Resin composition, electronic device, and method for manufacturing electronic device

Abstract

Disclosed are a resin composition, an electronic device, and a method of manufacturing the electronic device. The resin composition comprises polymer resin, fluoride resin and a free radical polymerization initiator, and the polymer resin comprises at least one selected from epoxy siloxane compounds, (methyl) acrylate monomers and tetrahydrofurfuryl acrylic acid.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority and all benefits derived therefrom to Korean Patent Application No. 10 - 2023 - 0191072, filed on December 26, 2023, the content of which is incorporated herein by reference in its entirety. Technical field

[0003] The present disclosure relates to a resin composition, an electronic device including a coating containing the resin composition, and a method of manufacturing an electronic device. Background art

[0004] Various display devices applied to multimedia devices (such as televisions, mobile phones, tablet computers, navigation units, and game units) are being developed. A display device generally includes various components, and a window for protecting a display module of the display device from external impacts can be formed by a direct coating method. Summary of the invention

[0005] When a window of a display device is formed by a direct coating method, the window may include a polymer compound. The physical properties of the polymer compound can be damaged by moisture in a high - temperature and high - humidity environment. Therefore, a material having waterproof properties is desired to be used as the polymer compound.

[0006] The present disclosure provides a resin composition that can prevent the physical properties of a coating formed therefrom from being damaged by moisture in a high - temperature and high - humidity environment and can prevent the physical properties of the coating from being damaged by reducing the generation of hydrogen ions during the polymerization of the polymer.

[0007] The present disclosure provides an electronic device including a coating formed from the resin composition.

[0008] The present disclosure provides a method of manufacturing an electronic device.

[0009] Embodiments of the present invention provide a resin composition including a polymer resin, a fluoride resin, and a radical polymerization initiator, wherein the polymer resin includes at least one selected from the group consisting of epoxy siloxane compounds, (meth)acrylate monomers, and tetrahydrofurfuryl acrylate monomers.

[0010] In an embodiment, the polymer resin may be an epoxy siloxane resin.

[0011] In an embodiment, the fluoride resin may include at least one selected from the group consisting of polytetrafluoroethylene (PTFE) monomer, polyvinylidene fluoride (PVDF) monomer, polyvinyl fluoride (PVF) monomer, ethylene tetrafluoroethylene (ETFE) monomer, perfluoroalkoxy alkane (PFA) monomer, poly[4,5-difluoro-2,2-bis(trifluoromethyl)-1,3-dioxolene-co-tetrafluoroethylene] monomer, poly[perfluoro(butenyl vinyl ether)] monomer, poly(tetrafluoroethylene-co-2,2,4-trifluoro-5-trifluoromethoxy-1,3-dioxolene) monomer, poly(tetrafluoroethylene-co-perfluoro-3,6-dioxa-4-methyl-7-octenesulfonic acid) monomer, fluorinated methacrylate, fluorinated styrene, fluorinated vinyl ether, fluorinated silicon, fluorinated imide, fluorinated diphthalic anhydride, and fluorinated oxetane.

[0012] In an embodiment, the proportion of the weight of the fluoride resin relative to the total weight of the resin composition may be equal to or greater than about 10 weight percent (wt%) and equal to or less than about 20 wt%.

[0013] In an embodiment, the radical polymerization initiator may include at least one selected from the group consisting of acetophenone initiators, sulfonium salt initiators, and benzophenone initiators.

[0014] In an embodiment, the acetophenone initiator may include at least one selected from the group consisting of benzyldimethyl ketal, 1-hydroxy-cyclohexyl phenyl ketone, and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide.

[0015] In an embodiment, the proportion of the weight of the radical polymerization initiator relative to the total weight of the resin composition may be equal to or greater than about 1 wt% and equal to or less than about 5 wt%.

[0016] In an embodiment, the resin composition may further include a framework compound, a crosslinking agent, and a diluent. In such an embodiment, the framework compound includes at least one selected from the group consisting of polyester acrylate oligomer, epoxy acrylate oligomer, polyurethane acrylate oligomer, and polyethylene glycol acrylate oligomer, and the crosslinking agent may include at least one selected from the group consisting of tripropylene glycol diacrylate (TPGDA), hexanediol diacrylate (HDDA), dodecanedioic acid (DDDA), and bisphenol A (ethoxylate) x diacrylate (BPA(EO) x DA), where x is an integer equal to or greater than 3 and equal to or less than 30.

[0017] In an embodiment, the diluent may include at least one selected from the group consisting of polyester acrylate oligomer and polyether acrylate oligomer.

[0018] In an embodiment, the viscosity of the resin composition measured by JIS K7117-2 may be equal to or greater than about 1 cP and equal to or less than about 1000 cP at 25 °C.

[0019] Embodiments of the present invention provide an electronic device, the electronic device comprising: a housing; a display panel disposed in the housing; and a first coating disposed on the display panel. In such an embodiment, the first coating comprises a resin composition comprising a polymer resin, a fluoride resin, and a free radical polymerization initiator, wherein the polymer resin comprises at least one selected from the group consisting of epoxy siloxane compounds, (meth)acrylate monomers, and tetrahydrofurfuryl acrylate monomers.

[0020] In an embodiment, the first coating may have a thickness equal to or greater than about 100 microns and equal to or less than about 300 microns.

[0021] In an embodiment, the electronic device may further comprise a second coating disposed on the first coating.

[0022] In an embodiment, the second coating may have a hardness greater than that of the first coating.

[0023] In an embodiment, the second coating may have a thickness equal to or greater than about 10 microns and equal to or less than about 15 microns.

[0024] In an embodiment, the electronic device may further comprise a polarizer disposed between the display panel and the first coating.

[0025] In an embodiment, the electronic device may further comprise a polarizer disposed on the first coating.

[0026] Embodiments of the present invention provide a method of manufacturing an electronic device. In such an embodiment, the method comprises: forming a resin composition comprising a polymer resin, a fluoride resin, and a free radical polymerization initiator, wherein the polymer resin comprises at least one selected from the group consisting of epoxy siloxane compounds, (meth)acrylate monomers, and tetrahydrofurfuryl acrylate monomers; spraying the resin composition on a substrate film to form an initial first coating; and irradiating ultraviolet light onto the initial first coating to form the first coating.

[0027] In an embodiment, the fluoride resin may include at least one selected from the group consisting of polytetrafluoroethylene (PTFE) monomer, polyvinylidene fluoride (PVDF) monomer, polyvinyl fluoride (PVF) monomer, ethylene tetrafluoroethylene (ETFE) monomer, perfluoroalkoxyalkane (PFA) monomer, poly[4,5-difluoro-2,2-bis(trifluoromethyl)-1,3-dioxolene-co-tetrafluoroethylene] monomer, poly[perfluoro(butenyl vinyl ether)] monomer, poly(tetrafluoroethylene-co-2,2,4-trifluoro-5-trifluoromethoxy-1,3-dioxolene) monomer, poly(tetrafluoroethylene-co-perfluoro-3,6-dioxa-4-methyl-7-octenesulfonic acid) monomer, fluorinated methacrylate, fluorinated styrene, fluorinated vinyl ether, fluorinated silicon, fluorinated imide, fluorinated diphthalic anhydride, and fluorinated oxetane, and the proportion of the weight of the fluoride resin relative to the total weight of the resin composition may be equal to or greater than about 10 wt% and equal to or less than about 20 wt%.

[0028] In an embodiment, the radical polymerization initiator may include at least one selected from the group consisting of acetophenone initiators, sulfonium salt initiators, and benzophenone initiators, and the proportion of the weight of the radical polymerization initiator relative to the total weight of the resin composition may be equal to or greater than about 1 wt% and equal to or less than about 5 wt%.

[0029] According to an embodiment, deterioration of the physical properties of the resin composition or the first coating formed from the resin composition due to a high-temperature and high-humidity environment is minimized.

[0030] According to an embodiment of the method of manufacturing an electronic device, deterioration of the physical properties of the first coating formed from the resin composition due to a high-temperature and high-humidity environment is minimized, and thus, the display module is effectively protected from external shocks. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] When considered in conjunction with the accompanying drawings, the above and other features of the embodiments of the present disclosure will become quite apparent by reference to the following detailed description, in which:[[]]END]]

[0032] Figure 1 is a perspective view of an electronic device according to an embodiment of the present disclosure;

[0033] Figure 2 is an exploded perspective view of an electronic device according to an embodiment of the present disclosure;

[0034] Figure 3 is along Figure 1 a sectional view taken along line I-I' of

[0035] Figure 4 is a perspective view of an electronic device according to an embodiment of the present disclosure;

[0036] Figure 5 is a cross-sectional view taken along line II-II' of Figure 4 ;

[0037] Figure 6 is a flowchart showing an embodiment of a method of manufacturing an electronic device; and

[0038] Figures 7 to 10 is a cross-sectional view showing a process of a method of manufacturing an electronic device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0039] Hereinafter, the present invention will be described more fully with reference to the accompanying drawings, in which various embodiments are shown. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art.

[0040] In the present disclosure, it will be understood that when an element, region, layer, or portion is referred to as being "on," "connected to," or "coupled to" another element, region, layer, or portion, the element, region, layer, or portion may be directly on, directly connected to, or directly coupled to the other element, region, layer, or portion, or there may be intervening elements, regions, layers, or portions.

[0041] Like reference numerals refer to like elements throughout. In the drawings, the thickness, ratio, and dimensions of components are exaggerated for effective description of the technical content.

[0042] It will be understood that although the terms first, second, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. Thus, a first element discussed below may be named a second element without departing from the teachings herein.

[0043] The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting. As used herein, unless the context clearly dictates otherwise, the articles "a", "an", "the", and "at least one" do not denote a limitation of quantity and are intended to include both the singular and the plural. Thus, a reference to "an" element followed by a reference to "the" element includes one or more of the elements. For example, unless the context clearly dictates otherwise, "an element" has the same meaning as "at least one element". "At least one" should not be construed as being limited to "one" or "a". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0044] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another as shown in the figures. It will be understood that the relative terms are intended to cover different orientations of the device in addition to the orientation depicted in the figures. For example, if the device in one figure is flipped, an element described as on the "lower" side of another element will then be positioned on the "upper" side of the other element. Thus, depending on the specific orientation of the figure, the term "lower" can cover both the "lower" and "upper" orientations. Similarly, if the device in one figure is flipped, an element described as "beneath" or "under" another element will then be positioned "above" the other element. Thus, the terms "beneath" or "under" can cover both the upper and lower orientations.

[0045] It will also be understood that when the terms "comprises" and / or "comprising" are used in this specification, they specify the presence of the stated features, integers, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0046] In the following description, the statement that "Component A is directly disposed / provided on Component B" means that there is no intervening element between Component A and Component B. That is, the statement that "Component A is directly disposed / provided on Component B" means that Component A is in contact with Component B.

[0047] Taking into account the measurements under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "about" or "approximate" as used herein includes the stated value and means within an acceptable deviation range of a particular value as determined by a person of ordinary skill in the art. For example, "about" may mean within one or more standard deviations, or within ±30%, ±20%, ±10%, or ±5% of the stated value.

[0048] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms, such as those defined in a general dictionary, should be understood as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense.

[0049] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0050] Figure 1 is a perspective view of an electronic device ED according to an embodiment of the present disclosure. Figure 2 is an exploded perspective view of an electronic device ED according to an embodiment of the present disclosure.

[0051] Reference Figure 1 , embodiments of the electronic device ED can be activated in response to an electrical signal. In an embodiment, for example, the electronic device ED can be a personal computer, a notebook computer, a personal digital assistant, a gaming unit, a mobile electronic device, a television, a monitor, an outdoor billboard, an automotive navigation unit, or a wearable device. However, the electronic device ED should not be limited thereto or thereby. As a representative example, Figure 1 shows an embodiment in which the electronic device ED is a mobile phone.

[0052] The electronic device ED can display an image IM through a display area DA. The display area DA can include a plane defined by a first direction axis DR1 and a second direction axis DR2. The display area DA can also include a curved surface bent from at least one side of the plane defined by the first direction axis DR1 and the second direction axis DR2. In an embodiment, as Figure 1 shown in, the electronic device ED can include two curved surfaces bent from both sides of the plane defined by the first direction axis DR1 and the second direction axis DR2. However, the electronic device ED should not be limited thereto or thereby. In another embodiment, for example, the display area DA can only include the plane defined by the first direction axis DR1 and the second direction axis DR2, or the display area DA can also include more than two curved surfaces (e.g., four curved surfaces bent from four sides of the plane defined by the first direction axis DR1 and the second direction axis DR2).

[0053] The electronic device ED of the present disclosure can be flexible. The term "flexible" used herein refers to the property of being able to bend from a fully bent structure to a structure bent within a range of several nanometers. In an embodiment, for example, the electronic device ED can be a curved display device or a foldable display device. According to an embodiment, the electronic device ED can be rigid.

[0054] The non-display area NDA may be defined adjacent to the display area DA. The non-display area NDA may surround the display area DA. Accordingly, the display area DA may have a shape substantially defined by the non-display area NDA. However, this is merely an example. The non-display area NDA may be defined adjacent to only one side of the display area DA, or the non-display area NDA may be omitted. According to an embodiment, the display area DA may be provided in various shapes, and the display area DA should not be particularly limited.

[0055] Figure 1 The following drawings illustrate a first direction axis DR1, a second direction axis DR2, and a third direction axis DR3, and the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be opposite to each other and may vary in other directions. In addition, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be referred to as the first direction, the second direction, and the third direction, respectively, and the first direction, the second direction, and the third direction may be assigned the same reference numerals as the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 in the drawings. In the following description, the first direction axis DR1 may be substantially perpendicular to the second direction axis DR2, and the third direction axis DR3 may be a normal direction with respect to the plane defined by the first direction axis DR1 and the second direction axis DR2.

[0056] The thickness direction of the electronic device ED may be substantially parallel to the third direction axis DR3, which is the normal direction of the plane defined by the first direction axis DR1 and the second direction axis DR2. In an embodiment, the front surface (or upper surface, top surface, or upper side surface) and the rear surface (or lower surface, bottom surface, or lower side surface) of each component of the electronic device ED may be defined with respect to the third direction axis DR3. In addition, the direction in which the third direction axis DR3 extends may be substantially parallel to the thickness direction, the front surface (or upper surface, top surface, or upper side surface) may indicate the surface (or direction) adjacent to the surface through which the image IM is displayed, and the rear surface (or lower surface, bottom surface, or lower side surface) may indicate the surface (or direction) spaced apart from the surface through which the image IM is displayed. In the present disclosure, the term "plane" refers to a surface substantially parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2, and the term "section" refers to a surface perpendicular to the plane defined by the first direction axis DR1 and the second direction axis DR2 and substantially parallel to the third direction axis DR3 (i.e., the thickness direction).

[0057] Reference Figure 2, an embodiment of the electronic device ED may include a housing HAU, a display module DM, and a protective film PF disposed on the display module DM. In addition, the electronic device ED may further include a lower panel UDP disposed between the housing HAU and the display module DM, and a polarizer PP disposed between the display module DM and the protective film PF.

[0058] In an embodiment of the electronic device ED, as Figure 1 and Figure 2 shown, the protective film PF and the housing HAU may be coupled to each other to provide the exterior of the electronic device ED. The housing HAU may be disposed below the display module DM.

[0059] The housing HAU may include a material having relatively high rigidity. In an embodiment, for example, the housing HAU may include a plurality of frames and / or plates including glass, plastic, or metal materials, or include a plurality of frames and / or plates formed of glass, plastic, or metal materials. The housing HAU may provide a predetermined accommodation space. The display module DM may be accommodated in the accommodation space and may protect the display module DM from external impacts.

[0060] The lower panel UDP may be disposed between the housing HAU and the display module DM. The lower panel UDP may be directly disposed on the lower surface of the display module DM. The lower panel UDP may disperse external impacts applied to the display module DM and thus may protect the display module DM. The lower panel UDP will be described in detail later with reference to Figure 3 .

[0061] The protective film PF may include a transmissive area TA and a border area BZA. The transmissive area TA may overlap at least a part of the active area AA-DM of the display module DM. The transmissive area TA may be an optically transparent area. An image IM may be provided to a user through the transmissive area TA. The protective film PF will be described in detail later with reference to Figure 3 .

[0062] The border area BZA may be an area having a transmittance relatively lower than that of the transmissive area TA. The border area BZA may define the shape of the transmissive area TA. The border area BZA may be disposed adjacent to the transmissive area TA and may surround the transmissive area TA.

[0063] The border area BZA may have a predetermined color. The border area BZA may cover the peripheral area NAA-DM of the display module DM to prevent the peripheral area NAA-DM from being viewed from the outside. However, this is only an example. The border area BZA may be disposed adjacent to only one side of the transmissive area TA, or at least a part of the border area BZA may be omitted.

[0064] Figure 3 is alongFigure 1 Cross-sectional view taken along line I-I'. Figure 3 Shows Figure 2 Cross-sectional view of the housing HAU, the lower panel UDP, the display module DM, the polarizer PP, and the protective film PF. In addition, Figure 3 is a cross-sectional view of the electronic device ED.

[0065] Refer to Figure 3 , in an embodiment of the electronic device ED, the lower panel UDP may include a metal plate MP disposed on the housing HAU, a cover plate CDP disposed on the metal plate MP, and a lower protective film PFM disposed on the cover plate CDP.

[0066] The metal plate MP may be disposed between the housing HAU and the cover plate CDP. The metal plate MP may be directly disposed on the housing HAU. The metal plate MP may support the display panel DP. The metal plate MP may include a metal material. In an embodiment, for example, the metal plate MP may include a stainless steel material. The metal plate MP may have a thickness equal to or greater than about 100 microns and equal to or less than about 500 microns.

[0067] The cover plate CDP may be disposed between the metal plate MP and the lower protective film PFM. The cover plate CDP may increase the resistance to compressive force caused by external pressure. Therefore, the cover plate CDP may effectively prevent the display panel DP from deforming. The cover plate CDP may include a plastic material (such as polyimide or polyethylene terephthalate). The cover plate CDP may have a thickness equal to or greater than about 10 microns and equal to or less than about 100 microns.

[0068] The lower protective film PFM may be disposed below the display panel DP. The lower protective film PFM may protect the lower part of the display panel DP. The lower protective film PFM may include a flexible plastic material. In an embodiment, for example, the lower protective film PFM may include polyethylene terephthalate (PET). The lower protective film PFM may have a thickness equal to or greater than about 10 microns and equal to or less than about 100 microns. The thickness of the metal plate MP may be greater than the thickness of each of the cover plate CDP and the lower protective film PFM. The thickness of the lower protective film PFM may be greater than the thickness of the cover plate CDP.

[0069] The display module DM may include a display panel DP and an input sensing unit TP disposed on the display panel DP. The display panel DP may have a configuration for basically generating an image IM (refer to Figure 1 ). The display panel DP may include a substrate base BS, a circuit layer DP-CL disposed on the substrate base BS, a display element layer DP-EL disposed on the circuit layer DP-CL, and a packaging layer TFE covering the display element layer DP-EL.

[0070] Figure 3 The structure of the display panel DP shown is only an example, and the structure of the display panel DP should not be limited thereto or thereby restricted. In another embodiment, for example, the display panel DP may include liquid crystal display elements, and in such an embodiment, the encapsulation layer TFE may be omitted.

[0071] The substrate base BS may provide a substrate surface on which a circuit layer DP-CL is provided. The substrate base BS may be a flexible substrate that is bendable, foldable, or rollable. The substrate base BS may be a glass substrate, a metal substrate, or a polymer substrate. However, the embodiments should not be limited thereto or thereby restricted, and the substrate base BS may be an inorganic layer, an organic layer, or a composite material layer.

[0072] The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, and signal lines. In an embodiment, for example, the circuit layer DP-CL may include switching transistors and driving transistors to drive light-emitting elements (not shown) of the display element layer DP-EL described later.

[0073] The display element layer DP-EL may include light-emitting elements that emit light. In an embodiment, for example, the light-emitting elements may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro light-emitting diodes (LEDs), or nano LEDs.

[0074] The encapsulation layer TFE may be provided on the display element layer DP-EL. The encapsulation layer TFE may protect the display element layer DP-EL from moisture, oxygen, and / or foreign substances such as dust particles. The encapsulation layer TFE may include at least one inorganic layer. In an embodiment, for example, the encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence.

[0075] The input sensing unit TP may be provided on the display panel DP. In an embodiment, for example, the input sensing unit TP may be directly provided on the encapsulation layer TFE. According to an embodiment, an adhesive layer may be provided between the input sensing unit TP and the display panel DP.

[0076] The input sensing unit TP may sense an external input, may convert the external input into a predetermined input signal, and may provide the input signal to the display panel DP. In an embodiment, for example, the input sensing unit TP of the electronic device ED may be a touch sensing unit that senses touch events. The input sensing unit TP may sense a direct touch of a user, an indirect touch of a user, a direct touch of an object, or an indirect touch of an object.

[0077] The input sensing unit TP can sense at least one of the position of a touch event externally applied to the TP of the input sensing unit and the intensity (or pressure) of a touch event externally applied to the TP of the input sensing unit. The input sensing unit TP can have various structures or can include various materials, and the input sensing unit TP should not be particularly limited. The input sensing unit TP can sense external input by a capacitive method. The display panel DP can receive an input signal from the input sensing unit TP and can generate an image corresponding to the input signal.

[0078] The polarizer PP can prevent external light from being reflected. The polarizer PP can block a part of the external light. The polarizer PP can have an anti-reflection function to reduce the reflection of external light in the electronic device ED. In an embodiment, the polarizer PP can be formed by adsorbing a dichroic dye onto a stretched polymer film. In an embodiment, for example, the polarizer PP can be formed by adsorbing iodine onto a stretched polyvinyl alcohol film. In such an embodiment, the direction along which the polymer film is stretched can be the adsorption axis of the polarizer PP, and the direction substantially perpendicular to the stretching direction can be the transmission axis of the polarizer PP.

[0079] In an embodiment, although not shown in the drawings, the polarizer PP can further include at least one protective layer. In an embodiment, for example, the polarizer PP can further include a triacetyl cellulose (TAC) layer provided on at least one of its upper surface and lower surface. However, the present disclosure should not be limited thereto or thereby, and the polarizer PP can further include a hard coat, an anti-reflection layer, or an anti-glare layer as a protective layer.

[0080] The protective film PF can include a base film BFM provided on the polarizer PP, a first coating CTL1 provided on the base film BFM, and a second coating CTL2 provided on the first coating CTL1.

[0081] The base film BFM can provide a base surface on which the first coating CTL1 is provided. The base film BFM can be a flexible substrate that is bendable, foldable, or rollable. The base film BFM can be a glass substrate, a metal substrate, or a polymer substrate. In an embodiment, for example, the base film BFM can include polyethylene terephthalate.

[0082] The first coating CTL1 can protect the display module DM from external impacts. The first coating CTL1 can be directly disposed on the base film BFM. An adhesive layer may not be provided between the first coating CTL1 and the base film BFM. The first coating CTL1 can have a thickness equal to or greater than about 100 microns and equal to or less than about 300 microns. When the thickness of the first coating CTL1 is less than about 100 microns, the absorption function of the protective film PF with respect to external impacts will deteriorate. When the thickness of the first coating CTL1 is greater than about 300 microns, the visibility of the electronic device ED will be reduced.

[0083] The first coating CTL1 can include a polymer resin, a fluoride resin, and a free radical polymerization initiator. The first coating CTL1 can be formed of a resin composition including a polymer resin, a fluoride resin, and a free radical polymerization initiator, or formed using a resin composition including a polymer resin, a fluoride resin, and a free radical polymerization initiator.

[0084] When forming the first coating CTL1, the polymer resin of the first coating CTL1 can be used as a main adhesive. The polymer resin of the first coating CTL1 can include at least one selected from the group consisting of epoxy siloxane compounds, (meth)acrylate monomers, and tetrahydrofurfuryl acrylate monomers. For example, the polymer resin can be an epoxy siloxane resin.

[0085] The fluoride resin of the first coating CTL1 can increase the durability and reliability of the first coating CTL1. That is, the fluoride resin of the first coating CTL1 can provide a waterproof property to the first coating CTL1.

[0086] The fluoride resin can include a monomer containing a fluorine group in its molecular structure. The fluoride resin of the first coating CTL1 can include at least one selected from the group consisting of polytetrafluoroethylene (PTFE) monomers, polyvinylidene fluoride (PVDF) monomers, polyvinyl fluoride (PVF) monomers, ethylene tetrafluoroethylene (ETFE) monomers, perfluoroalkoxy (PFA) monomers, poly[4,5-difluoro-2,2-bis(trifluoromethyl)-1,3-dioxolene-co-tetrafluoroethylene] monomers, poly[perfluoro(butenyl vinyl ether)] monomers, poly(tetrafluoroethylene-co-2,2,4-trifluoro-5-trifluoromethoxy-1,3-dioxolene) monomers, poly(tetrafluoroethylene-co-perfluoro-3,6-dioxa-4-methyl-7-octenesulfonic acid) monomers, fluorinated methacrylates, fluorinated styrenes, fluorinated vinyl ethers, fluorinated silicons, fluorinated imides, fluorinated diphthalic anhydrides, and fluorinated oxetanes.

[0087] The radical polymerization initiator of the first coating CTL1 can be used as an initiator for polymer polymerization. Different from cationic polymerization initiators that generate hydrogen ions during the polymer polymerization initiation process, the radical polymerization initiator of the first coating CTL1 can not generate hydrogen ions during the polymer polymerization initiation process and can generate free radicals to maintain the pH (hydrogen ion index) uniformly in the polymerization environment. Therefore, compared with cationic polymerization initiators, the radical polymerization initiator of the first coating CTL1 can provide stable initiation of polymer polymerization. The radical polymerization initiator of the first coating CTL1 can include at least one selected from acetophenone initiators, sulfonium salt initiators, and benzophenone initiators. The acetophenone initiators can include at least one selected from benzyldimethyl ketal, 1-hydroxy-cyclohexyl phenyl ketone, and bis(2,4,6-trimethylbenzoyl)-phenyl phosphine oxide.

[0088] The first coating CTL1 may further include a framework compound, a crosslinking agent, and a diluent.

[0089] The framework compound of the first coating CTL1 can improve the durability of the first coating CTL1. The framework compound of the first coating CTL1 can include at least one selected from polyester acrylate oligomers, epoxy acrylate oligomers, polyurethane acrylate oligomers, and polyethylene glycol acrylate oligomers.

[0090] The crosslinking agent of the first coating CTL1 can chemically connect the framework compound of the first coating CTL1. The crosslinking agent of the first coating CTL1 can improve the reliability and stability of the first coating CTL1. The crosslinking agent of the first coating CTL1 can include at least one selected from tripropylene glycol diacrylate (TPGDA), hexanediol diacrylate (HDDA), dodecanedioic acid (DDDA), and bisphenol A (ethoxylate) x diacrylate (BPA(EO) x DA), where x is an integer equal to or greater than 3 and equal to or less than 30. In an embodiment, for example, x can be 10.

[0091] The viscosity of the first coating CTL1 can be controlled by the diluent of the first coating CTL1. The viscosity of the resin composition RC (reference Figure 9 ) forming the first coating CTL1 measured by JIS K7117-2 of the Japanese Industrial Standards (JIS) at 25 °C can be equal to or greater than about 1 centipoise (cP) and equal to or less than about 1000 cP. When the viscosity of the resin composition RC (reference Figure 9 ) forming the first coating CTL1 is less than about 1 cP, the display module DM will be vulnerable to external shocks. When the resin composition RC (reference Figure 9) When the viscosity is greater than about 1000 cP, cracks will appear in the first coating CTL1, and the durability of the first coating CTL1 will deteriorate. The diluent of the first coating CTL1 may include at least one selected from polyester acrylate oligomers and polyether acrylate oligomers.

[0092] The second coating CTL2 can be directly disposed on the first coating CTL1. The second coating CTL2 can define the uppermost surface of the electronic device ED. The second coating CTL2 can have a hardness greater than that of the first coating CTL1, and thus can effectively prevent scratches and cracks from appearing on the upper surface of the first coating CTL1. There may be no adhesive member between the second coating CTL2 and the first coating CTL1. The second coating CTL2 can have a thickness equal to or greater than about 10 microns and equal to or less than about 15 microns. When the thickness of the second coating CTL2 is less than about 10 microns, the absorption function of the protective film PF against external impacts will deteriorate. When the thickness of the second coating CTL2 is greater than about 15 microns, the visibility of the electronic device ED will deteriorate.

[0093] In an embodiment, as described above, the electronic device ED may include the first coating CTL1 directly disposed on the substrate film BFM, and thus, the adhesive layer may not directly exist on the lower surface of the first coating CTL1. Therefore, in such an embodiment, the visibility of the electronic device ED can be improved, and the total thickness of the electronic device ED can be substantially reduced. In such an embodiment, since the first coating CTL1 includes a fluoride resin having waterproof properties, even if the electronic device ED is exposed to a high temperature and high humidity environment, external moisture can be effectively prevented from entering the display module DM of the electronic device ED, and the corrosion phenomenon caused by external moisture can be effectively prevented. In such an embodiment, since the first coating CTL1 includes a radical polymerization initiator, the generation of hydrogen ions during the polymerization initiation and elongation of the polymer can be substantially reduced, and the change in the physical properties of the electronic device ED can be substantially reduced.

[0094] Figure 4 is a perspective view of an electronic device ED-a according to an embodiment of the present disclosure. Figure 5 is along Figure 4 The cross-sectional view taken along line II-II'. Figure 4 Illustrates an embodiment in which the electronic device ED-a is a tablet terminal or a tablet computer.

[0095] Refer to Figure 4 and Figure 5 , embodiments of the electronic device ED-a may include a housing HAU', a display module DM' disposed in the housing HAU', and a protective film PF' disposed on the display module DM'. In such an embodiment, Figure 4The housing HAU', display area DA-a, and non-display area NDA-a shown in Figure 1 and Figure 2 may be substantially the same as the housing HAU, display area DA, and non-display area NDA described above, and any repeated detailed description thereof will be omitted.

[0096] In such an embodiment, Figure 5 the housing HAU', bottom panel UDP' (including metal plate MP', cover plate CDP', and lower protective film PFM'), display module DM' (including display panel DP' (including substrate base BS', circuit layer DP-CL', display element layer DP-EL', and encapsulation layer TFE') and input sensing unit TP'), base film BFM', first coating CTL1', and polarizer PP' shown in Figure 3 may be substantially the same as the housing HAU, bottom panel UDP, display module DM, base film BFM, first coating CTL1, and polarizer PP of the electronic device ED described above, and any repeated detailed description thereof will be omitted.

[0097] In an embodiment, as shown in Figure 5 the polarizer PP' of the electronic device ED-a is disposed on the first coating CTL1', and the component corresponding to the second coating CTL2 shown in Figure 3 is omitted. That is, according to an embodiment of the electronic device ED-a, the protective film PF' may include the base film BFM' and the first coating CTL1', the first coating CTL1' may be disposed between the polarizer PP' and the display module DM' (e.g., between the polarizer PP' and the base film BFM'), and the polarizer PP' may be disposed at the uppermost position of the electronic device ED-a instead of the protective film PF'.

[0098] Figure 6 is a flowchart showing an embodiment of a method of manufacturing an electronic device.

[0099] Referring to Figure 6 , an embodiment of a method of manufacturing an electronic device may include the steps of: mixing a polymer resin including at least one selected from the group consisting of epoxy siloxane compounds, (meth)acrylate monomers, and tetrahydrofurfuryl acrylate monomers, a fluoride resin, and a radical polymerization initiator with each other to form a resin composition (S100); spraying the resin composition onto a base film to form an initial first coating (S110); and irradiating ultraviolet rays onto the initial first coating to form a first coating (S120). Hereinafter, the process of an embodiment of a method of manufacturing an electronic device will be described in detail with reference to Figures 7 to 10 .

[0100] Figures 7 to 10It is a cross-sectional view of a process showing a method of manufacturing an electronic device according to an embodiment of the present disclosure. The method of manufacturing an electronic device according to an embodiment of the present disclosure mainly lies in the method of manufacturing a coating (e.g., the first coating CTL1) of the electronic device.

[0101] Referring Figure 7 and Figure 8 , the forming step of the resin composition RC may include: providing a mixture including a polymer resin PR to a container BW; and adding a mixture including a fluoride resin FR and a mixture including a radical polymerization initiator RI to the container BW to form the resin composition RC.

[0102] The container BW may accommodate a mixture including a polymer resin PR and may include glass, metal, or polymer. In an embodiment, for example, the container BW may include a plastic material or be formed of a plastic material.

[0103] The resin composition RC may include a polymer resin PR, a fluoride resin FR, and a radical polymerization initiator RI. In such an embodiment, the polymer resin PR, the fluoride resin FR, and the radical polymerization initiator RI are substantially the same as the polymer resin, the fluoride resin, and the radical polymerization initiator described above with reference to Figure 3 , and any repeated detailed description thereof will be omitted.

[0104] In the resin composition RC, the proportion of the weight of the fluoride resin FR relative to the total weight of the resin composition RC may be equal to or greater than about 10 weight percent (wt%) and equal to or less than about 20 wt%. When the proportion of the weight of the fluoride resin FR relative to the total weight of the resin composition RC is less than about 10 wt%, the waterproof property of the first coating CTL1 (refer to Figure 3 ) formed from the resin composition RC will deteriorate. When the proportion of the weight of the fluoride resin FR relative to the total weight of the resin composition RC is greater than about 20 wt%, the physical properties of the resin composition RC will deteriorate, and thus, the protective property of the first coating CTL1 (refer to Figure 3 ) formed from the resin composition RC will deteriorate.

[0105] In the resin composition RC, the proportion of the weight of the radical polymerization initiator RI relative to the total weight of the resin composition RC can be equal to or greater than about 1 wt% and equal to or less than about 5 wt%. When the proportion of the weight of the radical polymerization initiator RI relative to the total weight of the resin composition RC is less than about 1 wt%, radicals sufficient to initiate the polymerization of the polymer are not generated, and thus, the physical properties of the resin composition RC deteriorate. When the proportion of the weight of the radical polymerization initiator RI relative to the total weight of the resin composition RC is greater than about 5 wt%, radicals are over-generated, and thus, the physical properties of the resin composition RC deteriorate.

[0106] Figure 9 and Figure 10 show the process of forming Figure 3 the first coating CTL1. In Figure 9 and Figure 10 for ease of illustration and description, the housing HAU, the lower panel UDP, the display module DM, the polarizer PP, and the second coating CTL2 shown in Figure 3 are omitted.

[0107] Referring to Figure 9 and Figure 10 , the initial first coating PCTL1 can be formed by spraying the resin composition RC onto the upper surface of the substrate film BFM. The resin composition RC can be sprayed onto the upper surface of the substrate film BFM by an inkjet printing method, a dispensing method, or a jet dispensing method. However, the present disclosure should not be limited thereto or thereby.

[0108] The initial first coating PCTL1 can be cured by ultraviolet light L, and thus, the first coating CTL1 can be formed. Ultraviolet light L can be irradiated with an intensity equal to or greater than about 1 kilojoule (kJ) and equal to or less than about 2 kJ. When the intensity of ultraviolet light L is less than about 1 kJ, the initial first coating PCTL1 is not sufficiently cured, and thus, the physical properties of the first coating CTL1 deteriorate. When the intensity of ultraviolet light L is greater than about 2 kJ, the initial first coating PCTL1 is over-cured. As a result, cracks appear in the first coating CTL1, and the durability of the first coating CTL1 deteriorates.

[0109] Embodiments of the electronic device may include a first coating disposed directly on a substrate film, and an adhesive layer may not be directly present on the lower surface of the first coating. Accordingly, the visibility of the electronic device may be improved, and the total thickness of the electronic device may be substantially reduced. In such an embodiment, since the first coating includes a fluoride resin having a waterproof property, even if the electronic device is exposed to a high temperature and high humidity environment, external moisture can be effectively prevented from entering the display module of the electronic device, and a corrosion phenomenon caused by external moisture can be effectively prevented. In such an embodiment, since the first coating includes a radical polymerization initiator, generation of hydrogen ions during a polymer polymerization initiation and elongation process can be substantially reduced, and a change in physical properties of the electronic device can be substantially reduced.

[0110] The present invention should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

[0111] Although the present invention has been particularly shown and described with reference to its embodiments, it will be understood by those of ordinary skill in the art that various changes in its form and details may be made without departing from the spirit or scope of the invention as defined by the appended claims.

Claims

1. A resin composition, wherein The resin composition comprises a polymer resin, a fluoride resin and a free radical polymerization initiator, wherein the polymer resin comprises at least one selected from epoxysilicone compounds, (meth)acrylate monomers and tetrahydrofurfuryl acrylic acid monomers.

2. The resin composition according to claim 1, wherein The polymer resin is an epoxysiloxane-based resin.

3. The resin composition according to claim 1, wherein The fluoride resin includes at least one selected from polytetrafluoroethylene monomer, polyvinylidene fluoride monomer, polyvinyl fluoride monomer, ethylene tetrafluoroethylene monomer, polyoxymethylene monomer, poly[4,5-difluoro-2,2-bis(trifluoromethyl)-1,3-dioxole-co-tetrafluoroethylene] monomer, poly[perfluoro(butylene vinyl ether)] monomer, poly(tetrafluoroethylene-co-2,2,4-trifluoro-5-trifluoromethoxy-1,3-dioxole) monomer, poly(tetrafluoroethylene-co-perfluoro-3,6-dioxa-4-methyl-7-octene sulfonic acid) monomer, fluorinated methacrylate, fluorinated styrene, fluorinated vinyl ether, fluorinated silicon, fluorinated imide, fluorinated diphthalic anhydride and fluorinated oxetane.

4. The resin composition according to claim 1, wherein The ratio of the weight of the fluoride resin to the total weight of the resin composition is equal to or greater than 10 wt % and equal to or less than 20 wt %.

5. The resin composition according to claim 1, wherein The free radical polymerization initiator includes at least one selected from acetophenone initiators, sulfonium salt initiators and benzophenone initiators.

6. The resin composition according to claim 5, wherein The acetophenone initiator includes at least one selected from benzyl dimethyl ketal, 1-hydroxy-cyclohexyl phenyl ketone and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide.

7. The resin composition according to claim 1, wherein The ratio of the weight of the radical polymerization initiator to the total weight of the resin composition is equal to or greater than 1 wt % and equal to or less than 5 wt %.

8. The resin composition according to claim 1, wherein The resin composition further comprises a framework compound, a cross-linking agent and a diluent, wherein the framework compound comprises at least one selected from polyester acrylate oligomers, epoxy acrylate oligomers, polyurethane acrylate oligomers and polyethylene glycol acrylate oligomers, and The crosslinking agent includes a compound selected from tripropylene glycol diacrylate, hexanediol diacrylate, dodecanedioic acid and bisphenol A (ethoxylate). x At least one of diacrylates, wherein x is an integer equal to or greater than 3 and equal to or less than 30.

9. An electronic device, wherein: The electronic device comprises: case; A display panel is disposed in the housing; and A first coating layer is disposed on the display panel. wherein the first coating layer comprises a resin composition comprising a polymer resin, a fluoride resin and a free radical polymerization initiator, and Wherein, the polymer resin includes at least one selected from epoxysilicone compounds, (meth)acrylate monomers and tetrahydrofurfuryl acrylic acid monomers.

10. A method of manufacturing an electronic device, wherein: The method comprises: Forming a resin composition including a polymer resin, a fluoride resin and a free radical polymerization initiator, wherein the polymer resin includes at least one selected from epoxysilicone compounds, (meth)acrylate monomers and tetrahydrofurfuryl acrylic acid monomers; spraying the resin composition on a base film to form an initial first coating layer; and Ultraviolet rays are radiated to the initial first coating layer to form a first coating layer.

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