Packaging film, photoelectric device and preparation method thereof

Abstract

The invention discloses a packaging film, a photoelectric device and a preparation method thereof, and relates to the technical field of photoelectric devices. The packaging film comprises an interpenetrating network polymer. The interpenetrating network polymer is used as the packaging film, and the interpenetrating network polymer has high transparency, hydrophobicity, good mechanical properties, thermal stability, corrosion resistance, solvent resistance and the like, so that the problems of poor high temperature resistance and high brittleness of an existing film packaging structure are solved, and the water and oxygen resistance of the packaging film is also improved.

Description

Technical Field

[0001] The present application relates to the technical field of optoelectronic devices, and particularly to a packaging film, an optoelectronic device and a preparation method thereof. Background Art

[0002] Optoelectronic devices are semiconductor optoelectronic devices based on organic or inorganic materials, and have wide applications in the fields of new energy, sensing, communication, display, lighting, etc., such as solar cells, photodetectors, OLED / QLED.

[0003] A large number of studies have shown that optoelectronic devices are extremely sensitive to water and oxygen, and exposure to a water and oxygen environment will greatly affect the device performance. Therefore, optoelectronic devices need to be packaged in practical applications to ensure that the devices have a long service life. The current optoelectronic device packaging technologies mainly include hard substrate packaging and thin film packaging. Among them, although hard substrate packaging can effectively slow down the erosion of water and oxygen on the device, the hard substrate generally uses a rigid cover plate, which is not suitable for large-scale production. In addition, its impact resistance and bending resistance are poor; thin film packaging can achieve a good packaging effect on the device, but the thin film is generally composed of an inorganic barrier layer and an organic packaging layer overlapping and repeating. The organic packaging layer is generally a polymer layer, which can cover the defects on the surface of the inorganic barrier layer, but its high temperature resistance is poor, and the water and oxygen permeability of the material itself is relatively large. Although the inorganic barrier layer has excellent water and oxygen barrier performance, its brittleness, thermoelasticity performance, and hydrophilic surface defects also limit its application.

[0004] The thin film packaging structure of the prior art has problems of poor high temperature resistance, large brittleness and hydrophilic surface. Summary of the Invention

[0005] In view of this, the present application provides a packaging film, aiming to improve the problems of poor high temperature resistance, large brittleness and hydrophilic surface existing in the existing thin film packaging structure.

[0006] The embodiment of the present application is implemented as follows. A packaging film includes an interpenetrating network polymer.

[0007] Optionally, in some embodiments of the present application, the interpenetrating network polymer includes an acrylate polymer and a linear polymer.

[0008] Optionally, in some embodiments of the present application, the interpenetrating network polymer is formed by the interpenetration of the networks obtained by crosslinking an acrylate polymer and a linear polymer respectively.

[0009] Optionally, in some embodiments of the present application, the acrylate polymer includes polymethyl methacrylate; and / or

[0010] The linear polymer includes one or more of polyvinyl alcohol, polyacrylic acid, polysiloxane, and polyurethane; and / or

[0011] The thickness of the encapsulation film is 50 μm to 1000 μm.

[0012] Optionally, in some embodiments of the present application, the encapsulation film further includes a repair agent, and the repair agent includes one or more of an oligomer of an acrylate polymer, an oligomer of a linear polymer, a first compound, and a second compound. Among them, the first compound includes a fluorinated alkane, and the second compound includes a catecholamine compound.

[0013] Optionally, in some embodiments of the present application, the molecular weights of the oligomer of the acrylate polymer and the oligomer of the linear polymer are each independently 100 to 500; and / or

[0014] The carbon chain length of the fluorinated alkane is 6 to 12; and / or

[0015] The catecholamine compound includes a compound containing both a catechol group and an amine group.

[0016] Optionally, in some embodiments of the present application, the oligomer of the acrylate polymer includes an oligomer of polymethyl methacrylate; and / or

[0017] The oligomer of the linear polymer includes one or more of an oligomer of polyvinyl alcohol, an oligomer of polyacrylic acid, an oligomer of polysiloxane, and an oligomer of polyurethane; and / or

[0018] The fluorinated alkane includes one or more of perfluorohexylethane, perfluorohexane, and 1-fluoroheptane; and / or

[0019] The compound containing both a catechol group and an amine group includes one or more of dopamine, 1-(3,4-dihydroxyphenyl)-2-aminoethanol, or (R)-4-[(2-(methylamino)-1-hydroxyethyl]-1,2-benzenediol.

[0020] Optionally, in some embodiments of the present application, the total mass of the acrylate polymer in the interpenetrating network polymer and the oligomer of the acrylate polymer in the repair agent is a first mass, and the total mass of the linear polymer in the interpenetrating network polymer and the oligomer of the linear polymer in the repair agent is a second mass. The mass ratio of the first mass to the second mass is 2:1 to 50:1; and / or

[0021] The mass ratio of the first mass to the first compound is 50:1 to 200:1; and / or

[0022] The mass ratio of the first quality to the mass of the second compound is 100:1 to 500:1.

[0023] Correspondingly, an embodiment of the present application further provides a method for preparing an encapsulation film, including:

[0024] Providing a mixed solution, the mixed solution includes an oligomer of an acrylate polymer and an oligomer of a linear polymer;

[0025] Depositing the mixed solution, followed by a first heat treatment, to form an interpenetrating network polymer, and obtaining an encapsulation film.

[0026] Optionally, in some embodiments of the present application, a second heat treatment is further included between providing the mixed solution and depositing the mixed solution, the temperature of the second heat treatment is 40 to 80 °C, and the time is 5 to 30 min.

[0027] Optionally, in some embodiments of the present application, the encapsulation film further includes a repair agent, the repair agent includes one or more of an unreacted oligomer of an acrylate polymer, an unreacted oligomer of a linear polymer, a first compound, and a second compound, wherein the first compound includes an F - substituted alkane, and the second compound includes a compound containing both a catechol group and an amino group.

[0028] Optionally, in some embodiments of the present application, the oligomer of the acrylate polymer includes an oligomer of polymethyl methacrylate, and the molecular weight of the oligomer of polymethyl methacrylate is 100 to 500; and / or

[0029] The oligomer of the linear polymer includes one or more of an oligomer of polyvinyl alcohol, an oligomer of polyacrylic acid, an oligomer of polysiloxane, and an oligomer of polyurethane, and the molecular weights of the oligomer of polyvinyl alcohol, the oligomer of polyacrylic acid, the oligomer of polysiloxane, and the oligomer of polyurethane are each independently 100 to 500; and / or

[0030] The carbon chain length of the F - substituted alkane is 6 to 12; and / or

[0031] The F - substituted alkane includes one or more of perfluorohexylethane, perfluorohexane, and 1 - fluoroheptane; and / or

[0032] The compound containing both a catechol group and an amino group includes one or more of dopamine, 1 - (3,4 - dihydroxyphenyl) - 2 - aminoethanol, or (R) - 4 - [(2 - (methylamino) - 1 - hydroxyethyl] - 1,2 - benzenediol.

[0033] Optionally, in some embodiments of the present application, the mass ratio of the oligomer of the acrylate polymer to the oligomer of the linear polymer is 2:1 to 50:1; and / or

[0034] The mass ratio of the oligomer of the acrylate polymer to the first compound is 50:1 to 200:1; and / or

[0035] The mass ratio of the oligomer of the acrylate polymer to the second compound is 100:1 to 500:1.

[0036] Optionally, in some embodiments of the present application, the temperature of the first heat treatment is 60 to 150 °C, and the time is 5 to 120 min.

[0037] Correspondingly, an embodiment of the present application further provides an optoelectronic device, which includes: an optoelectronic device and an encapsulation film disposed on the optoelectronic device, wherein the encapsulation film includes an interpenetrating network polymer.

[0038] Correspondingly, an embodiment of the present application further provides a method for preparing an optoelectronic device, including:

[0039] Providing an optoelectronic device;

[0040] Preparing an encapsulation film on the optoelectronic device, and the encapsulation film includes an interpenetrating network polymer.

[0041] In the present application, the interpenetrating network polymer is used as the encapsulation film. Since the interpenetrating network polymer has properties such as high transparency, hydrophobicity, good mechanical properties, thermal stability, corrosion resistance, and solvent resistance, the problems of poor high-temperature resistance and large brittleness of the existing thin-film encapsulation structure are improved, and the water and oxygen resistance of the encapsulation film is also improved. Description of the Drawings

[0042] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0043] Figure 1 is a flowchart of a method for preparing an encapsulation film of the present application. Detailed Embodiments

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application. In addition, it should be understood that the specific implementation manners described herein are only used to illustrate and explain the present application, and are not used to limit the present application.

[0045] In the present application, unless otherwise stated, the orientation terms such as "upper" and "lower" generally refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the accompanying drawings; while "inner" and "outer" refer to the outline of the device. In addition, in the description of the present application, the term "including" means "including but not limited to". The terms first, second, third, etc. are only used as labels, and no numerical requirements are imposed or an order is established.

[0046] In the present application, "and / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. Where A and B can be singular or plural.

[0047] In the present application, "at least one" means one or more, and "a plurality" means two or more. "One or several", "at least one (item) below" or similar expressions refer to any combination of these items, including any combination of single (item) or plural items. For example, "at least one (item) of a, b, or c", or, "at least one (item) of a, b, and c" can both represent: a, b, c, a - b (i.e., a and b), a - c, b - c, or a - b - c, where a, b, and c can be single or multiple respectively.

[0048] The various embodiments of the present application may exist in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be construed as a rigid limitation on the scope of the present application; therefore, it should be considered that the described range description has specifically disclosed all possible sub - ranges and single values within that range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub - ranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and single numbers within that range, such as 1, 2, 3, 4, 5, and 6, regardless of what the range is. In addition, whenever a numerical range is indicated herein, it means including any cited number (fraction or integer) within the indicated range.

[0049] The technical solution of the present application is as follows:

[0050] In a first aspect, an embodiment of the present application provides a packaging film, and the packaging film includes an interpenetrating network polymer.

[0051] In the present application, the interpenetrating network polymer is used as the packaging film. Since the interpenetrating network polymer has properties such as high transparency, hydrophobicity, good mechanical properties, thermal stability, corrosion resistance, and solvent resistance, the problems of poor high-temperature resistance and high brittleness of the existing thin-film packaging structure are improved, and the water and oxygen resistance of the packaging film is also enhanced.

[0052] In some embodiments, the interpenetrating network polymer includes an acrylate polymer and a linear polymer.

[0053] In some embodiments, the interpenetrating network polymer is formed by the interpenetration of the networks obtained by crosslinking the acrylate polymer and the linear polymer respectively.

[0054] In some embodiments, in the interpenetrating network polymer, the content of the acrylate polymer is greater than that of the linear polymer.

[0055] It can be understood that the majority of the acrylate polymer can effectively ensure the high transparency and hydrophobicity of the packaging film, and the performance of the packaging film is enhanced by introducing a small amount of linear polymer.

[0056] In some embodiments, the acrylate polymer includes polymethyl methacrylate.

[0057] In some embodiments, the linear polymer includes one or more of polyvinyl alcohol, polyacrylic acid, polysiloxane, and polyurethane.

[0058] In some embodiments, the thickness of the packaging film is 50um to 1000um. For example, 50um, 60um, 70um, 90um, 120um, 150um, 180um, 190um, 200um, 205um, 210um, 215um, 220um, 230um, 240um, 250um, 260um, 270um, 280um, 290um, 300um, 350um, 380um, 400um, 420um, 450um, 480um, 500um, 520um, 550um, 580um, 600um, 640um, 650um, 700um, 750um, 800um, 850um, 900um, 950um, 1000um, etc. The packaging effect is the best within this thickness range, and the light transmittance is also good.

[0059] In some embodiments, the encapsulation film further includes a repair agent, and the repair agent includes one or more of an acrylate polymer oligomer, a linear polymer oligomer, a first compound, and a second compound, wherein the first compound includes a fluorinated alkane and the second compound includes a catecholamine compound.

[0060] It can be understood that the acrylate polymer oligomer and the linear polymer oligomer in the repair agent exist in the encapsulation film and are oligomers that did not crosslink during the preparation process. Since their surface energy is relatively low, they will actively migrate to the damaged area to reconstruct the interpenetrating network polymer for self-repair.

[0061] It can be understood that when preparing the encapsulation film, acrylate polymer oligomers and linear polymer oligomers are provided. During the preparation, most of the oligomers crosslinked to form an interpenetrating network polymer, while a small amount of oligomers did not crosslink and still exist in the form of oligomers in the encapsulation film.

[0062] It can be understood that due to the relatively low surface energy of the fluorinated alkane, it will spontaneously migrate outside the encapsulation film and can also migrate to the damaged area. While improving its hydrophobicity, it can make the self-repaired part also have high hydrophobicity.

[0063] It can be understood that due to the strong interaction between the catechol group and the amine group, small molecule compounds containing catechol groups and amine groups can polymerize to achieve a strong adhesion effect, thereby increasing the viscosity with other media, enabling the encapsulation film to better adhere to the optoelectronic device. At the same time, due to the polyhydroxy structure on the catechol group during its self-repair, the repaired position can have better strength.

[0064] In some embodiments, the molecular weight of the acrylate polymer oligomer is 100 - 500, for example, 100, 150, 200, 250, 300, 350, 400, 450, 500, etc. Within this molecular weight range, first, the networks obtained by crosslinking the acrylate polymer oligomer and the linear polymer oligomer with each other interpenetrate to form an interpenetrating network polymer. Second, the unreacted acrylate polymer oligomer will actively migrate to the damaged area due to its relatively low surface energy to reconstruct the interpenetrating network polymer for self-repair.

[0065] In some embodiments, the oligomers of the linear polymer have a molecular weight of 100 to 500, for example, 100, 150, 200, 250, 300, 350, 400, 450, 500, etc. Within this molecular weight range, first, the networks obtained after crosslinking the oligomers of the acrylate polymer and the oligomers of the linear polymer interpenetrate with each other to form an interpenetrating network polymer. Second, the oligomers of the unreacted polyvinyl alcohol, the oligomers of the polyacrylic acid, the oligomers of the polysiloxane, or the oligomers of the polyurethane have a relatively low surface energy, so they will actively migrate to the damaged area and reconstruct the interpenetrating network polymer for self-repair.

[0066] In some embodiments, the oligomers of the acrylate polymer include oligomers of polymethyl methacrylate.

[0067] In some embodiments, the oligomers of the linear polymer include one or more of oligomers of polyvinyl alcohol, oligomers of polyacrylic acid, oligomers of polysiloxane, and oligomers of polyurethane.

[0068] In some embodiments, the carbon chain length of the F - alkane is 6 to 12, for example, 6, 7, 8, 9, 10, 11, 12, etc. Within this length range, the F - alkane will spontaneously migrate out of the encapsulation film and can also migrate to the damaged area.

[0069] In some embodiments, the F - alkane includes one or more of perfluorohexylethane, perfluorohexane, and 1 - fluoroheptane.

[0070] In some embodiments, the catecholamine compounds include compounds containing both a catechol group and an amine group.

[0071] In some embodiments, the compounds containing both a catechol group and an amine group include one or more of dopamine, 1-(3,4 - dihydroxyphenyl)-2 - aminoethanol, or (R)-4-(2-(methylamino)-1 - hydroxyethyl]-1,2 - benzenediol.

[0072] In some embodiments, the total mass of the acrylate polymer in the interpenetrating network polymer and the oligomer of the acrylate polymer in the repair agent is the first mass, and the total mass of the linear polymer in the interpenetrating network polymer and the oligomer of the linear polymer in the repair agent is the second mass. The mass ratio of the first mass to the second mass is 2:1 to 50:1. For example, 2:1, 3:1, 5:1, 7:1, 9:1, 10:1, 12:1, 15:1, 18:1, 19:1, 20:1, 21:1, 23:1, 25:1, 26:1, 28:1, 29:1, 30:1, 31:1, 33:1, 34:1, 36:1, 38:1, 40:1, 41:1, 43:1, 45:1, 46:1, 48:1, 49:1, 50:1, etc. Within this mass ratio range, the good mechanical properties, thermal stability, corrosion resistance, solvent resistance, etc. of the encapsulation structure can be effectively ensured. In addition, the water and oxygen resistance of the encapsulation structure can be improved.

[0073] In some embodiments, the total mass of the acrylate polymer in the interpenetrating network polymer and the oligomer of the acrylate polymer in the repair agent is the first mass, and the mass ratio of the first mass to the mass of the first compound is 50:1 to 200:1. For example, 50:1, 55:1, 60:1, 65:1, 70:1, 80:1, 85:1, 90:1, 96:1, 100:1, 105:1, 110:1, 112:1, 115:1, 118:1, 120:1, 125:1, 130:1, 135:1, 140:1, 145:1, 150:1, 155:1, 160:1, 165:1, 170:1, 175:1, 180:1, 185:1, 190:1, 195:1, 200:1, etc. Within this mass ratio range, the hydrophobicity of the encapsulation structure and the hydrophobicity of the self-repairing part can be further improved.

[0074] In some embodiments, the total mass of the acrylate polymer in the interpenetrating network polymer and the oligomer of the acrylate polymer in the repair agent is the first mass, and the mass ratio of the first mass to the mass of the second compound is 100:1 to 500:1. For example, 100:1, 110:1, 120:1, 130:1, 140:1, 150:1, 160:1, 170:1, 180:1, 190:1, 200:1, 210:1, 220:1, 230:1, 240:1, 250:1, 260:1, 270:1, 280:1, 290:1, 300:1, 310:1, 320:1, 330:1, 340:1, 350:1, 360:1, 370:1, 380:1, 390:1, 400:1, 410:1, 420:1, 430:1, 440:1, 450:1, 460:1, 470:1, 480:1, 490:1, 500:1, etc. Within this mass ratio range, the encapsulation structure can be better combined with the optoelectronic device, and at the same time, the repaired position can have better strength.

[0075] In a second aspect, in some embodiments, please refer to Figure 1 , the embodiment of the present application provides a method for preparing an encapsulation structure, including:

[0076] S011. Provide a mixed solution, where the mixed solution includes an oligomer of an acrylate polymer and an oligomer of a linear polymer;

[0077] S012. Deposit the mixed solution and then perform a first heat treatment to form an interpenetrating network polymer and obtain an encapsulation film.

[0078] In some embodiments, a second heat treatment is further included between providing the mixed solution and depositing the mixed solution. The temperature of the second heat treatment is 40 to 80 °C, for example, 40 °C, 50 °C, 60 °C, 70 °C, 80 °C, etc., and the time is 5 to 30 min, for example, 5 min, 8 min, 10 min, 15 min, 18 min, 20 min, 22 min, 25 min, 28 min, 30 min, etc. Within this temperature and time range, the oligomers of the acrylate polymer and the linear polymer in the mixed solution can be preliminarily cross-linked, and then spraying can be performed to avoid affecting the electrodes and devices.

[0079] In step S011:

[0080] In some embodiments, the encapsulation film further comprises a repair agent, and the repair agent comprises one or more of an oligomer of an unreacted acrylate polymer, an oligomer of an unreacted linear polymer, a first compound, and a second compound, wherein the first compound comprises an F - substituted alkane, and the second compound comprises a compound containing both a catechol group and an amino group.

[0081] It can be understood that the oligomer of the unreacted acrylate polymer in the preparation method of the repair agent is the same as the oligomer of the acrylate polymer in the repair agent of the encapsulation film product; the oligomer of the unreacted linear polymer in the preparation method of the repair agent is the same as the oligomer of the linear polymer in the repair agent of the encapsulation film product.

[0082] In some embodiments, the oligomer of the acrylate polymer comprises an oligomer of polymethyl methacrylate, and the molecular weight of the oligomer of polymethyl methacrylate is 100 - 500, for example, 100, 150, 200, 250, 300, 350, 400, 450, 500, etc. Within this molecular weight range, first, the networks obtained after cross - linking of the oligomer of polymethyl methacrylate and the oligomer of the linear polymer interpenetrate to form an interpenetrating network polymer. Second, since the oligomer of unreacted polymethyl methacrylate has a relatively low surface energy, it will actively migrate to the damaged area and reconstruct the interpenetrating network polymer for self - repair.

[0083] The oligomer of the linear polymer comprises one or more of an oligomer of polyvinyl alcohol, an oligomer of polyacrylic acid, an oligomer of polysiloxane, and an oligomer of polyurethane. The molecular weights of the oligomer of polyvinyl alcohol, the oligomer of polyacrylic acid, the oligomer of polysiloxane, and the oligomer of polyurethane are each independently 100 - 500, for example, 100, 150, 200, 250, 300, 350, 400, 450, 500, etc. Within this molecular weight range, within this molecular weight range, first, the networks obtained after cross - linking of the oligomer of polymethyl methacrylate and the oligomer of the linear polymer interpenetrate to form an interpenetrating network polymer. Second, the oligomers of unreacted polyvinyl alcohol, polyacrylic acid, polysiloxane, or polyurethane have a relatively low surface energy, so they will actively migrate to the damaged area and reconstruct the interpenetrating network polymer for self - repair.

[0084] In some embodiments, the carbon chain length of the F - substituted alkane is 6 - 12, for example, 6, 7, 8, 9, 10, 11, 12, etc. Within this length range, the F - substituted alkane will spontaneously migrate out of the encapsulation film and can also migrate to the damaged area.

[0085] In some embodiments, the F - generation alkane includes one or more of perfluorohexylethane, perfluorohexane, and 1 - fluoroheptane.

[0086] In some embodiments, the compound containing both catechol group and amino group includes one or more of dopamine, 1-(3,4 - dihydroxyphenyl)-2 - aminoethanol, or (R)-4 - [(2-(methylamino)-1 - hydroxyethyl]-1,2 - benzenediol.

[0087] In some embodiments, the mass ratio of the oligomer of the acrylate polymer to the oligomer of the linear polymer is 2:1 to 50:1. For example, 2:1, 3:1, 5:1, 7:1, 9:1, 10:1, 12:1, 15:1, 18:1, 19:1, 20:1, 21:1, 23:1, 25:1, 26:1, 28:1, 29:1, 30:1, 31:1, 33:1, 34:1, 36:1, 38:1, 40:1, 41:1, 43:1, 45:1, 46:1, 48:1, 49:1, 50:1, etc. Within the range of the mass ratio, the good mechanical properties, thermal stability, corrosion resistance, solvent resistance, etc. of the encapsulation structure can be effectively guaranteed. In addition, the water and oxygen resistance of the encapsulation structure can be improved.

[0088] In some embodiments, the mass ratio of the oligomer of the acrylate polymer to the first compound is 50:1 to 200:1. For example, 50:1, 55:1, 60:1, 65:1, 70:1, 80:1, 85:1, 90:1, 96:1, 100:1, 105:1, 110:1, 112:1, 115:1, 118:1, 120:1, 125:1, 130:1, 135:1, 140:1, 145:1, 150:1, 155:1, 160:1, 165:1, 170:1, 175:1, 180:1, 185:1, 190:1, 195:1, 200:1, etc. Within the range of the mass ratio, the hydrophobicity of the encapsulation structure and the hydrophobicity of the self - repair part can be further improved.

[0089] In some embodiments, the mass ratio of the oligomer of the acrylate polymer to the second compound is from 100:1 to 500:1, for example, 100:1, 110:1, 120:1, 130:1, 140:1, 150:1, 160:1, 170:1, 180:1, 190:1, 200:1, 210:1, 220:1, 230:1, 240:1, 250:1, 260:1, 270:1, 280:1, 290:1, 300:1, 310:1, 320:1, 330:1, 340:1, 350:1, 360:1, 370:1, 380:1, 390:1, 400:1, 410:1, 420:1, 430:1, 440:1, 450:1, 460:1, 470:1, 480:1, 490:1, 500:1, etc. Within this mass ratio range, the encapsulation structure can be better combined with the optoelectronic device, and at the same time, the repair position can have better strength.

[0090] In step S012:

[0091] In some embodiments, the deposition includes solution methods, and the solution methods include one or more of spin coating, printing, blade coating, dip coating, immersion, spraying, roll coating, casting, slot die coating, and bar coating.

[0092] In some embodiments, the temperature of the first heat treatment is 60 - 150 °C, for example, 60 °C, 70 °C, 80 °C, 90 °C, 100 °C, 110 °C, 120 °C, 130 °C, 140 °C, 150 °C, etc., and the time is 5 - 120 min, for example, 5 min, 8 min, 10 min, 15 min, 20 min, 25 min, 30 min, 35 min, 40 min, 50 min, 60 min, 70 min, 80 min, 90 min, 100 min, 110 min, 120 min, etc. Within this temperature and time range, one or more of the oligomers of unreacted acrylate polymers and the oligomers of unreacted linear polymers will exist in the encapsulation film. It is precisely the existence of these oligomers of unreacted acrylate polymers and unreacted linear polymers that play a repair role. Specifically, due to the low surface energy of these oligomers of unreacted acrylate polymers and unreacted linear polymers, they will actively migrate to the damaged area, reconstruct the interpenetrating network polymer, and perform self-repair.

[0093] It is beneficial to prepare a film with better film-forming properties.

[0094] In a third aspect, an embodiment of the present application provides an optoelectronic device, which includes: an optoelectronic device and a packaging film disposed on the optoelectronic device, wherein the packaging film includes an interpenetrating network polymer.

[0095] In some embodiments, the optoelectronic device of the present application may further include: a substrate, an optoelectronic device disposed on the substrate, and a packaging film disposed on the optoelectronic device, wherein the packaging film includes an interpenetrating network polymer.

[0096] It can be understood that the packaging film completely covers the optoelectronic device, and the packaging film and the substrate are on the periphery of the optoelectronic device to seal the optoelectronic device, thereby realizing the packaging of the optoelectronic device.

[0097] In some embodiments, the substrate may be a substrate made of a rigid material, such as one or more of glass, metal foil, etc.; the substrate may also be a substrate made of a flexible material, such as one or more of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyether ether ketone (PEEK), polystyrene (PS), polyethersulfone (PES), polycarbonate (PC), polyarylate (PAT), polyarylate (PAR), polyimide (PI), polyvinyl chloride (PV), polyethylene (PE), polyvinylpyrrolidone (PVP), textile fibers, etc.

[0098] The packaging film of the present application does not affect light emission and has a good packaging effect at the same time.

[0099] For the relevant details of the packaging film, refer to the above, and will not be elaborated here.

[0100] In some embodiments, the optoelectronic device is a quantum dot light-emitting diode, and the quantum dot light-emitting diode includes: an anode, a cathode, and a quantum dot light-emitting layer disposed between the anode and the cathode. The packaging film is disposed in contact with the cathode, or may also be disposed in contact with the anode. It should be noted that the quantum dot light-emitting diode is not limited to this structure and may also include other functional layers, such as a hole functional layer, an electron functional layer, etc. The structure of the quantum dot light-emitting diode is prior art and will not be elaborated here. Of course, the optoelectronic device is not limited to the quantum dot light-emitting diode and may also be an optoelectronic device such as an organic light-emitting diode.

[0101] In a fourth aspect, an embodiment of the present application provides a method for manufacturing an optoelectronic device, including the following steps:

[0102] S022: Provide an optoelectronic device;

[0103] S023: Prepare a packaging film on the optoelectronic device, and the packaging film includes an interpenetrating network polymer.

[0104] For the relevant details of the encapsulation film, please refer to the above text and will not be elaborated here.

[0105] The following specific examples are used to specifically illustrate the present application. The following examples are only partial examples of the present application and do not limit the present application.

[0106] Example 1

[0107] This example provides a method for preparing an encapsulation film, including the following steps:

[0108] Provide 10 g of a polysiloxane oligomer with a molecular weight of 100 - 500, mix it with 100 g of polymethyl methacrylate with a molecular weight of 100 - 500 to obtain a mixed solution containing the polysiloxane oligomer and the polymethyl methacrylate oligomer. Spin-coat the mixed solution on a substrate by the spin-coating method. The rotation speed during spin-coating is 2000 rpm, the time is 30 seconds, and perform the first heat treatment at 100 °C for 30 min. Repeat this process twice to obtain the encapsulation film.

[0109] Example 2

[0110] This example is basically the same as Example 1, except that in this example, 1 g of 1-fluoroheptane is further added to the mixed solution containing the polysiloxane oligomer and the polymethyl methacrylate oligomer to obtain a mixed solution containing 1-fluoroheptane, the polysiloxane oligomer, and the polymethyl methacrylate oligomer.

[0111] Example 3

[0112] This example is basically the same as Example 1, except that in this example, 0.5 g of dopamine is further added to the mixed solution containing the polysiloxane oligomer and the polymethyl methacrylate oligomer to obtain a mixed solution containing dopamine, the polysiloxane oligomer, and the polymethyl methacrylate oligomer.

[0113] Example 4

[0114] This example is basically the same as Example 1, except that in this example, 1 g of 1-fluoroheptane and 0.5 g of dopamine-containing are further added to the mixed solution containing the polysiloxane oligomer and the polymethyl methacrylate oligomer to obtain a mixed solution containing 1-fluoroheptane, dopamine, the polysiloxane oligomer, and the polymethyl methacrylate oligomer.

[0115] Example 5

[0116] This example is basically the same as Example 1, except that in this example, the polysiloxane oligomer is replaced with a polyvinyl alcohol oligomer.

[0117] Example 6

[0118] This example is basically the same as Example 1, except that in this example, the polysiloxane oligomer is replaced with a polyurethane oligomer.

[0119] Example 7

[0120] This example is basically the same as Example 1, except that in this example, 2 g of polysiloxane oligomer and 100 g of polymethyl methacrylate oligomer are weighed.

[0121] Example 8

[0122] This example is basically the same as Example 1, except that in this example, 50 g of polysiloxane oligomer and 100 g of polymethyl methacrylate oligomer are weighed.

[0123] Example 9

[0124] This example is basically the same as Example 2, except that in this example, 0.5 g of 1-fluoroheptane, 2 g of polysiloxane oligomer and 100 g of polymethyl methacrylate oligomer are weighed.

[0125] Example 10

[0126] This example is basically the same as Example 2, except that in this example, 2 g of 1-fluoroheptane, 50 g of polysiloxane oligomer and 100 g of polymethyl methacrylate oligomer are weighed.

[0127] Example 11

[0128] This example is basically the same as Example 3, except that in this example, 0.2 g of dopamine, 2 g of polysiloxane oligomer and 100 g of polymethyl methacrylate oligomer are weighed.

[0129] Example 12

[0130] This example is basically the same as Example 3, except that in this example, 1 g of dopamine, 50 g of polysiloxane oligomer and 100 g of polymethyl methacrylate oligomer are weighed.

[0131] Example 13

[0132] This example is basically the same as Example 4, except that in this example, 0.2 g of dopamine, 0.5 g of 1-fluoroheptane, 2 g of polysiloxane oligomer and 100 g of polymethyl methacrylate oligomer are weighed.

[0133] Example 14

[0134] This example is basically the same as Example 4, except that in this example, 1 g of dopamine-containing, 2 g of 1-fluoroheptane, 50 g of polysiloxane oligomer and 100 g of polymethyl methacrylate oligomer are weighed.

[0135] Example 15

[0136] This example is basically the same as Example 1, except that the temperature of the first heat treatment in this example is 60 °C.

[0137] Example 16

[0138] This example is basically the same as Example 1, except that the temperature of the first heat treatment in this example is 150 °C.

[0139] Example 17

[0140] This example is basically the same as Example 1, except that the time of the first heat treatment in this example is 5 min.

[0141] Example 18

[0142] This example is basically the same as Example 1, except that the time of the first heat treatment in this example is 120 min.

[0143] Example 19

[0144] This example is basically the same as Example 1, except that before obtaining the mixed solution for spin coating, it further includes a second heat treatment of the mixed solution. The temperature of the second heat treatment is 60 °C, the time is 18 min, and spin coating is changed to spraying.

[0145] Example 20

[0146] This example is basically the same as Example 1, except that before obtaining the mixed solution for spin coating, it further includes a second heat treatment of the mixed solution. The temperature of the second heat treatment is 40 °C, the time is 30 min, and spin coating is changed to spraying.

[0147] Example 21

[0148] This example is basically the same as Example 1, except that before obtaining the mixed solution for spin coating, it further includes a second heat treatment of the mixed solution. The temperature of the second heat treatment is 80 °C, the time is 5 min, and spin coating is changed to spraying.

[0149] Comparative Example 1

[0150] This comparative example is basically the same as Example 1, except that the polysiloxane oligomer is removed.

[0151] Comparative Example 2

[0152] This comparative example is basically the same as Example 1, except that the polymethyl methacrylate oligomer is removed.

[0153] The encapsulation films of Examples 1-21 and Comparative Examples 1-2 were tested for transmittance and contact angle, and the test results are shown in Table 1.

[0154] Among them, the test method for transmittance is: ultraviolet-visible absorption spectroscopy was used to detect the light transmittance of the encapsulation film.

[0155] The test method for contact angle is: a contact angle measuring instrument was used to detect the water contact angle.

[0156] Table 1

[0157]

[0158]

[0159] As can be seen from Table 1:

[0160] Compared with the encapsulation films of Comparative Examples 1-2, the transmittances of the encapsulation films of Examples 1-21 of the present invention are all greater than those of Comparative Examples 1-2, indicating that the transmittances of the encapsulation films doped or not doped with the repair agent of the present invention are all good. This is because the interpenetrating network polymer has high transparency. In addition, the doping of the repair agent does not affect the transmittance.

[0161] Compared with the encapsulation films of Comparative Examples 1-2, the contact angles of the encapsulation films of Examples 1-21 of the present invention are all greater than those of Comparative Examples 1-2, indicating that the hydrophobicity of the encapsulation films of the present invention is better than that of the encapsulation films of Comparative Examples 1-2. This is because Comparative Examples 1 and 2 are merely films formed by single polymethyl methacrylate or polysiloxane, while the encapsulation film of the present application is an interpenetrating network polymer, which is formed by the interpenetration of the networks obtained by crosslinking acrylate polymers and linear polymers respectively. Because the interpenetrating network polymer has hydrophobicity and water and oxygen resistance, the hydrophobicity of the encapsulation films of the present invention is excellent. In addition, in the present application, due to the addition of the repair agent, the hydrophobicity of the encapsulation film is further improved.

[0162] Optoelectronic device Example 1

[0163] This example provides an optoelectronic device, and the preparation method is as follows:

[0164] The cleaned ITO plate was irradiated with ultraviolet light for 15 minutes to obtain an ITO anode;

[0165] PEDOT:PSS was spin-coated on the ITO anode at a rotation speed of 5000 rpm for 30 seconds to obtain a hole injection layer;

[0166] TFB was spin-coated on the hole injection layer at a rotation speed of 3000 rpm for 30 seconds to obtain a hole transport layer;

[0167] Spin coat ZnCdS on the hole transport layer at a concentration of 12 mg / ml, a rotation speed of 2000 rpm, and for 30 seconds to form a light-emitting layer;

[0168] Spin coat ZnO on the light-emitting layer at a rotation speed of 2000 rpm and for 30 seconds to form an electron transport layer;

[0169] Thermally evaporate Al on the electron transport layer with a vacuum degree not higher than 3x10 -4 Pa, at a deposition rate of 1 Å / s for 100 seconds to a thickness of 10 nm; thermally evaporate Ag with a vacuum degree not higher than 3x10 -4 Pa, at a deposition rate of 1 Å / s for 200 seconds to a thickness of 20 nm to form a cathode and obtain an optoelectronic device;

[0170] Form a packaging film on the surface of the cathode according to the method of Example 1 to obtain an optoelectronic device.

[0171] Optoelectronic device Examples 2 - 21

[0172] This example is basically the same as Optoelectronic device Example 1, except that the packaging film of Optoelectronic device Example 1 is replaced with the corresponding packaging films of Examples 2 - 21.

[0173] Optoelectronic device Example 22

[0174] This example is basically the same as Optoelectronic device Example 1, except that in this example, an inverted optoelectronic device is prepared in the order of cathode, electron transport layer, light-emitting layer, hole transport layer, hole injection layer, and anode.

[0175] Optoelectronic device Comparative Examples 1 - 2

[0176] Comparative Examples 1 - 2 are basically the same as Optoelectronic device Example 1, except that the packaging film of Optoelectronic device Example 1 is replaced with the corresponding packaging films of Comparative Examples 1 - 2.

[0177] Perform tests on the optoelectronic devices of Examples 1 - 22 and Comparative Examples 1 - 2 for T95@1k nit and CE d The test results are shown in Table 2.

[0178] Among them, the test method for T95@1k nit is as follows:

[0179] The time required for the device to reduce its brightness to a certain percentage of the maximum brightness under constant current or voltage drive. The time when the brightness drops to 95% of the maximum brightness is defined as T95, and this lifetime is the measured lifetime. To shorten the test cycle, the device lifetime test is usually carried out by accelerating the device aging at high brightness, and the lifetime at high brightness is obtained by fitting with an extended exponential decay brightness decay fitting formula. For example, the lifetime at 1000 nit is denoted as T95@1000 nit. The specific calculation formula is as follows:

[0180]

[0181] where T95 L is the lifetime at low brightness, T95 H is the measured lifetime at high brightness, L H is the device accelerated to the maximum brightness, L L is 1000 nit, A is the acceleration factor. In this experiment, the value of A is obtained as 1.7 by measuring the lifetimes of several groups of green QLED devices at the rated brightness.

[0182] CE d The test method is as follows: The detection method for the device efficiency stability includes the steps of: After placing the packaged optoelectronic device in an environment with a temperature of 80 °C and a relative humidity of 80% for 7 days, intermittently collect the brightness values of the optoelectronic device in the voltage range from 0 V to 8 V. Collect once every 0.2 V. The brightness value collected each time is divided by the corresponding current density to obtain the current efficiency of the optoelectronic device under the collection conditions of that time. Obtain the current efficiency (C.E2, cd / A) at a current density of 32 mA / cm 2 and calculate CE d (%) = C.E2 / C.E1 × 100%.

[0183] Table 2

[0184]

[0185]

[0186] As can be seen from Table 2:

[0187] Compared with Comparative Examples 1-2 of the optoelectronic device, Examples 1-22 of the optoelectronic device of the present invention have a significantly higher lifetime than Comparative Examples 1-2 of the optoelectronic device, indicating that the interpenetrating network polymer of the present application as the encapsulation film significantly improves the service life. In addition, due to the low surface energy of the doped repair agent, it will spontaneously migrate outside the encapsulation film and can also migrate to the damaged area to reconstruct the interpenetrating network polymer for self-repair, and improve the hydrophobicity and strength of the self-repaired part, further improving the lifetime of the device.

[0188] In Example 1-22 of the optoelectronic device of the present invention compared with Comparative Example 1-2 of the optoelectronic device, the CE d (%) value of the optoelectronic device of the present invention is significantly greater than the CE d (%) value of Comparative Document 1-2 of the optoelectronic device, indicating that the stability of the device efficiency of the optoelectronic device of the present invention is higher.

[0189] The above has introduced in detail the encapsulation film and its preparation method, optoelectronic device and its preparation method provided by the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

Claims

1. A packaging film, characterized in that, The encapsulation film includes an interpenetrating network polymer.

2. The encapsulation film according to claim 1, wherein, The interpenetrating network polymer includes an acrylate polymer and a linear polymer.

3. The encapsulation film according to claim 1 or 2, characterized in that, The interpenetrating network polymer is formed by the interpenetration of the networks obtained by crosslinking the acrylate polymer and the linear polymer respectively.

4. The encapsulation film according to claim 3, characterized in that, The acrylate polymer includes polymethyl methacrylate; and / or The linear polymer includes one or more of polyvinyl alcohol, polyacrylic acid, polysiloxane, and polyurethane; and / or The thickness of the encapsulation film is 50 μm to 1000 μm.

5. The encapsulation film according to claim 1, wherein, The encapsulation film further includes a repair agent, and the repair agent includes one or more of an oligomer of an acrylate polymer, an oligomer of a linear polymer, a first compound, and a second compound. Among them, the first compound includes a fluorinated alkane, and the second compound includes a catecholamine compound.

6. The encapsulation film according to claim 5, wherein The molecular weights of the oligomer of the acrylate polymer and the oligomer of the linear polymer are each independently 100 to 500; and / or The carbon chain length of the fluorinated alkane is 6 to 12; and / or The catecholamine compound includes a compound containing both a catechol group and an amino group.

7. The encapsulation film according to claim 6, characterized in that, The oligomer of the acrylate polymer includes an oligomer of polymethyl methacrylate; and / or The oligomer of the linear polymer includes one or more of an oligomer of polyvinyl alcohol, an oligomer of polyacrylic acid, an oligomer of polysiloxane, and an oligomer of polyurethane; and / or The fluorinated alkane includes one or more of perfluorohexylethane, perfluorohexane, and 1-fluoroheptane; and / or The compound containing both a catechol group and an amino group includes one or more of dopamine, 1-(3,4-dihydroxyphenyl)-2-aminoethanol, or (R)-4-[(2-(methylamino)-1-hydroxyethyl]-1,2-benzenediol.

8. The encapsulation film according to claim 5, characterized in that, The total mass of the acrylate polymer in the interpenetrating network polymer and the oligomer of the acrylate polymer in the repair agent is the first mass, and the total mass of the linear polymer in the interpenetrating network polymer and the oligomer of the linear polymer in the repair agent is the second mass; The mass ratio of the first mass to the second mass is 2:1 to 50:1; and / or The mass ratio of the first mass to the first compound is 50:1 to 200:1; and / or The mass ratio of the first mass to the second compound is 100:1 to 500:

1.

9. A method for preparing a packaging film, characterized in that, Including: Providing a mixed solution, the mixed solution includes an oligomer of an acrylate polymer and an oligomer of a linear polymer; Depositing the mixed solution, followed by a first heat treatment to form an interpenetrating network polymer, obtaining an encapsulation film.

10. The preparation method according to claim 9, characterized in that, There is also a second heat treatment between providing the mixed solution and depositing the mixed solution. The temperature of the second heat treatment is 40 to 80 °C, and the time is 5 to 30 min.

11. The preparation method according to claim 9, characterized in that, The encapsulation film further includes a repair agent, and the repair agent includes one or more of an unreacted oligomer of an acrylate polymer, an unreacted oligomer of a linear polymer, a first compound, and a second compound. Among them, the first compound includes a fluorinated alkane, and the second compound includes a compound containing both a catechol group and an amino group.

12. The preparation method according to claim 11, characterized in that, The oligomers of the acrylate polymer include oligomers of polymethyl methacrylate, and the molecular weight of the oligomers of polymethyl methacrylate is 100 to 500; and / or The oligomers of the linear polymer include one or more of oligomers of polyvinyl alcohol, oligomers of polyacrylic acid, oligomers of polysiloxane, and oligomers of polyurethane. The molecular weights of the oligomers of polyvinyl alcohol, the oligomers of polyacrylic acid, the oligomers of polysiloxane, and the oligomers of polyurethane are each independently 100 to 500; and / or The carbon chain length of the fluorinated alkane is 6 to 12; and / or The fluorinated alkane includes one or more of perfluorohexylethane, perfluorohexane, and 1-fluoroheptane; and / or The compound containing both catechol groups and amine groups includes one or more of dopamine, 1-(3,4-dihydroxyphenyl)-2-aminoethanol, or (R)-4-[(2-(methylamino)-1-hydroxyethyl]-1,2-benzenediol).

13. The preparation method according to claim 11, characterized in that, The mass ratio of the oligomers of the acrylate polymer to the oligomers of the linear polymer is 2:1 to 50:1; and / or The mass ratio of the oligomers of the acrylate polymer to the first compound is 50:1 to 200:1; and / or The mass ratio of the oligomers of the acrylate polymer to the second compound is 100:1 to 500:

1.

14. The preparation method according to claim 9, characterized in that, The temperature of the first heat treatment is 60 to 150 °C, and the time is 5 to 120 min.

15. An optoelectronic device, characterized in that, The optoelectronic device includes: an optoelectronic component and a packaging film disposed on the optoelectronic component, wherein the packaging film includes an interpenetrating network polymer.

Images