Display device

Abstract

A display device according to one embodiment includes: a display panel including at least one sensor hole; the back plate layer is arranged below the display panel; and a first reinforcing member surrounding the at least one sensor hole, where the at least one sensor hole passes through the display panel and the backplane layer, and the first reinforcing member is disposed coplanar with the backplane layer.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2023-0196950, filed on December 29, 2023, the entire contents of which are incorporated herein by reference for all purposes. Technical field

[0003] This specification relates to a display device. Background art

[0004] As the information society develops, various demands for display devices for displaying images increase, and various types of display devices such as liquid crystal display (LCD) devices and organic light emitting diode (OLED) display devices are utilized.

[0005] In display devices, as an advantage of self-emitting type OLED displays, they have a better viewing angle and contrast ratio than LCDs, and are lighter, thinner, and have low power consumption because they do not require a separate backlight. Additionally, OLED displays have the advantages that they can be driven at a low DC voltage, have a fast response speed, and especially have a low manufacturing cost.

[0006] In addition, in the case of a display device, an optical device can be embedded therein, but the optical device limits the screen design, making the screen design difficult. Therefore, the display device forms a space for the optical device by forming a hole. Summary of the invention

[0007] This specification relates to providing a display device having increased rigidity near a sensor hole.

[0008] This specification also relates to providing a display device capable of preventing cracks in a display panel.

[0009] This specification also relates to providing a display device having an extended area of a display region.

[0010] The object of this specification is not limited to the above-described object, and other technical objects can be inferred from the following embodiments.

[0011] To achieve these objects, a display device according to an embodiment includes: a display panel including at least one sensor hole; a backplane layer disposed under the display panel; and a first reinforcing member surrounding the at least one sensor hole, wherein the at least one sensor hole passes through the display panel and the backplane layer, and the first reinforcing member is disposed coplanarly with the backplane layer.

[0012] To achieve these objects, a display device according to another embodiment includes: a display panel including a sensor hole and a non-display area surrounding the sensor hole; and a first reinforcing member surrounding the sensor hole and located on a layer different from the display panel, wherein the first reinforcing member overlaps with the non-display area.

[0013] Details of other embodiments are included in the detailed description and the drawings.

[0014] The display panel of the display device according to an embodiment may further include a reinforcing member disposed near at least one sensor hole. The reinforcing member may supplement the rigidity of the sensor hole by surrounding the sensor hole vulnerable to external impact.

[0015] In addition, when the display area is positioned away from the sensor hole to prevent cracks generated from the sensor hole from transferring to the display area, the area of the display area may be reduced. However, the display device according to an embodiment may include a reinforcing member surrounding the sensor hole, thereby increasing the area of the display area.

[0016] In addition, the display device according to an embodiment may increase the durability of the display device and increase the lifespan of the display device by disposing a reinforcing member near the sensor hole vulnerable to external impact.

[0017] However, the effects obtainable from this specification are not limited to the effects described above, and other effects not mentioned will be clearly understood by those skilled in the art to which this specification pertains from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a plan view of a display device according to a first embodiment.

[0019] Figure 2 is along Figure 1 sectional view taken along line A-A' in

[0020] Figure 3 is Figure 1 an enlarged plan view of region Q1 in

[0021] Figure 4 is Figure 3 an enlarged plan view of region Q2 in

[0022] Figure 5 is along Figure 1 sectional view taken along line B-B' in

[0023] Figure 6 is along Figure 4 sectional view taken along line C-C' in

[0024] Figure 7 It is a schematic diagram showing the tensile stress of the display device according to the first embodiment.

[0025] Figure 8 It is a plan view of the display device according to the second embodiment.

[0026] Figure 9 It is along Figure 8 The sectional view taken along line D-D' in

[0027] Figure 10 It is a schematic diagram showing the tensile stress of the display device according to the second embodiment.

[0028] Figure 11 It is a plan view of the display device according to the third embodiment.

[0029] Figure 12 It is along Figure 11 The sectional view taken along line E-E' in

[0030] Figure 13 It is a schematic diagram showing the tensile stress of the display device according to the third embodiment.

[0031] Figure 14 It is a plan view of the display device according to the fourth embodiment.

[0032] Figure 15 It is a schematic diagram showing the tensile stress of the display device according to the fourth embodiment.

[0033] Figure 16 It is a schematic diagram showing the tensile stress of the display device according to the fifth embodiment.

[0034] Figure 17 It is a plan view of the display device according to the sixth embodiment.

[0035] Figure 18 It is a schematic diagram showing the tensile stress of the display device according to the sixth embodiment.

[0036] Figure 19 It is a plan view of the display device according to the seventh embodiment.

[0037] Figure 20 It is a schematic diagram showing the tensile stress of the display device according to the seventh embodiment. Detailed embodiments

[0038] Hereinafter, embodiments will be described with reference to the accompanying drawings. In this specification, when a first component (or region, layer, part, etc.) is described as being "on," "connected to," or "coupled to" a second component, this means that the first component can be directly connected / coupled to the second component, or a third component can be disposed between the first component and the second component.

[0039] Like reference numerals indicate like components. Additionally, in the drawings, the thickness, ratios, and dimensions of the components are exaggerated for effective description of the technical content. The term "and / or" includes all one or more combinations that can be defined by the associated configurations.

[0040] Terms such as first and second can be used to describe various components, but these components are not limited by these terms. These terms are only for the purpose of distinguishing one component from another. For example, without departing from the scope of the embodiments, the first component can be referred to as the second component, and similarly, the second component can also be referred to as the first component. Unless the context clearly dictates otherwise, singular expressions include plural expressions.

[0041] Terms such as "below," "at the lower side," "above," and "at the upper side" are used to describe the relationship between the components shown in the drawings. These terms are relative concepts and are described with respect to the directions marked in the drawings.

[0042] It should be understood that terms such as "including" or "having" are intended to specify the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in this specification, and do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0043] Figure 1 is a plan view of a display device according to a first embodiment.

[0044] Referring to Figure 1 , the display device 10 according to the first embodiment may include an optical module and a display panel. For example, the optical module may include sensors, and the sensors may include a camera device sensor, a distance monitoring sensor, or a face recognition sensor, but is not limited thereto.

[0045] The display panel may include a display area DA and a non-display area NDA. The display area DA may be an area for displaying an image. For example, the display area DA may be an active area. The non-display area NDA may be located near the display area DA, or may surround the display area DA. For example, the non-display area NDA may be a non-active area or a border area.

[0046] The display area DA in the display device 10 may include a plurality of sub-pixels SP. The sub-pixel SP may include a pixel circuit composed of a switching transistor, a driving transistor, an organic light-emitting diode, etc.

[0047] The display device 10 according to the first embodiment may be an organic light-emitting diode (OLED) display device, a quantum dot display device, a micro light-emitting diode (micro-LED) display device, etc., but is not limited thereto.

[0048] One or more sensor holes SH1 and SH2 may be provided in the display area DA. For example, sensors may be provided to correspond one-to-one with the sensor holes SH1 and SH2. For example, the sensors may be a camera device sensor, a distance monitoring sensor, or a face recognition sensor, but are not limited thereto. Since the sensors may be provided in each of the sensor holes SH1 and SH2, the non-display area NDA may be reduced, and the display area DA may be enlarged or widened. A product having an enlarged display area DA may increase the user's sense of immersion in the screen.

[0049] As shown, two sensor holes SH1 and SH2 may be provided. In this case, a camera device sensor may be provided in the first sensor hole SH1, and a distance monitoring sensor or a face recognition sensor may be provided in the second sensor hole SH2, but this specification is not limited thereto, and the camera device sensor and the distance monitoring sensor or the face recognition sensor may be provided interchangeably.

[0050] For example, the number and shape of the sensor holes may be changed in any of various ways. For example, one sensor hole or three or more sensor holes may be provided. Hereinafter, an example in which two sensor holes SH1 and SH2 are provided in the display area DA will be mainly described.

[0051] The non-display area NDA may include a first non-display area NDA1 adjacent to the display area DA and a second non-display area NDA2 adjacent to the sensor holes SH1 and SH2. For example, the first non-display area NDA1 may be located outside the display area DA and may surround the display area DA, and the second non-display area NDA2 may be located in the display area DA and may surround each of the sensor holes SH1 and SH2.

[0052] Figure 2 is a cross-sectional view taken along Figure 1 line A-A' in

[0053] Referring to Figure 1 and Figure 2, the display device 10 according to the first embodiment may include a display panel 100, a polarization layer 200 disposed on the display panel 100, a cover layer 300 disposed on the polarization layer 200, a film layer 400 disposed on the cover layer 300, a hard coat layer 500 disposed on the film layer 400, a backplane layer 600 disposed below the display panel 100, and coupling layers 810, 820, 830, and 840 that couple adjacent members 100, 200, 300, 400, and 600.

[0054] The display panel 100 may include a plurality of sub-pixels SP disposed in a display area of a base substrate and a driver disposed in a non-display area NDA near the display area DA to drive the sub-pixels SP. The sub-pixels SP may include a transistor TFT connected to the driver through a control signal line and a light-emitting element OLED connected to the transistor TFT. The transistor TFT is turned on or off according to a control signal applied through the control signal line to adjust the amount of current applied to the light-emitting element OLED. The light-emitting element OLED may emit light having a luminance corresponding to the amount of current applied through the transistor TFT. The light-emitting element OLED may include a light-emitting diode, but is not limited thereto. The display panel 100 may not be disposed in the first sensor hole SH1. Although Figure 2 shows Figure 1 a cross-sectional shape of the first sensor hole SH1 and regions DA, NDA2 near the first sensor hole SH1, the cross-sectional shape of the second sensor hole SH2 may also be substantially the same as the cross-sectional shape of the first sensor hole SH1.

[0055] The backplane layer 600 may be disposed below the display panel 100. The backplane layer 600 may be disposed below the display panel 100 to support the display panel 100. The backplane layer 600 may include a material capable of supporting the display panel 100. For example, the backplane layer 600 may include polyethylene terephthalate (PET), polyimide (PI), or polycarbonate (PC), but is not limited thereto. The backplane layer 600 may not be disposed in the first sensor hole SH1.

[0056] The polarization layer 200 may be disposed above the display panel 100. The polarization layer 200 may include a first retardation layer, a second retardation layer disposed on the first retardation layer, and a polarization layer disposed on the second retardation layer. In Figure 2 , the polarization layer 200 and the display panel 100 are shown separated from each other, but are not limited thereto, and the polarization layer 200 may be defined as being included in the display panel 100. The polarization layer 200 may not be disposed in the first sensor hole SH1.

[0057] The cover layer 300 may be disposed on the polarization layer 200. The cover layer 300 may be made of glass or a glass material including quartz. However, the cover layer 300 is not limited thereto and may be made of a plastic material.

[0058] The cover layer 300 may be disposed above the display panel 100 to protect the components disposed below the cover layer 300 from external influences. The modulus of the cover layer 300 is preferably less than or equal to 70 GPa, and the thickness t3 is also preferably less than or equal to about 100 μm. However, when the thickness of the cover layer 300 is too small, the cover layer 300 cannot be used to protect the components disposed below the cover layer 300, and thus the cover layer 300 preferably has a thickness of at least about 20 μm or more. The cover layer 300 may be a cover layer formed by chemical strengthening.

[0059] Meanwhile, although the cover layer 300 is used to protect the components disposed below the cover layer 300 from external influences, as described above, since the cover layer is made of a glass material, the cover layer 300 may be damaged by an external force to generate glass fragments, and the glass fragments may break outside the display device 10. In the first embodiment, in order to prevent the breakage of the glass fragments generated due to the breakage of the cover layer 300, a film layer 400 and a hard coat layer 500 may also be included above the cover layer 300.

[0060] The cover layer 300 may also be disposed in the first sensor hole SH1.

[0061] The film layer 400 may be used to protect the cover layer 300. The film layer 400 may be a thin film sheet made of a polymer organic material. The film layer 400 may have a high transmittance of 88% or higher, a heat resistance of 100 °C or higher, and a thermal expansion coefficient of 80e-6 / K or lower. This is to prevent the film layer 400 from bending or being damaged in a high temperature, high humidity, or thermal shock environment (e.g., 100 °C). In other words, the film layer 400 may have a low thermal expansion coefficient and may be made of a material with thermal stability. For example, the film layer 400 may be made of polyimide (PI), (poly)norbornene, high heat resistance polyester (PET), epoxy resin, polyurethane, etc. Alternatively, the film layer 400 may be made of a copolymer. For example, the film layer 400 may be made of a copolymer that joins polymethyl methacrylate (PMMA) with special PMMA, a copolymer that joins polycarbonate (PC) with PI, a copolymer that joins PMMA with PI, or a copolymer that joins polyurethane. The thickness of the film layer 400 may be about 75 μm or less. However, only when the thickness t4 of the film layer 400 is about 25 μm or more, the film layer 400 can be used to protect the cover layer 300. In other words, only when the thickness t4 of the film layer 400 is about 25 μm or more, the physical breakage of the cover layer 300 can be prevented, and the breakage can also be prevented even when the cover layer 300 is broken to generate glass fragments.

[0062] The modulus of the film layer 400 can be less than that of the cover layer 300 and greater than that of the third coupling layer 830. For example, the modulus of the film layer 400 can be in the range of 2 GPa to 8 GPa. Depending on the material of the film layer 400, the film layer 400 can have a modulus of 2 GPa or greater.

[0063] The film layer 400 can also be disposed in the first sensor hole SH1.

[0064] The hard coating 500 can be disposed on the film layer 400. The hard coating 500 can be formed by directly coating on the upper surface of the film layer 400. Since the hard coating 500 contacts the front surface of the cover layer 300, the hard coating 500 can be implemented as a surface protection layer with higher enhanced strength, and when the hard coating 500 is used as the surface protection layer, the hard coating 500 uses a material of a resin having a relatively high hardness during curing, such as a resin with a high content of acrylic resin or epoxy resin. In addition, the hard coating 500 can be given an anti-finger (AF) or anti-reflection (AR) function as needed, which can be achieved by synthesizing resins having these functions or by forming various patterns such as a moth-eye pattern.

[0065] The hard coating 500 can also be disposed in the first sensor hole SH1.

[0066] The coupling layers 810 to 840 can include a first coupling layer 810 that couples the backplane layer 600 to the display panel 100, a second coupling layer 820 that couples the display panel 100 to the polarizing layer 200, a third coupling layer 830 that couples the polarizing layer 200 to the cover layer 300, and a fourth coupling layer 840 that couples the cover layer 300 to the film layer 400.

[0067] Each of the coupling layers 810 to 840 can include an optically clear resin (OCR) or an optically clear adhesive (OCA).

[0068] The coupling layers 810 to 830 may not be disposed in the first sensor hole SH1. On the other hand, the fourth coupling layer 840 can be disposed in the first sensor hole SH1.

[0069] The first sensor OD1 can be disposed in the first sensor hole SH1. The first sensor OD1 can include any one of a camera device sensor, a distance monitoring sensor, and a face recognition sensor.

[0070] Figure 3 is Figure 1 an enlarged plan view of the region Q1 in.

[0071] Refer to Figure 3, the second non-display area NDA2 can completely surround each of the sensor holes SH1 and SH2. For example, the first sensor hole SH1 can have a circular shape with a first radius of curvature R1, and the second sensor hole SH2 can have a multi-curved shape with two or more second radii of curvature R2a and R2b. For example, the second sensor hole SH2 can have an elliptical shape. For example, the area of the second sensor hole SH2 facing the first sensor hole SH1 can have an elliptical shape and have two or more second radii of curvature R2a and R2b. Each of the second radii of curvature R2a and R2b can have a different radius of curvature.

[0072] Figure 4 is Figure 3 an enlarged plan view of the area Q2 in. In Figure 4 , although only the first sensor hole SH1 and the second non-display area NDA2 near the first sensor hole SH1 are shown, the second non-display area NDA2 near the second sensor hole SH2 (refer to Figure 3 ) can also be substantially the same as the second non-display area NDA2 near the first sensor hole SH1.

[0073] Refer to Figure 4 , the second non-display area NDA2 can include an outer separation area OSP between the first sensor hole SH1 and the display area DA, a dam area DMP between the outer separation area OSP and the display area DA, and an inner separation area ISP between the dam area DMP and the display area DA. The second non-display area NDA2 can completely surround the first sensor hole SH1. The outer separation area OSP, the dam area DMP, and the inner separation area ISP will be described in detail below.

[0074] Figure 5 is a cross-sectional view along the line B-B' in Figure 1 . Refer to Figure 5 , the display panel 100 can include a substrate 101, a buffer layer 102, a first thin film transistor 120, a second thin film transistor 130, a storage electrode 140, a light emitting part 150, a packaging part 170, and a touch part 180.

[0075] The substrate 101 can include one or more plastic materials. For example, the substrate 101 can be a multi-substrate including various plastic materials such as polyimide, but is not limited thereto.

[0076] The buffer layer 102 can be disposed on the substrate 101. The buffer layer 102 can minimize or delay the diffusion of moisture or oxygen permeating the substrate 101. The buffer layer 102 can be formed by laminating silicon nitride (SiNx) and silicon oxide (SiOx) alternately at least once, but is not limited thereto.

[0077] A first light blocking layer 126 may be disposed on the buffer layer 102. The first light blocking layer 126 may prevent light from transmitting through the first semiconductor layer 123 of the first thin film transistor 120. For example, the first semiconductor layer 123 may be disposed to overlap with the first light blocking layer 126. The first light blocking layer 126 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), nickel (Ni), neodymium (Nd), and copper (Cu), or their alloys, but is not limited thereto.

[0078] A first insulating layer 103 may be disposed on the first light blocking layer 126. The first insulating layer 103 may prevent a short circuit between the components of the first thin film transistor 120 and the first light blocking layer 126. The first insulating layer 103 may be made of the same material as the buffer layer 102, but is not limited thereto. For example, the first insulating layer 103 may be made of an inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), but is not limited thereto.

[0079] The first thin film transistor 120 may be disposed on the first insulating layer 103. The first thin film transistor 120 may include a first source electrode 121, a first gate electrode 122, a first semiconductor layer 123, and a first drain electrode 124.

[0080] The first semiconductor layer 123 may be disposed on the first insulating layer 103. The first semiconductor layer 123 may include a metal oxide semiconductor such as indium gallium zinc oxide (IGZO) and a silicon-based semiconductor material such as amorphous silicon or polycrystalline silicon, but is not limited thereto. The first semiconductor layer 123 may include a channel region, a source region, and a drain region.

[0081] Since the polycrystalline semiconductor layer has a higher mobility than the amorphous semiconductor layer and the oxide semiconductor layer, the power consumption can be low and the reliability can be excellent. Therefore, the driving transistor may be formed as a polycrystalline semiconductor layer.

[0082] A second insulating layer 104 may be disposed on the first semiconductor layer 123. The second insulating layer 104 may be made of the same material as the first insulating layer 103, and may prevent a short circuit between the first semiconductor layer 123 and another component of the first thin film transistor 120.

[0083] A first gate electrode 122 may be disposed on the second insulating layer 104. The first gate electrode 122 may be disposed on the second insulating layer 104 to overlap with the channel region of the first semiconductor layer 123. The first gate electrode 122 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or their compounds. The first gate electrode 122 may be disposed together with the gate line.

[0084] A third insulating layer 105 may be provided on the first gate electrode 122. The third insulating layer 105 may be made of the same material as the first insulating layer 103 or the second insulating layer 104.

[0085] The first source electrode 121 and the first drain electrode 124 may be provided on the third insulating layer 105.

[0086] The first source electrode 121 and the first drain electrode 124 may be electrically connected to the first semiconductor layer 123 through contact holes. The first source electrode 121 and the first drain electrode 124 may be made of a metal material. For example, the first source electrode 121 and the first drain electrode 124 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys, but are not limited thereto.

[0087] The first source electrode 121 and the first drain electrode 124 may be provided together with the data line. For example, the data line may be made of the same material as the first source electrode 121 and the first drain electrode 124, and may be formed coplanarly with them, but are not limited thereto.

[0088] The storage electrode 140 may be provided to be spaced apart from the first thin film transistor 120. The storage electrode 140 may include a first storage electrode 141, a second storage electrode 142, and a third storage electrode 143.

[0089] The first storage electrode 141 may be provided coplanarly with the first gate electrode 122, and may be made of the same material as the first gate electrode 122, but is not limited thereto.

[0090] The second storage electrode 142 may be provided above the first storage electrode 141. The second storage electrode 142 may be provided on the third insulating layer 105, and the third insulating layer 105 between the first storage electrode 141 and the second storage electrode 142 may be used as a dielectric to generate capacitance. The second storage electrode 142 may be made of the same material as the first storage electrode 141, but is not limited thereto.

[0091] The second thin film transistor 130 may be provided to be spaced apart from the first thin film transistor 120 and the storage electrode 140. The second thin film transistor 130 may include a second source electrode 131, a second gate electrode 132, a second semiconductor layer 133, and a second drain electrode 134.

[0092] The second light blocking layer 136 may be provided coplanarly with the second storage electrode 142.

[0093] Similar to the first light-blocking layer 126, the second light-blocking layer 136 can prevent light from being guided to the second semiconductor layer 133, thereby extending the lifespan of the second thin-film transistor 130. For example, the second semiconductor layer 133 can be arranged to overlap with the second light-blocking layer 136.

[0094] A fourth insulating layer 106 can be provided on the second light-blocking layer 136. The fourth insulating layer 106 can be made of the same material as the first insulating layer 103, the second insulating layer 104, or the third insulating layer 105, but is not limited thereto.

[0095] The second semiconductor layer 133 can be provided on the fourth insulating layer 106. The second semiconductor layer 133 can include a source region, a drain region, and a channel region between the source region and the drain region.

[0096] The second semiconductor layer 133 can include a metal oxide semiconductor such as indium-gallium-zinc oxide (IGZO) and a silicon-based semiconductor material such as amorphous silicon or polysilicon, but is not limited thereto.

[0097] A fifth insulating layer 108 can be provided on the second semiconductor layer 133. The fifth insulating layer 108 can be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, or the fourth insulating layer 106, but is not limited thereto.

[0098] A second gate electrode 132 can be provided on the fifth insulating layer 108.

[0099] The second gate electrode 132 can be made of the same material as the first gate electrode 122. For example, the second gate electrode 132 can be formed of a single layer or multiple layers made of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), or their compounds, but is not limited thereto.

[0100] A sixth insulating layer 109 can be provided on the second gate electrode 132. The sixth insulating layer 109 can be made of the same material as the first insulating layer 103, the second insulating layer 104, the third insulating layer 105, the fourth insulating layer 106, or the fifth insulating layer 108, but is not limited thereto.

[0101] The first source electrode 121, the first drain electrode 124, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 can be provided on the sixth insulating layer 109.

[0102] The third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be made of the same material as the first source electrode 121 and the first drain electrode 124 and be disposed coplanarly with them. For example, the third storage electrode 143, the second source electrode 131, and the second drain electrode 134 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys, but are not limited thereto.

[0103] The first thin film transistor 120 may be a driving transistor, and the second thin film transistor 130 may be a switching transistor, but is not limited thereto.

[0104] A first protective layer 111 may be disposed on the first source electrode 121 and the first drain electrode 124.

[0105] The first protective layer 111 may planarize the upper portion of the first thin film transistor 120 and protect the first thin film transistor 120. The first protective layer 111 may be made of an organic material. For example, the first protective layer 111 may be made of an organic material including acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin, but is not limited thereto.

[0106] A second protective layer 112 may be disposed on the first protective layer 111. The second protective layer 112 may be made of the same material as the first protective layer 111, but is not limited thereto.

[0107] A connection electrode 145 may be disposed between the first protective layer 111 and the second protective layer 112.

[0108] The connection electrode 145 may electrically connect the first thin film transistor 120 to the light emitting portion 150. The connection electrode 145 may be made of the same material as the first source electrode 121 and the first drain electrode 124, but is not limited thereto.

[0109] The connection electrode 145 may be formed of a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or their alloys, but is not limited thereto.

[0110] The light emitting portion 150 may be disposed on the second protective layer 112. The light emitting portion 150 may include an anode 151, an organic layer 152, and a cathode 153.

[0111] The anode 151 may be disposed on the second protective layer 112. The anode 151 may be electrically connected to the first thin film transistor 120 through a contact hole formed in the second protective layer 112. The anode 151 may be a reflective electrode that reflects light, but is not limited thereto. The anode 151 may include a laminated structure (Ti / Al / Ti) of metal materials such as aluminum (Al) and titanium (Ti) having a high reflectivity, a laminated structure (ITO / Al / ITO) of aluminum (Al) and indium tin oxide (ITO), or an APC alloy, and may be formed of a single layer or multiple layers, but is not limited thereto.

[0112] The organic layer 152 may be disposed on the anode 151. The organic layer 152 may include one or more light emitting structures (or one or more light emitting elements) laminated on the anode 151 in the order of a hole transport layer and an electron transport layer or in the reverse order. The organic layer 152 may be an organic light emitting layer, an inorganic light emitting layer, a quantum dot light emitting layer, a micro light emitting diode, a micro mini light emitting diode, etc., but is not limited thereto. For example, the organic layer 152 of the display panel 100 according to an embodiment of the present specification may include an organic light emitting layer. The organic layer 152 may include a red light emitting layer, a green light emitting layer, and a blue light emitting layer.

[0113] The cathode 153 may be disposed on the organic layer 152. The cathode 153 may be a transparent electrode that transmits light, but is not limited thereto. For example, the cathode 153 may include a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO) or a metal that transmits visible light.

[0114] The bank 154 may be provided to expose the anode 151. The bank 154 may define an opening (or a light emitting region) of a sub-pixel, and may be provided to cover an edge portion of the anode 151. Each sub-pixel may include a red light emitting region, a green light emitting region, and a blue light emitting region. For example, a sub-pixel may be defined as a pixel, but is not limited by the term.

[0115] The encapsulation part 170 may be disposed on the bank 154 or the light emitting part 150. The encapsulation part 170 may include one or more insulating layers. For example, the encapsulation part 170 may include a first encapsulation layer 171, a second encapsulation layer 172 disposed on the first encapsulation layer 171, and a third encapsulation layer 173 disposed on the second encapsulation layer 172. The encapsulation part 170 may include one or more inorganic layers and one or more organic layers. For example, the first encapsulation layer 171 and the third encapsulation layer 173 may include inorganic materials, and the second encapsulation layer 172 may include organic materials.

[0116] A touch buffer layer 181 may be provided on the encapsulation part 170. For example, the touch buffer layer 181 may be provided on the third encapsulation layer 173. The touch buffer layer 181 may be made of the same material as the buffer layer 102. A touch insulation layer 184 may be provided on the touch buffer layer 181. The touch insulation layer 184 may prevent short circuits between touch electrodes. The touch insulation layer 184 may be made of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof, but is not limited thereto. A first touch electrode 185 may be provided on the touch insulation layer 184. The first touch electrode 185 may include a 1a touch electrode 185a extending in a first direction and a 1b touch electrode 185b extending in a second direction different from the first direction.

[0117] A second touch electrode 182 may be provided between the touch buffer layer 181 and the touch insulation layer 184.

[0118] The second touch electrode 182 may be electrically connected to the 1a touch electrode 185a through a contact hole formed in the touch insulation layer 184. For example, the 1a touch electrode 185a and the second touch electrode 182 may extend in the first direction.

[0119] The first touch electrode 185 and the second touch electrode 182 may include a metal material. For example, the first touch electrode 185 and the second touch electrode 182 may be made of titanium (Ti), nickel (Ni), aluminum (Al), or an alloy thereof, and may be formed of three layers such as titanium (Ti) / aluminum (Al) / titanium (Ti), but is not limited thereto.

[0120] Figure 6 is a cross-sectional view along Figure 4 line C-C' in Figure 6 shows a cross-section of the second non-display area NDA2 and the first sensor hole SH1.

[0121] Referring to Figures 1 to 6 , the display panel 100 may include a substrate 101, an insulating layer provided on the substrate 101, and a pattern 112' provided on the insulating layer. The pattern 112' may be provided coplanarly with the second protective layer 112 and may include the same material. Hereinafter, descriptions that are substantially the same as those in Figure 3 will be given the same reference numerals, and their repeated descriptions will be omitted, and only the parts different from the descriptions in Figure 3 will be described.

[0122] Referring together to Figure 1, Although the screen immersion can be increased by maximizing the display area DA by forming sensor holes SH1 and SH2 inside the display area DA, the ends of the organic layer 152' can be exposed during the process of forming the sensor holes SH1 and SH2. Here, the organic layer 152' can be made of the same material as the organic layer 152 in the display area DA and can be formed coplanarly with the organic layer 152.

[0123] Therefore, a moisture-permeable path can be formed from the ends of the organic layer 152' exposed through the sensor holes SH1 and SH2 to the light-emitting part 150 of the display area DA. The display panel 100 can block moisture, oxygen, and foreign substances that may move along the moisture-permeable path by providing a disconnection structure such as the organic layer 152'.

[0124] The dam DAM can be provided in the dam area DMP.

[0125] The dam DAM can be made of the same material as the second protective layer 112 and the bank 154, and in order to reduce the area of the second non-display area NA2, only one dam DAM can be provided, but this specification is not limited thereto. Additionally, the organic layer 152' can be provided to cover the dam DAM. By increasing the distance of the moisture and oxygen permeation path, the dam DAM can more effectively prevent the permeation of moisture and oxygen.

[0126] In order to delay and block the permeation of moisture introduced from the outside through the exposed ends of the organic layer 152' and prevent damage to the display panel 100 due to foreign substances, the pattern 112' can be provided in the entire inner partition area ISP and the outer partition area OSP.

[0127] The touch buffer layer 181 can be formed across the entire display area DA and the second non-display area NDA2. For example, the touch buffer layer 181 can be formed across the entire inner partition area ISP, the dam area DMP, and the outer partition area OSP.

[0128] The hole crack detection part 186 can be formed on the touch buffer layer 181. For example, the hole crack detection part 186 can be formed in the second non-display area NDA2. For example, the hole crack detection part 186 can be formed in the inner partition area ISP, but is not limited thereto.

[0129] In the display panel 100, in addition to the substrate 101, sensor holes SH1 and SH2 can be formed in the components provided on the substrate 101. In addition to the substrate 101, the sensor holes SH1 and SH2 can expose the components provided on the substrate 101. In addition to the exposed substrate 101, the components provided on the substrate 101 may be exposed to physical or chemical damage. For example, cracks may occur in the regions corresponding to the sensor holes SH1 and SH2 of the display panel 100. For example, the hole crack detection portion 186 may be exposed to physical impacts and the like in the regions corresponding to the sensor holes SH1 and SH2.

[0130] When the hole crack detection portion 186 is disconnected by a crack, the hole crack detection portion 186 may not transmit an electrical signal and thus can detect the crack. The hole crack detection portion 186 can be provided coplanarly with the first touch electrode 185 and made of the same material. The hole crack detection portion 186 can also be formed to surround the sensor holes SH1 and SH2. For example, the hole crack detection portion 186 can be formed to have a curved surface corresponding to the sensor holes SH1 and SH2. For example, the hole crack detection portion 186 can be formed in the shape of two circles, but is not limited thereto. The hole crack detection portion 186 can be formed in the inner separation region ISP. For example, the hole crack detection portion 186 can be formed between the display region DA and the dam DAM, for example, formed to surround the dam DAM, but is not limited thereto.

[0131] A fourth metal layer 192 can be formed in the region overlapping the dam DAM. The fourth metal layer 192 can be formed coplanarly with the first gate electrode 122 and made of the same material as the first gate electrode 122. For example, the fourth metal layer 192 can be formed on the substrate 101. The fourth metal layer 192 can be an alignment mark required for the process of forming the sensor holes SH1 and SH2, but is not limited thereto.

[0132] The pattern 112' can be formed on the fifth insulating layer 108 and the sixth insulating layer 109. A plurality of patterns 112' can be provided. The plurality of patterns 112' can be spaced apart from each other. The pattern 112' can be disposed coplanarly with the second protective layer 112. In the inner separation region ISP and the outer separation region OSP, the sixth insulating layer 109 can be etched. The pattern 112' can be disposed on the non-etched region of the sixth insulating layer 109. The pattern 112' can not be disposed in the etched region of the sixth insulating layer 109. For example, the organic layer 152' can be disconnected by the pattern 112'. The organic layer 152' disconnected by the pattern 112' can be disposed on the fifth insulating layer 108 and the pattern 112'. The organic layer 152' disposed on the pattern 112' and the organic layer 152' disposed on the fifth insulating layer 108 can be physically separated (spaced apart) from each other. Accordingly, moisture and foreign substances introduced from the outside through the exposed ends of the organic layer 152' can be blocked, thereby preventing damage to the display panel 100.

[0133] Figure 7 is a schematic diagram showing the tensile stress of the display device according to the first embodiment. Figure 7 Shows the stress generated in the sensor holes SH1 and SH2 when a tensile stress of about 2 MPa is applied to each of one side and the other side in the second direction DR2 of the display device according to the first embodiment. The tensile stress of 2 MPa is applied for 1 second.

[0134] Refer to Figures 1 to 7 , the sensor holes SH1 and SH2 of the display device 10 according to the first embodiment may be very vulnerable to external shock or external pressure. In particular, when a predetermined amount of shock or pressure is applied to the sensor holes SH1 and SH2, cracks may occur in the display panel 100 adjacent to the sensor holes SH1 and SH2. As Figure 7 shown, when a tensile stress is applied to one side and the other side in the second direction DR2 of the display device of the first embodiment, it is confirmed that a maximum stress value Max of about 191 MPa is shown in the region of the second sensor hole SH2 facing the first sensor hole SH1. As referred to above Figure 3As described, the region of the second sensor hole SH2 facing the first sensor hole SH1 is a region having an elliptical shape with multiple curvatures R2a and R2b. Next, regions with high stress are shown at the end of the second sensor hole SH2 on the other side in the first direction DR1 and at the ends of the first sensor hole SH1 on one side and the other side in the first direction DR1. The reason for the generation of a large amount of stress at the ends of the sensor holes SH1 and SH2 in the first direction DR1 is that tensile stress is applied to each of one side and the other side of the display device 10 in the second direction DR2, and the reason for the generation of the maximum stress at the end of the second sensor hole SH2 on one side in the first direction DR1 is that the end of the second sensor hole SH2 on one side in the first direction DR1 has multiple curvatures R2a and R2b.

[0135] Based on the display device 10 according to the first embodiment, each of the sensor holes SH1 and SH2 with low rigidity may be exposed to external impacts. When an impact or pressure of a predetermined intensity or greater is applied to the sensor holes SH1 and SH2, cracks may be generated in the display panel 100 near the sensor holes SH1 and SH2, and when the cracks transfer to the display area DA along the display panel 100, it may cause physical damage, display defects, etc. of the display panel 100.

[0136] Figure 8 is a plan view of a display device according to the second embodiment. Figure 9 is along Figure 8 the line D-D' in Figure 10 is a schematic diagram showing the tensile stress of the display device according to the second embodiment. Figure 10 shows the stress generated in the sensor holes SH1 and SH2 when a tensile stress of about 2 MPa is applied to each of one side and the other side of the display device according to the second embodiment in the second direction DR2. The 2 MPa tensile stress is applied for 1 second.

[0137] Refer to Figures 8 to 10 , the display device 11 according to the second embodiment is different from the display device 10 according to Figures 1 to 6 in that it further includes a first reinforcing member RP1.

[0138] The first reinforcement member RP1 can surround the first sensor hole SH1 and the second sensor hole SH2 in a plan view. The first reinforcement member RP1 can completely surround the first sensor hole SH1 and the second sensor hole SH2 in a plane. The first reinforcement member RP1 can have a closed-loop shape. The first reinforcement member RP1 can be disposed in the second non-display area NDA2 near each of the sensor holes SH1 and SH2, and can also be disposed in the display area DA between the sensor holes SH1 and SH2. The sensors OD1 and OD2 can be respectively disposed in the sensor holes SH1 and SH2. The first reinforcement member RP1 can include: a first portion that is located on one side of the sensor holes SH1 and SH2 in the second direction DR2 and extends along the first direction DR1; a second portion that is located on the other side of the sensor holes SH1 and SH2 in the second direction DR2 and faces the first portion; a third portion that is located on one side of the first sensor hole SH1 in the first direction DR1 and extends along the second direction DR2; and a fourth portion that is located on the other side of the second sensor hole SH2 in the first direction DR1 and extends along the second direction DR2. The first reinforcement member RP1 can have a first width W1.

[0139] The first reinforcement member RP1 can be disposed coplanarly with the backplane layer 600. The backplane layer 600 can have an opening portion OP in the second non-display area NDA2. The first reinforcement member RP1 can be disposed in the opening portion OP. The first reinforcement member RP1 can have the same thickness as the backplane layer 600, but is not limited thereto.

[0140] The first reinforcement member RP1 can be arranged to surround the first sensor hole SH1 and the second sensor hole SH2 in a plan view, thereby supplementing the rigidity of the sensor holes SH1 and SH2 that are vulnerable to external impacts. For this purpose, the strength of the first reinforcement member RP1 can be greater than the strength of each of the display panel 100 and the backplane layer 600. For example, the first reinforcement member RP1 can include a metal, but the material is not limited as long as it is a material having a greater strength than the display panel 100 and the backplane layer 600.

[0141] The first reinforcement member RP1 can intersect with Figure 6 at least one of the outer separation area OSP, the dam area DMP, and the inner separation area ISP in

[0142] As Figure 10 shown, when tensile stresses are applied to one side and the other side of the display device according to the second embodiment in the second direction DR2, it is confirmed that, compared with Figure 7Similar to the display device according to the first embodiment, a maximum stress value Max of approximately 191 MPa is shown in the region of the second sensor hole SH2 facing the first sensor hole SH1. In Figure 10 Even when the first reinforcing member RP1 is provided, the reason why the maximum stress value Max is the same is that the first reinforcing member RP1 is only provided to surround the first sensor hole SH1 and the second sensor hole SH2 and is not provided near the end (elliptical shape) on one side of the second sensor hole SH2 in the first direction DR1, which is the part most vulnerable to external impact.

[0143] Figure 11 is a plan view of a display device according to the third embodiment. Figure 12 is along Figure 11 the cross-sectional view taken along line E-E' in Figure 13 is a schematic diagram showing the tensile stress of the display device according to the third embodiment. Figure 13 Shows the stress generated in the sensor holes SH1 and SH2 when a tensile stress of approximately 2 MPa is applied to each of one side and the other side in the second direction DR2 of the display device according to the third embodiment. The 2 MPa tensile stress is applied for 1 second.

[0144] Referring to Figures 11 to 13 According to the third embodiment, the display device 12 is different from the display device 11 according to Figures 8 to 10 in that it further includes a second reinforcing member RP2.

[0145] In the plan view, the first reinforcing member RP1 can surround the first sensor hole SH1 and the second sensor hole SH2. The first reinforcing member RP1 can include: a first part that is located on one side of the sensor holes SH1 and SH2 in the second direction DR2 and extends along the first direction DR1; a second part that is located on the other side of the sensor holes SH1 and SH2 in the second direction DR2 and faces the first part; a third part that is located on one side of the first sensor hole SH1 in the first direction DR1 and extends along the second direction DR2; and a fourth part that is located on the other side of the second sensor hole SH2 in the first direction DR1 and extends along the second direction DR2.

[0146] The second reinforcing member RP2 can extend along the second direction DR2 to connect to each of the first part and the second part of the first reinforcing member RP1. The end on one side of the second reinforcing member RP2 in the second direction DR2 can be connected to the first part of the first reinforcing member RP1, and the end on the other side of the second reinforcing member RP2 in the second direction DR2 can be connected to the second part of the first reinforcing member RP1.

[0147] The second reinforcing member RP2 may include the same material as the first reinforcing member RP1.

[0148] The second reinforcing member RP2 may be disposed coplanarly with the first reinforcing member RP1 and coplanarly with the backplane layer 600. The backplane layer 600 may also have an opening portion OP in the display area DA between the sensor holes SH1 and SH2. The second reinforcing member RP2 may be disposed in the opening portion OP of the display area DA between the sensor holes SH1 and SH2. The second reinforcing member RP2 may have the same thickness as the backplane layer 600, but is not limited thereto.

[0149] The width of the second reinforcing member RP2 in the first direction DR1 may be the same as the width of the first reinforcing member RP1, but is not limited thereto.

[0150] As Figure 13 shown, when tensile stress is applied to one side and the other side in the second direction DR2 of the display device according to the third embodiment, it is confirmed that, as with Figure 10 the display device according to the second embodiment, the maximum stress value Max is shown in the region of the second sensor hole SH2 facing the first sensor hole SH1. The stress is confirmed to be about 179 MPa. As described above, the first reinforcing member RP1 is only disposed to surround the first sensor hole SH1 and the second sensor hole SH2 and is not disposed near the end portion (elliptical shape) on one side of the second sensor hole SH2 in the first direction DR1, which is the portion most vulnerable to external impact. On the other hand, the display device 12 further includes a second reinforcing member RP2 extending in the second direction DR2 to connect to each of the first portion and the second portion of the first reinforcing member RP1, and thus, compared with Figures 1 to 7 the display device 10, the maximum stress value Max in the region of the second sensor hole SH2 facing the first sensor hole SH1 is reduced by about 6%.

[0151] In other words, since the display device 12 according to the third embodiment further includes a second reinforcing member RP2 disposed near the end portion (elliptical shape) on one side of the second sensor hole SH2 in the first direction DR1, which is the portion most vulnerable to external impact, the rigidity of the sensor holes SH1 and SH2 can be supplemented, and cracks can be prevented from being generated in the display panel 100 near the sensor holes SH1 and SH2.

[0152] Figure 14 is a plan view of a display device according to the fourth embodiment. Figure 15 is a schematic diagram showing the tensile stress of a display device according to the fourth embodiment. Figure 16It is a schematic diagram showing the tensile stress of the display device according to the fifth embodiment. Figure 15 and Figure 16 Each shows the stress generated in the sensor holes SH1 and SH2 when a tensile stress of about 2 MPa is applied to each of one side and the other side in the second direction DR2 of each of the display devices according to the fourth and fifth embodiments. The tensile stress of 2 MPa is applied for 1 second.

[0153] First, refer to Figures 14 to 16 , the display device 13 according to the fourth embodiment is different from the display device 12 according to Figures 10 to 13 in that the width W2 of the second reinforcing member RP2_1 is greater than the width W1 of the first reinforcing member RP1.

[0154] In a plan view, the first reinforcing member RP1 may surround the first sensor hole SH1 and the second sensor hole SH2. The first reinforcing member RP1 may include: a first portion located on one side of the sensor holes SH1 and SH2 in the second direction DR2 and extending along the first direction DR1; a second portion located on the other side of the sensor holes SH1 and SH2 in the second direction DR2 and facing the first portion; a third portion located on one side of the first sensor hole SH1 in the first direction DR1 and extending along the second direction DR2; and a fourth portion located on the other side of the second sensor hole SH2 in the first direction DR1 and extending along the second direction DR2.

[0155] The second reinforcing member RP2_1 may extend along the second direction DR2 to connect to each of the first portion and the second portion of the first reinforcing member RP1. One end of the second reinforcing member RP2 on one side in the second direction DR2 may be connected to the first portion of the first reinforcing member RP1, and the other end of the second reinforcing member RP2 on the other side in the second direction DR2 may be connected to the second portion of the first reinforcing member RP1.

[0156] The second reinforcing member RP2_1 may include the same material as the first reinforcing member RP1.

[0157] The second reinforcing member RP2_1 may be disposed coplanarly with the first reinforcing member RP1 and coplanarly with the backplane layer 600. The backplane layer 600 may also have an opening portion OP in the display area DA between the sensor holes SH1 and SH2. The second reinforcing member RP2_1 may be disposed in the opening portion OP of the display area DA between the sensor holes SH1 and SH2. The second reinforcing member RP2_1 may have the same thickness as the backplane layer 600, but is not limited thereto.

[0158] The width W2 of the second reinforcing member RP2_1 in the first direction DR1 can be greater than the width W1 of the first reinforcing member RP1.

[0159] As Figure 15 shown, when tensile stress is applied to one side and the other side in the second direction DR2 of the display device according to the fourth embodiment, it is confirmed that, similar to Figure 13 the display device according to the third embodiment, the maximum stress value Max is shown at the end on the other side in the first direction DR1 of the second sensor hole SH2. The stress is confirmed to be approximately 161 MPa. Since the display device 13 further includes a second reinforcing member RP2_1, the second reinforcing member RP2_1 extends along the second direction DR2 to connect to each of the first part and the second part of the first reinforcing member RP1 and is designed to have a width W2 of the second reinforcing member RP2_1 that is greater than the width W1 of the first reinforcing member RP1, the stress generated in the area of the second sensor hole SH2 facing the first sensor hole SH1 can be greatly reduced. Compared with Figures 1 to 7 the display device 10, the maximum stress value Max of the display device according to the fourth embodiment is reduced by approximately 16%.

[0160] In other words, since the display device 13 according to the fourth embodiment further includes a second reinforcing member RP2_1, the second reinforcing member RP2_1 is disposed near the end (elliptical shape) on one side in the first direction DR1 of the second sensor hole SH2, which is the part most vulnerable to external impact, and the second reinforcing member RP2_1 has a greater width than the first reinforcing member RP1, the rigidity of the sensor holes SH1 and SH2 can be supplemented, and cracks can be prevented from occurring in the display panel 100 near the sensor holes SH1 and SH2.

[0161] According to Figure 16 the display device according to the fifth embodiment is different from the display device 13 according to the fourth embodiment in that the reinforcing members RP1 and RP2_1 include graphite. The graphite can be a material with a lower strength than the metal of the reinforcing members RP1 and RP2_1 of Figure 14 the display device 13 but with a better heat dissipation function.

[0162] As Figure 14 and Figure 16 shown, when tensile stress is applied to one side and the other side in the second direction DR2 of the display device according to the fifth embodiment, even when the second reinforcing member RP2_1 has a sufficient width W2, the strength of the graphite is lower than that of the metal (but higher than the strength of the backplane layer 600 and the display panel 100), similar to Figure 15is the same as the display device according to the fourth embodiment, and the maximum stress value Max is shown at the end of the second sensor hole SH2 on one side in the first direction DR1. The stress is confirmed to be about 182 MPa.

[0163] Compared with Figures 1 to 7 the display device 10, the maximum stress value Max of the display device according to the fifth embodiment is reduced by about 5%.

[0164] However, in the display device according to the present embodiment, there is the following advantage: by coating graphite on the second reinforcing member RP2_1, the heat resistance near the sensor holes SH1 and SH2 can be enhanced.

[0165] To improve the heat resistance or heat dissipation function of the display device, applying graphite to the reinforcing member can be applied in the same way to the embodiments according to Figure 8 and Figure 11 and can also be applied to the embodiments according to Figure 17 and Figure 19 which will be described below.

[0166] Figure 17 is a plan view of the display device according to the sixth embodiment. Figure 18 is a schematic diagram showing the tensile stress of the display device according to the sixth embodiment.

[0167] Referring to Figure 17 and Figure 18 the display device 14 according to the sixth embodiment is different from the display device 11 according to Figures 11 to 13 in that the second reinforcing member RP2 is positioned closer to the second sensor hole SH2 than to the first proximity sensor hole SH1.

[0168] For example, the distance L1 between the second reinforcing member RP2 and the first sensor hole SH1 may be greater than the distance L2 between the second reinforcing member RP2 and the second sensor hole SH2. That is, the distance L2 between the second reinforcing member RP2 and the second sensor hole SH2 may be less than the distance L1 between the second reinforcing member RP2 and the first sensor hole SH1.

[0169] As Figure 18 shown, when tensile stress is applied to one side and the other side of the display device according to the sixth embodiment in the second direction DR2, it is confirmed that compared with Figure 13is the same as the display device according to the third embodiment, and the maximum stress value Max is shown at the end of the second sensor hole SH2 on the other side in the first direction DR1. The stress is confirmed to be about 170 MPa. Since the second reinforcing member RP2 of the display device 14 can be arranged closer to the second sensor hole SH2 than to the first sensor hole SH1, the stress generated in the area of the second sensor hole SH2 facing the first sensor hole SH1 can be greatly reduced. Compared with Figures 1 to 7 the display device 10, the maximum stress value Max of the display device according to the sixth embodiment is reduced by about 11%.

[0170] In other words, since the display device 14 according to the sixth embodiment further includes a second reinforcing member RP2 disposed near the end (elliptical shape) on one side of the second sensor hole SH2 in the first direction DR1, which is the part most vulnerable to external impact, the rigidity of the sensor holes SH1 and SH2 can be supplemented, and cracks can be prevented from occurring in the display panel 100 near the sensor holes SH1 and SH2.

[0171] The structure of positioning the second reinforcing member closer to the second sensor hole SH2 than to the first sensor hole SH1 can also be applied in the same way to Figure 14 the display device 13 and Figure 16 the display device.

[0172] Figure 19 is a plan view of the display device according to the seventh embodiment. Figure 20 is a schematic diagram showing the tensile stress of the display device according to the seventh embodiment.

[0173] Referring to Figure 19 and Figure 20 , the display device 15 according to the seventh embodiment is different from the display device 14 according to Figure 17 and Figure 18 in that the second reinforcing member RP2 is positioned farther from the second sensor hole SH2 than from the first sensor hole SH1.

[0174] For example, the distance L1 between the second reinforcing member RP2 and the first sensor hole SH1 can be less than the distance L2 between the second reinforcing member RP2 and the second sensor hole SH2. That is, the distance L2 between the second reinforcing member RP2 and the second sensor hole SH2 can be greater than the distance L1 between the second reinforcing member RP2 and the first sensor hole SH1.

[0175] As Figure 20 shown, when tensile stress is applied to one side and the other side of the display device according to the seventh embodiment in the second direction DR2, compared withFigure 18 is the same as the display device according to the sixth embodiment, and the maximum stress value Max is shown at an end portion on one side in the first direction DR1 of the second sensor hole SH2. The stress is confirmed to be about 186 MPa. The second reinforcing member RP2 of the display device 15 can be arranged to be farther from the second sensor hole SH2 than the first sensor hole SH1. As described above, the maximum stress is generated in the region of the second sensor hole SH2 facing the first sensor hole SH1, and different from the display device 14 according to the sixth embodiment, since the second reinforcing member RP2 is arranged to be farther from the second sensor hole SH2, the stress reduction effect of the sensor holes SH1 and SH2 is not good compared with the display device 14 according to the sixth embodiment.

[0176] However, compared with Figures 1 to 7 the display device 10, the maximum stress value Max of the display device according to the seventh embodiment is reduced by about 3%.

[0177] A display device according to some embodiments includes: a display panel including at least one sensor hole; a backplane layer provided below the display panel; and a first reinforcing member surrounding the at least one sensor hole, wherein the at least one sensor hole passes through the display panel and the backplane layer, and the first reinforcing member is disposed coplanarly with the backplane layer.

[0178] The backplane layer may include an opening portion surrounding the at least one sensor hole, and the first reinforcing member may be disposed in the opening portion.

[0179] The at least one sensor hole may include a first sensor hole and a second sensor hole.

[0180] The first reinforcing member may form a closed loop and completely surround the first sensor hole and the second sensor hole.

[0181] The display device may further include a second reinforcing member disposed coplanarly with the first reinforcing member, wherein the second reinforcing member may extend in a space between the first sensor hole and the second sensor hole and may be directly connected to the first reinforcing member.

[0182] The first sensor hole and the second sensor hole may have different shapes.

[0183] The first sensor hole may have one radius of curvature, and the second sensor hole may have two or more radii of curvature.

[0184] The first sensor hole may have a circular shape, and the second sensor hole may have an elliptical shape.

[0185] The second reinforcing member may be positioned closer to the second sensor hole than to the first sensor hole.

[0186] The width of the second reinforcing member may be greater than the width of the first reinforcing member.

[0187] The strength of the first reinforcing member may be greater than the strength of the backplane layer.

[0188] The first reinforcing member may include metal or graphite.

[0189] A display device according to some embodiments includes: a display panel including a sensor hole and a non-display area surrounding the sensor hole; and a first reinforcing member surrounding the sensor hole and located on a layer different from the display panel, wherein the first reinforcing member overlaps with the non-display area.

[0190] The non-display area may include an inner partition area between the display area of the display panel and the sensor hole, a dam area between the inner partition area and the sensor hole, and an outer partition area between the dam area and the sensor hole.

[0191] The first reinforcing member may overlap with the outer partition area.

[0192] The display area may include an organic layer, and the organic layer may be separated from each of the inner partition area and the outer partition area.

[0193] The display device may further include a backplane layer disposed below the display panel, and the sensor hole may pass through the display panel and the backplane layer.

[0194] The first reinforcing member may be disposed coplanarly with the backplane layer.

[0195] The display device may further include a cover layer disposed on the display panel, and the cover layer may overlap with the sensor hole.

[0196] The display device may further include a second reinforcing member disposed coplanarly with the first reinforcing member, wherein the second reinforcing member extends in the display area between the sensor holes and is directly connected to the first reinforcing member.

[0197] Although the embodiments have been described above with reference to the drawings, those skilled in the art to which this specification pertains will be able to understand that the above-described technical configurations can be implemented in other specific forms without changing their technical spirit or basic features. Therefore, it should be understood that the above-described embodiments are exemplary in all aspects and not restrictive. In addition, the scope of the embodiments is indicated by the described claims rather than the specific embodiments. Further, the meaning and scope of the claims and all changes or modifications derived from their equivalent concepts should be construed as being included within the scope of the embodiments.

[0198] Description of Reference Numerals 10, 11, 12, 13, 14, 15: display device 100: display panel

[0199] 200: Polarization layer

[0200] 300: Covering layer

[0201] 400: Film layer

[0202] 500: Hard coating

[0203] 600: Backplane layer

[0204] RP1: First reinforcement member

[0205] RP2: Second reinforcement member

Claims

1. A display device, comprising: a display panel, the display panel comprising at least one sensor hole; A backplane layer, the backplane layer being arranged below the display panel; as well as a first reinforcement member, the first reinforcement member surrounding the at least one sensor hole, wherein the at least one sensor hole passes through the display panel and the backplane layer, and The first reinforcement member is disposed coplanarly with the backing layer.

2. The display device according to claim 1, wherein: The back plate layer includes an opening portion surrounding the at least one sensor hole, and the first reinforcement member is disposed in the opening portion.

3. The display device according to claim 1, wherein: The at least one sensor hole includes a first sensor hole and a second sensor hole.

4. The display device according to claim 3, wherein: The first reinforcing member forms a closed loop and completely surrounds the first sensor hole and the second sensor hole.

5. The display device according to claim 4, further comprising a second reinforcement member disposed coplanarly with the first reinforcement member, wherein: The second reinforcement member extends in a space between the first sensor hole and the second sensor hole and is directly connected to the first reinforcement member.

6. The display device according to claim 5, wherein: The first sensor hole and the second sensor hole have different shapes.

7. The display device according to claim 6, wherein: The first sensor aperture has one radius of curvature and the second sensor aperture has two or more radii of curvature.

8. The display device according to claim 7, wherein: The first sensor hole has a circular shape, and the second sensor hole has an elliptical shape.

9. The display device according to claim 7, wherein: The second reinforcement member is positioned closer to the second sensor hole than to the first sensor hole.

10. The display device according to claim 5, wherein: The second reinforcing member has a width greater than a width of the first reinforcing member.

11. The display device according to claim 1, wherein: The strength of the first reinforcing member is greater than the strength of the back plate layer.

12. The display device according to claim 11, wherein: The first reinforcement member includes metal or graphite.

13. A display device, comprising: A display panel, the display panel comprising a sensor hole and a non-display area surrounding the sensor hole; as well as a first reinforcement member surrounding the sensor hole and located on a different layer from the display panel, and The first reinforcement member overlaps the non-display area.

14. The display device according to claim 13, wherein: The non-display area includes an inner partition area between a display area of ​​the display panel and the sensor hole, a dam area between the inner partition area and the sensor hole, and an outer partition area between the dam area and the sensor hole.

15. The display device according to claim 14, wherein: The first reinforcement member overlaps the outer partition region.

16. The display device according to claim 14, wherein: The display region includes an organic layer, and the organic layer is spaced apart from each of the inner partition region and the outer partition region.

17. The display device according to claim 13, wherein: The display device further includes a backplane layer disposed below the display panel, and the sensor hole passes through the display panel and the backplane layer.

18. The display device according to claim 17, wherein: The first reinforcement member is disposed coplanarly with the backing layer.

19. The display device according to claim 17, further comprising a cover layer disposed on the display panel, wherein: The cover layer overlaps the sensor hole.

20. The display device according to claim 13, further comprising a second reinforcing member disposed coplanarly with the first reinforcing member, wherein The second reinforcing member extends in the display area between the sensor holes and is directly connected to the first reinforcing member.

Images