Three-temperature test equipment and radio frequency chip test method based on positioning

Abstract

The invention relates to a radio frequency chip three-temperature testing device, in particular to a three-temperature testing device and a radio frequency chip testing method based on positioning, the three-temperature testing device comprises a sealing machine cover, an XYZ gantry material taking mechanism is arranged in the sealing machine cover, and a mounting cylinder is arranged on the XYZ gantry material taking mechanism; an air cylinder is installed in the installation barrel, an adsorption part is arranged on a telescopic rod of the air cylinder, a negative pressure assembly is arranged on the adsorption part, and in the process that the air cylinder pushes the adsorption part to be close to the radio frequency chip, the adsorption part can firstly cover and suck the radio frequency chip; when the negative pressure assembly is triggered, the suction force of the suction part on the radio frequency chip can be increased; a driving assembly is further arranged on the mounting cylinder, the driving assembly is connected with a clamping assembly arranged on the adsorption part through a linkage structure, and in the action process of the telescopic rod, the driving assembly drives the clamping assembly to deflect relative to the adsorption part, so that the radio frequency chip adsorbed by the adsorption part is clamped.

Description

Technical Field

[0001] The present invention relates to a three-temperature testing device for radio frequency chips, specifically a three-temperature testing device and a radio frequency chip testing method based on positioning. Background Art

[0002] Due to the rapid development of automotive electronics currently, there are mandatory high and low temperature experiment requirements for automotive-grade chips, and at the same time, clear requirements for the three-temperature testing of aerospace and military devices are put forward. Since the volume of radio frequency chips is very small and the manufacturing process is complex, faulty radio frequency chips may be produced. Therefore, before the radio frequency chips are put into use, it is usually necessary to test the radio frequency chips to ensure the quality of the radio frequency chips; the conventional three-temperature testing machine uses a medium to conduct heating or cooling to the chips through physical contact. Each time the material is taken out of the carrier tray and then placed on the three-temperature platform, heating or cooling is conducted through the contact conduction of the platform.

[0003] Currently, in three-temperature testing, due to the very small volume and complex manufacturing process of radio frequency chips, when taking out or placing the chips, it is usually necessary for personnel to manually pick them up. Since the testing will be carried out at high and low temperature states, it is easy for the operator to get frostbite and scald when picking up the chips; in addition, some three-temperature testing devices are provided with clamps. When these clamps pick up the chips, the clamping force on the chips needs to be very precise to avoid damaging the radio frequency chips. Such clamps require high costs and need to be synchronized with precision components such as pressure sensors. These precision components are extremely vulnerable to temperature and the surrounding environment. When the sensor components are affected, the clamping force of the clamp on the chips will deviate, which is very likely to damage the chips, resulting in problems such as low testing efficiency. Summary of the Invention

[0004] The purpose of the present invention is to provide a three-temperature testing device and a radio frequency chip testing method based on positioning to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions: A three-temperature testing device includes: a sealed machine cover, an XYZ gantry material taking mechanism is arranged inside the sealed machine cover, a moving box body is arranged on the XYZ gantry material taking mechanism, a storage material lifting mechanism is arranged on the moving box body, and an installation cylinder is arranged on the storage material lifting mechanism; A cylinder is installed inside the installation cylinder. An adsorbing member is arranged on the telescopic rod of the cylinder. A negative pressure assembly is arranged on the adsorbing member. During the process of the cylinder pushing the adsorbing member towards the RF chip, the adsorbing member can first cover and suck the RF chip. Along with the continuous movement of the adsorbing member, the negative pressure assembly is triggered, and the sucking force of the adsorbing member on the RF chip can be increased, so that when the cylinder resets, the RF chip can move along with the adsorbing member. A driving assembly is further arranged on the installation cylinder. The driving assembly is connected to a clamping assembly arranged on the adsorbing member through a linkage structure. During the movement of the telescopic rod, the driving assembly can drive the clamping assembly to deflect relative to the adsorbing member, so as to clamp the RF chip adsorbed by the adsorbing member.

[0006] The three-temperature testing device as described above: The adsorbing member includes a fixed cylinder fixedly arranged on the telescopic rod. A suction cup is fixedly arranged at one end of the fixed cylinder away from the installation cylinder.

[0007] The three-temperature testing device as described above: The negative pressure assembly includes a triggering structure and a suction structure. The triggering structure includes an elastic trigger and a passive member. The elastic trigger includes a plugging cylinder fixedly arranged on the telescopic rod. A first spring is slidably arranged inside the plugging cylinder. One end of the first spring abuts against the plugging cylinder, and the other end abuts against a plugging rod slidably arranged inside the plugging cylinder. A trigger block is fixedly arranged at one end of the plugging rod facing the installation cylinder, and a butting disc is fixedly arranged at the other end.

[0008] The three-temperature testing device as described above: The passive member includes a passive block. The passive block is slidably connected to a T-shaped rod fixed on the telescopic rod. A guiding plate is fixedly arranged on the passive block, and an inclined groove is formed on the guiding plate.

[0009] The three-temperature testing device as described above: The suction structure includes a suction cylinder fixedly arranged on the fixed cylinder. The suction cylinder is internally communicated with the inside of the fixed cylinder through a connecting pipe. A suction rod is hermetically slidably arranged inside the fixed cylinder. A piston disc is fixedly arranged at one end of the suction rod facing the suction cup, and a sliding rod is fixedly arranged at the other end. The sliding rod is slidably arranged inside the inclined groove.

[0010] The three-temperature testing device as described above: The clamping assembly includes a deflecting clamping rod rotatably installed on the fixed cylinder. Two groups of deflecting clamping rods are equidistantly arranged along the circumferential direction of the fixed cylinder. Each group of deflecting clamping rods is connected to the driving assembly through a linkage structure.

[0011] The three-temperature testing device as described above: The driving assembly includes a driving rod rotatably mounted on the mounting cylinder. There are two sets of the driving rods. A socket cylinder is sleeved on each set of the driving rods. A protrusion is formed on the inner wall of the socket cylinder. The protrusion is slidably arranged in a fitting groove body opened on the outer wall of the driving rod. And the driving rod is connected to a transmission rod rotatably mounted on the mounting cylinder through a bevel gear set.

[0012] The three-temperature testing device as described above: The fitting groove body includes a spiral groove opened on the outer wall of the driving rod. The two ends of the spiral groove are respectively connected with a first vertical groove and a second vertical groove.

[0013] The three-temperature testing device as described above: The linkage structure includes a second connecting plate hinged to the deflection clamping rod. One end of the second connecting plate away from the deflection clamping rod is rotatably mounted with a linkage rod. A first connecting plate is rotatably mounted on the linkage rod. One end of the first connecting plate away from the linkage rod is rotatably connected to the transmission rod. And the linkage rod is respectively connected to the transmission rod and the deflection clamping rod through a first linkage belt and a second linkage belt.

[0014] A radio frequency chip testing method based on positioning, adopting the three-temperature testing device as described above, includes the following steps: Step 1: Before the test, dry air at -20°C is filled into the air inlet hole of the sealed machine cover. After being filled, it is discharged from the exhaust hole to form a circulating air flow. The temperature control host blows and heats or cools the storage three-temperature box and the test three-temperature box synchronously. After reaching the test conditions, the storage three-temperature box and the test three-temperature box start to work. Step 2: After the test conditions are reached, the XYZ gantry material taking mechanism controls the storage lifting mechanism to move above the material bin and grabs the radio frequency chips in the material bin. One: The air cylinder pushes the fixed cylinder to approach the radio frequency chip. During the approaching process, the driving assembly can drive the deflection clamping rod to open. The suction cup can cover and adsorb the radio frequency chip. At the same time, the radio frequency chip makes contact extrusion with the abutting disc. Two: The abutting disc is squeezed, forcing the negative pressure assembly to move. Subsequently, the suction cylinder further increases the negative pressure value of the suction cup, thereby enhancing the adsorption ability of the suction cup to the radio frequency chip. Three: Subsequently, the air cylinder retracts. During this process, the driving assembly can drive the deflection clamping rods to approach each other, thereby clamping the radio frequency chip and preventing the radio frequency chip from separating from the suction cup during the moving process. Step 3: The XYZ gantry material taking mechanism drives the storage lifting mechanism to move to the upper side of the test three-temperature box. Subsequently, the air cylinder pushes the fixed cylinder. During this process, the driving assembly acts first to open the deflection clamping rod, and then the triggering structure releases the locking of the negative pressure assembly. Immediately, the suction cylinder resets, causing the radio frequency chip to fall into the test three-temperature box.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: An independent temperature-controlled three-temperature storage box and a three-temperature test box are adopted, combined with the blowing heating / cooling function (-70°C to +160°C) of the temperature control host, to simulate the performance of the RF chip under different working conditions. Through the design of circulating air flow and sealed machine cover, the temperature field is ensured to be uniform and stable, significantly improving the reliability and consistency of test results.

[0016] By using the linkage control of the XYZ gantry material taking mechanism, the moving box body, and the storage lifting mechanism, the full process automation of the RF chip from grasping, transferring, testing to resetting in the storage bin is realized. Through the cooperation of the air cylinder-driven suction accessory and the negative pressure component, when the suction cup deforms to generate a basic negative pressure, the suction cylinder further increases the negative pressure value in the suction cup through the mechanical transmission of the sliding rod and the inclined groove, so that the suction cup can stably adsorb the RF chip. The dual protection mechanism ensures the adsorption stability of the chip in the environment of high-speed movement and sudden temperature change. In addition, after the negative pressure component completes the adsorption operation, the limiting part and the induction structure cooperate to lock the state of the negative pressure component, preventing the first spring from rebounding and causing the negative pressure to disappear, so that the RF chip and the suction cup maintain a stable connection, reducing manual intervention and operation errors, and improving the test efficiency.

[0017] At the same time, by setting the driving component and the clamping component, and using the mechanical linkage cooperation between the two, when the suction cup descends, the deflecting clamping rod is driven to open to avoid the chip; during the subsequent rising process of the suction cup, the deflecting clamping rod is gradually tightened through the cooperation of the fitting groove body and the protrusion, so that the deflecting clamping rod maintains the clamping state and the clamping claw is located below the RF chip, ensuring that the chip is stably fixed to the suction cup during the transfer process, effectively avoiding the risk of chip falling off caused by equipment vibration. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic structural diagram of a three-temperature test device.

[0019] Figure 2 It is a schematic structural diagram inside the sealed machine cover of the three-temperature test device.

[0020] Figure 3 It is a schematic structural diagram of the moving box body in the three-temperature test device.

[0021] Figure 4 It is a schematic structural diagram of the storage lifting mechanism in the three-temperature test device.

[0022] Figure 5 It is a schematic structural diagram of the other side of the storage lifting mechanism in the three-temperature test device.

[0023] Figure 6 It is a schematic structural diagram inside the installation cylinder of the three-temperature test device.

[0024] Figure 7 It is a schematic structural diagram of the interior of a fixed cylinder in a three-temperature testing device.

[0025] Figure 8 It is a schematic structural diagram of a negative pressure component in a three-temperature testing device.

[0026] Figure 9 It is a schematic structural diagram of a suction structure in a three-temperature testing device.

[0027] Figure 10 It is a schematic structural diagram of a passive part in a three-temperature testing device.

[0028] Figure 11 It is a schematic structural diagram of an elastic trigger structure in a three-temperature testing device.

[0029] Figure 12 It is a schematic structural diagram of a linkage structure in a three-temperature testing device.

[0030] Figure 13 It is a schematic structural diagram of a driving component in a three-temperature testing device.

[0031] Figure 14 It is a schematic structural diagram of a fitting groove body in a three-temperature testing device.

[0032] Figure 15 It is a schematic structural diagram of a socket cylinder in a three-temperature testing device.

[0033] In the figure: 1. Sealing machine cover; 2. Air inlet hole; 3. Exhaust hole; 4. XYZ gantry material taking mechanism; 5. Testing mechanism; 6. Testing three-temperature box; 7. Storage three-temperature box; 8. Bin; 9. Temperature control main unit; 10. Switch valve; 11. Moving box body; 12. Installation cylinder; 13. Fixed cylinder; 1301. Suction cup; 14. Storage lifting mechanism; 15. Telescopic rod; 1501. Sliding groove; 1502. T-shaped rod; 1503. Installation part; 16. Deflection clamping rod; 17. Suction cylinder; 18. Driving rod; 1801. First vertical groove; 1802. Spiral groove; 1803. Second vertical groove; 19. Cylinder; 20. Socket cylinder; 2001. Protrusion; 21. Guide plate; 2101. Inclined groove; 22. Passive block; 2201. Trigger surface; 2202. T-shaped groove; 23. Trigger block; 2301. Abutting surface; 24. Insertion cylinder; 25. Insertion rod; 2501. Abutting disc; 26. Suction rod; 2601. Slide bar; 27. Limiting part; 28. Limiting plate; 29. First spring; 30. Bevel gear set; 31. Linkage rod; 32. First connecting plate; 33. First linkage belt; 34. Second linkage belt; 35. Second connecting plate; 36. Connecting rod; 37. Transmission rod; 38. Second spring. Specific implementation manner

[0034] Various exemplary embodiments, features, and aspects of the present application will be described in detail below with reference to the accompanying drawings. The same reference numerals in the drawings denote elements having the same or similar functions. Although various aspects of the embodiments are shown in the drawings, the drawings do not have to be drawn to scale unless otherwise specified.

[0035] As used herein, the term "exemplary" means "serving as an example, embodiment, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as superior to or better than other embodiments.

[0036] In addition, for a better illustration of the present application, numerous specific details are given in the following specific embodiments. Those skilled in the art should understand that the present application can be implemented without some of these specific details. In some instances, methods, means, and elements well known to those skilled in the art are not described in detail so as to highlight the gist of the present application.

[0037] Please refer to Figures 1-15 , in an embodiment of the present invention, a three-temperature testing device includes: A sealed machine cover 1, inside which an XYZ gantry material taking mechanism 4 is provided. A moving box body 11 is provided on the XYZ gantry material taking mechanism 4. A storage material lifting mechanism 14 is provided on the moving box body 11. An installation cylinder 12 is provided on the storage material lifting mechanism 14. Specifically, please refer to Figure 1 、 Figure 2 , an air inlet hole 2 and an exhaust hole 3 are provided on the above-mentioned sealed machine cover 1. A material bin 8, a storage material three-temperature box 7, a test three-temperature box 6, and a temperature control host 9 are provided inside the sealed machine cover 1. The temperature control host 9 is connected to a switch valve 10. Before the test, dry air at -20°C is filled into the sealed machine cover 1 through the air inlet hole 2, and after being filled, it is discharged from the exhaust hole 3 to form a circulating air flow. The temperature control host 9 and the switch valve 10 cooperate to simultaneously blow air and heat (+160°C) or refrigerate (-70°C) the storage material three-temperature box 7 and the test three-temperature box 6. After reaching the test conditions, the storage material three-temperature box 7 and the test three-temperature box 6 start to work, and can store or work on the RF chip at different temperatures, so as to perform quality inspection on the RF chip.

[0038] When the test conditions are met, the XYZ gantry material taking mechanism 4 controls the storage material lifting mechanism 14 to move above the material bin 8 to grab the RF chip in the material bin 8. Subsequently, the grabbed RF chip is driven by the XYZ gantry material taking mechanism 4 and moves towards the test three-temperature box 6. During the movement, the test mechanism 5 can position the RF chip and place it into the test three-temperature box 6. Subsequently, the temperature control host 9 controls the temperature of the test three-temperature box 6, and the final test result will be fed back to the temperature control host 9. Then, the temperature control host 9 stores the test result and controls the test three-temperature box 6 to end the test.

[0039] A cylinder 19 is installed inside the installation cylinder 12. An adsorbing member is arranged on the telescopic rod 15 of the cylinder 19, and a negative pressure assembly is arranged on the adsorbing member. During the process of the cylinder 19 pushing the adsorbing member towards the RF chip, the adsorbing member can first cover and suck the RF chip. Along with the continuous movement of the adsorbing member, the negative pressure assembly is triggered, and the sucking force of the adsorbing member on the RF chip can be increased, so that when the cylinder 19 resets, the RF chip can move along with the adsorbing member; The adsorbing member includes a fixed cylinder 13 fixedly arranged on the telescopic rod 15, and a suction cup 1301 is fixedly arranged at one end of the fixed cylinder 13 away from the installation cylinder 12; Please refer to Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 , in the initial state, the telescopic rod 15 is in a retracted state. After the moving box body 11 moves above the material bin 8, the cylinder 19 starts to act, and then the telescopic rod 15 pushes the fixed cylinder 13 towards the RF chip in the material bin 8. Along with the continuous approach of the fixed cylinder 13, the suction cup 1301 can first contact the RF chip and cover the upper part thereof (the suction cup 1301 can completely cover the RF chip). Subsequently, the suction cup 1301 continues to descend and contacts the platform for placing the RF chip, and the negative pressure generated by the deformation can adsorb the RF chip. In this way, when the moving box body 11 is driven by the XYZ gantry material taking mechanism 4 to move, the RF chip can be driven to move synchronously, and finally the transfer action of the RF chip is completed.

[0040] Further, please refer to Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 、 Figure 9 、 Figure 10 、 Figure 11 , the negative pressure assembly includes a triggering structure and a suction structure. The triggering structure includes an elastic triggering member and a passive member. The elastic triggering member includes a plugging cylinder 24 fixedly arranged on the telescopic rod 15. A first spring 29 is slidably arranged inside the plugging cylinder 24. One end of the first spring 29 abuts against the plugging cylinder 24, and the other end abuts against a plugging rod 25 slidably arranged inside the plugging cylinder 24. A triggering block 23 is fixedly arranged at one end of the plugging rod 25 facing the installation cylinder 12, and a butting disc 2501 is fixedly arranged at the other end; Specifically, the above-mentioned first spring 29 is always in a compressed energy storage state. The first spring 29 in the compressed state can push the abutting disc 2501 away from the mounting cylinder 12, and make the trigger block 23 contact with the fixed cylinder 13. And the above-mentioned insertion rod 25 is slidably arranged in the chute 1501 opened on the telescopic rod 15. Refer to Figure 11 , due to the connection relationship between the trigger block 23 and the insertion rod 25, the insertion rod 25 can only slide in the axial direction of the telescopic rod 15.

[0041] The passive part includes a passive block 22, the passive block 22 is slidably connected with a T-shaped rod 1502 fixed on the telescopic rod 15, and a guide plate 21 is fixedly arranged on the passive block 22, and an inclined groove 2101 is opened on the guide plate 21; It should be added that, please refer to Figure 8 , Figure 9 , Figure 10 , a T-shaped groove 2202 is opened on the above-mentioned passive block 22, and the T-shaped groove 2202 cooperates with the T-shaped rod 1502, so that the passive block 22 can only slide in the radial direction of the fixed cylinder 13; And both the passive block 22 and the trigger block 23 are set into a "right trapezoid" - like structure, and the inclined surfaces are respectively set into a trigger surface 2201 and an abutting surface 2301.

[0042] The suction structure includes a suction cylinder 17 fixedly arranged on the fixed cylinder 13. The suction cylinder 17 is internally communicated with the fixed cylinder 13 through a connecting pipe. And a suction rod 26 is hermetically slidably arranged in the fixed cylinder 13. One end of the suction rod 26 facing the suction cup 1301 is fixedly provided with a piston disc, and the other end is fixedly provided with a sliding rod 2601. The sliding rod 2601 is slidably arranged in the inclined groove 2101; Specifically, please refer to Figure 9 , a second spring 38 is also sleeved on the above-mentioned suction rod 26. One end of the second spring 38 abuts against the piston disc, and the other end abuts against the upper bottom surface of the suction cylinder 17. In the initial state, the second spring 38 is in a compressed energy storage state. At this time, the piston disc abuts against the lower bottom surface of the suction cylinder 17, and the sliding rod 2601 is located at the stroke end of the inclined groove 2101 far from the passive block 22; Combined with the above, in the initial state, the trigger block 23 and the passive block 22 are far away from each other. When the suction cup 1301 is driven by the cylinder 19 to move closer to the RF chip, the abutting disc 2501 contacts the RF chip. Subsequently, with the continuous approach of the suction cup 1301, the extrusion force generated by the RF chip on the abutting disc 2501 can force the trigger block 23 to move towards the passive block 22. In this process, the trigger surface 2201 can first contact the abutting surface 2301. Subsequently, the contact extrusion force generated by the trigger surface 2201 on the abutting surface 2301 can force the passive block 22 to drive the guide plate 21 to move towards the right (refer toFigure 8 (Description). At this time, the extrusion force exerted by the chute wall of the inclined chute 2101 on the sliding rod 2601 can force the suction rod 26 to rise. At this moment, the suction cylinder 17 can increase the negative pressure value generated by the suction cup 1301, thereby increasing the adsorption force of the suction cup 1301 on the RF chip; In addition, when the cylinder 19 controls the fixed cylinder 13 to descend to the lowest height, the rising height of the trigger block 23 reaches the maximum. At this time, the limit member 27 provided on the fixed cylinder 13 receives the induction and can drive the limit plate 28 inside the limit member 27 to protrude outward. The protruding limit plate 28 can block the trigger block 23, thereby preventing the trigger block 23 from retracting under the action of the elastic potential energy stored in the first spring 29, ensuring that the suction cup 1301 always maintains a negative pressure state, and preventing the RF chip from detaching from the suction cup 1301 due to oscillation when the moving box body 11 moves.

[0043] Furthermore, a driving component is also provided on the mounting cylinder 12. The driving component is connected to the clamping component provided on the suction attachment through a linkage structure. During the movement of the telescopic rod 15, the driving component can drive the clamping component to deflect relative to the suction attachment, thereby clamping the RF chip adsorbed by the suction attachment; The clamping component includes a deflecting clamping rod 16 rotatably mounted on the fixed cylinder 13. Two groups of deflecting clamping rods 16 are equidistantly arranged along the circumferential direction of the fixed cylinder 13, and each group of deflecting clamping rods 16 is connected to the driving component through a linkage structure; The driving component includes a driving rod 18 rotatably mounted on the mounting cylinder 12. There are two groups of driving rods 18. A socket cylinder 20 is sleeved on each group of driving rods 18. A protrusion 2001 is formed on the inner wall of the socket cylinder 20. The protrusion 2001 is slidably arranged in the fitting groove formed on the outer wall of the driving rod 18, and the driving rod 18 is connected to a transmission rod 37 rotatably mounted on the mounting cylinder 12 through a bevel gear set 30; Specifically, please refer to Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 12 、 Figure 13 、 Figure 14 Above, the two groups of socket cylinders 20 are connected to a mounting member 1503 fixedly arranged on the telescopic rod 15 through a connecting rod 36. With the cooperation of the mounting member 1503 and the connecting rod 36, the socket cylinder 20 can only move up and down along the axial direction of the driving rod 18; In addition, the above bevel gear set 30 includes a first bevel gear and a second bevel gear. The first bevel gear is coaxially fixed to the drive rod 18, and the second bevel gear is coaxially fixed to the transmission rod 37. When the telescopic rod 15 acts, the protrusion 2001 on the inner wall of the socket cylinder 20 cooperates with the fitting groove body, which can force the drive rod 18 to rotate. At the same time, the rotating drive rod 18 can drive the deflecting clamping rod 16 to adsorb on the suction cup 1301 under the cooperation of the bevel gear set 30 and the linkage structure.

[0044] For details, please refer to Figure 14 , the fitting groove body includes a spiral groove 1802 formed on the outer wall of the drive rod 18, and both ends of the spiral groove 1802 are respectively connected with a first vertical groove 1801 and a second vertical groove 1803; The linkage structure includes a second connecting plate 35 hinged to a convex shaft integrally provided at one end of the deflecting clamping rod 16. A linkage rod 31 is rotatably installed at one end of the second connecting plate 35 away from the deflecting clamping rod 16. A first connecting plate 32 is rotatably installed on the linkage rod 31. One end of the first connecting plate 32 away from the linkage rod 31 is rotatably connected to the transmission rod 37, and the linkage rod 31 is respectively connected to the transmission rod 37 and the convex shaft at one end of the deflecting clamping rod 16 through a first linkage belt 33 and a second linkage belt 34; Specifically, the first linkage belt 33 connects the transmission rod 37 and the linkage rod 31, and the second linkage belt 34 connects the linkage rod 31 and the convex shaft; When the transmission rod 37 rotates, the first linkage belt 33 can drive the linkage rod 31 to rotate. The linkage rod 31 then drives the convex shaft to rotate through the second linkage belt 34, and finally the deflecting clamping rod 16 rotates around the convex shaft; when the two symmetrically arranged clamping rods 16 rotate around the convex shafts at their respective ends and separate from each other, the opening action is performed; correspondingly, when the two clamping rods 16 rotate around the convex shafts at their respective ends and approach each other, the closing action is performed.

[0045] Combined with the above structure, in the initial state, the protrusion 2001 is located at the end of the stroke of the first vertical groove 1801 away from the spiral groove 1802, and the two sets of deflecting clamping rods 16 are in a clamping state. When the cylinder 19 pushes the fixed cylinder 13 towards the RF chip, the mounting member 1503 and the connecting rod 36 pull the socket cylinder 20 to descend along the axial direction of the telescopic rod 15. During this process, the protrusion 2001 first slides along the first vertical groove 1801; subsequently, the protrusion 2001 is combined with the spiral groove 1802. As the telescopic rod 15 continues to descend, the protrusion 2001 cooperates with the spiral groove 1802 to drive the drive rod 18 to rotate clockwise (taking Figure 12Taking the left drive rod 18 as an example, the right drive rod 18 moves in the reverse direction). Subsequently, under the action of the bevel gear set 30 and the linkage structure, the drive rod 18 drives the deflection clamping rod 16 to rotate clockwise, so that the two groups of deflection clamping rods 16 open to the maximum angle (after the protrusion 2001 is separated from the spiral groove 1802); thereafter, the protrusion 2001 slides along the second vertical groove 1803, and the deflection clamping rod 16 maintains the open state.

[0046] At the same time, the suction cup 1301 completes the negative pressure adsorption of the RF chip through the cooperation of the negative pressure component and the limiting member 27. When the telescopic rod 15 descends to the lowest position, the suction cup 1301 completes the suction of the RF chip.

[0047] Subsequently, the air cylinder 19 pulls the telescopic rod 15 to retract. During the retraction process, the suction cup 1301 drives the RF chip to rise. The protrusion 2001 first slides along the second vertical groove 1803 until it combines with the spiral groove 1802; when continuing to retract, the protrusion 2001 cooperates with the spiral groove 1802 to drive the deflection clamping rod 16 to close, realizing the clamping of the RF chip on the suction cup 1301. After the protrusion 2001 is separated from the spiral groove 1802, the deflection clamping rod 16 is completely tightened, and then the protrusion 2001 slides along the first vertical groove 1801 to the initial position. At this time, the deflection clamping rod 16 maintains the clamping state and the clamping claw is located below the RF chip, further preventing the chip from separating from the suction cup 1301.

[0048] When the telescopic rod 15 returns to the initial position, the XYZ gantry picking mechanism 4 drives the moving box body 11 to move towards the three-temperature test box 6. When the test mechanism 5 detects that the RF chip sucked by the suction cup 1301 moves to directly above the three-temperature test box 6, the XYZ gantry picking mechanism 4 stops operating; subsequently, the air cylinder 19 pushes the suction cup 1301 to descend to the lowest position. The drive assembly first drives the deflection clamping rod 16 to release the RF chip, and then the limiting member 27 is controlled by the test mechanism 5 to retract the limiting plate 28. The first spring 29 releases elastic potential energy to push the abutting disc 2501 and the trigger block 23 to descend, synchronously driving the second spring 38 to reset the suction rod 26. After the negative pressure disappears, the RF chip detaches from the suction cup 1301 and falls into the three-temperature test box 6.

[0049] When the RF chip is placed in the three-temperature test box 6, the air cylinder 19 retracts to drive the deflection clamping rod 16 to reset, and the XYZ gantry picking mechanism 4 drives the moving box body 11 to return above the material bin 8 again. After the current batch of three-temperature test box 6 completes the work and the internal chips are taken out, the air cylinder 19 repeats the above operation process until all RF chips are tested.

[0050] A method for testing RF chips based on positioning, using the three-temperature testing device as described above, includes the following steps: Step 1: Before the test, fill the sealed machine cover 1 with dry air at -20°C through the air inlet hole 2. After filling, discharge it from the exhaust hole 3 to form a circulating air flow. The temperature control main unit 9 blows and heats (+160°C) or cools (-70°C) the material storage three-temperature box 7 and the test three-temperature box 6 simultaneously. After reaching the test conditions, the material storage three-temperature box 7 and the test three-temperature box 6 start to work; Step 2: After the test conditions are reached, the XYZ gantry material taking mechanism 4 controls the material storage lifting mechanism 14 to move above the material bin 8 and grab the RF chips in the material bin 8: (In the initial state, the cylinder 19 retracts, and the deflection clamping rods 16 approach each other); One: The cylinder 19 pushes the fixed cylinder 13 towards the RF chip. During the approaching process, the driving component can drive the deflection clamping rods 16 to open, and the suction cup 1301 can cover and adsorb the RF chip. At the same time, the RF chip makes contact extrusion with the abutting disc 2501; Two: The abutting disc 2501 is squeezed, forcing the negative pressure component to move. Subsequently, the suction cylinder 17 further increases the negative pressure value of the suction cup 1301, thereby enhancing the adsorption capacity of the suction cup 1301 for the RF chip; Three: Subsequently, the cylinder 19 retracts. During this process, the driving component can drive the deflection clamping rods 16 to approach each other, thereby clamping the RF chip and preventing the RF chip from separating from the suction cup 1301 during the moving process; Step 3: The XYZ gantry material taking mechanism 4 drives the material storage lifting mechanism 14 to move to the upper side of the test three-temperature box 6. Subsequently, the cylinder 19 pushes the fixed cylinder 13. During this process, the driving component first acts to open the deflection clamping rods 16, and then the triggering structure releases the lock on the negative pressure component. Immediately, the suction cylinder 17 resets, causing the RF chip to fall into the test three-temperature box 6.

[0051] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0052] In addition, it should be understood that although this specification is described according to the embodiments, not every embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A three-temperature testing device, characterized in that, Comprising: A sealing hood, inside which an XYZ gantry material taking mechanism is arranged, on which a moving box body is arranged, on which a material storage lifting mechanism is arranged, and on which an installation cylinder is arranged; A cylinder is installed in the installation cylinder, an adsorbing member is arranged on the telescopic rod of the cylinder, and a negative pressure assembly is arranged on the adsorbing member. During the process of the cylinder pushing the adsorbing member towards the RF chip, the adsorbing member can first cover and adsorb the RF chip. Along with the continuous movement of the adsorbing member, the negative pressure assembly is triggered, and the adsorbing force of the adsorbing member on the RF chip can be increased, so that when the cylinder resets, the RF chip can move along with the adsorbing member; A driving assembly is further arranged on the installation cylinder, and the driving assembly is connected to a clamping assembly arranged on the adsorbing member through a linkage structure. During the movement of the telescopic rod, the driving assembly can drive the clamping assembly to deflect relative to the adsorbing member, so as to clamp the RF chip adsorbed by the adsorbing member.

2. The three-temperature testing device according to claim 1, characterized in that, The adsorbing member includes a fixed cylinder fixedly arranged on the telescopic rod, and a suction cup is fixedly arranged at one end of the fixed cylinder away from the installation cylinder.

3. The three-temperature testing device according to claim 2, characterized in that, The negative pressure assembly includes a triggering structure and a suction structure. The triggering structure includes an elastic triggering member and a passive member. The elastic triggering member includes a plugging cylinder fixedly arranged on the telescopic rod, a first spring is slidably arranged in the plugging cylinder, one end of the first spring abuts against the plugging cylinder, and the other end abuts against a plugging rod slidably arranged in the plugging cylinder. A triggering block is fixedly arranged at one end of the plugging rod facing the installation cylinder, and a butting disc is fixedly arranged at the other end.

4. The three-temperature testing device according to claim 3, characterized in that, The passive member includes a passive block, the passive block is slidably connected to a T-shaped rod fixed on the telescopic rod, and a guiding plate is fixedly arranged on the passive block, and an inclined groove is formed on the guiding plate.

5. The three-temperature testing device according to claim 4, characterized in that, The suction structure includes a suction cylinder fixedly arranged on the fixed cylinder, the suction cylinder is communicated with the inside of the fixed cylinder through a connecting pipe, and a suction rod is slidably arranged in the fixed cylinder in a sealed manner. A piston disc is fixedly arranged at one end of the suction rod facing the suction cup, and a sliding rod is fixedly arranged at the other end, and the sliding rod is slidably arranged in the inclined groove.

6. The three-temperature testing device according to claim 2, characterized in that, The clamping assembly includes a deflecting clamping rod rotatably installed on the fixed cylinder. Two groups of deflecting clamping rods are arranged at equal intervals along the circumferential direction of the fixed cylinder, and each group of deflecting clamping rods is connected to the driving assembly through a linkage structure.

7. The three-temperature testing device according to claim 6, characterized in that, The driving assembly includes a driving rod rotatably installed on the installation cylinder. There are two groups of driving rods, and a socket cylinder is sleeved on each driving rod. A protrusion is formed on the inner wall of the socket cylinder, and the protrusion is slidably arranged in a fitting groove body formed on the outer wall of the driving rod. The driving rod is connected to a transmission rod rotatably installed on the installation cylinder through a bevel gear set.

8. The three-temperature testing device according to claim 7, characterized in that, The fitting groove body includes a spiral groove formed on the outer wall of the driving rod, and the two ends of the spiral groove are respectively connected with a first vertical groove and a second vertical groove.

9. The three-temperature testing device according to claim 7, characterized in that, The linkage structure includes a second connecting plate hinged to the deflection clamping rod, a linkage rod is rotatably installed on one end of the second connecting plate away from the deflection clamping rod, a first connecting plate is rotatably installed on the linkage rod, an end of the first connecting plate away from the linkage rod is rotatably connected to the transmission rod, and the linkage rod is respectively connected to the transmission rod and the deflection clamping rod through a first linkage belt and a second linkage belt.

10. A method for testing a radio frequency chip based on positioning, using the three-temperature testing device according to claim 1, characterized in that, The steps include: Step 1: Before the test, -20℃ dry air is filled into the air inlet of the sealed hood, and then discharged from the exhaust hole to form a circulating airflow. The temperature control host simultaneously blows air to heat or cool the three-temperature storage box and the three-temperature test box. After the test conditions are met, the three-temperature storage box and the three-temperature test box start working; Step 2: After the test conditions are met, the XYZ gantry material picking mechanism controls the material storage lifting mechanism to move to the top of the silo to grab the RF chip in the silo; One: The cylinder pushes the fixed cylinder toward the RF chip. During the approach process, the driving component can drive the deflection clamping rod to open, and the suction cup can cover and adsorb the RF chip. At the same time, the RF chip contacts and squeezes the abutment plate; Second: The contact plate is squeezed, forcing the negative pressure component to move, and then the suction cylinder further increases the negative pressure value of the suction cup, thereby enhancing the suction cup's ability to adsorb the RF chip; 3. Then, the cylinder retracts. During this process, the driving assembly can drive the deflected clamping rods to move closer to each other, thereby clamping the RF chip and preventing the RF chip from being separated from the suction cup during the movement. Step 3: The XYZ gantry material picking mechanism drives the material storage lifting mechanism to move to the upper side of the test three-temperature box, and then the cylinder pushes the fixed cylinder. During this process, the drive component first moves to open the deflection clamping rod, and then the trigger structure releases the lock on the negative pressure component, and then the suction cylinder is reset, causing the RF chip to fall into the test three-temperature box.

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