Chip packaging adhesive with anti-seismic function and preparation method thereof

Abstract

The invention discloses a chip packaging adhesive with an anti-seismic function and a preparation method thereof, and the preparation method comprises the following steps: heating a first epoxy resin matrix, adding a foaming agent, stirring, pouring into a preset mold, heating and curing the preset mold, decomposing the foaming agent to form bubbles, and obtaining a damping layer base material with a porous structure; the nanoscale elastomer particles are placed in stirring equipment to be stirred and then mixed with a second epoxy resin matrix, and a water and oxygen barrier layer mixture is obtained; and putting the mixture of the damping layer base material and the water-oxygen barrier layer into a double-layer mold, carrying out light curing treatment, measuring the water vapor transmittance of a primary finished product of the composite packaging adhesive, and adjusting the addition amount of the foaming agent or the thiol coupling agent based on a measurement result to obtain the chip packaging adhesive with the anti-seismic function. The anti-seismic performance and the moisture-proof performance can be remarkably improved, balanced improvement of the anti-seismic performance and the moisture-proof performance is achieved, and the chip packaging adhesive is excellent in comprehensive performance and high in reliability.

Description

Technical Field

[0001] This application relates to the technical field of chip packaging materials, and particularly to a chip packaging adhesive with seismic resistance function and a preparation method thereof. Background Art

[0002] In modern electronic products, the performance of integrated circuit chips is increasing day by day, and the requirements for their packaging materials are becoming more and more stringent. As an important material in chip packaging, the packaging adhesive must have excellent seismic resistance, moisture resistance, and stability under long-term use. Therefore, how to effectively improve the seismic resistance function and moisture resistance performance of the packaging adhesive has become an urgent problem to be solved in the current packaging technology field.

[0003] The main materials of the existing packaging adhesives are epoxy resins. Although these materials have certain strength and stability, they usually perform poorly in terms of seismic resistance and moisture resistance. In the face of external vibrations or pressure changes, the existing packaging adhesives are difficult to effectively relieve the impact caused by vibrations, resulting in easy performance degradation or damage of the chips. In terms of moisture protection, due to the relatively dense structure of the existing packaging adhesive materials and the lack of effective bubble structures or flexible components, they tend to absorb moisture when exposed to a humid environment for a long time, thereby causing performance deterioration of the packaging materials, which poses a threat to the long-term use reliability of the chips.

[0004] At present, the existing methods can only optimize locally in one aspect and cannot improve the performance of both at the same time. In addition, the existing modification methods often focus on increasing fillers or changing the basic components of the adhesive, and there is still a lack of effective solutions for how to achieve a balanced improvement of better performance. Therefore, how to design a packaging adhesive that can simultaneously have excellent seismic resistance and moisture resistance has become an important research direction in the current technical field. Summary of the Invention

[0005] The purpose of this application is to provide a chip packaging adhesive with seismic resistance function and a preparation method thereof, so as to solve the technical problems of the existing chip packaging adhesives being insufficient in seismic resistance and moisture resistance.

[0006] To achieve this purpose, this application adopts the following technical solutions: A preparation method of a chip packaging adhesive with seismic resistance function, comprising: Heating a first epoxy resin matrix to obtain a low-viscosity epoxy resin solution; Adding a foaming agent to the low-viscosity epoxy resin solution and stirring to obtain an epoxy resin solution containing uniformly distributed foaming agent; Pouring the epoxy resin solution containing uniformly distributed foaming agent into a preset mold, and heating and curing the preset mold to decompose the foaming agent to form bubbles, thereby obtaining a shock-absorbing layer substrate with a porous structure; Place nanoscale elastomer particles in a stirring device, add a thiol coupling agent into the stirring device, stir, and then mix with a second epoxy resin matrix to obtain a barrier layer mixture for water and oxygen; Place the shock-absorbing layer substrate and the barrier layer mixture for water and oxygen in a double-layer mold, add a photoinitiator, and place it under an ultraviolet lamp for photocuring treatment to obtain a preliminary composite encapsulation adhesive product; Based on a water vapor tester, measure the water vapor transmission rate of the preliminary composite encapsulation adhesive product, and adjust the addition amount of the foaming agent or the thiol coupling agent based on the measurement result until the water vapor transmission rate of the preliminary composite encapsulation adhesive product reaches a preset standard to obtain a chip encapsulation adhesive with earthquake resistance function.

[0007] Further, the first epoxy resin matrix or the second epoxy resin matrix is any one or a combination of phenolic epoxy resin, bisphenol A epoxy resin, alicyclic epoxy resin, or biphenyl epoxy resin.

[0008] Further, the nanoscale elastomer particles are any one or a combination of silicone rubber particles, polyurethane particles, or acrylate rubber particles, and the particle size range is 10 to 100 nanometers.

[0009] Further, the foaming agent is any one or a combination of azodicarbonamide, sodium bicarbonate, or 4,4'-oxybis(benzenesulfonylhydrazide), and the addition amount is 3 to 5% based on the weight percentage of the low-viscosity epoxy resin solution.

[0010] Further, the thiol coupling agent is any one or a combination of γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, or 3-mercaptopropylmethyldiethoxysilane, and the addition amount is 3 to 5% based on the total weight percentage of the nanoscale elastomer particles.

[0011] Further, the step of pouring the epoxy resin solution containing uniformly distributed foaming agent into a preset mold and heating and curing the preset mold to decompose the foaming agent to form bubbles to obtain a shock-absorbing layer substrate with a porous structure includes: Perform preheating treatment on the epoxy resin solution containing uniformly distributed foaming agent, control the temperature to 70 to 90 °C and maintain for 5 to 10 minutes to obtain a preheated stable solution; Perform stepwise injection molding treatment on the preset mold according to the preheated stable solution to obtain a mold intermediate with uniform filling. The stepwise injection molding treatment includes injecting 50% of the volume at a flow rate of 0.5 to 1 mL / s, and then injecting the remaining volume at a flow rate of 1.5 to 2 mL / s; The mold intermediate is subjected to gradient temperature curing treatment to obtain a preliminarily cured porous substrate. The gradient temperature curing treatment includes raising the temperature from an initial temperature of 80°C to 120°C at a rate of 5°C / min and holding for 20 - 30 minutes. In a vacuum environment, the preliminarily cured porous substrate is degassed to obtain a preliminary shock-absorbing layer substrate with uniform bubble distribution. A silicone oxide coating with a thickness of 0.1 - 0.5 μm is coated on the surface of the preliminary shock-absorbing layer substrate and dried at 60°C for 10 minutes. After waiting until room temperature, a shock-absorbing layer substrate with a porous structure is obtained.

[0012] Further, the step of placing the nano-scale elastomer particles in a stirring device, adding a thiol coupling agent in the stirring device and stirring, and then mixing with the second epoxy resin matrix to obtain the barrier water and oxygen layer mixture includes: The nano-scale elastomer particles are added to a mixture of deionized water and a silane coupling agent, and subjected to ultrasonic dispersion treatment in an ultrasonic cleaner. After filtration, an activated nanoparticle suspension is obtained. The activated nanoparticle suspension is placed in a reaction kettle, a thiol coupling agent and an isopropanol solution are added and stirred to obtain a modified nanoparticle solution. The second epoxy resin matrix is heated to reduce its viscosity, and the modified nanoparticle solution is slowly added and stirred to form a primary composite resin liquid. Graphene with a sheet diameter of 10 - 120 nm is added to the primary composite resin liquid, and stirred at 1500 rpm for 35 minutes in a planetary mixer to obtain the barrier water and oxygen layer mixture.

[0013] Further, the step of placing the shock-absorbing layer substrate and the barrier water and oxygen layer mixture in a double-layer mold, adding a photoinitiator and placing it under an ultraviolet lamp for photocuring treatment to obtain a preliminary finished product of the composite encapsulant includes: The shock-absorbing layer substrate is placed in a plasma cleaning device and treated with oxygen-containing plasma at a power of 50 - 100 W for 5 - 10 minutes to obtain an activated shock-absorbing layer substrate. The activated shock-absorbing layer substrate and the barrier water and oxygen layer mixture are placed in a double-layer mold, and a photoinitiator accounting for 1.5 - 3% of the mass of the barrier water and oxygen layer mixture is added and stirred to obtain a composite body. The double-layer mold containing the composite body is placed under a 355 - 365 nm ultraviolet lamp and irradiated at a light intensity of 30 - 60 mW / cm² for 2 - 4 minutes to preliminarily bond the shock-absorbing layer substrate and the barrier water and oxygen layer, obtaining a semi-cured composite structure. Place the semi-cured composite structure in a vacuum environment, add a surface modifier containing siloxane, and treat it at 80-100 °C for 15-20 minutes by chemical vapor deposition to obtain a strengthened composite substrate; Place the strengthened composite substrate under a 405-415 nm ultraviolet lamp and irradiate it with a light intensity of 80-100 mW / cm² for 5-8 minutes to obtain the preliminary composite encapsulation adhesive.

[0014] Further, the step of measuring the water vapor transmission rate of the preliminary composite encapsulation adhesive based on a water vapor tester and adjusting the addition amount of a foaming agent or a mercaptan coupling agent based on the measurement result until the water vapor transmission rate of the preliminary composite encapsulation adhesive reaches a preset standard to obtain a chip encapsulation adhesive with earthquake resistance function includes: Perform sandblasting treatment on the surface of the preliminary composite encapsulation adhesive based on alumina sand grains to make the surface roughness of the preliminary composite encapsulation adhesive 1.5-2.0 μm; Place the preliminary composite encapsulation adhesive after sandblasting treatment in a water vapor tester and perform tests under the conditions of a temperature of 38 °C and a relative humidity of 90%, and record the water vapor transmission rate value; Set the preset standard of the water vapor transmission rate to 0.05 g / m²·1h, calculate the difference between the water vapor transmission rate value and the preset standard to obtain the adjustment amount of the foaming agent or the mercaptan coupling agent; Increase or decrease the addition amount of the foaming agent or the mercaptan coupling agent according to the adjustment amount, and repeat the preparation process until the water vapor transmission rate of the preliminary composite encapsulation adhesive meets the preset standard; Perform cutting and grinding treatments on the preliminary composite encapsulation adhesive that meets the water vapor transmission rate standard to obtain a finished chip encapsulation adhesive with earthquake resistance function.

[0015] This application also discloses a chip encapsulation adhesive with earthquake resistance function, which is prepared by using the preparation method of the chip encapsulation adhesive with earthquake resistance function described in any one of the above. The chip encapsulation adhesive with earthquake resistance function includes: a shock-absorbing layer, a heat-insulating layer, and a water and oxygen barrier layer. Among them, the shock-absorbing layer is composed of a porous structure substrate containing uniformly distributed bubbles, and the heat-insulating layer is formed by curing a mixture of nano-level elastomer particles and an epoxy resin matrix.

[0016] Compared with the prior art, this application has the following beneficial effects: The present application discloses a preparation method of a chip encapsulation adhesive with earthquake resistance function. By introducing a foaming agent into the epoxy resin matrix, uniformly distributed bubbles are formed in the epoxy resin solution. When an impact force is transmitted to the shock-absorbing layer, stress waves will refract, reflect and scatter around these pores, avoiding stress concentration in local areas, thereby greatly reducing the risk of brittle fracture of the material due to stress concentration, and further effectively improving the earthquake resistance performance of the encapsulation adhesive. Further, by introducing nano-scale elastomer particles and thiol coupling agents, a microscopic barrier network is constructed in the epoxy resin matrix. These elastomer particles have high flexibility and low permeability, can effectively fill the microscopic voids in the epoxy resin matrix, and extend the diffusion paths of water vapor and oxygen molecules, reducing the penetration rate of water vapor and oxygen, thereby effectively improving the moisture-proof performance of the encapsulation adhesive and avoiding the performance deterioration of the encapsulation adhesive under long-term exposure to a humid environment.

[0017] In summary, the chip encapsulation adhesive provided by the present application can not only significantly improve the earthquake resistance performance, but also effectively enhance the moisture-proof performance. Moreover, through the design of the porous structure and the barrier network, the balanced improvement of the two performances is achieved, providing a chip encapsulation adhesive with excellent comprehensive performance and high reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings.

[0019] The structures, proportions, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limited conditions under which the present application can be implemented. Therefore, they do not have a substantial technical meaning. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present application can produce and the purposes that can be achieved, should still fall within the scope that the technical content disclosed in the present application can cover.

[0020] Figure 1 It is a schematic diagram of the overall steps of the preparation method of the chip encapsulation adhesive with earthquake resistance function; Figure 2 It is a schematic diagram of the structure of the chip encapsulation adhesive with earthquake resistance function.

[0021] Among them, the reference numerals are: 1, water and oxygen barrier layer; 2, shock-absorbing layer; 3, porous structure. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] To make the invention objectives, features, and advantages of this application more obvious and understandable, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the embodiments described below are only a part of the embodiments of this application, rather than all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of this application.

[0023] In the description of this application, it should be understood that the orientation or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the accompanying drawings. These are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to this application. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component present.

[0024] The following further illustrates the technical solutions of this application with reference to the accompanying drawings and through specific implementation manners.

[0025] Reference Figure 1 , this application provides a preparation method for a chip encapsulation adhesive with seismic resistance function, including: S1: Heating the first epoxy resin matrix to obtain a low-viscosity epoxy resin solution; S2: Adding a foaming agent to the low-viscosity epoxy resin solution and stirring to obtain an epoxy resin solution containing uniformly distributed foaming agent; S3: Pouring the epoxy resin solution containing uniformly distributed foaming agent into a preset mold and heating and curing the preset mold to decompose the foaming agent to form bubbles, obtaining a shock-absorbing layer substrate with a porous structure; In steps S1 to S3, by heating the first epoxy resin matrix to 40 to 60 °C, the viscosity of the epoxy resin is reduced, thereby obtaining a low-viscosity epoxy resin solution. Within this temperature range, both the fluidity and reaction performance of the epoxy resin can be well controlled. In step S2, a foaming agent is added to the low-viscosity epoxy resin solution, and a high-speed stirring device is used to stir at a speed of 1000 to 3000 rpm for 15 to 30 minutes, so that the foaming agent can be evenly distributed in the epoxy resin solution. The role of high-speed stirring is to use mechanical force to evenly disperse the foaming agent in the solution, avoiding local aggregation or precipitation, and making the prepared rubber material have a uniform bubble distribution throughout the volume. During the stirring process, the foaming agent will interact with the epoxy resin matrix to form a stable solution containing the foaming agent. Step S3 is to pour the epoxy resin solution containing the evenly distributed foaming agent into a preset mold and perform heat curing treatment. During the heat curing process, the foaming agent will decompose and release gas to form bubbles, and these bubbles will form a nano-scale pore structure in the epoxy resin matrix. These pores can effectively relieve the transmission of external impact force and can disperse and absorb stress when an impact occurs. For example, when an external impact force acts on the encapsulating glue, these bubbles can disperse the stress inside the material, avoid stress concentration, and thus reduce the risk of brittle fracture of the material. In addition, the gas molecules in the pores will be compressed and move under the action of the external impact force, further consuming the impact energy, converting the external impact energy into forms such as heat energy, thereby effectively dissipating the impact energy and reducing the energy transmitted to the chip.

[0026] S4: Place nano-scale elastomer particles in a stirring device, add a thiol coupling agent to the stirring device and stir, and then mix with the second epoxy resin matrix to obtain a barrier water and oxygen layer mixture; In step S4, nano - scale elastomer particles are placed in a stirring device, and then a thiol coupling agent is added for stirring. The role of the thiol coupling agent is to enhance the interaction force between the elastomer particles and the epoxy resin matrix, enabling the elastomer particles to be more stably dispersed in the epoxy resin matrix. Through this process, the nano - scale elastomer particles can fill the microscopic voids in the epoxy resin matrix and form a tight bond with the epoxy resin, thereby constructing a dense barrier layer. This dense structure can effectively block the diffusion of water vapor and oxygen molecules along the tiny channels inside the material, forming a reliable moisture - proof and oxidation - proof barrier, thus extending the service life of the chip and providing a stable working environment for the chip. Further, the synergistic effect of reinforcing fillers such as carbon fiber or glass fiber is exerted. Carbon fiber and glass fiber have a high aspect ratio and excellent mechanical strength, and can form an additional physical barrier in the epoxy resin matrix, increasing the difficulty for water vapor and oxygen molecules to penetrate the material. For example, carbon fiber can form a continuous barrier network in the epoxy resin matrix, and its fiber structure can effectively prevent water vapor and oxygen molecules from penetrating along the weak direction of the material. In actual operation, by mixing nano - scale elastomer particles with reinforcing fillers and then mixing them with the second epoxy resin matrix, an efficient water - oxygen barrier layer can be obtained, which can prevent the penetration of water vapor and oxygen and enhance the mechanical strength of the encapsulant, enabling the chip to better protect the internal chip structure from damage when subjected to external impacts or vibrations.

[0027] S5: Place the shock - absorbing layer substrate and the water - oxygen barrier layer mixture in a double - layer mold, add a photo - initiator, and place it under an ultraviolet lamp for photocuring treatment to obtain a preliminary composite encapsulant product. In step S5, the shock - absorbing layer substrate and the water - oxygen barrier layer mixture are mixed in proportion and placed in a double - layer mold. The double - layer mold enables the encapsulant to maintain an appropriate thickness and structural form during the curing process, avoiding the loss or uneven distribution of the material during curing, and a photo - initiator is added. The photo - initiator causes the epoxy resin matrix to undergo a chemical reaction under ultraviolet light irradiation to form a cured three - dimensional cross - linked structure, thereby enhancing the mechanical strength and stability of the material. The mixture containing the photo - initiator is placed under an ultraviolet lamp for photocuring treatment. By releasing high - energy ultraviolet light, the photo - initiator is activated, causing the epoxy resin matrix to undergo a cross - linking curing reaction to form a composite encapsulant with a solid structure. Epoxy resin, as the common matrix material for both layers, has excellent adhesion and can achieve tight inter - layer bonding during the curing process.

[0028] S6: Based on a water vapor tester, measure the water vapor transmission rate of the preliminary composite encapsulant product, and adjust the addition amount of the foaming agent or the thiol coupling agent based on the measurement result until the water vapor transmission rate of the preliminary composite encapsulant product reaches a preset standard to obtain a chip encapsulant with earthquake - resistant function.

[0029] In step S6, the water vapor transmission rate of the preliminary composite encapsulant product is measured by a water vapor transmission rate tester. The water vapor transmission rate can reflect the moisture-proof ability of the encapsulant and is an important indicator for measuring whether the encapsulant can effectively protect the chip from moisture in the working environment. If the water vapor transmission rate of the encapsulant is higher than the preset standard, that is, the water vapor transmission rate is greater than 0.1 g / m²·24h, it means that the performance of the encapsulant in terms of moisture-proofing fails to meet the expected requirements and needs to be further optimized. At the same time, the compressive strength of the composite encapsulant is measured by a compression testing machine. The measurement of the compressive strength reflects the anti-deformation ability of the encapsulant when subjected to external pressure and also indirectly reflects its anti-seismic ability when subjected to vibration. If the compressive strength is lower than 50 MPa, that is, the anti-seismic property of the encapsulant is insufficient and it cannot effectively protect the chip from the influence of external vibration or impact, corresponding adjustments and optimizations are required. After the test data of the water vapor transmission rate and the compressive strength are fed back, based on the analysis of the performance feedback iteration algorithm, the formulation can be adjusted according to the specific test results. If the water vapor transmission rate is relatively high and exceeds the set standard, the tightness of the encapsulant can be improved by adjusting the addition amount of the foaming agent. The function of the foaming agent is to form tiny bubble structures inside the encapsulant. These bubbles help to improve the flexibility and shock-absorbing performance of the encapsulant, but too many bubbles may lead to insufficient tightness of the encapsulant, thereby increasing the water vapor transmission rate. Therefore, the content of the foaming agent can be adjusted at this time, and the addition amount of the foaming agent can be adjusted to the range of 2% to 5% to achieve the purpose of reducing the water vapor transmission rate. Further, the addition amount of the mercaptan coupling agent is adjusted simultaneously. If it is found through testing that the compressive strength is relatively low, it may be because the strength of the encapsulant is insufficient to withstand large pressure or vibration. At this time, the addition amount of the mercaptan coupling agent can be appropriately increased, which can be controlled within the range of 5% to 10%, to improve the compressive strength and anti-seismic ability of the encapsulant. Through repeated performance feedback and adjustment, the composite encapsulant can meet the preset standards in both key performance indicators of the water vapor transmission rate and the compressive strength. In actual operation, by continuously optimizing the parameters, the finished chip encapsulant that meets the requirements of the anti-seismic function can be gradually obtained.

[0030] In summary, through the optimization process, the composite encapsulant can ensure stable protection performance during use. Whether facing environmental humidity, air pressure changes, or external vibration or impact, it can effectively maintain the normal working state of the chip, thereby improving the reliability and service life of the chip. This post-treatment optimization process not only improves the performance of the encapsulant but also ensures its long-term stability and durability under various harsh conditions.

[0031] In one embodiment, the first epoxy resin matrix or the second epoxy resin matrix is any one or a combination of phenolic epoxy resin, bisphenol A epoxy resin, alicyclic epoxy resin, or biphenyl epoxy resin.

[0032] In one embodiment, the nano - scale elastomer particles are any one or a combination of silicone rubber particles, polyurethane particles, or acrylate rubber particles, and the particle size ranges from 10 to 100 nanometers.

[0033] In one embodiment, the blowing agent is any one or a combination of azodicarbonamide, sodium bicarbonate, or 4,4 - oxybis(benzenesulfonylhydrazide), and the addition amount is 3 - 5% based on the weight percentage of the low - viscosity epoxy resin solution. The thiol coupling agent is any one or a combination of γ - mercaptopropyltrimethoxysilane, γ - mercaptopropyltriethoxysilane, or 3 - mercaptopropylmethyldiethoxysilane, and the addition amount is 3 - 5% based on the total weight percentage of the nano - scale elastomer particles.

[0034] In one embodiment, the step of pouring the epoxy resin solution containing uniformly distributed blowing agent into a preset mold and heating and curing the preset mold to decompose the blowing agent to form bubbles to obtain a shock - absorbing layer substrate with a porous structure includes: Performing a pre - heating treatment on the epoxy resin solution containing uniformly distributed blowing agent, controlling the temperature to 70 - 90 °C and maintaining for 5 - 10 minutes to obtain a pre - heated stable solution; Performing a stepped injection - molding treatment on the preset mold according to the pre - heated stable solution to obtain a mold intermediate with uniform filling. The stepped injection - molding treatment includes injecting 50% of the volume at a flow rate of 0.5 - 1 mL / s and then injecting the remaining volume at a flow rate of 1.5 - 2 mL / s; Performing a gradient temperature - rising curing treatment on the mold intermediate to obtain a preliminarily cured porous substrate. The gradient temperature - rising curing treatment includes rising from an initial temperature of 80 °C to 120 °C at a rate of 5 °C / min and maintaining for 20 - 30 minutes; Performing a degassing treatment on the preliminarily cured porous substrate in a vacuum environment to obtain a shock - absorbing layer substrate initial body with uniform bubble distribution; Coating a 0.1 - 0.5 μm - thick silicone oxide coating on the surface of the shock - absorbing layer substrate initial body and drying it at 60 °C for 10 minutes, and waiting until it reaches room temperature to obtain a shock - absorbing layer substrate with a porous structure.

[0035] In this embodiment, the epoxy resin solution is heated to a temperature between 70°C and 90°C and maintained at this temperature for 5 to 10 minutes. This preheating process can prevent the blowing agent from decomposing too quickly at the initial stage of heating, thereby making the distribution of bubbles more uniform and facilitating the control of bubbles during the subsequent mold injection process. The preheated epoxy resin solution is poured into a preset mold for stepped mold injection treatment to evenly fill the mold with the epoxy resin solution and avoid bubble aggregation. Specifically, the mold injection process is divided into two stages: first, 50% of the solution is injected at a flow rate of 0.5 to 1 mL / s, and then the remaining solution is injected at a flow rate of 1.5 to 2 mL / s. This stepped mold injection method can ensure that the epoxy resin solution is evenly filled in the mold, reduce the problems of bubble aggregation or uneven pore formation caused by inconsistent flow rates, and thus ensure that the porous structure of the final substrate is more uniform. After the mold injection is completed, gradient temperature rising and curing treatment is carried out. By controlling the temperature and the heating rate, the epoxy resin is gradually cured during the temperature control process, and the blowing agent can be fully decomposed to release gas to form a stable bubble structure. Specifically, starting from the initial temperature of 80°C, the heating rate is set at 5°C / min until it reaches 120°C and is maintained for 20 to 30 minutes. This gradient temperature rising treatment method can effectively control the rheology of the epoxy resin and the stability of bubble formation during the curing process. After the curing treatment, the obtained porous substrate needs to be degassed to further remove excess bubbles. The degassing treatment is carried out in a vacuum environment to remove the residual bubbles that may form during the curing of the epoxy resin. In a vacuum environment, the gas in the bubbles will be effectively pumped out, making the final shock-absorbing layer substrate more uniform, and a thin layer of siloxane coating is applied on the surface. The thickness of the coating is controlled between 0.1 and 0.5 μm to ensure that the coating evenly covers and enhances the surface protection performance, can increase its adhesion to other materials, and enhance the long-term stability of the shock-absorbing layer. After the coating is completed, it is dried at 60°C for 10 minutes to cure the coating and ensure its firm attachment. After the coating is completely cooled to room temperature, a substrate with a porous structure and shock-absorbing performance is finally obtained.

[0036] In one embodiment, the step of placing the nano-scale elastomer particles in a stirring device, adding a thiol coupling agent into the stirring device and stirring, and then mixing with the second epoxy resin matrix to obtain the barrier water and oxygen layer mixture includes: Adding the nano-scale elastomer particles into a mixture of deionized water and a silane coupling agent, performing ultrasonic dispersion treatment in an ultrasonic cleaner, and filtering to obtain an activated nano-particle suspension; Placing the activated nano-particle suspension in a reaction kettle, adding a thiol coupling agent and an isopropanol solution and performing stirring treatment to obtain a modified nano-particle solution; The second epoxy resin matrix is ​​heated to reduce viscosity, and the modified nanoparticle solution is slowly added and stirred to form a primary composite resin solution; Graphene with a sheet diameter of 10 to 120 nm was added to the primary composite resin liquid, and the mixture was stirred at 1500 rpm for 35 minutes in a planetary mixer to obtain the water-oxygen barrier layer mixture.

[0037] In the present embodiment, nano-scale elastomer particles are placed in a stirring device so that the particles can be evenly distributed in subsequent treatment. Elastomer particles can improve the flexibility and shock resistance of the colloid in the encapsulation glue, and a suitable coupling agent is added to promote the good combination of elastomer particles and resin matrix. The coupling agent is selected as a thiol coupling agent, and the thiol coupling agent can form a chemical bond with the surface of the elastomer particles, thereby increasing the compatibility between the particles and the resin matrix and improving the overall mechanical properties of the material. Specifically, nano-scale elastomer particles are added to a mixture of deionized water and a silane coupling agent. With the help of deionized water, the dispersibility of the particles is improved, and the silane coupling agent can further improve the interfacial bonding ability of the particles with the aqueous phase and the final resin matrix. At this time, an ultrasonic cleaning machine is used for ultrasonic dispersion treatment, and high-frequency sound waves are used to induce the cavitation effect in the liquid, thereby destroying the agglomeration phenomenon between the particles, so that the nanoparticles are more evenly dispersed, forming an activated nanoparticle suspension, which is placed in a reactor, and a thiol coupling agent and an isopropanol solution are added for stirring. The thiol coupling agent at this time further modifies the particle surface, thereby further improving the dispersibility of the nanoparticles in the resin matrix. Isopropyl alcohol, as a solvent, can help regulate the viscosity of the reaction system, making stirring smoother and avoiding particle precipitation or uneven distribution. During the stirring process, the modified nanoparticles interact with other components in the solution to obtain a stable modified nanoparticle solution, which is then mixed with the second epoxy resin matrix. Specifically, the second epoxy resin matrix is ​​heat-treated for the purpose of reducing the viscosity of the resin so that it can flow more when mixed with the modified nanoparticle solution, slowly adding the modified nanoparticle solution to the resin, and fully stirring to form a primary composite resin liquid. Graphene with a sheet diameter of 10-120 nm is added to the primary composite resin liquid. Graphene exists in the form of nanoparticles. Graphene has an ultra-high specific surface area and excellent gas barrier properties. When graphene is dispersed in the resin liquid at the nanoscale, it can form a continuous network structure in the resin, significantly reducing the permeability of water and oxygen, and has very high tensile strength and hardness, which can significantly improve the mechanical properties of the composite material. Stirring at 1500 rpm in a planetary mixer for 35 minutes to evenly distribute the graphene in the resin, the obtained water-oxygen barrier layer mixture will have excellent seismic resistance and water-oxygen resistance, and is suitable for the packaging of electronic components.

[0038] In one embodiment, the step of placing the shock-absorbing layer substrate and the water and oxygen barrier layer mixture in a double-layer mold, adding a photoinitiator, and subjecting it to photocuring treatment under an ultraviolet lamp to obtain a preliminary composite encapsulant includes: Placing the shock-absorbing layer substrate in a plasma cleaning device, treating it with oxygen-containing plasma at a power of 50-100 W for 5-10 minutes to obtain an activated shock-absorbing layer substrate; Placing the activated shock-absorbing layer substrate and the water and oxygen barrier layer mixture in a double-layer mold, and adding a photoinitiator accounting for 1.5-3% of the mass of the water and oxygen barrier layer mixture and stirring to obtain a composite body; Placing the double-layer mold containing the composite body under an ultraviolet lamp with a wavelength of 355-365 nm, irradiating it with a light intensity of 30-60 mW / cm² for 2-4 minutes to preliminarily bond the shock-absorbing layer substrate and the water and oxygen barrier layer to obtain a semi-cured composite structure; Placing the semi-cured composite structure in a vacuum environment, adding a surface modifier containing siloxane, and treating it by chemical vapor deposition at 80-100 °C for 15-20 minutes to obtain a strengthened composite substrate; Placing the strengthened composite substrate under an ultraviolet lamp with a wavelength of 405-415 nm, irradiating it with a light intensity of 80-100 mW / cm² for 5-8 minutes to obtain the preliminary composite encapsulant.

[0039] In this embodiment, the shock-absorbing layer substrate is placed in a plasma cleaning device, and the substrate is treated with oxygen-containing plasma. By exciting gas molecules through a high-energy electric field, plasma is generated. During this process, the oxygen-containing plasma can effectively remove organic substances and impurities on the surface of the shock-absorbing layer substrate, and through surface activation treatment, make the substrate surface more affinity and adhesiveness. The plasma cleaning device is set to operate at a power of 50-100 W for 5-10 minutes to ensure that the surface of the shock-absorbing layer substrate has sufficient activity. The shock-absorbing layer substrate that has undergone plasma cleaning and activation is combined with the water and oxygen barrier layer mixture in a double-layer mold, and a photoinitiator is added. Polymerization reaction is initiated by ultraviolet light irradiation, promoting cross-linking of the mixture during the curing process. The amount of photoinitiator added is 1.5-3% of the mass of the water and oxygen barrier layer mixture. The photoinitiator can generate free radicals under ultraviolet light irradiation, thereby promoting the polymerization and cross-linking of the resin matrix and enhancing the overall strength and stability of the material. After uniformly stirring the shock-absorbing layer substrate, the water and oxygen barrier layer mixture, and the photoinitiator, a composite is obtained and loaded into a double-layer mold, entering the stage of ultraviolet curing treatment. In the ultraviolet curing step, the composite is irradiated under an ultraviolet lamp with a wavelength of 355-365 nm. The light intensity of the ultraviolet lamp is 30-60 mW / cm², and the irradiation time is 2-4 minutes. Through the irradiation of ultraviolet light, the photoinitiator begins to act, promoting the polymerization of the resin in the water and oxygen barrier layer mixture, and a preliminary bond is formed between the shock-absorbing layer substrate and the water and oxygen barrier layer, forming a semi-cured composite structure. The semi-cured composite structure is placed in a vacuum environment to remove possible bubbles and impurities, and at the same time enhance the overall density of the material. In the vacuum environment, a surface modifier containing siloxane is added to chemically react with the surface of the composite material to form a stable surface coating, improving the weather resistance, heat resistance, and surface adhesion of the material. At this time, chemical vapor deposition is used. Through heat treatment, it is carried out at a temperature of 80-100 °C for 15-20 minutes. The modifier penetrates to the surface of the material by vapor deposition, further enhancing the performance of the material, especially the improvement in water resistance and oxidation resistance. The strengthened composite substrate enters the ultraviolet curing treatment stage again. Based on an ultraviolet lamp with a wavelength of 405-415 nm, the light intensity is 80-100 mW / cm², and the irradiation time is 5-8 minutes, promoting further cross-linking and curing of the surface modification layer, making the structure of the entire composite substrate more firm and stable, and the stability is significantly improved.

[0040] In one embodiment, the step of measuring the water vapor transmission rate of the preliminary finished product of the composite encapsulation adhesive based on a water vapor tester and adjusting the addition amount of the foaming agent or the mercaptan coupling agent according to the measurement result until the water vapor transmission rate of the preliminary finished product of the composite encapsulation adhesive reaches a preset standard to obtain a chip encapsulation adhesive with earthquake resistance function includes: The surface of the initial composite encapsulation adhesive product is sandblasted with alumina sand grains to make the surface roughness of the initial composite encapsulation adhesive product 1.5 - 2.0 μm; The initial composite encapsulation adhesive product after sandblasting is placed in a water vapor tester and tested under the conditions of a temperature of 38 °C and a relative humidity of 90%, and the water vapor transmission rate value is recorded; Set the preset standard of the water vapor transmission rate to 0.05 g / m²·1h, calculate the difference between the water vapor transmission rate value and the preset standard, and obtain the adjustment amount of the foaming agent or mercaptan coupling agent; Increase or decrease the addition amount of the foaming agent or mercaptan coupling agent according to the adjustment amount, and repeat the preparation process until the water vapor transmission rate of the initial composite encapsulation adhesive product meets the preset standard; The initial composite encapsulation adhesive product that meets the water vapor transmission rate standard is cut and polished to obtain a finished chip encapsulation adhesive with earthquake resistance function.

[0041] In this embodiment, alumina sand grains are used to treat the surface of the preliminary product of the composite encapsulation adhesive. During this process, the sand grains rub and strike the surface of the encapsulation adhesive through high-speed spraying, removing the smooth layer on the surface and generating microscopic rough textures, such that the surface of the composite encapsulation adhesive presents a roughness of 1.5 - 2.0 μm. The water vapor transmission rate of the preliminary product of the composite encapsulation adhesive is measured by a water vapor tester. Under specific conditions, the measurement of the water vapor transmission rate is one of the important indicators for evaluating the performance of the encapsulation adhesive. Therefore, in this embodiment, the test conditions are set as a temperature of 38 °C and a relative humidity of 90%. Under these conditions, the water vapor tester can accurately measure the water vapor permeation rate of the composite encapsulation adhesive within a certain period of time. By measuring the water vapor transmission rate, the water vapor barrier ability of the encapsulation adhesive in a high-humidity environment can be understood, and further, it can be evaluated whether the encapsulation adhesive can effectively protect the internal chip from water vapor intrusion, preventing the chip from getting damp or suffering from other performance degradation problems caused by water vapor. The standard of the water vapor transmission rate is preset as 0.05 g / m²·1h. If the test result of the water vapor transmission rate does not meet the preset standard, further adjustment is required. During the adjustment process, by calculating the difference between the actually measured value of the water vapor transmission rate and the preset standard, the amount of additive to be increased or decreased is determined. The key to the adjustment lies in the usage amounts of the foaming agent or the mercaptan coupling agent. The foaming agent mainly plays a role in improving the toughness of the material, increasing the seismic resistance, and reducing the water vapor transmission rate in the composite encapsulation adhesive, while the mercaptan coupling agent helps to enhance the interfacial bonding force and adhesion of the composite material. Therefore, by precisely controlling the addition amounts of these two components, the physical properties of the composite encapsulation adhesive can be adjusted to a certain extent, thereby affecting the water vapor transmission rate. The adjustment steps include gradually increasing or decreasing the addition amounts of the foaming agent or the mercaptan coupling agent according to the difference between the measured water vapor transmission rate value and the standard, and the adjustment range is optimized within a specific percentage range. For example, the addition amount of the foaming agent is adjusted between 2% and 5%, and the adjustment range of the mercaptan coupling agent may be different. After each adjustment, the aforementioned preparation process needs to be re-executed, and the water vapor transmission rate is tested again. Through this iterative adjustment process, the water vapor transmission rate of the composite encapsulation adhesive can reach the preset standard. After the water vapor transmission rate of the preliminary product of the composite encapsulation adhesive finally meets the preset standard, the composite encapsulation adhesive is cut and polished. According to actual needs, the preliminary product of the composite encapsulation adhesive is processed into a finished product that meets the dimensional requirements. During this process, the surface of the encapsulation adhesive is finely polished using sandpaper to ensure that the surface is smooth and meets the dimensional accuracy requirements, and the accuracy can be set as ±0.01 mm. Through this polishing process, the surface quality and dimensional accuracy of the encapsulation adhesive are further improved, ensuring that the final product can better adapt to various chip encapsulation requirements in practical applications.

[0042] In another embodiment, the addition amount of the foaming agent or the mercaptan coupling agent can be adjusted and re-prepared. Specifically, through a preset algorithm model, based directly on the difference between the measured water vapor transmission rate and the preset standard, the optimal addition amount of the foaming agent or the mercaptan coupling agent can be calculated and directly applied to the next preparation process. Such an algorithm model can be developed based on machine learning or artificial intelligence technology and trained and optimized through a large amount of experimental data to enable it to accurately predict the impact of different addition amounts on the water vapor transmission rate. Specifically, the calculation expression for the optimal addition amount is: ; Wherein, is the adjusted addition amount, that is, the amount of the foaming agent or the mercaptan coupling agent to be added, and is used to guide the addition amount in the next preparation process; is the initial addition amount, that is, the original amount of the foaming agent or the mercaptan coupling agent in the composite encapsulant at the beginning. is the adjustment coefficient, indicating the amplitude of each addition dose adjustment. The size of the coefficient is based on past experimental data or machine learning model prediction, determines the speed of each iterative adjustment, and can be calculated by regression through experimental data or an optimized model; is the actually measured water vapor transmission rate value, that is, the water vapor transmission rate value of the composite encapsulant tested by a water vapor tester; is the target water vapor transmission rate, that is, the preset standard water vapor transmission rate (such as 0.05 g / m²·1h); α is a control parameter, indicating the sensitivity of the water vapor transmission rate deviation to the adjustment amount. The value of α depends on the material characteristics and the non-linear relationship of the adjustment, indicating the influence degree on the addition amount adjustment when the water vapor transmission rate changes; e is the base of the natural logarithm (constant), which is used here to represent the exponential adjustment relationship, indicating that as the transmission rate deviation changes, the adjustment amount of the additive changes exponentially, reflecting the non-linear adjustment characteristics of the encapsulant material under different deviations; β is the gain coefficient, indicating the relationship coefficient between the material composition and the additive content; is the component content of the current composite encapsulant, indicating the concentration (such as percentage) of the foaming agent or the mercaptan coupling agent in the current material; is the base component content, indicating the base concentration of the foaming agent or the mercaptan coupling agent in the original composite encapsulant, the starting point before optimization. The expression calculates how to adjust the addition amount of the foaming agent or the mercaptan coupling agent by measuring the difference between the actual water vapor transmission rate and the preset standard, so that the composite encapsulant reaches the target water vapor transmission rate standard. In each adjustment process, based on the deviation between the currently measured water vapor transmission rate and the target value, the adjustment coefficient ΔA is calculated using the parameters α and β, thereby gradually optimizing the water vapor transmission rate performance of the composite encapsulant.

[0043] In one embodiment, referring to Figure 2, the present invention also discloses a chip encapsulation adhesive with seismic resistance function, which is prepared by using the preparation method of the chip encapsulation adhesive with seismic resistance function described in any one of the above. It includes: a shock-absorbing layer 2, a heat-insulating layer, and a water and oxygen barrier layer 1. Among them, the shock-absorbing layer 2 is composed of a porous structure 3 substrate containing uniformly distributed bubbles, and the heat-insulating layer is formed by curing a mixture of nano-level elastomer particles and an epoxy resin matrix. It should be noted that in the embodiments and drawings of the present application, the specific form and distribution of the heat-insulating layer are not pointed out, but its existence is intended to provide an additional heat insulation effect, reduce the thermal stress generated by the encapsulation adhesive during temperature changes, and thus protect the chip from mechanical damage caused by thermal expansion and contraction.

[0044] It should be noted that the epoxy resin matrix existing as a liquid in this embodiment is only an example. In actual applications, other suitable raw materials and solvents can be selected for reaction according to needs, as long as it can ensure that the finally obtained chip encapsulation adhesive with seismic resistance function has the required performance.

[0045] As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

1. A method for preparing a chip packaging adhesive with anti-vibration function, characterized in that: include: heating the first epoxy resin matrix to obtain a low-viscosity epoxy resin solution; adding a blowing agent to the low-viscosity epoxy resin solution and stirring the mixture to obtain an epoxy resin solution containing a uniformly distributed blowing agent; Pour an epoxy resin solution containing a uniformly distributed foaming agent into a preset mold, and heat and cure the preset mold to decompose the foaming agent to form bubbles, thereby obtaining a shock-absorbing layer substrate with a porous structure; Placing nano-scale elastomer particles in a stirring device, adding a thiol coupling agent into the stirring device, stirring, and then mixing with a second epoxy resin matrix to obtain a water-oxygen barrier layer mixture; Placing the shock-absorbing layer substrate and the water-oxygen barrier layer mixture in a double-layer mold, adding a photoinitiator and placing under an ultraviolet lamp for light curing to obtain a composite encapsulation adhesive pre-finished product; The water vapor permeability of the composite packaging glue finished product is measured based on a water vapor tester, and the addition amount of the foaming agent or thiol coupling agent is adjusted based on the measurement result until the water vapor permeability of the composite packaging glue finished product reaches a preset standard, thereby obtaining a chip packaging glue with anti-vibration function.

2. The method for preparing chip packaging adhesive with anti-vibration function according to claim 1, characterized in that: The first epoxy resin matrix or the second epoxy resin matrix is ​​any one or more of a phenolic epoxy resin, a bisphenol A epoxy resin, an alicyclic epoxy resin or a biphenyl epoxy resin.

3. The method for preparing chip packaging adhesive with shock-resistant function according to claim 1, characterized in that: The nano-scale elastomer particles are any one or more combinations of silicone rubber particles, polyurethane particles or acrylic rubber particles, and the particle size ranges from 10 to 100 nanometers.

4. The method for preparing chip packaging adhesive with anti-vibration function according to claim 1, characterized in that: The foaming agent is any one or more of azodicarbonamide, sodium bicarbonate or 4,4-oxobisbenzenesulfonyl hydrazide, and the added amount is 3-5% by weight based on the low viscosity epoxy resin solution.

5. The method for preparing chip packaging adhesive with anti-vibration function according to claim 1, characterized in that: The thiol coupling agent is any one or more of γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane or 3-mercaptopropylmethyldiethoxysilane, and the added amount is 3-5% based on the total weight percentage of the nano-scale elastomer particles.

6. The method for preparing chip packaging adhesive with anti-vibration function according to claim 1, characterized in that: The step of pouring the epoxy resin solution containing the uniformly distributed foaming agent into a preset mold, and heating and curing the preset mold to decompose the foaming agent to form bubbles to obtain a shock-absorbing layer substrate with a porous structure includes: Preheating the epoxy resin solution containing the uniformly distributed foaming agent, controlling the temperature to 70-90°C and maintaining it for 5-10 minutes to obtain a preheated stable solution; Performing a stepwise injection molding process on a preset mold according to the preheated stable solution to obtain a uniformly filled mold intermediate, wherein the stepwise injection molding process includes injecting 50% of the volume at a flow rate of 0.5-1 mL / s and then injecting the remaining volume at a flow rate of 1.5-2 mL / s; The mold intermediate is subjected to a gradient temperature rise curing treatment to obtain a preliminarily cured porous substrate, wherein the gradient temperature rise curing treatment comprises heating the initial temperature from 80° C. to 120° C. at a rate of 5° C. / min and maintaining the temperature for 20 to 30 minutes; Under a vacuum environment, the preliminarily solidified porous substrate is degassed to obtain a preliminary body of a shock-absorbing layer substrate with uniform bubble distribution; A siloxane coating with a thickness of 0.1 to 0.5 μm is coated on the surface of the initial body of the shock-absorbing layer substrate and dried at 60° C. for 10 minutes. After the substrate cools to room temperature, a shock-absorbing layer substrate with a porous structure is obtained.

7. The method for preparing chip packaging adhesive with anti-vibration function according to claim 1, characterized in that: The step of placing the nano-scale elastomer particles in a stirring device, adding a thiol coupling agent in the stirring device, stirring, and mixing with the second epoxy resin matrix to obtain a water-oxygen barrier layer mixture comprises: Adding nano-scale elastomer particles into a mixture of deionized water and a silane coupling agent, performing ultrasonic dispersion treatment in an ultrasonic cleaning machine, and filtering to obtain an activated nano-particle suspension; Placing the activated nanoparticle suspension in a reaction kettle, adding a thiol coupling agent and an isopropanol solution and stirring the mixture to obtain a modified nanoparticle solution; The second epoxy resin matrix is ​​heated to reduce viscosity, and the modified nanoparticle solution is slowly added and stirred to form a primary composite resin solution; Graphene with a sheet diameter of 10 to 120 nm was added to the primary composite resin liquid, and the mixture was stirred at 1500 rpm for 35 minutes in a planetary mixer to obtain the water-oxygen barrier layer mixture.

8. The method for preparing chip packaging adhesive with shock-resistant function according to claim 1, characterized in that: The step of placing the shock-absorbing layer substrate and the water-oxygen barrier layer mixture in a double-layer mold, adding a photoinitiator and placing it under an ultraviolet lamp for light curing to obtain a composite encapsulation adhesive pre-finished product includes: Placing the shock-absorbing layer substrate in a plasma cleaning device and treating it with oxygen-containing plasma at a power of 50 to 100 W for 5 to 10 minutes to obtain an activated shock-absorbing layer substrate; The activated shock-absorbing layer substrate and the water-oxygen barrier layer mixture are placed in a double-layer mold, and a photoinitiator accounting for 1.5-3% of the weight of the water-oxygen barrier layer mixture is added and stirred to obtain a composite; The double-layer mold containing the composite is placed under a 355-365 nm ultraviolet lamp and irradiated with a light intensity of 30-60 mW / cm² for 2-4 minutes to initially combine the shock-absorbing layer substrate with the water and oxygen barrier layer to obtain a semi-cured composite structure; The semi-cured composite structure is placed in a vacuum environment, a surface modifier containing siloxane is added, and the surface is treated at 80-100° C. for 15-20 minutes by chemical vapor deposition to obtain a reinforced composite substrate; The reinforced composite substrate is placed under a 405-415 nm ultraviolet lamp and irradiated at a light intensity of 80-100 mW / cm² for 5-8 minutes to obtain the composite encapsulation adhesive pre-finished product.

9. The method for preparing chip packaging adhesive with anti-vibration function according to claim 1, characterized in that: The step of measuring the water vapor permeability of the composite packaging glue finished product based on a water vapor tester, and adjusting the amount of the foaming agent or the thiol coupling agent added based on the measurement result until the water vapor permeability of the composite packaging glue finished product reaches a preset standard to obtain a chip packaging glue with a shock-resistant function includes: Sandblasting the surface of the composite encapsulation adhesive pre-finished product with aluminum oxide sand particles to make the surface roughness of the composite encapsulation adhesive pre-finished product be 1.5-2.0 μm; The composite encapsulation adhesive product after sandblasting is placed in a water vapor tester and tested at a temperature of 38°C and a relative humidity of 90%, and the water vapor transmission rate value is recorded; The preset standard of water vapor transmission rate is set to 0.05 g / m²·1h, and the difference between the water vapor transmission rate value and the preset standard is calculated to obtain the adjustment amount of the foaming agent or the thiol coupling agent; Increasing or decreasing the amount of the foaming agent or the thiol coupling agent added according to the adjustment amount, and repeating the preparation process until the water vapor transmission rate of the composite encapsulation adhesive preliminary product meets the preset standard; The composite encapsulation adhesive preliminary product that meets the water vapor transmission rate standard is cut and polished to obtain a chip encapsulation adhesive product with anti-vibration function.

10. A chip packaging adhesive with anti-vibration function, characterized in that: The chip packaging adhesive with anti-vibration function is prepared by the preparation method of any one of claims 1 to 9, wherein the chip packaging adhesive with anti-vibration function comprises: a shock-absorbing layer, a heat-insulating layer and a water-oxygen barrier layer, wherein the shock-absorbing layer is composed of a porous structure substrate containing uniformly distributed bubbles, and the heat-insulating layer is formed by mixing nano-scale elastomer particles with an epoxy resin matrix and then curing.

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