light-emitting stack that face each other, with the charge generation layer between the first light-emitting stack and the second light-emitting stack.

[0120] The bank 154 is formed to expose the anode 151. The bank 154 can be made of an organic material (such as photoacrylic) and can be a translucent material, but is not limited thereto. The bank 154 can also be made of an opaque material to prevent light interference between sub-pixels.

[0121] A cathode 153 opposite to the anode 151 can be formed on the upper surface of the light-emitting stack 152, and the light-emitting stack 152 is inserted between the cathode 153 and the anode 151. When the cathode 153 is applied to a top-emission type organic light-emitting display device, the cathode 153 can be formed of a transparent conductive film thinly formed of indium tin oxide (ITO), indium zinc oxide (IZO), or magnesium silver (Mg-Ag).

[0122] An encapsulation part 17 can be formed on the cathode 153 to protect the light-emitting element 150. Since the light-emitting element 150 may react with external moisture or oxygen due to the organic nature of the light-emitting stack 152 to generate dark spots or pixel shrinkage, the encapsulation part 17 can be provided on the cathode 153 to prevent such problems.

[0123] The encapsulation part 17 can include a first encapsulation layer 171, a foreign matter compensation layer 172, and a second encapsulation layer 173. The first encapsulation layer 171 and the second encapsulation layer 173 can be made of an inorganic insulating material respectively, and the foreign matter compensation layer 172 can be made of an organic insulating material.

[0124] The touch part 18 can be provided on the encapsulation part 17. The touch part 18 can include a first touch planarization layer 181, a touch electrode 182, and a second touch planarization layer 183. The first touch planarization layer 181 and the second touch planarization layer 183 are provided to eliminate the step at the setting point of the touch electrode 182 and ensure good electrical insulation.

[0125] According to one embodiment, the first transistor 120 made of low-temperature polysilicon and the second transistor 130 made of an oxide semiconductor are provided in different layers, so that thin-film transistors (TFTs) with different driving characteristics are provided in the display device. However, it is not limited thereto. Only thin-film transistors with the same driving characteristics can also be used, or thin-film transistors with various circuit structures can be used.

[0126] Figure 5 is a view showing a light-transmitting region and a protective layer of an edge region surrounding the light-transmitting region, Figure 6 is a view showingFigure 5 An enlarged view of region B in Figure 7 shows Figure 6 an enlarged view of region C in

[0127] Referring to Figure 5 , the protective layer PL can be arranged to completely surround the periphery, i.e., the edge, of the light-transmitting region TA.

[0128] The protective layer PL can be arranged to completely surround the edge of the light-transmitting region TA so that when a laser is emitted for etching, the protective layer PL can protect the wirings arranged in the Z-axis direction from the laser. In this example, various structures for preventing the penetration of moisture, oxygen, etc. can be provided in the non-display area NDA, and the protective layer PL can also be used to protect these structures from the laser or the etching solution. For example, before forming the opening 11 as a via hole inside the mother substrate by etching, a laser can be emitted to the region where the opening 11 is to be formed, and the protective layer PL can be arranged in the laser emission direction to prevent damage to wirings, etc. caused by the laser.

[0129] When the opening 11 is formed by an etching process, the protective layer PL can be used as an anti-etching layer to prevent the etching solution from penetrating into the inside of the display panel 100. Specifically, the protective layer PL can overlap the opening 11 in the Z-axis direction to prevent the etching solution from penetrating into the inside of the display panel 100.

[0130] Before the laser cutting process, the protective layer PL can be provided in the light-transmitting region TA and the non-display area NDA around the light-transmitting region TA, thereby protecting the display panel 100 from the laser and preventing the etching solution from penetrating into the inside of the display panel 100.

[0131] In addition, since the display device according to an embodiment of the present invention can form openings 11 of various shapes in the substrate 10 made of glass by etching, it has the advantage of being able to form various openings while maintaining the rigidity of the substrate 10 compared to the scribing, cracking, and grinding techniques in the prior art. Additionally, the display device according to an embodiment of the present invention has the advantage of being able to optimize the process because the opening 11 can be formed together with the side processing for forming grooves or chamfers on the side surface of the substrate 10. In this case, of course, the protective layer PL can be formed on the side surface of the substrate 10.

[0132] Referring to Figure 6 and Figure 7 , the light-transmitting region TA provided with various sensors can be formed in a circular shape, and the non-display area NDA can be provided around the light-transmitting region TA, but the present invention is not limited thereto. For example, the light-transmitting region TA can have various shapes such as a polygon or an ellipse, and the shape of the non-display area NDA can also vary according to the shape of the light-transmitting region TA.

[0133] The non-display area NDA may include a wiring area NDA1 provided with wirings TL that bypass the light-transmitting area TA, a moisture-proof penetration area NDA2 provided between the wiring area NDA1 and the light-transmitting area TA, and a dummy area NDA3 provided with a protective layer PL. The moisture-proof penetration area NDA2 and the dummy area NDA3 may be provided to surround the light-transmitting area TA, and the dummy area NDA3 may be provided adjacent to the light-transmitting area TA. In this case, the dummy area NDA3 may also be used to prevent moisture penetration.

[0134] Figure 8 is a view showing a display device according to an embodiment of the present invention, Figure 9 is a view showing Figure 8 an enlarged view of area D in Figure 10 is a view showing Figure 8 an enlarged view of area E in

[0135] Referring to Figure 8 , the moisture-proof penetration area NDA2 may include a dam portion DAM and a plurality of protrusion patterns ST. The dam portion DAM and the plurality of protrusion patterns ST may be formed of a plurality of layers provided in the display area DA or a plurality of layers extending from the display area DA. In this example, the number of the dam portion DAM and the number of the protrusion patterns ST are not particularly limited. The dam portion DAM may be provided on the buffer layer 101, and the buffer layer 101 may be an inorganic insulating layer. The buffer layer 101 may be formed using at least one of the multi-buffer layer 102 and the active buffer layer 103.

[0136] The dam portion DAM and the protrusion patterns ST may be provided in a closed-loop shape to surround the light-transmitting area TA, thereby preventing moisture and the like from penetrating into the display area DA through the light-transmitting area TA. In this case, the width of the moisture-proof penetration area NDA2 may have a predetermined length to prevent moisture penetration.

[0137] The dummy area NDA3 may be an area formed to provide a margin when laser-etching and / or cutting the substrate 10. For example, when there is no dummy area NDA3, the moisture-proof penetration area NDA2 may be damaged during laser cutting, resulting in susceptibility to moisture penetration, and a minimum layer may be provided on the substrate 10 in the dummy area NDA3 to facilitate laser cutting. In addition, the substrate 10 and the like may be damaged by the laser, and in order to cope with this damage, the dummy area NDA3 may be provided.

[0138] The protective layer PL disposed in the dummy region NDA3 can prevent the etching solution from penetrating into the interior of the display panel 100 when etching the substrate 10 and prevent damage caused by the laser emitted before etching. The protective layer PL may include at least one of an inorganic insulating layer, an organic insulating layer, and a metal layer. In this example, the metal layer may include molybdenum (Mo) which has strong corrosion resistance to the etching solution.

[0139] A plurality of protrusion patterns ST may be disposed in the non-display region NDA. The protrusion pattern ST may be formed in an undercut shape such that the width of the protrusion pattern ST close to the upper protective layer PL1 is smaller than the width of the protrusion pattern ST away from the upper protective layer PL1. The protrusion pattern ST may cut off the light-emitting stack 152 formed on the non-display region NDA.

[0140] The plurality of protrusion patterns ST may include a plurality of first protrusion patterns ST1 and a plurality of second protrusion patterns ST2 disposed in the moisture-proof penetration region NDA2, and a plurality of third protrusion patterns ST3 disposed in the virtual region NDA3.

[0141] A plurality of first protrusion patterns ST1 may be disposed between the display region DA and the dam DAM, and a plurality of second protrusion patterns ST2 may be disposed between the dam DAM and the virtual region NDA3. The third protrusion pattern ST3 may be disposed on the protective layer PL in the virtual region NDA3. Therefore, the protective layer PL can protect the third protrusion pattern ST3 from the laser emitted before the etching process.

[0142] The shapes of the plurality of first protrusion patterns ST1, second protrusion patterns ST2, and third protrusion patterns ST3 may all be the same, but are not limited thereto. For example, the first protrusion pattern ST1 and the second protrusion pattern ST2 may have the same shape, but the third protrusion pattern ST3 may have a different shape. Specifically, since the third protrusion pattern ST3 is disposed adjacent to the light-transmitting region TA formed by laser cutting, considering the impact generated during laser cutting, the third protrusion pattern ST3 may have a different shape from the first protrusion pattern ST1. Various modifications can be made to the protrusion patterns ST1, ST2, and ST3 to have a structure capable of cutting off the light-emitting stack 152.

[0143] An opening 11 may be formed in the substrate 10 corresponding to the light-transmitting region TA. The opening 11 may have a diameter larger than that of the light-transmitting region TA.

[0144] A side coating layer 31 may be formed on the side surface of the opening 11. The side coating layer 31 may cover the side surface of the opening 11. The protective layer PL may be disposed on the side coating layer 31.

[0145] The side coating layer 31 may be made of an organic material that absorbs light. For example, the side coating layer 31 may include an organic material having a light density (OD) of 1.0 or greater.

[0146] A back coating layer 32 may be provided below the substrate 10 and below the side coating layer 31. The back coating layer 32 may further extend from the back surface of the substrate 10 and be formed to reach the side coating layer 31.

[0147] The display device according to an embodiment of the present invention may improve the adhesion of the back coating layer 32 by forming the back coating layer 32 to cover the side coating layer 31. In this example, the back coating layer 32 may also be formed only on the back surface of the substrate 10 to protect the substrate 10. However, since the back coating layer 32 made of an organic material has relatively low adhesion to the substrate 10, it may be peeled off from the substrate 10 due to the external environment or impact. Therefore, the adhesion of the back coating layer 32 may be improved by joining the back coating layer 32 to the side coating layer 31 made of an organic material at the opening 11 of the substrate 10. Thereby, the back coating layer 32 can be prevented from being peeled off from the substrate 10.

[0148] According to an embodiment, the side surface of the light-transmitting region TA may be formed vertically. That is, the side surfaces of the back coating layer 32, the side coating layer 31, the protective layer PL, and the polarizer 19 for forming the side surface of the light-transmitting region TA may be laser-cut to have the same vertical surface.

[0149] Referring to Figure 9 , the plurality of protrusion patterns ST may include a first pattern layer L1, a second pattern layer L2, and a third pattern layer L3 stacked in sequence. The first pattern layer L1 and the third pattern layer L3 may each include a titanium (Ti) material, and the second pattern layer L2 may include an aluminum (Al) material.

[0150] The protrusion pattern ST according to an embodiment may be made of the same material as the source / drain 121 and 124 or the connection electrode 145 in the display region DA. That is, when forming the connection electrode 145, the plurality of protrusion patterns ST may be formed simultaneously and then etched to be separated into a plurality of protrusion patterns. In this case, due to the difference in the etching reaction rate, the second pattern layer L2 made of aluminum may be etched relatively more. Therefore, since the width of the second pattern layer L2 is smaller than the width of the third pattern layer L3, the protrusion pattern ST may have an undercut shape. Due to this undercut shape, the light-emitting stack 152 formed on the plurality of protrusion patterns ST may be formed discontinuously and may be disconnected between the plurality of protrusion patterns ST. Therefore, the protrusion pattern ST may increase the length of the moisture penetration path and at the same time cause the light-emitting stack 152 to be disconnected to block moisture penetration.

[0151] A plurality of protruding patterns ST can further prevent the peeling of other inorganic insulating layers provided thereon. During laser cutting, external impact, etc., the inorganic insulating layer is likely to peel off. However, according to one embodiment, since the inorganic insulating layer is filled between a plurality of protruding patterns ST having an undercut shape, the peeling of the inorganic insulating layer can be prevented. Therefore, the inorganic insulating layer filled between the plurality of protruding patterns ST can more effectively prevent moisture penetration. The inorganic insulating layer can be formed by extending the first encapsulation layer 171 of the encapsulation portion 17 provided in the display area DA. In this example, different from the second protruding pattern ST2, a foreign matter compensation layer 172 can be provided to contact and cover the first encapsulation layer 171 of the first protruding pattern ST1. An inorganic insulating layer can also be provided to cover the plurality of protruding patterns ST.

[0152] Referring to Figure 10 , a plurality of third protruding patterns ST3 can be provided on the protective layer PL. The outermost third protruding pattern ST3 among the plurality of third protruding patterns ST3 can protrude more toward the light-transmitting area TA than the inclined surface 11a of the opening 11 of the substrate 10. However, this is not limited thereto, and the inclined surface 11a of the opening 11 of the substrate 10 can also protrude more toward the light-transmitting area TA than the outermost third protruding pattern ST3 among the plurality of third protruding patterns ST3. In this case, the inorganic insulating layer provided between the plurality of protruding patterns ST is exposed to the light-transmitting area TA, so that the third protruding pattern ST3 is not exposed through the light-transmitting area TA.

[0153] The light-emitting stack 152 formed on the plurality of third protruding patterns ST3 is discontinuously formed due to the third protruding patterns ST3. Therefore, the light-emitting stack 152 can be disconnected between the plurality of third protruding patterns ST3. Therefore, the third protruding pattern ST3 can block the moisture penetration path.

[0154] According to one embodiment, since a plurality of third protruding patterns ST3 are formed in the dummy area NDA3 and the inorganic insulating layer is filled between the plurality of protruding patterns ST, the peeling of the inorganic insulating layer can be prevented during laser cutting or external impact.

[0155] The plurality of third protruding patterns ST3 can also be directly formed on the protective layer PL, or can be provided on a dummy layer located on the protective layer PL. The second encapsulation layer 173 can be provided to contact the first encapsulation layer 171 serving as the inorganic insulating layer.

[0156] Figure 11 is a view showing the display panel before the formation of the light-transmitting area, Figures 12A to 12F is based on Figure 11 The view of area F in shows a view of the process of etching the substrate to form a light-transmitting area in the display panel.

[0157] Figure 12A This is a view showing the step of irradiating a substrate with a laser.

[0158] Reference Figure 11 and 12A , a laser can be emitted to a preset position on the substrate 10 to facilitate etching the substrate 10 using an etching solution. The preset position can be a position where a light-transmitting region TA is to be formed or a position where an opening 11 of the substrate 10 is to be formed.

[0159] Figure 12B This is a view showing the step of setting a mask pattern on the back surface of the substrate.

[0160] Referring Figure 12B , a mask pattern MP can be formed under the substrate 10. According to one embodiment, the mask pattern MP can be formed according to the number and shape of the openings to be formed in the substrate 10, and the mask pattern MP is exposed to the etching solution to simultaneously form a plurality of openings. Forming the openings and separating the substrate from the mother substrate can be performed simultaneously.

[0161] As Figure 12A and 12B shown, in a display device according to an embodiment of the present invention, the substrate 10 is irradiated with a laser, and then the mask pattern MP is set; however, the present invention is not limited thereto. For example, the laser can be emitted after the mask pattern MP is set on the substrate 10.

[0162] Figure 12C This is a view showing the step of forming an opening on the back surface of the substrate by an etching process.

[0163] Referring Figure 12C , when the etching solution is brought into contact with the exposed area of the substrate 10, a partial area of the substrate 10 exposed between the mask patterns MP can be etched to form the opening 11. In this case, the buffer layer 101 formed on the etched substrate 10 can prevent the etching solution from penetrating into the interior of the display panel 100. The buffer layer 101 can be made of an inorganic insulating material. Considering process optimization, the buffer layer 101 can be formed by at least one of the multi-buffer layer 102 and the active buffer layer 103 extending from the display area DA; however, the present invention is not limited thereto. For example, the buffer layer 101 can be formed separately using an inorganic insulating material different from the multi-buffer layer 102 and the active buffer layer 103 in the display area DA.

[0164] A portion of the buffer layer 101 may also be etched. For example, an etching solution may perform local etching in the buffer layer 101 in the Z-axis direction to form a groove, or form a through hole that completely penetrates the buffer layer 101. Even when a through hole is formed in the buffer layer 101, the planarization layer 110a provided on the buffer layer 101 can prevent the etching solution from penetrating into the interior of the display panel 100. When forming the first planarization layer 110 or the second planarization layer 111 in the display area DA, the planarization layer 110a may be formed together, thereby optimizing the process.

[0165] Figure 12D It is a view showing the step of providing a side coating layer in the opening.

[0166] Reference Figure 12D , the opening 11 of the substrate 10 can be filled with the side coating layer 31. Subsequently, when the side coating layer 31 is cured, the side coating layer 31 shrinks by a certain height h1, and a curvature can be formed on the lower surface 31a of the side coating layer 31. However, the side coating layer 31 may also not shrink depending on the material.

[0167] Figure 12E It is a view showing the step of providing a back coating layer.

[0168] Reference Figure 12E , the back coating layer 32 can be completely formed on the back surface of the substrate 10 and the back surface of the side coating layer 31. However, the present invention is not limited thereto, and the back coating layer 32 may also be formed only on the back surface of the substrate 10.

[0169] Figure 12F It is a view showing the laser cutting step.

[0170] Refer to Figure 12F , the opening 11 side of the substrate 10 can be irradiated with a laser to form a light-transmitting area TA. In this case, the laser can cut the protective layer PL and the third protrusion pattern ST3 provided on the substrate 10. According to one embodiment, since the contact area between the protrusion pattern ST and an inorganic insulating layer such as the first encapsulation layer 171 increases, peeling of the inorganic insulating layer due to laser emission can be prevented.

[0171] Since the protective layer PL according to one embodiment of the present invention may include at least one of an organic insulating layer, an inorganic insulating layer, and a metal layer, and may include an upper protective layer and a lower protective layer according to the placement position, the protective layer PL can be provided in various embodiments to cope with the laser emitted before the etching process.

[0172] Figure 13 It is a view showing an example of a protective layer provided in a display device according to one embodiment of the present invention. Figure 13The upper protection layer PL1 shown can represent the protection layer PL according to the first example.

[0173] Referring Figure 13 , a display device according to an embodiment of the present invention may include a substrate 10, an upper protection layer PL1 disposed on the substrate 10, and a third protrusion pattern ST3 disposed on the upper protection layer PL1. Subsequently, an opening 11 may be formed in the substrate 10, and a side coating layer 31 may be disposed in the opening 11. Subsequently, a back coating layer 32 may be disposed on the back surface of the substrate 10.

[0174] The upper protection layer PL1 may be disposed on the substrate 10 and may protect components such as the third protrusion pattern ST3 disposed on the upper protection layer PL1 from the laser emitted before the etching process. The upper protection layer PL1 may be disposed on the substrate 10 to prevent the etching solution from penetrating into the interior of the display panel 100. To facilitate the etching process on the substrate 10, the laser emitted before the etching process may be an infrared laser. In this case, when an infrared laser with a wavelength of 1064 nm is emitted onto the substrate 10, the upper protection layer PL1 may effectively protect the third protrusion pattern ST3 from the infrared laser in the order of a metal layer, an inorganic insulating layer, and an organic insulating layer.

[0175] The upper protection layer PL1 may include a buffer layer 101 disposed on the substrate 10, a planarization layer 110a disposed under the third protrusion pattern ST3, and an inorganic insulating layer and a metal layer disposed between the buffer layer 101 and the planarization layer 110a. The inorganic insulating layer and the metal layer may include a first inorganic insulating layer 107 disposed on the buffer layer 101, a first metal layer 132a disposed on the first inorganic insulating layer 107, a second inorganic insulating layer 108a disposed on the first inorganic insulating layer 107 to cover the first metal layer 132a, and a second metal layer 131a disposed on the second inorganic insulating layer 108a.

[0176] The buffer layer 101 may be made of an inorganic insulating material.

[0177] The buffer layer 101 may be an inorganic insulating layer, but may also be formed of two layers according to the wavelength of the laser, as Figure 13 shown. For example, the buffer layer 101 may include a first buffer layer 102a disposed on the substrate 10 and a second buffer layer 103a disposed on the first buffer layer 102a. Considering process optimization, the first buffer layer 102a may be formed by extending the multi-buffer layer 102 in the display area DA, and the second buffer layer 103a may be formed by extending the active buffer layer 103 in the display area DA; however, the present invention is not limited thereto. The first buffer layer 102a may be referred to as a lower buffer layer, and the second buffer layer 103a may be referred to as an upper buffer layer.

[0178] Therefore, depending on the type, wavelength, etc. of the laser, the buffer layer 101 may include one or more inorganic insulating layers, and the thickness, material, etc. of the buffer layer 101 may be adjusted.

[0179] The buffer layer 101 may be disposed on the opening 11 to prevent the etching solution from penetrating into the interior of the display panel 100.

[0180] The buffer layer 101 may also be disposed on the emission line of the laser emitted before the etching process to prevent the laser from damaging the third protrusion pattern ST3.

[0181] The first inorganic insulating layer 107 may be made of an inorganic insulating material.

[0182] The first inorganic insulating layer 107 may be a single inorganic insulating layer, but may also be formed of two layers depending on the wavelength of the laser, as Figure 13 shown. For example, the first inorganic insulating layer 107 may include a first lower inorganic insulating layer 104a disposed on the second buffer layer 103a and a first upper inorganic insulating layer 106a disposed on the first lower inorganic insulating layer 104a.

[0183] In consideration of process optimization, when forming the lower gate insulating layer 104 in the display area DA, the first lower inorganic insulating layer 104a may be formed together, and when forming the upper gate insulating layer 106 in the display area DA, the first upper inorganic insulating layer 106a may be formed together.

[0184] Therefore, depending on the type, wavelength, etc. of the laser, the first inorganic insulating layer 107 may include one or more inorganic insulating layers, and the thickness, material, etc. of the first inorganic insulating layer 107 may be adjusted.

[0185] The first metal layer 132a may be made of a metal material. The first metal layer 132a may overlap the opening 11 in the Z-axis direction. In this case, the first metal layer 132a may extend more into the display area DA than the opening 11. The side surface of the first metal layer 132a may be exposed to the light-transmitting area TA.

[0186] The first metal layer 132a may be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but is not limited thereto.

[0187] When forming the second gate 132, the first metal layer 132a may be formed together.

[0188] Since the side surface of the first metal layer 132a is exposed to the light-transmitting region TA, corrosion may occur depending on the material of the first metal layer 132a. However, the display device according to an embodiment of the present invention can prevent the spread of corrosion by disposing the second inorganic insulating layer 108a to cover the first metal layer 132a. That is, since the first inorganic insulating layer 107 and the second inorganic insulating layer 108a are used, the first metal layer 132a can be disconnected from the second gate 132, so that the corrosion occurring in the first metal layer 132a does not spread to the second gate 132.

[0189] The second inorganic insulating layer 108a may be made of an inorganic insulating material and may be a single layer or multiple layers, but is not limited thereto.

[0190] When forming the upper interlayer dielectric layer 108 in the display region DA, the second inorganic insulating layer 108a can be formed together, so that process optimization can be achieved.

[0191] The second metal layer 131a may be made of a metal material. The second metal layer 131a may overlap the first metal layer 132a in the Z-axis direction and may be spaced apart from the first metal layer 132a. In this case, the second metal layer 131a may extend more into the display region DA than the opening 11. The side surface of the second metal layer 131a may be exposed to the light-transmitting region TA.

[0192] The second metal layer 131a may be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but is not limited thereto.

[0193] When forming the first source 121, the first drain 124, the second source 131, and the second drain 134, the second metal layer 131a can be formed together. Therefore, the second metal layer 131a may include a first layer made of Ti, a second layer made of Al, and a third layer made of Ti. The second layer may be disposed between the first layer and the third layer.

[0194] Since the side surface of the second metal layer 131a is exposed to the light-transmitting region TA, corrosion may occur depending on the material of the second metal layer 131a. For example, the second layer made of Al may be relatively more susceptible to corrosion than the first and third layers. However, the display device according to an embodiment of the present invention can prevent the spread of corrosion by disposing the planarization layer 110a to cover the second metal layer 131a. That is, since the second metal layer 131a is disconnected from the first source 121, the first drain 124, the second source 131, and the second drain 134 by the second inorganic insulating layer 108a and the planarization layer 110a, the corrosion occurring in the second metal layer 131a does not spread to the first source 121, the first drain 124, the second source 131, and the second drain 134.

[0195] A planarization layer 110a may be disposed on the second inorganic insulating layer 108a to cover the second metal layer 131a. The planarization layer 110a may include an organic insulating material such as an acrylic resin. When forming the first planarization layer 110 or the second planarization layer 111 in the display region DA, the planarization layer 110a may be formed, thereby improving the efficiency of the manufacturing process.

[0196] The third protrusion pattern ST3 may be disposed on the planarization layer 110a.

[0197] Figure 14 It is a view showing another example of a protective layer provided in a display device according to an embodiment of the present invention. Figure 14 The shown upper protective layer PL1 may represent the protective layer PL according to the second example.

[0198] When describing the protective layer PL according to the second example, since the same components as those of the protective layer PL according to the first embodiment may be denoted by the same reference numerals, detailed description thereof will be omitted.

[0199] When referring to Figure 13 and 14 comparing the protective layer PL according to the first example and the protective layer PL according to the second example with each other, the protective layer PL according to the second example is different from the protective layer PL according to the first example in that a third metal layer 142a is further provided between the first buffer layer 102a and the second buffer layer 103a.

[0200] The third metal layer 142a may be made of a metal material. The third metal layer 142a may overlap with the first metal layer 132a and the second metal layer 131a in the Z-axis direction. In this case, the third metal layer 142a may be disposed below the first metal layer 132a with a gap therebetween, and the second buffer layer 103a may be disposed between the third metal layer 142a and the first metal layer 132a. Thus, the third metal layer 142a can more effectively block the laser light emitted toward the third protrusion pattern ST3.

[0201] The third metal layer 142a may be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof, but is not limited thereto. However, considering that the side surface of the third metal layer 142a may be exposed to the light-transmitting region TA and corroded, the third metal layer 142a may be made of corrosion-resistant molybdenum (Mo). In this case, since the second buffer layer 103a is provided to cover the third metal layer 142a, even if corrosion occurs in the third metal layer 142a, the spread of corrosion can be prevented.

[0202] Considering process optimization, the third metal layer 142a may be formed together with the second light-blocking layer 142.

[0203] Figure 15 It is a view showing still another example of the protective layer provided in the display device according to an embodiment of the present invention. Figure 15 The shown upper protective layer PL1 may represent the protective layer PL according to the third example.

[0204] When describing the protective layer PL according to the third example, since the same components as those of the protective layer PL according to the second example may be denoted by the same reference numerals, the detailed description thereof will be omitted.

[0205] When referring to Figure 14 and 15 comparing the protective layer PL according to the second example and the protective layer PL according to the third example with each other, the protective layer PL according to the third example is different from the protective layer PL according to the second example in that a fourth metal layer 141a is further provided between the substrate 10 and the first buffer layer 102a.

[0206] The fourth metal layer 141a may be made of a metal material. The fourth metal layer 141a may overlap with the first metal layer 132a, the second metal layer 131a, and the third metal layer 142a in the Z-axis direction. In this case, the fourth metal layer 141a may be disposed below the third metal layer 142a with a gap therebetween, and the first buffer layer 102a may be disposed between the third metal layer 142a and the fourth metal layer 141a. Accordingly, the fourth metal layer 141a may more effectively block the laser emitted toward the third protrusion pattern ST3.

[0207] The fourth metal layer 141a may be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but is not limited thereto. However, considering that the side surface of the fourth metal layer 141a may be exposed to the light-transmitting region TA and corroded, the fourth metal layer 141a may be made of corrosion-resistant molybdenum (Mo). In this case, since the first buffer layer 102a is disposed to cover the fourth metal layer 141a, even if corrosion occurs in the fourth metal layer 141a, the spread of corrosion can be prevented.

[0208] Considering process optimization, the fourth metal layer 141a may be formed together with the first light-blocking layer 141.

[0209] Figure 16 is a view showing still another example of a protective layer provided on a display device according to an embodiment of the present invention. Figure 16 The illustrated upper protective layer PL1 and lower protective layer PL2 may represent the protective layer PL according to the fourth example.

[0210] Referring to Figure 16 , a display device according to an embodiment of the present invention may include a substrate 10, an upper protective layer PL1 provided on the substrate 10, a lower protective layer PL2 provided under the substrate 10, and a third protrusion pattern ST3 provided on the upper protective layer PL1. An opening 11 may be formed in the substrate 10, and a side coating layer 31 may be provided in the opening 11. A back coating layer 32 may be provided on the back surface of the lower protective layer PL2.

[0211] The upper protective layer PL1 may be provided on the substrate 10 to protect components such as the third protrusion pattern ST3 provided on the upper protective layer PL1 from the laser emitted before the etching process. The upper protective layer PL1 may be provided on the substrate 10 to prevent the etching solution from penetrating into the interior of the display panel 100.

[0212] The lower protective layer PL2 can be disposed on the back surface of the substrate 10 to protect components such as the third protrusion pattern ST3 disposed on the upper protective layer PL1 from the laser emitted before the etching process.

[0213] A second distance D2 from the center C of the light-transmitting region TA to the lower protective layer PL2 can be greater than a first distance D1 from the center C of the light-transmitting region TA to the upper protective layer PL1. For example, the upper protective layer PL1 can be disposed at the first distance D1 from the center C of the light-transmitting region TA, the lower protective layer PL2 can be disposed at the second distance D2 from the center C of the light-transmitting region TA, and the second distance D2 can be greater than the first distance D1.

[0214] The upper protective layer PL1 may include a buffer layer 101 disposed on the substrate 10 and a planarization layer 110a disposed under the third protrusion pattern ST3. The buffer layer 101 can be made of an inorganic insulating material and may include a first buffer layer 102a disposed on the substrate 10 and a second buffer layer 103a disposed on the first buffer layer 102a.

[0215] The planarization layer 110a can be disposed on the buffer layer 101. The planarization layer 110a can be made of an organic insulating material such as an acrylic resin. Subsequently, the third protrusion pattern ST3 can be disposed on the planarization layer 110a.

[0216] The lower protective layer PL2 can be disposed on the back surface of the substrate 10 and can cope with the laser more effectively together with the upper protective layer PL1 while protecting the upper protective layer PL1 from the laser. For example, when a laser is emitted before the etching process, since the lower protective layer PL2 is irradiated by the laser first, the influence of the laser reaching the upper protective layer PL1 can be reduced. This can reduce the possibility that the buffer layer 101 disposed on the opening 11 is etched by the etching solution.

[0217] The unirradiated region of the lower protective layer PL2 that is not irradiated by the laser can be used as a mask pattern MP.

[0218] The lower protective layer PL2 can include at least one of an organic insulating layer made of an organic material, an inorganic insulating layer made of an inorganic material, and a metal layer made of a metal material. The lower protective layer PL2 can be a single layer or a multi-layer, but is not limited thereto.

[0219] Figure 17 is a view showing another embodiment of the display panel before forming the light-transmitting region, Figures 18A to 18F is based on Figure 17 a view of the region G in shows a view of the process of etching the substrate to form a light-transmitting region in the display panel provided with the lower protective layer.

[0220] When Figure 17The display panel shown and Figure 11 when comparing with the display panel shown, Figure 17 the difference between the display panel shown and Figure 11 the display panel shown is that a lower protective layer PL2 is provided instead of a mask pattern MP, and there are differences in the etching process due to the lower protective layer PL2.

[0221] Figure 18A is a view showing the step of emitting a laser to the back surface of the substrate provided with the lower protective layer.

[0222] Referring to Figure 11 and 18A , a laser can be emitted to a preset position on the lower protective layer PL2 to facilitate etching the substrate 10 using an etching solution. The preset position can be the position where the light-transmitting region TA is to be formed or the position where the opening 11 of the substrate 10 is to be formed.

[0223] Figure 18B is a view showing the step of exposing the region irradiated with the laser to the etching solution, Figure 18C is a view showing the step of forming an opening on the back surface of the substrate through an etching process.

[0224] Referring to Figure 18B and Figure 18C , when the etching solution contacts the region exposed to the laser, a part of the lower protective layer PL2 and the substrate 10 can be etched to form the opening 11. A part of the lower protective layer PL2 exposed to the laser can have its properties changed and be etched by the etching solution. Therefore, the inner side surface of the lower protective layer PL2 can form a part of the opening 11 and includes an inclined surface or a curved surface formed depending on the degree of exposure to the etching solution.

[0225] In this case, the buffer layer 101 formed on the etched substrate 10 can prevent the etching solution from penetrating into the interior of the display panel 100. The buffer layer 101 can be made of an inorganic insulating material, and considering process optimization, the buffer layer 101 can be formed by at least one of the multi-buffer layer 102 and the active buffer layer 103 extending from the display region DA; however, the present invention is not limited thereto. For example, the buffer layer 101 can be formed separately using an inorganic insulating material different from the multi-buffer layer 102 and the active buffer layer 103 in the display region DA. In this case, since the laser first passes through the lower protective layer PL2, a part of the buffer layer 101 will also be etched, but the etching degree is very small.

[0226] Figure 18D is a view showing the step of providing a side coating layer in the opening.

[0227] Referring to Figure 18D, the opening 11 of the substrate 10 can be filled with the side coating layer 31. Subsequently, when the side coating layer 31 is cured, the side coating layer 31 shrinks by a certain height h1, and a curvature can be formed on the lower surface 31a of the side coating layer 31. However, the side coating layer 31 may not shrink depending on the material.

[0228] Figure 18E is a view showing the step of providing the back coating layer.

[0229] Referring to Figure 18E , the back coating layer 32 can be completely formed on the back surface of the lower protective layer PL2 and the back surface of the side coating layer 31. However, the present invention is not limited thereto, and the back coating layer 32 may also be formed only on the back surface of the lower protective layer PL2.

[0230] Figure 18F is a view showing the laser cutting step.

[0231] Referring to Figure 18F , the light-transmitting region TA can be formed by irradiating the opening 11 side of the substrate 10 with a laser. In this case, the laser can cut the upper protective layer PL1 and the third protrusion pattern ST3 provided on the substrate 10 and the lower protective layer PL2 provided under the substrate 10.

[0232] Figure 19 is a view showing another example of the protective layer provided in the display device according to an embodiment of the present invention. Figure 19 The upper protective layer PL1 and the lower protective layer PL2 shown can represent the protective layer PL according to the fifth example.

[0233] When describing the protective layer PL according to the fifth example, since the same components as those of the protective layer PL according to the fourth example can be denoted by the same reference numerals, the detailed description thereof will be omitted.

[0234] When referring to Figure 16 and 19 compare the protective layer PL according to the fourth example and the protective layer PL according to the fifth example with each other, the upper protective layer PL1 in the protective layer PL according to the fifth example is different from the upper protective layer PL1 according to the fourth example in that it further includes a first inorganic insulating layer 107 provided on the buffer layer 101, a first metal layer 132a provided on the first inorganic insulating layer 107, a second inorganic insulating layer 108a provided on the first inorganic insulating layer 107 to cover the first metal layer 132a, and a second metal layer 131a provided on the second inorganic insulating layer 108a.

[0235] The first inorganic insulating layer 107 can be made of an inorganic insulating material and can be provided as a single layer of inorganic insulating layer or two or more layers of inorganic insulating layers. For example, the first inorganic insulating layer 107 may include a first lower inorganic insulating layer 104a disposed on the second buffer layer 103a and a first upper inorganic insulating layer 106a disposed on the first lower inorganic insulating layer 104a.

[0236] Considering process optimization, when forming the lower gate insulating layer 104 in the display area DA, the first lower inorganic insulating layer 104a can be formed together, and when forming the upper gate insulating layer 106 in the display area DA, the first upper inorganic insulating layer 106a can be formed together.

[0237] The first metal layer 132a can be made of a metal material. The first metal layer 132a can overlap the opening 11 in the Z-axis direction.

[0238] The first metal layer 132a can be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but is not limited thereto.

[0239] When forming the second gate 132, the first metal layer 132a can be formed together.

[0240] The second inorganic insulating layer 108a can be made of an inorganic insulating material and can be a single layer or multiple layers, but is not limited thereto.

[0241] When forming the upper interlayer dielectric layer 108 in the display area DA, the second inorganic insulating layer 108a can be formed together, thereby achieving process optimization.

[0242] The second metal layer 131a can be made of a metal material. The second metal layer 131a can overlap the first metal layer 132a in the Z-axis direction and can be spaced apart from the first metal layer 132a.

[0243] When forming the first source 121, the first drain 124, the second source 131, and the second drain 134, the second metal layer 131a can be formed together. Therefore, the second metal layer 131a may include a first layer made of Ti, a second layer made of Al, and a third layer made of Ti. The second layer can be disposed between the first layer and the third layer.

[0244] A planarization layer 110a may be provided on the second inorganic insulating layer 108a to cover the second metal layer 131a. The planarization layer 110a may include an organic insulating material such as an acrylic resin. When forming the first planarization layer 110 or the second planarization layer 111 in the display area DA, the planarization layer 110a may be formed, thereby improving the efficiency of the manufacturing process.

[0245] A third protrusion pattern ST3 may be provided on the planarization layer 110a.

[0246] Figure 20 It is a view showing still another example of a protective layer provided in a display device according to an embodiment of the present invention. Figure 20 The upper protective layer PL1 and the lower protective layer PL2 shown may represent the protective layer PL according to the sixth example.

[0247] When describing the protective layer PL according to the sixth example, since the same components as those of the protective layer PL according to the fifth example may be denoted by the same reference numerals, a detailed description thereof will be omitted.

[0248] When referring Figure 19 and 20 to compare the protective layer PL according to the fifth example and the protective layer PL according to the sixth example with each other, the protective layer PL according to the sixth example is different from the protective layer PL according to the fifth example in that a third metal layer 142a is further provided between the first buffer layer 102a and the second buffer layer 103a.

[0249] The third metal layer 142a may be made of a metal material. The third metal layer 142a may overlap with the first metal layer 132a and the second metal layer 131a in the Z-axis direction. In this case, the third metal layer 142a may be provided below the first metal layer 132a so as to be spaced apart from the first metal layer 132a, and the second buffer layer 103a may be provided between the third metal layer 142a and the first metal layer 132a. Therefore, the third metal layer 142a can more effectively block the laser light emitted to the third protrusion pattern ST3.

[0250] The third metal layer 142a may be a single layer or a multi-layer made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but is not limited thereto. However, considering that the side surface of the third metal layer 142a may be exposed to the light-transmitting region TA and be corroded, the third metal layer 142a may be made of corrosion-resistant molybdenum (Mo). In this case, since the second buffer layer 103a is provided to cover the third metal layer 142a, even if corrosion occurs in the third metal layer 142a, the spread of corrosion can be prevented.

[0251] In consideration of process optimization, the third metal layer 142a may be formed together with the second light-blocking layer 142.

[0252] Figure 21 It is a view showing another example of the protective layer provided in the display device according to an embodiment of the present invention. Figure 20 The illustrated upper protective layer PL1 and lower protective layer PL2 may represent the protective layer PL according to the seventh example.

[0253] When describing the protective layer PL according to the seventh example, since the same components as those of the protective layer PL according to the sixth example may be denoted by the same reference numerals, a detailed description thereof will be omitted.

[0254] When referring to Figure 20 and 21 and comparing the protective layer PL according to the seventh example and the protective layer PL according to the sixth example with each other, the protective layer PL according to the seventh example is different from the protective layer PL according to the sixth example in that a fourth metal layer 141a is further provided between the substrate 10 and the first buffer layer 102a.

[0255] The fourth metal layer 141a may be made of a metal material. The fourth metal layer 141a may overlap with the first metal layer 132a, the second metal layer 131a, and the third metal layer 142a in the Z-axis direction. In this case, the fourth metal layer 141a may be provided below the third metal layer 142a so as to be spaced apart from the third metal layer 142a, and the first buffer layer 102a may be provided between the third metal layer 142a and the fourth metal layer 141a. Therefore, the fourth metal layer 141a can more effectively block the laser light emitted toward the third protrusion pattern ST3.

[0256] The fourth metal layer 141a may be a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof, but is not limited thereto. However, considering that the side surface of the fourth metal layer 141a may be exposed to the light-transmitting region TA and corroded, the fourth metal layer 141a may be made of corrosion-resistant molybdenum (Mo). In this case, since the first buffer layer 102a is provided to cover the fourth metal layer 141a, even if corrosion occurs in the fourth metal layer 141a, the spread of corrosion can be prevented.

[0257] In consideration of process optimization, the fourth metal layer 141a may be formed together with the first light-blocking layer 141.

[0258] The display device according to one or more embodiments of the present invention may be described as follows.

[0259] A display device according to one or more embodiments of the present invention may include: a display panel including a display area, a light-transmitting area, and a non-display area surrounding the light-transmitting area; and a sensor disposed in the light-transmitting area, wherein the display panel may include: a substrate; a circuit portion and a light-emitting element portion disposed on the display area; an upper protective layer disposed on the substrate in the non-display area; and a plurality of protrusion patterns disposed on the upper protective layer, wherein the substrate may include an opening disposed at a position corresponding to the light-transmitting area.

[0260] The upper protective layer may include at least one of an organic insulating layer, an inorganic insulating layer, and a metal layer.

[0261] The upper protective layer may include: a buffer layer disposed on the substrate; a planarization layer disposed under the plurality of protrusion patterns; and an inorganic insulating layer and a metal layer disposed between the buffer layer and the planarization layer, and the planarization layer may be an organic insulating layer.

[0262] The inorganic insulating layer and the metal layer may include: a first inorganic insulating layer disposed on the buffer layer; a first metal layer disposed on the first inorganic insulating layer; a second inorganic insulating layer disposed on the first inorganic insulating layer to cover the first metal layer; and a second metal layer disposed on the second inorganic insulating layer.

[0263] The buffer layer may include a lower buffer layer and an upper buffer layer disposed on the lower buffer layer, and the upper protective layer may further include a third metal layer disposed between the lower buffer layer and the upper buffer layer.

[0264] The upper protective layer may further include a fourth metal layer disposed between the substrate and the lower buffer layer.

[0265] The fourth metal layer may be disposed to cover the upper portion of the opening.

[0266] The third metal layer or the fourth metal layer may contain molybdenum.

[0267] The display panel may further include a lower protective layer disposed under the substrate in the non-display area, and the lower protective layer may include at least one of an organic insulating layer, an inorganic insulating layer, and a metal layer.

[0268] The distance from the center of the light-transmitting area to the lower protective layer may be greater than the distance from the center of the light-transmitting area to the upper protective layer.

[0269] The upper protective layer may include a protruding portion protruding from the inner side of the opening toward the center of the light-transmitting area.

[0270] A dam portion may be disposed in the non-display area, and the plurality of protrusion patterns include: a plurality of first protrusion patterns disposed between the display area and the dam portion; a plurality of second protrusion patterns disposed between the dam portion and the upper protective layer; and a plurality of third protrusion patterns disposed on the upper protective layer.

[0271] At least one of the plurality of first protrusion patterns, the plurality of second protrusion patterns, and the plurality of third protrusion patterns may have a different shape or material from the others of the plurality of first protrusion patterns, the plurality of second protrusion patterns, and the plurality of third protrusion patterns.

[0272] The plurality of protrusion patterns may be formed to have an undercut shape, and an inorganic insulating layer may be provided between the plurality of protrusion patterns.

[0273] The plurality of protrusion patterns may be formed to have the same layer structure as the layer structure of the connection electrodes of the circuit portion.

[0274] A coating layer may be further provided in the opening.

[0275] A display device according to one or more embodiments of the present invention may include: a display panel including a display area, a light-transmitting area, and a non-display area surrounding the light-transmitting area; and a sensor provided in the light-transmitting area, wherein the display panel may include: a substrate having an opening at a position corresponding to the light-transmitting area; a circuit portion and a light-emitting element portion provided on the substrate in the display area; a buffer layer provided on the substrate in the non-display area; a lower protective layer provided under the substrate in the non-display area; a planarization layer provided on the buffer layer; and a plurality of protrusion patterns provided on the planarization layer, wherein a distance from the center of the light-transmitting area to the lower protective layer is greater than a distance from the center of the light-transmitting area to the buffer layer.

[0276] The display panel may include: a first inorganic insulating layer provided on the buffer layer; a first metal layer provided on the first inorganic insulating layer; a second inorganic insulating layer provided on the first inorganic insulating layer to cover the first metal layer; and a second metal layer provided on the second inorganic insulating layer.

[0277] The buffer layer may include a lower buffer layer, an upper buffer layer provided on the lower buffer layer, and a third metal layer provided between the lower buffer layer and the upper buffer layer.

[0278] The display panel may further include a fourth metal layer provided between the substrate and the lower buffer layer.

[0279] The objects to be achieved by the present invention described above, the means for achieving these objects, and the effects of the present invention are not necessary features of the claims, and thus, the scope of the claims is not limited to the disclosure of the present invention.

[0280] Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, the present invention is not limited thereto and can be embodied in many different forms without departing from the technical concept of the present invention. Therefore, the embodiments disclosed in the present invention are provided for illustrative purposes only and are not intended to limit the technical concept of the present invention. The scope of the technical concept of the present invention is not limited thereto. Therefore, it should be understood that the above embodiments are illustrative in all respects and do not limit the present invention.

[0281] [Description of Reference Numerals]

[0282] 10: Substrate 13: Circuit Unit

[0283] 15: Light-Emitting Element Unit 17: Encapsulation Unit

[0284] 100: Display Panel 101: Buffer Layer

[0285] PL: Protective Layer PL1: Upper Protective Layer

[0286] PL2: Lower Protective Layer TA: Translucent Region

[0287] ST: Protrusion Pattern

Claims

1. A display device, comprising: A display panel, the display panel comprising a display area, a light-transmitting area and a non-display area surrounding the light-transmitting area, Wherein, the display panel comprises: substrate; a circuit portion and a light emitting element portion on the substrate in the display area; an upper protective layer on the substrate in the non-display area; and a plurality of protrusion patterns on the upper protective layer, Wherein, the substrate includes an opening at a position corresponding to the light-transmitting area.

2. The display device according to claim 1, wherein: The upper protective layer includes at least one of an organic insulating layer, an inorganic insulating layer, and a metal layer.

3. The display device according to claim 1, wherein the upper protective layer comprises: a buffer layer on the substrate; a planarization layer below the plurality of protrusion patterns; as well as an inorganic insulating layer and a metal layer between the buffer layer and the planarization layer, Wherein, the planarization layer is an organic insulating layer.

4. The display device according to claim 3, wherein: The inorganic insulating layer and the metal layer include: a first inorganic insulating layer on the buffer layer; a first metal layer on the first inorganic insulating layer; a second inorganic insulating layer on the first inorganic insulating layer to cover the first metal layer; and A second metal layer is on the second inorganic insulating layer.

5. The display device according to claim 4, wherein: The buffer layer includes a lower buffer layer and an upper buffer layer on the lower buffer layer, The upper protection layer further includes a third metal layer between the lower buffer layer and the upper buffer layer.

6. The display device according to claim 5, wherein: The upper protection layer further includes a fourth metal layer between the substrate and the lower buffer layer.

7. The display device according to claim 6, wherein: The fourth metal layer covers an upper portion of the opening.

8. The display device according to claim 6, wherein: The third metal layer or the fourth metal layer includes molybdenum.

9. The display device according to claim 1, wherein: The display panel further includes a lower protective layer disposed under the substrate in the non-display area, Wherein, the lower protective layer includes at least one of an organic insulating layer, an inorganic insulating layer and a metal layer.

10. The display device according to claim 9, wherein: The distance from the center of the light-transmitting area to the lower protective layer is greater than the distance from the center of the light-transmitting area to the upper protective layer.

11. The display device according to claim 1, wherein: The upper protective layer includes a protrusion protruding from an inner side of the opening toward a center of the light-transmitting area.

12. The display device according to claim 1, further comprising: The dam-shaped portion in the non-display area, Wherein, the plurality of protrusion patterns include: a plurality of first protrusion patterns between the display area and the dam-shaped portion; a plurality of second protrusion patterns between the dam and the upper protective layer; and A plurality of third protrusion patterns are formed on the upper protection layer.

13. The display device according to claim 12, wherein: At least one of the plurality of first protrusion patterns, the plurality of second protrusion patterns, and the plurality of third protrusion patterns has a shape or material different from others of the plurality of first protrusion patterns, the plurality of second protrusion patterns, and the plurality of third protrusion patterns.

14. The display device according to claim 1, wherein: The plurality of protrusion patterns include undercut shapes, Wherein, the inorganic insulating layer is between the plurality of protrusion patterns.

15. The display device according to claim 1, wherein: The plurality of protrusion patterns have the same layer structure as that of the connection electrodes of the circuit portion.

16. The display device according to claim 1, wherein: A coating layer is further disposed in the opening.

17. A display device comprising: A display panel, the display panel comprising a display area, a light-transmitting area and a non-display area surrounding the light-transmitting area, Wherein, the display panel comprises: A substrate having an opening at a position corresponding to the light-transmitting area; a circuit portion and a light emitting element portion on the substrate in the display area; a buffer layer on the substrate in the non-display area; a lower protective layer under the substrate in the non-display area; a planarization layer on the buffer layer; and a plurality of protrusion patterns on the planarization layer, Wherein, the distance from the center of the light-transmitting area to the lower protective layer is greater than the distance from the center of the light-transmitting area to the buffer layer.

18. The display device according to claim 17, wherein: The display panel further includes: a first inorganic insulating layer on the buffer layer; a first metal layer on the first inorganic insulating layer; a second inorganic insulating layer on the first inorganic insulating layer to cover the first metal layer; and A second metal layer is on the second inorganic insulating layer.

19. The display device according to claim 18, wherein: The buffer layer includes a lower buffer layer, an upper buffer layer on the lower buffer layer, and a third metal layer between the lower buffer layer and the upper buffer layer.

20. The display device according to claim 19, wherein: The display panel further includes a fourth metal layer between the substrate and the lower buffer layer.

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