Ultrasonic module and ultrasonic mouse applied to same

Abstract

The invention relates to an ultrasonic module and an ultrasonic mouse applied to the ultrasonic module. The ultrasonic module comprises a substrate, an ultrasonic transmitting assembly and an ultrasonic receiving assembly. The substrate comprises a slot, the slot comprises a first side and a second side, and an acute included angle is formed between the first side and the second side. The ultrasonic transmitting assembly is arranged on the first side and generates an ultrasonic signal. And the ultrasonic receiving assembly is arranged on the second side and is used for receiving reflected waves of the ultrasonic signals after being reflected. In this way, the ultrasonic module can be applied to the mouse, the action path of the ultrasonic mouse is calculated by sensing ultrasonic reflection, and therefore the sensing problem of a traditional optical mouse can be solved, and the ultrasonic mouse is not affected by placed materials.

Description

Technical Field

[0001] This application relates to the field of sensing, and in particular to an ultrasonic module and an ultrasonic mouse applied thereto. Background Art

[0002] The mouse is a commonly used input device in computer applications at present. The mainstream mouse at the present stage is optical. Its operating principle is to collect the moving direction of the mouse on the surface of an object through an LED light source, in combination with a photoelectric sensor / or a small lens. Through a small image processing chip, the relative movement of the mouse on various surfaces is calculated according to the collected results, and then the movement signal is transmitted to the computer to generate the movement of the cursor on the screen.

[0003] However, optical mice are not sensitive to sensing on substances through which light can penetrate, such as glass, or on smooth surfaces, due to light penetration or scattering. Although there are currently ways to improve it with laser light sources, etc., the overall cost is much higher than that of traditional LED lighting. Summary of the Invention

[0004] With the recent gradual maturity of ultrasonic sensor technology, the sensing distance can be significantly shortened, and at the same time, the cost can also be significantly reduced. The purpose of this application is to replace traditional optical sensing with ultrasonic waves and can be applied to various interfaces.

[0005] To solve the problems faced by the prior art, an ultrasonic module is provided herein. In some embodiments, the ultrasonic module includes a substrate, an ultrasonic transmitting component, and an ultrasonic receiving component. The substrate includes a slot, and the slot includes a first side and a second side, with an acute angle between the first side and the second side. The ultrasonic transmitting component is disposed on the first side and generates an ultrasonic signal. The ultrasonic receiving component is disposed on the second side and receives the reflected wave of the ultrasonic signal after reflection.

[0006] In some embodiments, the ultrasonic module further includes a baffle plate, and the baffle plate is disposed in the slot and located between the ultrasonic transmitting component and the ultrasonic receiving component.

[0007] In some embodiments, the substrate is a semiconductor substrate or a ceramic substrate.

[0008] In some embodiments, the ultrasonic transmitting component includes one or more ultrasonic transmitters.

[0009] In some embodiments, the ultrasonic receiving component includes one or more ultrasonic receivers.

[0010] Here, an ultrasonic mouse is also provided. In some embodiments, the ultrasonic mouse includes an ultrasonic module, a housing, and a microprocessor. The ultrasonic module includes a substrate, an ultrasonic transmitting component, and an ultrasonic receiving component. The substrate includes a slot, and the slot includes a first side and a second side, with an acute angle between the first side and the second side. The ultrasonic transmitting component is disposed on the first side and generates ultrasonic signals, and the ultrasonic receiving component is disposed on the second side and receives the reflected waves of the ultrasonic signals after reflection. The housing includes an opening that exposes the ultrasonic transmitting component and the ultrasonic receiving component. The microprocessor is located in the housing and is electrically connected to the ultrasonic transmitting component and the ultrasonic receiving component. When the ultrasonic mouse moves, the ultrasonic receiving component generates a received signal according to the reflection angle of the ultrasonic signal, and the microprocessor generates and emits a displacement signal according to the change of the received signal.

[0011] In some embodiments, the ultrasonic module further includes a baffle plate, and the baffle plate is disposed in the slot and located between the ultrasonic transmitting component and the ultrasonic receiving component.

[0012] In some embodiments, the substrate is a semiconductor substrate or a ceramic substrate.

[0013] In some embodiments, the ultrasonic transmitting component includes one or more ultrasonic transmitters.

[0014] In some embodiments, the ultrasonic receiving component includes one or more ultrasonic receivers.

[0015] As shown in the foregoing embodiments, the ultrasonic module can be applied to an ultrasonic mouse, and by sensing the reflection of ultrasonic waves, the movement path of the ultrasonic mouse can be calculated. In this way, the sensing problem of traditional optical mice can be solved, and it is not affected by the materials on which it is placed. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 Is an exploded view of an embodiment of an ultrasonic mouse.

[0017] Figure 2 Is a block diagram of an embodiment of an ultrasonic mouse.

[0018] Figure 3 Is a perspective view of a first embodiment of an ultrasonic module.

[0019] Figure 4 Is a perspective view of a second embodiment of an ultrasonic module.

[0020] Figure 5 Is a perspective view of a third embodiment of an ultrasonic module.

[0021] Figure 6 Is a perspective view of a fourth embodiment of an ultrasonic module.

[0022] Description of the reference numerals:

[0023] 1: Ultrasonic mouse;

[0024] 10: Ultrasonic module;

[0025] 11: Substrate;

[0026] 110: Groove;

[0027] 111: First side;

[0028] 113: Second side;

[0029] 13: Ultrasonic emission component;

[0030] 131: Ultrasonic transmitter;

[0031] 15: Ultrasonic reception component;

[0032] 151: Ultrasonic receiver;

[0033] 17: Baffle;

[0034] 20: Housing;

[0035] 21: Opening;

[0036] 30: Microprocessor;

[0037] 40: Circuit board;

[0038] C: Received signal;

[0039] E: Actuation signal;

[0040] M: Displacement signal;

[0041] R: Reflection wave;

[0042] U: Ultrasonic signal. Detailed implementation manners

[0043] It should be understood that when a component is referred to as being "disposed" on another component, it may mean that the component is directly on the other component, or there may be an intermediate component connecting the component to the other component. Conversely, when a component is referred to as being "directly disposed on another component" or "directly disposed onto another component", it can be understood that there is no intermediate component defined at this time.

[0044] Additionally, terms such as "first", "second", and "third" are only used to distinguish one component, part, region, layer, or section from another, rather than indicating an inherent order. Moreover, relative terms such as "lower" and "upper" may be used herein to describe the relationship between one component and another. It should be understood that relative terms are intended to encompass different orientations of the device in addition to the orientations shown in the figures. For example, if the device in one figure is flipped, a component described as being on the "lower" side of another component will be oriented on the "upper" side of the other component. This only represents a relative orientation relationship, not an absolute orientation relationship.

[0045] Figure 1 Exploded view of an embodiment of an ultrasonic mouse. Figure 2 Block diagram of an embodiment of an ultrasonic mouse. Figure 3 Stereogram of an embodiment of an ultrasonic module. As Figures 1 to 3 As shown, in some embodiments, the ultrasonic mouse 1 includes an ultrasonic module 10, a housing 20, and a microprocessor 30. The ultrasonic module 10 includes a substrate 11, an ultrasonic transmitting component 13, and an ultrasonic receiving component 15. The substrate 11 includes a slot 110, and the slot 110 includes a first side 111 and a second side 113, with an acute angle between the first side 111 and the second side 113. Here, the substrate 11 is a semiconductor substrate or a ceramic substrate.

[0046] Here, the ultrasonic module 10 and the microprocessor 30 can be electrically connected to each other through a circuit board 40 and installed in the housing 20 as an integrated module. The housing 20 can be assembled and has a receiving space for accommodating the ultrasonic module 10, the microprocessor 30, and the circuit board 40. The microprocessor 30 is electrically connected to the ultrasonic transmitting component 13 and the ultrasonic receiving component 15, generates an actuation signal E to actuate the ultrasonic transmitting component 13 to emit an ultrasonic signal U. The housing 20 includes an opening 21, exposing the ultrasonic transmitting component 13 and the ultrasonic receiving component 15 for sensing.

[0047] Referring again to Figure 2 and Figure 3 , the ultrasonic transmitting component 13 is disposed on the first side 111 to generate an ultrasonic signal U, and the ultrasonic receiving component 15 is disposed on the second side 113 to receive a reflected wave R of the ultrasonic signal U after reflection. For example, the reflected wave R reflected by the desktop. Here, when the ultrasonic mouse 1 moves, the ultrasonic receiving component 15 generates a received signal C according to the reflection angle of the ultrasonic signal U, and the microprocessor 30 generates and emits a displacement signal M according to the change of the received signal C.

[0048] Referring again to Figure 3 , as Figure 3As shown in the figure, the ultrasonic module 10 further includes a baffle 17, which is disposed in the slot 110 and located between the ultrasonic transmitting component 13 and the ultrasonic receiving component 15. In this way, it can prevent the ultrasonic receiving component 15 from receiving the ultrasonic signal U directly generated by the ultrasonic transmitting component 13, thus avoiding interference with the reflected wave R.

[0049] Figure 4 It is a perspective view of the second embodiment of the ultrasonic module. Figure 5 It is a perspective view of the third embodiment of the ultrasonic module. Figure 6 It is a perspective view of the fourth embodiment of the ultrasonic module. As Figure 4 As shown in the figure, in the ultrasonic module 10 of the second embodiment, the ultrasonic transmitting component 13 is composed of a plurality of ultrasonic transmitters 131, and the ultrasonic receiving component 15 is a single ultrasonic receiver 151. That is, the second embodiment presents a one-to-many transmission / reception mode. As Figure 5 As shown in the figure, in the ultrasonic module 10 of the second embodiment, the ultrasonic transmitting component 13 is a single ultrasonic transmitter 131, and the ultrasonic receiving component 15 is composed of a plurality of ultrasonic receivers 151. That is, the third embodiment presents a many-to-one transmission / reception mode. As Figure 6 As shown in the figure, in the ultrasonic module 10 of the fourth embodiment, the ultrasonic transmitting component 13 is composed of a plurality of ultrasonic transmitters 131, and the ultrasonic receiving component 15 is also composed of a plurality of ultrasonic receivers 151. That is, the fourth embodiment presents a many-to-many transmission / reception mode.

[0050] The above are only examples and are not intended to limit. The actual number and arrangement of the ultrasonic transmitters 131 and the ultrasonic receivers 151 can vary according to actual specifications. The ultrasonic transmitters 131 and the ultrasonic receivers 151 can be implemented by piezoelectric micromachined ultrasonic transducers (PMUT). The microprocessor 30 can calculate using the reflection angle of the reflected wave R, or can be assisted by the ultrasonic receiver 151 that receives the reflected wave R to judge, calculate the displacement signal M for the computer, and generate corresponding mouse movement.

[0051] In summary, the ultrasonic module 10 can be applied to the ultrasonic mouse 1. By sensing the ultrasonic reflection, the movement path of the ultrasonic mouse 1 can be calculated. In this way, the sensing problem of traditional optical mice can be solved, and it is not affected by the placed material.

[0052] Although the technical content of this application has been disclosed above in the preferred embodiments, it is not intended to limit this application. Any person skilled in this art, without departing from the spirit of this application, making some modifications and refinements should be covered within the scope of this application. Therefore, the protection scope of this application shall be subject to that defined by the appended patent application scope.

Claims

1. An ultrasonic module, characterized in that, Comprising: A substrate comprising a slot, the slot comprising a first side and a second side, an acute angle being formed between the first side and the second side; An ultrasonic transmitting component disposed on the first side for generating an ultrasonic signal; and An ultrasonic receiving component disposed on the second side for receiving a reflected wave of the ultrasonic signal after reflection.

2. The ultrasonic module according to claim 1, wherein, It further comprises a baffle disposed in the slot and located between the ultrasonic transmitting component and the ultrasonic receiving component.

3. The ultrasonic module according to claim 1, characterized in that, The substrate is a semiconductor substrate or a ceramic substrate.

4. The ultrasonic module according to claim 1, wherein, The ultrasonic transmitting component comprises one or more ultrasonic transmitters.

5. The ultrasonic module according to claim 4, wherein, The ultrasonic receiving component comprises one or more ultrasonic receivers.

6. An ultrasonic mouse, characterized in that, Comprising: An ultrasonic module comprising a substrate, an ultrasonic transmitting component, and an ultrasonic receiving component, wherein the substrate comprises a slot, the slot comprising a first side and a second side, an acute angle being formed between the first side and the second side, the ultrasonic transmitting component being disposed on the first side for generating an ultrasonic signal, and the ultrasonic receiving component being disposed on the second side for receiving a reflected wave of the ultrasonic signal after reflection; A housing comprising an opening exposing the ultrasonic transmitting component and the ultrasonic receiving component; and A microprocessor located in the housing and electrically connected to the ultrasonic transmitting component and the ultrasonic receiving component, wherein when the ultrasonic mouse moves, the ultrasonic receiving component generates a received signal according to the reflection angle of the ultrasonic signal, and the microprocessor generates and emits a displacement signal according to the change of the received signal.

7. The ultrasonic mouse according to claim 6, wherein It further comprises a baffle disposed in the slot and located between the ultrasonic transmitting component and the ultrasonic receiving component.

8. The ultrasonic mouse according to claim 6, characterized in that, The substrate is a semiconductor substrate or a ceramic substrate.

9. The ultrasonic mouse according to claim 6, characterized in that, The ultrasonic transmitting component comprises one or more ultrasonic transmitters.

10. The ultrasonic mouse according to claim 9, wherein, The ultrasonic receiving component comprises one or more ultrasonic receivers.

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