Circuit board assembly and electronic equipment

Abstract

The invention discloses a circuit board assembly and electronic equipment. The circuit board assembly comprises a first circuit board, the first circuit board is provided with a first end face and a second end face in the thickness direction of the circuit board assembly, at least one of the first end face and the second end face is a target end face, the target end face is provided with at least one matching structure, and the matching structure at least comprises a convex structure or a concave structure; the second circuit board is at least partially connected with the at least one matching structure of the target end face in a matched mode, and the first circuit board is electrically connected with the second circuit board; the sum of the thickness of the first circuit board and the thickness of the second circuit board is larger than the thickness after the second circuit board and the first circuit board are connected in a matched mode.

Description

Technical Field

[0001] This application belongs to the technical field of circuit boards, and particularly relates to a circuit board assembly and an electronic device. Background Art

[0002] An electronic device includes a circuit board assembly, and the circuit board assembly includes a plurality of circuit boards which are stacked. To avoid interference between the electronic components of adjacent circuit boards, a spacer is provided between adjacent circuit boards, and the adjacent circuit boards are welded and connected through the spacer. In this way, when manufacturing the circuit board assembly, it is necessary to manually visually align the circuit boards multiple times, which is extremely likely to cause the circuit boards to be misaligned, affecting the welding reliability, increasing the manufacturing difficulty, reducing the manufacturing efficiency, and affecting the yield rate of the product. At the same time, this structural setting results in a relatively large thickness of the circuit board assembly, which cannot meet the usage requirements of the electronic device for being thin and light. Summary of the Invention

[0003] This application aims to provide a circuit board assembly and an electronic device, and solves the problems in the related art that due to the unreasonable structural setting of the circuit board assembly, it is necessary to manually visually align the circuit boards multiple times when manufacturing the circuit board assembly, which is extremely likely to cause the circuit boards to be misaligned, affecting the welding reliability, and the circuit board assembly has a relatively large thickness and cannot meet the usage requirements of the electronic device for being thin and light.

[0004] To solve the above technical problems, this application is implemented as follows:

[0005] In a first aspect, an embodiment of this application provides a circuit board assembly, including: a first circuit board, along the thickness direction of the circuit board assembly, the first circuit board has a first end face and a second end face, at least one of the first end face and the second end face is a target end face, and at least one mating structure is provided on the target end face, and the mating structure at least includes a protruding structure or a recessed structure; a second circuit board, at least a part of the second circuit board is mutually matingly connected with at least one mating structure of the target end face, and the first circuit board and the second circuit board are electrically connected; the sum of the thickness of the first circuit board and the thickness of the second circuit board is greater than the thickness after the second circuit board and the first circuit board are matingly connected.

[0006] In a second aspect, an embodiment of this application provides an electronic device, including: a power supply; and the circuit board assembly as in the first aspect, and the power supply is electrically connected to the circuit board assembly.

[0007] In an embodiment of the present application, at least one mating structure is provided on the target end face. At least a part of the second circuit board is cooperatively connected with at least one mating structure on the target end face. The mating structure includes at least one protruding structure or one recessed structure. It can be understood that when the mating structure includes a protruding structure, at least a part of the second circuit board is a recess, and the protruding structure is inserted and mated with the recess. When the mating structure includes a recessed structure, at least a part of the second circuit board is located within the recessed structure. In this way, the sum of the thickness of the first circuit board and the thickness of the second circuit board is greater than the thickness after the second circuit board and the first circuit board are cooperatively connected. That is to say, it is possible to reduce the overall thickness of the first circuit board and the second circuit board in the thickness direction of the circuit board assembly, further reduce the thickness of the circuit board assembly while ensuring the use performance of the circuit board assembly, reduce the occupancy rate of the internal space of the electronic device, and provide structural support for meeting the use requirements of the electronic device to be thin and light.

[0008] When the first end face is the target end face, when the second circuit board and the first circuit board are assembled, at least one mating structure on the target end face is cooperatively connected with at least a part of the second circuit board. It can be understood that the cooperative connection between at least one mating structure and at least a part of the second circuit board can play a role in limiting the displacement of the second circuit board relative to the first circuit board. That is to say, when the second circuit board is assembled on the first circuit board, at least a part of the second circuit board is inserted into the recessed structure, or the protruding structure is inserted into the recess of the second circuit board, and the alignment of the second circuit board and the first circuit board can be achieved. In this way, it is possible to avoid manually visually aligning the circuit boards, ensure the alignment accuracy of the second circuit board and the first circuit board, provide structural support for effectively soldering the first circuit board and the second circuit board subsequently, simplify the preparation process of the circuit board assembly, reduce the difficulty of preparing the circuit board assembly, be beneficial to improving the preparation efficiency of the circuit board assembly, and be beneficial to improving the yield rate of the product. At the same time, the cooperative connection between at least one mating structure and at least a part of the second circuit board increases the mating area at the connection between the first circuit board and the second circuit board, and can ensure the reliability and effectiveness of the assembly of the first circuit board and the second circuit board.

[0009] When the second end face is the target end face, when the second circuit board and the first circuit board are assembled, at least one mating structure of the target end face is matingly connected with at least a part of the second circuit board. It can be understood that the mating connection of at least one mating structure with at least a part of the second circuit board can play a role in limiting the displacement of the second circuit board relative to the first circuit board. That is to say, when assembling the second circuit board on the first circuit board, inserting at least a part of the second circuit board into the concave structure, or inserting the convex structure into the concave part of the second circuit board can achieve the alignment of the second circuit board and the first circuit board. In this way, it can avoid manual visual alignment of the circuit boards, ensure the alignment accuracy of the second circuit board and the first circuit board, provide structural support for subsequent effective soldering of the first circuit board and the second circuit board, simplify the preparation process of the circuit board assembly, reduce the difficulty of preparing the circuit board assembly, be conducive to improving the preparation efficiency of the circuit board assembly, and be conducive to improving the yield rate of the product. At the same time, the mating connection of at least one mating structure with at least a part of the second circuit board increases the mating area at the connection between the first circuit board and the second circuit board, and can ensure the reliability and effectiveness of the assembly of the first circuit board and the second circuit board.

[0010] It can be seen from this that the present application reasonably sets the structure of the circuit board assembly, enabling the avoidance of manual visual alignment of the circuit board assembly, ensuring the alignment accuracy of the circuit board assembly, providing structural support for subsequent effective soldering of the circuit board assembly, simplifying the preparation process of the circuit board assembly, reducing the difficulty of preparing the circuit board assembly, being conducive to improving the preparation efficiency of the circuit board assembly, and being conducive to improving the yield rate of the product. At the same time, this structural setting can reduce the overall thickness of the circuit board assembly in the thickness direction, further reduce the thickness of the circuit board assembly while ensuring the use performance of the circuit board assembly, reduce the internal space occupancy rate of the electronic device, and provide structural support for meeting the use requirements of the electronic device for thinness and lightness.

[0011] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0013] Figure 1 is a schematic structural diagram of a circuit board assembly according to the first embodiment of the present application;

[0014] Figure 2 is a partial structural diagram of a circuit board assembly according to the first embodiment of the present application;

[0015] Figure 3 is an exploded view of a circuit board assembly according to the first embodiment of the present application;

[0016] Figure 4 It is a partial structural schematic diagram of the circuit board assembly according to the second embodiment of the present application;

[0017] Figure 5 It is a partial structural schematic diagram of the circuit board assembly according to the third embodiment of the present application;

[0018] Figure 6 It is a partial structural schematic diagram of the circuit board assembly according to the fourth embodiment of the present application;

[0019] Figure 7 It is a partial structural schematic diagram of the circuit board assembly according to the fifth embodiment of the present application;

[0020] Figure 8 It is a partial structural schematic diagram of the circuit board assembly according to the sixth embodiment of the present application;

[0021] Figure 9 It is a partial structural schematic diagram of the circuit board assembly according to the seventh embodiment of the present application.

[0022] Reference numerals:

[0023] Figures 1 to 9 The corresponding relationship between the reference numerals and the component names in is as follows:

[0024] 10 Circuit board assembly, 100 First circuit board, 110 First end face, 120 Second end face, 130 Fitting structure, 132a Protruding structure, 132b Recessed structure, 135 Boss, 136 Pit, 137 Serrated structure, 140 Accommodating channel, 200 Second circuit board, 300 Third circuit board, 400 Metal layer, 500 Fourth circuit board, 600 Mounting board, 700 Electronic component, 800 Solder joint. Detailed description of the specific implementation

[0025] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the scope of protection of the present application.

[0026] The terms "first" and "second" in the description and claims of this application may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, the meaning of "a plurality" is two or more. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / ", generally represents an "or" relationship between the associated objects before and after.

[0027] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0028] In the description of this application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, or a welded connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0029] The following will describe the circuit board assembly 10 and the electronic device provided by the embodiments of this application in conjunction with the attached Figures 1 to 9 drawings.

[0030] As Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9As shown, in some embodiments of the present application, a circuit board assembly 10 is provided, including: a first circuit board 100, along the thickness direction of the circuit board assembly 10, the first circuit board 100 has a first end face 110 and a second end face 120, and at least one of the first end face 110 and the second end face 120 is a target end face. The target end face is provided with at least one mating structure 130, and the mating structure 130 at least includes a protruding structure 132a or a recessed structure 132b; a second circuit board 200, at least a part of the second circuit board 200 is matingly connected with at least one mating structure 130 of the target end face, and the first circuit board 100 and the second circuit board 200 are electrically connected; the sum of the thickness of the first circuit board 100 and the thickness of the second circuit board 200 is greater than the thickness after the second circuit board 200 and the first circuit board 100 are matingly connected.

[0031] In an embodiment of the present application, the circuit board assembly 10 includes a first circuit board 100 and a second circuit board 200.

[0032] Along the thickness direction of the circuit board assembly 10, the first circuit board 100 has a first end face 110 and a second end face 120, and at least one of the first end face 110 and the second end face 120 is a target end face. That is to say, the first end face 110 is the target end face, or the second end face 120 is the target end face, or both the first end face 110 and the second end face 120 are the target end faces.

[0033] The target end face is provided with at least one mating structure 130. At least a part of the second circuit board 200 is matingly connected with at least one mating structure 130 of the target end face. The mating structure 130 at least includes a protruding structure 132a or a recessed structure 132b. It can be understood that when the mating structure 130 includes the protruding structure 132a, at least a part of the second circuit board 200 is a recess, and the protruding structure 132a is inserted and mated with the recess. When the mating structure 130 includes the recessed structure 132b, at least a part of the second circuit board 200 is located within the recessed structure 132b. In this way, the sum of the thickness of the first circuit board 100 and the thickness of the second circuit board 200 is greater than the thickness after the second circuit board 200 and the first circuit board 100 are matingly connected. That is to say, it is possible to reduce the overall thickness of the first circuit board 100 and the second circuit board 200 in the thickness direction of the circuit board assembly 10, further reduce the thickness of the circuit board assembly 10 while ensuring the use performance of the circuit board assembly 10, and can reduce the occupancy rate of the internal space of the electronic device, providing a structural support for meeting the use requirements of the electronic device for being thin and light.

[0034] When the first end face 110 is the target end face, when the second circuit board 200 and the first circuit board 100 are assembled, at least one mating structure 130 of the target end face is matingly connected to at least a part of the second circuit board 200. It can be understood that the mating connection of at least one mating structure 130 with at least a part of the second circuit board 200 can limit the displacement of the second circuit board 200 relative to the first circuit board 100. That is to say, when the second circuit board 200 is assembled on the first circuit board 100, inserting at least a part of the second circuit board 200 into the recessed structure 132b, or inserting the protruding structure 132a into the recess of the second circuit board 200 can achieve the alignment of the second circuit board 200 and the first circuit board 100. In this way, it is possible to avoid manually visually aligning the circuit boards, ensure the alignment accuracy of the second circuit board 200 and the first circuit board 100, provide structural support for the subsequent effective welding of the first circuit board 100 and the second circuit board 200, simplify the preparation process of the circuit board assembly 10, reduce the difficulty of preparing the circuit board assembly 10, be beneficial to improving the preparation efficiency of the circuit board assembly 10, and be beneficial to improving the product yield. At the same time, the mating connection of at least one mating structure 130 with at least a part of the second circuit board 200 increases the mating area at the connection between the first circuit board 100 and the second circuit board 200, and can ensure the reliability and effectiveness of the assembly of the first circuit board 100 and the second circuit board 200.

[0035] When the second end face 120 is the target end face, when the second circuit board 200 and the first circuit board 100 are assembled, at least one mating structure 130 of the target end face is matingly connected to at least a part of the second circuit board 200. It can be understood that the mating connection of at least one mating structure 130 with at least a part of the second circuit board 200 can limit the displacement of the second circuit board 200 relative to the first circuit board 100. That is to say, when the second circuit board 200 is assembled on the first circuit board 100, inserting at least a part of the second circuit board 200 into the recessed structure 132b, or inserting the protruding structure 132a into the recess of the second circuit board 200 can achieve the alignment of the second circuit board 200 and the first circuit board 100. In this way, it is possible to avoid manually visually aligning the circuit boards, ensure the alignment accuracy of the second circuit board 200 and the first circuit board 100, provide structural support for the subsequent effective welding of the first circuit board 100 and the second circuit board 200, simplify the preparation process of the circuit board assembly 10, reduce the difficulty of preparing the circuit board assembly 10, be beneficial to improving the preparation efficiency of the circuit board assembly 10, and be beneficial to improving the product yield. At the same time, the mating connection of at least one mating structure 130 with at least a part of the second circuit board 200 increases the mating area at the connection between the first circuit board 100 and the second circuit board 200, and can ensure the reliability and effectiveness of the assembly of the first circuit board 100 and the second circuit board 200.

[0036] It can be seen from this that the structure of the circuit board assembly 10 is reasonably set in this application, so that it is possible to avoid manually visually aligning the circuit board assembly 10, ensure the alignment accuracy of the circuit board assembly 10, provide structural support for effectively soldering the circuit board assembly 10 subsequently, simplify the preparation process of the circuit board assembly 10, reduce the difficulty of preparing the circuit board assembly 10, be conducive to improving the preparation efficiency of the circuit board assembly 10, and be conducive to improving the yield rate of the product. At the same time, this structural setting can reduce the overall thickness of the circuit board assembly 10 in the thickness direction, further reduce the thickness of the circuit board assembly 10 while ensuring the use performance of the circuit board assembly 10, reduce the occupancy rate of the internal space of the electronic device, and provide structural support for meeting the use requirements of the electronic device for being thin and light.

[0037] Exemplarily, a mating structure 130 is provided on the target end face.

[0038] Exemplarily, a plurality of mating structures 130 are provided on the target end face, and "a plurality" means a number greater than or equal to two.

[0039] In some embodiments, such as Figure 2 、 Figure 3 、 Figure 6 and Figure 7 shown, the circuit board assembly 10 further includes: a third circuit board 300, and both the first end face 110 and the second end face 120 are target end faces; at least a part of the third circuit board 300 is mutually cooperatively connected with at least one mating structure 130 on the target end face, and the first circuit board 100 and the third circuit board 300 are electrically connected; wherein, the third circuit board 300 and the second circuit board 200 are respectively mutually cooperatively connected with different mating structures 130.

[0040] In this embodiment, the circuit board assembly 10 further includes a third circuit board 300. At least a part of the third circuit board 300 is mutually cooperatively connected with at least one mating structure 130 on the target end face, and the first circuit board 100 and the third circuit board 300 are electrically connected. When both the first end face 110 and the second end face 120 are target end faces, the third circuit board 300 and the second circuit board 200 are respectively mutually cooperatively connected with different mating structures 130, that is, the third circuit board 300 and the second circuit board 200 do not connect to the same mating structure 130, and the second circuit board 200 and the third circuit board 300 do not interfere with each other.

[0041] Since the third circuit board 300 is at least partially connected to at least one mating structure 130 of the target end face in a mating manner, when assembling the third circuit board 300, when the mating structure 130 includes a protruding structure 132a, at least part of the third circuit board 300 is a recess, and the protruding structure 132a is inserted into the recess in a plug-in manner. When the mating structure 130 includes a recessed structure 132b, at least part of the second circuit board 200 is located within the recessed structure 132b. Compared with the assembly method of the circuit board in the related art, the overall thickness of the first circuit board 100 and the third circuit board 300 can be reduced in the thickness direction of the circuit board assembly 10, and the occupancy rate of the internal space of the electronic device can be reduced, providing structural support for meeting the use requirements of the electronic device to be thinner and lighter. At the same time, at least one mating structure 130 is connected to at least part of the third circuit board 300 in a mating manner, which can play a role in limiting the displacement of the third circuit board 300 relative to the first circuit board 100. That is to say, when assembling the third circuit board 300 on the first circuit board 100, inserting at least a part of the third circuit board 300 into the recessed structure 132b, or inserting the protruding structure 132a into the recess of the third circuit board 300 can achieve the alignment of the third circuit board 300 and the first circuit board 100. In this way, it is possible to avoid manually visually aligning the circuit boards, ensure the alignment accuracy of the third circuit board 300 and the first circuit board 100, provide structural support for effectively soldering the first circuit board 100 and the third circuit board 300 subsequently, simplify the preparation process of the circuit board assembly 10, reduce the difficulty of preparing the circuit board assembly 10, be beneficial to improving the preparation efficiency of the circuit board assembly 10, and be beneficial to improving the yield rate of the product. At the same time, at least one mating structure 130 is connected to at least part of the third circuit board 300 in a mating manner, increasing the mating area at the connection between the first circuit board 100 and the third circuit board 300, and ensuring the reliability and effectiveness of the assembly of the first circuit board 100 and the third circuit board 300.

[0042] Exemplarily, the second circuit board 200 and the third circuit board 300 are located at the same target end face, and the number of mating structures 130 is multiple. A part of the mating structures 130 cooperate with the second circuit board 200, and another part of the mating structures 130 cooperate with the third circuit board 300.

[0043] Exemplarily, the second circuit board 200 and the third circuit board 300 are located at different target end faces. For example, the second circuit board 200 is located at the first end face 110, and the third circuit board 300 is located at the second end face 120. Or, the second circuit board 200 is located at the second end face 120, and the third circuit board 300 is located at the first end face 110.

[0044] In some embodiments, such as Figure 2 and Figure 7As shown, the partial mating structures 130 on the first end face 110 and the partial mating structures 130 on the second end face 120 correspond one by one; when at least one of a pair of corresponding mating structures 130 is a recessed structure 132b, the structures of the first end face 110 and the second end face 120 form a receiving channel 140, and the second circuit board 200 and the third circuit board 300 are respectively mated with the mating structures 130 on the first end face 110 and the second end face 120; at least one of the second circuit board 200 and the third circuit board 300 is disposed in the receiving channel 140.

[0045] In this embodiment, the partial mating structures 130 on the first end face 110 and the partial mating structures 130 on the second end face 120 correspond one by one. That is, along the thickness direction of the circuit board assembly 10, the partial mating structures 130 on the first end face 110 and the partial mating structures 130 on the second end face 120 are oppositely arranged.

[0046] When at least one of a pair of corresponding mating structures 130 is a recessed structure 132b, the structures of the first end face 110 and the second end face 120 form a receiving channel 140. That is, the structures of the first end face 110 and the second end face 120 are further defined. The first end face 110 and the second end face 120 not only form the target end faces, but also the structures of the first end face 110 and the second end face 120 can form a receiving channel 140.

[0047] Among them, as Figure 2 shown, the receiving channel 140 communicates with the recessed structure 132b. It can also be understood that the recessed structure 132b forms a part of the receiving channel 140.

[0048] Among them, as Figure 7 shown, the recessed structure 132b is located on one side of the receiving channel 140.

[0049] As Figure 2 shown, when the recessed structure 132b forms a part of the receiving channel 140, at least one of the second circuit board 200 and the third circuit board 300 is disposed in the receiving channel 140, and the receiving channel 140 has the function of accommodating at least one of the second circuit board 200 and the third circuit board 300. In this way, the overall thickness of the circuit board assembly 10 can be further thinned in the thickness direction of the circuit board assembly 10, and while ensuring the use performance of the circuit board assembly 10, the thickness of the circuit board assembly 10 is further thinned.

[0050] As Figure 7As shown, when the recessed structure 132b is located on one side of the receiving channel 140, at least one of the second circuit board 200 and the third circuit board 300 is disposed in the receiving channel 140. The receiving channel 140 can accommodate a part of the second circuit board 200, and / or the receiving channel 140 can accommodate a part of the third circuit board 300. In this way, the overall thickness of the circuit board assembly 10 can be further thinned in the thickness direction of the circuit board assembly 10, while ensuring the performance of the circuit board assembly 10, the thickness of the circuit board assembly 10 is further reduced.

[0051] In some embodiments, the target circuit board is at least one of the second circuit board 200 and the third circuit board 300; when the mating structure 130 for the target circuit board to be mated and connected with the first circuit board 100 is the recessed structure 132b, the target circuit board is at least partially recessed into the target end face; when the mating structure 130 for the target circuit board to be mated and connected with the first circuit board 100 is the protruding structure 132a, the target circuit board at least partially protrudes from the target end face.

[0052] In this embodiment, the target circuit board is defined such that the target circuit board is at least one of the second circuit board 200 and the third circuit board 300.

[0053] As Figure 2 shown, when the mating structure 130 for the target circuit board to be mated and connected with the first circuit board 100 is the recessed structure 132b, the target circuit board is at least partially recessed into the target end face. That is, the positional relationship between the target circuit board and the target end face is defined. This setting can reduce the overall thickness of the circuit board assembly 10 in the thickness direction of the circuit board assembly 10 while ensuring the effective assembly of the target circuit board and the first circuit board 100.

[0054] As Figure 9 shown, when the mating structure 130 for the target circuit board to be mated and connected with the first circuit board 100 is the protruding structure 132a, the target circuit board at least partially protrudes from the target end face. That is, the positional relationship between the target circuit board and the target end face is defined. So as to reduce the thickness of the circuit board assembly 10 while satisfying the effective electrical connection between the target circuit board and the first circuit board 100.

[0055] In some embodiments, at least one of the following or a combination thereof is provided on a part of the surface of the mating structure 130: a boss 135, a pit 136, and a serrated structure 137.

[0056] In this embodiment, the mating structure 130 is further defined.

[0057] At least one of the following or a combination thereof is provided on a part of the surface of the mating structure 130: a boss 135, a pit 136, and a serrated structure 137.

[0058] It can be understood that the second circuit board 200 is at least partially connected to at least one mating structure 130 of the target end face in a mating manner. When a part of the surface of the mating structure 130 includes a boss 135, the second circuit board 200 is provided with a recess, and the boss 135 can be inserted into the recess. When a part of the surface of the mating structure 130 includes a pit 136, the second circuit board 200 is provided with a protrusion, and the protrusion can extend into the pit 136. When a part of the surface of the mating structure 130 includes a serrated structure 137, the second circuit board 200 is provided with a structure adapted to the serrated structure 137, so that the serrated structure 137 can be inserted into the structure. This setting can increase the mating area and mating angle between the second circuit board 200 and the first circuit board 100, can limit the displacement of the second circuit board 200 relative to the first circuit board 100, and can ensure the stability and reliability of the assembly of the second circuit board 200 and the first circuit board 100.

[0059] In some embodiments, as Figure 2 shown, the circuit board assembly 10 further includes a metal layer 400; when the circuit board assembly 10 includes the second circuit board 200, the metal layer 400 is located at the mating connection between the mating structure 130 and the second circuit board 200, and the first circuit board 100 and the second circuit board 200 are electrically connected through the metal layer 400; when the circuit board assembly 10 includes the third circuit board 300, the metal layer 400 is located at the mating connection between the mating structure 130 and the third circuit board 300, and the first circuit board 100 and the third circuit board 300 are electrically connected through the metal layer 400.

[0060] In this embodiment, the structure of the circuit board assembly 10 is defined. The circuit board assembly 10 further includes a metal layer 400.

[0061] When the circuit board assembly 10 includes the second circuit board 200, the metal layer 400 is located at the mating connection between the mating structure 130 and the second circuit board 200, and the first circuit board 100 and the second circuit board 200 are electrically connected through the metal layer 400 to meet the use requirements of the electrical connection between the first circuit board 100 and the second circuit board 200.

[0062] When the circuit board assembly 10 includes the third circuit board 300, the metal layer 400 is located at the mating connection between the mating structure 130 and the third circuit board 300, and the first circuit board 100 and the third circuit board 300 are electrically connected through the metal layer 400 to meet the use requirements of the electrical connection between the first circuit board 100 and the third circuit board 300.

[0063] In some embodiments, such as Figure 4 、 Figure 5 and Figure 6As shown, the circuit board assembly 10 further includes a fourth circuit board 500. The fourth circuit board 500 is stacked on one side of the first circuit board 100, and the fourth circuit board 500 is electrically connected to the first circuit board 100.

[0064] In this embodiment, the structure of the circuit board assembly 10 is further defined.

[0065] The circuit board assembly 10 further includes a fourth circuit board 500. The fourth circuit board 500 is stacked on one side of the first circuit board 100, and the fourth circuit board 500 is soldered to the first circuit board 100 to electrically connect the fourth circuit board 500 and the first circuit board 100.

[0066] That is to say, the circuit board assembly 10 not only includes the second circuit board 200 and the third circuit board 300 that cooperate with the first circuit board 100, but also includes a fourth circuit board 500 that is stacked on one side of the first circuit board 100 and is soldered to the first circuit board 100.

[0067] Exemplarily, the fourth circuit board 500 and the first circuit board 100 are connected by solder joints 800.

[0068] In some embodiments, as Figure 5 and Figure 6 shown, the circuit board assembly 10 further includes: a support board 600. The support board 600 is located between the first circuit board 100 and the fourth circuit board 500, and the first circuit board 100 and the fourth circuit board 500 are electrically connected through the support board 600.

[0069] In this embodiment, the structure of the circuit board assembly 10 is further defined.

[0070] The circuit board assembly 10 further includes a support board 600. The support board 600 is located between the first circuit board 100 and the fourth circuit board 500, and the first circuit board 100 and the fourth circuit board 500 are soldered through the support board 600. The support board 600 has the function of raising the fourth circuit board 500 to increase the distance between the first circuit board 100 and the fourth circuit board 500.

[0071] When the circuit board assembly 10 includes the second circuit board 200, the third circuit board 300, and the fourth circuit board 500, and the fourth circuit board 500 is soldered to the first end face 110 through the support board 600, the support board 600 can increase the distance between the fourth circuit board 500 and the first circuit board 100. In this way, the fourth circuit board 500 will not interfere with the second circuit board 200.

[0072] When the circuit board assembly 10 includes a second circuit board 200, a third circuit board 300, and a fourth circuit board 500, and the fourth circuit board 500 is welded to the second end face 120 through a support plate 600, the support plate 600 can increase the distance between the fourth circuit board 500 and the first circuit board 100. In this way, the fourth circuit board 500 will not interfere with the third circuit board 300.

[0073] This setting can meet the requirement of using multiple circuit boards in the circuit board assembly 10 in a stacked manner, and at the same time, can reduce the thickness of the circuit board assembly 10, providing structural support for realizing the thin and light of the electronic device.

[0074] In some embodiments, as Figure 4 shown, the fourth circuit board 500 is disposed opposite to the receiving channel 140, and a part of the fourth circuit board 500 is located in the receiving channel 140.

[0075] In this embodiment, the mating structure 130 of the fourth circuit board 500 and the first circuit board 100 is further defined.

[0076] The fourth circuit board 500 is disposed opposite to the receiving channel 140, and a part of the fourth circuit board 500 is located in the receiving channel 140. The receiving channel 140 has the function of accommodating a part of the fourth circuit board 500. That is to say, a part of the fourth circuit board 500 is embedded in the receiving channel 140. In this way, the overall thickness of the circuit board assembly 10 can be thinned in the thickness direction of the circuit board assembly 10, and while ensuring the use performance of the circuit board assembly 10, the thickness of the circuit board assembly 10 can be further thinned.

[0077] An electronic device according to some other embodiments of the present application includes: a power supply; and the circuit board assembly 10 as described in any of the above embodiments, and the power supply is electrically connected to the circuit board assembly 10.

[0078] Since the electronic device provided by the present application includes the circuit board assembly 10 as described in any of the above embodiments, it has all the beneficial effects of the above circuit board assembly 10, which will not be described one by one here.

[0079] Exemplarily, the electronic device may be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also referred to as an AR (Augmented Reality) device), a virtual reality device (also referred to as a VR (Virtual Reality) device), and a handheld game console, etc.

[0080] Exemplarily, the present application proposes a circuit board assembly 10, and the circuit board assembly 10 is a mortise and tenon stacked circuit board. Its basic principle is to hollow out a full cavity structure at the position of the board 600 that needs to be placed on the main body planar circuit board (for example, the first circuit board 100), and a semi-groove-shaped array for welding is arranged around the cavity. The semi-groove-shaped array structure extends in the Z direction, and the Z direction refers to the thickness direction of the circuit board assembly 10. And the other planar circuit boards that need to be placed on the board 600 (for example, the second circuit board 200, for example, the third circuit board 300) correspond to the cavity structure, and a convex array matching the semi-groove is designed in the X direction and / or Y direction around the circuit board (for example, the second circuit board 200, for example, the third circuit board 300). The convex array and the semi-groove-shaped array are in clearance fit, which is convenient for nested welding. Along the X direction, the difference between the length of the convex part of the convex array and the length of the semi-groove of the semi-groove-shaped array is greater than 0.05 mm. Along the Y direction, the difference between the length of the convex part of the convex array and the length of the semi-groove of the semi-groove-shaped array is greater than 0.05 mm. Along the Z direction, the difference between the length of the convex part of the convex array and the length of the semi-groove of the semi-groove-shaped array is greater than 0.05 mm. After the main body planar circuit board with the hollowed-out cavity and the supporting planar circuit board are each welded with electronic components 700, solder paste is applied at the position of the semi-groove and / or the convex part, and after the semi-groove-shaped array and the convex array are nested, reflow soldering can be carried out.

[0081] The present application reasonably sets the structure of the circuit board assembly 10, which is beneficial to the thinning of the overall stack.

[0082] Exemplarily, the first circuit board 100 is a planar board, the second circuit board 200 is a planar board, and the third circuit board 300 is a planar board. In this way, the flatness of the circuit board assembly 10 is easier to control, and the manufacturing of the circuit board assembly 10 is simpler.

[0083] As Figure 3 shown, the first circuit board 100 is provided with a cavity (for example, a receiving channel 140), and a semi-groove-shaped array for welding is designed around the cavity (for example, a part of the surface of the recessed structure 132b is provided with a semi-groove-shaped array). A convex array for welding is designed around the second circuit board 200, and the convex array and the semi-groove-shaped array are welded together to achieve electrical conduction. A convex array for welding is designed around the third circuit board 300, and the convex array and the semi-groove-shaped array are welded together to achieve electrical conduction.

[0084] The accommodating channel 140 facilitates the accommodation of the electronic components 700 carried on the second circuit board 200 and the third circuit board 300. The connection between the convex array and the semi-groove-shaped array needs to be metallized for nested welding. Specifically, a metal layer 400 is provided on the inner surface of the semi-groove shape, and a metal layer 400 is provided on the outer surface of the convex. The metal layer 400 of the semi-groove shape and the metal layer 400 of the convex are welded together. When welding the convex array and the semi-groove-shaped array, it can be welded by nesting first and then spot-tinning, or by dipping in tin first, then nesting and soldering in a reflow manner. The convex array can be completely nested within the semi-groove-shaped array, or a part of the convex array can be located within the semi-groove-shaped array while the other part protrudes outside the semi-groove-shaped array. The second circuit board 200 can protrude from the first end face 110 of the first circuit board 100, or the second circuit board 200 can be lower than the first end face 110 of the first circuit board 100. The third circuit board 300 can protrude from the second end face 120 of the first circuit board 100, or the third circuit board 300 can be lower than the second end face 120 of the first circuit board 100. The shapes of the convex parts of the convex array include square, trapezoidal, etc., which will not be listed one by one here.

[0085] As Figure 4 shown, the circuit board assembly 10 adopts a single-sided nested design, and the fourth circuit board 500 is stacked at the first end face 110. The fourth circuit board 500 is directly welded to the first end face 110. Specifically, the first circuit board 100 and the fourth circuit board 500 enclose a groove-shaped structure, and the fourth circuit board 500 is directly welded to the first end face 110.

[0086] As Figure 5 shown, a spacer board 600 is provided between the first circuit board 100 and the fourth circuit board 500. The second circuit board 200 is provided with a convex array, and the first circuit board 100 is provided with a semi-groove-shaped array, and the convex array and the semi-groove-shaped array are welded together.

[0087] As Figure 6 shown, a spacer board 600 is provided between the first circuit board 100 and the fourth circuit board 500. The second circuit board 200 is provided with a convex array, and the first circuit board 100 is provided with a semi-groove-shaped array, and the semi-groove-shaped array and the convex array are welded together. The third circuit board 300 is provided with a convex array, and the first circuit board 100 is provided with a semi-groove-shaped array, and the semi-groove-shaped array and the convex array are welded together.

[0088] It can be understood that the semi-groove-shaped array includes a plurality of semi-groove-shaped structures, and the plurality of semi-groove-shaped structures are arranged in a matrix. The convex array includes a plurality of convexes, and the plurality of convexes are arranged in a matrix.

[0089] As Figure 7 and Figure 8As shown, the raised array of the second circuit board 200 can be formed by electroplating copper pillars. The raised array of the third circuit board 300 can be formed by electroplating copper pillars.

[0090] The structure of the circuit board assembly 10 is reasonably set in this application, which can reduce the internal space occupancy rate of the electronic device and meet the usage requirements of the whole machine for being thin and light. At the same time, it can also improve the stacking layout density of the electronic components 700 and enhance the overall stacking reliability.

[0091] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0092] Although the embodiments of this application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of this application, and the scope of this application is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: include: A first circuit board, wherein along the thickness direction of the circuit board assembly, the first circuit board has a first end face and a second end face, at least one of the first end face and the second end face is a target end face, and the target end face is provided with at least one matching structure, and the matching structure includes at least one protruding structure or one concave structure; a second circuit board, wherein at least a portion of the second circuit board is cooperatively connected with at least one of the matching structures of the target end surface, and the first circuit board and the second circuit board are electrically connected; The sum of the thickness of the first circuit board and the thickness of the second circuit board is greater than the thickness of the second circuit board after being matched and connected to the first circuit board.

2. The circuit board assembly according to claim 1, characterized in that: Also includes: A third circuit board, wherein the first end surface and the second end surface are both the target end surfaces; The third circuit board is at least partially connected to the at least one matching structure of the target end surface, and the first circuit board is electrically connected to the third circuit board; Wherein, the third circuit board and the second circuit board cooperate with different cooperation structures respectively.

3. The circuit board assembly according to claim 2, characterized in that: The matching structure of part of the first end surface corresponds to the matching structure of part of the second end surface in one-to-one correspondence; When at least one of a pair of mutually corresponding matching structures is the recessed structure, the structures of the first end surface and the second end surface form a receiving channel, and the second circuit board and the third circuit board respectively match the matching structures of the first end surface and the second end surface; At least one of the second circuit board and the third circuit board is disposed in the accommodating passage.

4. The circuit board assembly according to claim 2, characterized in that: The target circuit board is at least one of the second circuit board and the third circuit board; When the matching structure where the target circuit board and the first circuit board are matched to each other is the recessed structure, the target circuit board is at least partially recessed in the target end surface; When the matching structure in which the target circuit board and the first circuit board are matched and connected to each other is the protruding structure, the target circuit board at least partially protrudes from the target end surface.

5. The circuit board assembly according to any one of claims 1 to 4, characterized in that: A portion of the surface of the matching structure is provided with at least one of the following or a combination thereof: a boss, a pit and a serrated structure.

6. The circuit board assembly according to any one of claims 2 to 4, characterized in that: The circuit board assembly also includes a metal layer; When the circuit board assembly includes the second circuit board, the metal layer is located at the mating connection between the mating structure and the second circuit board, and the first circuit board and the second circuit board are electrically connected through the metal layer; When the circuit board assembly includes the third circuit board, the metal layer is located at the mating connection between the mating structure and the third circuit board, and the first circuit board and the third circuit board are electrically connected through the metal layer.

7. The circuit board assembly according to claim 3, characterized in that: The circuit board assembly further includes a fourth circuit board, which is stacked on one side of the first circuit board and is electrically connected to the first circuit board.

8. The circuit board assembly according to claim 7, characterized in that: Also includes: A frame plate is located between the first circuit board and the fourth circuit board, and the first circuit board and the fourth circuit board are electrically connected through the frame plate.

9. The circuit board assembly according to claim 7, characterized in that: The fourth circuit board is arranged opposite to the accommodating channel, and a part of the fourth circuit board is located in the accommodating channel.

10. An electronic device, characterized in that: include: power supply; and The circuit board assembly according to any one of claims 1 to 9, wherein the power supply is electrically connected to the circuit board assembly.

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