Electroplating-resistant composition, dry film and cured product thereof, and electrode of solar cell

Abstract

Provided are: an anti-electroplating composition which has excellent anti-electroplating performance and is capable of reducing the content of residual carbon in exposure and development and improving adhesiveness; a dry film of the anti-electroplating composition; a cured product of the anti-electroplating composition; and an electrode of a solar cell. The electroplating-resistant composition contains (A) an epoxy-modified acrylic resin, (B) a copolymerized acrylic resin, (C) a polyfunctional acrylic monomer, and (D) a photopolymerization initiator, and the content of the copolymerized acrylic resin (B) is 10-50% by mass relative to the total mass of the epoxy-modified acrylic resin (A) and the copolymerized acrylic resin (B) in terms of solid content, and the content of the polyfunctional acrylic monomer (C) is 10-50% by mass relative to the total mass of the epoxy-modified acrylic resin (A) and the copolymerized acrylic resin (B) in terms of solid content. The photopolymerization initiator (D) contains an acylphosphine oxide-based photopolymerization initiator.

Description

Technical Field

[0001] The present invention relates to an anti - electroplating composition, specifically to an anti - electroplating composition used in the manufacture of electrodes of solar cells, its dry film, cured product, and the electrodes of solar cells using the same, belonging to the field of anti - electroplating materials for solar cell manufacturing. Background Art

[0002] Globally, energy and environmental issues have been attracting increasing attention, and the utilization of new energy such as solar energy is being actively promoted. A solar cell is a device that directly converts light energy into electrical energy through the photovoltaic effect or the photochemical effect. Currently, crystalline silicon solar cells operating based on the photovoltaic effect are the mainstream and have been applied in many fields such as transportation, communication, meteorology, satellites, lighting, and power stations.

[0003] Regarding the electrodes of solar cells, which are the core components of solar cells, and their manufacturing methods, various studies and developments have been actively carried out so far. In order to further reduce the cost and increase the efficiency of solar cells, the use of electroplating to fabricate metal electrodes of solar cells has also attracted much attention. This method mainly uses relatively low - cost metals such as copper and nickel to partially or completely replace expensive silver. When fabricating electrodes using the electroplating method, it is necessary to define the position and size of the metal electrodes on the surface of the solar cell through a patterned mask, and an anti - electroplating ink is used for the mask opening process.

[0004] Patent Document 1 discloses an alkali - soluble anti - electroplating photosensitive resin prepared by free - radical polymerization of different acrylate monomers and an organosilicon resin containing carbon - carbon double bonds to form a polyacrylate resin with an organosilicon side chain. The prepared anti - electroplating photosensitive resin has good anti - etching properties and excellent anti - electroplating performance and can be used to prepare anti - electroplating inks. Its aim is to improve adhesion through the hydrolysis of organosilicon and does not pay attention to the carbon content remaining after development.

[0005] Patent Document 2 discloses printing an anti - electroplating ink with grid lines at a low price to replace the expensive dry film. After printing, it only needs to be cured by ultraviolet or heat baking to carry out electroplating, which is suitable for large - scale production. No research has been conducted on how to reduce the carbon content remaining after development, improve acid resistance, and adhesion.

[0006] Patent Document 3 discloses using an acrylic copolymer resin to prepare a matte solder resist ink to achieve good matting and curing effects. The preparation method is simple, the raw material cost is low, the production conditions are less demanding, and it can be produced on a large scale. No research has been conducted on how to reduce the carbon content remaining after development, improve acid resistance, and adhesion either.

[0007] Prior Art Documents

[0008] Patent Documents

[0009] Patent Document 1: CN108003271A

[0010] Patent Document 2: CN109427917A

[0011] Patent Document 3: CN110804339A Summary of the Invention

[0012] Problems to be Solved by the Invention

[0013] In the past, the anti - electroplating ink used for manufacturing the electrodes of solar cells had problems such as carbon residue and acid resistance, resulting in insufficient bonding force of the electroplated metal grid lines and the phenomenon of grid dropping (copper grid line shedding). This may lead to a reduction in the overall component power and excessive local heating, affecting the life of the component, and in more serious cases, may burn out the battery component. Therefore, there is an urgent need to develop an anti - electroplating ink that has low carbon residue (less than 5%) and no grid dropping while meeting the anti - electroplating performance.

[0014] Solutions to Solve the Problems

[0015] The inventors of the present invention conducted in - depth research and found that by using a specific main resin and adjusting the ratio between the main resin and the monomer, it is possible to reduce the carbon residue on the battery wafer after ink development and stripping, improve acid resistance, and ultimately improve the adhesion of the copper grid lines after electroplating the anti - electroplating composition, thus completing the present invention.

[0016] That is, the present invention is as described below.

[0017] 1. An anti - electroplating composition, characterized by comprising (A) an epoxy - modified acrylic resin, (B) a copolymerized acrylic resin, (C) a polyfunctional acrylic monomer, and (D) a photoinitiator, wherein, relative to the total mass of (A) the epoxy - modified acrylic resin and (B) the copolymerized acrylic resin in terms of solid content, the (B) copolymerized acrylic resin is 10 - 50% by mass, and the (D) photoinitiator contains an acylphosphine oxide - based photoinitiator.

[0018] 2. The anti - electroplating composition according to 1, characterized in that the (A) epoxy - modified acrylic resin is a carboxyl - containing resin obtained by reacting a polyfunctional epoxy resin with an unsaturated monocarboxylic acid and then reacting a saturated or unsaturated polycarboxylic anhydride with the resulting hydroxyl groups.

[0019] 3. The anti - electroplating composition according to 1 or 2, characterized in that the (B) copolymerized acrylic resin is a copolymer - based resin with carboxyl groups obtained by reacting (a) a carboxyl - containing (meth) acrylic copolymer resin with (b) a compound having an ethylene oxide ring and an ethylenically unsaturated group in one molecule.

[0020] 4. The anti - electroplating composition according to claim 3, characterized in that, based on 100 parts by mass of the total solid content of (A) epoxy - modified acrylic resin and (B) copolymerized acrylic resin, the (C) polyfunctional acrylic monomer is 12 to 35 parts by mass.

[0021] 5. The anti - electroplating composition according to claim 1 or 2, characterized in that the (D) photoinitiator further comprises a benzophenone - based photoinitiator, an α - aminoacetophenone - based photoinitiator, and a thioxanthone - based photoinitiator.

[0022] 6. Use of the anti - electroplating composition according to any one of claims 1 to 5 in manufacturing an electrode of a solar cell.

[0023] 7. A dry film, characterized in that it is obtained by coating the anti - electroplating composition according to any one of claims 1 to 5 on a carrier film and drying.

[0024] 8. A cured product, characterized in that it is obtained by curing the anti - electroplating composition according to any one of claims 1 to 5.

[0025] 9. A cured product, characterized in that it is obtained by curing the resin layer of the dry film according to claim 8.

[0026] 10. An electrode of a solar cell, characterized in that it has the cured product according to claim 8 or 9.

[0027] Effects of the Invention

[0028] According to the present invention, it is possible to provide an anti - electroplating composition, a dry film, a cured product thereof, and an electrode of a solar cell using the same, which have less carbon residue on the cell sheet of the solar cell, high resolution, good acid resistance, and high adhesion of copper grid lines. Detailed Embodiments

[0029] Various exemplary embodiments, features, and aspects of the present invention will be described in detail below. The term "exemplary" used here means "serving as an example, an embodiment, or illustrative". Any embodiment described as "exemplary" here does not have to be construed as superior to or better than other embodiments.

[0030] In addition, for better illustration of the present invention, numerous specific details are given in the following detailed embodiments. Those skilled in the art should understand that the present invention can also be implemented without some of these specific details. In other instances, methods, means, equipment, and steps well - known to those skilled in the art are not described in detail in order to highlight the gist of the present invention.

[0031] Unless otherwise specified, the units used in this specification are all international standard units, and the numerical values and numerical ranges appearing in the present invention should be understood to include the inevitable systematic errors in industrial production.

[0032] In this specification, the meaning expressed by "may" includes both the meaning of performing a certain treatment and the meaning of not performing a certain treatment.

[0033] In this specification, the "some specific / preferred embodiments", "some other specific / preferred embodiments", "embodiments", etc. mentioned refer to the specific elements (e.g., features, structures, properties, and / or characteristics) related to the embodiment, which are included in at least one of the embodiments described herein, and may or may not exist in other embodiments. Additionally, it should be understood that the elements can be combined in various embodiments in any suitable manner.

[0034] In this specification, the numerical range represented by "numerical value A to numerical value B" refers to the range including the endpoint numerical values A and B.

[0035] In this specification, (meth)acrylic acid refers to the term collectively referring to acrylic acid, methacrylic acid, and their mixtures, and the same applies to other similar expressions.

[0036] The present invention relates to an anti-electroplating composition, which is characterized by comprising (A) an epoxy-modified acrylic resin, (B) a copolymerized acrylic resin, (C) a polyfunctional acrylic monomer, and (D) a photopolymerization initiator. Among them, relative to the total mass of (A) the epoxy-modified acrylic resin and (B) the copolymerized acrylic resin based on solid content, the (B) copolymerized acrylic resin is 10 to 50% by mass, and the (D) photopolymerization initiator includes an acylphosphine oxide-based photopolymerization initiator.

[0037] The following provides a detailed description of each component of the anti-electroplating composition of the present invention.

[0038] (A) Epoxy-modified acrylic resin

[0039] The (A) epoxy-modified acrylic resin contained in the anti-electroplating composition of the present invention is a resin having multiple (meth)acryloyl groups in the molecule, and undergoes polymerization and / or crosslinking and curing by means of the ethylenically unsaturated double bonds possessed by the (meth)acryloyl groups upon light irradiation.

[0040] As the (A) epoxy-modified acrylic resin, there is no particular limitation. For example, it can be a resin having multiple (meth)acryloyl groups in the molecule obtained by acrylic modification of an epoxy resin.

[0041] In addition, from the viewpoint of imparting alkali developability, it is preferable to have multiple carboxyl groups in the molecule in addition to having multiple (meth)acryloyl groups. From the viewpoints of alkali developability and resolution, the acid value of the (A) epoxy-modified acrylic resin is preferably 5 to 100 mgKOH / g, more preferably 10 to 90 mgKOH / g, and still more preferably 20 to 80 mgKOH / g.

[0042] As the epoxy-modified acrylic resin, typically, a resin obtained by reacting a polyfunctional epoxy resin with (meth)acrylic acid and adding a dibasic anhydride to the hydroxyl group present in the side chain; and a resin obtained by further adding a compound having one epoxy group and one or more (meth)acryloyl groups in the molecule to the resin. Examples of the compound having one epoxy group and one or more (meth)acryloyl groups herein include glycidyl (meth)acrylate, α-methylglycidyl (meth)acrylate, and 3,4-epoxycyclohexylmethyl methacrylate.

[0043] As the polyfunctional epoxy resin used for synthesizing the epoxy-modified acrylic resin, for example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol A type epoxy resin, brominated bisphenol A type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol novolac type epoxy resin, biphenyl type epoxy resin, naphthol type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, dicyclopentadiene novolac type epoxy resin, triphenylmethane type epoxy resin, alicyclic epoxy resin, aliphatic chain epoxy resin, phosphorus-containing epoxy resin, anthracene type epoxy resin, norbornene type epoxy resin, adamantane type epoxy resin, fluorene type epoxy resin, aminophenol type epoxy resin, aminocresol type epoxy resin, alkylphenol type epoxy resin, etc. These epoxy resins can be used alone or in combination of two or more as appropriate. Among these polyfunctional epoxy resins, from the viewpoint of further exerting the effects of the present invention, phenol novolac type epoxy resin and cresol novolac type epoxy resin are preferred, and cresol novolac type epoxy resin is more preferred.

[0044] Examples of the dibasic anhydride used for synthesizing the epoxy-modified acrylic resin include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, etc. These epoxy resins can be used alone or in combination of two or more as appropriate. From the viewpoint of further exerting the effects of the present invention, tetrahydrophthalic anhydride is preferred.

[0045] Therefore, from the viewpoint of further enhancing the effects of the present invention, it is further preferred to react a phenol novolac type epoxy resin or a cresol novolac type epoxy resin with (meth)acrylic acid, and add tetrahydrophthalic anhydride to the hydroxyl groups present in the side chain to obtain an epoxy-modified acrylic resin; particularly from the viewpoint of less exposure and development residue, it is particularly preferred to react a phenol novolac type epoxy resin with acrylic acid, and add tetrahydrophthalic anhydride to the hydroxyl groups present in the side chain to obtain an epoxy-modified acrylic resin. From the same viewpoint, an epoxy-modified acrylic resin obtained by further adding glycidyl (meth)acrylate to these epoxy-modified acrylic resins is also preferred.

[0046] As the above-mentioned (A) epoxy-modified acrylic resin, commercially available products or synthetic products can be used. Specific examples of synthetic products include the compounds listed below:

[0047] (1) A carboxyl group-containing resin obtained by reacting a polyfunctional epoxy resin with (meth)acrylic acid and adding a dibasic acid anhydride such as phthalic anhydride, tetrahydrophthalic anhydride, or hexahydrophthalic anhydride to the hydroxyl groups present in the side chain.

[0048] (2) A carboxyl group-containing resin obtained by reacting a polyfunctional epoxy resin obtained by further epoxidizing the hydroxyl groups of a bifunctional epoxy resin with epichlorohydrin with (meth)acrylic acid and adding a dibasic acid anhydride to the resulting hydroxyl groups.

[0049] (3) A carboxyl group-containing resin obtained by further adding a compound having one epoxy group and one or more (meth)acryloyl groups in the molecule, such as glycidyl (meth)acrylate, α-methylglycidyl (meth)acrylate, or 3,4-epoxycyclohexylmethyl methacrylate, to the carboxyl group-containing resin described in the above (1) or (2).

[0050] From the perspective of more effectively solving the technical problems of the present invention, the above-mentioned first type of (A) epoxy-modified acrylic resin is preferred, and among them, a carboxyl group-containing resin obtained by reacting a polyfunctional epoxy resin with an unsaturated monocarboxylic acid and reacting a saturated or unsaturated polybasic acid anhydride with the resulting hydroxyl groups is more preferred.

[0051] (A) The weight average molecular weight of the epoxy-modified acrylic resin is generally preferably 2,000 to 150,000, more preferably 3,000 to 30,000, further preferably 4,000 to 15,000, and most preferably 6,000 to 10,000. When the weight average molecular weight is 2,000 or more, the resolution is good. On the other hand, when the weight average molecular weight is 150,000 or less, the developability is good.

[0052] With respect to the total mass of (A) epoxy-modified acrylic resin and (B) copolymerized acrylic resin based on solid content, the compounding amount of (A) epoxy-modified acrylic resin is preferably 50 to 90% by mass, more preferably 60 to 80% by mass. When the compounding amount of (A) epoxy-modified acrylic resin is within the above range, the viscosity of the anti-electroplating composition is appropriate, the coating property and the like can be improved, and the anti-electroplating performance is good. In particular, when it is within 60 to 80% by mass, the carbon content of the development residue can be further reduced.

[0053] (B) Copolymerized acrylic resin

[0054] (B) The copolymerized acrylic resin is a carboxyl-containing copolymer resin obtained by reacting (a) a carboxyl-containing (meth)acrylic copolymer resin with (b) a compound having an ethylene oxide ring and an ethylenically unsaturated group in one molecule.

[0055] The above (a) carboxyl-containing (meth)acrylic copolymer resin is obtained by copolymerizing a (meth)acrylate with a compound having one unsaturated group and at least one carboxyl group in one molecule. Examples of the (meth)acrylate constituting the (a) carboxyl-containing (meth)acrylic copolymer resin include (meth)acrylic acid alkyl esters such as methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, pentyl (meth)acrylate, and hexyl (meth)acrylate; hydroxyl-containing (meth)acrylate esters such as 2-hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, and caprolactone-modified 2-hydroxyethyl (meth)acrylate; diol-modified (meth)acrylate esters such as methoxydiethylene glycol (meth)acrylate, ethoxydiethylene glycol (meth)acrylate, isooctyloxydiethylene glycol (meth)acrylate, phenoxytriethylene glycol (meth)acrylate, methoxytriethylene glycol (meth)acrylate, and methoxypolyethylene glycol (meth)acrylate. They can be used alone or in combination of two or more.

[0056] Examples of the compound having one unsaturated group and at least one carboxyl group in one molecule include acrylic acid, methacrylic acid, modified unsaturated monocarboxylic acids in which the unsaturated group and the carboxylic acid are chain-extended, such as β-carboxyethyl (meth)acrylate, 2-acryloyloxyethyl succinic acid, 2-acryloyloxyethyl hexahydrophthalic acid, unsaturated monocarboxylic acids having an ester bond through lactone modification, modified unsaturated monocarboxylic acids having an ether bond, and substances containing two or more carboxyl groups in one molecule such as maleic acid. They can be used alone or in combination of two or more.

[0057] As the compound having an ethylene oxide ring and an ethylenically unsaturated group in one molecule of (b)1, any compound having an ethylenically unsaturated group and an ethylene oxide ring in one molecule may be used. Examples thereof include glycidyl (meth)acrylate, α-methylglycidyl (meth)acrylate, 3,4-epoxycyclohexylmethyl (meth)acrylate, 3,4-epoxycyclohexylethyl (meth)acrylate, 3,4-epoxycyclohexylbutyl (meth)acrylate, 3,4-epoxycyclohexylmethylamino acrylate, etc. Among them, 3,4-epoxycyclohexylmethyl (meth)acrylate is preferred. These compounds having an ethylene oxide ring and an ethylenically unsaturated group in one molecule (e) may be used alone or in combination of two or more.

[0058] From the viewpoints of copper plating resistance and acid resistance, the acid value of the (B) copolymerized acrylic resin is preferably 40 to 130 mgKOH / g, more preferably 50 to 120 mgKOH / g, and the weight average molecular weight of the (B) copolymerized acrylic resin is generally preferably 10,000 to 50,000, more preferably 15,000 to 40,000, further preferably 18,000 to 30,000, and most preferably 22,000 to 28,000.

[0059] With respect to the total mass of the (A) epoxy-modified acrylic resin and the (B) copolymerized acrylic resin on a solid content basis, the blending amount of the (B) copolymerized acrylic resin is 10 to 50% by mass, preferably 20 to 40% by mass. When the blending amount of the (B) copolymerized acrylic resin is within the above range, the cured film of the anti-plating composition has excellent resolution and good anti-plating performance. If it is less than 10% by mass, the developed residual carbon content increases. If it is more than 50% by mass, it has an adverse effect on the resolution and anti-plating performance.

[0060] (C) Polyfunctional acrylic monomer

[0061] The (C) polyfunctional acrylic monomer contained in the anti-plating composition of the present invention refers to a compound having a plurality of (meth)acryloyl groups in the molecule. The (C) polyfunctional acrylic monomer is photocured by irradiation with active energy rays, making the anti-plating composition of the present invention insoluble in an aqueous alkali solution or contributing to the insolubility of the anti-plating composition of the present invention in an aqueous alkali solution.

[0062] Examples of such polyfunctional (C) acrylic monomers include diacrylates of diols such as ethylene glycol, methoxytetraethylene glycol, polyethylene glycol, propylene glycol, and hexanediol; polyacrylates of polyols such as trimethylolpropane, pentaerythritol, dipentaerythritol, and trihydroxyethyl isocyanurate, or their ethylene oxide adducts or propylene oxide adducts; polyacrylates of phenoxyacrylates, bisphenol A diacrylate, and their ethylene oxide adducts or propylene oxide adducts of such phenols; polyacrylates of glycidyl ethers such as glycerol diglycidyl ether, glycerol triglycidyl ether, trimethylolpropane triglycidyl ether, and isocyanuric acid triglycidyl ester; and melamine acrylate and / or each methacrylate corresponding to the above acrylates, etc.

[0063] Furthermore, examples include epoxy acrylate resins obtained by reacting polyfunctional epoxy resins such as cresol novolak type epoxy resins with acrylic acid (such epoxy acrylate resins do not include substances belonging to the above (A) epoxy-modified acrylic resins); epoxy urethane acrylate compounds obtained by further reacting the hydroxyl groups of the epoxy acrylate resins with semi-carbamate compounds (obtained by reacting hydroxy acrylates such as pentaerythritol triacrylate with diisocyanates such as isophorone diisocyanate), etc.

[0064] These polyfunctional (C) acrylic monomers can be used alone or in the form of a mixture of two or more.

[0065] From the viewpoint of achieving the effects of the present invention, it is preferable to contain acrylic monomers having three or more functional groups. Furthermore, from the viewpoints of improving resolution and electroless plating resistance, it is more preferable to contain acrylic monomers having four or more functional groups, and even more preferably to contain acrylic monomers having five or more functional groups.

[0066] With respect to 100 parts by mass of the total mass of the (A) epoxy-modified acrylic resin and the (B) copolymerized acrylic resin in terms of solid content, the compounding amount of the (C) polyfunctional acrylic monomer is preferably 12 to 35 parts by mass, and more preferably 15 to 30 parts by mass. By containing the (C) polyfunctional acrylic monomer in such a compounding amount, the electroless plating-resistant composition can have more excellent electroless plating resistance and developability, and can further suppress development residues and scratches on the surface of the solar cell wafer.

[0067] If the blending amount of the polyfunctional acrylic monomer (C) exceeds 35 parts by mass, the content of the epoxy-modified acrylic resin (A) becomes relatively small, the photocurability and developability during exposure decrease, the resolution may become poor, it is difficult to obtain satisfactory electroless plating resistance performance, and there is a tendency for the residual carbon content after exposure and development to increase. If the aforementioned blending amount is less than 12 parts by mass, it is difficult to improve the photocurability, it is difficult to form a pattern by alkali development after irradiation with active energy rays, the resolution is poor, and the electroless copper plating resistance performance is not good. From the viewpoint of further exerting the effects of the present invention, it is more preferably 15 to 30 parts by mass.

[0068] (C) The molecular weight of the polyfunctional acrylic monomer is usually preferably 200 to 3000, more preferably 250 to 2000, and further preferably 300 to 1000. When the weight average molecular weight is 200 or more, the resolution is good. On the other hand, when the weight average molecular weight is 3000 or less, the developability is good.

[0069] Examples of commercially available polyfunctional acrylic monomers (C) include, for example, MT3501A (manufactured by Zhangjiagang Toagosei Chemical Co., Ltd., a mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate).

[0070] (D) Photopolymerization initiator

[0071] The photoinitiator (D) contained in the electroless plating resist composition of the present invention includes an acylphosphine oxide-based photoinitiator. In addition, the electroless plating resist composition of the present invention may further contain a photoinitiator other than the acylphosphine oxide-based photoinitiator.

[0072] As photoinitiators other than the acylphosphine oxide-based photoinitiator, known substances suitable for use in electroless plating resist compositions can be used. For example, there can be mentioned: benzoin, benzoin methyl ether, benzoin ethyl ether and other benzoins and their alkyl ethers; acetophenones such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1,1-dichloroacetophenone, 4-(1-tert-butyldioxy-1-methylethyl)acetophenone; anthraquinones such as 2-methylanthraquinone, 2-pentylanthraquinone, 2-tert-butylanthraquinone, 1-chloroanthraquinone; thioxanthones such as isopropylthioxanthone, 2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone; ketals such as acetophenone dimethyl ketal, benzil dimethyl ketal; benzophenones such as benzophenone, 4-(1-tert-butyldioxy-1-methylethyl)benzophenone, 3,3’,4,4’-tetra(tert-butyldioxycarbonyl)benzophenone, 4,4'-bis(diethylamino)benzophenone; and xanthenones, etc.

[0073] In addition, as the (D) photoinitiator, an oxime ester-based photoinitiator having an oxime ester group, an alkyl phenyl ketone-based photoinitiator, an α-aminoacetophenone-based photoinitiator, an acylphosphine oxide-based photoinitiator, a titanocene-based photoinitiator, a phosphate ester-based photoinitiator, etc. can also be used.

[0074] As a commercially available product of the benzophenone-based photoinitiator, EAB manufactured by BASF Corporation in Germany, etc. can be cited.

[0075] As a commercially available product of the thioxanthone-based photoinitiator, ITX manufactured by Hubei Goodrun Technology Co., Ltd. can be cited.

[0076] As commercially available products of the oxime ester-based photoinitiator, Irgacure OXE01, Irgacure OXE02 manufactured by BASF Japan Company, N-1919, NCI-831, etc. manufactured by ADEKA CORPORATION can be cited. A photoinitiator having 2 oxime ester groups in the molecule can be preferably used, and specifically, an oxime ester compound having a carbazole ring structure can be cited.

[0077] As commercially available products of the alkyl phenyl ketone-based photoinitiator, α-hydroxyalkyl phenyl ketone-based such as Omnirad 184, Omnirad 1173, Omnirad 2959, Omnirad 127, etc. manufactured by IGM Resins B.V. can be cited.

[0078] As the α-aminoacetophenone-based photoinitiator, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, etc. can be cited. As a commercially available product, Omnirad 907 manufactured by IGM Resins B.V. can be used.

[0079] As the acylphosphine oxide-based photoinitiator, specifically, 2,4,6-trimethylbenzoyl diphenylphosphine oxide, bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, bis(2,6-dimethoxybenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, a 3-functional or more acylphosphine-based photoinitiator, etc. can be cited.

[0080] As commercially available products of the acylphosphine oxide-based photoinitiator, Omnirad TPO manufactured by IGM Resins Company, Omnirad 819, Omnipol TP, etc. manufactured by IGM Resins B.V. can be used.

[0081] As the aforementioned titanocene-based photoinitiator, specifically, bis(cyclopentadienyl)-diphenyltitanium, bis(cyclopentadienyl)-titanium dichloride, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)phenyl)titanium, etc. can be cited. As commercially available products, Omnirad 784 manufactured by IGM Resins B.V. can be cited.

[0082] The photoinitiator of the present invention preferably contains a benzophenone-based photoinitiator, an α-aminobenzophenone-based photoinitiator, a thioxanthone-based photoinitiator, and an acylphosphine oxide-based photoinitiator at the same time. The preferred mixing ratio of the benzophenone-based photoinitiator: thioxanthone-based photoinitiator: α-aminobenzophenone-based photoinitiator: acylphosphine oxide-based photoinitiator is 1 to 3: 1 to 3: 10 to 20: 2 to 10 by mass ratio. Although the detailed mechanism is not clear, the inventors of the present invention found that in order to balance less carbon residue, good acid resistance and high adhesion of copper gate lines, the acylphosphine oxide-based photoinitiator is an essential initiator component. If the above-mentioned mixing ratios are used for the respective photoinitiators, an anti-electroplating composition with a cured film having high resolution, less carbon residue, good acid resistance and high adhesion of copper gate lines can be obtained.

[0083] On the premise of not affecting the effects of the present invention, other types of photoinitiators commonly used in the art as mentioned above can also be appropriately mixed.

[0084] For the total mixing ratio of these photoinitiators, it is appropriate to be 0.01 to 30 parts by weight, preferably 5 to 25 parts by weight, based on 100 parts by weight of the total mass of (A) epoxy-modified acrylic resin and (B) copolymerized acrylic resin in terms of solid content. When the usage amount of the photoinitiator is less than the above range, the photocurability of the composition tends to deteriorate. On the other hand, when it is excessive, the properties of the anti-electroplating composition may be reduced, so it is not preferred.

[0085] Other components

[0086] The anti-electroplating composition of the present invention may contain an inorganic filler, but from the viewpoint of reducing exposure and development residues, it is preferably free of inorganic fillers. Moreover, the anti-electroplating composition of the present invention has excellent anti-electroplating performance even without an inorganic filler.

[0087] The anti-electroplating composition of the present invention may contain (E) a colorant, and a known and commonly used organic colorant can be used. It should be noted that the (E) colorant that the anti-electroplating composition of the present invention can contain preferably does not include substances belonging to inorganic fillers.

[0088] Examples of the (E) colorant include perylene-based, phthalocyanine-based, anthraquinone-based, monoazo-based, bisazo-based, azo lake-based, benzimidazolone-based, perylene-based, diketopyrrolopyrrole-based, condensed azo-based, anthraquinone-based, quinacridone-based, isoindolinone-based, anthraquinone-based, etc.

[0089] Such (E) colorants can be used alone or in the form of a mixture of two or more.

[0090] Furthermore, the anti-electroplating composition of the present invention may also contain an (F) organic solvent, which is used for the preparation and viscosity adjustment of the composition.

[0091] Examples of the (F) organic solvent include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, petroleum-based solvents, etc. More specifically, there are ketones such as methyl ethyl ketone and cyclohexanone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; esters such as ethyl acetate, butyl acetate, diethylene glycol ethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum-based solvents such as petroleum ether, naphtha, hydrogenated naphtha, and solvent naphtha, etc.

[0092] Such (F) organic solvents can be used alone or in the form of a mixture of two or more.

[0093] In addition, the anti-electroplating composition of the present invention may also be compounded with known and commonly used additives such as thermal polymerization inhibitors, thermal curing catalysts, ultraviolet absorbers, plasticizers, flame retardants, antistatic agents, antioxidants, thixotropic agents, anti-aging agents, antibacterial / mildew-proof agents, defoamers, leveling agents, anti-sagging agents, thickeners, adhesion-imparting agents, thixotropy-imparting agents, photoinitiator aids, sensitizers, photo-base generators, thermoplastic resins, elastomers, organic fillers, mold release agents, surface treatment agents, dispersants, dispersion aids, surface modifiers, stabilizers, phosphors, cellulose resins, etc. as required.

[0094] Among them, it is preferable to add melamine. As an antioxidant, it improves the adhesion between the substrate and the cured film of the thermosetting composition by inhibiting the oxidation of the conductor (copper) on the substrate. As a thermal curing catalyst, it can improve the acid and alkali resistance, metal plating resistance, adhesion, hardness, and other properties of the dry film and curing agent formed by the anti-electroplating composition.

[0095] The anti - electroplating composition of the present invention can also be made into the form of a dry film, which has a carrier film (support) and a layer formed on the carrier film from the above - mentioned anti - electroplating composition.

[0096] When making it into a dry film, the anti - electroplating composition of the present invention is diluted with the aforementioned organic solvent and adjusted to an appropriate viscosity, and then coated on the carrier film with a uniform thickness by a notch wheel coater, a knife coater, a lip coater, a rod coater, an extrusion coater, a reverse coater, a transfer roll coater, an intaglio coater, a spray coater, etc. Usually, it is dried at a temperature of 50 - 130 °C for 1 - 30 minutes to form a resin layer as a dried coating film. There is no particular limitation on the resin layer, and it is usually preferably selected within the range of 10 - 150 μm, more preferably 20 - 60 μm, based on the dried film thickness.

[0097] As the carrier film, a plastic film is used, preferably a polyester film such as polyethylene terephthalate, a polyimide film, a polyamide - imide film, a polypropylene film, a polystyrene film, etc. There is no particular limitation on the thickness of the carrier film, and it is usually preferably selected within the range of 10 - 150 μm.

[0098] At this time, after forming a resin layer on the carrier film, for the purpose of preventing dust from adhering to the surface of the resin layer, etc., it is preferable to further laminate a peelable covering film on the surface of the resin layer. As the peelable covering film, for example, a polyethylene film, a polytetrafluoroethylene film, a polypropylene film, a surface - treated paper, etc. can be used. When peeling the covering film, the adhesion between the resin layer and the covering film should be less than the adhesion between the resin layer and the carrier film.

[0099] As a method for manufacturing a solar cell electrode using the anti - electroplating composition or its dry film of the present invention, a known manufacturing method can be adopted.

[0100] For example, the anti-electroplating composition of the present invention can be adjusted to a viscosity suitable for the coating method as needed, and it can be coated onto the surface of a solar cell wafer formed with a pyramidal texture by methods such as screen printing, curtain coating, spraying, roll coating, etc. The solvent contained in the composition is volatilized and dried at a temperature of, for example, 60 to 100 °C as needed, thereby forming a coating film. Alternatively, the dry film of the present invention is laminated onto the surface of a solar cell wafer formed with a pyramidal texture, and the carrier film is peeled off, thereby forming a layer formed of the anti-electroplating composition on the surface of the solar cell wafer. Then, selective exposure is performed by irradiating active energy rays through a photomask having a specified exposure pattern, and the unexposed portion is developed with a developer such as a 1 to 2% Na2CO3 or K2CO3 solution at a temperature of about 30 °C for, for example, 60 to 90 seconds to form an anti-electroplating mask having a specified exposure pattern. Electroplating is performed on the surface of the cell wafer having the anti-electroplating mask formed thereon, thereby forming a metal layer as an electrode on the surface of the cell wafer at the pattern notch. Then, the anti-electroplating mask is removed by stripping with a NaOH or KOH solution at a temperature of, for example, 40 to 70 °C, and then a welding layer is deposited by PVD. After sintering, a solar cell module having an electrode formed thereon is obtained.

[0101] Examples

[0102] The embodiments of the present invention will be described in detail below in conjunction with the examples. However, those skilled in the art will understand that the following examples are only used to illustrate the present invention and should not be construed as limiting the scope of the present invention. For those not specified in the examples, they are carried out under conventional conditions or conditions recommended by the manufacturer. For reagents or instruments not indicated by the manufacturer, they are all conventional products that can be obtained through commercial purchase.

[0103] It should be noted that the following "parts" and "%" are based on mass unless otherwise specified.

[0104] The anti-electroplating compositions of Examples 1 to 15 and Comparative Examples 1 to 7 were obtained by mixing the respective components shown in Tables 1 and 2 in the compounding ratios (mass basis) shown therein.

[0105]

Table 1

[0106]

[0107]

Table 2

[0108]

[0109] Remarks:

[0110] *1 (A) Epoxy-modified acrylic resin, a cresol novolak type epoxy-modified acrylic resin prepared as in Synthesis Example 1, with a solid content of 64% and an acid value of 58 mgKOH / g

[0111] *2(B) Copolymerized acrylate resin, acrylic copolymer type prepared in Synthesis Example 2, solid content 54%, acid value 109 mgKOH / g

[0112] *3(C) Polyfunctional acrylic monomer, MT3501A, manufactured by Zhangjiagang Dongya DIC Chemical Co., Ltd., mixture of dipentaerythritol pentaacrylate and dipentaerythritol hexaacrylate (solid content 100%)

[0113] *4(E) Blue pigment, FASTOGEN BLUE FA5380, manufactured by DIC Corporation

[0114] *5 Silicon-based defoamer, KS-66, manufactured by Shin-Etsu Chemical Co., Ltd.

[0115] *6 Polymer defoamer, BYK-057, manufactured by BYK-CHEMIE GmbH

[0116] *7 Dispersant, BYK-110, manufactured by BYK-CHEMIE GmbH

[0117] *8(D) Photoinitiator EAB, 4,4'-bis(diethylamino)benzophenone, manufactured by BASF SE

[0118] *9(D) Photoinitiator, TPO, diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide, manufactured by IGM RESINS B.V.

[0119] *10(D) Photoinitiator, Omnirad 369, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, manufactured by IGM RESINS B.V.

[0120] *11(D) Photoinitiator, ITX, 4-isopropylthioxanthone, manufactured by Hubei Guri New Materials Co., Ltd.

[0121] *12(D) Photoinitiator, Omnirad 907, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropan-1-one, manufactured by IGM RESINS B.V.

[0122] *13 Melamine, MELAMINE, manufactured by Guangzhou Jiachun Electronics Co., Ltd.

[0123] *14(F) Solvent, carbitol acetate (CA), manufactured by Jiangsu Tianyin Chemical Co., Ltd.

[0124] Synthesis Example 1

[0125] 950 parts of a phenol novolac type epoxy resin (manufactured by DIC Corporation, EPICLON N-770, softening point 65 - 75 °C, epoxy equivalent 190) (number of glycidyl groups (total number of aromatic rings): 5.0 moles), 360 parts (5.0 moles) of acrylic acid, and 1.5 parts of hydroquinone were put into 650 parts of diethylene glycol monoethyl ether acetate, heated to 100 °C and stirred until uniformly dissolved. Then, 4.3 parts of triphenylphosphine were added, heated to 110 °C, reacted for 2 hours, and then an additional 1.6 parts of triphenylphosphine were added, the temperature was raised to 120 °C, and the reaction was further carried out for 12 hours. 525 parts of an aromatic hydrocarbon (SOLVESSO 150) and 608 parts (4.0 moles) of tetrahydrophthalic anhydride were put into the resulting reaction solution, and the reaction was carried out at 110 °C for 4 hours. Further, 770 parts (5.4 moles) of glycidyl methacrylate were put into the resulting reaction solution, and the reaction was carried out at 115 °C for 4 hours to obtain a solution of a phenol novolac type epoxy-modified acrylic resin with a solid content acid value of 58 mgKOH / g and a solid content of 64%.

[0126] Synthesis Example 2

[0127] In a 2-liter detachable flask equipped with a stirrer, thermometer, reflux condenser, dropping funnel, and nitrogen inlet tube, 900 g of diethylene glycol dimethyl ether as a solvent and 21.4 g of tert-butyl peroxy-2-ethylhexanoate (PERBUTYL O manufactured by NOF Corporation) as a polymerization initiator were added and heated to 90 °C. After addition, over 3 hours, 309.9 g of methacrylic acid, 116.4 g of methyl methacrylate, and 109.8 g of lactone-modified 2-hydroxyethyl methacrylate (PLACCEL FM1 manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.) were added dropwise together with 21.4 g of bis(4-tert-butylcyclohexyl) peroxydicarbonate (PEROYL TCP manufactured by NOF Corporation) as a polymerization initiator, and then aged for 6 hours to obtain a carboxyl group-containing copolymer resin. The reaction was carried out under a nitrogen atmosphere.

[0128] Next, 363.9 g of 3,4-epoxycyclohexylmethyl methacrylate (Cyclomer A200 produced by DAICEL CHEMICAL INDUSTRIES, LTD.), 3.6 g of dimethylbenzylamine as a ring-opening catalyst, and 1.80 g of hydroquinone monomethyl ether as a polymerization inhibitor were added to the obtained carboxyl group-containing copolymer resin, heated to 100 °C, and stirred to carry out the ring-opening addition reaction of epoxy. After 16 hours, a solution containing a carboxyl group-containing resin without an aromatic ring with a solid content of 54% (solid content) was obtained, and the acid value of the solid content of this resin was 109 mgKOH / g and the weight average molecular weight was 25000.

[0129] The anti - electroplating compositions obtained in Examples 1 - 15 and Comparative Examples 1 - 7 were evaluated for performance as follows.

[0130] Evaluation methods and criteria

[0131] (1) Evaluation of resolution

[0132] The anti - electroplating compositions of the above - mentioned examples and comparative examples were coated on the surface of the solar cell wafer over the entire area, dried at 80 °C for 15 minutes, cooled to room temperature, and a resin layer with a thickness of 10 μm was formed. For the upper surface (exposed surface) of the dried composition, using a DI exposure machine (Ledia6 manufactured by SCREEN), the exposure pattern was designed with line / space of 10 μm / 10 μm, 20 μm / 20 μm, 30 μm / 30 μm, 40 μm / 40 μm, 50 μm / 50 μm, 60 μm / 60 μm, 70 μm / 70 μm, 80 μm / 80 μm, 90 μm / 90 μm, 100 μm / 100 μm, 200 μm / 200 μm, and exposed with an exposure dose of 405 nm light source output power of 100% and 400 mJ / cm 2 After development for 60 seconds under the condition of a spray pressure of 2 kg using a 1% by mass aqueous sodium carbonate solution at 30 °C, an evaluation substrate was obtained.

[0133] Visually confirm the minimum designed line width remaining on the substrate, and record it as the evaluation of resolution in Tables 1 and 2.

[0134] (2) Evaluation of development residue

[0135] The anti - electroplating compositions of the above - mentioned examples and comparative examples were coated on the surface of the solar cell wafer over the entire area, dried at 80 °C for 20 minutes, taken out and placed in an environment at 20 °C for 10 minutes, and a resin layer with a thickness of 10 μm was formed. For the upper surface (exposed surface) of the dried composition, using a DI exposure machine (Ledia6 manufactured by SCREEN), pattern exposure was carried out with a 405 nm light source output power of 100% and an exposure dose of 400 mJ / cm 2 After development for 60 seconds under the condition of a spray pressure of 2 kg using a 1% by mass aqueous sodium carbonate solution at 30 °C, an evaluation substrate was obtained.

[0136] The surface of the developed substrate was detected using an EDS element detection device: Hitachi SU3500 EDS: Thermo UltraDry 5225 (sample Pt pretreatment), and the carbon residue content was judged by the carbon element content. Based on this carbon content, the exposure and development residue of the above - mentioned composition was evaluated, and the evaluation criteria are as follows.

[0137] C% is 0% or more and less than 5% ○

[0138] C% is 5% or more and less than 10% △

[0139] C% is 10% or more ×

[0140] (3) Evaluation of copper electroplating resistance performance (adhesion)

[0141] The evaluation substrate obtained in the above (2) is subjected to a copper electroplating process to evaluate the copper electroplating resistance performance.

[0142] In the copper electroplating process, the electroplating solution used is prepared as follows: 200 g / L of copper sulfate (CuSO4·5H2O), 80 g / L of sulfuric acid (H2SO4), chloride ion (Cl - ) 70 mg / L, 13 ml / L of inhibitor, 30 ml / L of brightener, and 20 ml / L of leveling agent. The electroplating operation conditions are: temperature 20 - 25 °C, current density 5 A / dm 2 , strong stirring intensity, and copper electroplating thickness 5 - 50 μm.

[0143] The evaluation items are: 1) Whether there is peeling of the anti - plating composition and copper grid line cross - short - circuit on the surface of the cell after copper plating; 2) After copper plating, a 3M tape stress pull - off test is carried out to see if there is peeling of the copper grid line.

[0144] The evaluation criteria are as follows:

[0145] There is no peeling of the anti - plating composition on the surface of the cell after copper plating, no copper grid line cross - short - circuit, and no peeling of the copper grid line during the 3M tape stress pull - off test ○

[0146] There is no peeling of the anti - plating composition on the surface of the cell after copper plating, no copper grid line cross - short - circuit, but there is peeling of the copper grid line during the 3M tape stress pull - off test △

[0147] There is peeling of the anti - plating composition on the surface of the cell after copper plating, or there is copper grid line cross - short - circuit ×

[0148] (4) Evaluation of stripping and washing (acid resistance)

[0149] The evaluation substrate obtained in the above (2) is evaluated for stripping and washing performance according to the following conditions respectively.

[0150] 5 mass% sodium hydroxide solution at a constant temperature of 60 °C for 5 min

[0151] The evaluation criteria are as follows:

[0152] After soaking in the stripping solution, there is no residue on the surface of the substrate ○

[0153] After soaking in the stripping solution, there is slight residue, and no residue after water washing △

[0154] After soaking in the stripping solution, there is residue, and the residue still remains after water washing ×

[0155] The results of the above-mentioned respective evaluation tests are shown together in Tables 1 and 2 above.

[0156] As can be seen from Tables 1 and 2, in Examples 1 to 4 which simultaneously contain (A) epoxy-modified acrylic resin and 10 to 40% by mass of (B) copolymerized acrylate resin and do not contain Omnirad 369, compared with Comparative Example 1 which does not contain (B) copolymerized acrylate resin and also does not contain Omnirad 369, the evaluations of resolution, development residue, and stripping performance are all excellent results. Compared with Comparative Examples 5 to 7 which have a higher content of (B) copolymerized acrylate resin and also do not contain Omnirad 369, Examples 1 to 4 show excellent results in terms of resolution, development residue, and electroless copper plating resistance performance. Compared with Comparative Example 2 which does not use TPO but uses Omnirad 369, although the development residue of Example 1 is slightly higher, the resolution and electroless copper plating resistance performance are significantly more excellent.

[0157] In addition, it can be seen from between Examples 1 to 4, between Examples 5 to 8, and between Examples 9, 10, and 12 that as the content of (B) copolymerized acrylate resin further increases, there is a tendency for the development residue to improve but the resolution to decrease (i.e., the minimum designed line width of the residue increases). From the respective comparisons between Examples 1, 5, 9, between Examples 2, 6, 10, between Examples 3, 7, 11, and between Examples 4, 8, 12, it can be seen that as the content of (C) polyfunctional acrylic monomer decreases, there is a tendency for the development residue to improve but the resolution to decrease. Furthermore, from the comparison between Example 11 and Examples 13 to 15, it can be seen that when the content of (B) copolymerized acrylate resin further increases to the same amount as (A) epoxy acrylate modified resin, there is a tendency for the resolution and electroless copper plating resistance performance to deteriorate, and the development residue does not improve further. Also, in Comparative Examples 3 and 4, the content of (C) polyfunctional acrylic monomer further decreases. Although the development residue and stripping property are excellent, the content of (B) copolymerized acrylate resin is too high, and the resolution and electroless copper plating resistance performance are not good.

[0158] From these results, it can be determined that the anti-electroplating composition of the present invention has high resolution, less development residue, excellent electroless copper plating resistance performance and stripping performance, and is suitable for use in anti-electroplating inks used in the manufacture of solar cell electrodes.

[0159] It should be noted that although the technical solutions of the present invention are introduced with specific examples, those skilled in the art can understand that the present invention should not be limited thereto.

[0160] The embodiments of the present invention have been described above. The above description is exemplary and not exhaustive, and is also not limited to the disclosed embodiments. Many modifications and variations are obvious to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The choice of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to technologies in the market, or to enable other ordinary skilled persons in the art to understand the embodiments disclosed herein.

Claims

1. An anti - electroplating composition, characterized in that, Comprising (A) an epoxy-modified acrylic resin, (B) a copolymerized acrylic resin, (C) a polyfunctional acrylic monomer, and (D) a photopolymerization initiator, wherein, based on the total mass of (A) the epoxy-modified acrylic resin and (B) the copolymerized acrylic resin in terms of solid content, the (B) copolymerized acrylic resin is 10 to 50% by mass, and the (D) photopolymerization initiator comprises an acylphosphine oxide-based photopolymerization initiator.

2. The anti-electroplating composition according to claim 1, wherein The (A) epoxy-modified acrylic resin is a carboxyl-containing resin obtained by reacting a polyfunctional epoxy resin with an unsaturated monocarboxylic acid and then reacting a saturated or unsaturated polyacid anhydride with the resulting hydroxyl groups.

3. The anti - electroplating composition according to claim 1 or 2, characterized in that, The (B) copolymerized acrylic resin is a copolymer resin having a carboxyl group obtained by reacting (a) a carboxyl-containing (meth)acrylic copolymer resin with (b) a compound having an ethylene oxide ring and an ethylenically unsaturated group in one molecule.

4. The anti-electroplating composition according to claim 3, characterized in that, Based on 100 parts by mass of the total mass of (A) the epoxy-modified acrylic resin and (B) the copolymerized acrylic resin in terms of solid content, the (C) polyfunctional acrylic monomer is 12 to 35 parts by mass.

5. The anti-electroplating composition according to claim 1 or 2, characterized in that, The (D) photopolymerization initiator further comprises a benzophenone-based photopolymerization initiator, an α-aminobenzophenone-based photopolymerization initiator, and a thioxanthone-based photopolymerization initiator.

6. Use of the anti-electroplating composition according to any one of claims 1 to 5 in the manufacture of an electrode of a solar cell.

7. A dry film, characterized in that, It is obtained by coating the anti-electroplating composition according to any one of claims 1 to 5 on a carrier film and drying.

8. A cured product, characterized in that, It is obtained by curing the anti-electroplating composition according to any one of claims 1 to 5.

9. A cured product, characterized in that, It is obtained by curing the resin layer of the dry film according to claim 7.

10. An electrode of a solar cell, characterized in that, Having the cured product according to claim 8 or 9.

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