Display panel, preparation method thereof and display device

Abstract

The invention belongs to the technical field of display, and relates to a display panel, a preparation method thereof and a display device. The display panel comprises a plurality of pixel units, the adjacent pixel units are connected through bridging wires, and each pixel unit comprises a light-emitting device, a dam layer and a first packaging layer; the dam layer is arranged around the light-emitting device to form first openings, and the two ends of the bridging wires are located in the first openings of the two adjacent pixel units respectively; the first packaging layer is arranged in the first opening and seals the light-emitting device and the bridging wire located in the first opening. Substances such as water and oxygen can be prevented from entering the first opening to influence the performance of the light-emitting device and the bridging wire, so that the packaging reliability and the display effect of the display panel are improved.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a display panel, a preparation method thereof, and a display device. Background Art

[0002] To meet user requirements, existing display panels adopt flexible innovative display technologies. The core of the technology lies in stretch display technology, which enables the display panel to be stretchable, and can elongate the display panel without sacrificing resolution and finally return to its original state.

[0003] However, the packaging reliability and display effect of existing display panels still need to be further improved. Summary of the Invention

[0004] Based on this, embodiments of this application provide a display panel, a preparation method thereof, and a display device.

[0005] To solve the above technical problems, embodiments of this application provide a display panel, which adopts the following technical solutions:

[0006] The display panel includes a plurality of pixel units, and adjacent pixel units are connected by bridging wires;

[0007] The pixel unit includes a light-emitting device, a dam layer, and a first encapsulation layer;

[0008] The dam layer is disposed around the light-emitting device to form a first opening, and both ends of the bridging wire are respectively located in the first openings of two adjacent pixel units;

[0009] The first encapsulation layer is disposed in the first opening and seals the light-emitting device and the bridging wire located in the first opening.

[0010] Correspondingly, embodiments of this application also provide a preparation method of a display panel, and the method includes:

[0011] Provide a prefabricated component, where the prefabricated component includes a substrate and a plurality of pixel unit prefabricated components disposed on the substrate, and the pixel unit prefabricated component includes a light-emitting prefabricated component;

[0012] Form a dam layer around the light-emitting prefabricated component, and the dam layer is formed with a first opening;

[0013] Form a bridging wire between adjacent pixel unit prefabricated components, the bridging wire connects two adjacent pixel unit prefabricated components, and both ends of the bridging wire are respectively located in the first openings of two adjacent pixel unit prefabricated components;

[0014] A first encapsulation layer is formed within the first opening to seal the first opening, thereby obtaining the display panel;

[0015] Wherein, the light-emitting preform includes a first light-emitting electrode. Before forming the first encapsulation layer within the first opening, the method further includes the steps of: sequentially forming a functional layer and a second light-emitting electrode on the first electrode to form a light-emitting device.

[0016] Correspondingly, the present application further provides a display device, which includes the display panel described in any one of the above, or the display panel in the display device is prepared by using the preparation method of the display panel as described above.

[0017] Compared with the prior art, the embodiments of the present application mainly have the following beneficial effects:

[0018] The present application can prevent substances such as water and oxygen from entering the first opening and affecting the performance of the light-emitting device and the bridging wire, thereby improving the encapsulation reliability and display effect of the display panel. Description of the Drawings

[0019] In order to more clearly illustrate the solutions in the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0020] Figure 1 is a cross-sectional view of the display panel (contracted state) according to an embodiment of the present application;

[0021] Figure 2 is a cross-sectional view of the display panel (stretched state) according to an embodiment of the present application;

[0022] Figure 3 is a top view of the display panel (contracted state) according to an embodiment of the present application;

[0023] Figure 4 is a top view of the display panel (stretched state) according to an embodiment of the present application;

[0024] Figure 5 is another schematic structural view of the display panel in the display panel according to an embodiment of the present application;

[0025] Figure 6 is a schematic structural view of the bridging wire in the display panel according to an embodiment of the present application;

[0026] Figure 7a is a flowchart of the preparation method of the display panel according to an embodiment of the present application;

[0027] Figure 7bIt is a flowchart of another manufacturing method of the display panel according to an embodiment of the present application;

[0028] Figures 8 to 23 They are all cross-sectional schematic diagrams of the display panel in the manufacturing method of the display panel according to an embodiment of the present application;

[0029] Figure 24 It is a schematic structural diagram of the dam prefabricated layer and the bridging wire prefabricated layer in the manufacturing method of the display panel according to an embodiment of the present application;

[0030] Figure 25 It is another schematic structural diagram of the dam prefabricated layer and the bridging wire prefabricated layer in the manufacturing method of the display panel according to an embodiment of the present application.

[0031] Reference numerals:

[0032] Connection electrode 10, stripping layer 11, first defining layer 12, shadow area 13, evaporation area 14, first light-emitting electrode 20, functional layer 21, second light-emitting electrode 22, third encapsulation layer 23, first encapsulation layer 30, second encapsulation layer 40, second substrate layer 50, dam layer 60, dam prefabricated layer 61, pixel unit 100, driving matrix 200, connection via 210, light-emitting via 220, connection drain 230, light-emitting drain 240, source electrode 250, second defining layer 300, first flexible layer 400, cover plate layer 500, second flexible layer 600, first substrate layer 700, bridging wire 800, bridging wire layer, support layer 910, adhesive film material 920. Detailed implementation manners

[0033] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application. In addition, it should be understood that the specific implementation manners described herein are only used to illustrate and explain the present application, and are not used to limit the present application.

[0034] In the present application, unless otherwise stated, the orientation terms such as "upper" and "lower" usually refer to the upper and lower in the actual use or working state of the device, specifically the drawing direction in the accompanying drawings; and "inner" and "outer" refer to the outline of the device. In addition, in the description of the present application, the term "comprising" means "including but not limited to". The terms first, second, third, etc. are only used as labels and do not impose numerical requirements or establish an order.

[0035] In this application, "and / or" describes the relationship between related objects and indicates that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, or B exists alone. Here, A and B can be singular or plural.

[0036] In this application, "at least one" means one or more, and "a plurality" means two or more. "At least one kind", "at least one of the following items (pieces)" or similar expressions refer to any combination of these items, including any combination of single items (pieces) or plural items (pieces). For example, "at least one of a, b, or c", or "at least one of a, b, and c" can both represent: a, b, c, a - b (i.e., a and b), a - c, b - c, or a - b - c, where a, b, and c can be single or multiple respectively.

[0037] The various embodiments of this application can exist in the form of a range; it should be understood that the description in the form of a range is only for convenience and brevity, and should not be construed as a rigid limitation on the scope of this application; therefore, it should be considered that the range description has specifically disclosed all possible sub - ranges and single values within that range. For example, it should be considered that the range description from 1 to 6 has specifically disclosed sub - ranges such as from 1 to 3, from 1 to 4, from 1 to 5, from 2 to 4, from 2 to 6, from 3 to 6, etc., and single numbers within the range, such as 1, 2, 3, 4, 5, and 6, and this applies regardless of the range. Additionally, whenever a numerical range is indicated herein, it means including any cited number (fraction or integer) within the indicated range.

[0038] An embodiment of this application provides a display panel. Please refer to Figure 1 Figure 7. The display panel includes:

[0039] A plurality of pixel units 100, and adjacent pixel units 100 are connected by bridging wires 800;

[0040] The pixel unit 100 includes a light - emitting device, a dam layer 60, and a first encapsulation layer 30;

[0041] The dam layer is disposed around the light - emitting device to form a first opening, and both ends of the bridging wire 800 are respectively located within the first openings of two adjacent pixel units 100;

[0042] The first encapsulation layer 30 is disposed in the first opening and seals the light - emitting device and the bridging wire 800 located in the first opening.

[0043] In this application, a bridging wire 900 is provided to connect the pixel unit 100 provided with a dam layer, and a first encapsulation layer 30 is provided in a first opening formed in the dam layer 60, thereby sealing the light-emitting device and the bridging wire 800 in the first opening, preventing substances such as water and oxygen from entering the first opening and affecting the performance of the light-emitting device and the bridging wire 800, and improving the packaging reliability and display effect of the display panel.

[0044] Furthermore, the pixel unit 100 further includes a driving matrix 200 and a connection electrode 10;

[0045] The connection electrode 10 and the light-emitting device are disposed on the driving matrix 200 and are connected through the driving matrix 200. The connection electrode 10 is located within the first opening;

[0046] Both ends of the bridging wire 800 are respectively connected to the connection electrodes 10 within two adjacent pixel units.

[0047] Please refer to Figure 1 and Figure 2 , in this embodiment, both ends of the bridging wire 800 are respectively connected to the connection electrode 10 along two dam layers 60 in adjacent pixel units 100, and the connection electrode 10 and the light-emitting device are connected through the driving matrix 200, so that the light-emitting devices on each pixel unit 100 can be synchronously controlled to emit light.

[0048] Furthermore, please refer to Figure 1 to FIG. 7. The pixel unit further includes a driving matrix 200 and a connection electrode 10;

[0049] The connection electrode 10 and the light-emitting device are disposed on the driving matrix 200 and are connected through the driving matrix 200. The connection electrode 10 is located within the first opening;

[0050] Both ends of the bridging wire 800 are respectively connected to the connection electrodes 10 within two adjacent pixel units 100.

[0051] It can be understood that the light-emitting device includes a first light-emitting electrode 20, a functional layer 21, and a second light-emitting electrode 22, and it can emit light. The pixel unit 100 may further include a second defining layer 300 (i.e., a pixel defining layer). The second defining layer 300 is used to separate the connection electrode 10 and the first light-emitting electrode 20, and can simultaneously limit the formation positions of the functional layer 21, the second light-emitting electrode 22, and the bridging wire 800 during the formation process of the light-emitting device and the bridging wire 800.

[0052] Please refer to Figure 3 and Figure 4, multiple light-emitting devices and / or connection electrodes 10 can be provided within a single pixel unit 100, thereby improving the space utilization rate of the display panel or the connection strength between pixel units 100. When there are multiple light-emitting devices and / or connection electrodes 10, the dam layer 60 can be disposed around the multiple light-emitting devices and / or connection electrodes 10, thereby separating the multiple light-emitting devices and / or connection electrodes 10 to form independent structures, and further realizing independent protection of the light-emitting devices and / or connection electrodes 10. Even if one of the light-emitting devices and / or connection electrodes 10 fails, the remaining light-emitting devices and / or connection electrodes 10 can still operate, improving the service life of the display panel.

[0053] Please refer to Figure 1 and Figure 3 , the connection electrode 10 can be disposed at a position relatively closer to the periphery of the driving matrix 200 than the light-emitting device, thereby reducing the length of the bridging wire 800 entering the pixel unit 100 and reducing the material consumption of the display panel. The bridging wire 800 can be a metal thin film wire. The first encapsulation layer 30 can be flexible. At this time, during the stretching process of the display panel, its first opening will become larger, and the first encapsulation layer 30 can deform as the first opening becomes larger, avoiding breakage.

[0054] The functional layer 21 can include a hole functional layer, a light-emitting layer, and an electron functional layer stacked in sequence;

[0055] Further, the material of the light-emitting layer includes at least one of single-structure quantum dots and core-shell structure quantum dots. The materials of the single-structure quantum dots, the core materials of the core-shell structure quantum dots, and the shell materials of the core-shell structure quantum dots are respectively selected from at least one of II-VI group compounds, IV-VI group compounds, III-V group compounds, and I-III-VI group compounds. Among them, the II-VI group compounds include but are not limited to one or more of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, and HgZnSTe; the IV-VI group compounds include but are not limited to one or more of SnS, SnSe, SnTe, PbS, PbSe, PbTe, SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, SnPbSSe, SnPbSeTe, and SnPbSTe; the III-V group compounds include but are not limited to one or more of GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InNP, InNAs, InNSb, InPAs, InPSb, GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, and InAlPSb; the I-III-VI group compounds include but are not limited to at least one or more of CuInS2, CuInSe2, and AgInS2; and / or

[0056] The materials of the hole functional layer include at least one of TFB, CuPc, PVK, Poly-TPD, PFB, DNTPD, TCATA, TCCA, CBP, TPD, NPB, NPD, PEDOT:PSS, T·APC, MCC, F4-TCNQ, HATCN, 4,4',4'-tris(N-3-methylphenyl-N-phenylamino)triphenylamine, polyaniline, transition metal oxides, transition metal sulfides, transition metal stannides, doped graphene, undoped graphene, and C60; and / or

[0057] The materials of the electron functional layer include inorganic materials and / or organic materials; the inorganic materials are selected from one or more of doped or undoped zinc oxide, barium oxide, aluminum oxide, nickel oxide, titanium oxide, tin oxide, tantalum oxide, zirconium oxide, nickel oxide, lithium titanium oxide, aluminum zinc oxide, manganese zinc oxide, tin zinc oxide, lithium zinc oxide, indium tin oxide, cadmium sulfide, zinc sulfide, molybdenum sulfide, tungsten sulfide, copper sulfide, zinc stannide, indium phosphide, gallium phosphide, copper indium sulfide, copper gallium sulfide, barium titanate; the doped elements include one or more of aluminum, magnesium, lithium, manganese, yttrium, lanthanum, copper, nickel, zirconium, cerium, gadolinium; the organic materials are selected from one or more of quinoxaline compounds, imidazole compounds, triazine compounds, fluorene-containing compounds, hydroxyquinoline compounds; and / or

[0058] The materials of the second light-emitting electrode 22 and the connection electrodes 10 and the first light-emitting electrode 20 include one or more of metals, carbon materials, and metal oxides; the metals include one or more of Al, Ag, Cu, Mo, Au, Ba, Ca, Yb, and Mg; the carbon materials include one or more of graphite, carbon nanotubes, graphene, and carbon fibers; the metal oxides include doped or undoped metal oxides, including one or more of ITO, FTO, ATO, AZO, GZO, IZO, MZO, and AMO, or include a composite electrode with a metal sandwiched between doped or undoped transparent metal oxides, and the composite electrodes include one or more of AZO / Ag / AZO, AZO / Al / AZO, ITO / Ag / ITO, ITO / Al / ITO, ZnO / Ag / ZnO, ZnO / Al / ZnO, ZnS / Ag / ZnS, ZnS / Al / ZnS, TiO2 / Ag / TiO2, and TiO2 / Al / TiO2.

[0059] Furthermore, please refer to Figures 1 to 6 , the bridging wire 800 includes an intermediate section and a connection section. The connection section is located in the pixel unit 100, the connection end is located within the first opening and is connected to the connection electrode 10, and the intermediate section is located between two adjacent pixel units 100; the shape of the intermediate section is a three-dimensional spiral shape.

[0060] Since the structure of the three-dimensional spiral is distributed on multiple axes, rather than just in a single plane, when it is stretched or compressed, the axes of each pitch can disperse the force in multiple directions, thereby improving the overall tensile resistance. At the same time, the characteristics of the three-dimensional spiral include twisting and rotation, and these movements can absorb and disperse stress, reducing the concentration of stress in a specific area and avoiding the breakage of a certain section of the bridging wire 800 due to excessive force.

[0061] Please refer to Figure 6 In [reference], A, B, and C in the figure are the pitch, width, and thickness of the middle section respectively. The width and thickness of the middle section, as the cross-sectional dimensions of the middle section, jointly affect the cross-sectional area of the middle section, and further affect its tensile load and elastic strength. The thickness and width of the middle section in the present application can ensure that the tensile resistance of the middle section meets the strength requirements when the pixel unit 100 is bent, and at the same time can avoid the cross-sectional dimensions of the middle section being too large to deform or affecting the size of the display panel. The pitch of the middle section in the present application can prevent the arcs on the middle section from crossing and interfering with each other, and at the same time make the spiral more compact in the compressed state, thereby leaving a larger margin for the stretching of the middle section and improving the tensile load of the middle section.

[0062] In some embodiments, the width of the middle section is 3 μm to 50 μm; it can be understood that the width of the middle section can be any value among 3 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm or any range composed of any two of these values.

[0063] In some embodiments, the thickness of the middle section is 0.2 μm to 1 μm; it can be understood that the thickness of the middle section can be any value among 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm, 0.6 μm, 0.7 μm, 0.8 μm, 0.9 μm, 1.0 μm or any range composed of any two of these values.

[0064] In some embodiments, the pitch of the middle section is 10 μm to 500 μm; it can be understood that the pitch of the middle section can be any value among 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 110 μm, 120 μm, 130 μm, 140 μm, 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, 210 μm, 220 μm, 230 μm, 240 μm, 250 μm, 260 μm, 270 μm, 280 μm, 290 μm, 300 μm, 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, 360 μm, 370 μm, 380 μm, 390 μm, 400 μm, 410 μm, 420 μm, 430 μm, 440 μm, 450 μm, 460 μm, 470 μm, 480 μm, 490 μm, 500 μm or a range composed of any two of these values.

[0065] Further, please refer to Figure 1 and Figure 2 The display panel further includes a second encapsulation layer 40. The second encapsulation layer 40 is disposed on the first encapsulation layer 30 and only covers the pixel units 100. The second encapsulation layer 40 is used to seal the pixel units 100. When the first encapsulation layer 30 is located in the first opening and seals the light-emitting device, the connection electrodes 10, and the bridging wires 800, there may still be substances such as water and oxygen entering the pixel unit 100 region, which may further affect the pixel units 100 and / or the devices in the first opening, resulting in a decrease in the lifespan of the light-emitting device. Therefore, a second encapsulation layer 40 is also provided in this embodiment, which can seal the pixel units 100, thereby increasing the service life of the display panel. At the same time, since the second encapsulation layer 40 is only disposed in the pixel unit 100 region and does not connect the pixel units 100, the second encapsulation layer 40 will not affect the distance change of the pixel units 100 during stretching, thereby improving the stretchability of the display panel.

[0066] Further, please refer to Figure 1 and Figure 2Define the vertical distance from the upper surface of the first encapsulation layer 30 to the upper surface of the driving matrix 200 as the first distance, and the vertical distance from the upper surface of the dam layer 60 to the upper surface of the driving matrix 200 as the second distance. The ratio of the first distance to the second distance is (1 to 1.2):1. Since the second encapsulation layer 40 is disposed on the first encapsulation layer 30, and the first encapsulation layer 30 is located in the first opening, the height difference between the upper surface of the first encapsulation layer 30 and the upper surface of the dam layer 60 will affect the height of the protrusion of the second encapsulation layer 40. If the upper surface of the first encapsulation layer 30 is higher than the upper surface of the dam layer 60, the second encapsulation layer 40 will protrude from the pixel unit 100. If the upper surface of the first encapsulation layer 30 is lower than the upper surface of the dam layer 60, the second encapsulation layer 40 will be recessed in the first opening. The degree of protrusion or depression of the second encapsulation layer 40 will affect the shape of the second encapsulation layer 40, thereby changing the light emission angle and the spatial structure of the display panel, and ultimately affecting the light intensity and structural strength of the display panel.

[0067] When the ratio of the first distance to the second distance in this application is (1 to 1.2):1, the second encapsulation layer 40 can be laid flat on the pixel unit 100 or slightly protrude from the upper surface of the pixel unit 100. At this time, the light intensity and structural strength of the display panel are relatively high. It can be understood that the ratio of the first distance to the second distance can be any ratio among 1:1, 1.05:1, 1.1:1, 1.15:1, 1.2:1 or a range composed of any two ratios.

[0068] Furthermore, please refer to Figure 1 and Figure 2 , the display panel further includes a first flexible layer 400 and a cover plate layer 500 that are sequentially stacked. The first flexible layer 400 covers a plurality of pixel units 100 and bridging wires 800, and the cover plate layer 500 covers the first flexible layer 400.

[0069] Since the first flexible layer 400 and the cover plate layer 500 are sequentially stacked and covered on each pixel unit 100 and the bridging wires in the embodiment, display function film layers such as a touch screen, a polarizer, an anti-reflection film, an anti-glare film, a filter film, and a light conversion film can be covered on the cover plate layer 500, and at the same time, it is possible to prevent external substances from affecting the conductivity of the bridging wires 800 or the lifespan of the pixel units 100.

[0070] It can be understood that the light transmittance in a display panel refers to the ability of a material or device to transmit light, usually expressed as a percentage. It represents the relative intensity of the light transmitted after passing through the material or device. Materials or devices with high light transmittance allow more light to penetrate, enabling the display panel to better transmit images or information. The light transmittance is usually calculated using the following formula: Light transmittance = (Intensity of transmitted light / Intensity of incident light) × 100%. To enable light to exit from the first flexible layer 400, the first encapsulation layer 30, and the cover layer 500, the light transmittance of the first flexible layer 400, the first encapsulation layer 30, and the cover layer 500 can be greater than 80%.

[0071] Furthermore, please refer to Figure 1 and Figure 2 , the display panel further includes a first substrate layer 700 and a second flexible layer 600 disposed on the first substrate layer 700, and the pixel unit 100 is disposed on the second flexible layer 600; and / or

[0072] The pixel unit 100 includes a second substrate layer 50, and the second substrate layer 50 is disposed between the second flexible layer 600 and the light-emitting device. At this time, the driving matrix 200 is disposed on the second substrate layer 50; the second flexible layer 600 bears a plurality of pixel units 100 through the second substrate layer 50; the first substrate layer 700 is disposed on the side of the second flexible layer 600 away from the pixel unit 100 for encapsulating the second flexible layer 600..

[0073] The first substrate layer 700 and the second flexible layer 600 support each pixel unit 100, and the second substrate layer 50 is carried by the second flexible layer 600 as a carrier of the driving matrix 200. At this time, the cover layer 500, the first flexible layer 400, the second flexible layer 600, and the first substrate layer 700 form a sealing structure from top to bottom, sealing each pixel unit 100 and the bridging wire 800, playing a role in protecting the pixel unit 100 and the bridging wire 800. At the same time, because the first flexible layer 400 and the second flexible layer 600 are flexible, during the stretching process of the display panel, the first flexible layer 400 and the second flexible layer 600 can utilize their viscosity and fluidity to bond the first substrate layer 700 and the second substrate layer 50 together while avoiding the squeezing force on the first substrate layer 700 and the second substrate layer 50 when the pitch of the pixel units 100 changes, and offsetting the shear strain caused by the different Young's moduli of the first substrate layer 700 and the second substrate layer 50.

[0074] It can be understood that since the second flexible layer 600 bears the pixel unit 100, when it is stretched, in order to enable the pitch between the pixel units 100 to expand, the second flexible layer 600 should have a stretchable margin. For example, please refer to Figure 1, at this time, the display panel is in a contracted state, and the second flexible layer 600 between adjacent pixel units 100 arches away from the first substrate layer 700 to form a convex portion, and this convex portion serves as the stretching margin.

[0075] In some embodiments, the material of the first encapsulation layer 30 includes at least one of silicon oxynitride, silicon carbonitride, parylene, polypropylene, polystyrene, and polyimide. At this time, the first encapsulation layer 30 is a film layer with relatively soft film quality and almost zero film stress, and has a high visible light transmittance, which can improve the light emission intensity of the display panel.

[0076] In some embodiments, the material of the second encapsulation layer 40 includes at least one of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and titanium dioxide. At this time, the second encapsulation layer 40 has good light transmittance and the ability to isolate water and oxygen.

[0077] In some embodiments, the material of the first flexible layer 400 and the second flexible layer 600 includes at least one of silicone rubber, acrylic resin, unsaturated polyester, polyurethane, and epoxy resin. At this time, the first flexible layer 400 and the second flexible layer 600 have good viscosity and fluidity.

[0078] In some embodiments, the material of the cover layer 500 and the first substrate layer 700 includes at least one of polydimethylsiloxane, polysiloxane, and silicone rubber. At this time, the cover layer 500 and the first substrate layer 700 have very strong stretchability. Even after large tensile strains and repeated stretching, no defects such as fractures / cracks will occur, and they can still return to the state before strain after stretching, having a certain elasticity.

[0079] In some embodiments, the material of the second substrate layer 50 includes at least one of ceramics, glass, PI and its derivatives, PEN, PEP, and diphenylene ether resin. Preferably, the material of the second substrate layer 50 includes PI and a photoinitiator. At this time, the second substrate is easy to expose and develop, and after the second substrate layer 50 is formed over the entire surface, the pixel units 100 can be cut into individual structures through exposure and development.

[0080] The thicknesses of the first encapsulation layer 30, the second encapsulation layer 40, the first flexible layer 400, the cover layer 500, the first substrate layer 700, and the second substrate layer 50 in this application will affect the thickness and optical display effect of the display panel. The thickness ranges in this embodiment can ensure the best optical display effect of the light-emitting device.

[0081] In some embodiments, the thickness of the first encapsulation layer 30 is 0.5 μm to 20 μm; it can be understood that the thickness of the first encapsulation layer 30 can be any value among 0.5 μm, 2.5 μm, 4.5 μm, 6.5 μm, 8.5 μm, 10.5 μm, 12.5 μm, 14.5 μm, 16.5 μm, 18.5 μm, 20 μm or the range formed by any two of these values.

[0082] In some embodiments, the thickness of the second encapsulation layer 40 is 20 μm to 2000 μm; it can be understood that the thickness of the second encapsulation layer 40 can be any value among 20 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1100 μm, 1200 μm, 1300 μm, 1400 μm, 1500 μm, 1600 μm, 1700 μm, 1800 μm, 1900 μm, 2000 μm or the range formed by any two of these values.

[0083] In some embodiments, the thickness of the first flexible layer 400 is 20 μm to 500 μm; it can be understood that the thickness of the first flexible layer 400 can be any value among 20 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm or the range formed by any two of these values.

[0084] In some embodiments, the thickness of the second flexible layer 600 is 20 μm to 500 μm, and it can be understood that the thickness of the second flexible layer 600 can be any value among 20 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm or the range formed by any two of these values.

[0085] In some embodiments, the thickness of the cover layer 500 is 20 μm to 2000 μm, and the thickness of the cover layer 500 can be any value among 20 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1100 μm, 1200 μm, 1300 μm, 1400 μm, 1500 μm, 1600 μm, 1700 μm, 1800 μm, 1900 μm, 2000 μm or the range formed by any two of these values.

[0086] In some embodiments, the thickness of the first substrate layer 700 is from 20 μm to 2000 μm, which is a range formed by any one of the values 20 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1100 μm, 1200 μm, 1300 μm, 1400 μm, 1500 μm, 1600 μm, 1700 μm, 1800 μm, 1900 μm, 2000 μm or any range formed by any two of these values.

[0087] In some embodiments, the thickness of the second substrate layer 50 is from 5 μm to 20 μm, which is a range formed by any one of the values 0.5 μm, 2.5 μm, 4.5 μm, 6.5 μm, 8.5 μm, 10.5 μm, 12.5 μm, 14.5 μm, 16.5 μm, 18.5 μm, 20 μm or any range formed by any two of these values.

[0088] Further, please refer to Figure 1 and Figure 2 The driving matrix 200 includes a connection via 210, a light-emitting via 220, a source electrode 250, a light-emitting drain electrode 240, and a connection drain electrode 230; the connection electrode 10 is connected to the connection drain electrode through the connection via 210, the first light-emitting electrode 20 is connected to the light-emitting drain electrode 240 through the light-emitting via 220, and the connection drain electrode 230 and the light-emitting drain electrode 240 are connected through the source electrode 250. Through the connection method in the embodiments of the present application, the connection between the connection electrode 10 and the first light-emitting electrode 20 can be realized.

[0089] Further, the first opening gradually expands in a direction away from the driving matrix 200, and an inner angle is formed between the dam layer 60 and the driving matrix 200, and the angle of the inner angle is from 30° to 60°. At this time, when forming the first sealing layer and the functional layer 21 in the light-emitting device on the dam layer 60, it is possible to avoid the formation of a coffee ring by the functional layer liquid and the first sealing groove liquid, and thus it is easy for the liquid to form a uniform thin film, improving the morphological uniformity of the light-emitting device. It can be understood that the angle of the inner angle includes any one of the values 30°, 35°, 40°, 45°, 50°, 55°, 60° or any range formed by any two of these values.

[0090] Correspondingly, please refer to FIG. 7. The present application further provides a method for manufacturing a display panel, and the method includes:

[0091] Please refer to Figure 8 , providing a preform, the preform including a substrate and a plurality of pixel unit preforms disposed on the substrate, and the pixel unit preforms including light-emitting preforms;

[0092] Forming a dam layer 60 around the light-emitting preform, and the dam layer 60 is formed with a first opening;

[0093] Please refer to Figure 16 , a bridging wire 800 is formed between adjacent pixel unit preforms. The bridging wire 800 connects two adjacent pixel unit preforms, and both ends of the bridging wire 800 are respectively located in the first openings of the two adjacent pixel unit preforms;

[0094] Please refer to Figure 17 , a first encapsulation layer 30 is formed in the first opening to seal the first opening, obtaining a display panel;

[0095] Among them, please refer to Figures 12 to 14 , the light-emitting preform includes a first light-emitting electrode 20. Before the first encapsulation layer 30 is formed in the first opening, it further includes the steps of: sequentially forming a functional layer 21 and a second light-emitting electrode 22 on the first light-emitting electrode 20 to form a light-emitting device. Specifically, according to the process requirements during preparation, the step of "sequentially forming a functional layer 21 and a second light-emitting electrode 22 on the first light-emitting electrode 20 to form a light-emitting device" can be located between the step of "forming a dam layer 60 around the light-emitting preform" and the step of "forming a bridging wire 800 between adjacent pixel unit preforms". At this time, the preparation method of the display panel is as Figure 7b shown; or,

[0096] the step of "sequentially forming a functional layer 21 and a second light-emitting electrode 22 on the first light-emitting electrode 20 to form a light-emitting device" is located between the step of "forming a bridging wire 800 between adjacent pixel unit preforms" and the step of "forming a first encapsulation layer 30 in the first opening". At this time, the preparation method of the display panel is as Figure 7b shown.

[0097] In the display panel formed in this embodiment, the bridging wire 800 connects the pixel unit 100 of the dam layer, and the first encapsulation layer 30 is provided in the first opening formed in the dam layer 60, thereby sealing the light-emitting device and the bridging wire 800 in the first opening, avoiding the entry of substances such as water and oxygen into the first opening and affecting the performance of the light-emitting device and the bridging wire 800, and thus improving the encapsulation reliability and display effect of the display panel.

[0098] It can be understood that the light-emitting preform can be the first light-emitting electrode 20, or can be a light-emitting device including the first light-emitting electrode 20, the functional layer 21, and the cathode 22. The connecting electrode 10 and the first light-emitting electrode 20 can be an IZO / Ag / IZO stack, and the stack thicknesses are respectively 10nm - 50nm / 80nm - 150nm / 5nm - 20nm. Sealing the first opening can include sequentially fabricating a functional layer 21 and a second light-emitting electrode 22 on the connecting electrode 10, fabricating a third encapsulation layer 23 on the second light-emitting electrode 22, and then fabricating a first encapsulation layer 30 in the first opening, and realizing the sealing of each device in the first opening through the first encapsulation layer 30.

[0099] Further, please refer to Figures 10 to 13 and Figures 14 to 19 , the pixel unit preform further includes a driving matrix 200 and a connecting electrode 10, the light-emitting device preform and the connecting electrode 10 are located on the driving matrix 200, and the connecting electrode 10 is located within the first opening;

[0100] The step of forming the dam layer 60 around the light-emitting preform includes:

[0101] Please refer to Figure 1 and Figure 12 , a dam preform layer is formed between the pixel unit preforms and around the driving matrix 200, and the dam preform layer 61 surrounds and defines a plurality of first openings, so that the light-emitting preform and the connecting electrode 10 are located within the first openings;

[0102] The step of forming the bridging wire 800 between adjacent pixel unit preforms includes:

[0103] Please refer to Figure 16 , a bridging wire layer 810 is formed on the connecting electrode 10 and the dam preform layer 61;

[0104] Please refer to Figure 20 , a part of the dam preform layer 61 between adjacent pixel unit preforms is removed, so that the bridging wire layer 810 between adjacent pixel unit preforms is suspended, forming the bridging wire 800 and the dam layer 60;

[0105] Wherein, both ends of the bridging wire 800 are respectively connected to the connecting electrodes 10 within two adjacent pixel units.

[0106] It can be understood that the substrate can be the second substrate layer 50. When at least a part of the dam preform layer 61 between adjacent pixel unit preforms is removed, the second substrate layer 50 can be removed, so that the pixel unit preforms form independent pixel units 100.

[0107] Further, please refer to Figures 11 to 15 . The step of forming the dam preform layer 61 between the pixel unit preforms and around the driving matrix further includes:

[0108] Please refer to Figure 12 , a first defining layer 12 is formed on the connecting electrode, a second opening is formed between the first defining layer 12 and the driving matrix 200, and the first light-emitting electrode is located within the second opening;

[0109] After the step of forming the first defining layer 12 on the connecting electrode, the steps of sequentially forming a functional layer and a second light-emitting electrode on the first light-emitting electrode include:

[0110] Please refer to Figure 13, each functional layer 21 is sequentially deposited and formed within the second opening;

[0111] Please refer to Figure 14 , a second light-emitting electrode 22 is deposited on the functional layer 21 to obtain a light-emitting device.

[0112] During the process of forming the light-emitting device on the first light-emitting electrode 20, since the connection electrode 10 does not emit light and a bridging wire 800 needs to be formed on the connection electrode 10, a first defining layer 12 needs to be provided, thereby preventing the functional layer 21 from being formed on the connection electrode 10 during subsequent processing, resulting in the inability to connect the bridging wire 800 to the connection electrode 10. At the same time, the first defining layer 12 can also play a role in restricting the liquid of the functional layer 21 to improve the morphological uniformity of the functional layer 21 and the second light-emitting electrode 22.

[0113] It can be understood that, to form the first defining layer 12 and the mountain-shaped dam preform 61, a mask plate with partial light transmittance can be used for exposure processing. The materials for forming the first defining layer 12 and the dam layer preform 61 are negative photoresist. The mask plate on the first defining layer 12 is partially light-transmitting, and the dam preform 61 is partially completely light-transmitting. At this time, after development, the illuminated dam preform 61 can be retained.

[0114] Furthermore, please refer to Figure 24 and Figure 25 . Figure 25 In, the white part of the dam preform 61 is the bottom of the dam preform 61, and the black part is the top. The formation process of the bridging wire 800 is as follows: on the upper surface of the mountain-shaped dam preform 61, a continuously curved arc (snake-shaped) via mask plate is used to form a layer of continuously curved arc-shaped bridging wire layer 810. The adjacent bends of the bridging wire layer 810 are respectively located at the top and bottom of the dam preform 61. It can be understood that the curved segments of the bridging wire layer 810 at the top and bottom of the dam preform 61 are respectively located on both sides of the dam preform 61.

[0115] When referring to Figures 19 to 20 's steps, after the dam preform 61 between adjacent form unit preforms is cut to form the dam layer 60, the bridging wire layer 810 located on the cut part of the dam preform 61 is suspended, and the bridging wire layer 810 naturally droops and naturally forms a spiral-shaped bridging wire 800.

[0116] Furthermore, the second opening gradually decreases in the direction away from the driving matrix. At this time, the first defining layer 12 can be trapezoidal in reverse. At this time, please refer to Figure 21, the trapezoid-shaped first defining layer 12 divides the drying environment of the functional layer 21 solution in the second opening into a shaded area 13 and an evaporation area 14. The evaporation rate in the evaporation area 14 is fast, and that in the shaded area 13 is slow. This is beneficial to preferentially evaporate the functional layer 21 solution in the middle, promoting the Marangoni flow of the functional layer 21 solution (flowing from the edge to the center along the surface of the functional layer 21 solution, making the liquid flow from the direction with low surface tension to the direction with high surface tension), thereby effectively suppressing the coffee ring effect and improving the surface uniformity of the functional layer 21. When the functional layer 21 has multiple layers, for example, including a hole functional layer, a light-emitting layer, and an electron transport layer, a functional layer liquid film can be formed in the second opening multiple times and dried to form a multi-layer structure stacked in sequence.

[0117] Further, please refer to Figures 9 to 11 , Figure 21 and Figure 22 . Before the step of forming the first defining layer on the connecting electrode, the following steps are further included:

[0118] Please refer to Figure 9 , a stripping layer 11 is formed on the connecting electrode 10;

[0119] The step of forming the first defining layer 12 on the connecting electrode 10 includes:

[0120] Please refer to Figure 11 and Figure 12 , the first defining layer 12 is formed on the stripping layer 11;

[0121] After the step of depositing the second light-emitting electrode 22 on the functional layer 21 to obtain a light-emitting device, the following steps are further included:

[0122] Please refer to Figure 22 and Figure 23 , the first defining layer 12 and the stripping layer 11 are stripped.

[0123] Since the first defining layer 12 is disposed on the connecting electrode 10, when the first defining layer 12 is removed subsequently, part of the connecting electrode 10 may be removed together or the service life of the connecting electrode 10 may be affected. In this application, before forming the first defining layer 12, a stripping layer 11 is formed on the connecting electrode 10, and the material of the stripping layer 11 includes at least one of epoxy resin, ammonium polyphosphate, and expanded graphite. Therefore, the viscosity between the stripping layer 11 and the connecting electrode 10 is low, and the connecting electrode 10 will not be damaged when the stripping layer 11 and the first defining layer 12 are stripped. Please refer to Figure 22 and Figure 23 , when stripping the first defining layer 12, a viscous film material 920 and a support layer 910 can be sequentially formed on the upper surface of the first defining layer 12, and the first defining layer 12 can be stripped together with the support layer 910 through the viscous film material 920.

[0124] It is understandable that the material of the peelable layer 11 can be prepared by mixing epoxy resin, ammonium polyphosphate, and expanded graphite. Among them, epoxy resin can be automatically cured under ultraviolet light irradiation, reducing the adhesion force to zero, which is convenient for the peeling operation. After ammonium polyphosphate is dehydrated by heat, it generates polyphosphoric acid as a strong dehydrating agent, which promotes the dehydration of the organic surface to form carbide. In addition, the generated non-volatile phosphorus oxides and polyphosphoric acid cover the substrate surface. At the same time, since ammonium polyphosphate contains nitrogen elements, inert gases such as CO2, N2, and NH3 that are not easily combustible are released during thermal decomposition. Expanded graphite is connected to the epoxy resin. After being irradiated by ultraviolet light, when expanded graphite is instantaneously exposed to high temperature, due to the decomposition of the compounds retained in the layer lattice, expanded graphite will expand hundreds of times along the axis of the structure, making it easier to peel. The thickness of the peelable layer 11 is relatively thin and can be set to 100 - 1000 nm. Its formation range can be the same as or slightly smaller than the pattern of the partial connection electrode 10. When a second defining layer 300 is provided around the connection electrode 10, the second defining layer 300 can help define the inkjet range, which is beneficial to the realization of the peelable layer 11. At the same time, the peeling layer 11 can also be made such that the film layer at the edge part is thin and the film layer in the middle is thick by controlling the coffee ring effect, which is beneficial to the peeling effect of the peelable layer 11 and reduces the residue after peeling.

[0125] Further, please refer to Figures 17 to 20 . The step of sealing the first opening includes:

[0126] Please refer to Figure 17 , forming a flexible first encapsulation layer 30 in the first opening to seal the first opening;

[0127] Please refer to Figure 18 , forming a second encapsulation layer 40 on the first encapsulation layer 30, and the second encapsulation layer 40 at least covers the pixel unit 100 for sealing the pixel unit 100;

[0128] Please refer to Figure 19 , sequentially stacking a first flexible layer 400 and a cover plate layer 500 on the plurality of pixel units 100, such that the first flexible layer 400 covers the plurality of pixel units 100 and the bridging wires 800, and the cover plate layer encapsulates the first flexible layer 400;

[0129] The cover plate layer 500 is used to encapsulate the first flexible layer 400.

[0130] Since the first flexible layer 400 and the cover plate layer 500 are sequentially stacked and covered on each pixel unit 100 and the bridging wires in the embodiment, display function film layers such as a touch screen, a polarizer, an anti-reflection film, an anti-glare film, a filter film, and a light conversion film can be covered on the cover plate layer 500. At the same time, it can prevent external substances from affecting the conductivity of the bridging wires 800 or the lifespan of the pixel unit 100.

[0131] In one embodiment of the present application, the prefabricated component further includes a second liner layer 50, and the driving matrix 200 is located on the second liner layer 50. The manufacturing method flow of the display panel is as follows:

[0132] Referring to Figure 8 , at this time, the pixel unit prefabricated component should be understood as all the devices and film layers within the projection area of the driving matrix 200 formed on the substrate (the second liner layer 50) after the driving matrix 200, including at least one first light-emitting electrode 10, one connection electrode 20, and one driving matrix 200.

[0133] Referring to Figure 9 , a second defining layer 300 is fabricated around the connection electrode 10 and the first light-emitting electrode 20 to facilitate subsequent film layer fabrication.

[0134] Referring to Figure 10 , a stripping layer 11 is fabricated on the connection electrode.

[0135] Referring to Figure 11 , a dam prefabricated layer 61 material is coated over the entire surface.

[0136] Referring to Figure 12 , through exposure and development, an inverted trapezoidal first defining layer 12 is formed on the stripping layer 11, and at the same time, a mountain-shaped dam prefabricated layer 61 is formed around the pixel unit prefabricated component.

[0137] Referring to Figure 13 , a functional layer solution is coated within the first defining layer 12 to form various functional layers 21 on the first light-emitting electrode 10, and a second light-emitting electrode 22 is fabricated on the functional layer to form a light-emitting device.

[0138] Referring to Figure 14 , a third encapsulation layer 23 is formed on the light-emitting layer to seal the light-emitting device.

[0139] Referring to Figure 15 , the first defining layer 12 and the stripping layer 11 are stripped.

[0140] Referring to Figure 16 , a bridging wire layer 810 is fabricated on the dam prefabricated layer 61, the first defining layer, and the connection electrode.

[0141] Referring to Figure 17 , a first encapsulation layer 30 is fabricated within the first opening formed by the dam prefabricated layer 61 and the first defining layer 12.

[0142] Referring to Figure 18 , a second encapsulation layer 40 is fabricated on the surface of the first encapsulation layer 30.

[0143] Referring to Figure 19 , a first flexible layer 400 and a cover plate layer 500 are fabricated on the surface of the second encapsulation layer 40.

[0144] Reference Figure 20 , strip the first defining layer 12, the dam prefabrication layer 61, and the second substrate layer 50 between adjacent pixel unit prefabrications, suspend the bridging wire 800, and form independent pixel units 100, bridging wires 800, and dam layers 60.

[0145] It can be understood that the manufacturing method of the connecting electrode 10 and the first light-emitting electrode 20 can be physical vapor deposition, and the manufacturing method of the second defining layer 300 can be chemical vapor deposition. Please refer to Figure 1 , after the step of stripping the first defining layer 12 between adjacent pixel unit prefabrications, suspending the bridging wire 800, and forming independent pixel units 100, a second flexible layer 600 and a first substrate layer 700 can also be fabricated on the bottom of the pixel unit 100 by means of lamination. The preparation methods of the bridging wire 800 include methods such as evaporation coating and physical vapor deposition, and the manufacturing method of the first encapsulation layer 30 is inkjet printing. The manufacturing process of the second encapsulation layer 40 includes atomic layer deposition or microcontact printing process. The manufacturing methods of the first flexible layer 400 and the cover plate layer 500 are lamination by a laminator. The method of removing the first defining layer 12 and the second substrate layer 50 can be etching technology.

[0146] Further, after the step of removing a part of the dam prefabrication layer 61 between adjacent pixel unit prefabrications to suspend the bridging wire layer 810 between adjacent pixel unit prefabrications and form pixel units 100, bridging wires 800, and dam layers 60, the steps further include: sequentially forming a second flexible layer 600 and a first substrate layer 700 under the second substrate layer 50. The method of forming the second flexible layer 600 and the first substrate layer 700 can be lamination by a laminator.

[0147] The embodiment of the present application also provides a display device, characterized in that the display device includes the display panel in any one of the above embodiments, or the display panel in the display device is fabricated by using the preparation method of the display panel in the above embodiments. Since the display device of the present application connects the pixel units 100 of the dam layer through the bridging wire 800, and a first encapsulation layer 30 is disposed in the first opening formed in the dam layer 60, thereby sealing the light-emitting device and the bridging wire 800 in the first opening, preventing substances such as water and oxygen from entering the first opening and affecting the performance of the light-emitting device and the bridging wire 800, and further improving the packaging reliability and display effect of the display panel.

[0148] The above has introduced in detail the display panel, its manufacturing method, and the display device provided by the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

[0149] Obviously, the embodiments described above are only a part of the embodiments of the present application, rather than all of the embodiments. The preferred embodiments of the present application are shown in the drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present application more thorough and comprehensive. Although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments or perform equivalent replacements for some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present application in other related technical fields is similarly within the scope of patent protection of the present application.

[0150] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, combinations, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present application. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. A display panel, characterized in that, Comprising: A plurality of pixel units, with adjacent pixel units connected by bridging wires; The pixel unit includes a light-emitting device, a dam layer, and a first encapsulation layer; The dam layer is disposed around the light-emitting device to form a first opening, and both ends of the bridging wire are respectively located in the first openings of two adjacent pixel units; The first encapsulation layer is disposed in the first opening and seals the light-emitting device and the bridging wire located in the first opening.

2. The display panel according to claim 1, wherein The pixel unit further includes a driving matrix and a connection electrode; The connection electrode and the light-emitting device are disposed on the driving matrix and are connected through the driving matrix, and the connection electrode is located in the first opening; Both ends of the bridging wire are respectively connected to the connection electrodes in two adjacent pixel units.

3. The display panel according to claim 2, wherein The bridging wire includes an intermediate section and a connection section. The connection section is located in the first opening and is connected to the connection electrode, and the intermediate section is located between two adjacent pixel units; The shape of the intermediate section is a three-dimensional spiral shape.

4. The display panel according to claim 3, wherein The width of the intermediate section is 3 μm to 50 μm; and / or The thickness of the intermediate section is 0.2 μm to 1 μm; and / or The pitch of the intermediate section is 10 μm to 500 μm.

5. The display panel according to any one of claims 1 to 4, characterized in that The display panel further includes a second encapsulation layer, which is disposed on the first encapsulation layer and covers the pixel unit.

6. The display panel according to claim 5, characterized in that, Define the vertical distance from the upper surface of the first encapsulation layer to the upper surface of the driving matrix as the first distance, and the vertical distance from the upper surface of the dam layer to the upper surface of the driving matrix as the second distance. The ratio of the first distance to the second distance is (1 to 1.2):

1.

7. The display panel according to claim 5, wherein The display panel further includes a first flexible layer and a cover layer stacked in sequence. The first flexible layer covers a plurality of the pixel units and the bridging wires; The cover layer covers the first flexible layer.

8. The display panel according to claim 7, wherein The display panel further includes a first substrate layer and a second flexible layer disposed on the first substrate layer. The pixel unit is disposed on the second flexible layer; and / or The pixel unit includes a second substrate layer, and the second substrate layer is disposed between the second flexible layer and the light-emitting device; and / or The first encapsulation layer has flexibility.

9. The display panel according to claim 8, wherein The material of the first encapsulation layer includes at least one of silicon oxynitride, silicon carbonitride, parylene, polypropylene, polystyrene, and polyimide; and / or The material of the second encapsulation layer includes at least one of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, and titanium dioxide; and / or The materials of the first flexible layer and the second flexible layer include at least one of silicone rubber, acrylic resin and unsaturated polyester, polyurethane, and epoxy resin; and / or The materials of the cover layer and the first substrate layer include at least one of polydimethylsiloxane, polysiloxane, and silicone rubber; and / or The material of the second substrate layer includes at least one of ceramic, glass, PI and its derivatives, PEN, PEP, and diphenylene ether resin; and / or, The thickness of the first encapsulation layer is 0.5 μm to 20 μm; and / or The thickness of the second encapsulation layer is 20 μm to 2000 μm; and / or The thickness of the first flexible layer is 20 μm to 500 μm; and / or The thickness of the second flexible layer is 20 μm to 500 μm; and / or The thickness of the cover plate layer is 20 μm to 2000 μm; and / or The thickness of the first substrate layer is 20 μm to 2000 μm; and / or The thickness of the second substrate layer is 5 μm to 20 μm; and / or When the display panel is in a contracted state, the second flexible layer between adjacent pixel units bulges away from the first substrate layer to form a convex portion.

10. The display panel according to claim 2, wherein The driving matrix includes connection vias, light-emitting vias, source electrodes, light-emitting drains, and connection drains; The connection electrode is connected to the connection drain through the connection via, the light-emitting device is connected to the light-emitting drain through the light-emitting via, and the connection drain and the light-emitting drain are connected through the source electrode; and / or The first opening gradually expands in a direction away from the driving matrix, and an inner angle is formed between the dam layer and the driving matrix, and the inner angle is 30° to 60°.

11. A method for preparing a display panel, characterized in that, The method includes: Providing a preform, the preform includes a substrate and a plurality of pixel unit preforms disposed on the substrate, and the pixel unit preforms include light-emitting preforms; Forming a dam layer around the light-emitting preform, and the dam layer is formed with a first opening; Forming a bridging wire between adjacent pixel unit preforms, the bridging wire connecting two adjacent pixel unit preforms, and both ends of the bridging wire are respectively located in the first openings of two adjacent pixel unit preforms; Forming a first encapsulation layer in the first opening to seal the first opening to obtain the display panel; Wherein, the light-emitting preform includes a first light-emitting electrode, and before forming the first encapsulation layer in the first opening, the method further includes the step of sequentially forming a functional layer and a second light-emitting electrode on the first light-emitting electrode to form a light-emitting device.

12. The manufacturing method of the display panel according to claim 11, wherein, The pixel unit preform further includes a driving matrix and a connection electrode, the light-emitting device preform and the connection electrode are located on the driving matrix, and the connection electrode is located in the first opening; The step of forming the dam layer around the light-emitting preform includes: Forming a dam preform layer between the pixel unit preforms and around the driving matrix, and the dam preform layer surrounds and defines a plurality of first openings, so that the light-emitting preform and the connection electrode are located in the first openings; The step of forming the bridging wire between adjacent pixel unit preforms includes: Forming the bridging wire layer on the connection electrode and the dam preform layer; Removing a part of the dam preform layer between adjacent pixel unit preforms to make the bridging wire layer between adjacent pixel unit preforms suspended, thereby forming a bridging wire and a dam layer; Wherein, both ends of the bridging wire are respectively connected to the connection electrodes in two adjacent pixel units.

13. The method for manufacturing a display panel according to claim 12, wherein The step of forming a dam prefabrication layer between the pixel unit prefabrications and around the driving matrix includes: Forming a first defining layer on the connection electrode, the first defining layer defining a second opening around the driving matrix, and the first light-emitting electrode being located within the second opening; The step of sequentially forming a functional layer and a second light-emitting electrode on the first light-emitting electrode includes: Sequentially depositing to form each functional layer within the second opening; Depositing a second light-emitting electrode on the functional layer to obtain a light-emitting device.

14. The manufacturing method of the display panel according to claim 13, wherein The second opening gradually decreases in a direction away from the driving matrix; and / or Before the step of forming the first defining layer on the connection electrode, there is further a step of: Forming a peeling layer on the connection electrode; The step of forming the first defining layer on the connection electrode includes: Forming the first defining layer on the peeling layer; After the step of depositing a second light-emitting electrode on the functional layer to obtain a light-emitting device, there is further a step of: Peeling off the first defining layer and the peeling layer.

15. The method for manufacturing a display panel according to claim 12, wherein The step of sealing the first opening includes: Forming a flexible first encapsulation layer in the first opening to seal the first opening; Forming a second encapsulation layer on the first encapsulation layer, the second encapsulation layer covering at least the pixel unit for sealing the pixel unit; Sequentially laminating a first flexible layer and a cover plate layer on a plurality of the pixel units, such that the first flexible layer covers the plurality of pixel units and the bridging wires, and the cover plate layer encapsulates the first flexible layer.

16. The manufacturing method of the display panel according to claim 12, characterized in that, The prefabrication further includes a second substrate layer, and the driving matrix is located on the second substrate layer; After the step of removing a part of the dam layer between adjacent pixel unit prefabrications to make the bridging wire layer between adjacent pixel unit prefabrications suspended, forming a pixel unit, a bridging wire, and a dam layer, there is further a step of: Sequentially forming a second flexible layer and a first substrate layer under the second substrate layer.

17. A display device, characterized in that, The display device includes the display panel according to any one of claims 1 to 10 above, or the display panel in the display device is prepared by the preparation method of the display panel according to claims 11 to 16.

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