Display panel, manufacturing method thereof and display device

Abstract

The invention relates to a display panel and a manufacturing method thereof, and a display device, the display panel comprises a substrate, the substrate comprises a first substrate and a plurality of first connecting terminals, the first substrate comprises a first surface and a second surface which are opposite to each other, and a first hole penetrating through the first substrate, and the first connecting terminals are located at one side, far away from the second surface, of the first surface; the first opening exposes at least one first connecting terminal on the second surface; the circuit board is located on the side, away from the first surface, of the second surface, the circuit board comprises a plurality of second connecting terminals and a plurality of second open holes penetrating through the circuit board, the second open holes expose the corresponding second connecting terminals, and each second open hole is communicated with the corresponding first open hole; and the plurality of conductive parts are arranged in one-to-one correspondence with the second open holes, and each conductive part is at least accommodated in the corresponding second open hole and the first open hole and is connected with the corresponding second connecting terminal and the corresponding first connecting terminal. According to the invention, extremely narrow-frame or frameless design can be realized.

Description

Technical Field

[0001] The present application relates to the field of display technologies, and particularly to a display panel, a manufacturing method thereof, and a display device. Background Art

[0002] With the continuous development of display technologies, organic light-emitting diode (OLED) display devices have been widely used in multiple fields such as flat panel displays, flexible displays, vehicle-mounted displays, and solid-state lighting due to their advantages of wide color gamut, high contrast ratio, energy conservation, and foldability.

[0003] With the development of display technologies, how to achieve an extremely narrow bezel or borderless design of a display panel is an urgent problem to be solved. Summary of the Invention

[0004] Based on this, it is necessary to provide a display panel, a manufacturing method thereof, and a display device, aiming to solve the problem of how to achieve an extremely narrow bezel or borderless design of a display panel.

[0005] In a first aspect, an embodiment of the present application provides a display panel, including:

[0006] A substrate, including a first base and a plurality of first connection terminals, the first base including a first surface and a second surface disposed opposite to each other, and at least one first opening penetrating the first base, the first connection terminals being located on a side of the first surface away from the second surface, and at least one of the first connection terminals being exposed on the second surface through the first opening;

[0007] A circuit board, located on a side of the second surface away from the first surface, the circuit board including a plurality of second connection terminals and a plurality of second openings penetrating the circuit board, the second connection terminals and the second openings being provided in one-to-one correspondence, at least a part of the second connection terminals surrounding the corresponding second openings, and the second openings exposing the corresponding second connection terminals, each of the second openings communicating with a corresponding one of the first openings;

[0008] A plurality of conductive parts, the conductive parts being provided in one-to-one correspondence with the second openings, each of the conductive parts being at least accommodated in the corresponding second opening and the first opening, and connecting the corresponding second connection terminal and the corresponding first connection terminal.

[0009] In a second aspect, based on the same inventive concept, the present application further provides a manufacturing method of a display panel, including:

[0010] Provide a substrate, the substrate includes a first base and a plurality of first connection terminals, the first base includes a first surface and a second surface disposed opposite to each other, and at least one first opening penetrating the first base, the first connection terminals are located on a side of the first surface away from the second surface, and at least one of the first connection terminals is exposed on the second surface through the first opening;

[0011] Provide a circuit board, the circuit board includes a plurality of second connection terminals;

[0012] Prepare a plurality of second openings on the circuit board, the second connection terminals and the second openings are arranged in one-to-one correspondence, the second connection terminals at least partially surround the corresponding second openings, and the second openings expose the corresponding second connection terminals;

[0013] Arrange the circuit board on a side of the second surface away from the first surface, and the second openings are arranged in alignment with the first openings;

[0014] Fill a conductive material in the first opening and the corresponding second opening to form a plurality of conductive parts, the conductive parts are arranged in one-to-one correspondence with the second openings, each conductive part is at least accommodated in the corresponding second opening and the first opening, and connects the corresponding second connection terminal and the corresponding first connection terminal.

[0015] In a third aspect, based on the same inventive concept, embodiments of the present application further provide a display device, and the display device includes any one of the display panels provided in the first aspect.

[0016] In the embodiments of the present application, compared with the method of pad bending, the bending area is eliminated, enabling an extremely narrow or borderless design for the display panel, and having various beneficial effects. First, the conductive part is disposed in the corresponding second opening and first opening, eliminating the problems of overflow and diffusion of the conductive part and avoiding short-circuit problems. Second, through one-time alignment of the first substrate and the circuit board, precise alignment of multiple first connection terminals and multiple second connection terminals is achieved. Moreover, since the conductive part is filled into the second opening and the first opening, it can be realized by methods such as one-time filling and then removing the residue on the surface of the circuit board far from the first substrate, resulting in a simple process. Third, the conductive part is disposed in the corresponding second opening and first opening, without additionally increasing the thickness of the display panel, making the display panel thinner, lighter, and smaller in volume. Fourth, the conductive part is filled into the second opening and the first opening to connect the corresponding first connection terminal and second connection terminal. In the plane parallel to the plane where the first substrate is located, it does not occupy the space between two adjacent first connection terminals and does not occupy the space between two adjacent second connection terminals, and can well meet the signal connection requirements of high-end products and a larger number of connection terminals (or more densely arranged connection terminals). BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0018] Figure 1 The first top-down view of the back side of a display panel provided by an embodiment of the present application before setting the circuit board.

[0019] Figure 2 The second top-down view of the back side of a display panel provided by an embodiment of the present application before setting the circuit board.

[0020] Figure 3 The top-down view of the fourth surface of a circuit board provided by an embodiment of the present application.

[0021] Figure 4 The first top-down view of the back side of a display panel provided by an embodiment of the present application after setting the circuit board.

[0022] Figure 5 The first cross-sectional view of a display panel provided by an embodiment of the present application.

[0023] Figure 6The second cross-sectional schematic diagram of a display panel provided by an embodiment of the present application.

[0024] Figure 7 The third cross-sectional schematic diagram of a display panel provided by an embodiment of the present application.

[0025] Figure 8 The fourth cross-sectional schematic diagram of a display panel provided by an embodiment of the present application.

[0026] Figure 9 The fifth cross-sectional schematic diagram of a display panel provided by an embodiment of the present application.

[0027] Figure 10 The flow step schematic diagram of a manufacturing method of a display panel provided by an embodiment of the present application.

[0028] Figure 11 The first intermediate process schematic diagram of a manufacturing method of a display panel provided by an embodiment of the present application.

[0029] Figure 12 The second intermediate process schematic diagram of a manufacturing method of a display panel provided by an embodiment of the present application.

[0030] Figure 13 The third intermediate process schematic diagram of a manufacturing method of a display panel provided by an embodiment of the present application.

[0031] Figure 14 The schematic diagram of a display device provided by an embodiment of the present application.

[0032] Reference numerals:

[0033] Display device 200; Display panel 100; Substrate 10; Circuit board 20; Conductive part 50; First substrate 11; First connection terminal 10d; First surface 111; Second surface 112; First opening 10k; Second connection terminal 20d; Second opening 20k; Adhesive layer 30; Third opening 30k; Third surface 201; Fourth surface 202; First sub-part 51; Second sub-part 52; Third sub-part 53; Fourth sub-part 54;

[0034] Array composite layer 12; Light-emitting layer 13; Encapsulation layer 14; Protection cover plate 15; Circuit board body 21. Detailed implementation manners

[0035] To facilitate the understanding of the present application, the present application will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, these embodiments are provided to make the understanding of the disclosure content of the present application more thorough and comprehensive.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terms used in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0037] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there can also be intermediate elements. Further, when a layer is referred to as being "under" another layer, it can be directly below or there can be one or more intermediate elements. It can also be understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there can also be one or more intermediate elements.

[0038] In cases where "comprising", "having", and "including" as described herein are used, unless an explicit limiting term such as "only", "consisting of", etc. is used, another component can also be added. Unless otherwise mentioned, terms in the singular form can include the plural form and should not be construed as having a quantity of one.

[0039] It should be understood that although terms such as "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, the first element can be referred to as the second element, and similarly, the second element can be referred to as the first element.

[0040] It should also be understood that when interpreting an element, although not explicitly described, the element is interpreted as including an error range, and this error range should be within the acceptable deviation range of a specific value determined by those skilled in the art. For example, "about", "approximate", or "substantially" can mean within one or more standard deviations, which is not limited herein.

[0041] In addition, in the specification, the phrase "schematic diagram of planar distribution" refers to the drawing when observing the target part from above, and the phrase "schematic cross-sectional view" refers to the drawing when observing the cross-section intercepted by vertically cutting the target part from the side.

[0042] In addition, the drawings are not drawn to a 1:1 scale, and the relative dimensions of the various elements are only drawn by way of example in the drawings and not necessarily to the true scale.

[0043] Various modifications and variations can be made to the present application without departing from the spirit or scope thereof, which will be apparent to those skilled in the art. Accordingly, the present application is intended to cover modifications and variations of the present application that fall within the scope of the corresponding claims (claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in the present application can be combined with each other without conflict.

[0044] As described in the background art section, with the development of display technology, how to achieve an extremely narrow bezel or borderless design of a display panel is an urgent problem to be solved. For example, an OLED display panel can reduce the width of the lower bezel of a display by means of pad bending, but it is also impossible to further significantly reduce the bezel or achieve a borderless design.

[0045] Based on the above technical problems, the inventors have found through research that the substrate includes a first base and a plurality of first connection terminals. The first base includes a first surface and a second surface disposed opposite to each other, and at least one first opening penetrating the first base. The first opening exposes at least one first connection terminal on the second surface; the circuit board is located on the side of the second surface away from the first surface. The circuit board includes a plurality of second connection terminals and a plurality of second openings penetrating the circuit board. The second connection terminals and the second openings are arranged in one-to-one correspondence. The second connection terminals at least partially surround the corresponding second openings, and the second openings expose the corresponding second connection terminals. Each second opening communicates with a corresponding first opening; a plurality of conductive parts are arranged in one-to-one correspondence with the second openings. Each conductive part is at least accommodated in the corresponding second opening and first opening, and connects the corresponding second connection terminal and the corresponding first connection terminal; compared with the method of pad bending, the bending area is eliminated. In this way, an extremely narrow border or borderless design of the display panel can be achieved, and there are beneficial effects in many aspects. In the first aspect, the conductive parts are arranged in the corresponding second openings and first openings, and there is no problem of overflow and diffusion of the conductive parts, avoiding short-circuit problems; in the second aspect, the first base and the circuit board achieve precise alignment of a plurality of first connection terminals and a plurality of second connection terminals through one-time alignment, and the conductive parts are filled into the second openings and first openings. It can be achieved by one-time filling and then removing residues on the surface of the circuit board away from the first base, etc., and has the effect of simple process; in the third aspect, the conductive parts are arranged in the corresponding second openings and first openings, and do not additionally increase the thickness of the display panel, making the display panel thinner, lighter, and smaller in volume; in the fourth aspect, the conductive parts are filled into the second openings and first openings to connect the corresponding first connection terminals and second connection terminals. In the plane parallel to the plane where the first base is located, it does not occupy the space between two adjacent first connection terminals and does not occupy the space between two adjacent second connection terminals, and can very well meet the signal connection requirements of high-end products and more connection terminals (or denser connection terminals). Multiple embodiments of the present application have the beneficial effects of at least one of the above four aspects.

[0046] The above is the core idea of the present application. Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present application.

[0047] Please refer to Figures 1 to 9 。 Figure 1 It is the first top view schematic diagram of the back side of a display panel before setting the circuit board provided by the embodiment of the present application. Figure 2 It is the second top view schematic diagram of the back side of a display panel before setting the circuit board provided by the embodiment of the present application.Figure 3 A top view schematic diagram of the fourth surface of a circuit board provided by an embodiment of the present application. Figure 1 It is schemed that the display panel includes a first opening, and the first opening exposes a plurality of first connection terminals. Figure 2 It is schemed that the display panel includes a plurality of first openings, the first openings are arranged in one-to-one correspondence with the first connection terminals, and the first openings expose the corresponding first connection terminals.

[0048] Figure 4 A first top view schematic diagram of the back side after a display panel is provided with a circuit board according to an embodiment of the present application.

[0049] Figure 5 A first cross-sectional schematic diagram of a display panel after being provided with a circuit board according to an embodiment of the present application. Figure 6 A second cross-sectional schematic diagram of a display panel after being provided with a circuit board according to an embodiment of the present application. Figure 7 A third cross-sectional schematic diagram of a display panel after being provided with a circuit board according to an embodiment of the present application. Figure 8 A fourth cross-sectional schematic diagram of a display panel after being provided with a circuit board according to an embodiment of the present application. Figure 9 A fifth cross-sectional schematic diagram of a display panel after being provided with a circuit board according to an embodiment of the present application. Figures 5 to 7 It is Figure 4 A cross-sectional schematic diagram at the dashed line C1-C1 in. Compared with Figures 5 to 7 , Figure 8 and Figure 9 the setting positions of the second connection terminal 20d are different.

[0050] The present application provides a display panel 100, and the display panel 100 includes a substrate 10, a circuit board 20, and a plurality of conductive parts 50. The substrate 10 includes a first base 11 and a plurality of first connection terminals 10d. The first base 11 includes a first surface 111 and a second surface 112 arranged opposite to each other, and at least one first opening 10k penetrating through the first base 11. The first connection terminals 10d are located on one side of the first surface 111 away from the second surface 112, and at least one first connection terminal 10d is exposed on the second surface 112 through the first opening 10k. The circuit board 20 is located on one side of the second surface 112 away from the first surface 111. The circuit board 20 includes a plurality of second connection terminals 20d and a plurality of second openings 20k penetrating through the circuit board 20. The second connection terminals 20d and the second openings 20k are arranged in one-to-one correspondence. The second connection terminals 20d at least partially surround the corresponding second openings 20k, and the second openings 20k expose the corresponding second connection terminals 20d. Each second opening 20k communicates with a corresponding first opening 10k. The conductive parts 50 are arranged in one-to-one correspondence with the second openings 20k. Each conductive part 50 is at least accommodated in the corresponding second opening 20k and first opening 10k, and connects the corresponding second connection terminal 20d and the corresponding first connection terminal 10d.

[0051] Exemplarily, the substrate 10 may be an array substrate, or the substrate 10 may be the display panel body. The structure of the substrate 10 may include a first base 11, an array composite layer 12 disposed on one side of the first base 11, a light-emitting layer 13 disposed on a side of the array composite layer 12 away from the first base 11, a packaging layer 14 disposed on a side of the light-emitting layer 13 away from the first base 11. The substrate 10 may further include a protection cover plate 15 (CG, Cover glass) disposed on a side of the packaging layer 14 away from the first base 11. The material of the protection cover plate 15 may be glass or ultra-thin glass (UTG, Ultra-Thin Glass), but the structure of the substrate 10 is not limited thereto. For example, the substrate 10 may not include the protection cover plate 15. For example, the array composite layer 12 and the light-emitting layer 13 in the substrate 10 may have other relative positional relationships.

[0052] Exemplarily, the array composite layer 12 may include a plurality of thin film transistors and a plurality of signal traces. Structures such as the plurality of thin film transistors and the plurality of signal traces form a plurality of driving circuits. The light-emitting layer 13 may include a plurality of light-emitting elements arranged in an array. The light-emitting elements may be light-emitting devices of OLEDs, but are not limited thereto. For example, the light-emitting elements may be micro light-emitting diodes (Mirco LED), or the light-emitting elements may be mini light-emitting diodes (Min LED).

[0053] Exemplarily, the first connection terminal 10d can be electrically connected to a signal trace. For example, the first connection terminal 10d can be part of the signal trace. For example, the first connection terminal 10d is electrically connected to the signal trace and the width of the first connection terminal 10d is greater than the width of the signal trace.

[0054] Exemplarily, the first substrate 11 can be a glass substrate, a flexible substrate, etc., but not limited thereto. When the first substrate 11 is a flexible substrate, it is easier to form at least one first opening 10k through a laser grooving process.

[0055] Exemplarily, the first opening 10k penetrates the first substrate 11. The first connection terminal 10d is located on the side of the first surface 111 away from the second surface 112, and the first opening 10k exposes the first connection terminal 10d on the second surface 112. When there are other film layers between the first connection terminal 10d and the first substrate 11, for example, there is an insulating layer between the first connection terminal 10d and the first substrate 11, the first opening 10k also penetrates other film layers between the first connection terminal 10d and the first substrate 11, so that the first opening 10k exposes the first connection terminal 10d on the second surface 112.

[0056] Exemplarily, the circuit board 20 can be a flexible printed circuit (FPC), and the circuit board 20 can also be a chip on flex (COF), but not limited thereto.

[0057] Exemplarily, the circuit board 20 can include a circuit board body 21 and a plurality of second connection terminals 20d. The circuit board body 21 can be a body of a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as a substrate, but not limited thereto.

[0058] Exemplarily, the plurality of second connection terminals 20d can be bonding terminals, pins, etc. on the circuit board 20.

[0059] Exemplarily, Figure 1 and Figure 2 the filling pattern with a dotted edge in represents a plurality of first connection terminals 10d.

[0060] Exemplarily, the conductive parts 50 are arranged in one-to-one correspondence with the second openings 20k. Each conductive part 50 is at least received in the corresponding second opening 20k and the first opening 10k, and connects the corresponding second connection terminal 20d and the corresponding first connection terminal 10d. That is, the first connection terminal 10d and the corresponding second connection terminal 20d are electrically connected through the corresponding conductive part 50.

[0061] Exemplarily, the material of the conductive part 50 can be a conductive adhesive material, conductive ink, metal, etc.

[0062] Exemplarily, the second connection terminal 20d at least partially surrounds the corresponding second opening 20k. In some embodiments, the second opening 20k at least penetrates through a partial portion of the second connection terminal 20d to expose the end face of the second connection terminal 20d.

[0063] Exemplarily, a protection component may also be disposed on the side of the conductive portion 50 away from the first substrate 11 to protect the conductive portion 50 and prevent the conductive portion 50 from falling off. The protection component covers a partial portion of the second surface 112 and the surface of the conductive portion 50 away from the first substrate 11. The material of the protection component may include resin and the like.

[0064] Exemplarily, the display panel 100 may further include a heat dissipation structure layer and a protection component. The heat dissipation structure layer is located on the side of the first substrate 11 close to the circuit board 20. The protection component is fixedly connected to the surface of the circuit board 20 away from the first substrate 11, the surface of the conductive portion 50 away from the first substrate 11, and the surface of the heat dissipation structure layer away from the first substrate 11.

[0065] In the embodiments of the present application, compared with the method of pad bending, the bending area is eliminated, and an extremely narrow border or borderless design of the display panel can be achieved, and there are beneficial effects in many aspects. In the first aspect, the conductive portion 50 is disposed in the corresponding second opening 20k and first opening 10k, and there is no problem of overflow and diffusion of the conductive portion 50, avoiding the problem of short circuit. In the second aspect, the first substrate 11 and the circuit board 20 achieve precise alignment of a plurality of first connection terminals 10d and a plurality of second connection terminals 20d through one-time alignment, and the conductive portion 50 is filled into the second opening 20k and the first opening 10k, which can be achieved by one-time filling and then removing residues on the surface of the circuit board 20 away from the first substrate 11, etc., and has the effect of simple process. In the third aspect, the conductive portion 50 is disposed in the corresponding second opening 20k and first opening 10k, and does not additionally increase the thickness of the display panel 100, making the display panel 100 thinner and lighter and smaller in volume. In the fourth aspect, the conductive portion 50 is filled into the second opening 20k and the first opening 10k to connect the corresponding first connection terminal 10d and second connection terminal 20d. In the plane parallel to the plane where the first substrate 11 is located, it does not occupy the space between two adjacent first connection terminals 10d and does not occupy the space between two adjacent second connection terminals 20d, and can very well meet the signal connection requirements of high-order products and a larger number of connection terminals (or more dense connection terminals). The multiple embodiments of the present application have the beneficial effects of at least one of the above four aspects.

[0066] In some embodiments, such as Figure 5As shown, the display panel 100 further includes an adhesive layer 30, and the adhesive layer 30 is located between the circuit board 20 and the first substrate 11; wherein, the adhesive layer 30 includes a plurality of third openings 30k, and the third openings 30k communicate with the corresponding second openings 20k, and each conductive part 50 is also received in the corresponding third opening 30k.

[0067] Exemplarily, the circuit board 20 is attached to the first substrate 11 through the adhesive layer 30, and the adhesive layer 30 can be an adhesive material. For example, the adhesive layer 30 can be an NCF adhesive (Non-Conductive Film).

[0068] Exemplarily, as Figure 5 shown, the adhesive layer 30 includes a plurality of third openings 30k, and the third openings 30k communicate with the corresponding second openings 20k. During the manufacturing process of the display panel 100, the adhesive layer 30 can be attached to the circuit board 20 first, and then a plurality of second openings 20k and a plurality of third openings 30k are prepared by the same punching process, which has the effect of simple process.

[0069] In some other embodiments, as Figure 6 shown, the orthographic projection of the adhesive layer 30 on the circuit board 20 is located outside the orthographic projection of the plurality of second openings 20k on the first substrate 11.

[0070] Exemplarily, as Figure 6 shown, the orthographic projection of the adhesive layer 30 on the circuit board 20 is located outside the orthographic projection of the plurality of second openings 20k on the first substrate 11, that is, the adhesive layer 30 is arranged to avoid the plurality of second openings 20k; for example, in the direction parallel to the plane where the first substrate 11 is located, the adhesive layer 30 is located on one side of the plurality of second openings 20k; for example, in the direction parallel to the plane where the first substrate 11 is located, the adhesive layer 30 surrounds the plurality of second openings 20k. At this time, the conductive part 50 can be slightly diffused between the first substrate 11 and the circuit board 20. When the plurality of second connection terminals 20d are arranged on the third surface 201, the contact area between the conductive part 50 and the corresponding second connection terminal 20d can be increased, and the conductive performance can be improved.

[0071] In some embodiments, as Figure 1 shown, the first substrate 11 includes a first opening 10k, and the first opening 10k exposes a plurality of first connection terminals 10d on the second surface 112; at least a plurality of conductive parts 50 are received in the first opening 10k and the corresponding second openings 20k.

[0072] Exemplarily, as Figure 1As shown, the first substrate 11 includes a first opening 10k. The first opening 10k exposes a plurality of first connection terminals 10d on the second surface 112. Only one first opening 10k needs to be formed on the first substrate 11, and one first opening 10k can expose a plurality of first connection terminals 10d, achieving the effect of simple opening process.

[0073] In some embodiments, as Figure 2 shown, in combination with Figure 5 , the first substrate 11 includes a plurality of first openings 10k. The first openings 10k expose corresponding first connection terminals 10d on the second surface 112, and each first opening 10k communicates with a corresponding second opening 20k in a one-to-one manner; at least a plurality of conductive parts 50 are accommodated in the corresponding second openings 20k and the corresponding first openings 10k.

[0074] Exemplarily, as Figure 2 shown, in combination with Figure 5 , the first substrate 11 includes a plurality of first openings 10k, and the first openings 10k correspond to the first connection terminals 10d in a one-to-one manner, so that the materials of the first substrate 11 reserved between adjacent two first connection terminals 10d are separated from each other, avoiding the risk of short circuit.

[0075] In some embodiments, as Figure 8 shown, the circuit board 20 includes a third surface 201 and a fourth surface 202 which are opposite to each other. The third surface 201 is disposed opposite to the second surface 112, and at least a part of the second connection terminals 20d are located on the third surface 201; the conductive part 50 includes a first sub-part 51 accommodated in the first opening 10k, a second sub-part 52 accommodated in the second opening 20k, and a third sub-part 53 connecting the first sub-part 51 and the second sub-part 52. The area of the orthographic projection of the third sub-part 53 on the first substrate 11 is larger than the area of the orthographic projection of the second sub-part 52 on the first substrate 11.

[0076] Exemplarily, as Figure 8 shown, in a plane parallel to the plane where the first substrate 11 is located, in at least one direction, the length of the third opening 30k is greater than the length of the second opening 20k in the same direction. After filling the material of the conductive part 50 and before the material of the conductive part 50 dries, the material of the conductive part 50 can diffuse or overflow glue to increase the area of the third sub-part 53. At the same time, at least a part of the second connection terminals 20d are located on the third surface 201, thereby increasing the contact area between the third sub-part 53 and the second connection terminals 20d and improving the electrical connection performance between the third sub-part 53 and the second connection terminals 20d.

[0077] In some embodiments, as Figure 7As shown, the circuit board 20 includes a third surface 201 and a fourth surface 202 disposed opposite to each other. The third surface 201 is disposed opposite to the second surface 112, and at least a portion of the second connection terminals 20d are located on the fourth surface 202; the conductive portion 50 covers at least a portion of the surface of the corresponding second connection terminal 20d away from the first substrate 11.

[0078] Exemplarily, as Figure 7 shown, the conductive portion 50 includes a fourth sub-portion 54 that covers the surface of the corresponding second connection terminal 20d away from the first substrate 11. In a plane parallel to the plane where the first substrate 11 is located, in at least one direction, the fourth sub-portion 54 is longer than the length of the second opening 20k in the same direction, so that the conductive portion 50 covers at least a portion of the surface of the corresponding second connection terminal 20d away from the first substrate 11. At the same time, at least a portion of the second connection terminals 20d are located on the fourth surface 202, thereby increasing the contact area between the fourth sub-portion 54 and the second connection terminal 20d and improving the electrical connection performance between the fourth sub-portion 54 and the second connection terminal 20d. In addition, the fourth sub-portion 54 also serves to protect the material of the conductive portion 50 within the second opening 20k.

[0079] In some embodiments, as Figure 9 shown, the circuit board 20 includes a third surface 201 and a fourth surface 202 disposed opposite to each other. The third surface 201 is disposed opposite to the second surface 112, and at least a portion of the second connection terminals 20d are located between the third surface 201 and the fourth surface 202 and are located inside the circuit board 20; at least a portion of the second connection terminals 20d are connected to the corresponding conductive portion 50 through the end surface of the second opening 20k.

[0080] Exemplarily, at least a portion of the second connection terminals 20d are located between the third surface 201 and the fourth surface 202, that is, at least a portion of the second connection terminals 20d are located inside the circuit board 20. At this time, the second connection terminal 20d is connected to the corresponding conductive portion 50 through the end surface of the second opening 20k.

[0081] Please refer to Figures 10 to 13 . Figure 10 It is a schematic diagram of the process steps of a manufacturing method of a display panel provided by an embodiment of the present application. Figure 11 It is a first intermediate process schematic diagram of a manufacturing method of a display panel provided by an embodiment of the present application. Figure 12 It is a second intermediate process schematic diagram of a manufacturing method of a display panel provided by an embodiment of the present application. Figure 13 It is a third intermediate process schematic diagram of a manufacturing method of a display panel provided by an embodiment of the present application.

[0082] Second aspect, based on the same inventive concept, the present application further provides a manufacturing method of a display panel. Any one of the above-mentioned display panels 100 can be manufactured by using this manufacturing method of the display panel. The manufacturing method of the display panel includes step S100, step S200, step S300, step S400 and step S500.

[0083] Step S100: Provide a substrate, the substrate includes a first base and a plurality of first connection terminals. The first base includes a first surface and a second surface arranged opposite to each other, and at least one first opening penetrating through the first base. The first connection terminals are located on one side of the first surface away from the second surface, and the first opening exposes at least one of the first connection terminals on the second surface.

[0084] Exemplarily, as Figure 1 or Figure 2 , and Figure 11 shown, provide a substrate 10. The substrate 10 includes a first base 11 and a plurality of first connection terminals 10d. The first base 11 includes a first surface 111 and a second surface 112 arranged opposite to each other, and at least one first opening 10k penetrating through the first base 11. The first connection terminals 10d are located on one side of the first surface 111 away from the second surface 112, and the first opening 10k exposes at least one of the first connection terminals 10d on the second surface 112.

[0085] Step S200: Provide a circuit board, the circuit board includes a plurality of second connection terminals.

[0086] Exemplarily, in combination with Figure 12 shown, provide a circuit board 20. The circuit board 20 includes a plurality of second connection terminals 20d.

[0087] Step S300: Prepare a plurality of second openings on the circuit board. The second connection terminals and the second openings are arranged in one-to-one correspondence. The second connection terminals at least partially surround the corresponding second openings, and the second openings expose the corresponding second connection terminals.

[0088] Exemplarily, in combination with Figure 3 and Figure 13 shown, prepare a plurality of second openings 20k on the circuit board 20. The second connection terminals 20d and the second openings 20k are arranged in one-to-one correspondence. The second connection terminals 20d at least partially surround the corresponding second openings 20k, and the second openings 20k expose the corresponding second connection terminals 20d.

[0089] Step S400: Arrange the circuit board on one side of the second surface away from the first surface, and the second openings are arranged in alignment with the first openings.

[0090] Exemplarily, in combination with Figure 5 As shown, the circuit board 20 is disposed on the side of the second surface 112 away from the first surface 111, and the second opening 20k is disposed in alignment with the first opening 10k.

[0091] Step S500: Fill the first opening and the corresponding second opening with a conductive material to form a plurality of conductive parts, the conductive parts being arranged in one-to-one correspondence with the second openings, each of the conductive parts being at least received in the corresponding second opening and the first opening, and connecting the corresponding second connection terminal and the corresponding first connection terminal.

[0092] Exemplarily, as Figures 5 to 9 shown, fill the first opening 10k and the corresponding second opening 20k with a conductive material to form a plurality of conductive parts 50, the conductive parts 50 being arranged in one-to-one correspondence with the second openings 20k, each of the conductive parts 50 being at least received in the corresponding second opening 20k and the first opening 10k, and connecting the corresponding second connection terminal 20d and the corresponding first connection terminal 10d.

[0093] Exemplarily, fill the first opening 10k and the corresponding second opening 20k with a conductive material in a fluid or liquid state, and then dry and cure it to form a plurality of conductive parts 50.

[0094] In some embodiments, the manufacturing method of the display panel 100 further includes: Step S600: Provide an adhesive layer 30; Step S700: As Figure 12 shown, attach the adhesive layer 30 to one side surface of the circuit board 20; wherein, as Figure 13 shown, the step of preparing a plurality of second openings 20k on the circuit board 20 (Step S300) further includes: simultaneously preparing a plurality of third openings 30k on the adhesive layer 30, the third openings 30k corresponding to the second openings 20k; the step of disposing the circuit board 20 on the side of the second surface 112 away from the first surface 111 (Step S400) further includes: attaching the circuit board 20 to the side of the second surface 112 away from the first surface 111 through the adhesive layer 30; the step of filling the first opening 10k and the corresponding second opening 20k with a conductive material (Step S500) further includes: simultaneously filling the third openings 30k with a conductive material, and each of the conductive parts 50 is further received in the corresponding third opening 30k.

[0095] Exemplarily, Step S600 is further included before Step S300; Step S700 is further included before Step S300.

[0096] Exemplarily, a plurality of second openings 20k can be formed on the circuit board 20 through the same opening process, and a plurality of third openings 30k can be formed on the adhesive layer 30. The third openings 30k correspond to and communicate with the corresponding second openings 20k.

[0097] Please refer to Figure 14 , Figure 14 which is a schematic diagram of a display device provided by an embodiment of the present application.

[0098] In a third aspect, based on the same inventive concept, the present application further provides a display device 200. The display device 200 includes the display panel 100 of any one of the above, or the display device 200 includes the display panel 100 combined with several of the above features.

[0099] Exemplarily, the display device 200 also has the beneficial effects of the display panel 100 in the above embodiments. The same parts can be understood with reference to the explanation of the display panel 100 above, and will not be repeated hereinafter.

[0100] Exemplarily, the display device 200 provided by the embodiment of the present application can be Figure 14 the mobile phone shown in the figure, or any electronic product with a display function, including but not limited to the following categories: television, notebook computer, desktop display, tablet computer, digital camera, smart bracelet, smart glasses, in-vehicle display, industrial control equipment, medical display screen, touch interaction terminal, etc. The embodiment of the present application does not make special limitations on this.

[0101] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0102] The above embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A display panel, characterized in that: include: A substrate, comprising a first base and a plurality of first connection terminals, wherein the first base comprises a first surface and a second surface disposed opposite to each other, and at least one first opening penetrating the first base, wherein the first connection terminal is located on a side of the first surface away from the second surface, and the first opening exposes at least one of the first connection terminals on the second surface; a circuit board, located on a side of the second surface away from the first surface, the circuit board comprising a plurality of second connection terminals and a plurality of second openings penetrating the circuit board, the second connection terminals and the second openings being arranged in one-to-one correspondence, the second connection terminals at least partially surrounding the corresponding second openings, and the second openings exposing the corresponding second connection terminals, and each of the second openings being in communication with a corresponding one of the first openings; A plurality of conductive parts are arranged in one-to-one correspondence with the second openings, each of the conductive parts is at least accommodated in the corresponding second opening and the first opening, and connects the corresponding second connection terminal and the corresponding first connection terminal.

2. The display panel according to claim 1, characterized in that: Also includes: an adhesive layer, located between the circuit board and the first substrate; Wherein, the adhesive layer comprises a plurality of third openings, the third openings are correspondingly connected to the second openings, and each of the conductive parts is also accommodated in the corresponding third opening; or, The orthographic projection of the adhesive layer on the circuit board is outside the orthographic projections of the plurality of second openings on the first substrate.

3. The display panel according to claim 1, characterized in that: The first substrate comprises a first opening, wherein the first opening exposes a plurality of the first connection terminals on the second surface; The plurality of conductive parts are at least accommodated in the first opening and the corresponding second opening.

4. The display panel according to claim 1, characterized in that: The first substrate comprises a plurality of first openings, wherein the first openings expose the corresponding first connection terminals on the second surface, and each of the first openings is connected to each of the second openings in a one-to-one correspondence; The plurality of conductive parts are at least accommodated in the corresponding second openings and the corresponding first openings.

5. The display panel according to claim 1, characterized in that: The circuit board comprises a third surface and a fourth surface which are arranged opposite to each other, the third surface and the second surface are arranged opposite to each other, and at least part of the second connecting terminals are located on the third surface; The conductive portion includes a first sub-portion accommodated in the first opening, a second sub-portion accommodated in the second opening, and a third sub-portion connecting the first sub-portion and the second sub-portion, and an area of ​​an orthographic projection of the third sub-portion on the first substrate is larger than an area of ​​an orthographic projection of the second sub-portion on the first substrate.

6. The display panel according to claim 1, characterized in that: The circuit board comprises a third surface and a fourth surface which are arranged opposite to each other, the third surface and the second surface are arranged opposite to each other, and at least part of the second connecting terminals are located on the fourth surface; The conductive portion covers at least a portion of a surface of the corresponding second connecting terminal away from the first substrate.

7. The display panel according to claim 1, characterized in that: The circuit board comprises a third surface and a fourth surface disposed opposite to each other, the third surface and the second surface are disposed opposite to each other, and at least a part of the second connecting terminals are located between the third surface and the fourth surface and inside the circuit board; At least a portion of the second connecting terminals are connected to the corresponding conductive parts through end surfaces located at the second openings.

8. A method for manufacturing a display panel, characterized in that: include: A substrate is provided, the substrate comprising a first substrate and a plurality of first connecting terminals, the first substrate comprising a first surface and a second surface disposed opposite to each other, and at least one first opening penetrating the first substrate, the first connecting terminal being located on a side of the first surface away from the second surface, and the first opening exposing at least one of the first connecting terminals on the second surface; Providing a circuit board, the circuit board comprising a plurality of second connection terminals; A plurality of second openings are prepared on the circuit board, the second connection terminals and the second openings are arranged in one-to-one correspondence, the second connection terminals at least partially surround the corresponding second openings, and the second openings expose the corresponding second connection terminals; The circuit board is arranged on a side of the second surface away from the first surface, and the second opening is arranged in alignment with the first opening; Conductive material is filled in the first opening and the corresponding second opening to form a plurality of conductive parts, and the conductive parts are arranged in a one-to-one correspondence with the second openings. Each of the conductive parts is at least accommodated in the corresponding second opening and the first opening, and connects the corresponding second connecting terminal and the corresponding first connecting terminal.

9. The method for manufacturing a display panel according to claim 8, characterized in that: Also includes: providing an adhesive layer; Attaching the adhesive layer to one side surface of the circuit board; Wherein, the step of preparing a plurality of second openings on the circuit board further includes: simultaneously preparing a plurality of third openings on the adhesive layer, the third openings corresponding to the second openings; The step of arranging the circuit board on the side of the second surface away from the first surface further includes: attaching the circuit board to the side of the second surface away from the first surface through the adhesive layer; The step of filling the first opening and the corresponding second opening with conductive material also includes: simultaneously filling the third opening with conductive material, and each conductive part is also accommodated in the corresponding third opening.

10. A display device, characterized in that: The invention comprises the display panel as claimed in any one of claims 1 to 7.

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