Display device

Abstract

A display device includes: a display panel including a display area and a non-display area around the display area, in which the display panel includes a display surface on which an image from the display area is displayed and a rear surface opposite the display surface; and a circuit board connected to the display panel. The display panel further includes a first portion extending from the non-display area and bent, and a second portion extending from the first portion in a first direction to face a rear surface of the display panel, protruding from the first portion in the first direction, and connected to the circuit board, the first portion of the display panel has a first width in a second direction crossing the first direction, and the second portion of the display panel has a second width smaller than the first width in the second direction.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2023-0196286, filed with the Korean Intellectual Property Office on December 29, 2023, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a display device. Background Art

[0003] Generally, an electronic device is implemented as a multimedia device (multimedia player) having various functions such as image display, photograph or moving image capture, music or moving image playback, gaming, and broadcast reception. Due to the development of such multimedia devices, the importance of display devices is increasing.

[0004] Various types of display devices such as organic light emitting display (OLED) devices and liquid crystal display (LCD) devices are used in various fields. Such display devices may include a display panel and a circuit board connected to the display panel. Summary of the Invention

[0005] Recently, display devices are being developed in various forms. For example, various flexible display devices that can be deformed into a curved shape, folded, or curled are being developed. Since at least a part of such a flexible display device is bent, the space for arranging a circuit board and components may be insufficient.

[0006] Embodiments provide a display device in which space is efficiently provided in a circuit board.

[0007] According to an embodiment of the present disclosure, a display device includes: a display panel including a display area and a non-display area around the display area, wherein the display panel includes a display surface and a rear surface opposite to the display surface, and an image from the display area is displayed on the display surface; and a circuit board connected to the display panel. In such an embodiment, the display panel further includes a first part extending from the non-display area and being bent, and a second part extending from the first part in a first direction to face the rear surface of the display panel, protruding in the first direction from the first part, and connected to the circuit board. In such an embodiment, the first part of the display panel has a first width in a second direction intersecting the first direction, and the second part of the display panel has a second width less than the first width in the second direction.

[0008] In an embodiment, the display surface may have a third width greater than the first width in the second direction.

[0009] In an embodiment, the circuit board may be fixed to the second part of the display panel.

[0010] In an embodiment, the circuit board may be a flexible circuit board.

[0011] In an embodiment, the display device may further include: a driver integrated circuit disposed on a second portion of the display panel and electrically connected to the display panel through lines of the display panel.

[0012] In an embodiment, the circuit board may include a first region disposed adjacent to the second portion of the display panel in a second direction or in a direction opposite to the second direction.

[0013] In an embodiment, a first portion of the display panel may have a first edge adjacent to the first region and extending in the second direction, and a second portion of the display panel may have a second edge adjacent to the first region and extending in a first direction.

[0014] In an embodiment, the first region may be formed on the circuit board adjacent to the first edge and the second edge.

[0015] In an embodiment, the display device may further include: a driver integrated circuit disposed on a second portion of the display panel, wherein the driver integrated circuit controls the display panel; and a circuit element disposed on the first region of the circuit board and electrically connected to the driver integrated circuit.

[0016] In an embodiment, the display device may further include: a touch array disposed on the display panel; a driver integrated circuit disposed on a second portion of the display panel, wherein the driver integrated circuit controls the display panel; and a touch driving circuit disposed on the first region of the circuit board, wherein the touch driving circuit controls the touch array.

[0017] In an embodiment, the display panel may include: a substrate; a pixel circuit layer disposed on the substrate, wherein the pixel circuit layer includes transistors; a display element layer including light-emitting elements electrically connected to the transistors; and a thin film encapsulation layer disposed on the display element layer, and wherein the touch array may be disposed on the thin film encapsulation layer.

[0018] In an embodiment, the circuit board may further include a second region disposed adjacent to the second portion of the display panel in the first direction.

[0019] In an embodiment, the area of the first region may be smaller than the area of the second region.

[0020] In an embodiment, the display device may further include: a driver integrated circuit disposed on a second portion of the display panel, wherein the driver integrated circuit controls the display panel; and a circuit element disposed on a first area of the circuit board and electrically connected to the driver integrated circuit, and at least one selected from a battery, a sensor module, an antenna module, and a sound output module may be disposed on a second area of the circuit board.

[0021] In an embodiment, the display device may further include: a touch array disposed on the display panel; a driver integrated circuit disposed on a second portion of the display panel, wherein the driver integrated circuit controls the display panel; and a touch driving circuit disposed on a first area of the circuit board, wherein the touch driving circuit controls the touch array, and at least one selected from a battery, a sensor module, an antenna module, and a sound output module is disposed on a second area of the circuit board.

[0022] In an embodiment, the display area and the non-display area may include a first non-foldable area, a foldable area, and a second non-foldable area sequentially disposed in a direction opposite to the first direction, and the foldable area may be foldable based on a folding axis extending along a second direction.

[0023] In an embodiment, a first portion of the display panel may extend from an area adjacent to the second non-foldable area of the non-display area of the display panel, and the circuit board may overlap with the second non-foldable area. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other features of the embodiments of the present disclosure will become more apparent by describing the embodiments of the present disclosure in more detail with reference to the accompanying drawings, in which:

[0025] Figure 1 is a perspective view of an electronic device including a display device according to an embodiment of the present disclosure;

[0026] Figure 2 is a perspective view of Figure 1 the electronic device in a folded state;

[0027] Figure 3 is a block diagram illustrating an embodiment of a display device included in Figure 1 the electronic device;

[0028] Figure 4 is a block diagram illustrating an embodiment of Figure 3 the display module;

[0029] Figure 5 is a circuit diagram illustrating an embodiment of a pixel included in Figure 4 the display module;

[0030] Figure 6 is Figure 4 a cross-sectional view of a display panel of;

[0031] Figure 7 is an illustrated Figure 1 exploded perspective view of an electronic device of;

[0032] Figure 8 is Figure 7 a plan view of a display panel of;

[0033] Figure 9 is an illustrated Figure 7 plan view of an embodiment of a display panel of;

[0034] Figure 10 is an illustrated Figure 9 magnified view of portion A of;

[0035] Figure 11 is a cross-sectional view taken along line Figure 1 I-I’ of; and

[0036] Figure 12 is a system block diagram of an electronic device including a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0037] Now, the present invention will be described more fully hereinafter with reference to the accompanying drawings in which various embodiments are shown. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. Like reference numerals refer to like elements throughout.

[0038] It will be understood that when an element is referred to as being “on” another element, it can be directly on the other element or intervening elements may be present therebetween. In contrast, when an element is referred to as being “directly on” another element, there are no intervening elements.

[0039] Throughout the specification, in the case where one part is “connected” to another part, this case includes not only the case where the one part is “directly connected” but also the case where the one part is “indirectly connected” with another element intervening therebetween.

[0040] The terms used in this document are for the purpose of describing particular embodiments only and are not intended to be limiting. As used herein, "a," "the," and "at least one" do not denote a limitation of quantity and are intended to include both the singular and the plural, unless the context clearly dictates otherwise. Thus, a reference to "a" element in a claim followed by a reference to "the" element includes one element and a plurality of elements. For example, "element" and "at least one element" have the same meaning unless the context clearly dictates otherwise. "At least one" should not be construed as limiting "a." "Or" means "and / or." As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be further understood that when used in this specification, the terms "comprises" or "comprising," and variations thereof, specify the presence of the stated features, regions, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, components, and / or groups thereof.

[0041] It will be understood that although the terms "first," "second," "third," etc. may be used herein to describe various elements, components, regions, layers, and / or portions, these elements, components, regions, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or portion from another. Thus, without departing from the teachings herein, the first element, component, region, layer, or portion discussed below could be termed the second element, component, region, layer, or portion.

[0042] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship of one element to another as illustrated in the various figures. It will be understood that the relative terms are intended to encompass different orientations of the device in addition to the orientation depicted in the various figures. For example, if the device in one of the figures is flipped, an element described as on the "lower" side of other elements will then be oriented on the "upper" side of the other elements. Thus, depending on the specific orientation of the figure, the term "lower" can encompass both the "lower" and "upper" orientations. Similarly, if the device in one of the figures is flipped, an element described as "below" or "beneath" other elements will then be oriented "above" the other elements. Thus, the terms "below" or "beneath" can encompass both the above and below orientations.

[0043] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning that is consistent with their meaning in the relevant art and the context of this disclosure, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0044] Embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. As such, variations in the shapes of the illustrations as a result of, for example, manufacturing techniques and / or tolerances are to be expected. Thus, the embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein, but are to include deviations in shapes that result, for example, from manufacturing. For example, regions that are illustrated or described as flat will generally have rough and / or non-linear features. Additionally, sharp corners that are illustrated may be rounded. Thus, the regions illustrated in the various figures are schematic in nature, and their shapes are not intended to illustrate the exact shape of a region and are not intended to limit the scope of the claims.

[0045] Figure 1 is a perspective view of an electronic device including a display device according to an embodiment of the present disclosure.

[0046] Reference Figure 1 , an embodiment of the electronic device ED may include a display device DD (reference Figure 3 ).

[0047] In the present disclosure, the electronic device ED may be any electronic device such as a smart phone, a television, a tablet personal computer (PC), a mobile phone, a video phone, an e-book reader, a desktop PC, a laptop PC, a netbook computer, a workstation, a server, a personal digital assistant (PDA), a portable multimedia player (PMP), an MP3 player, a medical device, a camera, or a wearable device, including a display surface defined on at least one of its surfaces.

[0048] The electronic device ED may be provided in various shapes, for example, in the shape of a rectangular plate having two pairs of sides parallel to each other, but the present disclosure is not limited thereto. In an embodiment in which the electronic device ED is provided in the shape of a rectangular plate, one of the two pairs of sides may be provided to be longer than the other pair. According to an embodiment, the electronic device ED provided in the shape of a rectangular plate may have an arc shape at a corner portion where one long side and one short side are in contact with each other. However, the present disclosure is not limited thereto.

[0049] In an embodiment of the present disclosure, for ease of description, an embodiment is described in which the electronic device ED has a rectangular shape with a pair of long sides and a pair of short sides, and the extending direction of the long sides is indicated as the first direction DR1, the extending direction of the short sides is indicated as the second direction DR2, and the thickness direction of the display device DD (or the substrate SUB shown in Figure 6 is indicated as the third direction DR3.

[0050] In an embodiment, the electronic device ED may be a foldable electronic device. In an embodiment, at least a part of the electronic device ED may be flexible, and the flexible part may be foldable. In such an embodiment, the upper surface of the electronic device ED may be defined as the first surface S1 for displaying an image, and in the unfolded state, in other words, when the electronic device is flat, the first surface S1 may have a plane defined by the first direction DR1 and the second direction DR2.

[0051] The electronic device ED may include a first non-foldable (i.e., non-foldable or flat) region NFA1, a foldable region FA, and a second non-foldable region NFA2 that are sequentially defined (or arranged) in the first direction DR1 or the direction opposite to the first direction DR1. In an embodiment, for example, the foldable region FA may be provided between the first non-foldable region NFA1 and the second non-foldable region NFA2. However, the present disclosure is not limited thereto. In an embodiment, for example, the electronic device ED may include two or more non-foldable regions and a foldable region provided between the non-foldable regions.

[0052] The electronic device ED may include a display area DA for displaying an image and a non-display area NDA provided on at least one side of the display area DA. The non-display area NDA is an area that does not display an image. However, the present disclosure is not limited thereto. According to an embodiment, various designs may be made for the shape of the display area DA and the shape of the non-display area NDA.

[0053] Figure 2 is a perspective view of the Figure 1 electronic device in the folded state.

[0054] Referring to Figure 2 , an embodiment of the electronic device ED may be folded based on the folding axis FX. The foldable region FA may be bent based on the folding axis FX. In an embodiment, the folding axis FX may be defined as a short axis parallel to the short side of the electronic device ED. In another embodiment, for example, the folding axis FX may extend along the first direction DR1.

[0055] In an embodiment, the electronic device ED may be folded inwardly based on the folding axis FX. In such an embodiment, when the electronic device ED is folded, the first surface S1 of the first non-foldable area NFA1 and the first surface S1 of the second non-foldable area NFA2 may face each other. However, the present disclosure is not limited thereto. In another embodiment, for example, the electronic device ED may be folded outwardly based on the folding axis FX. In such an embodiment, when the electronic device ED is folded, the second surface S2 of the first non-foldable area NFA1 and the second surface S2 of the second non-foldable area NFA2 may face each other.

[0056] In an embodiment, as Figure 2 shown, the electronic device ED is folded along the short axis, but the electronic device ED may be folded based on a folding axis aligned in one of various directions. In another embodiment, for example, the electronic device ED may be folded based on the long axis.

[0057] Figure 3 is a block diagram illustrating an embodiment of a display device included in the Figure 1 electronic device.

[0058] Referring to Figure 3 , an embodiment of the display device DD may include a touch module TM and a display module DM.

[0059] The touch module TM may include a touch array TS and a touch driver TDR for driving the touch array TS. The display module DM may include a display panel DP and a display driver DDR for driving the display panel DP.

[0060] In an embodiment, the touch array TS and the display panel DP may be manufactured separately from each other and then combined to at least partially overlap each other. In other embodiments, the touch array TS and the display panel DP may be integrally manufactured with each other by a continuous process. In such an embodiment, the touch array TS may be directly formed on at least one layer (e.g., a thin film encapsulation layer or an insulating layer of the display panel DP) constituting the display panel DP. However, the touch array TS is not limited to being disposed on the display panel DP. In another embodiment, for example, the touch array TS may be disposed under the display panel DP.

[0061] The touch array TS may include a sensing area SA capable of sensing a touch and a non-sensing area NSA around the sensing area SA. The sensing area SA may at least partially overlap with the display area DA. The display device DD may display an image through the sensing area SA and may also sense a touch input on the display surface or sense light incident thereon from the front. The non-sensing area NSA may surround the sensing area SA, but this is an example and is not limited thereto.

[0062] The touch array TS may include a substrate, and drive electrodes TX and sense electrodes RX formed on the substrate. The drive electrodes TX and the sense electrodes RX may be disposed on the substrate in a sensing region SA.

[0063] The display panel DP may include a display area DA for displaying an image and a non-display area NDA surrounding the display area DA. The display panel DP may include pixels PX formed on the substrate. The pixels PX may be disposed in the display area DA.

[0064] One of the pixels PX may be connected to a scan line SL, a data line DL, and an emission line EL. In an embodiment, for example, one of the pixels PX may be selected by the conduction level of a drive signal supplied through the scan line SL, and may receive a data signal through the data line DL. Accordingly, the pixel PX emits light having a luminance corresponding to the data signal, and may display an image in the display area DA.

[0065] The lines connected to the pixels PX and / or the drive circuits may be disposed in the non-display area NDA. In an embodiment, for example, at least one selected from a scan driver, an emission driver, and a data driver may be disposed in the non-display area NDA.

[0066] In an embodiment, the display panel DP may include an organic light-emitting element (e.g., an organic light-emitting diode), an inorganic light-emitting element (e.g., an inorganic light-emitting diode), or a quantum dot / well light-emitting element (e.g., a quantum dot / well light-emitting diode), etc. as the pixels PX. In other embodiments, the display panel DP may be implemented as a liquid crystal display panel. In such an embodiment, a light source such as a backlight unit may be additionally provided.

[0067] The display driver DDR may be electrically connected to the display panel DP to drive the pixels PX. Additionally, the touch driver TDR may be connected to the touch array TS to drive the touch array TS.

[0068] In an embodiment, the touch driver TDR and the display driver DDR may be configured as separate integrated chips (ICs). However, the present disclosure is not limited thereto. In another embodiment, for example, the touch driver TDR and the display driver DDR may be included in a single IC.

[0069] Figure 4 is a diagram Figure 3 of a block diagram of an embodiment of a display module.

[0070] Referring Figure 4 , an embodiment of the display module DM may include a display panel DP and a display driver DDR. In an embodiment, the display driver DDR may include a gate driving circuit 120, a panel driving circuit 130, etc.

[0071] Pixels PX can be provided in a display panel DP. In the display panel DP, a plurality of data lines DL1 to DLn, a plurality of scan lines SL1 to SLm, a plurality of emission lines EL1 to ELm, etc., which are electrically connected to the pixels PX, can be provided.

[0072] Each of the pixels PX may include two or more sub-pixels. In an embodiment, for example, a plurality of sub-pixels may be arranged in a matrix structure or a structure, etc. However, embodiments of the present disclosure are not limited to the above structures.

[0073] The gate driving circuit 120 may include a scan driver 121 and an emission driver 122. The gate driving circuit 120 may output a gate signal (e.g., a scan signal or an emission signal, etc.) having a high-level voltage or a low-level voltage to a gate line (e.g., a scan line SL or an emission line EL, etc.).

[0074] The scan driver 121 may output a scan signal (e.g., a conduction level of the scan signal) to the plurality of scan lines SL1 to SLm in response to a scan driver control signal SCS. In an embodiment, for example, the scan driver control signal SCS may include a start signal indicating the start of a frame and a horizontal synchronization signal for outputting a gate signal (e.g., a scan signal) according to a timing at which a data voltage is applied, etc.

[0075] The scan driver 121 may be formed together with the display panel DP and may be formed in at least a partial region of a non-display area NDA (refer to Figure 3 ) of the display panel DP. According to an embodiment, at least a part of the scan driver 121 may be positioned to overlap with a display area DA. However, the present disclosure is not limited thereto. In an embodiment, for example, the scan driver 121 may be implemented as an integrated circuit (e.g., a gate driver integrated circuit (GDIC)) formed separately from the display panel DP.

[0076] The emission driver 122 may output an emission signal (e.g., a conduction level of the emission signal) to the plurality of emission lines EL1 to ELm in response to an emission driver control signal ECS. In an embodiment, for example, the emission driver control signal ECS may include a start signal and a horizontal synchronization signal for outputting a gate signal (e.g., an emission signal), etc.

[0077] The emission driver 122 may be formed together with the display panel DP and may be formed in at least a partial region of the non-display area NDA of the display panel DP. According to an embodiment, at least a part of the emission driver 122 may be positioned to overlap with the display area DA. However, the present disclosure is not limited thereto. In an embodiment, for example, the emission driver 122 may be implemented as an integrated circuit formed separately from the display panel DP.

[0078] The panel driving circuit 130 may include a data driver 131 and a timing controller 132. The panel driving circuit 130 may be implemented as a single integrated circuit, or the panel driving circuit 130 may be divided into two or more integrated circuits and implemented. For example, the data driver 131 and the timing controller 132 may be classified by function in one integrated circuit (or may be multiple functional blocks in one integrated circuit). In another embodiment, for example, the data driver 131 and the timing controller 132 may be implemented as separate integrated circuits. Hereinafter, for ease of description, an embodiment of the panel driving circuit in which the data driver 131 and the timing controller 132 are implemented as one integrated circuit will be described as an example, but the present disclosure is not limited thereto. In another embodiment, for example, the panel driving circuit 130 may be a driver integrated circuit DIC implemented as a timing controller embedded driver integrated circuit (TED-IC) (refer to Figure 8 ).

[0079] The data driver 131 may supply data voltages to a plurality of data lines DL1 to DLn. The data driver 131 may generate data voltages based on the image data DATA and the data driver control signal DCS, and output the generated data voltages to the plurality of data lines DL1 to DLn according to a timing. In an embodiment, for example, the data driver control signal DCS may include a source start pulse, a source shift clock, a source output enable, etc.

[0080] The timing controller 132 may be configured to control the data driver 131 or the gate driving circuit, etc. The timing controller 132 may receive a control signal CS (such as a synchronization signal, a data enable signal, or a clock signal, etc.) from the outside (for example, the host 140 (refer to Figure 12 ). The timing controller 132 may generate and output control signals DCS, SCS, ECS for controlling the data driver 131 and the gate driving circuit 120 based on the control signal CS.

[0081] The timing controller 132 may receive the input image data IDATA from the outside (for example, the host 140), and align the input image data IDATA in pixel row units. The timing controller 132 may convert the input image data IDATA according to a preset interface (such as a low voltage differential signal, a display port, or an embedded display port, etc.). The image data DATA may be obtained by conversion in the timing controller 132 according to the preset interface.

[0082] The timing controller 132 may receive from the outside (for example, Figure 12The host 140 shown therein receives input image data IDATA, a control signal CS, etc.

[0083] The timing controller 132 may receive power (e.g., interface driving power, logic driving power, etc.) from the outside (e.g., the power supply module 150 (refer to Figure 12 ))). The timing controller 132 may convert the input image data IDATA according to a preset interface or align the input image data IDATA in pixel row units by using the input power.

[0084] Figure 5 is a circuit diagram showing an embodiment of a pixel included in the Figure 4 display module.

[0085] For ease of illustration and description, Figure 5 a pixel PXij provided in the i-th row and the j-th column is shown as an example. Here, i and j are natural numbers.

[0086] Refer to Figure 5 , an embodiment of the pixel PXij may include a pixel circuit PXC connected to the i-th scan lines SL1_i to SL3_i and the j-th data line DLj and a light emitting element LD connected to the pixel circuit PXC.

[0087] The light emitting element LD may be connected between a first power supply line PL1 supplied with the voltage of a first driving power supply VDD and a second power supply line PL2 supplied with the voltage of a second driving power supply VSS. In an embodiment, for example, the light emitting element LD may be connected to the first driving power supply VDD via the pixel circuit PXC and the first power supply line PL1, and connected to the second driving power supply VSS via the second power supply line PL2.

[0088] The pixel circuit PXC of the pixel PXij may be electrically connected to the i-th scan lines SL1_i to SL3_i and the j-th data line DLj. In addition, the pixel circuit PXC may be electrically connected to the i-th emission control line ELi.

[0089] In an embodiment, as shown in Figure 5 , the pixel circuit PXC may include a first transistor M1 to a seventh transistor M7 and a storage capacitor Cst.

[0090] The first transistor M1 may be connected between a second node N2 and a third node N3. The first transistor M1 may generate a driving current and supply the driving current to the light emitting element LD. The gate electrode of the first transistor M1 may be connected to a first node N1. The first transistor M1 may control the amount of current (driving current) flowing from the first driving power supply VDD to the second driving power supply VSS via the light emitting element LD based on the voltage of the first node N1.

[0091] The second transistor M2 can be connected between the j-th data line DLj and the second node N2. The gate electrode of the second transistor M2 can be connected to the i-th first scan line SL1_i. When the first scan signal is supplied to the i-th first scan line SL1_i to electrically connect the j-th data line DLj and the second node N2, the second transistor M2 can be turned on.

[0092] The third transistor M3 can be connected between the first node N1 and the third node N3. The gate electrode of the third transistor M3 can be connected to the i-th first scan line SL1_i. The third transistor M3 can be turned on simultaneously with the second transistor M2.

[0093] The fourth transistor M4 can be connected between the first node N1 and the initialization power supply Vint. The gate electrode of the fourth transistor M4 can be connected to the i-th second scan line SL2_i. The fourth transistor M4 can be turned on by the second scan signal supplied to the second scan line SL2_i. When the fourth transistor M4 is turned on, the voltage of the initialization power supply Vint can be supplied to the first node N1 (i.e., the gate electrode of the first transistor M1).

[0094] The fifth transistor M5 can be connected between the first driving power supply VDD and the second node N2. The gate electrode of the fifth transistor M5 can be connected to the i-th emission control line ELi. The sixth transistor M6 can be connected between the third node N3 and the light-emitting element LD. The gate electrode of the sixth transistor M6 can be connected to the i-th emission control line ELi. The fifth transistor M5 and the sixth transistor M6 can be turned off when the emission control signal is supplied to the i-th emission control line ELi, and can be turned on in other cases.

[0095] According to an embodiment, when the fifth transistor M5 and the sixth transistor M6 are turned on, the current flowing in the first transistor M1 can be transmitted to the light-emitting element LD, and the light-emitting element LD can emit light. The emission period of the light-emitting element LD can be determined in response to the on-periods of the fifth transistor M5 and the sixth transistor M6. Additionally, the on-periods of the fifth transistor M5 and the sixth transistor M6 can correspond to the on-duty ratio (emission period) of the emission control signal, and the off-periods of the fifth transistor M5 and the sixth transistor M6 can correspond to the off-duty ratio (non-emission period) of the emission control signal.

[0096] The seventh transistor M7 can be connected to the first electrode of the light-emitting element LD (i.e., the fourth node N4). The gate electrode of the seventh transistor M7 can be connected to the i-th third scan line SL3_i. The seventh transistor M7 can be turned on by the third scan signal supplied to the i-th third scan line SL3_i to supply the voltage of the initialization power supply Vint to the first electrode of the light-emitting element LD.

[0097] The storage capacitor Cst can be connected between the first driving power supply VDD and the first node N1. Additionally, the storage capacitor Cst can include a first storage electrode and a second storage electrode. The first storage electrode can be electrically connected to the first driving power supply VDD, and the second storage electrode can be electrically connected to the first node N1. The storage capacitor Cst can be charged with a data voltage corresponding to the data signal supplied to the first node N1 during one frame period. Accordingly, the storage capacitor Cst can store a voltage corresponding to the potential difference between the voltage of the gate electrode of the first transistor M1 and the first driving power supply VDD.

[0098] Figure 5 An embodiment is shown in which all of the first transistor M1 to the seventh transistor M7 are P-type transistors, but the present disclosure is not limited thereto. In an embodiment, for example, at least one selected from the first transistor M1 to the seventh transistor M7 can be changed to an N-type transistor.

[0099] The structure of the pixel circuit PXC can be variously changed and implemented. In an embodiment, for example, the pixel circuit PXC can be constructed by including seven transistors and two capacitors. According to an embodiment, the pixel circuit PXC can include five transistors and two capacitors. However, the present disclosure is not limited thereto.

[0100] Figure 6 is Figure 4 a cross-sectional view of the display panel.

[0101] Reference Figure 6 , an embodiment of the display panel DP can include a substrate SUB and a pixel circuit layer PCL, a display element layer DPL, and a thin film encapsulation layer TFE sequentially stacked on the substrate SUB in a third direction DR3 intersecting the first direction DR1 and the second direction DR2. The input sensing layer ISL can be stacked on the thin film encapsulation layer TFE of the display panel DP. In Figure 6 , the input sensing layer ISL is shown as a structure separated from the display panel DP, but the input sensing layer ISL can be constructed as at least one layer constituting the display panel DP.

[0102] The substrate SUB can be a rigid substrate or a flexible substrate. In an embodiment where the substrate SUB is a rigid substrate, the substrate SUB can be one of a glass substrate, a quartz substrate, a glass-ceramic substrate, and a crystallized glass substrate. In an embodiment where the substrate SUB is a flexible substrate, the substrate SUB can be one of a thin film substrate and a plastic substrate including a polymer organic material. Additionally, the substrate SUB can include glass fiber reinforced plastic.

[0103] The pixel circuit layer PCL may be disposed on the substrate SUB. The pixel circuit layer PCL may include an insulating layer and semiconductor patterns and conductive patterns disposed between the insulating layers. The conductive patterns of the pixel circuit layer PCL may function as circuit elements or lines, etc.

[0104] The circuit elements of the pixel circuit layer PCL may include Figure 5 the pixel circuit PXC. In other words, the circuit elements of the pixel circuit layer PCL may be provided as transistors and one or more capacitors of the pixel circuit PXC. In an embodiment, for example, each of the transistors may have a form in which a semiconductor layer, a gate electrode, and a source electrode / drain electrode are sequentially stacked with an insulating layer therebetween. Additionally, the pixel circuit layer PCL may include one or more insulating layers.

[0105] The lines of the pixel circuit layer PCL may include lines connected to each of the pixels PX. The lines of the pixel circuit layer PCL may include various signal lines and / or voltage lines for driving the display element layer DPL.

[0106] The display element layer DPL may be disposed on the pixel circuit layer PCL. The display element layer DPL may include a light-emitting element LD that emits light (refer to Figure 5 ). The light-emitting element may be, for example, an organic light-emitting diode, but the present disclosure is not limited thereto. According to an embodiment, the light-emitting element may be an inorganic light-emitting element including an inorganic light-emitting material or a light-emitting element that emits light by changing the wavelength of the emitted light using quantum dots (quantum dot light-emitting element). The organic light-emitting diode may have, for example, a form in which an anode electrode, a hole transport layer, an organic light-emitting layer, an electron transport layer, and a cathode electrode are sequentially stacked, but is not limited thereto.

[0107] The thin film encapsulation layer TFE may be disposed on the display element layer DPL. The thin film encapsulation layer TFE may be an encapsulation substrate or may have the form of an encapsulation film formed of a multi-layer film. In an embodiment in which the thin film encapsulation layer TFE has the form of an encapsulation film, the thin film encapsulation layer TFE may include an inorganic film and / or an organic film. In an embodiment, for example, the thin film encapsulation layer TFE may have a form in which an inorganic film, an organic film, and an inorganic film are sequentially stacked. The thin film encapsulation layer TFE may prevent external air and moisture from penetrating into the display element layer DPL and the pixel circuit layer PCL.

[0108] The input sensing layer ISL may sense a user input on the first surface S1 of the display panel DP (refer to Figure 1 ). In an embodiment, for example, the input sensing layer ISL may sense an external object such as a user's hand or pen through a touch electrode. The input sensing layer ISL may be provided as a touch array TS (refer to Figure 3 ).

[0109] In an embodiment, the input sensing layer ISL may be directly disposed on the thin film encapsulation layer TFE. In this case, at least one layer of the thin film encapsulation layer TFE may be provided as a support layer (or substrate) for the input sensing layer ISL. In other embodiments, the input sensing layer ISL may be formed on a separate substrate, and the input sensing layer ISL formed on the separate substrate may be attached to the thin film encapsulation layer TFE.

[0110] Figure 7 is an exploded perspective view of Figure 1 an electronic device. In Figure 7 , for ease of illustration and description, the display panel is shown in a state where it is not bent.

[0111] Referring to Figure 7 , an embodiment of the electronic device ED may include a window WD, a display panel DP, and a housing member BC. Although not shown in Figure 7 , the electronic device ED may further include a touch array TS between the window WD and the display panel DP (refer to Figure 3 ).

[0112] The window WD may provide a first surface S1 of the electronic device ED (refer to Figure 1 ). Additionally, the window WD may include a transmissive region TA and a non-transmissive region NTA. For example, the window WD may be disposed on the display surface DS1 of the display panel DP (refer to Figure 11 ) to protect the display panel DP from external impacts. Additionally, the window WD may transmit an image provided from the display panel DP to the transmissive region TA. In such an embodiment of the electronic device ED, the image displayed in the display region DA of the display panel DP may be viewed from the outside through the transmissive region TA of the window WD.

[0113] The window WD may have a multi-layer structure including at least one selected from a glass substrate, a plastic film, and a plastic substrate. The multi-layer structure may be formed by a continuous process or a bonding process using an adhesive layer. The window WD may be fully or partially flexible.

[0114] The display panel DP may have a structure that is bent with a specific curvature along a bending axis BX. In an embodiment, for example, the display panel DP may be bent in a direction opposite to the third direction DR3 based on the bending axis BX.

[0115] The circuit board PB may be connected to one end (or one side surface) of the display panel DP. The circuit board PB may be disposed on the rear surface DS2 of the display panel DP (refer to Figure 11) above. The display panel DP can overlap with the circuit board PB and can be connected to the circuit board PB at one end (or one side surface) of the display panel DP. However, since the circuit board PB overlaps with the display panel DP, the area where components can be provided on the circuit board PB can be reduced.

[0116] The circuit board PB can be connected to the display panel DP to provide drive signals and voltages. In an embodiment, for example, the drive signal can be a signal for controlling the display panel DP to display an image, and the voltage can be a drive voltage required to drive the display panel DP.

[0117] The circuit board PB can be coupled to the display panel DP by an ultrasonic bonding method or a conductive adhesive member (not shown). Additionally, the circuit board PB can be fixed (e.g., bonded or attached) to the display panel DP by a thermal pressing process. According to an embodiment, the conductive adhesive member can include conductive particles formed in an adhesive film having adhesiveness. In such an embodiment, a first pad PD1 of the display panel DP (refer to Figure 8 ) and a second pad PD2 of the circuit board PB (refer to Figure 8 ) can be electrically connected through the conductive particles.

[0118] The circuit board PB can be constructed in various forms. The circuit board PB can be provided as a flexible printed circuit board (FPCB). In an embodiment, for example, the circuit board PB can be constructed by stacking at least one layer of copper foil on one surface or both surfaces of a base substrate including or formed of epoxy resin, etc., or can be constructed by stacking at least one layer of copper foil on one surface or both surfaces of a flexible plastic film. Additionally, the circuit board PB can have a multi-layer structure in which copper foil is formed inside the base substrate.

[0119] The accommodation member BC can be joined to the window WD. The accommodation member BC can provide the second surface S2 of the electronic device ED (refer to Figure 2 ). The accommodation member BC can be joined to the window WD to define an internal space. The accommodation member BC can include a material having relatively high rigidity. In an embodiment, for example, the accommodation member BC can include a plurality of frames and / or plates formed of glass, plastic, or metal. The accommodation member BC can stably protect the structure of the electronic device ED accommodated in the internal space from external impacts.

[0120] Additionally, the accommodation member BC can include a flexible material. In an embodiment, the electronic device ED can have foldable or bendable characteristics. In an embodiment, for example, as described above, the electronic device ED can be folded based on the folding axis FX (refer to Figure 2 ). As a result, the structures included in the electronic device ED can also have flexible characteristics.

[0121] Figure 8 is Figure 7 a plan view of a display panel. In Figure 8 , for ease of illustration and description, the display panel in a state where the display panel is not bent is shown.

[0122] Referring to Figure 8 , an embodiment of the display panel DP may include a display area DA, a non-display area NDA, and a fan-out area FOA.

[0123] The display area DA and the non-display area NDA of the display panel DP may include a first non-foldable area NFA1, a foldable area FA, and a second non-foldable area NFA2 sequentially arranged in a direction opposite to the first direction DR1. In addition, the foldable area FA may be folded based on a folding axis FX extending along the second direction DR2.

[0124] The scan driver 121 and the emission driver 122 may be disposed in the non-display area NDA of the display panel DP. The lines connected to the display panel DP, the scan driver 121, and the emission driver 122 may be disposed in the fan-out area FOA extending from the non-display area NDA of the display panel DP. A first pad area PDA1 in which a first pad PD1 is disposed may be further disposed in the fan-out area FOA. The lines connected to the display panel DP, the scan driver 121, and the emission driver 122 may be connected to at least a part of the first pad PD1.

[0125] Referring to Figure 4 and Figure 8 , the display panel DP may include pixels PX, a plurality of scan lines SL1 to SLm, a plurality of emission lines EL1 to ELm, and a plurality of data lines DL1 to DLn. According to an embodiment, the scan lines SL1 to SLm may extend in a direction opposite to the second direction DR2 and may be connected to the scan driver 121. The emission lines EL1 to ELm may extend in the second direction DR2 and may be connected to the emission driver 122. In addition, the data lines DL1 to DLn may extend in the first direction DR1 and may be electrically connected to at least a part of the first pad PD1 via the fan-out area FOA.

[0126] The driver integrated circuit DIC may be disposed on the display panel DP. The driver integrated circuit DIC may be disposed in the fan-out area FOA.

[0127] The driver integrated circuit DIC may be connected to at least a part of the first pad PD1. The driver integrated circuit DIC may provide signals required to drive the display panel DP through the first pad PD1 and the lines of the display panel DP. The driver integrated circuit DIC may include selected from Figure 4At least one of the data driver 131 and the timing controller 132. In an embodiment, for example, the driver integrated circuit DIC may be a source driver integrated circuit including the data driver 131. In another embodiment, for example, the driver integrated circuit DIC may be an integrated driver integrated circuit including not only the data driver 131 but also the timing controller 132. Additionally, various driving circuits for controlling the Figure 4 display panel DP of the display module DM may be included in the driver integrated circuit DIC. As Figure 8 shown, a single driver integrated circuit DIC may be provided on the display panel DP, but alternatively, multiple driver integrated circuits may also be provided on the display panel DP.

[0128] The driver integrated circuit DIC may be provided on the display panel DP to overlap with the first pad region PDA1. Additionally, the driver integrated circuit DIC may be provided on the display panel DP by a chip - on - glass (COG) method or a chip - on - plastic (COP) method.

[0129] The circuit board PB may include a second pad region PDA2. The second pad region PDA2 includes a second pad PD2. The second pad PD2 may be electrically connected to at least a part of the first pad PD1 and / or the driver integrated circuit DIC. In the present disclosure, electrical connection may include not only a structure in which a first electrical component and a second electrical component are directly connected to each other, but also a structure in which a first electrical component and a second electrical component are connected to each other through another electrical component.

[0130] At least a part of the second pad PD2 may be connected to the driver integrated circuit DIC to transmit signals. In an embodiment, for example, a host such as a processor may be mounted on the circuit board PB. The host may provide signals such as Figure 4 the input image data IDATA and the control signal CS to the driver integrated circuit DIC through at least a part of the second pad PD2. In an embodiment, for example, Figure 4 the timing controller 132 may be mounted on the circuit board PB. The timing controller 132 may provide signals such as Figure 4 the data driver control signal DCS and the image data DATA to the driver integrated circuit DIC through at least a part of the second pad PD2.

[0131] Another portion of the second pad PD2 may be connected to a portion of the first pad PD1. In an embodiment, for example, the display panel DP may receive signals and / or voltages from components mounted on the circuit board PB through the first pad region PDA1 and the second pad region PDA2. In other words, the display panel DP may receive signals and / or voltages from components of the circuit board PB instead of the driver integrated circuit DIC. In an embodiment, for example, electrical components such as capacitors and diodes may be mounted on the circuit board PB, and the electrical components may be connected to the driver integrated circuit DIC through the first pad region PDA1 and the second pad region PDA2. In other words, electrical components for the driver integrated circuit DIC may be provided on the circuit board PB.

[0132] Figure 9 is a diagram Figure 7 of a plan view of an embodiment of a display panel. In Figure 9 it, for ease of illustration and description, the display panel is shown in a state where it is not bent.

[0133] Reference Figure 9 , an embodiment of the display panel DP may include a first portion PT1 and a second portion PT2 in the fan-out region FOA. Hereinafter, any repeated detailed description of elements identical to those of the display panel DP and the circuit board PB described above with reference to Figure 7 and Figure 8 will be omitted.

[0134] The display panel DP may include a first portion PT1 extending from the non-display region NDA and being bent, and a second portion PT2 extending from the first portion PT1, protruding from the first portion PT1, and connected to the circuit board PB.

[0135] The first portion PT1 of the display panel DP may extend from the non-display region NDA in a direction opposite to the first direction DR1. The first portion PT1 may be bent around the bending axis BX in a direction opposite to the third direction DR3. Additionally, the first portion PT1 may be located between one end of the non-display region NDA and the circuit board PB. In an embodiment, for example, in a state where the display panel is not bent, the first portion PT1 may be located between the non-display region NDA and the circuit board PB.

[0136] The second portion PT2 of the display panel DP may extend from the first portion PT1. The second portion PT2 may be arranged to face the rear surface DS2 of the display panel DP (refer to Figure 11)). In an embodiment, for example, in a state where the first part PT1 is bent in a direction opposite to the third direction DR3, the second part PT2 may extend from the first part PT1 in the first direction DR1. In a state where the first part PT1 is bent in a direction opposite to the third direction DR3, the second part PT2 may overlap with the circuit board PB.

[0137] The second part PT2 of the display panel DP may be connected to the circuit board PB. In an embodiment, for example, the circuit board PB may be fixed to the second part PT2 of the display panel DP. In an embodiment, for example, during the manufacturing process, heat and pressure may be applied to the compression part CPR in a state where the circuit board PB is connected to the second part PT2 of the display panel DP, and thus, the circuit board PB may be fixed to the second part PT2 of the display panel DP.

[0138] In a case where the second part PT2 of the display panel DP and the circuit board PB overlap each other, the space for disposing components on the circuit board PB may be insufficient. In particular, when the display panel DP includes a foldable area FA (refer to Figure 8 ), the size of the circuit board PB may be reduced. In one case, for example, the circuit board PB may be designed to have a relatively small size so as not to overlap with the first non - foldable area NFA1 and the foldable area FA and only overlap with the second non - foldable area NFA2, such that the display panel DP can be folded without interference from the circuit board PB. In this case, the space for disposing components on the circuit board PB may be further insufficient.

[0139] In an embodiment, the second part PT2 of the display panel DP may have a shape protruding from the first part PT1. In an embodiment, for example, in a state where the first part PT1 is bent in a direction opposite to the third direction DR3, the second part PT2 may protrude from the first part PT1 in the first direction DR1. According to an embodiment, by cutting a part of the second part PT2, the second part PT2 may have a shape protruding from the first part PT1. The second part PT2 may extend from the first part PT1 and may have a width narrower than the width of the first part PT1. That is, the second part PT2 may have a width narrower than the non - display area NDA of the display panel DP and the width of the first part PT1. Here, the width may mean the length of the corresponding component along the second direction DR2.

[0140] Since the second part PT2 of the display panel DP has a shape protruding from the first part PT1, the circuit board PB can additionally secure an area that does not overlap with the display panel DP.

[0141] In an embodiment, as described above, by forming the width of the second part PT2 of the display panel DP to be relatively narrow, the circuit board PB can secure an additional area in the second direction of the second part PT2 or in the direction opposite to the second direction. In such an embodiment, the circuit board PB can secure an additional area in both the second direction of the second part PT2 and the direction opposite to the second direction. Accordingly, the area where components can be disposed in the circuit board PB can be used more effectively. Hereinafter, reference will be made to Figure 10 describe such features in detail.

[0142] Figure 10 is an enlarged view of part A shown Figure 9 in the figure.

[0143] Referring to Figure 10 , the circuit board PB can include a first area AR1 and a second area AR2. The first area AR1 of the circuit board PB can be disposed adjacent to the second part PT2 of the display panel DP in the second direction DR2 or in the direction opposite to the second direction DR2. The second area AR2 of the circuit board PB can be disposed adjacent to the second part PT2 of the display panel DP in the first direction DR1 or in the direction opposite to the first direction DR1. In Figure 10 , the first area AR1 is shown as being disposed adjacent to the second part PT2 of the display panel DP in the second direction DR2, but is not limited thereto. In an embodiment, for example, the first area AR1 can be disposed adjacent to the second part PT2 of the display panel DP in the direction opposite to the second direction DR2. Alternatively, based on the second part PT2 of the display panel DP, the first area AR1 can be disposed adjacent to the second part PT2 on both sides in the second direction DR2 and the direction opposite to the second direction DR2.

[0144] The display panel DP can include a first part PT1 and a second part PT2 extending from the non-display area NDA in the fan-out area FOA. The second part PT2 of the display panel DP can overlap at least a part of the circuit board PB. Additionally, the second part PT2 can include a compression part CPR. The driver integrated circuit DIC can be disposed in the second part PT2.

[0145] According to an embodiment, the first part PT1 of the display panel DP can have a first width w1 in the second direction DR2. The second part PT2 of the display panel DP can have a second width w2 in the second direction DR2. In such an embodiment, the second width w2 of the second part PT2 can be less than the first width w1 of the first part PT1.

[0146] In an embodiment, a first portion PT1 of the display panel DP may be located between the non-display area NDA and a second portion PT2. According to an embodiment, the first portion PT1 of the display panel DP may have a first width w1 in a second direction DR2. The non-display area NDA or the display surface DS1 of the display panel DP may have a third width w3 in the second direction DR2 that is greater than the width of the first portion PT1. In such an embodiment, the third width w3 of the display surface DS1 may be greater than the first width w1 of the first portion PT1.

[0147] In an embodiment, as described above, as the distance from the non-display area NDA increases, the display panel DP may have a gradually narrowing width in the fan-out area FOA. In particular, the second portion PT2 of the display panel DP that overlaps with the circuit board PB may have a width narrower than the width of the first portion PT1.

[0148] Since the second portion PT2 of the display panel DP has a protruding shape, the circuit board PB may additionally include a first area AR1. Accordingly, the first area AR1 of the circuit board PB may be additionally used to dispose components thereon. In an embodiment, for example, circuit elements electrically connected to the driver integrated circuit DIC may be disposed in the first area AR1. In an embodiment, for example, the circuit elements disposed in the first area AR1 may be capacitors or diodes, etc., and such circuit elements may be electrically connected to the driver integrated circuit DIC. However, the present disclosure is not limited thereto. In an embodiment, for example, in the case where the touch array TS (refer to Figure 3 ) is disposed on the display panel DP, a touch driving circuit configured to control the touch array TS may be disposed in the first area AR1.

[0149] Refer to Figure 10 , the first portion PT1 of the display panel DP may have a first edge EG1 adjacent to the first area AR1 and extending in the second direction DR2. The second portion PT2 of the display panel DP may have a second edge EG2 adjacent to the first area AR1 and extending in the first direction DR1. The first area AR1 may be formed adjacent to the first edge EG1 and the second edge EG2 on the circuit board PB. The first area AR1 may be a position on the circuit board PB that moves in the first direction DR1 to be adjacent to the first portion PT1 of the display panel DP. That is, the first area AR1 may be formed at a position closer to the first portion PT1 of the display panel DP than the compression portion CPR in the first direction DR1. Additionally, the first area AR1 may be formed at a position spaced apart from the driver integrated circuit DIC and / or the first pad PD1 in the second direction DR2.

[0150] The circuit board PB may include a second region AR2. The second region AR2 may refer to the region that overlaps with the display panel DP and the region of the circuit board PB other than the first region AR1. Since the first region AR1 is adjacent to the second part PT2 of the display panel DP, the second region AR2 may have a larger area. In an embodiment, for example, the area of the second region AR2 may be greater than the area of the first region AR1. Additionally, as the first region AR1 moves in the first direction DR1 based on the compression part CPR, the area of the second region AR2 may become larger. Here, at least one of a battery, a sensor module, an antenna module, and a sound output module may be disposed in the second region AR2. However, the components disposed in the second region AR2 are not limited thereto.

[0151] According to an embodiment, the circuit board PB may have a shape complementary to the shape of the display panel DP. That is, the circuit board PB may have a shape in which two ends protrude in the first direction DR1 on the side facing the display panel DP. In an embodiment, for example, the circuit board PB may have a shape in which, at two ends in the second direction DR2, a first edge EG1 and a second edge EG2 protrude in the first direction DR1 to face the display panel DP. The circuit board PB may include a first region AR1 in the protruding part. In such an embodiment, since the circuit board PB has a protruding shape, on the part that overlaps with the display panel DP, the side facing the display panel DP may be disposed between the driver integrated circuit DIC and the compression part CPR.

[0152] In an embodiment, as described above, the display panel DP may include a second part PT2 having a shape protruding from the first part PT1, and thus, the overlapping region between the display panel DP and the circuit board PB may be reduced. In such an embodiment, since the first region AR1 of the circuit board PB is additionally provided, the region of the circuit board PB where components can be disposed may be increased. Additionally, by utilizing the increased region of the circuit board PB, components can be disposed efficiently and / or effectively.

[0153] Figure 11 is a cross-sectional view taken along the Figure 1 line I-I'.

[0154] Reference Figure 11 , an embodiment of the electronic device ED may include a window WD, a display panel DP, a circuit board PB, and a housing member BC.

[0155] The electronic device ED may include an optical layer ARU and an outer coating OCL located between the window WD and the display panel DP. The window WD may be coupled to the optical layer ARU through an adhesive member ADH. Here, the adhesive member ADH may include an optically transparent adhesive (or bonding) member.

[0156] The electronic device ED may include a support member SPM, a circuit board PB, and a first region portion ARP1 and a second region portion ARP2 between the display panel DP and the receiving member BC. According to an embodiment, in a cross-sectional view, the display panel DP in the second non-foldable region NFA2 may include a display surface DS1 and a rear surface DS2 opposite to the display surface DS1. The display surface DS1 may be a surface of the display panel DP that contacts (or touches) the outer coating OCL, and the rear surface DS2 may be the other surface of the display panel DP that contacts the support member SPM.

[0157] The display panel DP may include a first portion PT1 bent in a direction opposite to the third direction DR3 and a second portion PT2 extending from the first portion PT1 in the first direction DR1, facing the rear surface DS2, protruding from the first portion PT1 in the first direction DR1, and connected to the circuit board PB.

[0158] The first portion PT1 may have a curved or bent shape with a predetermined radius of curvature. In an embodiment, for example, the first portion PT1 may have a shape that bulges in a direction opposite to the first direction DR1 of the display panel DP.

[0159] The second portion PT2 may overlap with the circuit board PB. As Figure 11 shown, since the display panel DP has a bent structure, the first region portion ARP1 and the second region portion ARP2 mounted on the circuit board PB may be disposed between the circuit board PB and the receiving member BC. The first region portion ARP1 may be a portion disposed in a first region adjacent to the second portion PT2 in the second direction DR2. In addition, the second region portion ARP2 may be a portion disposed in a second region adjacent to the second portion PT2 in the first direction DR1. Here, the second portion PT2 may extend from the first portion PT1 in the first direction DR1 and have a protruding shape with a width narrower than that of the first portion PT1 in the second direction DR2.

[0160] According to an embodiment, when viewed in the second direction DR2, the first region portion ARP1 may overlap with the second portion PT2. In addition, the first region portion ARP1 may overlap with at least a part of the second region portion ARP2.

[0161] In addition, when viewed in the second direction DR2, the first region portion ARP1 may overlap with the compressed portion CPR of the second portion PT2. In particular, the first region portion ARP1 may be disposed adjacent to the first portion PT1 rather than the compressed portion CPR. In addition, the first region portion ARP1 may be disposed on the same line as the second portion PT2 in the second direction DR2. As described above, due to the protruding shape of the second portion PT2, the first region portion ARP1 may be moved and disposed adjacent to the first portion PT1 of the display panel DP. In addition, the region where the second region portion ARP2 is disposed may become wider. Accordingly, the dead zone in the circuit board PB can be reduced, and components can be efficiently disposed.

[0162] Figure 12 is a system block diagram of an electronic device including a display device according to an embodiment of the present disclosure.

[0163] Reference Figure 12 , an embodiment of the electronic device ED including the display device DD may output various information. When the host 140 executes an application stored in the memory 2220, the electronic device ED may provide application information to the user through the display panel DP.

[0164] The host 140 may obtain an external input through the input module 2230 or the sensor module 2241, etc., and execute an application corresponding to the external input. For example, when a user of the electronic device ED selects a camera icon (or camera application) displayed on the display panel DP, the host 140 may obtain a user input through the input sensor 2241-2 and activate the camera module 2251. The host 140 may transmit image data corresponding to the captured image obtained through the camera module 2251 to the electronic device ED. The electronic device ED may display an image corresponding to the captured image through the display panel DP.

[0165] Above, the operation of the electronic device ED has been briefly described. Hereinafter, the configuration of the electronic device ED will be described in detail. Some of the configurations of the electronic device ED to be described later may be integrated and provided as one configuration, and one configuration may be divided into two or more configurations and provided.

[0166] The electronic device ED may communicate with an external electronic device EED through a network (e.g., a short-range wireless communication network or a long-range wireless communication network). According to an embodiment, the electronic device ED may include a host 140, a memory 2220, an input module 2230, a display device DD, a power module 150, an internal module 2240, and an external module 2250, etc. According to an embodiment, at least one of the above components may be omitted in the electronic device ED, or one or more other components may be added.

[0167] The host 140 may execute software to control at least another component (e.g., a hardware or software component) of the electronic device ED connected to the host 140, and perform various data processing or operations.

[0168] The host 140 may include a main processor 2211 and an auxiliary processor 2212. The main processor 2211 may include one or more of a central processing unit (CPU) 2211-1 or an application processor (AP). The main processor 2211 may further include any one of a graphics processing unit (GPU) 2211-2, a communication processor (CP), and an image signal processor (ISP). The main processor 2211 may further include a neural processing unit (NPU) 2211-3.

[0169] The host 140 may be disposed in a second area AR2 (refer to Figure 10 ) of the circuit board PB (refer to Figure 10 ). In an embodiment, for example, the host 140 may be mounted on the circuit board PB, and may provide signals such as input image data IDATA (refer to Figure 8 ) and a control signal CS (refer to Figure 4 ) through a driver integrated circuit DIC (refer to Figure 4 ).

[0170] The auxiliary processor 2212 may further include a touch driving circuit 2212-1. The touch driving circuit 2212-1 may supply a touch signal to the input sensor 2241-2, and receive a sensing signal from the input sensor 2241-2 in response to the touch signal. The touch driving circuit 2212-1 may be disposed in a first area AR1 (refer to Figure 10 ) of the circuit board PB (refer to Figure 10 ).

[0171] The memory 2220 may store various data used by at least one component (e.g., the host 140 or the sensor module 2241) of the electronic device ED, as well as input data or output data of commands related thereto. The memory 2220 may include at least one selected from a volatile memory 2221 and a non-volatile memory 2222.

[0172] The input module 2230 may receive commands or data to be used by components (e.g., the host 140, the sensor module 2241, or the sound output module 2243) of the electronic device ED from the outside of the electronic device ED (e.g., a user or an external electronic device EED).

[0173] The input module 2230 may include a first input module 2231 to which commands or data are input from a user, and a second input module 2232 to which commands or data are input from an external electronic device EED. The first input module 2231 may include a microphone, a mouse, a keyboard, a key (e.g., a button), or a pen (e.g., an active pen). The second input module 2232 may support a specified protocol capable of being connected to the external electronic device EED in a wired or wireless manner. According to an embodiment, the second input module 2232 may include a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0174] The display device DD may visually provide information to a user of the electronic device ED. The display device DD may include a display panel DP, a gate driving circuit 120, a panel driving circuit 130, and the like.

[0175] The power module 150 may supply power to components of the electronic device ED. The power module 150 may include a battery 152 that is charged with a power voltage. The battery 152 may be disposed in a second area AR2 of the circuit board PB (refer to Figure 10 ). The battery 152 may include a non-rechargeable primary battery, a rechargeable secondary battery, a fuel cell, or the like. The power circuit may include a power management integrated circuit (PMIC).

[0176] The electronic device ED may include an internal module 2240 and an external module 2250. The internal module 2240 may include a sensor module 2241, an antenna module 2242, a sound output module 2243, and the like. Here, at least one of the internal modules 2240 may be disposed in the second area AR2 of the circuit board PB (refer to Figure 10 ). In addition, the external module 2250 may include a camera module 2251, an optical module 2252, a communication module 2253, and the like.

[0177] The sensor module 2241 may sense an input of a user's body or a pen input among the first input module 2231, and may generate an electrical signal or a data value corresponding to the input. The sensor module 2241 may include at least one of a fingerprint sensor 2241-1, an input sensor 2241-2, and a digital converter 2241-3.

[0178] At least one selected from the fingerprint sensor 2241-1, the input sensor 2241-2, and the digital converter 2241-3 may be implemented as a sensor layer formed on the display panel DP through a continuous process (or defined by a sensor layer formed on the display panel DP through a continuous process). At least one selected from the fingerprint sensor 2241-1, the input sensor 2241-2, and the digital converter 2241-3 may be disposed on one side (e.g., the display surface) of the display panel DP, and another one selected from the fingerprint sensor 2241-1, the input sensor 2241-2, and the digital converter 2241-3 (e.g., the digital converter 2241-3) may be disposed on the other side (e.g., the rear surface) of the display panel DP.

[0179] At least two selected from the fingerprint sensor 2241-1, the input sensor 2241-2, and the digital converter 2241-3 may be formed by the same process to be integrated into one sensing panel. In an embodiment where at least two selected from the fingerprint sensor 2241-1, the input sensor 2241-2, and the digital converter 2241-3 are integrated into one sensing panel, the sensing panel may be disposed between the display panel DP and a window disposed on the display panel DP. According to an embodiment, the sensing panel may be disposed on the window. The position of the sensing panel is not particularly limited.

[0180] The sensor module 2241 may further generate an electrical signal or a data value corresponding to an internal state or an external state of the electronic device ED. The sensor module 2241 may further include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor, etc.

[0181] The antenna module 2242 may include one or more antennas for transmitting a signal or power to the outside or receiving a signal or power from the outside. According to an embodiment, the communication module 2253 may transmit a signal to an external electronic device EED or receive a signal from the external electronic device EED through an antenna suitable for a communication method.

[0182] The sound output module 2243 is a device for outputting a sound signal to the outside of the electronic device ED, and may include, for example, a speaker for general purposes such as multimedia playback or recording playback and a receiver dedicated to receiving a call, etc. According to an embodiment, the receiver may be formed integrally with or separately from the speaker.

[0183] The camera module 2251 may capture still images (e.g., photos) and moving images. According to an embodiment, the camera module 2251 may include one or more lenses, an image sensor, an image signal processor, an infrared camera, etc.

[0184] The light module 2252 may provide light. The light module 2252 may include a light emitting diode or a xenon lamp.

[0185] The communication module 2253 may support establishing a wired or wireless communication channel between the electronic device ED and an external electronic device EED and performing communication through the established communication channel. The communication module 2253 may include any one or two of a wireless communication module such as a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module and a wired communication module such as a local area network (LAN) communication module or a power line communication module. The various types of communication modules 2253 described above may be implemented as a single chip or may be implemented as separate chips.

[0186] The input module 2230, the sensor module 2241, the camera module 2251, etc. may be used to control the operation of the display device DD together with the host 140.

[0187] Some of the above components may be connected to each other by a communication method between peripheral devices such as a bus, a general-purpose input / output (GPIO), a serial peripheral interface (SPI), a mobile industry processor interface (MIPI), or a hyperpath interconnect (UPI) link to exchange signals (e.g., commands or data) with each other. The host 140 may communicate with the display device DD through a mutually agreed interface. For example, one of the above communication methods may be used, and it is not limited to the above communication methods.

[0188] According to an embodiment of the present disclosure, a display device is provided in which space in a circuit board is efficiently provided.

[0189] The present invention should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and these embodiments will fully convey the concept of the present invention to those skilled in the art.

[0190] Although the present invention has been specifically shown and described with reference to embodiments of the present invention, those of ordinary skill in the art will understand that various changes may be made therein in form and detail without departing from the spirit or scope of the present invention defined by the claims.

Claims

1. A display device, comprising: a display panel comprising a display area and a non-display area around the display area, wherein the display panel comprises a display surface and a rear surface opposite to the display surface, an image from the display area is displayed on the display surface; and A circuit board connected to the display panel, wherein the display panel further includes a first portion extending from the non-display area and being bent, and a second portion extending from the first portion in a first direction to face the rear surface of the display panel, protruding from the first portion in the first direction and connected to the circuit board, The first portion of the display panel has a first width in a second direction intersecting the first direction, and The second portion of the display panel has a second width in the second direction that is smaller than the first width.

2. The display device according to claim 1, wherein: The display surface has a third width in the second direction that is greater than the first width.

3. The display device according to claim 1, wherein: The circuit board is fixed to the second portion of the display panel.

4. The display device according to claim 1, wherein: The circuit board is a flexible circuit board.

5. The display device according to claim 1, further comprising: A driver integrated circuit is disposed on the second portion of the display panel and is electrically connected to the display panel through lines of the display panel.

6. The display device according to claim 1, wherein: The circuit board includes a first area disposed adjacent to the second portion of the display panel in the second direction or a direction opposite to the second direction.

7. The display device according to claim 6, wherein: The first portion of the display panel has a first edge adjacent to the first area and extending in the second direction, and The second portion of the display panel has a second edge adjacent to the first area and extending in the first direction.

8. The display device according to claim 7, wherein: The first region is formed on the circuit board adjacent to the first edge and the second edge.

9. The display device according to claim 6, further comprising: a driver integrated circuit disposed on the second portion of the display panel, wherein the driver integrated circuit controls the display panel; and A circuit element is disposed on the first area of ​​the circuit board and is electrically connected to the driver integrated circuit.

10. The display device according to claim 6, further comprising: A touch array, arranged on the display panel; a driver integrated circuit disposed on the second portion of the display panel, wherein the driver integrated circuit controls the display panel; and A touch driving circuit is arranged on the first area of ​​the circuit board, wherein the touch driving circuit controls the touch array.

11. The display device according to claim 10, wherein: The display panel comprises: substrate; A pixel circuit layer, disposed on the substrate, wherein the pixel circuit layer includes transistors; A display element layer including a light emitting element electrically connected to the transistor; and A thin film encapsulation layer is disposed on the display element layer, and Wherein, the touch array is arranged on the thin film encapsulation layer.

12. The display device according to claim 6, wherein: The circuit board further includes a second area disposed adjacent to the second portion of the display panel in the first direction.

13. The display device according to claim 12, wherein: The area of ​​the first region is smaller than the area of ​​the second region.

14. The display device according to claim 12, further comprising: a driver integrated circuit disposed on the second portion of the display panel, wherein the driver integrated circuit controls the display panel; and a circuit element disposed on the first area of ​​the circuit board and electrically connected to the driver integrated circuit, Wherein, at least one selected from a battery, a sensor module, an antenna module and a sound output module is arranged on the second area of ​​the circuit board.

15. The display device according to claim 12, further comprising: A touch array, arranged on the display panel; a driver integrated circuit disposed on the second portion of the display panel, wherein the driver integrated circuit controls the display panel; and A touch drive circuit is arranged on the first area of ​​the circuit board, wherein the touch drive circuit controls the touch array. Wherein, at least one selected from a battery, a sensor module, an antenna module and a sound output module is arranged on the second area of ​​the circuit board.

16. The display device according to any one of claims 1 to 15, wherein: The display area and the non-display area include a first non-foldable area, a foldable area, and a second non-foldable area sequentially arranged in a direction opposite to the first direction, and The foldable region is foldable based on a folding axis extending along the second direction.

17. The display device according to claim 16, wherein: The first portion of the display panel extends from an area adjacent to the second non-foldable area of ​​the non-display area of ​​the display panel, and The circuit board overlaps the second non-foldable area.

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