Arc-shaped receiving and transmitting combined transducer array
By arranging the piezoelectric ceramic transmitting array element and receiving array element in an arc, and an arc-shaped transceiver array with an inverted sound substrate and vibration isolation pad is installed outside, the problems of reduced sensitivity of large-sized hydroacoustic transducer arrays and large equipment size are solved, and the sonar performance with high power and high sensitivity is achieved.
Patent Information
- Application Number
- CN202411608481.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-12
- Publication Date
- 2025-06-20
AI Technical Summary
During large-size and long-distance low-frequency detection, external vibration and echo influence are greater, resulting in reduced sensitivity, and the traditional transmission and reception arrangement pattern leads to a larger volume of the entire equipment.
The arc-shaped transceiver array is adopted to arrange the piezoelectric ceramic transmitting array elements and receiving array elements in an arc-shaped manner on the sound-transceiver substrate, and a counter-acoustic substrate and vibration isolation pad are provided outside to achieve transceiver and reception arrangement and high sensitivity.
It realizes high power and high sensitivity sonar performance under the premise of large size and transmission and reception, reducing the impact of vibration and echo on the array element, and improving the sonar beam opening angle and imaging range.
Smart Images

Figure CN120186526A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to a transducer array, and more particularly to a high-power large-opening-angle arc-shaped transceiver combined transducer array, belonging to the technical field of underwater acoustic transducers. Background Art
[0002] Sound waves are currently the only carriers capable of transmitting information over long distances in water media. In an underwater environment, an underwater acoustic transducer is a key component for sonar equipment to receive and transmit information. Underwater acoustic transducers and arrays are the core sensing components of a sonar system, and their performance indicators play a decisive role in the performance of sonar equipment.
[0003] Currently, imaging sonar transducer arrays usually adopt a planar array form, with one transmitting channel cooperating with multiple receiving channels inside. This array structure is simple, convenient to process, and easy to control the array spacing. When using a transducer array in this situation, due to the single number of transmitting channels, the sound source level is low, and the received echo by the receiving array is weak, resulting in a short imaging or detection distance; at the same time, the planar array leads to a narrow range of received echo signals, affecting the overall field of view of the sonar.
[0004] Arc-shaped transducer arrays are a common type of transducer array in sonar systems. Arc-shaped transducer arrays can generate multiple beams, which is very useful for simultaneously detecting targets in multiple directions or performing three-dimensional imaging. It not only improves the spatial resolution of the sound field but also improves the imaging and target recognition accuracy. By arranging in an arc shape, the transducer array can cover a wider sound field area, which is very important for large-area search and imaging.
[0005] Arc-shaped transducer arrays generally adopt piezoelectric ceramic particles arranged along the arc direction and usually have a small size; when performing long-distance low-frequency detection, a high-power and large-size transducer array is required, and the required array element size is also large (such as the array element length is greater than 20 cm); at this time, the influence of external vibration and echo on the array element will be greater, thereby affecting the transducer sensitivity. In addition, when a conventional array wants to achieve high power, usually the transmitting array and the receiving array are arranged separately (that is, two independent arrays are set), making the entire transceiver transducer array large in volume. Summary of the Invention
[0006] In view of this, the present invention provides an arc-shaped transceiver combined transducer array, which can achieve high power and high sensitivity on the premise of large size (array element length greater than 20 cm) and transceiver combination.
[0007] The technical solution of the present invention is: an arc-shaped transceiver combined transducer array, comprising: a sound-transmitting substrate, piezoelectric ceramic transmitting array elements, piezoelectric ceramic receiving array elements, a cabin, and a circuit board arranged in the cabin;
[0008] The sound-transmitting base is in the form of a semi-cylindrical structure. A number of piezoelectric ceramic transmitting array elements are arranged at both circumferential ends of the arc surface of the sound-transmitting base, and a number of piezoelectric ceramic receiving array elements are evenly spaced along the circumference between the piezoelectric ceramic transmitting array elements at both ends; both the piezoelectric ceramic transmitting array elements and the piezoelectric ceramic receiving array elements are piezoelectric ceramic sheets, and the length direction is parallel to the axis of the arc surface of the sound-transmitting base; the sound radiation surfaces of the piezoelectric ceramic transmitting array elements and the piezoelectric ceramic receiving array elements face outward and are encapsulated on the sound-transmitting base through a waterproof sound-transmitting layer;
[0009] Both the piezoelectric ceramic transmitting array elements and the piezoelectric ceramic receiving array elements are arranged in an anti-sound substrate with a U-shaped cross-section; vibration isolation pads are arranged on both outer side surfaces of the anti-sound substrate;
[0010] The cabin body is installed on the sound-transmitting base. The signal lines of the piezoelectric ceramic transmitting array elements and the piezoelectric ceramic receiving array elements are electrically connected to the circuit board, and the circuit board is electrically connected to the cable arranged on the cabin body.
[0011] As a preferred embodiment of the present invention: both the piezoelectric ceramic transmitting array elements and the piezoelectric ceramic receiving array elements are segmented and are formed by sequentially docking a plurality of array element units along the axial direction; adjacent two receiving array element units are in parallel connection.
[0012] As a preferred embodiment of the present invention: a positioning plate is arranged on the outer side of each vibration isolation pad.
[0013] As a preferred embodiment of the present invention: a plurality of piezoelectric ceramic receiving array elements are sequentially arranged along the circumference at half-wavelength intervals between the piezoelectric ceramic transmitting array elements at both ends.
[0014] As a preferred embodiment of the present invention: an array element installation groove is provided on the arc surface of the sound-transmitting base corresponding to each piezoelectric ceramic transmitting array element and each piezoelectric ceramic receiving array element; the piezoelectric ceramic transmitting array elements and the piezoelectric ceramic receiving array elements are installed in the corresponding array element installation grooves, thereby forming an arc array on the arc surface of the sound-transmitting base.
[0015] As a preferred embodiment of the present invention: the anti-sound substrate is made of foam material; the vibration isolation pads are vibration isolation rubbers; the waterproof sound-transmitting layer is made of polyurethane rubber.
[0016] As a preferred embodiment of the present invention: it has a dual-transmission mode, and the piezoelectric ceramic transmitting array elements at both ends respectively form a left transmitting unit and a right transmitting unit; the dual-transmission modes are respectively: the left transmitting unit or the right transmitting unit transmits alone, and the left transmitting unit and the right transmitting unit transmit simultaneously;
[0017] The dual-transmission mode switching is realized through a switch arranged on the circuit board.
[0018] Beneficial effects:
[0019] (1) In the present invention, piezoelectric ceramic transmitting elements and piezoelectric ceramic receiving elements are arranged in an arc array to achieve a wider coverage angle in the horizontal direction; the arc array structure with transmitting elements placed at both ends is adopted to improve the transmission response and sound source level, realizing high-power transmission; and anti-acoustic substrates and vibration isolation pads are provided outside both the piezoelectric ceramic transmitting elements and the piezoelectric ceramic receiving elements. Specifically, the piezoelectric ceramic transmitting elements and the piezoelectric ceramic receiving elements are inserted into a U-shaped anti-acoustic substrate bonded with vibration isolation pads, which can play a role in reducing vibration interference and realizing low-loss transmission and reception of acoustic wave energy. Thus, the present invention not only has a simple structure but also can effectively reduce the influence of vibration and echo on the elements, improving the sonar beam opening angle and imaging range; furthermore, high power and high sensitivity are realized on the premise of large size and combined transmitting and receiving.
[0020] (2) Compared with the conventional layout form of separate transmitting and receiving often adopted for high-frequency high-power transmitting arrays, the present invention adopts combined transmitting and receiving; and transmitting elements are arranged at both ends of the arc array, enabling high-power transmission.
[0021] (3) In the present invention, the piezoelectric ceramic transmitting elements and the piezoelectric ceramic receiving elements adopt a segmented parallel connection mode, while the anti-acoustic substrate, the vibration isolation pad, and the positioning plate remain in an integral form, which can reduce the processing difficulty on the premise of ensuring the consistency of the piezoelectric ceramic transmitting elements and the piezoelectric ceramic receiving elements.
[0022] (4) In the present invention, the piezoelectric ceramic transmitting element adopts a dual-transmission mode switching, which can realize the switching between high and low power. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 is a cross-sectional view (horizontal cross-section) of the arc-shaped combined transmitting and receiving transducer array of the present invention;
[0024] Figure 2 is a side view (longitudinal side view) of the arc-shaped combined transmitting and receiving transducer array of the present invention;
[0025] Figure 3 is a structural diagram of the piezoelectric ceramic transmitting element or receiving element of the present invention.
[0026] Figure 4 is an installation schematic diagram of the piezoelectric ceramic transmitting element and the piezoelectric ceramic receiving element on the sound-transmitting substrate;
[0027] Figure 5 is a structural schematic diagram of the piezoelectric ceramic receiving element in Embodiment 2.
[0028] Wherein: 1 - waterproof sound-transmitting layer, 2 - piezoelectric ceramic transmitting element, 3 - piezoelectric ceramic receiving element, 4 - anti-acoustic substrate, 5 - sound-transmitting substrate, 6 - vibration isolation pad, 7 - positioning plate, 8 - cabin, 9 - circuit board, 10 - cable, 11 - receiving element unit. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0029] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0030] Embodiment 1:
[0031] This embodiment provides an arc-shaped transmit-receive combined displacement transducer array, which not only has the characteristic of a large opening angle, but also can achieve high power and high sensitivity on the premise of large size (the element length is greater than 20 cm) and transmit-receive combination; in addition, the overall structure is simple.
[0032] As Figure 1 and Figure 2 shown, the arc-shaped transmit-receive combined displacement transducer array includes: a sound-transmitting substrate 5, piezoelectric ceramic transmitting elements 2, piezoelectric ceramic receiving elements 3, a cabin 8, and a circuit board 9 arranged in the cabin 8.
[0033] The sound-transmitting substrate 5 is in the form of a semi-cylindrical surface structure. A plurality of piezoelectric ceramic transmitting elements 2 and a plurality of piezoelectric ceramic receiving elements 3 are arranged on the arc surface of the sound-transmitting substrate 5, thereby forming an arc array. Among them, piezoelectric ceramic transmitting elements 2 are arranged at both circumferential ends of the arc surface of the sound-transmitting substrate 5, and a plurality of piezoelectric ceramic receiving elements 3 are arranged at equal intervals along the circumference between the piezoelectric ceramic transmitting elements 2 at both ends. Both the piezoelectric ceramic transmitting elements 2 and the piezoelectric ceramic receiving elements 3 are strip-shaped piezoelectric ceramic sheets, and the length direction is parallel to the axis of the arc surface of the sound-transmitting substrate 5. The arc array structure with piezoelectric ceramic transmitting elements 2 arranged at both ends can improve the transmission response and sound source level, and achieve high-power transmission. The sound-transmitting substrate 5 not only serves as an installation structure but also has the function of transmitting sound, avoiding sound echo interference with the piezoelectric ceramic transmitting elements 2 and the piezoelectric ceramic receiving elements 3.
[0034] In order to increase the visual field range of the sonar, that is, to increase the opening angle range of the sound base array, the arc-shaped transmit-receive combined displacement transducer array adopts an arc-shaped layout. At the same time, piezoelectric ceramic sheets are used as the transmitting elements and receiving elements. Utilizing the longitudinal vibration of the piezoelectric ceramic sheets, piezoelectric ceramic transmitting elements 2 are symmetrically arranged at both ends of the arc array to improve the transmit voltage response and sound source level, and achieve high-power transmission.
[0035] As an example, two piezoelectric ceramic transmitting elements 2 are arranged on each circumferential side of the arc surface of the sound-transmitting substrate 5, and a plurality of piezoelectric ceramic receiving elements 3 are arranged in sequence along the circumference at a half-wavelength interval between the piezoelectric ceramic transmitting elements 2 on both sides.
[0036] As an example, the piezoelectric ceramic transmitting element 2 has two transmitting modes and can achieve the switching between the two transmitting modes in the following way: the piezoelectric ceramic transmitting elements 2 on each side are connected in parallel and then respectively connected to the circuit board 9 in the cabin 8 (so that the piezoelectric ceramic transmitting elements 2 on both sides form a left transmitting unit and a right transmitting unit respectively), and switches are correspondingly arranged on the circuit board 9; all the piezoelectric ceramic transmitting elements 2 on both sides are connected in parallel and then connected to the circuit board 9 in the cabin 8 together, and switches are correspondingly arranged on the circuit board 9; thus, by switching the switches on the circuit board 9, the switching between two transmitting modes can be achieved, namely, the left transmitting unit or the right transmitting unit transmits alone (the first transmitting mode), and the left transmitting unit and the right transmitting unit transmit simultaneously (the second transmitting mode).
[0037] In the arc array, each output signal of the piezoelectric ceramic receiving element 3 is connected to the circuit board 9. Specifically, the piezoelectric ceramic receiving element 3 leads out a signal line from the wire through hole on the acoustic transmission substrate 5 to the circuit board 9; the circuit board 9 is connected to the cable 10.
[0038] The upper surface of the acoustic transmission substrate 5 (the side opposite to the arc surface) is installed with the housing 8 through bolts. There is a circuit board 9 inside the cabin 8, and a cable 10 connected to the circuit board 9 is arranged outside.
[0039] As an example, the acoustic transmission substrate 5 is made of a composite substrate of epoxy glass + glass fiber, or processed from rigid foam or other vibration isolation and decoupling materials.
[0040] To achieve low-loss transmission and reception of acoustic wave energy, an anti-acoustic substrate 4 and a vibration isolation pad 6 are both arranged outside the piezoelectric ceramic transmitting element 2 and the piezoelectric ceramic receiving element 3. Taking the piezoelectric ceramic receiving element 3 as an example, as Figure 3 shown, the anti-acoustic substrate 4 is a long strip structure with the same length as the piezoelectric ceramic receiving element 3 and a U-shaped cross-section, and its concave part serves as the accommodation cavity for the piezoelectric ceramic receiving element 3; the anti-acoustic substrate 4 plays the role of isolating sound. Vibration isolation pads 6 are arranged on the outer sides of both sides of the anti-acoustic substrate 4, and the vibration isolation pads 6 play the role of isolating the vibration conducted from the acoustic transmission substrate 5 to the piezoelectric ceramic transmitting element 2 and the piezoelectric ceramic receiving element 3. A positioning plate 7 is arranged on the outer side of each vibration isolation pad 6, and the positioning plate 7 plays the role of positioning the piezoelectric ceramic transmitting element 2 and the piezoelectric ceramic receiving element 3 to the center position of the installation groove on the acoustic transmission substrate 5. By adopting this installation method for the piezoelectric ceramic transmitting element 2 and the piezoelectric ceramic receiving element 3, the influence of vibration and echo on the elements can be effectively reduced, and the sensitivity can be improved.
[0041] As an example, the anti-acoustic substrate 4 is made of foam material and is bonded to the piezoelectric ceramic receiving element 3 on both sides and at the bottom. The vibration isolation pad 6 is a vibration isolation rubber and is bonded to the outer side of the anti-acoustic substrate 4. The positioning plate 7 is an epoxy glass cloth positioning plate and is bonded to the outer side of each vibration isolation pad 6.
[0042] As Figure 4 shown, array element mounting grooves and wire through holes are machined on the arc-shaped surface of the sound-transmitting substrate 5, and one array element mounting groove is correspondingly provided for each piezoelectric ceramic transmitting array element 2 and each piezoelectric ceramic receiving array element 3; Figure 3 The piezoelectric ceramic transmitting array element 2 and the piezoelectric ceramic receiving array element 3 bonded with the anti-sound substrate 4, the vibration isolation pad 6 and the positioning plate 7 in Figure 3 are installed in the corresponding array element mounting grooves on the sound-transmitting substrate 5, thereby forming an arc-shaped array on the arc-shaped surface of the sound-transmitting substrate 5; wherein the piezoelectric ceramic transmitting array elements 2 are located at both ends of the arc-shaped array, and several piezoelectric ceramic receiving array elements 3 are in the middle.
[0043] The sound radiation surfaces of the piezoelectric ceramic transmitting array element 2 and the piezoelectric ceramic receiving array element 3 face outward, and a waterproof sound-transmitting layer 1 is arranged on the outer side of the arc-shaped array for sealing. The waterproof sound-transmitting layer 1 plays the role of water-tight sound transmission, isolating the contact between the piezoelectric ceramic transmitting array element 2 and the piezoelectric ceramic receiving array element 3 and water, and avoiding the damage of the array elements caused by water ingress.
[0044] As an example, the waterproof sound-transmitting layer 1 is made of polyurethane rubber, and the characteristic impedance of polyurethane is close to that of water, which can realize low-loss transmission and reception of sound wave energy.
[0045] When manufacturing the arc-shaped transceiver combined transducer array, the piezoelectric ceramic transmitting array element 2 and the piezoelectric ceramic receiving array element 3 are bonded in the anti-sound substrate 4. After the vibration isolation pads 6 are bonded on both sides of the anti-sound substrate 4 and the positioning plate 7 is bonded on the outer side of the vibration isolation pads 6, they are correspondingly inserted into the arc-shaped sound-transmitting substrate 5 with the array element mounting grooves already machined; the signal lines of the piezoelectric ceramic transmitting array element 2 and the piezoelectric ceramic receiving array element 3 are led out from the wire through holes of the sound-transmitting substrate 5 to the circuit board 9; the sound-transmitting substrate 5 and the cabin body 8 are encapsulated into one body with polyurethane; the circuit board 9 is electrically connected to the cable 10 on the cabin body 8.
[0046] The arc-shaped transceiver combined transducer array is formed by arranging piezoelectric ceramic longitudinal vibrators along the arc direction, and has advantages such as a large beam opening angle and a wide imaging range.
[0047] Tests show that the resonance frequencies of the piezoelectric ceramic array elements (the piezoelectric ceramic transmitting array element 2 and the piezoelectric ceramic receiving array element 3) are near 100 kHz, the working frequency band measured in the water tank is 95 kHz - 105 kHz, the transmitting voltage response of this transducer array is greater than 160 dB, and the horizontal -3 dB opening angle is greater than 120 degrees.
[0048] Embodiment 2:
[0049] On the basis of the above Embodiment 1, this embodiment further limits the piezoelectric ceramic transmitting array element 2 and the piezoelectric ceramic receiving array element 3.
[0050] Since the piezoelectric ceramic transmitting element 2 and the piezoelectric ceramic receiving element 3 are relatively long in size (20 cm to 50 cm), the overall processing difficulty is relatively large. In this embodiment, both the piezoelectric ceramic transmitting element 2 and the piezoelectric ceramic receiving element 3 are segmented and formed by sequentially docking a plurality of element units along the axial direction.
[0051] As Figure 5 shown, taking the piezoelectric ceramic receiving element 3 as an example, the piezoelectric ceramic receiving element 3 is formed by sequentially docking a plurality of receiving element units 31 along the axial direction, and adjacent two receiving element units 31 are connected in parallel; and the distance between the opposite surfaces of adjacent two receiving element units 31 is maintained at 1 mm and filled with insulating silicone.
[0052] As an example, when the sizes of the piezoelectric ceramic transmitting element 2 and the piezoelectric ceramic receiving element 3 are 20 cm, they are divided into four segments, and thus the length of each receiving element unit 31 is 5 cm, greatly reducing the processing difficulty.
[0053] Moreover, in this embodiment, the anti-reflection substrate 4, the vibration isolation pad 6, and the positioning plate 7 are still integral, and only the piezoelectric ceramic transmitting element 2 and the piezoelectric ceramic receiving element 3 are segmented; thus, first, the anti-reflection substrate 4, the vibration isolation pad 6, and the positioning plate 7 are bonded together, and then each receiving element unit 31 is sequentially placed in the sequentially concave portions of the anti-reflection substrate 4 to keep a distance of 1 mm between adjacent two receiving element units 31; then adjacent two receiving element units 31 are connected in parallel, and finally insulating silicone is filled between the opposite surfaces of adjacent two receiving element units 31. Thus, the processing difficulty can be reduced on the premise of ensuring the consistency of the piezoelectric ceramic transmitting element 2 and the piezoelectric ceramic receiving element 3.
[0054] Although the present invention has been described in detail with general descriptions and specific embodiments above, based on the present invention, some modifications or improvements can be made, which are obvious to those skilled in the art. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection required by the present invention.
Claims
1. An arc-shaped transceiver array, characterized in that: include: A sound-transmissive substrate (5), a piezoelectric ceramic transmitting array element (2), a piezoelectric ceramic receiving array element (3), a cabin (8), and a circuit board (9) arranged in the cabin; The sound-transmitting substrate (5) is in the form of a semi-cylindrical structure. A plurality of piezoelectric ceramic transmitting array elements (2) are arranged at both ends of the arc-shaped surface of the sound-transmitting substrate (5) in the circumferential direction. A plurality of piezoelectric ceramic receiving array elements (3) are evenly spaced and arranged between the piezoelectric ceramic transmitting array elements (2) at both ends in the circumferential direction. The piezoelectric ceramic transmitting array elements (2) and the piezoelectric ceramic receiving array elements (3) are both piezoelectric ceramic sheets, and the length direction is parallel to the axis of the arc-shaped surface of the sound-transmitting substrate (5). The piezoelectric ceramic transmitting array elements (2) and the piezoelectric ceramic receiving array elements (3) face outward with their sound radiation surfaces facing outward, and are encapsulated on the sound-transmitting substrate via a waterproof sound-transmitting layer (1). The piezoelectric ceramic transmitting array element (2) and the piezoelectric ceramic receiving array element (3) are both arranged in an anti-sound substrate (4) with a U-shaped cross section; vibration isolation pads (6) are arranged on both outer side surfaces of the anti-sound substrate (4); The cabin (8) is mounted on the sound-transmitting substrate (5); signal lines of the piezoelectric ceramic transmitting array element (2) and the piezoelectric ceramic receiving array element (3) are electrically connected to the circuit board (9); and the circuit board (9) is electrically connected to a cable arranged on the cabin (8).
2. The arc-shaped transceiver array according to claim 1, characterized in that: The piezoelectric ceramic transmitting array element (2) and the piezoelectric ceramic receiving array element (3) are both segmented, formed by a plurality of array element units being connected in sequence along the axial direction; two adjacent receiving array element units are connected in parallel.
3. The arc-shaped transceiver array according to claim 1, characterized in that: A positioning plate (7) is provided on the outer side of each vibration isolation pad (6).
4. The arc-shaped transceiver array according to claim 1, 2 or 3, characterized in that: A plurality of piezoelectric ceramic receiving array elements (3) are sequentially arranged along the circumferential direction between the piezoelectric ceramic transmitting array elements (2) at both ends at a half-wavelength interval.
5. The arc-shaped transceiver array according to claim 1, 2 or 3, characterized in that: An array element installation groove is provided on the arcuate surface of the sound-transmitting substrate (5) corresponding to each piezoelectric ceramic transmitting array element (2) and each piezoelectric ceramic receiving array element (2); the piezoelectric ceramic transmitting array element (2) and the piezoelectric ceramic receiving array element (3) are installed in the corresponding array element installation grooves, thereby forming an arcuate array on the arcuate surface of the sound-transmitting substrate (5).
6. The arc-shaped transceiver array according to claim 1, 2 or 3, characterized in that: The anti-sound substrate (4) is made of foam material; the vibration isolation pad (6) is made of vibration isolation rubber; and the waterproof sound-permeable layer (1) is made of polyurethane rubber.
7. The arc-shaped transceiver array according to claim 1, 2 or 3, characterized in that: It has a dual-transmitting mode, so that the piezoelectric ceramic transmitting array elements (2) at both ends form a left transmitting unit and a right transmitting unit respectively; the dual-transmitting modes are: the left transmitting unit or the right transmitting unit transmits alone, and the left transmitting unit and the right transmitting unit transmit simultaneously; The dual emission mode switching is achieved by means of a switch arranged on the circuit board (9).