Multi-channel audio processor based on DSP

Abstract

The invention discloses a multi-channel audio processor based on a DSP, and relates to the technical field of audio processing, the multi-channel audio processor comprises a shell and a processor body, the processor body is arranged on the inner side of the shell, a connecting seat is installed on the surface of the shell, and a heat dissipation mechanism and a limiting mechanism are arranged on the surfaces of the connecting seat and the shell. A supporting mechanism is arranged at the bottom end of the shell, a supporting frame is slidably connected to the top end of the shell, and an adjusting mechanism is installed at the top end of the supporting frame, so that more excellent heat dissipation performance is achieved, heat generated by the processor body is discharged from a heat dissipation net, a protective net and ventilation holes through a heat dissipation fan, and the heat dissipation performance of the processor body is improved; and the shell reserves a space for heat emission through supporting of the bottom end soft cushion and the top end supporting frame, so that the heat dissipation performance of the stacked audio processor is improved, and the problem that the heat dissipation performance becomes poor due to the fact that the distance between devices is too short in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of audio processing, and particularly to a multi-channel audio processor based on DSP. Background Art

[0002] An audio processor is a device used to process and optimize audio signals. It can perform various processes on audio signals, such as adjustment, enhancement, mixing, filtering, compression, and effect addition, aiming to improve audio quality, control the dynamic range of audio output, and achieve specific sound effects. A DSP audio processor is a digital audio signal processing device. It first converts the analog signals input from multiple channels into digital signals, and then applies a series of tunable algorithms to process the digital signals to achieve functions such as sound quality optimization, matrix mixing, noise suppression, echo cancellation, and feedback suppression. Then, the processed signals are output as multi-channel analog signals through digital-to-analog conversion.

[0003] During the process of broadcasting, a DSP audio processor is required. First, connect the microphone and other audio devices to the input end of the DSP audio processor, configure multiple audio channels for processing according to requirements, and then connect the audio output end to a speaker or a recording device.

[0004] However, the existing audio processors have the following deficiencies: 1) In the prior art, when using an audio processor, multiple devices need to be connected through a signal link to be responsible for different audio processing tasks. In order to save space and facilitate device layout, multiple devices are often stacked. Since the distance between multiple devices is too close, it is easy to make the heat dissipation of the devices poor, affecting the working performance of the devices. And usually, an integrated connection method is adopted between the devices and the heat dissipation network. When dust accumulates on the heat dissipation network and causes blockage, the entire device needs to be removed, and then the heat dissipation network is cleaned, which is not convenient for the maintenance work of the audio processor; 2) During the stacking process of multiple devices, the devices are directly placed on top of another device without limiting their positions. If a staff member accidentally collides with the device stacked on top, it will cause the device to shift or even fall, damaging the device and posing a safety hazard. Moreover, the sizes of multiple devices are not the same. If they are directly placed, it will affect the stacking stability of the devices; 3) Since the audio processor in the prior art is directly placed on the desktop, when the desktop is uneven or the table is placed unevenly, the audio processor will be placed unevenly, resulting in poor contact or failure of internal components. And when some components are placed unevenly, they will generate tiny electrical noise or distortion, resulting in a decrease in the quality of audio signals and affecting the normal use of the audio processor.

[0005] Therefore, we propose a multi-channel audio processor based on DSP to solve the problems raised above. Summary of the Invention

[0006] The object of the present invention is to provide a multi-channel audio processor based on DSP to achieve better heat dissipation performance and more convenient maintenance. First, the heat generated by the processor body is discharged from the heat dissipation net, protective net and ventilation holes through the heat dissipation fan. The shell reserves space for heat dissipation through the support of the bottom soft pad and the top support frame, improving the heat dissipation of the audio processor after stacking. At the same time, the heat dissipation net and the connection seat at the top of the shell are limited by the insertion block and the limit block, providing convenience for the maintenance of the audio processor, so as to solve the problems raised in the above background technology.

[0007] To achieve the above object, the present invention provides the following technical solution: A multi-channel audio processor based on DSP, including a shell and a processor body, the processor body is arranged inside the shell, a connection seat is installed on the surface of the shell, and heat dissipation mechanisms and limit mechanisms are arranged on the surfaces of the connection seat and the shell. A support mechanism is arranged at the bottom of the shell, and a support frame is slidably connected to the top of the shell, and an adjustment mechanism is installed at the top of the support frame; The heat dissipation mechanism includes a moving groove, the moving groove is opened at both ends inside the shell, and a heat dissipation net is slidably connected inside the moving groove. Ventilation holes are opened at the bottom end of the connection seat, and a heat dissipation fan and a protective net are installed on the inner surface of the connection seat. The four corners of the protective net are clamped to the top of the connection seat, and a clamping block is fixedly installed at the bottom end of the support frame.

[0008] Preferably, clamping grooves are opened on the top of the shell and the outer surface of the top heat dissipation net, and the inner side of the clamping groove is slidably connected to the surface of the clamping block.

[0009] Preferably, the limit mechanism includes a jack, the jack is opened on the top of the shell and the outer surface of the top heat dissipation net, and an insertion block is slidably connected inside the jack. A pulling block is fixedly installed at the top of the insertion block. A placement groove is opened at the top of the shell, and a first spring is fixedly installed at one end of the inner surface of the placement groove, and one end of the outer surface of the first spring is fixedly installed at the bottom end of the pulling block.

[0010] Preferably, a limit groove is opened on one side of the outer surface of the insertion block, a limit block is slidably connected inside the limit groove, and the outer surface of the limit block is slidably connected to a fixed block, and the fixed block is fixedly installed on both sides of the outer surface of the connection seat.

[0011] Preferably, the adjusting mechanism includes a groove which is formed at the top end of the housing, and a baffle is slidably connected to the inner side of the groove. The baffle is clamped to the top end of the housing. The top end and one side of the outer surface of the support frame are both provided with sliding grooves.

[0012] Preferably, a first sliding rod and a second sliding rod are slidably connected to the inner side of the sliding groove. Blocks are fixedly installed at one ends of the outer surfaces of the first sliding rod and the second sliding rod. A second spring is fixedly installed at one end of the outer surface of the block. The outer diameter of the block is larger than the inner diameter of one end of the inner surface of the sliding groove. One end of the outer surface of the second spring is fixedly installed on the inner surface of one end of the sliding groove. An adjusting frame is fixedly installed at the top end of the second sliding rod. Buffer pads are fixedly installed on one side of the outer surfaces of the adjusting frame and the support frame.

[0013] Preferably, the supporting mechanism includes a receiving groove which is formed at the four corners of the bottom end of the housing. Rotating rods are rotatably connected to the four corners of the top end of the housing. Thread grooves are formed on the bottom surface of the rotating rod and the inner side of the housing, and the bottom surface of the rotating rod is rotatably connected to the inner side of the housing through the thread groove.

[0014] Preferably, a soft pad is fixedly installed at the bottom end of the rotating rod, a rotating handle is fixedly installed at the top end of the rotating rod, a telescopic rod is fixedly installed on the outer surface of the soft pad, and the soft pad is slidably connected to the inner side of the receiving groove.

[0015] Preferably, a connecting ring is fixedly installed on the top surface of the telescopic rod, and a bearing is rotatably connected to the outer surface of the connecting ring. The bearing is fixedly installed on the inner side of the receiving groove.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. Through the structural cooperation of the moving groove, heat dissipation net, ventilation holes, heat dissipation fan, protective net, clamping block, card slot, jack, plug block, placement groove, first spring, pulling block, limiting groove, limiting block and fixing block, the present invention achieves better heat dissipation performance and more convenient maintenance work. First, the heat generated by the processor body is discharged through the heat dissipation net, protective net and ventilation holes at the bottom end of the housing, as well as the heat dissipation net at the top end of the housing by the heat dissipation fan. The bottom end of the housing is supported by soft pads and the top end of the housing is supported by a support frame, leaving space for heat dissipation, improving the heat dissipation of the audio processor after stacking. When it is necessary to clean the protective net and heat dissipation net, the limiting block can be pulled away from the limiting groove, so that the connecting seat can be removed from the housing, and the protective net clamped on the connecting seat can be directly removed. Subsequently, the first spring drives the plug block away from the jack, so that the heat dissipation net can be removed from the moving groove for cleaning. Then, the protective net and heat dissipation net can be cleaned. On the contrary, the plug block and the limiting block can be used to limit the heat dissipation net and the connecting seat at the top end of the housing. The operation is simple, providing convenience for the maintenance of the audio processor and avoiding the problems in the prior art that the heat dissipation performance becomes poor due to the close distance between devices and the maintenance of the devices is difficult.

[0017] 2. Through the structural cooperation of the groove, baffle, sliding groove, first sliding rod, blocking block, second spring, second sliding rod, adjusting frame and buffer pad, the present invention achieves a wider stacking range of devices. First, the adjusting frame is pulled, so that the adjusting frame drives the second sliding rod to move. Then, the second sliding rod drives the blocking block to move in the sliding groove at the top of the support frame, so that the blocking block compresses the second spring. Then, another device can be placed on the support frame, and the clamping block on the support frame is driven to move in the card slot by the extrusion of the device, so that the support frame moves to both sides. Subsequently, the second spring on one side of the outer surface of the support frame is compressed by the movement of the support frame, and the outer diameter of the blocking block is larger than the inner diameter of one end of the inner surface of the sliding groove, preventing the second sliding rod and the first sliding rod from detaching from the inner side of the sliding groove. When the support frame moves to a space suitable for placing the device, the adjusting frame can be released, so that the reset of the second spring drives the blocking block to move, and the blocking block drives the first sliding rod and the second sliding rod to move. Then, the first sliding rod and the second sliding rod drive the support frames on both sides to move towards the middle and the adjusting frame to move downwards, so that the support frame and the adjusting frame can limit devices of different sizes, and the buffer pad can prevent damage to the devices, improving the situation in the prior art that the devices are prone to displacement and the stacking of devices of different sizes easily affects their stability.

[0018] 3. Through the structural cooperation of the storage groove, rotating rod, threaded groove, soft pad, rotating handle, telescopic rod, connecting ring, bearing, connecting seat and support frame, the present invention achieves higher stability. First, the rotating handle drives the rotating rod to move, causing the rotating rod to drive the soft pad to move. Then, the soft pad drives the telescopic rod to move, enabling the telescopic rod to drive the connecting ring to rotate inside the bearing. The up and down movement of the soft pad will drive the telescopic rod to expand and contract, providing auxiliary support for the soft pad without affecting its movement, and increasing the friction between the soft pad and the tabletop, further improving the stability of the soft pad. Subsequently, the four corners of the housing can be leveled by adjusting the height of the soft pad, preventing the audio processor from being placed unevenly and affecting its normal use, thus solving the problem in the prior art that the audio processor is placed unevenly and affects its normal use. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is the front view structural three-dimensional diagram of a multi-channel audio processor based on DSP according to the present invention; Figure 2 is the side view structural three-dimensional diagram of a multi-channel audio processor based on DSP according to the present invention; Figure 3 is the exploded structural three-dimensional diagram of a multi-channel audio processor based on DSP according to the present invention; Figure 4 is the enlarged exploded structural three-dimensional diagram of the connecting seat of a multi-channel audio processor based on DSP according to the present invention; Figure 5 is the enlarged exploded structural three-dimensional diagram of the housing of a multi-channel audio processor based on DSP according to the present invention; Figure 6 is a multi-channel audio processor based on DSP according to the present invention Figure 5 The enlarged three-dimensional diagram of the structure at position A; Figure 7 is the enlarged exploded structural three-dimensional diagram of the adjustment mechanism of a multi-channel audio processor based on DSP according to the present invention; Figure 8 is a multi-channel audio processor based on DSP according to the present invention Figure 7 The enlarged three-dimensional diagram of the structure at position B; Figure 9 is the enlarged exploded structural three-dimensional diagram of the support mechanism of a multi-channel audio processor based on DSP according to the present invention; Figure 10 is a multi-channel audio processor based on DSP according to the present invention Figure 9 The enlarged three-dimensional diagram of the structure at position C.

[0020] In the figure: 1. Outer shell; 2. Heat dissipation mechanism; 201. Moving groove; 202. Heat dissipation net; 203. Ventilation hole; 204. Heat dissipation fan; 205. Protective net; 206. Clamping block; 207. Clamping groove; 3. Limiting mechanism; 301. Insertion hole; 302. Inserting block; 303. Placing groove; 304. First spring; 305. Pulling block; 306. Limiting groove; 307. Limiting block; 308. Fixed block; 4. Adjusting mechanism; 401. Groove; 402. Baffle; 403. Sliding groove; 404. First sliding rod; 405. Stopping block; 406. Second spring; 407. Second sliding rod; 408. Adjusting frame; 409. Buffer pad; 5. Supporting mechanism; 501. Receiving groove; 502. Rotating rod; 503. Threaded groove; 504. Soft pad; 505. Rotating handle; 506. Telescopic rod; 507. Connecting ring; 508. Bearing; 6. Connecting seat; 7. Support frame; 8. Processor body. Detailed implementation mode

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] Please refer to the attached Figure 1 - attached Figure 10 As shown, the present invention provides a technical solution: a multi-channel audio processor based on DSP, including an outer shell and a processor body. The processor body is arranged inside the outer shell. A connecting seat is installed on the surface of the outer shell. The surfaces of the connecting seat and the outer shell are both provided with a heat dissipation mechanism and a limiting mechanism. A supporting mechanism is arranged at the bottom end of the outer shell, and a support frame is slidably connected to the top end of the outer shell. An adjusting mechanism is installed at the top end of the support frame.

[0023] Example 1, according to Figures 1 - 6As shown in the figure, the heat dissipation mechanism 2 includes a moving groove 201, which is opened at both inner ends of the outer shell 1. A heat dissipation net 202 is slidably connected inside the moving groove 201. A ventilation hole 203 is opened at the bottom end of the connecting seat 6, and a heat dissipation fan 204 and a protective net 205 are installed on the inner surface of the connecting seat 6. The four corners of the protective net 205 are clamped to the top end of the connecting seat 6. A clamping block 206 is fixedly installed at the bottom end of the support frame 7. Slots 207 are opened on the top end of the outer shell 1 and the outer surface of the top heat dissipation net 202. The inner side of the slot 207 is slidably connected to the surface of the clamping block 206. The limiting mechanism 3 includes an insertion hole 301, which is opened on the top end of the outer shell 1 and the outer surface of the top heat dissipation net 202. An insertion block 302 is slidably connected inside the insertion hole 301. A pulling block 305 is fixedly installed at the top end of the insertion block 302. A placement groove 303 is opened at the top end of the outer shell 1. A first spring 304 is fixedly installed at one end of the inner surface of the placement groove 303. One end of the outer surface of the first spring 304 is fixedly installed at the bottom end of the pulling block 305. A limiting groove 306 is opened on one side of the outer surface of the insertion block 302. A limiting block 307 is slidably connected inside the limiting groove 306. The outer surface of the limiting block 307 is slidably connected to a fixing block 308, and the fixing block 308 is fixedly installed on both sides of the outer surface of the connecting seat 6.

[0024] The overall effect achieved by the entire Embodiment 1 is: realizing better heat dissipation performance and simpler maintenance work. First, the heat generated by the processor body 8 is discharged from the heat dissipation net 202, the protective net 205, and the ventilation hole 203 at the bottom end of the outer shell 1, as well as the heat dissipation net 202 at the top end of the outer shell 1 through the heat dissipation fan 204. The outer shell 1 reserves space for heat dissipation through the support of the bottom soft pad 504 and the top support frame 7, improving the heat dissipation performance of the audio processor after stacking. When it is necessary to clean the protective net 205 and the heat dissipation net 202, the limiting block 307 can be pulled to move away from the limiting groove 306, so that the connecting seat 6 can be removed from the outer shell 1, and the protective net 205 clamped on the connecting seat 6 can be directly removed. Subsequently, the first spring 304 drives the insertion block 302 to move away from the insertion hole 301 during reset, so that the heat dissipation net 202 can be removed from the moving groove 201 for cleaning. Then, the protective net 205 and the heat dissipation net 202 can be cleaned. Conversely, the insertion block 302 and the limiting block 307 can be used to limit the heat dissipation net 202 at the top end of the outer shell 1 and the connecting seat 6, and the connection between the connecting seat 6 and the outer shell 1 restricts the movement of the heat dissipation net 202 and the protective net 205 at the bottom end of the outer shell 1. The operation is simple, facilitating the maintenance work of the audio processor.

[0025] Embodiment 2, according to Figure 5 、 Figure 7 and Figure 8As shown in the figure, the adjusting mechanism 4 includes a groove 401 opened at the top end of the housing 1. A baffle 402 is slidably connected to the inner side of the groove 401, and the baffle 402 is clamped to the top end of the housing 1. The top end and one side of the outer surface of the support frame 7 are both provided with a chute 403. A first slide bar 404 and a second slide bar 407 are slidably connected to the inner side of the chute 403. One end of the outer surface of the first slide bar 404 and the second slide bar 407 are both fixedly installed with a stopper 405. One end of the outer surface of the stopper 405 is fixedly installed with a second spring 406, and the outer diameter of the stopper 405 is greater than the inner diameter of one end of the inner surface of the chute 403. One end of the outer surface of the second spring 406 is fixedly installed on the inner surface of one end of the chute 403. The top end of the second slide bar 407 is fixedly installed with an adjusting frame 408. Buffer pads 409 are fixedly installed on one side of the outer surfaces of the adjusting frame 408 and the support frame 7.

[0026] The effect achieved by the entire Embodiment 2 is as follows: It realizes a wider range of equipment stacking. First, pull the adjusting frame 408, so that the adjusting frame 408 drives the second slide bar 407 to move. Then, the second slide bar 407 drives the stopper 405 to move in the chute 403 at the top of the support frame 7, so that the stopper 405 drives the second spring 406 to be compressed. Then, another device can be placed on the support frame 7, and the clamping block 206 on the support frame 7 is driven to move in the card slot 207 by the extrusion of the device, so that the support frame 7 moves to both sides. Subsequently, the second spring 406 on one side of the outer surface of the support frame 7 is compressed by the movement of the support frame 7, and the outer diameter of the stopper 405 is greater than the inner diameter of one end of the inner surface of the chute 403 to prevent the second slide bar 407 and the first slide bar 404 from detaching from the inner side of the chute 403. When the support frame 7 moves to a space suitable for placing the device, the adjusting frame 408 can be released, so that the reset of the second spring 406 drives the stopper 405 to move, and the stopper 405 drives the first slide bar 404 and the second slide bar 407 to move. Then, the first slide bar 404 and the second slide bar 407 drive the support frames 7 on both sides to move towards the middle and the adjusting frame 408 to move downward, so that the support frame 7 and the adjusting frame 408 can limit devices of different sizes, and the buffer pads 409 can prevent damage to the devices, improving the stability of equipment stacking. Then, after removing the baffle 402 from the groove 401, the support frame 7 can be removed from the card slot 207 to stack the devices. When the support frame 7 moves above the baffle 402 during use, the baffle 402 can be limited by the groove 401 and the support frame 7.

[0027] Embodiment 3, according to Figure 3 、 Figure 9 and Figure 10As shown in the figure, the support mechanism 5 includes a storage groove 501, which is opened at the four corners of the bottom end of the outer shell 1. Rotating rods 502 are rotatably connected to the four corners of the top end of the outer shell 1. Threaded grooves 503 are provided on both the bottom surface of the rotating rod 502 and the inner side of the outer shell 1, and the bottom surface of the rotating rod 502 is rotatably connected to the inner side of the outer shell 1 through the threaded groove 503. A soft pad 504 is fixedly installed at the bottom end of the rotating rod 502, a rotating handle 505 is fixedly installed at the top end of the rotating rod 502, a telescopic rod 506 is fixedly installed on the outer surface of the soft pad 504, and the soft pad 504 is slidably connected to the inner side of the storage groove 501. A connecting ring 507 is fixedly installed on the top surface of the telescopic rod 506, and a bearing 508 is rotatably connected to the outer surface of the connecting ring 507. The bearing 508 is fixedly installed on the inner side of the storage groove 501.

[0028] The effect achieved by the entire Embodiment 3 is as follows: Higher stability is achieved. First, the rotating handle 505 is used to drive the rotating rod 502 to move, so that the rotating rod 502 drives the soft pad 504 to move. Then, the soft pad 504 drives the telescopic rod 506 to move, so that the telescopic rod 506 drives the connecting ring 507 to rotate inside the bearing 508. The up and down movement of the soft pad 504 will drive the telescopic rod 506 to expand and contract, providing auxiliary support for the soft pad 504 without affecting its movement, and increasing the friction between the soft pad 504 and the tabletop, further improving the stability of the soft pad 504. Subsequently, the four corners of the outer shell 1 can be leveled by adjusting the height of the soft pad 504, preventing the audio processor from being placed unevenly and affecting its normal use. At the same time, the soft pad 504 can be driven by the rotating rod 502 to be retracted into the inner side of the storage groove 501, enabling the audio processor to be stacked on top of another device, facilitating the placement of the audio processor.

[0029] The working principle of the entire device is as follows: When placing the audio processor, first place the audio processor on the desktop, and then drive the rotating rod 502 to move through the turning handle 505, so that the rotating rod 502 drives the soft pad 504 to move. Then, drive the telescopic rod 506 to move through the soft pad 504, so that the telescopic rod 506 drives the connecting ring 507 to rotate inside the bearing 508. The up and down movement of the soft pad 504 will drive the telescopic rod 506 to expand and contract, assisting in supporting it while not affecting the movement of the soft pad 504, and increasing its friction with the desktop through the soft pad 504, further improving the stability of the soft pad 504. Subsequently, the four corners of the housing 1 can be leveled by adjusting the height of the soft pad 504, so that the housing 1 is stably placed on the desktop, preventing the audio processor from being placed unevenly and affecting its normal use. At the same time, the soft pad 504 can be driven by the rotating rod 502 to be retracted into the inner side of the storage groove 501, enabling the audio processor to be stacked on top of another device. Then, pull the adjusting frame 408, so that the adjusting frame 408 drives the second sliding rod 407 to move. Then, drive the stopper 405 to move in the chute 403 at the top of the support frame 7 through the second sliding rod 407, so that the stopper 405 drives the second spring 406 to be compressed. Then, another device can be placed on the support frame 7, and the clamping block 206 on the support frame 7 is driven to move in the card slot 207 through the extrusion of the device, so that the support frame 7 moves to both sides. Subsequently, the second spring 406 on one side of the outer surface of the support frame 7 is compressed through the movement of the support frame 7, and the outer diameter of the stopper 405 is greater than the diameter of one end of the inner surface of the chute 403 to prevent the second sliding rod 407 from separating from the inner side of the chute 403 of the first sliding rod 404. When the support frame 7 moves to a space suitable for placing the device, release the adjusting frame 408, so that the reset of the second spring 406 drives the stopper 405 to move, and drives the first sliding rod 404 and the second sliding rod 407 to move through the stopper 405. Then, drive the two support frames 7 to move towards the middle and the adjusting frame 408 to move downward through the first sliding rod 404 and the second sliding rod 407, so that the support frame 7 and the adjusting frame 408 can limit devices of different sizes, improving the stacking stability while increasing the stacking range of the devices, and preventing damage to the devices through the buffer pad 409. When it is necessary to stack a device on another device, the baffle 402 can be removed from the groove 401, and then the support frame 7 can be removed from the card slot 207 to stack the devices. Since the support frame 7 will move above the baffle 402 during use, the baffle 402 can be limited by the groove 401 and the support frame 7. During the operation of the audio processor, the heat generated by the processor body 8 can be discharged through the heat dissipation fan 204 from the heat dissipation net 202 at the bottom end of the housing 1, the protective net 205 and the ventilation holes 203, as well as the heat dissipation net 202 at the top end of the housing 1. And the support of the soft pad 504 at the bottom end of the housing 1 reserves space for the discharge of heat.At the top of the housing 1, the support of the support frame 7 reserves space for heat dissipation, improving the heat dissipation performance of the audio processor after stacking. When the dust screen 202 is covered with dust and needs to be cleaned, since the first spring 304 is in a compressed state, the limit block 307 can be pulled away from the limit groove 306, so that the connecting seat 6 can be removed from the housing 1, and the protective net 205 clamped on the connecting seat 6 can be directly removed. Subsequently, the first spring 304 resets to drive the plug 302 away from the jack 301, so that the dust screen 202 can be removed from the moving groove 201, and then the protective net 205 and the dust screen 202 can be cleaned. On the contrary, the cleaned dust screen 202 and the protective net 205 can be moved back to their original positions, and then the pull block 305 is pressed down, so that the pull block 305 drives the plug 302 to insert into the jack 301 and drives the first spring 304 to be compressed. Then the connecting seat 6 is sleeved on the surface of the housing 1, and then the limit block 307 can be inserted into the limit groove 306, and the first spring 304 resets to apply an upward force to the pull block 305, and the limit block 307 will firmly clamp on the plug 302, so that the plug 302 and the limit block 307 limit the dust screen 202 and the connecting seat 6 at the top of the housing 1. Then, the connection between the connecting seat 6 and the housing 1 restricts the movement of the dust screen 202 and the protective net 205 at the bottom of the housing 1. The operation is simple, providing convenience for the maintenance of the audio processor.

[0030] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A multi-channel audio processor based on DSP, comprising a housing (1) and a processor body (8), characterized in that: The processor body (8) is arranged inside the housing (1). A connecting seat (6) is installed on the surface of the housing (1). Heat dissipation mechanisms (2) and limiting mechanisms (3) are provided on the surfaces of both the connecting seat (6) and the housing (1). A support mechanism (5) is provided at the bottom end of the housing (1). And a support frame (7) is slidably connected to the top end of the housing (1). An adjusting mechanism (4) is installed at the top end of the support frame (7). The heat dissipation mechanism (2) includes moving grooves (201). The moving grooves (201) are opened at both ends inside the housing (1). And a heat dissipation net (202) is slidably connected inside the moving grooves (201). Ventilation holes (203) are opened at the bottom end of the connecting seat (6). And a heat dissipation fan (204) and a protective net (205) are installed on the inner surface of the connecting seat (6). The four corners of the protective net (205) are clamped to the top end of the connecting seat (6). A clamping block (206) is fixedly installed at the bottom end of the support frame (7).

2. The multi-channel audio processor based on DSP according to claim 1, characterized in that: Card slots (207) are opened on the top end of the housing (1) and the outer surface of the top heat dissipation net (202). The surface of the clamping block (206) is slidably connected inside the card slots (207).

3. The multi-channel audio processor based on DSP according to claim 1, characterized in that: The limiting mechanism (3) includes jacks (301). The jacks (301) are opened on the top end of the housing (1) and the outer surface of the top heat dissipation net (202). And a plug (302) is slidably connected inside the jacks (301). A pulling block (305) is fixedly installed at the top end of the plug (302). A placement groove (303) is opened at the top end of the housing (1). A first spring (304) is fixedly installed at one end of the inner surface of the placement groove (303). One end of the outer surface of the first spring (304) is fixedly installed at the bottom end of the pulling block (305).

4. The multi-channel audio processor based on DSP according to claim 3, characterized in that: A limiting groove (306) is opened on one side of the outer surface of the plug (302). A limiting block (307) is slidably connected inside the limiting groove (306). The outer surface of the limiting block (307) is slidably connected to a fixed block (308). The fixed block (308) is fixedly installed on both sides of the outer surface of the connecting seat (6).

5. The multi-channel audio processor based on DSP according to claim 1, characterized in that: The adjusting mechanism (4) includes a groove (401). The groove (401) is opened at the top end of the housing (1). And a baffle (402) is slidably connected inside the groove (401). The baffle (402) is clamped to the top end of the housing (1). Chute grooves (403) are opened at the top end and one side of the outer surface of the support frame (7).

6. The multi-channel audio processor based on DSP according to claim 5, characterized in that: A first slide bar (404) and a second slide bar (407) are slidably connected to the inner side of the slide groove (403). One ends of the outer surfaces of the first slide bar (404) and the second slide bar (407) are fixedly provided with stoppers (405). One ends of the outer surfaces of the stoppers (405) are fixedly provided with second springs (406). The outer diameter of the stoppers (405) is larger than the inner diameter of one end of the inner surface of the slide groove (403). One ends of the outer surfaces of the second springs (406) are fixedly installed on one end of the inner surface of the slide groove (403). The top end of the second slide bar (407) is fixedly provided with an adjusting frame (408). Buffer pads (409) are fixedly installed on one side of the outer surfaces of the adjusting frame (408) and the support frame (7).

7. The multi-channel audio processor based on DSP according to claim 1, characterized in that: The support mechanism (5) includes a storage groove (501). The storage groove (501) is opened at the four corners of the bottom end of the housing (1). Rotating rods (502) are rotatably connected to the four corners of the top end of the housing (1). Thread grooves (503) are formed on the bottom surface of the rotating rods (502) and the inner side of the housing (1). The bottom surface of the rotating rods (502) is rotatably connected to the inner side of the housing (1) through the thread grooves (503).

8. The multi-channel audio processor based on DSP according to claim 7, characterized in that: Soft pads (504) are fixedly installed at the bottom ends of the rotating rods (502). Rotating handles (505) are fixedly installed at the top ends of the rotating rods (502). Telescopic rods (506) are fixedly installed on the outer surfaces of the soft pads (504). The soft pads (504) are slidably connected to the inner side of the storage groove (501).

9. The multi-channel audio processor based on DSP according to claim 8, characterized in that: A connecting ring (507) is fixedly installed on the top surface of the telescopic rod (506). A bearing (508) is rotatably connected to the outer surface of the connecting ring (507). The bearing (508) is fixedly installed on the inner side of the storage groove (501).

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