An integrated control system for solid-state lasers

Abstract

This application relates to the field of solid-state laser technology, and more particularly to an integrated control system for a solid-state laser. The system comprises a first PCB board, a second PCB board, and a third PCB board; the first PCB board is integrated with a main control unit, a communication unit, and an ADC unit; the second PCB board is provided with a temperature acquisition unit and a temperature control drive unit; and the third PCB board is provided with a PWM modulation unit, a radio frequency modulation unit, a current detection unit, and a constant current drive unit. This application achieves unified coordination and regulation of control while reducing the size of the solid-state laser.

Description

Technical Field

[0001] The present application relates to the technical field of solid-state lasers, and in particular to an integrated control system for solid-state lasers. Background Art

[0002] Solid-state lasers are currently widely used in high-precision applications such as industrial processing, precision measurement, and medical equipment. These applications place high demands on the stability of their output beams, their modulation capabilities, and their overall temperature control accuracy. To achieve coordinated control of multiple core parameters, such as the laser's emission state, modulation waveform, and operating temperature, it is often necessary to build a multi-module, multi-path data processing and signal control chain.

[0003] Existing solid-state laser control systems typically employ a separate functional module structure, where the temperature control module, current drive module, and modulation module operate independently, with state adjustment achieved through an external controller or manually set parameters. This multi-module separation not only increases the size of the solid-state laser but also hinders the laser control system's unified scheduling and state perception of each functional module, leaving room for improvement. Summary of the Invention

[0004] The present application provides an integrated control system for a solid-state laser, which can achieve unified coordination and regulation of control while reducing the volume of the solid-state laser.

[0005] The above-mentioned invention objective of this application is achieved through the following technical solutions:

[0006] An integrated control system for a solid-state laser, comprising:

[0007] A first PCB board, connected to a second PCB board via an I²C interface, and connected to a third PCB board via an SPI interface, the first PCB board integrating a main control unit for coordinating task scheduling of each unit and issuing control signals, a communication unit for communicating with a host computer, and an ADC unit for collecting analog feedback signals;

[0008] The second PCB board is provided with a temperature acquisition unit for collecting temperature data of the laser component and a temperature control drive unit for driving the TEC cooling plate to adjust the temperature;

[0009] The third PCB board is provided with a PWM modulation unit for outputting a PWM control signal, a radio frequency modulation unit for converting the PWM signal into a radio frequency pulse signal to drive an acousto-optic Q switch, a current detection unit for supplying and sampling feedback of the pump laser current, and a constant current drive unit for controlling the constant current output of the pump laser.

[0010] By adopting this technical solution, the main control unit, communication unit, and ADC unit are integrated on the first PCB board, the temperature acquisition unit and temperature control drive unit are placed on the second PCB board, and the PWM modulation unit, RF modulation unit, current detection unit, and constant current drive unit are integrated on the third PCB board. These units are connected via I²C and SPI interfaces, achieving the integration of temperature control, modulation control, and current control functions. Compared with separate modules, this improves the compactness of the control structure, thereby reducing the size of the laser. This also reduces the layout difficulty of the solid-state laser and improves space utilization efficiency.

[0011] In a preferred example, the present application may be further configured as follows: after completing temperature data acquisition, the temperature acquisition unit on the second PCB board transmits the temperature data to the first PCB board.

[0012] By adopting the above technical solution, the temperature of the laser component is detected by the temperature acquisition unit and uploaded to the first PCB board, so that the main control unit can accurately obtain the thermal status of the laser component, thereby providing reliable data support for subsequent temperature control judgment and closed-loop control.

[0013] In a preferred example, the present application can be further configured as follows: the main control unit is used to:

[0014] Calculating a temperature deviation value based on the temperature data and the target temperature data;

[0015] Based on the PID adjustment algorithm, a temperature control value is calculated according to the temperature deviation value, and a corresponding PWM duty cycle value is generated according to the temperature control value;

[0016] A first control signal is generated according to the temperature deviation value and the PWM duty cycle value.

[0017] By adopting the above technical solution, the main control unit calculates the temperature deviation based on the temperature data and the target temperature data, and calculates the temperature control value based on the PID adjustment algorithm and generates the PWM duty cycle value, which can achieve dynamic response and precise adjustment of the temperature deviation, thereby improving the sensitivity and stability of temperature control.

[0018] In a preferred example, the present application may be further configured as follows: the first PCB board sends the first control signal to the temperature control driving unit on the second PCB board;

[0019] The temperature control driving unit is used to adjust the current direction and power of the TEC cooling plate according to the first control signal.

[0020] By adopting the above technical solution, a first control signal is sent to the temperature control drive unit, and the current direction and power of the TEC cooling plate are adjusted according to the first control signal. It is possible to switch between heating and cooling modes under different temperature deviation conditions, and flexibly adjust the power according to the strength of the control signal, thereby ensuring that the laser is in a constant temperature operating state and improving the emission accuracy and life stability.

[0021] In a preferred example, the present application may be further configured as follows: the third PCB board obtains the preset PWM parameters sent by the first PCB board;

[0022] The PWM modulation unit is configured to generate a PWM signal according to the preset PWM parameters and send the PWM signal to the RF modulation unit;

[0023] The radio frequency modulation unit is used to perform frequency multiplication processing on the PWM signal to generate a high-frequency radio frequency signal, and perform power amplification processing on the high-frequency radio frequency signal to generate a radio frequency pulse signal.

[0024] By adopting the above technical solution, the PWM parameters sent by the first PCB board are received by the third PCB board, and the PWM modulation unit generates a PWM signal and transmits it to the RF modulation unit for frequency multiplication and amplification processing, and then outputs it as an RF pulse signal. This can achieve flexible control and high-frequency output of the laser modulation signal, thereby enhancing the accuracy and timing controllability of the laser pulse.

[0025] In a preferred example, the present application can be further configured as follows: the main control unit is also used to:

[0026] Determine whether the laser is in a laser emission working mode; if the laser is in the laser emission working mode, control the relay in the radio frequency modulation unit to be turned on, so that the radio frequency pulse signal is output to the acousto-optic Q switch to achieve pulse modulation of the laser output beam.

[0027] By adopting the above technical solution, the main control unit determines whether the laser is in the laser emission working mode, and controls the relay in the RF modulation unit to conduct, so that the RF pulse signal is output to the acousto-optic Q switch. This can achieve precise pulse control of the laser output in the laser emission working mode, thereby ensuring the timing consistency of the laser modulation process and the adaptability to application scenarios.

[0028] In a preferred example, the present application may be further configured as follows: the current detection unit on the third PCB board includes a current sampling resistor connected in series with the constant current driving path of the pump laser, and a current detection amplifier connected to both ends of the current sampling resistor;

[0029] The current detection amplifier is used to amplify the voltage drop generated on the current sampling resistor to obtain an analog voltage signal, and transmit the analog voltage signal to the first PCB board.

[0030] By adopting the above technical solution, a current sampling resistor and a voltage amplifier are set through the current detection unit, and the sampled voltage drop signal is converted into an analog voltage signal and transmitted to the first PCB board. This can achieve real-time sampling and high-precision amplification of the working current of the pump laser, thereby providing an accurate current feedback basis for the main control unit and ensuring the stability of current control.

[0031] In a preferred example, the present application can be further configured as follows: the main control unit is also used to:

[0032] Based on the reference data of the ADC unit and according to the analog voltage signal, an actual operating current value of the pump laser is calculated;

[0033] Calculating a current deviation value according to the actual working current value and the target current value;

[0034] Based on the proportional control algorithm, a current control value is calculated according to the current deviation value, and a second control signal is generated according to the current control value.

[0035] By adopting the above technical solution, the main control unit calculates the actual working current value based on the reference data of the ADC unit, and after comparing it with the target current value to obtain the current deviation, a proportional control algorithm is used to generate a current control value and a second control signal. This can realize dynamic closed-loop judgment and rapid adjustment of the current of the pump laser, thereby preventing the unstable laser output caused by current drift or deviation.

[0036] In a preferred example, the present application may be further configured as follows: the first PCB board sends the second control signal to the constant current driving unit on the third PCB board;

[0037] The constant current driving unit is used to adjust the output current of the pump laser according to the second control signal.

[0038] By adopting the above technical solution, the second control signal is sent to the constant current drive unit of the third PCB board through the first PCB board, and the output current of the pump laser is adjusted accordingly. The drive current can be dynamically adjusted according to real-time feedback changes, thereby maintaining long-term stable operation of the laser and improving the consistency and reliability of laser output.

[0039] In summary, this application includes at least one of the following beneficial technical effects:

[0040] 1. The main control unit, communication unit, and ADC unit are integrated on the first PCB board, the temperature acquisition unit and temperature control drive unit are placed on the second PCB board, and the PWM modulation unit, RF modulation unit, current detection unit, and constant current drive unit are integrated on the third PCB board. They are connected via I²C and SPI interfaces, realizing the integration of temperature control, modulation control, and current control functions. Compared with separate modules, this improves the compactness of the control structure, thereby reducing the size of the laser. At the same time, it reduces the layout difficulty of the solid-state laser and improves space utilization efficiency.

[0041] 2. The main control unit calculates the temperature deviation based on the temperature data and the target temperature data, calculates the temperature control value based on the PID adjustment algorithm, and generates the PWM duty cycle value, which can achieve dynamic response and precise adjustment of the temperature deviation, thereby improving the sensitivity and stability of temperature control;

[0042] 3. The main control unit determines whether the laser is in the laser emission mode and controls the relay in the RF modulation unit to conduct, so that the RF pulse signal is output to the acousto-optic Q switch. This enables precise pulse control of the laser output in the laser emission mode, thereby ensuring the timing consistency of the laser modulation process and the adaptability of the application scenario.

[0043] 4. The main control unit calculates the actual working current value based on the reference data of the ADC unit, and compares it with the target current value to obtain the current deviation. Then, a proportional control algorithm is used to generate the current control value and the second control signal. This can realize dynamic closed-loop judgment and rapid adjustment of the current of the pump laser, thereby preventing unstable laser output caused by current drift or deviation. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 It is a structural diagram of an integrated control system for a solid-state laser in an embodiment of the present application.

[0045] Figure 2 It is a flow chart of temperature control of an integrated control system for a solid-state laser in an embodiment of the present application.

[0046] Figure 3 It is a flow chart of modulation control of an integrated control system for a solid-state laser in an embodiment of the present application.

[0047] Figure 4 It is a flow chart of current control for an integrated control system of a solid-state laser in an embodiment of the present application. DETAILED DESCRIPTION

[0048] The following examples will help those skilled in the art further understand the purpose of this application, but are not intended to limit this application in any form. It should be noted that those skilled in the art may make several modifications and improvements without departing from the scope of this application. These modifications and improvements are all within the scope of this application.

[0049] In the following description, specific details such as specific system structures and techniques are provided for purposes of illustration rather than limitation to facilitate a thorough understanding of the embodiments of the present application. However, it will be apparent to those skilled in the art that the present application may be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid obscuring the description of the present application with unnecessary detail.

[0050] It should be understood that when used in the present specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or collections thereof.

[0051] An integrated control system for a solid-state laser, comprising:

[0052] A first PCB board, connected to the second PCB board via an I²C interface, and connected to the third PCB board via an SPI interface. The first PCB board integrates a main control unit for coordinating task scheduling and control signal distribution among various units, a communication unit for communicating with a host computer, and an ADC unit for collecting analog feedback signals.

[0053] A second PCB board is provided with a temperature acquisition unit for collecting temperature data of the laser component and a temperature control drive unit for driving the TEC cooling plate to adjust the temperature;

[0054] The third PCB board is provided with a PWM modulation unit for outputting a PWM control signal, an RF modulation unit for converting the PWM signal into an RF pulse signal to drive the acousto-optic Q switch, a current detection unit for supplying and sampling feedback of the pump laser current, and a constant current drive unit for controlling the constant current output of the pump laser.

[0055] Specifically, the first PCB board serves as the main control board and establishes a communication connection with the second PCB board through an I²C interface. The I²C interface is composed of a clock signal line SCL and a data signal line SDA. The main control unit on the first PCB board serves as the I²C master device to control the communication process. During the operation of the laser, the main control unit periodically reads the sampling data of the temperature acquisition unit from the second PCB board through the SDA line, and at the same time sends a temperature control signal to the second PCB board through the SDA line according to the current temperature control requirements. For example, the operating frequency of the I²C interface can be set to 400kHz to meet the sampling stability and real-time requirements. The main control unit performs subsequent temperature adjustment based on the collected temperature data.

[0056] More specifically, the first PCB board establishes a high-speed data communication path with the third PCB board through an SPI interface. The SPI interface includes a serial clock line SCLK, a master output slave input line MOSI, a master input slave output line MISO, and a chip select signal line CS. The main control unit, as an SPI master device, initiates PWM modulation parameter writing and data reading operations. The PWM modulation parameters are sent to the PWM modulation unit of the third PCB board through the MOSI line. The chip select signal line CS is used to select the target unit. The PWM modulation unit generates a PWM signal with a specified frequency and duty cycle according to the received parameters and outputs it to the RF modulation unit. The RF modulation unit multiplies the PWM signal and amplifies the power to form an RF pulse signal. The RF pulse signal is used to drive the acousto-optic Q switch to modulate the laser pulse. Furthermore, the current detection unit on the third PCB is connected in series with the pump laser's power supply path via a current sampling resistor. The voltage drop across the current sampling resistor is fed into an amplifier for differential amplification and output as an analog voltage signal. This analog voltage signal is then transmitted via a connecting pin to the ADC unit on the first PCB for analog-to-digital conversion. Based on this sampled data, the main control unit determines whether the pump laser current is within a set range. If there is a deviation, the main control unit outputs a voltage or PWM control signal to the constant current drive unit on the third PCB to adjust the pump laser's constant output current value, thereby achieving real-time closed-loop current control. The first PCB also includes a communication unit, which communicates with the host computer via a UART serial port or RS232 interface to upload operating status and receive parameter configurations. The main control unit updates control parameters based on received instructions and manages the operating status of the second and third PCBs in real time.

[0057] In some embodiments, the temperature acquisition unit on the second PCB board transmits the temperature data to the first PCB board after completing temperature data acquisition.

[0058] Specifically, the temperature acquisition unit on the second PCB board is equipped with multiple NTC thermistors. Each thermistor achieves temperature detection by being mounted on a heating device such as a doubled frequency crystal, a tripled frequency crystal, or a pump laser housing. The thermistor is connected in series in a voltage divider circuit. When the device temperature changes, its resistance changes, causing the output voltage at the divider point to change accordingly. The output voltage is converted into a digital value corresponding to the current temperature through analog-to-digital conversion. This digital value is transmitted to the first PCB board via the SCL and SDA signal lines. The main control unit of the first PCB board, as the I²C master device, initiates a temperature data read request in each temperature control processing cycle and receives the temperature values ​​of each channel uploaded by the second PCB board. After completing the reception, the main control unit writes the set of temperature data into the status buffer and makes temperature adjustment judgments based on the subsequent control logic.

[0059] In some embodiments, the main control unit is used to:

[0060] According to the temperature data and the target temperature data, the temperature deviation value is calculated;

[0061] Based on the PID adjustment algorithm, the temperature control value is calculated according to the temperature deviation value, and the corresponding PWM duty cycle value is generated according to the temperature control value;

[0062] A first control signal is generated according to the temperature deviation value and the PWM duty cycle value.

[0063] Specifically, after the main control unit completes the numerical comparison between the current temperature value uploaded by the second PCB board and the preset target temperature value, it uses the calculated temperature deviation value as the input variable to call the PID adjustment algorithm function for real-time calculation. The PID algorithm uses the proportional Kp, integral Ki and differential Kd coefficients to build a regulation model. The proportional term is used to reflect the direct response of the current deviation, the integral term is used to measure the cumulative deviation trend of the deviation in history, and the differential term is used to predict the rate of temperature change. The three calculation results are weighted and summed to obtain a floating-point temperature control value. The temperature control value itself does not have a direct driving function, but rather represents the strength and weakness of the current required adjustment. The main control unit makes adjustments based on the temperature control value. Normalization is performed, limiting it to the set control range and linearly mapping it to the duty cycle value required for PWM control. The mapping process converts the control value proportionally to a duty coefficient between 0 and 1, and then multiplies it by the PWM cycle length to obtain the high-level duration of the PWM signal, thereby determining the duty cycle parameter of the target PWM waveform. The main control unit then constructs a data structure containing the temperature deviation value, PWM frequency parameter, duty cycle parameter, start flag bit and check bit, and encapsulates it as the first control signal to drive the subsequent temperature control unit to perform the adjustment action. This control signal is generated during the main control task scheduling cycle and output to the target interface according to the temperature control adjustment channel to ensure that the PWM waveform can accurately reflect the PID adjustment intention.

[0064] In some embodiments, the first PCB board sends the first control signal to the temperature control driving unit on the second PCB board;

[0065] The temperature control driving unit is used to adjust the current direction and power of the TEC cooling plate according to the first control signal.

[0066] Specifically, after constructing the first control signal, the first PCB board transmits a control signal containing a temperature deviation value, PWM frequency, and duty cycle parameters to the second PCB board via an I²C communication interface. The I²C transmission utilizes a master-slave architecture, with the master control unit on the first PCB initiating a write control signal and specifying a target register address. Upon receiving the first control signal, the temperature-controlled drive unit on the second PCB board analyzes the PWM parameters and controls the conduction timing of the MOSFET switch on the second PCB board based on the duty cycle parameters, thereby adjusting the voltage polarity and duty cycle applied to the TEC cooling plate. The switch conducts when the duty cycle is high and turns off when the duty cycle is low. The temperature-controlled drive unit determines the average drive power across the TEC cooling plate based on the ratio of the duration of the PWM high and low levels. It also controls the direction of the output voltage to determine whether the TEC operates in cooling or heating mode. The temperature-controlled drive unit periodically receives the PWM control parameters and updates the output state, allowing the cooling and heating effects generated by the TEC cooling plate to dynamically respond to the first control signal, thereby achieving stable temperature regulation of the laser operating area.

[0067] For example, when the temperature deviation value is greater than 0, that is, the current detected temperature is higher than the target value, the direction bit is set to "cooling", and the temperature control drive unit controls the current to act on the TEC cooling plate in a first polarity to start the cooling state. When the temperature deviation value is less than 0, that is, the current temperature is lower than the target value, the direction bit is set to "heating", and the temperature control drive unit switches the current direction to the second polarity to trigger the TEC plate to enter the heating state. The PWM duty cycle parameter in the control signal is used to adjust the intensity of the current adjustment action. If the temperature deviation is large, the duty cycle is set higher to provide stronger cooling or heating output. If the temperature is close to the target, the duty cycle is reduced to achieve gentle adjustment. The temperature control drive unit refreshes the output logic in real time according to the control signal, so that the TEC cooling plate switches between the heating and cooling working modes and maintains the temperature closed-loop control effect.

[0068] In some embodiments, the third PCB board obtains the preset PWM parameters sent by the first PCB board;

[0069] The PWM modulation unit is used to generate a PWM signal according to preset PWM parameters and send the PWM signal to the RF modulation unit;

[0070] The radio frequency modulation unit is used to perform frequency multiplication processing on the PWM signal to generate a high-frequency radio frequency signal, and to perform power amplification processing on the high-frequency radio frequency signal to generate a radio frequency pulse signal.

[0071] Specifically, the first PCB board will contain preset PWM parameters of PWM modulation frequency value and duty cycle value, and the preset PWM parameters will be sent to the third PCB board through the SPI interface. After receiving the preset PWM parameters, the PWM modulation unit will immediately update its internal timer configuration, set the PWM cycle time length according to the frequency value, set the high level duration within the cycle according to the duty cycle, and output a square wave signal, namely the PWM signal. The PWM signal is a digital control signal with a set frequency and duty cycle. The PWM signal is then input into the RF modulation unit. The RF modulation unit first multiplies the frequency of the PWM waveform to increase it to a predetermined RF frequency range. For example, a PWM signal of several MHz is converted into a 150MHz high-frequency signal through a frequency multiplier in the RF modulation unit, and then the power amplifier unit in the RF modulation unit performs a signal amplitude enhancement operation. The enhanced signal is an RF pulse signal, which is used to drive the subsequent acousto-optic Q switch to perform laser pulse modulation.

[0072] In some embodiments, the main control unit is further configured to:

[0073] Determine whether the laser is in the laser emission working mode; if the laser is in the laser emission working mode, control the relay in the RF modulation unit to be turned on, so that the RF pulse signal is output to the acousto-optic Q switch to achieve pulse modulation of the laser output beam.

[0074] Specifically, after completing the PWM parameter issuance and RF modulation preparation, the main control unit further determines whether the laser is currently in the laser emission mode. The judgment operation is completed by reading the system status register, the operating mode flag, or an external trigger signal. When the detection result confirms that the laser is in the emission mode, the main control unit outputs a relay control instruction to the RF modulation unit. This instruction is sent to the relay drive circuit in the RF modulation unit through the SPI channel or the digital IO control line. The drive circuit controls the contact switching state of the RF relay, switching the output path originally in the closed or load state to the control channel connected to the acousto-optic Q-switch, so that the RF pulse signal is conducted to the input end of the acousto-optic Q-switch within the specified time window. When the acousto-optic Q-switch receives the RF pulse signal, the acousto-optic effect causes its crystal to diffract the beam, controlling the output on-off rhythm of the laser to form a nanosecond pulse modulation signal. The main control unit controls the relay on and off timing according to the modulation requirements to ensure that the laser output meets the emission requirements of periodic pulses or adjustable duty cycle. The relay on-control action is controlled by the main control interrupt program or the timed task scheduling mechanism to ensure the timing accuracy and power stability of the pulse output.

[0075] In some embodiments, the current detection unit on the third PCB board includes a current sampling resistor connected in series with a constant current driving path of the pump laser, and a current detection amplifier connected to both ends of the current sampling resistor;

[0076] The current detection amplifier is used to amplify the voltage drop generated on the current sampling resistor to obtain an analog voltage signal, and transmit the analog voltage signal to the first PCB board.

[0077] Specifically, the current detection unit on the third PCB board includes a constant current drive path of the pump laser, wherein the current sampling resistor is connected in series with the constant current drive path of the pump laser. The resistor is selected as a low-resistance, high-precision sampling-specific resistor, which is used to generate a small voltage drop when the constant current drive output current flows through it. The voltage drop signal forms a differential voltage across the resistor and is connected to the input end of the pre-amplifier of the current detection unit. The amplifier adopts an instrument amplifier structure with a high common-mode rejection ratio. Its function is to amplify the small voltage difference across the current sampling resistor to a level range suitable for ADC sampling. The amplified signal is a linear analog voltage value, and its amplitude is proportional to the actual current of the pump laser. The analog voltage signal is output from the third PCB board to the ADC unit pin of the first PCB board via a connecting pin. The ADC unit performs an analog-to-digital conversion operation on the analog signal and converts it into a digital voltage value for reading by the main control unit. The main control unit further calculates the actual operating current of the pump laser based on this voltage value for executing the current feedback regulation process. The amplifier gain parameter, resistor value and ADC reference voltage in the entire sampling chain are pre-calibrated and written into the program data to ensure that the current detection accuracy is within the engineering allowable range.

[0078] In some embodiments, the main control unit is further configured to:

[0079] Based on the reference data of the ADC unit, the actual operating current value of the pump laser is calculated according to the analog voltage signal;

[0080] The current deviation value is calculated based on the actual working current value and the target current value;

[0081] Based on the proportional control algorithm, a current control value is calculated according to the current deviation value, and a second control signal is generated according to the current control value.

[0082] Specifically, after receiving the analog voltage signal corresponding to the pump laser current sampled by the ADC unit, the main control unit performs denormalization conversion on the sampled value according to the ADC reference voltage range and the sampling bit number to obtain the actual value of the current sampling voltage. Then, the actual operating current value of the pump laser is calculated according to Ohm's law in combination with the amplification factor of the current detection amplifier and the resistance parameter of the current sampling resistor. The operating current value is used as the current feedback value and compared with the preset target current value in real time. The current deviation value between the two is calculated as the basis for adjustment judgment. The main control unit calls the proportional control algorithm to calculate the current adjustment amount based on the current deviation value. The proportional control algorithm linearly amplifies the deviation amount into the adjustment signal output amplitude through the set gain coefficient Kp. This calculation process is performed once within each current feedback sampling cycle, and the output adjustment result is the current control value. The main control unit generates a second control signal based on the current control value. The control signal can encode the adjustment amplitude information in the form of PWM or analog voltage. The second control signal is sent to the constant current drive unit in the third PCB board to keep the pump laser current near the desired value and achieve closed-loop stability.

[0083] In some embodiments, the first PCB board sends the second control signal to the constant current driving unit on the third PCB board;

[0084] The constant current driving unit is used to adjust the output current of the pump laser according to the second control signal.

[0085] Specifically, after the first PCB board completes the generation of the second control signal, it sends the adjustment signal containing the current control instruction to the third PCB board through the SPI interface. The second control signal is encapsulated in the SPI communication format and contains the PWM duty cycle parameter or analog voltage amplitude corresponding to the current control value. After the constant current drive unit on the third PCB board receives the control signal, it determines whether it is a PWM signal or analog quantity adjustment according to the signal type, and calls the corresponding output path to perform current regulation operation. When the control signal is in PWM mode, the constant current drive unit sets the high and low level duration of the internal PWM modulation circuit according to the received duty cycle value, and adjusts the constant current output path by adjusting the pulse width control mode. The conduction ratio of the power devices in the circuit makes the average driving current obtained by the pump laser respond dynamically with the change of the control signal. When the control signal is an analog voltage, the constant current drive unit inputs it to the reference end of the voltage-controlled current source unit, and changes the current limiting characteristics of the source device in the output path by adjusting the reference level, thereby realizing linear current regulation. In the above two regulation modes, the constant current drive unit continuously accepts the control parameters issued by the main control in a closed-loop control manner and updates the output current in real time, so that the pump laser maintains a stable operating current and has the ability to automatically adjust with load changes. The regulation process is cyclically driven with high-frequency sampling and refresh rhythm to ensure the dynamic stability of the control response.

[0086] Those skilled in the art will clearly understand that for the sake of convenience and brevity of description, only the above-mentioned functional units and the division of units are used as examples. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and units as needed, that is, the internal structure of the device can be divided into different functional units or units to complete all or part of the functions described above.

[0087] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. An integrated control system for a solid-state laser, characterized in that: include: A first PCB board, connected to a second PCB board via an I²C interface, and connected to a third PCB board via an SPI interface, the first PCB board integrating a main control unit for coordinating task scheduling of each unit and issuing control signals, a communication unit for communicating with a host computer, and an ADC unit for collecting analog feedback signals; The second PCB board is provided with a temperature acquisition unit for collecting temperature data of the laser component and a temperature control drive unit for driving the TEC cooling plate to adjust the temperature; The third PCB board is provided with a PWM modulation unit for outputting a PWM control signal, a radio frequency modulation unit for converting the PWM signal into a radio frequency pulse signal to drive an acousto-optic Q switch, a current detection unit for supplying and sampling feedback of the pump laser current, and a constant current drive unit for controlling the constant current output of the pump laser; Wherein, the main control unit is used to: Calculating a temperature deviation value based on the temperature data and the target temperature data; Based on the PID adjustment algorithm, a temperature control value is calculated according to the temperature deviation value, and a corresponding PWM duty cycle value is generated according to the temperature control value; generating a first control signal according to the temperature deviation value and the PWM duty cycle value; The third PCB board obtains the preset PWM parameters sent by the first PCB board; The PWM modulation unit is configured to generate a PWM signal according to the preset PWM parameters and send the PWM signal to the RF modulation unit; The radio frequency modulation unit is used to perform frequency multiplication processing on the PWM signal to generate a high-frequency radio frequency signal, and perform power amplification processing on the high-frequency radio frequency signal to generate a radio frequency pulse signal; The current detection unit on the third PCB board includes a current sampling resistor connected in series with the constant current driving path of the pump laser, and a current detection amplifier connected to both ends of the current sampling resistor; The current detection amplifier is used to amplify the voltage drop generated on the current sampling resistor to obtain an analog voltage signal, and transmit the analog voltage signal to the first PCB board; The main control unit is also used to: Based on the reference data of the ADC unit, and according to the analog voltage signal, an actual operating current value of the pump laser is calculated; Calculating a current deviation value according to the actual working current value and the target current value; Based on the proportional control algorithm, a current control value is calculated according to the current deviation value, and a second control signal is generated according to the current control value.

2. The integrated control system for solid-state laser according to claim 1, characterized in that: After completing temperature data collection, the temperature collection unit on the second PCB board transmits the temperature data to the first PCB board.

3. The integrated control system for solid-state laser according to claim 1, characterized in that: The first PCB board sends the first control signal to the temperature control driving unit on the second PCB board; The temperature control driving unit is used to adjust the current direction and power of the TEC cooling plate according to the first control signal.

4. The integrated control system for solid-state laser according to claim 1, characterized in that: The main control unit is also used to: Determine whether the laser is in a laser emission working mode; if the laser is in the laser emission working mode, control the relay in the radio frequency modulation unit to be turned on, so that the radio frequency pulse signal is output to the acousto-optic Q switch to achieve pulse modulation of the laser output beam.

5. The integrated control system for solid-state laser according to claim 1, characterized in that: The first PCB board sends the second control signal to the constant current driving unit on the third PCB board; The constant current driving unit is used to adjust the output current of the pump laser according to the second control signal.

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