Display module and display device

Abstract

The invention provides a display module and a display device. The display module comprises a display assembly and a supporting heat dissipation part. The display assembly comprises a display part and a device setting part with one ends connected, the supporting heat dissipation part is used for supporting the display part, the device setting part is arranged on the side, away from the display part, of the supporting part through a bent section, the tail end of the device setting part is connected with a circuit board, and the device setting part is fixedly connected with the supporting heat dissipation part through the circuit board. The display component is of a curved surface structure, the side, close to the display component, of the supporting heat dissipation component is a curved surface, the side, away from the display component, of the supporting heat dissipation component is a plane, first foam is arranged between the device setting component and the supporting heat dissipation component, the side, close to the supporting heat dissipation component, of the first foam is a non-glue surface, and the side, close to the device setting component, of the first foam is a glue surface. One side, close to the device setting component, of the first foam is provided with a groove used for placing a chip.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display module and a display device. Background Art

[0002] Currently, more and more in-vehicle projects adopt OLED screen technology. Due to the large size of in-vehicle projects and to meet the personalized design requirements of each terminal, many irregular-shaped modules have emerged. The front side, i.e., the display surface, of the irregular-shaped module is curved, and the back side is flat. The irregular-shaped module includes a device setting component bent on the back of the support and heat dissipation component. After bending (bending), stress concentration is likely to occur in the device setting component, thus damaging the device setting component. Summary of the Invention

[0003] The purpose of the embodiments of this application is to provide a display module and a display device. The device setting component of the display module after bending has sufficient free movement space and is not prone to stress concentration. Therefore, the device setting component is not easily damaged.

[0004] The specific technical solutions are as follows:

[0005] In a first aspect of this application, a display module is provided, including a display panel, a support and heat dissipation component, a flip chip film, and a circuit board; the display component includes a display part and a device setting part connected at one end, and the support and heat dissipation component is used to support the display part; the device setting part is disposed on the side of the support part away from the display part through a bending section, the end of the device setting part is connected to a circuit board, and the device setting part is fixedly connected to the support and heat dissipation component through the circuit board; the display part is a curved surface structure, the side of the support and heat dissipation component close to the display part is a curved surface, the side of the support and heat dissipation component away from the display part is a flat surface, a first foam is provided between the second section and the support and heat dissipation component, the side of the first foam close to the support and heat dissipation component is a non-adhesive surface, the side of the first foam close to the device setting part is an adhesive surface, and the side of the first foam close to the device setting part has a groove for placing a chip, and the chip is located in the groove.

[0006] In addition, the display module provided in the first aspect of this application may further have the following technical features:

[0007] In some embodiments, the display component includes a first panel body and a chip-on-film (COF). The first panel body is the display part. The COF includes a first section, a middle section, and a second section that are connected in sequence. The first section is connected to the panel body. The middle section is the bent section. The second section is the device setting part. The second section is bent on a side of the support and heat dissipation part away from the panel body through the middle section.

[0008] In some embodiments, the groove includes two first sidewalls oppositely arranged along a first direction and two second sidewalls oppositely arranged along a second direction. There is a first preset distance between the two first sidewalls and the sidewalls of the chip opposite to each of them, and there is a second preset distance between the second sidewalls and the sidewalls of the chip opposite to them. The first direction and the second direction are coplanar and perpendicular to the thickness direction of the display module.

[0009] In some embodiments, the first sidewall is the long side of the groove, the second sidewall is the short side of the groove, and the first preset distance is greater than the second preset distance.

[0010] In some embodiments, the middle parts of the two second sidewalls are recessed in a direction to shorten the distance between the second sidewalls, so that four bosses are formed at the four corners of the groove.

[0011] In some embodiments, there is a third preset distance between the starting position of the recess of the second sidewall and the sidewall of the chip corresponding to it, and the third preset distance is 0.5 mm - 1 mm; there is a fourth preset distance between the starting position of the recess of the second sidewall and the first sidewall adjacent to it, and the fourth preset distance is 1 mm - 2 mm; there is a fifth preset distance between the second sidewall at the recess position and the sidewall of the chip corresponding to it, and the fifth preset distance is 1 mm - 2 mm.

[0012] In some embodiments, the support and heat dissipation part includes a buffer, a heat dissipation film, and a heat dissipation plate arranged in sequence along a direction away from the display part. The thickness of the heat dissipation film is less than the thickness of the heat dissipation plate.

[0013] In some embodiments, the buffer is a second foam, the heat dissipation film is a copper foil, and the heat dissipation plate is an aluminum plate.

[0014] In some embodiments, a thermal conductive filler is provided between the heat dissipation film and the heat dissipation plate, and the thermal conductive filler covers the surface of the heat dissipation plate.

[0015] In some embodiments, the thermal conductive filler is liquid thermal conductive silicone grease or the thermal conductive filler is thermal conductive silica gel.

[0016] In some embodiments, at least one first conductive glue is provided on the first surface of the heat sink close to the heat sink film, and the first conductive glue passes through the thermal conductive filler and contacts the heat sink film; at least one second conductive glue is provided on the second surface of the heat sink facing away from the heat sink film, and the second conductive glue is used to connect with the middle frame; the first conductive glue and the second conductive glue are staggered.

[0017] In some embodiments, four first conductive adhesives are provided and evenly distributed on the first surface near the top corners, and four second conductive adhesives are provided and evenly distributed on the second surface near the top corners.

[0018] In some embodiments, along a direction opposite to the extension direction of the second segment, a boundary of the first foam exceeds a boundary of the heat dissipation plate.

[0019] In some embodiments, a distance between a boundary of the first foam and a boundary of the heat dissipation plate is 1 mm-2 mm.

[0020] In some embodiments, the thickness of the first foam is greater than the thickness of the circuit board.

[0021] In some embodiments, the difference between the thickness of the first foam and the thickness of the circuit board is greater than or equal to 0.2 mm.

[0022] A second aspect of the present application provides a display device, which includes the display module described above.

[0023] Beneficial effects of the embodiments of the present application:

[0024] The display module and display device provided by the embodiment of the present application have sufficient free movement space for the device setting component after being bent by the bending section, and it is not easy to generate stress concentration, so the device setting component is not easy to be damaged. Specifically: by setting the side of the first foam close to the device setting component to have an adhesive surface, the device setting component and the first foam are bonded and fixed, and there is no adhesive surface between the first foam and the supporting heat dissipation component, that is, the first foam and the supporting heat dissipation component are not bonded, and only the end of the device setting component is fixed and bonded to the heat dissipation plate through the circuit board, so that the device setting component after being bent by the bending section has sufficient free movement space, and it is not easy to generate stress concentration, so the device setting component can be prevented from being damaged. The chip is placed in the groove of the first foam, so that the chip can be better protected from damage.

[0025] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the accompanying drawings required in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other embodiments can also be obtained based on these drawings.

[0027] Figure 1 It is a plan view of the display module provided by the embodiment of the present application, where the flip-chip film is not bent;

[0028] Figure 2 It is a stacked structure diagram of the display module provided by the embodiment of the present application, where the flip-chip film is not bent;

[0029] Figure 3a It is a stacked structure diagram of the display module in one embodiment provided by the embodiment of the present application, where the flip-chip film is bent;

[0030] Figure 3b It is a stacked structure diagram of the display module in another embodiment provided by the embodiment of the present application, where the flip-chip film is bent;

[0031] Figure 4 For Figure 3a it is a cross-sectional view along line B-B;

[0032] Figure 5 It is a top view of the heat dissipation plate on the side close to the heat dissipation film;

[0033] Figure 6 It is a side view of the heat dissipation plate;

[0034] Figure 7 It is a top view of the heat dissipation plate on the side away from the heat dissipation film.

[0035] The reference numerals are as follows: display component 100; first panel main body 100A; second panel main body 100B; display component 101; display side 101a; device setting component 102; bending section 103; support heat dissipation component 200; buffer 201; heat dissipation film 202; heat dissipation plate 203; first conductive adhesive 2031; second conductive adhesive 2032; thermal conductive filler 204; flip-chip film 300; first section 301; middle section 302; second section 303; circuit board 400; first foam 500; groove 501; first side wall 5011; second side wall 5012; boss 5013; first preset distance L1; second preset distance L2; third preset distance L3; fourth preset distance L4; fifth preset distance L5; pitch d; chip S; first direction X; second direction Y; extension direction A; cover plate 600; optical adhesive 700; tempered glass 800; polarizer 900. Detailed implementation manners

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0037] In a first aspect, the present application provides a display module, such as Figure 1 , Figure 2 , Figure 3a As shown, the display module includes a display component 100, a support heat dissipation component 200 and a circuit board 400. Figure 2 is a schematic diagram of the cross-sectional structure of the device setting component 102 when it is not bent, Figure 3a Schematic diagram of the cross-sectional structure of the device setting component 102 after bending. The support heat dissipation component 200 is used to support the display component 101. Specifically, the display component 101 includes a display side 101a, which is the side of the display component 101 from which light is emitted. The support heat dissipation component 200 is used to support the side of the display component 101 away from the display side 101a. The device setting component 102 is arranged on the side of the support heat dissipation component 200 away from the display component 101 through the bending section 103. The device setting component 102 is fixedly connected to the support heat dissipation component 200 through the circuit board 400. The display component 101 is a curved structure, the side of the supporting heat dissipation component 200 close to the display component 101 is a curved surface, and the side of the supporting heat dissipation component 200 away from the display component 101 is a flat surface, and a first foam 500 is provided between the second section 303 and the supporting heat dissipation component 200, the side of the first foam 500 close to the supporting heat dissipation component 200 is a non-glue surface, and the side of the first foam 500 close to the device setting component 102 is a glue surface, and the side of the first foam 500 close to the device setting component 102 has a groove 501, and the groove 501 is used to place the chip S, and the chip S is located in the groove 501.

[0038] The support and heat dissipation component 200 is arranged on the back of the display component 101, which can improve the mechanical strength of the display module on the one hand, and improve the heat dissipation capacity of the display module on the other hand. A circuit board 400 is arranged at the end of the device setting component 102, and components are arranged on the circuit board 400. The device setting component 102 is moved to the back of the support and heat dissipation component 200 by bending, which reduces the occupied space of the frame and is conducive to realizing the narrow frame design of the display module.

[0039] By setting the side of the first foam 500 close to the device setting component 102 as the adhesive surface, the device setting component 102 and the first foam 500 are adhesively fixed. The surface between the first foam 500 and the support and heat dissipation component 200 is a non-adhesive surface, that is, there is no adhesion between the first foam 500 and the support and heat dissipation component 200. Only at the end of the device setting component 102, it is fixedly adhered to the heat dissipation plate 203 through the circuit board 400, so that there is sufficient free movement space for the bent device setting component 102, and stress concentration is not easily generated. Therefore, damage to the device setting component 102 can be avoided. The chip S is placed in the groove 501 of the first foam 500, so that the chip S can be better protected from damage.

[0040] It should be noted that 100A / 101 means that the indication part can represent both the display component 101 and the first panel main body 100A, and the two are the same component. The same applies to 302 / 103 and 303 / 102.

[0041] In some embodiments, such as Figure 3a As shown, the display assembly 100 includes a first panel main body 100A and a flip chip film 300. The first panel main body 100A serves as the display component 101. The flip chip film 300 includes a first section 301, a middle section 302, and a second section 303 that are connected in sequence. The first section 301 is connected to the first panel main body 100A, and the middle section 302 is the bent section 103; the second section 303 serves as the device setting component 102, and the second section 303 is bent on the side of the support and heat dissipation component 200 facing away from the first panel main body 100A through the middle section 302.

[0042] Among them, the first panel main body 100A can be rigid or flexible, and the present application does not limit this. The first section 301 of the flip chip film 300 is connected to the first panel main body 100A, for example, it can be but not limited to being connected to the display side 101a of the first panel main body 100A. The flip chip film 300 is bent through the middle section 302, so that the second section 303 is disposed on the back of the support and heat dissipation component 200, and the second section 303 is fixedly connected to the support and heat dissipation component 200 through the circuit board 400.

[0043] In this embodiment, the first foam 500 has a glue surface on one side close to the second section 303, the second section 303 is bonded and fixed to the first foam 500, and there is no glue surface between the first foam 500 and the supporting heat dissipation component 200, that is, the first foam 500 and the supporting heat dissipation component 200 are not bonded, and the chip-on-film 300 is only fixedly bonded to the heat dissipation plate 203 through the circuit board 400 at the end of the second section 303, so that the second section 303 after bending has enough free movement space, and it is not easy to generate stress concentration, so that the chip-on-film 300 can be prevented from being damaged. The chip S is placed in the groove 501 of the first foam 500, so that the chip S can be better protected from damage.

[0044] In some embodiments, Figure 3b As shown, the display assembly 100 includes a second panel body 100B and only includes the second panel body 100B, and the second panel body 100B is flexible. The second panel body 100B includes a display component 101, a device setting component 102, and a bending section 103 connecting the display component 101 and the device setting component 102, and the device setting component 102 is bent at the side of the support heat dissipation component 200 away from the display component 101 through the bending section 103. That is, the second panel body 100B forms the device setting component 102 located at the side of the support heat dissipation component 200 away from the display component 101 through its own bending.

[0045] In this embodiment, in order to facilitate the bending of the second panel body 100B, some inorganic layers in the flexible panel body can be removed from the bending section 103 between the display component 101 and the device setting component 102. The bending section 103 can also be narrowed so that the width of the bending section 103 is smaller than the width of the display component 101.

[0046] Understandable, such as Figure 3a , Figure 3b As shown, the display module generally further includes a polarizer 900 disposed on the display side 101a of the display component 101, and a cover plate 600 disposed on the side of the polarizer 900 away from the display component 101, and the cover plate 600 and the polarizer 900 are bonded by an optical adhesive 700. In some embodiments, as Figure 2 As shown, a tempered glass 800 is further provided on the side of the polarizer 900 away from the component 100 , and the tempered glass 800 and the polarizer 900 are also bonded by an optical adhesive 700 .

[0047] It should be noted that Figure 3a and Figure 3b The difference between the embodiments is that the display assembly 100 is composed of a panel body and a COF 300, or is composed of only a panel body. Figure 3a The embodiments shown are described in detail, and it can be understood that the following contents are also applicable toFigure 3b For the embodiments shown, this application will not describe them one by one.

[0048] In some embodiments, as Figure 4 shown, where Figure 4 is Figure 3a a cross-sectional view along line B-B, the groove 501 includes two first side walls 5011 oppositely arranged along the first direction X and two second side walls 5012 oppositely arranged along the second direction Y. There is a first preset distance L1 between the first side wall 5011 and the side wall of the chip S opposite to it, and there is a second preset distance L2 between the second side wall 5012 and the side wall of the chip S opposite to it. The first direction X and the second direction Y are coplanar and perpendicular to the thickness direction of the display module.

[0049] The side walls of the chip S opposite to each other respectively refer to the side walls of the chip S close to the first side wall 5011 or the second side wall 5012. There is a first preset distance L1 between the first side wall 5011 and the side wall of the chip S opposite to it, so that the chip S does not contact the first side wall 5011 of the groove 501, which is beneficial to the heat dissipation of the chip S in the first direction X. Similarly, there is a second preset distance L2 between the second side wall 5012 and the side wall of the chip S opposite to it, so that the chip S does not contact the second side wall 5012 of the groove 501, which is beneficial to the heat dissipation of the chip S in the second direction Y.

[0050] Therefore, the side wall of the chip S does not contact the first side wall 5011 and the second side wall 5012, which is beneficial to the chip S to dissipate heat to the surroundings, reduces the risk of overheating of the chip S, is beneficial to improving the use performance of the chip S, and prolongs the service life of the chip S.

[0051] Optionally, the first side wall 5011 is the long side of the groove 501, the second side wall 5012 is the short side of the groove 501, and the first preset distance L1 is greater than the second preset distance L2.

[0052] It can be understood that the placement direction of the chip S is generally related to the setting of the groove 501. When the first side wall 5011 is the long side of the groove 501, the long side of the chip S is placed parallel to the first side wall 5011, so that the space in the groove 501 can be fully utilized, and the opening area of the groove 501 can be reduced while ensuring the heat dissipation of the chip S. The first preset distance L1 is greater than the second preset distance L2, so that the long side of the chip S is the main heat dissipation side, and the heat dissipation effect is improved when the opening areas are approximately equal.

[0053] In some embodiments, as Figure 4 shown, the middle parts of the two second side walls 5012 are recessed in the direction of shortening the distance between the second side walls 5012, so that four convex platforms 5013 are formed at the four corners of the groove 501.

[0054] The provision of the boss 5013 has a certain positioning effect when placing the chip S, which is conducive to improving the placement accuracy of the chip S. Specifically, it can be understood that the depression of the second sidewall 5012 reduces the placement space of the chip S in the second direction Y. Therefore, the placement error of the chip S in the second direction Y is reduced, and the starting positions of the two bosses 5013 on the same side along the first direction X play a positioning role in the placement of the chip S along the first direction X, so that the placement error of the chip S along the first direction X is also reduced, thereby improving the placement accuracy of the chip S.

[0055] In some embodiments, such as Figure 4 shown, there is a third preset distance L3 between the starting position of the depression of the second sidewall 5012 and the sidewall of the corresponding chip S. The third preset distance L3 is 0.5 mm - 1 mm, such as 0.8 mm, 0.9 mm, 1 mm, etc.; there is a fourth preset distance L4 between the starting position of the depression of the second sidewall 5012 and the first sidewall 5011 adjacent to it. The fourth preset distance L4 is 1 mm - 2 mm, such as 1.3 mm, 1.5 mm, 1.8 mm, etc.; there is a fifth preset distance L5 between the second sidewall 5012 at the depression position and the sidewall of the corresponding chip S. The fifth preset distance L5 is 1 mm - 2 mm, such as 1.2 mm, 1.3 mm, 1.5 mm, etc.

[0056] By the middle part of the second sidewall 5012 being recessed inward, two bosses 5013 are formed on both sides of the second sidewall 5012 along the first direction X. As shown in the figure, the starting position of the depression of the second sidewall 5012 refers to the lower boundary of the boss 5013, and the sidewall of the chip S corresponding to the starting position refers to the sidewall of the chip S close to the lower boundary of the boss 5013. The fourth preset distance L4 is the thickness of the boss 5013. The third preset distance L3 is less than the fourth preset distance L4, which is more conducive to positioning the placement position of the chip S through the boss 5013 and improving the placement accuracy. The fifth preset distance L5 between the second sidewall 5012 at the depression position and the sidewall of the corresponding chip S, on the one hand, reduces the distance between the two second sidewalls 5012 of the groove 501 and improves the placement accuracy of the chip S, and on the other hand, prevents the chip S from directly contacting the second sidewall 5012 of the groove 501, which is conducive to the heat dissipation of the chip S.

[0057] In some embodiments, such as Figure 3a shown, the support heat dissipation component 200 includes a buffer member 201, a heat dissipation film 202, and a heat dissipation plate 203 arranged in sequence along the direction away from the display component 101, and the thickness of the heat dissipation film 202 is less than the thickness of the heat dissipation plate 203.

[0058] The buffer member 201 is disposed between the display component 101 and the heat dissipation film 202. The material is a high-elasticity material, which has good flexibility and impact absorption ability, can improve the impact resistance of the display module, and is beneficial to reducing the film printing defect rate of the display component 101.

[0059] On one side of the buffer member 201 away from the display component 101, the heat dissipation film 202 is provided. By utilizing the characteristics of the heat dissipation film 202 with a small thickness and high flexibility, while ensuring the heat dissipation capacity, the film printing defect rate of the display component 101 is reduced.

[0060] The heat dissipation plate 203 is disposed on one side of the heat dissipation film 202 away from the display component 101. It has a relatively large thickness and is the main support and heat dissipation component, which improves the overall strength of the display module and ensures the heat dissipation effect of the display module.

[0061] Optionally, as Figure 3a shown, the buffer member 201 is a second foam, the heat dissipation film 202 is a copper foil, and the heat dissipation plate 203 is an aluminum plate.

[0062] The second foam and the first foam 500 can be of the same material. The second foam has the advantages of good elasticity and light weight, and setting it between the display component 101 and the heat dissipation film 202 can play a role in buffering and shock absorption.

[0063] The copper foil has the advantages of good electrical conductivity, good thermal conductivity, strong processability, and excellent ductility. As the heat dissipation film 202, on the one hand, it can play a role in quickly dissipating heat, and on the other hand, it can also deform synchronously with the display component 101 to reduce the film printing defect rate of the display component 101.

[0064] The heat dissipation plate 203 is selected as an aluminum plate. The aluminum plate has good electrical and thermal conductivity, which is beneficial to heat dissipation. In addition, it has the characteristics of light weight and high strength, which is beneficial to reducing the weight of the heat dissipation plate 203, thereby reducing the weight of the display module.

[0065] It can be understood that the copper foil and the aluminum plate also have good electrical conductivity. Therefore, using the copper foil as the heat dissipation film 202 and the aluminum plate as the heat dissipation plate 203 is also beneficial to discharging the static electricity of the display component 101 and avoiding the accumulation of static electricity inside the display component 101.

[0066] Of course, the heat dissipation film 202 is not limited to copper foil, and can also be other materials with good ductility, good thermal and electrical conductivity. The heat dissipation plate 203 is not limited to aluminum plate, and can also be other materials with good thermal and electrical conductivity.

[0067] In some embodiments, as Figure 3a 、 Figure 3b shown, a thermal conductive filler 204 is provided between the heat dissipation film 202 and the heat dissipation plate 203, and the thermal conductive filler 204 covers the surface of the heat dissipation plate 203.

[0068] The heat-conducting filler 204 can fully fill the gap between the heat-dissipating film 202 and the heat-dissipating plate 203, so as to be in full contact with both the heat-dissipating film 202 and the heat-dissipating plate 203, thereby improving the heat conduction efficiency.

[0069] Optionally, the heat-conducting filler 204 is liquid heat-conducting silicone grease or the heat-conducting filler 204 is heat-conducting silica gel.

[0070] The heat-conducting silicone grease also has good adhesion performance. The heat-conducting silicone grease can adhere well to various materials, ensuring good contact between the heat-conducting silicone grease and the heat-dissipating film 202 and the heat-dissipating plate 203, and improving the heat conduction efficiency. And the liquid heat-conducting silicone grease has a certain fluidity, which can better fill the gap between the heat-dissipating film 202 and the heat-dissipating plate 203, enabling full contact between the heat-dissipating film 202 and the heat-dissipating plate 203 and improving the heat dissipation effect.

[0071] In addition, the heat-conducting silicone grease has high temperature stability. The heat-conducting silicone grease can maintain stable heat-conducting performance at a relatively high temperature and will not melt or decompose due to high temperature. This enables the heat-conducting silicone grease to be used in some high-temperature environments, such as being used as the heat-dissipating component of the display component 101 in this embodiment.

[0072] The heat-conducting silica gel is an efficient heat-conducting material that can adapt to various shapes. Therefore, filling the heat-conducting silica gel between the heat-dissipating film 202 and the heat-dissipating plate 203 can ensure full contact with both the heat-dissipating film 202 and the heat-dissipating plate 203, and improve the heat conduction efficiency.

[0073] When a heat-conducting filler 204 is provided between the heat-dissipating film 202 and the heat-dissipating plate 203 and the heat-conducting filler 204 does not have electrical conductivity, as Figure 5 、 Figure 6 and Figure 7 shown, at least one first conductive adhesive 2031 is further provided on the first surface of the heat-dissipating plate 203 close to the heat-dissipating film 202. The first conductive adhesive 2031 passes through the heat-conducting filler 204 to contact the heat-dissipating film 202; at least one second conductive adhesive 2032 is further provided on the second surface of the heat-dissipating plate 203 facing away from the heat-dissipating film 202. The second conductive adhesive 2032 is used to connect with the middle frame; the first conductive adhesive 2031 and the second conductive adhesive 2032 are arranged in a staggered manner.

[0074] Since the heat dissipation film 202 is a conductive material, the static charges of the display component 101 can be transferred to the heat dissipation film 202. The first conductive adhesive 2031 passes through the heat conductive filler 204 and contacts the heat dissipation film 202, and the static charges can be transferred to the front side of the heat sink 203 (here it refers to the side close to the heat dissipation film 202) through the first conductive adhesive 2031. Since the heat sink 203 is a conductive material and the second conductive adhesive 2032 is provided on the back side of the heat sink 203 (here it refers to the side far from the heat dissipation film 202), and the second conductive adhesive 2032 is used to connect to the middle frame, the static electricity inside the display component 101 can be released through the middle frame, avoiding the accumulation of static charges inside the display component 101 and causing short - circuit defects.

[0075] As Figure 6 shown, the first conductive adhesive 2031 and the second conductive adhesive 2032 are arranged in a staggered manner, that is, the projections of the first conductive adhesive 2031 and the second conductive adhesive 2032 along the thickness direction of the display module do not overlap, which can reduce the risk of force concentration at local positions and reduce the probability of causing poor front - side stamping of the display module.

[0076] In some embodiments, as Figure 3a shown, along the opposite direction of the extension direction A of the device setting component 102, the boundary of the first foam 500 extends beyond the boundary of the heat sink 203. For Figure 3a the embodiment shown, it is along the opposite direction of the extension direction A of the second section 303. The boundary of the first foam 500 extends beyond the boundary of the heat sink 203, that is, the boundary of the heat sink 203 is located inside the boundary of the first foam 500, which can prevent the boundary of the heat sink 203 from scraping the COF film 300 during the bending process of the COF film 300, thus playing a protective role for the COF film 300.

[0077] As a feasible solution, as Figure 3a shown, the distance d between the boundary of the first foam 500 and the boundary of the heat sink 203 is 1 mm - 2 mm. For example, the distance d between the boundary of the first foam 500 and the boundary of the heat sink 203 can be 1.3 mm, 1.5 mm, 1.8 mm, 2 mm, etc.

[0078] The distance d between the boundary of the first foam 500 and the boundary of the heat sink 203, that is, the distance by which the first foam 500 extends beyond the boundary of the heat sink 203. As this distance increases, the risk of interference between the COF film 300 and the heat sink 203 during the bending process is further reduced, thus preventing the boundary of the heat sink 203 from scraping the COF film 300. However, an increase in this distance will also lead to an increase in the border size of the display module. Therefore, a distance of 1 mm - 2 mm between the two can ensure that the COF film 300 does not interfere with the heat sink 203 during the bending process and will not cause an increase in the border size of the display module.

[0079] As Figure 3a shown, the thickness of the first foam 500 is greater than the thickness of the circuit board 400.

[0080] The thickness of the first foam 500 being greater than the thickness of the circuit board 400 ensures that when the side of the flip chip film 300 away from the display component 101 is subsequently subjected to pressure, it will not be reversely compressed and deformed, or even damaged.

[0081] Optionally, the difference in thickness between the first foam 500 and the circuit board 400 is greater than or equal to 0.2 mm. For example, the thickness difference can be 0.2 mm, 0.25 mm, 0.3 mm, etc.

[0082] In this embodiment, the gap between the flip chip film 300 and the heat sink plate 203 depends on the thickness of the circuit board 400. The thickness of the first foam 500 is slightly more than 0.2 mm thicker than that of the circuit board 400, enabling the first foam 500 to fill the gap between the flip chip film 300 and the heat sink plate 203, thereby playing a buffering role. This thickness also provides a certain amount of movement space for the first foam 500 and the flip chip film 300, that is, when the compression amount of the first foam 500 is within 0.2 mm, it will not cause deformation of the flip chip film 300, thus protecting the flip chip film 300 from damage.

[0083] At the same time, as Figure 2 、 Figure 3a shown, the depth of the groove 501 is greater than the thickness of the chip S. The depth of the groove 501 being greater than the thickness of the chip S ensures that the chip S is completely located within the groove 501 and does not contact the bottom wall of the groove 501, preventing impact on the chip S when the flip chip film 300 or the first foam 500 is impacted, thereby protecting the chip S.

[0084] In the second aspect of the present application, a display device is further provided, and the display device includes the above-described display module.

[0085] Among them, the display device can be, but is not limited to, an in-vehicle display, an advertising screen, a mobile phone, a computer, etc. The device setting component 102 of the display module included in the display device has sufficient free movement space after being bent, and is not prone to stress concentration. Therefore, the device setting component 102 is not easily damaged, which is beneficial to improving the service life of the display device.

[0086] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising an..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the said element.

[0087] Each embodiment in this specification is described in a related manner. For the same or similar parts among the embodiments, reference may be made to each other, and the differences between each embodiment and other embodiments are emphasized.

[0088] The above description is only the preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included within the protection scope of the present application.

Claims

1. A display module, characterized in that, It includes a panel main body display assembly, a supporting heat dissipation component and a circuit board; The display assembly includes a display component and a device setting component connected at one end, the support heat dissipation component is used to support the display component, the device setting component is arranged on a side of the support component away from the display component through a bending section, a circuit board is connected to the end of the device setting component, and the device setting component is fixedly connected to the support heat dissipation component through the circuit board; The display component is a curved structure, the side of the supporting heat dissipation component close to the display component is a curved surface, and the side of the supporting heat dissipation component away from the display component is a flat surface, a first foam is arranged between the device setting component and the supporting heat dissipation component, the side of the first foam close to the supporting heat dissipation component is a non-glue surface, the side of the first foam close to the device setting component is a glue surface, and the side of the first foam close to the device setting component has a groove, the groove is used to place a chip, and the chip is located in the groove.

2. The display module according to claim 1, wherein The display component includes a first panel body and a chip-on-chip film, the first panel body is the display component, the chip-on-chip film includes a first section, a middle section and a second section connected in sequence, the first section is connected to the panel body, the middle section is the bending section, the second section is a device setting component, and the second section is bent through the middle section to the side of the supporting heat dissipation component away from the panel body.

3. The display module according to claim 1, wherein The groove includes two first side walls arranged opposite to each other along a first direction and two second side walls arranged opposite to each other along a second direction, a first preset distance is provided between the two first side walls and the side walls of the chip opposite to each other, a second preset distance is provided between the second side walls and the side walls of the chip opposite to each other, and the first direction and the second direction are coplanar and perpendicular to the thickness direction of the display module.

4. The display module according to claim 3, wherein The first side wall is a long side of the groove, the second side wall is a short side of the groove, and the first preset distance is greater than the second preset distance.

5. The display module according to claim 3, wherein The middle parts of the two second side walls are recessed in a direction to shorten the distance between the second side walls, so that four corners of the groove form four bosses.

6. The display module according to claim 5, wherein There is a third preset distance between the starting position of the second sidewall recess and the sidewall of the chip corresponding thereto, and the third preset distance is 0.5mm-1mm; there is a fourth preset distance between the starting position of the second sidewall recess and the first sidewall close thereto, and the fourth preset distance is 1mm-2mm; There is a fifth preset distance between the second side wall of the recessed position and the side wall of the chip corresponding thereto, and the fifth preset distance is 1 mm-2 mm.

7. The display module according to any one of claims 1-6, characterized in that, The supporting heat dissipation component comprises a buffer, a heat dissipation film and a heat dissipation plate which are sequentially arranged in a direction away from the display component, and the thickness of the heat dissipation film is smaller than the thickness of the heat dissipation plate.

8. The display module according to claim 7, wherein The buffer is a second foam, the heat dissipation film is a copper foil, and the heat dissipation plate is an aluminum plate.

9. The display module according to claim 8, wherein A heat-conductive filler is arranged between the heat-dissipating film and the heat-dissipating plate, and the heat-conductive filler covers the surface of the heat-dissipating plate.

10. The display module according to claim 9, wherein The heat-conducting filler is liquid heat-conducting silicone grease or the heat-conducting filler is heat-conducting silica gel.

11. The display module according to claim 10, wherein At least one first conductive adhesive is provided on a first surface of the heat dissipation plate close to the heat dissipation film, and the first conductive adhesive passes through the heat-conducting filler to contact the heat dissipation film; At least one second conductive adhesive is provided on a second surface of the heat dissipation plate facing away from the heat dissipation film, and the second conductive adhesive is used for connecting with the middle frame; The first conductive adhesive and the second conductive adhesive are arranged in a staggered manner.

12. The display module according to claim 11, wherein Four first conductive adhesives are provided and are evenly distributed at positions close to the top corners on the first surface, and four second conductive adhesives are provided and are evenly distributed at positions close to the top corners on the second surface.

13. The display module according to claim 7, wherein Along the opposite direction of the extension direction of the device setting component, the boundary of the first foam exceeds the boundary of the heat dissipation plate.

14. The display module according to claim 13, wherein The distance between the boundary of the first foam and the boundary of the heat dissipation plate is 1 mm - 2 mm.

15. The display module according to any one of claims 1-6, characterized in that, The thickness of the first foam is greater than the thickness of the circuit board.

16. The display module according to claim 15, wherein The difference between the thickness of the first foam and the thickness of the circuit board is greater than or equal to 0.2 mm.

17. A display device, characterized in that, The display device includes the display module according to any one of claims 1-16.

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