Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof, and a display device. The display panel comprises a substrate, and a display function layer, an isolation structure and a first packaging layer which are located on the substrate. The display function layer comprises a plurality of light-emitting units, the isolation structure defines a plurality of isolation openings, the light-emitting units are located in the isolation openings, the first packaging layer is located on the side, away from the substrate, of the display function layer and at least comprises a first sub-packaging layer, a second sub-packaging layer and a third sub-packaging layer which are stacked in sequence, and the second sub-packaging layer is a planarization layer. The first packaging layer is designed into three layers, and the planarization layer is arranged in the three layers, so that the first packaging layer has a planarized surface, the packaging quality of the first packaging layer is improved, and the display effect of the display panel is ensured.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular, to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is an organic thin film electroluminescent unit. It has attracted great attention and is widely used in electronic display products due to its advantages such as simple preparation process, low cost, low power consumption, high brightness, wide viewing angle, high contrast and flexible display.

[0003] However, current electronic display products are limited by their own structural design, making it difficult to further improve the packaging effect of OLED while further increasing the pixel density PPI. Summary of the invention

[0004] In a first aspect, the present disclosure provides a display panel, which includes a substrate, a display function layer, an isolation structure, and a first encapsulation layer located on the substrate. The display function layer includes a plurality of light-emitting units, the isolation structure defines a plurality of isolation openings, the light-emitting units are located in the isolation openings, the first encapsulation layer is located on a side of the display function layer away from the substrate, and at least includes a first sub-encapsulation layer, a second sub-encapsulation layer, and a third sub-encapsulation layer stacked in sequence, wherein the second sub-encapsulation layer is a planarization layer.

[0005] In the above solution, the first encapsulation layer is designed to be three layers and a planarization layer is arranged therein so that the first encapsulation layer has a planarized surface, thereby improving the encapsulation quality of the first encapsulation layer and ensuring the display effect of the display panel.

[0006] In a specific embodiment of the first aspect of the present disclosure, in the edge region of the isolation opening, the first sub-packaging layer is surrounded by a cavity with an open opening, and the second sub-packaging layer fills the cavity. The second sub-packaging layer fills the cavity, so that the first sub-packaging layer and the second sub-packaging layer can be embedded with each other, thereby reducing the risk of interface separation between the first sub-packaging layer and the second sub-packaging layer; in addition, the second sub-packaging layer can prevent the corrosive liquid (or etching gas) used in the subsequent process from gathering in the cavity and destroying the packaging of the first sub-packaging layer.

[0007] In a specific embodiment of the first aspect of the present disclosure, the first sub-packaging layer includes a plurality of first sub-packaging units corresponding to the isolation openings, the second sub-packaging layer includes a plurality of second sub-packaging units corresponding to the isolation openings, the third sub-packaging layer includes a plurality of third sub-packaging units corresponding to the isolation openings, and the orthographic projection of the edge of the end of the first sub-packaging unit facing away from the substrate on the substrate coincides with the orthographic projection of the edge of the third sub-packaging unit on the substrate.

[0008] In a specific embodiment of the first aspect of the present disclosure, the first sub-encapsulation unit includes a suspended portion on the side of the isolation structure facing away from the substrate, and the third sub-encapsulation unit covers the suspended portion.

[0009] When the first encapsulation layer is set as a single film layer, a suspended portion will also be formed on the side of the isolation structure facing away from the substrate. When the first encapsulation layer is etched in subsequent processes, this suspended portion is prone to breakage, which will lead to cracks in other parts of the surrounding first encapsulation layer, resulting in the failure of the first encapsulation layer. In the above solution, since the first encapsulation layer is designed to have a structure including at least a first sub-encapsulation layer, a second sub-encapsulation layer, and a third sub-encapsulation layer, the degree of etching of the first encapsulation layer is reduced, and the risk of the suspended portion of the first sub-encapsulation layer breaking due to etching is reduced or eliminated. In addition, the third sub-encapsulation layer can reinforce the first sub-encapsulation layer and support the suspended portion of the first sub-encapsulation layer to reduce the risk of the suspended portion falling off, thereby further improving the encapsulation effect of the first encapsulation layer.

[0010] In a specific embodiment of the first aspect of the present disclosure, the first sub-encapsulation layer and the third sub-encapsulation layer are inorganic film layers, and the second sub-encapsulation layer is an organic film layer. The organic film layer has a relatively large thickness and can level the surface and fill the chamber when formed.

[0011] In a specific embodiment of the first aspect of the present disclosure, the second sub-encapsulation layer is a glue layer. In this way, the bonding strength between the various film layers in the first encapsulation layer can be increased to improve the reliability of the first encapsulation layer.

[0012] In a specific embodiment of the first aspect of the present disclosure, the first sub-encapsulation layer and the third sub-encapsulation layer are made of the same material to save process costs.

[0013] In a specific embodiment of the first aspect of the present disclosure, the orthographic projection of the end of the isolation structure facing the substrate on the substrate is located within the orthographic projection of the end of the isolation structure facing away from the substrate on the substrate.

[0014] In a specific embodiment of the first aspect of the present disclosure, the light-emitting unit includes a first electrode, a light-emitting functional layer, and a second electrode stacked in sequence on the substrate. The light-emitting functional layer and the second electrode are located within the isolation opening. At least a part of the isolation structure is set as a conductive structure, and the second electrode is connected to the conductive structure.

[0015] In the above solution, the isolation structure as a whole presents a shape that is wider at the top and narrower at the bottom, so that while ensuring that the edge of the second electrode can be connected to the conductive structure of the isolation structure, the light-emitting functional layer or some of its film layers (such as the film layer including the hole material) can be prevented from contacting the isolation structure.

[0016] In a specific embodiment of the first aspect of the present disclosure, the edge of the light-emitting functional layer is spaced apart from the isolation structure.

[0017] In a specific embodiment of the first aspect of the present disclosure, the isolation structure includes a support portion and a crown portion. The support portion is located between the crown portion and the substrate, and the orthographic projection of the support portion on the substrate is located within the orthographic projection of the crown portion on the substrate.

[0018] In a specific embodiment of the first aspect of the present disclosure, at least a part of the support portion is a conductive structure. For example, the above-mentioned chamber is located between the crown portion and the substrate.

[0019] In a specific embodiment of the first aspect of the present disclosure, the orthographic projections of the edges of the end of the first sub-packaging unit facing away from the substrate, the edges of the second sub-packaging unit, and the edges of the third sub-packaging unit on the substrate coincide with each other, and the surface of the second sub-packaging unit facing away from the substrate is a plane.

[0020] In the above solution, the second sub-packaging unit with a planarization function completely covers the first sub-packaging unit, so as to planarize the entire isolation opening and the area nearby, and improve the surface defects of the first sub-packaging layer; in addition, the second sub-packaging unit with a planarization function can provide stress buffering for the first sub-packaging unit, thereby reducing the risk of damage to the first sub-packaging unit (such as the overhanging portion it includes).

[0021] In another specific embodiment of the first aspect of the present disclosure, the distance from the part of the surface of the third sub-packaging unit facing away from the substrate corresponding to the center of the light-emitting unit to the substrate is greater than or equal to the distance from the surface of the crown portion facing the substrate to the substrate.

[0022] In the above solution, the second sub-packaging unit is completely covered by the first sub-packaging unit and the third sub-packaging unit, so as to avoid over-etching of the second sub-packaging unit during the etching process and form a new overhanging portion at the edge of the third sub-packaging unit; in addition, the edge portions of the first sub-packaging unit and the third sub-packaging unit can be in contact with each other to have a higher bonding strength, thereby further strengthening the overhanging portion of the first packaging unit and improving the reliability of the first packaging layer; in addition, the above design can make the chamber formed by the first packaging unit under the crown portion completely closed, so as to reduce the risk of damage to the first packaging layer by etching.

[0023] In a specific embodiment of the first aspect of the present disclosure, when the edge portions of the first sub-packaging unit and the third sub-packaging unit are in contact, the surface of the second sub-packaging unit facing away from the substrate is coplanar with the surface of the crown portion facing the substrate. In this way, the bonding area between the first sub-packaging unit and the third sub-packaging unit can be increased to improve the strength of the first packaging layer.

[0024] In a specific embodiment of the first aspect of the present disclosure, when the edge portions of the first sub-encapsulation unit and the third sub-encapsulation unit are in contact, the portion of the surface of the third sub-encapsulation unit facing away from the substrate corresponding to the center of the light-emitting unit is coplanar with the surface of the crown facing the substrate. In this way, it can be ensured that the second sub-encapsulation unit can completely fill the chamber formed by the first sub-encapsulation unit, so as to improve the reliability of the first encapsulation layer.

[0025] In a specific embodiment of the first aspect of the present disclosure, in a cross-section perpendicular to the substrate, the cross-sectional shape of the portion of the support portion located between adjacent isolation openings is a regular trapezoid. The support portion is provided as a conductive structure, and the second electrode is connected to the side wall of the support portion. This solution can reduce the requirement for the width difference between the crown portion and the support portion, so as to reduce the design width of the portion of the isolation structure between the two isolation openings, thereby improving the pixel density PPI of the display panel.

[0026] In another specific embodiment of the first aspect of the present disclosure, the support portion includes a first support layer and a second support layer. The first support layer is located between the substrate and the second support layer. The orthographic projection of the second support layer on the substrate is located within the orthographic projection of the first support layer on the substrate. The orthographic projection of the first support layer on the substrate is located within the orthographic projection of the crown on the substrate. The first support layer is a conductive structure, and the second electrode is connected to the portion of the surface of the first support layer facing away from the substrate that is not covered by the second support layer. Optionally, the second support layer is a conductive structure, and the second electrode is connected to the side wall of the second support layer. This solution can enable the surface of the first support layer to be used for depositing part of the second electrode, so as to increase the thickness of the contact portion between the second electrode and the isolation structure, thereby reducing the impedance of the contact area.

[0027] In a specific embodiment of the first aspect of the present disclosure, the display panel may further include a pixel definition layer. The pixel definition layer is located between the substrate and the isolation structure and defines a plurality of pixel openings respectively corresponding to the isolation openings. The pixel openings communicate with the corresponding isolation openings to limit the light-emitting units.

[0028] Optionally, the pixel definition layer is an inorganic layer.

[0029] In another specific embodiment of the first aspect of the present disclosure, the display panel may further include a second encapsulation layer and a third encapsulation layer. The second encapsulation layer is located on the side of the first encapsulation layer facing away from the substrate and covers the first encapsulation layer and the isolation structure. The third encapsulation layer is located on the side of the second encapsulation layer facing away from the substrate.

[0030] Optionally, the second encapsulation layer is a planarization layer.

[0031] Optionally, the second encapsulation layer is an organic film layer, and the third encapsulation layer is an inorganic film layer.

[0032] Optionally, the second encapsulation layer and the third encapsulation layer are continuous film layers.

[0033] In the above solution, the second encapsulation layer can improve the flatness of the display panel surface to facilitate the setting of other components on the encapsulation layer; in addition, the second encapsulation layer can have a certain flexibility to relieve the stress of the first encapsulation layer and the third encapsulation layer, thereby improving the reliability of the display panel, which is more conducive to the application of the display panel in the flexible display field; in addition, the third encapsulation layer has high density, has a high barrier effect on water, oxygen, etc., and the third encapsulation layer has higher strength to facilitate the preparation of other components (such as structures related to touch functions, optical film layers, etc.) on it.

[0034] The second aspect of the present disclosure provides a display device, which includes the display panel in the first aspect above.

[0035] The third aspect of the present disclosure provides a method for manufacturing a display panel, the manufacturing method including: providing a substrate and forming an isolation structure and a plurality of first electrodes on the substrate, wherein the isolation structure defines a plurality of isolation openings respectively corresponding to the first electrodes; sequentially depositing a light-emitting functional material layer and a conductive material layer to cover the isolation structure and the isolation openings; sequentially forming a first encapsulation material layer, a second encapsulation material layer and a third encapsulation material layer on the side of the conductive material layer facing away from the substrate, wherein the second encapsulation material layer is a planarization layer; performing a patterning process on the light-emitting functional material layer, the conductive material layer, the first encapsulation material layer, the second encapsulation material layer and the third encapsulation material layer to remove the light-emitting functional material layer, the conductive material layer and the first encapsulation material layer corresponding to part of the isolation openings, wherein the remaining light-emitting functional material layer forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, the remaining first encapsulation material layer forms a first sub-encapsulation unit, the remaining second encapsulation material layer forms a second sub-encapsulation unit, the remaining third encapsulation material layer forms a third sub-encapsulation unit, and the light-emitting functional layer and the second electrode and the first electrode corresponding to the isolation opening where they are located constitute a light-emitting unit; repeating the above process of manufacturing the light-emitting functional layer, the second electrode, and the first sub-encapsulation unit, the second sub-encapsulation unit and the third sub-encapsulation unit at the isolation openings where no light-emitting functional layer is formed until a light-emitting unit and a first sub-encapsulation unit, a second sub-encapsulation unit and a third sub-encapsulation unit are formed at each isolation opening, wherein the light-emitting units constitute a display functional layer, the first sub-encapsulation units constitute a first sub-encapsulation layer, the second sub-encapsulation units constitute a second sub-encapsulation layer, the third sub-encapsulation units constitute a third sub-encapsulation layer, and the first sub-encapsulation layer, the second sub-encapsulation layer and the third sub-encapsulation layer constitute a first encapsulation layer. Description of the Drawings

[0036] Figure 1 It is a schematic plan view of a display panel provided by an embodiment of the present disclosure.

[0037] Figure 2 An enlarged view of region S1 of the display panel shown Figure 1 in FIG.

[0038] Figure 3 A cross-sectional view of the display panel shown Figure 2 along M-N in one design

[0039] Figure 4A A cross-sectional view of the display panel shown Figure 2 along M-N in another design

[0040] Figure 4B A cross-sectional view of the display panel shown Figure 2 along M-N in another design

[0041] Figure 5 Schematic diagram of the structure of another display panel provided as a comparative example in one embodiment of the present disclosure

[0042] Figure 6 Flow chart of a method for manufacturing a display panel provided in one embodiment of the present disclosure

[0043] Figures 7 to 11 A process diagram of a manufacturing method provided in one embodiment of the present disclosure for forming the display panel shown Figure 3 in FIG.

[0044] Figure 12 Schematic diagram of the positional relationship between a partial film layer of a display panel and an evaporation source during evaporation provided in one embodiment of the present disclosure

[0045] Figure 13 Cross-sectional view of a partial region of a display panel provided in one embodiment of the present disclosure

[0046] Description of reference numerals:

[0047] 11 - Display area; 12 - Border area; 100 - Substrate; 200 - Light-emitting unit; 210 - First electrode; 220 - Light-emitting functional layer; 221 - First functional layer; 222 - Light-emitting layer; 223 - Second functional layer; 230 - Second electrode; 300 - Isolation structure; 301 - Isolation opening; 302 - Pixel opening; 310 - Support part; 311 - First support layer; 312 - Second support layer; 320 - Crown part; 330 - Pixel definition layer; 401 - Chamber; 410 - First encapsulation layer; 411 - First sub-encapsulation layer; Suspended part - 411a; 412 - Second sub-encapsulation layer; 413 - Third sub-encapsulation layer; 420 - Second encapsulation layer; 430 - Third encapsulation layer; 500 - Photoresist pattern Detailed description of the invention

[0048] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this specification.

[0049] In display products, some functional film layers in the light-emitting units are formed by evaporation, and there are multiple functional film layers in each light-emitting unit, and the materials of some functional film layers (such as the light-emitting layer) in the light-emitting units emitting different light are different. Therefore, when evaporating these functional film layers through a mask plate (such as a fine mask plate), multiple alignments are required. In order to solve the position offset problem caused by the alignment accuracy error, sufficient space (and the safety margin related to the alignment error) needs to be reserved between different light-emitting units to ensure that the position of the actual light-emitting area of ​​the light-emitting unit can have a certain overlap rate with the designed position (design area), which is equivalent to compressing the design area of ​​the light-emitting area of ​​the light-emitting unit, which not only limits the light-emitting area of ​​the light-emitting unit, but also prevents the arrangement density of the light-emitting unit from being further increased, thereby making it difficult to further improve the PPI (pixel density) of the display panel.

[0050] In the present disclosure, an isolation structure is provided at the gap between the light-emitting units to separate the functional film layers of the adjacent light-emitting units. Thus, in the evaporation process of the functional film layer, it is only necessary to perform evaporation on the entire surface of the display panel without using a mask plate to prepare the functional film layer of each light-emitting unit separately. The process does not need to consider the alignment accuracy during evaporation, so that the gap between the light-emitting units can be designed to be smaller in size to increase the PPI (the principle of which can be seen in the following and Figures 7 to 11 (See also the relevant description in the relevant embodiments).

[0051] It should be noted that when preparing the light-emitting unit through the isolation structure, because the light-emitting unit is prepared in batches according to different light-emitting colors, after the preparation of the previous batch of light-emitting units is completed, a packaging structure will be formed thereon for protection, so as to reduce the damage to the previous batch of light-emitting units caused by the preparation process when preparing the next batch of light-emitting units. Therefore, the packaging effect of the packaging structure will directly affect the preparation yield of the light-emitting unit. However, due to the setting of the isolation structure, the packaging structure will form an open space (the chamber mentioned below) at the edge of the isolation structure. In this space, the thickness of the packaging structure is limited and the film quality is low. In the subsequent preparation process of the light-emitting unit, the space may also store a large amount of corrosive liquid (or etching gas, such as for removing photoresist), thereby damaging the packaging structure at the space, which will not only lead to poor packaging, but also may cause damage to the light-emitting unit to cause poor display.

[0052] The embodiment of the present disclosure provides a display panel to at least solve the above technical problems. The display panel includes a substrate and a display function layer, an isolation structure and a first encapsulation layer located on the substrate. The display function layer includes a plurality of light-emitting units, the isolation structure defines a plurality of isolation openings, the isolation openings limit the light-emitting units, for example, the light-emitting units are located in the isolation openings, the first encapsulation layer is located on the side of the display function layer away from the substrate, and at least includes a first sub-encapsulation layer and a second sub-encapsulation layer stacked in sequence. In this way, the second sub-encapsulation layer can make the first encapsulation layer have a flattened surface to avoid the first encapsulation layer from gathering corrosive liquid (or etching gas) in the subsequent preparation process, thereby reducing the etching degree of the first encapsulation layer; in addition, the first sub-encapsulation layer can protect the light-emitting unit, and the third sub-encapsulation layer can protect the second sub-encapsulation layer as a flattening layer to improve the encapsulation effect of the first encapsulation layer, so that the risk of damage to the light-emitting unit due to poor encapsulation caused by etching of the first encapsulation layer can be reduced, thereby ensuring the display effect of the display panel.

[0053] The structure of the display panel in at least one embodiment of the present disclosure is described in detail below with reference to the accompanying drawings. In addition, in these drawings, a spatial rectangular coordinate system is established with the substrate as a reference to more intuitively present the positional relationship of the relevant structures in the display panel, and in the spatial rectangular coordinate system, the X-axis and the Y-axis are parallel to the surface where the substrate is located, and the Z-axis is perpendicular to the surface where the substrate is located.

[0054] like Figures 1 to 3 As shown, the plane area of ​​the display panel 10 can be divided into a display area 11 and a border area 12 surrounding the display area 11. Sub-pixels (which may be called sub-pixels, etc.) may be arranged in the display area 11, such as R, G, and B sub-pixels. The physical structure of the sub-pixel may be a light-emitting unit. Adjacent sub-pixels with different colors of emitted light constitute a pixel (which may be called a pixel unit, a large pixel, etc.). The arrangement density of the pixel in the display area 11 represents the pixel density PPI. It should be noted that in some embodiments of the present disclosure, some of the wiring in the border area 12 may be arranged in the display area 11, so that the border area 12 may be designed as a single-sided border.

[0055] The physical structure of the display panel 10 may include a substrate 100 and a display function layer and an isolation structure 300 located on the substrate 100 , wherein the display function layer includes a plurality of light emitting units 200 .

[0056] The isolation structure 300 is located on the substrate 100 and defines a plurality of isolation openings 301. That is, the planar shape of the isolation structure 300 presents a grid pattern, and the isolation openings 301 are the meshes of the grid pattern. At least some of the film layers in the light-emitting unit 200 are formed by using the isolation structure 300. Therefore, the isolation openings 301 limit the light-emitting unit 200. That is, the light-emitting region of the light-emitting unit 200 is located in the isolation openings 301. For the composition, preparation, etc. of the isolation structure, reference can be made to Patent PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5.

[0057] It should be noted that in the embodiments of the present disclosure, the isolation openings 301 limit the light-emitting unit 200 so that the light-emitting unit 200 can be located in the isolation openings 301, which means that the part corresponding to the light-emitting region in the structure included in the light-emitting unit 200 is limited by the isolation openings 301, so that the isolation openings 301 limit the light-emitting region of the light-emitting unit 200. Therefore, the light-emitting unit 200 can be entirely (for example, when the pixel defining layer mentioned below is not provided) located in the isolation openings 301, or some of its structures (such as the light-emitting functional layer and the second electrode described below) are located in the isolation openings 301.

[0058] On the side of the light-emitting unit 200 and the isolation structure 300 facing away from the substrate 100, a first encapsulation layer 410 is covered. The first encapsulation layer 410 is used to encapsulate and protect the light-emitting unit 200 to avoid damage to the light-emitting unit 200 caused by harmful materials such as etching solution or etching gas during subsequent processes; in addition, during the use of the display panel, the first encapsulation layer 410 is used to isolate water, oxygen, etc. to avoid the invasion of water, oxygen, etc. leading to the accelerated aging of the light-emitting unit 200, thereby improving the service life of the display panel. Therefore, the encapsulation quality of the first encapsulation layer 410 directly affects the yield and performance of the display panel.

[0059] It should be noted that when the first encapsulation layer 410 has a planarized surface (for example, only includes the first sub-encapsulation layer 411), during the film-forming process, the encapsulation material will be deposited on the surface of the isolation structure 300 and the surface of the light-emitting unit 200, and form a depression corresponding to the isolation openings 301. During the etching process, the etching solution or etching gas will accumulate in the depression to etch the first encapsulation layer 410, and the part of the first encapsulation layer 410 forming the depression faces the light-emitting unit. If the damage degree of the first encapsulation layer 410 in this area is too large, it will lead to encapsulation failure.

[0060] In at least one embodiment of the present disclosure, as Figure 3As shown, in the edge region of the isolation opening 301, the first sub - encapsulation layer 411 surrounds a chamber 401 with an open opening. The second sub - encapsulation layer 412 fills the chamber 401 surrounded by the first encapsulation layer 410 and has a planarized surface (the surface facing away from the substrate), so that the third sub - encapsulation layer 413 is planarized. It should be noted that when the first encapsulation layer 410 is set as a single film layer, in the edge region of the isolation opening 301, if the designed thickness of the first encapsulation layer 410 is limited, an open chamber 401 is likely to be formed in this region. In the subsequent preparation process, the etching solution (or etching gas) is likely to accumulate in the chamber 401, causing the first encapsulation layer 410 to be over - etched, resulting in packaging failure. In the scheme as Figure 3 shown, even if the first sub - encapsulation layer 411 forms a chamber 401 with an open opening in the edge region of the isolation opening 301, and the second sub - encapsulation layer 412 also fills the chamber 401, thus preventing the etching solution (or etching gas) from entering the chamber 401 in the subsequent preparation process, avoiding the etching damage of the first sub - encapsulation layer 411, and improving the packaging quality of the first encapsulation layer 410.

[0061] Based on the above description, it can be seen that the film - forming problem of the first encapsulation layer is related to the isolation structure. Therefore, the relevant design of the isolation structure will be described below, and the specific design structure of the first encapsulation layer will be described in combination with the setting method of the isolation structure.

[0062] In at least one embodiment of the present disclosure, as Figure 3As shown, the orthographic projection of the end of the isolation structure 300 facing the substrate 100 on the substrate 100 is located within the orthographic projection of the end of the isolation structure 300 facing away from the substrate 100 on the substrate 100. The light-emitting unit 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 that are sequentially stacked on the substrate 100. The light-emitting functional layer 220 and the second electrode 230 are located within the isolation opening 301. At least a part of the isolation structure 300 is configured as a conductive structure, and the second electrode 230 is connected to the conductive structure. Thus, the isolation structure 300 as a whole presents a shape that is wider at the top and narrower at the bottom. Therefore, during the evaporation process of the light-emitting functional layer 220 and the second electrode 230, by controlling the evaporation angle of each film layer, under the blocking effect of the isolation structure 300, while ensuring that the edge of the second electrode 230 can be connected to the conductive structure of the isolation structure 300, it is possible to avoid the light-emitting functional layer 220 or some of its film layers (such as the film layer including the hole material) from contacting the isolation structure 300. Thus, while blocking the light-emitting functional layer 220 or some of its film layers (including electrical isolation, the light-emitting functional layers 220 or some of their film layers of adjacent light-emitting units 200 will not be directly or indirectly electrically connected), it is ensured that the second electrode 230 can be connected to the conductive structure of the isolation structure 300 to still form a common electrode (or a common cathode) or be connected to other related circuits (such as a common electrode line or a pixel driving circuit, etc.).

[0063] As Figure 3 shown, the light-emitting unit 200 includes a first electrode 210, a light-emitting functional layer 220, and a second electrode 230 that are sequentially stacked on the substrate 100. The light-emitting functional layer 220 and the second electrode 230 of each light-emitting unit 200 are located in the corresponding isolation opening 301. For example, in at least one embodiment of the present disclosure, the first electrode 210 may be configured as an anode, and the second electrode 230 may be configured as a cathode.

[0064] For example, the light-emitting functional layer 220 may further include a first functional layer 221, a light-emitting layer 222, and a second functional layer 223. The first functional layer 221, the light-emitting layer 222, and the second functional layer 223 are sequentially stacked on the first electrode 210. The first functional layer 221 may include a hole injection layer, a hole transport layer, an electron blocking layer, etc. The second functional layer 223 may include an electron injection layer, an electron transport layer, a hole blocking layer, etc. It should be noted that since carriers (holes, electrons) mainly crosstalk between adjacent light-emitting units 200 through the first functional layer 221, the isolation structure 300 needs to be arranged such that the first functional layers 221 of the respective light-emitting units 200 are electrically disconnected from each other.

[0065] Since the isolation structure 300 has a shape that is wider at the top and narrower at the bottom, the first functional layer 221 will be disconnected at the edge of the crown portion 320 during the evaporation process. That is, the first functional layer 221 will not be connected to the conductive part (such as the support portion 310) of the isolation structure 300, resulting in crosstalk between adjacent light-emitting units 200.

[0066] For example, in at least one embodiment of the present disclosure, as Figure 3 shown, the edge of the light-emitting functional layer 220 is spaced apart from the isolation structure 300, thereby improving the isolation effect of the isolation structure 300.

[0067] In the embodiments of the present disclosure, without further limitation on the specific structure of the isolation structure under the condition that the isolation structure is wider at the top and narrower at the bottom. Below, several setting methods of the isolation structure will be described in different embodiments.

[0068] In some embodiments of the present disclosure, as Figure 3 shown, the isolation structure 300 includes a support portion 310 and a crown portion 320. The support portion 310 is located between the crown portion 320 and the substrate 100. The orthographic projection of the support portion 310 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. For example, at least a part of the support portion 310 is a conductive structure. In this solution, the chamber 401 will be located between the crown portion 320 and the substrate 100.

[0069] For example, in the display panel as Figure 3 shown, the support portion 310 is formed of a conductive material such as metal. On this basis, the crown portion 320 can be formed of a conductive material such as metal, or the crown portion 320 can be formed of an insulating material. It should be noted that when the crown portion 320 is formed of a conductive material, the impedance of the structure formed by the second electrode 230 and the isolation structure 300 can be reduced; or, when the crown portion 320 is formed of an insulating material, the bonding strength between the first encapsulation layer 410 and the crown portion 320 (such as the surface of the crown portion 320 facing the substrate 100) can be increased to improve the film-forming quality of the first encapsulation layer 410 (such as the first sub-encapsulation layer 411 included therein), thereby improving the yield of the display panel. For example, when the crown portion 320 is formed of an insulating material, the crown portion 320 can be set to be formed of the same material as the first sub-encapsulation layer 411.

[0070] Since the edge of the crown portion 320 extends beyond the upper edge of the support portion 310, a chamber 401 will be formed at the support portion 310 and the side wall of the first sub-encapsulation unit. By controlling the thicknesses of the second sub-encapsulation unit and the third sub-encapsulation unit, the chamber 401 can be closed. Below, several different thickness designs of the second sub-encapsulation unit and the third sub-encapsulation unit will be used to illustrate the structure of the display panel.

[0071] In at least one embodiment of the present disclosure, as Figure 3 shown, the projections of the edges of the end of the first sub-packaging unit facing away from the substrate 100 on the substrate 100, the projections of the edges of the second sub-packaging unit on the substrate 100, and the projections of the edges of the third sub-packaging unit on the substrate 100 coincide with each other, and the surface of the second sub-packaging unit facing away from the substrate 100 is a flat surface. In this way, the second sub-packaging unit with a planarization function completely covers the first sub-packaging unit, so as to planarize the entire isolation opening 301 and the area nearby, and improve the surface defects of the first sub-packaging layer; in addition, the second sub-packaging unit with a planarization function can provide stress buffering for the first sub-packaging unit, thereby reducing the risk of damage to the first sub-packaging unit (such as the overhanging part it includes).

[0072] In at least one embodiment of the present disclosure, as Figure 4A and Figure 4B shown, the distance H1 from the part corresponding to the center of the light-emitting unit 200 on the surface of the third sub-packaging unit facing away from the substrate 100 to the substrate 100 is greater than or equal to the distance H2 from the surface of the crown 320 facing the substrate 100 to the substrate 100. The second sub-packaging unit is completely covered by the first sub-packaging unit and the third sub-packaging unit, so as to avoid the second sub-packaging unit from being over-etched in the etching process and forming new overhanging parts at the edges of the third sub-packaging unit; in addition, the edge parts of the first sub-packaging unit and the third sub-packaging unit can be in contact with each other to have a higher bonding strength, thereby further strengthening the overhanging part of the first packaging unit and improving the reliability of the first packaging layer 410; in addition, the above design can make the chamber formed by the first packaging unit under the crown 320 completely closed, so as to reduce the risk of damage to the first packaging layer 410 by etching.

[0073] For example, in one example, as Figure 4A shown, when the edge parts of the first sub-packaging unit and the third sub-packaging unit are in contact, the part corresponding to the center of the light-emitting unit 200 on the surface of the third sub-packaging unit facing away from the substrate 100 is coplanar with the surface of the crown 320 facing the substrate 100 (for example, the plane where the line P is located). In this way, it can be ensured that the second sub-packaging unit can completely fill the chamber formed by the first sub-packaging unit, so as to improve the reliability of the first packaging layer 410.

[0074] For example, in another example, as Figure 4B shown, when the edge parts of the first sub-packaging unit and the third sub-packaging unit are in contact, the surface of the second sub-packaging unit facing away from the substrate 100 is coplanar with the surface of the crown 320 facing the substrate 100 (for example, the plane where the line P is located). In this way, the bonding area between the first sub-packaging unit and the third sub-packaging unit can be increased, so as to improve the strength of the first packaging layer 410.

[0075] For example, as Figure 3 shown, in a cross-section perpendicular to the substrate 100, the cross-sectional shape of the portion of the support portion 310 located between adjacent isolation openings 301 is a regular trapezoid. The support portion 310 is provided as a conductive structure, and the second electrode 230 is connected to the side wall of the support portion 310. In this way, the width difference between the end of the support portion 310 far from the substrate 100 and the crown portion 320 can be increased to enhance the isolation effect of the isolation structure 300. Correspondingly, the requirement for the width difference between the crown portion 320 and the support portion 310 can also be reduced to decrease the design width of the portion of the isolation structure 300 between two isolation openings, thereby improving the pixel density PPI of the display panel.

[0076] In some other embodiments of the present disclosure, as Figure 5 shown, the support portion 310 includes a first support layer 311 and a second support layer 312. The first support layer 311 is located between the substrate 100 and the second support layer 312. The orthographic projection of the second support layer 312 on the substrate 100 is located within the orthographic projection of the first support layer 311 on the substrate 100. The orthographic projection of the first support layer 311 on the substrate 100 is located within the orthographic projection of the crown portion 320 on the substrate 100. The first support layer 311 is a conductive structure, and the second electrode 230 is connected to the portion of the surface of the first support layer 311 facing away from the substrate 100 that is not covered by the second support layer 312. Optionally, the second support layer 312 is a conductive structure, and the second electrode 230 is connected to the side wall of the second support layer 312. This solution can enable the surface of the first support layer 311 to be used for depositing part of the second electrode 230 to increase the thickness of the contact portion between the second electrode 230 and the isolation structure 300, thereby reducing the impedance of the contact area.

[0077] For example, the materials of the first support layer 311, the second support layer 312, and the crown portion 320 are all different. For example, the first support layer 311, the second support layer 312, and the crown portion 320 can be molybdenum, aluminum, and titanium respectively. The corrosion resistance of aluminum, molybdenum, and titanium increases in sequence. During etching, the film layers formed by these materials can form an isolation structure 300 as Figure 5 shown.

[0078] In the embodiments of the present disclosure, the isolation structure is used to connect the second electrode. To avoid the isolation structure being connected to the first electrode, the size of the first electrode can be reduced to be spaced apart from the isolation structure, or an insulating layer can be provided between the first electrode and the isolation structure.

[0079] For example, in some embodiments of the present disclosure, as Figure 3 and Figure 5As shown, the display panel may further include a pixel definition layer 330. The pixel definition layer 330 is located between the substrate 100 and the isolation structure 300 and defines a plurality of pixel openings 302 respectively corresponding to the isolation openings 301. The pixel openings 302 communicate with the corresponding isolation openings 301 to limit the light-emitting unit 200. For example, the orthographic projection of the pixel opening 302 on the substrate 100 is located within the orthographic projection of the corresponding isolation opening 301 on the substrate 100, and the light-emitting functional layer 220 and the second electrode 230 fill the pixel opening 302 and extend to the surface of the pixel definition layer 330 facing away from the substrate 100.

[0080] When the pixel definition layer 330 is provided in the display panel, the first electrode 210 of the light-emitting unit 200 can be designed to have a relatively large area, so as to avoid the occurrence of position deviation (errors caused by process accuracy) between the first electrode 210 and the isolation structure 300 in the actual process, which is difficult to ensure the actual light-emitting area of the light-emitting unit, thereby improving the aperture ratio (related to the light-emitting area of the light-emitting unit) and brightness of the display image of the display panel. For example, when the pixel definition layer 330 is not provided, in order to avoid the connection between the first electrode 210 and the isolation structure 300, the designed area of the first electrode 210 is limited. If the position of the first electrode 210 deviates, it may cause the light-emitting area of the light-emitting unit to be smaller than the designed area, resulting in a decrease in the brightness of the light-emitting unit.

[0081] In at least one embodiment of the present disclosure, the pixel definition layer 330 may be an inorganic layer. In the embodiment of the present disclosure, the light-emitting functional layer 220 and the second electrode 230 of the light-emitting unit 200 can be formed by evaporation based on the isolation structure 300, and the isolation structure 300 can limit the light-emitting functional layer 220 and the second electrode 230. Therefore, the pixel definition layer 330 does not need to have too large a thickness to accommodate the light-emitting functional layer 220, that is, the pixel definition layer 330 does not need to be prepared from an organic material; in addition, when the pixel definition layer 330 is an inorganic layer, it can have a relatively small thickness, so as to reduce the step difference at the edge of the pixel opening 302, improve the film layer continuity of the second electrode 230 at this position, and reduce the impedance of the second electrode 230.

[0082] In at least one embodiment of the present disclosure, such as Figure 3 and Figure 5As shown, the light-emitting units 200 can be classified as emitting light of different colors. In this case, the first sub-encapsulation layer 411 can include a plurality of first sub-encapsulation units respectively corresponding to the isolation openings 301, the second sub-encapsulation layer 412 can include a plurality of second sub-encapsulation units respectively corresponding to the isolation openings 301, and the third sub-encapsulation layer 413 can include a plurality of third sub-encapsulation units respectively corresponding to the isolation openings 301. The projections of the edges of the ends of the first sub-encapsulation units facing away from the substrate 100 on the substrate 100, the projections of the edges of the second sub-encapsulation units on the substrate 100, and the projections of the edges of the third sub-encapsulation units on the substrate 100 all coincide with each other.

[0083] It should be noted that the light-emitting units 200 with different emitted lights are independently manufactured, but the film layers (such as evaporation film layers like the light-emitting functional layer) in each light-emitting unit 200 are evaporated over the entire display panel during evaporation. For example, the light-emitting units 200 are classified as light-emitting units that emit red light (R), green light (G), and blue light (B) respectively. During the preparation process, the light-emitting units R, G, and B are prepared in sequence. When preparing the light-emitting unit R, the light-emitting unit R is formed in each isolation opening 301, and the first encapsulation layer 410 is prepared on the display panel to cover the light-emitting unit R. Then, the first encapsulation layer 410, the second electrode, and the light-emitting functional layer in some of the isolation openings 301 (used to form the light-emitting units G and B in the final product) are removed. During this process, the first encapsulation layer 410 is used to protect the light-emitting units R in other isolation openings 301 (used to form the light-emitting units R in the final product). Based on this method, the light-emitting units G and B are prepared in sequence, and finally, the first encapsulation layer 410 as shown in Figure 3 is formed, that is, the first encapsulation layer 410 on the entire display panel is obtained through multiple process steps. The first encapsulation layer 410 also forms a plurality of spaced-apart encapsulation units, and the encapsulation unit includes a first sub-encapsulation unit, a second sub-encapsulation unit, and a third sub-encapsulation unit. Correspondingly, the first encapsulation layer 410 (at this time, it is an encapsulation unit) formed in the process of preparing the light-emitting unit R will be corroded and damaged during the process of preparing the light-emitting units G and B.

[0084] It should be noted that in the embodiments of the present disclosure, the preparation sequence of the three types of light-emitting units R, G, and B is not limited and can be designed according to the actual process requirements. For example, the preparation process can also be implemented based on the sequence of light-emitting units B, G, and R.

[0085] In at least one embodiment of the present disclosure, as shown in Figure 3 and Figure 5As shown, in view of the above preparation process, the first sub-packaging unit includes a suspended portion 411a on the side of the isolation structure 300 facing away from the substrate 100, and the third sub-packaging unit covers the suspended portion 411a. For the reason of the formation of the suspended portion 411a, reference can be made to the relevant description of the preparation method of the display panel in the following embodiments, which will not be elaborated here. If the solution provided by the embodiments of the present disclosure is not adopted and the first encapsulation layer 410 is set as a single film layer, then a suspended portion will also be formed on the side of the isolation structure 300 facing away from the substrate 100. When the first encapsulation layer 410 is etched in subsequent processes, this suspended portion is obviously prone to be etched and break. When it breaks and falls off, cracks will appear in other parts of the first encapsulation layer 410 around the suspended portion, resulting in the failure of the encapsulation of the first encapsulation layer 410. In the embodiments of the present disclosure, since the first encapsulation layer 410 is designed to have a structure including at least a first sub-encapsulation layer 411, a second sub-encapsulation layer 412, and a third sub-encapsulation layer 413, the degree of etching of the first encapsulation layer 410 is reduced, thereby reducing or eliminating the risk of the suspended portion 411a of the first sub-encapsulation layer 411 breaking due to etching; in addition, at least the third sub-encapsulation layer 413 (or the second sub-encapsulation layer 412 and the third sub-encapsulation layer 413) can reinforce the first sub-encapsulation layer 411 and support the suspended portion 411a to reduce the risk of the suspended portion 411a falling off, thereby further improving the encapsulation effect of the first encapsulation layer 410.

[0086] In at least one embodiment of the present disclosure, both the first sub-encapsulation layer 411 and the third sub-encapsulation layer 413 are inorganic film layers, so as to have good density and excellent barrier function. The second sub-encapsulation layer 412 can be an organic film layer to have a relatively large thickness, so as to have a flat surface and can fill the chamber.

[0087] In at least one embodiment of the present disclosure, the second sub-encapsulation layer 412 is an adhesive layer. In this way, the bonding strength between the various film layers in the first encapsulation layer can be increased to improve the reliability of the first encapsulation layer.

[0088] In at least one embodiment of the present disclosure, the first sub-encapsulation layer 411 and the third sub-encapsulation layer 413 are made of the same material to simplify the preparation process and save costs. For example, the first sub-encapsulation layer 411 and the third sub-encapsulation layer 413 can be silicon oxide, silicon nitride, silicon oxynitride, etc.

[0089] At least one embodiment of the present disclosure provides a method for preparing a display panel, and the preparation method may include steps S110 to S150 as follows. Figure 6 Specifically as follows.

[0090] S110. Provide a substrate and form an isolation structure and a plurality of first electrodes on the substrate. The isolation structure defines a plurality of isolation openings corresponding to the first electrodes respectively.

[0091] For example, in step S110, the isolation structure can be directly prepared on the substrate; alternatively, a pixel defining layer can be prepared on the substrate, and then the isolation structure can be prepared on the pixel defining layer. The setting manner of the pixel defining layer and its positional relationship with the isolation structure can refer to the relevant descriptions in the foregoing embodiments and will not be elaborated here.

[0092] It should be noted that in step S110, the preparation sequence of the first electrode and the isolation structure is not limited. Among them, in the case where a pixel defining layer is formed in the display panel, the first electrode can be prepared on the substrate first, and then the pixel defining layer and the isolation structure can be prepared in sequence.

[0093] S120. Deposit a light-emitting functional material layer and a conductive material layer in sequence to cover the isolation structure and the isolation openings.

[0094] Both the light-emitting functional material layer and the conductive material layer are deposited in a whole layer, that is, a mask plate may not be used or an open mask plate may be used for deposition. In different steps S120, the light-emitting colors of the deposited light-emitting functional material layers are different. Specifically, it can refer to the relevant descriptions in the following Figures 7 to 11 illustrated embodiments and will not be elaborated here.

[0095] S130. Form a first encapsulation material layer, a second encapsulation material layer, and a third encapsulation material layer on the side of the conductive material layer facing away from the substrate in sequence, where the second encapsulation material layer is a planarization layer. The first encapsulation material layer, the second encapsulation material layer, and the third encapsulation material layer are used to prepare a first sub-encapsulation layer, a second sub-encapsulation layer, and a third sub-encapsulation layer in sequence. Their materials can refer to the relevant descriptions in the foregoing embodiments, and their formation manners can refer to the relevant descriptions in the following Figures 7 to 11 illustrated embodiments and will not be elaborated here.

[0096] S140. Perform a patterning process on the light-emitting functional material layer, the conductive material layer, the first encapsulation material layer, the second encapsulation material layer, and the third encapsulation material layer to remove the light-emitting functional material layer, the conductive material layer, and the first encapsulation material layer corresponding to a part of the isolation openings, so as to obtain a light-emitting functional layer, a second electrode, a first sub-encapsulation unit, a second sub-encapsulation unit, and a third sub-encapsulation unit. For example, the remaining light-emitting functional material layer forms the light-emitting functional layer, the remaining conductive material layer forms the second electrode, the remaining first encapsulation material layer forms the first sub-encapsulation unit, the remaining second encapsulation material layer forms the second sub-encapsulation unit, and the remaining third encapsulation material layer forms the third sub-encapsulation unit. The light-emitting functional layer and the second electrode and the first electrode corresponding to the isolation opening where they are located constitute a light-emitting unit. For the specific process of step S140, reference can be made to the relevant description in the following Figures 7 to 11 illustrated embodiments and will not be elaborated here.

[0097] S150. Repeat the above process of preparing the light-emitting functional layer, the second electrode, and the first sub-encapsulation unit, the second sub-encapsulation unit, and the third sub-encapsulation unit at the isolation openings where the light-emitting functional layer is not formed until a light-emitting unit, a first sub-encapsulation unit, a second sub-encapsulation unit, and a third sub-encapsulation unit are formed at each isolation opening.

[0098] For the specific structural design of the display panel obtained by the preparation method corresponding to the above steps S110 to S150, and the setting relationship of each element and other elements included in the display panel, reference can be made to the relevant description in the foregoing embodiments and will not be elaborated here.

[0099] Next, taking the display panel as shown in Figure 3 as an example, an exemplary description of the preparation method of the display panel will be given.

[0100] As shown in Figure 7 , provide a substrate 100 and form an array of first electrodes 210 on the substrate 100; deposit an insulating material film layer (such as an inorganic material film layer) on the substrate 100 on which the first electrodes 210 are formed; form a support portion 310 and a crown portion 320 on the display panel; perform a patterning process on the insulating material film layer to form a pixel defining layer 330 (the planar shape is grid-like), and the pixel defining layer 330 covers the gaps between adjacent first electrodes 210. Thus, the planar shape of the pixel defining layer 330 is grid-like.

[0101] In an embodiment of the present disclosure, the patterning process may be a photolithography patterning process. For example, it may include: coating a photoresist on a structural layer to be patterned, exposing the photoresist using a mask, developing the exposed photoresist to obtain a photoresist pattern, etching the structural layer using the photoresist pattern (optionally wet etching or dry etching), and then optionally removing the photoresist pattern. It should be noted that when the material of the structural layer (such as the following photoresist pattern 500) includes a photoresist, the structural layer can be directly exposed through a mask to form a required pattern.

[0102] As Figure 8 shown, a light-emitting functional layer 220 and a second electrode 230 are vapor-deposited on a substrate 100 to form a light-emitting unit 200 in each isolation opening 301 of the isolation structure 300. In this process, no mask is used for vapor deposition, so the vapor-deposited material will also be deposited on the crown 320. It should be noted that in an actual process, the vapor-deposited material will be deposited on the upper surface of the crown 320 facing away from the substrate 100 and the side walls (not shown in the figure); then a first sub-packaging film 411b is deposited to cover the light-emitting unit 200 and the isolation structure 300. For example, the light-emitting layer in the vapor-deposited light-emitting functional layer 220 may emit red light, that is, at this stage, a light-emitting unit 200 that emits red light is formed in each isolation opening 301 of the isolation structure 300.

[0103] As Figure 9 shown, a second sub-packaging film 412b covering the first sub-packaging film 411b is deposited.

[0104] As Figure 10 shown, a third sub-packaging film 413b covering the second sub-packaging film 412b is deposited; a photoresist is formed (such as coated) on the substrate 100 on which the first sub-packaging film 411b, the second sub-packaging film 412b, and the third sub-packaging film 413b are formed, and then a patterning process is performed on it to form a photoresist pattern 500. The photoresist pattern 500 only covers a part of the isolation openings 301 of the isolation structure 300.

[0105] As Figure 11 shown, the surface of the display panel is etched using the photoresist pattern 500 as a mask to remove the first sub-packaging film 411b, the second sub-packaging film 412b, the third sub-packaging film 413b, the second electrode 230, and the light-emitting functional layer 220 that are not covered by the photoresist pattern 500. The remaining parts of the first sub-packaging film 411b, the second sub-packaging film 412b, and the third sub-packaging film 413b respectively form a first sub-packaging layer 411, a second sub-packaging layer 412, and a third sub-packaging layer 413; then the remaining photoresist pattern 500 is removed.

[0106] During this process, an etchant (or etching gas) is used to remove the residual photoresist pattern 500. If the first encapsulation layer 410 does not have the second sub-encapsulation layer 412 to level the surface and form a depression corresponding to the isolation opening 301, the etchant (or etching gas) will obviously accumulate in this depression, which may cause excessive etching of the first encapsulation layer 410. In addition, these etchants will enter the chamber at the side wall of the support portion 310, causing damage to the first sub-encapsulation film 411b. For example, after the used etchant has etched the photoresist pattern 500, there is still residue, and this residual etchant may accumulate in the chamber. Additionally, the third sub-encapsulation layer 413 can protect the second sub-encapsulation layer 412 from being etched by the etchant (or etching gas).

[0107] Repeat the above Figures 7 to 11 steps to separately form the light-emitting unit 200 that emits green light and the light-emitting unit 200 that emits blue light in other isolation openings 301, and form a display panel as Figure 3 shown.

[0108] During the process of forming the light-emitting unit 200 that emits green light and the light-emitting unit 200 that emits blue light, there are two steps of lithography again to form the photoresist pattern 500 and remove the residual photoresist pattern 500. If there is no second sub-encapsulation layer 412 to cover the first sub-encapsulation layer 411, the etchant (or etching gas) used twice will enter the chamber at the side wall of the support portion 310 (the chamber in the isolation opening 301 corresponding to the light-emitting unit 200 that emits green light) again, causing multiple damages to the first sub-encapsulation layer 411.

[0109] As Figure 12 shown, when evaporating and depositing the light-emitting functional layer (such as the first functional layer therein), if the evaporation source P moves to be directly opposite the isolation structure 300, the positions corresponding to the boundaries of its evaporation angle on the display panel are lines L1 and L2. That is, the area between lines L1 and L2 will not be evaporated in this case, while in the area on the side of lines L1 and L2 away from the isolation structure 300, no matter where the evaporation source P moves, this area will be evaporated. That is, starting from the area of line L1 or line L2, the closer to the isolation structure 300, the smaller the thickness of the light-emitting functional layer.

[0110] In at least one embodiment of the present disclosure, as Figure 13As shown in the figure, the display panel may further include a second encapsulation layer 420 and a third encapsulation layer 430. The second encapsulation layer 420 is located on the side of the first encapsulation layer 410 away from the substrate 100 and covers the first encapsulation layer 410 and the isolation structure 300. The third encapsulation layer 430 is located on the side of the second encapsulation layer 420 away from the substrate 100. Optionally, the second encapsulation layer 420 is a planarization layer. Optionally, the second encapsulation layer 420 is an organic film layer, and the third encapsulation layer 430 is an inorganic film layer. Optionally, the second encapsulation layer 420 and the third encapsulation layer 430 are continuous film layers. The second encapsulation layer 420 can improve the flatness of the surface of the display panel, so as to facilitate the setting of other components on the encapsulation layer. In addition, the second encapsulation layer 420 can have a certain flexibility to relieve the stress of the first encapsulation layer 410 and the third encapsulation layer 430, thereby improving the reliability of the display panel and being more conducive to the application of the display panel in the flexible display field. In addition, the third encapsulation layer 430 has high density, has a high barrier effect on water, oxygen, etc., and the third encapsulation layer 430 has higher strength, so as to facilitate the preparation of other components (such as structures related to touch control functions, optical film layers, etc.) thereon.

[0111] In at least one embodiment of the present disclosure, as Figure 13 shown, the substrate 100 may include a substrate and a driving circuit layer located on the substrate. The driving circuit layer includes a plurality of pixel driving circuits located in the display area, and the display function layer is located on the driving circuit layer. For example, the pixel driving circuit may include a plurality of transistors TFTs, capacitors, etc., and is formed in various forms such as 2T1C (i.e., 2 transistors (TFTs) and 1 capacitor (C)), 3T1C or 7T1C. The pixel driving circuit is connected to the light-emitting unit 200 to control the on / off state and the light-emitting brightness of the light-emitting unit 200.

[0112] At least one embodiment of the present disclosure provides a display device, and the display device may include the display panel in the above embodiments. For example, the display device may include structures such as a touch control structure, optical film sheets (such as microlenses, polarizers), and a cover plate provided on the light-emitting side of the display panel

[0113] For example, the display device may be any product or component with a display function such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, a navigator, etc.

[0114] The above are only the preferred embodiments of this specification and are not intended to limit this specification. Any modifications, equivalent replacements, etc. made within the spirit and principle of this specification shall be included within the protection scope of this specification.

Claims

1. A display panel, characterized in that, include: substrate; A display function layer, located on the substrate and comprising a plurality of light-emitting units; An isolation structure, located on the substrate and defining a plurality of isolation openings, wherein the light emitting unit is located in the isolation openings; as well as The first encapsulation layer is located on a side of the display function layer away from the substrate and comprises at least a first sub-encapsulation layer, a second sub-encapsulation layer and a third sub-encapsulation layer stacked in sequence, wherein the second sub-encapsulation layer is a planarization layer.

2. The display panel according to claim 1, characterized in that, In the edge region of the isolation opening, the first sub-packaging layer surrounds a cavity with an open opening, and the second sub-packaging layer fills the cavity.

3. The display panel according to claim 1 or 2, characterized in that, The first sub-packaging layer includes a plurality of first sub-packaging units respectively corresponding to the isolation openings, the second sub-packaging layer includes a plurality of second sub-packaging units respectively corresponding to the isolation openings, the third sub-packaging layer includes a plurality of third sub-packaging units respectively corresponding to the isolation openings, and An orthographic projection of an edge of an end portion of the first sub-packaging unit facing away from the substrate on the substrate coincides with an orthographic projection of an edge of the third sub-packaging unit on the substrate.

4. The display panel according to claim 3, characterized in that, The first sub-packaging unit includes a suspended portion located at a side of the isolation structure away from the substrate, and the third sub-packaging unit covers the suspended portion.

5. The display panel according to claim 4, characterized in that, The first sub-encapsulation layer and the third sub-encapsulation layer are inorganic film layers, and the second sub-encapsulation layer is an organic film layer.

6. The display panel according to claim 5, characterized in that, The second sub-encapsulation layer is a glue layer.

7. The display panel according to claim 5, characterized in that, The first sub-encapsulation layer and the third sub-encapsulation layer are made of the same material.

8. The display panel according to claim 3, characterized in that, An orthographic projection of one end of the isolation structure facing the substrate on the substrate is located within an orthographic projection of one end of the isolation structure facing away from the substrate on the substrate.

9. The display panel according to claim 8, characterized in that, The light-emitting unit includes a first electrode, a light-emitting functional layer and a second electrode stacked in sequence on the substrate, the light-emitting functional layer and the second electrode are located within the isolation opening, and at least a portion of the isolation structure is configured as a conductive structure and connected to the second electrode.

10. The display panel according to claim 9, characterized in that, The edge of the light-emitting functional layer is spaced apart from the isolation structure.

11. The display panel according to claim 10, characterized in that, The isolation structure includes a support portion and a crown portion, wherein the support portion is located between the crown portion and the substrate, and an orthographic projection of the support portion on the substrate is located within an orthographic projection of the crown portion on the substrate.

12. The display panel according to claim 11, characterized in that, The orthographic projection of the edge of the end of the first sub-package unit facing away from the substrate on the substrate, the orthographic projection of the edge of the second sub-package unit on the substrate and the orthographic projection of the edge of the third sub-package unit on the substrate coincide with each other, and the surface of the second sub-package unit facing away from the substrate is a plane; or, A distance from a portion of a surface of the third sub-packaging unit facing away from the substrate and corresponding to a center of the light-emitting unit to the substrate is greater than or equal to a distance from a surface of the crown facing the substrate to the substrate.

13. The display panel according to claim 12, characterized in that, A surface of the second sub-packaging unit facing away from the substrate is coplanar with a surface of the crown portion facing the substrate.

14. The display panel according to claim 12, characterized in that, A portion of a surface of the third sub-packaging unit that is away from the substrate and corresponds to a center of the light-emitting unit is coplanar with a surface of the crown that faces the substrate.

15. The display panel according to claim 11, characterized in that, At least a portion of the support portion is a conductive structure.

16. The display panel according to claim 11, characterized in that, In a cross-section perpendicular to the substrate, the cross-sectional shape of the portion of the support part located between adjacent isolation openings is a regular trapezoid. The support part is provided as a conductive structure, and the second electrode is connected to the side wall of the support part; Or The support part includes a first support layer and a second support layer. The first support layer is located between the substrate and the second support layer. The orthographic projection of the second support layer on the substrate is located within the orthographic projection of the first support layer on the substrate. The orthographic projection of the first support layer on the substrate is located within the orthographic projection of the crown part on the substrate. The first support layer is a conductive structure, and the second electrode is connected to the portion of the surface of the first support layer facing away from the substrate that is not covered by the second support layer. Further preferably, the second support layer is a conductive structure, and the second electrode is connected to the side wall of the second support layer.

17. The display panel according to claim 10, wherein, Further includes: A pixel defining layer, located between the substrate and the isolation structure, and defining a plurality of pixel openings respectively corresponding to the isolation openings; Wherein, the pixel openings communicate with the corresponding isolation openings to limit the light-emitting unit; Preferably, the pixel defining layer is an inorganic layer.

18. The display panel according to claim 1 or 2, wherein, Further includes: A second encapsulation layer, located on the side of the first encapsulation layer facing away from the substrate and covering the first encapsulation layer and the isolation structure; And A third encapsulation layer, located on the side of the second encapsulation layer facing away from the substrate; Preferably, the second encapsulation layer is a planarization layer; Preferably, the second encapsulation layer is an organic film layer, and the third encapsulation layer is an inorganic film layer; Preferably, the second encapsulation layer and the third encapsulation layer are continuous film layers.

19. A display device, wherein, Including the display panel according to any one of claims 1 to 18.

20. A method for manufacturing a display panel, wherein, Including: Providing a substrate and forming an isolation structure and a plurality of first electrodes on the substrate, wherein the isolation structure defines a plurality of isolation openings respectively corresponding to the first electrodes; Sequentially depositing a light-emitting functional material layer and a conductive material layer to cover the isolation structure and the isolation openings; Forming a first encapsulation material layer, a second encapsulation material layer, and a third encapsulation material layer in sequence on the side of the conductive material layer facing away from the substrate, wherein the second encapsulation material layer is a planarization layer; Performing a patterning process on the light-emitting functional material layer, the conductive material layer, the first encapsulation material layer, the second encapsulation material layer, and the third encapsulation material layer to remove the light-emitting functional material layer, the conductive material layer, the first encapsulation material layer, the second encapsulation material layer, and the third encapsulation material layer corresponding to part of the isolation openings. Wherein, the remaining light-emitting functional material layer forms a light-emitting functional layer, the remaining conductive material layer forms a second electrode, the remaining first encapsulation material layer forms a first sub-encapsulation unit, the remaining second encapsulation material layer forms a second sub-encapsulation unit, the remaining third encapsulation material layer forms a third sub-encapsulation unit, and the light-emitting functional layer and the second electrode and the first electrode corresponding to the isolation opening where they are located constitute a light-emitting unit; and Repeat the processes of preparing the light-emitting functional layer, the second electrode, the first sub-packaging unit, the second sub-packaging unit, and the third sub-packaging unit at the isolation opening where the light-emitting functional layer is not formed until the light-emitting unit, the first sub-packaging unit, the second sub-packaging unit, and the third sub-packaging unit are formed at each isolation opening. Among them, the light-emitting unit constitutes the display functional layer, the first sub-packaging unit constitutes the first sub-packaging layer, the second sub-packaging unit constitutes the second sub-packaging layer, the third sub-packaging unit constitutes the third sub-packaging layer, and the first sub-packaging layer, the second sub-packaging layer, and the third sub-packaging layer constitute the first packaging layer.

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