Abnormality detection method and device for integrated busbar CCS and electronic equipment

Abstract

The invention provides an anomaly detection method and device for an integrated busbar CCS and electronic equipment, and relates to the technical field of fault detection.The anomaly detection method for the integrated busbar CCS comprises the steps that a simulation model of the CCS is constructed, and first position data of a nickel sheet in the simulation model is obtained; obtaining a target CCS coated with the conductive fluorescent ink; supplying power to the target CCS to obtain second position data of each light-emitting point after the target CCS is supplied with power; determining an abnormal result of the CCS according to the first position data and the second position data; the technical problem that in the prior art, CCS detection accuracy is low is solved.

Description

Technical Field

[0001] This application relates to the technical field of fault detection, and particularly to an abnormal detection method, device and electronic device for an integrated busbar CCS. Background Art

[0002] Currently, the detection methods for open circuits, short circuits and breaks in an integrated busbar (Cells Contact System, CCS) are usually resistance tests. However, the resistance test method is subject to many interferences, such as contact resistance interference and the risk of nickel sheet oxidation, which can lead to larger data errors. At high density, the physical position differences, along with the increasing density of wire harnesses and nickel sheets, may cause the resistance detection to be unable to identify the data differences brought about by too small a distance between adjacent nickel sheets, etc., resulting in low detection accuracy. Summary of the Invention

[0003] This application aims to solve at least one of the technical problems in the related art to some extent.

[0004] To this end, the first object of this application is to propose an abnormal detection method for an integrated busbar CCS to achieve high-precision abnormal detection.

[0005] The second object of this application is to propose an abnormal detection device for an integrated busbar CCS.

[0006] The third object of this application is to propose an electronic device.

[0007] The fourth object of this application is to propose a computer-readable storage medium.

[0008] The fifth object of this application is to propose a computer program product.

[0009] To achieve the above object, an embodiment of the first aspect of this application proposes an abnormal detection method for an integrated busbar CCS, including:

[0010] Construct a simulation model of the CCS to be detected, and obtain the first position data of the nickel sheets in the simulation model;

[0011] Obtain the target CCS after being coated with conductive fluorescent ink;

[0012] Power the target CCS to obtain the second position data of each luminous point after the target CCS is powered;

[0013] Determine the abnormal result of the CCS according to the first position data and the second position data.

[0014] To achieve the above object, an embodiment of the second aspect of this application proposes an abnormal detection device for an integrated busbar CCS, including:

[0015] The first acquisition module is configured to build a simulation model of the CCS to be detected and acquire first position data of the nickel sheet in the simulation model;

[0016] The second acquisition module is configured to acquire the target CCS after being coated with conductive fluorescent ink;

[0017] The third acquisition module is configured to supply power to the target CCS to obtain second position data of each light-emitting point after the target CCS is powered;

[0018] The detection module is configured to determine an abnormal result of the CCS according to the first position data and the second position data.

[0019] To achieve the above object, an embodiment of the third aspect of the present application provides an electronic device, including: a processor, and a memory communicatively connected to the processor;

[0020] The memory stores computer-executable instructions;

[0021] The processor executes the computer-executable instructions stored in the memory to implement the method described in the embodiment of the first aspect.

[0022] To achieve the above object, an embodiment of the fourth aspect of the present application provides a computer-readable storage medium, in which computer-executable instructions are stored, and when the computer-executable instructions are executed by a processor, they are used to implement the method described in the embodiment of the first aspect.

[0023] To achieve the above object, an embodiment of the fifth aspect of the present application provides a computer program product, including a computer program, and when the computer program is executed by a processor, it implements the method described in the embodiment of the first aspect.

[0024] The abnormal detection method, device and electronic device for the integrated busbar CCS provided by the present application build a simulation model of the CCS to obtain the first position data of the nickel sheet, use the first position data as a reference for the real data, coat the CCS with conductive fluorescent ink to obtain the processed target CCS, supply power to the target CCS, and thus determine the second position data of each light-emitting point. By comparing the second position data with the first position data used as a reference, the abnormal result of the CCS is determined, solving the problems in the prior art such as misjudgment of nickel sheet oxidation and resistance fluctuation through resistance detection, data confusion caused by small resistance differences between adjacent nickel sheets, and low detection efficiency when the amount of data is large. By using the optical signal of light instead of the resistance value information, the measurement method is more direct, effectively improving the accuracy of CCS abnormal detection.

[0025] The additional aspects and advantages of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present application. Description of the Drawings

[0026] The above and / or additional aspects and advantages of the present application will become apparent and easy to understand from the following description of embodiments in conjunction with the drawings, where:

[0027] Figure 1 It is a schematic flowchart of an abnormal detection method for an integrated busbar CCS provided by an embodiment of the present application;

[0028] Figure 2 It is a schematic structural diagram of a CCS provided by an embodiment of the present application;

[0029] Figure 3 It is a schematic flowchart of another abnormal detection method for an integrated busbar CCS provided by an embodiment of the present application;

[0030] Figure 4 It is a schematic structural diagram of an abnormal detection device for an integrated busbar CCS provided by an embodiment of the present application. Detailed Embodiments

[0031] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present application, and should not be construed as limiting the present application.

[0032] The following refers to the drawings to describe an abnormal detection method, device and electronic device for an integrated busbar CCS according to an embodiment of the present application.

[0033] Figure 1 It is a schematic flowchart of an abnormal detection method for an integrated busbar CCS provided by an embodiment of the present application. As Figure 1 shown, the method includes the following steps:

[0034] S101, construct a simulation model of the CCS to be detected, and obtain the first position data of the nickel sheets in the simulation model.

[0035] In some implementations, the simulation model is a model obtained by simulating and modeling the overall structure of the CCS, the distribution position of the nickel sheets, the fixing device, and other related component interfaces. For example Figure 2 the schematic structural diagram of the CCS shown; the method for establishing the simulation model can use common modeling tools such as Computer Aided Design (CAD), and will not be elaborated here.

[0036] Optionally, the coordinate information of the nickel sheet in the simulation model can be determined by using the built-in function of the simulation software to obtain the first position data; other measuring tools can also be used to measure the position of the nickel sheet in the simulation model to obtain the coordinate information of the nickel sheet in the CCS, so as to determine the first position data.

[0037] S102. Obtain the target CCS after being coated with conductive fluorescent ink.

[0038] It can be understood that the conductive fluorescent ink is a special material with conductivity and fluorescence characteristics. Coating the CCS with conductive fluorescent ink can visually determine whether there is a wrong path or an open circuit in the CCS based on the light-emitting position after power-on.

[0039] In this embodiment, the conductive fluorescent ink applied by layer-by-layer coating is used. The bottom layer is conductive silver paste, which can ensure electrical connection, and the surface layer is insulating fluorescent material, which ensures that it can emit light when powered on.

[0040] S103. Supply power to the target CCS to obtain the second position data of each light-emitting point after the target CCS is powered on.

[0041] Optionally, an appropriate voltage can be applied to the target CCS to activate the fluorescent material in the conductive fluorescent ink to make it emit light; it can be understood that the power supply voltage should be kept stable during the power supply process to avoid uneven light emission or flickering.

[0042] In some implementations, the target CCS can also be powered in regions. For example, each nickel sheet position is powered one by one, so as to observe whether each nickel sheet can emit light smoothly. At the same time, whether there are process defects such as false soldering of the nickel sheet can also be determined according to the light emission intensity.

[0043] Furthermore, an image detection device can be used to determine the light-emitting positions in the target CCS. The image detection device is, for example, a high-resolution camera or an optical sensor. After determining the light-emitting positions in the target CCS, the coordinate information of each light-emitting position is determined to obtain the second position data.

[0044] S104. Determine the abnormal result of the CCS according to the first position data and the second position data.

[0045] In some implementations, the matching degree between the first position data and the second position data can be determined, and the abnormal result reflecting whether there is an abnormality in the CCS can be obtained according to the matching degree.

[0046] It is understandable that the first position data is the position data of the nickel sheet in the actual simulation model, and the second position data is the coordinate data corresponding to the light-emitting position. The light-emitting position is the area where the CCS surface is aligned with the nickel sheet and the wire harness hole position, usually located at the intersection of the conductive coating or a specific design position. In this embodiment, the matching degree can be used to reflect the correspondence between the position data of the nickel sheet in the actual simulation model and the coordinate data corresponding to the light-emitting position at the corresponding position. The greater the matching degree, the more matching the position data of the nickel sheet in the actual simulation model and the coordinate data corresponding to the light-emitting position at the corresponding position, indicating that the position verification between the nickel sheet and the wire harness hole is successful. On the contrary, the smaller the matching degree, the less matching the position data of the nickel sheet in the actual simulation model and the coordinate data corresponding to the light-emitting position, indicating that the position verification between the nickel sheet and the wire harness hole is not successful, and it is determined that there is an abnormality in the CCS.

[0047] In this embodiment, the first position data of the nickel sheet is obtained by constructing a simulation model of the CCS. Taking the first position data as a reference for the real data, the CCS is coated with conductive fluorescent ink to obtain the processed target CCS. The target CCS is powered to determine the second position data of each light-emitting point. By comparing the second position data with the first position data used as a reference, the abnormal result of the CCS is determined, which can avoid the problems of misjudgment due to nickel sheet oxidation, resistance fluctuation, small difference in resistance between adjacent nickel sheets leading to data confusion, and low detection efficiency when the amount of data is large in the nickel sheet detection by resistance. Using the optical signal of light instead of the resistance value information, the measurement method is more direct, avoiding the risk of data error caused by interference items. It can also determine whether there is a process defect of false soldering of the nickel sheet through the light intensity, effectively improving the accuracy of CCS abnormality detection.

[0048] Figure 3 It is a schematic flow chart of another method for detecting abnormalities in an integrated busbar CCS provided by an embodiment of the present application. As Figure 3 shown, the method includes the following steps:

[0049] S301, construct a simulation model of the CCS to be detected, and obtain the first position data of the nickel sheet in the simulation model.

[0050] Optionally, the position of the nickel sheet in the simulation model can be measured based on a measuring instrument to obtain the first position data. In this embodiment, the measuring instrument can be a high-precision three-coordinate measuring instrument, and the coordinate error of the measuring horizontal X / vertical Y axis is ±0.01 mm.

[0051] In the embodiment of the present application, the implementation method of step S301 can be implemented in any one of the embodiments of the present disclosure, and no limitation is made here and no further description is given.

[0052] S302, obtain the target CCS after being coated with conductive fluorescent ink.

[0053] In the embodiments of the present application, the implementation method of step S302 can be implemented in any one of the embodiments of the present disclosure, and no limitation is made herein and will not be elaborated further.

[0054] S303. Obtain a mapping table between the wiring harness hole positions and the nickel plates, and divide the target CCS into different power supply areas according to the hole positions based on the mapping table.

[0055] Optionally, the mapping relationship between the wiring harness hole positions and the nickel plates can be determined according to the electrical connection relationship between the wiring harness hole positions and the nickel plates; based on the first position data of the nickel plates and the mapping relationship, a mapping table between the wiring harness hole positions and the nickel plates is constructed; wherein the electrical connection relationship between the wiring harness hole positions and the nickel plates refers to the physical connection in which the wiring harness realizes current transmission or signal transmission through the hole positions and the nickel plates, which can be determined based on the actual wiring in the CCS. Based on this electrical connection relationship, the nickel plate corresponding to each wiring harness hole position is determined, so as to form a one-to-one mapping relationship between the wiring harness hole positions and the nickel plates.

[0056] Furthermore, the first position data of each nickel plate can be used as the basis for constructing the mapping table. The mapping table can include the numbers of the wiring harness hole positions, the numbers of the nickel plates corresponding to the wiring harness hole positions determined according to the mapping relationship, and the first position data of the nickel plates, so as to obtain the mapping table between the wiring harness hole positions and the nickel plates. Based on this mapping table, the corresponding relationship between the wiring harness hole positions and the nickel plates can be quickly located, which is convenient for detection, maintenance and optimization.

[0057] Optionally, the format of the mapping table can be the JSON format. The JSON format is convenient for data exchange and parsing, and the mapping table can also be imported into the Manufacturing Execution System (MES). The MES system can efficiently read and process the topology mapping information.

[0058] In some implementations, the target CCS can be divided into multiple independent power supply areas according to the hole position distribution in the mapping table. Each power supply area includes a set of hole positions and their corresponding nickel plates and wiring harnesses. In this embodiment, each wiring harness hole position is used for division, that is, each hole position and its corresponding nickel plate and wiring harness are used as a power supply area, so as to obtain multiple power supply areas in the target CCS. The number of power supply areas is the same as the number of hole positions in the target CCS, so as to facilitate the detection of each hole position and ensure the reliability of the detection results.

[0059] S304. Sort in sequence according to the positions of the power supply areas to obtain a sorting result.

[0060] In some implementations, the sorting can be performed according to the physical positions of the power supply areas on the target CCS. For example, the power supply areas are sorted in the order from left to right and from top to bottom to obtain a sorting result.

[0061] S305, supply power to the power supply area of the target CCS in sequence according to the sorting result, and obtain the second position data of each light-emitting point after the target CCS is powered.

[0062] Supply power to the power supply area of the target CCS in sequence according to the sorting result. For example, design a dedicated segmented power supply program, and based on this segmented power supply program, supply power to the power supply area of the target CCS in sequence, so as to activate the conductive fluorescent ink material in the power supply area to emit light and obtain the light-emitting position.

[0063] Optionally, a vision detection unit such as a high-resolution camera or an optical sensor can be used to detect the light-emitting condition on the surface of the target CCS, receive the detection result of the vision detection unit, and the detection result at least includes the second position data of each light-emitting point, that is, detect the light-emitting points on the surface of the target CCS based on the vision detection unit, and determine and record the second position data of each light-emitting point.

[0064] S306, determine the abnormal result of the CCS according to the first position data and the second position data.

[0065] In some implementations, the similarity between the nickel sheet and the light-emitting point can be determined according to the first position data and the second position data; the matching result between the nickel sheet and the light-emitting point can be determined according to the similarity; that is, calculate the similarity between the first coordinate in the first position data and the second coordinate in the second position data, such as the Euclidean distance or the cosine similarity, and this similarity is used to reflect the position similarity between the nickel sheet and the light-emitting point. The higher the similarity, the more matching the nickel sheet and the light-emitting point are.

[0066] In this embodiment, the matching result is determined by a similarity threshold. If the similarity is greater than or equal to the similarity threshold, the matching result is determined to be a successful match. On the contrary, if the similarity is less than the similarity threshold, the matching result is determined to be a failed match; in response to the matching result indicating a successful match, it is determined that the CCS has no abnormality; correspondingly, if the matching result indicates a failed match, it means that the CCS has abnormal conditions such as nickel sheet offset, short circuit, open circuit or wrong path.

[0067] In some other implementations, the first position data and the second position data can also be input into a pre-trained recognition model, and a comparison result is output according to the recognition model; the position deviation information between the nickel sheet and the light-emitting point is determined according to the comparison result; that is, the pre-trained recognition model compares the first position data and the second position data to obtain a comparison result, and this comparison result reflects the position comparison information between the nickel sheet and the light-emitting point. The position deviation information between the nickel sheet and the light-emitting point is determined according to the comparison result. For example, data reflecting the position deviation such as the Euclidean distance or the angular deviation. The larger the position deviation information, the more the nickel sheet deviates from the hole position. When the position deviation information is less than a preset threshold, that is, when the deviation between the nickel sheet and the hole position is relatively small, it is determined that the CCS is normal; on the contrary, if the position deviation information is greater than or equal to the preset threshold, it means that the deviation between the nickel sheet and the hole position is large, and the CCS may have abnormal conditions such as nickel sheet offset, short circuit, open circuit or wrong path.

[0068] Furthermore, the detection data of each CSS can also be stored in the manufacturing execution system MES. The detection data at least includes the first position data, the second position data, the detection time and the detection abnormal result in the CSS. The detection abnormal result can include the fault code for each detection; that is, the data in the CCS detection process is stored in the MES system. The MES system collects the data and information in the production process in real time, and quickly responds to the changes in the production activities to ensure the continuity and stability of the production process, and supports the data traceability of the entire life cycle of the abnormal detection, realizing transparent and efficient data management.

[0069] In this embodiment, the first position data of the nickel sheet is obtained by constructing a simulation model of the CCS, the first position data is used as a reference for the real data, and a topological mapping relationship table between the nickel sheet and the wire harness hole positions is constructed based on the first position data to detect abnormal results with a more accurate mapping relationship; the CCS is subjected to a layered conductive fluorescent ink coating treatment to obtain the processed target CCS, the target CCS is divided into power supply areas based on the mapping table, each hole position is used as an independent power supply area for power supply testing, and the second position data of the light-emitting points is determined after the power supply testing. It is also possible to determine whether there are process defects such as false soldering of the nickel sheet based on the light-emitting intensity. The second position data is compared with the first position data used as a reference, and abnormal results such as wrong paths, short circuits, and open circuits in the CCS are determined through position deviation or position similarity. It is also possible to store the detection data of each CCS in the MES system to support data traceability throughout the life cycle of CCS detection. The abnormal detection based on optical signals has stronger anti-interference ability, greatly reducing the misjudgment rate. Through optical positioning and data mapping comparison for abnormal analysis, problems such as oxidation of the nickel sheet detected by resistance, misjudgment due to resistance fluctuation, small difference in resistance between adjacent nickel sheets leading to data confusion, and low detection efficiency when the amount of data is large are avoided. Using the optical signal of light emission instead of the resistance value information, the measurement method is more direct, and it is possible to realize the integrated diagnosis of four types of faults such as wrong paths, short circuits, open circuits, and process defects, improving the abnormal detection efficiency of the CCS.

[0070] To implement the above embodiment, the present application also proposes an abnormal detection device for an integrated busbar CCS.

[0071] Figure 4 FIG. is a schematic structural diagram of an abnormal detection device for an integrated busbar CCS provided by an embodiment of the present application. As Figure 4 shown, the abnormal detection device 400 for the integrated busbar CCS includes:

[0072] A first acquisition module 401, configured to construct a simulation model of the CCS to be detected and acquire the first position data of the nickel sheet in the simulation model;

[0073] A second acquisition module 402, configured to acquire the target CCS after the conductive fluorescent ink coating treatment;

[0074] A third acquisition module 403, configured to supply power to the target CCS to obtain the second position data of each light-emitting point after the target CCS is powered;

[0075] A detection module 404, configured to determine the abnormal result of the CCS according to the first position data and the second position data.

[0076] Further, in a possible implementation manner of the embodiment of the present application, the detection module 404 includes:

[0077] Determine the similarity between the nickel sheet and the light-emitting point according to the first position data and the second position data;

[0078] Determine the matching result between the nickel sheet and the light-emitting point according to the similarity;

[0079] In response to the matching result indicating successful matching, determine that the CCS is normal.

[0080] Further, in a possible implementation manner of the embodiment of the present application, the detection module 404 includes:

[0081] Input the first position data and the second position data into a pre-trained recognition model, and obtain a comparison result according to the recognition model;

[0082] Determine the position deviation information between the nickel sheet and the light-emitting point according to the comparison result;

[0083] In response to the position deviation information being less than a preset threshold, determine that the CCS is normal.

[0084] Further, in a possible implementation manner of the embodiment of the present application, the third acquisition module 403 includes:

[0085] Obtain a mapping table between the wire harness hole positions and the nickel sheet, and divide the target CCS into different power supply areas according to the hole positions based on the mapping table;

[0086] Sort in sequence according to the positions of the power supply areas to obtain a sorting result;

[0087] Supply power to the power supply areas of the target CCS in sequence according to the sorting result.

[0088] Further, in a possible implementation manner of the embodiment of the present application, the third acquisition module 403 includes:

[0089] Determine the mapping relationship between the wire harness hole positions and the nickel sheet according to the electrical connection relationship between the wire harness hole positions and the nickel sheet;

[0090] Based on the first position data of the nickel sheet and the mapping relationship, construct a mapping table between the wire harness hole positions and the nickel sheet.

[0091] Further, in a possible implementation manner of the embodiment of the present application, the first acquisition module 401 includes:

[0092] Measure the position of the nickel sheet in the simulation model based on a measuring instrument to obtain the first position data.

[0093] Further, in a possible implementation manner of the embodiment of the present application, the third acquisition module 403 includes:

[0094] Receive the detection results of the vision detection unit, where the detection results at least include the second position data of each light-emitting point.

[0095] Further, in a possible implementation manner of the embodiment of the present application, the device 400 further includes:

[0096] Store the detection data of each piece of CSS into the Manufacturing Execution System (MES), where the detection data at least includes the first position data, the second position data, the detection time, and the detection abnormal result in the CSS.

[0097] It should be noted that the foregoing explanation of the embodiment of the abnormal detection method for the integrated busbar CCS also applies to the abnormal detection device for the integrated busbar CCS in this embodiment, and will not be elaborated here.

[0098] In the embodiment of the present application, the first position data of the nickel sheet is obtained by constructing a simulation model of the CCS, and the first position data is used as a reference for the real data. Based on the first position data, a topological mapping relationship table between the nickel sheet and the wire harness hole positions is constructed, and the abnormal results are detected with a more accurate mapping relationship. The CCS is subjected to a layered conductive fluorescent ink coating process to obtain the processed target CCS. Based on the mapping table, the power supply area of the target CCS is divided, and each hole position is used as an independent power supply area for power supply testing. The second position data of the light-emitting points after the power supply test is determined. It is also possible to determine whether there are process defects such as false soldering of the nickel sheet by the light emission intensity. The second position data is compared with the first position data used as a reference, and whether there are abnormal results such as wrong circuits, short circuits, and open circuits in the CCS is determined by the position deviation or position similarity. It is also possible to store the detection data of each piece of CCS into the MES system to support the data traceability of the entire life cycle of CCS detection. The abnormal detection based on optical signals has stronger anti-interference ability, greatly reducing the misjudgment rate. Through optical positioning and data mapping comparison for abnormal analysis, it avoids the problems of nickel sheet oxidation, resistance fluctuation misjudgment, small resistance difference between adjacent nickel sheets leading to data confusion, and low detection efficiency when the amount of data is large. Using the optical signal of light emission instead of the resistance value information, the measurement method is more direct, and it can realize the integrated diagnosis of four types of faults, namely wrong circuits, short circuits, open circuits, and process defects, improving the abnormal detection efficiency of CCS.

[0099] To implement the above embodiments, the present application also proposes an electronic device, including: a processor, and a memory communicatively connected to the processor; the memory stores computer execution instructions; the processor executes the computer execution instructions stored in the memory to implement the method provided in the foregoing embodiments.

[0100] To implement the above embodiments, the present application also provides a computer-readable storage medium storing computer-executable instructions, which are used to implement the method provided by the foregoing embodiments when executed by a processor.

[0101] To implement the above embodiments, the present application also provides a computer program product including a computer program, which implements the method provided by the foregoing embodiments when executed by a processor.

[0102] The collection, storage, use, processing, transmission, provision, and disclosure of the user's personal information involved in the present application all comply with the provisions of relevant laws and regulations and do not violate public order and good customs.

[0103] It should be noted that personal information from users should be collected for legal and reasonable purposes and should not be shared or sold outside of these legitimate uses. In addition, such collection / sharing should be carried out after obtaining the informed consent of the user, including but not limited to notifying the user to read the user agreement / user notice and sign an agreement / authorization including authorizing relevant user information before the user uses the function. In addition, any necessary steps should be taken to protect and safeguard access to such personal information data and ensure that others with access to personal information data comply with their privacy policies and procedures.

[0104] The present application anticipates providing embodiments for users to selectively block the use or access of personal information data. That is, the present disclosure anticipates providing hardware and / or software to prevent or block access to such personal information data. Once personal information data is no longer needed, the risk can be minimized by restricting data collection and deleting the data. In addition, when applicable, personal identifiers are removed from such personal information to protect the privacy of users.

[0105] In the description of the foregoing embodiments, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0106] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present application, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0107] Any process or method description represented in a flowchart or described otherwise herein can be understood to represent a module, segment, or portion of code including one or more executable instructions for implementing a customized logical function or process. The scope of the preferred embodiments of the present application includes additional implementations, where functions may be executed in a substantially simultaneous manner or in a reverse order according to the functions involved, rather than in the order shown or discussed, which should be understood by those skilled in the art to which the embodiments of the present application pertain.

[0108] The logic and / or steps represented in a flowchart or described otherwise herein, for example, can be considered a sequenced list of executable instructions for implementing a logical function, and can be embodied specifically in any computer-readable medium for use by or in connection with an instruction execution system, apparatus, or device, such as a computer-based system, a system including a processor, or other systems that can fetch and execute instructions from the instruction execution system, apparatus, or device. For the purposes of this specification, a "computer-readable medium" can be any device that can contain, store, communicate, propagate, or transport a program for use by or in connection with an instruction execution system, apparatus, or device. More specific examples (a non-exhaustive list) of the computer-readable medium include the following: an electrical connection portion having one or more wirings (electronic device), a portable computer diskette (magnetic device), a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber device, and a portable compact disc read-only memory (CDROM). Additionally, the computer-readable medium can even be paper or other suitable media on which the program can be printed, as the program can be obtained electronically, for example, by optically scanning the paper or other media, followed by editing, interpretation, or otherwise processing as appropriate, and then storing it in a computer memory.

[0109] It should be understood that each part of the present application can be implemented by hardware, software, firmware, or a combination thereof. In the above embodiments, multiple steps or methods can be implemented by software or firmware stored in a memory and executed by a suitable instruction execution system. For example, if implemented by hardware, as in another embodiment, any one or a combination of the following techniques well known in the art can be used: discrete logic circuits with logic gate circuits for implementing logic functions on data signals, application specific integrated circuits with appropriate combinational logic gate circuits, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.

[0110] Those of ordinary skill in the art can understand that all or part of the steps carried by the method of implementing the above embodiments can be completed by instructing relevant hardware through a program. The said program can be stored in a computer-readable storage medium. When the program is executed, it includes one or a combination of the steps of the method embodiments.

[0111] In addition, in each embodiment of the present application, each functional unit can be integrated into a processing module, or each unit can exist physically alone, or two or more units can be integrated into one module. The above integrated module can be implemented in the form of hardware or in the form of a software functional module. When the above integrated module is implemented in the form of a software functional module and sold or used as an independent product, it can also be stored in a computer-readable storage medium.

[0112] The above-mentioned storage medium can be a read-only memory, a magnetic disk, an optical disc, etc. Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present application.

Claims

1. A method for detecting abnormality of an integrated busbar CCS, characterized in that: The method comprises: Constructing a simulation model of the CCS to be detected, and obtaining first position data of the nickel sheet in the simulation model; Obtaining a target CCS after the conductive fluorescent ink coating process; Powering the target CCS to obtain second position data of each light-emitting point after the target CCS is powered; An abnormal result of the CCS is determined according to the first position data and the second position data.

2. The abnormality detection method of the integrated busbar CCS according to claim 1 is characterized in that: The determining the abnormal result of the CCS according to the first position data and the second position data includes: Determine the similarity between the nickel sheet and the light-emitting point according to the first position data and the second position data; Determining the matching result between the nickel sheet and the luminous point according to the similarity; In response to the matching result indicating a successful match, it is determined that there is no abnormality in the CCS.

3. The abnormality detection method of the integrated busbar CCS according to claim 1 is characterized in that: The determining the abnormal result of the CCS according to the first position data and the second position data includes: Inputting the first position data and the second position data into a pre-trained recognition model, and outputting a comparison result according to the recognition model; Determine the position deviation information between the nickel sheet and the light-emitting point according to the comparison result; In response to the position deviation information being less than a preset threshold, it is determined that there is no abnormality in the CCS.

4. The abnormality detection method of the integrated busbar CCS according to any one of claims 1 to 3, characterized in that: The supplying power to the target CCS includes: Obtaining a mapping table between wiring harness hole positions and nickel sheets, and dividing the target CCS into different power supply areas according to the hole positions based on the mapping table; Sorting the power supply areas in sequence according to their locations to obtain a sorting result; Power is supplied to the power supply areas of the target CCS in sequence according to the sorting result.

5. The abnormality detection method of the integrated busbar CCS according to claim 4 is characterized in that: The obtaining of a mapping table between wiring harness hole positions and nickel sheets includes: Determine the mapping relationship between the wiring harness hole position and the nickel sheet according to the electrical connection relationship between the wiring harness hole position and the nickel sheet; Based on the first position data of the nickel sheet and the mapping relationship, a mapping table between the wiring harness hole positions and the nickel sheets is constructed.

6. The abnormality detection method of the integrated busbar CCS according to claim 5 is characterized in that: The obtaining of first position data of the nickel sheet in the simulation model comprises: The position of the nickel sheet in the simulation model is measured based on a measuring instrument to obtain the first position data.

7. The abnormality detection method of the integrated busbar CCS according to claim 1 is characterized in that: The step of supplying power to the target CCS to obtain second position data of each light-emitting point after the target CCS is supplied with power comprises: A detection result of the visual detection unit is received, wherein the detection result at least includes second position data of each light-emitting point.

8. The abnormality detection method of the integrated busbar CCS according to claim 1 is characterized in that: The method further comprises: The detection data of each piece of the CSS is stored in a manufacturing execution system MES, wherein the detection data at least includes first position data, second position data, detection time and detection abnormality result in the CSS.

9. An abnormality detection device for an integrated busbar CCS, characterized in that: The device comprises: A first acquisition module is used to construct a simulation model of the CCS to be detected and acquire first position data of the nickel sheet in the simulation model; The second acquisition module is used to acquire the target CCS after the conductive fluorescent ink coating process; A third acquisition module is used to power the target CCS and obtain second position data of each light-emitting point after the target CCS is powered; A detection module is used to determine an abnormal result of the CCS according to the first position data and the second position data.

10. An electronic device, characterized in that: include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the method according to any one of claims 1 to 8.

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