Movement module and infrared imaging device

Abstract

The invention provides a machine core module and an infrared imaging device, relates to the technical field of infrared thermal imaging machine cores, and aims to improve the heat dissipation condition of a small-size infrared machine core. The machine core module comprises at least two circuit boards and at least two spacing boards. The circuit boards and the spacing boards are arranged in a staggered mode in the optical axis direction of the machine core module. Connector slots are formed in the spacing boards, connectors are arranged on the circuit boards, and every two adjacent circuit boards are connected through the connectors penetrating through the connector slots of the spacing boards. And the positions of the connector slots on the two adjacent spacing boards are staggered from each other.

Description

Technical Field

[0001] The present invention relates to the technical field of infrared thermal imaging cores, and particularly relates to a core module and an infrared imaging device. Background Art

[0002] The continuous maturity of thermal imaging technology has promoted the development of infrared cores towards lightweight, small size, and high performance.

[0003] As the size of the infrared core continues to shrink, the heat dissipation area of the infrared core is also continuously decreasing. The traditional method of using heat pipes and fins to dissipate heat from the infrared core is difficult to adapt to smaller-sized infrared cores, resulting in increasingly prominent thermal management problems for small-sized cores, causing poor heat dissipation of the infrared core and seriously affecting the detection accuracy of the infrared core. Summary of the Invention

[0004] Embodiments of the present invention provide a core module and an infrared imaging device, aiming to improve the heat dissipation of small-sized infrared cores.

[0005] To achieve the above object, the embodiments of the present invention adopt the following technical solutions:

[0006] In a first aspect, the present application provides a core module, which includes: at least two circuit boards and at least two spacer plates. Along the optical axis direction of the core module, the circuit boards and the spacer plates are arranged alternately. Connector slots are provided on the spacer plates, connectors are provided on the circuit boards, and adjacent two circuit boards are connected by the connectors passing through the connector slots on the spacer plates. The positions of the connector slots on adjacent two spacer plates are staggered from each other.

[0007] The core module provided by the present application includes at least two circuit boards and at least two spacer plates. The spacer plates and the circuit boards are arranged alternately along the optical axis direction of the core module, that is, one spacer plate is arranged between two circuit boards. Since connector slots are provided on all the spacer plates, the connectors can pass through the connector slots to connect the circuit boards on both sides of the spacer plates, thereby realizing the transmission of information flow. Staggered means that the connector slots located on different spacer plates are not aligned. The staggered connector slots can reduce the phenomenon of thermal bridging. The heat conduction speed of the connectors is very fast, and the setting of the staggered connector slots makes the heat unable to quickly transfer from one circuit board to another through the connectors, effectively preventing the rapid transfer of heat between the circuit boards, and thus achieving better temperature control for each circuit board.

[0008] As a possible implementation, at least two circuit boards include a first circuit board, a second circuit board, and a third circuit board, and at least two spacers include a first heat dissipation plate and a heat insulation plate. The first circuit board, the first heat dissipation plate, the second circuit board, the heat insulation plate, and the third circuit board are arranged in sequence along the optical axis direction of the movement module. A first connector slot is provided on the first heat dissipation plate. The first circuit board and the second circuit board are connected by a connector passing through the first connector slot. A second connector slot is provided on the heat insulation plate, and the second circuit board and the third circuit board are connected by a connector passing through the second connector slot. The projection of the first connector slot on the second circuit board and the projection of the second connector slot on the second circuit board are staggered from each other.

[0009] As a possible implementation, for the projection of the first connector slot on the heat insulation plate, the side adjacent to the heat insulation plate is the first side edge, and for the second connector slot, the side adjacent to the heat insulation plate is the second side edge, and the first side edge and the second side edge are adjacent.

[0010] As a possible implementation, for the projection of the first connector slot on the heat insulation plate, the side adjacent to the heat insulation plate is the first side edge, and for the second connector slot, the side adjacent to the heat insulation plate is the second side edge, and the first side edge and the second side edge are opposite.

[0011] As a possible implementation, a first mounting hole is provided on the first heat dissipation plate, a second mounting hole and a third mounting hole are provided on the second circuit board, and a fourth mounting hole is provided on the third circuit board; the first mounting hole and the second mounting hole overlap, the third mounting hole and the fourth mounting hole overlap, and the second mounting hole and the third mounting hole are staggered from each other; the movement module further includes: a first fixing member and a second fixing member, the first fixing member passes through the first mounting hole and the second mounting hole to connect the first heat dissipation plate and the second circuit board, and the second fixing member passes through the third mounting hole and the fourth mounting hole to connect the second circuit board and the third circuit board.

[0012] In the movement module provided by the present application, the first heat dissipation plate is connected to the second circuit board through a first fixing member, and the second circuit board and the third circuit board are connected through a second fixing member. The second circuit board is provided with a second mounting hole and a third mounting hole, and the second mounting hole and the third mounting hole are staggered from each other. The second mounting hole overlaps with the first mounting hole located on the first heat dissipation plate, and the third mounting hole overlaps with the fourth mounting hole located on the third circuit board, which means that the first mounting hole and the fourth mounting hole are also staggered from each other. That is to say, the first fixing member that connects the first heat dissipation plate and the second circuit board and the second fixing member that connects the second circuit board and the third circuit board are also staggered from each other. When heat generated on the third circuit board is transferred forward, if the heat wants to be transferred to the detector and the first circuit board, the heat transfer needs to first diffuse through the second fixing member to the position where the second mounting hole of the second circuit board is located, and then diffuse through the first fixing member to the first heat dissipation plate. Since the third and fourth mounting holes matching the second fixing member are arranged staggeredly with the first and second mounting holes, more heat dissipation space is created between the circuit boards. This means that the same amount of heat needs more time to be transferred from the third circuit board to the first circuit board and the detector. During this time, the first heat dissipation plate and the air can effectively take away the heat, thus improving the heat dissipation efficiency.

[0013] As a possible implementation manner, the number of the first mounting holes and the second mounting holes is at least two, and at least two second mounting holes are arranged at two diagonal positions of the second circuit board; the number of the third mounting holes and the fourth mounting holes is at least two, and at least two third mounting holes are arranged at the other two diagonal positions of the second circuit board.

[0014] As a possible implementation manner, the heat insulation plate is provided with a fifth mounting hole, and the fifth mounting hole overlaps with the third mounting hole; the second fixing member passes through the third mounting hole, the fifth mounting hole and the fourth mounting hole to connect the second circuit board, the heat insulation plate and the third circuit board.

[0015] As a possible implementation manner, the movement module further includes a detector. The first circuit board is provided with a heat conduction window, and a convex platform structure is arranged on one side of the first heat dissipation plate facing the first circuit board. The convex platform structure passes through the heat conduction window and contacts the detector.

[0016] As a possible implementation manner, a heat conduction layer is arranged on the surface of the convex platform structure, and the convex platform structure contacts the detector through the heat conduction layer.

[0017] As a possible implementation manner, at least two spacer plates further include: a second heat dissipation plate arranged on one side of the first circuit board away from the first heat insulation plate and a lens assembly arranged on one side of the second heat dissipation plate away from the first heat dissipation plate. The second heat dissipation plate is connected to the first circuit board, and the second heat dissipation plate surrounds the detector; the lens assembly is connected to the second heat dissipation plate.

[0018] As a possible implementation, the material of the first fixing member and / or the second fixing member includes resin.

[0019] In a second aspect, the present application further provides an infrared imaging device, including a movement module and an image processor as described above, and the movement module is connected to the image processor.

[0020] Among them, the beneficial effects of the second aspect can refer to the beneficial effects of the first aspect, which will not be elaborated here. Description of the Drawings

[0021] Figure 1 It is a partial composition schematic diagram of a movement module provided by an embodiment of the present application;

[0022] Figure 2 It is a schematic diagram of the front and back of a first circuit board provided by an embodiment of the present application;

[0023] Figure 3 It is a partial composition schematic diagram of another movement module provided by an embodiment of the present application;

[0024] Figure 4 It is a projection schematic diagram provided by an embodiment of the present application;

[0025] Figure 5 It is another projection schematic diagram provided by an embodiment of the present application;

[0026] Figure 6 It is a schematic diagram of the front and back of a heat insulation plate provided by an embodiment of the present application;

[0027] Figure 7 It is a schematic diagram of the front and back of a first heat dissipation plate provided by an embodiment of the present application;

[0028] Figure 8 It is a schematic diagram of the partial composition connection of a movement module provided by an embodiment of the present application;

[0029] Figure 9 It is a schematic diagram of an infrared imaging device provided by an embodiment of the present application. Detailed Embodiments

[0030] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0031] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, when describing the pipeline, the "connected" and "connection" used in the present invention have the meaning of conduction. The specific meaning needs to be understood in conjunction with the context.

[0033] In the embodiments of the present invention, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present invention should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0034] Infrared thermal imaging technology is a technology that uses infrared detectors and optical imaging lenses to receive the infrared radiation energy distribution diagram of the target to be measured and reflect it on the photosensitive element of the infrared detector to obtain infrared thermal images. This technology can convert invisible infrared radiation energy into visible thermal images and intuitively display the temperature distribution on the surface of the object. Due to the advantages of infrared thermal imaging technology such as non-contact, real-time, fast and intuitive, it is widely used in various fields.

[0035] Movement modules, such as infrared movement modules, are core components of equipment made using infrared thermal imaging technology. With the continuous development of technology, people's requirements for movement modules are getting higher and higher, prompting movement modules to continue to develop in the direction of lightweight, miniaturization and high performance.

[0036] However, as the size of infrared cores continues to shrink, the heat dissipation area of ​​infrared cores is also shrinking. The traditional method of using heat pipes and fins to dissipate heat for infrared cores is difficult to adapt to smaller infrared cores, resulting in increasingly prominent thermal management issues for small-sized cores, causing poor heat dissipation of infrared cores, which seriously affects the detection accuracy of infrared cores.

[0037] In view of this, the present application provides a movement module, exemplarily, such as Figure 1As shown, the movement module 100 includes: at least two circuit boards and at least two spacer plates. Along the optical axis direction of the movement module, the circuit boards and the spacer plates are arranged alternately. Figure 1 The movement module 100 shown in [Figure] includes three circuit boards, numbered 2, 4, and 5 respectively; Figure 1 The spacer plates shown in [Figure] include a heat dissipation plate and a heat insulation plate, numbered 3 and 6 respectively. The circuit board numbered 2 and the circuit board numbered 4 are arranged alternately with the heat dissipation plate numbered 3 along the optical axis direction of the movement module; the circuit board numbered 4 and the circuit board numbered 5 are arranged alternately with the heat insulation plate 6 along the optical axis direction of the movement module ( Figure 1 the direction shown by the dotted line in [Figure]). According to Figure 1 it can be seen that two adjacent circuit boards are separated by a spacer plate (two adjacent circuit boards are separated by a heat dissipation plate numbered 3 or a heat insulation plate 6). It should be understood that the alternate arrangement mentioned in the embodiments of the present application means that there is a spacer plate between two circuit boards. In actual processes, there may be other components between two circuit boards, but as long as the connection method provided by the embodiments of the present application is satisfied, it belongs to the protection scope of the present application.

[0038] Connector slots are provided on the spacer plates. Still taking Figure 1 the spacer plates in [Figure] as the heat dissipation plate and the heat insulation plate for example for illustration, Figure 1 the connector slots on the heat dissipation plate and the heat insulation plate in [Figure] are numbered 32 and 62 respectively. Two adjacent circuit boards are connected by connectors passing through the connector slots of the spacer plates, Figure 1 and the numbers of the connectors in [Figure] are 43 and 7. Because connector slots are provided on both the heat insulation plate 6 and the heat dissipation plate, the connectors can pass through the connector slots to connect the circuit boards on both sides of the heat insulation plate 6 or the heat dissipation plate, so as to realize the transmission of information flow.

[0039] As a possible implementation manner, at least two spacer plates include at least one heat dissipation plate and at least one heat insulation plate. Based on this, the positions of the connector slots on two adjacent spacer plates are staggered from each other. There are three cases, namely: the positions of the connector slots on two adjacent heat insulation plates 6 are staggered from each other, the positions of the connector slots on two adjacent heat dissipation plates are staggered from each other, and the positions of the connector slots on a heat insulation plate 6 and an adjacent heat dissipation plate are staggered from each other.

[0040] "Mutually staggered" means that the connector slots located on different heat insulation plates 6 and heat dissipation plates are not aligned. For the above three cases, there are three corresponding forms: the projection of the connector slots provided on adjacent heat insulation plates 6 on the circuit board that separates the two adjacent heat insulation plates 6 does not have overlapping parts; the projection of the connector slots provided on adjacent heat dissipation plates on the circuit board that separates the two adjacent heat dissipation plates does not have overlapping parts; the projection of the connector slots provided on adjacent heat dissipation plates and heat insulation plates 6 on the circuit board that separates the adjacent heat dissipation plates and heat insulation plates 6 does not have overlapping parts.

[0041] The mutually staggered slot arrangement can reduce the heat bridging phenomenon. The heat conduction speed of the connector is very fast, and the staggered arrangement of the connector slots makes the heat unable to quickly transfer from one circuit board to another through the connector, that is, it delays the speed of heat directly transferring from one circuit board to another. This can prevent the rapid transfer of heat between circuit boards, thereby achieving better temperature control for each circuit board. As a possible implementation method, taking Figure 1 as an example, the movement module 100 includes a first circuit board 2, a second circuit board 4, a third circuit board 5, a first heat dissipation plate 3, and a heat insulation plate 6. The first circuit board 2, the first heat dissipation plate 3, the second circuit board 4, the heat insulation plate 6, and the third circuit board 5 are arranged in sequence along the optical axis direction of the movement module 100. The first heat dissipation plate 3 is provided with a first connector slot 32. The first circuit board 2 and the second circuit board 4 are connected by a connector passing through the first connector slot 32. The heat insulation plate 6 is provided with a second connector slot 62, and the second circuit board 4 and the third circuit board 5 are connected by a connector passing through the second connector slot 62. The projection of the first connector slot 32 on the second circuit board 4 and the projection of the second connector slot 62 on the second circuit board 4 are mutually staggered.

[0042] Exemplarily, the first circuit board 2 is provided with a first connector, and the second circuit board 4 is provided with a second connector 43. One of the first connector and the second connector 43 passes through the first connector slot 32 and is electrically connected to the other of the first connector and the second connector 43. The second circuit board 4 and the third circuit board 5 are connected by a third connector 7 passing through the second connector slot 62.

[0043] The projection of the first connector slot 32 on the second circuit board 4 and the projection of the second connector slot 62 on the second circuit board 4 are mutually staggered. With such a staggered arrangement, when the heat is transferred to the front end, it needs to first diffusely spread horizontally within the second circuit board 4 and then be transferred to the front end through the connector, increasing the time required for the heat to be transferred to the front end, which is beneficial for heat dissipation.

[0044] As a possible implementation method, the movement module further includes a detector. Combining Figure 1 andFigure 2 . Figure 2 The front and back sides of the first circuit board 2 are shown respectively. Figure 2 It can be seen that the detector 1 is connected to the middle area of ​​the first circuit board 2, and a first connector 21 matching with the second connector 43 is provided on the back of the first circuit board 2. The first circuit board 2 and the second circuit board 4 are electrically connected through the first connector 21 and the second connector 43, so that data and signals can be transmitted from the second circuit board 4 to the first circuit board 2, and data and signals can also be transmitted from the first circuit board 2 to the second circuit board 4.

[0045] As a possible implementation, the first connector and the second connector are respectively a male connector and a female connector that match each other. In some embodiments, a female connector is provided on the side of the first circuit board 2 facing the first heat sink 3, a male connector is provided on the side of the second circuit board 4 facing the first heat sink 3, and the male connector on the second circuit board 4 passes through the second connector slot 32 to connect with the female connector on the first circuit board 2. In other embodiments, a male connector is provided on the side of the first circuit board 2 facing the first heat sink 3, a female connector is provided on the side of the second circuit board 4 facing the first heat sink 3, and the male connector on the first circuit board 2 passes through the second connector slot 32 to connect with the female connector on the second circuit board 4.

[0046] Regarding “the projection of the first connector slot on the second circuit board and the projection of the second connector slot on the second circuit board are staggered with each other”, an embodiment of the present application provides a form as follows: Figure 3 The side of the projection of the first connector slot 32 on the heat insulation board 6 adjacent to the heat insulation board 6 is the first side L1, and the side of the second connector slot 62 adjacent to the heat insulation board 6 is the second side L2. The first side L1 and the second side L2 are opposite.

[0047] It should be noted that although Figure 3 There are two slots shown on the second circuit board 4 in the figure, but in the process of connecting the second circuit board 4 and the first circuit board 2 through the connector, only one slot is used, that is, the first connector slot 32. Figure 3 As shown in the dashed box. Figure 3 The reason why two slots are still shown is that in the actual production process, components with a symmetrical structure are easier to produce.

[0048] Regarding “the projection of the first connector slot on the second circuit board and the projection of the second connector slot on the second circuit board are staggered with each other”, the embodiment of the present application also provides another form: the edge of the projection of the first connector slot 32 on the insulation board 6 adjacent to the insulation board 6 is the first side L1, the edge of the second connector slot 62 adjacent to the insulation board 6 is the second side L2, and the first side L1 and the second side L2 are adjacent.

[0049] As a possible implementation, in combination with Figure 4 and Figure 5 , when the first side L1 and the second side L2 are adjacent, the following form may also occur: the projection of the first connector slot 32 on the second circuit board 4 is separated from the projection of the second connector slot 62 on the second circuit board 4, and the direction in which the projection of the first connector slot 32 on the second circuit board 4 is located intersects with the direction in which the projection of the second connector slot 62 on the second circuit board 4 is located.

[0050] The direction in which the projection of the first connector slot 32 is located refers to the direction pointed to by the projection of the first connector slot 32 on the second circuit board 4. This direction is defined as the direction where the long side of the first connector slot 32 is located. Exemplarily, as Figure 4 shown, Figure 4 the shaded area in Figure 4 represents the projection of the first connector slot 32 on the second circuit board 4, and the direction pointed to by the projection of the first connector slot 32 on the second circuit board 4 is as shown by the double arrow in

[0051] The projection of the first connector slot 32 on the second circuit board 4 being separated from the projection of the second connector slot 62 on the second circuit board 4 ensures that there is no overlapping part between the projection of the first connector slot 32 on the second circuit board 4 and the projection of the second connector slot 62 on the second circuit board 4. Referring to Figure 5 , the direction in which the projection of the first connector slot 32 on the second circuit board 4 is located intersects with the direction in which the projection of the second connector slot 62 on the second circuit board 4 is located, including the direction in which the projection of the first connector slot 32 on the second circuit board 4 is located being perpendicular to and non-perpendicularly intersecting with the direction in which the projection of the second connector slot 62 on the second circuit board 4 is located.

[0052] In order to enable the movement module to achieve better heat dissipation, the embodiment of the present application also provides a connection method between the components constituting the movement module assembly. Exemplarily, as Figure 3As shown in the figure. The first heat dissipation plate 3 is provided with a first mounting hole 31, the second circuit board 4 is provided with a second mounting hole 41 and a third mounting hole 42, and the third circuit board 5 is provided with a fourth mounting hole 51. The first mounting hole 31 and the second mounting hole 41 overlap, the third mounting hole 42 and the fourth mounting hole 51 overlap, and the second mounting hole 41 and the third mounting hole 42 are offset from each other. The movement module 100 further includes: a first fixing member 101 and a second fixing member 102. The first fixing member 101 passes through the first mounting hole 31 and the second mounting hole 41 to connect the first heat dissipation plate 3 and the second circuit board 4, and the second fixing member 102 passes through the third mounting hole 42 and the fourth mounting hole 51 to connect the second circuit board 4 and the third circuit board 5.

[0053] As a possible implementation manner, the first circuit board 2, the second circuit board 4, and the third circuit board 5 are a detector circuit board, a power supply circuit board, and a main control circuit board respectively. The detector circuit board is connected to the detector, the main control circuit board is responsible for controlling the movement module, and the power supply circuit board supplies power. Usually, the main control circuit board is the place where the heat generation in the movement module is the most serious, and the detector is a precision instrument, and its performance will be greatly affected under high temperature conditions. Therefore, the heat transfer from the third circuit board 5 to the front end should be reduced.

[0054] In some embodiments, the first fixing member 101 and the second fixing member 102 are screws, and the first mounting hole 31, the second mounting hole 41, the third mounting hole 42, and the fourth mounting hole 51 are matching screw holes. In other embodiments, the first fixing member 101 and the second fixing member 102 are pins, and the first mounting hole 31, the second mounting hole 41, the third mounting hole 42, and the fourth mounting hole 51 are matching pin holes. For the convenience of description, the following embodiments take the fixing member as a screw and the mounting hole as a screw hole as an example.

[0055] In the movement module 100 provided by the present application, the first heat dissipation plate 3 is connected to the second circuit board 4 through the first fixing member 101, and the second circuit board 4 and the third circuit board 5 are connected through the second fixing member 102. The second circuit board 5 is provided with a second mounting hole 41 and a third mounting hole 42, and the second mounting hole 41 and the third mounting hole 42 are offset from each other.

[0056] The second mounting hole 41 overlaps with the first mounting hole 31 on the first heat dissipation plate 3, and the third mounting hole 42 overlaps with the fourth mounting hole 51 on the third circuit board 5, which means that the first mounting hole 31 and the fourth mounting hole 51 are also staggered from each other. That is to say, the first fixing member 101 that connects the first heat dissipation plate 3 and the second circuit board 4 and the second fixing member 102 that connects the second circuit board 4 and the third circuit board 5 are also staggered from each other. When the heat generated on the third circuit board 5 is transferred forward and wants to be transferred to the detector 1 and the first circuit board 2, the heat transfer needs to first diffuse through the second fixing member 102 to the position where the second mounting hole 41 of the second circuit board 4 is located, and then diffuse through the first fixing member 101 to the first heat dissipation plate 3. Since the third and fourth mounting holes matching the second fixing member 102 are staggered from the first and second mounting holes, more heat dissipation space is created between the circuit boards. This means that the same amount of heat needs more time to be transferred from the third circuit board 5 to the first circuit board 2 and the detector 1. During this time, the first heat dissipation plate 3 and the air can effectively take away the heat, thus improving the heat dissipation efficiency.

[0057] As a possible implementation, the material of the first fixing member 101 and / or the second fixing member 102 includes resin. The material of the first fixing member 101 and / or the second fixing member 102 including resin includes that the material of the first fixing member 101 includes resin; the material of the second fixing member 102 includes resin; the materials of both the first fixing member 101 and the second fixing member 102 include resin. Since the thermal conductivity of resin is relatively low, the transfer of heat can be further restricted.

[0058] As a possible implementation, the number of the first mounting holes 31 and the second mounting holes 41 is at least two, and at least two second mounting holes 41 are provided at two diagonal positions of the second circuit board 4. The number of the third mounting holes 42 and the fourth mounting holes 51 is at least two, and at least two third mounting holes 42 are provided at the other two diagonal positions of the second circuit board 4.

[0059] As a possible implementation, as Figure 3 shown, each of the second mounting hole 41 and the third mounting hole 42 includes two screw holes, and the second mounting hole 41 and the third mounting hole 42 are respectively located on two diagonal lines of the second circuit board 4. The first mounting hole 41 on the first heat insulation plate 3 includes two screw holes, which are respectively located at two corners of the first heat dissipation plate 3 and on a diagonal line of the first heat dissipation plate 3. The four mounting holes 51 on the fourth circuit board 5 include two screw holes, which are respectively located at two corners of the fourth circuit board 5 and on a diagonal line of the fourth circuit board 5.

[0060] The present application does not limit the number of mounting holes. More mounting holes can be added according to the actual application scenario. However, in order to further reduce heat transfer, the number of the provided mounting holes should be minimized as much as possible and should be set at the corners as much as possible to achieve a larger heat dissipation buffer area.

[0061] In some embodiments, by way of example, such as Figure 3 As shown, a fifth mounting hole 61 is provided on the heat insulation plate 6, and the fifth mounting hole 61 overlaps with the third mounting hole 42. The second fixing member 102 passes through the third mounting hole 42, the fifth mounting hole 61 and the fourth mounting hole 51 to connect the second circuit board 4, the heat insulation plate 6 and the third circuit board 5.

[0062] As a possible implementation manner, the fifth mounting hole 61 includes two screw holes, and the two screw holes are respectively located at the corners of the heat insulation plate 6 and are located on a diagonal line of the heat insulation plate 6. Since the fifth mounting hole 61 provided on the heat insulation plate 6 overlaps with the third mounting hole 42, and the third mounting hole 42 overlaps with the fourth mounting hole 51, it means that the diagonal line where the fifth mounting hole 61 is located is parallel to the diagonal line where the fourth mounting hole 51 is located.

[0063] Providing the heat insulation plate 6 between the second circuit board 4 and the third circuit board 5 further prolongs the time required for heat transfer from the third circuit board 5 to between the first circuit board 2 and the detector 1. And since the heat insulation plate 6 is made of a material with low thermal conductivity, for example, the thermal conductivity of the heat insulation plate 6 is below 1, more heat is dissipated, and only a small part of the heat can be transferred to the detector 1. Therefore, the heat dissipation efficiency can be further improved. As a possible implementation manner, the material of the heat insulation plate 6 includes a foam material with low thermal conductivity.

[0064] In addition, since the fifth mounting hole 61 provided on the heat insulation plate 6 overlaps with the third mounting hole 42, the second fixing member 102 will sequentially pass through the fourth mounting hole 51, the fifth mounting hole 61 and the third mounting hole 42 to connect the third circuit board 5, the heat insulation plate 6 and the second circuit board 4. Finally, the third mounting hole 42 on the second circuit board 4 and the second mounting hole 41 are staggered from each other, so more heat dissipation space is created between the circuit boards. This means that the same amount of heat needs a longer time to transfer from the third circuit board 5 to the first circuit board 2 and the detector 1. During this time, the first heat dissipation plate 3 and the air can effectively take away the heat, thus improving the heat dissipation efficiency.

[0065] As a possible implementation manner, referring to Figure 3, the second circuit board 4 includes a first interface, and the third circuit board 5 includes a second interface 52. The flexible circuit board 7 connects the second circuit board 4 and the third circuit board 5. The flexible circuit board 7 passes through the second connector slot 62. One end of the flexible circuit board 7 is electrically connected to the first interface, and the other end of the flexible circuit board 7 is electrically connected to the second interface 52.

[0066] Exemplarily, as Figure 6 shown, Figure 6 the front and back of the heat insulation plate 6 are respectively shown. Through Figure 6 it can be seen that the second connector slot 62 for accommodating the flexible circuit board is provided on the heat insulation plate 6. The flexible circuit board 7 electrically connects the third circuit board and the second circuit board, enabling data and signals to be transmitted from the third circuit board to the second circuit board and also from the second circuit board to the third circuit board. Additionally, due to the flat and long characteristics of the flexible circuit board, the thermal resistance is increased, so the speed of heat diffusion from the third circuit board to the front end can be further reduced, leaving more space for heat dissipation.

[0067] Referring to Figure 1 , Figure 2 and Figure 7 , as a possible implementation, a heat conduction window 22 is provided on the first circuit board 2, and a boss structure 33 is provided on the side of the first heat dissipation plate 3 facing the first circuit board 2. The heat conduction window 22 on the first circuit board 2 can accommodate the boss structure 33 to pass through, and the boss structure 33 passes through the heat conduction window 22 to contact the detector 1. The boss structure 33 (also known as fins, ribs or protrusions) in the first heat dissipation plate 3 is designed to enhance the heat dissipation performance. The boss structure 33 can significantly increase the surface area of the first heat dissipation plate 3, thereby providing more surfaces for heat dissipation. The boss structure 33 can also promote air flow and enhance the convective heat dissipation effect. When air flows through the boss structure 33, vortices and disturbances will be generated, which helps to break the thermal boundary layer, improve the heat transfer efficiency, help evenly distribute heat, and reduce the phenomenon of local overheating of the heat source.

[0068] In some embodiments, a heat conduction layer is provided on the surface of the boss structure, and the boss structure contacts the detector through the heat conduction layer. As a possible implementation, the heat conduction layer is heat-conducting silicone grease. Spin-coating heat-conducting silicone grease on the surface where the boss structure contacts the detector can increase the heat dissipation contact area and reduce the contact thermal resistance, thereby improving the heat dissipation efficiency.

[0069] Referring to Figure 1, as a possible implementation, at least two spacers further include: a second heat sink 8 disposed on a side of the first circuit board 2 away from the first heat sink 3, the second heat sink 8 being connected to the first circuit board 2, and the second heat insulation plate 8 surrounding the detector 1. The movement module 100 further includes a lens assembly disposed on a side of the third heat insulation plate 8 away from the first heat sink 3, the lens assembly being connected to the second heat sink 8. Arranging the second heat sink 8 at the front end can further enhance the heat dissipation at the front end, contributing to improving the overall heat dissipation effect. The overall formed after the connection of the second heat sink 8, the first circuit board 2, the first heat sink 3, the second circuit board 4, the heat insulation plate 6, and the third circuit board 5 is as Figure 8 shown. Exemplarily, the lens assembly includes a lens holder and a lens. The lens holder and the lens are connected by threads, and the lens holder is connected to the first and second heat sinks by screws.

[0070] The embodiment of the present application further provides an infrared imaging device. Exemplarily, as Figure 9 shown. The infrared imaging device 200 includes the movement module 100 and an image processor 50 as described above, and the movement module 100 is connected to the image processor 50. Since the third and second heat sinks adopted by the movement module 100 provided in the present application are arranged at the front end, the heat dissipation at the front end of the movement module 100 can be better promoted. The arrangement of the first heat sink with a boss structure and the thermal grease can increase the heat dissipation of the detector to the rear end. In addition, by means of the diagonal assembly of the first fixing member and the second fixing member, and the misaligned arrangement of the flexible circuit board and the connector, the time required for heat transfer is increased, so as to give more sufficient heat dissipation time and achieve a better heat dissipation effect.

[0071] Those skilled in the art will readily think of other implementation schemes of the present application after considering the specification and practicing the invention disclosed herein. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include the common general knowledge or conventional technical means in the technical field not disclosed in the present application.

[0072] Finally, it should be noted that: the above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A movement module, characterized in that: include: at least two circuit boards and at least two spacer boards; Along the optical axis direction of the movement module, the circuit board and the spacer are arranged alternately; a connector slot is provided on the spacer, a connector is provided on the circuit board, and two adjacent circuit boards are connected by a connector passing through the connector slot of the spacer; The positions of the connector slots on two adjacent partition plates are staggered with each other.

2. The movement module according to claim 1, characterized in that: The at least two circuit boards include a first circuit board, a second circuit board and a third circuit board, and the at least two spacer boards include a first heat dissipation board and a heat insulation board; The first circuit board, the first heat sink, the second circuit board, the heat insulation board and the third circuit board are arranged in sequence along the optical axis direction of the movement module; a first connector slot is provided on the first heat sink; the first circuit board and the second circuit board are connected by a connector passing through the first connector slot; A second connector slot is provided on the heat insulation board, and the second circuit board and the third circuit board are connected by a connector passing through the second connector slot; a projection of the first connector slot on the second circuit board and a projection of the second connector slot on the second circuit board are staggered with each other.

3. The movement module according to claim 2, characterized in that: The side of the projection of the first connector slot on the insulation board adjacent to the insulation board is the first side, the side of the second connector slot adjacent to the insulation board is the second side, and the first side and the second side are adjacent.

4. The movement module according to claim 2, characterized in that: The projection of the first connector slot on the insulation board adjacent to the insulation board is a first side, the projection of the second connector slot adjacent to the insulation board is a second side, and the first side is opposite to the second side.

5. The movement module according to any one of claims 2 to 4, characterized in that: The first heat sink is provided with a first mounting hole, the second circuit board is provided with a second mounting hole and a third mounting hole, and the third circuit board is provided with a fourth mounting hole; the first mounting hole overlaps with the second mounting hole, the third mounting hole overlaps with the fourth mounting hole, and the second mounting hole and the third mounting hole are staggered with each other; The movement module also includes: a first fixing member and a second fixing member, the first fixing member passes through the first mounting hole and the second mounting hole to connect the first heat sink and the second circuit board, and the second fixing member passes through the third mounting hole and the fourth mounting hole to connect the second circuit board and the third circuit board.

6. The movement module according to claim 5, characterized in that: The number of the first mounting holes and the number of the second mounting holes are both at least two, and at least two of the second mounting holes are arranged at two diagonal positions of the second circuit board; The number of the third mounting holes and the number of the fourth mounting holes are both at least two, and at least two of the third mounting holes are arranged at the other two diagonal positions of the second circuit board.

7. The movement module according to claim 5, characterized in that: The heat insulation board is provided with a fifth mounting hole, and the fifth mounting hole overlaps with the third mounting hole; The second fixing member passes through the third mounting hole, the fifth mounting hole and the fourth mounting hole to connect the second circuit board, the heat insulation board and the third circuit board.

8. The movement module according to claim 2, characterized in that: The movement module also includes a detector. A heat-conducting window is provided on the first circuit board. A boss structure is provided on the side of the first heat sink facing the first circuit board. The boss structure passes through the heat-conducting window and contacts the detector.

9. The movement module according to claim 8, characterized in that: A heat-conducting layer is provided on the surface of the boss structure, and the boss structure is in contact with the detector through the heat-conducting layer.

10. The movement module according to claim 8, characterized in that: The at least two spacer plates further include: A second heat sink disposed on a side of the first circuit board away from the first heat sink, the second heat sink is connected to the first circuit board, and the second heat sink surrounds the detector; A lens assembly is arranged on a side of the second heat sink away from the first heat sink, and the lens assembly is connected to the two heat sinks.

11. The movement module according to claim 5, characterized in that: The material of the first fixing member and / or the second fixing member includes resin.

12. An infrared imaging device, characterized in that: include: An image processor, and a core module as claimed in any one of claims 1 to 11, wherein the core module is connected to the image processor.

Images