Driving substrate and preparation method of driving substrate

Abstract

The invention relates to the technical field of display, in particular to a driving substrate and a preparation method of the driving substrate, the driving substrate comprises a substrate, a driving electrode group and an adjusting layer, the driving electrode group comprises two driving electrodes arranged at an interval, the driving electrodes are configured to be correspondingly bound with connecting electrodes of a light-emitting chip, and the adjusting layer is arranged on the substrate. The first adjusting part in the adjusting layer is located between the two driving electrodes in the driving electrode group. The top surface of the first adjusting part is higher than the top surface of the driving electrode, and the first adjusting part is configured to have no binding material between the first adjusting part and the main body part when the driving electrode group is irradiated by laser to etch the binding material between the connecting electrode and the driving electrode after the connecting electrode and the driving electrode are bound. The first adjusting part is arranged between the two driving electrodes in the driving electrode group, so that the thickness of the binding material between the main body part and the substrate is adjusted by using the first adjusting part, and the problem that the driving electrodes are damaged due to excessive laser irradiation energy under the condition of uniformly receiving laser cleaning is solved.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technologies, and particularly relates to a driving substrate and a method for preparing the driving substrate. Background Art

[0002] When the driving substrate technology repairs a faulty light-emitting chip, a laser cleaning technology is usually used to clean the bonding material. However, on the area of the driving substrate where the faulty light-emitting chip is set, the thickness of the bonding material on the bonding area bonded to the connection electrode in the light-emitting chip is different from the thickness of the bonding material on the non-bonding area not bonded to the connection electrode, and the thickness of the bonding material on the bonding area is thinner than that on the non-bonding area. As a result, when the bonding material on the driving substrate is uniformly irradiated by the laser for cleaning, the bonding area receives too much laser irradiation energy, leading to damage to the driving electrode. Summary of the Invention

[0003] The purpose of the present application is to provide a driving substrate and a method for preparing the driving substrate. By providing an adjustment layer on the driving substrate and using a first adjustment portion to adjust the thickness of the bonding material between the main body portion and the substrate, the problem that the driving electrode is damaged due to receiving too much laser irradiation energy under the condition of uniform laser cleaning is improved.

[0004] An embodiment of the present disclosure provides a driving substrate, including:

[0005] A substrate;

[0006] A driving electrode group provided on the substrate, the driving electrode group including two driving electrodes arranged at intervals, and the driving electrodes being configured to be correspondingly bonded to the connection electrodes of the light-emitting chips;

[0007] An adjustment layer provided on the same side of the substrate as the driving electrode group, the adjustment layer including a first adjustment portion located between the two driving electrodes in the driving electrode group;

[0008] Wherein, the top surface of the first adjustment portion is higher than the top surface of the driving electrode, and the adjustment layer is configured to make the first bonding thickness and the second bonding thickness meet a set condition. The first bonding thickness is defined as the thickness of the bonding material between the connection electrode and the driving electrode after they are bonded, and the second bonding thickness is defined as the thickness of the bonding material between the first adjustment portion and the main body portion of the light-emitting chip after the connection electrode and the driving electrode are bonded. The set condition is defined as: when the driving electrode group is irradiated with a laser to etch the bonding material between the connection electrode and the driving electrode, there is no bonding material between the first adjustment portion and the main body portion.

[0009] In an exemplary embodiment of the present disclosure, the height difference between the first adjusting portion and the driving electrode is equal to the height of the connecting electrode; or,

[0010] A height difference between the first adjusting portion and the driving electrode is equal to a sum of a height of the connecting electrode and the first binding thickness.

[0011] In an exemplary embodiment of the present disclosure, the adjustment layer includes a second adjustment portion, the second adjustment portion is located between adjacent driving electrode groups, and the top surface of the second adjustment portion is higher than the top surface of the driving electrode; after the connecting electrode is bound to the driving electrode, the thickness of the binding material on the second adjustment portion is equal to the first binding thickness.

[0012] In an exemplary embodiment of the present disclosure, the adjustment layer is made of an insulating material; the adjustment layer includes a lower adjustment portion and an upper adjustment portion, the top surface of the lower adjustment portion is flush with the top surface of the driving electrode, and the side wall of the lower adjustment portion close to the driving electrode is in contact with the side wall of the driving electrode; the upper adjustment portion is located on a side of the lower adjustment portion away from the substrate, and in a direction away from the substrate, the side wall of the upper adjustment portion close to the driving electrode is inclined toward a side away from the center of the driving electrode.

[0013] In an exemplary embodiment of the present disclosure, an angle between a side wall of the upper regulating portion close to the driving electrode and a horizontal plane is defined as θ, and a value range of θ is: 60°<θ<90°.

[0014] In an exemplary embodiment of the present disclosure, the adjustment layer is made of an electrodeformable material, and the adjustment layer is spaced apart from the driving electrode; under the drive of a voltage, the adjustment layer can be deformed in the height direction; after the voltage on the adjustment layer is removed, the adjustment layer restores the deformation; wherein:

[0015] Before the connection electrode is bound to the driving electrode, a voltage is applied to the first adjustment portion so that a top surface of the first adjustment portion is higher than a top surface of the driving electrode; and / or,

[0016] During the binding process of the connection electrode and the driving electrode, a voltage is applied to the first adjustment part to adjust the thickness of the binding material between the first adjustment part and the main body of the light emitting chip.

[0017] In an exemplary embodiment of the present disclosure, the heights of the two driving electrodes in the driving electrode group are equal; before applying a voltage to the adjustment layer, the top surface of the adjustment layer is flush with the top surface of the driving electrode.

[0018] In an exemplary embodiment of the present disclosure, the driving substrate includes a spacer layer, the spacer layer is located between the adjusting layer and the driving electrode, and the spacer layer has insulating properties to be configured to separate the driving electrode from the adjusting layer.

[0019] The present disclosure provides a method for preparing a driving substrate, the preparation method includes:

[0020] Providing a substrate;

[0021] Forming a driving electrode group on the substrate; the driving electrode group includes two driving electrodes arranged at intervals, and the driving electrodes are configured to be bonded to the connection electrodes of the light-emitting chips;

[0022] Forming an adjusting layer on the substrate, the adjusting layer and the driving electrode group are located on the same side of the substrate; the adjusting layer includes a first adjusting portion, and the first adjusting portion is located between the two driving electrodes in the driving electrode group; wherein, the top surface of the first adjusting portion is higher than the top surface of the driving electrode, and the adjusting layer is configured to make the first bonding thickness and the second bonding thickness meet the set conditions. The first bonding thickness is defined as the thickness of the bonding material between the connection electrode and the driving electrode after they are bonded, and the second bonding thickness is defined as the thickness of the bonding material between the first adjusting portion and the main body portion of the light-emitting chip after the connection electrode and the driving electrode are bonded. The set condition is defined as: when the driving electrode group is irradiated with laser to etch the bonding material between the connection electrode and the driving electrode, there is no bonding material between the first adjusting portion and the main body portion.

[0023] In an exemplary embodiment of the present disclosure, the adjusting layer is made of an electro-deformable material; the adjusting layer is spaced from the driving electrode; under the drive of voltage, the adjusting layer can deform in the height direction; after the voltage on the adjusting layer is removed, the adjusting layer restores the deformation; wherein:

[0024] Before the connection electrode and the driving electrode are bonded, applying a voltage to the first adjusting portion to make the top surface of the first adjusting portion higher than the top surface of the driving electrode; and / or,

[0025] During the bonding process of the connection electrode and the driving electrode, applying a voltage to the first adjusting portion to adjust the thickness of the bonding material between the first adjusting portion and the main body portion of the light-emitting chip.

[0026] The technical solutions provided by the embodiments of the present disclosure have at least the following advantages:

[0027] In the embodiments of the present disclosure, an adjustment layer is provided in the driving substrate, and the first adjustment part between two driving electrodes in the driving electrode group is used to adjust the thickness of the bonding material between the main body part and the substrate. Subsequently, when the bonding material between the connecting electrode and the driving electrode is etched by irradiating the driving electrode group with a laser, there is no bonding material between the first adjustment part and the main body part, which improves the problem that, under the condition of uniformly receiving laser cleaning, due to the thin thickness of the bonding material between the driving electrode and the connecting electrode, too much laser irradiation energy is received in the area corresponding to the driving electrode group, resulting in damage to the driving electrode.

[0028] Meanwhile, by making the first bonding thickness and the second bonding thickness meet the set conditions, the present disclosure can also improve the problem that, due to the excessive thickness of the bonding material on the first adjustment part, the bonding material on the first adjustment part cannot be completely removed, and subsequently, when the light-emitting chip is re-bonded in the same area next time, the excessive thickness of the bonding material on the first adjustment part hinders the electrical connection between the driving electrode and the connecting electrode. That is to say, it improves the problem that, due to the excessive thickness of the bonding material on the first adjustment part, the first adjustment part has directly abutted against the main body part before the connecting electrode is electrically connected to the driving electrode, thereby improving the bonding yield of the light-emitting chip and the driving substrate.

[0029] Other features and advantages of the present application will become apparent from the following detailed description, or will be partially learned through the practice of the present application.

[0030] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The accompanying drawings herein are incorporated into the specification and form a part of the specification, showing embodiments consistent with the present disclosure, and are used together with the specification to explain the principles of the present disclosure. Obviously, the accompanying drawings in the following description are only some embodiments of the present disclosure, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.

[0032] Figure 1 Shows a schematic cross-sectional structure diagram when the driving substrate is bonded to the light-emitting chip in the related art.

[0033] Figure 2 Shows Figure 1 The schematic cross-sectional structure diagram after unbonding the light-emitting chip from the driving substrate.

[0034] Figure 3 Shows a schematic cross-sectional structure diagram of the driving substrate in the embodiments of the present disclosure.

[0035] Figure 4 Shows the light-emitting chip andFigure 3 Schematic cross-sectional structure diagram during the binding of the driving substrate.

[0036] Figure 5 Shows the Figure 4 Schematic cross-sectional structure diagram after unbinding the light-emitting chip from the driving substrate.

[0037] Figure 6 Schematic cross-sectional structure diagram showing the binding of the light-emitting chip to another driving substrate in an embodiment of the present disclosure.

[0038] Figure 7 Schematic cross-sectional structure diagram showing the second adjusting part in an embodiment of the present disclosure.

[0039] Figure 8 Shows the light-emitting chip and Figure 7 Schematic cross-sectional structure diagram during the binding of the driving substrate.

[0040] Figure 9 Shows the Figure 8 Schematic cross-sectional structure diagram after unbinding the light-emitting chip from the driving substrate.

[0041] Figure 10 Schematic cross-sectional structure diagram showing the lower adjusting part and the upper adjusting part in an embodiment of the present disclosure.

[0042] Figure 11 Shows the light-emitting chip and Figure 10 Schematic cross-sectional structure diagram during the binding of the driving substrate.

[0043] Figure 12 Schematic cross-sectional structure diagram showing that the top surface of the adjusting layer is flush with the top surface of the driving electrode in an embodiment of the present disclosure.

[0044] Figure 13 Shows the light-emitting chip and Figure 12 Schematic process structure diagram after binding the light-emitting chip to the driving substrate and then removing it from the driving substrate.

[0045] Figure 14 Schematic cross-sectional structure diagram showing that the top surface of the second adjusting part is flush with the top surface of the driving electrode and the top surface of the first adjusting part is lower than the top surface of the driving electrode in an embodiment of the present disclosure.

[0046] Figure 15 Shows the light-emitting chip and Figure 14 Schematic process structure diagram after binding the light-emitting chip to the driving substrate and then removing it from the driving substrate.

[0047] Figure 16 Schematic cross-sectional structure diagram showing that the top surface of the second adjusting part is flush with the top surface of the driving electrode and the top surface of the first adjusting part is higher than the top surface of the driving electrode in an embodiment of the present disclosure.

[0048] Figure 17 shows the flow structure diagram after the light-emitting chip is bonded to the Figure 16 driver substrate in

[0049] Figure 18 shows the flow diagram of the method for preparing the driver substrate in the embodiments of the present disclosure.

[0050] Figure 19 shows a flow structure diagram of the method for preparing the driver substrate in the embodiments of the present disclosure.

[0051] Figure 20 shows the light-emitting chip and Figure 19 the flow structure diagram of the bonding of the driver substrate in

[0052] Figure 21 shows the process of Figure 20 unbonding the faulty light-emitting chip in and removing the bonding material from the driver substrate.

[0053] Figure 22 shows another flow structure diagram of the method for preparing the driver substrate in the embodiments of the present disclosure.

[0054] Figure 23 shows the flow structure diagram of removing the bonding material on the driver substrate that is greater than the first bonding thickness in the embodiments of the present disclosure.

[0055] Description of reference numerals:

[0056] 100, driver substrate; 11, substrate; 12, driving layer; 13, driving electrode; 13a, metal material; 14, adjusting layer; 141, first adjusting portion; 142, second adjusting portion; 143, lower adjusting portion; 144, upper adjusting portion; 145, deformation layer; 146, control electrode; 14a, adjusting material; 15, spacer layer; 15a, insulating material; 2, light-emitting chip; 21, main body portion; 22, connecting electrode; 3, bonding material. Detailed implementation manners

[0057] Now, the exemplary embodiments will be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more complete and comprehensive, and will fully convey the concept of the exemplary embodiments to those skilled in the art.

[0058] In addition, the described features, structures, or characteristics may be combined in one or more embodiments in any suitable manner. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of the present application. However, those skilled in the art will realize that the technical solutions of the present application may be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be employed. In other cases, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the present application.

[0059] The present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted here that the technical features involved in the various embodiments of the present application described below can be combined with each other as long as they do not conflict with each other. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present application and should not be construed as a limitation of the present application.

[0060] As Figure 1 and Figure 2 shown, the driving substrate generally includes a substrate 11 and driving electrodes 13 disposed on the substrate 11. Before the light-emitting chip 2 is bonded to the driving substrate, a bonding material 3 is disposed on the top surface of the driving electrode 13 facing away from the substrate 11. After the light-emitting chip 2 is pressed onto the bonding material 3 and bonded to the driving electrodes 13 on the driving substrate, there is a situation where the thickness of the bonding material 3 between the light-emitting chip 2 and the driving substrate is uneven.

[0061] Specifically, after the light-emitting chip 2 is bonded to the driving substrate, the thickness of the bonding material 3 between the connecting electrode 22 in the light-emitting chip 2 and the driving electrode 13 is less than the thickness of the bonding material 3 between the main body portion 21 in the light-emitting chip 2 and the substrate 11.

[0062] It should be noted that in the field of display technology, common bonding materials 3 between the driving substrate and the light-emitting chip 2 include solder paste, anisotropic conductive adhesive, etc. When bonding the light-emitting chip 2 and the driving substrate, the bonding material 3 used is a fixed quantity (such as N mg). When repairing a faulty light-emitting chip 2 and then bonding a new light-emitting chip 2 again, an equal amount (such as N mg) of the bonding material 3 will be filled. If the residual bonding material 3 is not removed, it will cause too much bonding material 3, resulting in poor bonding accuracy and even the risk of short circuit.

[0063] In addition, the residual amount of the bonding material 3 remaining on the driving substrate is not fixed and cannot be identified (such as remaining X mg), so the total amount of the bonding material 3 cannot be compensated by refilling (such as compensating N - X mg).

[0064] Moreover, when the bonding material 3 is an anisotropic conductive adhesive, since the anisotropic conductive adhesive is a thermocompression adhesive, the light-emitting chip 2 and the driving substrate are physically connected through high temperature and high pressure. At the same time, the insulating shell of the conductive particles inside the conductive adhesive is compressed under high temperature and high pressure to expose the conductive layer, realizing the electrical connection between the light-emitting chip 2 and the driving substrate. When the bonding material 3 is an anisotropic conductive adhesive, after removing the light-emitting chip 2, both the physical connection and electrical connection functions of the anisotropic conductive adhesive fail. Therefore, it is necessary to first remove the anisotropic conductive adhesive on the driving substrate and then use a new anisotropic conductive adhesive to realize its functions through high temperature and high pressure again.

[0065] Currently, when repairing the faulty light-emitting chip 2 on the driving substrate, the laser cleaning technology is usually used to clean the bonding material 3. Since the thickness of the bonding material 3 between the light-emitting chip 2 and the driving substrate is uneven, and the thickness of the bonding material 3 on the driving electrode 13 is relatively thin, when uniformly receiving the laser to clean the bonding material 3 between the light-emitting chip 2 and the driving substrate, the area corresponding to the driving electrode 13 may receive too much laser irradiation energy, resulting in damage to the driving electrode 13.

[0066] To solve the above technical problems, as Figure 3 shown, the present disclosure provides a driving substrate 100, which includes a substrate 11, a driving electrode group, and an adjustment layer 14. The driving electrode group is disposed on the substrate 11 and includes two driving electrodes 13 arranged at intervals, and the driving electrode 13 is configured to be correspondingly bonded to the connection electrode 22 in the light-emitting chip 2. The adjustment layer 14 and the driving electrode group are disposed on the same side of the substrate 11. The adjustment layer 14 at least includes a first adjustment portion 141, and the first adjustment portion 141 is located between the two driving electrodes 13 in the driving electrode group, and the top surface of the first adjustment portion 141 is higher than the top surface of the driving electrode 13.

[0067] It should be noted that the driving substrate 100 in the present disclosure may include a plurality of driving electrode groups arranged at intervals in an array. At this time, the first adjustment portion 141 is disposed between the two driving electrodes 13 in the same driving electrode group.

[0068] It should also be noted that the top surface of the first adjustment portion 141 in the present disclosure refers to the surface of the first adjustment portion 141 facing away from the substrate 11, and the top surface of the driving electrode 13 refers to the surface of the driving electrode 13 facing away from the substrate 11.

[0069] Since the bonding material 3 has fluidity, when the light-emitting chip 2 is bonded to the driving substrate 100, the light-emitting chip 2 is pressed on the bonding material 3 on the driving substrate 100, and the bonding material 3 between the light-emitting chip 2 and the driving substrate 100 will flow and diffuse around under the extrusion action to discharge the excess bonding material 3, realizing the electrical connection between the connection electrode 22 and the driving electrode 13.

[0070] In the present disclosure, the adjustment layer 14 is configured to make the first bonding thickness and the second bonding thickness satisfy a set condition. Herein, the first bonding thickness is defined as the thickness of the bonding material 3 between the connection electrode 22 and the driving electrode 13 after they are bonded, and the second bonding thickness is defined as the thickness of the bonding material 3 between the first adjustment portion 141 and the main body portion 21 of the light-emitting chip 2 after the connection electrode 22 and the driving electrode 13 are bonded. The set condition is defined as: when the driving electrode group is irradiated with a laser to etch the bonding material 3 between the connection electrode 22 and the driving electrode 13, there is no bonding material 3 between the first adjustment portion 141 and the main body portion 21.

[0071] It should be noted that when there are multiple driving electrode groups on the driving substrate 100, the driving substrate 100 can be divided into multiple bonding units according to the positions of the respective driving electrode groups. When repairing the faulty light-emitting chip 2 on the driving substrate 100, the repair can be performed for the bonding unit where the faulty light-emitting chip 2 is located.

[0072] In the present disclosure, by providing the adjustment layer 14 in the driving substrate 100 to adjust the thickness of the bonding material 3 between the main body portion 21 and the substrate 11 by means of the first adjustment portion 141, it is then possible that when the driving electrode group is irradiated with a laser to etch the bonding material 3 between the connection electrode 22 and the driving electrode 13, there is no bonding material 3 between the first adjustment portion 141 and the main body portion 21, thus improving the problem that in the case of uniformly receiving laser cleaning, due to the relatively thin thickness of the bonding material 3 between the driving electrode 13 and the connection electrode 22, too much laser irradiation energy is received in the area corresponding to the driving electrode group, and the driving electrode 13 is damaged.

[0073] Meanwhile, by making the first bonding thickness and the second bonding thickness satisfy the set condition, the present disclosure can also improve the problem that due to the excessive thickness of the bonding material 3 on the first adjustment portion 141, the bonding material 3 on the first adjustment portion 141 cannot be completely removed, and then when the light-emitting chip 2 is rebonded in the same area next time, due to the excessive thickness of the bonding material 3 on the first adjustment portion 141, the electrical connection between the driving electrode 13 and the connection electrode 22 is hindered, that is, the problem that before the connection electrode 22 is electrically connected to the driving electrode 13, the first adjustment portion 141 has directly abutted against the main body portion 21 due to the excessive thickness of the bonding material 3 on the first adjustment portion 141, thereby improving the bonding yield of the light-emitting chip 2 and the driving substrate 100.

[0074] In some embodiments, there is bonding material 3 between the connection electrode 22 and the driving electrode 13, and between the main body portion 21 and the first adjustment portion 141, that is, both the first bonding thickness and the second bonding thickness are greater than zero.

[0075] Exemplarily, when the light-emitting chip 2 is bonded to the driving electrode group, the height difference between the first adjusting portion 141 and the driving electrode 13 may be equal to the height of the connecting electrode 22.

[0076] It should be noted that the distance between the main body portion 21 and the substrate 11 is equal everywhere. That is, the sum of the height of the connecting electrode 22, the height of the driving electrode 13 corresponding to the connecting electrode 22, and the first bonding thickness corresponding to the connecting electrode 22 is equal to the sum of the height of the corresponding first adjusting portion 141 and the corresponding second bonding thickness.

[0077] As Figure 4 and Figure 5 shown, since the height difference between the first adjusting portion 141 and the driving electrode 13 is equal to the height of the connecting electrode 22, at this time, the first bonding thickness and the second bonding thickness in the embodiments of the present disclosure are also equal. In the case of uniformly receiving laser cleaning, the bonding material 3 between the driving electrode 13 and the connecting electrode 22 can be removed simultaneously with the bonding material 3 between the main body portion 21 and the first adjusting portion 141.

[0078] In another example, when the light-emitting chip 2 is bonded to the driving electrode group, the height difference between the first adjusting portion 141 and the driving electrode 13 may not be equal to the height of the connecting electrode 22.

[0079] For example, the height difference between the first adjusting portion 141 and the driving electrode 13 in the embodiments of the present disclosure may be slightly greater than the height of the connecting electrode 22. At this time, both the first bonding thickness and the second bonding thickness are greater than zero, and the second bonding thickness is less than the first bonding thickness.

[0080] Specifically, when the bonding material 3 on the first adjusting portion 141 is completely removed, the laser continues to remove the bonding material 3 on the driving substrate 100 until the bonding material 3 on the driving electrode 13 is completely removed. Since the second bonding thickness is less than the first bonding thickness, after removing the bonding material 3 with the second bonding thickness, the laser will etch the first adjusting portion 141. And after removing the bonding material 3 with the first bonding thickness, the height of the first adjusting portion 141 on the driving substrate 100 can be greater than the height of the driving electrode 13 to ensure that when the light-emitting chip 2 is bonded again in the same bonding unit, the adjusting layer 14 can still make the first bonding thickness and the second bonding thickness meet the set conditions. In addition, the embodiments of the present disclosure set the adjusting layer 14 to block the laser, so as to improve the problem of damage to structural layers such as the driving layer 12 between the substrate 11 and the driving electrode group caused by excessive laser irradiation energy after the bonding material 3 with the first bonding thickness is etched.

[0081] It should be noted that in the embodiments of the present disclosure, the adjusting layer 14 can also be made of a material that is not affected by laser etching, so as to improve the problem that when the top surface of the first adjusting portion 141 is lower than the top surface of the driving electrode 13, the first bonding thickness and the second bonding thickness cannot meet the set conditions.

[0082] In some embodiments, there is a bonding material 3 between the connecting electrode 22 and the driving electrode 13, and there may be no bonding material 3 between the main body portion 21 and the first adjusting portion 141. That is, the first bonding thickness is greater than zero, and the second bonding thickness is equal to zero.

[0083] As Figure 6 shown, at this time, the sum of the height of the connecting electrode 22, the height of the driving electrode 13 corresponding to the connecting electrode 22, and the first bonding thickness corresponding to the connecting electrode 22 is equal to the height of the corresponding first adjusting portion 141. That is, the height difference between the first adjusting portion 141 and the driving electrode 13 in the embodiments of the present disclosure is equal to the sum of the height of the connecting electrode 22 and the first bonding thickness. When the driving electrode 13 and the connecting electrode 22 are bonded, the main body portion 21 and the first adjusting portion 141 are in direct contact.

[0084] In the embodiments of the present disclosure, by making the height difference between the first adjusting portion 141 and the driving electrode 13 equal to the sum of the height of the connecting electrode 22 and the first bonding thickness, the first adjusting portion 141 and the main body portion 21 are in direct contact and play a role of pressing and limiting, so as to improve the situation that during the process of pressing the light-emitting chip 2 onto the driving substrate 100, due to unstable pressing force, after bonding, the first bonding thickness and the second bonding thickness cannot meet the set conditions.

[0085] In some embodiments, the value range of the first bonding thickness can be: 100 μm - 300 μm.

[0086] Exemplarily, the value of the first bonding thickness can be: 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, etc., but not limited thereto. The value of the first bonding thickness can be set according to the actual situation.

[0087] Define the height difference between the first adjusting portion 141 and the driving electrode 13 as △H.

[0088] In some embodiments, the value range of △H can be: 0 μm - 600 μm, where △H ≠ 0.

[0089] Exemplarily, the value of the first bonding thickness can be: 50 μm, 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 550 μm, 600 μm, etc., but not limited thereto. The value of △H can be set according to the actual situation.

[0090] In some embodiments, the heights of two driving electrodes 13 in the same driving electrode group may be equal. Correspondingly, the heights of two connecting electrodes 22 in the light-emitting chip 2 bound to the driving electrode group are also equal.

[0091] However, it is not limited thereto. In other embodiments, the heights of two driving electrodes 13 in the same driving electrode group may also be unequal.

[0092] Exemplarily, in the light-emitting chip 2 and the driving electrode group that are bound to each other, the height difference between two connecting electrodes 22 in the light-emitting chip 2 should be equal to the height difference between two driving electrodes 13 in the corresponding driving electrode group. Among them, the driving electrode 13 with a larger height is correspondingly bound to the connecting electrode 22 with a smaller height, and the driving electrode 13 with a smaller height is correspondingly bound to the connecting electrode 22 with a larger height.

[0093] In some embodiments, the adjusting layer 14 may include a second adjusting portion 142, and the second adjusting portion 142 is located between adjacent driving electrode groups.

[0094] Among them, in some exemplary embodiments, the top surface of the second adjusting portion 142 may be higher than the top surface of the driving electrode 13. After the connecting electrode 22 is bound to the driving electrode 13, the thickness of the binding material 3 on the second adjusting portion 142 may be equal to the first binding thickness. For details, reference may be made to Figure 7 and Figure 9 as shown.

[0095] It should be noted that the top surface of the second adjusting portion 142 refers to the surface of the second adjusting portion 142 facing away from the substrate 11.

[0096] Since the top surface of the second adjusting portion 142 is higher than the top surface of the driving electrode 13, when the binding material 3 is formed on the driving substrate 100, the thickness of the binding material 3 on the driving electrode 13 is greater than the thickness of the binding material 3 on the second adjusting portion 142; after the light-emitting chip 2 is bound to the driving electrode group, the connecting electrode 22 can squeeze at least part of the binding material 3 on the driving electrode 13 onto the second adjusting portion 142 until the thickness of the binding material 3 on the second adjusting portion 142 is equal to the first binding thickness.

[0097] In the embodiments of the present disclosure, by making the top surface of the second adjusting portion 142 higher than the top surface of the driving electrode 13, after the connecting electrode 22 and the driving electrode 13 are bonded, the thickness of the bonding material 3 on the second adjusting portion 142 can be made equal to the first bonding thickness, so that when the bonding material 3 on the bonding unit corresponding to the faulty light-emitting chip 2 is removed by unified laser cleaning, the bonding material 3 on the second adjusting portion 142 can be removed simultaneously with the bonding material 3 on the driving electrode 13. When improving the problem that when the light-emitting chip 2 is bonded multiple times on the same bonding unit, due to the incomplete removal of the bonding material 3 on the second adjusting portion 142, the bonding material 3 on the second adjusting portion 142 accumulates too thickly, and then the overall structure after the driving substrate 100 and the light-emitting chip 2 are bonded is too thick, it can also improve the problem that the bonding material 3 on the second adjusting portion 142 is too thin, resulting in damage to the second adjusting portion 142 and even the structural layers such as the driving layer 12 between the second adjusting portion 142 and the substrate 11.

[0098] However, this is not limited thereto. In some other exemplary embodiments, the top surface of the second adjusting portion 142 may not be higher than the top surface of the driving electrode 13. After the connecting electrode 22 and the driving electrode 13 are bonded, the thickness of the bonding material 3 on the second adjusting portion 142 may not be equal to the first bonding thickness, and it may be determined according to the actual situation specifically.

[0099] As Figure 10 shown, in some embodiments, the adjusting layer 14 may include a lower adjusting portion 143 and an upper adjusting portion 144. The top surface of the lower adjusting portion 143 is flush with the top surface of the driving electrode 13. The upper adjusting portion 144 is located on the side of the lower adjusting portion 143 away from the substrate 11, and in the direction away from the substrate 11, the side wall of the upper adjusting portion 144 close to the driving electrode 13 inclines away from the center of the driving electrode 13.

[0100] It should be noted that the top surface of the lower adjusting portion 143 refers to the surface of the lower adjusting portion 143 away from the substrate 11.

[0101] Exemplarily, the side wall of the lower adjusting portion 143 of the embodiments of the present disclosure close to the driving electrode 13 may be attached to the side wall of the driving electrode 13.

[0102] In the embodiments of the present disclosure, by making the side wall of the upper adjusting portion 144 close to the driving electrode 13 incline away from the center of the driving electrode 13, the requirement for the alignment accuracy of the connecting electrode 22 and the driving electrode 13 is reduced. While improving the alignment accuracy of the connecting electrode 22 and the driving electrode 13 to improve the bonding yield, the alignment rate of the connecting electrode 22 and the driving electrode 13 can also be improved.

[0103] In addition, since the side wall of the upper adjusting portion 144 close to the driving electrode 13 inclines away from the center of the driving electrode 13, asFigure 11 As shown, when the connection electrode 22 is bonded to the driving electrode 13, a gap can be formed between the side wall of the connection electrode 22 and the side wall of the upper adjusting portion 144, making it easier to squeeze the bonding material 3 between the driving electrode 13 and the connection electrode 22 to the periphery of the driving electrode 13.

[0104] Define the included angle between the side wall of the upper adjusting portion 144 close to the driving electrode 13 and the horizontal plane as θ.

[0105] In some embodiments, the value range of θ can be: 60° < θ < 90°.

[0106] For example, the value of θ can be: 65°, 70°, 75°, 80°, 85°, etc., which can be determined according to the actual situation.

[0107] By limiting the value range of θ in the embodiments of the present disclosure, the problem that a higher alignment accuracy is required for the light-emitting chip 2 and the driving electrode 13 due to an overly large θ can be improved. At the same time, the problem that the bonding material 3 accumulates too thickly on the inclined side wall of the upper adjusting portion 144, thereby hindering the next alignment and bonding of the light-emitting chip 2 and the driving electrode 13, can also be improved.

[0108] In some embodiments, the adjusting layer 14 can be made of an insulating material.

[0109] For example, when the side wall of the adjusting layer 14 is attached to the side wall of the driving electrode 13, by making the adjusting layer 14 of an insulating material, the problem of mutual interference between adjacent driving electrodes 13 can be reduced.

[0110] Exemplarily, the adjusting layer 14 in the embodiments of the present disclosure can include insulating materials such as resin and silicon dioxide, but is not limited thereto. The adjusting layer 14 can also be made of other insulating materials other than resin and silicon dioxide, which can be determined according to the actual situation.

[0111] In some embodiments, the adjusting layer 14 can be made of an electro-deformable material.

[0112] Among them, the adjusting layer 14 can include a deformation layer 145 and a control electrode 146. The control electrode 146 is configured to apply a voltage to the deformation layer 145 to control the deformation of the deformation layer 145.

[0113] Specifically, under the drive of the voltage, the adjusting layer 14 can deform in the height direction; after removing the voltage on the adjusting layer 14, the adjusting layer 14 restores its deformation.

[0114] In the embodiments of the present disclosure, before bonding the connecting electrode 22 to the driving electrode 13, a voltage can be applied to the first adjusting portion 141 to make the top surface of the first adjusting portion 141 higher than the top surface of the driving electrode 13, so that after the connecting electrode 22 squeezes the bonding material 3 on the driving electrode 13 to the periphery, the first bonding thickness and the second bonding thickness can meet the set conditions.

[0115] In addition, during the bonding process of the connecting electrode 22 and the driving electrode 13, the embodiments of the present disclosure can also apply a voltage to the first adjusting portion 141 to adjust the thickness of the bonding material 3 located between the first adjusting portion 141 and the main body portion 21 of the light-emitting chip 2. Furthermore, it can improve the problem that it is difficult to make the first bonding thickness and the second bonding thickness meet the set conditions due to the inability to precisely control the pressing force when the light-emitting chip 2 is pressed on the driving substrate 100, and then the bonding rate between the light-emitting chip 2 and the driving substrate 100 can be increased.

[0116] In some embodiments, the electroactive deformation material can be an azobenzene molecular elastomer, but it is not limited thereto. Among other dielectric elastomers except azobenzene molecular elastomers, if there is an electroactive polymer that can generate a strain response to an external electric field, and under an applied external electric field, it can cause the adjusting layer 14 to change in the height direction and can restore the adjusting layer 14 to its original state after the external electric field is removed, all can be used as the material for making the adjusting layer 14 in the present disclosure.

[0117] In some embodiments, the adjusting layer 14 can be arranged at intervals from the driving electrode 13.

[0118] Among them, the distance between the adjusting layer 14 and the driving electrode 13 should be not less than 1 um, so as to reduce the problem that mutual interference may occur between the adjusting layer 14 and the driving electrode 13, or even cause a short circuit.

[0119] As Figure 12 shown, in some embodiments, when the adjusting layer 14 is made of an electroactive deformation material and the heights of the two driving electrodes 13 in the driving electrode group are equal, the top surface of the adjusting layer 14 can be made flush with the top surface of the driving electrode 13 before applying a voltage to the adjusting layer 14. That is, when setting the adjusting layer 14 on the substrate 11, the top surface of the adjusting layer 14 can be directly made flush with the top surface of the driving electrode 13. At this time, the top surface of the adjusting layer 14 and the top surface of the driving electrode 13 are on the same horizontal plane.

[0120] As Figure 13 shown, the embodiments of the present disclosure can apply to Figure 12A voltage is applied to the adjustment layer 14 in the driving substrate 100 to adjust the height of the adjustment layer 14 so that the top surface of the adjustment layer 14 is higher than the top surface of the driving electrode 13. After the height of the adjustment layer 14 is adjusted, a bonding material 3 is disposed on the driving substrate 100, and the light-emitting chip 2 is pressed onto the driving substrate 100. Wherein, when the light-emitting chip 2 is bonded to the driving substrate 100, the first bonding thickness and the second bonding thickness satisfy the set conditions. When the voltage on the adjustment layer 14 is removed, since the top surface of the adjustment layer 14 returns to the same height as the driving electrode 13, it is possible to improve the interference between the side walls of the groove formed by the uneven laser light during laser cleaning and the uneven top surface structure layer (such as the adjustment layer 14, the driving electrode 13, and the bonding material 3), thereby causing damage to the side walls of the groove and incomplete removal of the bonding material 3.

[0121] In some embodiments, when the adjustment layer 14 is made of an electro-deformable material, the top surface of the adjustment layer 14 can also be higher or lower than the top surface of the driving electrode 13 before applying a voltage to the adjustment layer 14.

[0122] Exemplarily, as Figure 14 shown, when the adjustment layer 14 includes a first adjustment portion 141 and a second adjustment portion 142, the top surface of the second adjustment portion 142 can be flush with the top surface of the driving electrode 13, and the top surface of the first adjustment portion 141 can be lower than the top surface of the driving electrode 13 before applying a voltage to the adjustment layer 14.

[0123] As Figure 15 shown, the embodiments of the present disclosure can be directed to Figure 14In the driving substrate 100, the first adjusting portion 141 and the second adjusting portion 142 apply the same magnitude of voltage, so that the first adjusting portion 141 and the second adjusting portion 142 undergo the same magnitude of deformation in the height direction. After adjusting the heights of the first adjusting portion 141 and the second adjusting portion 142, a bonding material 3 is disposed on the driving substrate 100, and the light-emitting chip 2 is pressed onto the driving substrate 100. Wherein, when the light-emitting chip 2 is bonded to the driving substrate 100, the first bonding thickness and the second bonding thickness satisfy the set conditions, and the second bonding thickness is not equal to zero. After completing the bonding of the light-emitting chip 2 and the driving substrate 100, the voltage on the adjusting layer 14 is removed, and the adjusting layer 14 restores its deformation. Since the magnitudes of the voltages applied to the first adjusting portion 141 and the second adjusting portion 142 are the same, in the embodiments of the present disclosure, the first adjusting portion 141, the second adjusting portion 142 can be connected to the same control electrode 146, that is, one control electrode 146 can be used to connect to the first adjusting portion 141 and the second adjusting portion 142 at the same time, and then the setting of the control electrode 146 can be reduced to reduce the manufacturing cost of the driving substrate 100 and reduce the complexity of controlling the deformation of the adjusting layer 14. In addition, after removing the voltage on the adjusting layer 14, the top surface of the adjusting layer 14 is not higher than the top surface of the driving electrode 13, thereby improving the problem that the adjusting layer 14 causes an increase in the thickness of the driving substrate 100.

[0124] As Figure 16 shown, in another example, when the adjusting layer 14 includes the first adjusting portion 141 and the second adjusting portion 142, before applying a voltage to the adjusting layer 14, the top surface of the second adjusting portion 142 can be flush with the top surface of the driving electrode 13, and the top surface of the first adjusting portion 141 can be higher than the top surface of the driving electrode 13.

[0125] As Figure 17 shown, the embodiments of the present disclosure can apply Figure 16The first adjustment part 141 and the second adjustment part 142 in the driving substrate 100 apply the same magnitude of voltage, so that the first adjustment part 141 and the second adjustment part 142 undergo the same magnitude of deformation in the height direction. After adjusting the heights of the first adjustment part 141 and the second adjustment part 142, a bonding material 3 is provided on the driving substrate 100, and the light-emitting chip 2 is pressed onto the driving substrate 100. Among them, when the light-emitting chip 2 is bonded to the driving substrate 100, the first bonding thickness and the second bonding thickness meet the set conditions, and the second bonding thickness is equal to zero. Since the magnitudes of the voltages applied to the first adjustment part 141 and the second adjustment part 142 are the same, in the embodiments of the present disclosure, the first adjustment part 141, the second adjustment part 142 can be connected to the same control electrode 146, that is, one control electrode 146 can be used to connect to the first adjustment part 141 and the second adjustment part 142 at the same time, and then the setting of the control electrode 146 can be reduced to reduce the manufacturing cost of the driving substrate 100 and reduce the complexity of controlling the deformation of the adjustment layer 14.

[0126] In some embodiments, when the adjustment layer 14 and the driving electrode 13 are arranged at intervals, the driving substrate 100 may include a spacer layer 15. The spacer layer 15 is located between the adjustment layer 14 and the driving electrode 13, and the spacer layer 15 has insulation properties to be configured to separate the driving electrode 13 and the adjustment layer 14.

[0127] Exemplarily, the height of the spacer layer 15 in the embodiments of the present disclosure may be equal to the height of the driving electrode 13, so as to realize the insulation between the adjustment layer 14 and the driving electrode 13, and at the same time, it can also reduce the hindrance to the alignment bonding between the connection electrode 22 and the driving electrode 13 when the spacer layer 15 is too high.

[0128] Among them, the value of the width of the spacer layer 15 should not be less than 1um.

[0129] It should be noted that the width of the spacer layer 15 refers to the distance between the side wall of the adjustment layer 14 and the side wall of the adjacent driving electrode 13 in the figure.

[0130] Reference Figures 18 to 21 As shown, the embodiments of the present disclosure also provide a preparation method of a driving substrate 100. The preparation method may include:

[0131] S1. Provide a substrate.

[0132] S2. Form a driving electrode group on the substrate; the driving electrode group includes two driving electrodes arranged at intervals, and the driving electrodes are configured to be bonded to the connection electrodes of the light-emitting chip.

[0133] S3. Form an adjustment layer on the substrate. The adjustment layer and the driving electrode group are on the same side of the substrate. The adjustment layer includes a first adjustment portion located between two driving electrodes in the driving electrode group. Among them, the top surface of the first adjustment portion is higher than the top surface of the driving electrode. The adjustment layer is configured to make the first bonding thickness and the second bonding thickness meet the set conditions. The first bonding thickness is defined as the thickness of the bonding material between the connection electrode and the driving electrode after bonding. The second bonding thickness is defined as the thickness of the bonding material between the first adjustment portion and the main body portion of the light-emitting chip after bonding between the connection electrode and the driving electrode. The set condition is defined as: when the driving electrode group is irradiated with laser to etch the bonding material between the connection electrode and the driving electrode, there is no bonding material between the first adjustment portion and the main body portion.

[0134] As Figure 19 shown, in some embodiments, before forming the driving electrode group, a driving layer 12 can be formed on the substrate 11 first to implement functions such as data processing, transmission, and signal conversion in the driving substrate 100 by using the driving layer 12.

[0135] Among them, the driving layer 12 and the driving electrode group are on the same side of the substrate 11, and the driving layer 12 can cover the corresponding side surface of the substrate 11.

[0136] As Figure 19 shown, in some embodiments, the step of forming the driving electrode group on the substrate 11 may include: coating a metal material 13a on the substrate 11, and the metal material 13a can cover the corresponding side surface of the substrate 11. Patterning the metal material 13a to form a plurality of driving electrode groups arranged at intervals, and the driving electrode group includes two driving electrodes 13 arranged at intervals.

[0137] It should be noted that when the driving layer 12 is provided in the driving substrate 100, the driving electrode 13 is located on the side of the driving layer 12 away from the substrate 11.

[0138] As Figure 19 shown, in some embodiments, the step of forming the adjustment layer 14 on the substrate 11 may include: coating an adjustment material 14a on the substrate 11, and the adjustment material 14a covers the substrate 11 and the driving electrode 13. Patterning the adjustment material 14a to expose the top surface of the driving electrode 13 and form the adjustment layer 14.

[0139] As Figure 20As shown in the figure, before the preparation of the driving substrate 100 is completed and before the light-emitting chip 2 is bonded to the driving substrate 100, the bonding material 3 is first disposed on the driving substrate 100. Generally, the amount of the bonding material 3 disposed on the driving substrate 100 each time is fixed, and the surface of the bonding material 3 on the driving substrate 100 facing away from the substrate 11 is parallel to the horizontal plane. The bonding material 3 can realize the electrical connection between the driving electrode 13 and the connecting electrode 22, and can play a buffering role in the bonding of the light-emitting chip 2 and the driving substrate 100.

[0140] As Figure 20 shown in the figure, after the bonding material 3 is formed on the driving substrate 100, the light-emitting chip 2 is aligned with the corresponding driving electrode group on the driving substrate 100, and then the light-emitting chip 2 is pressed onto the bonding material 3 to complete the bonding of the light-emitting chip 2 and the driving substrate 100 through the bonding material 3. After the light-emitting chip 2 is bonded to the driving substrate 100, the thickness of the bonding material 3 between the connecting electrode 22 and the driving electrode 13 and the thickness of the bonding material 3 between the first adjusting portion 141 and the main body portion 21 can meet the set conditions under the action of the adjusting layer 14, that is, when the bonding material 3 between the connecting electrode 22 and the driving electrode 13 is etched by irradiating the driving electrode group with a laser, there is no bonding material 3 between the first adjusting portion 141 and the main body portion 21.

[0141] As Figure 21 shown in the figure, when the light-emitting chip 2 bonded to the driving substrate 100 fails, the faulty light-emitting chip 2 can be first unbonded from the driving substrate 100, and then the bonding material 3 on the driving substrate 100 can be cleaned by laser to facilitate the re-bonding of the light-emitting chip 2 on this bonding unit.

[0142] In the embodiment of the present disclosure, the driving substrate 100 prepared by the above preparation method can adjust the thickness of the bonding material 3 between the main body portion 21 and the substrate 11 by using the adjusting layer 14, and then can improve the problem that when repairing the faulty light-emitting chip 2 on the driving substrate 100, under the condition of uniformly receiving laser cleaning, due to the thin thickness of the bonding material 3 between the driving electrode 13 and the connecting electrode 22, too much laser irradiation energy is received in the area corresponding to the driving electrode group, resulting in damage to the driving electrode 13.

[0143] At the same time, by making the first bonding thickness and the second bonding thickness meet the set conditions, the present disclosure can also improve the problem that due to the excessive thickness of the bonding material 3 on the first adjusting portion 141, the bonding material 3 on the first adjusting portion 141 cannot be completely removed, and then when the light-emitting chip 2 is re-bonded in the same area next time, the excessive thickness of the bonding material 3 on the first adjusting portion 141 hinders the electrical connection between the driving electrode 13 and the connecting electrode 22, thereby improving the bonding yield of the light-emitting chip 2 and the driving substrate 100.

[0144] In some embodiments, the adjustment layer 14 is made of an electro-deformable material, and there may be a gap between the adjustment layer 14 and the driving electrode 13. Under the drive of a voltage, the adjustment layer 14 can deform in the height direction; after the voltage on the adjustment layer 14 is removed, the adjustment layer 14 restores its deformation.

[0145] Wherein, before the connection electrode 22 and the driving electrode 13 are bonded, a voltage can be applied to the first adjustment portion 141 to make the top surface of the first adjustment portion 141 higher than the top surface of the driving electrode 13, so that after the light-emitting chip 2 and the driving substrate 100 are bonded, the first bonding thickness and the second bonding thickness can meet the set conditions.

[0146] Specifically, after the driving substrate 100 is formed and before the bonding material 3 is disposed on the driving substrate 100, a voltage can be applied to the adjustment layer 14 to adjust the height of the adjustment layer 14.

[0147] However, not limited thereto, the present disclosure can also apply a voltage to the adjustment layer 14 after the bonding material 3 is disposed on the driving substrate 100 and before the light-emitting chip 2 and the driving substrate 100 are bonded, so as to adjust the height of the adjustment layer 14.

[0148] In some embodiments, during the bonding process of the connection electrode 22 and the driving electrode 13, a voltage can be applied to the first adjustment portion 141 to adjust the thickness of the bonding material 3 located between the first adjustment portion 141 and the main body portion 21 of the light-emitting chip 2, thereby improving the problem that it is difficult to make the first bonding thickness and the second bonding thickness meet the set conditions due to the difficulty in precisely controlling the pressing force of the light-emitting chip 2 pressed on the driving substrate 100, and then the bonding rate between the light-emitting chip 2 and the driving substrate 100 can be increased.

[0149] In some embodiments, the driving substrate 100 may include a spacer layer 15, the spacer layer 15 is located between the adjustment layer 14 and the driving electrode 13, and the spacer layer 15 has insulation properties to be configured to separate the driving electrode 13 and the adjustment layer 14.

[0150] Specifically, as Figure 22 shown, after the driving electrode group is formed on the substrate 11, an insulating material 15a can be disposed on the substrate 11, and the insulating material 15a can cover the substrate 11 and the driving electrode 13. The insulating material 15a is patterned to form the spacer layer 15. Then, an adjustment material 14a is disposed on the substrate 11, and the adjustment layer 14 is formed by patterning the adjustment material 14a, thereby completing the preparation of the driving substrate 100.

[0151] It should be noted that, as Figure 23As shown, in some embodiments, the adjustment layer 14 in the driving substrate 100 is made of an electro-deformable material, and the driving substrate 100 includes a spacer layer 15 located between the adjustment layer 14 and the driving electrode 13. The top surface of the spacer layer 15 is flush with the top surface of the driving electrode 13. In the embodiments of the present disclosure, if after the light-emitting chip 2 is bonded to the driving substrate 100, the first bonding thickness and the second bonding thickness meet the set conditions, then after the adjustment layer 14 restores its deformation and the light-emitting chip 2 is unbonded from the driving substrate 100, the bonding material 3 higher than the first bonding thickness on the surface of the spacer layer 15 facing away from the substrate 11 can be removed first, and then the bonding material 3 on the driving substrate 100 is irradiated with uniform laser to remove the remaining bonding material 3 on the driving substrate 100.

[0152] In the description of this specification, the terms "first", "second", etc. are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second" may explicitly or implicitly include one or more of such features. In the description of this application, "a plurality of" means two or more unless otherwise specifically defined.

[0153] In addition, it should be noted that terms such as "upper", "lower", "left", "right" are only used for distinction for convenience of description and do not impose restrictions on the orientation of the embodiments of the present invention. For example, the so-called "upper" can actually be "lower", "left", "right" or other orientations in practice. In the present disclosure, unless otherwise clearly specified and limited, terms such as "assembly", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0154] In the description of this specification, the description with reference to terms such as "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0155] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limitations on the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application. Therefore, any changes or modifications made in accordance with the claims and the description of the present application shall fall within the scope covered by the patent of the present application.

Claims

1. A driving substrate, characterized in that: include: substrate; A driving electrode group, disposed on the substrate, the driving electrode group comprising two driving electrodes arranged at intervals, the driving electrodes being configured to be bound correspondingly to the connecting electrodes of the light-emitting chip; an adjustment layer, which is disposed on the same side of the substrate as the driving electrode group, and comprises a first adjustment portion, wherein the first adjustment portion is located between two driving electrodes in the driving electrode group; Among them, the top surface of the first adjustment part is higher than the top surface of the driving electrode, and the adjustment layer is configured to make the first binding thickness and the second binding thickness meet the set conditions, the first binding thickness is defined as the thickness of the binding material between the connecting electrode and the driving electrode after the two are bound, and the second binding thickness is defined as the thickness of the binding material between the first adjustment part and the main body of the light-emitting chip after the connecting electrode and the driving electrode are bound, and the set condition is defined as: when the driving electrode group is irradiated with laser to etch the binding material between the connecting electrode and the driving electrode, there is no binding material between the first adjustment part and the main body.

2. The driving substrate according to claim 1, characterized in that: The height difference between the first adjusting portion and the driving electrode is equal to the height of the connecting electrode; or, A height difference between the first adjusting portion and the driving electrode is equal to a sum of a height of the connecting electrode and the first binding thickness.

3. The driving substrate according to claim 1, characterized in that: The adjustment layer includes a second adjustment portion, the second adjustment portion is located between adjacent driving electrode groups, and the top surface of the second adjustment portion is higher than the top surface of the driving electrode; after the connecting electrode is bound to the driving electrode, the thickness of the binding material on the second adjustment portion is equal to the first binding thickness.

4. The driving substrate according to claim 1, characterized in that: The adjustment layer is made of insulating material; the adjustment layer includes a lower adjustment portion and an upper adjustment portion, the top surface of the lower adjustment portion is flush with the top surface of the driving electrode, and the side wall of the lower adjustment portion close to the driving electrode is in contact with the side wall of the driving electrode; the upper adjustment portion is located on the side of the lower adjustment portion away from the substrate, and in the direction away from the substrate, the side wall of the upper adjustment portion close to the driving electrode is inclined toward the side away from the center of the driving electrode.

5. The driving substrate according to claim 4, characterized in that: The angle between the side wall of the upper regulating portion close to the driving electrode and the horizontal plane is defined as θ, and the value range of θ is: 60°<θ<90°.

6. The driving substrate according to claim 1, characterized in that: The adjustment layer is made of an electrodeformable material, and is spaced apart from the driving electrode; the adjustment layer can be deformed in the height direction under the drive of a voltage; after the voltage on the adjustment layer is removed, the adjustment layer recovers its deformation; wherein: Before the connection electrode is bound to the driving electrode, a voltage is applied to the first adjustment portion so that a top surface of the first adjustment portion is higher than a top surface of the driving electrode; and / or, During the binding process of the connection electrode and the driving electrode, a voltage is applied to the first adjustment part to adjust the thickness of the binding material between the first adjustment part and the main body of the light emitting chip.

7. The driving substrate according to claim 6, characterized in that: The heights of the two driving electrodes in the driving electrode group are equal; before the voltage is applied to the adjustment layer, the top surface of the adjustment layer is flush with the top surface of the driving electrode.

8. The driving substrate according to claim 6, characterized in that: The driving substrate includes a spacer layer, the spacer layer is located between the adjustment layer and the driving electrode, and the spacer layer has an insulating property so as to be configured to separate the driving electrode from the adjustment layer.

9. A method for preparing a driving substrate, characterized in that: The preparation method comprises: providing a substrate; A driving electrode group is formed on the substrate; the driving electrode group includes two driving electrodes arranged at intervals, and the driving electrodes are configured to be bound to the connecting electrodes of the light-emitting chip; An adjustment layer is formed on the substrate, wherein the adjustment layer and the driving electrode group are located on the same side of the substrate; the adjustment layer includes a first adjustment portion, wherein the first adjustment portion is located between two driving electrodes in the driving electrode group; wherein the top surface of the first adjustment portion is higher than the top surface of the driving electrode, and the adjustment layer is configured to make a first binding thickness and a second binding thickness satisfy a set condition, wherein the first binding thickness is defined as the thickness of the binding material between the connecting electrode and the driving electrode after the two are bound, and the second binding thickness is defined as the thickness of the binding material between the first adjustment portion and the main body of the light-emitting chip after the connecting electrode and the driving electrode are bound, and the set condition is defined as: when the driving electrode group is irradiated with a laser to etch the binding material between the connecting electrode and the driving electrode, there is no binding material between the first adjustment portion and the main body.

10. The preparation method according to claim 9, characterized in that: The adjustment layer is made of an electrodeformable material; the adjustment layer is spaced apart from the driving electrode; the adjustment layer can be deformed in the height direction under the drive of voltage; after the voltage on the adjustment layer is removed, the adjustment layer recovers its deformation; wherein: Before the connection electrode is bound to the driving electrode, a voltage is applied to the first adjustment portion so that a top surface of the first adjustment portion is higher than a top surface of the driving electrode; and / or, During the binding process of the connecting electrode and the driving electrode, a voltage is applied to the first adjustment part to adjust the thickness of the binding material between the first adjustment part and the main body of the light emitting chip.

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