Memory connection system and electronic equipment

Abstract

The present application provides a memory connection system and electronic device that can be applied to the field of memory device technology. The memory connection system includes: a memory connector, including a first connector, a second connector, and a signal connection assembly, wherein the first connector is disposed on the second connector, and the second connector is disposed on a main circuit board, the first connector extending along a first direction, and the second connector extending along a second direction perpendicular to the first direction; the signal connection assembly is disposed within the first connector and the second connector; and a plurality of memory slots disposed on the first connector and extending along the second direction, such that the openings of the plurality of memory slots are parallel to the main circuit board.

Description

Technical Field

[0001] The present application relates to the technical field of memory devices, and in particular to a memory connection system and electronic equipment. Background Art

[0002] Memory is a core component of modern servers. As server computing scale and computing power gradually expand, the amount of internal memory and processor processing power required by servers are also increasing. However, processor processing power is often related to its size. As processor size increases, the space available for memory decreases, making it difficult to meet the high demands of servers. Summary of the Invention

[0003] In view of the above problems, the present application provides a memory connection system and an electronic device.

[0004] According to the first aspect of the present application, a memory connection system is provided, comprising: a memory connector, comprising a first connector, a second connector, and a signal connection assembly, wherein the first connector is arranged on the second connector, the second connector is arranged on the main circuit board, the first connector extends along a first direction, and the second connector extends along a second direction perpendicular to the first direction; the signal connection assembly is arranged in the first connector and the second connector; a plurality of memory slots are arranged on the first connector and extend along the second direction, so that the openings of the plurality of memory slots are parallel to the main circuit board.

[0005] The second aspect of the present application provides an electronic device, including: a memory connection system, arranged on a main circuit board; a memory module, accommodated in a memory slot of the memory connection system; a processor, arranged on the main circuit board, for providing power supply signals and memory signals to the memory module via multiple routing paths electrically connected to the processor via the memory connection system.

[0006] According to an embodiment of the present application, a memory connection system may include a memory connector and multiple memory slots. The memory connector may include a first connector, a second connector and a signal connection component. The first connector and the second connector are arranged adjacent to each other on the main circuit board. The first connector can extend along a first direction perpendicular to the main circuit board, and the second connector can extend along a second direction parallel to the main circuit board. The signal connection component can be arranged in the first connector and the second connector with a hollow structure inside. Multiple memory slots can be arranged adjacent to the first connector, and the extension direction of the bottom surface of the multiple memory slots is the first direction, thereby realizing the arrangement of multiple memory slots stacked side by side along the first direction on the first connector, and the multiple memory slots are all parallel to the main circuit board.

[0007] According to an embodiment of the present application, when the memory modules are inserted into the multiple memory slots on the memory connector, the opening of each memory slot is oriented parallel to the main circuit board, so that the multiple memory modules inserted into the multiple memory slots are also parallel to the main circuit board. Combined with the internal signal connection components that can interconnect the pins, the physical area of ​​the second connector and the main circuit board can be reduced. When the same number of memory modules need to be used, the space occupied by the memory modules and the memory connector is reduced, so that more memory modules can be arranged in the predetermined memory space, so as to adapt to the high computing power of the processor, simplify the assembly process of various hardware components on the main circuit board, and reduce production costs.

[0008] According to the embodiments of the present application, by means of a signal connection component in the memory connector that is electrically connected to the memory slot and the main circuit board, the length of the component connection line of the signal connection component can be further shortened. There is no need to provide a circuit board in the connector and lay out traces on the circuit board, thereby reducing problems such as signal delay, reflection and crosstalk during transmission, and improving the integrity of the signal transmitted between the memory module. Furthermore, since there is no need to transmit signals through traces on the circuit board in the connector, the memory configuration can be adjusted without changing the structural parameters of the chassis and the motherboard, so as to facilitate memory upgrade, maintenance and configuration adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above contents and other objects, features and advantages of the present application will become more apparent through the following description of the embodiments of the present application with reference to the accompanying drawings, in which:

[0010] Figure 1 A schematic diagram of a memory connection system according to an embodiment of the present application is shown;

[0011] Figure 2 shows a front view of a memory connection system according to an embodiment of the present application;

[0012] Figure 3 A schematic diagram of a golden finger guiding line according to an embodiment of the present application is shown;

[0013] Figure 4 A schematic diagram of a memory connection system including signal transmission conductors according to an embodiment of the present application is shown;

[0014] Figure 5 A schematic diagram showing bottom pins of a second connector corresponding to a plurality of memory slots according to an embodiment of the present application is shown;

[0015] Figure 6 A schematic diagram of a second connector bottom package corresponding to a memory slot according to an embodiment of the present application is shown;

[0016] Figure 7A schematic diagram of a second connector bottom package corresponding to a memory slot according to another embodiment of the present application is shown;

[0017] Figure 8 A schematic diagram showing a correspondence between the first connector package pins and the second connector package pins and the gold finger guide wires according to an embodiment of the present application;

[0018] Figure 9 A schematic diagram showing inner layer routing from a processor to the farthest memory module according to an embodiment of the present application is shown;

[0019] Figure 10 A schematic diagram of a spring-type pin according to an embodiment of the present application is shown;

[0020] Figure 11 A schematic diagram of a plug-in pin according to an embodiment of the present application is shown;

[0021] Figure 12 A schematic diagram of the bottom of a memory slot according to an embodiment of the present application is shown;

[0022] Figure 13 A schematic diagram showing the wiring at the bottom of a memory slot according to an embodiment of the present application is shown;

[0023] Figure 14 A schematic diagram of an electronic device according to an embodiment of the present application is shown. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present application will be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the present application. In the detailed description below, for ease of explanation, many specific details are set forth to provide a comprehensive understanding of the embodiments of the present application. However, it is apparent that one or more embodiments may also be implemented without these specific details. In addition, in the following description, descriptions of known structures and technologies are omitted to avoid unnecessarily confusing the concepts of the present application.

[0025] The terms used herein are only for describing specific embodiments and are not intended to limit this application. The terms "comprise," "include," etc. used herein indicate the presence of the features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0026] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art unless otherwise defined. It should be noted that the terms used herein should be interpreted as having a meaning consistent with the context of this specification and should not be interpreted in an idealized or overly rigid manner.

[0027] When expressions such as "at least one of A, B, and C, etc." are used, they should generally be interpreted in accordance with the meaning commonly understood by those skilled in the art (for example, "a system having at least one of A, B, and C" should include but is not limited to a system having A alone, B alone, C alone, A and B, A and C, B and C, and / or A, B, C, etc.).

[0028] Memory is a core component of modern servers. As server computing scale and computing power gradually expand, the amount of internal memory and processor processing power required by servers are also increasing. However, processor processing power is often related to its size. As processor size increases, the space available for memory decreases, making it difficult to meet the high demands of servers.

[0029] An embodiment of the present application provides a memory connection system, comprising: a memory connector, comprising a first connector, a second connector, and a signal connection component, wherein the first connector is arranged on the second connector, the second connector is arranged on the main circuit board, the first connector extends along a first direction, and the second connector extends along a second direction perpendicular to the first direction; the signal connection component is arranged in the first connector and the second connector; a plurality of memory slots are arranged on the first connector and extend along the second direction, so that when at least one memory module is inserted into the memory slot, the plug-in and removal direction of at least one memory module is parallel to the main circuit board.

[0030] According to an embodiment of the present application, a memory connector includes a first connector, a second connector, and a signal connection component. The first connector is arranged on the second connector, and the second connector is arranged on the main circuit board. The first connector extends along a first direction, and the second connector extends along a second direction perpendicular to the first direction; the signal connection component is arranged in the first connector and the second connector.

[0031] The memory connector formed by the first connector and the second connector may be L-shaped. The memory connector may be used to electrically connect the memory module to the main circuit board when at least one memory module is inserted into the memory slot.

[0032] The first direction can be characterized as a direction perpendicular to the main circuit board, and the second direction can be characterized as a direction parallel to the main circuit board. The first connector can be resized in the first direction to accommodate more memory modules, and the second connector can be resized in the second direction to accommodate more memory modules, thereby providing more package pins at the bottom of the second connector.

[0033] The first connector and the second connector may be hollow structures. A signal connection component may be provided in the space inside the first connector and the second connector. The signal connection component may be characterized as a connection component for transmitting various data signals including power supply signals, memory signals, etc.

[0034] The memory slot and the main circuit board are electrically connected through a signal connection component so that when the memory module is inserted into the memory slot, the memory module can be electrically connected to the main circuit board, thereby allowing memory signals to be transmitted interactively between the memory module and the main circuit board, and the memory module performs storage and other operations based on the memory signals.

[0035] The main circuit board can be a PCB. In addition to memory connectors, memory slots, and memory modules, it can also house a processor and a heat sink. The memory connectors for the memory modules are typically located on both sides of the processor or heat sink. Typically, a processor has eight memory slots on each side, allowing for 16 memory modules. The processor can interact with the memory modules in the memory slots through the main circuit board.

[0036] According to an embodiment of the present application, a plurality of memory slots are provided on the first connector and extend along the second direction, so that the openings of the plurality of memory slots are parallel to the main circuit board.

[0037] The memory module can be a data storage memory stick. Multiple memory slots are stacked in parallel on a side surface of the first connector. The multiple memory slots are parallel to the second connector, i.e., the multiple memory slots are perpendicular to the first connector and parallel to the second connector and the main circuit board. By arranging the multiple memory slots on the first connector and extending in the second direction, the memory module can be inserted or removed parallel to the main circuit board, and the inserted memory module is parallel to the surface of the main circuit board.

[0038] The center distance between each two adjacent memory slots can be 7.5 mm, and the width of the main circuit board available for the processor and the memory slots can be more than 200 mm. The width of the main circuit board is usually about 452 mm.

[0039] According to an embodiment of the present application, a memory connection system may include a memory connector and multiple memory slots. The memory connector may include a first connector, a second connector and a signal connection component. The first connector is arranged on the second connector, and the second connector is arranged on the main circuit board. The first connector can extend along a first direction perpendicular to the main circuit board, and the second connector can extend along a second direction parallel to the main circuit board. The signal connection component can be arranged in the first connector and the second connector with a hollow structure inside. Multiple memory slots can be arranged on the first connector and extend along the second direction, thereby realizing the arrangement of multiple memory slots stacked side by side along the first direction on the first connector, and the multiple memory slots are all parallel to the main circuit board.

[0040] According to an embodiment of the present application, when the memory modules are inserted into the multiple memory slots on the memory connector, the opening of each memory slot is oriented parallel to the main circuit board, so that the multiple memory modules inserted into the multiple memory slots are also parallel to the main circuit board. Combined with the internal signal connection components that can interconnect the pins, the physical area of ​​the second connector and the main circuit board can be reduced. When the same number of memory modules need to be used, the space occupied by the memory modules and the memory connector is reduced, so that more memory modules can be arranged in the predetermined memory space, so as to adapt to the high computing power of the processor, simplify the assembly process of various hardware components on the main circuit board, and reduce production costs.

[0041] According to the embodiments of the present application, by means of a signal connection component in the memory connector that is electrically connected to the memory slot and the main circuit board, the length of the component connection line of the signal connection component can be further shortened. There is no need to provide a circuit board in the connector and lay out traces on the circuit board, thereby reducing problems such as signal delay, reflection and crosstalk during transmission, and improving the integrity of the signal transmitted between the memory module. Moreover, since there is no need to transmit the signal through the traces on the circuit board in the connector, the memory configuration can be adjusted without changing the structural parameters of the chassis and the motherboard, so as to facilitate memory upgrade, maintenance and configuration adjustment.

[0042] Figure 1 A schematic diagram of a memory connection system according to an embodiment of the present application is shown.

[0043] like Figure 1As shown, a plurality of memory connection systems may be provided on the main circuit board, each memory connection system may include a memory connector and a plurality of memory slots 101, a memory module 104 may be inserted into each memory slot 101, and a plurality of parallel stacked memory modules 104 parallel to the main circuit board 106 are respectively provided on both sides of the processor or the heat dissipation module 105, and the memory connector includes a first connector 102 and a second connector 103, the first connector 102 is vertically provided on the second connector 103, and the second connector 103 is provided on the main circuit board 106, and a signal connection component 107 is provided in the first connector 102 and the second connector 103.

[0044] Figure 2 A front view of a memory connection system according to an embodiment of the present application is shown.

[0045] like Figure 2 As shown, a plurality of memory slots 101 are stacked side by side on the second connector 103 , each memory slot 101 can be inserted with a memory module, and the back of the plurality of memory slots 101 is the first connector 102 .

[0046] According to an embodiment of the present application, the signal connection component may include a plurality of signal connection sub-components.

[0047] According to an embodiment of the present application, the plurality of signal connection subassemblies are electrically connected to the plurality of memory slots respectively, and extend to the second connector to be electrically connected to the connector package pins in the second connector.

[0048] The signal connection subassembly can be characterized as a connection assembly for transmitting signals including memory signals. The first ends of the multiple signal connection subassemblies can be electrically connected to the multiple memory package pins at the bottom of the memory slot for transmitting memory signals, and the second ends of the multiple signal connection subassemblies can be electrically connected to the multiple connector package pins at the bottom of the second connector for transmitting memory signals. Therefore, when the memory module is inserted into the memory slot, the memory module can be electrically connected to the main circuit board, processor, heat dissipation module and other components through the signal connection subassembly for transmitting memory signals, so that the processor can exchange data with the memory module through the multiple signal connection subassemblies.

[0049] Each memory slot has multiple memory package pins with different functions at the bottom, and thus each memory slot has multiple corresponding signal connection subassemblies. The memory package pins at the bottom of the memory slot can have approximately 288 pins, so the number of signal connection subassemblies corresponding to the number of pins in the memory slot can be configured.

[0050] According to an embodiment of the present application, the signal connection component may include multiple signal connection sub-components, which are respectively electrically connected to multiple memory slots and extend to the second connector to be electrically connected to the connector package pins in the second connector. Therefore, when the memory module is inserted into the memory slot, one end of the multiple signal connection sub-components can be electrically connected to the function pins and data pins at the bottom of the memory slot, and the other end of the multiple signal connection sub-components can be electrically connected to the connector package pins at the bottom of the second connector, thereby realizing interactive transmission of signals.

[0051] According to an embodiment of the present application, a plurality of memory gold finger pins are provided on the memory module, and a plurality of memory gold finger slots may be included in the memory slot.

[0052] According to an embodiment of the present application, the plurality of signal connection subassemblies may include a plurality of gold finger wires, a plurality of first signal transmission conductors, and a plurality of second signal transmission conductors.

[0053] According to an embodiment of the present application, any one of the multiple groups of gold finger guide wires includes a first gold finger guide wire and a second gold finger guide wire, and the first gold finger guide wire and the second gold finger guide wire are respectively arranged on both sides of the memory gold finger slot, and the first gold finger guide wire and the second gold finger guide wire respectively have relative first protrusion structures and second protrusion structures, so that when the memory module is inserted, the first gold finger guide wire and the second gold finger guide wire jointly clamp the memory gold finger pins of the memory module, and the first protrusion structure and the second protrusion structure form a double-contact connection with the memory gold finger pins.

[0054] The gold finger lead can be characterized as a lead having a protruding structure and can be V-shaped. The second gold finger lead, combined with the first signal transmission conductor, can electrically connect two package pins with the same functional definition within a memory module, or two package pins with the same functional definition within multiple memory modules. This can reduce the number of second signal transmission conductors extending to the second connector, thereby reducing the number of package pins at the bottom of the second connector and reducing the area occupied by the second connector on the main circuit board.

[0055] The second gold finger trace combined with the first signal transmission conductor can also electrically connect multiple (more than two) package pins with the same functional definition, thereby further reducing the number of signal transmission conductors led to the second connector. For example, if the first connector is provided with five memory slots, and the addresses of the first memory slot, the second memory slot, and the third memory slot are all assigned the same address, then the gold finger trace and the first signal transmission conductor can be used to interconnect the functional pins corresponding to the address assignment of the first memory slot, the second memory slot, and the third memory slot. Then, one end of the second signal transmission conductor is electrically connected to the interconnecting gold finger trace to lead out the other end of the second signal transmission conductor. However, if the clock of the second memory slot is different from the clock of the fourth memory slot, it is impossible to interconnect the functional pins corresponding to the clock function of the second memory slot and the fourth memory slot.

[0056] Furthermore, since the memory gold finger slots and memory package pins at the bottom of each memory slot are arranged according to the same functional sequence, the lead arrangement when using gold finger guide wires to connect package pins with the same functional definition can be more regular and easy to adjust and modify.

[0057] According to an embodiment of the present application, multiple first signal transmission conductors are used to electrically connect multiple second gold finger guide wires in multiple memory gold finger slots that have the same first preset pin function for the same memory module, and to electrically connect multiple second gold finger guide wires in multiple memory gold finger slots that have the same second preset pin function for different memory modules.

[0058] The first preset pin function can be characterized as a pin function that allows interconnection between multiple memory gold finger pins in the same memory module. The second preset pin function can be characterized as a pin function that allows interconnection between multiple memory gold finger pins in different memory modules.

[0059] The first preset pin function may include data function, enable control function, read / write control function, power supply function and grounding function. When the pin functions of the memory gold finger pins in the same memory module are address allocation function, clock function, reset function and retention function, the second gold finger pins with the above-mentioned same pin functions in the slot are usually not interconnected using the first signal transmission conductor.

[0060] The second preset pin function may include pin functions such as address allocation function, clock function, enable control function, read / write control function, power supply function, and grounding function. When the pin function of the memory gold finger pins in different memory modules is a data function, the second gold finger pins with data function in the slots are usually not interconnected using the first signal transmission conductor.

[0061] According to an embodiment of the present application, the plurality of second signal transmission conductors are electrically connected to the plurality of first gold finger guides and at least one second gold finger guide, and are electrically connected to the plurality of connector package pins in the second connector.

[0062] For memory gold finger slots that do not have interconnections with the same pin function, the second gold finger lead in the memory gold finger slot is electrically connected to the second signal transmission conductor. For memory gold finger slots that do have interconnections with the same pin function, the second gold finger lead in one of the interconnected memory gold finger slots can be selected and electrically connected to the second signal transmission conductor, so that the memory signal can be transmitted to the second gold finger leads in multiple memory gold finger slots through one second signal transmission conductor, and the memory signal is transmitted to the memory module that is in contact with the second gold finger lead.

[0063] Memory signals can include functional signals and data storage signals.

[0064] The signal transmission conductor can be characterized as a connection component for connecting the second gold finger wiring and transmitting memory signals.

[0065] After using multiple first signal transmission conductors to electrically connect the package pins with the same function at the bottom of the two gold finger slots, multiple second signal transmission conductors extending to the connector package pins are used to achieve the effect of simultaneously transmitting functional signals to the interconnected memory package pins with the same function when using gold finger guides and signal transmission conductors in combination.

[0066] Compared with the situation where the packaging pins at the bottom of each memory gold finger slot need to lead out independent signal transmission conductors, the combination of gold finger guides and signal transmission conductors adopted in this application can reduce the use of space inside the first connector, thereby reducing the volume of the first connector on the basis of inserting the same memory modules, so that more memory modules can be set up when more memory modules are needed. At the same time, due to the interconnection of the second gold finger guides in multiple memory gold finger slots, the number of second signal transmission conductors led out can be greatly reduced, thereby greatly reducing the number of connector packaging pins at the bottom of the second connector and reducing the packaging area.

[0067] According to an embodiment of the present application, the signal connection subassembly may include multiple groups of gold finger guides, multiple first signal transmission conductors and multiple second signal transmission conductors, each group of gold finger guides includes a first gold finger guide and a second gold finger guide, and the memory gold finger pins of the memory module are clamped by using the first gold finger guide and the second gold finger guide to form a double-contact electrical connection, and then the second gold finger guides in the multiple memory gold finger slots are interconnected by using the first preset pin function and the second preset pin function, and then the first gold finger guide, the uninterconnected second gold finger guide and one of the interconnected multiple second gold finger guides are electrically connected by using the second signal transmission conductor, and extended to the connector package pin at the bottom of the second connector, so that the number of second signal transmission conductors used for transmitting between multiple memory gold finger slots with the same function can be greatly reduced while maintaining normal transmission of the memory signal, the number of pins on the second connector can be reduced, the length of the signal transmission conductor and the length of the routing path in the main circuit board can be shortened, so as to reduce the packaging area of ​​the second connector on the main circuit board and improve the miniaturization and integration of the main circuit board.

[0068] Figure 3 A schematic diagram of a golden finger guide line according to an embodiment of the present application is shown.

[0069] like Figure 3 As shown, a first gold finger guide 303 and a second gold finger guide 304 are respectively provided on both sides of a first memory gold finger slot 301 and a second memory gold finger slot 302 of a memory module, the first gold finger guide 303 has a first protruding structure 305, and the second gold finger guide 304 has a second protruding structure 306. The first protruding structure 305 and the second protruding structure 306 are arranged opposite to each other, and a first signal transmission conductor 307 is used to interconnect the second gold finger guides 304 in the first memory gold finger slot 301 and the second memory gold finger slot 302, and a second signal transmission conductor 308 is used to connect and extend the first gold finger guides 303 in the first memory gold finger slot 301 and the second memory gold finger slot 302, and then the second signal transmission conductor 308 is used to connect and extend the second gold finger guides 304 in the second memory gold finger slot 302.

[0070] Figure 4 A schematic diagram of a memory connection system including signal transmission conductors according to an embodiment of the present application is shown.

[0071] like Figure 4 As shown, the memory slot 101 needs to be electrically connected to the main circuit board through an extended signal connection component 107. The signal connection component 107 is led out from the first connector 102 and the second connector 103 and is electrically connected to multiple connector package pins at the bottom of the second connector 103.

[0072] According to an embodiment of the present application, the first signal transmission conductor and the second signal transmission conductor may include a signal cable or a signal guide pin.

[0073] The signal cable can be a cable conductor, and the exterior of the signal cable and the signal guide pin can be wrapped and fixed using a shell made of a material including but not limited to plastic.

[0074] The signal transmission conductor may also include a signal cable and a signal guide pin. The signal guide pin may be set at the intersection of the first connector and the second connector, that is, it may be set at the bottom surface of the first connector, and a plurality of guide pin slots are set at the intersection of the second connector and the first connector, so that the first end of the signal cable is electrically connected to the third end of the gold finger contact point lead, and the second end of the signal cable is electrically connected to the first end of the signal guide pin. The first connector fixed with a plurality of memory slots is electrically connected to the second connector through the plurality of signal guide pins, so that the first connector and the second connector do not need to be an integrated device. When replacing the memory slot or memory module on the first connector, it is not necessary to unplug the entire memory connector, but only the first connector can be unplugged to facilitate subsequent operations.

[0075] According to an embodiment of the present application, by using signal cables or signal guide pins as transmission components for transmitting functional signals and data storage signals, each signal cable or signal guide pin can be led out from the second connector. Compared with setting a circuit board inside the connector and transmitting signals through the signal path on the circuit board, it can reduce the loss of signals during transmission and optimize the integrity of the signal in the signal transmission conductor. Combined with the outer shell wrapped around the outside of the signal transmission conductor, it can reduce the interference of multiple signals with each other when they are transmitted simultaneously.

[0076] According to an embodiment of the present application, the signal connection assembly may further include a power cable and a ground cable.

[0077] According to an embodiment of the present application, the power cable is electrically connected to the plurality of memory slots and extends to the second connector to be electrically connected to the connector package pins in the second connector.

[0078] The memory package pins at the bottom of the memory slot may include memory power package pins. A power cable with gold finger definitions can be used to interconnect multiple memory power package pins in a memory slot and the second gold finger pins of each memory gold finger slot. A power cable can then be led out and electrically connected to the connector package pins. In other words, by connecting the power cable to the memory power package pins at the bottom of each memory gold finger slot and the connector package pins with power supply function, power signals can be provided to the memory module inserted in the memory slot.

[0079] According to an embodiment of the present application, the ground cable is electrically connected to the plurality of memory slots and extends to the second connector to be electrically connected to the connector package pins in the second connector.

[0080] The memory package pins at the bottom of the memory slot may include a memory ground package pin. A ground cable with gold finger definition can be used to interconnect multiple memory ground package pins within a memory slot and the memory ground package pins at the bottom of each memory slot. A ground cable can then be extended to electrically connect to the connector package pins. This allows the ground cable to be connected to the memory ground package pins at the bottom of each memory slot and to the connector package pins with grounding functionality, thereby forming a complete conductive loop between the memory module inserted in the memory slot, the main circuit board, and the processor.

[0081] According to an embodiment of the present application, the memory packaging pins at the bottom of all memory slots contain pins corresponding to power supply for connecting power cables and ground cables. By connecting the pins corresponding to power supply that are common to each memory slot together using a power cable with the same definition as the gold finger and a ground cable with the same definition as the gold finger, and then electrically connecting the other ends of the power cable and the ground cable to the connector packaging pins, there is no need to connect each memory slot to the power cable and the ground cable, saving the number of cables led out, further reducing the number of pins led out of the second connector, reducing the packaging area of ​​the second connector on the main circuit board, and improving the miniaturization and integration of the main circuit board.

[0082] According to an embodiment of the present application, the second connector may include a plurality of connector package pins and a plurality of first fixed connectors.

[0083] According to an embodiment of the present application, multiple connector package pins are arranged at the bottom of the second connector, which are used to electrically connect the multiple memory slots to the processor through the main circuit board, so as to transmit memory signals from the processor to the multiple memory slots.

[0084] Multiple connector packaging pins can be set at the bottom of the second connector. Since the memory packaging pins on the memory slot are connected by a combination of signal transmission conductors and gold finger guides, and combined with power cables and ground cables that can interconnect all memory slots, the number of signal transmission conductors, power cables and ground cables led out from the first connector can be reduced, and the number of connector packaging pins at the bottom of the second connector can be greatly reduced, so that the area of ​​the second connector is reduced, and the space of the main circuit board occupied by the second connector is reduced.

[0085] According to an embodiment of the present application, a plurality of first fixed connectors are provided on both sides of a plurality of connector package pins, and are used to fix the second connector on the main circuit board.

[0086] The first fixed connectors of the present application may contain only two, and the multiple first fixed connectors of the present application are only distributed on both sides of the bottom of the second connector, and are not set in the multiple connector package pins at the bottom of the second connector.

[0087] The main circuit board may be provided with a positioning and fixing mark corresponding to the first fixed connector, so as to facilitate fixing the first fixed connector in the positioning and fixing mark of the main circuit board, thereby ensuring the accuracy of the fixed position.

[0088] According to an embodiment of the present application, a plurality of connector package pins and a plurality of first fixed connectors are provided on the bottom of the second connector. The signal connection component is electrically connected to the plurality of connector package pins, thereby being electrically connected to the routing path in the main circuit board. The plurality of first fixed connectors are only provided on both sides of the plurality of connector package pins, thereby making the arrangement of the plurality of connector package pins more compact and reducing the package area.

[0089] Figure 5 A schematic diagram of the bottom pins of the second connector corresponding to multiple memory slots according to an embodiment of the present application is shown.

[0090] like Figure 5 As shown in the figure, multiple connector package pins 501 and multiple first fixed connectors 502 corresponding to multiple memory slots are shown. A first fixed connector 502 is provided on both sides of the multiple connector package pins 501. Since a single side of a processor usually needs to be matched with 8 memory modules, when there are two processors, two memory slots can be continuously provided in a row, so that the second first fixed connector 502 corresponding to the first memory slot and the first first fixed connector 502 corresponding to the second memory slot in the same row can share one.

[0091] According to an embodiment of the present application, a plurality of connector package pins are arranged in a dotted manner at the bottom of the second connector in a form that matches the functional package pins of the processor. The plurality of connector package pins include a plurality of first connector package pins and a plurality of second connector package pins. The first connector package pins are electrically connected to a plurality of memory gold finger slots through a first signal transmission conductor and a second signal transmission conductor, and the second connector package pins are electrically connected to the memory gold finger slots through a second signal transmission conductor; and the plurality of first connector package pins and the plurality of second connector package pins are electrically connected to the processor via a routing path arranged in the main circuit board.

[0092] The distribution area of ​​multiple connector package pins at the bottom of the second connector can be designed according to the functional area of ​​the processor's functional package pins. For example, if the processor's power supply function package pin is located at the lower left of the processor, then multiple connector power supply package pins can be set at the lower left of the bottom of the second connector; if the processor's clock function package pin is located at the upper right of the processor, then multiple connector clock package pins can be set at the upper right of the bottom of the second connector. This can reduce the size of the routing path and facilitate centralized management and regulation of the same function of multiple memory sticks. It can also arrange the routing paths corresponding to multiple memory modules on the same layer, so as to facilitate grouping and centralized management of multiple memory modules, signal transmission conductors connecting multiple memory modules, and multiple memory gold finger slots, thereby improving integration and operability.

[0093] Furthermore, by utilizing the second gold finger guide wire, the first signal transmission conductor and the second signal transmission conductor having the same functional interconnection, one connector package pin can correspond to multiple memory gold finger slots or even multiple memory modules, thereby greatly reducing the number of the first connector package pins at the bottom of the second connector.

[0094] Furthermore, since the package shape of the connector package pins is dot-shaped, the package area can be further reduced.

[0095] Figure 6 A schematic diagram of a second connector bottom package corresponding to a memory slot according to an embodiment of the present application is shown.

[0096] like Figure 6 As shown, a plurality of connector package pins 601 are provided at the bottom of the second connector, and a first fixed connector 502 is provided on both sides of the plurality of connector package pins 601. The plurality of connector package pins 601 in each row are arranged in parallel. Since the connector package pins 601 can be spring-type pins or pin-type pins, a plurality of point-shaped package contact points are formed during packaging. The number of connector package pins 601 and the first fixed connector 502 is small, and the spacing between each connector package pin 601 is small, so that the packaging area is smaller.

[0097] Figure 7 A schematic diagram of a second connector bottom package corresponding to a memory slot according to another embodiment of the present application is shown.

[0098] like Figure 7 As shown, a first fixed connector 502 is provided on both sides of the multiple connector package pins 601. In order to further reduce the package area, the multiple connector package pins 601 in each row can be staggered, so that the multiple point-shaped package contact points in each row can also be staggered, thereby further reducing the package area.

[0099] Figure 8 A schematic diagram shows the correspondence between the first connector package pins, the second connector package pins and the gold finger guide wires according to an embodiment of the present application.

[0100] like Figure 8 As shown, after using the first signal transmission conductor 307 to interconnect the second gold finger guide wires 304 in the first memory gold finger slot 301 and the second memory gold finger slot 302 of two memory modules with the same pin function, the second signal transmission conductor 308 is used to connect and extend the second gold finger guide wire 304 in the second memory gold finger slot 302, so that the signal can be transmitted to the first memory gold finger slot 301 and the second memory gold finger slot 302 through a first connector package pin 801, the signal can be transmitted to the second memory gold finger slot 302 through the second connector package pin 802, and the signal can be transmitted to the first memory gold finger slot 301 through the third connector package pin 803.

[0101] Figure 9 A schematic diagram of inner layer routing from a processor to the farthest memory module according to an embodiment of the present application is shown.

[0102] like Figure 9 As shown, the processor can be mounted on a processor connection board 903, which is mounted on the main circuit board. This eliminates the need to repeatedly adjust the electrical connection between the processor and the main circuit board when the processor needs to be replaced or adjusted, reducing damage to the main circuit board. A heat sink module can also be mounted on the main circuit board, which can be positioned at a predetermined location using positioning posts 904. By using a combination of gold finger guides and signal transmission conductors, multiple routing paths 901 corresponding to memory modules farthest from the processor area 902 can be neatly arranged on the main circuit board. The interconnection of gold finger guides reduces the number of routing paths 901 used. This allows configurations of 12 or more memory modules while maintaining the same motherboard size, meeting the memory capacity and speed requirements of high-performance processors. Furthermore, the memory connector footprint is small, and the routing paths from the pins on the main circuit board are also short. The routing path from the processor to the connector package pins can be shortened to less than 3 feet. This shortened routing reduces delays, reflections, and crosstalk during signal transmission, significantly improving signal integrity.

[0103] According to an embodiment of the present application, the plurality of connector package pins include a connector power package pin, a connector ground package pin, and a plurality of connector signal package pins.

[0104] According to an embodiment of the present application, a first end of the connector power supply package pin is electrically connected to the power cable, and a second end of the connector power supply package pin is electrically connected to the main circuit board.

[0105] According to an embodiment of the present application, a first end of the connector ground package pin is electrically connected to the ground cable, and a second end of the connector ground package pin is electrically connected to the main circuit board.

[0106] According to an embodiment of the present application, the first ends of multiple connector signal package pins are electrically connected to multiple second signal transmission conductors, and the second ends of multiple connector signal package pins are electrically connected to the main circuit board, so that the multiple second signal transmission conductors extending to the multiple connector signal package pins are electrically connected to the processor through a routing path.

[0107] Multiple routing paths are arranged in the main circuit board. By fixing the connector power supply package pins, the connector ground package pins and multiple connector signal package pins on the main circuit board, one end of the routing path can be electrically connected to the connector power supply package pins, the connector ground package pins and multiple connector signal package pins, and the other end of the routing path can be electrically connected to the pins of the processor or the heat dissipation module, so that the power supply signal and memory signal sent by the processor can be transmitted through different routing paths in the main circuit board to different signal transmission conductors, power cables and ground cables in the memory connector, and then the memory signal is transmitted to different functional pins through the signal transmission conductors, so that the memory module inserted in the memory slot can perform address allocation, data storage and other operations according to the functional signal.

[0108] According to an embodiment of the present application, the connector package pins may include spring-type pins or pin-type pins.

[0109] Figure 10 A schematic diagram of a spring-type pin according to an embodiment of the present application is shown.

[0110] like Figure 10 As shown, a plurality of spring-type pins 1001 may be used at the bottom of the second connector.

[0111] Figure 11 A schematic diagram of a plug-in pin according to an embodiment of the present application is shown.

[0112] like Figure 11 As shown, a plug-in pin 1101 may be used at the bottom of the second connector, and a socket 1102 for inserting the plug-in pin 1101 may be provided on the main circuit board.

[0113] In the case where the signal connector pins are spring-type pins, the second connector can be electrically connected to the main circuit board by spring crimping without the need to solder the connector to the main circuit board.

[0114] In the case where the signal connector pins are pin-type pins, the pin-type pins can be electrically connected to the main circuit board in a crimping or welding manner, thereby interconnecting the signal connection component and the wiring path.

[0115] Since the contact points of spring-type pins or pin-type pins are relatively small, package contact points can be formed during packaging and neatly arranged in a dot-like manner at the bottom of the connector. Compared with existing linear package contacts, the center spacing between adjacent pins is greatly reduced.

[0116] At the end of assembly, the memory connector with the memory module inserted can be directly fixed to the main circuit board, which saves assembly process and simplifies the operation of plugging and removing the memory module inserted in the memory slot. It is beneficial to the upgrade of server configuration and can avoid the consumption and damage of components caused by repeated plugging and removal.

[0117] According to the embodiments of the present application, by using spring-type pins and plug-in pins, it is possible to set the second connector on the main circuit board and electrically connect to multiple wiring paths in the main circuit board without using a welding fixing method, and only needing to use a crimping or abutting connection method. In addition, by using the connection method of spring-type pins and plug-in pins, the stability between the second connector and the main circuit board can be improved. For the main circuit board, when electrically connecting to the pins, there is no need to perform operations such as punching, so that the wiring paths in the main circuit board can be easier to electrically connect to the pins.

[0118] The memory package pins on the memory slots are connected by combining signal transmission conductors and gold finger guides, and combined with power cables and ground cables that can interconnect all memory slots, the number of connector package pins at the bottom of the second connector can be greatly reduced. By selecting spring-type pins or pin-type pins, the area extended by the pins at the bottom of the second connector is reduced. Combined with the first fixed connector that is only provided on both sides of multiple connector package pins, the area of ​​the second connector occupied by multiple pins and the package area can be reduced in multiple dimensions. Since the electrical connection form between the pins and the motherboard can be flexibly defined according to needs, the flexibility of the memory connector is improved and the space of the main circuit board occupied by the second connector is reduced.

[0119] The center-to-center spacing between adjacent pins in this application can be approximately 1.0-2.0mm. If soldering is desired, the diameter of the soldering pad is approximately 0.5-1.0mm. Since the soldering pad area is typically larger than the pin area, the diameter of the protruding area of ​​the spring-type pins or pin-type pins can be less than 0.5-1.0mm. The package size between the second connector and the main circuit board is approximately 17mm x 170mm. This reduces the footprint of the second connector by a quarter compared to that of a conventional connector. The footprint corresponding to eight memory slots is equivalent to the footprint of two conventional connectors.

[0120] When the area at the bottom of the first connector can accommodate the number of memory modules plugged into the first connector, the second connector may not be required, and the signal transmission conductor may be led out of the first connector. A plurality of connector package pins electrically connected to the signal transmission conductor may be provided at the bottom of the first connector.

[0121] According to an embodiment of the present application, the memory slot may include a memory groove frame, multiple memory gold finger slots, multiple memory package pins and pads.

[0122] According to an embodiment of the present application, the memory groove frame is used to accommodate a memory module.

[0123] The bottom surface of the memory groove frame can be arranged on the first connector.

[0124] According to an embodiment of the present application, a plurality of memory gold finger slots are provided at the bottom of the memory groove frame for accommodating a plurality of memory gold finger pins.

[0125] A memory module may include multiple memory gold finger pins.

[0126] According to an embodiment of the present application, multiple memory package pins are respectively arranged at the bottom of multiple memory gold finger slots, electrically connected to the signal connection components in the memory connector, and provide power supply signals and memory signals to multiple memory slots.

[0127] The memory package pins can be set at the bottom of the memory gold finger slot. By combining signal transmission conductors and gold finger guides, and matching power cables and ground cables, the power supply signal and memory signal can be transmitted to the memory gold finger slot, so that when a memory module is inserted into the memory groove frame, the multiple memory gold finger pins at the bottom of the memory module can be electrically connected to the multiple memory package pins, so that the power supply signal and memory signal can be transmitted to the memory module.

[0128] According to an embodiment of the present application, a solder pad is provided at the bottom of the memory groove frame and is used to solder a plurality of memory package pins to the first connector.

[0129] The number of the plurality of memory package pins of the memory slot is generally about 288 pins, the package size of the memory slot may be about 142x6.8 mm, and the pad size may be about 0.53x1.5 mm.

[0130] The maximum width of a memory module is approximately 30mm, and when inserted into a memory slot, the overall height is approximately 35mm. The spacing between memory slots is approximately 7.5mm. A single processor typically has eight memory slots on one side, and memory modules typically require at least 59mm of space. The memory slot layout adjusted in this application reduces the motherboard space occupied by the memory slots from 60mm to approximately 40mm, thereby reducing motherboard space and lowering the manufacturing cost of the main circuit board.

[0131] According to an embodiment of the present application, the memory slot may include a memory slot frame, multiple memory gold finger slots, multiple memory package pins and pads. The multiple memory package pins are soldered to a first connector by welding and electrically connected to a signal connection component, so that when the memory module is inserted into the memory slot frame, it can be electrically connected to the signal connection component to transmit the power supply signal and memory signal completely and quickly.

[0132] Figure 12 A schematic diagram of the bottom of a memory slot according to an embodiment of the present application is shown.

[0133] like Figure 12 As shown, a plurality of memory package pins and pads may be arranged on the bottom of the memory slot.

[0134] According to an embodiment of the present application, the plurality of memory package pins may include a memory power package pin, a memory ground package pin, and a plurality of memory signal package pins.

[0135] According to an embodiment of the present application, when the memory module is inserted into the memory groove frame, the first end of the memory power supply package pin is electrically connected to the memory module, and the second end of the memory power supply package pin is electrically connected to the power cable.

[0136] When the memory module is inserted into the memory groove frame, the first end of the memory power supply package pin can be electrically connected to the memory gold finger pin related to the power supply function in the memory module.

[0137] According to an embodiment of the present application, when the memory module is inserted into the memory groove frame, the first end of the memory ground package pin is electrically connected to the memory module, and the second end of the memory ground package pin is electrically connected to the ground cable.

[0138] When the memory module is inserted into the memory groove frame, the first end of the memory ground package pin can be electrically connected to the memory gold finger pin related to the ground function in the memory module.

[0139] According to an embodiment of the present application, multiple memory signal packaging pins, when the memory module is inserted into the memory groove frame, the multiple memory signal packaging pins are electrically connected to the multiple memory gold finger pins and multiple signal connection sub-components of the memory module respectively.

[0140] When the memory module is inserted into the memory slot frame, the power supply signal and memory signal can be transmitted to the corresponding pins of the memory slot through the signal connection component, and then the power supply signal and memory signal can be transmitted to the memory module through the electrical connection between the gold finger pins of the memory module and the multiple memory package pins of the memory slot.

[0141] According to an embodiment of the present application, the memory slot may further include a plurality of second fixed connectors.

[0142] According to an embodiment of the present application, a plurality of second fixed connectors are respectively arranged on both sides of a plurality of memory package pins, and are used to fix the memory groove frame to the first connector.

[0143] The first connector may be provided with a memory positioning fixing mark corresponding to the second fixed connector, so as to facilitate fixing the second fixed connector in the memory positioning fixing mark of the first connector, thereby ensuring the accuracy of the fixed position.

[0144] According to an embodiment of the present application, a plurality of second fixing connectors are respectively arranged on both sides of a plurality of memory package pins, so that the stability of the arrangement of the memory slots can be improved through the plurality of second fixing connectors.

[0145] Figure 13 A schematic diagram of wiring at the bottom of a memory slot according to an embodiment of the present application is shown.

[0146] like Figure 13 As shown, since a single side of a processor usually needs to be equipped with 8 memory modules, in the case of two processors, two memory slots can be continuously arranged in a row, so that the second second fixed connector 1301 of the first memory slot and the first second fixed connector 1301 of the second memory slot in the same row can share one, so that the memory slot can be fixed on the first connector through the second fixed connector 1301, wherein the memory package pin size can be approximately 0.53mm×1.5mm, the spacing between the two rows of pins can be approximately 4.1mm, the length of the first connector on the back of two memory slots arranged in the same row can be approximately 142mm, the width of the first connector can be approximately 6.8mm, and the pin spacing on both sides of two adjacent second fixed pins can be approximately 5.95mm.

[0147] The air duct direction of the multiple memory modules inserted into the multiple memory slots of the present application is consistent with the traditional heat dissipation direction.

[0148] When the memory stick needs to be replaced or the system needs to be upgraded, since the memory connector is not fixed on the main circuit board, the memory connector with multiple memory modules can be pulled out from the main circuit board without disassembling the entire motherboard. After inserting the memory module into the vacant memory slot or pulling it out from the memory slot, the memory connector containing the memory module is inserted into the motherboard, which improves assembly efficiency and reduces the risks brought by directly plugging and unplugging memory modules on the motherboard, such as electrostatic damage or misoperation, improves the convenience of maintenance and upgrades, and reduces the assembly process and production costs.

[0149] The memory connection system may further include a protection frame, in which the memory connector and the plurality of memory slots are disposed.

[0150] The protective frame can be a plastic shell or an insulating metal shell.

[0151] By utilizing a protective frame, the memory connector and multiple memory slots can be wrapped and fixed, thereby reducing electromagnetic interference and improving signal integrity during transmission.

[0152] According to an embodiment of the present application, the memory connection system may further include a third connector.

[0153] According to an embodiment of the present application, a third connector is arranged between the second connector and the main circuit board, the upper surface of the third connector is provided with a plurality of connection structures, and the lower surface of the third connector is provided with a plurality of intermediate package pins; the third connector electrically connects the plurality of transmission connector package pins on the lower surface of the second connector with the main circuit board, so that the second connector is fixed to the main circuit board.

[0154] The third connector can be used to transmit power signals and memory signals. The third connector can be arranged between the second connector and the main circuit board. The upper surface of the third connector is electrically connected to the second connector via multiple connection structures. The lower surface of the third connector is also provided with multiple intermediate package pins, which is greater than the number of connector package pins at the bottom of the second connector. The multiple connection structures on the upper surface and the multiple intermediate package pins on the lower surface can be electrically connected via signal cables or signal guide pins. The multiple intermediate package pins are packaged on the main circuit board and electrically connected to the conductive paths in the main circuit board. This allows the power signal and memory signal to be transmitted through the third connector to the second connector and the signal connection component in the first connector, and then transmitted to the memory slot.

[0155] The multiple connection structures on the upper surface of the third connector are compatible with the multiple connector package pins at the bottom of the second connector, and the multiple intermediate package pins and seals on the lower surface of the third connector are the same as the multiple connector package pins and their packages at the bottom of the second connector.

[0156] By setting up the third connector, when the memory module and memory connector need to be configured and upgraded, there is no need to repeatedly plug and unplug the memory connector electrically connected to the main circuit board, thereby avoiding damage to the main circuit board and loose connections caused by repeated plugging and unplugging.

[0157] According to an embodiment of the present application, a third connector is provided between the second connector and the main circuit board, so that when the memory module needs to be replaced, there is no need to plug and unplug the memory connector electrically connected to the main circuit board. The second connector is used to keep the connection with the main circuit board almost fixed or reduce the number of plugging and unplugging times, thereby reducing the probability of damage to the main circuit board and pins during the plugging and unplugging process, and improving maintenance convenience and safety.

[0158] According to an embodiment of the present application, an electronic device may include a memory connection system, a memory module, and a processor.

[0159] According to an embodiment of the present application, the memory connection system is disposed on a main circuit board.

[0160] According to an embodiment of the present application, a memory module is accommodated in a memory slot of a memory connection system.

[0161] By inserting the memory module into the memory slot provided on the first connector, the memory module can communicate normally with the processor or the heat dissipation module.

[0162] According to an embodiment of the present application, a processor is disposed on a main circuit board and is configured to provide power supply signals and memory signals to a memory module via a plurality of wiring paths electrically connected to the processor via a memory connection system.

[0163] A heat dissipation module may also be provided on the main circuit board, and a plurality of memory modules may be respectively provided on both sides of the processor or the heat dissipation module.

[0164] According to an embodiment of the present application, an electronic device may include a memory connection system, a memory module and a processor. By inserting multiple memory modules into the memory connection system, the multiple memory modules are stacked and arranged parallel to the main circuit board, so that a larger number of memory modules can be inserted into the limited memory space compared with traditional memory modules to meet the high computing requirements of the processor.

[0165] According to an embodiment of the present application, the electronic device may further include a horizontal memory slot.

[0166] According to an embodiment of the present application, a horizontal memory slot is provided between a plurality of memory connection systems for accommodating an expansion memory module.

[0167] The bottom surface of the horizontal memory slot can be perpendicular to the main circuit board. This means that multiple expansion memory modules can be placed side by side on the same horizontal plane, either side of the processor or heat sink module. The horizontal memory slot can also be placed on a second connector. By using gold finger guides and signal transmission conductors to interconnect pins with the same function, the number of second signal transmission conductors leading to the second connector can be reduced, thereby reducing the number of connector package pins used. Furthermore, the second connector can be used to consolidate the wiring paths, making the wiring paths shorter and neater.

[0168] In the memory space, multiple memory modules can be stacked and arranged parallel to the main circuit board, and extended memory modules can be inserted into horizontal memory slots to further increase the number of memory modules in the space and space utilization.

[0169] According to an embodiment of the present application, the electronic device may further include a horizontal memory slot, and the space utilization of the memory module is further improved by combining the horizontal memory slot and the memory connector.

[0170] Figure 14 A schematic diagram of an electronic device according to an embodiment of the present application is shown.

[0171] like Figure 14 As shown, in order to maximize memory layout within the limited motherboard space of an electronic device and meet the needs of server upgrades and configuration expansion, a memory connector and horizontal memory slot 1401 can be used for layout. On the main circuit board 106, the expansion memory module 1402 is paired with the horizontal memory slot 1401, and the memory module 104 is paired with the memory connector. The memory connector can be designed to arrange the memory slot 101 above the 40mm motherboard space of the main circuit board 106, leaving a height space for the horizontal memory slot 1401 directly soldered to the main circuit board 106 to insert the memory. The memory connector can be as close as possible to the horizontal memory slot 1401, thereby reducing the motherboard space occupied by the memory module 104. The memory module 104 is inserted above the expansion memory module 1402 on the memory connector, and the overall structure is higher than the insertion height of the expansion memory module 1402. The air duct direction is consistent with the traditional memory layout method, and does not affect the heat dissipation of the memory module 104. This layout of the electronic device can support more memory slots 101 within the limited motherboard space, meet the memory capacity requirements of high-performance processors or heat dissipation modules 105, reduce the length of the routing paths in the signal connection components and the main circuit board 106, reduce signal delay and crosstalk, and improve high-speed signal performance, so as to facilitate server upgrades and increase the flexibility of the configuration of expanded memory.

[0172] The flowcharts and block diagrams in the accompanying drawings illustrate the possible implementation architecture, functions and operations of the systems, methods and computer program products according to various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, program segment, or a part of code, and the above-mentioned module, program segment, or a part of code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram or flowchart, and the combination of the boxes in the block diagram or flowchart, can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0173] Those skilled in the art will appreciate that the features described in the various embodiments of this application may be combined and / or coupled in various ways, even if such combinations or couplings are not explicitly described in this application. In particular, the features described in the various embodiments of this application may be combined and / or coupled in various ways without departing from the spirit and teachings of this application. All such combinations and / or couplings fall within the scope of this application.

[0174] The embodiments of the present application have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of the present application. Although each embodiment has been described separately above, this does not mean that the measures in each embodiment cannot be advantageously used in combination. Without departing from the scope of the present application, those skilled in the art may make various substitutions and modifications, and these substitutions and modifications should all fall within the scope of the present application.

Claims

1. A memory connection system, characterized in that: The system comprises: A memory connector, comprising a first connector, a second connector, and a signal connection assembly, wherein the first connector is disposed on the second connector, and the second connector is disposed on a main circuit board, the first connector extends along a first direction, and the second connector extends along a second direction perpendicular to the first direction, and both the first connector and the second connector are hollow structures; a plurality of memory slots disposed on the first connector and extending along the second direction, such that openings of the plurality of memory slots are oriented parallel to the main circuit board; The signal connection component is arranged in the hollow structure of the first connector and the second connector, and the signal connection component includes multiple signal connection sub-components, and the signal connection sub-components include multiple groups of gold finger guides, any group of gold finger guides includes a first gold finger guide and a second gold finger guide; multiple first signal transmission conductors, used to electrically connect the multiple second gold finger guides with the same first preset pin function for the same memory module in the multiple memory gold finger slots included in the memory slot in the hollow structure, and electrically connect the multiple second gold finger guides with the same second preset pin function for different memory modules in the multiple memory gold finger slots; multiple second signal transmission conductors, electrically connected to the multiple first gold finger guides and at least one second gold finger guide, used to electrically connect the multiple groups of gold finger guides with the multiple connector package pins in the second connector in the hollow structure.

2. The system according to claim 1, wherein: The signal connection component includes: The plurality of signal connection sub-assemblies are electrically connected to the plurality of memory slots respectively, and extend to the second connector to be electrically connected to the plurality of connector package pins in the second connector.

3. The system according to claim 2, characterized in that The signal connection subassembly further includes: The multiple groups of gold finger guide wires, the first gold finger guide wire and the second gold finger guide wire are respectively arranged on both sides of the memory gold finger slot, and the first gold finger guide wire and the second gold finger guide wire respectively have relative first protrusion structures and second protrusion structures, so that when the memory module is inserted, the first gold finger guide wire and the second gold finger guide wire jointly clamp the memory gold finger pins of the memory module, and the first protrusion structure and the second protrusion structure form a double-contact connection with the memory gold finger pins.

4. The system according to claim 3, characterized in that The first signal transmission conductor and the second signal transmission conductor include signal cables or signal guide pins.

5. The system according to claim 2, wherein: The signal connection component further includes: a power cable electrically connected to the plurality of memory slots and extending to the second connector to electrically connect to the connector package pins in the second connector; A ground cable is electrically connected to the plurality of memory slots and extends to the second connector to be electrically connected to the connector package pins in the second connector.

6. The system according to claim 1, wherein: The second connector includes: a plurality of connector package pins, disposed at the bottom of the second connector, for electrically connecting the plurality of memory slots to the processor via the main circuit board, so as to transmit memory signals from the processor to the plurality of memory slots; A plurality of first fixed connectors are arranged on both sides of the plurality of connector package pins and are used to fix the second connector on the main circuit board.

7. The system according to claim 6, characterized in that The plurality of connector package pins are arranged in a dotted manner at the bottom of the second connector in a form that matches the functional package pins of the processor. The plurality of connector package pins include a plurality of first connector package pins and a plurality of second connector package pins. The first connector package pins are electrically connected to the plurality of memory gold finger slots through the first signal transmission conductor and the second signal transmission conductor, and the second connector package pins are electrically connected to the memory gold finger slots through the second signal transmission conductor; and the plurality of first connector package pins and the plurality of second connector package pins are electrically connected to the processor via a routing path set in the main circuit board.

8. The system according to claim 6, wherein: The plurality of connector package pins include: A connector power supply package pin, wherein a first end of the connector power supply package pin is electrically connected to a power cable, and a second end of the connector power supply package pin is electrically connected to the main circuit board; A connector ground package pin, wherein a first end of the connector ground package pin is electrically connected to a ground cable, and a second end of the connector ground package pin is electrically connected to the main circuit board; A plurality of connector signal package pins, wherein the first ends of the plurality of connector signal package pins are electrically connected to the plurality of second signal transmission conductors, and the second ends of the plurality of connector signal package pins are electrically connected to the main circuit board, so that the plurality of second signal transmission conductors extending to the plurality of connector signal package pins are electrically connected to the processor through a routing path.

9. The system according to claim 6, wherein: The connector package pins include spring-type pins or pin-type pins.

10. The system according to claim 1, wherein: The memory slot includes: A memory groove frame is used to accommodate a memory module; A plurality of memory gold finger slots are provided at the bottom of the memory groove frame for accommodating a plurality of memory gold finger pins; A plurality of memory package pins are respectively arranged at the bottom of the plurality of memory gold finger slots, electrically connected to the signal connection component in the memory connector, and provide power supply signals and memory signals to the plurality of memory slots; A soldering pad is provided at the bottom of the memory groove frame and is used for soldering a plurality of the memory package pins to the first connector.

11. The system according to claim 10, wherein: The plurality of memory package pins include: A memory power supply package pin, wherein when the memory module is inserted into the memory groove frame, a first end of the memory power supply package pin is electrically connected to the memory module, and a second end of the memory power supply package pin is electrically connected to a power cable; A memory ground package pin, wherein when the memory module is inserted into the memory groove frame, a first end of the memory ground package pin is electrically connected to the memory module, and a second end of the memory ground package pin is electrically connected to a ground cable; A plurality of memory signal packaging pins, when the memory module is inserted into the memory groove frame, the plurality of memory signal packaging pins are electrically connected to a plurality of memory gold finger pins and a plurality of signal connection sub-components of the memory module respectively.

12. The system according to claim 10, wherein: The memory slot also includes: A plurality of second fixed connectors are respectively arranged on both sides of the plurality of memory package pins and are used to fix the memory groove frame to the first connector.

13. The system according to claim 1, wherein: The system further comprises: A third connector is arranged between the second connector and the main circuit board. The upper surface of the third connector is provided with multiple connection structures, and the lower surface of the third connector is provided with multiple intermediate packaging pins. The third connector electrically connects the multiple connector packaging pins on the lower surface of the second connector with the main circuit board, so that the second connector is fixed to the main circuit board.

14. An electronic device, characterized in that: The electronic device comprises: The memory connection system according to any one of claims 1 to 13, arranged on a main circuit board; a memory module, accommodated in a memory slot of the memory connection system; A processor is disposed on the main circuit board and is used to provide power supply signals and memory signals to the memory module via a plurality of wiring paths electrically connected to the processor via the memory connection system.

15. The electronic device according to claim 14, characterized in that The electronic device further comprises: The horizontal memory slot is arranged between the plurality of memory connection systems and is used to accommodate an expansion memory module.

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